LNBH221 Dual LNB supply and control IC with step-up converter and IC interface Features All the features are the same for both section Complete and independent interface between LNBS and relevant IC bus Built-in DC-DC controller for single 12 V supply operation and high efficiency (typ. 93 % @ 500 mA) LNB output current guaranteed up to 500 mA Both compliant with EUTELSAT and direct output voltage specification accurate built-in 22 kHz tone oscillator suits widely accepted standards Fast oscillator start-up facilitates DiSEqCTM encoding Built-in 22 kHz tone detector supports bidirectional DiSEqCTM 2.0 Semi low-drop post regulator and high efficiency step-up PWM for low power loss: Typ. 0.56 W @ 125 mA Two output pins suitable to by-pass the output R-L filter and avoid any tone distortion (R-L filter as per DiSEqC 2.0 specs, see Figure 4 on page 8) Overload and over-temperature internal protections Overload and over-temperature IC diagnostic bits LNB short circuit SOA protection with IC diagnostic bit PowerSO-36 ) s t( c u d o r P e et assembled in PowerSO-36, specifically designed to provide the power 13/18 V, and the 22 kHz tone signalling for two independent LNB down converters or to a multiswitch box that could be independently powered and set. In this application field, it offers a complete solution with extremely low component count, low power dissipation together with simple design and IC standard interfacing. l o bs O ) s ( t c u d o r eP t e ol s b O +/- 4 kV ESD tolerant on input/output power pins Description Intended for analog and digital dual satellite STB receivers/sat-TV, sets/PC cards, the LNBH221 is a voltage regulator and interface IC, April 2009 Doc ID 9913 Rev 6 1/27 www.st.com 27 Contents LNBH221 Contents 1 Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Typical application circuits for each section: A and B . . . . . . . . . . . . . 7 5 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 IC bus interface (one for each section) . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.2 Data validity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.3 Start and stop conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.4 Byte format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5.5 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 ) s t( c u d o r P e t section) . . . . . . . . . . . 13 LNBH221 software description (same for lboth e o s b O ) s ( t c u d o r P e t oleElectrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6 7 5.1 s b O 5.6 Transmission without acknowledgement . . . . . . . . . . . . . . . . . . . . . . . . . 11 6.1 Interface protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.2 System register (SR, 1 byte) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.3 Transmitted data (IC bus write mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.4 Received data (IC bus read mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6.5 Power-on IC interface reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6.6 Address pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6.7 DiSEqCTM implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 8 Thermal design notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 9 Typical performance characteristics (of each section) . . . . . . . . . . . . 19 10 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2/27 Doc ID 9913 Rev 6 LNBH221 Diagram 1 Diagram Figure 1. Block diagram Gate LNBH221- section A Sense Step-up Controller VoTX Vup Vcc Byp SDA SCL VoRX Preregul.+ U.V.lockout +P.ON res. Linear Post-reg +Modulator +Protections V Select IC Diagn. Enable ADDR TEN 22KHz Oscill. DSQIN Tone Detector DSQOUT Step-up Controller SDA SCL Linear Post-reg +Modulator +Protections l o bs V Select IC TEN ) s t( c du EXTM Diagn. Enable ADDR DSQIN P e et VoRX Preregul.