HEATSINKS & CASES SURFACES HEATSINKS & CASES SURFACES art. no. The information given in this catalogue were established and examined carefully. Nevertheless, mistakes or printing errors, and especially The information given in and this catalogue wereimprovement established and examined technical modifications updating and of our products, carefully. or are printing errors,even andif especially cannot beNevertheless, excluded. All mistakes trade marks recognised they are not technical modifications and updating No andidentification improvementdoes of our specifically identified or mentioned. notproducts, imply that cannot be excluded. All trade marks are recognised even if they are not a product or trademark is not registered. No part of this catalogue may specifically identified or mentioned. No identification not imply that be reproduced or distributed without prior writtendoes consent of Fischer a Elektronik. product or All trademark is not registered. No part of in thistexts, catalogue may data contained in this catalogue, illustrations, bedocuments reproduced or distributed without prior written consent of Fischer and descriptions are subject to copyright and the provisions Elektronik. All16016. data contained in this catalogue, in texts, illustrations, of DIN ISO All rights reserved. documents and descriptions are subject to copyright and the provisions of(c)DIN ISO 16016. AllElektronik rights reserved. Copyright Fischer 1969 ... 2014 art. no. AL (c) Copyright Fischer Elektronik 1969 ... 2014 raw degreased aluminium AL BZ raw degreased aluminium raw pickled aluminium BZ LP raw pickled aluminium outside black lacquered RAL 9005/transparent passivated LP ME outside black lacquered RAL 9005/transparent passivated ME MI clear anodised MI SA solderable surface SA TP black anodised chrome-free transparent passivated TP chrome-free transparent passivated clear anodised solderable surface black anodised CONNECTOR CONTACT SURFACE FINISH CONNECTOR CONTACT SURFACE FINISH art. no. art. no. G Fischer Elektronik GmbH & Co. KG Postfach 1590 * D-58465 Ludenscheid Fischer Elektronik GmbH & Co. KG G S gold-plated S Z selective gold-plated Z tin-plated selective gold-plated tin-plated art. no. RAL RAL COLOURS COLOURS GO 6026 opal green GO K 6026 7032 opal green gravel grey system cases RackCase/shell cases bench cases K LG 7032 7035 gravel grey bench cases light grey shell cases LG NB 7035 5022 light grey night blue shell cases system cases RackCase/shell cases NB S 5022 9005 night blue system cases RackCase/shell cases S TB 9005 5018 deep black TB UL 5018 5002 turquoise blue UL 5002 ultramarine blue art. no. f.cool.e 08-2014 f.cool.e 08-2014 Hausadresse/House Address/Adresse Postfach 1590 * D-58465 Ludenscheidde domicile Nottebohmstr. 28 * D-58511 Ludenscheid Hausadresse/House Address/Adresse de domicile Telefon: 0 23 51 / 4 35 - 0 Nottebohmstr. 28 * D-58511 Ludenscheid Telefax: Telefon: 0 23 51 / 4 35 - 0 Verkauf / sales / ventes Telefax: 0 23 51 / 4 57 54 Verkauf / sales / ventes Einkauf / purchasing / achats 0 23 51 / 4 57 54 0 23 51 / Elektronik 45 94 33 Fischer GmbH & Co. KG Einkauf / purchasing / achats Export / exports / exports P.O. Box 1590 0 23 51 / Elektronik 45 94 33 Fischer GmbH & Co. KG 0 23 51 /Ludenscheid 43 51 85 D-58465 Export / exports P.O. Box 1590 / exports info@fischerelektronik.de 0 23 51 /Ludenscheid 43 51 85 D-58465 House Address www.fischerelektronik.de info@fischerelektronik.de Nottebohmstr. 28 House Address www.fischerelektronik.de Fischer Elektronik D-58511 Ludenscheid Nottebohmstr. 28 Osterreich Fon: +49Ges. (0) 23m.b.H. 51 4 35 - 0 Fischer Elektronik D-58511 Ludenscheid Firmiangasse 49 51 * A -1130 Wien Fax: sales +49 (0) 23 51 4 57 54 Osterreich Fon: +49Ges. (0) 23m.b.H. 51 4 35 - 0 Telefon: 01 +49 / 8 76 purchasing (0) 62 23 27 51 45 94 33 Firmiangasse 49 (0) - 5123* 51 A -1130 Wien Fax: sales +49 4 57 54 exports 01 +49 (0) 62 23 27-11 51 43 51 85 Telefax: / 8 76 Telefon: 01 +49 / 8 76 purchasing (0) 62 23 27 51 45 94 33 info@fischerelektronik.de online@fischerelektronik.co.at exports 01 +49 (0) 62 23 27-11 51 43 51 85 Telefax: / 8 76 www.fischerelektronik.de www.fischerelektronik.at info@fischerelektronik.de online@fischerelektronik.co.at www.fischerelektronik.de www.fischerelektronik.at gold-plated deep black turquoise blue ultramarine blue ARTICLES ARTICLES system cases RackCase/shell cases bench cases/shell cases/system cases RackCase bench cases/shell cases/system cases RackCase system cases RackCase/shell cases system cases RackCase/shell cases Plusline/shell cases Plusline/shell cases Quotations for Fischer Elektronik 3 C-print on Alu Dibond 65,5 x 98 cm from: Thomas Kellner www.thomaskellner.com A A1 - A 140 B B1 - B 62 C C1 - C 22 D D1 - D 36 E E1 - E 52 F F1 - F 28 G G1 - G 84 H H1 - H 12 I I1 - I 28 K K1 - K 28 L L1 - L 10 M M1 - M 56 N N1 - N 80 A1 - A 140 A Heatsinks for processors and LED: heatsinks and fan coolers for universal PGA/BGA, DIL, PLCC, Intel Pentium Xeon, Intel Pentium IV, heatsinks for LED B1 - B 62 B Board level heatsinks: finger-shaped heatsinks, heatsinks for transistors in plastic case, attachable heatsinks, small heatsinks, copper heatsinks for D PAK and others C1 - C 22 C Cooling aggregates: miniature cooling aggregates, heatsink cooling aggregates, high capacity cooling aggregates, multi module cooling aggregates, hollow-fin aggregates D1 - D 36 D Accessories for electronic components: mounting parts for heatsinks, thermal transfer compound, thermally conductive material, aluminium oxide and mica wafers, silicone washers, guide rails, solder stop plug, clip fastening for mounting rail E1 - E 50 E Sockets: IC-sockets for DIL, PLCC, sockets for transistors, LED displays, crystal oscillators and connector-sleeves F1 - F 28 F PCB connectors and accessories: male and female headers, grid spacing 2.54, 2.00 and 1.27 mm, high precision contact strips, jumpers G1 - G 84 G IDC connectors: design DIL, single and double row female headers, lockable connectors, ribbon cable H1 - H 12 H D-Sub connectors: male and female headers, connectors with mounting angle, connectors for ribbon cable, SMD and mixed layout, D-Sub shells, cut-out covers I1 - I 28 I Brackets: brackets for PC and PCI with or without fixing tab, retainer for ISA versions K1 - K 32 K Optoelectronics: LED-holders for front panel assembly, LED-holder without LED, LED-holder with mounted LED, light pipes for SMDs L1 - L 10 L Cases: desk consoles, shell cases, extruded assembled cases, combination cases, tube cases, miniature aluminium cases, design cases, cooling cases, ventilation frames, feet and bushings, special front panels, sheet constructions M1 - M 56 M 19" Extension systems: plug-in chassis, subracks, bench cases, system cases, insert modules, part front panels, rack handles, PC-board holder, extender cards N1 - N 80 N Extruded profiles: extruded heatsinks, extruded heatsinks with solder pins, fin coolers, fluid coolers, high-performance heatsinks Alphanumerical product list art. no. ABM 2550 ABM 3050 ABM 4070 ABM 5080 ABM TE 04 ABM TE 04 DIN ABM TE 06 ABM TE 06 DIN ABM TE 08 ABM TE 08 DIN ABP 2550 ABP 3060 ABP 4080 AHG K 27 AHG K 28 AHG L 7 AHG V 14 AHG V 17 AHM 3260 AHM 4380 AKK 127 AKK 191 AOS 3 AOS 3 P AOS 3 P 2 AOS 3 P SL AOS 5 AOS 18 AOS 32 AOS 66 AOS 93 AOS 127 AOS 218 247 AOS 218 247 1 AOS 220 AOS 220 3 AOS 220 4 AOS 220 SL AOS 247 AOS P 1 AOS P 1.1 AOS P 2 AOS P 3 AOS P 4 AOS P 5 AOS P 6 AOS P 7 AOS P 8 AOS P 9 AOS P 10 CLIP 151 DR 071 V0 DR 072 V0 DR 073 V0 DR 074 V0 DR 075 V0 DR 076 V0 DR 077 V0 DR 078 V0 DR 079 V0 DR 081 V0 DR 082 V0 DR 083 V0 DR 084 V0 DR 085 V0 DR 086 V0 DR 087 V0 DR 088 V0 DR 089 V0 DR 105 V0 DR 110 V0 DR 115 V0 DR 120 V0 DR 125 V0 DR 130 V0 page E 38 E 38 E 38 E 38 E 39 E 39 E 39 E 39 E 39 E 39 E 38 E 38 E 38 E 31 E 31 E 31 E 31 E 31 E 39 E 39 A 125 A 125 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 17 E 18 E 18 E 18 E 18 E 18 E 18 E 18 E 18 E 18 E 18 E 18 E 26 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 art. no. DR 135 V0 DR 140 V0 DR 145 V0 DR 150 V0 DR 710 V0 DR 711 V0 DR 712 V0 DR 713 V0 DR 714 V0 DR 715 V0 DR 720 V0 DR 725 V0 DR 730 V0 DR 735 V0 DR 740 V0 DR 745 V0 DR 750 V0 DR 760 V0 DR 810 V0 DR 811 V0 DR 812 V0 DR 813 V0 DR 814 V0 DR 815 V0 DR 820 V0 DR 825 V0 DR 830 V0 DR 835 V0 DR 840 V0 DR 845 V0 DR 850 V0 DR 860 V0 ELS 3 EPN 1 FK 201 SA FK 201 SA 3 FK 201 SA CB FK 202 SA FK 202 SA 3 FK 202 SA CB FK 205 SA L FK 206 SA L FK 207 SA L FK 208 SA L FK 209 SA 32 FK 210 SA CB FK 211 32 FK 212 CB FK 213 SA 32 FK 214 SA CB FK 215 32 FK 216 CB FK 217 SA CB 2 FK 218 32 FK 219 CB 1 FK 219 CB 2 FK 219 CB 3 FK 220 SA 220 FK 222 FK 222 THF FK 223 SA FK 223 SA 3 FK 223 SA CB FK 224 ... 218 1 FK 224 ... 218 2 FK 224 ... 220 1 FK 224 ... 220 2 FK 224 ... P SIP FK 225 SA L 1 FK 225 SA L 2 FK 227 SA L 1 FK 228 SA L 1 FK 229 SA L 1 FK 230 SA L 1 FK 231 SA 220 page E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 E 40 A 88 E 44 C2 C2 C2 C2 C2 C2 C2 C2 C2 C2 C6 C6 C7 C7 C6 C6 C7 C7 C3 C8 C9 C9 C9 C 10 C7 C7 C3 C3 C3 C 11 C 11 C 11 C 11 C 10 C5 C5 C8 C5 C5 C5 C6 art. no. FK 232 220 FK 233 220 FK 234 SA L 1 FK 234 SA L 2 FK 234 SA L 3 FK 234 SA L 4 FK 235 MI L 1 FK 235 MI L 2 FK 235 SA L 1 FK 235 SA L 2 FK 236 220 FK 236 CB FK 237 SA 220 H FK 237 SA 220 O FK 237 SA 220 V FK 237 SA 220 VL FK 238 SA L 1 FK 239 SA 32 FK 240 SA 220 H FK 240 SA 220 O FK 240 SA 220 V FK 240 SA 220 VL FK 241 SA 218 V FK 242 SA 220 H FK 242 SA 220 O FK 242 SA 220 V FK 242 SA 220 VL FK 243 MI 247 H FK 243 MI 247 O FK 243 MI 247 V FK 244 08 D2 PAK FK 244 08 D3 PAK FK 244 08 D PAK FK 244 13 D2 PAK FK 244 13 D3 PAK FK 244 13 D PAK FK 245 MI 247 H FK 245 MI 247 O FK 245 MI 247 V FK 247 220 FK 248 SA 220 FK 249 SA 220 FK 250 06 LF PAK FK 250 08 LF PAK FK 250 10 LF PAK FK 251 06 LF PAK FK 251 08 LF PAK FK 251 10 LF PAK FK 252 SA 220 H FK 252 SA 220 O FK 252 SA 220 V FK 252 SA 220 VL FK 253 FK 254 SA 3 FK 255 FK 256 FK 257 FK 258 SA 220 FK 318 SA FK 318 SA 3 FL 0,55 FL 1,1 FLKI 80 FLKI 80 G 200 FLKI 80 G 300 FLKI 80 G 500 FLKR 1 FLKU 140 FLKU 140 G 200 FLKU 140 G 300 FLKU 140 G 500 FS 6 065 FS 6 070 FS 6 080 FS 6 090 page C8 C8 C4 C4 C4 C4 C4 C4 C4 C4 C9 C9 C 14 C 13 C 14 C 14 C8 C6 C 14 C 13 C 14 C 14 C 11 C 14 C 13 C 14 C 14 C 12 C 12 C 12 C 21 C 21 C 21 C 21 C 21 C 21 C 12 C 12 C 12 C7 C 11 C5 C 22 C 22 C 22 C 22 C 22 C 22 C 15 C 15 C 15 C 15 C 16 C2 C 16 C 22 C 16 C 10 C2 C2 A 128 A 128 A 131 A 132 A 132 A 132 A 133 A 131 A 132 A 132 A 132 E 27 E 27 E 27 E 27 art. no. FS 6 100 FS 6 110 FS 6 120 FS 6 130 FS 85 FS 85 50 FS 85 60 FS 85 70 FS 100 FS 109 FS 151 P FS BF 06 FS BF 07 FS BF 10 FS BF 11 FS BF 13 FS BF 15 FS BF 19 FS BF 20 FS BT 06 FS BT 08 FS BT 10 FS BT 11 FS BT 13 FS BT 15 FS BT 16 FS BT 19 FS BT 20 FSF 52 P FS LP 05 FS LP 07 FS LP 08 FS LP 10 FS LP 11 FS LP 13 FS LP 15 FS LP 16 FS LP 17 FS LP 22 FS LP 30 FS S 06 2 FS S 07 2 FS S 08 2 FS S 10 2 FS S 11 2 FS S 12 2 FS S 13 2 FS S 15 2 FS S 16 2 FS S 19 3 FS S 20 3 FS S 21 2 FS S 21 3 FS U 06 FS U 11 FS U 20 GBM 2550 GBM 3050 GBM 4070 GBM 5080 GBP 3060 GBP 4080 GEL ... GEL G ... GEL 27 S ... GEL 28 ... GEL 28 G ... GEL 45 ... GEL 45 G ... GEL 60 ... GEL 60 G ... GEL F 15 ... GEL F 15 G ... GS 3 GS 3 P page E 27 E 27 E 27 E 27 E 28 E 28 E 28 E 28 E 27 E 27 E 26 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 20 E 30 E 30 E 30 E 30 E 30 E 30 E 30 E 30 E 30 E 30 E 30 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 29 E 30 E 30 E 30 E 37 E 37 E 37 E 37 E 37 E 37 E 12 E 15 E 13 E 14 E 15 E 11 E 19 E 19 Alphanumerical product list art. no. GS 3 P SL GS 32 P GS 66 P GS 218 GS 220 4 GS 220 C GS 220 P IB 1 IB 2 IB 3 IB 4 IB 5 IB 6 IB 7 IB 8 IB 9 IB 10 IB 11 IB 12 IB 13 IB 14 IB 15 IB 16 IB 17 IB 18 IBT 1 IBT 2 IBT 3 IBT 4 IBT 6 IBT 7 IBT 8 IBT 9 IBT 10 IBT 11 IBT 12 IBT 14 IBT 15 IBT 18 ICK 6 8 L ICK 14 16 B ICK 14 16 L ICK 14 H ICK 16 H ICK 18 H ICK 20 L ICK 24 B ICK 28 B ICK 35 SA ICK 36 B ICK 40 B ICK 1000 B ICK 1000 H ICK BGA 10 x 10 ICK BGA 10 x 10 x 10 ICK BGA 14 x 14 ICK BGA 14 x 14 x 10 ICK BGA 21 x 21 ICK BGA 23 x 23 ICK BGA 23 x 23 x 10 ICK BGA 27 x 27 ICK BGA 27 x 27 x 10 ICK BGA 27 x 27 x 14 ICK BGA 27 x 27 x 22 ICK BGA 31 x 31 ICK BGA 31 x 31 x 10 ICK BGA 35 x 35 ICK BGA 35 x 35 x 10 ICK BGA 37 x 37 x 6 ICK BGA 37 x 37 x 10 ICK BGA 40 x 40 ICK BGA 40 x 40 x 10 ICK BGA 42,5 x 45 ICK EM 25 ICK LED R 23,5 x 14 page E 19 E 19 E 19 E 19 E 19 E 19 E 19 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 E 52 B 52 B 52 B 52 B 52 B 52 B 52 B 52 B 52 B 52 A 124 B 52 B 52 B 52 B 52 B 17 B 17 B 17 B 17 B 18 B 18 B 18 B 18 B 18 B 18 B 19 B 19 B 19 B 19 B 19 B 19 B 20 B 20 B 20 B 20 B 56 B 35 art. no. ICK LED R 23,5 x 14 G ICK LED R 27 x 10 ICK LED R 27 x 10 G ICK LED R 28 x 15 ICK LED R 28 x 15 G ICK LED R 29 x 11,5 ICK LED R 29 x 11,5 G ICK LED R 32 x 14 ICK LED R 32 x 14 G ICK LED R 33 x 10 ICK LED R 33 x 10 G ICK LED R 33 x 16,5 ICK LED R 33 x 16,5 G ICK LED R 35 x 10 ICK LED R 35 x 10 G ICK LED R 36 x 12 ICK LED R 36 x 12 G ICK LED R 40 x 10 ICK LED R 40 x 10 G ICK LED R 40 x 27 ICK LED R 40 x 27 G ICK LED R 45,7 x 16,5 ICK LED R 45,7 x 16,5 G ICK LED R 50,8 x 16,5 ICK LED R 50,8 x 16,5 G ICK LED R 50 x 10 ICK LED R 50 x 10 G ICK LED R 54 x 20 ICK LED R 54 x 20 G ICK LED R 66 x 40 ICK LED R 75 x 10 ICK LED R 84 x 40 ICK LED R 100 x 40 ICK LED R 160 x 40 ICK LED R 200 x 40 ICK PEN 3 FC ICK PEN 3 XE ICK PEN 3 XE 1 ICK PEN 38 F ICK PEN 38 W ICK PEN 45 W ICK PGA 6 x 6 x 14 ICK PGA 8 x 8 x 12 ICK PGA 9 x 9 ICK PGA 11 x 11 ICK PGA 11 x 11 x 8 ICK PGA 11 x 11 x 12 ICK PGA 14 x 14 ICK PGA 14 x 14 x 10 ICK PGA 14 x 14 x 12 ICK PGA 14 x 14 x 14 ICK PGA 15 x 15 ICK PGA 16 x 16 x 8 ICK PGA 16 x 16 x 10 ICK PGA 16 x 16 x 12 ICK PGA 17 x 17 ICK PGA 17 x 17 x 8 ICK PGA 17 x 17 x 12 ICK PGA 18 x 18 ICK PGA 19 x 19 ICK PGA 19 x 19 x 12 ICK PGA 20 x 20 ICK PGA 20 x 20 K ICK PGA 20 x 20 x 8 ICK PGA 20 x 20 x 10 ICK PGA 20 x 20 x 12 ICK PGA 21 x 21 ICK PGA 22 x 22 ICK PGA 25 x 25 ICK PLCC 28 ICK PPC 51 ICK PRO 40 W ICK R ICK S 10 x 10 x 6,5 ICK S 10 x 10 x 10 page B 35 B 35 B 35 B 35 B 36 B 36 B 36 B 36 B 36 B 36 B 36 B 37 B 37 B 37 B 37 B 37 B 37 B 37 B 38 B 38 B 38 B 38 B 38 B 39 B 39 B 38 B 39 B 39 B 39 B 39 B 40 B 40 B 40 B 40 B 41 B 57 B 56 B 56 B 57 B 57 B 57 B 11 B 11 B 11 B 11 B 11 B 12 B 12 B 12 B 12 B 12 B 12 B 13 B 13 B 13 B 13 B 13 B 13 B 14 B 14 B 14 B 14 B 15 B 15 B 14 B 15 B 15 B 15 B 16 B 52 B 56 B 57 B 52 B 21 B 21 art. no. ICK S 10 x 10 x 12,5 ICK S 10 x 10 x 18,5 ICK S 14 x 14 x 6,5 ICK S 14 x 14 x 10 ICK S 14 x 14 x 12,5 ICK S 14 x 14 x 18,5 ICK S 17 x 17 x 15 ICK S 17 x 17 x 20 ICK S 18 x 18 x 6,5 ICK S 18 x 18 x 10 ICK S 22 x 22 x 10 ICK S 22 x 22 x 18,5 ICK S 25 x 25 x 6,5 ICK S 25 x 25 x 12,5 ICK S 25 x 25 x 18,5 ICK S 29 x 29 x 10 ICK S 29 x 29 x 20 ICK S 29 x 29 x 30 ICK S 32 x 32 x 10 ICK S 32 x 32 x 20 ICK S 36 x 36 x 10 ICK S 36 x 36 x 15 ICK S 36 x 36 x 20 ICK S 36 x 36 x 30 ICK S 40 x 40 x 10 ICK S 40 x 40 x 20 ICK S 40 x 40 x 25 ICK S 45 x 45 x 10 ICK S 45 x 45 x 20 ICK S 50 x 50 x 20 ICK S 50 x 50 x 25 ICK S 50 x 50 x 40 ICK S 50 x 50 x 50 ICK S 98 x 98 x 30 ICK S 98 x 98 x 45 ICK S D 12 x 12 x 7,5 ICK S D 18 x 12 x 7,5 ICK S D 24 x 18 x 7,5 ICK S D 98 x 98 x 10 ICK SMD A 5 ICK SMD A 8 ICK SMD A 10 ICK SMD A 13 ICK SMD A 17 ICK SMD A 22 ICK SMD B 5 ICK SMD B 7 SA ICK SMD B 10 SA ICK SMD B 13 SA ICK SMD B 19 ICK SMD BOX 1 ICK SMD C 7 SA ICK SMD C 10 SA ICK SMD C 17 ICK SMD E 15 SA ICK SMD E 22 SA ICK SMD E 29 SA ICK SMD F 8 ICK SMD F 10 ICK SMD F 17 SA ICK SMD F 19 ICK SMD F 21 ICK SMD F 26 ICK SMD G 8 MI ICK SMD G 10 ICK SMD G 13 SA ICK SMD G 17 SA ICK SMD G 19 SA ICK SMD G 21 ICK SMD H 8 ICK SMD H 10 ICK SMD H 17 ICK SMD H 19 SA ICK SMD H 25 ICK SMD K 8 page B 21 B 22 B 22 B 22 B 22 B 22 B 22 B 23 B 23 B 23 B 23 B 23 B 23 B 24 B 24 B 24 B 24 B 24 B 24 B 25 B 25 B 25 B 25 B 25 B 25 B 26 B 26 B 26 B 26 B 26 B 26 B 27 B 27 B 27 B 27 B 28 B 28 B 28 B 28 B 53 B 53 B 53 B 53 B 53 B 53 B 53 B 53 B 53 B 53 B 53 B 55 B 53 B 53 B 53 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 art. no. ICK SMD K 10 SA ICK SMD K 13 ICK SMD K 17 ICK SMD K 19 ICK SMD K 21 ICK SMD M 8 SA ICK SMD M 10 SA ICK SMD M 17 MI ICK SMD M 19 SA ICK SMD M 21 SA ICK SMD N 8 ICK SMD N 10 ICK SMD N 17 ICK SMD N 19 ICK SMD N 21 ICK SMD N 26 ICK S R 28,5 x 6,5 ICK S R 28,5 x 10 ICK S R 28,5 x 12,5 ICK S R 28,5 x 18,5 ICK S R 32,5 x 10 ICK S R 32,5 x 20 ICK S R 32,5 x 30 ICK S R 32,5 x 40 ICK S R 32,5 x 50 ICK S R 36,5 x 20 ICK S R 40 x 10 ICK S R 40 x 20 ICK S R 40 x 30 ICK S R 40 x 50 ICK S R 45 x 30 ICK S R 45 x 45 ICK S R 50 x 10 ICK S R 50 x 20 ICK S R 50 x 30 ICK S R 50 x 45 ICK S R 54 x 20 ICK S R 54 x 30 ICK S R 54 x 45 ICK S R 70 x 30 ICK S R 70 x 50 ICK S R 85 x 30 ICK S R 85 x 45 ICK S R 98 x 30 ICK S R 98 x 50 ICK S R A 40 x 20 IK 3 IK 341 3 IS 1 IS 2 IS 3 IS 4 IS 5 IS 6 IS 7 IS 8 IS 53 ISAB 3 A ISAB 3 B ISAB 3 C ISAB 4 A ISAB 4 B ISAB 4 C ISAB 5 B ISAB 5 C ISAB 6 A ISAB 6 B ISAB 6 C ISAB 25 A ISAB 25 B ISAB 25 C ISAM 2 A ISAM 2 B ISAM 2 C ISAM 3 A page B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 54 B 55 B 55 B 55 B 55 B 55 B 55 B 29 B 29 B 29 B 29 B 29 B 29 B 30 B 30 B 30 B 30 B 30 B 30 B 31 B 31 B 31 B 31 B 31 B 32 B 32 B 32 B 32 B 32 B 33 B 33 B 33 B 33 B 33 B 34 B 34 B 31 E 51 E 51 E 49 E 49 E 49 E 49 E 49 E 49 E 50 E 50 A 127 E 32 E 33 E 33 E 32 E 33 E 33 E 33 E 33 E 32 E 33 E 33 E 32 E 33 E 33 E 34 E 34 E 34 E 34 Alphanumerical product list art. no. ISAM 3 B ISAM 3 C ISAS 25 A ISAS 25 B ISAS 25 C ISAS 30 A ISAS 30 B ISAS 30 C ISAS 40 A ISAS 40 B ISAS 40 C ISAS 50 A ISAS 50 B ISAS 50 C ISAS 60 A ISAS 60 B ISAS 60 C ISP 218 ISP 220 ISP 220 V ISP 247 K 0,55 K 1,1 K3 K3T K5 K9 K 15 KAP 1 P KAP 3 G KAP 3 K KAP 218 KAP 218 O KAP 220 G KAP 220 K KAP 220 O KAP 247 O KF 5/10 KF 5/15 KF 5/5 KK 1 3,96 KK 1 6,35 KK 1 12,7 KK 1 19,05 KK 32 KK 92 KK 562 GS KL 35 50 KL 35 75 KL 35 100 KL 35 K 40 KL 35 K 50 KL 35 K 75 KL 35 K 100 KTE 1 KTE 2 KTE R LA 1 01 LA 1 02 LA 1 03 LA 1 04 LA 1 05 LA 1 06 LA 1 07 LA 1 08 LA 1 09 LA 1 10 LA 2 01 LA 2 02 LA 2 03 LA 2 04 LA 2 05 LA 2 06 LA 2 07 LA 2 08 page E 34 E 34 E 35 E 36 E 36 E 35 E 36 E 36 E 35 E 36 E 36 E 35 E 36 E 36 E 35 E 36 E 36 E 45 E 45 E 45 E 45 A 128 A 128 A 126 A 126 A 126 A 126 A 127 E 16 E 16 E 16 E 16 E 16 E 16 E 16 E 16 E 16 C 18 C 18 C 18 C 17 C 17 C 17 C 17 C 19 C 19 C 18 E 25 E 25 E 25 E 25 E 25 E 25 E 25 A 129 A 129 B 47 D5 D5 D5 D5 D5 D5 D5 D5 D5 D5 D7 D7 D7 D7 D7 D7 D7 D7 art. no. LA 2 09 LA 2 10 LA 4 LA 5 LA 6 LA 7 LA 8 LA 9 LA 10 LA 11 LA 14 LA 15 LA 17 LA 18 LA 20 LA 21 LA 22 LA 25 LA 26 LA 27 K LAGI 40 LAGI 60 LAGI 80 LAGI 92 LAGI 119 LA HL 1 LA HL 2 LA HL 3 LAHL D 1 LAHLR 1 500 LA HLV 1 LA HLV 2 LA HLV 3 LA ICK 15 x 15 F 05 LA ICK 15 x 15 F 12 LA ICK 17 x 17 F 12 LA ICK 17 x 17 F 12 A LA ICK 17 x 17 W 05 LA ICK 17 x 17 W 12 LA ICK 18 x 18 F 12 LA ICK 18 x 18 W 12 LA ICK 21 x 21 F 05 LA ICK 21 x 21 F 12 LA ICK 21 x 21 W 05 LA ICK 21 x 21 W 12 LA ICK PEN 2 K 12 LA ICK PEN 3 XE LA ICK PEN 4 1 K LA ICK PEN 8 F 05 LA ICK PEN 8 F 12 LA ICK PEN 8 W 05 LA ICK PEN 8 W 12 LA ICK PEN 16 K 12 LA ICK PEN 16 W 12 LA ICK PEN 16 W 12 A LA ICK PEN 18 W 12 LA ICK PEN 38 W 12 LA ICK PRO 25 F 12 LA LED 40 x 30 LA LED 50 x 20 LA LED 50 x 45 LA LED 68 LAM 1 LAM 2 LAM 3 LAM 3 K LAM 4 LAM 4 K LAM 5 LAM 5 K LA V 6 LA V 7 LA V 8 LA V 9 LA V 10 page D7 D7 D 14 D 14 D 15 D 15 D 15 D 17 D 17 D 17 D 19 D 19 D 21 D 21 D 34 D 23 D 23 D 33 D 33 D 13 D 36 D 36 D 36 D 36 D 36 D 27 D 27 D 27 D 29 D 35 D 28 D 28 D 28 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 60 B 60 B 60 B 59 B 59 B 59 B 59 B 59 B 59 B 59 B 59 B 59 B 59 B 49 B 49 B 49 B 50 D9 D9 D 10 D 10 D 11 D 11 D 12 D 12 D 16 D 16 D 16 D 18 D 18 art. no. LA V 11 LA V 14 LA V 15 LA V 17 LA V 18 LA V 21 LA V 22 LA V 24 LS 101 LS 102 LS 103 LS 104 LS 105 LS 106 LS 107 LSD 07520 LSD 08910 LSD 08920 LSD 13510 LSD 13520 MD A 04 MD A 06 MD A 07 MD A 09 MD A 12 MD B 07 MD B 10 MD B 11 MD B 12 MD B 15 MD C 13 MD C 22 MLW 32 MLW 44 MLW 51 MRL 20 MS 34 518 MS 53 3 MS 53 7 MS 53 25 MS 54 25 MS 56 15 MS 58 5 MS 58 7 MS 58 15 MS 84 4 MS 183 7 MS 183 25 MS 183 35 MS 184 7 MS 184 25 MS 184 35 MS 510 15 MS 923 25 MS 3518 25 MS 3518 35 MS 4016 MSHV 90 MST 3 MST 220 MSTS 3 MSTS 220 MSVL 50 MSVL 60 MSVL 70 MSVL 85 MSVL 100 SFP 005 SFP 006 SFP 007 SFP 016 SFP 028 SFP 029 SFP 037 SFP 046 page D 18 D 20 D 20 D 22 D 22 D 24 D 24 D 25 E 43 E 43 E 43 E 43 E 43 E 43 E 43 E 42 E 42 E 42 E 42 E 42 E 48 E 48 E 48 E 48 E 48 E 48 E 48 E 48 E 48 E 48 E 48 E 48 E 47 E 47 E 47 E 47 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 46 E 28 E 44 E 44 E 44 E 44 E 28 E 28 E 28 E 28 E 27 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 art. no. SFP 054 SFP 057 SFP 058 SFP 060 SFP 067 SFP 074 SFP 076 SFP 079 SFP 090 SFP 100 SFP 106 SFP 112 SK 01 SK 02 SK 03 SK 04 SK 05 SK 06 SK 07 SK 08 SK 09 SK 11 SK 12 SK 12 SA 2 x 32 SK 12 SA 32 SK 13 SK 13 35 SA 220 SK 13 35 SA 220 3,2 SK 13 35 SA 220 3,5 SK 14 SK 15 SK 16 SK 18 SK 19 SK 20 SK 21 SK 23 SK 25 SK 28 SK 30 SK 31 SK 32 SK 33 SK 34 SK 36 SK 39 SK 40 SK 42 SK 44 SK 45 SK 46 SK 47 SK 48 SK 49 SK 50 SK 51 SK 52 SK 53 SK 55 SK 56 SK 57 SK 58 SK 59 SK 60 SK 61 SK 63 SK 64 SK 65 SK 66 SK 67 SK 68 SK 69 SK 71 SK 72 SK 73 page A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 66 A 66 A 66 A 64 A 62 A 79 A 72 A 73 A 59 A 79 A 123 A 124 A 124 A 123 A 124 A 124 A 124 A 67 A 77 A 72 A 62 A 63 A 68 A 70 A 79 A 61 A 63 A 67 A 72 A 76 A 42 A 67 A 66 A 67 A 82 A 49 A 90 A 63 B 43 A 49 A 73 A 51 A 37 A 61 A 74 A 74 A 83 A 54 A 64 A 45 A 60 A 74 A 82 A 62 A 70 A 70 A 55 A 69 A 89 A 71 A 64 A 63 A 64 Alphanumerical product list art. no. SK 74 SK 75 25 SK 75 25 STS TO 220 SK 75 25 TO 220 SK 75 37,5 SK 75 37,5 STS TO 220 SK 75 37,5 TO 220 SK 75 50 SK 75 50 STS TO 220 SK 75 50 TO 220 SK 75 75 SK 75 1000 SK 76 25 SK 76 25 STS TO 220 SK 76 25 TO 220 SK 76 37,5 SK 76 37,5 STS TO 220 SK 76 37,5 TO 220 SK 76 50 SK 76 50 STS TO 220 SK 76 50 TO 220 SK 76 75 SK 76 1000 SK 78 SK 79 SK 80 SK 81 SK 82 SK 83 SK 84 SK 85 SK 86 SK 88 SK 89 SK 90 SK 91 SK 92 SK 93 SK 94 SK 95 15 SK 95 15 SOT 32 S SK 95 15 STS SOT 32 S SK 95 25 SK 95 25 1 x M2,5 1 x M3 SK 95 25 2 x M3 SK 95 25 SOT 32 SK 95 25 STS SOT 32 SK 95 25 STS TO 220 SK 95 25 TO 220 SK 95 1000 SK 96 SK 97 SK 98 SK 99 SK 100 SK 101 SK 102 SK 104 ... LS SK 104 ... STC SK 104 ... STIC SK 104 ... STCB SK 104 ... STS SK 104 ... STIS SK 104 ... STSB SK 105 SK 106 SK 107 SK 108 SK 109 SK 110 SK 111 SK 112 SK 113 SK 115 SK 118 page A 71 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 105 A 61 A 73 A 74 A 41 A 75 A 79 A 68 A 46 A 75 A 73 A 77 A 48 A 52 A 41 A 56 A 49 A 108 A 108 A 108 A 108 A 108 A 108 A 108 A 108 A 108 A 108 A 108 A 91 A 62 A 65 A 37 A 38 A 54 A 50 A 98 A 97 A 97 A 90 A 31 A 60 A 80 A 80 A 80 A 81 A 89 A 48 A 123 A 51 art. no. SK 119 SK 120 SK 121 SK 122 SK 124 SK 125 SK 126 25 SK 126 25 2 x M3 SK 126 25 STS TO 220 SK 126 25 TO 220 SK 126 37,5 SK 126 37,5 2 x M3 SK 126 37,5 STS TO 220 SK 126 37,5 TO 220 SK 126 1000 SK 128 SK 129 ... STC SK 129 ... STIC SK 129 ... STCB SK 129 ... STS SK 129 ... STIS SK 129 ... STSB SK 130 SK 132 SK 133 SK 134 SK 135 SK 136 SK 138 SK 139 SK 140 SK 144 SK 145 SK 145 25 STC SK 145 25 STS TO 220 SK 145 30 STC SK 145 37,5 STS TO 220 SK 145 50 STC SK 145 50 STS TO 220 SK 147 SK 148 SK 149 SK 150 SK 153 SK 154 SK 155 SK 156 SK 157 SK 158 SK 159 SK 160 SK 161 SK 162 SK 163 SK 165 SK 166 SK 168 SK 172 SK 173 SK 174 SK 175 SK 176 SK 177 SK 178 SK 179 SK 180 SK 181 SK 181 94 C 3 x TO 220 SK 182 SK 184 SK 185 SK 185 25 STC TO 220 SK 185 25 STS TO 220 SK 185 25 TO 220 SK 185 37,5 STC TO 220 page A 47 A 45 A 42 A 60 A 71 A 91 A 107 A 107 A 107 A 107 A 107 A 107 A 107 A 107 A 107 A 91 A 103 A 103 A 56 A 44 A 44 A 28 A 39 A 48 A 91 A 53 A 77 A 82 A 59 A 106 A 106 A 106 A 106 A 106 A 106 A 74 A 68 A 53 A 61 A 83 A 46 A 45 A 36 A 54 A 58 A 58 A 58 A 58 A 58 A 78 A 61 A 48 A 50 A 81 A 59 A 30 A 83 A 78 A 27 A 28 A 30 A 36 A 60 A 60 A 40 A 68 A 73 A 104 A 104 A 104 A 104 art. no. SK 185 37,5 STS TO 220 SK 185 37,5 TO 220 SK 185 50 C TO 220 SK 185 50 STC TO 220 SK 185 50 STS TO 220 SK 185 50 TO 220 SK 187 SK 189 SK 190 SK 191 SK 193 SK 194 SK 195 SK 197 SK 198 SK 199 SK 400 SK 400 20 1 x M3 L SK 400 40 2 x M3 L SK 400 60 3 x M3 L SK 401 SK 402 SK 403 SK 404 SK 405 SK 406 SK 407 SK 408 SK 409 ... STC SK 409 ... STIC SK 409 ... STCB SK 409 ... STS SK 409 ... STIS SK 409 ... STSB SK 410 SK 411 SK 412 SK 413 SK 414 SK 415 SK 416 SK 417 SK 418 SK 419 SK 420 SK 421 SK 422 SK 423 SK 424 SK 425 SK 426 SK 427 SK 429 SK 431 1 SK 431 2 SK 431 3 SK 432 SK 433 SK 434 SK 435 SK 436 SK 437 SK 437 ... STC SK 437 ... STC 2 SK 437 ... STS SK 437 ... STS 2 SK 438 SK 439 SK 440 SK 441 SK 442 SK 443 SK 444 SK 445 SK 446 page A 104 A 104 A 104 A 104 A 104 A 104 A 76 A 32 A 52 A 56 A 50 A 81 A 71 A 65 A 53 A 51 A 28 A 111 A 111 A 111 A 63 A 62 A 64 A 65 A 47 A 38 A 39 A 40 A 100 A 100 A 44 A 42 A 47 A 43 A 90 A 90 A 47 A 46 A 58 A 70 A 31 A 47 A 32 A 32 A 34 A 34 A 36 A 36 A 37 A 124 A 124 A 124 A 82 A 41 A 35 A 81 A 37 A 24 A 109 A 109 A 109 A 109 A 52 A 55 D 30 D 30 A 42 A 59 A 38 A 34 A 53 art. no. SK 447 SK 448 SK 448 20 1 x M3 L SK 448 40 2 x M3 L SK 448 60 3 x M3 L SK 450 SK 451 SK 452 SK 452 20 1 x M3 SK 452 20 2 x M3 SK 452 40 2 x M3 SK 452 40 4 x M3 SK 452 60 3 x M3 SK 452 60 6 x M3 SK 452 80 4 x M3 SK 452 80 8 x M3 SK 452 100 5 x M3 SK 452 100 10 x M3 SK 453 SK 454 SK 454 20 1 x M3 SK 454 20 1 x M3 L SK 454 20 2 x M3 SK 454 40 2 x M3 SK 454 40 2 x M3 L SK 454 40 4 x M3 SK 454 60 3 x M3 SK 454 60 3 x M3 L SK 454 60 6 x M3 SK 454 80 4 x M3 SK 454 80 8 x M3 SK 454 100 5 x M3 SK 454 100 10 x M3 SK 455 SK 456 SK 456 20 1 x M3 L SK 456 40 2 x M3 L SK 456 60 3 x M3 L SK 458 SK 459 ... STC SK 459 ... STIC SK 459 ... STCB SK 459 ... STS SK 459 ... STIS SK 459 ... STSB SK 459 25 2 x TO 220 SK 459 25 M SK 459 37,5 2 x TO 220 SK 459 37,5 M SK 459 50 2 x TO 220 SK 459 50 M SK 460 25 SK 460 37,5 SK 460 50 SK 461 SK 463 SK 464 SK 466 SK 467 SK 468 SK 469 SK 469 ... STS SK 470 SK 470 25 STS SK 470 30 STS SK 470 35 STS SK 470 50 STS SK 471 SK 472 SK 473 SK 475 SK 476 SK 477 SK 478 SK 479 page A 26 A 27 A 111 A 111 A 111 A 34 A 91 A 27 A 96 A 96 A 96 A 96 A 96 A 96 A 96 A 96 A 96 A 96 A 33 A 24 A 96 A 111 A 96 A 96 A 111 A 96 A 96 A 111 A 96 A 96 A 96 A 96 A 96 A 33 A 30 A 111 A 111 A 111 D 30 A 101 A 101 A 102 A 102 A 102 A 102 A 102 A 102 A 112 A 112 A 112 D 30 A 43 A 39 A 43 A 33 A 36 A 23 A 110 A 22 A 110 A 110 A 110 A 110 A 29 A 31 A 25 A 35 A 24 A 24 A 23 A 55 Alphanumerical product list art. no. page SK 480 A 84 SK 481 A 85 SK 482 A 86 SK 483 A 87 SK 484 A 110 SK 485 A 38 SK 486 A 25 SK 487 A 87 SK 489 A 85 SK 490 A 84 SK 492 A 84 SK 493 A 28 SK 494 A 83 SK 495 A 87 SK 496 A 22 SK 497 D 30 SK 498 D 30 SK 499 A 87 SK 500 A 72 SK 501 A 54 SK 502 A 49 SK 503 A 46 SK 504 A 45 SK 505 A 41 SK 507 A 40 SK 508 A 41 SK 509 A 29 SK 510 A 46 SK 511 A 32 SK 512 A 84 SK 513 A 31 SK 514 A 86 SK 515 05 10 A 94 SK 515 05 10 S A 94 SK 515 05 23,5 A 94 SK 515 05 23,5 S 2 A 94 SK 515 05 37 A 94 SK 515 05 37 S 3 A 94 SK 515 10 S TO 220 A 94 SK 515 10 TO 220 A 94 SK 515 23,5 S 2 x TO 220 A 94 SK 515 23,5 TO 220 A 94 SK 515 37 S 3 x TO 220 A 94 SK 515 37 TO 220 A 94 SK 516 15 S TO 218 A 94 SK 516 15 TO 218 A 94 SK 516 33 S 2 x TO 218 A 94 SK 517 A 93 SK 518 A 93 SK 519 A 48 SK 520 A 50 SK 521 A 24 SK 522 A 23 SK 523 A 55 SK 524 A 52 SK 525 15 A 95 SK 525 15 ST A 95 SK 525 20 ST A 95 SK 525 25 ST A 95 SK 525 30 A 95 SK 525 30 ST A 95 SK 526 30 ST A 95 SK 527 A 35 SK 530 A 57 SK 531 A 57 SK 533 A 57 SK 535 A 57 SK 536 A 57 SK 537 A 57 SK 538 A 57 SK 539 A 57 SK 540 A 57 SK 544 A 76 SK 545 A 39 SK 546 A 40 art. no. SK 547 SK 548 SK 549 SK 550 SK 551 SK 552 SK 553 SK 554 SK 555 SK 556 SK 557 SK 558 SK 559 SK 560 SK 561 SK 562 SK 563 SK 564 SK 565 SK 566 SK 567 SK 568 SK 569 SK 570 SK 571 SK 572 SK 573 SK 574 SK 575 SK 576 SK 577 SK 578 SK 579 SK 580 SK 581 SK 582 SK 583 SK 584 SK 585 ... SK 586 SK 587 SK 588 SK 589 SK 590 SK 591 SK 592 SK 593 SK 594 SK 595 SK 596 SK 597 SK 598 SK 599 SK 600 ... SK 600 ... SK 600 ... SK 600 ... SK 600 ... SK 600 ... SK 601 SK 602 SK 603 SK 604 SK 605 SK 606 SK 607 SK 608 SK 609 SK 610 SK 611 SK 612 SK 613 SK 614 SK 615 SK 616 STC STIC STCB STS STIS STSB page A 31 A 34 A 29 A 27 A 25 A 23 A 44 A 26 A 51 A 77 A 50 A 23 A 25 A 26 A 26 A 29 A 30 A 30 A 22 A 26 A 35 A 54 B 43 B 44 B 44 B 44 A 85 A 86 A 84 A 85 B 43 B 43 A 55 A 51 A 28 A 25 A 53 B 44 B 42 A 22 A 29 A 45 A 86 B 46 A 49 B 45 A 87 A 38 A 43 A 76 A 27 B 42 B 45 A 99 A 99 A 44 B 43 D 31 D 31 D 31 D 31 D 31 D 31 A 92 A 92 A 92 A 39 A 43 A 52 B 45 A 22 art. no. SK 617 SK 618 SK 619 SK 620 SK 621 SK DC 2 1 76 SA SK DC 4 1 117 SA SK DC 5 1 59 SA SK DC 5 59 SA SK DC 6 1 60 SA SK DC 7 1 117 SA SK DC 7 117 SA SK DC 8 1 60 SA SK DC 8 60 SA SK DC 10 60 SA SKK 56 SKK 58 SKK 510 SK LED 1 SK LED 2 SK LED 3 SK LED BOX 1 SMP 410 A SMP 410 B SMP 410 C SMP 415 A SMP 415 B SMP 415 C SMP 515 A SMP 515 B SMP 515 C STP 4 STP 5 SU 02 SU 03 SU 05 SU 09 SU 16 SU 27 SU 29 SU 32 SVP 01 SVP 04 SVP 10 SVP 12 SVP 13 SWP 02 SWP 06 SWP 10 SWP 15 SWP 23 SWP 25 SWP 29 SWP 36 SWP 40 SWP 55 SWP 57 TF 3 2 THF 104 THF 129 TO 220 THF 220 THF 220 17 THF 247 THF 247 4 THF 249 THF 409 220 1 THF 409 220 2 THF 409 SOT 32 THF 409 TO 220 THF 600 THFA 1 THFA 2 THFA 3 THFA 4 THFK 220 page A 88 B 42 B 42 B 42 A 56 A 114 A 113 A 114 A 114 A 113 A 114 A 114 A 113 A 113 A 113 C 19 C 19 C 19 B 48 B 48 B 48 B 51 E 41 E 41 E 41 E 41 E 41 E 41 E 41 E 41 E 41 A 136 A 136 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 136 A 136 A 136 A 136 A 136 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 A 135 E 50 A 115 A 115 A 115 A 115 A 115 A 115 A 115 A 115 A 115 A 115 A 115 A 115 A 117 A 117 A 117 A 117 A 116 art. no. THFK 247 THFM THFMG THFU 1 THFU 2 THFU 3 THFU 4 THFU 5 THFU 6 THFU 7 UK 14 SA 220 UK 14 SA 220 3,2 UK 14 SA M3 US 58 4 US 512 4 WB 3 WB 3 P WBT 30 WBT 300 WG 3 WG 3 P WGT 300 WK 3 WK 3 P WK 3/4 WKT 24 WKT 300 WL 0,55 WL 1,1 WLFG 9010 R 25 WLFG 9010 R 50 WLFG 9010 R 100 WLFG 9015 R 25 WLFG 9015 R 50 WLFG 9015 R 100 WLFG 9020 R 25 WLFG 9020 R 50 WLFG 9020 R 100 WLFG S 900 K R 25 WLFG S 900 K R 50 WLFG S 900 K R 100 WLFT 88 ... WLFT 404 ... / WLFT 405 .../ WLFT 414 ... WLFT 8943 ... WLK 5 WLK 10 WLK 30 WLK 120 WLK DK 4 WLK DK 10 WLK DK 50 WLK M 4 WLK M 50 WLK P WLP 004 WLP 035 WLP 300 S WLP 500 WLP 500 S WLPF 05 WLPF 10 WLPF 20 WLPF 50 WLPF 300 S WLPK 3 WLPK 5 WLPK 10 WP 4030 100 WP 4030 100 3 WS 3 WS 3 M WS 3 P WS 3/4 page A 116 A 116 A 116 A 119 A 119 A 120 A 120 A 120 A 121 A 121 A 123 A 123 A 123 E 46 E 46 E4 E4 E4 E4 E4 E4 E4 E4 E4 E4 E4 E4 A 128 A 128 E9 E9 E9 E9 E9 E9 E9 E9 E9 E9 E9 E9 E8 E7 E6 E 23 E 23 E 23 E 23 E 24 E 24 E 24 E 24 E 24 E 24 E 21 E 21 E 21 E 21 E 21 E 21 E 21 E 21 E 21 E 21 E 22 E 22 E 22 A 125 A 125 E4 E4 E4 E4 Alphanumerical product list art. no. WSC-220 WSF 16 WSF 32 WSF 635 WSFS 635 WSI 220 210 WSI 220 225 WSI TO 3 PL WSI TOP 3 235 WSI TOP 3 280 WSM-220 WST 30 WST 36 WST 85 page E4 E 10 E 10 E 10 E 10 E5 E5 E5 E5 E5 E4 E4 E4 E4 Index Active heatsinks for processors Aluminium flat-, quadrangular-, angled-, U- & T-profiles Aluminium oxide wafers Attachable heatsink Cooling aggregates with axial fan Cooling aggregates with radial fan Die-cast heatsinks Distance sleeves and spacers Extruded heatsinks for DC/DC converter Extruded heatsinks for lock-in retaining spring Extruded heatsinks for PCB mounting Fastening for mounting rail Fin coolers Finger shaped heatsinks Fluid coolers Guide rails Heat conductive foam and gel foils Heatsinks for BGAs Heatsinks for DIL-IC, PLCC and SMD Heatsinks for D PAK and others Heatsinks for LEDs Heatsinks for PGA High-performance heatsinks High thermoconducting graphite foils Insulating caps and insolater sleeves Insulating clamping parts for power transistors Kapton insulator washers Mica wafers Miniature cooling aggregates Mounting kits for insulation of power transistors Mounting parts for heatsinks Mounts Passive heatsinks for processors Pin heatsinks Protection grid for fans Retaining springs for transistors Segment cooling aggregates Small heatsinks Standard extruded heatsinks Thermal conductive foil one-sided adhesive Thermally conductive adhesive Thermally conductive foil both sides adhesive Thermally conductive foil made of siliconelastomer Thermal transfer compound and thermal interface film U-Extruded heatsinks Vibration dampers and solder terminals B A E C D D A E A A A E A C A E E B B C B B D E E E E E D E E E B B D A D C A E E E E E A E 58-61 135-136 17-18 10-16 13-29 33-35 125-128 32-40 113-114 84-88 89-112 25 129 2-9 131-134 26-31 10-15 17-20 52-55 21-22 35-51 11-16 30-32 9 51-52 45 16 19 9-12 44 49-50 46-48 56-57 21-34 36 115-122 5-9 17-20 22-83 6 23-24 7-8 2-5 20-22 123-124 41-43 certified quality management own tool-making department foresighted storekeeping efficient special machines precise punching department up-to-date milling technology foyer of the company motivated employees committed field service innovative product development Quality-Management System DIN EN ISO 9001 We are certified to DIN EN ISO 9001. This process-directed quality management system implies a constant focus on satisfying the demands of customers, and this is the major objective of our company. The implementation and further development of our quality management system demonstrably ensures - guaranteed customer satisfaction and thus the success of our company, - compliance with customers' requirements at all times through defined processes, - early detection and prevention of errors, and - checking of both process effectiveness and efficiency on a regular basis together with steady improvement. It is through constant vigilance and the provision of evidence that we deliver flawless products, which fully comply with quality requirements, that we maintain our quality certification. In order to secure lasting company success and to meet our customers` expectations now and in the future, we define measurable objectives within the framework of our quality system, which are regularly checked and developed. We are committed to constant measurement and improvement of our performance. Our quality management system applies to all processes carried out by our company. Environmental Management System DIN EN ISO 14001 Fischer Elektronik considers protection of the environment and saving of natural resources entrepreneurial tasks of high priority. Aware of this, Fischer Elektronik was the first German heatsink manufacturer to implement, in 1998, the environmental management system in accordance with DIN EN ISO 14001. Our entrepreneurial responsibility comprises preventing accidents, safeguarding against occupational diseases, designing workplaces to suit human requirements, developing products which are safe to use, saving resources and avoiding environmental impact to the maximum extent possible. We already consider environmental compatibility at the product and process development stage. The environmental impact of our activities is documented, assessed and in a continuous improvement process reduced to a minimum. Implementation and consistent working on and with the environmental management system is a vital process and a constant challenge but finally it will always lead to better results. I BIAS, Milan Electronica, Tel Aviv Electro Salon, Budapest IL HU PCIM, Nuremberg D Elkom, Helsinki FI We exhibit Paris F Hamburg 16. 9. - 18. 9. 2014 www.enova-event.com hall 7.2 23. 9. - 26. 9. 2014 www.windenergyhamburg.com hall B 7, stand 537 Paris F Munich 14. 10. - 15. 10. 2014 www.forumled.com stand B 10 Nuremberg D Bregenz D Nuremberg 24. 2. - 26. 2. 2015 www.embedded-world.de stand 4 A - 311 20. 5. - 22. 5. 2015 www.pcim.de 30. 9. - 2. 10. 2014 www.led-professional.com D London 11. 11. - 14. 11. 2014 www.electronica.de hall B 1, stand 155 A GB 19. 11. - 20. 11. 2014 www.luxlive.co.uk hall A 32 D Stockholm 19. 4. - 21. 4. 2016 www.see-event.se S Explanations - references - printings A ... index area: shows topics/categories "current" SA MI ME TP = = = = "following" ... page number D 15 Standard aluminium profiles Technical explanations Extruded heatsinks Assignment table B ... index area: shows topics/categories A A A A 135 - 136 2-8 22 - 83 18 - 22 black anodised solderable surface clear anodised chrom-free transparent passivated A 10 ... footnotes, give references to pages with combinable or similar products ... option for surface finishing ... link to page ... length on stock in mm ... hole pattern ... symbol of heatsink geometry Rth ... thermal resistance in K/W ... thickness of sheet/plate v ... air/speed in m/s Imprinting of cardholders - Your and our time is expensive An order for imprinting must state the font, the font size and the exact position of the imprint with dimensions, taking due account of countersunk holes etc.. When placing the first order, the company logo must be supplied as a vector file. If these conditions are not complied with, the order for imprinting may have to be turned down, or additional costs will have to be charged. Compliance with the following criteria ensures smooth handling: Adobe Illustrator (.ai/.eps) without half-tone images, fonts transformed into paths or supplied CorelDraw (.cdr) Adobe Acrobat (.pdf) QuarkXPress (.qxd) all fonts enclosed; half-tone images colour-separated (full-tone or scale colours) and InDesign (.indd) with correct resolution (300 dpi colour, black / white 600 dpi), no RGB All this takes additional time and consequently incurs extra costs. The usability must be checked by our printing shop: screen formats (.jpg, .gif, .png) and paper copies, stickers and the like are not suitable for preparing printer`s copies! Copies that definitely cannot be used: Imperfect copies such as fax copies / Microsoft Office files (.doc, .xls, .ppt) can only be used for information or for transmitting texts. Please always add dimensional drawings (.dxf) to the parts to be imprinted! Please note as a general rule: Retouching work extending beyond the standard time will be invoiced additionally at cost price. No part of this catalogue may be reproduced or distributed without prior written consent of Fischer Elektronik. All data contained in this catalogue, in texts, illustrations, documents and descriptions are subject to copyright and the provisions of DIN ISO 16016. All rights reserved. (c) Copyright Fischer Elektronik 1969 ... 2014 Machined heatsinks Fluid heatsinks Lamella heatsinks Extruded heatsink with solder pins Machined heatsinks - several hundreds of extrusion profiles available - future orientated stockkeeping of heatsink profiles in a fully automatic honeycomb warehouse - precise milling treatments in highest quality - effective heat spreading by means of heatsinks with grouted copper areas - designs and modifications according to your demand Fluid heatsinks - fluid heatsinks for dissipation of big heat flow volumes - compact design with internal lamella structure - thick bottom plates for optimal heat dissipation - I- and U streamed versions - water connection or mounting flange for your special application - customized treatments and solutions Lamella heatsinks - compact lamella heatsinks with a big surface - special design for forced convection - thermotechnical optimal fitted lamellas - precise milled flat semiconductor mounting surface - single and double sided bottom plate made of aluminium or copper - production according to customer specified demands Extruded heatsinks with solder pins - solid pressed in soldering pins and threaded bolts for a direct pcb-mounting - for horizontal and vertical mounting position - standard drilling patterns and transistor retaining springs for various semi-conductive elements - soldering pins with insulation for spacing help - variations and modifications according to drawing A Technical introduction 1. General points In order to provide optimum performance of semi-conducting devices it is essential not to exceed the maximum junction temperature indicated by the manufacturer. B Generally this maximum junction temperature can only be maintained without exceeding it by running the device concerned at lower power outputs. At outputs approaching the maximum ratings semi-conductor devices have to be cooled by so called heatsinks, sometimes called dissipators. C The thermal performance of these heatsinks primarily depends on the thermal conductivity of the material from which they are made, size of surface area and mass. In addition, surface colour, mounting position,temperature, ambient air velocity and mounting place all have varying influence on the final performance of the heatsink from one application to another.. D However, a figure for thermal resistance can be experimentally determined in a reliable manner and used in the equations that follow in part 2. There are no agreed international standard methods for testing electronic cooling systems or for the determination of the thermal resistance. E Therefore the diagrams and values given in our catalogue have been determined under practical operating conditions and therefore allow the most suitable heatsink from the range to be selected. We expressly point out that all information and data is given to the best of our knowledge and belief. The user is solely responsible for the proper use of our products and he should check their suitability for the intended application. Fischer Elektronik do not assume any warranty, whether expressed or implied, for the suitability, function or merchantibility of their products in specific or general applications, and they cannot be held liable for accidental or consequential damage due to non-observance of the above. Furthermore Fischer Elektronik reserve the right to carry out technical modifications to their products at any time. All orders are subject to the General Sales Conditions of Fischer Elektronik. F G 2. The determination of thermal resistance The thermal resistance is the parameter that is the most important in cooler selection, apart from mechanical considerations. For determination of the thermal resistance the following equation applies: Equation 1: RthK = H i - u - ( RthG + RthM ) = - RthGM P P In case of an application where the maximum junction temperature is not exceeded the temperature has to be verified. When the case temperature has been measured the use of the following equation will enable the maximum junction temperature to be calculated: Equation 2: i = G + P x RthG I The meaning of the determinants: K i = maximum junction temperature in C of the device as indicated by manufacturer. As a safety factor this should be reduced by 20-30 C. u = ambient temperature in C. The rise in temperature caused by radiant heat of the heatsink should be increased by a margin of 10-30 C. = difference between maximum junction temperature and ambient temperature. G = measured temperature of device case (equation 2). P = maximum power rating of device in watts Rth = thermal resistance in K/W RthG = internal thermal resistance of semiconductor device (as indicated by manufacturer) Heatsinks profile-overview Heatsink special design Special profiles Heatsink as visual & decor-parts L M A A A A 13 - 17 137 - 138 140 10 Heatsinks for SSR Die-cast heatsinks Assigment table Order example A A A A 11 - 12 125 18 - 20 21 A2 N A B C Technical introduction RthM = thermal resistance of mounting surface. For TO 3 cases the following approximate values apply: 1. dry, without insulatar 2. with thermal compound/without insulator 3. Aluminium oxide wafer with thermal compound 4. Mica wafer (0.05 mm thick) with thermal compound RthK = thermal resistance of heatsink, which can be directly taken from the diagrams RthGM = sum of RthG and RthM. For parallel connections of several transistors the value RthGM can be determined by the following equation: 1 = RthGM ges. Equation 3: D 0.05 - 0.20 K/W 0.005 - 0.10 K/W 0.20 - 0.60 K/W 0.40 - 0.90 K/W 1 RthG1 + RthM1 + 1 1 + ... + RthG2 + RthM2 RthGn + RthMn The result can be substituted into equation 1. K = Kelvin, which is the standard measure of temperature differences, measured in C, therefore 1C = 1 K. K/W = Kelvin per watt, the unit of thermal resistance. Calculation examples: E F 1. A TO 3 power transistor with 60 watt rating has a maximum junction temperature of 180 C and an internal resistance of 0.6 K/W at an ambient of 40 C with aluminium oxide wafers. What thermal resistance is required for the heatsink? given: P = 60 W i = 180 C - 20 C =160 C (for safety margin) u = 40 C find: RthK using equation 1 G RthG = 0.6 K/W RthM = 0.4 K/W (average value) - RthK = i u - (RthG + RthM) =160 C - 40 C - (0.6 K/W + 0.4 K/W) = 1,0 K/W P 60 W 2. Same conditions as above but for three devices with equally distributed power ratings. solution use equation 1 and equation 3 1 1 1 1 + = + =3 RthGM ges. 0.6 + 0.4 K/W 0.6 + 0.4 K/W 0.6 + 0.4 K/W 1 W/K RthGM ges. = 1 K/W = 0.33 K/W 3 H RthK = 160 C - 40 C _ 0.33 K/W = 1.67 K/W 60 W substitute into Equation 1 gives: I K With these values determined, the tabulation on page A 13 - 17 can be used to give a choice of possible heatsink profiles. Then by examination of the drawings and curves the final choice can be made. 3. A transistor with power rating of 50 W and internal thermal resistance of 0.5 K/W has a case temperature of 40 C. What is the actual value of junction temperature? given: P = 50 W RthG = 0.5 K/W G = 40 C find: i using equation 2 i = G + (P * RthG) L M N i = 40 C + (50 W * 0.5 K/W) = 65 C a Thermal resistances of any profiles with forced convection RthKf RthKf RthK a = = = 1 0,8 a * RthK thermal resistance with forced convection thermal resistance with natural convection factor of proportion 0,6 0,4 0,2 0 A3 Standard aluminium profiles Extruded heatsinks Lamella heatsinks Fluid coolers A A A A 135 - 136 22 - 83 129 - 130 131 - 133 0 1 2 3 Thermal conductive material Hole pattern Drilling pattern for SSR Technical introduction 4 5 6 v [m/s] E 2 - 24 A 21 A 12 A2-8 A Technical introduction Computer based thermal simulation for optimal cooling concepts Performance, service life and reliability of electronic semiconductor devices are significantly determined by the thermal load to which the devices are exposed. An exceeding of the maximum operating temperature leads to malfunctions. An exceeding of the permissible junction temperature leads to a destruction of the semiconductor. To make it worse there is an advancing trend in the semiconductor industry for continuous increasing integration- and power densities of electronic devices. For the solution of thermal problems the first question is which kind of heat dissipation has to be considered. For this there are different processes available: by means of free convection (passive) with different heatsink solutions, by means of forced convection (active with help of fans, cooling aggregates) or by means of fluid media (fluid cooling). However, electronic devices and systems have many different boundary and installation conditions. Therefore the choice of the optimum thermal management is often difficult. There are surely possibilities to find the right heat dissipation concept by using the thermal resistance for calculations or by testing and verifying prototypes directly in the application, but nowadays customer specified mechanical adjustments are requested and demanded more than ever. Small mechanical post-machinings, such as additional integrated threads or drilling can be considered in the calculation with safety reserves in the temperature of the thermal resistance, but extensive modifications demand a repeated inspection of the thermal circumstances. B C D E F To facilitate the determination of passive heat dissipation concepts Fischer Elektronik offers a computer based thermal simulation as a kind of service. G Considered factors in the thermal simulation With help of the computer based thermal simulation the necessary characteristics of the cooling concept can be determined exactly. Based on physical concepts such as mass, energy and impulse the software especially considers the thermal requirements for free or forced convection. Simultaneously the system is aligned to thermal dissipation by means of fluid. Moreover the thermal simulation calculates physical effects such as thermal radiation and turbulences. The emission factor of the different surfaces also plays its role. As a result the simulation software delivers a precise cooling solution for the application and is a big help for the decision-making and interpretation of the electronic design. Advantages of a computer based simulation The computer based thermal simulation is already used for the prototype development. Herewith the development cycles of heat dissipation concepts is reduced considerably. Unsuitable concepts can be discarded quickly and without big costs of material. A lot of features and options of the simulation system also reduce the temporary and apparatuses efforts compared to a conventional simulation in the measurement chamber. H I K L We will be happy to advise you in detail about the theme thermal simulation. M Heatsinks profile-overview Heatsink special design Special profiles Heatsink as visual & decor-parts A A A A 13 - 17 137 - 138 140 10 Heatsinks for SSR Die-cast heatsinks Assigment table Order example A A A A 11 - 12 125 18 - 20 21 A4 N A B Technical introduction Remarks: 1. The values indicated in the diagrams apply only for heatsinks with black anodised surface, mounted vertically and natural convection. Correction factors: natural surface: +10 to 15 % for horizontal mounting: +15 to 20 % C D E F G 2. Heatsink profiles are extruded to European standard DIN EN 12020 (former DIN 17615). For profiles exceeding a circumscribed circle of 350 mm, the tolerances to DIN EN 755 (former DIN 1748) apply. Important note: Manufacturers of certain electronic components, especially modules with a large surface area, IGBT etc., specify installation surfaces for heatsinks etc. with an flatness, which is beyond standard tolerances. Such perfect flatness can only be achieved by milling the installation surface. Furthermore, it should be noted that threaded wire inserts may be required in order to reach higher tightening torques in aluminium (e.g. Heli-Coil or similar.). Please observe the semiconductor manufacturers` information. 3. The mentioned heatsink profiles in our catalogue contain so called extrusion marks between the fins for a profile identification. To avoid misuse the operator has to check the size and position for the mechanical treatment or placement of the components. 4. Profile extruded threaded channels are no threads conforming to standards, as they have no thread pitch. The thread pitch is imitated by staggered webs (ribs). The customer is responsible for appropriate use. 5. Machining of our extruded and non extruded profiles conforms to requirements of DIN ISO 2768 m - unless otherwise stated. For all ICK S types DIN ISO 2768c is valid. 6. The lengths of extruded profiles [ ] and the pin layouts [ ] indicate only the standard range. We offer every profile cut to customer's exact length and machining requirement made to drawing or sample. We bore, countersink, mill, saw, grind and cut threads into your heat sink to meet your specific requirements. With our modern machine tools including CNC machining centres, multispindled drills (up to 26 drillings/threads at the same time) and digital milling and stamping tools plus our own "in house" tool room we are able to manufacture competetively priced prototypes as well as batch and mass produced parts with short lead times. 