SK515/10STO220 - Fischer Elektronik - Datasheet.Directory

Fischer Elektronik GmbH & Co. KG

Postfach 1590 • D-58465 Lüdenscheid

Hausadresse/House Address/Adresse de domicile

Nottebohmstr. 28 • D-58511 Lüdenscheid

Telefon: 0 23 51 / 4 35-0

Telefax:

Verkauf / sales / ventes

0 23 51 / 4 57 54

Einkauf / purchasing / achats

0 23 51 / 45 94 33

Export / exports / exports

0 23 51 / 43 51 85

info@fischerelektronik.de

www.fischerelektronik.de

Fischer Elektronik

Österreich Ges. m.b.H.

Firmiangasse 49-51 • A -1130 Wien

Telefon: 01 / 8 76 62 27

Telefax: 01 / 8 76 62 27-11

online@fischerelektronik.co.at

www.fischerelektronik.at

f.cool.e 08-2014

Fischer Elektronik GmbH & Co. KG

P.O. Box 1590

D-58465 Lüdenscheid

House Address

Nottebohmstr. 28

D-58511 Lüdenscheid

Fon: +49 (0) 23 51 4 35-0

Fax: sales +49 (0) 23 51 4 57 54

purchasing +49 (0) 23 51 45 94 33

exports +49 (0) 23 51 43 51 85

info@fischerelektronik.de

www.fischerelektronik.de

The information given in this catalogue were established and examined

carefully. Nevertheless, mistakes or printing errors, and especially

technical modifications and updating and improvement of our products,

cannot be excluded. All trade marks are recognised even if they are not

specifically identified or mentioned. No identification does not imply that

a product or trademark is not registered. No part of this catalogue may

be reproduced or distributed without prior written consent of Fischer

Elektronik. All data contained in this catalogue, in texts, illustrations,

documents and descriptions are subject to copyright and the provisions

of DIN ISO 16016. All rights reserved.

© Copyright Fischer Elektronik 1969 ... 2014

AL

BZ

LP

ME

MI

SA

TP

raw degreased aluminium

raw pickled aluminium

outside black lacquered RAL 9005/transparent passivated

clear anodised

solderable surface

black anodised

chrome-free transparent passivated

art. no.HEATSINKS & CASES SURFACES

G

S

Z

gold-plated

selective gold-plated

tin-plated

art. no.CONNECTOR CONTACT SURFACE FINISH

GO

K

LG

NB

S

TB

UL

6026

7032

7035

5022

9005

5018

5002

ARTICLES

RAL COLOURS

opal green system cases RackCase/shell cases

gravel grey bench cases

light grey shell cases

night blue system cases RackCase/shell cases

deep black bench cases/shell cases/system cases RackCase

turquoise blue system cases RackCase/shell cases

ultramarine blue Plusline/shell cases

art. no.

Fischer Elektronik GmbH & Co. KG

Postfach 1590 • D-58465 Lüdenscheid

Hausadresse/House Address/Adresse de domicile

Nottebohmstr. 28 • D-58511 Lüdenscheid

Telefon: 0 23 51 / 4 35-0

Telefax:

Verkauf / sales / ventes

0 23 51 / 4 57 54

Einkauf / purchasing / achats

0 23 51 / 45 94 33

Export / exports / exports

0 23 51 / 43 51 85

info@fischerelektronik.de

www.fischerelektronik.de

Fischer Elektronik

Österreich Ges. m.b.H.

Firmiangasse 49-51 • A -1130 Wien

Telefon: 01 / 8 76 62 27

Telefax: 01 / 8 76 62 27-11

online@fischerelektronik.co.at

www.fischerelektronik.at

f.cool.e 08-2014

Fischer Elektronik GmbH & Co. KG

P.O. Box 1590

D-58465 Lüdenscheid

House Address

Nottebohmstr. 28

D-58511 Lüdenscheid

Fon: +49 (0) 23 51 4 35-0

Fax: sales +49 (0) 23 51 4 57 54

purchasing +49 (0) 23 51 45 94 33

exports +49 (0) 23 51 43 51 85

info@fischerelektronik.de

www.fischerelektronik.de

The information given in this catalogue were established and examined

carefully. Nevertheless, mistakes or printing errors, and especially

technical modifications and updating and improvement of our products,

cannot be excluded. All trade marks are recognised even if they are not

specifically identified or mentioned. No identification does not imply that

a product or trademark is not registered. No part of this catalogue may

be reproduced or distributed without prior written consent of Fischer

Elektronik. All data contained in this catalogue, in texts, illustrations,

documents and descriptions are subject to copyright and the provisions

of DIN ISO 16016. All rights reserved.

© Copyright Fischer Elektronik 1969 ... 2014

AL

BZ

LP

ME

MI

SA

TP

raw degreased aluminium

raw pickled aluminium

outside black lacquered RAL 9005/transparent passivated

clear anodised

solderable surface

black anodised

chrome-free transparent passivated

art. no.HEATSINKS & CASES SURFACES

G

S

Z

gold-plated

selective gold-plated

tin-plated

art. no.CONNECTOR CONTACT SURFACE FINISH

GO

K

LG

NB

S

TB

UL

6026

7032

7035

5022

9005

5018

5002

ARTICLES

RAL COLOURS

opal green system cases RackCase/shell cases

gravel grey bench cases

light grey shell cases

night blue system cases RackCase/shell cases

deep black bench cases/shell cases/system cases RackCase

turquoise blue system cases RackCase/shell cases

ultramarine blue Plusline/shell cases

art. no.

Quotations for Fischer Elektronik 3

C-print on Alu Dibond 65,5 x 98 cm

from:

Thomas Kellner

www.thomaskellner.com

A

B

C

D

E

F

G

H

I

K

L

M

N

A 1

–

A 140

E 1

–

E 52

K 1

–

K 28

C 1

–

C 22

G 1

–

G 84

M 1

–

M 56

B 1

–

B 62

F 1

–

F 28

L 1

–

L 10

D 1

–

D 36

I 1

–

I 28

H 1

–

H 12

N 1

–

N 80

A

B

C

D

E

F

G

H

I

K

L

M

N

A 1

–

A 140

E 1

–

E 50

K 1

–

K 32

C 1

–

C 22

G 1

–

G 84

M 1

–

M 56

B 1

–

B 62

F 1

–

F 28

L 1

–

L 10

D 1

–

D 36

I 1

–

I 28

H 1

–

H 12

N 1

–

N 80

Extruded proﬁles:

extruded heatsinks, extruded heatsinks with solder pins, ﬁn coolers, ﬂuid coolers, high-performance heatsinks

Accessories for electronic components:

mounting parts for heatsinks, thermal transfer compound, thermally conductive material, aluminium oxide and

mica wafers, silicone washers, guide rails, solder stop plug, clip fastening for mounting rail

D-Sub connectors:

male and female headers, connectors with mounting angle, connectors for ribbon cable,

SMD and mixed layout, D-Sub shells, cut-out covers

Board level heatsinks:

ﬁnger-shaped heatsinks, heatsinks for transistors in plastic case, attachable heatsinks, small heatsinks,

copper heatsinks for D PAK and others

PCB connectors and accessories:

male and female headers, grid spacing 2.54, 2.00 and 1.27 mm, high precision contact strips, jumpers

Optoelectronics:

LED-holders for front panel assembly, LED-holder without LED, LED-holder with mounted LED,

light pipes for SMDs

Heatsinks for processors and LED:

heatsinks and fan coolers for universal PGA/BGA, DIL, PLCC, Intel Pentium Xeon, Intel Pentium IV, heatsinks for LED

Sockets:

IC-sockets for DIL, PLCC, sockets for transistors, LED displays, crystal oscillators and connector-sleeves

Brackets:

brackets for PC and PCI with or without ﬁxing tab, retainer for ISA versions

Cooling aggregates:

miniature cooling aggregates, heatsink cooling aggregates, high capacity cooling aggregates,

multi module cooling aggregates, hollow-ﬁn aggregates

IDC connectors:

design DIL, single and double row female headers, lockable connectors, ribbon cable

Cases:

desk consoles, shell cases, extruded assembled cases, combination cases, tube cases, miniature aluminium cases,

design cases, cooling cases, ventilation frames, feet and bushings, special front panels, sheet constructions

19“ Extension systems:

plug-in chassis, subracks, bench cases, system cases, insert modules, part front panels, rack handles,

PC-board holder, extender cards

pageart. no.

E 38ABM 2550

E 38ABM 3050

E 38ABM 4070

E 38ABM 5080

E 39ABM TE 04

E 39ABM TE 04 DIN

E 39ABM TE 06

E 39ABM TE 06 DIN

E 39ABM TE 08

E 39ABM TE 08 DIN

E 38ABP 2550

E 38ABP 3060

E 38ABP 4080

E 31AHG K 27

E 31AHG K 28

E 31AHG L 7

E 31AHG V 14

E 31AHG V 17

E 39AHM 3260

E 39AHM 4380

A 125AKK 127

A 125AKK 191

E 17AOS 3

E 17AOS 3 P

E 17AOS 3 P 2

E 17AOS 3 P SL

E 17AOS 5

E 17AOS 18

E 17AOS 32

E 17AOS 66

E 17AOS 93

E 17AOS 127

E 17AOS 218 247

E 17AOS 218 247 1

E 17AOS 220

E 17AOS 220 3

E 17AOS 220 4

E 17AOS 220 SL

E 17AOS 247

E 18AOS P 1

E 18AOS P 1.1

E 18AOS P 2

E 18AOS P 3

E 18AOS P 4

E 18AOS P 5

E 18AOS P 6

E 18AOS P 7

E 18AOS P 8

E 18AOS P 9

E 18AOS P 10

E 26CLIP 151

E 40DR 071 V0

E 40DR 072 V0

E 40DR 073 V0

E 40DR 074 V0

E 40DR 075 V0

E 40DR 076 V0

E 40DR 077 V0

E 40DR 078 V0

E 40DR 079 V0

E 40DR 081 V0

E 40DR 082 V0

E 40DR 083 V0

E 40DR 084 V0

E 40DR 085 V0

E 40DR 086 V0

E 40DR 087 V0

E 40DR 088 V0

E 40DR 089 V0

E 40DR 105 V0

E 40DR 110 V0

E 40DR 115 V0

E 40DR 120 V0

E 40DR 125 V0

E 40DR 130 V0

pageart. no.

E 40DR 135 V0

E 40DR 140 V0

E 40DR 145 V0

E 40DR 150 V0

E 40DR 710 V0

E 40DR 711 V0

E 40DR 712 V0

E 40DR 713 V0

E 40DR 714 V0

E 40DR 715 V0

E 40DR 720 V0

E 40DR 725 V0

E 40DR 730 V0

E 40DR 735 V0

E 40DR 740 V0

E 40DR 745 V0

E 40DR 750 V0

E 40DR 760 V0

E 40DR 810 V0

E 40DR 811 V0

E 40DR 812 V0

E 40DR 813 V0

E 40DR 814 V0

E 40DR 815 V0

E 40DR 820 V0

E 40DR 825 V0

E 40DR 830 V0

E 40DR 835 V0

E 40DR 840 V0

E 40DR 845 V0

E 40DR 850 V0

E 40DR 860 V0

A 88ELS 3

E 44EPN 1

C 2FK 201 SA

C 2FK 201 SA 3

C 2FK 201 SA CB

C 2FK 202 SA

C 2FK 202 SA 3

C 2FK 202 SA CB

C 2FK 205 SA L

C 2FK 206 SA L

C 2FK 207 SA L

C 2FK 208 SA L

C 6FK 209 SA 32

C 6FK 210 SA CB

C 7FK 211 32

C 7FK 212 CB

C 6FK 213 SA 32

C 6FK 214 SA CB

C 7FK 215 32

C 7FK 216 CB

C 3FK 217 SA CB 2

C 8FK 218 32

C 9FK 219 CB 1

C 9FK 219 CB 2

C 9FK 219 CB 3

C 10FK 220 SA 220

C 7FK 222

C 7FK 222 THF

C 3FK 223 SA

C 3FK 223 SA 3

C 3FK 223 SA CB

C 11FK 224 ... 218 1

C 11FK 224 ... 218 2

C 11FK 224 ... 220 1

C 11FK 224 ... 220 2

C 10FK 224 ... P SIP

C 5FK 225 SA L 1

C 5FK 225 SA L 2

C 8FK 227 SA L 1

C 5FK 228 SA L 1

C 5FK 229 SA L 1

C 5FK 230 SA L 1

C 6FK 231 SA 220

pageart. no.

C 8FK 232 220

C 8FK 233 220

C 4FK 234 SA L 1

C 4FK 234 SA L 2

C 4FK 234 SA L 3

C 4FK 234 SA L 4

C 4FK 235 MI L 1

C 4FK 235 MI L 2

C 4FK 235 SA L 1

C 4FK 235 SA L 2

C 9FK 236 220

C 9FK 236 CB

C 14FK 237 SA 220 H

C 13FK 237 SA 220 O

C 14FK 237 SA 220 V

C 14FK 237 SA 220 VL

C 8FK 238 SA L 1

C 6FK 239 SA 32

C 14FK 240 SA 220 H

C 13FK 240 SA 220 O

C 14FK 240 SA 220 V

C 14FK 240 SA 220 VL

C 11FK 241 SA 218 V

C 14FK 242 SA 220 H

C 13FK 242 SA 220 O

C 14FK 242 SA 220 V

C 14FK 242 SA 220 VL

C 12FK 243 MI 247 H

C 12FK 243 MI 247 O

C 12FK 243 MI 247 V

C 21FK 244 08 D2 PAK

C 21FK 244 08 D3 PAK

C 21FK 244 08 D PAK

C 21FK 244 13 D2 PAK

C 21FK 244 13 D3 PAK

C 21FK 244 13 D PAK

C 12FK 245 MI 247 H

C 12FK 245 MI 247 O

C 12FK 245 MI 247 V

C 7FK 247 220

C 11FK 248 SA 220

C 5FK 249 SA 220

C 22FK 250 06 LF PAK

C 22FK 250 08 LF PAK

C 22FK 250 10 LF PAK

C 22FK 251 06 LF PAK

C 22FK 251 08 LF PAK

C 22FK 251 10 LF PAK

C 15FK 252 SA 220 H

C 15FK 252 SA 220 O

C 15FK 252 SA 220 V

C 15FK 252 SA 220 VL

C 16FK 253

C 2FK 254 SA 3

C 16FK 255

C 22FK 256

C 16FK 257

C 10FK 258 SA 220

C 2FK 318 SA

C 2FK 318 SA 3

A 128FL 0,55

A 128FL 1,1

A 131FLKI 80

A 132FLKI 80 G 200

A 132FLKI 80 G 300

A 132FLKI 80 G 500

A 133FLKR 1

A 131FLKU 140

A 132FLKU 140 G 200

A 132FLKU 140 G 300

A 132FLKU 140 G 500

E 27FS 6 065

E 27FS 6 070

E 27FS 6 080

E 27FS 6 090

pageart. no.

E 27FS 6 100

E 27FS 6 110

E 27FS 6 120

E 27FS 6 130

E 28FS 85

E 28FS 85 50

E 28FS 85 60

E 28FS 85 70

E 27FS 100

E 27FS 109

E 26FS 151 P

E 29FS BF 06

E 29FS BF 07

E 29FS BF 10

E 29FS BF 11

E 29FS BF 13

E 29FS BF 15

E 29FS BF 19

E 29FS BF 20

E 29FS BT 06

E 29FS BT 08

E 29FS BT 10

E 29FS BT 11

E 29FS BT 13

E 29FS BT 15

E 29FS BT 16

E 29FS BT 19

E 29FS BT 20

E 20FSF 52 P

E 30FS LP 05

E 30FS LP 07

E 30FS LP 08

E 30FS LP 10

E 30FS LP 11

E 30FS LP 13

E 30FS LP 15

E 30FS LP 16

E 30FS LP 17

E 30FS LP 22

E 30FS LP 30

E 29FS S 06 2

E 29FS S 07 2

E 29FS S 08 2

E 29FS S 10 2

E 29FS S 11 2

E 29FS S 12 2

E 29FS S 13 2

E 29FS S 15 2

E 29FS S 16 2

E 29FS S 19 3

E 29FS S 20 3

E 29FS S 21 2

E 29FS S 21 3

E 30FS U 06

E 30FS U 11

E 30FS U 20

E 37GBM 2550

E 37GBM 3050

E 37GBM 4070

E 37GBM 5080

E 37GBP 3060

E 37GBP 4080

E 12GEL ...

GEL G ...

E 15GEL 27 S ...

E 13GEL 28 ...

GEL 28 G ...

E 14GEL 45 ...

GEL 45 G ...

E 15GEL 60 ...

GEL 60 G ...

E 11GEL F 15 ...

GEL F 15 G ...

E 19GS 3

E 19GS 3 P

Alphanumerical product list

pageart. no.