+ U.V.lockout +P.ON res. ) s t( c u d o r VoTX Vup Byp DETIN LNBH221- section B Gate Sense Vcc EXTM -O 22KHz Oscill. Tone Detector DETIN DSQOUT o r eP t e ol s b O Doc ID 9913 Rev 6 3/27 Maximum ratings LNBH221 2 Maximum ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit VCC DC input voltage -0.3 to 16 V VUP DC input voltage -0.3 to 25 V DC output pin voltage -0.3 to 25 V Internally limited mA VOTX/RX IO Output current VI Logic input voltage (SDA, SCL, DSQIN) -0.3 to 7 V Detector input signal amplitude -0.3 to 2 VPP VOH Logic high output voltage (DSQOUT) -0.3 to 7 V IGATE Gate current 400 mA Current sense voltage -0.3 to 1 Address pin voltage -0.3 to 7 VDETIN VSENSE VADDRESS TSTG TJ Storage temperature range -40 to 150 ) s t( Operating junction temperature range -40 to 125 C V c u d o r V C P e et Note: Absolute maximum ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied. Table 2. Thermal data Symbol RthJC -O Parameter ) s t( c du Thermal resistance junction-case l o bs o r eP t e ol s b O 4/27 Doc ID 9913 Rev 6 Value Unit 2 C/W LNBH221 Pin configuration 3 Pin configuration Figure 2. Pin configurations (top view) ) s t( c u d o r Table 3. Pin description Symbol VCC l o bs Name P e et Function A B 8 V to 15 V supply. A 220 F bypass capacitor to GND with a 470 nF (ceramic) in parallel is recommended. 8 26 External MOS switch gate connection of the step-up converter. 7 25 ) s t( c du Supply input -O Pin number Sect: GATE External switch gate SENSE Current sense (input) Current Sense comparator input. Connected to current sensing resistor. 6 24 Step-up voltage Input of the linear post-regulator. The voltage on this pin is monitored by the internal step-up controller to keep a minimum dropout across the linear pass transistor. 9 27 Output port during 22 RX Output to the LNB in DiSEqC 2.0 application. See truth table kHz Tone RX for voltage selections and description on page 4. 28 10 SDA Serial data Bidirectional data from/to IC bus. 2 20 SCL Serial clock Clock from IC bus. 3 21 DSQIN DiSEqC input When the TEN bit of the system register is LOW, this pin will accept the DiSEqC code from the main controller. Each section of the LNBH221 will use this code to modulate the internally generated 22 kHz carrier. Set to GND this pin if not used. 4 22 DETIN Detector in 22 kHz tone detector input. Must be AC coupled to the DiSEqC bus. 35 17 VUP o r eP t e ol VORX s b O Doc ID 9913 Rev 6 5/27 Pin configuration Table 3. LNBH221 Pin description Symbol Name Pin number Sect: Function A B Open drain output of the tone detector to the main microcontroller for DiSEqC data decoding. It is LOW when tone is detected on the DETIN. 5 23 External modulation External modulation input. Needs DC decoupling to the AC source. If not used, can be left open. 31 13 GND Ground 1, 14, 1, 14, 18, 18, Circuit ground. It is internally connected to the die frame for heat 19, 19, dissipation. 32, 32, 36 36 BYP Bypass capacitor pin Needed for internal pre regulator filtering. VOTX Output port during 22 Output of the linear post regulator/modulator to the LNB. See kHz tone TX truth table for voltage selections. GND Ground To be connected to ground. Address setting Four IC bus addresses available by setting the address pin level voltage. DSQOUT DiSEqC output EXTM ADDR l o bs O ) s ( t c u d o r eP t e ol s b O 6/27 Doc ID 9913 Rev 6 34 ) s t( 30 c u d o r P e et 16 12 29 11 33 15 LNBH221 Typical application circuits for each section: A and B 4 Typical application circuits for each section: A and B Figure 3. Application circuit for DiSEqC 1.x and output current up to 500 mA D1 1N4001 Axial Ferrite Bead Filter F1 suggested part number: MURATA BL01RN1-A62 Panasonic EXCELS A35 IC1 F1 Vup C9 220F C2 220F IC2 STS4DNFS30L VoRX C3 470nF Ceramic Set TTX=1 to LNB Gate VoTX LNBH221 Sense L1=22H Rsc 0.1 C5 10nF Section A and B C4 470nF Ceramic c u d o r Byp C5 470nF C1 220F P e et SDA EXTM SCL Address DSQIN DSQOUT Tone Enable ) s t( (**) DETIN Vcc Vin 12V D2 BAT43 l o bs GND 0150C, power block disabled 0 IOUTIOMAX, overload protection triggered Values are typical unless otherwise specified. 