7. The standard material of our heatsinks is warm age-hardened aluminium alloy according to EN AW 6060 - T66 (former AlMgSi05 - F22 acc. to DIN 1748). Our standard surface treatments are raw degreased aluminium (Al) and black anodised (SA). On request, we anodise clear natural (ME) or decorative in any colour that is technically possible. 8. If you cannot find a suitable profile within our range of approx. 400 profiles, 13 small heatsinks and 50 finger shaped heatsinks, we can design and produce to your requirements. Please contact us at the start of your next project so that we can work together, either directly or through our representatives. Remember that we have the ability to find the solution for "your" cooling problem. H 9. Note on tolerances All dimensions given in this cataloque for products, items and machined parts are acc. to DIN ISO 2768 m if not otherwise stated. Not included are items like extruded profiles, diecasts, handles, vibration dumpers etc. for which different standards apply. I K Update - August 2014 The information given in this catalogue were established and examined carefully. Nevertheless, mistakes or printing errors, and especially technical modifications and updating and improvement of our products, cannot be excluded. All trade marks are recognised even if they are not specifically identified or mentioned. No identification does not imply that a product or trademark is not registered. No part of this catalogue may be reproduced or distributed without prior written consent of Fischer Elektronik. All data contained in this catalogue, in texts, illustrations, documents and descriptions are subject to copyright and the provisions of DIN ISO 16016. All rights reserved. (c) Copyright Fischer Elektronik 1969 ... 2014 L M N A5 Standard aluminium profiles Extruded heatsinks Lamella heatsinks Fluid coolers A A A A 135 - 136 22 - 83 129 - 130 131 - 133 Thermal conductive material Hole pattern Drilling pattern for SSR Technical introduction E 2 - 24 A 21 A 12 A2-8 A Technical introduction General information B Blind holes are produced after anodising. Through holes are produced before anodising. With completely visual parts, additional painting is recommended. The sections are extruded according to DIN EN 12020. For sections that exceed a circumscribed circle of 300 mm, DIN EN 755 apply. The machining tolerances are specified according to DIN ISO 2768 m. Visual parts: Please indicate at which place clamp points are allowed! We recommend e.g. supplementary laquering. C zero point 15 5 + 3 x M 3 - 6/8 deep and/or continuous D 49.7 44.7 24.7 5 200 - 1.2 E B C D O 3.4 C F M6 9.6 A O 6.5 11.6 zero point A face counterbore O 12/0.5 deep G break-through O 8 B zero point H M4 3.2 6.4 49.7 39.7 24.7 10 D 8.4 O 4.5 4 33.4 50.4 65 I O8 plunge-through and counterbore with O 8 135 149.6 166.6 196 K L M Heatsinks profile-overview Heatsink special design Special profiles Heatsink as visual & decor-parts A A A A 13 - 17 137 - 138 140 10 Heatsinks for SSR Die-cast heatsinks Assigment table Order example A A A A 11 - 12 125 18 - 20 21 A6 N A Technical introduction Information for dimensioning, shown on SK 47 general: B C D The deflection can be up to 0.8 mm concave, 0.2 mm convex. If a certain flatness of the bottom surface is required the bottom thickness can be decreased by a maximum of approx. 0.8 mm by means of face-milling. This situation must be taken into consideration with the bore hole depths for blind holes. Counterbores and bore hole diameters are to be produced according to DIN 74, if not explicitly stated otherwise. The depth of thread should be calculated as follows. Example M 5: thread: <M> 5 x 1.6 mm = 8 mm core bore: 8 mm + 2 mm = 10 mm Examples: cutout A: Through-hole according to DIN 74 A m 3, counterbore bottom side, undercut of the fins. cutout B: Through hole with break-through of the fins according to DIN 74 H m 4, counterbore on fin side. cutout C: Thread M 6. Depth of thread 1.6 x 6 mm = 9.6 mm, bore depth 9.6 mm + 2 mm = 11.6 mm. Bore hole on fin base is plunged through. Face counterbore dia. 12 x 0.5 on bottom side. cutout D: Blind thread M 4. Depth of thread 1.6 x 4 mm = 6.4 mm, bore depth 6.4 mm + 2 mm = 8.4 mm. Extrusion tolerances - production tolerances E There is often the problem, that the production tolerances cannot be adhered to, due to the extrusion tolerances. The two examples show how the production tolerances can be cut in half by means of suitable dimensioning (here: extension of the zero point from the outer edge to the center of the section). When taking unfavourable extrusion tolerances into consideration a difference of 1.1 mm arises between the two types of dimensioning with respect to the axis of symmetry. F SK 82 .75 R220 extrusion tolerance 3.5 mm 440 G 55 165 275 385 H 437.8 1.93 I zero point 55 165 275 K 385 1.1 0.83 L zero point 55 M 55 165 165 437.8 N A7 Standard aluminium profiles Extruded heatsinks Lamella heatsinks Fluid coolers A A A A 135 - 136 22 - 83 129 - 130 131 - 133 Thermal conductive material Hole pattern Drilling pattern for SSR Technical introduction E 2 - 24 A 21 A 12 A2-8 A Technical introduction SK 34 B extrusion tolerance 0.8 mm C 125 0.8 124.20 dimensioning set to the outer edges zero point 4.2 D E 58.3 120.8 0.4 124.20 F dimensioning set to the center G zero point 58.3 58.3 When taking unfavourable extrusion tolerances into consideration, a difference of 0.4 mm arises between the two types of dimensioning with respect to the axis of symmetry. H Milling If, when milling heatsinks, cooling aggregates, etc., the milling tool diameter is smaller than the area being milled for production reasons, so called milling grooves" with steps or edges are produced (see sketch). Even if the roughness depth value for the surface is observed, it is a good idea to specify the area of the component in which no milling edges are allowed. I K milling groove milling tool milling groove milling tool milling tool bigger than milled surface (no milling edge) milling tool smaller than milled surface L M Heatsinks profile-overview Heatsink special design Special profiles Heatsink as visual & decor-parts A A A A 13 - 17 137 - 138 140 10 Heatsinks for SSR Die-cast heatsinks Assigment table Order example A A A A 11 - 12 125 18 - 20 21 A8 N Precision machining and highly decorative surfaces Decorative aluminium milled parts - high quality, very precise milled, decorative aluminium parts - exact radii and sharp-edged cutouts - precision ground surfaces - natural colour and black anodized Chromium plating and gold plating - chromium plating and gold plating of front panels, extruded profiles and construction parts - qualitative constant and reproducible, high quality surfaces - various gloss levels by means of different polishing processes - processing of brass, aluminium and steel Surface refinements - corrosion resistant and decorative anodize layers - lacquerings and durable powder coatings in all current RAL colours - anti-glare surfaces, Nextel(R)-Suide Coating - electrically conductive surfaces, chromate VI free - prevention of clamp marks by means of special contacting systems Development and construction - compentent partner with experience of more than 40 year - Innovative product development, product-specific support by means of application engineers - design assistance, feasibility analyses and product optimizations - construction support and preparation of drawings A Heatsinks for decorative purposes and as visual parts B C D E F G Anodising (also known as ELOXAL: ELectrically OXidised ALuminium) is used in many cases for decorative surface protection of aluminium. In this process, the aluminium parts to be treated are connected to the positive pole of a direct-current source (anode) in a suitable electrolyte where aluminium, in so doing, forms the negative pole (cathode). The flowing direct current now causes a migration of oxygencontaining ions, with electrically negative charge, to the anode in order to deposit the oxygen. At this point, the aluminium reacts with this oxygen, forming aluminium oxide. A non-porous, electrically insulating, abrasion free, oxide barrier, or eloxallayer", then develops. The development and therefore thickness of this layer can be controlled by the amount of current flow. For process handling, secure transportation and electrical connection, the parts to be anodised must be placed on racks" (figure 1). As excellent electrical contact is necessary and the parts being processed must be mounted on the carrying racks in a totally secure manner a high clamping force is required especially for those large and heavy heatsinks (figure 2). This will mean that clamp marks" are visible. These are mere bare points in the case of small and light weight heatsinks with black anodising (figure 3) but for heavy parts the clamping pressures and current can cause deformation of the surface (figure 4). Any such deformations on large heatsinks is unavoidable and varies with each part (figure 5). If heat sinks are used as visual parts, in other words parts whose surface must be blemish-free in appearance, it is suggested that the customer will define specific areas which should have no clamp marks. If, for technical production reasons, it is not possible to place clamps on the remaining points then consideration should be either given to the construction of separate specialpurpose frames which will allow processing (figure 6). Existing or additional threaded holes may possibly also be used for screwing on fixing angles, upon which the clamps may then be placed (figure 7). Furthermore, there is always the possibility to remove the clamp marks by hand finishing, although some slight indentation may still be visible. Alternatively, instead of using the anodising process there are various paint finishes available. With visual parts and mouldings, both discussion of all technical details and determination of the desired design in cooperation with the manufacturer - even at the initial enquiry stage - are imperative for the smooth completion of orders to the satisfaction of the customer. H I K L Our experts are at your disposal for all technical advice. M Standard aluminium profiles Technical introduction Extruded heatsinks Assigment table A A A A 135 - 136 2-8 22 - 83 18 - 20 Drilling pattern for SSR Die-cast heatsinks High capacity heatsinks Heatsinks for PCB A A D A 12 125 30 - 32 89 - 112 A 10 N A Heatsinks for solid state relays B C D E F - universal clip fastening, suitable for all 35 mm mounting rails according to DIN EN 50 022, rail thickness from 1 to 2.3 mm E 25 - fast and simple asssembly of heatsinks by means of snapping them onto the mounting rail G - secure hold due to a stable extruded profile with integral stainless steel spring - special lengths (40 mm) and drillings on request 7.4 50 1.5 35 1 37.5 35 35 H 2.3 3.5 I 7.5 15 15 Examples of mounting rail versions suitable for KL 35 8.5 K surface: finish clear anodised L M N A 11 Distance sleeves Fastening for mounting rail Guide rails for PCBs Mounting material f. semiconduct. E E E E 32 - 39 25 26 - 30 44 - 48 Spacers Mica wafers Aluminium oxide wafers Technical introduction E 40 E 19 E 17 - 18 A2-8 A Heatsinks for solid state relays perforations with KL 35 - drilling pattern rotated by 90 - fixing of the SSR by means of screws with the help of as well as further drilling insert nuts in the heatsink patterns upon request 57 - fixing of the SSR by means of screws with the help of tapped holes in the heatsink - fixing of the SSR by means of screws with the help of tapped holes in the heatsink art. no. art. no. art. no. SK 172 75 KL SSR 1 SK 89 75 KL SSR 1 SK 89 100 KL SSR 1 SK 111 75 KL SSR 1 SK 434 75 KL SRR 1 SK 453 75 KL SRR 1 SK 467 75 KL SRR 1 SK 507 75 KL SSR 1 SK 04 75 SSR 1 SK 33 75 SSR 1 SK 453 75 SSR 1 SK 455 75 SSR 1 SK 467 75 SRR 1 SK 507 75 SRR 1 SK 89 100 KL SSR 2 SK 89 150 KL SSR 2 SK 176 100 KL SSR 2 SK 176 150 KL SSR 2 SK 194 75 KL SSR 2 SK 507 100 KL SSR 2 SK 04 150 SSR 2 SK 33 75 SSR 2 SK 507 100 SSR 2 SK 507 150 SSR 2 47.5 SSR 1 without KL 35 B C D M4 45 SSR 2 E F 92 104.5 47.6 G M4 73.5 SSR 3 SK 187 75 KL SSR 3 SK 111 75 KL SSR 3 SK 48 50 SSR 3 30.2 38.1 H M4 17 SSR 4 SK 172 150 KL SSR 4 SK 455 100 KL SSR 4 SK 455 100 SSR 4 SK 467 100 SSR 4 I M4 80 94 K L 34 M Distance sleeves Fastening for mounting rail Guide rails for PCBs Mounting material for semiconduct E E E E 32 - 39 25 26 - 30 44 - 48 Spacers Mica wafers Aluminium oxide wafers Mounting parts for heatsinks E 40 E 19 E 17 - 18 A2-8 A 12 N A Heatsink-chart SK 440 D 30 SK 441 SK 47 A 49 SK 49 D 30 SK 458 D 30 SK 461 D 30 SK 497 D 30 SK 498 D 30 A 54 SK 66 A 55 SK 90 A 48 SK 91 A 52 B A 51 SK 56 C SK 93 A 56 SK 101 A 54 SK 102 A 50 SK 130 SK 149 A 53 SK 154 A 46 SK 155 A 45 SK 157 SK 159 A 58 SK 160 A 58 SK 161 SK 168 A 50 SK 190 A 52 SK 191 A 56 SK 139 A 53 D A 54 SK 158 A 58 E A 58 SK 162 A 58 F A 56 SK 193 A 50 G SK 198 A 53 SK 199 A 51 SK 416 A 47 SK 418 A 58 SK 438 A 52 SK 439 A 55 SK 446 A 53 SK 466 A 43 SK 479 A 55 A 46 SK 520 A 50 SK 523 A 55 H I SK 501 A 54 SK 502 A 49 SK 507 A 40 SK 510 SK 524 A 52 SK 530 A 57 SK 531 A 57 SK 533 A 57 SK 535 A 57 SK 536 A 57 SK 537 A 57 SK 538 A 57 K L M Heatsink-chart classified in categories of thermal resistance at 75 mm length N A 13 A Heatsink-chart SK 539 A 57 SK 540 A 57 SK 553 A 44 SK 555 A 51 SK 557 A 50 B SK 568 A 54 SK 579 A 55 SK 580 A 51 SK 588 A 45 SK 591 A 49 SK 601 A 44 C SK 613 A 43 SK 614 A 52 SK 621 A 56 SK 57 A 64 SK 30 A 67 SK 53 A 74 D SK 82 A 75 SK 86 A 75 SK 15 A 77 SK 163 A 78 SK 556 A 77 E SK 83 A 79 SK 108 A 80 SK 109 A 80 SK 110 A 80 SK 435 A 81 SK 144 A 82 SK 584 B 44 SK 590 B 46 SK 592 B 45 F SK 615 B 45 SK 33 A 42 SK 42 A 49 SK 58 A 45 SK 85 A 46 SK 92 A 41 G SK 94 A 49 SK 113 A 48 SK 118 A 51 SK 119 A 47 H SK 120 A 45 SK 121 A 42 SK 132 A 44 SK 133 A 44 SK 135 A 39 SK 136 A 48 SK 411 A 42 I SK 412 A 47 SK 413 A 43 SK 429 SK 504 A 45 SK 519 A 48 SK 583 A 66 SK 34 A 67 SK 67 A 37 SK 463 A 43 SK 467 A 33 SK 503 A 53 SK 595 A 43 SK 71 A 64 SK 98 A 68 SK 88 A 73 SK 80 A 46 K A 65 SK 197 A 65 A 74 SK 147 A 74 L SK 404 A 65 SK 02 A 69 SK 148 M < 1 K/W 1-1,5 K/W 1,5-2 K/W 2-2,5 K/W 2,5-3 K/W 3-4 K/W 4-5 K/W > 5 K/W A 14 N A Heatsink-chart SK 89 A 77 SK 140 A 77 SK 06 A 79 SK 23 A 79 SK 194 A 81 SK 40 A 82 SK 61 A 82 SK 415 A 90 SK 569 B 43 SK 570 B 44 SK 571 B 44 SK 572 B 44 SK 577 B 43 SK 578 B 43 SK 599 B 45 SK 602 B 43 SK 50 A 37 SK 100 A 38 B C SK 166 A 48 SK 408 A 40 SK 410 A 44 SK 417 A 46 A 47 SK 433 A 41 SK 442 A 42 SK 453 A 33 SK 455 A 33 SK 464 A 67 SK 39 A 67 SK 20 A 68 SK 84 A 68 A 71 SK 500 A 72 SK 08 A 73 SK 60 A 74 B 42 SK 407 A 39 SK 436 A 37 SK 450 A 34 SK 505 A 41 A 64 SK 97 A 62 SK 03 A 66 SK 419 A 70 A 90 SK 81 A 41 D SK 421 A 39 SK 527 A 35 E SK 04 A 64 SK 72 A 63 SK 401 A 63 SK 403 SK 184 A 68 SK 74 A 71 SK 124 A 71 SK 195 SK 176 A 78 SK 172 A 81 SK 432 A 82 SK 46 A 64 SK 14 F G B 43 SK 598 H SK 508 A 41 SK 612 SK 16 A 72 SK 79 A 39 SK 73 I A 73 SK 187 A 76 SK 11 A 79 SK 111 A 81 SK 44 A 47 SK 406 A 38 SK 434 A 35 SK 445 A 34 SK 05 A 62 SK 18 A 62 SK 25 A 61 A 62 SK 402 A 62 SK 01 A 66 SK 64 A 70 SK 48 A 73 SK 52 A 74 SK 32 A 76 K SK 189 A 32 SK 405 L SK 28 A 63 SK 63 M Heatsink-chart classified in categories of thermal resistance at 75 mm length N A 15 A Heatsink-chart SK 544 A 76 SK 596 A 76 SK 175 A 83 SK 105 A 90 SK 484 A 110 SK 487 A 87 SK 499 A 87 SK 514 A 86 B SK 593 A 87 SK 617 A 88 SK 99 A 37 SK 106 A 31 SK 134 A 28 SK 182 A 40 SK 424 A 34 SK 425 A 34 SK 426 A 36 C SK 475 A 35 SK 545 A 39 SK 546 A 40 SK 567 A 35 SK 594 A 38 SK 19 A 63 D SK 45 A 63 SK 51 A 61 SK 165 A 61 SK 181 A 60 SK 36 A 66 SK 21 A 70 SK 65 A 70 E SK 69 A 71 SK 07 A 72 SK 55 A 83 SK 68 A 89 SK 112 A 89 SK 128 A 91 SK 414 A 90 F SK 481 A 85 SK 482 A 86 SK 483 A 87 SK 489 A 85 SK 495 A 87 SK 517 A 93 SK 518 A 93 SK 585 ... B 42 SK 589 A 86 G SK 610 A 92 SK 618 B 42 SK 619 B 42 SK 620 B 42 SK 156 A 36 SK 174 A 30 SK 179 A 30 SK 180 A 36 SK 422 A 32 H SK 444 A 38 SK 468 A 36 SK 472 A 31 SK 485 A 38 SK 566 A 26 SK 78 A 61 SK 107 A 60 SK 122 A 60 SK 150 A 61 I SK 173 A 59 SK 185 A 73 LA LED 68 B 50 SK 96 A 91 SK 138 A 91 SK 451 A 91 SK 490 A 84 SK 573 A 85 SK 574 A 86 SK 576 A 85 SK 611 A 92 SK LED 2 B 48 SK LED 3 B 48 SK 177 A 27 SK 178 A 28 SK 400 A 28 SK 420 A 31 SK 423 A 32 SK 427 A 36 SK 437 A 24 SK 447 A 26 SK 448 A 27 SK 452 A 27 SK 454 A 24 SK 456 A 30 SK 469 A 23 K L M < 1 K/W 1-1,5 K/W 1,5-2 K/W 2-2,5 K/W 2,5-3 K/W 3-4 K/W 4-5 K/W > 5 K/W A 16 N A Heatsink-chart SK 470 A 22 SK 471 A 29 SK 473 A 25 SK 476 A 24 SK 477 A 24 SK 478 A 23 SK 486 A 25 SK 493 A 28 SK 496 A 22 SK 509 A 29 SK 511 A 32 SK 513 A 31 SK 521 A 24 SK 522 A 23 SK 547 A 31 SK 548 A 34 SK 549 A 29 SK 550 A 27 SK 551 A 25 SK 552 A 23 SK 554 A 26 SK 558 A 23 SK 559 A 25 SK 560 A 26 SK 561 A 26 SK 562 A 29 SK 563 A 30 SK 564 A 30 SK 565 A 22 SK 581 A 28 SK 582 A 25 SK 586 A 22 SK 587 A 29 SK 597 A 27 SK 616 A 22 SK 09 A 59 SK 59 A 60 SK 145 A 59 SK 443 A 59 SK 31 A 72 SK 153 A 83 SK 494 A 83 ICK ... B B 52 ICK ... H B 52 ICK ... L B 52 B C D E F SFP A 135 SK 12 A 123 SK 13 A 123 SK 75 A 105 SK 76 A 105 SK 95 A 108 SK 115 A 123 SK 125 A 91 SK 126 A 107 A 94 SK 515 05 A 94 SK 516 A 94 SK 575 A 84 SK 609 A 92 G SK 431 ... A 124 SK 480 A 84 SK 492 A 84 SK 512 A 84 SK 515 H SK LED 1 B 48 STP A 136 SU A 135 SVP A 136 SWP A 135 UK 14 SA ... A 123 I K L M Heatsink-chart classified in categories of thermal resistance at 75 mm length N A 17 A Assignment table of transistor heatsinks extruded profiles TO 3 TO 66 SOT 9 TO 220 SOT 32 SK 01 SK 02 SK 03 SK 04 SK 05 SK 07 SK 08 SK 14 SK 16 SK 18 SK 19 SK 20 SK 21 SK 28 SK 30 SK 31 SK 34 SK 36 SK 39 SK 45 SK 48 SK 52 SK 53 SK 55 SK 60 SK 63 SK 67 SK 69 SK 71 SK 72 SK 73 SK 74 SK 78 SK 79 SK 80 SK 84 SK 88 SK 97 SK 122 SK 124 SK 147 SK 148 SK 150 SK 165 SK 185 SK 195 SK 197 SK 401 SK 402 SK 404 SK 01 SK 02 SK 03 SK 04 SK 05 SK 07 SK 08 SK 14 SK 16 SK 18 SK 19 SK 20 SK 21 SK 28 SK 30 SK 31 SK 34 SK 36 SK 39 SK 45 SK 48 SK 52 SK 53 SK 55 SK 60 SK 63 SK 69 SK 71 SK 72 SK 73 SK 74 SK 78 SK 79 SK 80 SK 122 SK 147 SK 148 SK 150 SK 165 SK 185 SK 195 SK 197 SK 401 SK 402 SK 404 SK 01 SK 02 SK 03 SK 04 SK 05 SK 07 SK 08 SK 14 SK 16 SK 18 SK 19 SK 20 SK 21 SK 28 SK 30 SK 31 SK 34 SK 36 SK 39 SK 45 SK 48 SK 52 SK 53 SK 55 SK 60 SK 63 SK 69 SK 71 SK 72 SK 73 SK 74 SK 78 SK 79 SK 80 SK 122 SK 147 SK 148 SK 150 SK 165 SK 185 SK 195 SK 197 SK 401 SK 402 SK 404 SK 09 SK 59 SK 145 SK 01 SK 02 SK 03 SK 04 SK 05 SK 07 SK 08 SK 14 SK 16 SK 18 SK 19 SK 20 SK 21 SK 28 SK 30 SK 31 SK 34 SK 36 SK 39 SK 45 SK 48 SK 52 SK 53 SK 55 SK 60 SK 63 SK 69 SK 71 SK 72 SK 73 SK 74 SK 78 SK 79 SK 80 SK 122 SK 147 SK 148 SK 150 SK 165 SK 185 SK 195 SK 197 SK 401 SK 402 SK 404 B C D E F G H I K L M Extruded heatsinks Heatsinks f. printed circuit boards Thermal conductive material Mount. material f. semiconductors A 22 - 83 A 89 - 111 E 2 - 24 E 44 - 48 Die-cast heatsinks Reating springs for transistors Lock-in transistor fixing spring Technical introduction A A A A 125 115 - 117 84 - 88 2-8 A 18 N A Assignment table of transistor heatsinks TO 3 B C TO 66 SOT 9 TO 5 extruded heatsink with solder pins D TO 247 TO 3 P SK 126 SK 104 SK 145 SK 129 SK 437 SK 400 SK 459 SK 409 SK 484 SK 448 SK 456 SK 484 E extruded set-up/clip-on heatsinks F WP 4030 SK 126 heatsinks SK 452 AKK 127 FK 243 AKK 191 FK 245 finger-shaped FK 201 FK 201 FK 201 heatsinks FK 202 FK 202 FK 202 FK 205 FK 205 FK 205 FK 206 FK 206 FK 206 FK 223 FK 207 FK 207 FK 236 FK 208 FK 208 FK 217 FK 217 FK 225 FK 234 FK 234 FK 236 G H SK 452 FK 236 I small heatsinks KF KK 562 SKK K L M N A 19 Extruded heatsinks Heatsinks f. printed circuit boards Thermal conductive material Mount. material f. semiconductors A 22 - 83 A 89 - 112 E 2 - 24 E 44 - 48 Die-cast heatsinks Reating springs for transistors Lock-in transistor fixing spring Technical introduction A A A A 125 115 - 117 84 - 88 2-8 A Assignment table transistor heatsinks TO 218 U-heatsinks TO 220 SOT 32 ICK 35 SK 13 SK 431 UK 14 SK 12 extruded heatsink with solder pin SK 145 SK 437 SK 459 SK 460 SK 75 SK 104 SK 129 SK 145 SK 185 SK 409 SK 459 SK 460 SK 104 SK 129 SK 409 SK 459 SK 469 SK 470 extruded heatsinks SK 126 SK 452 SK 95 SK 126 SK 452 SK 454 SK 517 SK 518 SK 95 SK 454 set-up/clip-on heatsinks FK 224 FK 241 SK 516 FK 220 FK 224 FK 237 SK 515 finger-shaped heatsinks FK 224 FK 243 FK 245 FK 205 FK 206 FK 207 FK 208 FK 210 FK 212 FK 214 FK 216 FK 217 FK 218 FK 219 FK 220 FK 222 FK 225 FK 227 FK 228 FK 229 FK 230 FK 231 FK 232 FK 233 FK 234 FK 235 FK 247 small heatsinks DIL PLCC P-SIP PGA/BGA assignment table B 2 - 10 SK 459 SK 460 ICK...B ICK..H ICK...L B C D E ICK PLCC ICK R F FK 224 FK 241 FK 201 FK 205 FK 206 FK 207 FK 208 FK 209 FK 210 FK 211 FK 212 FK 213 FK 214 FK 215 FK 216 FK 217 FK 218 FK 219 FK 223 FK 234 FK 235 FK 236 FK 239 G FK 224 H I K L KK 32 KK 92 M Extruded heatsinks Heatsinks f. printed circuit boards Thermal conductive material Mount. material f. semiconductors A 22 - 83 A 89 - 112 E 2 - 24 E 44 - 48 Die-cast heatsinks Reating springs for transistors Lock-in transistor fixing spring Technical introduction A A A A 125 115 - 117 84 - 88 2-8 A 20 N Hole pattern CB TO 3 S 33,5 13.2 4.7 7 15.1 5.6 10.9 6 30.2 CB = TO 3 + SOT 9 + TO 66 + SOT 32 at 37.5 mm oblique drilling TO 3 oblique drilling for TO 220 E 4.2 4.2 4.2 D 10.9 30.2 13.2 3.6 14.9 32 13.2 10 3 10.9 4.2 C TO 3 37.5 mm TO 3 exceeding SOT 32 50 mm K 5 F 4 x10 24.4 4 3.2 10 4.5 14.75 M 2.5 37.5 (50) O 3.2 14.8 B Heatsinks 15.1 A 9 13 SOT 32 / TO 220 exceeding G Standard hole pattern are processed as complete pin layouts, centered on the length of the heatsink. Other positions of the pin layout on the heatsink, multiple drillings or changes of the drillings are processed according to customer`s requirements. For heatsinks exceeding 75 mm standard hole pattern can be supplied in multiple design. 18.75 Fixing slots 6.4 H I 25 M number of fixing slots 2 4 75 [mm] 50 number of fixing slots 2 100 9 Heatsinks with the following shape L [mm] 37.5 9 6.4 K 37.5 mm 4 and a standard hole pattern have these fixing slots as part of the serial production Order example SK 01 50 SA profile length surface TO3 pin layout Surface treatment for heatsinks with standard drilling: black anodised (SA). Raw degreased aluminium (AL) and clear natural anodise (ME) on request. N A 21 Extruded heatsinks Heatsinks for printed circuit boards Thermal conductive material Mount. material for semiconductors A 22 - 83 A 89 - 112 E 2 - 24 E 44 - 48 Die-cast heatsinks Reating springs for transistors Lock-in transistor fixing spring Technical introduction A A A A 125 115 - 117 84 - 88 2-8 A Standard extruded heatsinks Rth [K/W] 40 art. no. B 35 6 30 25 20 2 8 15 SK 586 ... please indicate: 50 100 150 200 [mm] ... C 37.5 50 75 100 1000 mm Rth [K/W] 40 art. no. 35 6 30 D 25 2 8 20 15 SK 616 ... please indicate: 50 100 150 200 [mm] ... E 37.5 50 75 100 1000 mm art. no. Rth [K/W] 32 30 6 28 26 F 24 1,8 10 22 SK 496 ... please indicate: 50 100 150 200 [mm] ... 37.5 50 75 100 1000 mm art. no. G Rth [K/W] 32 10 30 28 26 24 1,8 10 H 22 SK 565 ... please indicate: 50 100 150 200 [mm] ... 37.5 50 75 100 1000 mm art. no. Rth [K/W] 30 I 8 25 20 15 2,5 11,8 10 50 SK 470 ... please indicate: 100 150 200 [mm] K extruded heatsinks for PCB mounting A 110 ... ... 25 37.5 50 75 100 1000 mm (optional) SOT 32; TO 220 L M High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A 22 N A Standard extruded heatsinks art. no. Rth [K/W] 36 6,3 33 3,9 6,5 1,3 B 30 27 10,6 12,6 C 24 SK 522 ... please indicate: 15 30 45 60 [mm] 100 150 200 [mm] 100 150 ... 15 25 37.5 50 1000 mm Rth [K/W] 14 art. no. 12 15,24 3,5 D 10 8 6 13,5 E 50 SK 469 ... please indicate: extruded heatsinks for PCB mounting A 110 ... ... 25 37.5 75 100 1000 mm (optional) SOT 32; TO 220 Rth [K/W] 32 art. no. F 30 6 28 26 G 24 1,8 14 SK 478 ... please indicate: 50 200 [mm] ... 25 37.5 50 75 1000 mm Rth [K/W] art. no. 20 H 10 16 12 8 I 4 1,8 14 SK 552 ... please indicate: 50 100 150 200 [mm] ... 25 37.5 50 75 100 1000 mm Rth [K/W] 25 art. no. K 14 20 15 10 L SK 558 ... please indicate: 2,5 5 14 50 100 150 200 [mm] ... 25 37.5 50 75 100 1000 mm M N A 23 High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A Standard extruded heatsinks art. no. Rth [K/W] 26 B 24 3 8 22 20 15,3 18 SK 521 ... please indicate: 50 100 150 200 [mm] C ... 25 37.5 50 75 100 1000 mm art. no. Rth [K/W] O 1,4 24 D 20 16 16 3,5 O 2,5 5 12 8 16 SK 437 ... please indicate: 50 100 150 200 [mm] extruded heatsinks for PCB mounting A 109 ... ... 100 1000 mm E (optional) TO 218; TO 220; TO 247; TO 248 Rth [K/W] 26 art. no. F 24 6 22 20 18 1,8 21 SK 476 ... please indicate: 50 100 150 200 [mm] G ... 37.5 50 75 100 1000 mm art. no. Rth [K/W] 12 H 19 3 10 8 6 4 21,45 50 SK 454 ... please indicate: 100 150 200 [mm] I extruded heatsinks for PCB mounting A 96 ... ... 37.5 50 75 100 150 1000 mm (optional) SOT 32; TO 220 Rth [K/W] 24 art. no. K 6 22 20 1,8 18 23 16 L SK 477 ... please indicate: 50 100 150 200 [mm] ... 37.5 50 100 1000 mm M High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A 24 N A Standard extruded heatsinks art. no. Rth [K/W] 24 B 10 22 20 18 C 16 1,8 23 SK 582 ... please indicate: 50 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] ... 37.5 50 75 100 1000 mm art. no. Rth [K/W] 14 2,5 12 12,3 D 10 8 23 E 6 SK 559 ... please indicate: 50 ... 37.5 75 100 1000 mm art. no. Rth [K/W] 12,5 F 12,3 10,0 7,5 5,0 G 2,5 3,5 24,2 SK 551 ... please indicate: 50 ... 37.5 50 75 100 1000 mm Rth [K/W] art. no. 16 14 12 3 8 H 10 8 6 4 2 25,8 SK 486 ... I please indicate: 50 ... 37.5 50 75 100 1000 mm Rth [K/W] 20 art. no. 18 6 K 16 1,8 14 27 SK 473 ... L please indicate: 12 50 ... 37.5 50 75 1000 mm M N A 25 High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A Standard extruded heatsinks art. no. Rth [K/W] 12,5 B 10 10,0 7,5 5,0 1,8 27 2,5 SK 554 ... please indicate: 50 100 150 200 [mm] C ... 37.5 50 75 100 1000 mm art. no. Rth [K/W] 10 D 8 10 6 3 4 2 27 SK 447 ... please indicate: 50 100 150 200 [mm] E ... 37.5 1000 mm Rth [K/W] art. no. 10 F 14 8 6 4 SK 560 ... please indicate: 2,5 2 27 50 100 150 200 [mm] ... G 37.5 50 75 100 1000 mm Rth [K/W] 10 art. no. 22 8 H 6 4 27 SK 566 ... please indicate: 3,5 2 50 100 150 200 [mm] ... I 37.5 50 75 100 1000 mm art. no. Rth [K/W] 20 8 16 K 12 8 SK 561 ... please indicate: 4 2,5 27,95 50 100 150 200 [mm] ... 37.5 50 75 100 1000 mm L M High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A 26 N A Standard extruded heatsinks art. no. Rth [K/W] 12 B 12,5 10 8 6 4 3,5 27,95 C 50 SK 448 ... please indicate: 100 150 200 [mm] extruded heatsinks for PCB mounting A 111 ... 37.5 50 75 mm D Rth [K/W] 10 art. no. E 15,24 3,5 8 6 4 2 27,95 SK 177 ... please indicate: 50 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] ... 50 75 100 1000 mm Rth [K/W] art. no. 11 F 11,5 10 9 8 G 3,5 29 7 SK 550 ... please indicate: 50 ... 37.5 50 75 100 1000 mm Rth [K/W] 12 art. no. H 3,5 25 10 8 6 4 I 29 50 SK 452 ... please indicate: extruded heatsinks for PCB mounting A 96 ... ... 37.5 100 1000 mm art. no. Rth [K/W] K 17,5 12 3 L (optional) TO 218; TO 220; TO 247; TO 248; TO 3 P 30 SK 597 ... please indicate: 10 8 6 4 50 100 150 200 [mm] ... 37.5 50 75 100 1000 mm M N A 27 High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A Standard extruded heatsinks Rth [K/W] 20 art. no. B 16 6 12 1,8 8 31 4 SK 493 ... please indicate: 50 100 150 200 [mm] C ... 37.5 50 75 100 1000 mm Rth [K/W] 20 art. no. D 10 16 12 1,8 8 31 4 SK 581 ... please indicate: 50 100 150 200 [mm] ... E 37.5 50 75 100 1000 mm Rth [K/W] 12 art. no. 10 F 3 10 8 6 4 33 50 SK 400 ... please indicate: 100 150 200 [mm] G extruded heatsinks for PCB mounting A 111 ... 37.5 50 75 100 1000 mm Rth [K/W] 10 art. no. H 16,5 8 6 5 4 2 34,5 SK 178 ... please indicate: 50 100 150 200 [mm] ... I 37.5 75 100 1000 mm art. no. K 50 Rth [K/W] 5 4 L 3 2 5 1 SK 134 ... please indicate: 34,5 50 100 150 200 [mm] M ... 37.5 50 100 1000 mm High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A 28 N A Standard extruded heatsinks Rth [K/W] 18 art. no. B 6 16 14 1,8 12 35 C 10 SK 471 ... please indicate: 50 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] ... 37.5 50 75 1000 mm art. no. Rth [K/W] 16 10 D 14 12 1,8 10 35 E 8 SK 587 ... please indicate: 50 ... 37.5 50 75 100 1000 mm Rth [K/W] art. no. 9 8 10 F 7 6 2,5 35 5 SK 549 ... G please indicate: 50 ... 37.5 50 75 100 1000 mm Rth [K/W] art. no. 8 14 7 H 6 5 4 2,5 35 SK 562 ... I please indicate: 50 ... 37.5 50 75 100 1000 mm Rth [K/W] 10 art. no. 12,3 8 K 4 2 3,5 36 SK 509 ... L 6 please indicate: 50 ... 37.5 50 100 1000 mm M N A 29 High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A Standard extruded heatsinks Rth [K/W] 16 art. no. B 6 14 12 10 8 1,8 37 SK 563 ... please indicate: 50 100 150 200 [mm] C ... 37.5 50 75 100 1000 mm Rth [K/W] art. no. 20 D 10 16 12 8 4 1,8 37 SK 564 ... please indicate: 50 100 150 200 [mm] ... E 37.5 50 75 100 1000 mm art. no. Rth [K/W] 10 F 30 8 6 SK 174 ... please indicate: 10 12 6 4 2 38 50 100 150 200 [mm] ... G 75 1000 mm art. no. Rth [K/W] 10 16,5 3,5 8 H 6 4 2 38,1 SK 179 ... please indicate: 50 100 150 200 [mm] ... I 37.5 50 100 1000 mm Rth [K/W] art. no. 16 6 14 K 12 40 1,8 10 8 50 SK 456 ... please indicate: 100 150 200 [mm] extruded heatsinks for PCB mounting A 111 L ... 37.5 50 75 100 1000 mm M High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A 30 N A Standard extruded heatsinks art. no. Rth [K/W] 14 B 8 12 10 8 C 3,5 40 6 SK 420 ... please indicate: 50 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] ... 37.5 75 1000 mm art. no. Rth [K/W] 15 D 10 12 9 6 1, 8 40 E 3 SK 513 ... please indicate: 50 ... 37.5 50 75 100 1000 mm art. no. Rth [K/W] 16 F 10 14 12 10 G 2,5 40 8 SK 547 ... please indicate: 50 ... 37.5 50 75 100 1000 mm art. no. Rth [K/W] 10 H 27 8 6 4 5 2 I SK 106 ... please indicate: 40 50 ... 50 75 1000 mm art. no. Rth [K/W] 6 K 8 22 5 4 3 2 L 41,5 SK 472 ... please indicate: 50 ... 37.5 50 75 100 1000 mm M N A 31 High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A Standard extruded heatsinks art. no. B Rth [K/W] 5 34 4 3 8 2 41,5 SK 189 ... please indicate: C 1 50 100 150 200 [mm] ... 37.5 50 75 100 1000 mm D Rth [K/W] art. no. 14 10 3 8 12 8 43,1 E 6 SK 423 ... please indicate: 50 100 150 200 [mm] ... 100 1000 mm 7 16,51 6 5 4 4 G 3 43,1 SK 422 ... please indicate: F Rth [K/W] art. no. 50 100 150 200 [mm] ... 50 1000 mm Rth [K/W] 15 art. no. H 6 12 1,8 45 9 6 3 I SK 511 ... please indicate: 50 100 150 200 [mm] ... 50 75 100 1000 mm K L M High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A 32 N A Standard extruded heatsinks art. no. B 60 C Rth [K/W] 5 4 3 1 45 SK 453 ... please indicate: E 2 10 D 50 ... ... 37.5 75 mm 100 150 200 [mm] (optional) SSR 1 5 art. no. 80 F Rth [K/W] 3,0 2,5 G 2,0 1,5 12 1,0 H SK 455 ... please indicate: 0,5 45 50 ... ... 75 mm art. no. 100 150 200 [mm] (optional) SSR 4 5 I 85 K Rth [K/W] 3,0 2,5 2,0 L 1,5 12 1,0 SK 467 ... M N please indicate: 45 50 ... ... 37.5 50 75 100 1000 mm A 33 0,5 High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 100 150 200 [mm] (optional) SSR 1; SSR 4 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A Standard extruded heatsinks Rth [K/W] art. no. 16,51 6 B 5 4 4 3 45,7 SK 424 ... please indicate: 50 100 150 200 [mm] ... C 75 1000 mm Rth [K/W] art. no. 16,51 6 5 4 3 48,3 SK 425 ... please indicate: D 4 50 100 150 200 [mm] ... 75 mm E art. no. Rth [K/W] 38 5 F 4 3 5 2 SK 445 ... please indicate: 1 49,5 50 100 150 200 [mm] G ... 100 1000 mm art. no. 50 H Rth [K/W] 3,0 I 2,4 7 1,8 1,2 0,6 SK 450 ... please indicate: 49,5 50 100 150 200 [mm] K ... 75 1000 mm art. no. Rth [K/W] 10 10 L 8 SK 548 ... please indicate: 2,5 6 50 50 100 150 200 [mm] ... M 37.5 50 75 100 1000 mm High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A 34 N A Standard extruded heatsinks Rth [K/W] 5 art. no. B 25 4,5 4 3 2 1 C 50 SK 567 ... please indicate: 50 100 150 200 [mm] 100 150 200 [mm] ... 37.5 50 75 100 1000 mm art. no. D Rth [K/W] 40 5 4 3 E 10 2 SK 434 ... please indicate: F 1 50 50 ... ... 50 75 100 1000 mm (optional) SSR 1 art. no. Rth [K/W] 4,0 45 G 3,5 3,0 3,5 2,5 2,0 H SK 475 ... please indicate: 50 50 100 150 200 [mm] ... 37.5 50 100 1000 mm art. no. 60 I K Rth [K/W] 5 4 3 10 L 2 1 SK 527 ... please indicate: 50 100 150 200 [mm] ... 50 75 100 1000 mm M N 50 A 35 High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A Standard extruded heatsinks Rth [K/W] art. no. 12 B 8 10 3 8 6 50,8 4 SK 427 ... please indicate: 50 100 150 200 [mm] ... C 50 75 1000 mm Rth [K/W] art. no. 6 16,51 5 D 4 4 3 2 50,8 SK 426 ... please indicate: 50 100 150 200 [mm] ... E 37.5 50 75 100 1000 mm Rth [K/W] art. no. 10 12 8 F 5 6 4 51 2 SK 156 ... please indicate: 50 100 150 200 [mm] G ... 37.5 50 75 100 1000 mm Rth [K/W] 7,5 art. no. 12,3 6,5 5,5 H 4,5 51 3,5 3,5 SK 468 ... please indicate: 50 100 150 200 [mm] ... I 37.5 75 1000 mm Rth [K/W] art. no. 10 16,5 8 6 K 5 4 2 53,3 SK 180 ... please indicate: 50 100 150 200 [mm] ... 37.5 50 75 100 1000 mm L M High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A 36 N A Standard extruded heatsinks art. no. Rth [K/W] 5 B 20 4 3 4 2 1 C 54 SK 99 ... please indicate: 50 100 150 200 [mm] ... 37.5 50 75 100 150 1000 mm art. no. 5,5 3 6,3 D Rth [K/W] 55 M3 2,2 1,5 3,5 7,5 SK 429 ... F 6 4 E 19 22 3,0 please indicate: M3 M3 35,6 2,5 2,0 1,5 5,2 54 50 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] ... 37.5 50 75 100 1000 mm art. no. Rth [K/W] 3,5 55 3 SK 436 ... please indicate: 1,5 58 50 ... 75 1000 mm art. no. 55 H 2 16,8 22,6 G 2,5 Rth [K/W] 20,5 I 5 4 30 3 2 1 K 6,4 SK 50 ... please indicate: 58 50 ... 75 1000 mm L M N A 37 High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A Standard extruded heatsinks Rth [K/W] art. no. 10 B 8,9 8 6 3,7 4 61 2 SK 485 ... please indicate: 50 100 150 200 [mm] C ... 50 75 100 1000 mm Rth [K/W] art. no. 6 D 5 20 4 3 62,5 3,5 SK 444 ... please indicate: 2 50 75 100 150 [mm] ... E 37.5 50 75 1000 mm Rth [K/W] art. no. 4 25 4,5 5 F 3 6 2 1 63 SK 406 ... please indicate: 50 100 150 200 [mm] G ... 37.5 50 75 100 1000 mm Rth [K/W] art. no. 5 40 4 10 2 1 66 SK 100 ... please indicate: H 3 50 100 150 200 [mm] ... I 37.5 50 75 100 150 1000 mm Rth [K/W] art. no. 5 25 4 3 K 5 2 1 75 SK 594 ... please indicate: 50 100 150 200 [mm] ... L 37.5 50 75 100 1000 mm M High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A 38 N A Standard extruded heatsinks Rth [K/W] 5 art. no. B 10 4 3 2 C 2,5 80 1 SK 545 ... please indicate: 50 100 150 200 [mm] 100 150 200 [mm] ... 50 75 100 150 1000 mm Rth [K/W] art. no. 5 D 32 4 5 2 1 82 E 3 SK 612 ... please indicate: 50 ... 37.5 50 75 100 150 1000 mm art. no. 85 F Rth [K/W] 2,2 69 1,8 1,0 6 8 10 1,4 G 0,6 SK 135 ... please indicate: 50 82 150 100 200 [mm] ... 50 100 1000 mm art. no. Rth [K/W] 5 4 25 4,2 H 3 2 I 83 1 SK 407 ... please indicate: 50 100 150 200 [mm] 100 150 200 [mm] ... 37.5 50 75 100 1000 mm K Rth [K/W] art. no. 5 L 10 40 4 84 SK 464 ... please indicate: 3 2 1 50 ... 50 75 100 150 1000 mm M N A 39 High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A Standard extruded heatsinks Rth [K/W] art. no. 5 B 4 10 3 2 2 89 1 SK 182 ... please indicate: 50 100 150 200 [mm] C ... 37.5 50 75 100 150 200 1000 mm art. no. 100 D Rth [K/W] 1,8 E 1,4 1,0 12 0,6 SK 507 ... please indicate: 0,2 50 90 ... ... 37.5 75 100 1000 mm 100 150 200 [mm] F (optional) SSR 1; SSR 2 art. no. Rth [K/W] 5 G 40 5,5 4 3 2 1 98 SK 408 ... please indicate: 50 100 150 200 [mm] H ... 50 75 100 150 1000 mm art. no. Rth [K/W] 5 I 4 10 3 2,5 2 100 1 SK 546 ... please indicate: 50 100 150 200 [mm] K ... 37.5 50 75 100 150 1000 mm L M High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A 40 N A Standard extruded heatsinks art. no. Rth [K/W] 5 B 15 4 3 2 C 4 100 1 SK 81 ... please indicate: 50 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] ... 37.5 50 75 100 1000 mm Rth [K/W] art. no. 5,0 D 15 4,0 3,0 2,0 E 4 100 1,0 50 SK 505 ... please indicate: weight reduced like SK 81 ... 37.5 50 75 100 150 1000 mm art. no. Rth [K/W] 4,0 F 25 4,3 3,0 1,0 100 G 2,0 SK 508 ... please indicate: 50 ... 37.5 50 75 100 1000 mm art. no. Rth [K/W] 2,5 H 40 2,0 1,5 10 1,0 0,5 I 100 SK 92 ... please indicate: 50 ... 50 75 100 150 1000 mm art. no. Rth [K/W] 3,0 K 33 7,6 2,5 2,0 1,5 1,0 L 111,1 SK 433 ... please indicate: 50 ... 37.5 50 75 1000 mm M N A 41 High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A Standard extruded heatsinks art. no. Rth [K/W] B 10,5 67,5 2,5 2,0 1,5 1,0 C 0,5 112 SK 121 ... please indicate: 50 100 150 200 [mm] ... 75 100 150 1000 mm art. no. 114,5 70 D E Rth [K/W] 2,5 2,0 31,8 44,5 1,5 F 1,0 0,5 108,2 50 SK 33 ... please indicate: 100 150 200 [mm] 114,2 ... ... 50 75 100 1000 mm G (optional) SSR 1 art. no. Rth [K/W] 2,5 50 2,0 1,5 H 15 1,0 SK 411 ... please indicate: 0,5 116,5 50 100 150 200 [mm] ... I 50 75 100 150 1000 mm Rth [K/W] 2,5 4 10,3 40 art. no. 2,0 1,5 K 1,0 0,5 6 SK 442 ... please indicate: 120 50 100 150 200 [mm] ... 50 75 100 150 1000 mm L M High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A 42 N A Standard extruded heatsinks art. no. Rth [K/W] 2,5 B 60 2,0 1,5 1,0 9 0,5 C SK 595 ... please indicate: 120 50 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] ... 50 75 100 150 1000 mm Rth [K/W] art. no. 2,5 4,2 25 D 2,0 1,5 1,0 0,5 130 E SK 463 ... please indicate: 50 ... 50 75 100 150 1000 mm art. no. F Rth [K/W] 84 2,5 2,0 1,5 G 1,0 15 0,5 SK 613 ... please indicate: H 130 50 ... 37.5 50 75 100 150 1000 mm art. no. Rth [K/W] 10,2 50 2,5 1,5 1,0 I 0,5 138 SK 466 ... please indicate: K 2,0 50 100 150 100 150 200 [mm] ... 50 75 100 150 1000 mm art. no. Rth [K/W] 120,25 2,5 L 33,3 7,9 2,0 1,5 1,0 0,5 141,05 SK 413 ... please indicate: 50 200 [mm] ... 100 1000 mm M N A 43 High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A Standard extruded heatsinks Rth [K/W] art. no. 8 B 9 6 2 4 149,6 4 SK 601 ... please indicate: 50 100 150 200 [mm] C ... 50 75 100 150 1000 mm art. no. Rth [K/W] 3,7 3,0 D 19 2,2 1,5 0,7 6 150 SK 553 ... please indicate: 50 100 150 200 [mm] ... E 37.5 50 75 100 150 1000 mm Rth [K/W] art. no. 2,5 4,5 25 2,0 1,5 F 1,0 0,5 150 SK 132 ... please indicate: 50 100 150 200 [mm] ... G 37.5 50 75 100 150 1000 mm Rth [K/W] art. no. 2,5 4,7 25 2,0 1,5 H 1,0 0,5 150 SK 410 ... please indicate: 50 100 150 200 [mm] ... 37.5 50 75 100 150 1000 mm art. no. I Rth [K/W] 2,5 27 5 2,0 1,5 1,0 150 K 0,5 SK 133 ... please indicate: 50 100 150 200 [mm] ... 50 75 100 1000 mm L M High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A 44 N A Standard extruded heatsinks Rth [K/W] 2,5 art. no. B 5 27 2,0 1,5 1,0 0,5 150 C SK 58 ... please indicate: 50 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] ... 50 75 100 150 1000 mm art. no. Rth [K/W] 1,7 D 27 5 1,5 1,3 1,1 0,9 150 E 50 SK 504 ... please indicate: weight reduced like SK 58 ... 37.5 50 75 100 150 1000 mm Rth [K/W] art. no. 2,5 F 39,5 2,0 1,5 9 1,0 0,5 G 150 SK 588 ... please indicate: 50 ... 50 75 100 150 1000 mm art. no. Rth [K/W] 2,5 H 40 4,5 2,0 1,5 1,0 0,5 I 150 SK 120 ... please indicate: 50 ... 50 75 100 150 1000 mm Rth [K/W] art. no. 2,5 K 15 50 2,0 L SK 155 ... please indicate: 150 1,5 1,0 0,5 50 ... 75 100 150 1000 mm M N A 45 High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A Standard extruded heatsinks art. no. 11 71 B Rth [K/W] 1,0 0,8 3 0,6 C 0,4 0,2 8 156 SK 154 ... please indicate: 4 50 100 150 200 [mm] ... D 50 75 100 150 mm art. no. Rth [K/W] 5 19 4 3 E 160 6 2 1 SK 417 ... please indicate: 50 100 150 200 [mm] ... F 75 100 150 1000 mm Rth [K/W] 2,5 art. no. 40 2,0 1,5 G 10 1,0 0,5 160 SK 85 ... please indicate: 50 100 150 200 [mm] ... 37.5 50 75 100 150 1000 mm art. no. H Rth [K/W] 1,4 40 1,2 1,0 I 10 0,8 0,6 160 50 SK 503 ... please indicate: 100 150 200 [mm] weight reduced like SK 85 ... K 75 100 1000 mm art. no. Rth [K/W] 2,5 50 2,0 1,5 L 9 1,0 SK 510 ... please indicate: 0,5 160 50 100 150 200 [mm] ... M 50 75 100 150 1000 mm High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A 46 N A Standard extruded heatsinks Rth [K/W] 2,5 art. no. B 50 2,0 1,5 10 1,0 C SK 416 ... please indicate: 0,5 160 50 100 150 200 [mm] 100 150 200 [mm] ... 50 75 100 150 1000 mm art. no. Rth [K/W] 2,0 D 4 25 1,6 1,2 0,8 0,4 162 E SK 119 ... please indicate: 50 ... 50 75 100 150 1000 mm art. no. Rth [K/W] 2,0 1,6 40 F 10 0,8 please indicate: 0,4 163 SK 412 ... G 1,2 50 100 150 200 [mm] ... 50 75 100 150 1000 mm art. no. Rth [K/W] 2,5 2,0 15 H 1,5 1,0 4,5 167 0,5 SK 421 ... I please indicate: 50 150 200 [mm] 100 150 200 [mm] 50 75 100 150 200 1000 mm Rth [K/W] art. no. 5 4 2,5 3 10 K 2 169 SK 405 ... L 100 ... please indicate: 2 1 50 ... 100 1000 mm M N A 47 High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A Standard extruded heatsinks Rth [K/W] 2,0 art. no. B 9,8 40 1,6 1,2 0,8 0,4 177,5 SK 519 ... please indicate: 50 100 150 200 [mm] C ... 50 100 1000 mm Rth [K/W] 1,0 art. no. D 50 0,8 5 0,6 0,4 0,2 SK 90 ... please indicate: 190 50 100 150 200 [mm] ... E 50 75 100 1000 mm art. no. Rth [K/W] 2,5 15 2,0 1,0 3,5 200 F 1,5 0,5 SK 136 ... please indicate: 50 100 150 200 [mm] ... G 75 100 150 1000 mm art. no. Rth [K/W] 2,5 15 2,0 1,0 3,5 200 H 1,5 0,5 SK 166 ... please indicate: 50 100 150 200 [mm] I ... 1000 mm art. no. Rth [K/W] 2,5 20 2,0 K 1,5 200 4 1,0 0,5 SK 113 ... please indicate: 50 100 150 200 [mm] L ... 50 75 100 150 1000 mm M High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A 48 N A Standard extruded heatsinks art. no. Rth [K/W] 2,5 B 2,0 25 1,5 1,0 C 0,5 4 200 SK 42 ... please indicate: 50 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] ... 50 75 100 150 200 1000 mm Rth [K/W] 2,5 art. no. 200 D 25 2,2 2,0 1,5 1,0 E 1,5 188,3 SK 94 ... please indicate: 5,7 4 3,7 0,5 50 ... 1000 mm art. no. Rth [K/W] 1,3 1,1 39,9 9,2 F 0,9 0,7 0,5 200 G 50 SK 502 ... please indicate: weight reduced like SK 47 ... 37.5 50 75 100 150 1000 mm art. no. Rth [K/W] 1,2 H 10 40 1,0 0,8 0,6 0,4 I 200 SK 47 ... please indicate: 50 100 200 [mm] 150 ... 75 100 150 1000 mm art. no. Rth [K/W] K 2,0 60 1,6 1,2 L 10 0,8 200 SK 591 ... please indicate: 0,4 50 100 150 200 [mm] ... 75 100 150 1000 mm M N A 49 High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A Standard extruded heatsinks art. no. Rth [K/W] 1,0 B 16,5 83 0,8 0,6 0,4 0,2 SK 520 ... please indicate: 200 50 100 150 200 [mm] C ... 75 100 150 1000 mm art. no. Rth [K/W] 1,0 D 40 10 0,8 0,6 0,4 0,2 213 SK 193 ... please indicate: 50 100 150 200 [mm] E ... 100 150 1000 mm Rth [K/W] art. no. 1,0 F 77 0,8 0,6 0,4 17 0,2 216 SK 557 ... please indicate: 50 100 150 200 [mm] G ... 75 100 150 1000 mm art. no. Rth [K/W] 1,0 H 83 0,8 0,6 0,4 15 0,2 SK 102 ... please indicate: 216 50 100 150 200 [mm] ... I 75 100 150 1000 mm art. no. 104,5 13,5 80 Rth [K/W] 1,2 15 13,5 K 0,8 40 7,6 1,0 0,6 0,4 SK 168 ... please indicate: 226,5 50 100 150 200 [mm] ... L 1000 mm M High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A 50 N A Standard extruded heatsinks art. no. Rth [K/W] 1,0 B 60 0,8 0,6 8 0,4 C 235 SK 580 ... please indicate: 0,2 50 100 150 200 [mm] ... 75 100 150 200 1000 mm art. no. Rth [K/W] 1,2 D 25 5 1,0 0,8 0,6 245 E 0,4 SK 118 ... please indicate: 50 100 200 [mm] 150 ... 75 100 150 1000 mm art. no. Rth [K/W] 2,5 F 6 28 2,0 1,5 1,0 0,5 250 G SK 49 ... please indicate: 50 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] ... 50 75 150 200 1000 mm Rth [K/W] 1,0 art. no. 0,8 6 40 H 0,6 0,4 0,2 I 250 SK 555 ... please indicate: 50 ... 75 100 150 1000 mm art. no. Rth [K/W] 1,0 0,8 6 40 K 0,6 0,4 0,2 250 SK 199 ... L please indicate: 50 ... 75 100 1000 mm M N A 51 High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A Standard extruded heatsinks Rth [K/W] 1,1 10 40 art. no. B 0,9 0,7 0,5 0,3 250 SK 524 ... 50 100 150 200 [mm] C ... please indicate: 75 100 150 1000 mm art. no. Rth [K/W] 1,0 250 D 3,4 40 10 0,8 0,6 1,9 0,4 0,2 230,5 4 SK 91 ... please indicate: 7,5 50 100 150 200 [mm] ... E 75 100 150 1000 mm art. no. Rth [K/W] 0,6 F 83 0,5 0,4 15 0,3 SK 438 ... 0,2 50 250 100 150 200 [mm] ... please indicate: G 75 100 150 1000 mm art. no. Rth [K/W] 252 1,0 H 2 6 40 0,8 0,6 0,4 0,2 6 5 258 SK 190 ... please indicate: 50 100 150 200 [mm] ... I 150 1000 mm art. no. Rth [K/W] 1,0 K 11,5 67,5 0,8 0,6 0,4 0,2 260 SK 614 ... please indicate: 50 100 150 200 [mm] ... L 75 100 150 200 1000 mm M High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A 52 N A Standard extruded heatsinks art. no. Rth [K/W] 2,5 B 6 50 2,0 1,5 1,0 0,5 C 265 SK 149 ... 50 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] ... please indicate: 200 1000 mm art. no. 54 0,8 0,6 10 74 6,5 D Rth [K/W] 1,0 E SK 139 ... 10,7 15 20 0,4 please indicate: 3,5 265 0,2 9 50 ... 100 150 200 1000 mm Rth [K/W] art. no. 1,3 F 6 28 1,1 0,7 6 G 0,9 0,5 282 SK 583 ... 50 please indicate: ... 100 150 200 1000 mm Rth [K/W] art. no. 1,2 3,9 H 15 1,0 0,8 0,6 300 0,4 I SK 198 ... 50 please indicate: ... 100 150 1000 mm Rth [K/W] art. no. 6,5 1,2 1,0 27 K 0,8 0,6 300 0,4 SK 446 ... L please indicate: 50 ... 75 100 150 1000 mm M N A 53 High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A Standard extruded heatsinks Rth [K/W] art. no. 1,0 B 0,6 40 10 0,8 0,4 0,2 300 SK 56 ... 50 please indicate: 100 150 200 [mm] C ... 75 100 150 200 1000 mm art. no. Rth [K/W] 0,6 D 0,4 40 10 0,5 0,3 0,2 300 50 SK 501 ... 100 150 200 [mm] weight reduced like SK 56 E ... please indicate: 37.5 50 75 100 150 200 1000 mm art. no. Rth [K/W] F 0,5 0,4 60 0,3 12 0,2 0,1 300 SK 568 ... 50 please indicate: 100 150 200 [mm] G ... 75 100 150 200 1000 mm art. no. Rth [K/W] 0,5 H 40 12 83,5 0,4 0,3 0,2 0,1 SK 157 ... 300 please indicate: 50 100 150 200 [mm] I ... 100 150 200 1000 mm art. no. Rth [K/W] 39,5 4,5 1,0 K 0,8 0,6 0,4 304 0,2 SK 101 ... please indicate: 50 100 150 200 [mm] L ... 75 100 1000 mm M High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A 54 N A Standard extruded heatsinks Rth [K/W] 2,0 art. no. B 4 1,6 20 1,2 0,8 320 C 0,4 SK 579 ... 50 100 150 200 [mm] ... please indicate: 75 100 150 200 1000 mm art. no. Rth [K/W] 1,0 338 285 0,8 32 D 0,6 5 0,4 E 126 SK 66 ... please indicate: 0,2 5 8 126 50 200 [mm] 150 100 ... 75 100 1000 mm Rth [K/W] 0,7 art. no. 0,6 40 F 0,5 0,4 0,3 G 7,2 350 SK 523 ... please indicate: 50 150 100 200 [mm] ... 100 150 200 1000 mm art. no. Rth [K/W] 0,8 8 25 0,7 H 0,6 0,5 5 380 0,4 SK 439 ... I please indicate: 50 100 150 50 100 150 200 [mm] ... 100 150 1000 mm art. no. Rth [K/W] 1,0 0,8 40 K 0,4 9,2 400 SK 479 ... L 0,6 please indicate: 0,2 200 [mm] ... 75 100 150 1000 mm M N A 55 High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A Standard extruded heatsinks art. no. Rth [K/W] 1,0 400 B 40 10 0,8 0,6 SK 93 ... please indicate: 3,4 1,9 0,4 380,5 0,2 7,5 4 50 100 150 200 [mm] C ... 75 100 150 1000 mm art. no. Rth [K/W] 1,0 D 40 0,8 0,6 0,4 6 420 0,2 SK 130 ... please indicate: 50 100 150 200 [mm] ... E 200 1000 mm art. no. Rth [K/W] 1,0 F 57,5 0,8 0,6 0,4 SK 621 ... please indicate: 0,2 10,5 426,4 50 100 150 200 [mm] ... G 75 100 150 200 1000 mm Rth [K/W] 1,0 33,5 art. no. 11,4 0,8 H 0,6 482,8 = 19" 8 0,4 0,2 50 SK 191 ... please indicate: 100 150 200 [mm] I suitable heatsink for rear panal in 19'' cases ... 75 100 150 200 1000 mm K L M High decorative surfaces Order example Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 Heatsinks for Solid State Relay Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A 56 N A Welded high perfomance heatsinks B - - - - - - optimum fin geometry and fin quantity for free convection well suited for forced convection flat milled base (not SK 530, SK 531) * = welded joint (not SK 530, SK 531) length according customers details customer specific versions and machining on request Rth C [K/W] 0,40 0,38 0,36 0,34 0,32 D 0,30 0,28 0,26 0,24 E 0,22 0,20 SK 530 0,18 12,5 0,16 F 0,14 SK 531 A C 0,12 G < Rz10 * 0,10 SK 533 0,08 SK 535 SK 536 SK 537 SK 538 SK 539 SK 540 0,06 0,04 < 0,1 100 B 100 200 300 400 [mm] art. no. H I K SK SK SK SK SK SK SK SK SK 530 531 533 535 536 537 538 539 540 number of fins ... ... ... ... ... ... ... ... ... please indicate: 14 22 30 38 42 46 50 54 58 A 15 0.7 15 0.7 16 +0/ -1.5 16 +0/ -1.5 16 +0/ -1.5 16 +0/ -1.5 16 +0/ -1.5 16 +0/ -1.5 16 +0/ -1.5 dim. [mm] B 200 0.7 300 1 400 +0.6/ -1.6 500 +0.6/ -1.6 550 +0.6/ -1.6 600 +0.6/ -1.6 650 +0.6/ -1.6 700 +0.6/ -1.6 750 +0.6/ -1.6 C 84 0.7 84 0.7 84 +0/ -1.5 84 +0/ -1.5 84 +0/ -1.5 84 +0/ -1.5 84 +0/ -1.5 84 +0/ -1.5 84 +0/ -1.5 ... 200 300 400 500 600 mm L M N A 57 High decorative surfaces Heatsink profile-overview Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 heatsinks for Solid State Relais Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A High performance heatsinks with press-in fins - other length according to customers details - customer specific versions and machining upon request B 4 art. no. R 0,3 6,2 3, 6 71 4 R 1 C Rth [K/W] 12,5 0,35 8 6 0,3 7,5 0,25 D 0,15 0,1 16 12 84 0,6 0,2 0,05 200 1,2 SK 418 ... please indicate: 100 150 200 250 300 350 400 [mm] E ... 100 150 200 1000 mm Rth [K/W] 4,8 0,35 F 0,3 0,25 R 0,4 0,2 0,15 5,2 SK 158 0,1 5 13,5 69 R 1,1 SK 159 SK 160 SK 161 SK 162 0,05 100 12,5 4,8 150 200 250 300 350 G 400 [mm] v = 5 m/s Rth 0,08 H [K/W] 0,07 0,06 83,5- 1 + 1,2 0,05 0,04 A 0,03 0,01 15 B SK 158 SK 159 SK 160 SK 161 SK 162 0,02 100 art. no. SK SK SK SK SK 158 159 160 161 162 number of fins ... ... ... ... ... please indicate: 150 200 250 300 350 400 [mm] dim. [mm] A 20 20 20 20 20 22 30 38 46 58 I K B 300 2 400 2 500 2.5 600 3 750 4 L ... 200 300 400 500 600 mm M High decorative surfaces Heatsink profile-overview Heatsink as visual & decor-parts Drilling pattern for Solid State Relais A A A A 9 21 10 12 heatsinks for Solid State Relais Special heatsink design Special profiles Technical introduction A A A A 11 - 12 137 - 138 140 2-8 A 58 N A Standard extruded heatsinks SK 09 37,5 TO 220 1 SK 09 50,0 TO 220 1 SK 09 37,5 TO 220 3,2 17 20 9,6 14,8 4,5 4,5 11,3 14,75 37,5 4,5 C 3,2 7 29 29 29 Rth [K/W] 16 14 7 29 12 12 10 SK 09 ... 8 11,5 2,5 D 6 ... ... 20 37.5 50 1000 mm 37,5 50 100 [mm] 75 SK 145 37,5 TO 220 7 29 G 7 29 15,5 25 5,1 14,75 29 3,2 14,75 50 11,3 14,75 37,5 4,5 17 20 F 3,2 3,2 3,2 SK 145 25 TO 220 SK 145 50 TO 220 4,5 SK 145 20 TO 220 (optional) K; TO 220 17,7 art. no. 20 29 please indicate: 4,5 E 3,2 3,2 3,2 7 SK 09 20 TO 220 14,75 50 B SK 09 50 TO 220 17,7 art. no. 7 29 Rth [K/W] 14 12 12 10 3 8 H SK 145 ... please indicate: 6 25,4 29 50 ... ... 20 25 37.5 50 1000 mm art. no. 3,6 3,5 100 150 200 [mm] 100 150 200 [mm] (optional) TO 220 20 12 12,5 2,5 16 8 4 11,7 K 150 Rth [K/W] 3,6 I 200 [mm] 100 30,1 SK 443 ... please indicate: 50 ... 37.5 75 100 1000 mm art. no. Rth [K/W] 10 37,5 L 39 6,7 8 6 4 2 M 44,5 SK 173 ... please indicate: 76,2 50 ... 1000 mm N A 59 Hole pattern Profiles for PCB components Heatsinks for PCB Profiles for PCB mounting A A A A 21 91 89 89 - 112 Screw mounted guide rails Thermal conductive material Heatsink-cooling aggregates Technical introduction E 26 - 27 E 2 - 24 D 14 A2-8 A Standard extruded heatsinks art. no. Rth [K/W] 10 19,5 B 12,5 2,5 8 6 4 2 42,7 SK 59 ... please indicate: 50 ... ... 37.5 50 75 100 1000 mm art. no. 100 200 [mm] 150 C (optional) TO 220 Rth [K/W] 8 27,4 D 12,5 3 6 4 2 45 SK 122 ... please indicate: 50 ... ... 