E 19GS 3 P SL

E 19GS 32 P

E 19GS 66 P

E 19GS 218

E 19GS 220 4

E 19GS 220 C

E 19GS 220 P

E 52IB 1

E 52IB 2

E 52IB 3

E 52IB 4

E 52IB 5

E 52IB 6

E 52IB 7

E 52IB 8

E 52IB 9

E 52IB 10

E 52IB 11

E 52IB 12

E 52IB 13

E 52IB 14

E 52IB 15

E 52IB 16

E 52IB 17

E 52IB 18

E 52IBT 1

E 52IBT 2

E 52IBT 3

E 52IBT 4

E 52IBT 6

E 52IBT 7

E 52IBT 8

E 52IBT 9

E 52IBT 10

E 52IBT 11

E 52IBT 12

E 52IBT 14

E 52IBT 15

E 52IBT 18

B 52ICK 6 8 L

B 52ICK 14 16 B

B 52ICK 14 16 L

B 52ICK 14 H

B 52ICK 16 H

B 52ICK 18 H

B 52ICK 20 L

B 52ICK 24 B

B 52ICK 28 B

A 124ICK 35 SA

B 52ICK 36 B

B 52ICK 40 B

B 52ICK 1000 B

B 52ICK 1000 H

B 17ICK BGA 10 x 10

B 17ICK BGA 10 x 10 x 10

B 17ICK BGA 14 x 14

B 17ICK BGA 14 x 14 x 10

B 18ICK BGA 21 x 21

B 18ICK BGA 23 x 23

B 18ICK BGA 23 x 23 x 10

B 18ICK BGA 27 x 27

B 18ICK BGA 27 x 27 x 10

B 18ICK BGA 27 x 27 x 14

B 19ICK BGA 27 x 27 x 22

B 19ICK BGA 31 x 31

B 19ICK BGA 31 x 31 x 10

B 19ICK BGA 35 x 35

B 19ICK BGA 35 x 35 x 10

B 19ICK BGA 37 x 37 x 6

B 20ICK BGA 37 x 37 x 10

B 20ICK BGA 40 x 40

B 20ICK BGA 40 x 40 x 10

B 20ICK BGA 42,5 x 45

B 56ICK EM 25

B 35ICK LED R 23,5 x 14

pageart. no.

B 35ICK LED R 23,5 x 14 G

B 35ICK LED R 27 x 10

B 35ICK LED R 27 x 10 G

B 35ICK LED R 28 x 15

B 36ICK LED R 28 x 15 G

B 36ICK LED R 29 x 11,5

B 36ICK LED R 29 x 11,5 G

B 36ICK LED R 32 x 14

B 36ICK LED R 32 x 14 G

B 36ICK LED R 33 x 10

B 36ICK LED R 33 x 10 G

B 37ICK LED R 33 x 16,5

B 37ICK LED R 33 x 16,5 G

B 37ICK LED R 35 x 10

B 37ICK LED R 35 x 10 G

B 37ICK LED R 36 x 12

B 37ICK LED R 36 x 12 G

B 37ICK LED R 40 x 10

B 38ICK LED R 40 x 10 G

B 38ICK LED R 40 x 27

B 38ICK LED R 40 x 27 G

B 38ICK LED R 45,7 x 16,5

B 38ICK LED R 45,7 x 16,5 G

B 39ICK LED R 50,8 x 16,5

B 39ICK LED R 50,8 x 16,5 G

B 38ICK LED R 50 x 10

B 39ICK LED R 50 x 10 G

B 39ICK LED R 54 x 20

B 39ICK LED R 54 x 20 G

B 39ICK LED R 66 x 40

B 40ICK LED R 75 x 10

B 40ICK LED R 84 x 40

B 40ICK LED R 100 x 40

B 40ICK LED R 160 x 40

B 41ICK LED R 200 x 40

B 57ICK PEN 3 FC

B 56ICK PEN 3 XE

B 56ICK PEN 3 XE 1

B 57ICK PEN 38 F

B 57ICK PEN 38 W

B 57ICK PEN 45 W

B 11ICK PGA 6 x 6 x 14

B 11ICK PGA 8 x 8 x 12

B 11ICK PGA 9 x 9

B 11ICK PGA 11 x 11

B 11ICK PGA 11 x 11 x 8

B 12ICK PGA 11 x 11 x 12

B 12ICK PGA 14 x 14

B 12ICK PGA 14 x 14 x 10

B 12ICK PGA 14 x 14 x 12

B 12ICK PGA 14 x 14 x 14

B 12ICK PGA 15 x 15

B 13ICK PGA 16 x 16 x 8

B 13ICK PGA 16 x 16 x 10

B 13ICK PGA 16 x 16 x 12

B 13ICK PGA 17 x 17

B 13ICK PGA 17 x 17 x 8

B 13ICK PGA 17 x 17 x 12

B 14ICK PGA 18 x 18

B 14ICK PGA 19 x 19

B 14ICK PGA 19 x 19 x 12

B 14ICK PGA 20 x 20

B 15ICK PGA 20 x 20 K

B 15ICK PGA 20 x 20 x 8

B 14ICK PGA 20 x 20 x 10

B 15ICK PGA 20 x 20 x 12

B 15ICK PGA 21 x 21

B 15ICK PGA 22 x 22

B 16ICK PGA 25 x 25

B 52ICK PLCC 28

B 56ICK PPC 51

B 57ICK PRO 40 W

B 52ICK R

B 21ICK S 10 x 10 x 6,5

B 21ICK S 10 x 10 x 10

pageart. no.

B 21ICK S 10 x 10 x 12,5

B 22ICK S 10 x 10 x 18,5

B 22ICK S 14 x 14 x 6,5

B 22ICK S 14 x 14 x 10

B 22ICK S 14 x 14 x 12,5

B 22ICK S 14 x 14 x 18,5

B 22ICK S 17 x 17 x 15

B 23ICK S 17 x 17 x 20

B 23ICK S 18 x 18 x 6,5

B 23ICK S 18 x 18 x 10

B 23ICK S 22 x 22 x 10

B 23ICK S 22 x 22 x 18,5

B 23ICK S 25 x 25 x 6,5

B 24ICK S 25 x 25 x 12,5

B 24ICK S 25 x 25 x 18,5

B 24ICK S 29 x 29 x 10

B 24ICK S 29 x 29 x 20

B 24ICK S 29 x 29 x 30

B 24ICK S 32 x 32 x 10

B 25ICK S 32 x 32 x 20

B 25ICK S 36 x 36 x 10

B 25ICK S 36 x 36 x 15

B 25ICK S 36 x 36 x 20

B 25ICK S 36 x 36 x 30

B 25ICK S 40 x 40 x 10

B 26ICK S 40 x 40 x 20

B 26ICK S 40 x 40 x 25

B 26ICK S 45 x 45 x 10

B 26ICK S 45 x 45 x 20

B 26ICK S 50 x 50 x 20

B 26ICK S 50 x 50 x 25

B 27ICK S 50 x 50 x 40

B 27ICK S 50 x 50 x 50

B 27ICK S 98 x 98 x 30

B 27ICK S 98 x 98 x 45

B 28ICK S D 12 x 12 x 7,5

B 28ICK S D 18 x 12 x 7,5

B 28ICK S D 24 x 18 x 7,5

B 28ICK S D 98 x 98 x 10

B 53ICK SMD A 5

B 53ICK SMD A 8

B 53ICK SMD A 10

B 53ICK SMD A 13

B 53ICK SMD A 17

B 53ICK SMD A 22

B 53ICK SMD B 5

B 53ICK SMD B 7 SA

B 53ICK SMD B 10 SA

B 53ICK SMD B 13 SA

B 53ICK SMD B 19

B 55ICK SMD BOX 1

B 53ICK SMD C 7 SA

B 53ICK SMD C 10 SA

B 53ICK SMD C 17

B 54ICK SMD E 15 SA

B 54ICK SMD E 22 SA

B 54ICK SMD E 29 SA

B 54ICK SMD F 8

B 54ICK SMD F 10

B 54ICK SMD F 17 SA

B 54ICK SMD F 19

B 54ICK SMD F 21

B 54ICK SMD F 26

B 54ICK SMD G 8 MI

B 54ICK SMD G 10

B 54ICK SMD G 13 SA

B 54ICK SMD G 17 SA

B 54ICK SMD G 19 SA

B 54ICK SMD G 21

B 54ICK SMD H 8

B 54ICK SMD H 10

B 54ICK SMD H 17

B 54ICK SMD H 19 SA

B 54ICK SMD H 25

B 54ICK SMD K 8

pageart. no.

B 54ICK SMD K 10 SA

B 54ICK SMD K 13

B 54ICK SMD K 17

B 54ICK SMD K 19

B 54ICK SMD K 21

B 54ICK SMD M 8 SA

B 54ICK SMD M 10 SA

B 54ICK SMD M 17 MI

B 54ICK SMD M 19 SA

B 54ICK SMD M 21 SA

B 55ICK SMD N 8

B 55ICK SMD N 10

B 55ICK SMD N 17

B 55ICK SMD N 19

B 55ICK SMD N 21

B 55ICK SMD N 26

B 29ICK S R 28,5 x 6,5

B 29ICK S R 28,5 x 10

B 29ICK S R 28,5 x 12,5

B 29ICK S R 28,5 x 18,5

B 29ICK S R 32,5 x 10

B 29ICK S R 32,5 x 20

B 30ICK S R 32,5 x 30

B 30ICK S R 32,5 x 40

B 30ICK S R 32,5 x 50

B 30ICK S R 36,5 x 20

B 30ICK S R 40 x 10

B 30ICK S R 40 x 20

B 31ICK S R 40 x 30

B 31ICK S R 40 x 50

B 31ICK S R 45 x 30

B 31ICK S R 45 x 45

B 31ICK S R 50 x 10

B 32ICK S R 50 x 20

B 32ICK S R 50 x 30

B 32ICK S R 50 x 45

B 32ICK S R 54 x 20

B 32ICK S R 54 x 30

B 33ICK S R 54 x 45

B 33ICK S R 70 x 30

B 33ICK S R 70 x 50

B 33ICK S R 85 x 30

B 33ICK S R 85 x 45

B 34ICK S R 98 x 30

B 34ICK S R 98 x 50

B 31ICK S R A 40 x 20

E 51IK 3

E 51IK 341 3

E 49IS 1

E 49IS 2

E 49IS 3

E 49IS 4

E 49IS 5

E 49IS 6

E 50IS 7

E 50IS 8

A 127IS 53

E 32ISAB 3 A

E 33ISAB 3 B

E 33ISAB 3 C

E 32ISAB 4 A

E 33ISAB 4 B

E 33ISAB 4 C

E 33ISAB 5 B

E 33ISAB 5 C

E 32ISAB 6 A

E 33ISAB 6 B

E 33ISAB 6 C

E 32ISAB 25 A

E 33ISAB 25 B

E 33ISAB 25 C

E 34ISAM 2 A

E 34ISAM 2 B

E 34ISAM 2 C

E 34ISAM 3 A

Alphanumerical product list

pageart. no.

E 34ISAM 3 B

E 34ISAM 3 C

E 35ISAS 25 A

E 36ISAS 25 B

E 36ISAS 25 C

E 35ISAS 30 A

E 36ISAS 30 B

E 36ISAS 30 C

E 35ISAS 40 A

E 36ISAS 40 B

E 36ISAS 40 C

E 35ISAS 50 A

E 36ISAS 50 B

E 36ISAS 50 C

E 35ISAS 60 A

E 36ISAS 60 B

E 36ISAS 60 C

E 45ISP 218

E 45ISP 220

E 45ISP 220 V

E 45ISP 247

A 128K 0,55

A 128K 1,1

A 126K 3

A 126K3T

A 126K 5

A 126K 9

A 127K 15

E 16KAP 1 P

E 16KAP 3 G

E 16KAP 3 K

E 16KAP 218

E 16KAP 218 O

E 16KAP 220 G

E 16KAP 220 K

E 16KAP 220 O

E 16KAP 247 O

C 18KF 5/10

C 18KF 5/15

C 18KF 5/5

C 17KK 1 3,96

C 17KK 1 6,35

C 17KK 1 12,7

C 17KK 1 19,05

C 19KK 32

C 19KK 92

C 18KK 562 GS

E 25KL 35 50

E 25KL 35 75

E 25KL 35 100

E 25KL 35 K 40

E 25KL 35 K 50

E 25KL 35 K 75

E 25KL 35 K 100

A 129KTE 1

A 129KTE 2

B 47KTE R

D 5LA 1 01

D 5LA 1 02

D 5LA 1 03

D 5LA 1 04

D 5LA 1 05

D 5LA 1 06

D 5LA 1 07

D 5LA 1 08

D 5LA 1 09

D 5LA 1 10

D 7LA 2 01

D 7LA 2 02

D 7LA 2 03

D 7LA 2 04

D 7LA 2 05

D 7LA 2 06

D 7LA 2 07

D 7LA 2 08

pageart. no.

D 7LA 2 09

D 7LA 2 10

D 14LA 4

D 14LA 5

D 15LA 6

D 15LA 7

D 15LA 8

D 17LA 9

D 17LA 10

D 17LA 11

D 19LA 14

D 19LA 15

D 21LA 17

D 21LA 18

D 34LA 20

D 23LA 21

D 23LA 22

D 33LA 25

D 33LA 26

D 13LA 27 K

D 36LAGI 40

D 36LAGI 60

D 36LAGI 80

D 36LAGI 92

D 36LAGI 119

D 27LA HL 1

D 27LA HL 2

D 27LA HL 3

D 29LAHL D 1

D 35LAHLR 1 500

D 28LA HLV 1

D 28LA HLV 2

D 28LA HLV 3

B 58LA ICK 15 x 15 F 05

B 58LA ICK 15 x 15 F 12

B 58LA ICK 17 x 17 F 12

B 58LA ICK 17 x 17 F 12 A

B 58LA ICK 17 x 17 W 05

B 58LA ICK 17 x 17 W 12

B 58LA ICK 18 x 18 F 12

B 58LA ICK 18 x 18 W 12

B 58LA ICK 21 x 21 F 05

B 58LA ICK 21 x 21 F 12

B 58LA ICK 21 x 21 W 05

B 58LA ICK 21 x 21 W 12

B 60LA ICK PEN 2 K 12

B 60LA ICK PEN 3 XE

B 60LA ICK PEN 4 1 K

B 59LA ICK PEN 8 F 05

B 59LA ICK PEN 8 F 12

B 59LA ICK PEN 8 W 05

B 59LA ICK PEN 8 W 12

B 59LA ICK PEN 16 K 12

B 59LA ICK PEN 16 W 12

B 59LA ICK PEN 16 W 12 A

B 59LA ICK PEN 18 W 12

B 59LA ICK PEN 38 W 12

B 59LA ICK PRO 25 F 12

B 49LA LED 40 x 30

B 49LA LED 50 x 20

B 49LA LED 50 x 45

B 50LA LED 68

D 9LAM 1

D 9LAM 2

D 10LAM 3

D 10LAM 3 K

D 11LAM 4

D 11LAM 4 K

D 12LAM 5

D 12LAM 5 K

D 16LA V 6

D 16LA V 7

D 16LA V 8

D 18LA V 9

D 18LA V 10

pageart. no.

D 18LA V 11

D 20LA V 14

D 20LA V 15

D 22LA V 17

D 22LA V 18

D 24LA V 21

D 24LA V 22

D 25LA V 24

E 43LS 101

E 43LS 102

E 43LS 103

E 43LS 104

E 43LS 105

E 43LS 106

E 43LS 107

E 42LSD 07520

E 42LSD 08910

E 42LSD 08920

E 42LSD 13510

E 42LSD 13520

E 48MD A 04

E 48MD A 06

E 48MD A 07

E 48MD A 09

E 48MD A 12

E 48MD B 07

E 48MD B 10

E 48MD B 11

E 48MD B 12

E 48MD B 15

E 48MD C 13

E 48MD C 22

E 47MLW 32

E 47MLW 44

E 47MLW 51

E 47MRL 20

E 46MS 34 518

E 46MS 53 3

E 46MS 53 7

E 46MS 53 25

E 46MS 54 25

E 46MS 56 15

E 46MS 58 5

E 46MS 58 7

E 46MS 58 15

E 46MS 84 4

E 46MS 183 7

E 46MS 183 25

E 46MS 183 35

E 46MS 184 7

E 46MS 184 25

E 46MS 184 35

E 46MS 510 15

E 46MS 923 25

E 46MS 3518 25

E 46MS 3518 35

E 46MS 4016

E 28MSHV 90

E 44MST 3

E 44MST 220

E 44MSTS 3

E 44MSTS 220

E 28MSVL 50

E 28MSVL 60

E 28MSVL 70

E 28MSVL 85

E 27MSVL 100

A 135SFP 005

A 135SFP 006

A 135SFP 007

A 135SFP 016

A 135SFP 028

A 135SFP 029

A 135SFP 037

A 135SFP 046

pageart. no.