14/27 Doc ID 9913 Rev 6 LNBH221 6.5 LNBH221 software description (same for both section) Power-on IC interface reset The IC interface built in the LNBH221 is automatically reset at power on. As long as the VCC stays below the under voltage lockout threshold (6.7 V typ.), the interface will not respond to any IC command and the system register (SR) is initialized to all zeroes, thus keeping the power blocks disabled. Once the VCC rises above 7.3 V typ, the IC interface becomes operative and the SR can be configured by the main micropower. This is due to 500 mV of hysteresis provided in the UVL threshold to avoid false retriggering of the poweron reset circuit. 6.6 Address pin Connecting this pin to GND the chip IC interface address is 0001000, but, it is possible to choice among 4 different addresses simply setting this pin at 4 fixed voltage levels (see Table 9 on page 17). 6.7 ) s t( DiSEqCTM implementation c u d o r The LNBH221 helps the system designer to implement the bi-directional DiSEqC 2.0 protocol by allowing an easy PWK modulation/demodulation of the 22 kHz carrier. The PWK data are exchanged between the LNBH221 and the main micropower using logic levels that are compatible with both 3.3 and 5 V microcontrollers. This data exchange is made through two dedicated pins, DSQIN and DSQOUT, in order to maintain the timing relationships between the PWK data and the PWK modulation as accurate as possible. These two pins should be directly connected to two I/O pins of the micropower, thus leaving to the resident firmware the task of encoding and decoding the PWK data in accordance to the DiSEqC protocol. Full compliance of the system to the specification is thus not implied by the bare use of the LNBH221. The system designer should also take in consideration the bus hardware requirements; that can be simply accomplished by the R-L termination connected on the VOUT pins of the LNBH221, as shown in the Figure 4 on page 8. To avoid any losses due to the R-L impedance during the tone transmission, the LNBH221 has dedicated output (VOTX) that, in a DiSEqC 2.0 application, is connected after the filter and must be enabled by setting the TTX SR bit HIGH only during the tone transmission (see DiSEqC 2.0 Application information on page 9). Unidirectional (1.x) DiSEqC and non-DiSEqC systems normally don't need this termination, and the VOTX pin can be directly connected to the LNB supply port of the tuner (see Figure 3: Application circuit for DiSEqC 1.x and output current up to 500 mA on page 7). There is also no need of tone decoding, thus DETIN and DSQOUT pins can be left unconnected and the tone is provided by the VOTX. l o bs P e et O ) s ( t c u d o r eP t e ol s b O Doc ID 9913 Rev 6 15/27 Electrical characteristics 7 LNBH221 Electrical characteristics TJ = 0 to 85 C, EN = 1, TTX = 0/1, LLC=VSEL=TEN=PCL=0, DSQIN=LOW, VIN = 12 V, IOUT = 50 mA, unless otherwise specified. See software description section for IC access to the system register. Table 6. Electrical characteristics of each section (A and B) Symbol Parameter VIN Supply voltage IIN Supply current VOUT Output voltage VOUT Line regulation VOUT Load regulation Min. IOUT = 500 mA TEN=VSEL=LLC=1 Output voltage VOUT IMAX Parameter Typ. 8 Max. Unit 15 V EN=TEN=VSEL=LLC=1, No Load 20 EN=0 3.5 7 40 mA IOUT = 500 mA VSEL=1 LLC=0 17.3 18 18.7 LLC=1 18.7 19.5 20.3 IO = 500 mA VSEL=0 LLC=0 12.75 13.25 13.75 LLC=1 13.75 14.25 14.75 V c u d o r VSEL=0 VIN =8 to 15V VSEL=1 P e et 5 40 5 60 VSEL = 0 or 1 IOUT = 50 to 500mA l o bs Output current limiting VSEL = 0 ) s t( 500 V mV 200 mV 750 mA 300 -O ISC Output short circuit current tOFF Dynamic overload protection OFF time PCL=0, output shorted 900 ms tON Dynamic overload protection ON time PCL=0, output shorted tOFF/1 0 ms fTONE Tone frequency TEN=1 20 22 24 kHz ATONE DTONE VSEL = 1 c u d ) s t( mA 200 o r eP Tone amplitude TEN=1 0.55 0.72 0.9 VPP Tone duty cycle TEN=1 