37.5 50 mm 100 200 [mm] 150 (optional) TO 3; CB art. no. E Rth [K/W] 7 32 6 F 4 24 2,4 3 4 25 5 2 1 46 SK 107 ... please indicate: 50 100 200 [mm] 150 G ... 50 75 100 1000 mm Rth [K/W] art. no. 5 11 7,5 H 4 2,5 20 3 2 1 50 SK 181 ... please indicate: 50 100 150 200 [mm] I ... 50 75 100 1000 mm 11 2xM3 7,5 20 2,5 20 art. no. K 83,82 94 50 16,5 Rth [K/W] 4,2 4,2 5 3xM3 L 4 50 4 17,25 8 3 2 1 19,06 27,94 27,94 SK 181 94 C 3 x TO 220 retaining spring for transistor THF 409 TO 220 A 115 Hole pattern Profiles for PCB components Heatsinks for PCB Profiles for PCB mounting A A A A 21 91 89 89 - 112 Screw mounted guide rails Thermal conductive material Heatsink-cooling aggregates Technical introduction 50 E 26 - 27 E 2 - 24 D 14 A2-8 100 150 200 [mm] A 60 M N A Standard extruded heatsinks art. no. Rth [K/W] 10 B 8 33 4 15 6 4 2 C 60 SK 78 ... please indicate: 50 ... ... 37.5 50 75 100 1000 mm 100 150 200 [mm] (optional) TO 3; CB Rth [K/W] 10 art. no. D 35,5 6 20 3,5 8 4 2 E SK 51 ... please indicate: 60 50 ... ... 37.5 50 75 100 1000 mm 150 100 200 [mm] (optional) TO 3; CB art. no. Rth [K/W] 5 F 34 4 17,5 4 3 2 1 G 62 SK 165 ... please indicate: 50 ... ... 37.5 50 75 1000 mm 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 1,7 art. no. 100 (optional) TO 3; CB 5 Rth [K/W] 5 28,5 H I 4 3 2 9,2 29 1 28 63,2 SK 25 ... please indicate: 50 with slots for cover plates or PCBs ... 37.5 50 1000 mm Rth [K/W] 25,4 10 5 12,1 8 2,6 2 K art. no. 6 L 1,5 4 63,8 SK 150 ... please indicate: 3,2 57,4 2 50 ... 1000 mm M N A 61 Hole pattern Profiles for PCB components Heatsinks for PCB Profiles for PCB mounting A A A A 21 91 89 89 - 112 Screw mounted guide rails Thermal conductive material Heatsink-cooling aggregates Technical introduction E 26 - 27 E 2 - 24 D 14 A2-8 A Standard extruded heatsinks art. no. Rth [K/W] 33 5 B 24 4 4 3 2 1 SK 18 ... please indicate: 65 50 ... ... 37.5 50 75 1000 mm art. no. 100 150 200 [mm] C (optional) TO 3; CB Rth [K/W] 5 29 D 27 4 4 3 2 1 SK 63 ... please indicate: 65 50 ... ... 37.5 50 75 100 1000 mm 150 200 [mm] (optional) TO 3; CB 1,7 art. no. 100 5 Rth [K/W] 3,7 F 4 28,5 25 5 29 E 3 2 1 65 SK 05 ... please indicate: 50 100 150 200 [mm] G with slots for cover plates or PCBs ... ... 50 75 1000 mm art. no. (optional) TO 3; CB 27,1 H Rth [K/W] 33,8 5 4 3 4 2 I 1 SK 402 ... please indicate: 71,1 ... 50 ... 100 mm 100 150 200 [mm] (optional) TO 3; CB art. no. K Rth [K/W] 5 37,8 23,5 4 3 2 L 1 please indicate: ... 4,5 72 SK 97 ... ... 37.5 50 75 100 1000 mm 50 100 150 200 [mm] (optional) TO 3 M Hole pattern Profiles for PCB components Heatsinks for PCB Profiles for PCB mounting A A A A 21 91 89 89 - 112 Screw mounted guide rails Thermal conductive material Heatsink-cooling aggregates Technical introduction E 26 - 27 E 2 - 24 D 14 A2-8 A 62 N A Standard extruded heatsinks Rth [K/W] art. no. 5 B 31,5 15 4 4 3 2 1 C 79 SK 45 ... please indicate: 50 ... ... 37.5 50 75 100 1000 mm 100 150 200 [mm] (optional) TO 3; CB Rth [K/W] art. no. 5 4 5 35 14,5 D 3 2 1 E 94 SK 19 ... please indicate: 50 ... ... 37.5 50 75 100 1000 mm 100 150 200 [mm] (optional) TO 3; CB Rth [K/W] art. no. 5 4 36 3 20 3,5 F 2 1 94,5 SK 28 ... G please indicate: 50 ... ... 37.5 50 75 1000 mm 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] (optional) TO 3; CB art. no. Rth [K/W] 5 33 4 H 25 4 3 2 1 95 SK 401 ... I please indicate: 50 ... ... 100 1000 mm (optional) TO 3; CB art. no. Rth [K/W] 5 33 25 4 K 24 4 3 2 1 97 SK 72 ... L please indicate: 50 ... ... 37.5 50 75 100 1000 mm (optional) TO 3; CB M N A 63 Hole pattern Profiles for PCB components Heatsinks for PCB Profiles for PCB mounting A A A A 21 91 89 89 - 112 Screw mounted guide rails Thermal conductive material Heatsink-cooling aggregates Technical introduction E 26 - 27 E 2 - 24 D 14 A2-8 A Standard extruded heatsinks Rth [K/W] 5 3 1,6 art. no. B 4 3 4 25 36 2 1 97 SK 04 ... please indicate: 50 100 150 200 [mm] C with slots for cover plates or PCBs ... ... 37.5 50 75 100 1000 mm (optional) SSR 1; SSR 2; TO 3; CB art. no. 38 D 10 40 Rth [K/W] 5 4 3 2 E 1 SK 403 ... please indicate: 104 50 100 150 200 [mm] ... 1000 mm art. no. Rth [K/W] 5 23 4 3,5 30,6 F 3 2 G 1 105 SK 73 ... please indicate: 50 ... ... 50 75 1000 mm 100 150 200 [mm] (optional) TO 3; CB Rth [K/W] 2,5 art. no. 34 H 37 2,0 6 1,5 1,0 0,5 120 SK 71 ... please indicate: 50 ... ... 37.5 50 75 100 1000 mm 100 150 200 [mm] I (optional) TO 3 10 art. no. K 50 1,6 Rth [K/W] 2,5 36 2,0 8 1,5 L 1,0 0,5 120 SK 57 ... please indicate: 50 100 150 200 [mm] with slots for cover plates or PCBs ... M 37.5 75 100 1000 mm Hole pattern Profiles for PCB components Heatsinks for PCB Profiles for PCB mounting A A A A 21 91 89 89 - 112 Screw mounted guide rails Thermal conductive material Heatsink-cooling aggregates Technical introduction E 26 - 27 E 2 - 24 D 14 A2-8 A 64 N A Standard extruded heatsinks art. no. B Rth [K/W] 2,5 2,0 2,35 4,7 32,6 1,4 35 1,5 1,0 3,85 C SK 197 ... please indicate: 5,85 125,65 145 0,5 50 ... ... 37.5 1000 mm art. no. 32 0,5 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] Rth [K/W] 2,5 2,0 1,5 40 29 1,6 D 100 (optional) TO 3; CB 6 1,0 E 0,5 150 SK 98 ... please indicate: 50 with slots for cover plates or PCBs ... 100 150 mm art. no. Rth [K/W] 52,9 15,4 1,4 F 40 10 1,2 1,0 0,8 0,6 G SK 404 ... please indicate: 160 50 ... ... 50 75 1000 mm (optional) TO 3; CB H I K L M N A 65 Hole pattern Profiles for PCB components Heatsinks for PCB Profiles for PCB mounting A A A A 21 91 89 89 - 112 Screw mounted guide rails Thermal conductive material Heatsink-cooling aggregates Technical introduction E 26 - 27 E 2 - 24 D 14 A2-8 A Standard extruded heatsinks art. no. Rth [K/W] 5 69,4 37 B 4 26 3 4 2 1 88 SK 36 ... 50 100 150 200 [mm] C mounting parts IS 1, IS 2, IS 3 E 49 please indicate: ... ... 50 75 1000 mm art. no. (optional) TO 3; CB 93 Rth [K/W] 5 36 D 4 4 26 3 2 1 115 SK 01 ... 50 100 150 200 [mm] E mounting parts IS 1, IS 2, IS 3 E 49 please indicate: ... ... 37.5 50 75 100 1000 mm art. no. (optional) TO 3; CB F G 63 4 10 1,6 92 38,5 Rth [K/W] 2,5 2,0 36 1,5 H 2 1,0 0,5 115 SK 02 ... please indicate: 50 ... ... 200 [mm] I (optional) TO 3; CB 1,6 100 Rth [K/W] 5 4 3 art. no. K 4 32 3 2 2 36 1 120 please indicate: 150 with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 E 49 37.5 50 75 100 1000 mm SK 03 ... 100 50 100 150 200 [mm] with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 E 49 ... ... 50 75 100 1000 mm L (optional) TO 3; CB M Thermal conductive material Mounting material for semiconduct. Mounting parts for heatsinks Distance sleeves for PCBs in HP grid E E E E 2-5 44 - 48 49 - 50 39 Order example Guide rails for PCBs Heatsink-cooling aggregates Technical introduction A 21 E 26 - 27 D 14 A2-8 A 66 N A Standard extruded heatsinks 100 5 4 3 31,4 4,8 B Rth [K/W] 5 1,7 art. no. 2 1 34 C 121,3 SK 39 ... please indicate: 50 150 200 [mm] 100 150 200 [mm] 100 150 100 150 with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 E 49 ... ... 75 100 1000 mm art. no. (optional) TO 3; CB 10 100,6 Rth [K/W] 2,5 4,8 67 1,6 D 100 2,0 1,5 E 33,8 1,0 0,5 122 F SK 30 ... please indicate: 50 with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 E 49 ... ... 75 100 1000 mm (optional) TO 3; CB 104 10 art. no. 65 5 1,6 G Rth [K/W] 2,5 2,0 1,5 1,0 36 H 0,5 125 SK 34 ... please indicate: 50 ... ... 50 75 100 1000 mm art. no. (optional) TO 3; CB 106 Rth [K/W] 2,5 66 5 1,7 10 I 200 [mm] with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 E 49 K 2,0 1,5 1,0 0,5 34 125 L SK 14 ... please indicate: 50 200 [mm] with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 E 49 ... ... 50 75 100 mm (optional) TO 3; CB M N A 67 Thermal conductive material Mounting material for semiconduct. Mounting parts for heatsinks Distance sleeves for PCBs in HP grid E E E E 2-5 44 - 48 49 - 50 39 Order example Guide rails for PCBs Heatsink-cooling aggregates Technical introduction A 21 E 26 - 27 D 14 A2-8 A Standard extruded heatsinks 7 28 4 4,5 34 art. no. B Rth [K/W] 5 4 3 2,5 1,6 2 89 100 SK 20 ... C 1 50 100 150 200 [mm] with slots for cover plates or PCBs; mounting parts IS 5, IS 8 E 49 please indicate: ... ... 37.5 75 100 1000 mm (optional) TO 3; CB D 4 art. no. 50,5 4 8,4 38 5 5,5 Rth [K/W] 5 E 17,5 3 2 1 SK 184 ... please indicate: 106,4 50 100 150 200 [mm] F ... 100 1000 mm 34 5,8 Rth [K/W] 2,5 50 1,8 5 3,5 5 art. no. G 2,0 1,5 1,0 0,5 119 132 SK 148 ... please indicate: 50 100 150 200 [mm] H with slots for cover plates or PCBs ... ... 37.5 100 1000 mm (optional) TO 3; CB Rth [K/W] 2,5 art. no. 35,5 I 4 2,0 25 1,5 1,0 0,5 142 SK 84 ... please indicate: 50 ... ... 50 150 1000 mm 100 150 200 [mm] K (optional) TO 3 L M Guide rails for PCBs Mounting material for semiconduct. Mounting parts for heatsinks Heatsink-cooling aggregates E 26 - 30 E 44 - 48 E 49 - 50 D 14 Order example Assignment table Hole pattern Technical introduction A A A A 21 18 - 20 21 2-8 A 68 N A Standard extruded heatsinks art. no. Rth [K/W] 2,5 34 40 B 2,0 6,5 1,5 1,0 145 C 0,5 164 SK 67 ... please indicate: 50 100 150 200 [mm] mounting part IS 6 E 49 ... ... 37.5 50 100 1000 mm (optional) TO 3 D E F G H I K L M N A 69 Guide rails for PCBs Mounting material for semiconduct. Mounting parts for heatsinks Heatsink-cooling aggregates E 26 - 30 E 44 - 48 E 49 - 50 D 14 Order example Assignment table Hole pattern Technical introduction A A A A 21 18 - 20 21 2-8 A Standard extruded heatsinks 46 37,5 37,5 14 5 75 mm 3,6 K/W for cases SOT 32 ... ... 37.5 75 mm art. no. D (optional) 1xM3; 2xM3 62 18,75 37,5 37,5 13 37,5 mm 4,1 K/W SK 64 ... 13 17 54 70 18,75 5 4 3,5 25 12 75 2xM3 please indicate: 37,5 1xM3 SK 65 ... 14 54 C 18,75 12 38 37,5 mm 5,5 K/W B 18,75 37,5 1xM3 22,5 3,5 4 10 75 2xM3 art. no. 75 mm 2,7 K/W E F for cases TO 220, TOP 3 please indicate: ... ... 37.5 75 mm art. no. (optional) 1xM3; 2xM3 G 4 78 4,3 26,5 Rth [K/W] 3,0 H 3 9 2,5 2,0 1,5 SK 419 ... please indicate: 1,0 25,1 47 77 50 100 150 200 [mm] ... I 1000 mm art. no. Rth [K/W] 36 21 4 4 1,6 3 5 K 3 2 1 120 50 SK 21 ... please indicate: 100 150 200 [mm] with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 E 49 ... ... 37.5 1000 mm L (optional) TO 3; CB M Mounting for TO 3 angle Order example Special heatsink design Heatsinks for DC/DC converter A A A A 125 21 137 - 138 113 - 114 Insulting clamping parts Mica wafers Insulator sleeves Technical introduction E 45 E 19 E 52 A2-8 A 70 N A Standard extruded heatsinks art. no. Rth [K/W] 5 100 34 3 11,7 1,5 4 3 B 2 1 120,5 C 50 SK 69 ... 100 150 200 [mm] 100 150 200 [mm] 100 150 100 150 mounting parts IS 1, IS 2, IS 3 E 49 please indicate: ... ... 50 75 100 1000 mm art. no. (optional) TO 3; CB Rth [K/W] 5 31,5 4 22 5,5 D 3 2 E 1 127 SK 74 ... 50 ... please indicate: ... 37.5 100 1000 mm (optional) TO 3; CB art. no. Rth [K/W] 2,5 38 F 8 33 2,0 1,5 1,0 0,5 G 140 SK 124 ... 50 please indicate: ... ... 50 100 150 1000 mm (optional) TO 3 165 art. no. 200 [mm] Rth [K/W] 2,5 32,5 SK 195 ... please indicate: 25 0,5 32,5 85 1,5 1,0 7,6 4,2 I 2,0 2,8 5,1 1,5 H 60 185 50 ... ... 75 100 mm 200 [mm] (optional) TO 3; CB K L M N A 71 Mounting for TO 3 angle Order example Special heatsink design Heatsinks for DC/DC converter A A A A 125 21 137 - 138 113 - 114 Insulting clamping parts Mica wafers Insulator sleeves Technical introduction E 45 E 19 E 52 A2-8 A Standard extruded heatsinks Rth [K/W] 10 art. no. B 8 6 12 3 29 4 2 50 SK 31 ... 50 please indicate: ... ... 37.5 50 75 1000 mm 100 150 200 [mm] C (optional) TO 3; CB art. no. Rth [K/W] 5 36 D 15 3,2 4 3 2 1 70 SK 07 ... 50 ... please indicate: ... 37.5 50 75 1000 mm 100 150 200 [mm] (optional) TO 3; CB art. no. E Rth [K/W] 5 34 F 4,7 25,4 4 3 2 1 104,8 50 SK 16 ... 100 150 200 [mm] mountingpart IS 3 E 49 please indicate: ... ... 75 1000 mm art. no. G (optional) TO 3; CB 39 Rth [K/W] H 3,0 8 39 2,5 2,0 1,5 1,0 105 SK 500 ... please indicate: 50 100 150 200 [mm] I ... 37.5 50 75 100 1000 mm K L M Special heatsink design Mounting for TO 3 angle Special profiles Fin coolers A A A A 137 - 138 Hole pattern 125 Profiles for lock-in fixing spring 140 Extruded heatsinks 129 Technical introduction A A A A 21 84 - 88 22 - 83 2-8 A 72 N A Standard extruded heatsinks art. no. Rth 30 6 2 18 2,7 4 B 8 [K/W] 7 5 4,5 34,4 65 C SK 185 ... please indicate: 4 50 100 150 200 [mm] 50 100 150 200 [mm] 50 100 150 200 [mm] 50 100 150 200 [mm] 50 100 150 extruded heatsink for PCB mounting A 104 ... ... 37.5 50 1000 mm art. no. (optional) TO 3; CB Rth 30 3 20 4 D 5 [K/W] 4 2 1 65 SK 48 ... please indicate: ... ... 37.5 50 75 100 1000 mm (optional) SSR 3; TO 3; CB Rth 30 3,5 art. no. 5 [K/W] 4 3 2 25 1,7 F 4,5 E 1 88 SK 79 ... G please indicate: with slots for cover plates or PCBs ... ... 37.5 50 75 100 1000 mm Rth 30 3 35 15 5 H 5 [K/W] 4 1,6 art. no. (optional) TO 3; CB 2 1 88 SK 08 ... I please indicate: with slots for cover plates or PCBs ... ... 37.5 50 75 100 1000 mm art. no. (optional) TO 3; CB Rth 30 1,6 [K/W] 2,5 30 50 2,0 K 1,5 6 1,0 0,5 100 L SK 88 ... please indicate: 200 [mm] with slots for cover plates or PCBs ... ... 37.5 50 75 100 1000 mm (optional) TO 3 M N A 73 Assignment table Standard aluminium profiles Extruded heatsinks High capacity cooling aggregat. A 18 - 20 A 135 - 136 A 22 - 83 D 26 - 28 Retaining springs for transistors Thermal. conductive silicone foam foil Thermal conductive foil Technical introduction A 115 - 117 E 10 E7 A2-8 A Standard extruded heatsinks Rth [K/W] art. no. 5 26,5 28 B 4 3 19 4,6 28 2 1 105 SK 52 ... 50 please indicate: ... ... 37.5 50 75 100 1000 mm art. no. 200 [mm] C 2,5 34 32,5 D 2,0 1,5 2,2 4 1,5 25 150 Rth [K/W] 135 32,5 100 (optional) 2xTO 3; 2xCB 1,0 0,5 3,7 SK 60 ... please indicate: 5,7 125 50 ... ... 50 75 100 1000 mm art. no. 10 34 150 200 [mm] (optional) 2xTO 3; 2xCB 2,5 29 F 1,5 30 4 25 2,0 2,5 E Rth [K/W] 10 29 100 1,0 0,5 135 SK 147 ... please indicate: 50 ... ... 50 150 1000 mm 100 150 200 [mm] (optional) 2xTO 3; 2xCB art. no. G Rth [K/W] 32 2,5 37 2,0 H 1,5 20 4 37 1,0 0,5 179 SK 80 ... please indicate: 50 ... ... 75 100 1000 mm art. no. 68 38 100 150 200 [mm] I (optional) 2xTO 3; 2xCB Rth [K/W] 38 2,5 48 2,0 K 1,5 5 1,0 0,5 SK 53 ... please indicate: 180 ... 50 ... 50 75 100 150 1000 mm 100 150 200 [mm] L (optional) 2xTO 3; 2xCB M Hole pattern Standard aluminium profiles Extruded heatsinks Thermal conductive material A 21 A 135 - 136 A 22 - 83 E2-5 Heatsink as visual & decor-parts Assignment table Kapton insulator washers Technical introduction A 10 A 18 - 20 E 16 A2-8 A 74 N A Standard extruded heatsinks art. no. Rth [K/W] B 28 29 2,5 28 29 28 29 2,0 1,5 38 4,5 29 1,0 0,5 C 232 SK 86 ... 50 100 150 200 [mm] 100 150 200 [mm] ... please indicate: 100 150 1000 mm art. no. D 110 110 Rth [K/W] 1,0 110 30 28 6 0,8 0,6 0,4 0,2 440 E SK 82 ... please indicate: 50 ... 100 1000 mm F G H I K L M N A 75 Hole pattern Standard aluminium profiles Extruded heatsinks Thermal conductive material A 21 A 135 - 136 A 22 - 83 E2-5 Heatsink as visual & decor-parts Assignment table Kapton insulator washers Technical introduction A 10 A 18 - 20 E 16 A2-8 A Standard extruded heatsinks art. no. Rth [K/W] 8 9 12 B 10 45 8 17 26 6 4 C 2 SK 596 ... please indicate: 3 5 50 100 150 200 [mm] ... 37.5 50 75 100 1000 mm 30 art. no. D 3 Rth [K/W] 6 45 5 29 4 E 3 2 2 1 SK 544 ... please indicate: 8 11,4 50 25 100 150 200 [mm] ... F 50 75 100 1000 mm 38 8 art. no. Rth [K/W] 5 G 54 4 26 3 2 1 6 SK 32 ... please indicate: 50 20 100 150 200 [mm] ... H 37.5 50 75 100 1000 mm art. no. 30,5 4,5 3 6,5 I 59 Rth [K/W] 3 2 6 K 10,5 SK 187 ... please indicate: ... 1 6,5 20 40 50 ... 75 1000 mm 100 150 200 [mm] (optional) SSR 3 L M Hole pattern Standard aluminium profiles Extruded heatsinks Thermal conductive material A 21 A 135 - 136 A 22 - 83 E2-5 heatsinks for Solid State Relais Assignment table Kapton insulator washers Technical introduction A 11 - 12 A 18 - 20 E 16 A2-8 A 76 N A Standard extruded heatsinks art. no. 10 5 72 B 94 Rth [K/W] 2,5 2,0 1,5 C 7 1,0 8,5 please indicate: 50 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] ... 1000 mm art. no. Rth [K/W] 1,2 5,3 D 13,5 22 3 SK 140 ... 0,5 94,3 1,0 E 0,8 0,6 4 0,4 0,2 SK 556 ... please indicate: 50 ... 75 100 150 1000 mm 14 art. no. 35 48 62 30 F 72 G Rth [K/W] 124 1,2 1,0 0,8 0,6 0,4 H 0,2 SK 15 ... please indicate: 50 72 ... 75 1000 mm art. no. 80 Rth [K/W] 1,4 1,2 14,5 78,6 6 I K 1,0 0,8 0,6 1 58,5 SK 89 ... please indicate: 50 with slots for cover plates or PCBs ... ... 100 150 1000 mm L (optional) SSR 1; SSR 2 M N A 77 Hole pattern Standard aluminium profiles Extruded heatsinks Thermal conductive material A 21 A 135 - 136 A 22 - 83 E2-5 heatsinks for Solid State Relais Assignment table Kapton insulator washers Technical introduction A 11 - 12 A 18 - 20 E 16 A2-8 A Standard extruded heatsinks art. no. 8 80 B 160 Rth [K/W] 1,2 C 1,0 0,8 0,6 0,4 D 8 SK 163 ... please indicate: 71 9 50 100 150 200 [mm] ... 100 150 1000 mm 82 25 E Rth [K/W] 1,8 8 art. no. 58 1,6 1,4 1,2 SK 176 ... please indicate: ... 50 ... 75 100 150 1000 mm F 1,0 16 78 100 150 200 [mm] (optional) SSR 2 G H I K L M Hole pattern Standard aluminium profiles Extruded heatsinks Thermal conductive material A 21 A 135 - 136 A 22 - 83 E2-5 heatsinks for Solid State Relais Assignment table Kapton insulator washers Technical introduction A 11 - 12 A 18 - 20 E 16 A2-8 A 78 N A Standard extruded heatsinks Rth [K/W] 5 art. no. 2 B 12 , 55 + 0 52 4 3 2 1 C 52 SK 11 ... please indicate: 50 100 150 200 [mm] threads, through holes and fixing according to your demand; mounting parts IS 1, IS 2, IS 3 E 49 ... 1000 mm art. no. 11 Rth [K/W] 30 2,5 6 11 D 70 2,0 6 3,5 1,5 1,0 E 0,5 10 SK 83 ... please indicate: 6 87,9 50 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] ... 100 1000 mm art. no. 50 Rth [K/W] 2,5 G 107 6,4 F 2,0 40,3 1,5 1,0 0,5 107 H SK 06 ... please indicate: 50 mounting part IS 4 E 49 ... 75 1000 mm 119 art. no. 105 3,6 1,5 I Rth [K/W] 2,5 7,8 K 119 105 55 2,0 1,5 1,0 0,5 50 SK 23 ... L please indicate: with slots for cover plates or PCBs; equipped with fan and endplates = LA 4 D 14 ... 75 mm M N A 79 Profiles for PCB components High capacity heatsinks Mounting for TO 3 angle Heatsinks for PCB A A A A 91 57 - 58 125 89 - 112 heatsinks for lock-in retaining spring Heatsink-cooling aggregates Special heatsink design Technical introduction A 85 - 88 D 14 A 137 - 138 A2-8 A Standard extruded heatsinks art. no. 76,9 22 8,5 70,5 8,3 13 50 52,5 8 B 120 Rth [K/W] 15 12 1,0 C 0,8 0,6 12,4 0,4 SK 110 ... please indicate: 0,2 52,5 120,5 50 100 150 200 [mm] D ... 150 200 1000 mm art. no. 6 125 80 E 135 115 101,5 96 4,2 5,3 F Rth [K/W] 4,2 1,0 SK 109 ... please indicate: 96 101,5 110 0,8 0,6 13 2,2 15,2 2,2 G 0,4 5,3 0,2 50 100 150 200 [mm] with slots for cover plates or PCBs ... H 100 150 200 1000 mm art. no. 8,3 5,2 126 80 6,5 4 I 96 101,5 115 136 20 2,5 4,7 K 4,5 1,2 2,2 1,0 14 13 7,2 4,2 Rth [K/W] 0,8 SK 108 ... please indicate: 15,2 8,5 0,6 8,3 5,2 L 0,4 101,5 110 50 100 150 200 [mm] with slots for cover plates or PCBs ... M 100 1000 mm Profiles for PCB components High capacity heatsinks Mounting for TO 3 angle Heatsinks for PCB A A A A 91 57 - 58 125 89 - 112 heatsinks for lock-in retaining spring Heatsink-cooling aggregates Special heatsink design Technical introduction A 85 - 88 D 14 A 137 - 138 A2-8 A 80 N A Standard extruded heatsinks art. no. Rth [K/W] 2,8 81 B 2,0 40 4 38 2,4 1,6 1,2 C 58 SK 111 ... please indicate: 50 ... ... 75 100 1000 mm 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 7 2,0 1,0 4,3 47,6 80 96 SK 172 ... please indicate: 200 [mm] 1,5 5,3 E 150 Rth [K/W] 2,5 12 20,5 41 D 2 76 5 art. no. 100 (optional) SSR 1; SSR 3 5,3 0,5 50 ... ... 50 75 100 150 1000 mm (optional) SSR 1; SSR 4 145 art. no. Rth [K/W] 2,5 F 1,5 8 5,3 8,4 75 2,0 G 7 1,0 SK 194 ... please indicate: 0,5 7 120 50 ... ... 75 1000 mm art. no. 200 Rth [K/W] 1,0 6,5 10,3 20 H (optional) SSR 2 8,5 5,3 8,3 77 0,8 17 I SK 435 ... please indicate: 0,6 0,4 0,2 215 50 ... 150 200 1000 mm K L M N A 81 High capacity heatsinks Heatsinks for DC/DC converter heatsinks for lock-in retaining spring Heatsink profile-overview A A A A 57 - 58 113 - 114 85 - 88 13 - 17 Extruded heatsinks Die-cast heatsinks High decorative surfaces Technical introduction A A A A 22 - 83 125 9 2-8 A Standard extruded heatsinks 76,2 4,4 1,85 O 4,4 B 3,2 2,4 1,6 C 0,8 4,4 7,3 47,6 87 5,1 SK 432 ... Rth [K/W] 4,0 7,3 7,3 4,4 2,2 21,5 16,65 41 5,1 1,8 art. no. 50 100 150 200 [mm] with slots for cover plates or PCBs please indicate: ... 100 1000 mm art. no. 108 1,2 9,6 6,5 12,5 63,5 19 27 6,5 6,5 6,5 D Rth [K/W] 1,4 12,5 1,0 E 0,8 0,6 46,8 127 SK 40 ... please indicate: 50 100 150 200 [mm] ... 100 1000 mm F Rth [K/W] 2,5 2 2,4 1,5 1,5 28 1,0 0,5 72,5 130 143 SK 61 ... G 2,0 91 8 80 103 91 6,4 art. no. 50 100 150 200 [mm] with slots for cover plates or PCBs; cooling case M 29 please indicate: H ... 75 100 150 1000 mm art. no. 175 13,5 8,5 12 I 108 8,5 13,5 48 Rth [K/W] 1,0 K 0,8 25 0,6 0,4 102 122 240 8,5 SK 144 ... please indicate: 13,5 0,2 50 100 150 200 [mm] ... L 1000 mm M High capacity heatsinks Heatsinks for DC/DC converter heatsinks for lock-in retaining spring Heatsink profile-overview A A A A 57 - 58 113 - 114 85 - 88 13 - 17 Extruded heatsinks Die-cast heatsinks High decorative surfaces Technical introduction A A A A 22 - 83 125 9 2-8 A 82 N A Standard extruded heatsinks art. no. Rth [K/W] M3 3,5 40 38 36 34 32 30 28 26 36,5 B C SK 494 ... please indicate: 6 50 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] ... 25 37.5 50 75 100 1000 mm art. no. Rth [K/W] 19 D 30 20 21,2 2,5 1,6 25 15 10 E 10,7 50 SK 153 ... please indicate: F ... 50 mm Rth [K/W] 5 art. no. 71 35 4 10 20 4 3 G 2 1 41 SK 55 ... please indicate: 50 ... ... 37.5 1000 mm art. no. 7 10 Rth [K/W] 3,5 69,8 39,9 4 7 7 22 H (optional) TO 3; CB I 3,0 2,5 2,0 12 6 1,5 9,5 SK 175 ... K please indicate: 80 50 100 200 [mm] 150 ... 50 1000 mm L M N A 83 High capacity heatsinks Heatsinks for DC/DC converter heatsinks for lock-in retaining spring Heatsink profile-overview A A A A 57 - 58 113 - 114 85 - 88 13 - 17 Extruded heatsinks Die-cast heatsinks High decorative surfaces Technical introduction A A A A 22 - 83 125 9 2-8 A Extruded heatsinks for lock-in retaining spring art. no. B 10 50 Rth [K/W] 30,5 25 8 6 4 C 2 2,5 SK 575 ... please indicate: M3 6 50 100 150 200 [mm] ... 25 37.5 50 75 84 100 1000 mm art. no. Rth 10,3 D 40 [K/W] 30 14,5 20 20 10 8 SK 512 ... please indicate: E 50 100 150 200 [mm] ... 25 50 100 1000 mm art. no. 14 Rth 10,3 [K/W] F 12 10 22,8 28 8 6 4 2 M3 8 SK 480 ... please indicate: 50 100 150 200 [mm] G ... 25 37.5 50 75 84 100 1000 mm 11 art. no. M3 [K/W] 50 8 please indicate: 6 4 21,7 31,8 SK 490 ... H 10 Rth I 2 50 M3 100 150 200 [mm] ... 37.5 50 75 84 100 1000 mm art. no. Rth 16,8 K 14 [K/W] 12 20 20 26 10 8 6 4 M3 SK 492 ... please indicate: 12 50 100 150 200 [mm] L ... 25 37.5 50 75 84 100 1000 mm please note: profile threads A 5 Mounting parts for heatsinks Insulating caps Mounting pads Lock-in retaining spring for transistors M E 49 - 50 E 51 E 46 A 119 - 121 Heatsinks for PCB Profiles for PCB components Heatsinks with threaded rail Technical introduction A A A A 89 91 93 2-8 A 84 N A Extruded heatsinks for lock-in retaining spring 29,4 art. no. B 10 Rth 45 [K/W] 6 27,4 12 8 4 2 C M3 8 SK 489 ... please indicate: 50 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] ... 25 37.5 50 75 84 100 1000 mm art. no. Rth [K/W] 8 7 6 30 25 19,9 3,5 D 5 4 6 3 2 E M3 SK 573 ... please indicate: 1 7 8 12 50 ... 25 37.5 50 75 84 100 1000 mm Rth [K/W] 8 7 6 art. no. 5 45 F 4 19,25 3 G 2 1 M3 SK 576 ... please indicate: 6 19 50 ... 25 37.5 50 75 84 100 1000 mm 30 art. no. Rth [K/W] 7 6 25,6 45 H SK 481 ... please indicate: 4 3 2 8 I 5 8 M3 17 1 50 ... 25 37.5 50 75 84 100 1000 mm K please note: profile threads A 5 L M N A 85 Mounting parts for heatsinks Insulating caps Mounting pads Lock-in retaining spring for transistors E 49 - 50 E 51 E 46 A 119 - 121 Heatsinks for PCB Profiles for PCB components Heatsinks with threaded rail Technical introduction A A A A 89 91 93 2-8 A Extruded heatsinks for lock-in retaining spring art. no. 30 B 52 Rth [K/W] 6 25,6 5 4 8 please indicate: 3,4 17 8 2 1 2 M3 SK 514 ... C 3 50 100 150 200 [mm] ... D 25 37.5 50 75 100 1000 mm art. no. Rth [K/W] 8 32,3 5 E 4 3,5 28 19,9 14 7 6 3 2 1 M3 7 8 SK 574 ... please indicate: 22 50 100 150 200 [mm] F ... 25 37.5 50 75 84 100 1000 mm art. no. 33 M3 G Rth [K/W] 66,5 7 6 5 31 4 3 H 8 2 SK 589 ... please indicate: 1 M3 12 9 50 100 150 200 [mm] ... 25 37.5 50 75 84 100 1000 mm 10,3 art. no. I Rth [K/W] 7 6 35 22,8 5 12,5 3 K 2 1 M3 SK 482 ... please indicate: 4 8 25 50 100 150 200 [mm] ... 25 37.5 50 75 84 100 1000 mm L please note: profile threads A 5 M Mounting parts for heatsinks Insulating caps Mounting pads Lock-in retaining spring for transistors E 49 - 50 E 51 E 46 A 119 - 121 Heatsinks for PCB Profiles for PCB components Heatsinks with threaded rail Technical introduction A A A A 89 91 93 2-8 A 86 N A Extruded heatsinks for lock-in retaining spring art. no. 47,8 36,75 Rth [K/W] 7 6 M3 B 21,2 4 33 21,2 5 3 2 4 1 C SK 495 ... please indicate: M3 35,6 43,1 50 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] ... 25 37.5 50 75 100 1000 mm art. no. 50,7 Rth [K/W] 7 6 3,5 26,1 26,1 33 D E SK 499 ... please indicate: 4 3 2 1 M3 35,6 46 5 50 ... 25 37.5 50 75 100 1000 mm art. no. Rth [K/W] 52,3 10 8 12,5 28 6 22,5 F 4 2 M3 SK 487 ... G please indicate: 42 8 50 ... 25 37.5 50 75 84 100 1000 mm art. no. Rth [K/W] 7 6 57 5 28 22,5 H 14 4 3 2 1 M3 SK 483 ... I please indicate: 47 8 50 ... 25 37.5 50 75 84 100 1000 mm 75,5 50 art. no. Rth [K/W] 7 6 60 K 5 26,4 4 L 3 2 1 50 57,5 SK 593 ... please indicate: 50 ... 25 37.5 50 75 84 100 1000 mm M N please note: profile threads A 5 A 87 Mounting parts for heatsinks Insulating caps Mounting pads Lock-in retaining spring for transistors E 49 - 50 E 51 E 46 A 119 - 121 Heatsinks for PCB Profiles for PCB components Heatsinks with threaded rail Technical introduction A A A A 89 91 93 2-8 A Extruded heatsinks for lock-in retaining spring art. no. B Rth [K/W] 7 6 50 65,8 75,5 50 5 C 29,5 4 3 2 1 50 57,5 SK 617 ... please indicate: 50 100 150 200 [mm] D ... 25 37.5 50 75 84 94 100 1000 mm please note: profile threads A 5 Screw-in solder pin ELS 3 - - - - - - - E screw in solder pin made of brass easy mounting secure hold surface coating suitable for soldering suitable for all heatsinks with M3 profile thread position in the threaded channel as required specific designs upon customers request F art. no. 12,5 G 0,8 4 1 7,5 M3 ELS 3 O6 0,8 O 2,3 H I K L M Mounting parts for heatsinks Insulating caps Mounting pads Lock-in retaining spring for transistors E 49 - 50 E 51 E 46 A 119 - 121 Heatsinks for PCB Profiles for PCB components Heatsinks with threaded rail Technical introduction A A A A 89 91 93 2-8 A 88 N A Extruded heatsinks for PCB mounting Heatsinks for printed circuit boards - matching cylindrial screws according to DIN 84 with zinc coated surface - M 3 thread diameter: 2.90 ... 2.94 mm (art. no.: SZ M 3 x 8) - screw-in solder pin M 3 (art. no.: ELS 3) art. no. C M3 4 33 6 5 4 3 M3 SK 68 ... 22 M3 31 Rth [K/W] M 2,5 D 36,75 M3 17 B 35,6 2 M3 46 50 100 150 200 [mm] 100 150 200 [mm] 46 art. no. 34 33 31 Rth [K/W] E 6 5 8 4 28 SK 112 ... F please indicate: 35,6 3 2 M3 50 ... 37.5 50 75 94 100 1000 mm please note: profile threads A 5 G H I K L M N A 89 Lock-in retaining spring for transistors Profiles for PCB components Vibration dampers Heatsinks with threaded rail A 119 - 121 Miniature distance sleeves A 91 Thermal conductive glue E 41 Thermal conductive paste A 93 Technical introduction E 34 E 23 - 24 E 21 - 22 A2-8 A Extruded heatsinks for PCB mounting Heatsinks for printed circuit boards - the heatsinks SK 414, SK 105, SK 44 and SK 415 are especially suitable for printed circuit board heatsinks for 19'' plug in units art. no. B Rth [K/W] 5 15 4 4 3 C 2 99 1 50 SK 414 ... please indicate: 100 150 200 [mm] ... D 100 233.4 1000 mm art. no. Rth [K/W] 5 10 4 4 E 3 2 159 1 50 SK 105 ... please indicate: 100 150 200 [mm] F ... 37.5 50 75 100 150 200 233.4 1000 mm art. no. Rth [K/W] 5 G 4 4 15 3 2 159 1 50 SK 44 ... please indicate: 100 150 200 [mm] H ... 50 75 100 150 200 233.4 1000 mm art. no. Rth [K/W] 5 I 15 4 4 3 2 219 1 50 SK 415 ... please indicate: 100 150 200 [mm] K ... 37.5 100 150 1000 mm L M Lock-in retaining spring for transistors Heatsink profile overview Heatsinks for PCB Heatsinks with threaded rail A A A A 119 - 121 13 - 17 89 93 Thermal conductive material Profiles for lock-in fixing spring Retaining springs for transistors Technical introduction E 2 - 23 A 84 - 88 A 115 - 117 A2-8 A 90 N A Extruded heatsinks for PCB mounting Heatsinks for printed circuit boards B - for use on eurocards Rth [K/W] 10 art. no. 8 6 4 C 2 50 SK 125 ... 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] Thermal conductive material Profiles for lock-in fixing spring Retaining springs for transistors Technical introduction E 2 - 23 A 84 - 88 A 115 - 117 A2-8 Rth [K/W] 10 14 10 art. no. 28 D 100 screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3 6 M3 E 47 4 SK 96 ... please indicate: 8 4 2 M3 55 50 screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3 ... 50 84 94 1000 mm F Rth [K/W] art. no. 10 8 6 4 G 2 SK 138 ... 50 art. no. Rth [K/W] 7,0 H 5,6 4,2 2,8 1,4 I 50 SK 451 ... screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3 art. no. Rth [K/W] 10 8 K 6 4 2 50 L SK 128 ... please indicate: screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3 ... 50 84 94 1000 mm M please note: profile pressed threads A 5 N A 91 Lock-in retaining spring for transistors Heatsink profile overview Heatsinks for PCB Heatsinks with threaded rail A A A A 119 - 121 13 - 17 89 93 A Extruded heatsinks for PCB mounting 30 art. no. 6,5 Rth [K/W] 10 B 6 4 14 8 23 M3 31 8 2 C M3 4 50 8 SK 609 ... 100 150 200 [mm] screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3 55 art. no. 6,5 Rth [K/W] 10 D 14 6 8 23 M3 31 8 4 2 M3 4 50 8 SK 610 ... 100 150 200 [mm] screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3 E 50 art. no. 6,5 Rth [K/W] 7,0 F 12,5 4,2 8 23 M3 31 5,6 2,8 1,4 M3 4 8 SK 611 ... please indicate: 50 100 150 200 [mm] screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3 G ... 50 84 94 1000 mm H I K L M please note: profile pressed threads A 5 Lock-in retaining spring for transistors Heatsink profile overview Heatsinks for PCB Heatsinks with threaded rail A A A A 119 - 121 13 - 17 89 93 Thermal conductive material Profiles for lock-in fixing spring Retaining springs for transistors Technical introduction E 2 - 23 A 84 - 88 A 115 - 117 A2-8 A 92 N A Extruded heatsinks for PCB mounting Heatsink for PCB with threaded rail transistor mounting onto the heatsink using a slide-in rail with M 3 thread easy positioning using a grid 6.35mm other rail grids upon request suitable for TO 220, TO 218, TO 247 and similar suitable screws M 3 (art. no.: SZ M 3 x 8) screw-in solder pin M 3 (art. no.: ELS 3) specific versions upon customers request 55 2 14 18 28 C - - - - - - - 6 B D 6,35 -1 M3 8 E M3 SK SK SK SK SK SK 517 517 517 517 517 517 47 art. no. [mm] Rth [K/W] 50 GS 75 GS 84 GS 50 75 84 50 75 84 50 75 84 version 5.0 3.9 3.6 5.0 3.9 3.6 TO 220 TO 220 TO 220 -- -- -- F with threaded rail with threaded rail with threaded rail without threaded rail without threaded rail without threaded rail 6 45 30 2 M3 6,35 -1 8 18 G 8 H I SK SK SK SK SK SK 518 518 518 518 518 518 art. no. [mm] Rth [K/W] 50 GS 75 GS 84 GS 50 75 84 50 75 84 50 75 84 4.3 3.3 3.0 4.3 3.3 3.0 M3 17 version TO 220 TO 220 TO 220 -- -- -- with threaded rail with threaded rail with threaded rail without threaded rail without threaded rail without threaded rail please note: profile threads A 5 surface: black anodised K L M N A 93 Profiles for lock-in fixing spring Assignment table Thermal conductive material Lock-in retaining spring for transistors A 84 - 88 A 18 - 20 E2-5 A 119 - 121 Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction E 19 E 16 E 21 A2-8 A Extruded heatsinks for PCB mounting Attachable heatsinks for transistors - - - - compact heatsink in transistor dimensions for horizontal and vertical transistors can be screwed or glued specific versions upon customers request B SK 515 23,5 S 2 x TO 220 10,7 O 2,8 C 15 8,4 3,1 3,1 3,1 SK 515 37 S 3 x TO 220 O 2,8 O 2,8 10 3,2 5 SK 515 10 S TO 220 art. no. SK 515 10 S TO 220 SK 515 23,5 S 2 x TO 220 SK 515 37 S 3 x TO 220 SK 515 10 TO 220 SK 515 23,5 TO 220 SK 515 37 TO 220 13,5 23,5 D version 30.0 27.5 26.1 30.0 27.5 26.1 TO 220 2xTO 220 3xTO 220 -- -- -- SK 516 15 S TO 218 10 13,5 37 [mm] Rth [K/W] 10.0 23.5 37.0 10.0 23.5 37.0 13,5 5 for screw fastening M2.5 for screw fastening M2.5 for screw fastening M2.5 without screw fastening without screw fastening without screw fastening SK 516 33 S 2 x TO 218 O 3,5 O 3,5 F 21 12,45 4,6 4,6 E art. no. SK 516 15 S TO 218 SK 516 33 S 2 x TO 218 SK 516 15 TO 218 7,5 15 3,5 18 33 [mm] Rth [K/W] 15 33 15 surface: G version 28.4 26.9 28.4 TO 218 2xTO 218 -- for screw fastening M3 for screw fastening M3 without screw fastening black anodised H Attachable extruded heatsinks for transistors with thin bottom plate (0.5 mm) SK 515 05 37 S 3 SK 515 05 23,5 S 2 10,7 O 2,8 O 2,8 3,1 3,1 3,1 O 2,8 15 8,4 I 10 3,95 SK 515 05 10 S art. no. SK SK SK SK SK SK 515 515 515 515 515 515 05 05 05 05 05 05 10 S 23,5 S 2 37 S 3 10 23,5 37 5 13,5 23,5 5 surface: 13,5 37 [mm] Rth [K/W] 10.0 23.5 37.0 10.0 23.5 37.0 13,5 version 30.0 27.5 26.1 30.0 27.5 26.1 TO 220 2xTO 220 3xTO 220 -- -- -- K for screw fastening M2.5 for screw fastening M2.5 for screw fastening M2.5 without screw fastening without screw fastening without screw fastening L black anodised M Profiles for lock-in fixing spring Assignment table Thermal conductive material Lock-in retaining spring for transistors A 84 - 88 A 18 - 20 E2-5 A 119 - 121 Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction E 19 E 16 E 21 A2-8 A 94 N A Extruded heatsinks for PCB mounting Attachable heatsinks for transistors B - - - - - extruded heatsink with intergrated spring locking function simple assembly by pushing the heatsink onto the transistor optimum heat transfer between component and heatsink solderable pin for PCB mounting specific versions upon customers request 19,4 30 25 32,5 28 C 4,8 4 O 2,1 O4 2,7 = = 5 4,5 1 D 15 2,3 25,4 3,3 13,5 art. no. E F SK SK SK SK SK SK 525 525 525 525 525 525 15 30 15 20 25 30 for transistor [mm] Rth [K/W] TO 220 TO 220 TO 220 TO 220 TO 220 TO 220 ST ST ST ST 15 30 15 20 25 30 13.3 7.8 13.3 10.7 9.0 7.8 22 spring force [N] version 54 100 54 70 85 100 without solder pins without solder pins with 1 solder pin with 1 solder pin with 2 solder pins with 2 solder pins 35 30 G H 4,5 4,8 1 4,5 O 2,1 O4 3,3 2,7 2,3 25,4 15 art. no. SK 526 30 ST surface: for transistor [mm] Rth [K/W] TO 247 30 6.3 spring force [N] version 100 with 2 solder pins black anodised I K L M N A 95 Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks A 84 - 88 A 18 - 20 E2-5 C 10 - 16 Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction E 19 E 16 E 21 A2-8 A Extruded heatsinks for PCB mounting Extruded heatsinks for transistors compact PCB heatsink effective heat dissipation for single and double row transistor mounting profile SK 454 A 24 profile SK 452 A 27 specific versions upon customers request M 3 bei TO 220 2xM3 M 3 bei SOT 32 16 3 19 1xM3 B 10 21,45 C 10 - - - - - 20 20 20 10 D art. no. [mm] Rth [K/W] SK 454 20 1 x M3 ... SK 454 60 3 x M3 ... SK 454 20 2 x M3 ... SK 454 40 4 x M3 ... SK 454 60 6 x M3 ... SK 454 40 2 x M3 TO 220 SK 454 80 4 x M3 TO 220 SK 454 100 5 x M3 TO220 SK 454 80 8 x M3 TO 220 SK 454 100 10xM3 TO220 please indicate: 20 60 20 40 60 40 80 100 80 100 10.8 7.7 10.8 9.4 7.7 9.4 6.5 5.9 6.5 5.9 SOT 32/ TO 220 SOT 32/ TO 220 SOT 32/ TO 220 SOT 32/ TO 220 SOT 32/ TO 220 TO 220 TO 220 TO 220 TO 220 TO 220 E F ... SOT 32; TO 220 G 19 29 art. no. SK SK SK SK SK SK SK SK SK SK 452 452 452 452 452 452 452 452 452 452 20 1 x M3 40 2 x M3 60 3 x M3 80 4 x M3 100 5 x M3 20 2 x M3 40 4 x M3 60 6 x M3 80 8 x M3 100 10 x M3 M3 2xM3 3,5 25 1xM3 10 20 20 20 10 H [mm] Rth [K/W] 20 40 60 80 100 20 40 60 80 100 surface: 11.1 7.5 5.9 4.9 4.3 11.1 7.5 5.9 4.9 4.3 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P I K L black anodised M Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks A 84 - 88 A 18 - 20 E2-5 C 10 - 16 Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction E 19 E 16 E 21 A2-8 A 96 N A Extruded heatsinks for PCB mounting B - for semiconductor clip-mounting - special lengths and transistor drillings upon request - P = raised retaining stud, E = mounting method 34,9 16 P 6,5 18,3 C 12,7 1,5 O 3,2 25,4 10,8 25,4 ... STC ... STIC O 2,3 max. E F art. no. SK SK SK SK 104 104 104 104 25,4 38,1 50,8 63,5 ... ... ... ... please indicate: ... STCB O7 M3 O6 O 2,3 max. [mm] Rth [K/W] 25.4 38.1 50.8 63.5 14 11 9 8 TO 220 TO 220 TO 220 TO 220 ... mounting method STC = with solder pin STIC = with solder pin and insulating washer STCB = with threaded bolt M 3, brass surface: G 6,5 1,5 D 6 max. 3 4,5 max. E black anodised - for semiconductor screw-mounting - special lengths and transistor drillings on request - E = mounting method O 3,2 25,4 10,8 25,4 ... STS K art. no. L SK SK SK SK 104 104 104 104 25,4 38,1 50,8 63,5 ... ... ... ... please indicate: M surface: N A 97 6,5 6,5 1,5 ... STIS O 2,3 max. 10,8 25,4 E 6 max. 3 4,5 max. I 6,5 25,4 18,3 13,5 12,7 1,5 H 25,4 18,3 13,5 O 3,2 34,9 16 ... STSB O6 O 2,3 max. O7 M3 [mm] Rth [K/W] 25.4 38.1 50.8 63.5 14 11 9 8 SOT 32/ TO 220/ TO 3 P SOT 32/ TO 220/ TO 3 P SOT 32/ TO 220/ TO 3 P SOT 32/ TO 220/ TO 3 P ... mounting method STS = with solder pin STIS = with solder pins and insulating washer STSB = with threaded bolt M 3, brass black anodised Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks A 84 - 88 A 18 - 20 E2-5 C 10 - 16 Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction E 19 E 16 E 21 A2-8 A Extruded heatsinks for PCB mounting - horizontal for semiconductor screw-mounting - special lengths and transistor drillings on request O 3,2 O 3,2 B 10,8 art. no. SK 104 25,4 LS SK 104 38,1 LS SK 104 50,8 LS C 9,5 25,4 18,3 13,5 25,4 25,4 18,3 13,5 9,5 12,7 1,5 34,9 15,9 10,8 [mm] Rth [K/W] 25.4 38.1 50.8 14 11 9 surface: SOT 32/ TO 220/ TO 3 P SOT 32/ TO 220/ TO 3 P SOT 32/ TO 220/ TO 3 P D black anodised E F G H I K L M Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks A 84 - 88 A 18 - 20 E2-5 C 10 - 16 Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction E 19 E 16 E 21 A2-8 A 98 N A Extruded heatsinks for PCB mounting B - for semiconductor clip-mounting - special lengths and transistor drillings on request - P = raised retaining stud, E = mounting method O 3,2 25,4 35 17 18,3 P 2,5 6,5 C 25,4 10,8 ... STC ... STCB ... STIC O 2,3 max. E F art. no. SK SK SK SK 600 600 600 600 25,4 38,1 50,8 63,5 ... ... ... ... please indicate: O7 M3 O6 O 2,3 max. [mm] Rth [K/W] 25.4 38.1 50.8 63.5 11.0 9.0 7.3 6.5 TO 218/ TO 220/ TO 247/ TO 3 P TO 218/ TO 220/ TO 247/ TO 3 P TO 218/ TO 220/ TO 247/ TO 3 P TO 218/ TO 220/ TO 247/ TO 3 P ... mounting method STC = with solder pin STIC = with solder pin and insulating washer STCB = with threaded bolt M 3, brass surface: G 6,5 1,5 D 6 max. 3 4,5 max. 25,4 E black anodised - for semiconductor screw-mounting - special lengths and transistor drillings on request - E = mounting method 35 O 3,2 O 3,2 2,5 K L 600 600 600 600 25,4 38,1 50,8 63,5 ... ... ... ... please indicate: M N surface: A 99 25,4 6 max. 3 4,5 max. O 2,3 max. SK SK SK SK 10,8 E ... STSB ... STIS ... STS art. no. 25,4 10,8 25,4 6,5 1,5 I 18,3 6,5 13,5 25,4 H 6,5 13,5 18,3 25,4 17 O7 M3 O6 O 2,3 max. [mm] Rth [K/W] 25.4 38.1 50.8 63.5 11.0 9.0 7.3 6.5 TO 218/ TO 220/ TO 247/ TO 3 P TO 218/ TO 220/ TO 247/ TO 3 P TO 218/ TO 220/ TO 247/ TO 3 P TO 218/ TO 220/ TO 247/ TO 3 P ... mounting method STS = with solder pin STIS = with solder pins and insulating washer STSB = with threaded bolt M 3, brass black anodised Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks A 84 - 88 A 18 - 20 E2-5 C 10 - 16 Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction E 19 E 16 E 21 A2-8 A Extruded heatsinks for PCB mounting - for semiconductor clip-mounting - special lengths and transistor drillings on request - P = raised retaining stud, E = mounting method B O2,8 9 6 C O 2,3 max. art. no. SK SK SK SK 409 409 409 409 25,4 38,1 50,8 63,5 ... ... ... ... please indicate: E 6,5 1,5 ... STIC 15 16,5 25,8 35,5 6 max. 3 ... STC 4,5 max. 12,7 3 18,3 45 26,2 14 P ... STCB D O7 M3 O6 O 2,3 max. [mm] Rth [K/W] 25.4 38.1 50.8 63.5 8.2 7.0 6.2 5.6 E TO 220/ TO 3 P TO 220/ TO 3 P TO 220/ TO 3 P TO 220/ TO 3 P ... mounting method STC = with solder pin STIC = with solder pin and insulating washer STCB = with threaded bolt M 3, brass surface: F black anodised - for semiconductor screw-mounting - special lengths and transistor drillings on request - E = mounting method G 3,2 SK SK SK SK 409 409 409 409 25,4 38,1 50,8 63,5 ... ... ... ... please indicate: 6 12,5 ... STSB E I 6,5 1,5 6 max. 3 ... STIS O 2,3 max. art. no. H 15 35,5 4,5 max. ... STS 18,3 12,7 3 25,4 45 26,2 O7 M3 O6 O 2,3 max. [mm] Rth [K/W] 25.4 38.1 50.8 63.5 8.2 7.0 6.2 5.6 K TO 220/ TO 3 P TO 220/ TO 3 P TO 220/ TO 3 P TO 220/ TO 3 P L ... mounting method STS = with solder pin STIS = with solder pins and insulating washer STSB = with threaded bolt M 3, brass surface: black anodised M Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks A 84 - 88 A 18 - 20 E2-5 C 10 - 16 Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction E 19 E 16 E 21 A2-8 A 100 N A Extruded heatsinks for PCB mounting B - for semiconductor clip-mounting - special lengths and transistor drillings on request - E = mounting method 20 O5 O5 11,7 10,5 3 C 0,72 12,22 8,5 30,8 25,33 11,7 3,1 20 30,3 50 ... STC ... STIC ... STCB O 2,3 max. E art. no. SK 459 25 ... SK 459 37,5 ... SK 459 50 ... please indicate: F O7 M3 O6 O 2,3 max. [mm] Rth [K/W] 25.0 37.5 50.0 7.9 6.3 5.6 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 ... mounting method STC = with solder pin STIC = with solder pin and insulating washer STCB = with threaded bolt M 3, brass surface: G E 6,5 1,5 D 6 max. 3 4,5 max. 30,3 black anodised - for semiconductor screw-mounting - special lengths and transistor drillings on request - E = mounting method 20 M3 11,7 21,2 3 H 0,72 12,22 8,5 30,8 25,33 11,7 3,1 30,3 50 ... STS ... STIS ... STSB O 2,3 max. K art. no. SK 459 25 ... SK 459 37,5 ... SK 459 50 ... please indicate: L surface: E 6,5 1,5 I 6 max. 3 4,5 max. 30,3 O7 M3 O6 O 2,3 max. [mm] Rth [K/W] 25.0 37.5 50.0 7.9 6.3 5.6 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 ... mounting method STS = with solder pin STIS = with solder pins and insulating washer STSB = with threaded bolt M 3, brass black anodised M N A 101 Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks A 84 - 88 A 18 - 20 E2-5 C 10 - 16 Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction E 19 E 16 E 21 A2-8 A Extruded heatsinks for PCB mounting - for semiconductor screw-mounting - special lengths and transistor drillings on request - E = mounting method B 30,8 25,33 18 3 0,72 12,22 8,5 20 M3 11,7 11,7 3,1 30,3 50 ... STS ... STIS 25.0 37.5 50.0 7.9 6.3 5.6 E SIP-Multiwatt SIP-Multiwatt SIP-Multiwatt ... mounting method STS = with solder pin STIS = with solder pins and insulating washer STSB = with threaded bolt M 3, brass surface: - - - - O7 M3 O6 O 2,3 max. [mm] Rth [K/W] SK 459 25 M ... SK 459 37,5 M ... SK 459 50 M ... please indicate: D ... STSB O 2,3 max. art. no. E 6,5 1,5 6 max. 3 4,5 max. 30,3 C F black anodised for semiconductor screw-mounting with combination-hole pattern for mounting of 2 x TO 220 or 2 x SOT 32 special lengths and transistor drillings on request E = mounting method G 30,8 25,33 M3 11,7 18 3 0,72 12,22 8,5 20 M3 11,7 3,1 18,9 30,3 50 O7 M3 O6 O 2,3 max. [mm] Rth [K/W] SK 459 25 2 x TO 220 ... SK 459 37,5 2 x TO 220... SK 459 50 2 x TO 220 ... please indicate: I ... STSB ... STIS O 2,3 max. art. no. E 6,5 1,5 6 max. 3 4,5 max. 30,3 ... STS 25.0 37.5 50.0 7.9 6.3 5.6 K 2xSOT 32/ 2xTO 220 2xSOT 32/ 2xTO 220 2xSOT 32/ 2xTO 220 ... mounting method STS = with solder pin STIS = with solder pins and insulating washer STSB = with threaded bolt M 3, brass surface: H L black anodised M Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks A 84 - 88 A 18 - 20 E2-5 C 10 - 16 Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction E 19 E 16 E 21 A2-8 A 102 N A Extruded heatsinks for PCB mounting B - for semiconductor clip-mounting - special lengths and transistor drillings on request - P = raised retaining stud, E = mounting method 42 17 O 2,8 D SK SK SK SK 129 129 129 129 25,4 38,1 50,8 63,5 ... ... ... ... please indicate: F [mm] Rth [K/W] 25.4 38.1 50.8 63.5 7.8 6.5 5.3 4.5 TO 220 TO 220 TO 220 TO 220 ... mounting method STC = with solder pin STIC = with solder pin and insulating washer STCB = with threaded bolt M 3, brass surface: G black anodised - for semiconductor screw-mounting - special lengths and transistor drillings on request - E = mounting method 42 17 O 3,2 25 13,5 18,3 25,4 1,8 O 3,2 H O 2,3 max. SK SK SK SK 129 129 129 129 25,4 38,1 50,8 63,5 ... ... ... ... please indicate: L surface: E 6,5 1,5 ... STIS I art. no. 25,4 6 max. 3 4,5 max. O 2,3 max. 25,4 ... STS K O7 M3 O6 O 2,3 max. 13,5 18,3 25,4 E ... STCB O 2,3 max. art. no. E 6,5 1,5 ... STIC 10 25,4 6 max. 3 ... STC 4,5 max. C 19,5 8 4 25 1,8 P ... STSB O7 M3 O6 O 2,3 max. [mm] Rth [K/W] 25.4 38.1 50.8 63.5 7.8 6.5 5.3 4.5 SOT 32/ TO 220/ TO 3 P SOT 32/ TO 220/ TO 3 P SOT 32/ TO 220/ TO 3 P SOT 32/ TO 220/ TO 3 P ... mounting method STS = with solder pin STIS = with solder pins and insulating washer STSB = with threaded bolt M 3, brass black anodised M N A 103 Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks A 84 - 88 A 18 - 20 E2-5 C 10 - 16 Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction E 19 E 16 E 21 A2-8 A Extruded heatsinks for PCB mounting for semiconductor clip-mounting profile SK 185 A 73 special lengths and drillings on request L = solderable pins B 10,25 - - - - C 4 O5 21,5 O 3,1 max. 34,4 art. no. SK SK SK SK 185 185 185 185 25 STC TO 220 37,5 STC TO 220 50 STC TO 220 50 C TO 220 [mm] Rth [K/W] 25.0 37.5 50.0 50.0 7.9 6.4 4.9 4.9 surface: - - - - D version TO 220 TO 220 TO 220 TO 220 with solder pins with solder pins with solder pins without solder pins E black anodised for semiconductor screw-mounting profile SK 185 A 73 special lengths and drillings on request L = solderable pins F 3,2 34,4 65 art. no. SK SK SK SK SK SK 185 185 185 185 185 185 25 STS TO 220 37,5 STS TO 220 50 STS TO 220 25 TO 220 37,5 TO 220 50 TO 220 G 4 4,5 18,3 4 2,7 2 18 30 3,1 max. 34,4 L [mm] Rth [K/W] 25.0 37.5 50.0 25.0 37.5 50.0 surface: version 7.9 6.4 4.9 7.9 6.4 4.9 TO 220 TO 220 TO 220 TO 220 TO 220 TO 220 with solder pins with solder pins with solder pins without solder pins without solder pins without solder pins H I black anodised K L M Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks A 84 - 88 A 18 - 20 E2-5 C 10 - 16 Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction E 19 E 16 E 21 A2-8 A 104 N A Extruded heatsinks for PCB mounting for semiconductor screw-mounting hole pattern is centered to the total length of the heatsink special lengths and drillings on request *1 = versions with solder pins; *2 = versions without solder pins L = solderable pins *1 15 18,3 13 5 5 14,75 14 3 = C O 3,2 *2 O 3,2 4 max. B - - - - - = 17,78 32 O 1,3 D 75 75 75 75 75 75 75 75 75 75 75 25 STS TO 220 37,5 STS TO 220 50 STS TO 220 25 25 TO 220 37,5 37,5 TO 220 50 50 TO 220 75 1000 25.0 37.5 50.0 25.0 25.0 37.5 37.5 50.0 50.0 75.0 1000.0 version 12.5 10.0 8.5 12.5 12.5 10.0 10.0 8.5 8.5 7.0 -- TO 220/*1 TO 220/*1 TO 220/*1 -- TO 220/*2 -- TO 220/*2 -- TO 220/*2 -- -- *1 15 O 3,2 *2 O 3,2 14,75 13 5 7 20 4 = G with solder pins with solder pins with solder pins without solder pins without solder pins without solder pins without solder pins without solder pins without solder pins without solder pins without solder pins 18,3 F SK SK SK SK SK SK SK SK SK SK SK [mm] Rth [K/W] 4 max. E art. no. L = 17,78 32 O 1,3 H art. no. I K L SK SK SK SK SK SK SK SK SK SK SK 76 76 76 76 76 76 76 76 76 76 76 25 STS TO 220 37,5 STS TO 220 50 STS TO 220 25 25 TO 220 37,5 37,5 TO 220 50 50 TO 220 75 1000 surface: [mm] Rth [K/W] 25.0 37.5 50.0 25.0 25.0 37.5 37.5 50.0 50.0 75.0 1000.0 L version 10.0 8.0 7.0 10.0 10.0 8.0 8.0 7.0 7.0 5.9 -- TO 220/*1 TO 220/*1 TO 220/*1 -- TO 220/*2 -- TO 220/*2 -- TO 220/*2 -- -- with solder pins with solder pins with solder pins without solder pins without solder pins without solder pins without solder pins without solder pins without solder pins without solder pins without solder pins black anodised M N A 105 Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks A 84 - 88 A 18 - 20 E2-5 C 10 - 16 Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction E 19 E 16 E 21 A2-8 A Extruded heatsinks for PCB mounting - - - - for semiconductor clip-mounting profile SK 145 A 73 special lengths and drillings on request L = solderable pins B 20,5 O 4,5 4,5 15 C O 2,8 max. 25,4 art. no. [mm] Rth [K/W] SK 145 25 STC 25 13.5 SK 145 30 STC 30 12.4 SK 145 50 STC 50 10.0 surface: - - - - L version TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 D with solder pins with solder pins E with solder pins black anodised for semiconductor screw-mounting profile SK 145 A 73 special lengths and drillings on request L = solderable pins F O 3,2 15,5 3 12 18,3 G 4,5 25,4 29 O 2,8 max. 25,4 L art. no. [mm] Rth [K/W] SK 145 25 STS TO 220 25.0 13.5 SK 145 37,5 STS TO 220 37.5 12.0 SK 145 50 STS TO 220 50.0 10.0 surface: version TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 H with solder pins with solder pins I with solder pins black anodised K L M Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks A 84 - 88 A 18 - 20 E2-5 C 10 - 16 Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction E 19 E 16 E 21 A2-8 A 106 N A Extruded heatsinks for PCB mounting B - special lengths and drillings on request - L = solderable pins SK 126 25 TO 220 SK 126 37,5 TO 220 SK 126 25 STS TO 220 SK 126 37,5 STS TO 220 SK 126 25 2 x M 3 SK 126 37,5 2 x M 3 8 M3 6,35 3 6,35 12,7 C 34,5 D M3 4,5 max. art. no. G H 18,3 8 18,3 18,3 E F M3 M3 [mm] Rth [K/W] SK 126 25 STS TO 220 25.0 8.0 SK 126 37,5 STS TO 220 37.5 6.5 SK 126 25 TO 220 25.0 8.0 SK 126 25 2 x M3 25.0 8.0 SK 126 37,5 TO 220 37.5 6.5 SK 126 37,5 2 x M3 37.5 6.5 25.0 37.5 1000.0 8.0 6.5 -- SK 126 25 SK 126 37,5 SK 126 1000 surface: M3 O 2,3 L version TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 -- -- -- with solder pin and thread M3 with solder pin and thread M3 ohne Lotstift, mit M3-Gewinde ohne Lotstift, mit M3-Gewinde ohne Lotstift, mit M3-Gewinde ohne Lotstift, mit M3-Gewinde -- -- -- black anodised I K L M N A 107 Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks A 84 - 88 A 18 - 20 E2-5 C 10 - 16 Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction E 19 E 16 E 21 A2-8 A Extruded heatsinks for PCB mounting - special lengths and drillings on request - L = solderable pins B M3 L 25 13,5 18,3 O 1,3 SK 95 25 STS TO 220 SK 95 25 STS SOT 32 D [mm] Rth [K/W] 38.5 36.0 36.0 SOT 32 SOT 32 TO 220 SK 95 25 1 x M2,5 