A 135SFP 054

A 135SFP 057

A 135SFP 058

A 135SFP 060

A 135SFP 067

A 135SFP 074

A 135SFP 076

A 135SFP 079

A 135SFP 090

A 135SFP 100

A 135SFP 106

A 135SFP 112

A 66SK 01

A 66SK 02

A 66SK 03

A 64SK 04

A 62SK 05

A 79SK 06

A 72SK 07

A 73SK 08

A 59SK 09

A 79SK 11

A 123SK 12

A 124SK 12 SA 2 x 32

A 124SK 12 SA 32

A 123SK 13

A 124SK 13 35 SA 220

A 124SK 13 35 SA 220 3,2

A 124SK 13 35 SA 220 3,5

A 67SK 14

A 77SK 15

A 72SK 16

A 62SK 18

A 63SK 19

A 68SK 20

A 70SK 21

A 79SK 23

A 61SK 25

A 63SK 28

A 67SK 30

A 72SK 31

A 76SK 32

A 42SK 33

A 67SK 34

A 66SK 36

A 67SK 39

A 82SK 40

A 49SK 42

A 90SK 44

A 63SK 45

B 43SK 46

A 49SK 47

A 73SK 48

A 51SK 49

A 37SK 50

A 61SK 51

A 74SK 52

A 74SK 53

A 83SK 55

A 54SK 56

A 64SK 57

A 45SK 58

A 60SK 59

A 74SK 60

A 82SK 61

A 62SK 63

A 70SK 64

A 70SK 65

A 55SK 66

A 69SK 67

A 89SK 68

A 71SK 69

A 64SK 71

A 63SK 72

A 64SK 73

Alphanumerical product list

pageart. no.

A 71SK 74

A 105SK 75 25

A 105SK 75 25 STS TO 220

A 105SK 75 25 TO 220

A 105SK 75 37,5

A 105SK 75 37,5 STS TO 220

A 105SK 75 37,5 TO 220

A 105SK 75 50

A 105SK 75 50 STS TO 220

A 105SK 75 50 TO 220

A 105SK 75 75

A 105SK 75 1000

A 105SK 76 25

A 105SK 76 25 STS TO 220

A 105SK 76 25 TO 220

A 105SK 76 37,5

A 105SK 76 37,5 STS TO 220

A 105SK 76 37,5 TO 220

A 105SK 76 50

A 105SK 76 50 STS TO 220

A 105SK 76 50 TO 220

A 105SK 76 75

A 105SK 76 1000

A 61SK 78

A 73SK 79

A 74SK 80

A 41SK 81

A 75SK 82

A 79SK 83

A 68SK 84

A 46SK 85

A 75SK 86

A 73SK 88

A 77SK 89

A 48SK 90

A 52SK 91

A 41SK 92

A 56SK 93

A 49SK 94

A 108SK 95 15

A 108SK 95 15 SOT 32 S

A 108SK 95 15 STS SOT 32 S

A 108SK 95 25

A 108SK 95 25 1 x M2,5 1 x M3

A 108SK 95 25 2 x M3

A 108SK 95 25 SOT 32

A 108SK 95 25 STS SOT 32

A 108SK 95 25 STS TO 220

A 108SK 95 25 TO 220

A 108SK 95 1000

A 91SK 96

A 62SK 97

A 65SK 98

A 37SK 99

A 38SK 100

A 54SK 101

A 50SK 102

A 98SK 104 ... LS

A 97SK 104 ... STC

SK 104 ... STIC

SK 104 ... STCB

A 97SK 104 ... STS

SK 104 ... STIS

SK 104 ... STSB

A 90SK 105

A 31SK 106

A 60SK 107

A 80SK 108

A 80SK 109

A 80SK 110

A 81SK 111

A 89SK 112

A 48SK 113

A 123SK 115

A 51SK 118

pageart. no.

A 47SK 119

A 45SK 120

A 42SK 121

A 60SK 122

A 71SK 124

A 91SK 125

A 107SK 126 25

A 107SK 126 25 2 x M3

A 107SK 126 25 STS TO 220

A 107SK 126 25 TO 220

A 107SK 126 37,5

A 107SK 126 37,5 2 x M3

A 107SK 126 37,5 STS TO 220

A 107SK 126 37,5 TO 220

A 107SK 126 1000

A 91SK 128

A 103SK 129 ... STC

SK 129 ... STIC

SK 129 ... STCB

A 103SK 129 ... STS

SK 129 ... STIS

SK 129 ... STSB

A 56SK 130

A 44SK 132

A 44SK 133

A 28SK 134

A 39SK 135

A 48SK 136

A 91SK 138

A 53SK 139

A 77SK 140

A 82SK 144

A 59SK 145

A 106SK 145 25 STC

A 106SK 145 25 STS TO 220

A 106SK 145 30 STC

A 106SK 145 37,5 STS TO 220

A 106SK 145 50 STC

A 106SK 145 50 STS TO 220

A 74SK 147

A 68SK 148

A 53SK 149

A 61SK 150

A 83SK 153

A 46SK 154

A 45SK 155

A 36SK 156

A 54SK 157

A 58SK 158

A 58SK 159

A 58SK 160

A 58SK 161

A 58SK 162

A 78SK 163

A 61SK 165

A 48SK 166

A 50SK 168

A 81SK 172

A 59SK 173

A 30SK 174

A 83SK 175

A 78SK 176

A 27SK 177

A 28SK 178

A 30SK 179

A 36SK 180

A 60SK 181

A 60SK 181 94 C 3 x TO 220

A 40SK 182

A 68SK 184

A 73SK 185

A 104SK 185 25 STC TO 220

A 104SK 185 25 STS TO 220

A 104SK 185 25 TO 220

A 104SK 185 37,5 STC TO 220

pageart. no.

A 104SK 185 37,5 STS TO 220

A 104SK 185 37,5 TO 220

A 104SK 185 50 C TO 220

A 104SK 185 50 STC TO 220

A 104SK 185 50 STS TO 220

A 104SK 185 50 TO 220

A 76SK 187

A 32SK 189

A 52SK 190

A 56SK 191

A 50SK 193

A 81SK 194

A 71SK 195

A 65SK 197

A 53SK 198

A 51SK 199

A 28SK 400

A 111SK 400 20 1 x M3 L

A 111SK 400 40 2 x M3 L

A 111SK 400 60 3 x M3 L

A 63SK 401

A 62SK 402

A 64SK 403

A 65SK 404

A 47SK 405

A 38SK 406

A 39SK 407

A 40SK 408

A 100SK 409 ... STC

SK 409 ... STIC

SK 409 ... STCB

A 100SK 409 ... STS

SK 409 ... STIS

SK 409 ... STSB

A 44SK 410

A 42SK 411

A 47SK 412

A 43SK 413

A 90SK 414

A 90SK 415

A 47SK 416

A 46SK 417

A 58SK 418

A 70SK 419

A 31SK 420

A 47SK 421

A 32SK 422

A 32SK 423

A 34SK 424

A 34SK 425

A 36SK 426

A 36SK 427

A 37SK 429

A 124SK 431 1

A 124SK 431 2

A 124SK 431 3

A 82SK 432

A 41SK 433

A 35SK 434

A 81SK 435

A 37SK 436

A 24SK 437

A 109SK 437 ... STC

A 109SK 437 ... STC 2

A 109SK 437 ... STS

A 109SK 437 ... STS 2

A 52SK 438

A 55SK 439

D 30SK 440

D 30SK 441

A 42SK 442

A 59SK 443

A 38SK 444

A 34SK 445

A 53SK 446

pageart. no.

A 26SK 447

A 27SK 448

A 111SK 448 20 1 x M3 L

A 111SK 448 40 2 x M3 L

A 111SK 448 60 3 x M3 L

A 34SK 450

A 91SK 451

A 27SK 452

A 96SK 452 20 1 x M3

A 96SK 452 20 2 x M3

A 96SK 452 40 2 x M3

A 96SK 452 40 4 x M3

A 96SK 452 60 3 x M3

A 96SK 452 60 6 x M3

A 96SK 452 80 4 x M3

A 96SK 452 80 8 x M3

A 96SK 452 100 5 x M3

A 96SK 452 100 10 x M3

A 33SK 453

A 24SK 454

A 96SK 454 20 1 x M3

A 111SK 454 20 1 x M3 L

A 96SK 454 20 2 x M3

A 96SK 454 40 2 x M3

A 111SK 454 40 2 x M3 L

A 96SK 454 40 4 x M3

A 96SK 454 60 3 x M3

A 111SK 454 60 3 x M3 L

A 96SK 454 60 6 x M3

A 96SK 454 80 4 x M3

A 96SK 454 80 8 x M3

A 96SK 454 100 5 x M3

A 96SK 454 100 10 x M3

A 33SK 455

A 30SK 456

A 111SK 456 20 1 x M3 L

A 111SK 456 40 2 x M3 L

A 111SK 456 60 3 x M3 L

D 30SK 458

A 101SK 459 ... STC

SK 459 ... STIC

SK 459 ... STCB

A 101SK 459 ... STS

SK 459 ... STIS

SK 459 ... STSB

A 102SK 459 25 2 x TO 220

A 102SK 459 25 M

A 102SK 459 37,5 2 x TO 220

A 102SK 459 37,5 M

A 102SK 459 50 2 x TO 220

A 102SK 459 50 M

A 112SK 460 25

A 112SK 460 37,5

A 112SK 460 50

D 30SK 461

A 43SK 463

A 39SK 464

A 43SK 466

A 33SK 467

A 36SK 468

A 23SK 469

A 110SK 469 ... STS

A 22SK 470

A 110SK 470 25 STS

A 110SK 470 30 STS

A 110SK 470 35 STS

A 110SK 470 50 STS

A 29SK 471

A 31SK 472

A 25SK 473

A 35SK 475

A 24SK 476

A 24SK 477

A 23SK 478

A 55SK 479

Alphanumerical product list

pageart. no.

A 84SK 480

A 85SK 481

A 86SK 482

A 87SK 483

A 110SK 484

A 38SK 485

A 25SK 486

A 87SK 487

A 85SK 489

A 84SK 490

A 84SK 492

A 28SK 493

A 83SK 494

A 87SK 495

A 22SK 496

D 30SK 497

D 30SK 498

A 87SK 499

A 72SK 500

A 54SK 501

A 49SK 502

A 46SK 503

A 45SK 504

A 41SK 505

A 40SK 507

A 41SK 508

A 29SK 509

A 46SK 510

A 32SK 511

A 84SK 512

A 31SK 513

A 86SK 514

A 94SK 515 05 10

A 94SK 515 05 10 S

A 94SK 515 05 23,5

A 94SK 515 05 23,5 S 2

A 94SK 515 05 37

A 94SK 515 05 37 S 3

A 94SK 515 10 S TO 220

A 94SK 515 10 TO 220

A 94SK 515 23,5 S 2 x TO 220

A 94SK 515 23,5 TO 220

A 94SK 515 37 S 3 x TO 220

A 94SK 515 37 TO 220

A 94SK 516 15 S TO 218

A 94SK 516 15 TO 218

A 94SK 516 33 S 2 x TO 218

A 93SK 517

A 93SK 518

A 48SK 519

A 50SK 520

A 24SK 521

A 23SK 522

A 55SK 523

A 52SK 524

A 95SK 525 15

A 95SK 525 15 ST

A 95SK 525 20 ST

A 95SK 525 25 ST

A 95SK 525 30

A 95SK 525 30 ST

A 95SK 526 30 ST

A 35SK 527

A 57SK 530

A 57SK 531

A 57SK 533

A 57SK 535

A 57SK 536

A 57SK 537

A 57SK 538

A 57SK 539

A 57SK 540

A 76SK 544

A 39SK 545

A 40SK 546

pageart. no.

A 31SK 547

A 34SK 548

A 29SK 549

A 27SK 550

A 25SK 551

A 23SK 552

A 44SK 553

A 26SK 554

A 51SK 555

A 77SK 556

A 50SK 557

A 23SK 558

A 25SK 559

A 26SK 560

A 26SK 561

A 29SK 562

A 30SK 563

A 30SK 564

A 22SK 565

A 26SK 566

A 35SK 567

A 54SK 568

B 43SK 569

B 44SK 570

B 44SK 571

B 44SK 572

A 85SK 573

A 86SK 574

A 84SK 575

A 85SK 576

B 43SK 577

B 43SK 578

A 55SK 579

A 51SK 580

A 28SK 581

A 25SK 582

A 53SK 583

B 44SK 584

B 42SK 585 ...

A 22SK 586

A 29SK 587

A 45SK 588

A 86SK 589

B 46SK 590

A 49SK 591

B 45SK 592

A 87SK 593

A 38SK 594

A 43SK 595

A 76SK 596

A 27SK 597

B 42SK 598

B 45SK 599

A 99SK 600 ... STC

SK 600 ... STIC

SK 600 ... STCB

A 99SK 600 ... STS

SK 600 ... STIS

SK 600 ... STSB

A 44SK 601

B 43SK 602

D 31SK 603

D 31SK 604

D 31SK 605

D 31SK 606

D 31SK 607

D 31SK 608

A 92SK 609

A 92SK 610

A 92SK 611

A 39SK 612

A 43SK 613

A 52SK 614

B 45SK 615

A 22SK 616

pageart. no.

A 88SK 617

B 42SK 618

B 42SK 619

B 42SK 620

A 56SK 621

A 114SK DC 2 1 76 SA

A 113SK DC 4 1 117 SA

A 114SK DC 5 1 59 SA

A 114SK DC 5 59 SA

A 113SK DC 6 1 60 SA

A 114SK DC 7 1 117 SA

A 114SK DC 7 117 SA

A 113SK DC 8 1 60 SA

A 113SK DC 8 60 SA

A 113SK DC 10 60 SA

C 19SKK 56

C 19SKK 58

C 19SKK 510

B 48SK LED 1

B 48SK LED 2

B 48SK LED 3

B 51SK LED BOX 1

E 41SMP 410 A

E 41SMP 410 B

E 41SMP 410 C

E 41SMP 415 A

E 41SMP 415 B

E 41SMP 415 C

E 41SMP 515 A

E 41SMP 515 B

E 41SMP 515 C

A 136STP 4

A 136STP 5

A 135SU 02

A 135SU 03

A 135SU 05

A 135SU 09

A 135SU 16

A 135SU 27

A 135SU 29

A 135SU 32

A 136SVP 01

A 136SVP 04

A 136SVP 10

A 136SVP 12

A 136SVP 13

A 135SWP 02

A 135SWP 06

A 135SWP 10

A 135SWP 15

A 135SWP 23

A 135SWP 25

A 135SWP 29

A 135SWP 36

A 135SWP 40

A 135SWP 55

A 135SWP 57

E 50TF 3 2

A 115THF 104

A 115THF 129 TO 220

A 115THF 220

A 115THF 220 17

A 115THF 247

A 115THF 247 4

A 115THF 249

A 115THF 409 220 1

A 115THF 409 220 2

A 115THF 409 SOT 32

A 115THF 409 TO 220

A 115THF 600

A 117THFA 1

A 117THFA 2

A 117THFA 3

A 117THFA 4

A 116THFK 220

pageart. no.

A 116THFK 247

A 116THFM

A 116THFMG

A 119THFU 1

A 119THFU 2

A 120THFU 3

A 120THFU 4

A 120THFU 5

A 121THFU 6

A 121THFU 7

A 123UK 14 SA 220

A 123UK 14 SA 220 3,2

A 123UK 14 SA M3

E 46US 58 4

E 46US 512 4

E 4WB 3

E 4WB 3 P

E 4WBT 30

E 4WBT 300

E 4WG 3

E 4WG 3 P

E 4WGT 300

E 4WK 3

E 4WK 3 P

E 4WK 3/4

E 4WKT 24

E 4WKT 300

A 128WL 0,55

A 128WL 1,1

E 9WLFG 9010 R 25

E 9WLFG 9010 R 50

E 9WLFG 9010 R 100

E 9WLFG 9015 R 25

E 9WLFG 9015 R 50

E 9WLFG 9015 R 100

E 9WLFG 9020 R 25

E 9WLFG 9020 R 50

E 9WLFG 9020 R 100

E 9WLFG S 900 K R 25

E 9WLFG S 900 K R 50

E 9WLFG S 900 K R 100

E 8WLFT 88 ...

E 7WLFT 404 ... /

WLFT 405 .../

WLFT 414 ...

E 6WLFT 8943 ...

E 23WLK 5

E 23WLK 10

E 23WLK 30

E 23WLK 120

E 24WLK DK 4

E 24WLK DK 10

E 24WLK DK 50

E 24WLK M 4

E 24WLK M 50

E 24WLK P

E 21WLP 004

E 21WLP 035

E 21WLP 300 S

E 21WLP 500

E 21WLP 500 S

E 21WLPF 05

E 21WLPF 10

E 21WLPF 20

E 21WLPF 50

E 21WLPF 300 S

E 22WLPK 3

E 22WLPK 5

E 22WLPK 10

A 125WP 4030 100

A 125WP 4030 100 3

E 4WS 3

E 4WS 3 M

E 4WS 3 P

E 4WS 3/4

Alphanumerical product list

pageart. no.