40 50 60 % Tone rise and fall time TEN=1 5 8 15 s GEXTM External modulation gain VOUT/VEXTM, f = 10Hz to 50kHz, TTX=1 VEXTM External modulation input voltage AC Coupling, TTX=1 400 mVPP ZEXTM External modulation impedance f = 10Hz to 50kHz 260 W fSW DC-DC converter switch frequency 220 kHz fDETIN Tone detector frequency capture range t e ol tr, tf s b O 16/27 0.4VPP sinewave Doc ID 9913 Rev 6 6 18 24 kHz LNBH221 Table 6. Electrical characteristics Electrical characteristics of each section (A and B) (continued) Symbol Parameter Parameter VDETIN Tone detector input amplitude ZDETIN Tone detector input impedance Min. fIN=22 kHz sinewave Typ. 0.2 Max. Unit 1.5 VPP 150 VOL DSQOUT pin logic LOW Tone present, IOL=2mA IOZ DSQOUT pin leakage current Tone absent, VOH = 6V VIL DSQIN input pin logic LOW VIH DSQIN input pin logic HIGH IIH DSQIN pin input current VIH = 5V 15 IOBK Output backward current EN=0, VOBK = 18V -6 0.3 k 0.5 V 10 A 0.8 V 2 V A -15 mA TSHDN Thermal shutdown threshold 150 C TSHDN Thermal shutdown hysteresis 15 C Table 7. Gate and sense electrical characteristics (TJ = 0 to 85 C, VIN = 12 V) Symbol Parameter Parameter RDSON-L Gate LOW RDSON IGATE=-100mA RDSON-H Gate LOW RDSON IGATE=100mA VSENSE Current limit sense voltage Table 8. Min. c u d o r eP let o s b ) s t( Typ. Max. Unit 4.5 4.5 200 mV IC electrical characteristics (TJ = 0 to 85 C, VIN = 12 V) Symbol O ) Parameter VIL LOW level input voltage VIH HIGH level input voltage IIN Input current c u d o r eP Parameter t(s Min. Typ. SDA, SCL SDA, SCL Max. Unit 0.8 V 2 SDA, SCL, VIN= 0.4 to 4.5V VOL Low level output voltage SDA (open drain), IOL = 6mA fMAX Maximum clock frequency SCL V -10 10 A 0.6 V 500 kHz t e ol bs Table 9. O Symbol Address pin characteristics (TJ = 0 to 85 C, VIN = 12 V) Parameter Parameter Min. Typ. Max. Unit VADDR-1 "0001000" addr pin voltage 0 0.7 V VADDR-2 "0001001" addr pin voltage 1.3 1.7 V VADDR-3 "0001010" addr pin voltage 2.3 2.7 V VADDR-4 "0001011" addr pin voltage 3.3 5 V VADDR-1 "0001000" addr pin voltage 0 0.7 V Doc ID 9913 Rev 6 17/27 Thermal design notes 8 LNBH221 Thermal design notes During normal operation, the LNBH221 device dissipates some power. At rated output current of 500 mA on each section output, the voltage drop on both linear regulators lead to a total dissipated power that is typically 2 W. The heat generated requires a suitable heatsink to keep the junction temperature below the over-temperature protection threshold. Assuming a 45 C temperature inside the set-top-box case, the total RthJC has to be less than 40 C/W. While this can be easily achieved using a through-hole power package that can be attached to a small heatsink or to the metallic frame of the receiver, a surface mount power package must rely on PCB solutions whose thermal efficiency is often limited. The simplest solution is to use a large, continuous copper area of the GND layer to dissipate the heat coming from the IC body. Given for the PSO-36 package an RthJC equal to 2 C/W, a maximum of 38 C/W are left to the PCB heatsink. This area can be the inner GND layer of a multi-layer PCB, or, in a dual layer PCB, an unbroken GND area even on the opposite side where the IC is placed. In figure 8, it is shown a suggested layout for the PSO-36 package with a dual layer PCB, where the IC exposed pad connected to GND and the square dissipating area are thermally connected through 32 vias holes, filled by solder. This arrangement, when L = 40 mm, achieves an RthJA of about 28 C/W. ) s t( c u d o r Different layouts are possible, too. Basic principles, however, suggest to keep the IC and its ground exposed pad approximately in the middle of the dissipating area; to provide as many vias as possible; to design a dissipating area having a shape as square as possible and not interrupted by other copper traces. Figure 8. l o bs PowerSO-36 suggested PCB heatsink layout O ) s ( t c u d o r eP t e ol s b O 18/27 Doc ID 9913 Rev 6 P e