1 x M3 E 2,6 4,4 M2,5 2,6 1,1 1,3 15 25 25 6,5 art. no. L O 1,3 SK 95 15 STS SOT 32 S SK 95 15 STS SOT 32 S SK 95 25 STS SOT 32 SK 95 25 STS TO 220 L O 1,3 C 3,5 max. 6,3 10,6 12,6 3,5 max. 11 M3 3,5 max. 6,5 1,3 3,9 4,4 15 1,1 25 M3 10,6 12,6 M3 M3 M3 SK 95 15 SOT 32 S art. no. SK SK SK SK SK SK SK SK 95 95 95 95 95 95 95 95 15 SOT 32 S 25 SOT 32 25 TO 220 25 1x M2,5 1x M3 25 2 x M3 15 25 1000 SK 95 25 SOT 32 25 M3 SK 95 25 TO 220 SK 95 25 2 x M3 G [mm] Rth [K/W] 15 25 25 25 25 15 25 1000 F 7 18,3 18,3 18,3 25 M3 13,5 M3 11 15 M3 25 25 M3 38.5 36.0 36.0 36.0 36.0 38.5 36.0 -- SOT 32 SOT 32 TO 220 1xM2.5/ 1xM3 (TO 220) 2xM3 (TO 220) -- -- -- surface: black anodised type of thread: not anodised H I K L M Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks A 84 - 88 A 18 - 20 E2-5 C 10 - 16 Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction E 19 E 16 E 21 A2-8 A 108 N A Extruded heatsinks for PCB mounting SK SK SK SK 437 437 437 437 art. no. [mm] Rth [K/W] 25 30 35 50 25 30 35 50 STC STC STC STC 24 22 18 14 M3 4,5 max. 5 20 16 E 16 F G L O 2,55 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 3,5 D 4,5 max. C 14,5 single solder pin profile SK 437 A 24 special lengths and drillings on request L = solderable pin 10,5 B - - - - SK SK SK SK 437 437 437 437 art. no. [mm] Rth [K/W] 25 30 35 50 25 30 35 50 STS STS STS STS surface: - - - - 24 22 18 14 L O 2,55 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 black anodised double solder pin profile SK 437 A 24 special lengths and drillings on request L = solderable pin 10,5 4,5 max. [mm] Rth [K/W] SK 437 25 STC 2 SK 437 30 STC 2 SK 437 35 STC 2 25 30 35 24 22 18 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 M N M3 4,5 max. 3,5 K 10 16 L art. no. A 109 L O 1,45 L [mm] Rth [K/W] SK 437 25 STS 2 SK 437 30 STS 2 SK 437 35 STS 2 surface: L L O 1,45 20 art. no. 16 I 14,5 H 25 30 35 24 22 18 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 TO 218/ TO 220/ TO 247/ TO 248 black anodised Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks A 84 - 88 A 18 - 20 E2-5 C 10 - 16 Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction E 19 E 16 E 21 A2-8 A Extruded heatsinks for PCB mounting - special versions on customers request - L = solderable pin B 8 18 2,5 1,25 M3 C 3,5 max. 5,9 11,8 L O 1,3 SK SK SK SK 470 470 470 470 art. no. [mm] Rth [K/W] 25 30 35 50 25 30 35 50 STS STS STS STS 29.0 27.2 25.6 23.2 SOT 32/ TO 220 SOT 32/ TO 220 SOT 32/ TO 220 SOT 32/ TO 220 D E 18 3,5 max. 3,5 1,75 15,24 M3 6,75 13,5 SK SK SK SK 469 469 469 469 art. no. [mm] Rth [K/W] 25 30 35 50 25 30 35 50 STS STS STS STS 15.3 14.3 13.0 10.6 surface: - - - - - F L O 1,3 SOT 32/ TO 220 SOT 32/ TO 220 SOT 32/ TO 220 SOT 32/ TO 220 G black anodised as mounting- and connecting piece for clamp mounting of the transistors triple unit can be seperated solder pin mounting possible special versions on customers request H 20,4 20,4 I 20,4 5,2 11,5 O 2,6 20 15 20 15 20 2 K 94 art. no. SK SK SK SK 484 484 484 484 25 37,5 50 75 [mm] Rth [K/W] 25.0 37.5 50.0 75.0 6.0 4.5 3.7 2.8 TO 218/ TO 220/ TO 247/ TO 264/ TO 3 P TO 218/ TO 220/ TO 247/ TO 264/ TO 3 P TO 218/ TO 220/ TO 247/ TO 264/ TO 3 P TO 218/ TO 220/ TO 247/ TO 264/ TO 3 P L M Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks A 84 - 88 A 18 - 20 E2-5 C 10 - 16 Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction E 19 E 16 E 21 A2-8 A 110 N A Extruded heatsinks for PCB mounting compact PCB heatsinks especially suitable for vertical PCB mounting in housings, racks etc. easy solder fixing special versions on customers request L = solderable pin 17,8 M3 O 2,3 max 10 20 M3 M3 O 2,3 max [mm] Rth [K/W] SOT 32/ TO 220 SOT 32/ TO 220 SOT 32/ TO 220 SK 448 40 2 x M 3 L 10 27,95 20 10 10 M3 20 M3 20 10 M3 M3 O 2,3 max 12,5 O 2,3 max 5,6 5,6 L 6,25 O 2,3 max [mm] Rth [K/W] 11.8 9.8 7.1 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P SK 400 20 1 x M 3 L SK 400 40 2 x M 3 L 10 20 M3 10 20 M3 20 M3 10 M3 O 2,3 max O 2,3 max 4 O 2,3 max 10 [mm] Rth [K/W] SK 400 20 1 x M3 L SK 400 40 2 x M3 L SK 400 60 3 x M3 L 20 40 60 11.6 8.2 7.2 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P SK 456 20 1 x M 3 L SK 456 40 2 x M 3 L 10 20 M3 SK 456 60 3 x M 3 L 10 M3 10 20 M3 20 M3 10 M3 5 L M3 20,3 40 K 20 20,3 art. no. SK 400 60 3 x M 3 L 10 L 5 4 H M3 22,5 33 M3 20 22,5 20 40 60 22,5 SK 448 20 1 x M3 L SK 448 40 2 x M3 L SK 448 60 3 x M3 L 4 art. no. M3 20,6 M3 20 SK 448 60 3 x M 3 L 20,6 10.1 8.8 7.5 20,6 20 40 60 5,6 SK 454 20 1 x M3 L SK 454 40 2 x M3 L SK 454 60 3 x M3 L E I 20 3,9 3,9 O 2,3 max SK 448 20 1 x M 3 L G M3 M3 10 10 L 19 F 20 17,8 21,45 M3 9,5 art. no. 10 SK 454 60 3 x M 3 L 3,9 20 C D SK 454 40 2 x M 3 L 17,8 SK 454 20 1 x M 3 L 20,3 B - - - - - L art. no. O 2,3 max O 2,3 max O 2,3 max 5 6 5 3,4 [mm] Rth [K/W] SK 456 20 1 x M3 L SK 456 40 2 x M3 L SK 456 60 3 x M3 L 20 40 60 13.0 10.5 8.5 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P M N A 111 Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks A 84 - 88 A 18 - 20 E2-5 C 10 - 16 Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction E 19 E 16 E 21 A2-8 A Extruded heatsinks for PCB mounting - for semiconductor clip-mounting - special lengths and transistor drillings on request - E = mounting method 18,16 14,54 7,1 4 5,1 20 B C 34 2,25 18,16 6,5 1,5 6 max. 3 4,5 max. E D O 2,3 max. ... STC art. no. SK 460 25 ... SK 460 37,5 ... SK 460 50 ... please indicate: O7 M3 O6 O 2,3 max. ... STIC ... STCB [mm] Rth [K/W] 25.0 37.5 50.0 9.0 7.9 7.0 E SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 248 SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 248 SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 248 ... mounting method STC = with solder pin STIC = with solder pin and insulating washer STCB = with threaded bolt M 3, brass surface: F black anodised - for semiconductor screw-mounting - special lengths and transistor drillings on request - E = mounting method G 21,2 4 5,1 20 M3 18,16 6 max. 3 4,5 max. 34 18,16 H E I O 2,3 max. O6 O 2,3 max. STS art. no. SK 460 25 STS SK 460 37,5 STS SK 460 50 STIS STIS [mm] Rth [K/W] 25.0 37.5 50.0 9.0 7.9 7.0 surface: K SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 248 SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 248 SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 248 black anodised L M Profiles for lock-in fixing spring Assignment table Thermal conductive material Attachable heatsinks A 84 - 88 A 18 - 20 E2-5 C 10 - 16 Mica wafers Kapton insulator washers Thermal conductive paste Technical introduction E 19 E 16 E 21 A2-8 A 112 N A Extruded heatsinks for DC/DC converter - special versions on customers request art. no. 7 Rth [K/W] 3,3 8,0 3,5 16,51 B 32,3 6,0 4,0 38,1 C 2,0 0 SK DC 10 60 SA 13,5 16,5 art. no. 16,5 7 D 0 13,5 1 2 3 4 5 6 V [m/s] 1 2 3 4 5 6 V [m/s] 1 2 3 4 5 6 V [m/s] 1 2 3 4 5 6 V [m/s] 1 2 3 4 5 6 V [m/s] Rth [K/W] 3,3 1,8 8,0 32,3 6 6,0 40 4,0 2,0 E 0 16,5 13,5 SK DC 8 60 SA art. no. 16,5 0 13,5 Rth [K/W] 3,3 7 1,8 8,0 6,0 32,3 6 F 40 4,0 2,0 G 0 16,5 13,5 SK DC 8 1 60 SA art. no. 16,5 0 13,5 Rth [K/W] 3,8 4,0 3,0 53,3 10 H 2 61 2,0 1,0 0 I 45,7 12,8 SK DC 4 1 117 SA art. no. 0 12,8 45,7 Rth [K/W] 3,8 53,3 K 4,0 20 3,5 5,0 62,5 3,0 2,0 1,0 0 13,5 16,5 16,5 13,5 SK DC 6 1 60 SA L surface: 0 black anodised M N A 113 Heatsink profile-overview Drilling pattern for Solid State Relais Heatsinks for Solid State Relais Special profiles A A A A 13 - 17 12 11 - 12 140 Standard aluminium profiles Extruded heatsinks Profiles for PCB mounting Technical introduction A A A A 135 - 136 22 - 83 89 - 112 2-8 A Extruded heatsinks for DC/DC converter - special versions on customers request art. no. B Rth [K/W] 3,8 3,5 20 4,0 53,3 3,0 62,5 2,0 C 1,0 0 12,8 45,7 45,7 0 12,8 1 2 3 4 5 6 V [m/s] SK DC 7 117 SA art. no. D R th [K/W] 3,8 3,5 20 4,0 53,3 3,0 62,5 2,0 E 1,0 0 12,8 SK DC 7 1 117 SA 45,7 0 12,8 45,7 art. no. 1 2 3 4 5 6 V [m/s] Rth [K/W] F 6,0 O 3,2 4,0 30,5 8 3 5,0 50,8 3,0 2,0 G 1,0 0 66 76,2 SK DC 2 1 76 SA 0 art. no. 1 2 3 4 5 6 V [m/s] H 4,0 O 3,2 3,0 50,8 3,5 20 Rth [K/W] 62,5 2,0 1,0 SK DC 5 59 SA I 0 48,3 59 0 art. no. 1 2 3 4 5 6 V [m/s] O 3,2 K 3,0 50,8 3,5 20 Rth [K/W] 4,0 62,5 2,0 1,0 0 48,3 SK DC 5 1 59 SA 0 1 2 59 surface: 3 4 5 6 V [m/s] L black anodised M Heatsink profile-overview Drilling pattern for Solid State Relais Heatsinks for Solid State Relais Special profiles A A A A 13 - 17 12 11 - 12 140 Standard aluminium profiles Extruded heatsinks Profiles for PCB mounting Technical introduction A A A A 135 - 136 22 - 83 89 - 112 2-8 A 114 N A 4 THF 129 TO 220 4 13,2 7,8 SK 409 1.5-3.0 stainless steel 5 4,6 16,5 2-3 stainless steel 5 SK 409 16,5 THF 409 220 2 K THF 249 4,5 5,5 14,1 9 stainless steel 5,5 6,9 16,1 4,3 stainless steel 3,9 4,5 3,5 3 SK 409/ SK 459 2-3 16,5 1,5 1,8 16,9 3,6 stainless steel O5 21,6 SK 145/ SK 185/ SK 437 4 20 3 stainless steel O5 21,5 18 3 FK 249 1.0-1.5 spring steel, corrosion protected 16,4 3 SK 600 2.5 spring steel, corrosion protected 15 3,7 14,4 TO 218/ TO 220/ TO 247/ TO 3 P 3,5 17,4 12 THF 600 29,5 3,5 5 8,8 1.0-1.5 7,54 37,1 M N A 115 3,5 32,9 31,3 UK 35 29,5 3,2 I 4 3,5 5 30,4 11 THF 409 220 1 SK 460 2,2 stainless steel 9,2 H TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P TO 220 2 12,3 THF 220 17 SK 484 15,5 11,3 G TO 220/ TO 247/ TO 248/ TO 3 P 11,5 1,5 3,1 12,1 6,3 THF 247 3,9 spring steel, corrosion protected 7,15 1-2 4,6 FK 219/ FK 222 3 4,5 TO 220 4,25 4,25 4,6 THF 220 4,25 4,25 3 18 18,2 THF 247 4 L 4 31,3 38,5 2,45 F 3,1 4,6 E 4 stainless steel 4,5 THF 409 SOT 32 1-2 13,3 9,2 D SK 104 11,4 7,2 THF 409 TO 220 TO 220/ TO 247/ TO 248/ TO 3 P TO 220/ TO 247/ TO 248/ TO 3 P TO 126/ SOT 32/ SOT 82 7,5 C THF 104 10 4 B for transistor- suitable for plate thickmaterial housing heatsinks ness [mm] TO 220 FK 219/ 1-2 spring steel, FK 222/ corrosion protecSK 129 ted 6,6 art. no. 13,8 11,3 Retaining springs for transistors Mica wafers Kapton insulator washers Heatsinks for PCB Profiles for lock-in fixing spring E 19 E 16 A 89 - 112 A 84 - 88 Thermal conductive material Insulating caps Thermal conductive paste Technical introduction E2-5 E 51 E 21 A2-8 3 A Retaining springs for transistors universal retaining spring for transistor housings types TO 218, TO 220, TO 247, TO 264, SOT 32 and various SIP Multiwatt etc. utility patent 200 14 739.0 fast and easy mounting of the transistors number of retaining spring elements can be chosen (n = max. 10) THFMG with thread M 4 specific versions and modifications on customers request material stainless steel 10,4 D 15 60 5 stainless steel 11 14 10,4 3,25 11 14 for transistor- spring housing force [N] TO 220 79 stainless steel 6,5 stainless steel 12 0,6 16,5 22,5 29,7 4,2 H 18 119 5,9 TO 218/ TO 247 F G 4,2 3,4 THFK 247 3,5 material 5,1 THFK 220 E ... number of retaining-spring elements 1 - 10 0,6 art. no. 6,5 n (max. 172,5 mm) 25 17,5 M4 7,5 15 please indicate: 3,5 8 TO 218/ TO 220/ TO 247/ TO 264/ SOT 32/ SIP Multiwatt 30 THFMG ... C n (max. 172,5 mm) 25 17,5 n x O 3,2 7,5 3,25 THFM ... for transistor- spring housing force [N] TO 218/ 60 5 TO 220/ TO 247/ TO 264/ SOT 32/ SIP Multiwatt B 8 art. no. 30 - - - - - - 3,4 15,5 23,5 30,55 I K L M Mica wafers Kapton insulator washers Heatsinks for PCB Profiles for lock-in fixing spring E 19 E 16 A 89 - 112 A 84 - 88 Thermal conductive material Insulating caps Thermal conductive paste Technical introduction E2-5 E 51 E 21 A2-8 A 116 N A Retaining springs for transistors able to slide on the transistor and mounting plate easy mounting high pressure force and firm grip specific versions upon customers request art. no. C THFA 1 for transistor- plate thick- holdhousing ness [mm] ing force [N] TO 220 2 20 material stainless steel 10,2 10,7 22,1 B - - - - 0,6 D 2,5 7,9 THFA 2 TO 220 6.5 20 spring steel, corrosion protected 10 13,2 0,5 26,5 E F 6,3 13,1 THFA 3 TO 220 5.5 33 G spring steel, corrosion protected 10 12,2 17,7 0,6 4 8,5 H THFA 4 TO 218/ TO 247 6.5 59 spring steel, corrosion protected 0,5 26,5 I 15 13,2 6,3 13,1 K L M N A 117 Mica wafers Lock-in retaining spring for transistors Heatsinks for PCB Mounting material for semiconduct. E 19 A 119 - 121 A 89 - 91 E 44 - 48 Thermal conductive material Mounting parts for heatsinks Thermal conductive paste Technical introduction E2-5 E 49 - 50 E 21 - 22 A2-8 A Retaining springs for transistors - universal lock-in retaining spring for types TO 218, TO 220, TO 247, TO 264 and various SIP-Multiwatt etc. transistor housings - clip fastening also for power transistors without holes, MAX types etc. - easy assembly and secure hold when using a special groove geometry in heatsinks, housing parts etc. - optimal heat transfer between component and cooling element - various spring clip shapes available for fastening the components (see sketch) - the range of suitable heat sinks is continuously extended - versions specifically designed to meet customers requirements on request B C Installation THFU 1 D A - insert the lock-in retaining spring for transistors THFU 1 (A) into the groove of the profile - push transistor (B) below the springinu E B F THFU 2, THFU 3, THFU 4, THFU 5, THFU 6, THFU 7 G A - place transistor (B) onto the mounting area - press the lock-in retaining spring for transistors THFU 2 - 7 (A) into the groove of the profile (a suitable installation aid will facilitate pressing in) H B I K - Once in place, the spring will keep its position and fix the transistor with a high contact pressure on the installation surface (the spring remains in its position and it can neither be moved in a lengthwise direction nor fall it can out of the groove in a cross direction). material: stainless steel material thickness: 0.8 mm Mica wafers Lock-in retaining spring for transistors Heatsinks for PCB Mounting material for semiconduct. E 19 A 119 - 121 A 89 - 91 E 44 - 48 L M Thermal conductive material Mounting parts for heatsinks Thermal conductive paste Technical introduction E2-5 E 49 - 50 E 21 - 22 A2-8 A 118 N A Lock-in retaining spring for transistors THFU 1 C D E F THFU 2 G H I K 10,3 17,2 14 B for transistor- suitable for spring materihousing heatsinks force [N] al 5 TO 218/ SK 480/ stain60 TO 220/ SK 481/ less TO 247/ SK 482/ steel TO 262/ SK 483/ TO 3 P/ SK 487/ SOT 199/ SK 489/ SOT 429 SK 490/ SK 492/ SK 495/ SK 499/ SK 512/ SK 514/ SK 573/ SK 574/ SK 575/ SK 576/ SK 589/ SK 593/ SK 617/ LAM 3 K/ LAM 4 K/ LAM 5 K/ LA 27 K TO 218/ SK 480/ stain60 5 TO 220/ SK 481/ less TO 247/ SK 482/ steel TO 262/ SK 483/ TO 3 P/ SK 487/ SOT 199/ SK 489/ SOT 429 SK 490/ SK 492/ SK 495/ SK 499/ SK 512/ SK 514/ SK 573/ SK 574/ SK 575/ SK 576/ SK 589/ SK 593/ SK 617/ LAM 3 K/ LAM 4 K/ LAM 5 K/ LA 27 K 0,8 2,9 10 10,5 17,7 14,4 art. no. 0,8 2,5 10 L M N A 119 Heatsinks for PCB Heatsink profile-overview Assignment table Profiles for lock-in fixing spring A A A A 89 13 18 84 - - - - 93 17 20 88 Mounting parts for heatsinks Profiles for PCB mounting Thermal conductive material Technical introduction E 49 - 50 A 89 - 112 E 2 - 24 A2-8 A Lock-in retaining spring for transistors THFU 4 THFU 5 B C 20,5 17 10,4 D 0,8 2,8 10 E F G 10,4 23,6 19,7 THFU 3 for transistor- suitable for spring materihousing heatsinks force [N] al 5 TO 218/ SK 480/ stain50 TO 220/ SK 481/ less TO 247/ SK 482/ steel TO 262/ SK 483/ TO 3 P/ SK 487/ SOT 199/ SK 489/ SOT 429 SK 490/ SK 492/ SK 495/ SK 499/ SK 514/ SK 573/ SK 574/ SK 575/ SK 576/ SK 589/ SK 593/ SK 617/ LAM 3 K/ LAM 4 K/ LAM 5 K/ LA 27 K TO 218/ SK 480/ stain32 5 TO 202/ SK 481/ less TO 220/ SK 482/ steel TO 248/ SK 483/ TO 262/ SK 487/ TO 264/ SK 489/ TO 3 P/ SK 490/ SOT 199 SK 495/ SK 499/ SK 514/ SK 575/ SK 589/ SK 593/ SK 617/ LAM 5 K/ LA 27 K TO 218/ SK 490/ stain25 5 TO 202/ SK 589/ less TO 220/ SK 617/ steel TO 247/ LAM 5 K/ TO 248/ LA 27 K TO 262/ TO 264/ TO 3 P/ SOT 199/ SOT 429 0,8 1 10 H I 10,4 27,8 23,7 art. no. K 0,8 1,4 10 L M Heatsinks for PCB Heatsink profile-overview Assignment table Profiles for lock-in fixing spring A A A A 89 13 18 84 - - - - 93 17 20 88 Mounting parts for heatsinks Profiles for PCB mounting Thermal conductive material Technical introduction E 49 - 50 A 89 - 112 E 2 - 24 A2-8 A 120 N A Lock-in retaining spring for transistors - THFU for transistors with low component height THFU 6 C D E F THFU 7 G H for transistor- suitable for spring materihousing heatsinks force [N] al TO 126/ SK 480/ stain65 5 TO 218/ SK 481/ less TO 220/ SK 482/ steel TO 225/ SK 483/ TO 247/ SK 487/ TO 248/ SK 489/ TO 251/ SK 490/ TO 3 P/ SK 492/ SOT 32 SK 495/ SK 499/ SK 512/ SK 514/ SK 573/ SK 574/ SK 575/ SK 576/ SK 589/ SK 593/ SK 617/ LAM 3 K/ LAM 4 K/ LAM 5 K/ LA 27 K eSIP SK 480/ stain46 5 SK 482/ less SK 483/ steel SK 487/ SK 490/ SK 492/ SK 495/ SK 573/ SK 574/ SK 576/ LAM 3 K 10,5 17,5 14,7 art. no. 0,8 1,5 10 10,4 20,25 16,9 B 0,8 3,6 10 I K L M N A 121 Heatsinks for PCB Heatsink profile-overview Assignment table Profiles for lock-in fixing spring A A A A 89 13 18 84 - - - - 93 17 20 88 Mounting parts for heatsinks Profiles for PCB mounting Thermal conductive material Technical introduction E 49 - 50 A 89 - 112 E 2 - 24 A2-8 A B C D E F G H I K L M N A U-Extruded heatsinks Rth [K/W] art. no. 25 9 B 20 15 15 1,5 10 5 C 12 SK 12 ... 25 please indicate: 50 100 [mm] 75 ... 1000 mm art. no. D Rth [K/W] 25 14 20 15 13 1,5 10 E 5 17 25 50 75 100 [mm] 100 150 200 [mm] SK 13 ... please indicate: ... F 25 35 mm 12 art. no. Rth [K/W] 10 8 40 4 G 6 4 2 SK 115 ... 37.5 50 1000 mm UK 14 SA 220 I M 2,5 O 1,8 O 3,2 4 O 1,8 UK 14 SA M3 4 M3 O 1,8 4 5 5 1,5 UK 14 SA 220 3,2 15 5 H 50 ... please indicate: 5 12,5 20 25 14 5 12,5 20 25 K art. no. L Rth [K/W] UK 14 SA 220 UK 14 SA 220 3,2 UK 14 SA M3 surface: 5 12,5 20 25 20 20 20 TO 220 TO 220 TO 220 black anodised M N A 123 Profiles for PCB components Heatsink profile-overview Heatsinks for PCB Hole pattern A A A A 91 13 - 17 89 - 91 21 Profiles for PCB mounting Extruded heatsinks Retaining springs for transistors Technical introduction A A A A 89 - 112 22 - 83 115 - 117 2-8 A U-Extruded heatsinks 3 x O 3,2 B 15 9,5 1,2 4 1,2 14,8 18,5 35 27,5 C art. no. Rth [K/W] ICK 35 SA 15 TO 220 SK 12 SA 32 M 2,5 SK 12 SA 2 x 32 M 2,5 4,5 D 3 15 4 8 1,5 10 10 20 20 25 12 45 50 E Rth [K/W] SK 12 SA 32 SK 12 SA 2 x 32 30 15 1xSOT 32 2xSOT 32 SK 13 35 SA 220 M3 O 3,2 5 17 O 3,5 F 5 8 10,1 24,85 35 10,1 24,85 35 10,1 24,85 35 G Rth [K/W] SK 13 35 SA 220 SK 13 35 SA 220 3,2 SK 13 35 SA 220 3,5 17 17 17 TO 220 TO 220 TO 220 SK 431 1 SK 431 2 H SK 431 3 O 3,2 O 3,8 3,2 art. no. SK 13 35 SA 220 3,5 5 8 13 1,5 SK 13 35 SA 220 3,2 8 art. no. 35 12 11 11 12 11 9 11 12 2 5,5 8 21 25 16 art. no. 2,5 8 17 25 25 I 17 Rth [K/W] SK 431 1 SK 431 2 SK 431 3 18 18 18 surface: TO 220 TO 220 TO 220 K black anodised L M Profiles for PCB components Heatsink profile-overview Heatsinks for PCB Hole pattern A A A A 91 13 - 17 89 - 91 21 Profiles for PCB mounting Extruded heatsinks Retaining springs for transistors Technical introduction A A A A 89 - 112 22 - 83 115 - 117 2-8 A 124 N A Die-cast heatsinks Setup heatsinks and angle for TO 3 12,7 27 4,2 B C O 22 O 24 art. no. 30,2 40 [mm] AKK 127 Rth [K/W] 27 14 8,6 E art. no. AKK 191 F 27 0,8 3,5 19,1 4,2 D O 22 O 24 30,2 40 [mm] Rth [K/W] 27 12 surface: black lacquered material: die-casting aluminium ,9 10 H art. no. 7 13 30 G 5 41 4,5 [mm] WP 4030 100 ... WP 4030 100 3 ... please indicate: 33 ,5 O 4,2 O 4,2 11 40 ,2 30 17 9 41 5,56 Rth [K/W] 100 100 3.7 3.7 -- TO 3 ... surface SA = black anodised AL = raw degreased aluminium I socket: TF 3 2 E 50 K L M N A 125 Mounting for TO 3 angle Order example Standard aluminium profiles Heatsinks for PCB A A A A 125 21 135 - 136 89 - 112 Heatsinks for DC/DC converter Profiles for lock-in fixing spring Heatsink profile-overview Technical introduction A A A A 113 - 114 84 - 88 13 - 17 2-8 A Die-cast heatsinks Die-cast acc. to german standard DIN 41882 - other lengths and drillings on request B art. no. C 30 M6 4,5 59,5 60,5 71 40 2,8 K/W M6 20,1 82 K 3 ... please indicate: D for mounting use insulator: art. no.: IS 53 ... semiconductor retaining thread M 6, M 8, M 10, M 12, 1/4"-28 UNF art. no. 2,8 K/W 30 M6 4,5 59,5 60,5 71 40 E F M6 20,1 82 G ... semiconductor retaining thread M 6, M 8 art. no. 5 K/W 4 30 35 M5 M6 20,1 61 ... semiconductor retaining thread M 5, M 6, M 8, 1/4"-28 UNF 55 art. no. 9 K/W K 3 30 20 M4 please indicate: I for mounting use insulator: art. no.: IS 53 41,5 K 5 ... 44 H 33,5 please indicate: Cathode lug insulator with an additional insulated connection (M 3). for mounting use insulator: art. no.: IS 53 53,5 K 3 T ... M4 14 55 K 9 ... please indicate: M4 L ... semiconductor retaining thread M 4, M 5 surface: black lacquered M Mounting for TO 3 angle Special profiles Standard aluminium profiles Heatsinks for PCB A A A A 125 21 135 - 136 89 - 112 Heatsinks for DC/DC converter Profiles for lock-in fixing spring Heatsink profile-overview Technical introduction A A A A 113 - 114 84 - 88 13 - 17 2-8 A 126 N A Die-cast heatsinks Die-cast acc. to german standard DIN 41882 B - other lengths and drillings on request art. no. 53 M4 please indicate: D 3 M4 14 37 K 15 ... 27,5 C 34,5 30 20 15 K/W ... semiconductor retaining thread M 4, M 5 surface: black lacquered Mounting parts for heatsinks art. no. 16,3 9,7 E 13,3 O 25,5 50 37 31 27 O 6,5 F O 25,5 G IS 53 H I K L M N A 127 Mounting for TO 3 angle Special profiles Standard aluminium profiles Heatsinks for PCB A A A A 125 21 135 - 136 89 - 112 Heatsinks for DC/DC converter Profiles for lock-in fixing spring Heatsink profile-overview Technical introduction A A A A 113 - 114 84 - 88 13 - 17 2-8 A Die-cast heatsinks - - - - - - completely milled mounting surface for semiconductors with square bottom plates the mounting surface can be equipped with threads for fastening semiconductors with screwed glands (semiconductor thread tapping) threads from M 4 to M 32 x 1.5 or 4 x threads for semiconductors with clamping plate mounting are available strap fastening thread M 8 delivery without anode strap other lengths and drillings on request B 50 135 0,55 K/W C 50 39 5xM8 O 61 36 36 100 art. no. [mm] K 0,55 ... Rth [K/W] 120 please indicate: D 0.55 ... semiconductor retaining thread M 12, M 24 x 1,5 E 94 100 75 90 3xM8 1,1 K/W O 42 F 25 50 68 art. no. [mm] K 1,1 ... Rth [K/W] 90 please indicate: 1.1 G ... semiconductor retaining thread M 8, M 12, M 16 x 1,5 surface: black lacquered Accessories H - anode end strap made of tin-plated cathode copper FL 0,55 O 52 FL 1,1 O 42 O 8,5 2 1,5 O 9,4 86 I 65 art. no. art. no. FL 0,55 FL 1,1 WL 1,1 O 13,5 O 42 K O 11,4 1,5 O 8,5 2 80 95 O 9,5 45 55 WL 0,55 O 52 80 L 90 art. no. art. no. WL 0,55 WL 1,1 M Mounting for TO 3 angle Special profiles Standard aluminium profiles Heatsinks for PCB A A A A 125 21 135 - 136 89 - 112 Heatsinks for DC/DC converter Profiles for lock-in fixing spring Heatsink profile-overview Technical introduction A A A A 113 - 114 84 - 88 13 - 17 2-8 A 128 N A Standard fin coolers for thermoelectrical elements B C D E F G - - - - - - - - - - - - fin coolers in special design especially suitable for thermoelectric elements (Peltier-elements) and similar power modules compact design with reduced volume large surface, therefore more efficient than extruded profiles particularly low heat resistance with forced air cooling ideally fitted fins from a heat engineers point of view accurately flat milled surfaces very low roughness machining for module mounting according to drawing heat bridges (spacing bridges) on request lapped surface on request customer specific special design 32 x 3 = 96 mm H Rth [K/W] 8 0,8 I 0,05 100 Rz10 2 100 art. no. K KTE 1 0,9 0,8 Rth [K/W] 0,9 0,8 0,7 0,6 0,5 0,4 0,3 0,2 0,1 0 0,7 0,6 0,5 0,4 0,3 0,2 0,1 0 0 1 2 3 4 5 6 V [m/s] KTE 1 [mm] 58 material: aluminium, construction with copper on request 0 1 art. no. KTE 2 KTE 2 2 3 4 5 6 V [m/s] [mm] 46 L M N A 129 Fluid coolers Standard aluminium profiles High capacity cooling aggregat. Heatsink profile-overview A 131 - 133 A 135 - 136 D 26 - 29 A 13 - 17 Drilling pattern for Solid State Special heatsink design Special profiles Technical introduction A A A A 12 137 - 138 140 2-8 A Fin coolers KTE/KTED custom design KTE B C B D E Rz10 C 0,05 100 A possible dimensions: F dimensions [mm] D A B C D E F max. 400 max. 30 max. 150 0.8 / 1 / 1.5 / 2 min. 2 max. 400 E F please indicate with your order: dimensions [mm] A B C D E aluminium, construction with copper upon request material: F 0,2 100 B1 Rz10 C G - fin coolers in special design - for forced convection, thus particularly low thermal resistance - two opposite bottom plates as mounting surfaces for power modules and similar - mounting surfaces precisely flat milled - compact design with reduced volume - ideally fitted fins from a heat engineering point of view - lapped finish on request - additional machining according to customer's requirements - fan versions on request - special constructions to customer's indications B KTED D E 0,2 100 H F Rz10 A I possible dimensions: dimensions [mm A B B1 C D E F max. 400 max. 30 max. 30 max. 150 0.8 / 1 / 1.5 / 2 min. 2 max. 400 please indicate with your order: L dimensions [mm] A B B1 C D E F max. 400 max. 30 max. 30 max. 150 0.8 / 1 / 1.5 / 2 min. 2 max. 400 material: Fluid coolers Standard aluminium profiles High capacity cooling aggregat. Heatsink profile-overview M aluminium, construction with copper upon request A 131 - 133 A 135 - 136 D 26 - 29 A 13 - 17 K Drilling pattern for Solid State Special heatsink design Special profiles Technical introduction A A A A 12 137 - 138 140 2-8 A 130 N A Fluid coolers for power modules B C w [l/h] V w [mbar] 900 2600 800 2400 700 2200 U-flow (FLKU 140) 2000 I-flow (FLKI 80) 400 300 1400 200 1200 100 100 200 300 400 500 600 700 800 900 1000 0 FLKU 140 300 500 1600 0 400 600 1800 1000 FLKI 80 500 U-flow (FLKU 140) 1000 [W] Q I-flow (FLKI 80) 200 100 0 [l/h] Vw 0 .... 100 200 300 400 500 600 700 800 900 1000 24 33 51 42 [l/h] Vw 60 Temperatur [C] - water-gycol mixture (60/40); inlet temperature approx. 26 C D E F Fluid cooler for dissipating large quantities of heat with low space requirement; effective system to cool power modules; suitable for water pH 6.5-8.5 with anticorrosives, as well as other fluids (eg. oil, alcohols, etc.); compact design with internal fin structure for particularly good heat transfer to the fluid; minimised flow pressure losses (see diagram); operating pressure up to 2 bar possible; thick base plate for optimum heat distribution and to secure the heat-emmiting elements; mounting flange for the cooler according to customer's instructions; precisely face milled surface of component mounting area with very good flatness and low roughness depth; dimensionally accurate adjustment to given mounting conditions; connections using hole ports 12 mm in diameter with reinforcing seam to DIN 71550 or installation flange to customers instuctions; I- or U-throughflow or multiple throughflow versions; max. drilling depth in the base plate: 7 mm To avoid corrosion in the water cooler the cooling fluid has to flow in a closed circuit and it has to contain 40-60% (preferred is 50%) anti-corrosive fluids for aluminium, if necessary with anti-freeze. For the choice and approval of the cooling fluid as well as for the possible consequences in the cooling circuit the user is the only liable person. Therefore we exclude any liability for damages caused by the choice or approval of the cooling fluids. - dimensions and designs using customer's instructions art. no. 500 68 _1 + O 12 x 1,5 80 G DIN 71550 _2 + 40 16 8,5 H 11,5 580 0,1 100 Rz10 FLKI 80 500 DIN 71550 140 119 + _ 1,5 I _2 + 40 FLKU 140 material: 16 8,5 Rz10 540 0,1 100 11,5 K L O 12 x 1,5 art. no. EN AW 6060 (AlMgSi 0.5) M N A 131 Fin coolers Cooling aggregates with axial fan High capacity cooling aggregat. Heatsink profile-overview A 129 D 13 - 25 D 26 - 29 A 13 - 17 Special heatsink design Special profiles Hole pattern Technical introduction A A A A 137 - 138 140 21 2-8 A Fluid coolers for power modules 1 = FLKI 80 G 500 2 = FLKI 80 G 300 3 = FLKI 80 G 200 1 = FLKU 140 G 500 2 = FLKU 140 G 300 3 = FLKU 140 G 200 w [l/h] V w [mbar] w [mbar] 500 1000 w [l/h] V 1 500 1000 900 900 400 800 700 3 600 500 800 300 2 C 1 500 200 100 0 .... 100 200 300 400 500 600 700 800 24 33 [l/h] Vw 300 100 200 1 100 0 51 42 3 2 200 400 3 2 1 100 200 300 600 300 0 400 700 400 0 3 2 B 0 100 200 300 400 500 600 700 800 0 .... [l/h] Vw Temperatur [C] 24 33 42 51 Temperatur [C] D - water-gycol mixture (60/40); inlet temperature approx. 26 C Fluid cooler for dissipating large quantities of heat with low space requirement; effective system to cool power modules; suitable for water pH 6.5-8.5 with anticorrosive, as well as other fluids (eg. oil, alcohols, etc.); compact design with internal fin structure for particularly good heat transfer to the fluid; minimised flow pressure losses; operating pressure up to 2 bar possible; thick base plate for optimum heat distribution and to secure the heat-emitting elements; mounting flange for the cooler according to customer's instructions; precisely face milled surface of component mounting area with very good eveness and low roughness depth; for power modules like IGBT-module, Thyristor-module, SCR diode module, bridge amplifiers and others; dimensionally accurate adjustment to given mounting conditions; conncetions with thread muffle 1/8" or mounting flange according to customer's instructions; I- or U-throughflow or multiple throughflow versions; max. drilling depth in the base plate: 17 mm To avoid corrosion in the water cooler the cooling fluid has to flow in a closed circuit and it has to contain 40-60% (preferred is 50%) anti-corrosive fluids for aluminium, if necessary with anti-freeze. For the choice and approval of the cooling fluid as well as for the possible consequences in the cooling circuit the user is the only liable person. Therefore we exclude any liability for damages caused by the choice or approval of the cooling fluids. E F G - dimensions and designs using customer's instructions Q [W] O 20 2600 20 15 2400 2200 60 80 0,1 100 Rz10 2000 FLKI 80 G 500 1800 FLKI 80 G 300 1600 FLKI 80 G 200 H 1400 20 29 20 1200 1/8" 1000 100 200 300 400 500 600 700 800 900 1000 0 [l/h] Vw art. no. FLKI 80 G 200 FLKI 80 G 300 [mm] 200 300 art. no. FLKI 80 G 500 [mm] 500 I [W] Q K 2600 O 20 2400 Rz10 140 0,1 100 100 15 20 2200 FLKU 140 G 500 2000 FLKU 140 G 300 1800 FLKU 140 G 200 1600 1400 art. no. FLKU 140 G 200 FLKU 140 G 300 [mm] 200 300 material: Fin coolers Cooling aggregates with axial fan High capacity cooling aggregat. Heatsink profile-overview 20 29 20 1200 1/8" 1000 0 100 200 300 400 500 600 700 800 900 1000 [l/h] Vw art. no. FLKU 140 G 500 [mm] 500 M EN AW 6060 (AlMgSi 0.5) A 129 D 13 - 25 D 26 - 29 A 13 - 17 Special heatsink design Special profiles Hole pattern Technical introduction L A A A A 137 - 138 140 21 2-8 A 132 N A Recooling systems for liquid coolers B C D - - - - - - - - recooling system for all types of liquid coolers cools up to 2,600 watts thermal power loss consists of pump and recooler pump as normally aspirating, single-stage centrifugal pump with spiral housing in block construction recooler with liquid-conducting tube system with air lamella and electrically driven fan motor further information free of charge under: FLK R1-Info notes: anticorrosive agents are required when water is used as coolant (eg. water/glykol - 60/40) the hose systems used (NOT in scope of delivery) must be resistant to anticorrosive agents (eg. material EPDM according to DIN 73411, ISO 4081) To avoid corrosion in the water cooler the cooling fluid has to flow in a closed circuit and it has to contain 40-60% (preferred is 50%) anti-corrosive fluids for aluminium, if necessary with anti-freeze. For the choice and approval of the cooling fluid as well as for the possible consequences in the cooling circuit the user is the only liable person. Therefore we exclude any liability for damages caused by the choice or approval of the cooling fluids. art. no. 25 225 56 75 E 120 64 1/8" 82 90 90 106 276 177 F 288 G 3/4" H FLKR 1 I thermal cooling capacity: max. 2.600 W pump: single-phase 230 V AC, 120 W recooler: single-phase 230 V AC, 120 W/ three-phase 400 V AC, 90 W type of delivery: pump and recooler K L M N A 133 Fin coolers Cooling aggregates with axial fan High capacity cooling aggregat. Heatsink profile-overview A 129 D 13 - 25 D 26 - 29 A 13 - 17 Special heatsink design Special profiles Hole pattern Technical introduction A A A A 137 - 138 140 21 2-8 A B C D E F G H I K L M N A Standard aluminium profiles B - length, drilling and surface finishes to customer's instructions - other standard profiles on request U-profiles C A D C E A [mm] 20 20 30 20 B [mm] 40 40 20 20 C [mm] 20 20 30 20 D [mm] 2.5 2.0 2.0 1.5 art. no. SU 16 SU 27 SU 29 SU 32 tolerances: EN 755 material: EN AW 6060 (AlMgSi 0.5) A [mm] 30 40 40 30 B [mm] 30 40 40 30 C [mm] 30 40 40 30 D [mm] 2.0 2.5 4.0 3.0 flat profiles B D B art. no. SU 02 SU 03 SU 05 SU 09 A F G H art. no. SFP 005 SFP 006 SFP 007 SFP 016 SFP 028 SFP 029 SFP 037 SFP 046 SFP 054 SFP 057 A [mm] 40 30 40 70 40 30 55 25 50 115 B [mm] 15 8 5 15 10 10 10 5 10 100 art. no. SFP 058 SFP 060 SFP 067 SFP 074 SFP 076 SFP 079 SFP 090 SFP 100 SFP 106 SFP 112 tolerances: EN 755 material: EN AW 6060 (AlMgSi 0.5) A [mm] 40 80 30 70 60 90 120 100 40 100 B [mm] 8 8 15 10 30 100 15 15 20 25 B I C angled profile A K L art. no. SWP 02 SWP 06 SWP 10 SWP 15 SWP 23 SWP 25 A [mm] 80 80 30 40 20 50 B [mm] 80 40 20 20 15 30 C [mm] 8 6 2 4 2 5 art. no. SWP 29 SWP 36 SWP 40 SWP 55 SWP 57 tolerances: EN 755 material: EN AW 6060 (AlMgSi 0.5) A [mm] 15 75 40 40 60 B [mm] 10 50 30 40 30 C [mm] 2 5 5 5 5 M N A 135 Hole pattern Extruded heatsinks Mounting for TO 3 angle High capacity heatsinks A A A A 21 22 - 83 125 - 126 57 - 58 Construction parts made of aluminium Heatsink as visual & decor-parts Special profiles Technical introduction A A A A 139 10 140 2-8 A Standard aluminium profiles quadrangular profile B B A art. no. SVP 01 SVP 04 SVP 10 A [mm] 8 25 10 B [mm] 8 25 10 art. no. SVP 12 SVP 13 tolerances: EN 755 material: EN AW 6060 (AlMgSi 0.5) A [mm] 50 55 B [mm] 50 55 C D C T-profile B A art. no. STP 4 A [mm] 60 B [mm] 60 C [mm] 6 tolerances: EN 755 material: EN AW 6060 (AlMgSi 0.5) E art. no. STP 5 A [mm] 20 B [mm] 20 C [mm] 2 F G H I K L M Hole pattern Extruded heatsinks Mounting for TO 3 angle High capacity heatsinks A A A A 21 22 - 83 125 - 126 57 - 58 Construction parts made of aluminium Heatsink as visual & decor-parts Special profiles Technical introduction A A A A 139 10 140 2-8 A 136 N CNC treatments of cooling profiles Streamlined omnidirectional fin geometrie Heatsinks with pressed-in fins Precise milled flat surfaces Customer specified CNC treatments of cooling profiles - latest CNC machining centres for highest quality demands - profile treatments for seizes up to 1600 mm - future orientated stockkeeping of the aluminium profiles in fully automated honeycomb warehouses - batch size optimized production flow - special profiles, modifications and surfaces according to your special demand Streamlined omnidirectional fin geometrie - free-standing cooling fingers for forced cooling - incident flow of the heatsinks by means of fans from all sides (omnidirectional) - no direction-oriented installation position - fin spacings according to your demand - special designs, treatments and versions according to customer's request Extruded heatsinks with pressed-in fins - for highest thermal dissipation losses - channelled fin geometrie for increasing the surface - thermotechnical optimized connection between fin and bottom plate - deliverable in widths of 200 up to 750 mm - customer specific versions and treatments Precise milled flat surfaces - very small depth of roughness and unevenness - individually milled flat semi-conductor mounting surfaces for minimizing the heat-transmission resistances - millings on the already anodized heatsinks - protective foil avoid scratching of the high-quality mounting surface - special designs according to customer's drawing Surface labelling Additional equipments Heatsinks with integrated sealing 19" compliant CNC-treatment Surface labelling - durable and high quality labeling by means of YAG-laser, silk screen-, pad- and digital printing - print layout preparation by means of in-house repro department - precise in contrast, precise engraved fonts and contours by means of CNC-controlled treatment systems - labeling of aluminium, Plexiglas and plastics Additional equipments - fractional semi-conductor mounting surfaces made of copper for heat dissipation - pressed-in or screwed distance sleeves made of metal and plastics - threaded bolts with internal and external thread - support rail mountings made of metal or plastics according to DIN EN 50022 Heatsinks with integrated sealing - foamed sealing applied on the profile as a permanent element of the heatsink - also usable for front plates or milled parts - groove filled or stacked - permanently elastic and CFC-free - adaption of the sealing properties to the specific application 19" compliant CNC-treatment - milled heatsink side or back panels for 19" cases, 19" plug in boxes, subracks and insert modules - pressing in or welding of threaded bolts - customer specified modifications, designs - surfaces and printing upon request Welded high perfomance heatsinks Welded heatsinks Construction- and milled parts Cases and contour milled parts Welded high performance heatsinks - optimal fin geometry with channelled structure for free convection - production of heatsink widths outside of the press-technical production possibilities - removing of the welding line by means of precise milled flat surfaces - individual surface design Welded heatsinks - homogeneous connection of the materials by means of special welding methods - welding on additional mounting levels which are situated diagonally to the pressing direction of the profiles - production of prototypes - application-based special designs and treatments according to your demand Construction- and milled parts made of aluminium according to customer specifications - precise milled contours and surfaces - inserting of holes and cut-outs, cutting or milling of threads - turning in of wire thread inserts for high- and wear-resistant threads - simple data exchange by means of up to date CAD- / CAM-systems Cases and contour milled parts made of aluminium - customer specific cases and construction parts - precise mechanical treatments for highest quality demands - all requested surface designs - modifications and versions, special requirements, treatments and designs according to your drawing specification A Special profiles B Whenever you cannot find the ideal solution for your problem from the wide range of standard extrusions on offer or a solution constitutes a compromise between the use of the space available and the weight, as long as the quantity is correct a special section is the answer. Released from the dimensional restrictions of the standard profiles, special extrusions are tailored to your design requirements, and offer considerable benefits in terms of machining time and use of space. C D 70 27.5 Furthermore your calculation will be influenced positively by the optimised material use and shorter machining times. You can determine the combination of the desired thermal properties and the design element yourself, by the use of a special profile. We are not allowed to publish many of our customer-specific Profiles, because they are subject to non disclosure agreements". Therefore we only show some examples for customer profiles in the industry. All figures are illustrations. Changes reserved. 98 22 E 200 120 50 70 F G 107 50 18 200 H 59 15 107 I 22 220.8 7.5 25 120 26.8 K 85 138 44.3 80 65.5 70 66 L M 222.9 If required please send your request. 37.1 40 A 140 N Round and pin heatsinks Heatsinks for LEDs Heatsinks for all transistor types Heatsinks and coolers for processors Round and pin heatsinks - streamlined omnidirectional fin geometrie - excellent thermal conductivity due to special aluminium alloys - suitable for free and forced convection - no direction bounded installation position - flat semiconductor mounting surfaces - contour also as milled parts according to your demands Heatsinks for LEDs - various heatsink geometries adjusted to all current LED-types and light-engines - star shaped heatsinks for the use as a LED-lamp housing - LED mounting by means of screws, thermal conductive adhesive foil or thermal conductive glue - customer specified versions with application based thermal management" Heatsinks for all current PL CC, DIL-IC and SMD transistor types - effective heat dissipation at a low profile and low weight - direct mounting of the component by means of a double-sided adhesive thermal foil or glue - solderable versions of the surface - special packaging such as tape & reel, magazine or tray upon request Heatsinks and coolers for processors - passive and active product solutions - effective heat dissipation due to optimal conception of fan and heatsink - long lifetime and high operating safety due to high quality fans - versions for screw, glue and clip mounting - customer specific solutions and fans A Heatsinks for IC processor art. no. page Rth [K/W] ICK PGA 6 x 6 x 14 B 11 20 dissipation loss [W] 6.4 ICK PGA 8 x 8 x 12 B 11 14.8 8.1 ICK PGA 9 x 9 B 11 14 3 ICK PGA 11 x 11 x 8 B 11 16 7.5 ICK PGA 11 x 11 B 11 10.9 4.5 ICK PGA 11 x 11 x 12 B 12 12.3 3.9 ICK PGA 14 x 14 B 12 10 4.9 ICK PGA 14 x 14 x 10 B 12 10.5 11.2 ICK PGA 14 x 14 x 14 B 12 9.6 12.5 ICK PGA 14 x 14 x 12 B 12 9.8 5.3 ICK PGA 15 x 15 B 12 9.4 5.9 ICK PGA 16 x 16 x 8 B 13 14 4.9 ICK PGA 16 x 16 x 10 B 13 10.5 12.9 ICK PGA 16 x 16 x 12 B 13 9.3 6.2 ICK PGA 17 x 17 B 13 8.6 6.9 ICK PGA 17 x 17 x 8 B 13 13.2 5.2 ICK PGA 17 x 17 x 12 B 13 9 6.5 ICK PGA 18 x 18 B 14 8.4 7.2 ICK PGA 19 x 19 B 14 8.6 7.6 ICK PGA 19 x 19 x 12 B 14 9 6.9 ICK PGA 20 x 20 x 10 B 14 8.5 15.1 ICK PGA 20 x 20 B 14 7.6 8.3 ICK PGA 20 x 20 K B 15 7.6 8.3 ICK PGA 20 x 20 x 8 B 15 12 6.3 ICK PGA 20 x 20 x 12 B 15 8 8.1 - - - - way of fixation socket suitable for processor type therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive fixing clamp universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal K socket 7/ socket 370 L universal IDT W2A/ AMD(R) K6-III/ AMD(R) K6-2/ MMX/ IDT C6/ Intel(R) Pentium(R) universal universal universal M therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive very good thermal efficiency aerodynamic imnidirectional fin geometry simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue customer specified designs, surfaces and modifications upon request B2 B C D E F G H I N A Heatsinks for IC processor art. no. page Rth [K/W] ICK PGA 21 x 21 B 15 7 dissipation loss [W] 8.6 ICK PGA 22 x 22 B 15 6.2 8.9 ICK PGA 25 x 25 B 16 5 11.1 ICK BGA 10 x 10 B 17 30 1.8 ICK BGA 10 x 10 x 10 B 17 28.5 1.9 ICK BGA 14 x 14 B 17 30 2.1 ICK BGA 14 x 14 x 10 B 17 27.4 2.3 ICK BGA 21 x 21 B 18 24.3 2.5 ICK BGA 23 x 23 B 18 22.5 2.8 ICK BGA 23 x 23 x 10 B 18 21.5 2.9 ICK BGA 27 x 27 B 18 20 3.1 ICK BGA 27 x 27 x 10 B 18 18.5 3.3 ICK BGA 27 x 27 x 14 B 18 13.5 9.5 ICK BGA 27 x 27 x 22 B 19 10.5 9.5 ICK BGA 31 x 31 B 19 18.6 3.4 ICK BGA 31 x 31 x 10 B 19 17 3.7 ICK BGA 35 x 35 B 19 16.5 3.7 ICK BGA 35 x 35 x 10 B 19 15.7 3.8 ICK BGA 37 x 37 x 6 B 19 15.7 9.5 ICK BGA 37 x 37 x 10 B 20 14 10.5 ICK BGA 40 x 40 B 20 14.6 4.3 ICK BGA 40 x 40 x 10 B 20 13.8 4.4 ICK BGA 42,5 x 45 B 20 13.6 4.2 ICK S 10 x 10 x 6,5 B 21 25 2.5 ICK S 10 x 10 x 10 B 21 23.75 2.6 ICK S 10 x 10 x 12,5 B 21 22.5 2.8 ICK S 10 x 10 x 18,5 B 22 21.75 3 B C D E F G H I K L M N B3 - - - - way of fixation socket suitable for processor type therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal very good thermal efficiency aerodynamic imnidirectional fin geometry simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue customer specified designs, surfaces and modifications upon request A Heatsinks for IC processor art. no. page Rth [K/W] ICK S 14 x 14 x 6,5 B 22 9 dissipation loss [W] 5 ICK S 14 x 14 x 10 B 22 8.8 5.1 ICK S 14 x 14 x 12,5 B 22 8.1 5.4 ICK S 14 x 14 x 18,5 B 22 7.9 5.6 ICK S 17 x 17 x 15 B 22 8.36 5.95 ICK S 17 x 17 x 20 B 23 7.89 6.3 ICK S 18 x 18 x 6,5 B 23 7 7.7 ICK S 18 x 18 x 10 B 23 6.8 8 ICK S 22 x 22 x 10 B 23 5.9 8.5 ICK S 22 x 22 x 18,5 B 23 5 10 ICK S 25 x 25 x 6,5 B 23 5.8 12.9 ICK S 25 x 25 x 12,5 B 24 5.3 14.1 ICK S 25 x 25 x 18,5 B 24 5.2 14.4 ICK S 29 x 29 x 10 B 24 5.7 13.1 ICK S 29 x 29 x 20 B 24 3.7 20.2 ICK S 29 x 29 x 30 B 24 2.9 21 ICK S 32 x 32 x 10 B 24 5.4 13.8 ICK S 32 x 32 x 20 B 25 3.7 20.4 ICK S 36 x 36 x 10 B 25 4.7 16 ICK S 36 x 36 x 15 B 25 3.9 19.2 ICK S 36 x 36 x 20 B 25 3.2 22 ICK S 36 x 36 x 30 B 25 2.5 23.4 ICK S 40 x 40 x 10 B 25 4.6 16.3 ICK S 40 x 40 x 20 B 26 3.5 21.4 ICK S 40 x 40 x 25 B 26 3.1 23.7 ICK S 45 x 45 x 10 B 26 4.7 16 ICK S 45 x 45 x 20 B 26 4.4 17 - - - - way of fixation socket suitable for processor type therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal very good thermal efficiency aerodynamic imnidirectional fin geometry simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue customer specified designs, surfaces and modifications upon request B4 B C D E F G H I K L M N A Heatsinks for IC processor art. no. page Rth [K/W] ICK S 50 x 50 x 20 B 26 2.7 dissipation loss [W] 27.7 ICK S 50 x 50 x 25 B 26 2.4 31.2 ICK S 50 x 50 x 40 B 27 6.05 13.5 ICK S 50 x 50 x 50 B 27 4.05 14.32 ICK S 98 x 98 x 30 B 27 2.4 35 ICK S 98 x 98 x 45 B 27 3.5 42 ICK S D 12 x 12 x 7,5 B 28 10.85 4.6 ICK S D 18 x 12 x 7,5 B 28 9 5.4 ICK S D 24 x 18 x 7,5 B 28 8.5 5.85 ICK S D 98 x 98 x 10 B 28 4.88 10.25 ICK S R 28,5 x 6,5 B 29 5.82 15.6 ICK S R 28,5 x 10 B 29 5.65 16 ICK S R 28,5 x 12,5 B 29 5.53 16.3 ICK S R 28,5 x 18,5 B 29 4.25 20.2 ICK S R 32,5 x 10 B 29 5.54 9 ICK S R 32,5 x 20 B 29 5.6 8.9 ICK S R 32,5 x 30 B 30 4.2 11 ICK S R 32,5 x 40 B 30 3.2 15 ICK S R 32,5 x 50 B 30 2.7 18 ICK S R 36,5 x 20 B 30 6.41 18 ICK S R 40 x 10 B 30 11.04 8.4 ICK S R 40 x 20 B 30 10.32 8.8 ICK S R A 40 x 20 B 31 11.62 8.2 ICK S R 40 x 30 B 31 9.77 16 ICK S R 40 x 50 B 31 2 25 ICK S R 45 x 30 B 31 8 9.2 ICK S R 45 x 45 B 31 6 9.2 B C D E F G H I K L M N B5 - - - - way of fixation socket suitable for processor type therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal very good thermal efficiency aerodynamic imnidirectional fin geometry simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue customer specified designs, surfaces and modifications upon request A Heatsinks for IC processor art. no. page Rth [K/W] ICK S R 50 x 10 B 31 5.28 dissipation loss [W] 9.5 ICK S R 50 x 20 B 32 8.55 9.8 ICK S R 50 x 30 B 32 8.26 10 ICK S R 50 x 45 B 32 6.32 12.7 ICK S R 54 x 20 B 32 8.11 10.2 ICK S R 54 x 30 B 32 6.95 11.57 ICK S R 54 x 45 B 33 5.37 15.2 ICK S R 70 x 30 B 33 1.8 27 ICK S R 70 x 50 B 33 1.5 33 ICK S R 85 x 30 B 33 2 25 ICK S R 85 x 45 B 33 1.8 27 ICK S R 98 x 30 B 34 1.65 30 ICK S R 98 x 50 B 34 1.4 35 ICK LED R 23,5 x 14 B 35 18.58 6.5 ICK LED R 23,5 x 14 G B 35 19.16 6.3 ICK LED R 27 x 10 B 35 17.69 6.7 ICK LED R 27 x 10 G B 35 18.24 6.6 ICK LED R 28 x 15 B 35 15.24 7.8 ICK LED R 28 x 15 G B 36 15.72 7.6 ICK LED R 29 x 11,5 B 36 17.26 8.2 ICK LED R 29 x 11,5 G B 36 17.8 8 ICK LED R 32 x 14 B 36 15.23 7.8 ICK LED R 32 x 14 G B 36 15.23 7.6 ICK LED R 33 x 10 B 36 17.6 6.8 ICK LED R 33 x 10 G B 36 18.15 6.6 ICK LED R 33 x 16,5 B 37 13.87 8.5 ICK LED R 33 x 16,5 G B 37 14.3 8.3 - - - - way of fixation socket suitable for processor type therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal very good thermal efficiency aerodynamic imnidirectional fin geometry simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue customer specified designs, surfaces and modifications upon request B6 B C D E F G H I K L M N A Heatsinks for IC processor art. no. page Rth [K/W] ICK LED R 35 x 10 B 37 16.9 dissipation loss [W] 9.35 ICK LED R 35 x 10 G B 37 17.5 9.2 ICK LED R 36 x 12 B 37 12.88 10 ICK LED R 36 x 12 G B 37 13.28 8.9 ICK LED R 40 x 10 B 37 12.28 9.45 ICK LED R 40 x 10 G B 38 12.66 9.3 ICK LED R 40 x 27 B 38 9.41 12.1 ICK LED R 40 x 27 G B 38 9.71 11.9 ICK LED R 45,7 x 16,5 B 38 10.46 11.05 ICK LED R 45,7 x 16,5 G B 38 10.49 10.8 ICK LED R 50 x 10 B 38 10.57 10.5 ICK LED R 50 x 10 G B 39 10.9 10.3 ICK LED R 50,8 x 16,5 B 39 10.17 11.1 ICK LED R 50,8 x 16,5 G B 39 10.49 10.9 ICK LED R 54 x 20 B 39 9.48 12.1 ICK LED R 54 x 20 G B 39 9.78 11.9 ICK LED R 66 x 40 B 39 3.2 21 ICK LED R 75 x 10 B 40 5.2 12.1 ICK LED R 84 x 40 B 40 2.5 14.5 ICK LED R 100 x 40 B 40 2 27 ICK LED R 160 x 40 B 40 1.4 42 ICK LED R 200 x 40 B 41 1 51 B C D E F G H I K way of fixation socket suitable for processor type therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal universal L M N B7 - - - - very good thermal efficiency aerodynamic imnidirectional fin geometry simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue customer specified designs, surfaces and modifications upon request A Fan coolers for IC processor art. no. page Rth [K/W] LA LED 40 x 30 B 49 1.4 dissipation loss [W] 35 way of fixation socket suitable for processor type universal universal universal universal universal universal 14 31.3 therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive therm. conductive foil/ therm. cond. adhesive screw fastening screw fastening LA LED 50 x 20 B 49 1.25 40 LA LED 50 x 45 B 49 0.9 50 ICK PPC 51 ICK PEN 3 XE B 56 B 56 8.1 2 ICK PEN 3 XE 1 B 56 1.8 33.6 screw fastening Slot 2 ICK EM 25 ICK PEN 38 F B 56 B 57 3.9 4 20.4 15.1 screw fastening therm. conductive foil ICK PEN 38 W B 57 4 15.1 therm. cond. adhesive socket 7/ socket 370 ICK PEN 45 W B 57 3.5 21 therm. cond. adhesive socket 7/ socket 370 ICK PRO 40 W ICK PEN 3 FC B 57 B 57 2.7 3.5 22 22 therm. cond. adhesive fixing clamp socket 8 socket 7/ socket 370 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 58 B 58 2.3 2.3 1.6 1.6 1.6 1.6 1.5 1.5 1.4 1.4 1.4 1.4 22.2 22.2 35.8 35.8 35.8 35.8 41.7 41.7 46.3 46.3 46.3 46.3 therm. conductive foil therm. conductive foil therm. conductive foil therm. conductive foil therm. cond. adhesive therm. cond. adhesive therm. conductive foil therm. cond. adhesive therm. conductive foil therm. conductive foil therm. cond. adhesive therm. cond. adhesive universal universal universal universal universal universal universal universal universal universal universal universal LA LA LA LA LA LA LA LA LA LA LA LA ICK ICK ICK ICK ICK ICK ICK ICK ICK ICK ICK ICK 15 15 17 17 17 17 18 18 21 21 21 21 x x x x x x x x x x x x 15 15 17 17 17 17 18 18 21 21 21 21 F 05 F 12 F 12 F 12 A W 05 W 12 F 12 W 12 F 05 F 12 W 05 W 12 Slot 2 socket 7/ socket 370 Power PC Intel(R) Pentium(R) III-XeonTM Slot II Format (R) Intel Pentium(R) III-XeonTM Slot II Format Q7 Board AMD(R) K6-III/ IDT W2A/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 AMD(R) K6-III/ IDT W2A/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 AMD(R) K6-III/ IDT W2A/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 Intel(R) Pentium(R) PRO Intel(R) Pentium(R) III FC PGA (Mendocino, Coppermine) universal universal universal universal universal universal universal universal universal universal universal universal B C D E F G H I K L M - - - - high-quality industrial design compact design with high mechanical stability fan with doubled ball bearing axis optimal thermotechnical design of fan and heatsink B8 N A Fan coolers for IC processor art. no. page Rth [K/W] way of fixation socket suitable for processor type 2.5 dissipation loss [W] 23.4 LA ICK PEN 8 F 05 B 59 therm. conductive foil socket 7/ socket 370 B 59 2.5 23.4 therm. conductive foil socket 7/ socket 370 LA ICK PEN 8 W 05 B 59 2.5 23.4 therm. cond. adhesive socket 7/ socket 370 LA ICK PEN 8 W 12 B 59 2.5 23.4 therm. cond. adhesive socket 7/ socket 370 LA ICK PEN 16 K 12 B 59 1.2 51.1 fixing clamp socket 7/ socket 370 LA ICK PEN 16 W 12 B 59 1.2 51.1 therm. cond. adhesive socket 7/ socket 370 LA ICK PEN 16 W 12 A B 59 1.2 51.1 therm. cond. adhesive socket 7/ socket 370 AMD(R) K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 AMD(R) K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 AMD(R) K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 AMD(R) K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 AMD(R) K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 AMD(R) K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 AMD(R) K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 LA ICK PEN 8 F 12 B C D E F G H I K L M N B9 - - - - high-quality industrial design compact design with high mechanical stability fan with doubled ball bearing axis optimal thermotechnical design of fan and heatsink A Fan coolers for IC processor art. no. LA ICK PEN 18 W 12 LA ICK PEN 38 W 12 page Rth [K/W] B 59 1.6 B 59 dissipation loss [W] 38.6 1.1 53.6 LA ICK PRO 25 F 12 LA ICK PEN 2 K 12 B 59 B 60 0.97 1.2 60 58 LA ICK PEN 3 XE B 60 0.8 61.8 LA ICK PEN 4 1 K B 60 0.6 85 way of fixation socket suitable for processor type AMD(R) K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 therm. cond. adhesive socket 7/ AMD(R) K6-III/ socket 370 IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 therm. conductive foil socket 8 Intel(R) Pentium(R) PRO Slot A/ Intel(R) Pentium(R) II/ Slot 1 AMD(R) Athlon(R) screw fastening Slot 2 Intel(R) Pentium(R) III-XeonTM (R) fixing clamp socket 463/ Intel Pentium(R) IV socket 423 therm. cond. adhesive B socket 7/ socket 370 C D E F G H I K L M - - - - high-quality industrial design compact design with high mechanical stability fan with doubled ball bearing axis optimal thermotechnical design of fan and heatsink B 10 N A Heatsinks for PGA B C D - double-sided adhesive thermal conductive foil WLF ... E 7 - surface: black anodised art. no. 14 Rth 14 12 8 14 2,5 E 4 0 ICK PGA 6 x 6 x 14 WLF ... 