E 4WSC-220

E 10WSF 16

E 10WSF 32

E 10WSF 635

E 10WSFS 635

E 5WSI 220 210

E 5WSI 220 225

E 5WSI TO 3 PL

E 5WSI TOP 3 235

E 5WSI TOP 3 280

E 4WSM-220

E 4WST 30

E 4WST 36

E 4WST 85

Alphanumerical product list

B 58-61

Active heatsinks for processors

A 135-136

Aluminium flat-, quadrangular-, angled-, U- & T-profiles

E 17-18

Aluminium oxide wafers

C 10-16

Attachable heatsink

D 13-29

Cooling aggregates with axial fan

D 33-35

Cooling aggregates with radial fan

A 125-128

Die-cast heatsinks

E 32-40

Distance sleeves and spacers

A 113-114

Extruded heatsinks for DC/DC converter

A 84-88

Extruded heatsinks for lock-in retaining spring

A 89-112

Extruded heatsinks for PCB mounting

E 25

Fastening for mounting rail

A 129

Fin coolers

C 2-9

Finger shaped heatsinks

A 131-134

Fluid coolers

E 26-31

Guide rails

E 10-15

Heat conductive foam and gel foils

B 17-20

Heatsinks for BGAs

B 52-55

Heatsinks for DIL-IC, PLCC and SMD

C 21-22

Heatsinks for D PAK and others

B 35-51

Heatsinks for LEDs

B 11-16

Heatsinks for PGA

D 30-32

High-performance heatsinks

E 9

High thermoconducting graphite foils

E 51-52

Insulating caps and insolater sleeves

E 45

Insulating clamping parts for power transistors

E 16

Kapton insulator washers

E 19

Mica wafers

D 9-12

Miniature cooling aggregates

E 44

Mounting kits for insulation of power transistors

E 49-50

Mounting parts for heatsinks

E 46-48

Mounts

B 56-57

Passive heatsinks for processors

B 21-34

Pin heatsinks

D 36

Protection grid for fans

A 115-122

Retaining springs for transistors

D 5-9

Segment cooling aggregates

C 17-20

Small heatsinks

A 22-83

Standard extruded heatsinks

E 6

Thermal conductive foil one-sided adhesive

E 23-24

Thermally conductive adhesive

E 7-8

Thermally conductive foil both sides adhesive

E 2-5

Thermally conductive foil made of siliconelastomer

E 20-22

Thermal transfer compound and thermal interface film

A 123-124

U-Extruded heatsinks

E 41-43

Vibration dampers and solder terminals

Index

certiﬁed quality management

own tool-making department

foresighted storekeeping

efﬁcient special machines

precise punching department

up-to-date milling technology

foyer of the company

motivated employees

innovative product development

committed ﬁeld service

Environmental Management System

DIN EN ISO 14001

Fischer Elektronik considers protection of the environment

and saving of natural resources entrepreneurial tasks of high

priority.

Aware of this, Fischer Elektronik was the ﬁrst German heat-

sink manufacturer to implement, in 1998, the environmental

management system in accordance with DIN EN ISO 14001.

Our entrepreneurial responsibility comprises preventing

accidents, safeguarding against occupational diseases,

designing work places to suit human requirements, develo-

ping products which are safe to use, saving resources and

avoiding environmental impact to the maximum extent

possible.

We already consider environmental compatibility at the

product and process development stage. The environmental

impact of our activities is documented, assessed and in a

continuous improvement process reduced to a minimum.

Implementation and consistent working on and with the

environmental management system is a vital process and

a constant challenge but ﬁnally it will always lead to better

results.

Quality-Management System

DIN EN ISO 9001

We are certiﬁed to DIN EN ISO 9001.

This process-directed quality management system implies a

constant focus on satisfying the demands of customers, and

this is the major objective of our company.

The implementation and further development of our quality

management system demonstrably ensures

– guaranteed customer satisfaction and thus the success of

our company,

– compliance with customers’ requirements at all times

through deﬁned processes,

– early detection and prevention of errors, and

– checking of both process effectiveness and efﬁciency on a

regular basis together with steady improvement.

It is through constant vigilance and the provision of evidence

that we deliver ﬂawless products, which fully comply with

quality requirements, that we maintain our quality certiﬁca-

tion.

In order to secure lasting company success and to meet our

customers‘ expectations now and in the future, we deﬁne

measurable objectives within the framework of our quality

system, which are regularly checked and developed.

We are committed to constant measurement and improve-

ment of our performance.

Our quality management system applies to all processes

carried out by our company.

BIAS, Milan I

Electronica, Tel Aviv IL PCIM, Nuremberg D

Electro Salon, Budapest HU Elkom, Helsinki FI

We exhibit

Nuremberg D

24. 2. - 26. 2. 2015

www.embedded-world.de

stand 4 A - 311

Hamburg D

23. 9. - 26. 9. 2014

www.windenergyhamburg.com

hall B 7, stand 537

Munich D

11. 11. - 14. 11. 2014

www.electronica.de

hall B 1, stand 155

Paris F

16. 9. - 18. 9. 2014

www.enova-event.com

hall 7.2

Bregenz A

30. 9. - 2. 10. 2014

www.led-professional.com

Paris F

14. 10. - 15. 10. 2014

www.forumled.com

stand B 10

London GB

19. 11. - 20. 11. 2014

www.luxlive.co.uk

hall A 32

Nuremberg D

20. 5. - 22. 5. 2015

www.pcim.de

Stockholm S

19. 4. - 21. 4. 2016

www.see-event.se

A B

... index area:

shows topics/categories

“current“

... index area:

shows topics/categories

“following”

D 15

Standard aluminium proﬁles A 135 - 136

Technical explanations A 2 - 8

Extruded heatsinks A 22 - 83

Assignment table A 18 - 22

... page number

... footnotes, give references to pages with

combinable or similar products

... option for surface ﬁnishing

... link to page

... length on stock in mm

... hole pattern

... symbol of heatsink geometry

... thermal resistance in K/W

Rth

v

A 10

Explanations – references – printings

SA = black anodised

MI = solderable surface

ME = clear anodised

TP = chrom-free transparent passivated

... thickness of sheet/plate

... air/speed in m/s

No part of this catalogue may be reproduced or distributed without prior written consent of Fischer Elektronik.

All data contained in this catalogue, in texts, illustrations, documents and descriptions are subject to copyright

and the provisions of DIN ISO 16016. All rights reserved.

© Copyright Fischer Elektronik 1969 ... 2014

Imprinting of cardholders - Your and our time is expensive

An order for imprinting must state the font, the font size and the exact position of the imprint with dimensions, taking due

account of countersunk holes etc.. When placing the ﬁrst order, the company logo must be supplied as a vector ﬁle. If these

conditions are not complied with, the order for imprinting may have to be turned down, or additional costs will have to be

charged.

Compliance with the following criteria ensures smooth handling:

Adobe Illustrator (.ai/.eps) without half-tone images, fonts transformed into paths or supplied

CorelDraw (.cdr)

Adobe Acrobat (.pdf)

QuarkXPress (.qxd) all fonts enclosed; half-tone images colour-separated (full-tone or scale colours) and

InDesign (.indd) with correct resolution (300 dpi colour, black / white 600 dpi), no RGB

All this takes additional time and consequently incurs extra costs.

The usability must be checked by our printing shop:

screen formats (.jpg, .gif, .png) and paper copies, stickers and the like are not suitable for preparing printer‘s copies!

Copies that deﬁnitely cannot be used:

Imperfect copies such as fax copies / Microsoft Ofﬁce ﬁles (.doc, .xls, .ppt) can only be used for information or for transmitting

texts.

Please always add dimensional drawings (.dxf) to the parts to be imprinted! Please note as a general rule:

Retouching work extending beyond the standard time will be invoiced additionally at cost price.

Lamella heatsinks

– compact lamella heatsinks with a big surface

– special design for forced convection

– thermotechnical optimal ﬁtted lamellas

– precise milled ﬂat semiconductor mounting surface

– single and double sided bottom plate made of aluminium

or copper

– production according to customer speciﬁed demands

Machined heatsinks

Fluid heatsinks

Lamella heatsinks

Extruded heatsink with solder pins

Machined heatsinks

– several hundreds of extrusion proﬁles available

– future orientated stockkeeping of heatsink proﬁles in a

fully automatic honeycomb warehouse

– precise milling treatments in highest quality

– effective heat spreading by means of heatsinks

with grouted copper areas

– designs and modiﬁcations according to your demand

Fluid heatsinks

– ﬂuid heatsinks for dissipation of big heat ﬂow volumes

– compact design with internal lamella structure

– thick bottom plates for optimal heat dissipation

– I- and U streamed versions

– water connection or mounting ﬂange for your special

application

– customized treatments and solutions

Extruded heatsinks with solder pins

– solid pressed in soldering pins and threaded bolts for a

direct pcb-mounting

– for horizontal and vertical mounting position

– standard drilling patterns and transistor retaining springs

for various semi-conductive elements

– soldering pins with insulation for spacing help

– variations and modiﬁcations according to drawing

1. General points

In order to provide optimum performance of semi-conducting devices it is essential not to exceed the maximum junction temperature

indicated by the manufacturer.

Generally this maximum junction temperature can only be maintained without exceeding it by running the device concerned at lower

power outputs.

At outputs approaching the maximum ratings semi-conductor devices have to be cooled by so called heatsinks, sometimes called

dissipators.

The thermal performance of these heatsinks primarily depends on the thermal conductivity of the material from which they are made,

size of surface area and mass.

In addition, surface colour, mounting position,temperature, ambient air velocity and mounting place all have varying inﬂuence on the

ﬁnal performance of the heatsink from one application to another..

However, a ﬁgure for thermal resistance can be experimentally determined in a reliable manner and used in the equations that follow

in part 2.

There are no agreed international standard methods for testing electronic cooling systems or for the determination of the thermal

resistance.

Therefore the diagrams and values given in our catalogue have been determined under practical operating conditions and therefore

allow the most suitable heatsink from the range to be selected.

We expressly point out that all information and data is given to the best of our knowledge and belief. The user is solely responsible for

the proper use of our products and he should check their suitability for the intended application.

Fischer Elektronik do not assume any warranty, whether expressed or implied, for the suitability, function or merchantibility of their

products in speciﬁc or general applications, and they cannot be held liable for accidental or consequential damage due to non-obser-

vance of the above.

Furthermore Fischer Elektronik reserve the right to carry out technical modiﬁcations to their products at any time.

All orders are subject to the General Sales Conditions of Fischer Elektronik.

2. The determination of thermal resistance

The thermal resistance is the parameter that is the most important in cooler selection, apart from mechanical considerations.

For determination of the thermal resistance the following equation applies:

Equation 1:

In case of an application where the maximum junction temperature is not exceeded the temperature has to be veriﬁed.

When the case temperature has been measured the use of the following equation will enable the maximum junction temperature to be

calculated:

Equation 2: ϑi = ϑG + P x RthG

The meaning of the determinants:

ϑi = maximum junction temperature in °C of the device as indicated by manufacturer.

As a »safety factor« this should be reduced by 20-30 °C.

ϑu = ambient temperature in °C.

The rise in temperature caused by radiant heat of the heatsink should be increased by a margin of 10-30 °C.

Δϑ = difference between maximum junction temperature and ambient temperature.

ϑG = measured temperature of device case (equation 2).

P = maximum power rating of device in watts

Rth = thermal resistance in K/W

RthG = internal thermal resistance of semiconductor device (as indicated by manufacturer)

Technical introduction

A 2

Heatsinks proﬁle-overview A 13 - 17

Heatsink special design A 137 - 138

Special proﬁles A 140

Heatsink as visual & decor-parts A 10

Heatsinks for SSR A 11 - 12

Die-cast heatsinks A 125

Assigment table A 18 - 20

Order example A 21

A

B

C

D

E

F

G

H

I

K

L

M

N

RthK = − ( RthG + RthM ) = − RthGM

ϑi − ϑu

P

Δϑ

P

RthM = thermal resistance of mounting surface. For TO 3 cases the following approximate values apply:

1. dry, without insulatar 0.05 - 0.20 K/W

2. with thermal compound/without insulator 0.005 - 0.10 K/W

3. Aluminium oxide wafer with thermal compound 0.20 - 0.60 K/W

4. Mica wafer (0.05 mm thick) with thermal compound 0.40 - 0.90 K/W

RthK = thermal resistance of heatsink, which can be directly taken from the diagrams

RthGM = sum of RthG and RthM. For parallel connections of several transistors the value RthGM can be determined by the following

equation:

Equation 3:

The result can be substituted into equation 1.

K = Kelvin, which is the standard measure of temperature differences, measured in °C, therefore 1°C = 1 K.

K/W = Kelvin per watt, the unit of thermal resistance.

Calculation examples:

1. A TO 3 power transistor with 60 watt rating has a maximum junction temperature of 180 °C and an internal resistance of

0.6 K/W at an ambient of 40 °C with aluminium oxide wafers.

What thermal resistance is required for the heatsink?

given:

P = 60 W RthG = 0.6 K/W

ϑi = 180 °C - 20 °C =160 °C (for safety margin) RthM = 0.4 K/W (average value)

ϑu = 40 °C

ﬁnd: RthK using equation 1

2. Same conditions as above but for three devices with equally distributed power ratings.

solution use equation 1 and equation 3

substitute into Equation 1 gives:

With these values determined, the tabulation on page A 13 - 17 can be used to give a choice of possible heatsink proﬁles.

Then by examination of the drawings and curves the ﬁnal choice can be made.

3. A transistor with power rating of 50 W and internal thermal resistance of 0.5 K/W has a case temperature of 40 °C.

What is the actual value of junction temperature?

given:

P = 50 W RthG = 0.5 K/W ϑG = 40 °C

ﬁnd: ϑi using equation 2

ϑi = ϑG + (P • RthG) ϑi = 40 °C + (50 W • 0.5 K/W) = 65 °C

1

RthGM ges.

1

RthG1 + RthM1

1

RthG2 + RthM2

1

RthGn + RthMn

+

=+... +

RthK = _ 0.33 K/W = 1.67 K/W

RthK = − (RthG + RthM) = − (0.6 K/W + 0.4 K/W) = 1,0 K/W

ϑi - ϑu

P160 °C - 40 °C

60 W

1

RthGM ges.

1

0.6 + 0.4 K/W

1

0.6 + 0.4 K/W

1

0.6 + 0.4 K/W

++

=3 W/K

1

RthGM ges.

=

1 K/W

3=0.33 K/W

=

160 °C – 40 °C

60 W

0

0,2

0,4

0,6

0,8

a 1

0123456v [m/s]

Thermal resistances of any proﬁles with forced convection

RthKf ≈ a • RthK

RthKf = thermal resistance with forced convection

RthK = thermal resistance with natural convection

a = factor of proportion

A 3

Technical introduction

Standard aluminium proﬁles A 135 - 136

Extruded heatsinks A 22 - 83

Lamella heatsinks A 129 - 130

Fluid coolers A 131 - 133

Thermal conductive material E 2 - 24

Hole pattern A 21

Drilling pattern for SSR A 12

Technical introduction A 2 - 8

A

B

C

D

E

F

G

H

I

K

L

M

N

Performance, service life and reliability of electronic semiconductor devices are signiﬁcantly determined by the thermal load

to which the devices are exposed. An exceeding of the maximum operating temperature leads to malfunctions. An exceeding

of the permissible junction temperature leads to a destruction of the semiconductor. To make it worse there is an advancing

trend in the semiconductor industry for continuous increasing integration- and power densities of electronic devices. For the

solution of thermal problems the ﬁrst question is which kind of heat dissipation has to be considered. For this there are different

processes available: by means of free convection (passive) with different heatsink solutions, by means of forced convection

(active with help of fans, cooling aggregates) or by means of ﬂuid media (ﬂuid cooling).

However, electronic devices and systems have many

different boundary and installation conditions. There-

fore the choice of the optimum thermal management

is often difﬁcult. There are surely possibilities to

ﬁnd the right heat dissipation concept by using the

thermal resistance for calculations or by testing and

verifying prototypes directly in the application, but

nowadays customer speciﬁed mechanical adjust-

ments are requested and demanded more than ever.

Small mechanical post-machinings, such as additio-

nal integrated threads or drilling can be considered

in the calculation with safety reserves in the tempera-

ture of the thermal resistance, but extensive modiﬁ-

cations demand a repeated inspection of the thermal

circumstances.

To facilitate the determination of passive heat dissipation concepts Fischer Elektronik offers a computer based thermal simu-

lation as a kind of service.

Considered factors in the thermal simulation

With help of the computer based thermal simulation

the necessary characteristics of the cooling concept

can be determined exactly. Based on physical con-

cepts such as mass, energy and impulse the software

especially considers the thermal requirements for free

or forced convection. Simultaneously the system is alig-

ned to thermal dissipation by means of ﬂuid. Moreover

the thermal simulation calculates physical effects such

as thermal radiation and turbulences. The emission

factor of the different surfaces also plays its role. As a

result the simulation software delivers a precise cooling

solution for the application and is a big help for the

decision-making and interpretation of the electronic

design.

Advantages of a computer based simulation

The computer based thermal simulation is already used for the prototype development. Herewith the development cycles of

heat dissipation concepts is reduced considerably. Unsuitable concepts can be discarded quickly and without big costs of

material. A lot of features and options of the simulation system also reduce the temporary and apparatuses efforts compa-

red to a conventional simulation in the measurement chamber.

We will be happy to advise you in detail about the theme thermal simulation.