et LNBH221 9 Typical performance characteristics (of each section) Typical performance characteristics (of each section) TJ = 25 C, unless otherwise specification. Figure 9. Output voltage vs. temperature Figure 10. Output voltage vs. temperature ) s t( Figure 11. Output voltage vs. temperature c u d o r Figure 12. Load regulation vs. temperature l o bs P e et O ) s ( t c u d o r eP Figure 13. Load regulation vs. temperature t e ol Figure 14. Supply current vs. temperature s b O Doc ID 9913 Rev 6 19/27 Typical performance characteristics (of each section) LNBH221 Figure 15. Supply current vs. temperature Figure 16. Supply current vs. temperature Figure 17. Dynamic overload protection ON time vs. temperature Figure 18. Dynamic overload protection OFF time vs. temperature ) s t( c u d o r l o bs P e et O ) s ( t c u d Figure 19. Output current limiting vs. temperature Figure 20. Tone frequency vs. temperature o r eP t e ol s b O 20/27 Doc ID 9913 Rev 6 LNBH221 Typical performance characteristics (of each section) Figure 21. Tone amplitude vs. temperature Figure 22. Tone duty cycle vs. temperature Figure 23. Tone rise time vs. temperature Figure 24. Tone fall time vs. temperature ) s t( c u d o r l o bs P e et O ) s ( t c u d Figure 25. Under voltage lockout threshold vs. Figure 26. Output backward current vs. temperature temperature o r eP t e ol s b O Doc ID 9913 Rev 6 21/27 Typical performance characteristics (of each section) LNBH221 Figure 27. DC-DC converter efficiency vs. temperature Figure 28. Current limit sense voltage vs. temperature Figure 29. 22 kHz tone waveform Figure 30. DSQIN tone enable transient response ) s t( c u d o r l o bs P e et O ) s ( t c u d VCC = 12 V, IO = 50 mA, EN = TEN = 1 VCC = 12 V, IO = 50 mA, EN=1, Tone enabled by DSQIN pin Figure 31. DSQIN tone enable transient response Figure 32. DSQIN tone disable transient response o r eP t e ol s b O VCC = 12 V, IO = 50 mA, EN=1, Tone enabled by DSQIN pin 22/27 VCC = 12 V, IO = 50 mA, EN=1, Tone enabled by DSQIN pin Doc ID 9913 Rev 6 LNBH221 10 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. ) s t( c u d o r l o bs P e et O ) s ( t c u d o r eP t e ol s b O Doc ID 9913 Rev 6 23/27 Package mechanical data LNBH221 PowerSO-36 mechanical data mm. Dim. A a1 a2 a3 b c D (1) D1 E E1 (1) E2 E3 e e3 G H h L N S Min. inch. Typ. Max. Min. 3.60 0.30 3.30 0.10 0.38 0.32 16.00 9.80 14.50 11.10 2.90 6.2 0.10 0 0.22 0.23 15.80 9.40 13.90 10.90 5.8 Typ. Max. 0.1417 0.0118 0.1299 0.0039 0.0150 0.0126 0.6299 0.3858 0.5709 0.4370 0.1142 0.2441 0.0039 0 0.0087 0.0091 0.6220 0.3701 0.5472 0.4291 0.2283 0.65 11.05 ) s t( 0.0256 0.4350 0 15.50 0.10 15.90 1.10 1.10 10 8 0.80 0 c u d o r 0.0000 0.6102 P e et 0.0315 0.0039 0.6260 0.0433 0.0433 10 8 0 l o bs (1) "D and E1" do not include mold flash or protusions - Mold flash or protusions shall not exceed 0.15 mm (0.006") O ) s ( t c u d o r eP t e ol s b O 0096119/B 24/27 Doc ID 9913 Rev 6 LNBH221 Package mechanical data Tape and reel PowerSO-36 mechanical data mm. inch. Dim. Min. Typ. Max. A Min. Typ. 330 12.992 C 12.8 13.2 D 20.2 0.795 N 60 2.362 T Max. 0.504 30.4 0.519 1.197 Ao 15.1 15.3 0.594 0.602 Bo 16.5 16.7 0.650 0.658 Ko 3.8 4.0 0.149 0.157 Po 3.9 4.1 0.153 0.161 P 23.9 24.1 0.941 W 23.7 24.3 0.933 l o bs ) s t( c u d o r 0.949 0.957 P e et O ) s ( t c u d o r eP t e ol s b O Doc ID 9913 Rev 6 25/27 Revision history LNBH221 11 Revision history Table 10. Document revision history Date Revision Changes 08-Apr-2005 4 Maturity changed. 01-Mar-2006 5 The Figure 3 and Figure 4 updated. 17-Apr-2009 6 Updated statement ECOPACK(R). ) s t( c u d o r l o bs O ) s ( t c u d o r eP t e ol s b O 26/27 Doc ID 9913 Rev 6 P e et LNBH221 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. ) s t( All ST products are sold pursuant to ST's terms and conditions of sale. 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The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 9913 Rev 6 27/27