14 x 14 Rth 12,3 art. no. 23 23 0 1 2 3 4 5 6 v [m/s] 0 1 2 3 4 5 6 v [m/s] 0 1 2 3 4 5 6 v [m/s] 0 1 2 3 4 5 6 v [m/s] 0 1 2 3 4 5 6 v [m/s] 15 [K/W] 12 9 6 2,5 F 3 ICK PGA 8 x 8 x 12 WLF ... 23 x 23 0 Rth art. no. 12,3 G 20 [K/W] 16 24,2 10 8 3,5 24,2 14 [K/W] 12 6 4 H 2 ICK PGA 9 x 9 WLF ... 24 x 24 0 8 art. no. 24,76 27,95 12 2,5 I Rth 20 [K/W] 16 8 4 0 ICK PGA 11 x 11 x 8 WLF ... 24 x 27 art. no. Rth 15,24 K 27,95 10 8 3,5 24,76 14 [K/W] 12 6 4 L 2 0 ICK PGA 11 x 11 WLF ... 24 x 27 M N B 11 Mounts Heatsinks for PLCC Thermal conductive paste Thermal conductive glue E 44 - 48 B 52 E 21 - 24 E 23 - 24 Pin heatsinks for IC SMD-heatsinks Heatsinks for PGA Technical introduction B 21 - 27 B 53 - 54 B 11 - 16 A2-8 A Heatsinks for PGA art. no. 12,5 Rth 27,95 B 10 8 3,5 24,76 14 [K/W] 12 6 4 2 C 0 ICK PGA 11 x 11 x 12 WLF ... 24 x 27 0 art. no. 31,34 16,51 5 Rth 1 2 3 4 5 6 v [m/s] 14 [K/W] 12 D 10 8 34,5 6 4 2 0 ICK PGA 14 x 14 WLF ... 31 x 34 art. no. 10 Rth 2 3 4 5 6 v [m/s] E 12 [K/W] 10 8 2,5 35 35 1 0 F 6 4 2 0 ICK PGA 14 x 14 x 10 WLF ... 35 x 35 0 1 2 3 4 5 6 v [m/s] G art. no. 14 Rth 12 [K/W] 10 8 35 6 2,5 35 4 H 2 0 ICK PGA 14 x 14 x 14 WLF ... 35 x 35 36 36 1 2 3 4 5 6 v [m/s] Rth 14 [K/W] 12 I 10 3,5 12,3 art. no. 0 8 6 4 2 0 ICK PGA 14 x 14 x 12 WLF ... 36 x 36 art. no. 16,51 Rth 38,1 1 2 3 4 5 6 v [m/s] 14 [K/W] 12 L 10 8 3,5 37,92 K 0 6 4 2 0 ICK PGA 15 x 15 WLF ... 37 x 37 Mounts Heatsinks for PLCC Thermal conductive paste Thermal conductive glue E 44 - 48 B 52 E 21 - 24 E 23 - 24 Pin heatsinks for IC SMD-heatsinks Heatsinks for PGA Technical introduction 1 0 2 B 21 - 27 B 53 - 54 B 11 - 16 A2-8 3 4 5 6 v [m/s] B 12 M N A Heatsinks for PGA art. no. Rth 8 B 40 14 [K/W] 12 10 40 3,5 8 6 4 2 C 0 ICK PGA 16 x 16 x 8 WLF ... 40 x 40 art. no. 10 Rth D 1 2 3 4 5 6 v [m/s] 0 1 2 3 4 5 6 v [m/s] 0 1 2 3 4 5 6 v [m/s] 0 1 2 3 4 5 6 v [m/s] 0 1 2 3 4 5 6 v [m/s] 0 1 2 3 4 5 6 v [m/s] 12 [K/W] 10 8 40 6 2,5 40 0 4 2 0 E ICK PGA 16 x 16 x 10 WLF ... 40 x 40 art. no. Rth 14 [K/W] 12 10 8 40 3,5 12,3 40 F 6 4 2 0 ICK PGA 16 x 16 x 12 WLF ... 40 x 40 art. no. Rth 16,51 G 43,1 14 [K/W] 12 10 43,1 4 8 6 4 H 2 0 ICK PGA 17 x 17 WLF ... 43 x 43 art. no. Rth 8 I 10 43,1 8 3 43,1 14 [K/W] 12 6 4 2 K 0 ICK PGA 17 x 17 x 8 WLF ... 43 x 43 art. no. Rth 14 [K/W] 12 L 3,5 12,3 10 43,6 43,6 8 6 4 2 M N 0 ICK PGA 17 x 17 x 12 WLF ... 43 x 43 B 13 Mounts Heatsinks for PLCC Thermal conductive paste Thermal conductive glue E 44 - 48 B 52 E 21 - 24 E 23 - 24 Pin heatsinks for IC SMD-heatsinks Heatsinks for PGA Technical introduction B 21 - 27 B 53 - 54 B 11 - 16 A2-8 A Heatsinks for PGA art. no. 16,51 Rth 45,7 14 [K/W] 12 B 10 8 4 45,7 6 4 2 0 ICK PGA 18 x 18 WLF ... 45 x 45 1 0 art. no. 16,51 Rth 3 4 5 6 v [m/s] C 14 [K/W] 12 10 D 8 48,3 6 4 48,3 2 4 2 0 ICK PGA 19 x 19 WLF ... 48 x 48 0 art. no. Rth 1 2 3 4 5 6 v [m/s] E 14 [K/W] 12 10 8 3,5 12,3 47,3 47,3 6 F 4 2 0 ICK PGA 19 x 19 x 12 WLF ... 47 x 47 0 art. no. 10 Rth 2 3 4 5 6 v [m/s] G 14 [K/W] 12 10 50 8 2,5 50 1 6 4 H 2 0 ICK PGA 20 x 20 x 10 WLF ... 48 x 48 0 16,51 art. no. 50,8 4 50,8 Rth 1 2 3 4 5 6 v [m/s] 14 I [K/W] 12 10 8 6 4 2 0 ICK PGA 20 x 20 WLF ... 50 x 50 1 0 2 3 4 5 6 v [m/s] K L M Mounts Heatsinks for PLCC Thermal conductive paste Thermal conductive glue E 44 - 48 B 52 E 21 - 24 E 23 - 24 Pin heatsinks for IC SMD-heatsinks Heatsinks for PGA Technical introduction B 21 - 27 B 53 - 54 B 11 - 16 A2-8 B 14 N A Heatsinks for PGA 16,51 art. no. B 50,8 Rth 14 [K/W] 12 4 50,8 10 8 6 4 C 2 0 0 2 3 4 5 6 v [m/s] with fixing clamp for socket 7 and socket 370 art. no. 8 D ICK PGA 20 x 20 K WLF ... 50 x 50 1 Rth 14 [K/W] 12 50,8 3 50,8 10 8 E 6 4 2 0 ICK PGA 20 x 20 x 8 WLF ... 50 x 50 F 0 1 2 3 4 5 6 v [m/s] 0 1 2 3 4 5 6 v [m/s] 0 1 2 3 4 5 art. no. Rth 14 [K/W] 12 51 10 3,5 12,3 51 8 G 6 4 2 0 ICK PGA 20 x 20 x 12 WLF ... 50 x 50 art. no. 16,5 H Rth 10 53,3 5 53,3 14 [K/W] 12 8 6 I 4 2 0 ICK PGA 21 x 21 WLF ... 53 x 53 art. no. 20 K 6 v [m/s] 14 [K/W] 12 10 54 4 54 Rth 8 6 L 4 2 0 ICK PGA 22 x 22 WLF ... 54 x 54 0 1 2 3 4 5 6 v [m/s] M N B 15 Mounts Heatsinks for PLCC Thermal conductive paste Thermal conductive glue E 44 - 48 B 52 E 21 - 24 E 23 - 24 Pin heatsinks for IC SMD-heatsinks Heatsinks for PGA Technical introduction B 21 - 27 B 53 - 54 B 11 - 16 A2-8 A Heatsinks for PGA 20 art. no. Rth B 14 [K/W] 12 62,5 3,5 62,5 10 8 6 4 C 2 0 0 ICK PGA 25 x 25 WLF ... 62 x 62 1 2 3 4 5 6 v [m/s] D E F G H I K L M Mounts Heatsinks for PLCC Thermal conductive paste Thermal conductive glue E 44 - 48 B 52 E 21 - 24 E 23 - 24 Pin heatsinks for IC SMD-heatsinks Heatsinks for PGA Technical introduction B 21 - 27 B 53 - 54 B 11 - 16 A2-8 B 16 N A Heatsinks for BGAs B C D - - - - - particularly suited for Ball Grid Arrays heatsink dimensions match the respective BGA-type can be glued directly on the BGA component double-sided adhesive thermal conductive foil WLF ... E 7 surface: black anodised art. no. 6 Rth 35 [K/W] 30 25 20 10 10 15 1,8 E 10 5 0 ICK BGA 10 x 10 WLF ... 10 x 10 1 2 3 4 5 6 v [m/s] art. no. 10 F 0 Rth 30 [K/W] 24 18 10 12 1,8 10 G 6 0 ICK BGA 10 x 10 x 10 WLF ... 10 x 10 0 1 2 3 4 5 6 v [m/s] art. no. Rth 35 [K/W] 30 6 H 14 20 15 1,8 14 25 10 I 5 0 ICK BGA 14 x 14 WLF ... 14 x 14 0 2 3 4 5 6 v [m/s] art. no. Rth 30 [K/W] 24 14 14 1,8 10 K L 1 18 12 6 0 ICK BGA 14 x 14 x 10 WLF ... 14 x 14 0 1 2 3 4 5 6 v [m/s] M N B 17 Mounts SMD-heatsinks Thermally conductive foil Thermal conductive paste E 44 - 48 B 53 - 55 E 5 - 15 E 21 - 22 Thermal conductive glue Hole pattern Processor overview Technical introduction E 23 - 24 A 21 B 2 - 10 A2-8 A Heatsinks for BGAs 6 art. no. 21 B 15 1,8 21 25 Rth [K/W] 20 10 5 0 ICK BGA 21 x 21 WLF ... 21 x 21 0 1 2 3 4 5 6 v [m/s] 6 art. no. 23 25 Rth [K/W] 20 15 1,8 23 C D 10 5 0 ICK BGA 23 x 23 WLF ... 23 x 23 0 1 2 3 4 5 6 v [m/s] 10 art. no. 23 E 12 1,8 23 24 Rth [K/W] 18 F 6 0 ICK BGA 23 x 23 x 10 WLF ... 23 x 23 0 1 2 3 4 5 6 v [m/s] 6 art. no. 27 G 15 1,8 27 Rth 25 [K/W] 20 10 5 0 ICK BGA 27 x 27 WLF ... 27 x 27 0 1 2 3 4 5 6 H v [m/s] 10 art. no. 27 I 12 1,8 27 20 Rth [K/W] 16 8 4 0 0 ICK BGA 27 x 27 x 10 WLF ... 27 x 27 1 2 3 4 5 6 v [m/s] 14 art. no. K Rth 14 [K/W] 12 10 27 8 2,5 27 L 6 4 2 0 ICK BGA 27 x 27 x 14 WLF ... 27 x 27 Mounts SMD-heatsinks Thermally conductive foil Thermal conductive paste 0 E 44 - 48 B 53 - 55 E 5 - 15 E 21 - 22 Thermal conductive glue Hole pattern Processor overview Technical introduction 1 2 E 23 - 24 A 21 B 2 - 10 A2-8 3 4 5 6 v [m/s] B 18 M N A Heatsinks for BGAs art. no. 22 B 14 Rth [K/W] 12 10 8 27 6 3,5 27 4 C 2 0 ICK BGA 27 x 27 x 22 WLF ... 27 x 27 6 art. no. 31 31 1 2 3 4 5 6 v [m/s] 0 1 2 3 4 5 20 Rth [K/W] 16 12 1,8 D 0 8 4 E 0 ICK BGA 31 x 31 WLF ... 31 x 31 10 art. no. 31 31 20 Rth [K/W] 16 12 1,8 F 6 v [m/s] 8 4 0 G 0 ICK BGA 31 x 31 x 10 WLF ... 31 x 31 1 2 3 4 5 6 v [m/s] 6 art. no. H 12 1,8 35 35 20 Rth [K/W] 16 8 4 0 ICK BGA 35 x 35 WLF ... 35 x 35 1 2 3 4 5 6 v [m/s] art. no. 10 I 0 35 12 1,8 35 20 Rth [K/W] 16 8 K 4 0 ICK BGA 35 x 35 x 10 WLF ... 35 x 35 0 1 2 3 4 5 6 v [m/s] art. no. 37 37 1,8 6 L 20 Rth [K/W] 16 12 8 4 M N 0 ICK BGA 37 x 37 x 6 WLF ... 37 x 37 B 19 Mounts SMD-heatsinks Thermally conductive foil Thermal conductive paste 0 1 2 3 4 5 6 v [m/s] E 44 - 48 B 53 - 55 E 5 - 15 E 21 - 22 Thermal conductive glue Hole pattern Processor overview Technical introduction E 23 - 24 A 21 B 2 - 10 A2-8 A Heatsinks for BGAs art. no. 10 Rth 14 [K/W] 12 37 B 10 8 1,8 37 6 4 2 0 ICK BGA 37 x 37 x 10 WLF ... 37 x 37 0 6 art. no. 40 1,8 40 1 2 3 4 5 6 v [m/s] C 20 Rth [K/W] 16 D 12 8 4 0 ICK BGA 40 x 40 WLF ... 40 x 40 0 1 2 3 4 5 6 v [m/s] 10 art. no. 40 20 Rth [K/W] 16 12 1,8 40 E F 8 4 0 0 ICK BGA 40 x 40 x 10 WLF ... 40 x 40 1 2 3 4 5 6 v [m/s] 6 art. no. 45 1,8 42,5 Rth 15 [K/W] 12 G 9 6 H 3 0 0 ICK BGA 42,5 x 45 WLF ... 42,5 x 45 1 2 3 4 5 6 v [m/s] I K L M Mounts SMD-heatsinks Thermally conductive foil Thermal conductive paste E 44 - 48 B 53 - 55 E 5 - 15 E 21 - 22 Thermal conductive glue Hole pattern Processor overview Technical introduction E 23 - 24 A 21 B 2 - 10 A2-8 B 20 N A Pin heatsinks B C D E F - - - - - - - - - arrangement and number of pins for optimum air flow suitable for forced and free convection excellent thermal conductivity by the alloy material (Al99,5; 220 W/mK) and homogeneous arrangement of materials constant heat dissipation in the base and the pins in the direction of heat flow low weight achieved by optimised geometry components fastened using glue, adhesive foil or clamps customer-specific modifications and special designs other pin-lengths and surfaces on request surface: Al-natural art. no. G 6,5 2 30 Rth [K/W] 25 20 15 10 10 10 art. no. 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 2 20 15 10 10 I 10 5 ICK S 10 x 10 x 10 WLF ... 10 x 10 weight: 1g 12,5 art. no. 2 K 0 30 Rth [K/W] 25 10 H 5 ICK S 10 x 10 x 6,5 WLF ... 10 x 10 weight: 1g 10 10 30 Rth [K/W] 25 20 15 10 L 5 ICK S 10 x 10 x 12,5 WLF ... 10 x 10 weight: 1.3g M N B 21 Processor overview Mounts SMD-heatsinks Thermally conductive foil B 2 - 10 E 44 - 48 B 53 - 55 E 5 - 15 Thermal conductive paste Thermal conductive glue Heatsinks for LEDs Technical introduction E 21 - 22 E 23 - 24 B 35 - 48 A2-8 A Pin heatsinks 18,5 art. no. B 20 15 2 10 30 Rth [K/W] 25 10 10 5 ICK S 10 x 10 x 18,5 WLF ... 10 x 10 weight: 1.3g 0 1 2 3 4 5 v [m/s] C 6,5 art. no. D 8 14 6 2 14 12 Rth [K/W] 10 4 2 ICK S 14 x 14 x 6,5 WLF ... 14 x 14 weight: 1.5g 0 0 1 2 3 4 5 v [m/s] E 10 art. no. 8 14 6 2 14 12 Rth [K/W] 10 F 4 2 ICK S 14 x 14 x 10 WLF ... 14 x 14 weight: 1.9g 0 0 1 2 3 4 5 v [m/s] 12,5 art. no. 8 14 6 2 14 G 12 Rth [K/W] 10 4 H 2 ICK S 14 x 14 x 12,5 WLF ... 14 x 14 weight: 2g 0 0 1 2 3 4 5 v [m/s] 18,5 art. no. 12 Rth [K/W] 10 I 8 6 14 2 14 4 2 ICK S 14 x 14 x 18,5 WLF ... 14 x 14 weight: 2.4g 0 0 1 2 3 4 5 K v [m/s] 3,5 15 art. no. 12 Rth [K/W] 10 L 8 17,3 17,3 6 4 2 ICK S 17 x 17 x 15 WLF ... 17 x 17 weight: 4.7g Processor overview Mounts SMD-heatsinks Thermally conductive foil 0 0 B 2 - 10 E 44 - 48 B 53 - 55 E 5 - 15 Thermal conductive paste Thermal conductive glue Heatsinks for LEDs Technical introduction 1 2 E 21 - 22 E 23 - 24 B 35 - 48 A2-8 3 4 5 v [m/s] B 22 M N A Pin heatsinks art. no. 3,5 20 B 12 Rth [K/W] 10 8 6 17,3 17,3 4 2 C ICK S 17 x 17 x 20 WLF ... 17 x 17 weight: 5.6g 0 0 1 2 3 4 5 v [m/s] 6,5 art. no. D 8 18 6 2 18 12 Rth [K/W] 10 4 E 2 ICK S 18 x 18 x 6,5 WLF ... 18 x 18 weight: 2.5g 0 0 1 2 3 4 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 5 v [m/s] 10 art. no. 18 8 18 6 2 F 12 Rth [K/W] 10 4 2 ICK S 18 x 18 x 10 WLF ... 18 x 18 weight: 3.1g art. no. 10 G 0 8 22 6 2 22 12 Rth [K/W] 10 H 4 2 ICK S 22 x 22 x 10 WLF ... 22 x 22 weight: 4g 0 art. no. 6 18,5 I K 4 2 1 ICK S 22 x 22 x 18,5 WLF ... 22 x 22 weight: 5.4g 25 25 2 6,5 art. no. L 5 3 22 2 22 Rth [K/W] Rth [K/W] 6 5 4 3 2 M N 1 ICK S 25 x 25 x 6,5 WLF ... 25 x 25 weight: 4g B 23 Processor overview Mounts SMD-heatsinks Thermally conductive foil B 2 - 10 E 44 - 48 B 53 - 55 E 5 - 15 Thermal conductive paste Thermal conductive glue Heatsinks for LEDs Technical introduction E 21 - 22 E 23 - 24 B 35 - 48 A2-8 A Pin heatsinks 12,5 art. no. 25 6 B 5 4 2 25 Rth [K/W] 3 2 1 ICK S 25 x 25 x 12,5 WLF ... 25 x 25 weight: 6g 0 18,5 art. no. 2 3 4 5 v [m/s] C 6 5 D 4 3 2 25 25 Rth [K/W] 1 2 1 ICK S 25 x 25 x 18,5 WLF ... 25 x 25 weight: 7g 0 10 art. no. 29 2 3 4 5 v [m/s] E 6 5 4 3,5 29 Rth [K/W] 1 3 F 2 1 ICK S 29 x 29 x 10 WLF ... 29 x 29 weight: 11g 0 20 art. no. Rth [K/W] 1 2 3 4 5 v [m/s] G 6 5 4 29 3 3,5 29 2 H 1 ICK S 29 x 29 x 20 WLF ... 29 x 29 weight: 15g 0 30 art. no. Rth [K/W] 1 2 3 4 5 v [m/s] 6 I 5 4 29 3 3,5 29 2 1 ICK S 29 x 29 x 30 WLF ... 29 x 29 weight: 15.4g 0 10 art. no. 32,7 2 3 4 5 v [m/s] K 6 5 4 3,5 32,7 Rth [K/W] 1 L 3 2 1 ICK S 32 x 32 x 10 WLF ... 32 x 32 weight: 14g Processor overview Mounts SMD-heatsinks Thermally conductive foil 0 B 2 - 10 E 44 - 48 B 53 - 55 E 5 - 15 Thermal conductive paste Thermal conductive glue Heatsinks for LEDs Technical introduction 1 2 E 21 - 22 E 23 - 24 B 35 - 48 A2-8 3 4 5 v [m/s] B 24 M N A Pin heatsinks art. no. Rth [K/W] 20 B C 3 3,5 2 1 ICK S 32 x 32 x 20 WLF ... 32 x 32 weight: 19g 10 art. no. 36,4 36,4 Rth [K/W] 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 6 5 4 3,5 D 5 4 32,7 32,7 6 3 2 E 1 ICK S 36 x 36 x 10 WLF ... 36 x 36 weight: 17g 15 art. no. F 5 3 2 1 ICK S 36 x 36 x 15 WLF ... 36 x 36 weight: 20g art. no. 20 G 6 4 3,5 36,4 36,4 Rth [K/W] Rth [K/W] 6 5 4 H 36,4 3 3,5 36,4 2 1 ICK S 36 x 36 x 20 WLF ... 36 x 36 weight: 24g art. no. 30 I Rth [K/W] 6 5 4 K 36,4 3 3,5 36,4 2 1 ICK S 36 x 36 x 30 WLF ... 36 x 36 weight: 24.4g 40 40 L 3,5 10 art. no. Rth [K/W] 6 5 4 3 2 M N 1 ICK S 40 x 40 x 10 WLF ... 40 x 40 weight: 21g B 25 Processor overview Mounts SMD-heatsinks Thermally conductive foil B 2 - 10 E 44 - 48 B 53 - 55 E 5 - 15 Thermal conductive paste Thermal conductive glue Heatsinks for LEDs Technical introduction 5 v [m/s] E 21 - 22 E 23 - 24 B 35 - 48 A2-8 A Pin heatsinks 20 art. no. Rth [K/W] 6 B 5 4 40 3 3,5 40 2 1 ICK S 40 x 40 x 20 WLF ... 40 x 40 weight: 29g 0 25 art. no. Rth [K/W] 1 2 3 4 5 v [m/s] 6 5 D 4 40 3 3,5 40 C 2 1 ICK S 40 x 40 x 25 WLF ... 40 x 40 weight: 37g 0 10 art. no. 45 2 3 4 5 v [m/s] E 6 5 4 3,5 45 Rth [K/W] 1 3 F 2 1 ICK S 45 x 45 x 10 WLF ... 45 x 45 weight: 26g 0 20 art. no. Rth [K/W] 1 2 3 4 5 v [m/s] G 6 5 4 45 3 3,5 45 2 H 1 ICK S 45 x 45 x 20 WLF ... 45 x 45 weight: 36g 0 20 art. no. Rth [K/W] 1 2 3 4 5 v [m/s] 6 I 5 50 50 3,5 4 3 2 1 ICK S 50 x 50 x 20 WLF ... 50 x 50 weight: 43g 0 25 art. no. Rth [K/W] 1 2 3 4 5 v [m/s] 6 5 L 50 3,5 4 50 K 3 2 1 ICK S 50 x 50 x 25 WLF ... 50 x 50 weight: 49g Processor overview Mounts SMD-heatsinks Thermally conductive foil 0 B 2 - 10 E 44 - 48 B 53 - 55 E 5 - 15 Thermal conductive paste Thermal conductive glue Heatsinks for LEDs Technical introduction 1 2 E 21 - 22 E 23 - 24 B 35 - 48 A2-8 3 4 5 v [m/s] B 26 M N A Pin heatsinks art. no. 40 B 5 3,5 3 2 1 ICK S 50 x 50 x 40 WLF ... 50 x 50 weight: 80.05g 0 Rth [K/W] 50 D 1 2 3 4 5 v [m/s] art. no. E 6 4 50 50 C Rth [K/W] 6 5 4 50 3 3,5 50 2 1 ICK S 50 x 50 x 50 WLF ... 50 x 50 weight: 95.51g 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 30 art. no. Rth [K/W] 6 5 4 F 98 3 5 98 2 1 0 G ICK S 98 x 98 x 30 WLF ... 98 x 98 weight: nullg 5 v [m/s] 45 art. no. Rth [K/W] 6 5 98 98 5 4 H 3 2 1 0 I 0 ICK S 98 x 98 x 45 WLF ... 98 x 98 weight: 301.3g 1 2 3 4 5 v [m/s] K L M N B 27 Processor overview Mounts SMD-heatsinks Thermally conductive foil B 2 - 10 E 44 - 48 B 53 - 55 E 5 - 15 Thermal conductive paste Thermal conductive glue Heatsinks for LEDs Technical introduction E 21 - 22 E 23 - 24 B 35 - 48 A2-8 A Pin heatsinks Dome B art. no. 7,5 12 Rth [K/W] 10 8 12 6 2,5 12 4 C 2 ICK S D 12 x 12 x 7,5 WLF ... 12 x 12 weight: 1.8g 0 0 1 2 3 4 5 v [m/s] art. no. 7,5 12 Rth [K/W] 10 12 6 2,5 18 D 8 4 2 ICK S D 18 x 12 x 7,5 WLF ... 12 x 18 weight: 2.7g 0 0 1 2 3 4 5 E v [m/s] art. no. 7,5 12 Rth [K/W] 10 24 8 2,5 18 F 6 4 2 0 ICK S D 24 x 18 x 7,5 WLF ... 18 x 24 weight: 4.4g 0 art. no. 98 2 3 4 5 v [m/s] G 12 Rth [K/W] 10 5 10 98 1 8 6 H 4 2 0 0 ICK S D 98 x 98 x 10 WLF ... 98 x 98 weight: 154g 1 2 3 4 5 v [m/s] I K L M Processor overview Mounts SMD-heatsinks Thermally conductive foil B 2 - 10 E 44 - 48 B 53 - 55 E 5 - 15 Thermal conductive paste Thermal conductive glue Heatsinks for LEDs Technical introduction E 21 - 22 E 23 - 24 B 35 - 48 A2-8 B 28 N A Pin heatsinks Round art. no. Rth [K/W] O 28,5 6 5 4 2 6,5 B 3 2 C ICK S R 28,5 x 6,5 WLF ... D 28,5 weight: 4.41g 1 0 10 art. no. 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 6 5 4 2 D O 28,5 Rth [K/W] 0 3 2 E 1 ICK S R 28,5 x 10 WLF ... D 28,5 weight: 5.16g 0 art. no. Rth [K/W] F 3 2 1 ICK S R 28,5 x 12,5 WLF ... D 28,5 weight: 5.7g 0 18,5 art. no. O 28,5 Rth [K/W] 6 5 4 2 G 5 4 2 12,5 O 28,5 6 3 2 H 1 ICK S R 28,5 x 18,5 WLF ... D 28,5 weight: 6.98g 0 art. no. 10 I 6 5 4 3 O 32,5 Rth [K/W] 3 2 K ICK S R 32,5 x 10 WLF ... D 32 weight: 9.7g 1 0 20 art. no. Rth [K/W] 6 5 O 32,5 3 4 L 3 2 1 M N ICK S R 32,5 x 20 WLF ... D 32 weight: 13.8g B 29 Thermal conductive glue Thermal conductive paste SMD-heatsinks Processor overview 0 E 23 - 24 E 21 - 22 B 53 - 55 B2-8 Mounting material for semiconduct. Thermally conductive foil Heatsinks for LEDs Technical introduction E 44 - 48 E 5 - 15 B 35 - 51 A2-8 A Pin heatsinks 30 art. no. B 6 5 4 3 2 3,5 O 32,5 Rth [K/W] 1 ICK S R 32,5 x 30 WLF ... D 32 weight: 20.6g 0 0 1 2 3 4 5 v [m/s] C 40 art. no. Rth [K/W] 6 D 5 4 3 2 3,5 O 32,5 1 ICK S R 32,5 x 40 WLF ... D 32 weight: 24.61g 0 0 1 2 3 4 5 v [m/s] E 50 art. no. Rth [K/W] 6 F 5 4 3 ICK S R 32,5 x 50 WLF ... D 32 weight: 28.62g 2 1 3,5 O 32,5 0 0 20 art. no. Rth [K/W] 1 2 3 4 5 v [m/s] 7 6 5 O 36,5 H 3,5 4 3 2 ICK S R 36,5 x 20 WLF ... D 36,5 weight: 17.59g 1 0 1 2 3 4 5 v [m/s] I 10 art. no. 12 Rth [K/W] 10 8 3,5 O 40 6 K 4 2 ICK S R 40 x 10 WLF ... D 40 weight: 15.85g 0 0 20 art. no. 1 2 3 4 5 v [m/s] 12 Rth [K/W] 10 L 8 3,5 O 40 6 4 ICK S R 40 x 20 WLF ... D 40 weight: 21.96g Thermal conductive glue Thermal conductive paste SMD-heatsinks Processor overview G 2 0 0 E 23 - 24 E 21 - 22 B 53 - 55 B2-8 Mounting material for semiconduct. Thermally conductive foil Heatsinks for LEDs Technical introduction 1 2 3 E 44 - 48 E 5 - 15 B 35 - 51 A2-8 4 5 v [m/s] B 30 M N A Pin heatsinks 20 art. no. B 6 4 ICK S R A 40 x 20 WLF ... D 40 weight: 22.18g 2 0 art. no. 30 C 8 3,5 O 40 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 12 Rth [K/W] 10 8 6 3,5 O 40 D 12 Rth [K/W] 10 4 ICK S R 40 x 30 WLF ... D 40 weight: 29.24g 2 0 art. no. 50 E F 8 6 3,5 O 40 12 Rth [K/W] 10 4 ICK S R 40 x 50 WLF ... D 40 weight: 47.96g 2 0 30 art. no. 8 6 3,5 O 45 G 12 Rth [K/W] 10 4 ICK S R 45 x 30 WLF ... D 45 weight: 37.78g 0 Rth [K/W] art. no. 45 H 2 8 7 6 5 I 4 3,5 O 45 3 2 ICK S R 45 x 45 WLF ... D 45 weight: 50.67g 1 0 O 50 K 3 10 art. no. Rth [K/W] 6 5 4 3 2 ICK S R 50 x 10 WLF ... D 50 weight: 22g 1 0 L M N B 31 Thermal conductive glue Thermal conductive paste SMD-heatsinks Processor overview E 23 - 24 E 21 - 22 B 53 - 55 B2-8 Mounting material for semiconduct. Thermally conductive foil Heatsinks for LEDs Technical introduction E 44 - 48 E 5 - 15 B 35 - 51 A2-8 A Pin heatsinks Rth [K/W] 20 art. no. 9 8 B 6 5 3,5 O 50 4 3 ICK S R 50 x 20 WLF ... D 50 weight: 34.39g 2 C 1 0 30 art. no. 1 2 3 4 5 v [m/s] 9 8 6 D 5 3,5 O 50 Rth [K/W] 0 4 3 2 ICK S R 50 x 30 WLF ... D 50 weight: 45.28g 1 0 45 art. no. Rth [K/W] 0 1 2 3 4 5 v [m/s] E 8 7 6 5 4 3,5 O 50 F 3 2 ICK S R 50 x 45 WLF ... D 50 weight: 61.59g 1 0 art. no. 20 Rth [K/W] 1 2 3 4 5 v [m/s] G 7 6 5 3,5 O 54 0 8 4 3 H 2 ICK S R 54 x 20 WLF ... D 54 weight: 40.94g 1 0 0 30 art. no. Rth [K/W] 1 2 3 4 5 v [m/s] 8 7 I 6 5 3,5 O 54 4 3 2 ICK S R 54 x 30 WLF ... D 54 weight: 54.11g 1 0 0 1 2 3 4 5 v [m/s] K L M Thermal conductive glue Thermal conductive paste SMD-heatsinks Processor overview E 23 - 24 E 21 - 22 B 53 - 55 B2-8 Mounting material for semiconduct. Thermally conductive foil Heatsinks for LEDs Technical introduction E 44 - 48 E 5 - 15 B 35 - 51 A2-8 B 32 N A Pin heatsinks art. no. 45 B Rth [K/W] C 3 2 1 ICK S R 54 x 45 WLF ... D 54 weight: 73.86g 0 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] 0 1 2 3 4 5 v [m/s] art. no. 30 D 5 4 3,5 O 54 6 5 O 70 Rth [K/W] 6 5 4 3 E 2 ICK S R 70 x 30 WLF ... D 70 weight: 92.8g 1 0 art. no. 50 F Rth [K/W] 5 O 70 6 5 4 3 G 2 ICK S R 70 x 50 WLF ... D 70 weight: 135.56g 1 0 art. no. 30 H Rth [K/W] 5 O 85 6 5 4 3 I 2 ICK S R 85 x 30 WLF ... D 85 weight: nullg 1 0 art. no. 45 K 5 O 85 Rth [K/W] 6 5 4 L 3 2 ICK S R 85 x 45 WLF ... D 85 weight: nullg 1 0 M N B 33 Thermal conductive glue Thermal conductive paste SMD-heatsinks Processor overview E 23 - 24 E 21 - 22 B 53 - 55 B2-8 Mounting material for semiconduct. Thermally conductive foil Heatsinks for LEDs Technical introduction E 44 - 48 E 5 - 15 B 35 - 51 A2-8 A Pin heatsinks art. no. 30 B Rth [K/W] 5 O 98 6 5 4 3 C 2 ICK S R 98 x 30 WLF ... D 98 weight: nullg 1 0 0 1 2 3 4 5 v [m/s] art. no. 50 D 5 O 98 Rth [K/W] 6 5 4 3 E 2 ICK S R 98 x 50 WLF ... D 98 weight: 194.23g 1 0 0 1 2 3 4 5 v [m/s] F G H I K L M Thermal conductive glue Thermal conductive paste SMD-heatsinks Processor overview E 23 - 24 E 21 - 22 B 53 - 55 B2-8 Mounting material for semiconduct. Thermally conductive foil Heatsinks for LEDs Technical introduction E 44 - 48 E 5 - 15 B 35 - 51 A2-8 B 34 N A Heatsinks for LEDs B C D - - - - - - - suitable for free or forced convection heat sink dimensions are fitted to the respective LED typ simple mounting by using thermally conductive adhesive foil, glue or screw mounting specific versions on customers request double-sided adhesive thermal conductive foil WLF ... E 7 special design, surfaces and modification to customer specification on request surface: black anodised E 14 art. no. F Rth = 18,58 K/W 2,5 O 23,5 ICK LED R 23,5 x 14 WLF ... D 23 14 art. no. G 12 8 2,5 O 23,5 4 ICK LED R 23,5 x 14 G WLF ... D 23 0 0 1 2 3 4 5 6 v [m/s] 3 4 5 6 v [m/s] art. no. 10 H Rth = 17,69 K/W 3 O 27 ICK LED R 27 x 10 WLF ... D 27 20 Rth [K/W] 16 art. no. 10 I 20 Rth [K/W] 16 12 O 27 3 8 4 K 0 ICK LED R 27 x 10 G WLF ... D 27 0 1 2 L O 27,95 3,5 15,24 art. no. Rth = 15,24 K/W ICK LED R 28 x 15 WLF ... D 28 M N B 35 Pin heatsinks O Mounts Thermally conductive foil Thermal conductive paste B 29 - 33 E 44 - 48 E 5 - 15 E 21 - 22 Thermal conductive glue Hole pattern Heatsink profile-overview Technical introduction E 23 - 24 A 21 A 13 - 17 A2-8 A Heatsinks for LEDs art. no. 20 Rth [K/W] 16 B 12 3,5 15,24 O 27,95 ICK LED R 28 x 15 G WLF ... D 28 8 4 0 0 1 2 3 4 5 6 v [m/s] 3,5 O 29 11,5 art. no. C Rth = 17,26 K/W ICK LED R 29 x 11,5 WLF ... D 29 D art. no. Rth 20 [K/W] 16 3,5 12 11,5 O 29 8 E 4 0 ICK LED R 29 x 11,5 G WLF ... D 29 0 1 2 3 4 5 6 v [m/s] art. no. 14 F Rth = 15,23 K/W 2,5 O 32 ICK LED R 32 x 14 WLF ... D 32 G 14 art. no. 12 8 2,5 O 32 Rth 20 [K/W] 16 4 H 0 ICK LED R 32 x 14 G WLF ... D 32 0 1 2 3 4 5 6 v [m/s] 10 art. no. O 33 I 3 Rth = 17,6 K/W ICK LED R 33 x 10 WLF ... D 33 10 art. no. K Rth 20 [K/W] 16 12 3 O 33 8 4 0 ICK LED R 33 x 10 G WLF ... D 33 0 1 2 3 4 5 6 v [m/s] L M Pin heatsinks O Mounts Thermally conductive foil Thermal conductive paste B 29 - 33 E 44 - 48 E 5 - 15 E 21 - 22 Thermal conductive glue Hole pattern Heatsink profile-overview Technical introduction E 23 - 24 A 21 A 13 - 17 A2-8 B 36 N A Heatsinks for LEDs 16,5 art. no. O 33 C Rth = 13,87 K/W 3,5 B ICK LED R 33 x 16,5 WLF ... D 33 16,5 art. no. D 12 3,5 O 33 20 Rth [K/W] 16 8 4 0 ICK LED R 33 x 16,5 G WLF ... D 33 0 1 2 3 4 5 6 v [m/s] 3 4 5 6 v [m/s] 3 4 5 6 v [m/s] art. no. 10 E ICK LED R 35 x 10 WLF ... D 35 art. no. 10 F Rth = 16,9 K/W 2,5 O 35 12 2,5 O 35 20 Rth [K/W] 16 8 4 G 0 ICK LED R 35 x 10 G WLF ... D 35 0 2 12,3 art. no. 1 O 36 Rth = 12,88 K/W 3,5 H ICK LED R 36 x 12 WLF ... D 36 art. no. 12,3 I 12 3,5 O 36 Rth 20 [K/W] 16 8 4 K 0 0 ICK LED R 36 x 12 G WLF ... D 36 1 2 O 40 L 2,5 10 art. no. Rth = 12,28 K/W ICK LED R 40 x 10 WLF ... D 40 M N B 37 Pin heatsinks O Mounts Thermally conductive foil Thermal conductive paste B 29 - 33 E 44 - 48 E 5 - 15 E 21 - 22 Thermal conductive glue Hole pattern Heatsink profile-overview Technical introduction E 23 - 24 A 21 A 13 - 17 A2-8 A Heatsinks for LEDs 10 art. no. B 12 2,5 O 40 20 Rth [K/W] 16 8 4 0 ICK LED R 40 x 10 G WLF ... D 40 0 1 2 3 4 5 6 v [m/s] C 27 art. no. Rth = 9,41 K/W 5 O 40 D ICK LED R 40 x 27 WLF ... D 40 27 art. no. Rth 12 [K/W] 10 E 8 O 40 5 6 4 2 0 ICK LED R 40 x 27 G WLF ... D 40 0 1 2 3 4 5 6 v [m/s] F 16,51 art. no. G Rth = 10,46 K/W 4 O 45,7 ICK LED R 45,7 x 16,5 WLF ... D 45 H 16,51 art. no. 8 6 4 O 45,7 Rth 12 [K/W] 10 4 I 2 0 ICK LED R 45,7 x 16,5 G WLF ... D 45 0 1 2 3 4 5 6 v [m/s] art. no. 10 K 2,5 O 50 Rth = 10,57 K/W L ICK LED R 50 x 10 WLF ... D 50 M Pin heatsinks O Mounts Thermally conductive foil Thermal conductive paste B 29 - 33 E 44 - 48 E 5 - 15 E 21 - 22 Thermal conductive glue Hole pattern Heatsink profile-overview Technical introduction E 23 - 24 A 21 A 13 - 17 A2-8 B 38 N A Heatsinks for LEDs art. no. 10 12 Rth [K/W] 10 B 8 2,5 O 50 6 4 2 C 0 ICK LED R 50 x 10 G WLF ... D 50 0 1 2 3 4 5 6 v [m/s] 3 4 5 6 v [m/s] 3 4 5 6 v [m/s] 16,51 art. no. O 50,8 4 D Rth = 10,17 K/W ICK LED R 50,8 x 16,5 WLF ... D 50 E 16,51 art. no. O 50,8 Rth 12 [K/W] 10 4 8 6 4 F 2 0 ICK LED R 50,8 x 16,5 G WLF ... D 50 0 1 2 art. no. O 54 4 20 G Rth = 9,48 K/W H ICK LED R 54 x 20 WLF ... D 54 art. no. 4 20 I O 54 Rth 12 [K/W] 10 8 6 4 2 K 0 ICK LED R 54 x 20 G WLF ... D 54 0 1 2 40 art. no. 10 L O 66 M N Rth = 3,2 K/W ICK LED R 66 x 40 WLF ... D 66 B 39 Pin heatsinks O Mounts Thermally conductive foil Thermal conductive paste B 29 - 33 E 44 - 48 E 5 - 15 E 21 - 22 Thermal conductive glue Hole pattern Heatsink profile-overview Technical introduction E 23 - 24 A 21 A 13 - 17 A2-8 A Heatsinks for LEDs 10 art. no. B 2,5 O 75 Rth = 5,2 K/W C ICK LED R 75 x 10 WLF ... D 75 40 art. no. 10 D O 84 Rth = 2,5 K/W E ICK LED R 84 x 40 WLF ... D 84 art. no. 10 40 F O 100 Rth = 2 K/W G H ICK LED R 100 x 40 WLF ... D 100 40 art. no. I 10 O 160 Rth = 1,4 K/W K ICK LED R 160 x 40 WLF ... D 160 L M Pin heatsinks O Mounts Thermally conductive foil Thermal conductive paste B 29 - 33 E 44 - 48 E 5 - 15 E 21 - 22 Thermal conductive glue Hole pattern Heatsink profile-overview Technical introduction E 23 - 24 A 21 A 13 - 17 A2-8 B 40 N A Heatsinks for LEDs art. no. O 200 C D 10 40 B Rth = 1 K/W ICK LED R 200 x 40 WLF ... D 200 E F G H I K L M N B 41 Pin heatsinks O Mounts Thermally conductive foil Thermal conductive paste B 29 - 33 E 44 - 48 E 5 - 15 E 21 - 22 Thermal conductive glue Hole pattern Heatsink profile-overview Technical introduction E 23 - 24 A 21 A 13 - 17 A2-8 A Heatsinks for LEDs - special design, surfaces and modification to customer specification on request - up from a profile length of 25 mm: optional adapter plate LA LED 68 ... B 50 suitable for LED modules: Bridgelux Vero, Citizen CitiLED, Cree XLamp, Edison Edilex, GE Infusion, Luga Shop und Industrial, Lustrous Lustron, Megaman Teco, Osram PrevaLED und Soleriq, Philips Fortimo und Luxeon, Prolight Opto, Sharp Mega Zenigata, Toshiba E-Core, Tridonic Stark, Vexica Lumaera, Vossloh Schwabe art. no. Rth [K/W] 7,5 C 6,0 O12 O 13,6 B 4,5 3,0 1,5 O 20 SK 585 ... 50 art. no. 100 150 200 [mm] D Rth [K/W] 7,5 6,0 O 30 O 18 4,5 E 3,0 1,5 50 SK 620 ... art. no. 100 150 200 [mm] F Rth [K/W] 5 O 45 O 25 4 3 2 G 1 6,75 50 SK 618 ... please indicate: 100 150 200 [mm] ... 10 15 20 25 37.5 50 1000 mm surface: H black anodised art. no. Rth [K/W] 5 O 46 O 30 4 I 3 2 1 50 SK 619 ... art. no. 100 150 200 [mm] K Rth [K/W] 5 O 30 O 46 4 3 2 L 1 5,73 SK 598 ... please indicate: ... 10 15 20 25 37.5 50 1000 mm surface: Pin heatsinks O Hole pattern Special heatsink design Thermal conductive paste 50 100 150 200 [mm] ... adapter (optional) AD = adapter plate M black anodised B 29 - 33 A 21 A 137 - 138 E 21 - 22 Mounts Thermally conductive foil Thermal conductive glue Technical introduction E 44 - 48 E 5 - 15 E 23 - 24 A2-8 B 42 N A Heatsinks for LEDs Rth [K/W] 5 art. no. 4 O 30 O 50 B 3 2 1 C SK 602 ... 6,5 50 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] Rth [K/W] 2,5 art. no. D O 30 O 50 2,0 1,5 1,0 0,5 SK 577 ... 6,76 50 art. no. Rth [K/W] 2,5 E 51 O 26 2,0 1,5 1,0 0,5 F 51,5 SK 46 ... 50 art. no. Rth [K/W] 2,5 O 30 O 60 G 2,0 1,5 1,0 0,5 H 50 5,73 SK 578 ... art. no. I O 40 O 60 Rth [K/W] 2,5 2,0 1,5 1,0 0,5 K 8,1 SK 569 ... please indicate: 50 ... 10 15 20 25 37.5 50 1000 mm surface: ... adapter (optional) AD = adapter plate black anodised L M N B 43 Pin heatsinks O Hole pattern Special heatsink design Thermal conductive paste B 29 - 33 A 21 A 137 - 138 E 21 - 22 Mounts Thermally conductive foil Thermal conductive glue Technical introduction E 44 - 48 E 5 - 15 E 23 - 24 A2-8 A Heatsinks for LEDs art. no. B Rth [K/W] 2,5 O 70 O 50 2,0 1,5 1,0 C 0,5 50 100 150 200 [mm] 9,1 SK 570 ... art. no. D Rth [K/W] 2,5 O 35 O 70 2,0 1,5 1,0 E 0,5 SK 571 ... 50 100 150 200 [mm] art. no. O 50 O 85 Rth 2,5 F [K/W] 2,0 1,5 1,0 G 0,5 50 SK 572 ... please indicate: ... 150 200 [mm] ... adapter (optional) AD = adapter plate 10 15 20 25 37.5 50 1000 mm surface: 100 H black anodised art. no. I Rth [K/W] 2,5 O 70 O 105 2,0 1,5 1,0 K 0,5 50 100 150 200 [mm] L SK 584 ... please indicate: ... 10 15 20 25 37.5 50 1000 mm surface: black anodised M Pin heatsinks O Hole pattern Special heatsink design Thermal conductive paste B 29 - 33 A 21 A 137 - 138 E 21 - 22 Mounts Thermally conductive foil Thermal conductive glue Technical introduction E 44 - 48 E 5 - 15 E 23 - 24 A2-8 B 44 N A Heatsinks for LEDs art. no. B Rth [K/W] 2,5 C 1,5 O 60 O 120 2,0 1,0 0,5 50 100 150 200 [mm] 100 150 200 [mm] 100 150 200 [mm] D SK 615 ... art. no. E Rth [K/W] 2,5 F 1,5 O 65 O 120 2,0 1,0 0,5 50 G 10 SK 599 ... art. no. H Rth [K/W] 2,5 O 85 O 145 I 2,0 1,5 1,0 0,5 K 50 SK 592 ... please indicate: ... 10 15 20 25 37.5 50 75 100 150 1000 mm L surface: black anodised M N B 45 Pin heatsinks O Hole pattern Special heatsink design Thermal conductive paste B 29 - 33 A 21 A 137 - 138 E 21 - 22 Mounts Thermally conductive foil Thermal conductive glue Technical introduction E 44 - 48 E 5 - 15 E 23 - 24 A2-8 A Heatsinks for LEDs art. no. B O 80 O 178 Rth [K/W] 2,5 C 2,0 1,5 1,0 0,5 50 100 150 200 [mm] D SK 590 ... please indicate: E ... 10 15 20 25 37.5 50 75 100 150 1000 mm surface: black anodised F G H I K L M Pin heatsinks O Hole pattern Special heatsink design Thermal conductive paste B 29 - 33 A 21 A 137 - 138 E 21 - 22 Mounts Thermally conductive foil Thermal conductive glue Technical introduction E 44 - 48 E 5 - 15 E 23 - 24 A2-8 B 46 N A LED fin cooler KTE R customised B C D E - - - - - individual LED heatsinks acc. to customer's requests adaptable to all common LED modules and sizes integration possibility of reflectors or fans by using special sheet metal design entry core for heat dissipation made of copper upon request other dimensions, sheet metal geometries, surfaces and mechanical machinings upon request G F H KTE R D OB G OC O A H F possible dimensions: I K dim. [mm] A B + 20 to 200 B C 35 30 40 35 55 50 80 75 90 85 100 95 E max. number of grooves at D = 0.8 mm D 0.8 1 1.5 2 E 32 36 50 72 84 92 F max. 400 G max. 800 H max. 200 E F G H please indicate with your order: L dim. [mm] A please indicate: M N material: B 47 B C D ... surface SA = black anodised ME = clear anodised aluminium Pin heatsinks O Hole pattern Special heatsink design Thermal conductive paste B 29 - 33 A 21 A 137 - 138 E 21 - 22 Mounts Thermally conductive foil Processor overview Technical introduction E 44 - 48 E 5 - 15 B 2 - 10 A2-8 A Heatsinks for LEDs - heatsink specially made for flexible and fixed LED Line Modules - insertion possibility of metal sheets and sheets of Plexiglas - customer specified designs, lengths and treatments upon request 1,2 R th [K/W ] C 10 8,7 5 1,8 2 17 B 24,8 20,8 18,4 16 7 2,2 art. no. 8 6 4 50 18 36 SK LED 1 100 150 200 [mm] D art. no. 35 , 33 6 ,2 32 30 , 2 , 26 8 ,2 E R th [K/W ] 8 ,8 17 10 34,4 ,6 6 4 F 2 50 30 100 150 200 [mm] 53,9 SK LED 2 G art. no. 57,2 42,55 41,8 39,4 37 R th [K/W ] H 2,2 5,6 19,2 4 15,5 12,2 1,8 40 2,3 9,4 1,2 5 3 2 50 100 150 200 [mm] I 39 SK LED 3 please indicate: ... 50 75 100 150 1000 mm ... surface SA = black anodised ME = clear anodised K L M Pin heatsinks O Hole pattern Special heatsink design Thermal conductive paste B 29 - 33 A 21 A 137 - 138 E 21 - 22 Mounts Thermally conductive foil Processor overview Technical introduction E 44 - 48 E 5 - 15 B 2 - 10 A2-8 B 48 N A Active heat dissipation of LEDs O 40 31,4 30 3,5 10 B C O 40 art. no. Rth [K/W] LA LED 40 x 30 1.4 D 22,4 20 3,5 10 O 40 E O 50 art. no. 1.25 O 40 10 F Rth [K/W] LA LED 50 x 20 3,5 46,4 45 G H O 50 art. no. Rth [K/W] LA LED 50 x 45 I 0.9 Technical data of the fans LF 40B12 K L M N circuit voltage 12 V bearing type two-way plain bearing cur. consumpt. 50 mA max. iuitial current 160 mA max. volume flow 157 l/min - 9.4 m3/h max. static pressure 3.4 mmH2O - 33 Pa noise level 26 dB(A), 1 m lateral temperature range -20C... +60C failure rate (L10) 60,000 h MTBF 1,900,000 h (20C) Type rotor speed 6,600 min-1 weight 10 g B 49 Pin heatsinks O Hole pattern Special heatsink design Thermal conductive paste B 29 - 33 A 21 A 137 - 138 E 21 - 22 Mounts Thermally conductive foil Processor overview Technical introduction E 44 - 48 E 5 - 15 B 2 - 10 A2-8 A Active heat dissipation of LEDs B C - - - - active heat dissipation of LED modules Zhaga compliant mounting possibility integrated low noise fan optional adapter plate suitable for LED modules: Bridgelux Vero, Citizen CitiLED, Cree XLamp, Edison Edilex, GE Infusion, Luga Shop und Industrial, Lustrous Lustron, Megaman Teco, Osram PrevaLED und Soleriq, Philips Fortimo und Luxeon, Prolight Opto, Sharp Mega Zenigata, Toshiba E-Core, Tridonic Stark, Vexica Lumaera, Vossloh Schwabe M2x0,4 - 6H (3x) art. no. O 68,5 Rth [K/W] 2,5 D E 2,0 35 1,5 1,0 0,5 LA LED 68 ... please indicate: ... 50 75 100 mm ... surface SA = black anodised ME = clear anodised F 50 M3x0,5 - 6H (2x) 100 150 200 [mm] ... adapter (optional) AD = adapter plate G Technical data of the fans LF 40B12 circuit voltage 12 V bearing type two-way plain bearing cur. consumpt. 50 mA max. iuitial current 160 mA max. volume flow 157 l/min - 9.4 m3/h max. static pressure 3.4 mmH2O - 33 Pa noise level 26 dB(A), 1 m lateral temperature range -20C... +60C failure rate (L10) 60,000 h MTBF 1,900,000 h (20C) Type rotor speed 6,600 min-1 weight 10 g H I K L M Pin heatsinks O Hole pattern Special heatsink design Thermal conductive paste B 29 - 33 A 21 A 137 - 138 E 21 - 22 Mounts Thermally conductive foil Processor overview Technical introduction E 44 - 48 E 5 - 15 B 2 - 10 A2-8 B 50 N A Sample box LED Heatsinks B - Sample box for verification of the thermal management for LEDs - Contains a choice of different extruded heatsinks, LED extruded heatsinks in round design, LED pin heatsinks and extruded profiles for LED-Line modules - for thermal contacting or mounting of LED a high-performance thermal conductive graphite foil is also enclosed (WLFG, sample strips 25x150mm), a high-performance thermal conductive (silicone-free) ceramic-filled thermal conductive paste (WLPK, syringe), a double-sided sticky thermal conductive foil (WLFT 404, sample strips 25x150mm) and a thermal conductive epoxy based two-component adhesive (WLK DK, syringe) C D E F art. no. SK LED BOX 1 G H I K L M N B 51 Pin heatsinks O Hole pattern Special heatsink design Thermal conductive paste B 29 - 33 A 21 A 137 - 138 E 21 - 22 Mounts Thermally conductive foil Processor overview Technical introduction E 44 - 48 E 5 - 15 B 2 - 10 A2-8 A Heatsinks for DIL-IC and PLCC Heatsinks for DIL-IC - other length on request 1 4,8 B 6,3 art. no. 6/8 contacts 14/16 contacts [mm] Rth [K/W] 8.5 19.0 art. no. 83 46 ICK 20 L for cases [mm] 20 contacts 25.0 Rth [K/W] 34 C 1 4,8 ICK 6 8 L ICK 14 16 L for cases 19 art. no. ICK 14 16 B ICK 24 B ICK 28 B for cases 14/16 contacts 24 contacts 28 contacts [mm] Rth [K/W] 6.3 33.0 37.0 surface: art. no. 54.0 19.4 18.5 ICK 36 B ICK 40 B ICK 1000 B for cases [mm] 36 contacts 40 contacts -- 47.0 51.0 1000.0 Rth [K/W] 16.5 15.8 -- black anodised D E - with clip - other length on request 16 14,8 F 1 G 7,1 12 2,45 art. no. ICK 14 H ICK 16 H for cases 14 contacts 16 contacts [mm] Rth [K/W] 18.0 20.5 surface: 20 18 art. no. ICK 18 H ICK 1000 H for cases [mm] 18 contacts -- 23.0 1000.0 Rth [K/W] 16 -- black anodised H O 10 O 25 I O 16 12 8,5 16 Heatsinks for PLCC O 10 art. no. Rth [K/W] K 19 2,5 8 ICK R L 11,8 art. no. ICK PLCC 28 [mm] Rth [K/W] 11.8 25 surface: black anodised M Extruded heatsinks Pin heatsinks for IC Insulting clamping parts Thermal conductive glue A 22 - 83 B 21 - 28 E 45 E 23 - 24 Thermally conductive foil Thermal conductive paste Hole pattern Technical introduction E 5 - 15 E 21 - 22 A 21 A2-8 B 52 N A Heatsinks for SMD B C D E particularly suitable for SMD components low profile reduced weight effective heat dissipation can be glued directly onto the component solderable versions customer specific versions on request special packaging like tape and real, bar magazin, tray etc. on request 4,8 1 F - - - - - - - - G 6,3 art. no. [mm] ICK SMD A 5 ... ICK SMD A 8 ... ICK SMD A 10 ... 5 8 10 Rth [K/W] art. no. 123 87 75 ICK SMD A 13 ... ICK SMD A 17 ... ICK SMD A 22 ... Rth [K/W] 63 51 34 4,8 1 H [mm] 13 17 22 19 art. no. [mm] ICK SMD B 5 ... ICK SMD B 7 SA ICK SMD B 10 SA 5 7 10 Rth [K/W] art. no. 56 47 35 ICK SMD B 13 SA ICK SMD B 19 ... 30 Rth [K/W] 29 22 7,5 K [mm] 13 19 2,8 I 17 art. no. L [mm] ICK SMD C 7 SA ICK SMD C 10 SA please indicate: 7 10 Rth [K/W] art. no. 33 26 ICK SMD C 17 ... [mm] 17 Rth [K/W] 17 ... surface SA = black anodised MI = solderable surface M N B 53 Extruded heatsinks ICK S 10 x 10 x 6,5 Insulting clamping parts Thermal conductive glue A 22 - 83 B 21 - 28 E 45 E 23 - 24 Thermally conductive foil Thermal conductive paste Hole pattern Technical introduction E 5 - 15 E 21 - 22 A 21 A2-8 A Heatsinks for SMD 8 B art. no. Rth [K/W] 15.3 22.3 art. no. 27 21 ICK SMD E 29 SA B [mm] 29.0 Rth [K/W] 18 C 2 6 ICK SMD E 15 SA ICK SMD E 22 SA [mm] 3 B 8 art. no. Rth [K/W] 8 10 17 74 71 42 art. no. ICK SMD F 19 ... ICK SMD F 21 ... ICK SMD F 26 ... [mm] 19 21 26 Rth [K/W] E Rth [K/W] 8 10 13 73 70 61 art. no. ICK SMD G 17 SA ICK SMD G 19 SA ICK SMD G 21 ... [mm] 17 19 21 Rth [K/W] 41 36 32 F 8 ICK SMD G 8 MI ICK SMD G 10 ... ICK SMD G 13 SA [mm] 1,8 10 art. no. D 37 33 26 6 ICK SMD F 8 ... ICK SMD F 10 ... ICK SMD F 17 SA [mm] Rth [K/W] 8 10 17 33.0 29.0 24.5 art. no. ICK SMD H 19 SA ICK SMD H 25 ... 3,5 ICK SMD H 8 ... ICK SMD H 10 ... ICK SMD H 17 ... [mm] [mm] 19 25 Rth [K/W] 23.0 20.0 H 15,24 art. no. G 2,5 11,8 13,5 art. no. Rth [K/W] 8 10 13 25.6 23.4 21.5 art. no. ICK SMD K 17 ... ICK SMD K 19 ... ICK SMD K 21 ... [mm] 17 19 21 Rth [K/W] 19.4 18.0 16.5 art. no. ICK SMD M 8 SA ICK SMD M 10 SA ICK SMD M 17 MI please indicate: Extruded heatsinks ICK S 10 x 10 x 6,5 Insulting clamping parts Thermal conductive glue [mm] Rth [K/W] 8 10 17 72 66 40 1,8 14 art. no. ICK SMD M 19 SA ICK SMD M 21 SA [mm] 19 21 Rth [K/W] 35 31 L ... surface SA = black anodised MI = solderable surface A 22 - 83 B 21 - 28 E 45 E 23 - 24 I K 6 ICK SMD K 8 ... ICK SMD K 10 SA ICK SMD K 13 ... [mm] Thermally conductive foil Thermal conductive paste Hole pattern Technical introduction M E 5 - 15 E 21 - 22 A 21 A2-8 B 54 N A heatsink for SMD 6 B art. no. C ICK SMD N 8 ... ICK SMD N 10 ... ICK SMD N 17 ... please indicate: D [mm] 8 10 17 2 8 Rth [K/W] art. no. 74 71 42 ICK SMD N 19 ... ICK SMD N 21 ... ICK SMD N 26 ... [mm] 19 21 26 Rth [K/W] 37 33 26 ... surface SA = black anodised MI = solderable surface Sample box SMD heatsinks - contains an assortment of SMD heatsinks with anodised and solderable surface as well as thermally conductive glue (WLK) and double-sided adhesive thermal foil (WLF) E F art. no. ICK SMD BOX 1 G H I K L M N B 55 Extruded heatsinks ICK S 10 x 10 x 6,5 Insulting clamping parts Thermal conductive glue A 22 - 83 B 21 - 28 E 45 E 23 - 24 Thermally conductive foil Thermal conductive paste Hole pattern Technical introduction E 5 - 15 E 21 - 22 A 21 A2-8 A Passive heatsinks for processors O 4,2 R 6,5 51 48 12 5 1,3 B 51 48 art. no. ICK PPC 51 Rth [K/W] suitable for processor type 8.1 Power PC C O 4,2 O 8,5 Rth [K/W] D 25 107 3,0 2,0 4,2 1,0 0 0 1 2 3 4 130 art. no. Rth [K/W] ICK PEN 3 XE 5 6 v [m/s] E suitable for processor type Intel(R) 2 Pentium(R) III-XeonTM Slot II Format O 4,2 F O 8,5 Rth [K/W] 25 107 3,0 2,0 G 4,2 1,0 0 0 1 2 3 4 130 art. no. Rth [K/W] ICK PEN 3 XE 1 5 6 v [m/s] suitable for processor type Intel(R) 1.8 Pentium(R) III-XeonTM Slot II Format H 3 Heatsink specially for Q7 "Embedded-Boards" 2,9 I 70 52 25 6,5 3 5 18 75 2,5 K 56,5 art. no. ICK EM 25 Rth [K/W] suitable for processor type 3.9 Q7 Board L M Fan cooler for Intel PentiumIIIXeon Fan cooler, universal Attachable heatsinks Thermal conductive material B 60 B 58 C 10 - 16 E 2 - 24 Heatsinks for Q7 "Embedded-Boards" Heatsinks for BGA Heatsinks for PGA Technical introduction B 56 B 17 - 20 B 11 - 16 A2-8 B 56 N A Passive heatsinks for processors - customer specific versions and modifications on request B ICK PEN 38 Rth [K/W] 4 3 2 1 C C B 0 0 1 3 4 ICK PEN 45 Rth [K/W] D 2 5 6 v [m/s] 3 2 D A 1 0 E F art. no. Rth [K/W] ICK PEN 38 F 4.0 ICK PEN 38 W 4.0 ICK PEN 45 W 3.5 suitable for processor type AMD(R) K6-III/ IDT W2A/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 AMD(R) K6-III/ IDT W2A/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 AMD(R) K6-III/ IDT W2A/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 0 1 2 3 4 5 6 v [m/s] A 49.5 dim. [mm] B C 49.5 38 D 5.0 49.5 49.5 38 5.0 50.0 50.0 45 3.5 Rth [K/W] 3 2 B C G D 1 0 H art. no. ICK PRO 40 W I Rth [K/W] suitable for processor type Intel(R) 2.7 Pentium(R) 2 3 4 dim. [mm] B C 67.5 40 A 65 PRO 1 0 A 5 6 v [m/s] D 4.5 F = with double-sided thermally conductive adhesive foil W = for thermally conductive adhesive (please order separately) WLK ... E 23 Rth [K/W] 4 25 K 14 63 3 2 1 4,5 0 L art. no. ICK PEN 3 FC 70 Rth [K/W] 0 1 2 3 4 5 6 v [m/s] suitable for processor type Intel(R) 3.5 Pentium(R) III FC PGA (Mendocino, Coppermine) fixing method: K = with fixing clamp (incl. one-sided adherent thermal foil) M N B 57 Fan cooler for Intel PentiumIIIXeon Fan cooler, universal Attachable heatsinks Thermal conductive material B 60 B 58 C 10 - 16 E 2 - 24 Heatsinks for Q7 "Embedded-Boards" Heatsinks for BGA Heatsinks for PGA Technical introduction B 56 B 17 - 20 B 11 - 16 A2-8 A Active heatsinks for processors A art. no. LA LA LA LA LA LA LA LA LA LA LA LA ICK ICK ICK ICK ICK ICK ICK ICK ICK ICK ICK ICK 15 15 17 17 17 17 18 18 21 21 21 21 x x x x x x x x x x x x 15 15 17 17 17 17 18 18 21 21 21 21 F 05 F 12 F 12 F 12 A W 05 W 12 F 12 W 12 F 05 F 12 W 05 W 12 B C B Rth [K/W] suitable for processor type 2.3 2.3 1.6 1.6 1.6 1.6 1.5 1.5 1.4 1.4 1.4 1.4 universal universal universal universal universal universal universal universal universal universal universal universal A 37.92 37.92 43.10 43.10 43.10 43.10 45.70 45.70 53.34 53.34 53.34 53.34 dim. [mm] B 38.10 38.10 43.10 43.10 43.10 43.10 45.70 45.70 53.34 53.34 53.34 53.34 C C 20 20 20 20 20 20 20 20 20 20 20 20 D E F used fans: 5 Volt = Sepa MFB 25 F 05 L / MFB 40 H 05 / MFB 40 H 05 A; 12 Volt = Sepa MFB 25 F 12 / MFB 40 H 12 / MFB 40 H 12 A F = with double-sided thermally conductive adhesive foil W = for thermally conductive adhesive (please order separately) WLK ... E 23 G A = alarm exit H I K L M Heatsinks for BGA Heatsinks for Q7 "Embedded-Boards" Fan cooler, universal Heatsinks for Pentium PRO B B B B 17 - 20 56 58 57 Heatsinks for P II-Mobile Module Fan cooler for Pentium IV Thermal conductive material Technical introduction B 56 B 60 E 2 - 24 A2-8 B 58 N A Active heatsinks for processors B - easy assembly on ZIF socket by fixing clamp B C C D D A art. no. E F G H I K Rth [K/W] suitable for processor type LA ICK PEN 8 F 05 2.50 LA ICK PEN 8 F 12 2.50 LA ICK PEN 8 W 05 2.50 LA ICK PEN 8 W 12 2.50 LA ICK PEN 16 K 12 1.20 LA ICK PEN 16 W 12 1.20 LA ICK PEN 16 W 12 A 1.20 LA ICK PEN 18 W 12 1.60 LA ICK PEN 38 W 12 1.10 LA ICK PRO 25 F 12 0.97 AMD(R) K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 AMD(R) K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 AMD(R) K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 AMD(R) K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 AMD(R) K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 AMD(R) K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 AMD(R) K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 AMD(R) K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 AMD(R) K6-III/ IDT W2A/ Cyrix MII and similar/ MMX/ IDT C6/ Intel(R) Pentium(R)/ AMD(R) K6-2 Intel(R) Pentium(R) PRO A 50.8 dim. [mm] B C 50.8 8.00 D 9.00 50.8 50.8 8.00 9.00 50.8 50.8 8.00 9.00 50.8 50.8 8.00 9.00 50.8 50.8 16.51 26.51 50.8 50.8 16.51 26.51 50.8 50.8 16.51 26.51 50.8 50.8 49.5 49.5 38.00 48.00 63.5 67.5 25.00 35.00 8.00 18.00 used fans: 5 Volt = Sepa MFB 50 E 05; 12 Volt = Sepa MFB 50 E 12/ Sepa MFB 50 E 12 A; LA ICK PEN 8: 5 Volt = Sepa HFB 44 X 05 A; 12 Volt = Sepa HFB 44 B 12 A K = with fixing clamp (incl. one-sided adherent conductive foil) F = with double-sided thermally conductive adhesive foil W = for thermally conductive adhesive (please order separately) WLK ... E 23 A = alarm exit L M N B 59 Heatsinks for BGA Heatsinks for Q7 "Embedded-Boards" Fan cooler, universal Heatsinks for Pentium PRO B B B B 17 - 20 56 58 57 Heatsinks for P II-Mobile Module Fan cooler for Pentium IV Thermal conductive material Technical introduction B 56 B 60 E 2 - 24 A2-8 A Active heatsinks for processors - incl. one-sided adherent thermal foil 52 4 27 3,5 B C 125 art. no. Rth [K/W] suitable for processor type 1.2 Intel(R) Pentium(R) II/ AMD(R) Athlon(R) LA ICK PEN 2 K 12 ... please indicate: ... accessory (optional) SM = molex connection plug D utilized fans: 12 Volt = Sepa MFB 40 H 12 107 4 28,4 E F 130 art. no. Rth [K/W] suitable for processor type 0.8 Intel(R) Pentium(R) III-XeonTM LA ICK PEN 3 XE please indicate: G ... accessory (optional) A = alarm exit SM = molex connection plug fixing method: SB= screw fixing utilized fans: 12 Volt = Sepa MFB 50 E 12 H - with copper base plate - customer specific designs and modifications on request 7,7 45 70 63,5 I art. no. Rth [K/W] suitable for processor type 0.6 Intel(R) Pentium(R) IV LA ICK PEN 4 1 K please indicate: K 80 7 ... accessory (optional) SM = molex connection plug L fixing method: K = with fixing clamp operating voltage of the fan motor: 12 Volt (Papst 612 NHH) M Heatsinks for BGA Heatsinks for Q7 "Embedded-Boards" Fan cooler, universal Heatsinks for Pentium PRO B B B B 17 - 20 56 58 57 Heatsinks for P II-Mobile Module Fan cooler for Pentium IV Thermal conductive material Technical introduction B 56 B 60 E 2 - 24 A2-8 B 60 N A B C D E F G H I K L M N A Technical data of the fans B molex crimp case series: 6471; molex crimp terminals: 2759 - Sepa-fan 24 h BURN-IN tested C 5 volt fan Sepa Sepa MFB 25 F 05 L MFB 40 H 05 circuit voltage bearing type Sepa Sepa MFB 40 H 05 A MFB 50 E 05 Sepa ebmpapst HFB 44 X 05 A 405 F 4.5...5.5 V DC 4.5...5.5 V DC 4.5...5.5 V DC 4.5...5.5 V DC 4.5...5.5 V DC double ball bearing double ball bearing double ball bearing double ball bearing ball bearing fan dimensions cur. consumpt. max. iuitial current max. volume flow 4.5...5.5 V DC double slide bearing 40x40x10 mm 140 mA D E 25x25x10 mm 90 mA 170 mA 46 l/min 2.8 m3/h max. static pressure 2.2 mmH2O 22 Pa noise level 18 dB(A), 1 m lateral 40x40x10 mm 90 mA 250 mA 184 l/min 11 m3/h 3.1mm H2O 30.5 Pa 24 dB(A), 1 m lateral 40x40x10 mm 90 mA 250 mA 184 l/min 11 m3/h 3.1mm H2O 30.5 Pa 24 dB(A), 1 m lateral 50x50x10 mm 50 mA 120 mA 169 l/min 10.1 m3/h 1.6mm H2O 15.6 Pa 17 dB(A), 1 m lateral 44x44x6.2 mm 90 mA 160 mA 50 l/min 3 m3/h 2.6mm H2O 25.5 Pa 28 dB(A), 1 m lateral temperature range failure rate (L10) MTBF weight cases -10C ... +85C 95,000 h -40C... +80C 95,000 h -40C... +80C 95,000 h -10C... +70C 95,000 h -40C... +80C 95,000 h 132 l/min 8 m3/h 3.06mm H2O 30 Pa 22.1 dB(A), 1 m lateral -20C... +70C 45,000 h (20C) 280,000 h (20C) 8g plastic PBT (UL E54695) 280,000 h (20C) 13 g plastic PBT (UL E54695) 280,000 h (20C) 13 g plastic PBT (UL E54695) 280,000 h (20C) 19 g plastic PBT (UL E54695) 280,000 h (20C) 7g plastic PBT (UL E54695) 17 g plastic PBT (UL E38324) G 12 volt fan Sepa MFB 25 F 12 circuit voltage bearing type F Sepa MFB 40 H 12 Sepa Sepa MFB 40 H 12 A MFB 50 E 12 10.2...13.8 V DC 10.2...13.8 V DC 10.2...13.8 V DC 10.2...13.8 V DC double ball bearing double ball bearing double ball bearing ball bearing fan dimensions cur. consumpt. max. iuitial current max. volume flow Sepa ebmpapst HFB 44 B 12 A 412 F 10.2...13.8 V DC ball bearing 10-14 V DC double slide bearing 40x40x10 mm 60 mA 25x25x10 mm 70 mA 150 mA 70 l/min 4.1 m3/h max. static pressure 2.24mm H2O 41.5 Pa noise level 23 dB(A), 1 m lateral 40x40x10 mm 50 mA 130 mA 173 l/min 10.3 m3/h 2.9 mmH2O 28.5 Pa 24 dB(A), 1 m lateral 40x40x10 mm 50 mA 130 mA 173 l/min 10.3 m3/h 2.9 mmH2O 28.5 Pa 21 dB(A), 1 m lateral 50x50x10 mm 60 mA 140 mA 238 l/min 14.3 m3/h 2.7mm H2O 26.9 Pa 22 dB(A), 1 m lateral 44x44x6.2 mm 40 mA 70 mA 50 l/min 3 m3/h 2.6mm H2O 25.5 Pa 28 dB(A), 1 m lateral temperature range failure rate (L10) MTBF weight cases -40C... +80C 95,000 h -40C... +80C 95,000 h -40C... +80C 95,000 h -10C... +70C 95,000 h -40C... +80C 95,000 h 280,000 h (20C) 8g plastic PBT (UL E54695) 280,000 h (20C) 13 g plastic PBT (UL E54695) 280,000 h (20C) 13 g plastic PBT (UL E54695) 280,000 h (20C) 19 g plastic PBT (UL E54695) 280,000 h (20C) 20 g 17 g steel/aluminium (UL plastic PBT E54695) (UL E38324) 132 l/min 8 m3/h 3.06mm H2O 30 Pa 22.1 dB(A), 1 m lateral -20C... +70C 45,000 h (20C) H I K Fans with pulse output - Technical data of fans with pulse output: - - - - - L pulse output for activation of the alarm control pulse similar to a square pulse with three times the frequency of the rotor speed when the rotor is blocked, the output signal may be L (0.8 V) or H (Vcc-1 V) the pulse output must not be connected to GND or Vcc withoutb protective resistor (>10 K) in order to avoid short circuits, the pulse output not being used must be insulated M B 62 N Finger shaped heatsinks for power semiconductors Attachable heatsinks Finger shaped heatsinks for transistors Miniature heatsinks Finger shaped heatsinks for power semiconductors - specially compatible for power semiconductors in a TO-case - made as a bent sheet metal part or die cast heatsink made of aluminium - aligned heatsink contours for the best heat dissipation - direct screwing of the component to the heatsink on the PCB Attachable heatsinks - made of aluminium or copper material - solderable surface coating - integrated spring clip for easy and fast mounting of the transistor - secure hold of the component due to optimized spring force and geometry - customer specific version upon request Finger shaped heatsinks for transistors - effective heat dissipation of transistors - efficient radiation of heat at a horizontal or vertical mounting position - component fastening by means of screws or special transistor retaining springs - solder mounting by means of integrated solder pins and solderable surfaces Miniature heatsinks - for TO 5, SOT 82, D PAK and similar semiconductors - made of aluminium, phosphorus bronze or copper - simple mounting by direct plugging or soldering of the heatsink - special types of packaging such as tape & reel, magazine or tray upon request - versions and designs for your application A Finger shaped heatsinks for power semiconductors B ,9 10 4,5 46 38,1 4, 2 ,2 ,2 30 13 3,7 C 38,1 46 [mm] FK 254 SA 3 FK 318 SA FK 318 SA 3 Rth [K/W] 25.4 31.8 31.8 5.8 4.8 4.8 material: die-casting aluminium surface: black lacquered TO 3 without TO 3 CB TO 3 3 D 45 40 ,9 45 35 2,5 6 3, 4, 2 ,2 30 ,2 13 E ,2 30 ,1 15 ,2 13 O 4, O 2 art. no. 4 5, ,2 6 10 F FK FK FK FK FK FK 201 201 201 202 202 202 SA SA SA SA SA SA [mm] Rth [K/W] 25.4 25.4 25.4 12.7 12.7 12.7 3 CB 3 CB 10 ,9 ,1 13 4,9 5 1 9, 0 1 art. no. 6 6 6 8 8 8 L (TO 3 - SOT 9 + TO 66 - SOT 32 - TO220) H 30,1 23,1 16,9 13 I 33 10,9 4,2 5,4 4,2 1,5 2,5 G without TO 3 CB without TO 3 CB 3,6 K 41,6 art. no. FK FK FK FK 205 206 207 208 SA SA SA SA [mm] L L L L Rth [K/W] 31.8 25.4 19.1 12.7 9.0 10.5 12.0 14.0 material: aluminium surface: black anodised L L L L L M Attachable heatsinks Heatsinks for TO 5 and TO 18 Heatsinks for D PAK Aluminium oxide wafers C 10 - 14 C 17 - 19 C 21 - 117 E 17 - 18 Mounts Insulating caps Thermal conductive material Technical introduction E 44 - 48 E 51 E 2 - 24 A2-8 C2 N A Finger shaped heatsinks for power semiconductors FK 223 SA CB ,2 30 ,2 13 4, 4 5, ,2 6 O 2 4, 10 ,9 42 32 8 3 6 3, 9, C 1, O 2 10 ,2 30 ,2 13 B ,9 FK 223 SA 3 5 13 1,5 10 ,1 art. no. D [mm] FK 223 SA FK 223 SA 3 FK 223 SA CB Rth [K/W] 17 17 17 6.8 6.8 6.8 without TO 3 CB M 2,5 1,5 8,5 E F art. no. 10 14,75 35,5 [mm] FK 217 SA CB 2 M3 28,3 4 Rth [K/W] 13 16 material: aluminium surface: black anodised CB 2 (SOT 32; TO 220) G H I K L M N C3 Attachable heatsinks Heatsinks for TO 5 and TO 18 Heatsinks for D PAK Aluminium oxide wafers C 10 - 14 C 17 - 19 C 21 - 117 E 17 - 18 Mounts Insulating caps Thermal conductive material Technical introduction E 44 - 48 E 51 E 2 - 24 A2-8 A Heatsinks for transistors in plastic case - for semiconductor screw-assembly, horizontal FK 234 SA L 1 28 3 3 O 3,2 8 8 O 3,8 18,50,5 11,50,5 C 1,5 14,75 20 10 20 FK 234 SA L 3 FK 234 SA L 4 10 O 3,8 O 3,2 O 3,8 O 3,8 234 234 234 234 SA SA SA SA L L L L [mm] 1 2 3 4 E 20 12,5 FK FK FK FK D 28 28 8 art. no. B FK 234 SA L 2 28 Rth [K/W] 15 15 15 15 17 17 17 17 material: aluminium surface: black anodised TO 220 SOT 32 CB CB F G - for semiconductor screw-assembly, vertical FK 235 ... L 1 FK 235 ... L 2 28 28 18,3 2 13,5 1,5 10,16 O 3,2 10,16 O 3,8 4 4 art. no. FK FK FK FK 235 235 235 235 [mm] MI L 1 MI L 2 SA L 1 SA L 2 15 15 15 15 H 2 18,50,5 11,50,5 I Rth [K/W] 16 16 16 16 material: aluminium surface: solderable surface/ black anodised TO 220 SOT 32 TO 220 SOT 32 K L M Attachable heatsinks Heatsinks for TO 5 and TO 18 Heatsinks for D PAK Aluminium oxide wafers C 10 - 14 C 17 - 19 C 21 E 17 - 18 Mounts Insulating caps Thermal conductive material Technical introduction E 44 E 51 E 2 - 24 A2-8 C4 N A Heatsinks for transistors in plastic case 38 26 18 B 1,5 4 9,9 K/W 22 art. no. TO 220 art. no. 24,5 8 38 10 26 18 9,9 K/W D 22 FK 225 SA L 1 3,6 TO 220 6,9 16,5 31,2 FK 225 SA L 2 art. no. 24,5 2,5 21 13 19 E 30 K/W 4 11,5 C 13 19 TO 220 F art. no. 1,5 18,5 6,5 FK 228 SA L 1 21 13 19 4 13,5 27 K/W TO 220 18,5 6,5 1,5 G FK 229 SA L 1 art. no. 21 13 19 4 19,5 21 K/W H 18,5 FK 230 SA L 1 I material: aluminium surface: black anodised art. no. 12,5 5,1 30,4 4 31,2 3,8 5 7 15,2 K 17 K/W TO 220 15 3 FK 249 SA 220 L 1,5 TO 220 6,5 0,8 24,2 1,2 11,1 material: aluminium surface: black passivated, solder pins tin plated 1,9 M N C5 Attachable heatsinks Heatsinks for TO 5 and TO 18 Heatsinks for D PAK Aluminium oxide wafers C 10 - 14 C 17 - 19 C 21 E 17 - 18 Mounts Insulating caps Thermal conductive material Technical introduction E 44 - 48 E 51 E 2 - 24 A2-8 A Heatsinks for transistors in plastic case art. no. 3,8 12,2 25,4 8 B 1 25 K/W SOT 32 18 FK 209 SA 32 C available without hole pattern as well 22,4 12,2 25,4 8 3,8 art. no. 1 18 K/W CB (SOT 32 + TO 220) FK 210 SA CB D 30 available without hole pattern as well 12,2 E 25,4 13 O 3,8 art. no. 1 21 K/W SOT 32 18 FK 213 SA 32 F available without hole pattern as well 22,4 12,2 25,4 13 O 3,8 art. no. 15 K/W 1 G CB (SOT 32 + TO 220) 30 FK 214 SA CB available without hole pattern as well art. no. 1 11,5 3,8 24 K/W 13,5 9,5 13,5 H TO 220 19 FK 231 SA 220 art. no. I 1,3 16,45 24 K/W 19,05 3,8 9,5 13,34 SOT 32 K 19,5 FK 239 SA 32 material: aluminium surface: black anodised L M Attachable heatsinks Heatsinks for TO 5 and TO 18 Heatsinks for D PAK Aluminium oxide wafers C 10 - 14 C 17 - 19 C 21 E 17 - 18 Mounts Insulating caps Thermal conductive material Technical introduction E 44 - 48 E 51 E 2 - 24 A2-8 C6 N A Heatsinks for transistors in plastic case 12,2 1 25,4 8 B 3,8 1,2 art. no. 1 25 K/W SOT 32 18 3 available without hole pattern as well art. no. 22,4 12,2 8 25,4 1 3,8 1,2 1 18 K/W D CB (SOT 32 + TO 220) 18,2 30 3 available without hole pattern as well 12,2 13 E 25,4 1,2 O 3,8 art. no. 1 1 21 K/W SOT 32 18 FK 215 32 ... art. no. 22,4 12, 2 1 15 K/W G CB (SOT 32 + TO 220) 3 available without hole pattern as well art. no. 3,8 5,2 5,5 25,4 20 K/W 30 14,4 3,8 2,5 12,7 H FK 222 ... 