Computer based thermal simulation for optimal cooling concepts

Technical introduction

A 4

Heatsinks proﬁle-overview A 13 - 17

Heatsink special design A 137 - 138

Special proﬁles A 140

Heatsink as visual & decor-parts A 10

Heatsinks for SSR A 11 - 12

Die-cast heatsinks A 125

Assigment table A 18 - 20

Order example A 21

A

B

C

D

E

F

G

H

I

K

L

M

N

Remarks:

1. The values indicated in the diagrams apply only for heatsinks with black anodised surface, mounted vertically and

natural convection.

Correction factors: natural surface: +10 to 15 % for horizontal mounting: +15 to 20 %

2. Heatsink proﬁles are extruded to European standard DIN EN 12020 (former DIN 17615).

For proﬁles exceeding a circumscribed circle of 350 mm, the tolerances to DIN EN 755 (former DIN 1748) apply.

Important note:

Manufacturers of certain electronic components, especially modules with a large surface area, IGBT etc., specify installation surfaces

for heatsinks etc. with an ﬂatness, which is beyond standard tolerances. Such perfect ﬂatness can only be achieved by milling the

installation surface. Furthermore, it should be noted that threaded wire inserts may be required in order to reach higher tightening

torques in aluminium (e.g. Heli-Coil or similar.). Please observe the semiconductor manufacturers‘ information.

3. The mentioned heatsink proﬁles in our catalogue contain so called extrusion marks between the ﬁns for a proﬁle identiﬁcation.

To avoid misuse the operator has to check the size and position for the mechanical treatment or placement of the components.

4. Proﬁle extruded threaded channels are no threads conforming to standards, as they have no thread pitch.

The thread pitch is imitated by staggered webs (ribs). The customer is responsible for appropriate use.

5. Machining of our extruded and non extruded proﬁles conforms to requirements of DIN ISO 2768 m - unless otherwise stated.

For all ICK S types DIN ISO 2768c is valid.

6. The lengths of extruded proﬁles [ ] and the pin layouts [ ] indicate only the standard range. We offer every proﬁle cut to

customer’s exact length and machining requirement made to drawing or sample. We bore, countersink, mill, saw, grind and cut

threads into your heat sink to meet your speciﬁc requirements. With our modern machine tools including CNC machining centres,

multispindled drills (up to 26 drillings/threads at the same time) and digital milling and stamping tools plus our own “in house” tool

room we are able to manufacture competetively priced prototypes as well as batch and mass produced parts with short lead times.

7. The standard material of our heatsinks is warm age-hardened aluminium alloy according to EN AW 6060 – T66

(former AlMgSi05 – F22 acc. to DIN 1748). Our standard surface treatments are raw degreased aluminium (Al) and

black anodised (SA). On request, we anodise clear natural (ME) or decorative in any colour that is technically possible.

8. If you cannot ﬁnd a suitable proﬁle within our range of approx. 400 proﬁles, 13 small heatsinks and 50 ﬁnger shaped heatsinks,

we can design and produce to your requirements. Please contact us at the start of your next project so that we can work together,

either directly or through our representatives. Remember that we have the ability to ﬁnd the solution for “your” cooling problem.

9. Note on tolerances

All dimensions given in this cataloque for products, items and machined parts are acc. to DIN ISO 2768 m if not otherwise stated.

Not included are items like extruded proﬁles, diecasts, handles, vibration dumpers etc. for which different standards apply.

Update - August 2014

The information given in this catalogue were established and examined carefully.

Nevertheless, mistakes or printing errors, and especially technical modiﬁcations and updating and improvement of our products,

cannot be excluded. All trade marks are recognised even if they are not speciﬁcally identiﬁed or mentioned. No identiﬁcation does not

imply that a product or trademark is not registered. No part of this catalogue may be reproduced or distributed without prior written

consent of Fischer Elektronik. All data contained in this catalogue, in texts, illustrations, documents and descriptions are subject to

copyright and the provisions of DIN ISO 16016. All rights reserved.

© Copyright Fischer Elektronik 1969 ... 2014

A 5

Technical introduction

Standard aluminium proﬁles A 135 - 136

Extruded heatsinks A 22 - 83

Lamella heatsinks A 129 - 130

Fluid coolers A 131 - 133

Thermal conductive material E 2 - 24

Hole pattern A 21

Drilling pattern for SSR A 12

Technical introduction A 2 - 8

A

B

C

D

E

F

G

H

I

K

L

M

N

General information

Blind holes are produced after anodising. Through holes are produced before anodising. With completely visual parts, additional

painting is recommended. The sections are extruded according to DIN EN 12020. For sections that exceed a circumscribed circle of

300 mm, DIN EN 755 apply. The machining tolerances are speciﬁed according to DIN ISO 2768 m.

Visual parts: Please indicate at which place clamp points are allowed! We recommend e.g. supplementary laquering.

zero point

break-through Ø 8

plunge-through and

counterbore with Ø 8

5

24.7

44.7

49.7

5

15

11.6

9.6

M 4

6.4

8.4

3.2

196

166.6

149.6

135

65

50.4

33.4

4

10

24.7

39.7

49.7

Ø 8

D

C

BA

AC

D

B

200 – 1.2

+

Ø 6.5

Ø 3.4

Ø 4.5

M 6

zero point

face counterbore

Ø 12/0.5 deep

3 x M 3 - 6/8 deep

and/or continuous

zero point

Technical introduction

A 6

Heatsinks proﬁle-overview A 13 - 17

Heatsink special design A 137 - 138

Special proﬁles A 140

Heatsink as visual & decor-parts A 10

Heatsinks for SSR A 11 - 12

Die-cast heatsinks A 125

Assigment table A 18 - 20

Order example A 21

A

B

C

D

E

F

G

H

I

K

L

M

N

Information for dimensioning, shown on SK 47 general:

The deﬂection can be up to 0.8 mm concave, 0.2 mm convex. If a certain ﬂatness of the bottom surface is required the bottom

thickness can be decreased by a maximum of approx. 0.8 mm by means of face-milling. This situation must be taken into

consideration with the bore hole depths for blind holes.

Counterbores and bore hole diameters are to be produced according to DIN 74, if not explicitly stated otherwise.

The depth of thread should be calculated as follows.

Example M 5:

thread: <M> 5 x 1.6 mm = 8 mm core bore: 8 mm + 2 mm = 10 mm

Examples:

cutout A: Through-hole according to DIN 74 A m 3, counterbore bottom side, undercut of the ﬁns.

cutout B: Through hole with break-through of the ﬁns according to DIN 74 H m 4, counterbore on ﬁn side.

cutout C: Thread M 6. Depth of thread 1.6 x 6 mm = 9.6 mm, bore depth 9.6 mm + 2 mm = 11.6 mm.

Bore hole on ﬁn base is plunged through. Face counterbore dia. 12 x 0.5 on bottom side.

cutout D: Blind thread M 4. Depth of thread 1.6 x 4 mm = 6.4 mm, bore depth 6.4 mm + 2 mm = 8.4 mm.

Extrusion tolerances – production tolerances

There is often the problem, that the production tolerances cannot be adhered to, due to the extrusion tolerances. The two examples

show how the production tolerances can be cut in half by means of suitable dimensioning (here: extension of the zero point from the

outer edge to the center of the section).

When taking unfavourable extrusion tolerances into consideration a difference of 1.1 mm

arises between the two types of dimensioning with respect to the axis of symmetry.

extrusion tolerance ±3.5 mm

R220.75

440

55

165

275

385

55

165

275

385

437.8

437.8

165

55

55

165

0.83

zero point

zero point

SK 82

1.93

1.1

A 7

Technical introduction

Standard aluminium proﬁles A 135 - 136

Extruded heatsinks A 22 - 83

Lamella heatsinks A 129 - 130

Fluid coolers A 131 - 133

Thermal conductive material E 2 - 24

Hole pattern A 21

Drilling pattern for SSR A 12

Technical introduction A 2 - 8

A

B

C

D

E

F

G

H

I

K

L

M

N

125 ± 0.8

120.8

58.3

124.20

4.2

0.4

124.20

58.3 58.3

zero point

zero point

SK 34

extrusion tolerance ± 0.8 mm

dimensioning set to the outer edges

dimensioning set to the center

When taking unfavourable extrusion tolerances into consideration, a difference of 0.4 mm arises between the two types of

dimensioning with respect to the axis of symmetry.

Milling

If, when milling heatsinks, cooling aggregates, etc., the milling tool diameter is smaller than the area being milled for production

reasons, so called „milling grooves“ with steps or edges are produced (see sketch). Even if the roughness depth value for the surface

is observed, it is a good idea to specify the area of the component in which no milling edges are allowed.

milling tool

milling groove milling tool milling groove

milling tool bigger than milled

surface

(no milling edge) milling tool smaller than milled surface

Technical introduction

A 8

Heatsinks proﬁle-overview A 13 - 17

Heatsink special design A 137 - 138

Special proﬁles A 140

Heatsink as visual & decor-parts A 10

Heatsinks for SSR A 11 - 12

Die-cast heatsinks A 125

Assigment table A 18 - 20

Order example A 21

A

B

C

D

E

F

G

H

I

K

L

M

N

Surface reﬁnements

– corrosion resistant and decorative anodize layers

– lacquerings and durable powder coatings in all current

RAL colours

– anti-glare surfaces, Nextel®-Suide Coating

– electrically conductive surfaces, chromate VI free

– prevention of clamp marks by means of special

contacting systems

Precision machining and

highly decorative surfaces

Decorative aluminium milled parts

– high quality, very precise milled, decorative

aluminium parts

– exact radii and sharp-edged cutouts

– precision ground surfaces

– natural colour and black anodized

Chromium plating and gold plating

– chromium plating and gold plating of front panels,

extruded proﬁles and construction parts

– qualitative constant and reproducible, high

quality surfaces

– various gloss levels by means of different polishing

processes

– processing of brass, aluminium and steel

Development and construction

– compentent partner with experience of more

than 40 year

– Innovative product development, product-speciﬁc

support by means of application engineers

– design assistance, feasibility analyses and product

optimizations

– construction support and preparation of drawings

Anodising (also known as ELOXAL: ELectrically OXidised ALuminium) is used in many cases for decorative surface protection of alumi-

nium. In this process, the aluminium parts to be treated are connected to the positive pole of a direct-current source (anode) in a suitable

electrolyte where aluminium, in so doing, forms the negative pole (cathode). The ﬂowing direct current now causes a migration of oxy-

gencontaining ions, with electrically negative charge, to the anode in order to deposit the oxygen. At this point, the aluminium reacts with

this oxygen, forming aluminium oxide. A non-porous, electrically insulating, abrasion free, oxide barrier, or „eloxallayer“, then develops.

The development and therefore thickness of this layer can be controlled by the amount of current ﬂow.

For process handling, secure transportation and electrical connection, the parts to be anodised must be placed on „racks“ (ﬁgure 1).

As excellent electrical contact is necessary and the parts being processed must be mounted on the carrying racks in a totally secure man-

ner a high clamping force is required especially for those large and heavy heatsinks (ﬁgure 2). This will mean that „clamp marks“ are

visible. These are mere bare points in the case of small and light weight heatsinks with black anodising (ﬁgure 3) but for heavy parts the

clamping pressures and current can cause deformation of the surface (ﬁgure 4). Any such deformations on large heatsinks is unavoidable

and varies with each part (ﬁgure 5).

If heat sinks are used as visual parts, in other words parts whose surface must be blemish-free in appearance, it is suggested that the cus-

tomer will deﬁne speciﬁc areas which should have no clamp marks. If, for technical production reasons, it is not possible to place clamps

on the remaining points then consideration should be either given to the construction of separate specialpurpose frames which will allow

processing (ﬁgure 6). Existing or additional threaded holes may possibly also be used for screwing on ﬁxing angles, upon which the

clamps may then be placed (ﬁgure 7). Furthermore, there is always the possibility to remove the clamp marks by hand ﬁnishing, although

some slight indentation may still be visible. Alternatively, instead of using the anodising process there are various paint ﬁnishes available.

With visual parts and mouldings, both discussion of all technical details and determination of the desired design in cooperation with the

manufacturer - even at the initial enquiry stage - are imperative for the smooth completion of orders to the satisfaction of the

customer.

Our experts are at your disposal for all technical advice.

Heatsinks for decorative purposes and as visual parts

A 10

Standard aluminium proﬁles A 135 - 136

Technical introduction A 2 - 8

Extruded heatsinks A 22 - 83

Assigment table A 18 - 20

Drilling pattern for SSR A 12

Die-cast heatsinks A 125

High capacity heatsinks D 30 - 32

Heatsinks for PCB A 89 - 112

A

B

C

D

E

F

G

H

I

K

L

M

N

– universal clip fastening, suitable for all 35 mm mounting rails

according to DIN EN 50 022, rail thickness from 1 to 2.3 mm E 25

– fast and simple asssembly of heatsinks by means of snapping them onto the mounting rail

– secure hold due to a stable extruded proﬁle with integral stainless steel spring

– special lengths (≥40 mm) and drillings on request

37.5

50

8.5

3.5

7.4

35

1

7.5

35

15

1.5

35

2.3

15

Examples of mounting rail versions suitable for KL 35

surface: ﬁnish clear anodised

A 11

Heatsinks for solid state relays

Distance sleeves E 32 - 39

Fastening for mounting rail E 25

Guide rails for PCBs E 26 - 30

Mounting material f. semiconduct. E 44 - 48

Spacers E 40

Mica wafers E 19

Aluminium oxide wafers E 17 - 18

Technical introduction A 2 - 8

A

B

C

D

E

F

G

H

I

K

L

M

N

art. no. art. no. art. no.