18, 2 30 1 FK 216 CB TO 220 available without hole pattern as well art. no. 5,2 14,4 8 12 3,8 2,5 3,8 12,7 I 25,4 13 1 3,8 1,2 F 3 available without hole pattern as well 2,2 FK 212 CB ... 25,4 C FK 211 32 ... FK 247 220 ... please indicate: material: 19,1 1,5 16,8 3,8 1,5 1,95 L TO 220 4 art. no. 7,9 K 5,5 30 FK 222 THF ... 22 K/W TO 220 1,6 1 20 K/W 23,5 4,5 ... surface SA = black anodised MI = solderable surface aluminium M N C7 Attachable heatsinks Heatsinks for TO 5 and TO 18 Heatsinks for D PAK Aluminium oxide wafers C 10 - 14 C 17 - 19 C 21 E 17 - 18 Mounts Insulating caps Thermal conductive material Technical introduction E 44 E 51 E 2 - 24 A2-8 A Heatsinks for transistors in plastic case 17,8 O 3,6 art. no. B 22 K/W 1 20 45 7 9,8 9 18 TO 220 FK 227 SA L 1 4,3 36,6 C 1 O 3,7 art. no. 9,5 45 18 12 K/W 20 D TO 220 FK 238 SA L 1 10,2 12,2 material: aluminium surface: black anodised art. no. E 35,6 4 3,5 FK 218 32 ... 1,6 O 3,2 12,3 19,4 SOT 32 TO 220 19,3 F 1,2 22 6,7 21 K/W 24,5 20,5 3,2 7 TO 220 G 24 13 1,2 21 K/W O 3,6 art. no. 4 17 FK 232 220 ... 33 29 3,2 7 TO 220 H 27 1,2 16 20,2 K/W O 3,6 art. no. 4 I 20 FK 233 220 ... please indicate: ... surface SA = black anodised MI = solderable surface material: K aluminium L M Attachable heatsinks Heatsinks for TO 5 and TO 18 Heatsinks for D PAK Aluminium oxide wafers C 10 - 14 C 17 - 19 C 21 E 17 - 18 Mounts Insulating caps Thermal conductive material Technical introduction E 44 E 51 E 2 - 24 A2-8 C8 N A Heatsinks for transistors in plastic case 2,5 3,2 10,8 9,7 14,8 7,1 18,3 25,4 FK 219 CB 1 ... FK 219 CB 2 ... [mm] 21 4,8 Rth [K/W] 12.6 12.6 14 14 CB 1 (TO 220) CB 2 (TO 220) 2,5 art. no. 4,8 50,8 6 1,8 1,2 35,1 16,6 E 11,5 22,9 3,2 1,5 C D 50,8 1,2 22,9 35,1 16,6 50,8 35,1 16,6 B FK 219 CB 2 ... 3,2 2,5 FK 219 CB 1 ... 3,9 7,1 18,3 25,4 F FK 219 CB 3 ... [mm] Rth [K/W] 12.6 14 CB 3 (TO 220) FK 236 CB ... 32 3,8 22 18 12 3,8 32 1,9 G FK 236 220 ... 1,9 art. no. 4,8 3,3 16 23,4 22,8 12 16 23,4 3,3 22,8 12 3,3 1 22 H 28,5 30,8 art. no. I FK 236 220 ... FK 236 CB ... please indicate: K material: [mm] 5 28,5 30,8 5 Rth [K/W] 5 5 18 18 TO 220 CB ... surface SA = black anodised MI = solderable surface aluminium L M N C9 Retaining springs for transistors Lock-in retaining spring for transistors Profiles for lock-in fixing spring Profiles for PCB mounting A A A A 115 - 117 119 84 89 - 112 Heatsinks for TO 5 and TO 18 Attachable heatsinks Mounting material for semiconductors Technical introduction C 17 - 19 C 10 - 14 E 46 A2-8 A Attachable heatsinks 25 B 20,5 7 C 0,6 art. no. Rth [K/W] FK 220 SA 220 25 TO 220 material: aluminium surface: black anodised D - for transistiors with thin bottom thickness (0.5 mm) 25 7 20,5 E 0,6 art. no. F Rth [K/W] FK 258 SA 220 25 TO 220 material: aluminium surface: black anodised G 25 18 4 25,4 8,3 1,2 art. no. 1,2 1,3 22,5 Rth [K/W] FK 224 ... P SIP please indicate: H 18 I P SIP ... surface SA = black anodised MI = solderable surface material: K aluminium L M Heatsinks for D PAK Heatsinks for transistors Kapton insulator washers Vibration dampers C 21 C4-9 E 16 E 41 Vibration dampers U-shaped heatsink Aluminium oxide wafers Technical introduction E 41 A 123 - 124 E 17 - 18 A2-8 C 10 N A Attachable heatsinks FK 224 ... 218 2 FK 224 ... 218 1 B 25 18 25 18 4 8,3 14,5 25,4 25,4 8,3 15,5 4 15,5 4 C 1,3 1,2 1,3 1,2 FK 224 ... 220 1 D 25 18 FK 224 ... 220 2 25 18 4 8,3 14,5 25,4 25,4 8,3 E 1,2 art. no. F FK 224 ... 218 1 FK 224 ... 218 2 1,2 art. no. 18 18 TO 218 TO 218 10,5 15,5 4 4 1,3 Rth [K/W] please indicate: G 10,5 15,5 1,3 Rth [K/W] FK 224 ... 220 1 FK 224 ... 220 2 18 18 TO 220 TO 220 ... surface SA = black anodised MI = solderable surface material: aluminium 12,7 25,4 22,86 0,81 7,6 H 3,81 5,3 31 1,27 FK 241 SA 218 V I 2 3,4 art. no. with tin-plated soldering lug for direct soldering onto circuit board, for vertical installation art. no. 20 20 28 9,8 K/W TO 220 17,2 1,4 8 K O 1,2 20,1 FK 248 SA 220 material: aluminium surface: black anodised, solder pins tin plated L M N C 11 Heatsinks for D PAK Heatsinks for transistors Kapton insulator washers Vibration dampers C 21 C4-9 E 16 E 41 Vibration dampers U-shaped heatsink Aluminium oxide wafers Technical introduction E 41 A 123 - 124 E 17 - 18 A2-8 A Attachable heatsinks universal clip on heatsinks for type TO 218, TO 229, TO 247, TO 248, SIP-Muliwatt and similar easy assembly by pushing the heatsink onto the component for vertical and horizontal fastening by soldering fin height variations on request special design accord. to customized specification art. no. B 27 9 20 1,2 without soldering lug art. no. 16 3,2 0,6 10 0,6 20 1,2 4,85 1,1 4 1 27 9 8,5 16 0,6 0,6 10 with soldering lug for vertical mounting G 13 0,6 10 8,5 16 18,4 K/W 20 1,2 without soldering lug art. no. H 19 K/W 13 8,5 16 3,2 0,6 10 0,6 27 20 1,2 I 1 with soldering lug for horizontal mounting art. no. 4,85 18,4 K/W 4 1 8,5 16 27 13 0,6 10 0,6 1,1 FK 243 MI 247 V F 20 1,2 27 FK 243 MI 247 H E 19,7 K/W art. no. FK 243 MI 247 O 1 with soldering lug for horizontal mounting art. no. FK 245 MI 247 V D 20,5 K/W 27 FK 245 MI 247 H C 9 FK 245 MI 247 O 0,6 10 8,5 16 20,2 K/W 8,5 - - - - - 1,2 20 with soldering lug for vertical mounting material: copper (Cu) surface: solderable surface material thickness: 0.6 mm K L M Heatsinks for D PAK Heatsinks for transistors Kapton insulator washers Vibration dampers C 21 C4-9 E 16 E 41 Vibration dampers U-shaped heatsink Aluminium oxide wafers Technical introduction E 41 A 123 - 124 E 17 - 18 A2-8 C 12 N A Attachable heatsinks 2 * B 1 TO 220 C 3 D E - - - - - - - - - narrow version with better thermal resistance max. 14.5 mm wide 3 different lengths for varied dissipation power takes less space than any other attachable heatsink simple assembly by pushing the heatsink onto the TO 220 housing the cooling fingers form spring clamps (1+2), which pushes the TO 220 and it's mounting flange onto the heatsink (3) optimum heat transfer due the constant pressure on the entire contact surface of the TO 220 cases effective heat emmision with horizontal and vertical mounting * = touch in edge of transistor art. no. max. 14,5 * 12,7 26 K/W 0,81 ca. 8,5 F 15,24 G FK 242 SA 220 O without soldering lug art. no. * max. 14,5 12,7 21 K/W ca. 8,5 H 19,05 0,81 FK 237 SA 220 O without soldering lug art. no. 16 K/W max. 14,5 12,7 * K 38,1 0,81 FK 240 SA 220 O L ca. 8,5 I without soldering lug material: aluminium surface: black anodised, solder pins tin plated M N C 13 Heatsinks for D PAK Heatsinks for transistors Kapton insulator washers Vibration dampers C 21 C4-9 E 16 E 41 Vibration dampers U-shaped heatsink Aluminium oxide wafers Technical introduction E 41 A 123 - 124 E 17 - 18 A2-8 A Attachable heatsinks art. no. * 4,05 ca. 8,5 26 K/W 0,81 0,81 1,27 11,8 15,24 6,4 * 21 K/W 0,81 ca. 8,5 4,05 max. 14,5 0,81 1,27 19,05 with tinned soldering lug for direct soldering onto circuit board, for horizontal installation art. no. 16 K/W max. 14,5 E ca. 8,5 0,81 0,81 1,27 12, 7 4,05 * 0,81 4,6 6,4 FK 240 SA 220 H 38,1 F with tinned soldering lug for direct soldering onto circuit board, for horizontal installation material: aluminium surface: black anodised, solder pins tin plated - with tinned soldering lug for direct soldering onto circuit board, for vertical installation 0,81 A [mm] Rth [K/W] 6.35 26 FK 242 SA 220 VL A [mm] Rth [K/W] 6.35 21 26 ca. 8,5 19,05 FK 237 SA 220 VL A [mm] Rth [K/W] 9.53 21 * Rth [K/W] 6.35 16 ca. 8,5 L 38,1 art. no. FK 240 SA 220 VL material: aluminium surface: black anodised, solder pins tin plated C 21 C4-9 E 16 E 41 K 12,7 0,81 1,62 31,8 A A [mm] 9.53 H I art. no. 0,81 Heatsinks for D PAK Heatsinks for transistors Kapton insulator washers Vibration dampers Rth [K/W] 12,7 0,81 1,62 A 6,4 FK 240 SA 220 V A [mm] 12,8 0,81 max. 14,5 art. no. ca. 8,5 art. no. * 6,4 FK 237 SA 220 V 9 15,24 A max. 14,5 art. no. 12,7 0,81 1,62 6,4 FK 242 SA 220 V G * max. 14,5 art. no. D 4,6 6,4 FK 237 SA 220 H C with tinned soldering lug for direct soldering onto circuit board, for horizontal installation art. no. 0,81 12,7 FK 242 SA 220 H B 0,81 12,7 max. 14,5 Vibration dampers U-shaped heatsink Aluminium oxide wafers Technical introduction A [mm] Rth [K/W] 9.53 16 M E 41 A 123 - 124 E 17 - 18 A2-8 C 14 N A Attachable heatsinks for TO 220 with a bottom plate thickness of 0.5 mm B C D E - - - - - - - - narrow version with better thermal resistance max. 14.5 mm wide takes less space than any other attachable heatsink simple assembly by pushing the heatsink onto the TO 220 housing the cooling fingers form spring clamps (1+2), which pushes the TO 220 and it's mounting flange onto the heatsink (3) optimum heat transfer due the constant pressure on the entire contact surface of the TO 220 cases effective heat emmision with horizontal and vertical mounting * = touch in edge of transistor art. no. max 14,5 * without soldering lug max 14,5 art. no. * 4,1 H 12,7 21 K/W 0,81 1,27 0,81 19,05 6,35 12,7 FK 252 SA 220 H I ca. 8,4 FK 252 SA 220 O 19,05 0,81 12,7 G 12,7 21 K/W ca. 8,4 F with tinned soldering lug for direct soldering onto circuit board, for horizontal installation material: aluminium surface: black anodised - with tinned soldering lug for direct soldering onto circuit board, for vertical installation max. 14,5 1,27 0,81 12,7 L art. no. FK 252 SA 220 V ca. 8,4 0,81 K A [mm] Rth [K/W] 6.35 21 12,7 * 19,05 A art. no. FK 252 SA 220 VL material: aluminium surface: black anodised A [mm] Rth [K/W] 9.53 21 M N C 15 Heatsinks for D PAK Heatsinks for transistors Kapton insulator washers Vibration dampers C 21 C4-9 E 16 E 41 Vibration dampers U-shaped heatsink Aluminium oxide wafers Technical introduction E 41 A 123 - 124 E 17 - 18 A2-8 A Attachable heatsinks 19 11,1 B 19 10,7 22 art. no. C Rth [K/W] 23.7 TO 220 D 11,7 19,05 11,1 FK 253 19,05 24,8 art. no. E Rth [K/W] 16.8 TO 220 F 19,05 10,2 4,19 0,13 FK 255 0,6 12,2 19,05 21,84 art. no. G Rth [K/W] FK 257 21.2 TO 220 material: aluminium surface: black anodised H I K L M Heatsinks for D PAK Heatsinks for transistors Kapton insulator washers Vibration dampers C 21 C4-9 E 16 E 41 Vibration dampers U-shaped heatsink Aluminium oxide wafers Technical introduction E 41 A 123 - 124 E 17 - 18 A2-8 C 16 N A Small heatsinks art. no. B 10,1 40 K/W TO 5 O8 0,6 C 3,96 6,35 6,35 6,35 21,4 KK 1 3,96 art. no. 10,1 38 K/W D TO 5 O8 0,6 21,4 E KK 1 6,35 art. no. 35 K/W 10,1 TO 5 F O8 0,6 12,7 6,35 21,4 KK 1 12,7 art. no. 31 K/W G 10,1 TO 5 H O8 0,6 19,05 6,35 21,4 KK 1 19,05 material: aluminium surface: black anodised I K L M N C 17 Finger-shaped heatsinks Heatsinks for transistors Attachable heatsinks Heatsinks for D PAK C C C C 2-3 4-9 10 - 16 21 - 22 Thermal conductive material Mounting material for semiconductors Extruded heatsinks Technical introduction E 2 - 24 E 46 - 48 A 22 - 83 A2-8 A Small heatsinks art. no. B 25 5 7,9 57 K/W TO 5 KF 5/5 C art. no. 25 10 7,9 46 K/W TO 5 D KF 5/10 art. no. 25 15 7,9 40 K/W TO 5 E KF 5/15 material: brass surface: blackened F art. no. 7,8 KK 562 GS 8 T 19 F 60 K/W TO 5 G T = gap; F = spring loaded material: special bronze CuZn 15 material thickness: 0.3 mm surface: blackened H I K L M Finger-shaped heatsinks Heatsinks for transistors Attachable heatsinks Heatsinks for D PAK C C C C 2-3 4-9 10 - 16 21 - 22 Thermal conductive material Mounting material for semiconductors Extruded heatsinks Technical introduction E 2 - 24 E 46 - 48 A 22 - 83 A2-8 C 18 N A Small heatsinks art. no. max. 12,7 1+0,5 -0,2 B 6 63 K/W TO 5 8,10,1 SKK 56 C art. no. max. 12,7 1+0,5 -0,2 8 55 K/W D TO 5 8,10,1 SKK 58 art. no. 10 max. 12,7 1+0,5 -0,2 E 44 K/W TO 5 8,10,1 SKK 510 F material: aluminium surface: etched (other surfaces on request) 3,5 art. no. G 80 K/W 9,5 15 TO 126 SOT 32 SOT 82 KK 92 art. no. 2,4 3,3 13 H 60 K/W I 30 10 11 0,5 O 2,2 TO 126 SOT 32 SOT 82 4 8,8 KK 32 material: special bronze CuZn 6 surface: blackened K L M N C 19 Finger-shaped heatsinks Heatsinks for transistors Attachable heatsinks Heatsinks for D PAK C C C C 2-3 4-9 10 - 16 21 - 22 Thermal conductive material Mounting material for semiconductors Extruded heatsinks Technical introduction E 2 - 24 E 46 - 48 A 22 - 83 A2-8 A B C D E F G H I K L M N A Heatsinks for D PAK and others B C D - copper heatsinks with excellent heat conductivity - direct mounting on printed circuit through solderable surface - especially suitable for SMD components of type D PAK (TO 252), D PAK (TO 263), D PAK (TO 268), SOT 669 LF PAK, SO IC-8 FL MP, Power SO-8, Power SO-10, Power SO-20, Power SO-36, SO-14, SO-16, SOT 223 etc - available standard packing: bulk parts or reel - special packing like magazine, tray etc. on request; - special versions according to customers specifications - tape width: 44 mm, reel diameter: 330 mm, quantity: FK 244 08 = 450, FK 244 13 = 200 E 23 10 FK 244 08 D PAK ... weight: 2g 8 8 10 art. no. 31,5 K/W 14,8 F FK 244 13 D PAK ... weight: 3.3g 13 8 10 art. no. 10 25 K/W 14,8 23 G 13 FK 244 08 D2 PAK ... weight: 2.2g 8 8 10 art. no. 26 29,3 K/W 17,8 13 8 H 10 art. no. 13 FK 244 13 D2 PAK ... weight: 3.6g M N 8 31 18 26 K/W 22,8 please indicate: 13 18 22,8 19,5 K/W 31 ... packing (optional) TR = tape and reel surface: solderable surface material: copper (Cu) material thickness: 0.6 mm C 21 10 8 art. no. FK 244 13 D3 PAK ... weight: 3.9g L 10 art. no. FK 244 08 D3 PAK ... weight: 2.5g K 22,8 K/W 8 I 26 17,8 Heatsink profile-overview Assignment table Finger-shaped heatsinks Heatsinks for transistors A 13 - 17 A 18 - 20 C2-3 C4-9 Attachable heatsinks Heatsinks for TO 5 and TO 18 Thermal conductive material Technical introduction C 10 - 16 C 17 - 19 E 2 - 24 A2-8 A Heatsinks for D PAK and others - tape width: 24 mm, reel diameter: 330 mm, quantity: FK 250 06 = 450, FK 250 08 = 450, FK 250 10 = 350 - tape width: 24 mm, reel diameter: 330 mm, quantity: FK 251 06 = 450, FK 251 08 = 350, FK 251 10 = 250 B FK 250 06 LF PAK ... weight: 1g 7 11,4 8 4,5 6,5 art. no. 15 37 K/W C 6 8 8 art. no. FK 250 08 LF PAK ... weight: 1.1g 7 11,4 15 34,8 K/W D 15 7 11,4 FK 250 10 LF PAK ... weight: 1.2g 8 8 10 art. no. 28,8 K/W E 4,5 6,5 13 art. no. 7 11,4 FK 251 06 LF PAK ... weight: 1.3g 15 32 K/W F 6 8 13 art. no. FK 251 08 LF PAK ... weight: 1.4g 7 11,4 29,8 K/W 15 G FK 251 10 LF PAK ... weight: 1.5g please indicate: 7 11,4 13 8 10 art. no. 15 24 K/W H ... packing (optional) TR = tape and reel surface: solderable surface material: copper (Cu) material thickness: 0.6 mm I art. no. 15,24 0,6 19,38 11,43 11 K/W 19,38 25,4 FK 256 surface: solderable surface material: aluminium material thickness: 0.6 mm K 11,43 L M Heatsink profile-overview Assignment table Finger-shaped heatsinks Heatsinks for transistors A 13 - 17 A 18 - 20 C2-3 C4-9 Attachable heatsinks Heatsinks for TO 5 and TO 18 Thermal conductive material Technical introduction C 10 - 16 C 17 - 19 E 2 - 24 A2-8 C 22 N Segment cooling aggregates Miniature cooling aggregates Hollow fin cooling aggregates High performance heatsinks Segment cooling aggregates - modular assembly consisting of different circle- and length segments - electrical and thermal insulation of the single cooling segment sections - standard drilling patterns TO 3 and pressfit - segment profile also sold by the meter - other fan types and fan voltages upon request Miniature cooling aggregates - compact construction for dissipating high power losses on smallest installation space - heatsink geometries and fixed length optimal adjusted to the fan being used - homogeneous heat dissipation - mounting of the semi-conductor by means of sliding nut chanels or specific snap-to-retaining springs for transistors Hollow fin cooling aggregates - flow-optimized hollow fin geometry - precise milled flat semiconductor mounting surface, single- and double-sided - laminar airflow and noise reduction by means of harmonized chamber systems - additional treatments, modifications and designs according to customers specifications High performance heatsinks - exclusive for forced convection - for radial- and tangential fans - flow-optimized design, best heat dissipation by means of especially thick bottom plates - precise milled flat semiconductor mounting surfaces - mechanical treatments, special designs and surface coating for your application A Order example (see drawing on the right) Semiconductor cooling package, consisting of 4 heatsinks LA 1 -2 A (segment C), 1 heatsink LA 1 - 8 A (segment D), 8 heatsinks LA 1 - 1 A (segment E) and 2 heatsinks LA 1- 4 A (segment F). Total dissipation 1280 W. B How to tick off? C F 1. Tick on the left hand side the circles corresponding to an eight element long package, D E and also at the end of each row of the segments C, D, E and F to define the length. 2. For segment C: 4 marks for four double length elements, insulated from each other. This indicates 4 units LA 1 - 2. 3. For segment D: 1 mark for one single length of heatsink, 290.5 mm long. This indicates 1 unit LA 1 - 8. 4. For segment E: 8 marks for 8 elements of the standard length (35 mm) each insulated from the other. This indicates 8 units LA 1 - 1. 5. For segment F: 2 marks for each two heatsinks of 144.5 mm length, each insulated from the other. This indicates 2 units LA 1 - 4. 6. For each segment the profile types, either A or B, must be indicated for aggregate LA 1. 7. In the rectangle corresponding to the heatsink elements, the pin layouts for the transistor should also be indicated. 8. In the order form please indicate whether the cooling-aggregate is to be supplied with a fan and whether this is equipped with a protection-grid, or if it is to be supplied without a fan. C D Upon request, it is possible to supply fans for special voltages and higher temperatures. LA 1 LA 2 E le date: pieces p. order: r rde company: p m a x e O name/dept.: town: F street: signature: with fan length units: mm 35.0 71.5 108.0 144.5 181.0 217.5 254.0 290.5 327.0 1 2 3 4 5 6 7 8 9 363.5 10 segment: ...... Volt 230 Volt protection grid without fan voltage: ~ = segment: segment: segment: Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 Fassung TO-3 Lochung Prefit-Bohrg. Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole C F D E G cable connection C D E H I The segment-line C-D-E-F is shown against air-escape orifice, thus on the other side of the axial fan. From this view also tick off cable terminal with axial fan. K L M F Please check off here total length of the cooling aggregate. POB 1590 Nottebohmstrae 28 Tel.: +49 (0) 23 51 / 4 35-0 D - 58465 Ludenscheid D - 58511 Ludenscheid Fax: +49 (0) 23 51 / 4 57 54 info@fischerelektronik.de www.fischerelektronik.de www.facebook.de/fischerelektronik D2 N A B Order / inquiry LA 1 LA 2 date: pieces p. order: company: C name/dept.: town: street: signature: D E with fan length units: mm 35.0 F 71.5 108.0 1 2 3 G 144.5 H 181.0 217.5 4 5 6 I 254.0 K 290.5 327.0 L 7 8 9 363.5 10 segment: N voltage: ~ = segment: segment: segment: Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 Fassung TO-3 Lochung Prefit-Bohrg. Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole C F D E cable connection C M ...... Volt 230 Volt protection grid without fan D E The segment-line C-D-E-F is shown against air-escape orifice, thus on the other side of the axial fan. From this view also tick off cable terminal with axial fan. F Please check off here total length of the cooling aggregate. D3 POB 1590 Nottebohmstrae 28 Tel.: +49 (0) 23 51 / 4 35-0 D - 58465 Ludenscheid D - 58511 Ludenscheid Fax: +49 (0) 23 51 / 4 57 54 info@fischerelektronik.de www.fischerelektronik.de www.facebook.de/fischerelektronik A Order / inquiry LA 1 LA 2 B date: pieces p. order: company: name/dept.: C town: street: signature: with fan length units: mm 35.0 71.5 108.0 144.5 181.0 217.5 254.0 290.5 327.0 1 2 3 4 5 6 7 8 9 363.5 10 segment: D ...... Volt 230 Volt protection grid without fan voltage: ~ = segment: segment: segment: Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 Fassung TO-3 Lochung Prefit-Bohrg. Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole Typ. A B TO-3 holder TO-3 hole pressfit hole C F D E E cable connection C D E F G The segment-line C-D-E-F is shown against air-escape orifice, thus on the other side of the axial fan. From this view also tick off cable terminal with axial fan. I K L F M Please check off here total length of the cooling aggregate. POB 1590 Nottebohmstrae 28 Tel.: +49 (0) 23 51 / 4 35-0 D - 58465 Ludenscheid D - 58511 Ludenscheid Fax: +49 (0) 23 51 / 4 57 54 H info@fischerelektronik.de www.fischerelektronik.de www.facebook.de/fischerelektronik D4 N A Segment cooling aggregates A-Type B-Type 84 42 58,5 6,5 48 ,7 62 B 35 C 58,5 170 129 105 [mm WS ] 9 p Y 38 119 86 8 80 7 70 6 60 5 50 4 40 3 30 2 20 1 10 35 [INCHES H2 O] 30 D 129 105 [PA] 90 60 Hz 50 Hz 25 20 15 10 E 05 20 40 60 80 100 [CFM] 0 1,5 0 F G H I LA LA LA LA LA 1 1 1 1 1 01 02 03 04 05 0 100 art. no. L [mm] ... ... ... ... ... 35.0 71.5 108.0 144.5 181.0 dim. [mm] X Y 26.0 88.6 62.5 125.1 99.0 161.6 135.5 198.1 172.0 234.6 art. no. LA LA LA LA LA 40 60 80 100 120 140 160 180 200 . [m33/h] /h] VV[m 7,5 X 6,2 20 1 1 1 1 1 06 07 08 09 10 ... ... ... ... ... 0,5 1 L [mm] 217.5 254.0 290.5 327.0 363.5 1,5 2 2,5 3 . 3 3 /min] V [m V [m /min] dim. [mm] X Y 208.5 271.1 245.0 307.6 281.5 344.1 318.0 380.6 354.5 417.1 ... for A-types: please add an "A", for B-types: please add a "B". L: unit lengths of the segments incl. insulation; X: mounting distance; Y: length of the cooling aggregate incl. fan 24 V DC fan on request In case of order please use order form. segments also available in meter length: art. no. for A-type: LA 1 1000 A; art. no. for B-type: LA 1 1000 B Other fan types and fan voltages on request. Technical data of the fans ... 230 K L type ebmpapst, ball bearing dimensions 119x119x38 mm tension 230 V AC power inout 19 W max. air volume 160 m3/h temperature range -40C... +85C noise level 47 dB(A) speed 2,650 min-1 weight 550 g failure rate (L10) L10 < 37,500 h (40C) M N D5 Miniature cooling aggregates Protection grid for axial fans Thermal conductive material Heatsinks with hollow fin profile D 9 - 11 D 36 E 2 - 29 D 30 Order example Order form Mounting parts for heatsinks Technical introduction D2 D3-4 E 49 - 50 A2-8 A Thermal resistance LA 1 The thermal resistance in the following diagrams is given on the base of a total dissipation of 40 Watt per heatsink of the A"-type. When using B"-types this value increases by 3 %. B K/W 1. Cooling aggregate consisting of 4 heatsinks LA 1 - 1 A. Total dissipation 160 W. C K/W 2. Cooling aggregate consisting of 4 heatsinks LA 1 - 1 A and 2 x 1 heatsink LA 1 - 2 A. Total dissipation 320 W. D E K/W 3. Cooling aggregate consisting of 4 heatsinks LA 1 - 1 A, 2 heatsinks LA 1 - 2 A and 2 x 1 heatsink LA 1 - 4 A. Total dissipation 640 W. F G K/W 4. Cooling aggregate consisting of 6 heatsinks LA 1 - 1 A, 3 heatsinks LA 1 - 2 A and 2 x 1 heatsink LA 1 - 6 A. Total dissipation 960 W. H K/W 5. Cooling aggregate consisting of 8 heatsinks LA 1 - 1 A, 4 heatsinks LA 1 - 2 A, 2 heatsinks LA 1 - 4 A and 1 heatsink LA 1 - 8 A. Total dissipation 1280 W. I K K/W 6. Cooling aggregate consisting of 10 heatsinks LA 1 - 1 A, 2 heatsinks LA 1 - 5 A, and 2 x 1 heatsink LA 1 - 10 A. Total dissipation 1600 W. L M Miniature cooling aggregates Protection grid for axial fans Thermal conductive material Heatsinks with hollow fin profile D 9 - 11 D 36 E 2 - 29 D 30 Order example Order form Mounting parts for heatsinks Technical introduction D2 D3-4 E 49 - 50 A2-8 D6 N A Segment cooling aggregates 72,5 22 B 45,5 33,8 30 C 148 100 38 Y 92 100 72 D E 75 . V [m3/h] 5 X M4 . V [m3/min] art. no. F G LA LA LA LA LA 2 2 2 2 2 01 02 03 04 05 L [mm] ... ... ... ... ... 35.0 71.5 108.0 144.5 181.0 dim. [mm] X 54.2 90.7 127.2 163.7 200.2 art. no. Y 92.0 128.5 165.0 201.5 238.0 LA LA LA LA LA 2 2 2 2 2 06 07 08 09 10 ... ... ... ... ... L [mm] 217.5 254.0 290.5 327.0 363.5 dim. [mm] X 236.7 273.2 309.7 346.2 382.7 Y 274.5 311.0 347.5 384.0 420.5 L: unit lengths of the segments incl. insulation; X: mounting distance; Y: length of the cooling aggregate incl. fan H 24 V DC fan on request In case of order please use order form. segments also available in meter length: art. no. for A-type: LA 1 1000 A; art. no. for B-type: LA 2 1000 B Other fan types and fan voltages on request. Technical data of the fans I K L ... 230 type ebmpapst, ball bearing dimensions 92x92x38 mm tension 230 V AC power inout 12 W max. air volume 75 m3/h temperature range -40C... +75C noise level 37 dB(A) speed 2,700 min-1 weight 420 g failure rate (L10) L10 < 52,500 h (40C) M N D7 Miniature cooling aggregates Protection grid for axial fans Thermal conductive material Heatsinks with hollow fin profile D 9 - 11 D 36 E 2 - 29 D 30 Order example Order form Mounting parts for heatsinks Technical introduction D2 D3-4 E 49 - 50 A2-8 A Thermal resistance LA 2 The thermal resistance in the following diagrams is given on the base of a total dissipation of 40 Watt per heatsink of the A"-type. K/W B 1. Cooling aggregate consisting of 4 heatsinks LA 2 - 1. Total dissipation 160 W maximal. C K/W 2. Cooling aggregate consisting of 4 heatsinks LA 2 - 1 and 2 x 1 heatsink LA 2 - 2. Total dissipation 320 W. D E K/W 3. Cooling aggregate consisting of 4 heatsinks LA 2 - 1, 2 heatsinks LA 2 - 2 and 2 x 1 heatsink LA 2 - 4. Total dissipation 640 W. F G K/W 4. Cooling aggregate consisting of 6 heatsinks LA 2 - 1, 3 heatsinks LA 2 - 2 and 2 x 1 heatsink LA 2 - 6. Total dissipation 960 W. H K/W 5. Cooling aggregate consisting of 8 heatsinks LA 2 - 1, 4 heatsinks LA 2 - 2, 2 heatsinks LA 2 - 4 and 1 heatsink LA 2 - 8. Total dissipation 1280 W. I K K/W 6. Cooling aggregate consisting of 10 heatsinks LA 2 - 1, 2 heatsinks LA 2 - 5, and 2 x 1 heatsink LA 2 - 10. Total dissipation 1600 W. L M Miniature cooling aggregates Protection grid for axial fans Thermal conductive material Heatsinks with hollow fin profile D 9 - 11 D 36 E 2 - 29 D 30 Order example Order form Mounting parts for heatsinks Technical introduction D2 D3-4 E 49 - 50 A2-8 D8 N A Miniature cooling aggregates made for dissipation of high power within a very small space approximate length is optimised to the fan motor slide-nut channels for M3 nuts for mounting the transistors and circuit boards other fan types and fan voltages on request art. no. C 1 50 25 4 75 3,5 B - - - - 3,1 5,5 50 15 D 75 140 mm 0,3 K/W LAM 1 art. no. 11 100 mm 32 F 50 13 1 32 4 50 3,5 E 3,1 5,5 0,73 K/W LAM 2 G surface: natural colour anodised Technical data of the fans H I LAM 1 LAM 2 type ebmpapst 612 NHH-118 ebmpapst 412 F dimensions 60x60x25 mm 40x40x10 mm tension 12 V DC 12 V DC power inout 2.9 W 0.7 W max. air volume 56 temperature range -20C... +70C -20C... +70C m3/h 8 m3/h noise level 41 dB(A) 22.1 dB(A) speed 6,800 min-1 5,400 min-1 weight 66 g 17 g failure rate (L10) L10 < 60,000 h (40C) L10 < 45,000 h (20C) K L M N D9 Retaining springs for transistors Special heatsink design Hollow-fin cooling aggregates High capacity cooling aggregat. A 115 - 117 A 137 - 138 D 15 - 25 D 26 - 35 Fluid coolers Protection grid for axial fans Thermally conductive foil Technical introduction A 131 - 133 D 36 E 5 - 15 A2-8 A Miniature cooling aggregates compact design homogeneous heat dissipation mounting possible on any side powerful axial-fan motor other lengths, special designs and processing according to customers requirements other surfaces treatment, fan types and fan voltages on request 0,15 4 x art. no. 3 3 24 30 LAM 3 ... please indicate: surface: Rth [K/W] 1,6 1,4 1,2 1,0 0,8 10 ... 25 50 C 5 V DC 12 V DC 75 100 125 150 [mm] ... fan type 5 = 5 V DC 12 = 12 V DC 50 75 100 125 150 mm with grooves for lock-in retaining spring for transistors THFU A 119 compact design homogeneous heat dissipation mounting possible on any side powerful axial-fan motor other lengths, special designs and processing according to customers requirements other surfaces treatment, fan types and fan voltages on request art. no. F Rth [K/W] 1,6 1,4 1,2 1,0 0,8 20 24 30 0,1 2 x 24 30 ... 50 75 100 125 150 mm surface: E 0,15 2 x 3 LAM 3 K ... please indicate: D natural colour anodised 3 - - - - - - - B 24 30 - - - - - - 10 25 50 5 V DC 12 V DC G 75 100 125 150 [mm] ... fan type 5 = 5 V DC 12 = 12 V DC H natural colour anodised Technical data of the fans ... 5 ... 12 type Sepa, ball bearing Sepa, ball bearing dimensions 30x30x10 mm 30x30x10 mm tension 5 V DC 12 V DC max. air volume 6.8 cur. consumpt. 130 mA 70 mA temperature range -10C... +70C -10C... +70C noise level 21 dB(A) 23 dB(A) speed 8,500 min-1 9,100 min-1 weight 8g 8g failure rate (L10) L10 < 95,000 h (20C) MTBF < 280,000 h (20C) L10 < 95,000 h (20C) MTBF < 280,000 h (20C) m3/h I 7.7 m3/h K L M Retaining springs for transistors Special heatsink design Hollow-fin cooling aggregates High capacity cooling aggregat. A 115 - 117 A 137 - 138 D 15 - 25 D 26 - 35 Fluid coolers Protection grid for axial fans Thermally conductive foil Technical introduction A 131 - 133 D 36 E 5 - 15 A2-8 D 10 N A Miniature cooling aggregates B - - - - - - compact design homogeneous heat dissipation mounting possible on any side powerful axial-fan motor other lengths, special designs and processing according to customers requirements other surfaces treatment, fan types and fan voltages on request art. no. 0,15 4 x 3 3 40 32 40 C D 32 40 LAM 4 ... 20 (25) ... please indicate: ... fan type 5 = 5 V DC 12 = 12 V DC 24 = 24 V DC 50 75 100 125 150 mm E F surface: - - - - - - - natural colour anodised with grooves for lock-in retaining spring for transistors THFU A 119 compact design homogeneous heat dissipation mounting possible on any side powerful axial-fan motor other lengths, special designs and processing according to customer's requirements other surfaces treatment, fan types and fan voltages on request art. no. 0,15 2 x 32 40 LAM 4 K ... 20 (25) ... please indicate: surface: Rth [K/W] 1,6 1,4 1,2 5 V DC 1,0 0,8 12 V DC 24 V DC 0,6 0,4 25 50 75 100 125 150 [mm] ... fan type 5 = 5 V DC 12 = 12 V DC 24 = 24 V DC 50 75 100 125 150 mm I 40 G 3 26,5 32 40 0,1 2 x 3 H Rth [K/W] 1,6 1,4 1,2 5 V DC 1,0 0,8 12 V DC 24 V DC 0,6 0,4 25 50 75 100 125 150 [mm] natural colour anodised Technical data of the fans ... 5 K L ... 24 type ebmpapst 405 ebmpapst 412 JHH ebmpapst 414 JHH dimensions 40x40x20 mm 40x40x25 mm 40x40x25 mm tension 5 V DC 12 V DC 24 V DC power inout 0.9 W 3.3 W 3.6 W max. air volume 10 m3/h 24 m3/h 24 m3/h temperature range -20C... +70C -20C... +60C -20C... +60C noise level 18 dB(A) 46 dB(A) 46 dB(A) speed 6,000 min-1 13,000 min-1 13,000 min-1 weight 27 g 50 g 50 g failure rate (L10) L10 < 50,000 h (40C) L10 < 20,000 h (tmax) L10 < 57,500 h (40C) L10 < 35,000 h (tmax) L10 < 57,500 h (40C) L10 < 35,000 h (tmax) M N ... 12 D 11 Retaining springs for transistors Special heatsink design Hollow-fin cooling aggregates High capacity cooling aggregat. A 115 - 117 A 137 - 138 D 15 - 25 D 26 - 35 Fluid coolers Protection grid for axial fans Thermally conductive foil Technical introduction A 131 - 133 D 36 E 5 - 15 A2-8 A Miniature cooling aggregates compact design homogeneous heat dissipation mounting possible on any side powerful axial-fan motor other lengths, special designs and processing according to customers requirements other surfaces treatment, fan types and fan voltages on request 4,5 4,5 please indicate: 0,15 4 x 42 50 LAM 5 ... 25 50 C 5 V DC 12 V DC 24 V DC 75 100 125 150 [mm] E natural colour anodised with grooves for lock-in retaining spring for transistors THFU A 119 compact design homogeneous heat dissipation mounting possible on any side powerful axial-fan motor other lengths, special designs and processing according to customers requirements other surfaces treatment, fan types and fan voltages on request 0,2 4 x 42 50 LAM 5 K ... please indicate: 10 (15) ... 25 50 5 V DC G 12 V DC 24 V DC 75 100 125 150 [mm] ... fan type 5 = 5 V DC 12 = 12 V DC 24 = 24 V DC 50 75 100 125 150 mm surface: Rth [K/W] 1,4 1,2 1,0 0,8 0,6 0,4 0,2 27,1 4,5 42 50 4,5 F 50 art. no. D ... fan type 5 = 5 V DC 12 = 12 V DC 24 = 24 V DC 50 75 100 125 150 mm - - - - - - - Rth [K/W] 1,4 1,2 1,0 0,8 0,6 0,4 0,2 10 (15) ... surface: B 50 art. no. 42 50 - - - - - - H natural colour anodised I Technical data of the fans ... 5 ... 12 ... 24 type Sepa, ball bearing Sepa, ball bearing ebmpapst dimensions 50x50x10 mm 50x50x10 mm 50x50x15 mm tension 5 V DC 12 V DC 24 V DC max. air volume 10 m3/h 14.3 m3/h 20 m3/h temperature range -10C... +70C -10C... +70C -20C... +70C speed 3,400 min-1 4,800 min-1 5,000 min-1 noise level 17 dB(A) 22 dB(A) 30 dB(A) weight 19 g 19 g 27 g failure rate (L10) L10 < 95,000 h (20C) MTBF < 280,000 h (20C) L10 < 95,000 h (20C) MTBF < 280,000 h (20C) L10 50,000 h (20C) alarm output with with K L M Retaining springs for transistors Special heatsink design Hollow-fin cooling aggregates High capacity cooling aggregat. A 115 - 117 A 137 - 138 D 15 - 25 D 26 - 35 Fluid coolers Protection grid for axial fans Thermally conductive foil Technical introduction A 131 - 133 D 36 E 5 - 15 A2-8 D 12 N A Cooling aggregates with axial fan Heatsink-cooling aggregates B - - - - with grooves for lock-in retaining springs THFU A 119 screw-in solder pin M 3 (art. no.: ELS 3) different lengths, special designs and machinings according to customer specifications different surfaces, fan types and fan voltages upon request 75,5 50 art. no. 12 V DC 24 V DC Rth [K/W] C 2,0 50 1,2 0,8 29,5 65,8 1,6 D 50 57,5 LA 27 K ... please indicate: ... 50 75 84 94 100 125 150 mm E F G 0,4 50 100 150 200 [mm] ... fan type 12 = 12 V DC 24 = 24 V DC Technical data of the fans ... 12 ... 24 type ebmpapst, ball bearing ebmpapst, ball bearing dimensions 60x60x25 mm 60x60x25 mm tension 12 V DC 24 V DC power inout 2.9 W 2.9 W max. air volume 56 temperature range -20C... +70C -20C... +70C noise level 41 dB(A) 41 dB(A) m3/h 56 m3/h speed 6,800 weight 66 g 66 g failure rate (L10) L10 < 60,000 h (40C) L10 < 60,000 h (40C) min-1 6,850 min-1 H I K L M N D 13 Cooling aggreg. in segment mount. Miniature cooling aggregates Protection grid for axial fans Thermal conductive material D5-7 D 9 - 11 D 36 E 2 - 29 Extruded heatsinks Cooling aggregates with radial fan Heatsinks with hollow fin profile Technical introduction A 22 - 83 D 33 - 35 D 30 A2-8 A Cooling aggregates with axial fan Heatsink-cooling aggregates - - - - - - especially suitable for IGBT, SSR, semiconductor modules, high performance transistors etc. effective construction with axial fans good thermal performance additional machining according to customer's instructions cooling aggregates also available without fans other fan types and fan voltages on request B C art. no. 55 8 Rth [K/W] 119 105 1,0 0,8 D 0,6 0,4 230 V AC 24 V DC 0,2 105 119 LA 4 ... 50 100 150 [mm] art. no. E Rth [K/W] 2 1,0 116 0,8 57 10,5 0,6 0,4 230 V AC 24 V DC 0,2 50 112 LA 5 ... 100 F 150 [mm] * for one segment please indicate: ... ... fan type 24 = 24 V DC 230 = 230 V AC 75 100 150 mm G Technical data of the fans ... 24 ... 230 type ebmpapst, ball bearing ebmpapst, ball bearing dimensions 119x119x38 mm 119x119x38 mm tension 24 V DC 230 V AC power inout 11 W 19 W max. air volume 237 m3/h 160 m3/h temperature range -30C ... +70C -40C... +85C noise level 57 dB(A) 47 dB(A) speed 4,400 min-1 2,650 min-1 weight 390 g 550 g failure rate (L10) L10 < 70,000 h (40C) L10 < 37,500 h (40C) H I K L M Cooling aggreg. in segment mount. Miniature cooling aggregates Protection grid for axial fans Thermal conductive material D5-7 D 9 - 11 D 36 E 2 - 29 Extruded heatsinks Cooling aggregates with radial fan Heatsinks with hollow fin profile Technical introduction A 22 - 83 D 33 - 35 D 30 A2-8 D 14 N A Cooling aggregates with axial fan Hollow-fin cooling aggregates B - - - - - geometry of hollow fin opimising the air flow particularly effective heat dissipation compact construction milled flat semiconductor mounting surface other fan types and fan voltages on request art. no. 0,1 100 Rz10 C 12 V DC 24 V DC Rth [K/W] 11,5 0,5 1,2 1,2 50 74 0,5 0,30 0,25 0,20 0,15 D 0,10 50 62 0,5 LA 6 ... 100 200 300 [mm] without air flow chamber art. no. 0,1 100 Rz10 12 V DC 24 V DC Rth [K/W] 0,25 E 74 0,5 0,20 0,15 0,10 F 1,2 1,4 0,05 125 0,5 LA 7 ... 100 200 300 [mm] without air flow chamber art. no. 0,1 100 Rz10 12 V DC 24 V DC Rth [K/W] 0,25 G 74 0,5 0,20 0,15 0,10 0,05 H 188 0,5 LA 8 ... please indicate: ... K L 200 300 [mm] A 137 - 138 D 30 E 2 - 24 A2-8 ... fan type 12 = 12 V DC 24 = 24 V DC 100 150 200 250 300 mm I 100 without air flow chamber Technical data of the fans ... 12 ... 24 type ebmpapst, ball bearing ebmpapst, ball bearing dimensions 60x60x25 mm 60x60x25 mm tension 12 V DC 24 V DC power inout 2.9 W 2.9 W max. air volume 56 temperature range -20C... +70C -20C... +70C m3/h 56 m3/h noise level 41 dB(A) 41 dB(A) speed 6,800 min-1 6,850 min-1 weight 66 g 66 g failure rate (L10) L10 < 60,000 h (40C) L10 < 60,000 h (40C) M N D 15 Miniature cooling aggregates Protection grid for axial fans Drilling pattern for Solid State Relais High capacity heatsinks D 9 - 11 D 36 A 12 A 57 - 58 Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction A Cooling aggregates with axial fan Hollow-fin cooling aggregates - - - - - geometry of hollow fin optimising the air flow particularly effective heat dissipation compact construction milled flat semiconductor mounting surface other fan types and fan voltages on request B art. no. 0,1 100 Rz10 12 V DC 24 V DC Rth [K/W] 0,30 C 74 0,5 60 74 0,5 50 11,5 0,5 0,25 0,20 0,15 0,10 50 62 0,5 LA V 6 ... 100 25 200 300 [mm] D 30 with air flow chamber art. no. Rz10 12 V DC 24 V DC Rth [K/W] 0,20 0,1 100 E 0,16 74 0,5 0,12 0,08 0,04 100 125 0,5 LA V 7 ... 200 300 [mm] with air flow chamber art. no. 0,1 100 Rz10 F 12 V DC 24 V DC Rth [K/W] 0,12 0,10 G 74 0,5 0,08 0,06 0,04 188 0,5 LA V 8 ... 100 200 300 [mm] with air flow chamber please indicate: ... 100 150 200 250 300 mm H ... fan type 12 = 12 V DC 24 = 24 V DC Technical data of the fans I ... 12 ... 24 type ebmpapst, ball bearing ebmpapst, ball bearing dimensions 60x60x25 mm 60x60x25 mm tension 12 V DC 24 V DC power inout 2.9 W 2.9 W K max. air volume 56 temperature range -20C... +70C -20C... +70C m3/h 56 m3/h noise level 41 dB(A) 41 dB(A) speed 6,800 min-1 6,850 min-1 weight 66 g 66 g failure rate (L10) L10 < 60,000 h (40C) L10 < 60,000 h (40C) L M Miniature cooling aggregates Protection grid for axial fans Drilling pattern for Solid State Relais High capacity heatsinks D 9 - 11 D 36 A 12 A 57 - 58 Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction A 137 - 138 D 30 E 2 - 24 A2-8 D 16 N A Cooling aggregates with axial fan Hollow-fin cooling aggregates B - - - - - geometry of hollow fin opimising the air flow particularly effective heat dissipation compact construction milled flat semiconductor mounting surface other fan types and fan voltages on request art. no. 0,5 C Rz10 Rth [K/W] 0,1 100 0,30 0,5 11,5 0,25 0,20 230 V AC 83 0,15 24V DC 0,10 0,05 D +1 80 -0,5 LA 9 ... 100 200 300 [mm] without air flow chamber art. no. 0,1 100 0,5 Rz10 Rth [K/W] 11 0,20 0,5 0,18 0,14 83 E 0,10 230 V AC 24 V DC 0,06 0,02 +1,5 160 -1 100 300 [mm] 200 0,5 without air flow chamber art. no. 10 F LA 10 ... Rth [K/W] 0,1 100 Rz10 0,12 0,5 G 0,08 83 0,10 0,06 24V DC 0,04 +2 100 240 -0,5 LA 11 ... H 230V AC 300 [mm] 200 without air flow chamber please indicate: ... ... fan type 24 = 24 V DC 230 = 230 V AC 100 150 200 250 300 mm Technical data of the fans I K L ... 24 ... 230 type ebmpapst, ball bearing ebmpapst, ball bearing dimensions 80x80x32 mm 80x80x38 mm tension 24 V DC 230 V AC power inout 6W 12 W max. air volume 80 m3/h 50 m3/h temperature range -20C... 75C -40C... +90C noise level 48 dB(A) 31 dB(A) speed 5,000 min-1 2,800 min-1 weight 170 g 490 g failure rate (L10) L10 < 55,000 h (40C) L10 < 52,500 h (40C) M N D 17 Miniature cooling aggregates Protection grid for axial fans Drilling pattern for Solid State Relais High capacity heatsinks D 9 - 11 D 36 A 12 A 57 - 58 Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction A 137 - 138 D 30 E 2 - 24 A2-8 A Cooling aggregates with axial fan Hollow-fin cooling aggregates geometry of hollow fin optimising the air flow particularly effective heat dissipation compact construction milled flat semiconductor mounting surface other fan types and fan voltages on request B 0,1 100 Rz10 83 0,5 11,5 0,5 Rth [K/W] 0,30 83 0,5 art. no. 80 - - - - - C 0,25 0,20 0,15 230 V AC 0,10 24 V DC +1 80 -0,5 LA V 9 ... 38 100 30 200 300 [mm] with air flow chamber art. no. 0,1 100 Rz10 Rth [K/W] 0,25 83 0,5 11 0,5 0,20 E 0,15 0,10 230 V AC 24 V DC 0,05 +1,5 LA V 10 ... D 100 160 -1 200 300 [mm] with air flow chamber art. no. F Rth [K/W] 0,1 100 Rz10 0,12 83 0,5 10 0,5 0,10 0,08 0,06 230 V AC 24 V DC 0,04 +2 LA V 11 ... 100 240 -0,5 200 G 300 [mm] with air flow chamber please indicate: ... 100 150 200 250 300 mm ... fan type 24 = 24 V DC 230 = 230 V AC H Technical data of the fans type ... 24 ... 230 ebmpapst, ball bearing ebmpapst, ball bearing dimensions 80x80x32 mm 80x80x38 mm tension 24 V DC 230 V AC power inout 6W 12 W max. air volume 80 temperature range -20C... 75C m3/h I 50 m3/h K -40C... +90C noise level 48 dB(A) 31 dB(A) speed 5,000 min-1 2,800 min-1 weight 170 g 490 g failure rate (L10) L10 < 55,000 h (40C) L10 < 52,500 h (40C) L M Miniature cooling aggregates Protection grid for axial fans Drilling pattern for Solid State Relais High capacity heatsinks D 9 - 11 D 36 A 12 A 57 - 58 Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction A 137 - 138 D 30 E 2 - 24 A2-8 D 18 N A Cooling aggregates with axial fan Hollow-fin cooling aggregates B C - - - - - - extremly low losses due to optimised hollow fin geometry particularly effective heat dissipation compact design with axial fan milled flat semiconductor mounting surface addtional design to customer's intructions other fan types and fan voltages on request art. no. 0,1 100 Rz10 Rth [K/W] 0,25 0,5 0,5 15 D 120 0,20 0,10 230V AC 24V DC 0,05 120 LA 14 ... E 0,15 100 0,8 200 300 [mm] without air flow chamber art. no. 0,1 100 Rz10 Rth [K/W] 0,10 0,5 0,5 0,06 120 15 0,08 0,04 F 230V AC 24V DC 0,02 +1,4 100 240 -1,2 LA 15 ... 200 300 [mm] without air flow chamber please indicate: ... 100 150 200 250 300 400 mm G ... fan type 24 = 24 V DC 230 = 230 V AC Technical data of the fans H I K ... 24 ... 230 type ebmpapst, ball bearing ebmpapst, ball bearing dimensions 119x119x38 mm 119x119x38 mm tension 24 V DC 230 V AC power inout 11 W 19 W max. air volume 237 temperature range -30C ... +70C -40C... +85C noise level 57 dB(A) 47 dB(A) speed 4,400 min-1 2,650 min-1 weight 390 g 550 g failure rate (L10) L10 < 70,000 h (40C) L10 < 37,500 h (40C) m3/h 160 m3/h L M N D 19 Miniature cooling aggregates Protection grid for axial fans Drilling pattern for Solid State Relais High capacity heatsinks D 9 - 11 D 36 A 12 A 57 - 58 Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction A 137 - 138 D 30 E 2 - 24 A2-8 A Cooling aggregates with axial fan Hollow-fin cooling aggregates - - - - - - extremly low losses due to optimised hollow fin geometry particularly effective heat dissipation compact design with axial fan milled flat semiconductor mounting surface addtional design to customer's intructions on request other fan types and fan voltages on request 15 0,5 art. no. B Rz10 C 0,1 100 Rth [K/W] 0,20 120 0,5 119 120 0,5 0,25 0,15 0,10 230 V AC 24 V DC 0,05 120 0,8 LA V 14 ... 100 38 30 200 300 [mm] with air flow chamber 15 0,5 art. no. E 0,1 100 Rz10 D Rth [K/W] 0,10 120 0,5 0,08 0,06 230 V AC 24 V DC 0,04 F 0,02 100 +1,4 200 300 [mm] 240 -1,2 LA V 15 ... G with air flow chamber please indicate: ... 100 150 200 250 300 400 mm ... fan type 24 = 24 V DC 230 = 230 V AC H Technical data of the fans ... 24 ... 230 type ebmpapst, ball bearing ebmpapst, ball bearing dimensions 119x119x38 mm 119x119x38 mm tension 24 V DC 230 V AC power inout 11 W 19 W max. air volume 237 m3/h 160 m3/h temperature range -30C ... +70C -40C... +85C noise level 57 dB(A) 47 dB(A) speed 4,400 min-1 2,650 min-1 weight 390 g 550 g failure rate (L10) L10 < 70,000 h (40C) L10 < 37,500 h (40C) I K L M Miniature cooling aggregates Protection grid for axial fans Drilling pattern for Solid State Relais High capacity heatsinks D 9 - 11 D 36 A 12 A 57 - 58 Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction A 137 - 138 D 30 E 2 - 24 A2-8 D 20 N A Cooling aggregates with axial fan Hollow-fin cooling aggregates B C - - - - - - extremly low losses due to optimised hollow fin geometry effective heat dissipation compact construction with axial fans two oposite mounting surfaces are milled flat additional treatment upon customer's request other fan types and fan voltages on request art. no. 0,1 100 Rz10 Rth [K/W] 0,15 0,09 10 0,5 0,5 0,12 120 230 V AC D 0,06 0,5 122 LA 17 ... 100 10 Rz10 E 24 V DC 0,03 200 300 [mm] 0,1 100 0,8 without air flow chamber art. no. 0,1 100 Rz10 Rth [K/W] 0,5 10 0,5 0,07 120 F 0,06 0,05 230 V AC 0,04 0,03 24 V DC Rz10 G 0,1 100 243 LA 18 ... ... 100 150 200 250 300 400 mm I K 100 200 300 [mm] without air flow chamber please indicate: H 1,5 10 0,5 0,02 ... fan type 24 = 24 V DC 230 = 230 V AC Technical data of the fans ... 24 ... 230 type ebmpapst, ball bearing ebmpapst, ball bearing dimensions 119x119x38 mm 119x119x38 mm tension 24 V DC 230 V AC power inout 11 W 19 W max. air volume 237 temperature range -30C ... +70C -40C... +85C noise level 57 dB(A) 47 dB(A) speed 4,400 min-1 2,650 min-1 weight 390 g 550 g failure rate (L10) L10 < 70,000 h (40C) L10 < 37,500 h (40C) m3/h 160 m3/h L M N D 21 Miniature cooling aggregates Protection grid for axial fans Drilling pattern for Solid State Relais High capacity heatsinks D 9 - 11 D 36 A 12 A 57 - 58 Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction A 137 - 138 D 30 E 2 - 24 A2-8 A Cooling aggregates with axial fan Hollow-fin cooling aggregates - - - - - - extremly low losses due to optimised hollow fin geometry effective heat dissipation compact construction with axial fans two oposite mounting surfaces are milled flat additional treatment upon customer's request other fan types and fan voltages on request art. no. B Rz10 C 0,1 100 Rth [K/W] Rz10 120 0,5 119 0,09 230 V AC 24 V DC 0,06 10 0,5 120 0,5 10 0,5 0,15 0,12 D 0,03 0,1 100 100 38 30 200 300 [mm] 122 0,8 LA V 17 ... with air flow chamber E 119 art. no. F 38 30 0,1 100 Rz10 Rth [K/W] 0,06 0,5 10 0,5 0,05 230 V AC 0,04 G 120 0,03 24 V DC 0,02 0,1 100 243 LA V 18 ... 1,5 10 0,5 0,01 Rz10 100 200 300 [mm] H with air flow chamber please indicate: ... 100 150 200 250 300 400 mm ... fan type 24 = 24 V DC 230 = 230 V AC I Technical data of the fans ... 24 ... 230 type ebmpapst, ball bearing ebmpapst, ball bearing dimensions 119x119x38 mm 119x119x38 mm tension 24 V DC 230 V AC power inout 11 W 19 W max. air volume 237 temperature range -30C ... +70C -40C... +85C noise level 57 dB(A) 47 dB(A) speed 4,400 min-1 2,650 min-1 weight 390 g 550 g failure rate (L10) L10 < 70,000 h (40C) L10 < 37,500 h (40C) m3/h K 160 m3/h L M Miniature cooling aggregates Protection grid for axial fans Drilling pattern for Solid State Relais High capacity heatsinks D 9 - 11 D 36 A 12 A 57 - 58 Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction A 137 - 138 D 30 E 2 - 24 A2-8 D 22 N A Cooling aggregates with axial fan Hollow-fin cooling aggregates C - - - - - - extremly low losses due to optimised hollow fin geometry effective heat dissipation compact construction with axial fans two oposite mounting surfaces are milled flat additional treatment upon customer's request other fan types and fan voltages on request art. no. 9,5 0,5 B 0,1 100 Rz10 Rth [K/W] 0,20 93 0,5 0,16 9,5 0,5 D 0,12 230 V AC 24 V DC 0,08 Rz10 100 200 300 [mm] 0,1 100 92 0,8 E LA 21 ... without air flow chamber art. no. 0,1 100 Rz10 Rth [K/W] 0,5 0,12 9 0,09 93 0,5 0,15 F 230 V AC 0,06 24 V DC 0,1 100 184 G LA 22 ... I K 100 200 300 [mm] without air flow chamber ... please indicate: 100 150 200 250 300 400 mm H 1,25 9 Rz10 0,5 0,03 ... fan type 24 = 24 V DC 230 = 230 V AC Technical data of the fans ... 24 ... 230 type ebmpapst, ball bearing ebmpapst, ball bearing dimensions 92x92x32 mm 92x92x38 mm tension 24 V DC 230 V AC power inout 5W 12 W max. air volume 107 m3/h 75 m3/h temperature range -20C... 75C -40C... +75C noise level 47 dB(A) 37 dB(A) speed 4,000 min-1 2,700 min-1 weight 190 g 420 g failure rate (L10) L10 < 57,500 h (40C) L10 < 52,500 h (40C) L M N D 23 Miniature cooling aggregates Protection grid for axial fans Drilling pattern for Solid State Relais High capacity heatsinks D 9 - 11 D 36 A 12 A 57 - 58 Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction A 137 - 138 D 30 E 2 - 24 A2-8 A Cooling aggregates with axial fan Hollow-fin cooling aggregates extremly low losses due to optimised hollow fin geometry effective heat dissipation compact construction with axial fans two oposite mounting surfaces are milled flat additional treatment upon customer's request other fan types and fan voltages on request art. no. B 0,1 100 Rz10 C Rth [K/W] 0,20 9,5 0,5 - - - - - - 92 0,5 0,16 0,5 93 0,12 230 V AC 24 V DC 9,5 0,08 Rz10 92 LA V 21 ... 100 32 30 (38) 0,1 100 0,8 200 D 300 [mm] with air flow chamber art. no. 92 E 32 (38) 30 F 0,1 100 Rz10 Rth [K/W] 0,15 0,09 9 93 0,5 0,5 0,12 230 V AC 0,06 24 V DC G LA V 22 ... 1,25 100 9 0,1 100 184 0,5 0,03 Rz10 200 300 [mm] with air flow chamber please indicate: ... 100 150 200 250 300 400 mm H ... fan type 24 = 24 V DC 230 = 230 V AC Technical data of the fans type I ... 24 ... 230 ebmpapst, ball bearing ebmpapst, ball bearing dimensions 92x92x32 mm 92x92x38 mm tension 24 V DC 230 V AC power inout 5W 12 W max. air volume 107 m3/h 75 m3/h K temperature range -20C... 75C -40C... +75C noise level 47 dB(A) 37 dB(A) speed 4,000 min-1 2,700 min-1 weight 190 g 420 g failure rate (L10) L10 < 57,500 h (40C) L10 < 52,500 h (40C) L M Miniature cooling aggregates Protection grid for axial fans Drilling pattern for Solid State Relais High capacity heatsinks D 9 - 11 D 36 A 12 A 57 - 58 Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction A 137 - 138 D 30 E 2 - 24 A2-8 D 24 N A Cooling aggregates with axial fan Hollow-fin cooling aggregates C - - - - - - extremly low losses due optimised hollow fin geometry especially effective heat dissipation compact construction with axial fans two oposite mounting surfaces are miled flat additional treatment upon customer's request other fan types and fan voltages on request art. no. 0,1 100 Rz10 Rth [K/W] 12 0,5 B 0,08 0,07 D 0,05 O 150 158 0,5 12 0,5 0,06 0,04 230 V AC 0,03 24 V DC 0,02 0,01 200 Rz10 E 155 LA V 24 ... H 500 [mm] 38 30 (55) 1 ... ... fan type 24 = 24 V DC 230 = 230 V AC 200 300 400 mm G 400 with air flow chamber please indicate: F 300 0,1 100 Technical data of the fans ... 24 ... 230 type ebmpapst, ball bearing, with grid ebmpapst, ball bearing, with grid dimensions O150x38 mm O150x55 mm tension 24 V DC 230 V AC power inout 19 W 47 W max. air volume 420 m3/h 380 m3/h temperature range -25C... +72C -30C... +60C noise level 59 dB(A) 60 dB(A) speed 3,350 min-1 2,700 min-1 weight 620 g 1,100 g failure rate (L10) L10 < 75,000 h (40C) L10 < 40,000 h (40C) I K L M N D 25 Miniature cooling aggregates Protection grid for axial fans Drilling pattern for Solid State Relais High capacity heatsinks D 9 - 11 D 36 A 12 A 57 - 58 Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction A 137 - 138 D 30 E 2 - 24 A2-8 A Cooling aggregates with axial fan High performance cooling aggregate B C D extremely low losses of air flow as compared to cooling aggregates with extruded aluminium - compact dimensions, that means high performance density due to large heat-conducting surfaces - maximum heat flow due to brazing or thermal adhesion - high performance cooling aggregates are only effective with forced ventilation by means of the fan, but not with free convection - other fan types and fan voltages on request E material: solder-plated aluminium sheet, thus minimal weight due to the thickness of the material An optimised unit for any application can be produced from the wide range of existing components upon request. The specific capacity will be determined by a test run upon customers request. F Technical data of the fans ... 230 type ebmpapst, ball bearing dimensions 119x119x38 mm tension 230 V AC power inout 19 W max. air volume 160 m3/h temperature range -40C... +85C noise level 47 dB(A) speed 2,650 min-1 weight 550 g failure rate (L10) L10 < 37,500 h (40C) G H I K L M Miniature cooling aggregates Protection grid for axial fans Drilling pattern for Solid State Relais High capacity heatsinks D 9 - 11 D 36 A 12 A 57 - 58 Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction A 137 - 138 D 30 E 2 - 24 A2-8 D 26 N A Cooling aggregates with axial fan High performance cooling aggregate B 150 mm LA HL 1 ... 3 v = 6 m/s v = 6 m/s Rth [K/W] Rth [K/W] 0,18 0,075 0,14 + 0,061 115 C + 0,096 119 0,100 0,10 0,050 0,025 1 2 0,06 + 0, 28 0,02 1 D 2 3 38 1050 max. 129 1 104,8 Rz16 0,2 100 art. no. 3 50 100 150 200 250 [mm] 150 mm Rth [K/W] 0,18 0,10 ca. 6 115 1 104,8 0,14 E 0,06 0,02 1 F Rz16 ca. 2 LA HL 1 ... 2 3 4 6 v [m/s] 5 0,2 100 without air flow chamber art. no. 33,2 104,8 258 1 104,8 0,2 100 Rz16 ca. 6 104,8 115 1 G H Rz16 ca. 2 LA HL 2 ... 0,2 100 without air flow chamber art. no. 104,8 0,3 100 ca. 6 Rz16 104,8 115 1 I 387 1,5 29,2 K Rz16 ca. 2 LA HL 3 ... L please indicate: 0,3 100 without air flow chamber ... 100 150 200 250 300 400 mm M N D 27 Miniature cooling aggregates Protection grid for axial fans Drilling pattern for Solid State Relais High capacity heatsinks D 9 - 11 D 36 A 12 A 57 - 58 Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction A 137 - 138 D 30 E 2 - 24 A2-8 A Cooling aggregates with axial fan High performance cooling aggregate 150 mm LA HL V 1 ... 3 v = 6 m/s Rth [K/W] Rth [K/W] 0,18 + 0,09 0,075 + 0,059 0,050 0,14 115 119 0,100 0,10 1 2 0,06 + 0,027 0,025 B v = 6 m/s 30 0,02 1 2 3 3 50 100 150 200 250 [mm] 1050 max. 38 art. no. 129 1 104,8 Rz16 C D 150 mm 0,2 100 Rth [K/W] 0,18 115 1 104,8 0,14 E ca. 6 0,10 0,06 0,02 1 Rz16 ca. 2 LA HLV 1 ... 2 3 4 0,2 100 5 6 v [m/s] F with air flow chamber art. no. 104,8 33,2 258 1 104,8 0,2 100 Rz16 ca. 6 115 1 104,8 G H ca. 2 LA HLV 2 ... Rz16 0,2 100 with air flow chamber art. no. 104,8 387 1,5 29,2 115 1 104,8 K ca. 2 LA HLV 3 ... please indicate: I 0,3 100 ca. 6 Rz16 Rz16 0,3 100 with air flow chamber L ... 100 150 200 250 300 400 mm M Miniature cooling aggregates Protection grid for axial fans Drilling pattern for Solid State Relais High capacity heatsinks D 9 - 11 D 36 A 12 A 57 - 58 Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction A 137 - 138 D 30 E 2 - 24 A2-8 D 28 N A Cooling aggregates with axial fan High performance cooling aggregate B C - - - - - - - innovative, efficient heatsink design thick multiwall sheets for maximum heat dissipation specially formed laminated structures ensure optimum heat exchange with the air flow powerful mixed axial fan for highly effcient heat dissipation reduced noise output achieved by an optimised adaption of fan and heatsink additional treatment and modifications upon customer's request double and triple versions upon request art. no. Rth [K/W] 0,10 0,08 0,06 0,04 0,02 0 D 12 V DC 24 V DC 100 200 300 [mm] 129 1 104,8 Rz16 0,2 100 F LAHL D 1 ... I 115 119 38 ... ... fan type 12 = 12 V DC 24 = 24 V DC 100 150 200 250 300 400 mm H 1050 max. 0,2 100 ca. 2 please indicate: G 115 1 104,8 Rz16 ca. 6 E 30 Technical data of the fans ... 12 ... 24 type ebmpapst, ball bearing, with grid ebmpapst, ball bearing, with grid dimensions 119x119x38 mm 119x119x38 mm tension 12 V DC 24 V DC power inout 21 W 19.5 W max. air volume 310 temperature range -20C... +65C -20C... +65C m3/h 310 m3/h noise level 65 dB(A) 65 dB(A) speed 6,000 min-1 6,000 min-1 weight 390 g 390 g failure rate (L10) L10 > 60,000 h (40C) L10 > 37,500 h (tmax) L10 > 65,000 h (40C) L10 > 37,500 h (tmax) K L M N D 29 Miniature cooling aggregates Protection grid for axial fans Drilling pattern for Solid State Relais High capacity heatsinks D 9 - 11 D 36 A 12 A 57 - 58 Special heatsink design Heatsinks with hollow fin profile Thermal conductive material Technical introduction A 137 - 138 D 30 E 2 - 24 A2-8 A High-performance heatsinks High performance heatsinks with hollow-fin profile - - - - - - high performance heatsinks for fan operation exclusively for forced convection preferably for radial or tangential fans hollow fin geometry optimises the air flow particularly effective heat dissipation milled flat base (except length 1000 mm) B art. no. 17 64 84 0,5 8 Rz10 0,08 0,07 0,06 0,05 0,04 0,03 0,02 0,01 D 0,1 100 SK 497 ... 100 5,2 165 1 art. no. 200 300 400 [mm] E Rth [K/W] v = 5 m/s 15 60 75 76 0,5 6,5 Rz10 0,1 100 SK 498 ... please indicate: C Rth [K/W] v = 5 m/s 0,08 0,07 0,06 0,05 0,04 0,03 0,02 0,01 5 F 100 200 300 215 1,2 400 [mm] ... ... surface SA = black anodised AL = raw degreased aluminium 150 200 250 300 1000 mm 8,5 G v = 5 m/s Rth [K/W] H 0,08 0,07 0,05 71 A 0,06 0,04 SK 440 SK 458 SK 441 SK 461 0,03 C 0,02 I 0,01 6 B 100 art. no. SK SK SK SK 440 458 441 461 number of fins ... ... ... ... please indicate: A 84 1 84 1 84 1 88 1 15 19 23 31 ... 150 200 300 1000 mm 200 300 [mm] K dim. [mm] B 200 1.2 250 1.4 300 1.6 400 2 C 16 16 16 20 L ... surface SA = black anodised AL = raw degreased aluminium M High capacity cooling aggregat. Cooling aggregates with radial fan Heatsinks with hollow fin profile Hollow-fin cooling aggregates D D D D 26 33 30 15 - - - - 29 35 31 25 Heatsink-cooling aggregates Cooling aggreg. in segment mount. Miniature cooling aggregates Technical introduction D 14 D5 D 9 - 11 A2-8 D 30 N A High performance heatsinks with hollow-fin profile B - - - - - high capacity heatsinks for fan operation preferably for radial- or tangential fan motors universal modular design exclusively for forced convection flow-optimized hollow fin geometry minimum order quantity: 1000 kg, samples on request 5 5 70 62 52 43 D F SK SK SK SK SK SK 603 604 605 606 607 608 5 5 5 G 23 5 number of fins ... ... ... ... ... ... please indicate: 20 A art. no. E 81,5 112 C dim. [mm] A 200 250 300 350 400 500 25 32 39 45 52 65 ... fin height 430 = 43 mm 520 = 52 mm 620 = 62 mm 700 = 70 mm 815 = 81.5 mm 1120 = 112 mm ... ... surface SA = black anodised ME = clear anodised 200 300 400 500 mm SK 603 H Rth [K/W] v = 11 m/s 0,06 0,05 0,04 I SK 603 430 SK 603 520 SK 603 620 SK 603 700 SK 603 815 SK 603 1120 0,03 0,02 0,01 100 K 150 200 250 300 350 400 450 500 [mm] SK 604 Rth [K/W] v = 11 m/s 0,05 L 0,04 SK 604 430 SK 604 520 SK 604 620 SK 604 700 SK 604 1120 0,03 0,02 0,01 M 100 150 200 250 300 350 SK 604 815 400 500 [mm] N D 31 High capacity cooling aggregat. Cooling aggregates with radial fan Heatsinks with hollow fin profile Hollow-fin cooling aggregates D D D D 26 33 30 15 - - - - 29 35 31 25 Heatsink-cooling aggregates Cooling aggreg. in segment mount. Miniature cooling aggregates Technical introduction D 14 D5 D 9 - 11 A2-8 A High performance heatsinks with hollow-fin profile SK 605 Rth [K/W] B v = 11 m/s 0,040 0,035 0,030 C 0,025 0,020 SK 605 430 SK 605 520 SK 605 620 SK 605 700 SK 605 815 SK 605 1120 0,015 0,010 100 150 200 250 300 350 400 450 D 500 [mm] SK 606 Rth [K/W] v = 11 m/s E 0,035 0,030 0,025 0,020 SK 606 430 SK 606 520 SK 606 620 0,015 0,01 100 150 200 250 300 350 SK 606 1120 450 400 F SK 606 700 SK 606 815 500 [mm] SK 607 Rth [K/W] G v = 11 m/s 0,020 SK 607 430 SK 607 520 SK 607 620 SK 607 815 SK 607 1120 0,015 0,010 0,005 200 250 300 350 400 450 500 550 H SK 607 700 600 [mm] SK 608 Rth [K/W] I v = 11 m/s 0,016 0,014 K 0,012 SK 608 430 0,010 0,008 0,006 200 250 300 350 400 450 SK 608 520 SK 608 620 SK 608 700 SK 608 815 SK 608 1120 500 550 L 600 [mm] M High capacity cooling aggregat. Cooling aggregates with radial fan Heatsinks with hollow fin profile Hollow-fin cooling aggregates D D D D 26 33 30 15 - - - - 29 35 31 25 Heatsink-cooling aggregates Cooling aggreg. in segment mount. Miniature cooling aggregates Technical introduction D 14 D5 D 9 - 11 A2-8 D 32 N A Cooling aggregates with radial fan High performance cooling aggregate B C - - - - - - - optimised air flow due to hollow fin geometrie very good thermal performance optimized high performance construction with radial fan milled flat mounting surface for semiconductor cover plate for fin side upon request additional customized treatment upon request fan condenser: art. no. LAHLR K 2 art. no. Rth [K/W] 0,10 0,08 0,06 0,04 0,02 D 11 0,5 100 200 300 400 500 600 [mm] 1000 max. 162 160 +1,5 -1 LA 25 ... F 165 83 0,5 E 0,1 100 Rz10 art. no. Rth [K/W] 0,08 0,06 0,04 0,02 G 0,1 100 Rz10 84 0,5 165 17 0,5 100 200 300 400 500 600 [mm] H 165 0,5 LA 26 ... please indicate: 162 1000 max. ... I 200 300 400 500 600 mm Technical data of the fans ... 230 K L M N type ebmpapst, radial blower with grid, double sided absorbtion bearing type ball bearing discharge air flow 435 m3/h rotation speed 1,950 min-1 power inout 87 W current consumption 0.39 A temperature range -25C... +40C circuit voltage 230 V AC motor condenser 2 F/400 V noise level 58 dB(A) weight 1,500 g D 33 Drilling pattern for Solid State Relais Mounting for TO 3 angle High capacity heatsinks Cooling aggreg. in segment mount. A 12 A 125 - 128 A 57 - 58 D5-7 Miniature cooling aggregates heatsinks for Solid State Relais Hole pattern Technical introduction D 9 - 12 135 - 136 A 21 A2-8 A Cooling aggregates with radial fan High performance cooling aggregate - - - - - - - optimised air flow due to hollow fin geometrie very good thermal performance optimized high performance construction with radial fan milled flat mounting surface for semiconductor cover plate for fin side upon request additional customized treatment upon request fan condenser: art. no. LA 20 K 6 B art. no. C Rth [K/W] 0,035 0,025 D 0,015 0,005 100 200 300 400 600 [mm] 500 276 LA 20 ... please indicate: 300 Rz10 241 126 1,6 27 1 E 1,6 225 0,1 100 F (1000 max.) ... 200 300 400 500 600 mm G Technical data of the fans ... 230 bearing type ball bearing type ebmpapst, radial blower with grid, double sided absorbtion discharge air flow 1,310 m3/h rotation speed 1,350 min-1 power inout 185 W current consumption 0.81 A circuit voltage 230 V AC temperature range -25C... +70C motor condenser 6 F noise level 64 dB(A) weight 5,900 g H I K L M Drilling pattern for Solid State Relais Mounting for TO 3 angle High capacity heatsinks Cooling aggreg. in segment mount. A 12 A 125 - 128 A 57 - 58 D5-7 Miniature cooling aggregates heatsinks for Solid State Relais Hole pattern Technical introduction D 9 - 12 135 - 136 A 21 A2-8 D 34 N A Cooling aggregates with radial fan High performance cooling aggregate B - other lengths upon request - fan condenser: art. no. LAHLR K 2 art. no. Rth [K/W] 0,09 0,07 C 0,05 100 200 300 500 600 [mm] Rz16 0,5 70 1 165 D 400 E F 170 1 LAHLR 1 500 162 500 2 max. construction: solid frame construction with inner animation and carrier plates, thermally connected by soldering weight: 6,300 g material: aluminium alloy surface: blanc, milled flat Technical data of the fans ... 230 G H I type ebmpapst, radial blower with grid, double sided absorbtion bearing type ball bearing discharge air flow 435 m3/h rotation speed 1,950 min-1 power inout 87 W current consumption 0.39 A temperature range -25C... +40C circuit voltage 230 V AC motor condenser 2 F/400 V noise level 58 dB(A) weight 1,500 g K L M N D 35 Drilling pattern for Solid State Relais Mounting for TO 3 angle High capacity heatsinks Cooling aggreg. in segment mount. A 12 A 125 - 128 A 57 - 58 D5-7 Miniature cooling aggregates heatsinks for Solid State Relais Hole pattern Technical introduction D 9 - 12 135 - 136 A 21 A2-8 A Protection grid for fans - - - - protection against contact as per EN 294 aerodynamic contruction minimized noise modification only low modification of the air flow B 32 0,4 O 29 1,5 +0,3 0,8 art. no. LAGI 40 C 4,7 +1 O 4 +0,3 suitable for cooling aggregate LAM 2/ LAM 4/ LAM 4 K 1,5 +0,3 50 0,6 O 53 1 D 4,7 +1 O 4 +0,3 art. no. LAGI 60 suitable for cooling aggregate LAM 1/ LA (V) 6/ LA (V) 7/ LA (V) 8/ LA 27 K 71,5 0,6 E 1,5 +0,3 O 75 1,2 F O 4 + 0,3 art. no. LAGI 80 4,7 +1 suitable for cooling aggregate LA (V) 9/ LA (V) 10/ LA (V) 11 82,5 0,6 1,5 O 89 G +0,3 1,5 H O 4 +0,3 art. no. LAGI 92 4,7 +1 suitable for cooling aggregate LA 2/ LA (V) 21/ LA (V) 22 104,8 0,8 1,5 +0,3 5,4 O 11 O 4 +0,3 art. no. LAGI 119 I 1,5 K L 4,7 +1 suitable for cooling aggregate LA 1/ LA 4/ LA 5/ LA (V) 14/ LA (V) 15/ LA (V) 17/ LA (V) 18/ LA HL (V) 1/ LA HL (V) 2/ LA HL (V) 3 / LA HL D1 material: High capacity cooling aggregat. Cooling aggregates with radial fan Heatsinks with hollow fin profile Hollow-fin cooling aggregates steel wire, nickel-plated D D D D 26 - 29 33 - 35 30 15 - 25 Heatsink-cooling aggregates Cooling aggreg. in segment mount. Miniature cooling aggregates Technical introduction D 14 D5 D 9 - 11 A2-8 D 36 M N Thermal conductive material Guide rails for PCBs Mounting material for semiconductorsMounting material for mechanical components Thermal conductive material - large standard programme for thermal conductive pastes and glues, silicone-, GEL-, and foam foils (Gap Filler), cuts, tapes, tubes and caps - thermal conductive electrically insulating foils - customer specific productions made in our in-house punching shop Guide rails for PCBs - for horizontal and vertical assembly - suitable for sheet thicknesses of 0.5 - 1.85 mm - with and without lock mechanism - slim an wide designs - screwable and snapable versions, extractors with locking pin fixing - special designs upon request Mounting material for semiconductors - mounting disc for discrete devices such as transistors, capacitors and LEDs - electrically insulating mounting of the transistors - simple and fast assembly - insulating clamping pins for various semiconductors for increasing the dielectric strength - cover and insulating cap for transistors Mounting material for mechanical components - distance bolts made of metal and plastics with inner or outer thread - clamp mounting made of aluminium and plastics for mounting the heatsinks and cases on the mounting rail acc. to DIN EN 50022 - anti-vibration device for minimizing the noise and resonance A Silicon-rubber insulating material for semiconductors B C D E F A: washer B: insulating cap C: insulating tube D: cuts G Our thermal conduction wafers effect following advantages: - good surface contact as material is flexible - reduced production costs as a matter of mounting without thermal conducting paste (clean and fast) - spring-back of the elastic material protects the transistor against damage - free of any toxic substances H Customer specific versions: - punching and cuts of our thermal conductive foil according to drawing - sold per sheet or by the meter - other foils, plastics, papers, etc. upon request I The thermal details refer to an area of 1 inch2 (6.45 cm2). K L M Thermal conductive foil GEL thermal conductive foils Thermal conductive paste Thermal conductive glue E E E E 7 - 10 12 - 15 21 - 22 23 - 24 Heatsinks for PCB Heatsinks for BGA Extruded heatsinks Technical introduction A 89 - 112 B 17 - 20 A 22 - 83 A2-8 E2 N A Silicone rubber insulating material for semiconductors - other cuttings on request B 30 50 10,9 28,2 42 5,5 15 20,5 22 17,1 11 16,5 17,5 7,5 O 3,1 4 17,5 30 O 3,9 O 3,1 15 20,5 16,9 24 O 3,1 F O 4,2 R 18 2xO2 42 11 36 5,5 29 11 30 D E R 10 2 x O 1,5 R 14,5 R6 2 x O2 2 x O 4,2 5,5 C 2 2 2 x O 3,1 16 17,4 20 10 20 21 O 3,1 6 18 17 13,5 18 15 24 O3 G H 13 21 O 3,2 I 15 15 15 7,5 O 3,1 O 2,5 O 3,2 K 18 9 8 4 7,5 5,5 11 60 7,3 11 L M N E3 Thermal conductive foil GEL thermal conductive foils Thermal conductive paste Thermal conductive glue E E E E 7 - 10 12 - 15 21 - 22 23 - 24 Heatsinks for PCB Heatsinks for BGA Extruded heatsinks Technical introduction A 89 - 112 B 17 - 20 A 22 - 83 A2-8 A Thermally conductive foil made of siliconelastomer foil type material foil WS silicone foil, standard foil WG silicone foil, GF reinforced foil WK silicone foil, GF reinforced, one-sided selfadhesive foil WB silicone foil, GF reinforced B Washer TO-3 TO-3 M TO-3/4 TO-3 PF 3158 TOP 3 TOP 3/1 TO 218 (Multiwatt) TO 247 TO 220 4 X TO 220 3159 TO 126 SOT 32 TO 247/1 WS WS WS WS WS WS WS 3 3M 3/4 3P 3158 TOP 3 TOP 3/1 WG 3 WK 3 WB 3 WG 3 P WK 3/4 WK 3 P WK 3158 C WB 3 P WB 3158 D WK TOP 3/1 WG 218 WS WS WS WS 247 220 4 220 3159 WK 247 WK 220 WG 220 WB 220 WK 3159 WK 126 WK 32 E WB 3159 WS 247/1 Insulating tube F TO-220 O 11 mm, WSC-220 length 25 mm TO-3 PF O 13.5 mm, WSC-3 P length 25 mm TO-247 O 14.5 mm, WSC-247 length 30 mm G Insulating tube as meterpiece TO-220 O 11 mm TO-3 PF O 13.5 mm WSM-220 WSM-3 P Tape material (width) 24 mm 30 mm 36 mm 85 mm 300 mm H WKT 24 WST 30 WST 36 WST 85 WBT 30 WGT 300 Foil WS WKT 300 I WBT 300 Foil WG Foil WK Foil WB material thickness 0.3 mm 0.2 mm 0.15 mm material hardness 75 Shore A 87 Shore A 90 Shore A dielectric strength 10 kV 6.5 kV 3 kV thermal resistance 0.4 K/W 0.42 K/W 0.45 K/W 0.34 K/W 1.22 W/m*K 1.13 W/m*K 0.92 W/m*K 1.43 W/m*K thermal conductivity insulation resistance 2.9*1015 extensibility *cm 100 % 5.7*1015 K 1.6*1015 *cm *cm 2% 4% temperature range -60C... +180C class of flammibility UL 94 V-0 L M Thermal conductive foil GEL thermal conductive foils Thermal conductive paste Thermal conductive glue E E E E 7 - 10 12 - 15 21 - 22 23 - 24 Heatsinks for PCB Heatsinks for BGA Extruded heatsinks Technical introduction A 89 - 112 B 17 - 20 A 22 - 83 A2-8 E4 N A Insulating cap B D B C D E WSI WSI WSI WSI WSI art. no. type 220 210 220 225 TOP 3 235 TOP 3 280 TO 3 PL TO 220 TO 220 TOP 3 TO 3 PL/TO 247 TO 3 PL/TO 247 dim. [mm] A 11 11 18 16 22 B 21.0 22.5 23.5 28.0 34.0 Foil WSI material thickness C 5.0 5.0 5.0 5.0 5.5 D 0.9 0.3 0.9 0.3 0.9 Foil WSI 0.9 mm material hardness F C A 0.3 mm 75 Shore A dielectric strength 15 kV 10 kV thermal resistance 0.96 K/W 0.4 K/W thermal conductivity 1.22 W/m*K insulation resistance 2.9*1015 *cm extensibility 100 % temperature range -60C... +180C class of flammibility UL 94 V-0 G H I K L M N E5 Thermal conductive foil GEL thermal conductive foils Thermal conductive paste Thermal conductive glue E E E E 7 - 10 12 - 15 21 - 22 23 - 24 Heatsinks for PCB Heatsinks for BGA Extruded heatsinks Technical introduction A 89 - 112 B 17 - 20 A 22 - 83 A2-8 A Thermal conductive foil one-sided adhesive B C - - - - - one-sided acrylate adhesive coating, silicone-free carrier material good thermal characteristics with high operating temperature thin material thickness for optimal thermal resistance high dielectric strength, electrically insulating cuttings and customised cut-outs acc. to customer specific requirements art. no. WLFT 8943 D type of delivery plates, usable area 300x200mm E WLFT 8943 description one-sided adhesive, filled Copolymer overall thickness 0.17 mm filling material ceramic specific thermal resistance F 4.7C cm2/W thermal conductivity 0.4 W/m*K temperature range -40C... +150C volume resistance 2.5*1013 /cm dielectric strength 62,7 kV/mm peel strength at ambient temperature and 24 h G 6 N/cm class of flammibility UL 94 V-0 H I K L M Thermal conductive material Heatsinks for PCB Profiles for PCB mounting Heatsinks for transistors E2-5 A 89 - 93 A 89 - 112 C4-9 GEL thermal conductive foils Spacers Insulating distance sleeves Technical introduction E 12 - 15 E 40 E 32 - 33 A2-8 E6 N A Thermally conductive foil both sides adhesive B C D - - - - good thermal charactaristics double-sided adhesive layers replaces mechanical fastenings cuttings and cut-outs upon request art. no. E WLFT WLFT WLFT WLFT WLFT WLFT 404 404 404 404 414 414 F R25 R50 R100 R200 R25 R50 art. no. G WLFT WLFT WLFT WLFT WLFT 404 404 404 414 414 H description width [mm] 25 50 100 200 25 50 100x100 100x200 200x200 100x100 100x200 type of delivery art. no. sold by the meter sold by the meter sold by the meter sold by the meter sold by the meter sold by the meter dimensions [mm] type of delivery 100x100 plate 100x200 plate 200x200 plate 100x100 plate 100x200 plate WLFT WLFT WLFT WLFT WLFT WLFT 414 414 405 405 405 405 R100 R200 R25 R50 R100 R200 art. no. WLFT WLFT WLFT WLFT 414 405 405 405 200x200 100x100 100x200 200x200 WLFT 404 WLFT 414 WLFT 405 0.15 mm 0.03 polyimide (Kapton MT) 0.025mm aluminium foil 0.05mm acrylate (pressure sensitive) double-sided thermal conductivity 0.4 W/m*K 0.5 W/m*K 3.7C cm2/W 3.4C cm2/W temperature range -30C... +125C holding force (overlapping) L dimensions [mm] type of delivery 200x200 plate 100x100 plate 100x200 plate 200x200 plate 0.127 mm 0.03 specific thermal resistance K sold by the meter sold by the meter sold by the meter sold by the meter sold by the meter sold by the meter non insulating, double-sided adhesive glue layer I type of delivery insulating, double sided adhesive overall thickness truss material width [mm] 100 200 25 50 100 200 holding force (shear rate) 0.86 MPa Al 25C 0.897 [MPa]/ Al 150C 0.345 [MPa]/ Cu 25C 0.828 [MPa]/ Cu 150C 0.31 [MPa]/ Al2O3 25C 1.17 [MPa]/ Al2O3 150C 0.34 [MPa] dielectric strength 0.93 MPa Al 25C 0.897 [MPa]/ Al 150C 0.345 [MPa] Al 25C 0.86 [MPa]/ Al 150C 0.38 [MPa]/ Cu 25C 1.1 [MPa]/ Cu 150C 0.48 [MPa]/ Al2O3 25C 1.0 [MPa]/ Al2O3 150C 0.41 [MPa] 5 kV (AC) class of flammibility UL 94 V-0 M N E7 Thermal conductive material Heatsinks for PCB Profiles for PCB mounting Heatsinks for transistors E2-5 A 89 - 93 A 89 - 112 C4-9 GEL thermal conductive foils Spacers Insulating distance sleeves Technical introduction E 12 - 15 E 40 E 32 - 33 A2-8 A Thermally conductive foil both sides adhesive B C D - - - - - - double sided adhesive layer optimal adhesion of different substrates very good thermal conductivity, electrical insulating easy handling due to double sided protection foil optimized surface moistening and excellent impact strength cutouts and different punchings according to customer drawing art. no. WLFT 8805 WLFT 8810 WLFT 8815 WLFT 8820 WLFT 8940 E type of delivery plates, usable area 300x200mm plates, usable area 300x200mm plates, usable area 300x200mm plates, usable area 300x200mm plates, usable area 300x200mm WLFT 8805 description WLFT 8810 F G WLFT 8815 WLFT 8820 WLFT 8940 double sided adhesive, filled acrylic polymer overall thickness 0.13 mm 0.25 mm 0.38 mm 0.5 mm filling material ceramic protection cover silicone treated polyester, 37.5 - 50 m thermal conductivity 0.6 W/m*K specific thermal resistance 3.1C cm2/W temperature range 5.7C cm2/W 7.6C 5.2*1011 /cm 3.9*1011 /cm 5.8 N/cm 8.3 N/cm dielectric strength 9.7C cm2/W permanent up to 150C 3.8*1011 /cm 37 kV/mm peel strength at ambient temperature and 72 h class of flammibility H 0.9 W/m*K cm2/W permanent up to 100C volume resistance 0.19 mm I 2.5*1013 /cm 55 kV/mm 9.8 N/cm 11.9 N/cm UL 746 C 6 N/cm UL 94 V-0 K L M Thermal conductive material Heatsinks for PCB Profiles for PCB mounting Heatsinks for transistors E2-5 A 89 - 93 A 89 - 112 C4-9 GEL thermal conductive foils Spacers Insulating distance sleeves Technical introduction E 12 - 15 E 40 E 32 - 33 A2-8 E8 N A High thermoconducting graphite foils B C D E F G - - - - - - high-compressed anisotropic natural graphite very good thermal characteristics optimal for heat spreading high operating temperature range different material thicknesses and coatings upon request customer specified cuttings and stampings acc. to drawing art. no. WLFG WLFG WLFG WLFG WLFG WLFG 9010 9010 9010 9015 9015 9015 R R R R R R 25 50 100 25 50 100 width [mm] 25 50 100 25 50 100 type of delivery art. no. sold by the meter sold by the meter sold by the meter sold by the meter sold by the meter sold by the meter WLFG 9010 description WLFG WLFG WLFG WLFG WLFG WLFG 9020 R 25 9020 R 50 9020 R 100 S 900 K R 25 S 900 K R 50 S 900 K R 100 WLFG 9015 base film made of graphite, electrically conductive sold by the meter sold by the meter sold by the meter sold by the meter sold by the meter sold by the meter WLFG 9020 WLFG S 900 K adherent layer on one side overall thickness 0.15 mm 0.2 mm 0.25 mm 0.175 mm thermal resistance 0,09 K/W 0,07 K/W 0,23 K/W 0,08 K/W thermal conductivity z (x/y) 5.5 (55) W/m*K 6 (55) W/m*K 4 (55) W/m*K 7.5 (<450) W/m*K specific thermal resistance 36C mm2/W 28.8C mm2/W 72C mm2/W 34C mm2/W temperature range I type of delivery graphite foil, electrically conductive version H width [mm] 25 50 100 25 50 100 -40C... +500C hardness range 30 Shore D tensile strength 5.5 N/mm2 6 N/mm2 elongation at break 10 % tightness g/cm3 1 class of flammibility 5.5 N/mm2 10 N/mm2 5% <1.6 g/cm3 UL 94 V-0 K L M N E9 Thermal conductive material Heatsinks for PCB Profiles for PCB mounting Heatsinks for transistors E2-5 A 89 - 93 A 89 - 112 C4-9 GEL thermal conductive foils Spacers Insulating distance sleeves Technical introduction E 12 - 15 E 40 E 32 - 33 A2-8 A Heat conductive silicon foam foil B C - - - - - elastomer foam with closed cell structure good heat conductor e.g. between components, heatsinks and casing parts electrical insulating can be compressed even with a low contact pressure absorbs shocks and vibrations art. no. WSF 16 WSF 32 WSF 635 WSFS 635 D material thickness [mm] 1.60 0.4 3.20 0.8 6.35 1.2 6.35 1.2 E Thermal resistance at 3.2 mm material thickness: compression % contact 10 25 50 contact pressure PSI Rth K/W (1 in2 >1 x 3.2 mm) 6 heat conductivity W/mK 0.3 5 12 34 F 4.5 2.5 1 0.4 0.45 0.65 - WSFS 635 double sided adhesive and WSF adhesive upon request - according to NASA gas emission requirements WSF version no adhesive thermal conductivity G WSFS 635 one-sided self-adhesive 0.108 W/m*K (substrate) hardness range 13 Shore D H compression, 25% 18 PSI temperature range -62C... +205C extensibility 150 % tensile strength 120 PSI dielectric strength 4 kV/mm tightness I 1.118 g/cm3 class of flammibility UL 94 V-1 (at thickness 3.2mm) plates 914x914mm/ cuttings on customer's requirements type of delivery K L M Thermal conductive material GEL thermal conductive foils Thermal conductive paste Thermal conductive glue E E E E 2-5 12 - 15 21 - 22 23 - 24 Kapton insulator washers Heatsinks for PGA Heatsinks for BGA Technical introduction E 16 B 11 - 16 B 17 - 20 A2-8 E 10 N A Silicone free thermal adhesive foils B C D E - - - - silicone free gap-filler with good thermal characteristics smooth, compressible and elastic cut outs, punchings and modifications according to customer specification other material thicknesses upon request art. no. material thick- Rth (100 kPa) Rth (100 kPa) art. no. material thick- Rth (100 kPa) Rth (100 kPa) ness [mm] ness [mm] [C in2/W] [C cm2/W] [C in2/W] [C cm2/W] 0.2 0.2 GEL F 15 10 1.06 6.56 GEL F 15 G 10 1.16 7.55 1.0 1.0 GEL F 15 15 1.44 8.01 GEL F 15 G 15 1.52 9.22 1.5 0.2 1.5 0.2 0.3 0.3 GEL F 15 20 1.83 11.26 GEL F 15 G 20 1.93 10.89 2.0 2.0 version GEL F 15 GEL F 15 G standard polyamide film mash reinforced thermal conductivity F 1.5 W/m*K volume resistance 2 *103 M/m hardness range 53 Shore 00 temperature range -40C... +105C extensibility 150 % dielectric constant G H 9,12 [50 Hz] / 8,55 [1 kHz] / 5,83 [1 MHz] dielectric loss factor 0,152 [50 Hz] / 0,135 [1 kHz] / 0,034 [1 MHz] dielectric strength 11 kV/mm tightness 2.1 g/cm3 class of flammibility UL 94 V-0 on both sides covered with protective foil/ plates, usable area 300x200mm/ cuttings on customer's requirements type of delivery I K L M N E 11 Thermal Thermal Thermal Thermal conductive conductive conductive conductive material foil paste glue E E E E 2-5 7 - 15 21 - 22 23 - 24 Extruded heatsinks Heatsinks for LEDs Heatsink profile-overview Technical introduction A 22 - 83 B 35 - 48 A 13 - 17 A2-8 A Gel thermal conducting foils B C - highly heat-conductive silocon foil - smooth, elastic and compressible - equals uneven surfaces very well (Gap-Filler) art. no. GEL GEL GEL GEL GEL GEL GEL GEL GEL GEL 05 10 15 20 25 30 35 40 45 50 material thick- Rth (100 kPa) Rth (100 kPa) ness [mm] [C in2/W] [C cm2/W] 0.69 4.45 0.5 0.1 0.2 1.03 6.64 1.0 1.39 8.96 1.5 0.2 1.52 9.78 2.0 0.3 2.10 13.58 2.5 0.3 2.35 15.15 3.0 0.3 2.56 16.51 3.5 0.3 3.25 20.95 4.0 0.4 3.38 21.82 4.5 0.4 3.52 22.70 5.0 0.5 art. no. GEL GEL GEL GEL GEL GEL GEL GEL GEL GEL GEL version G G G G G G G G G G material thick- Rth (100 kPa) Rth (100 kPa) ness [mm] [C in2/W] [C cm2/W] 0.63 4.04 0.5 0.1 0.2 1.17 7.56 1.0 1.59 10.27 1.5 0.2 2.07 13.33 2.0 0.3 2.61 16.81 2.5 0.3 2.89 18.66 3.0 0.3 3.35 21.63 3.5 0.3 3.56 22.96 4.0 0.4 3.89 25.10 4.5 0.4 4.22 27.23 5.0 0.5 05 1 15 2 25 3 35 4 45 5 GEL G 05 - 25 standard 1.5 W/m*K volume resistance E F GEL G 3 - 5 polyamide film mash reinforced, adherent layer on one side thermal conductivity D G 1*106 M/m hardness range 49 Shore 00 temperature range -60C ... +200C extensibility 100 % 60 % dielectric constant H 5.8 [50 Hz]/ 5.6 [1 KHz]/ 5.5 [1 MHz] dielectric loss factor 0.048 [50 Hz]/ 0.015 [1 KHz]/ 0.003 [1 MHz] dielectric strength 14 kV/mm (AC) tightness 8 kV/mm (AC) 2.6 class of flammibility UL 94 V-0 type of delivery g/cm3 UL 94 V-1 UL 94 V-0 on both sides covered with protective foil/ plates, usable area 300x200mm/ cuttings on customer's requirements I K L M Thermal Thermal Thermal Thermal conductive conductive conductive conductive material foil paste glue E E E E 2-5 7 - 15 21 - 22 23 - 24 Extruded heatsinks Heatsinks for LEDs Heatsink profile-overview Technical introduction A 22 - 83 B 35 - 48 A 13 - 17 A2-8 E 12 N A Gel thermal conducting foils B C - - - - D E F GEL thermal conductive foils with very good thermical characteristics for balancing non-planarities and differences in components (Gap Filler) soft, elastic and compressible customer specific cuts and punchings according to drawing art. no. GEL GEL GEL GEL GEL GEL GEL GEL GEL 28 28 28 28 28 28 28 28 28 05 10 15 20 25 30 35 40 50 material thick- Rth (100 kPa) Rth (100 kPa) ness [mm] [C in2/W] [C cm2/W] 0.15 0.23 1.48 0.5 0.2 0.44 2.76 1.0 0.61 3.82 1.5 0.2 0.3 0.80 5.00 2.0 0.90 5.65 2.5 0.3 0.3 1.10 6.90 3.0 1.27 7.97 3.5 0.3 0.3 1.39 8.69 4.0 1.67 10.47 5.0 0.3 art. no. GEL GEL GEL GEL GEL GEL GEL GEL GEL 28 28 28 28 28 28 28 28 28 G G G G G G G G G 05 10 15 20 25 30 35 40 50 material thick- Rth (100 kPa) Rth (100 kPa) ness [mm] [C in2/W] [C cm2/W] 0.15 0.29 1.85 0.5 0.2 0.47 2.99 1.0 0.72 4.53 1.5 0.2 0.3 0.97 6.07 2.0 1.15 7.23 2.5 0.3 0.3 1.23 7.69 3.0 1.35 8.46 3.5 0.3 0.3 1.67 10.47 4.0 1.92 12.02 5.0 0.3 GEL 28 version G standard thermal conductivity volume resistance 3.6*104 M/m 50 Shore 00 temperature range 55 Shore 00 -60C ... +200C extensibility 64 % dielectric constant 32 % 8,98 [50 Hz] / 8,63 [1 kHz] / 8,05 [1 MHz] dielectric loss factor I polyamide film mash reinforced 2.5 W/m*K hardness range H GEL 28 G 0.0826 [50 Hz]/0.0300 [1 kHz]/0.0052 [1 MHz] dielectric strength 15 kV/mm tightness 2.7 g/cm3 class of flammibility UL 94 V-0 type of delivery on both sides covered with protective foil/ plates, usable area 300x200mm/ other dimensions upon request K L M N E 13 Thermal Thermal Thermal Thermal conductive conductive conductive conductive material foil paste glue E E E E 2-5 7 - 15 21 - 22 23 - 24 Extruded heatsinks Heatsinks for LEDs Heatsink profile-overview Technical introduction A 22 - 83 B 35 - 48 A 13 - 17 A2-8 A Thermal adhesive foils B - - - - C gap filler with exceptionally good thermal conductivity and low outgassing especially smooth, compressible and elastic cut outs, punchings and modifications according to customer specification other material thicknesses upon request art. no. GEL GEL GEL GEL GEL GEL GEL GEL GEL GEL 45 45 45 45 45 45 45 45 45 45 05 10 15 20 25 30 35 40 45 50 material thick- Rth (100 kPa) Rth (100 kPa) ness [mm] [C in2/W] [C cm2/W] 0.61 3.94 0.5 0.15 0.2 0.96 6.27 1.0 1.30 8.42 1.5 0.2 1.52 9.85 2.0 0.3 1.71 11.08 2.5 0.3 1.94 12.52 3.0 0.3 0.35 2.20 14.20 3.5 2.46 15.88 4.0 0.4 0.45 2.68 17.34 4.5 2.84 17.34 5.0 0.5 art. no. GEL GEL GEL GEL GEL GEL GEL GEL GEL GEL 45 45 45 45 45 45 45 45 45 45 G G G G G G G G G G 05 10 15 20 25 30 35 40 45 50 material thick- Rth (100 kPa) Rth (100 kPa) ness [mm] [C in2/W] [C cm2/W] 0.64 4.17 0.5 0.15 0.2 0.97 6.28 1.0 1.71 11.06 1.5 0.2 1.71 11.06 2.0 0.3 2.03 13.11 2.5 0.3 0.3 2.28 14.76 3.0 0.35 2.54 16.40 3.5 2.80 18.12 4.0 0.4 0.45 3.03 19.56 4.5 3.22 20.82 5.0 0.5 GEL 45 version polyamide film mash reinforced 4.5 W/m*K volume resistance 1.4*105 hardness range E F GEL 45 G standard thermal conductivity D G /cm 45 Shore 00 temperature range -60C ... +200C extensibility 50 % dielectric constant H 8,98 [50 Hz] / 8,63 [1 kHz] / 8,05 [1 MHz] dielectric loss factor 0,0249 [50 Hz] / 0,0219 [1 kHz] / 0,00675 [1 MHz] dielectric strength 11 kV/mm tightness 3.2 g/cm3 class of flammibility UL 94 V-0 on both sides covered with protective foil/ plates, usable area 300x200mm/ cuttings on customer's requirements type of delivery I K L M Thermal Thermal Thermal Thermal conductive conductive conductive conductive material foil paste glue E E E E 2-5 7 - 15 21 - 22 23 - 24 Extruded heatsinks Heatsinks for LEDs Heatsink profile-overview Technical introduction A 22 - 83 B 35 - 48 A 13 - 17 A2-8 E 14 N A Gel thermal conducting foils B - - - - GEL silicone foils with especially high thermal conductivity balances non-planarities and differences in components (Gap Filler) soft, elastic and compressible cuts, punchings and special designs according to customer specifications art. no. C GEL GEL GEL GEL GEL 60 60 60 60 60 05 10 15 20 25 material thick- Rth (100 kPa) Rth (100 kPa) ness [mm] [C in2/W] [C cm2/W] 0.1 0.20 1.30 0.5 0.33 2.11 1.0 0.2 0.2 0.53 3.45 1.5 0.61 3.91 2.0 0.3 0.3 0.72 4.67 2.5 D art. no. GEL GEL GEL GEL GEL 05 10 15 20 25 GEL 60 G standard thermal conductivity polyamide film mash reinforced 6 W/m*K volume resistance 1*106 M/m hardness range 52 Shore 00 temperature range -60C ... +200C extensibility 80 % dielectric constant 6.4 [50 Hz]/6.4 [1 kHz]/6.4 [1 MHz] dielectric loss factor F G G G G G GEL 60 version E 60 60 60 60 60 material thick- Rth (100 kPa) Rth (100 kPa) ness [mm] [C in2/W] [C cm2/W] 0.1 0.21 1.37 0.5 0.31 1.99 1.0 0.2 0.2 0.48 3.08 1.5 0.62 4.00 2.0 0.3 0.3 0.77 4.96 2.5 0.035 [50 Hz]/0.005 [1 kHz]/0.001 [1 MHz] dielectric strength 13 kV/mm tightness 3.2 g/cm3 class of flammibility UL 94 V-0 type of delivery on both sides covered with protective foil/ plates, usable area 300x200mm/ other dimensions upon request G H - especially soft design - levels smallest air gaps and unevennesses - cuts and contours with cutouts according to customer specifaction art. no. I K L material thick- Rth (100 kPa) Rth (100 kPa) art. no. material thick- Rth (100 kPa) Rth (100 kPa) 2 2 ness [mm] ness [mm] [C in /W] [C cm /W] [C in2/W] [C cm2/W] GEL 27 S 25 2.5 0.94 6.05 GEL 27 S 50 5.0 1.69 10.91 version: standard thermal conductivity: 2.7 W/m*K volume resistance: 2*107 M/m hardness range: 53 Shore 00 temperature range: -60C ... +200C extensibility: 45 % dielectric strength: 15 kV/mm tightness: 3 g/cm3 class of flammibility: UL 94 V-0 type of delivery: on both sides covered with protective foil/ plates, usable area 300x200mm/ other dimensions upon request M N E 15 Thermal Thermal Thermal Thermal conductive conductive conductive conductive material foil paste glue E E E E 2-5 7 - 15 21 - 22 23 - 24 Extruded heatsinks Heatsinks for LEDs Heatsink profile-overview Technical introduction A 22 - 83 B 35 - 48 A 13 - 17 A2-8 A Kapton insulator washers - - - - - - - - - - - very low thermal resistance optimised heat conductivity best mechanical charactaristics polyimide-carrier foil with silicone-free phase changing thermal conductive layer completely coated on both sides clean processing, no abrasion of the coating stacked foils do not stick together good resistance against cleening agents no cold flow low pressure force necessary, thus particularly applicable for spring-fixing of semiconductors cuttings and special versions according to customer's requirements the thermal details refer to an area of 1 inch2 (6.45 cm2) B C O 3,1 18 23 24 21 13 18 21 10000,5 D 6 18 24 E 3050,5 art. no. KAP 247 O suitable for pre-cut parts (plate) TO 248/ TO 218/ TO 247 art. no. KAP 218 O TO 218 O 4,2 O 4,2 16 23 TO 248/ TO 218/ TO 247 F O 4,2 34 5,5 5,5 13 4,5 TO 220 O 4,2 O 3,1 18 7 art. no. KAP 218 O 1,5 O 1,5 O 3,1 art. no. KAP 220 O 11 29 art. no. KAP 1 P 13,5 18 G 17 17 13 30 8,5 47 42 art. no. KAP 220 G art. no. KAP 220 K art. no. KAP 3 G art. no. KAP 3 K TO 220 TO 220 TO 3 TO 3 H KAP material polyimide-carrier foil with silicone-free phase changing thermal conductive layer completely coated on both sides material thickness I 0.077mm (substrate 0.05mm) thermal conductivity 0.45 W/m*K (substrate) insulation resistance 1014 thermal resistance 0.15 K/W [at 1 temperature range inch2; K = 6.45 cm2; = TO 3 (KAP 3)] -40C... +150C phase change temperature 52 C extensibility 30 % dielectric strength 7.8 kV class of flammibility L UL 94 V-0 M Profiles for PCB components Heatsinks for PCB Profiles for PCB mounting Heatsinks for transistors A 91 A 89 - 93 A 89 - 112 C4-9 Finger-shaped heatsinks C2-3 Distance sleeves for PCBs in HP grid E 39 Spacers E 40 Technical introduction A2-8 E 16 N A Aluminium oxide wafers 0.02 mm 0.15 mm O 3,7 0.11 mm 4.5 mm 0.054 mm 1.5 mm 4 25 art. no. AOS 3 P 0.076 mm O 4,9 1.5 mm 4,9 17,5 0.15 mm O 3,1 O 3,1 4 art. no. AOS 220 1.5 mm 0.054 mm 7,3 11 3,7 art. no. AOS 32 1.5 mm 0.033 mm 8 2,5 9,5 O 3,2 art. no. AOS 5 0.061 mm 1.5 mm art. no. AOS 93 0.032 mm 2.3 mm 0.03 mm art. no. AOS 18 1.5 mm 0.023 mm O 4,3 40,5 2.9 mm 14,7 9,7 16,9 13,2 5,1 19,2 11 26,2 4,2 O 4,3 33,3 art. no. AOS 3 art. no. AOS 66 0.123 mm 2.5 mm 0.10 mm K AOS material AL2O3 - ceramics thermal resistance 0.3 K/W [at 1 inch2; = 6.45 cm2; = TO 3 (AOS 3 G)] specific electrical resistance L 1.5 mm 15 20,5 18 3 mm 0.15 mm 14 18 0.054 mm 10,9 5,1 art. no. AOS 3 P SL 17,5 21 R 7,5 20 4 art. no. AOS 220 4 O 3,1 art. no. AOS 127 I 14 18 art. no. AOS 220 SL 1 mm O4 O4 G H 0.02 mm 14 14 art. no. AOS 220 3 F 1.5 mm 4 14 18 19,3 1.6 mm art. no. AOS 3 P 2 O 3,2 14,5 E art. no. AOS 218 247 1 15 20,5 12 D 3 mm 23 8 art. no. AOS 218 247 18 25 O O,9 art. no. AOS 247 7 18 25 O 3,1 12 7 21 21 23 1 mm 16 O4 20 C O 3,6 O4 O 1,1 B - other thicknesses and versions on request = thickness; = flatness >1014 /cm thermal conductivity 25 W/m*K dielectric constant 9 linear expansion coefficient ~8*10-6/K snap through stability 10 kV/mm M N E 17 Thermal conductive material GEL thermal conductive foils Thermal conductive paste Thermal conductive glue E E E E 2-5 12 - 15 21 - 22 23 - 24 Thermal conductive foil Kapton insulator washers Mica wafers Technical introduction E 7 - 10 E 16 E 19 A2-8 A Aluminium oxide wafers according to customer's instructions - laser-cut versions with outer dimensions and cutouts according to customer's requirements - other plate dimensions upon request - max. plate dimension 180 x 180 mm B C D E F G material thickness [mm] 2.000 2.540 1.500 1.270 1.000 0.800 0.635 0.500 0.400 0.300 0.250 outer dimensions [mm] 114x114 114x114 114x114 114x114 114x114/ 165x115/ 160x113 114x114/ 165x115/ 160x113 106.5x106.5/ 114x114/ 165x115/ 160x113 106.5x106.5/ 114x114 106.5x106.5/ 114x114 106.5x106.5/ 114x114 106.5x106.5/ 114x114 H I K L M Thermal conductive material GEL thermal conductive foils Thermal conductive paste Thermal conductive glue E E E E 2-5 12 - 15 21 - 22 23 - 24 Thermal conductive foil Kapton insulator washers Mica wafers Technical introduction E 7 - 10 E 16 E 19 A2-8 E 18 N A Mica wafers O 4,1 O 3,1 13,5 17,5 21 11 20 C D 24 art. no. GS 220 C TO 220 art. no. GS 218 TO 218 18 18 art. no. GS 3 P SL TOP 3 art. no. GS 66 P TO 66 O 4,2 O 3,1 4 5,3 15 20,5 18 O4 O 3,7 12 B art. no. GS 220 4 TO 220 O2 O 3,1 3,7 11 4 10,9 30 4 17,5 E 8 12 O 3,1 15 20,5 18 17 13,2 43 F art. no. GS 220 P TO 220 art. no. GS 32 P SOT 32 art. no. GS 3 P TOP 3 art. no. GS 3 TO 3 GS G material muskovit material thickness 0.05 mm thermal resistance (GS 3) 0.4 K/W insulation resistance 3*1017 *cm snap through stability 5 kV H I K L M N E 19 Thermal conductive material Thermal conductive foil GEL thermal conductive foils Thermal conductive paste E E E E 2-5 7 - 10 12 - 15 21 - 22 Thermal conductive glue Kapton insulator washers Aluminium oxide wafers Technical introduction E 23 - 24 E 16 E 17 - 18 A2-8 A Free standing film B C - - - - - - - - - - - self-supporting differential phase changing thermal interface material, contains no substrate (Free Standing Film) materials with phase change temperature at 52 C; best thermal conductivity, exceeding phase change temperature point, material flows into all gaps between components and heatsink thixotropic, does not migrate from the interface area no lowering of thermal conductivity though thermal cycling application with very low contact pressure, due to non elastomeric material, particularly suitable for clamp mounting of components electrically non-conductive, but not an insulator self adhering characteristics, also suitable for large areas no toxic ingredients custom required shapes on request all with protection foil on both sides art. no. FSF 52 P basin plate, protection foil on both sides E dimensions [mm] 330x343x0.127 0.025 F FSF 52 P phase change temperature D 52 C colour white tightness 2 g/cm3 thermal conductivity 0.9 W/m*K G 0.03 K/W 0.031 N/mm2 thermal resistance (1 in2, TO 3) at contact pressure of temperature range +200C adhesive holding force 0.35 N/mm2 class of flammibility UL 94 V-0 dielectric constant H 3.8 [1 kHz] 3.4 [1 MHz] I K L M Mica wafers Thermal conductive foil Thermal conductive paste Thermal conductive glue E E E E 19 7 - 10 21 - 22 23 - 24 Thermal conductive material Insulating caps Aluminium oxide wafers Technical introduction E2-5 E 51 E 17 - 18 A2-8 E 20 N A Thermal transfer compounds Silicon thermal transfer compound B - thermal transfer compound used to reduce the thermal transmission resistance between semiconductor and heatsink C D E WLP WLP WLP WLP WLP art. no. 004 035 500 300 S 500 S basin box box box cartridge (310 ml) cartridge (310 ml) delivery quantity [g] 4 35 500 300 500 Silicone-free thermal transfer compound - thermal transfer compound used to reduce the thermal transmission resistance between semiconductor and heatsink F G H WLPF WLPF WLPF WLPF WLPF art. no. 05 10 20 50 300 S basin syringe syringe syringe syringe cartridge (310 ml) composition I delivery quantity [ml] 2 5 10 20 -- WLP WLPF silicone oil, inorganic filling material silicone free synthetic liquid. Metal oxide filling. consistance pastey colour tightness thermal conductivity K white white-grey 1.1 g/cm3 approx. 2 g/cm3 0.61 W/m*K >0.7 W/m*K specific electrical resistance flashpoint >1012 /cm none (DIN 53213) drop point of the basic oil >280C (ISO 2592) >260C thermal resistance L delivery quantity [g] -- -- -- -- 300 no bleeding at (4 h/200C) <1% (96 h/200C) temperature range -40C ... +250C -40C... +150C acid number < 0.01 mg KOH/g solubility in water insoluble M N E 21 Mica wafers Thermal conductive foil Thermal conductive paste Thermal conductive glue E E E E 19 7 - 10 21 - 22 23 - 24 Thermal conductive material Insulating caps Aluminium oxide wafers Technical introduction E2-5 E 51 E 17 - 18 A2-8 A Thermal transfer compounds Ceramic filled, silicone-free thermal conductive paste with high thermal conductivity - - - - suitable especially for silicone-sensitive applications no drying out, hardening or melting of the thermal conductive paste high long-term stability further package sizes, container types such as cans, cartridge, etc. upon request B C D art. no. WLPK 3 WLPK 5 WLPK 10 basin syringe syringe syringe delivery quantity [ml] 3 5 10 E WLPK composition silicone-free, synthetic fluid ceramic filled consistance pastey colour F silver tightness 1.4 g/cm3 thermal conductivity 10 W/m*K dielectric strength not applicable, because conducting temperature range G -60C ... +150C solubility in water insoluble H I K L M Mica wafers Thermal conductive foil Thermal conductive paste Thermal conductive glue E E E E 19 7 - 10 21 - 22 23 - 24 Thermal conductive material Insulating caps Aluminium oxide wafers Technical introduction E2-5 E 51 E 17 - 18 A2-8 E 22 N A Thermally conductive adhesive B - - - - - thermally conductive, electrically non-conductive adhesive two part epoxy resin adhesive, metaloxide filled fully replaces mechanical fastenings excellent function and application characteristics to be stored at a cool and dark place C D art. no. WLK 5 composition 5 g resin/0.5 g hardener art. no. WLK 10 composition 10 g resin/1 g hardener art. no. WLK 30 composition 30 g resin/3 g hardener art. no. WLK 120 composition 120 g resin/12 g hardener E F G WLK thermal conductivity H 0.836 W/m*K specific thermal resistance 1.2 m*K/W volume resistance 1016 /cm temperature range -56C... +149C hardening time 20C approx. 