perforations

– drilling pattern rotated by 90°

as well as further drilling

patterns upon request

– ﬁxing of the SSR by means

of screws with the help of

insert nuts in the heatsink

– ﬁxing of the SSR by means

of screws with the help of

tapped holes in the heatsink

without KL 35

– ﬁxing of the SSR by means

of screws with the help of

tapped holes in the heatsink

with KL 35

SK 172 75 KL SSR 1

SK 187 75 KL SSR 3

SK 172 150 KL SSR 4

SK 89 75 KL SSR 1

SK 89 100 KL SSR 1

SK 111 75 KL SSR 1

SK 434 75 KL SRR 1

SK 453 75 KL SRR 1

SK 467 75 KL SRR 1

SK 507 75 KL SSR 1

SK 111 75 KL SSR 3

SK 455 100 KL SSR 4

SK 04 75 SSR 1

SK 33 75 SSR 1

SK 453 75 SSR 1

SK 455 75 SSR 1

SK 467 75 SRR 1

SK 507 75 SRR 1

SK 48 50 SSR 3

SK 455 100 SSR 4

SK 467 100 SSR 4

SK 89 100 KL SSR 2

SK 89 150 KL SSR 2

SK 176 100 KL SSR 2

SK 176 150 KL SSR 2

SK 194 75 KL SSR 2

SK 507 100 KL SSR 2

SK 04 150 SSR 2

SK 33 75 SSR 2

SK 507 100 SSR 2

SK 507 150 SSR 2

Heatsinks for solid state relays

A 12

Distance sleeves E 32 - 39

Fastening for mounting rail E 25

Guide rails for PCBs E 26 - 30

Mounting material for semiconduct E 44 - 48

Spacers E 40

Mica wafers E 19

Aluminium oxide wafers E 17 - 18

Mounting parts for heatsinks A 2 - 8

A

B

C

D

E

F

G

H

I

K

L

M

N

104.5

M4

92

73.5

47.6

57

M4

47.5

45

38.1

17

M4

30.2

80

94

34

M4

SSR 1

SSR 2

SSR 3

SSR 4

D 30SK 498D 30SK 497D 30SK 461D 30SK 458D 30SK 441D 30SK 440

A 52SK 91A 48SK 90A 55SK 66A 54SK 56A 51SK 49A 49SK 47

A 53SK 139A 56SK 130A 50SK 102A 54SK 101A 56SK 93

A 58SK 158A 54SK 157A 45SK 155A 46SK 154A 53SK 149

A 58SK 162A 58SK 161A 58SK 160A 58SK 159

A 50SK 193A 56SK 191A 52SK 190A 50SK 168

A 52SK 438A 58SK 418A 47SK 416A 51SK 199A 53SK 198

A 55SK 479A 43SK 466A 53SK 446A 55SK 439

A 55SK 523A 50SK 520A 46SK 510A 40SK 507A 49SK 502A 54SK 501

A 57SK 533A 57SK 531A 57SK 530A 52SK 524

A 57SK 538A 57SK 537A 57SK 536A 57SK 535

Heatsink-chart classified in categories of thermal resistance at 75 mm length

A 13

Heatsink-chart

A

B

C

D

E

F

G

H

I

K

L

M

N

A 50SK 557A 51SK 555A 44SK 553A 57SK 540A 57SK 539

A 44SK 601A 49SK 591A 45SK 588A 51SK 580A 55SK 579A 54SK 568

A 74SK 53A 67SK 30A 64SK 57A 56SK 621A 52SK 614A 43SK 613

A 77SK 556A 78SK 163A 77SK 15A 75SK 86A 75SK 82

B 45SK 592B 46SK 590B 44SK 584A 82SK 144A 81SK 435A 80SK 110A 80SK 109A 80SK 108A 79SK 83

A 41SK 92A 46SK 85A 45SK 58A 49SK 42A 42SK 33B 45SK 615

A 47SK 119A 51SK 118A 48SK 113A 49SK 94

A 42SK 411A 48SK 136A 39SK 135A 44SK 133A 44SK 132A 42SK 121A 45SK 120

A 46SK 503A 33SK 467A 43SK 463A 37SK 429A 43SK 413A 47SK 412

A 65SK 197A 65SK 98A 64SK 71A 43SK 595A 53SK 583A 48SK 519A 45SK 504

A 74SK 147A 74SK 80A 73SK 88A 68SK 148A 69SK 67A 67SK 34A 66SK 02A 65SK 404

A 14

2-2,5 K/W1,5-2 K/W1-1,5 K/W< 1 K/W

> 5 K/W4-5 K/W3-4 K/W2,5-3 K/W

Heatsink-chart

A

B

C

D

E

F

G

H

I

K

L

M

N

B 43SK 569A 90SK 415A 82SK 61A 82SK 40A 81SK 194A 79SK 23A 79SK 06A 77SK 140A 77SK 89

A 38SK 100A 37SK 50B 43SK 602B 45SK 599B 43SK 578B 43SK 577B 44SK 572B 44SK 571B 44SK 570

A 46SK 417A 44SK 410A 40SK 408A 48SK 166

A 35SK 527A 39SK 464A 33SK 455A 33SK 453A 42SK 442A 41SK 433A 47SK 421

A 68SK 84A 68SK 20A 67SK 39A 67SK 14A 64SK 403A 63SK 401A 63SK 72A 64SK 04

A 74SK 60A 73SK 08A 72SK 500A 71SK 195A 71SK 124A 71SK 74A 68SK 184

A 41SK 505A 34SK 450A 37SK 436A 39SK 407B 42SK 598B 43SK 46A 82SK 432A 81SK 172A 78SK 176

A 70SK 419A 66SK 03A 62SK 97A 64SK 73A 39SK 612A 41SK 508

A 41SK 81A 90SK 44A 81SK 111A 79SK 11A 76SK 187A 73SK 79A 72SK 16

A 61SK 25A 62SK 18A 62SK 05A 34SK 445A 35SK 434A 38SK 406A 47SK 405A 32SK 189

A 76SK 32A 74SK 52A 73SK 48A 70SK 64A 66SK 01A 62SK 402A 62SK 63A 63SK 28

Heatsink-chart classified in categories of thermal resistance at 75 mm length

A 15

Heatsink-chart

A

B

C

D

E

F

G

H

I

K

L

M

N

A 86SK 514A 87SK 499A 87SK 487A 110SK 484A 90SK 105A 83SK 175A 76SK 596A 76SK 544

A 36SK 426A 34SK 425A 34SK 424A 40SK 182A 28SK 134A 31SK 106A 37SK 99A 88SK 617A 87SK 593

A 63SK 19A 38SK 594A 35SK 567A 40SK 546A 39SK 545A 35SK 475

A 70SK 65A 70SK 21A 66SK 36A 60SK 181A 61SK 165A 61SK 51A 63SK 45

A 90SK 414A 91SK 128A 89SK 112A 89SK 68A 83SK 55A 72SK 07A 71SK 69

A 86SK 589B 42SK 585 ...A 93SK 518A 93SK 517A 87SK 495A 85SK 489A 87SK 483A 86SK 482A 85SK 481

A 32SK 422A 36SK 180A 30SK 179A 30SK 174A 36SK 156B 42SK 620B 42SK 619B 42SK 618A 92SK 610

A 61SK 150A 60SK 122A 60SK 107A 61SK 78A 26SK 566A 38SK 485A 31SK 472A 36SK 468A 38SK 444

A 86SK 574A 85SK 573A 84SK 490A 91SK 451A 91SK 138A 91SK 96B 50LA LED 68A 73SK 185A 59SK 173

A 32SK 423A 31SK 420A 28SK 400A 28SK 178A 27SK 177B 48SK LED 3B 48SK LED 2A 92SK 611A 85SK 576

A 23SK 469A 30SK 456A 24SK 454A 27SK 452A 27SK 448A 26SK 447A 24SK 437A 36SK 427

A 16

2-2,5 K/W1,5-2 K/W1-1,5 K/W< 1 K/W

> 5 K/W4-5 K/W3-4 K/W2,5-3 K/W

Heatsink-chart

A

B

C

D

E

F

G

H

I

K

L

M

N

A 22SK 496A 28SK 493A 25SK 486A 23SK 478A 24SK 477A 24SK 476A 25SK 473A 29SK 471A 22SK 470

A 27SK 550A 29SK 549A 34SK 548A 31SK 547A 23SK 522A 24SK 521A 31SK 513A 32SK 511A 29SK 509

A 30SK 563A 29SK 562A 26SK 561A 26SK 560A 25SK 559A 23SK 558A 26SK 554A 23SK 552A 25SK 551

A 59SK 09A 22SK 616A 27SK 597A 29SK 587A 22SK 586A 25SK 582A 28SK 581A 22SK 565A 30SK 564

B 52ICK ... LB 52ICK ... HB 52ICK ... BA 83SK 494A 83SK 153A 72SK 31A 59SK 443A 59SK 145A 60SK 59

A 107SK 126A 91SK 125A 123SK 115A 108SK 95A 105SK 76A 105SK 75A 123SK 13A 123SK 12A 135SFP

A 92SK 609A 84SK 575A 94SK 516A 94SK 515 05A 94SK 515A 84SK 512A 84SK 492A 84SK 480A 124SK 431 ...

A 123UK 14 SA ...A 135SWPA 136SVPA 135SUA 136STPB 48SK LED 1

Heatsink-chart classified in categories of thermal resistance at 75 mm length

A 17

Heatsink-chart

A

B

C

D

E

F

G

H

I

K

L

M

N

extruded proﬁles SK 01

SK 02

SK 03

SK 04

SK 05

SK 07

SK 08

SK 14

SK 16

SK 18

SK 19

SK 20

SK 21

SK 28

SK 30

SK 31

SK 34

SK 36

SK 39

SK 45

SK 48

SK 52

SK 53

SK 55

SK 60

SK 63

SK 67

SK 69

SK 71

SK 72

SK 73

SK 74

SK 78

SK 79

SK 80

SK 84

SK 88

SK 97

SK 122

SK 124

SK 147

SK 148

SK 150

SK 165

SK 185

SK 195

SK 197

SK 401

SK 402

SK 404

SK 01

SK 02

SK 03

SK 04

SK 05

SK 07

SK 08

SK 14

SK 16

SK 18

SK 19

SK 20

SK 21

SK 28

SK 30

SK 31

SK 34

SK 36

SK 39

SK 45

SK 48

SK 52

SK 53

SK 55

SK 60

SK 63

SK 69

SK 71

SK 72

SK 73

SK 74

SK 78

SK 79

SK 80

SK 122

SK 147

SK 148

SK 150

SK 165

SK 185

SK 195

SK 197

SK 401

SK 402

SK 404

SK 01

SK 02

SK 03

SK 04

SK 05

SK 07

SK 08

SK 14

SK 16

SK 18

SK 19

SK 20

SK 21

SK 28

SK 30

SK 31

SK 34

SK 36

SK 39

SK 45

SK 48

SK 52

SK 53

SK 55

SK 60

SK 63

SK 69

SK 71

SK 72

SK 73

SK 74

SK 78

SK 79

SK 80

SK 122

SK 147

SK 148

SK 150

SK 165

SK 185

SK 195

SK 197

SK 401

SK 402

SK 404

SK 09

SK 59

SK 145

SK 01

SK 02

SK 03

SK 04

SK 05

SK 07

SK 08

SK 14

SK 16

SK 18

SK 19

SK 20

SK 21

SK 28

SK 30

SK 31

SK 34

SK 36

SK 39

SK 45

SK 48

SK 52

SK 53

SK 55

SK 60

SK 63

SK 69

SK 71

SK 72

SK 73

SK 74

SK 78

SK 79

SK 80

SK 122

SK 147

SK 148

SK 150

SK 165

SK 185

SK 195

SK 197

SK 401

SK 402

SK 404

TO 3 TO 66 SOT 9 TO 220 SOT 32

Assignment table of transistor heatsinks

A 18

A

B

C

D

E

F

G

H

I

K

L

M

N

Extruded heatsinks A 22 - 83

Heatsinks f. printed circuit boards A 89 - 111

Thermal conductive material E 2 - 24

Mount. material f. semiconductors E 44 - 48

Die-cast heatsinks A 125

Reating springs for transistors A 115 - 117

Lock-in transistor ﬁxing spring A 84 - 88

Technical introduction A 2 - 8

WP 4030

SK 126

SK 145

SK 437

SK 459

SK 484

SK 104

SK 129

SK 400

SK 409

SK 448

SK 456

SK 484

extruded heatsink

with solder pins

extruded

heatsinks

SK 126

SK 452

SK 452

set-up/clip-on

heatsinks

AKK 127

AKK 191

FK 243

FK 245

ﬁnger-shaped

heatsinks

FK 201

FK 202

FK 205

FK 206

FK 223

FK 236

FK 201

FK 202

FK 205

FK 206

FK 207

FK 208

FK 217

FK 225

FK 234

FK 236

FK 201

FK 202

FK 205

FK 206

FK 207

FK 208

FK 217

FK 234

FK 236

small heatsinks KF

KK 562

SKK

TO 3 TO 66 SOT 9 TO 5 TO 247 TO 3 P

A 19

Assignment table of transistor heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Extruded heatsinks A 22 - 83

Heatsinks f. printed circuit boards A 89 - 112

Thermal conductive material E 2 - 24

Mount. material f. semiconductors E 44 - 48

Die-cast heatsinks A 125

Reating springs for transistors A 115 - 117

Lock-in transistor ﬁxing spring A 84 - 88

Technical introduction A 2 - 8

SK 145

SK 437

SK 459

SK 460

U-heatsinks

extruded heatsink

with solder pin

SK 459

SK 460

extruded heatsinks ICK...B

ICK..H

ICK...L

set-up/clip-on

heatsinks

FK 224

FK 241

SK 516

FK 220

FK 224

FK 237

SK 515

ﬁnger-shaped

heatsinks

TO 218 TO 220 SOT 32 DIL PLCC P-SIP PGA/BGA

small heatsinks

ICK 35

SK 13

SK 431

UK 14

SK 12

SK 75

SK 104

SK 129

SK 145

SK 185

SK 409

SK 459

SK 460

SK 104

SK 129

SK 409

SK 459

SK 469

SK 470

SK 95

SK 454

SK 126

SK 452

SK 95

SK 126

SK 452

SK 454

SK 517

SK 518

ICK PLCC

ICK R

FK 224

FK 241

FK 224

FK 243

FK 245

FK 205

FK 206

FK 207

FK 208

FK 210

FK 212

FK 214

FK 216

FK 217

FK 218

FK 219

FK 220

FK 222

FK 225

FK 227

FK 228

FK 229

FK 230

FK 231

FK 232

FK 233

FK 234

FK 235

FK 247

FK 201

FK 205

FK 206

FK 207

FK 208

FK 209

FK 210

FK 211

FK 212

FK 213

FK 214

FK 215

FK 216

FK 217

FK 218

FK 219

FK 223

FK 234

FK 235

FK 236

FK 239

assignment

table

B 2 -

10

FK 224

KK 32

KK 92

Assignment table transistor heatsinks

A 20

A

B

C

D

E

F

G

H

I

K

L

M

N

Extruded heatsinks A 22 - 83

Heatsinks f. printed circuit boards A 89 - 112

Thermal conductive material E 2 - 24

Mount. material f. semiconductors E 44 - 48

Die-cast heatsinks A 125

Reating springs for transistors A 115 - 117

Lock-in transistor ﬁxing spring A 84 - 88

Technical introduction A 2 - 8

Hole pattern

10.9

4.2

4.2

5.6

13.2

32

10

3

14.9

3.6

4.77

6

33,5°

13.2

15.1

4.2

10.9

30.2 10.9

4.2

13.2

15.1

30.2

CB TO 3 S TO 3

CB = TO 3 + SOT 9 + TO 66 + SOT 32

at 37.5 mm oblique drilling TO 3 oblique drilling for 37.5 mm TO 3 exceeding 50 mm

TO 220 SOT 32 K

14.75

13

5

Ø 3.2

M 2.5

4

10

4.5

9

4

x10

3.2

24.4

14.8

37.5 (50)

SOT 32 / TO 220 exceeding 37.5 mm

Standard hole pattern are processed as complete pin layouts, centered on the length of the heatsink.

Other positions of the pin layout on the heatsink, multiple drillings or changes of the drillings are processed according to customer‘s

requirements.

For heatsinks exceeding 75 mm standard hole pattern can be supplied in multiple design.

Fixing slots

Heatsinks with the following shape and a standard hole pattern have these ﬁxing slots as part of the serial production

9

6.4

18.75

9

6.4

25

[mm] number of ﬁxing slots

37.5 2

75 4

[mm] number of ﬁxing slots

50 2

100 4

SK 01 50 SA TO3

 prole length surface pinlayout

Order example

Surface treatment for heatsinks with standard drilling: black anodised (SA).

Raw degreased aluminium (AL) and clear natural anodise (ME) on request.

A 21

Heatsinks

A

C

D

E

F

G

H

I

K

L

M

N

Extruded heatsinks A 22 - 83

Heatsinks for printed circuit boards A 89 - 112

Thermal conductive material E 2 - 24

Mount. material for semiconductors E 44 - 48

Die-cast heatsinks A 125

Reating springs for transistors A 115 - 117

Lock-in transistor ﬁxing spring A 84 - 88

Technical introduction A 2 - 8

B

Rth [K/W]

200 [mm]

8

2

6

50 100 150

15

20

25

30

35

40

art. no.

SK 586 ...

...

37.5 50 75 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

8

2

6

50 100 150

15

20

25

30

35

40

art. no.

SK 616 ...

...

37.5 50 75 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

50 100 150

22

24

26

28

30

32

10

1,8

6

art. no.

SK 496 ...

...

37.5 50 75 100 1000 mm

please indicate:

10

10

1,8

Rth [K/W]

200 [mm]

50 100 150

22

24

26

28

30

32

art. no.

SK 565 ...

...

37.5 50 75 100 1000 mm

please indicate:

8

2,5

11,8

50 100 150

10

15

20

25

30

Rth [K/W]

200 [mm]

art. no.

SK 470 ... extruded heatsinks for PCB mounting ➔A 110

... (optional)

SOT 32; TO 220

...

25 37.5 50 75 100 1000 mm

please indicate:

A 22

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

60 [mm]

12,6

6,5

10,6

6,3

3,9

1,3

15 30 45

36

24

27

30

33

art. no.

SK 522 ...

...

15 25 37.5 50 1000 mm

please indicate:

50 100 150

Rth [K/W]

200 [mm]

3,5

13,5

15,24

14

12

10

8

6

art. no.

SK 469 ... extruded heatsinks for PCB mounting ➔A 110

... (optional)

SOT 32; TO 220

...

25 37.5 75 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

6

1,8

14

50 100 150

32

30

28

26

24

art. no.

SK 478 ...

...

25 37.5 50 75 1000 mm

please indicate:

Rth [K/W]

200 [mm]

50 100 150

20

16

12

8

4

10

1,8

14

art. no.

SK 552 ...

...

25 37.5 50 75 100 1000 mm

please indicate:

Rth [K/W]

50 100 150 200 [mm]

25

20

15

10

5

14

2,5

14

art. no.

SK 558 ...

...

25 37.5 50 75 100 1000 mm

please indicate:

A 23

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

8

3

50 100 150

20

22

24

26

18

15,3

art. no.

SK 521 ...

...

25 37.5 50 75 100 1000 mm

please indicate:

Ø 2,5

16

16

3,5

Ø 1,4

5

50 100 150

8

12

16

20

24

Rth [K/W]

200 [mm]

art. no.

SK 437 ... extruded heatsinks for PCB mounting ➔A 109

... (optional)

TO 218; TO 220; TO 247; TO 248

...

100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

6

1,8

21

50 100 150

20

22

24

26

18

art. no.

SK 476 ...

...

37.5 50 75 100 1000 mm

please indicate:

50 100 150 200 [mm]

4

6

8

12

19

3

21,45

Rth [K/W]

10

art. no.

SK 454 ... extruded heatsinks for PCB mounting ➔A 96

... (optional)

SOT 32; TO 220

...

37.5 50 75 100 150 1000 mm

please indicate:

24

22

20

18

16

Rth [K/W]

50 100 150 200 [mm]

6

1,8

23

art. no.

SK 477 ...

...

37.5 50 100 1000 mm

please indicate:

A 24

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

24

22

20

18

16

Rth [K/W]

50 100 150 200 [mm]

10

1,8

23

art. no.

SK 582 ...

...

37.5 50 75 100 1000 mm

please indicate:

12,3

23

2,5

Rth [K/W]

50 100 150 200 [mm]

6

8

14

12

10

art. no.

SK 559 ...

...

37.5 75 100 1000 mm

please indicate:

Rth [K/W]

50 100 150 200 [mm]

12,5

10,0

7,5

5,0

2,5

12,3

3,5

24,2

art. no.

SK 551 ...

...

37.5 50 75 100 1000 mm

please indicate:

2

6

10

12

16

14

8

4

50 100 150 200 [mm]

3

25,8

8

Rth [K/W]

art. no.