16-24h / 25C approx. 8 h / 120C approx. 20 min glue layer Epoxid mixture proportion 10:1 I K L M N E 23 Thermal conductive material Thermal conductive foil GEL thermal conductive foils Thermal conductive paste E E E E 2-5 7 - 10 12 - 15 21 - 22 Thermal conductive glue fan cooler for Pentium and MMX heatsinks for Pentium III FC PGA Technical introduction E 23 - 24 B 59 B 57 A2-8 A Thermally conductive adhesive - - - - - solvent-free and thermal conductive two part adhesive epoxy based filled with aluminium oxide composition of hardener and resin (1:1) with statical mixing tube lockability of the container via Luer-Lock System good usage and working properties B C D art. no. WLK DK 4 WLK DK 10 WLK DK 50 basin syringe syringe cartridge contents of delivery 1x 4 ml syringe / 3x mixer WLK M4 1x 10 ml syringe / 3x mixer WLK M4 1x 50 ml cartridge / 3x mixer WLK M50 WLK DK thermal conductivity F 1 W/m*K specific thermal resistance 118C cm/W volume resistance 8*1011 /cm temperature range -50C... +145C working life at room temperature approx. 30 min hardening time 25C approx. 4 h/50C approx. 1 h/85C approx. 10 min/125C approx. 2 min glue layer E G Epoxid mixture proportion 1:1 Accessories H - more package sizes and container types upon request - store cool and dry art. no. WLK M 4 WLK M 50 WLK P contents of delivery 10x mixer fur 4 & 10 ml syringe (packing unit 10 pieces) 10x mixer fur 50 ml cartridge (packing unit 10 pieces) 1x applicator gun for 50 ml cartridge I K L M Thermal conductive material Thermal conductive foil GEL thermal conductive foils Thermal conductive paste E E E E 2-5 7 - 10 12 - 15 21 - 22 Thermal conductive glue fan cooler for Pentium and MMX heatsinks for Pentium III FC PGA Technical introduction E 23 - 24 B 59 B 57 A2-8 E 24 N A Fastening for mounting rail B C - - - - universal, solid plastic clip fastening for all 35 mm mounting rails suitable for rail material thicknesses from 1 to 2.3 mm according to DIN EN 60 715 (formerly DIN EN 50 022) registrated design DE 200 07 435.0 fast and easy mounting of heatsinks, casings etc. due to direct snap up on the mounting rail - - - - safe hold due to a stable extruded plastic profile with integrated spring back electroconductive material or surface on request special lengths and treatments on customer's request * = examples of mounting rail versions suitable for KL 35 K D 13,5 F 7,5 art. no. H 35 1,5 2,3 2,7 12,9 G 35 1 2,7 5,6 9 43,7 * 35 E dim. [mm] 15 art. no. KL 35 K 40 KL 35 K 50 40 50 material: rigid PVC heat distortion: -30C ... +80C colour: anthracite grey class of flammibility: UL 94 V-0 15 dim. [mm] KL 35 K 75 KL 35 K 100 75 100 - safe hold due to a stable extuded profile with integrated stainless steel spring - special lengths (40mm), treatments and surfaces on request - * = examples of mounting rail versions suitable for KL 35 I 1,5 37,5 35 1 35 35 K * 17 50 12,1 7,4 2,3 3,5 5 7,5 15 15 8,5 L art. no. KL 35 50 M N dim. [mm] 50 art. no. KL 35 75 material: aluminium surface: clear anodised E 25 Distance sleeves for PCBs in HP grid E 39 Extractors for guide rails E 30 Insulting clamping parts E 45 Vibration dampers E 41 dim. [mm] 75 art. no. dim. [mm] KL 35 100 Mounting pads for transistors Mounting parts for heatsinks Vibration dampers Technical introduction 100 E 47 E 49 E 41 A2-8 A Guide rails Screw-on type for eurocards connectors according to DIN 41612 or VG 95324 mountable high stability through inner reinforcements stable foot mounting trough inserted brass- thread inserts groove depth: 2.2 mm, groove width 1.9 mm suitable for PCB thicknesses from 0.5 to 1.85 mm * = printed circuit board B C 116,5 108 90 M4 x 7,5 7,8 O 2,8 5 - - - - - - - D 100 12 * A E 10,2 10,2 10 O 4,05 119,5 F G 1,5 11 37,5 2,75 90 15 B 16,4 art. no. H dim. [mm] A 151 FS 151 P B 2.5 art. no. 8 CLIP 151 2,5 O1,2 10 15 9,5 10,35 20 24,25 27,5 2,6 7,5 I K only for FS 151 P material: polycarbonate, GF reinforced temperature range: -40C... +125C class of flammibility: UL 94 V-0 L M Solder pins Snap-in guide rails Extractors for guide rails Insulting clamping parts E E E E 43 29 - 30 30 45 Distance sleeves for PCBs in HP grid E 39 Mounting pads for transistors E 47 Vibration dampers E 41 Technical introduction A2-8 E 26 N A Guide rails Screw-on type B 6 6 1,8 M3 A 2,4 8 3 art. no. C FS FS FS FS FS FS FS FS D E A 65 70 80 90 100 110 120 130 065 070 080 090 100 110 120 130 C dim. [mm] B 50 50 67 67 84 84 84 84 material: polycarbonate, GF reinforced temperature range: -20C... +130C thread nut: brass nickel-plated class of flammibility: UL 94 V-0 C 7 12 5 15 8 18 28 38 art. no. 109 18 2 G 4 2 8,5 3 F 6 6 6 6 6 6 6 6 B 14 5 art. no. 12,5 2,5 FS 109 100 93 2 8 7 8,5 7 3 9 M3 2 H 22 9 92 FS 100 2,2 5 8,5 1 100 92 8 7 5,5 85 K 12,5 2 * M3 art. no. 2,2 I 1,8 L MSVL 100 * = position of snap-in slot material: polyamide, GF reinforced temperature range: -40C... +205C class of flammibility: UL 94 V-0 M N E 27 Solder pins Snap-in guide rails Extractors for guide rails Insulting clamping parts E E E E 43 29 - 30 30 45 Distance sleeves for PCBs in HP grid E 39 Mounting pads for transistors E 47 Vibration dampers E 41 Technical introduction A2-8 A Guide rails Lockable mounting rails - - - - - lockable by pushing the plastic pin or the metal button no conductive connection to the PCB the PCB requires a snap-in slot in accordance to the drawing other position with locking device on request * = position of snap-in slot B 2 C O 3,1 6 A L 3 6 9,5 12,7 D 18,8 art. no. FS 85 50 FS 85 60 version without bolting device without bolting device dim. [mm] L A 50 42 FS 85 70 60 FS 85 52 art. no. version without bolting device without bolting device 8,5 * 2,2 dim. [mm] L A 70 62 85 E 76 5 5,5 1 F 2 O 7 2,2 L 6 G 6 A A O 1,8 3 O 3,1 9,5 12,7 18,8 3 art. no. MSVL 50 MSVL 60 version dim. [mm] L 50 60 with bolting device with bolting device art. no. A 42 52 MSVL 70 MSVL 85 material: polyamide, GF reinforced temperature range: -40C... +205C class of flammibility: UL 94 V-0 version with bolting device with bolting device dim. [mm] L 70 85 H A 62 76 I - the guide bars have got mounting holes for vertical and horizontal assembly of printed circuits - they can also be stacked together horizontally or vertically using pins and treatments 90 65 9 7 13,9 22 3,5 4 K 7 10 O8 3 4,5 O 2,5 2 80 O3 2,5 10 O 2,8 4 art. no. MSHV 90 material: polyamide, GF reinforced class of flammibility: UL 94 V-0 L M Solder pins Snap-in guide rails Extractors for guide rails Insulting clamping parts E E E E 43 29 - 30 30 45 Distance sleeves for PCBs in HP grid E 39 Mounting pads for transistors E 47 Vibration dampers E 41 Technical introduction A2-8 E 28 N A Guide rails Snap-in - narrow version E F art. no. FS FS FS FS FS FS FS S S S S S S S 06 07 08 10 11 12 13 2 B 6,4 A O 3,2 5,5 dim. [mm] art. no. L 63.5 76.2 88.9 101.6 114.3 127.0 139.7 2 2 2 2 2 2 2 R 1,5 3 3,4 D L 4,4 1,2 ... 2,2 1,2 3,2 C 3,2 6,2 B A 50.8 63.5 76.2 88.9 101.6 114.3 127.0 FS FS FS FS FS FS material: nylon, natural coloured temperature range: -40C... +120C class of flammibility: UL 94 V-2 S S S S S S 15 16 19 20 21 21 dim. [mm] A 139.7 152.4 177.8 190.5 203.2 203.2 L 152.4 165.1 190.5 203.2 215.9 215.9 2 2 3 3 2 3 B -- -- 88.9 95.2 -- 101.6 - wide version I K L art. no. FS FS FS FS FS FS FS FS FS BT BT BT BT BT BT BT BT BT 06 08 10 11 13 15 16 19 20 7,9 1,9 dim. [mm] L 63.5 88.9 101.6 114.3 139.7 152.4 165.1 190.5 203.2 5,7 art. no. A 38.1 63.5 76.2 88.9 114.3 127.0 139.7 165.1 177.8 FS FS FS FS FS FS FS FS material: nylon, natural coloured temperature range: -40C... +120C class of flammibility: UL 94 V-2 4,3 O 4,6 3,2 1,9 1,2 ... 2,3 4,5 R 2,2 version deep groove deep groove deep groove deep groove deep groove deep groove deep groove deep groove deep groove L FS BF ... A 12,7 4,3 3,2 4,4 H L FS BT ... 1,2 ... 2,3 7,9 1,9 G BF BF BF BF BF BF BF BF 06 07 10 11 13 15 19 20 version shallow groove shallow groove shallow groove shallow groove shallow groove shallow groove shallow groove shallow groove dim. [mm] L A 63.5 38.1 76.2 50.8 101.6 76.2 114.3 88.9 139.7 114.3 152.4 127.0 190.5 165.1 203.2 177.8 M N E 29 Solder pins Snap-in guide rails Extractors for guide rails Insulting clamping parts E E E E 43 29 - 30 30 45 Distance sleeves for PCBs in HP grid E 39 Mounting pads for transistors E 47 Vibration dampers E 41 Technical introduction A2-8 A Guide rails Ejectors - low profile - suitable for ejectors art. no. AHG V 14 und AHG V 17 B 7,9 2 L 12,7 2,6 05 07 08 10 11 13 L 50.8 76.2 88.9 101.6 114.3 139.7 4,4 C LP LP LP LP LP LP dim. [mm] A C 25.8 2.0 38.5 2.0 38.5 2.0 76.6 2.0 76.6 2.0 76.6 2.0 D A O 4,4 art. no. FS FS FS FS FS FS B 2,6 3 art. no. D 3.2 3.2 3.2 3.2 3.2 3.2 FS FS FS FS FS material: polyamide, GF reinforced temperature range: -40C... +120C class of flammibility: UL 94 V-0 LP LP LP LP LP dim. [mm] A B 127.4 -- 127.4 -- 153.2 -- 191.3 95.7 267.9 134.0 L 152.4 165.1 177.8 228.6 304.8 15 16 17 22 30 D 3,4 4,4 4 1,2 ... 2,3 C C 2.0 2.0 2.0 2.0 2.4 D 3.2 3.2 3.2 3.6 4.0 E F - deep guideway - bevelled entrance zone G H 3,3 11,3 L 6,35 2 6,35 6,35 1,27 A 6,35 4,8 6,4 R 2,3 12,7 art. no. FS U 06 FS U 11 FS U 20 material: polyamide, GF reinforced temperature range: -40C... +120C class of flammibility: UL 94 V-0 I B dim. [mm] A 38.1 88.9 177.8 L 63.5 114.3 203.2 4,62 1,3 1,2 ... 2,3 O 4,75 K B -- -- 88.9 L M Solder pins Snap-in guide rails Extractors for guide rails Insulting clamping parts E E E E 43 29 - 30 30 45 Distance sleeves for PCBs in HP grid E 39 Mounting pads for transistors E 47 Vibration dampers E 41 Technical introduction A2-8 E 30 N A Ejectors art. no. B O 2,2 0,76 O2 * = mounting dimensions; locking in FS LP art. no. O 2,2 3,2 O 2,8 O2 7,6 FS LP 1,6 3,2 6,4 19,8 6,9 14,3 14,3 PCB 28,4 7,9 6,4 10,8 6,4 3,2 * 0,76 O 2,4 14,3 * = mounting dimensions; locking in FS LP 3,2 art. no. 27,9 6,4 6,4 AHG V 17 14,3 O 2,4 6,4 O 2,8 6,4 AHG V 14 E F 10,8 1,6 6,4 D FS LP 3,2 C 6,4 14,3 14,3 * 28,7 6,9 7,9 PCB 7,6 6,4 3,2 R 3,2 O 2,4 R 3,6 art. no. 6,4 G 1,6 9,5 9,5 28,6 6,4 6,4 AHG K 27 12,7 R 3,2 R 3,6 AHG K 28 6,4 O 2,8 A 1,9 art. no. L 11 O 2,3 7,6 K 12,4 4 1,2 6,1 I 50,8 37,5 6,6 15 16,6 6,4 45 O 2,3 11,1 1,6 4,7 H dim. [mm] A 7.4 AHG L 7 material: nylon temperature range: -40C... +120C class of flammibility: UL 94 V-2 type of delivery: all ejectors with matching spring pin M N E 31 Solder pins Snap-in guide rails Extractors for guide rails Insulting clamping parts E E E E 43 29 - 30 30 45 Distance sleeves for PCBs in HP grid E 39 Mounting pads for transistors E 47 Vibration dampers E 41 Technical introduction A2-8 A Insulating spacers with internal and external thread B C D E field of applications: - insulated assembly of stacked PCB - insulated assembly of stacked heatsinks with varying capacities - insulated assembly of chassis plates in cases - insulated supports in the wiring - mechanicaly very stable as threads are made of brass - other lengths on request - dimensions = nominal size: deviation 0.5 mm - ... please indicate length "L" L D art. no. ISAB ISAB ISAB ISAB 25 A ... 3 A ... 4 A ... 6 A ... A 8.0 8.0 8.0 12.7 P' G A D' P F H dim. [mm] L 10/ 15/ 20/ 25 10/ 20 15/ 20 25 D/D' M2.5/M2.5 M3/M3 M4/M4 M6/M6 dielectric strength: 27 kV/mm creeping current resistance: CTI 600 thread inserts: brass temperature range: -30C... +85C (short term +200C) surface: raw plastic body: polyamide 66 colour: natural (opaque) P/P' 6.0 6.0 6.0 12.7 I K L M Spacers Screw mounted guide rails Ejectors Vibration dampers E E E E 40 26 - 30 31 41 Mounting material for semiconduct. Mounting parts for heatsinks Thermal conductive material Technical introduction E 44 - 48 E 49 - 50 E 2 - 24 A2-8 E 32 N A Insulating spacers with internal and external thread P' L B D A D' P C D art. no. ISAB ISAB ISAB ISAB ISAB 25 B ... 3 B ... 4 B ... 5 B ... 6 B ... A 8.0 8.0 8.0 9.5 12.7 dim. [mm] L 10/ 13/ 15/ 18/ 20/ 25/ 30 10/ 13/ 15/ 18/ 20/ 25/ 30/ 35/ 40 15/ 20/ 25/ 30/ 40 20/ 30/ 40 25/ 30/ 35/ 40/ 50 D/D' M2.5/M2.5 M3/M3 M4/M4 M5/M5 M6/M6 P/P' 6.0 6.0 6.0 10.0 12.7 - dimensions = nominal size: deviation 0.5 mm; at ISAB 3 C ... L=10 => P/P'=3.5 E L P D A D' P' F G H I art. no. ISAB ISAB ISAB ISAB ISAB ISAB 25 C ... 3 C ... 4 C ... 5 C ... 6 C ... 6 C ... A 8.0 8.0 8.0 9.5 12.7 12.7 dim. [mm] L 10/ 13/ 15/ 18/ 20/ 25/ 30 10/ 13/ 15/ 18/ 20 15/ 35 20 25 30 D/D' M2.5/M2.5 M3/M3 M4/M4 M5/M5 M6/M6 M6/M6 dielectric strength: 27 kV/mm creeping current resistance: CTI 600 thread inserts: brass temperature range: -30C... +85C (short term +200C) surface: raw plastic body: polyamide 66 colour: natural (opaque) P/P' 6.0 6.0 6.0 10.0 12.0 12.7 K L M N E 33 Spacers Screw mounted guide rails Ejectors Vibration dampers E E E E 40 26 - 30 31 41 Mounting material for semiconduct. Mounting parts for heatsinks Thermal conductive material Technical introduction E 44 - 48 E 49 - 50 E 2 - 24 A2-8 A Miniature spacers with threads B C - - - - - - D allows compact, insulated constructions reduced volume in case of stack assembly insulated mounting of heatsinks, PCB, housingparts etc. very good mechanical stability due to brass inserts dimensions = nominal size: deviation 0.5 mm ... please indicate length "L" +0,5 +0,5 6 L E S G O 6 art. no. ISAM 2 A ... ISAM 3 A ... F dim. [mm] S type of thread L 6 7 M2.5 M3 4/ 5/ 7/ 9/ 11/ 12 4/ 5/ 7/ 8/ 9/ 10 6 +0,5 L S -0,3 art. no. dim. [mm] S type of thread L 6 7 M2.5 M3 8/ 9/ 10/ 11 7/ 8/ 9/ 10/ 11/ 12 L I dim. [mm] S type of thread L 6 7 M2.5 M3 9 9/ 10/ 12 28 kV/mm creeping current resistance: CTI 600 thread inserts: brass temperature range: -30C... +85C (short term +200C) surface: raw plastic body: polyamide 6 colour: natural (opaque) E E E E 40 26 - 30 31 41 max. diameter of the bushing 6 7 K L dielectric strength: Spacers Screw mounted guide rails Ejectors Vibration dampers H G art. no. ISAM 2 C ... ISAM 3 C ... max. diameter of the bushing 6 7 S -0,3 4 -0,3 O 4 G G O 4 ISAM 2 B ... ISAM 3 B ... max. diameter of the bushing 6 7 Mounting material for semiconduct. Mounting parts for heatsinks Thermal conductive material Technical introduction M E 44 - 48 E 49 - 50 E 2 - 24 A2-8 E 34 N A Distance hexagonal bolts insulating B C D F field of applications: - insulated assembly of stacked PCBs - insulated assembly of stacked heatsinks with varying capacities - insulated assembly of chassis plates in cases - insulated supports in the wiring - mechanicaly very stable, as threads are made of brass - other lengths on request - dimensions = nominal size: deviation 0.5 mm - ... please indicate length "L" P A P' D G L D' E H I K art. no. ISAS ISAS ISAS ISAS ISAS 25 30 40 50 60 A A A A A ... ... ... ... ... A 6.35 6.35 8.00 9.50 12.70 dim. [mm] L 15/ 20/ 25/ 30/ 35/ 40 15/ 20/ 25/ 30/ 35/ 40/ 45/ 50 15/ 20/ 25/ 30/ 35/ 40/ 45/ 50 20/ 25/ 30/ 35/ 40/ 45/ 50 25/ 30/ 35/ 40/ 45/ 50/ 60 D/D' M2.5/M2.5 M3/M3 M4/M4 M5/M5 M6/M6 dielectric strength: 27 kV/mm creeping current resistance: CTI 600 thread inserts: brass temperature range: -30C... +85C (short term +200C) surface: raw plastic body: polyamide 66 colour: natural (opaque) P/P' 6.0 6.0 6.0 10.0 12.7 L M N E 35 Spacers Screw mounted guide rails Ejectors Vibration dampers E E E E 40 26 - 30 31 41 Mounting material for semiconduct. Mounting parts for heatsinks Thermal conductive material Technical introduction E 44 - 48 E 49 - 50 E 2 - 24 A2-8 A Distance hexagonal bolts insulating P A L B D D' P' art. no. ISAS ISAS ISAS ISAS ISAS 25 30 40 50 60 B B B B B ... ... ... ... ... A 6.35 6.35 8.00 9.50 12.70 C dim. [mm] L 15/ 20/ 25/ 30/ 35/ 40 15/ 20/ 25/ 30/ 35/ 40/ 45/ 50 15/ 20/ 25/ 30/ 35/ 40/ 45/ 50 20/ 25/ 30/ 35/ 40/ 45/ 50 25/ 30/ 35/ 40/ 45/ 50/ 60 D/D' M2.5/M2.5 M3/M3 M4/M4 M5/M5 M6/M6 P/P' 6.0 6.0 6.0 10.0 12.7 D L P A P' D' D art. no. ISAS ISAS ISAS ISAS ISAS 25 30 40 50 60 C C C C C ... ... ... ... ... A 6.35 6.35 8.00 9.50 12.70 E dim. [mm] L 15/ 20/ 25/ 30/ 35/ 40 15/ 20/ 25/ 30/ 35/ 40/ 45/ 50 15/ 20/ 25/ 30/ 35/ 40/ 45/ 50 20/ 25/ 30/ 35/ 40/ 45/ 50 25/ 30/ 35/ 40/ 45/ 50/ 60 D/D' M2.5/M2.5 M3/M3 M4/M4 M5/M5 M6/M6 dielectric strength: 27 kV/mm creeping current resistance: CTI 600 thread inserts: brass temperature range: -30C... +85C (short term +200C) surface: raw plastic body: polyamide 66 colour: natural (opaque) P/P' 6.0 6.0 6.0 10.0 12.7 F G H I K L M Spacers Screw mounted guide rails Ejectors Vibration dampers E E E E 40 26 - 30 31 41 Mounting material for semiconduct. Mounting parts for heatsinks Thermal conductive material Technical introduction E 44 - 48 E 49 - 50 E 2 - 24 A2-8 E 36 N A Spacers with internal and external thread B - other lengths and threads on request - ... please indicate length "L" L 0,1 P D D' P' C H art. no. D E F G H GBM GBM GBM GBM GBM GBM GBM GBM GBM GBM GBM GBM GBM GBM GBM GBM 2550 2550 2550 2550 3050 3050 3050 3050 4070 4070 4070 4070 4070 5080 5080 5080 H 5 5 5 5 5 5 5 5 7 7 7 7 7 8 8 8 ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... dim. [mm] L 5 10 15/ 20 25/ 30/ 35 5 10/ 12/ 14 15/ 18/ 20 25/ 30/ 35/ 40/ 45/ 50 5 10 15 20 25/ 30/ 35/ 40/ 45/ 50 10 15/ 20 25/ 30/ 35/ 40/ 45/ 50 D/D' M2.5 M2.5 M2.5 M2.5 M3 M3 M3 M3 M4 M4 M4 M4 M4 M5 M5 M5 material: brass surface: 6 m nickel-plated, solderable P 6 6 6 8 8 8 8 10 8 8 8 8 10 8 8 10 P' 2.5 5.0 8.0 10.0 2.5 5.0 10.0 10.0 2.5 5.0 8.0 10.0 10.0 5.0 6.0 10.0 P 8 8 8 8 8 8 P' 7 8 10 7 9 10 - other lengths and threads on request - ... please indicate length "L" L 0,1 P D D' P' I H art. no. K L GBP GBP GBP GBP GBP GBP 3060 3060 3060 4080 4080 4080 H 6 6 6 8 8 8 ... ... ... ... ... ... dim. [mm] L 10 12 15/ 18/ 20/ 25/ 30 10 12 15/ 18/ 20/ 25/ 30/ 35/ 40/ 45 D/D' M3 M3 M3 M4 M4 M4 material: polyamide, GF reinforced temperature range: -30C... +110C colour: black M N E 37 Spacers Screw mounted guide rails Ejectors Vibration dampers E E E E 40 26 - 30 31 41 Mounting material for semiconduct. Mounting parts for heatsinks Thermal conductive material Technical introduction E 44 - 48 E 49 - 50 E 2 - 24 A2-8 A Distance sleeves with internal thread - other lengths and threads on request - ... please indicate length "L" B L 0,1 P D D' P' C H art. no. ABM ABM ABM ABM ABM ABM ABM ABM ABM ABM ABM 2550 2550 2550 3050 3050 3050 4070 4070 4070 5080 5080 ... ... ... ... ... ... ... ... ... ... ... H 5 5 5 5 5 5 7 7 7 8 8 dim. [mm] L 5/ 8/ 10/ 12/ 15 18 20/ 25/ 30/ 35/ 40/ 45/ 50 5/ 8/ 9/ 10/ 12/ 13/ 15 16/ 18/ 19 20/ 25/ 29/ 30/ 35/ 40/ 45/ 50 5/ 8/ 10/ 12/ 15 18 20/ 25/ 30/ 35/ 40/ 45/ 50 5/ 12/ 15 20/ 30/ 40/ 50 D/D' M2.5 M2.5 M2.5 M3 M3 M3 M4 M4 M4 M5 M5 material: brass surface: 6 m nickel-plated, solderable P =L 8 10 =L 8 10 =L 9 10 =L 10 P' -- 8 10 -- 8 10 -- 9 10 -- 10 - other lengths and threads on request - ... please indicate length "L" D D' H art. no. ABP ABP ABP ABP ABP ABP ABP 2550 2550 3060 3060 3060 4080 4080 ... ... ... ... ... ... ... F P' H H 5 5 6 6 6 8 8 E G L 0,1 P D dim. [mm] L 10 15/ 20/ 25/ 30 10/ 12/ 15 20 25/ 30 10/ 15/ 20 30/ 40 D/D' M2.5 M2.5 M3 M3 M3 M4 M4 material: polyamide, GF reinforced temperature range: -30C... +110C colour: black P =L 6 =L 8 10 =L 10 P' -- 6 -- 8 10 -- 10 I K L M Spacers Screw mounted guide rails Ejectors Vibration dampers E E E E 40 26 - 30 31 41 Mounting material for semiconduct. Mounting parts for heatsinks Thermal conductive material Technical introduction E 44 - 48 E 49 - 50 E 2 - 24 A2-8 E 38 N A Distance sleeves for PCB in HP grid B C D - these internally threaded distance sleeves mount PCBs to the correct pitch for insertion into subracks - ABM TE: spacer between two PC boards - ABM TE ... DIN:spacer between two PC boards, one of them equipped with DIN-connector resp. A front panal/PCB Interconnection deviece VS 1 - spacers with internal and external thread to HP grid on request E F art. no. suitable for TE ABM TE 04 ABM TE 06 ABM TE 08 4 6 8 dim. [mm] L 18.72 28.88 39.04 P/P' 8 8 8 dim. [mm] L 12.72 22.88 33.04 P =L 8 8 G H art. no. 4 6 8 material: brass surface: 8 m nickel-plated, solderable - ... please indicate length "L" L 0,1 OD K ABM TE 04 DIN ABM TE 06 DIN ABM TE 08 DIN L art. no. AHM 3260... AHM 4380... M N dim. [mm] A 6 8 D 3.2 4.3 L 1/ 2/ 3/ 4/ 5/ 6/ 7/ 8/ 9/ 10/ 12/ 15/ 18/ 25/ 30 2/ 3/ 4/ 5/ 6/ 7/ 8/ 9/ 10/ 12/ 15/ 18/ 20 material: brass surface: 8 m nickel-plated, solderable E 39 OA I suitable for TE Spacers Screw mounted guide rails Ejectors Vibration dampers E E E E 40 26 - 30 31 41 Mounting material for semiconduct. Mounting parts for heatsinks Thermal conductive material Technical introduction E 44 - 48 E 49 - 50 E 2 - 24 A2-8 A Distance spacers - special lengths on request B DR DR DR DR DR DR DR DR art. no. 071 V0 072 V0 073 V0 074 V0 075 V0 076 V0 077 V0 078 V0 C [mm] 1 2 3 4 5 6 7 8 DR DR DR DR DR DR DR DR art. no. 079 V0 710 V0 711 V0 712 V0 713 V0 714 V0 715 V0 720 V0 C [mm] 9 10 11 12 13 14 15 20 DR DR DR DR DR DR DR art. no. 725 V0 730 V0 735 V0 740 V0 745 V0 750 V0 760 V0 C [mm] 25 30 35 40 45 50 60 C D E DR DR DR DR DR DR DR DR art. no. 081 V0 082 V0 083 V0 084 V0 085 V0 086 V0 087 V0 088 V0 C [mm] 1 2 3 4 5 6 7 8 DR DR DR DR DR DR DR DR art. no. 089 V0 810 V0 811 V0 812 V0 813 V0 814 V0 815 V0 820 V0 C [mm] 9 10 11 12 13 14 15 20 DR DR DR DR DR DR DR art. no. 825 V0 830 V0 835 V0 840 V0 845 V0 850 V0 860 V0 C [mm] 25 30 35 40 45 50 60 F G H DR DR DR DR art. no. 105 V0 110 V0 115 V0 120 V0 C [mm] 5 10 15 20 art. no. DR 125 V0 DR 130 V0 DR 135 V0 material: polyamide heat distortion: 180C temperature range: +180C colour: black class of flammibility: UL 94 V-0 C [mm] 25 30 35 art. no. DR 140 V0 DR 145 V0 DR 150 V0 C [mm] 40 45 50 I K L M Spacers Screw mounted guide rails Ejectors Vibration dampers E E E E 40 26 - 30 31 41 Mounting material for semiconduct. Mounting parts for heatsinks Thermal conductive material Technical introduction E 44 - 48 E 49 - 50 E 2 - 24 A2-8 E 40 N A Contructional elements to vibration damping and insulation B C - universal applicable round metal, antivibration buffers for solving vibration problems - other lengths and hardness range on request - ... please indicate height "H" Field of applications: - reduction of dynamic component stress - vibration insulation for disc drives and motors - impact reducing on sensitive instruments - reduction of the noise level - prevention of vibration resonance phenomena (amplified effect) - compensation of mechanical inbalances L G L H D OD art. no. SMP 410 A ... SMP 415 A ... SMP 515 A ... type of thread M4 M4 M5 OD 10 15 15 L 10 10 12 L' E dim. [mm] H 10 15 15 H G L F OD art. no. SMP 410 B ... SMP 415 B ... SMP 515 B ... type of thread M4 M4 M5 L' 4 4 5 L 10 10 12 L' G H 10 15 15 dim. [mm] OD 10 15 15 H G H I K OD art. no. dim. [mm] H 15/ 20 15/ 20 20 SMP 410 C ... SMP 415 C ... SMP 515 C ... type of thread M4 M4 M5 OD 10 15 15 material: rubber-metal connection rubber: natural rubber (NR according to ISO) hardness range: ~ 50 Shore A extensibility and tebsile strength: very good colour: black metall parts: steel tin-plated temperature range: -40C... +80C (short term +90C) L' 4 4 5 L M N E 41 Screw mounted guide rails Ejectors Insulating distance sleeves Spacers E E E E 26 - 28 31 32 - 39 40 Insulting clamping parts Mounting parts for heatsinks Mounting material for semiconduct. Technical introduction E 45 E 49 - 50 E 44 A2-8 A Solder terminals art. no. O 2,4 B 3,5 1, 5 1 7,5 1,2 1,2 O 3,8 O 4,4 LSD 07520 art. no. C 2,5 O2 D 1 3,5 8,9 1,5 O1 O 3,8 O 4,4 LSD 08910 art. no. 2,5 O2 E 3,5 1,5 1 8,9 O1 O 3,8 O 4,4 LSD 08920 art. no. F O2 1,5 3,5 1 G O 3,8 O 1,5 4,7 13,5 2,5 O1 LSD 13510 O 4,4 art. no. O2 2,5 1,5 3,5 1 13,5 4,7 LSD 13520 H O1 O 3,8 O 1,5 I O 4,4 material: insulating body: PTFE (teflon) contact pin: brass, 2 m Ni, 4 m Ag temperature range: -200C ... +260C K L M Screw mounted guide rails Ejectors Insulating distance sleeves Spacers E E E E 26 - 28 31 32 - 39 40 Insulting clamping parts Mounting parts for heatsinks Mounting material for semiconduct. Technical introduction E 45 E 49 - 50 E 44 A2-8 E 42 N A Solder pins 3,5 3 B 2,8 2,8 3 1,2 13 0,95 6,6 11,3 O 1,3 7 4 8,5 2,9 O 1,4 10 1,2 5 11,3 2,2 1,4 1,2 C 1,4 1,4 1,1 art. no. LS 101 art. no. LS 102 art. no. LS 103 art. no. LS 104 art. no. LS 105 0.6 mm 0.6 mm 0.6 mm 0.6 mm 0.5 mm 3,8 D 2,8 2,8 16 7 3,5 10,5 O 1,4 O 1,4 E F 1,2 1,4 art. no. LS 106 art. no. LS 107 0.8 mm 0.5 mm = thickness LS material brass, 6 m Sn G H I K L M N E 43 Solder terminals E Distance sleeves for PCBs in HP grid E Spacers E Insulting clamping parts E 42 39 39 - 40 45 Miniature distance sleeves Mounting material for semiconduct. Mounting parts for heatsinks Technical introduction E 34 E 44 - 48 E 49 - 50 A2-8 A Mounting kits for insulation of power transistors B C art. no. MST 3 for transistor TO 3 MSTS 3 TO 3 MST 220 TO 220 MSTS 220 TO 220 version contents of delivery with mica wafer GS 1 mica wafer, 2 insulator sleeves, 1 tin-plated solder lug, 2 cheese 3 head screws, nickel-plated, 2 screw nuts M3 nickel-plated with silicone wafer 1 silicone wafer, 2 insulator sleeves, 1 tin-plated solder lug, 2 WS 3 cheese head screws, nickel-plated, 2 screw nuts M3 nickel-plated with mica wafer GS 1 mica wafer, 1 tin-plated solder lug, 1 cheese head screw, nickel220 plated, 1 screw nut M3 nickel-plated with silicone wafer 1 silicone wafer, 1 insulator sleeve, 1 tin-plated solder lug, 1 WS 220 cheese head screw, nickel-plated, 1 screw nut M3 nickel-plated Snap rivet for quick fastening of TO 220 - detachable plastic snap rivet for quick fastening of transistors onto heatsinks and cooling plates (e.g. FK 212-CB, FK 216-CB, FK 222-220. FK 232. FK 233. FK 235-L 1) - suitable for material thickness: 1 - 1.5 mm - suitable for hole diameter: 3.5 - 4 mm - * = bottom view, pin not inserted D E F O 6,4 1,6 O 4,6 0,85 G 4,5 * 6,1 H O 3,5 art. no. EPN 1 for transistor TO 220 material: polysulphone, GF reinforced temperature range: -70C... +180C (5s+260C) class of flammibility: UL 94 V-0 I K L M Mounting parts for heatsinks Spacers Guide rails for PCBs Finger-shaped heatsinks E 49 - 50 E 40 E 26 - 30 C2-3 Vibration dampers Thermal conductive material Retaining springs for transistors Technical introduction E 41 E 2 - 24 A 115 - 117 A2-8 E 44 N A Insulating clamping parts for power transistors B art. no. 15,2 3 3,4 3,7 C Plastic insulating clamping parts for mounting transistors in cases TO 220, TO 218 and TO 247 for enhanced dielectric stengths - electrically insulating assembly of the transistor by means of a plastic clamping part - pin reaching into the hole of the transistor plate - fastening of clamping part onto the mounting plate by screws, no electroinsulating connection to the transistor - dielectric strength only determined by the insulating washer between transistor and mounting surface - no insulating bush necessary, thus no dielectric breakdown O3,4 10,1 O 3,7 D 8,5 4 6,5 ISP 220 art. no. 17,7 O 3,4 O 3,7 12,1 5,6 E 10 4,6 F 6,4 ISP 220 V art. no. 5,8 18,5 0,9 15,2 G O3,5 O 3,7 12,1 7 3,8 H ISP 218 art. no. O 3,7 20 2 24 7 I 3,8 13,1 ISP 247 K L material: polyamide 6, GF reinforced dielectric strength: <27 kV/mm heat distortion: 205C (1.8 MPa); 135C (8 MPa) dielectric constant: 8 [100 Hz]/4.5 [1 MHz] dielectric loss factor: 1300 [100 Hz] 450 [1 MHz] specific volume resistance: >1013 *cm colour: black class of flammibility: UL 94 V-0 M N E 45 Profiles for PCB components Heatsinks for PCB Profiles for PCB mounting Thermal conductive material A 91 A 89 A 89 - 112 E 2 - 23 Insulating distance sleeves Vibration dampers Aluminium oxide wafers Technical introduction E 32 - 34 E 41 E 17 - 18 A2-8 A Mounts O 9,4 O 9,2 3 O 9,2 O5,08 O9 O5,08 2,5 1 5 5 3 B 1 0,8 0,8 0,8 0, 8 O 0,8 5,08 O 9,2 O5,08 2,5 7 5,08 art. no. MS 53 3 art. no. MS 53 7 art. no. MS 53 25 art. no. MS 54 25 art. no. MS 58 5 TO 5 TO 5 TO 5 TO 5 TO 5-8 p. 1,5 9,5 O 9,2 O5,08 1 O 5,08 O 2,54 1 O 0,8 O9 0,8 8 TO 5-8 p. O 0,8 O 9,0 O 5,08 art. no. MS 56 15 art. no. MS 58 15 TO 5-6 p. TO 5-8 p. 9,2 5,08 3,5 2,5 D 0,8 0, art. no. MS 58 7 2,5 1,5 5,08 5,08 1,5 9,5 5,08 1,5 9,5 1 7 5 C 2,5 1 5,4 TO 5/ TO 18 5,5 2,54 2,5 2,5 3,5 E 2,5 1 O 2,54 art. no. MS 3518 35 TO 5/ TO 18 5,5 art. no. MS 34 518 art. no. MS 183 25 art. no. MS 184 25 art. no. MS 183 35 TO 5/TO 18 TO 18 TO 18 TO 18 5,4 0,8 3,5 7 2,54 2,5 1,75 5,1 7,1 5 4 F G 0,8 5 0, 0,8 1 0,8 2,5 10 5,4 7 5 2,54 2,5 2,54 5 0, 0,7 1 1 1 0,8 2,5 art. no. MS 3518 25 TO 5-10 p. 2,5 5,4 3,5 art. no. MS 510 15 art. no. MS 184 35 art. no. MS 183 7 art. no. MS 184 7 art. no. MS 84 4 art. no. MS 923 25 TO 18 TO 18 TO 18 TO 8 TO 92 4 9,9 7,62 2,5 2,54 O 0,9 2,54 3,6 4 3,2 1,5 5,08 9,9 5,08 O 1,3 H I art. no. MS 4016 art. no. US 58 4 art. no. US 512 4 max. 16 contacts TO 5 TO 5 K * = transfer washer: the US-pads convent the TO 5 pin circle to a pitch of 2.54 mm material: polyamide 6, GF reinforced temperature range: -40C... +205C class of flammibility: UL 94 V-0 (at thickness 3mm), UL 94 V-1 L M Mounting parts for heatsinks Heatsinks for PCB Profiles for PCB mounting Thermal conductive material E 49 - 50 A 89 - 93 A 89 - 112 E 2 - 24 Insulating distance sleeves Finger-shaped heatsinks Retaining springs for transistors Technical introduction E 32 - 34 C2-3 A 115 - 117 A2-8 E 46 N A Mounts Mounts for power transistors - for TO 220, TO 219, TO 202 and similar - for vertical and horizontal mounting - also suitable as mounting bracket for angled connections 10,8 1 5,6 3,2 1 B A C O 1,5 art. no. D E 1,3 B C colour MLW 32 MLW 44 MLW 51 dim. [mm] B -- 1.3 1.9 A 3.2 4.4 5.1 white white white material: polyamide 6 (nylon) temperature range: -40C... +120C class of flammibility: UL 94 V-2 C 7.1 7.1 7.1 Mounts for rectangular LEDs O 0,813 F - for LED 2x4 mm oder 2x5 mm - symmetric version for easy assembly - self-adhesive 5,2 2,5 4,2 1,25 C A G 2,3 max. B 1,3 O 0,64 O 1,1 O 0,51 H art. no. colour MRL 20 I A 2 white material: polyamide 6 (nylon) temperature range: -40C... +120C class of flammibility: UL 94 V-2 dim. [mm] B 0.5 C 1 K L M N E 47 Mounting parts for heatsinks Heatsinks for PCB Profiles for PCB mounting Thermal conductive material E 49 - 50 A 89 - 93 A 89 - 112 E 2 - 24 Insulating distance sleeves Finger-shaped heatsinks Retaining springs for transistors Technical introduction E 32 - 34 C2-3 A 115 - 117 A2-8 A Mounts for discrete components - suitable for various components e.g. resistors, capacitors etc. B D A F C B O 1,1 E B 1.1 1.1 1.1 dim. [mm] C D 0.55 1.3 0.55 2.3 0.55 2.3 art. no. E 4.6 6.9 7.4 F 2.3 3.2 2.3 MD A 09 MD A 12 A 7.6 10.2 0,81 0,64 MD A 04 MD A 06 MD A 07 A 2.5 3.8 5.1 0,76 2,5 O 0,89 dim. [mm] C D 0.66 3.6 0.76 4.8 B 1.1 1.1 C E 9.9 12.4 F 2.3 2.3 D B 1,3 2,5 art. no. O 1,7 E A art. no. A 7.6 10.2 11.4 art. no. B 5.1 7.6 8.9 dim. [mm] MD B 12 MD B 15 A 12.7 15.2 O 2,3 B 10.2 12.7 F 5,1 B 30 MD B 07 MD B 10 MD B 11 dim. [mm] 2,3 A O 1,1 G 7,4 art. no. MD C 13 dim. [mm] A 1.3 art. no. MD C 22 material: polyamide 6 (nylon) temperature range: -30C... +110C class of flammibility: UL 94 V-2 dim. [mm] A 2.2 B 0.89 H I K L M Profiles for PCB components Heatsinks for PCB Profiles for PCB mounting Thermal conductive material A 91 A 89 A 89 - 112 E 2 - 23 Insulating distance sleeves Finger-shaped heatsinks Retaining springs for transistors Technical introduction E 32 - 34 C2-3 A 115 - 117 A2-8 E 48 N A Mounting parts for heatsinks 7 4 10 O 7,3 10 4,2 4 9 4 2 20 26 7,3 B 4,2 art. no. C 5 for SK 01, 02, 03, 11, 14, 21, 30, 34, 36, 39, 46, 69; heatsink length: 50 mm art. no. 7 4 10 20 26 4,2 2 4 9 4 7 2 D 10 7,3 O 7,3 O 4,2 4,2 IS 1 O4 O 4,2 25,7 35,7 5 O4 5 E IS 2 19,5 29,5 5 for SK 01, 02, 03, 11, 14, 21, 30, 34, 36, 39, 46, 69; heatsink length: 37.5 75 100 mm art. no. 10 222 F 6,9 10 9,3 4,2 5,5 for SK 01, 02, 03, 11, 14, 21, 30, 34, 36, 39, 46, 69 16 12,5 1,8 34,5 G 14,6 14 o 4,2 o 7,3 H 11,6 IS 3 art. no. 2,7 8,6 IS 4 for SK 06 art. no. 3 7 10 5 7 for SK 20 art. no. 12 6,2 13 2,5 2,5 L M5 15 IS 6 M N 4 14,5 3 25 IS 5 K 2 M2,5 I for SK 67 material: polyamide 6, GF reinforced class of flammibility: UL 94 V-0 E 49 5 Heatsink profile-overview Profiles for PCB mounting Heatsinks for PCB Insulating distance sleeves A 13 - 17 A 89 - 112 A 89 - 93 E 32 - 34 Insulting clamping parts Mounting pads for transistors Mounting pads for single components Technical introduction E 45 E 47 E 48 A2-8 A Mounting parts for heatsinks art. no. 13 6,2 3 6 3,5 M5 5 10,5 IS 7 art. no. 24,5 13,5 B C 6,8 3 3 D 9,5 19,5 2 10 4,2 13 5 M3 IS 8 for SK 20 material: polyamide 6, GF reinforced class of flammibility: UL 94 V-0 E Sockets for power transistors TO 3 17 11,4 F O 3,3 4 5,9 14,6 10,9 0,8 1,5 O 5,5 17,5 O 6,4 30,2 O 5,5 39,8 art. no. TF 3 2 G no. of contacts 3 insulating body material: stanyl PA 4.6 contact: CuSn-alloy, CuSn 6; Ni 1-2m, Au 0.2m current rating: 15 A max. contact resistance: <10 m temperature range: -65C ... +290C capacity: 1 pF test voltage: 1650 V class of flammibility: UL 94 V-0 H I K L M Heatsink profile-overview Profiles for PCB mounting Heatsinks for PCB Insulating distance sleeves A 13 - 17 A 89 - 112 A 89 - 93 E 32 - 34 Insulting clamping parts Mounting pads for transistors Mounting pads for single components Technical introduction E 45 E 47 E 48 A2-8 E 50 N A Insulating caps - different transistor flange levels will be by the sleeves art. no. C 11 29 B O 3,2 30,2 43,6 IK 341 3 art. no. 26,5 D E F 41,3 12,3 11,6 IK 3 material: polyamide, GF reinforced pressed-in sleeves: brass, nickel-plated class of flammibility: UL 94 V-0 G H I K L M N E 51 Mica wafers Thermal conductive material Mounting for TO 3 angle Die-cast heatsinks E 19 E2-5 A 125 A 125 - 128 Aluminium oxide wafers Thermal conductive paste Thermal conductive glue Technical introduction E 17 - 18 E 21 - 22 E 23 - 24 A2-8 A Insulating bush O 7,1 2,6 4,2 1,8 2,2 1,2 1,9 2,5 4,7 1,05 1,5 1,4 O 3,2 O 3,1 O4 O 6,2 O 2,6 O3 O 4,4 O 6,3 O 3,9 O 4,2 O 6,3 O4 O 3,1 B O 9,2 O 9,3 C art. no. IB 1 / IBT 1 art. no. IB 2 / IBT 2 art. no. IB 3 / IBT 3 art. no. IB 4 / IBT 4 O6 O6 art. no. IB 5 O 3,1 O 3,5 O 3,3 O 4,3 art. no. IB 6 / IBT 6 2,3 1,2 4 3,5 1 7,5 2,2 1 O 3,1 O 3,5 D O 6,4 1 1,6 O8 O6 O 3,1 O 3,8 O 3,05 O 3,55 E art. no. IB 7 / IBT 7 art. no. IB 8 / IBT 8 art. no. IB 9 / IBT 9 art. no. IB 10 / IBT 10 O 2,6 O3 art. no. IB 11 / IBT 11 1,5 1 O 3,1 O 3,1 O 3,85 O 4,15 art. no. IB 12 / IBT 12 O3 O 3,9 art. no. IB 13 6 4,5 4,4 2,1 3,5 1 O 3,1 O 3,8 F O7 O 7,5 6,2 O8 7,7 O 7,1 1,7 O 6,5 O4 art. no. IB 14 / IBT 14 G art. no. IB 15 / IBT 15 5,8 10 1,4 1 3,5 O 3,1 O 3,5 4 1,4 O 3,1 H O6 1 O7 O 3,5 I O 3,1 O 3,5 art. no. IB 16 art. no. IB 17 art. no. IB 18 / IBT 18 IB 1 - IB 7 / 18 material form stability IBT 1 - IBT 15 / 18 IB 8 - IB 17 polyamide 4.6, GF reinforced PTFE (teflon) thermoplastic resin -40C ... +250C (1.8 MPa) -260C ... +250C -40C ... +200C 30 kV/mm 40 kV/mm 38 kV/mm dielectric strength class of flammibility UL 94 V-0 K L M Mica wafers Thermal conductive material Mounting for TO 3 angle Insulating distance sleeves E 19 E2-5 A 125 E 32 - 128 Aluminium oxide wafers Thermal conductive paste Thermal conductive glue Technical introduction E 17 - 18 E 21 - 22 E 23 - 24 A2-8 E 52 N High quality surface treatment for electronic components Tin-plating Gold-plating properties: process: materials: coating system: high resistance to wear, good corrosion resistance, temperature stability and solderability drum technology non-ferrous metals copper/nickel/gold Anodising performance: fabrication of corrosion resistant, decorative oxide films process: anodic oxidation in fully automated equipment materials: aluminium and aluminium alloys max. component size: 1500 x 2000 x 450 mm colour: natural aluminium or black properties: process: materials: coating system: Degreasing performance: solderable layers with improved tarnishing and corrosion resistance drum technology non-ferrous metals copper/nickel/tin degreasing of oily or greasy metallic surfaces process: steam degreasing using chlorinated hydro-carbons in hermetically sealed equipment material: aluminium and aluminium alloys min. component size: 30 x 30 x 30 mm max. component size: 600 x 400 x 380 mm max. component weight: 80 kg High quality surface treatment for electronic components Transparent passivating (surface free from chromium VI) characteristics: environmental compatibility due to chrome free passivation of the aluminium surfaces process: fabrication of conversion coatings by immersion process materials: aluminium und aluminium alloys max. component size: 1500 x 2000 x 450 mm colour: natural aluminium or black Anodisation facility - economization of water by using spray-rinsing, automized ion exchange installation, cascade water guided system and recirculation of splash water - reduction of electrical energy by means of current density regulation - reduction of chemicals by recirculation of the dragged-off chemicals using a compensation of the evaporation losses - recycling of the sulphuric acid out of the anodizing bathes Vibratory grinding characteristics: deburring, removing of sharp edges, rough and fine grinding process: treatment using vibration technique and grinding tools (trowalization) materials: metallic, aluminium favourized max. component size: 230 x 200 mm General Business conditions 1. General provisions Our deliveries are exclusively subject to the conditions set forth herein which shall be deemed to be explicitly accepted by the purchaser. No conditions which may appear on the purchaser`s order shall be binding on us, even without our express contradiction. 2. Quotations and orders Our quotations are not binding on us. This applies also to information contained in price lists, leaflets etc.. Delivery dates stated in our quotations or given to the purchaser by any other means are approximate, and we endeavour to keep to them. Delays in delivery shall give no right to claims, unless we have explicitly confirmed such delivery dates and an adequate period of grace granted to us has expired. Orders shall only be binding on us when they are explicitly confirmed in writing, regardless of the form in which they have been placed with us. Furthermore the characteristics of our samples cannot be regarded as guaranteed characteristics. 3. Prices Prices shall be valid only when confirmed by us in writing. They are exclusive of VAT at the current rate and incidentals such as postage and packing, freight, insurance etc.. If delivery is made more than 4 months after the date of order, we shall be entitled to invoice the price valid at the date of despatch, even though different prices were initially confirmed. The price valid at the date of despatch shall also apply if the order was confirmed without prices. When an order on call is placed, partial deliveries shall be invoiced at the price valid at the date of despatch. Any request by the purchaser for subsequent modifications shall give us the right to amend prices. 4. Conditions of payment Payment of the invoice amount shall become due following receipt of the invoice. Payments made within 14 days of the date of invoice give the right to a 2% cash discount. Payments 30 days after the date of invoice shall be made without any deduction. If the purchaser is in default with any payment, we are entitled to claim interest for such default at the normal rate for current accounts. If greater damage can be demonstrated to have been caused by the delay, we are entitled to request compensation for such damage. 5. Set-off, right to retention Only uncontested or legally binding counterclaims may be offset against our invoices. Any right to a retention to be exercised by the purchaser in connection with our claims is explicitly excluded. 6. Delivery Delivery of our goods is explicitly made on behalf of and at the risk of the purchaser. The risk shall pass on to the purchaser when the ordered goods leave our premises. The same applies if goods are collected in our premises after notification of their readi-ness. We decide at our discretion on the most economical delivery method without assuming any liability for the chosen means of delivery. 7. Specially manufactured goods Components made according to a sample or a drawing or by special request must be taken over and paid for, unless they have a defect we are answerable for and which makes the components completely unfit for the purchaser`s purposes. If their fitness for poses is only reduced, the purchaser`s pur the purchaser may request a reduction of payment but the contract shall not be cancelled. 8. Quantities We are entitled to supply quantities which are above or below the ordered quantities by up to 10%. Such deviations are usual in this trade and the deliveries are deemed as being in compliance with the contract.If delivery quantities fall below the ordered quantities there shall be no right to subsequent delivery of the missing quantity. 9. Reservation of proprietary rights 9.1. All goods supplied shall remain our property until all of our claims resulting from the contract have been paid in full. The purchaser is entitled to dispose of the purchased goods in the ordinary course of business transactions. Reservation of proprietary rights also applies to products resulting from processing, mixing up or combining our goods with goods of third parties, in which case we are considered as manufacturers. In the case where our goods are processed, mixed up or combined with goods of third parties, and the proprietary rights of such third parties remain in force, we are entitled to co-ownership according to the proportion of the amount invoiced for such processed goods. Such right to coownership shall be safeguarded by the purchaser. 9.2. The purchaser shall transfer to us, as a security, his claims against third parties resulting from the re-sale of our goods in full or in the proportion of our co-ownership (see subparagraph 9.1). He is entitled to collect the amount of such claims on our behalf until revoked or until cessation of his payments made to us. The purchaser is not entitled to assign these claims to third parties. 9.3. The purchaser is not entitled to mortgage or transfer the goods which are subject to reservation by way of security. 9.4. The purchaser shall advise us immediately at any seizure of our goods or of any infringement of our rights by third parties. 9.5. In case of a default in payment or a deterioration in the financial situation, we are entitled to request immediate handing over of the goods which are subject to reservation. Any time limited claims shall immediately become due. 9.6. If the value of the securities exceeds our claims by more than 20%, securities to a corresponding amount will be released by us on request at our discretion. 10. Warranty 10.1. We expressly point out that all information and data is given to the best of our knowledge and belief. The user is solely responsible for the proper use of our products and he should check their suitability for the intended application. Fischer Elektronik do not assume any warranty, whether expressed or implied, for the suitability, function or merchantibility of their products in specific or general applications, and they cannot be held liable for accidental or consequential damage due to non-observance of the above. 10.2. Claims for defects can only be considered if the purchaser has complied with his obligation to check and put forward a complaint as per 377 HGB. 10.3. If goods have a defect attributable to us, we are obliged to provide subsequent fulfilment, excluding the purchaser`s right to withdraw from the contract or to reduce the purchase price (abatement), unless we are entitled to refuse subsequent fulfilment by virtue of legal provisions. The purchaser shall grant us an adequate period of grace for subsequent fulfilment. Subsequent fulfilment may at our discretion be an elimination of the defect (rectification) or the supply of new products. 10.4. If rectification of the defect has failed, the purchaser shall be entitled to request a reduction in the purchase price (abatement) or to withdraw from the contract. Rectification shall be deemed to have failed after the second vain attempt, unless further attempts are reasonable in view of the object of the contract and can be reasonably imposed on the purchaser. 10.5. The purchaser`s right to put forward further claims for damages shall remain unaffected by this. 10.6. The purchaser`s warranty claims shall come under the limitation of time which is 12 months from the delivery of the goods to the purchaser, unless we have fraudulently concealed the defect. In this case, the legal provisions shall apply. 10.7 The purchaser`s claims for damages shall come under the limitation of time which is 12 months from the delivery of the goods. This does not apply if the threat to life, bodily injury or injury to health is imputable to us, our legal representatives or other vicarious agents, or if we or our legal representatives have been grossly negligent, or if our vicarious agents have acted deliberately. 11. Withdrawal When delivery in accordance with the contract is not possible for reasons beyond our control, we are entitled to withdraw from the contract. Such withdrawal shall not entitle the purchaser to assert any right against us. 12. Place of performance, place of venue, applicable law 12.1. The place of performance and the place of venue for deliveries and payments and for any litigation arising between us and the purchaser shall be the headquarters of our company. 12.2. The relations between the parties to the contract shall be exclusively governed by the law of the Federal Republic of Germany. The application of the UN Conventions on contracts for the international sale of goods is excluded. If any provision herein is or will become invalid, such provision shall not affect the validity of the remaining provisions. The invalid provision shall be replaced by a valid provision which shall meet as closely as possible the legal and commercial purpose of the original one. As at: 1. 1. 2014 How to find us Fischer Elektronik GmbH und Co. KG Nottebohmstrae 28 D - 58511 Ludenscheid Telefon: +49 (0) 23 51 / 4 35 - 0 Telefax: +49 (0) 23 51 / 4 57 54 info@fischerelektronik.de www.fischerelektronik.de www.facebook.de/fischerelektronik N exit "Ludenscheid" town centre X exit "Ludenscheid-Sud" HEATSINKS & CASES SURFACES HEATSINKS & CASES SURFACES art. no. The information given in this catalogue were established and examined carefully. Nevertheless, mistakes or printing errors, and especially The information given in and this catalogue wereimprovement established and examined technical modifications updating and of our products, carefully. or are printing errors,even andif especially cannot beNevertheless, excluded. All mistakes trade marks recognised they are not technical modifications and updating No andidentification improvementdoes of our specifically identified or mentioned. notproducts, imply that cannot be excluded. All trade marks are recognised even if they are not a product or trademark is not registered. No part of this catalogue may specifically identified or mentioned. No identification not imply that be reproduced or distributed without prior writtendoes consent of Fischer a Elektronik. product or All trademark is not registered. No part of in thistexts, catalogue may data contained in this catalogue, illustrations, bedocuments reproduced or distributed without prior written consent of Fischer and descriptions are subject to copyright and the provisions Elektronik. All16016. data contained in this catalogue, in texts, illustrations, of DIN ISO All rights reserved. documents and descriptions are subject to copyright and the provisions of(c)DIN ISO 16016. AllElektronik rights reserved. Copyright Fischer 1969 ... 2014 art. no. AL (c) Copyright Fischer Elektronik 1969 ... 2014 raw degreased aluminium AL BZ raw degreased aluminium raw pickled aluminium BZ LP raw pickled aluminium outside black lacquered RAL 9005/transparent passivated LP ME outside black lacquered RAL 9005/transparent passivated ME MI clear anodised MI SA solderable surface SA TP black anodised chrome-free transparent passivated TP chrome-free transparent passivated clear anodised solderable surface black anodised CONNECTOR CONTACT SURFACE FINISH CONNECTOR CONTACT SURFACE FINISH art. no. art. no. G Fischer Elektronik GmbH & Co. KG Postfach 1590 * D-58465 Ludenscheid Fischer Elektronik GmbH & Co. KG G S gold-plated S Z selective gold-plated Z tin-plated selective gold-plated tin-plated art. no. RAL RAL COLOURS COLOURS GO 6026 opal green GO K 6026 7032 opal green gravel grey system cases RackCase/shell cases bench cases K LG 7032 7035 gravel grey bench cases light grey shell cases LG NB 7035 5022 light grey night blue shell cases system cases RackCase/shell cases NB S 5022 9005 night blue system cases RackCase/shell cases S TB 9005 5018 deep black TB UL 5018 5002 turquoise blue UL 5002 ultramarine blue art. no. f.cool.e 08-2014 f.cool.e 08-2014 Hausadresse/House Address/Adresse Postfach 1590 * D-58465 Ludenscheidde domicile Nottebohmstr. 28 * D-58511 Ludenscheid Hausadresse/House Address/Adresse de domicile Telefon: 0 23 51 / 4 35 - 0 Nottebohmstr. 28 * D-58511 Ludenscheid Telefax: Telefon: 0 23 51 / 4 35 - 0 Verkauf / sales / ventes Telefax: 0 23 51 / 4 57 54 Verkauf / sales / ventes Einkauf / purchasing / achats 0 23 51 / 4 57 54 0 23 51 / Elektronik 45 94 33 Fischer GmbH & Co. KG Einkauf / purchasing / achats Export / exports / exports P.O. Box 1590 0 23 51 / Elektronik 45 94 33 Fischer GmbH & Co. KG 0 23 51 /Ludenscheid 43 51 85 D-58465 Export / exports P.O. Box 1590 / exports info@fischerelektronik.de 0 23 51 /Ludenscheid 43 51 85 D-58465 House Address www.fischerelektronik.de info@fischerelektronik.de Nottebohmstr. 28 House Address www.fischerelektronik.de Fischer Elektronik D-58511 Ludenscheid Nottebohmstr. 28 Osterreich Fon: +49Ges. (0) 23m.b.H. 51 4 35 - 0 Fischer Elektronik D-58511 Ludenscheid Firmiangasse 49 51 * A -1130 Wien Fax: sales +49 (0) 23 51 4 57 54 Osterreich Fon: +49Ges. (0) 23m.b.H. 51 4 35 - 0 Telefon: 01 +49 / 8 76 purchasing (0) 62 23 27 51 45 94 33 Firmiangasse 49 (0) - 5123* 51 A -1130 Wien Fax: sales +49 4 57 54 exports 01 +49 (0) 62 23 27-11 51 43 51 85 Telefax: / 8 76 Telefon: 01 +49 / 8 76 purchasing (0) 62 23 27 51 45 94 33 info@fischerelektronik.de online@fischerelektronik.co.at exports 01 +49 (0) 62 23 27-11 51 43 51 85 Telefax: / 8 76 www.fischerelektronik.de www.fischerelektronik.at info@fischerelektronik.de online@fischerelektronik.co.at www.fischerelektronik.de www.fischerelektronik.at gold-plated deep black turquoise blue ultramarine blue ARTICLES ARTICLES system cases RackCase/shell cases bench cases/shell cases/system cases RackCase bench cases/shell cases/system cases RackCase system cases RackCase/shell cases system cases RackCase/shell cases Plusline/shell cases Plusline/shell cases