SK 486 ...

...

37.5 50 75 100 1000 mm

please indicate:

6

1,8

50 100 150 200 [mm]

14

16

18

20

12

Rth [K/W]

27

art. no.

SK 473 ...

...

37.5 50 75 1000 mm

please indicate:

A 25

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

50 100 150 200 [mm]

12,5

10,0

7,5

5,0

2,5

10

1,8

27

art. no.

SK 554 ...

...

37.5 50 75 100 1000 mm

please indicate:

50 100 150 200 [mm]

2

4

6

8

10

Rth [K/W]

10

27

3

art. no.

SK 447 ...

...

37.5 1000 mm

please indicate:

Rth [K/W]

50 100 150 200 [mm]

10

8

6

4

2

27

14

2,5

art. no.

SK 560 ...

...

37.5 50 75 100 1000 mm

please indicate:

Rth [K/W]

50 100 150 200 [mm]

10

8

6

4

2

27

22

3,5

art. no.

SK 566 ...

...

37.5 50 75 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

20

2,5

50 100 150

4

8

12

16

27,95

8

art. no.

SK 561 ...

...

37.5 50 75 100 1000 mm

please indicate:

A 26

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

12

4

6

8

10

3,5

50 100 150

27,95

12,5

art. no.

SK 448 ... extruded heatsinks for PCB mounting ➔A 111

...

37.5 50 75 mm

please indicate:

50 100 150

2

4

6

8

10

Rth [K/W]

200 [mm]

15,24

3,5

27,95

art. no.

SK 177 ...

...

50 75 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

29

3,5

11,5

50 100 150

7

8

9

10

11

art. no.

SK 550 ...

...

37.5 50 75 100 1000 mm

please indicate:

4

10

12

8

6

50 100 150

Rth [K/W]

200 [mm]

29

25

3,5

art. no.

SK 452 ... extruded heatsinks for PCB mounting ➔A 96

... (optional)

TO 218; TO 220; TO 247; TO 248; TO 3 P

...

37.5 100 1000 mm

please indicate:

30

3

17,5

Rth [K/W]

200 [mm]50 100 150

12

10

4

6

8

art. no.

SK 597 ...

...

37.5 50 75 100 1000 mm

please indicate:

A 27

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

31

1,8

6

50 100 150 200 [mm]

4

8

12

16

20

Rth [K/W]

art. no.

SK 493 ...

...

37.5 50 75 100 1000 mm

please indicate:

Rth [K/W]

31

1,8

10

50 100 150 200 [mm]

4

8

12

16

20

art. no.

SK 581 ...

...

37.5 50 75 100 1000 mm

please indicate:

33

10

3

Rth [K/W]

50 100 150 200 [mm]

4

6

8

10

12

art. no.

SK 400 ... extruded heatsinks for PCB mounting ➔A 111

...

37.5 50 75 100 1000 mm

please indicate:

Rth [K/W]

34,5

5

16,5

50 100 150 200 [mm]

2

4

6

8

10

art. no.

SK 178 ...

...

37.5 75 100 1000 mm

please indicate:

50 100 150 200 [mm]

1

2

3

4

5

Rth [K/W]

34,5

5

50

art. no.

SK 134 ...

...

37.5 50 100 1000 mm

please indicate:

A 28

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

50 100 150

18

16

14

12

10

Rth [K/W]

200 [mm]

6

1,8

35

art. no.

SK 471 ...

...

37.5 50 75 1000 mm

please indicate:

50 100 150

16

14

12

10

8

Rth [K/W]

10

1,8

35

200 [mm]

art. no.

SK 587 ...

...

37.5 50 75 100 1000 mm

please indicate:

50 100 150

5

6

7

8

9

Rth [K/W]

200 [mm]

35

2,5

10

art. no.

SK 549 ...

...

37.5 50 75 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

35

2,5

14

50 100 150

4

5

6

7

8

art. no.

SK 562 ...

...

37.5 50 75 100 1000 mm

please indicate:

50 100 150

10

8

6

4

2

Rth [K/W]

200 [mm]

3,5

36

12,3

art. no.

SK 509 ...

...

37.5 50 100 1000 mm

please indicate:

A 29

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

6

1,8

37

50 100 150

16

14

12

10

8

Rth [K/W]

200 [mm]

art. no.

SK 563 ...

...

37.5 50 75 100 1000 mm

please indicate:

10

1,8

50 100 150

20

16

12

8

4

Rth [K/W]

200 [mm]

37

art. no.

SK 564 ...

...

37.5 50 75 100 1000 mm

please indicate:

50 100 150

2

4

6

8

10

Rth [K/W]

200 [mm]

30

6

38

12

10

art. no.

SK 174 ...

...

75 1000 mm

please indicate:

50 100 150

2

4

6

8

10

Rth [K/W]

200 [mm]

38,1

3,5

16,5

art. no.

SK 179 ...

...

37.5 50 100 1000 mm

please indicate:

1,8

40

6

Rth [K/W]

200 [mm]

50 100 150

8

10

12

14

16

art. no.

SK 456 ... extruded heatsinks for PCB mounting ➔A 111

...

37.5 50 75 100 1000 mm

please indicate:

A 30

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

50 100 150

6

8

10

12

14

Rth [K/W]

200 [mm]

3,5

40

8

art. no.

SK 420 ...

...

37.5 75 1000 mm

please indicate:

50 100 150

3

6

9

12

15

Rth [K/W]

200 [mm]

1,8

40

10

art. no.

SK 513 ...

...

37.5 50 75 100 1000 mm

please indicate:

40

2,5

10

50 100 150

8

10

12

14

16

Rth [K/W]

200 [mm]

art. no.

SK 547 ...

...

37.5 50 75 100 1000 mm

please indicate:

40

5

27

50 100 150

2

4

6

8

10

Rth [K/W]

200 [mm]

art. no.

SK 106 ...

...

50 75 1000 mm

please indicate:

50 100 150

3

4

5

6

2

Rth [K/W]

41,5

8

22

200 [mm]

art. no.

SK 472 ...

...

37.5 50 75 100 1000 mm

please indicate:

A 31

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

41,5

8

34

Rth [K/W]

200 [mm]

50 100 150

1

2

3

4

5

art. no.

SK 189 ...

...

37.5 50 75 100 1000 mm

please indicate:

43,1

3

8

50 100 150

6

8

10

12

14

Rth [K/W]

200 [mm]

art. no.

SK 423 ...

...

100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

4

43,1

16,51

50 100 150

3

4

5

6

7

art. no.

SK 422 ...

...

50 1000 mm

please indicate:

50 100 150 200 [mm]

3

6

9

12

15

Rth [K/W]

1,8

6

45

art. no.

SK 511 ...

...

50 75 100 1000 mm

please indicate:

A 32

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

50 100 150

1

2

3

4

5

Rth [K/W]

200 [mm]

45

10

60

art. no.

SK 453 ...

... (optional)

SSR 1

...

37.5 75 mm

please indicate:

50 100 150

0,5

1,0

1,5

2,0

2,5

3,0

12

80

45

5

Rth [K/W]

200 [mm]

art. no.

SK 455 ...

... (optional)

SSR 4

...

75 mm

please indicate:

12

Rth [K/W]

85

45

5

50 100 150 200 [mm]

2,5

2,0

1,5

1,0

0,5

3,0

art. no.

SK 467 ...

... (optional)

SSR 1; SSR 4

...

37.5 50 75 100 1000 mm

please indicate:

A 33

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

45,7

4

16,51

Rth [K/W]

50 100 150

3

4

5

6

200 [mm]

art. no.

SK 424 ...

...

75 1000 mm

please indicate:

48,3

Rth [K/W]

50 100 150

3

4

5

6

200 [mm]

4

16,51

art. no.

SK 425 ...

...

75 mm

please indicate:

50 100 150

1

2

3

4

5

Rth [K/W]

49,5

5

38

200 [mm]

art. no.

SK 445 ...

...

100 1000 mm

please indicate:

50 100 150

0,6

1,2

1,8

2,4

3,0

200 [mm]

Rth [K/W]

7

50

49,5

art. no.

SK 450 ...

...

75 1000 mm

please indicate:

Rth [K/W]

50

2,5

10

50 100 150 200 [mm]

6

8

10

art. no.

SK 548 ...

...

37.5 50 75 100 1000 mm

please indicate:

A 34

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

50 100 150 200 [mm]

1

2

3

4

5

50

4,5

25

art. no.

SK 567 ...

...

37.5 50 75 100 1000 mm

please indicate:

Rth [K/W]

50 100 150 200 [mm]

1

2

3

4

5

10

50

40

art. no.

SK 434 ...

... (optional)

SSR 1

...

50 75 100 1000 mm

please indicate:

Rth [K/W]

50 100 150 200 [mm]

4,0

3,5

3,0

2,5

2,0

50

45

3,5

art. no.

SK 475 ...

...

37.5 50 100 1000 mm

please indicate:

10

50

60

50 100 150

1

2

3

4

5

Rth [K/W]

200 [mm]

art. no.

SK 527 ...

...

50 75 100 1000 mm

please indicate:

A 35

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

50 100 150

4

6

8

10

12

Rth [K/W]

50,8

3

8

200 [mm]

art. no.

SK 427 ...

...

50 75 1000 mm

please indicate:

50 100 150

2

3

4

5

6

Rth [K/W]

50,8

16,51

4

200 [mm]

art. no.

SK 426 ...

...

37.5 50 75 100 1000 mm

please indicate:

50 100 150

2

4

6

8

10

Rth [K/W]

200 [mm]

51

5

12

art. no.

SK 156 ...

...

37.5 50 75 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

3,5

12,3

50 100 150

7,5

6,5

5,5

4,5

3,5

51

art. no.

SK 468 ...

...

37.5 75 1000 mm

please indicate:

Rth [K/W]

200 [mm]

5

16,5

53,3

50 100 150

2

4

6

8

10

art. no.

SK 180 ...

...

37.5 50 75 100 1000 mm

please indicate:

A 36

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

50 100 150

1

2

3

4

5

Rth [K/W]

200 [mm]

4

20

54

art. no.

SK 99 ...

...

37.5 50 75 100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

5,5

6,3

2,2

3

1,5

M 3

M 3M 3

22

54

19

55

7,5 5,2

4

6

35,6

50 100 150

1,5

2,0

2,5

3,0

3,5

art. no.

SK 429 ...

...

37.5 50 75 100 1000 mm

please indicate:

50 100 150

1,5

2

2,5

3

3,5

Rth [K/W]

200 [mm]

22,6

58

16,8

55

art. no.

SK 436 ...

...

75 1000 mm

please indicate:

Rth [K/W]

200 [mm]

55

30

20,5

6,4

58 50 100 150

1

2

3

4

5

art. no.

SK 50 ...

...

75 1000 mm

please indicate:

A 37

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

61

3,7

8,9

50 100 150

2

4

6

8

10

Rth [K/W]

200 [mm]

art. no.

SK 485 ...

...

50 75 100 1000 mm

please indicate:

50 75 100

2

3

4

5

6

Rth [K/W]

150 [mm]

62,5

3,5

20

art. no.

SK 444 ...

...

37.5 50 75 1000 mm

please indicate:

50 100 150

1

2

3

4

5

Rth [K/W]

200 [mm]

4,5

6

25

63

art. no.

SK 406 ...

...

37.5 50 75 100 1000 mm

please indicate:

66

40

10

Rth [K/W]

200 [mm]

50 100 150

1

2

3

4

5

art. no.

SK 100 ...

...

37.5 50 75 100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

50 100 150

1

2

3

4

5

75

5

25

art. no.

SK 594 ...

...

37.5 50 75 100 1000 mm

please indicate:

A 38

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

50 100 150

1

2

3

4

5

80

2,5

10

art. no.

SK 545 ...

...

50 75 100 150 1000 mm

please indicate:

82

32

5

Rth [K/W]

200 [mm]

50 100 150

1

2

3

4

5

art. no.

SK 612 ...

...

37.5 50 75 100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

6

8

10

69

82 50 100 150

0,6

1,0

1,4

1,8

2,2

85

art. no.

SK 135 ...

...

50 100 1000 mm

please indicate:

50 100 150

1

2

3

4

5

Rth [K/W]

200 [mm]

83

4,2

25

art. no.

SK 407 ...

...

37.5 50 75 100 1000 mm

please indicate:

84

40

10

Rth [K/W]

200 [mm]

50 100 150

1

2

3

4

5

art. no.

SK 464 ...

...

50 75 100 150 1000 mm

please indicate:

A 39

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

50 100 150

1

2

3

4

5

Rth [K/W]

200 [mm]

89

10

2

art. no.

SK 182 ...

...

37.5 50 75 100 150 200 1000 mm

please indicate:

100

12

90

50 100 150

0,2

0,6

1,0

1,4

1,8

Rth [K/W]

200 [mm]

art. no.

SK 507 ...

... (optional)

SSR 1; SSR 2

...

37.5 75 100 1000 mm

please indicate:

50 100 150

1

2

3

4

5

Rth [K/W]

200 [mm]

98

40

5,5

art. no.

SK 408 ...

...

50 75 100 150 1000 mm

please indicate:

50 100 150

1

2

3

4

5

Rth [K/W]

200 [mm]

100

2,5

10

art. no.

SK 546 ...

...

37.5 50 75 100 150 1000 mm

please indicate:

A 40

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

50 100 150

1

2

3

4

5

Rth [K/W]

200 [mm]

15

100

4

art. no.

SK 81 ...

...

37.5 50 75 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

50 100 150

1,0

2,0

3,0

4,0

5,0

4

15

100

art. no.

SK 505 ... weight reduced like SK 81

...

37.5 50 75 100 150 1000 mm

please indicate:

100

25

4,3

Rth [K/W]

200 [mm]

50 100 150

1,0

2,0

3,0

4,0

art. no.

SK 508 ...

...

37.5 50 75 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

100

10

40

50 100 150

0,5

1,0

1,5

2,0

2,5

art. no.

SK 92 ...

...

50 75 100 150 1000 mm

please indicate:

50 100 150

1,0

1,5

2,0

2,5

3,0

Rth [K/W]

200 [mm]

111,1

33

7,6

art. no.

SK 433 ...

...

37.5 50 75 1000 mm

please indicate:

A 41

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

50 100 150 200 [mm]

0,5

1,0

1,5

2,0

2,5

112

67,5

10,5

Rth [K/W]

art. no.

SK 121 ...

...

75 100 150 1000 mm

please indicate:

114,2

108,2

31,8

44,5 70

50 100 150 200 [mm]

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

114,5

art. no.

SK 33 ...

... (optional)

SSR 1

...

50 75 100 1000 mm

please indicate:

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

116,5

15

50

art. no.

SK 411 ...

...

50 75 100 150 1000 mm

please indicate:

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

4

10,3

40

6120

art. no.

SK 442 ...

...

50 75 100 150 1000 mm

please indicate:

A 42

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

9

60

120 50 100 150

0,5

1,0

1,5

2,0

2,5

art. no.

SK 595 ...

...

50 75 100 150 1000 mm

please indicate:

130

25

4,2

Rth [K/W]

200 [mm]

50 100 150

0,5

2,0

2,5

1,5

1,0

art. no.

SK 463 ...

...

50 75 100 150 1000 mm

please indicate:

130

84

15

Rth [K/W]

200 [mm]

50 100 150

0,5

2,0

2,5

1,5

1,0

art. no.

SK 613 ...

...

37.5 50 75 100 150 1000 mm

please indicate:

10,2

138

50

50 100 150

2,5

2,0

1,5

1,0

0,5

Rth [K/W]

200 [mm]

art. no.

SK 466 ...

...

50 75 100 150 1000 mm

please indicate:

50 100 150

0,5

1,0

1,5

2,0

2,5

120,25

141,05

7,9

33,3

Rth [K/W]

200 [mm]

art. no.

SK 413 ...

...

100 1000 mm

please indicate:

A 43

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

149,6

4

9

Rth [K/W]

50 100 150

2

4

6

8

200 [mm]

art. no.

SK 601 ...

...

50 75 100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

150

6

19

50 100 150

0,7

1,5

2,2

3,0

3,7

art. no.

SK 553 ...

...

37.5 50 75 100 150 1000 mm

please indicate:

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

150

4,5

25

art. no.

SK 132 ...

...

37.5 50 75 100 150 1000 mm

please indicate:

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

150

25

4,7

art. no.

SK 410 ...

...

37.5 50 75 100 150 1000 mm

please indicate:

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

150

5

27

art. no.

SK 133 ...

...

50 75 100 1000 mm

please indicate:

A 44

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

150

27

5

art. no.

SK 58 ...

...

50 75 100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

50 100 150

0,9

1,1

1,3

1,5

1,7

5

150

27

art. no.

SK 504 ... weight reduced like SK 58

...

37.5 50 75 100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

39,5

150

9

50 100 150

0,5

1,0

1,5

2,0

2,5

art. no.

SK 588 ...

...

50 75 100 150 1000 mm

please indicate:

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

40

150

4,5

art. no.

SK 120 ...

...

50 75 100 150 1000 mm

please indicate:

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

150

15

50

art. no.

SK 155 ...

...

75 100 150 1000 mm

please indicate:

A 45

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

156

3

4

8

11

71

50 100 150

0,2

0,4

0,6

0,8

1,0

art. no.

SK 154 ...

...

50 75 100 150 mm

please indicate:

Rth [K/W]

200 [mm]

160

19

6

50 100 150

1

2

3

4

5

art. no.

SK 417 ...

...

75 100 150 1000 mm

please indicate:

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

40

160

10

art. no.

SK 85 ...

...

37.5 50 75 100 150 1000 mm

please indicate:

40

160

10

Rth [K/W]

200 [mm]

50 100 150

0,6

0,8

1,0

1,2

1,4

art. no.

SK 503 ... weight reduced like SK 85

...

75 100 1000 mm

please indicate:

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

9

50

160

art. no.

SK 510 ...

...

50 75 100 150 1000 mm

please indicate:

A 46

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

50

160

10

art. no.

SK 416 ...

...

50 75 100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

162

25

4

50 100 150

0,4

0,8

1,2

1,6

2,0

art. no.

SK 119 ...

...

50 75 100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

163

40

10

50 100 150

0,4

0,8

1,2

1,6

2,0

art. no.

SK 412 ...

...

50 75 100 150 1000 mm

please indicate:

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

167

4,5 15

art. no.

SK 421 ...

...

50 75 100 150 200 1000 mm

please indicate:

50 100 150

1

2

3

4

5

Rth [K/W]

200 [mm]

10

2

169

2,5

art. no.

SK 405 ...

...

100 1000 mm

please indicate:

A 47

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

9,8

40

177,5

Rth [K/W]

200 [mm]

50 100 150

0,4

0,8

1,2

1,6

2,0

art. no.

SK 519 ...

...

50 100 1000 mm

please indicate:

50 100 150

0,2

0,4

0,6

0,8

1,0

Rth [K/W]

200 [mm]

190

550

art. no.

SK 90 ...

...

50 75 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

200

15

3,5

50 100 150

0,5

1,0

1,5

2,0

2,5

art. no.

SK 136 ...

...

75 100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

200

15

3,5

50 100 150

0,5

1,0

1,5

2,0

2,5

art. no.

SK 166 ...

...

1000 mm

please indicate:

Rth [K/W]

200 [mm]

200

20

4

50 100 150

0,5

1,0

1,5

2,0

2,5

art. no.

SK 113 ...

...

50 75 100 150 1000 mm

please indicate:

A 48

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

200

425

50 100 150

0,5

1,0

1,5

2,0

2,5

art. no.

SK 42 ...

...

50 75 100 150 200 1000 mm

please indicate:

Rth [K/W]

200 [mm]

200

188,3

3,7

4

5,7

2,2

1,5 25

50 100 150

0,5

1,0

1,5

2,0

2,5

art. no.

SK 94 ...

...

1000 mm

please indicate:

Rth [K/W]

200 [mm]

200

39,9

50 100 150

0,5

0,7

0,9

1,1

1,3

9,2

art. no.

SK 502 ... weight reduced like SK 47

...

37.5 50 75 100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

40

10

1,2

50 100 150

0,4

0,6

0,8

1,0

200

art. no.

SK 47 ...

...

75 100 150 1000 mm

please indicate:

10

0,4

0,8

1,2

2,0

50 100 150

Rth [K/W]

60

200 200 [mm]

1,6

art. no.

SK 591 ...

...

75 100 150 1000 mm

please indicate:

A 49

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

50 100 150

1,0

0,2

0,4

0,6

0,8

16,5

83

200

art. no.

SK 520 ...

...

75 100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

213

10

40

50 100 150

0,2

0,4

0,6

0,8

1,0

art. no.

SK 193 ...

...

100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

216

17

77

50 100 150

0,2

0,4

0,6

0,8

1,0

art. no.

SK 557 ...

...

75 100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

216

15

83

50 100 150

0,2

0,4

0,6

0,8

1,0

art. no.

SK 102 ...

...

75 100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

80

104,5

13,5

13,5

7,6

40

226,5

15

50 100 150

0,4

0,6

0,8

1,0

1,2

art. no.

SK 168 ...

...

1000 mm

please indicate:

A 50

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

235

860

50 100 150

0,2

0,4

0,6

0,8

1,0

art. no.

SK 580 ...

...

75 100 150 200 1000 mm

please indicate:

Rth [K/W]

200 [mm]

245

5

25

50 100 150

0,4

0,6

0,8

1,0

1,2

art. no.

SK 118 ...

...

75 100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

250

28

6

50 100 150

0,5

1,0

1,5

2,0

2,5

art. no.

SK 49 ...

...

50 75 150 200 1000 mm

please indicate:

Rth [K/W]

200 [mm]

250

40

6

50 100 150

0,2

0,4

0,6

0,8

1,0

art. no.

SK 555 ...

...

75 100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

250

40

6

50 100 150

0,2

0,4

0,6

0,8

1,0

art. no.

SK 199 ...

...

75 100 1000 mm

please indicate:

A 51

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

50 100 150

1,1

0,3

0,5

0,7

0,9

Rth [K/W]

200 [mm]

40

250

10

art. no.

SK 524 ...

...

75 100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

4

230,5

250

10

1,9

3,4

7,5

40

50 100 150

0,2

0,4

0,6

0,8

1,0

art. no.

SK 91 ...

...

75 100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

83

15

250 50 100 150

0,2

0,3

0,4

0,5

0,6

art. no.

SK 438 ...

...

75 100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

6

5

40

252

2

6

258 50 100 150

0,2

0,4

0,6

0,8

1,0

art. no.

SK 190 ...

...

150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

50 100 150

0,2

0,4

0,6

0,8

1,0

11,5

67,5

260

art. no.

SK 614 ...

...

75 100 150 200 1000 mm

please indicate:

A 52

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

6

50

265

50 100 150

0,5

1,0

1,5

2,0

2,5

art. no.

SK 149 ...

...

200 1000 mm

please indicate:

Rth [K/W]

200 [mm]

9

10,7 6,5

3,5

10

15

20 54

74

265 50 100 150

0,2

0,4

0,6

0,8

1,0

art. no.

SK 139 ...

...

100 150 200 1000 mm

please indicate:

Rth [K/W]

200 [mm]

282

6

6

28

50 100 150

0,5

0,7

0,9

1,1

1,3

art. no.

SK 583 ...

...

100 150 200 1000 mm

please indicate:

Rth [K/W]

200 [mm]

300

15

3,9

50 100 150

0,4

0,6

0,8

1,0

1,2

art. no.

SK 198 ...

...

100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

27

300

6,5

50 100 150

0,4

0,6

0,8

1,0

1,2

art. no.

SK 446 ...

...

75 100 150 1000 mm

please indicate:

A 53

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

300

40

10

50 100 150

0,2

0,4

0,6

0,8

1,0

art. no.

SK 56 ...

...

75 100 150 200 1000 mm

please indicate:

Rth [K/W]

200 [mm]

300

40

10

50 100 150

0,2

0,3

0,4

0,5

0,6

art. no.

SK 501 ... weight reduced like SK 56

...

37.5 50 75 100 150 200 1000 mm

please indicate:

Rth [K/W]

200 [mm]

12

60

300

100 150

0,1

0,2

0,3

0,4

0,5

50

art. no.

SK 568 ...

...

75 100 150 200 1000 mm

please indicate:

Rth [K/W]

200 [mm]

12

83,5

100 150

0,1

0,2

0,3

0,4

0,5

50

300

40

art. no.

SK 157 ...

...

100 150 200 1000 mm

please indicate:

Rth [K/W]

200 [mm]

304

39,5

4,5

100 150

0,2

0,4

0,6

0,8

1,0

50

art. no.

SK 101 ...

...

75 100 1000 mm

please indicate:

A 54

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

320

20

4

100 150

0,4

0,8

1,2

1,6

2,0

50

art. no.

SK 579 ...

...

75 100 150 200 1000 mm

please indicate:

Rth [K/W]

200 [mm]

338

285

5

8

126 126

32

5

50 100 150

0,2

0,4

0,6

0,8

1,0

art. no.

SK 66 ...

...

75 100 1000 mm

please indicate:

50 100 150

0,4

0,5

0,6

0,7

0,3

Rth [K/W]

200 [mm]

40

350

7,2

art. no.

SK 523 ...

...

100 150 200 1000 mm

please indicate:

Rth [K/W]

200 [mm]

380

525

8

100 150

0,4

0,5

0,6

0,7

0,8

50

art. no.

SK 439 ...

...

100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

400

9,2 40

50 100 150

0,2

0,4

0,6

0,8

1,0

art. no.

SK 479 ...

...

75 100 150 1000 mm

please indicate:

A 55

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

400

40

10

380,5

4

1,9

3,4

7,5 50 100 150

0,2

0,4

0,6

0,8

1,0

art. no.

SK 93 ...

...

75 100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

420

40

6

50 100 150

0,2

0,4

0,6

0,8

1,0

art. no.

SK 130 ...

...

200 1000 mm

please indicate:

Rth [K/W]

200 [mm]

426,4

57,5

10,5

50 100 150

0,2

0,4

0,6

0,8

1,0

art. no.

SK 621 ...

...

75 100 150 200 1000 mm

please indicate:

Rth [K/W]

200 [mm]

482,8 = 19"

8

11,4

33,5

50 100 150

0,2

0,4

0,6

0,8

1,0

art. no.

SK 191 ... suitable heatsink for rear panal in 19'' cases

...

75 100 150 200 1000 mm

please indicate:

A 56

A 11 – 12Heatsinks for Solid State RelayA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Order example

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

– optimum fin geometry and fin quantity for free convection

– well suited for forced convection

– flat milled base (not SK 530, SK 531)

–*= welded joint (not SK 530, SK 531)

– length according customer´s details

– customer specific versions and machining on request

B

A

C

12,5

100 200 300 400

0,10

0,12

0,14

0,16

0,18

0,20

Rth

[K/W]

0,22

0,24

0,26

0,28

0,30

0,32

0,34

0,36

0,38

0,40

0,04

0,06

0,08

[mm]

SK 540

SK 539

SK 538

SK 537

SK 536

SK 535

SK 533

SK 531

SK 530

*

Rz10 < 0,1 100

<

dim. [mm]number of finsart. no.

CBA

84 ±0.7

200 ±0.7

15 ±0.7

14SK 530 ...

84 ±0.7

300 ±1

15 ±0.7

22SK 531 ...

84 +0/ -1.5

400 +0.6/ -1.6

16 +0/ -1.5

30SK 533 ...

84 +0/ -1.5

500 +0.6/ -1.6

16 +0/ -1.5

38SK 535 ...

84 +0/ -1.5

550 +0.6/ -1.6

16 +0/ -1.5

42SK 536 ...

84 +0/ -1.5

600 +0.6/ -1.6

16 +0/ -1.5

46SK 537 ...

84 +0/ -1.5

650 +0.6/ -1.6

16 +0/ -1.5

50SK 538 ...

84 +0/ -1.5

700 +0.6/ -1.6

16 +0/ -1.5

54SK 539 ...

84 +0/ -1.5

750 +0.6/ -1.6

16 +0/ -1.5

58SK 540 ...

...

200 300 400 500 600 mm

please indicate:

A 57

A 11 – 12heatsinks for Solid State RelaisA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Heatsink profile-overview

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

Welded high perfomance heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

– other length according to customer´s details

– customer specific versions and machining upon request

6

R 1

R 0,3

71

3,6

4

8

200 ±1,2

84 ±0,6

16

7,5

12

Rth [K/W]

6,2

4

12,5

100

0,05

0,1

0,15

0,2

0,25

0,3

0,35

150 200 250 300 350 400 [mm]

art. no.

SK 418 ...

...

100 150 200 1000 mm

please indicate:

15

5,2

5

12,5

69

13,5

4,8

R 0,4

R 1,1

4,8

100

0,05

0,1

0,15

0,2

0,25

0,3

0,35

150 200 250 300 350

100 150 200 250 300 350

0,01

0,02

0,03

0,04

0,05

0,06

0,07

0,08

SK 158

SK 159

SK 160

SK 161

SK 162

Rth

[K/W]

Rth

[K/W]

400 [mm]

400 [mm]

v = 5 m/s

B

A

SK 158

SK 159

SK 160

SK 161

SK 162

+ 1,2

– 1

83,5

dim. [mm]number of finsart. no.

BA

300 ±2

2022SK 158 ...

400 ±2

2030SK 159 ...

500 ±2.5

2038SK 160 ...

600 ±3

2046SK 161 ...

750 ±4

2058SK 162 ...

...

200 300 400 500 600 mm

please indicate:

A 58

A 11 – 12heatsinks for Solid State RelaisA 9High decorative surfaces

A 137 – 138Special heatsink designA 21Heatsink profile-overview

A 140Special profilesA 10Heatsink as visual & decor-parts

A 2 – 8Technical introductionA 12Drilling pattern for Solid State Relais

High performance heatsinks with press-in fins

A

B

C

D

E

F

G

H

I

K

L

M

N

12

29

11,5

2,5

SK 09 37,5 TO 220 1

SK 09 50,0 TO 220 1

29

14,8

9,6

4,5

∅ 3,2

7

29

SK 09 20 TO 220

17

29

∅ 3,2

20

SK 09 50 TO 220

29

17,7

∅ 3,2

50

7

14,75

4,5

37,5

SK 09 37,5 TO 220

4,5

11,3

∅ 3,2

7

14,75

Rth [K/W]

20 37,5 50 75

6

8

10

12

100

[mm]

14

16

3,2∅

art. no.

SK 09 ...

... (optional)

K; TO 220

...

20 37.5 50 1000 mm

please indicate:

15,5

25,4

29

12

3

SK 145 37,5 TO 220

11,3

29

∅ 3,2

37,5

7

14,75

4,5

SK 145 20 TO 220

17

29

∅ 3,2

20

29

17,7

∅ 3,2

50

7

14,75

4,5

SK 145 50 TO 220

29

SK 145 25 TO 220

5,1

∅ 3,2

25

7

4,5

14,75

Rth [K/W]

50 100 150 200 [mm]

6

8

10

12

14

art. no.

SK 145 ...

... (optional)

TO 220

...

20 25 37.5 50 1000 mm

please indicate:

Rth [K/W]

30,1

2,5

3,6

3,5 3,6

12,5

11,7

50 100 150 200 [mm]

4

8

12

16

20

art. no.

SK 443 ...

...

37.5 75 100 1000 mm

please indicate:

37,5

6,7

39

44,5

76,2

Rth [K/W]

200 [mm]

2

4

6

8

10

50 100 150

art. no.

SK 173 ...

...

1000 mm

please indicate:

A 59

E 26 – 27Screw mounted guide railsA 21Hole pattern

E 2 – 24Thermal conductive materialA 91Profiles for PCB components

D 14Heatsink-cooling aggregatesA 89Heatsinks for PCB

A 2 – 8Technical introductionA 89 – 112Profiles for PCB mounting

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

19,5

2,5

12,5

42,7

50 100 150

2

4

6

8

10

art. no.

SK 59 ...

... (optional)

TO 220

...

37.5 50 75 100 1000 mm

please indicate:

Rth [K/W]

27,4

3

12,5

45

50 100 150

2

4

6

8

200 [mm]

art. no.

SK 122 ...

... (optional)

TO 3; CB

...

37.5 50 mm

please indicate:

32

4

24

2,4

25

46

Rth [K/W]

200 [mm]

50 100 150

1

2

3

4

5

6

7

art. no.

SK 107 ...

...

50 75 100 1000 mm

please indicate:

11 7,5

2,5

20

50

Rth [K/W]

50 100 150 200 [mm]

1

2

3

4

5

art. no.

SK 181 ...

...

50 75 100 1000 mm

please indicate:

Rth [K/W]

11 7,5

2,5

20

50

19,06

27,94 27,94

4

50

4,2

4,2

16,5

8

17,25

3 x M 3

50 100 150 200 [mm]

1

2

3

4

5

2 x M 3

20

83,82

94

art. no.

SK 181 94 C 3

x TO 220 retaining spring for transistor THF 409 TO 220 ➔A 115

A 60

E 26 – 27Screw mounted guide railsA 21Hole pattern

E 2 – 24Thermal conductive materialA 91Profiles for PCB components

D 14Heatsink-cooling aggregatesA 89Heatsinks for PCB

A 2 – 8Technical introductionA 89 – 112Profiles for PCB mounting

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

60

33

15

4

Rth [K/W]

50 100 150

2

4

6

8

10

200 [mm]

art. no.

SK 78 ...

... (optional)

TO 3; CB

...

37.5 50 75 100 1000 mm

please indicate:

35,5

3,5

20

60

Rth [K/W]

2

4

6

8

10

200 [mm]

50 100 150

art. no.

SK 51 ...

... (optional)

TO 3; CB

...

37.5 50 75 100 1000 mm

please indicate:

34

17,5

4

62

Rth [K/W]

1

2

3

4

5

200 [mm]

50 100 150

art. no.

SK 165 ...

... (optional)

TO 3; CB

...

37.5 50 75 1000 mm

please indicate:

Rth [K/W]

200 [mm]

29

5

1,7

28,5

9,2

28

63,2 50 100 150

1

2

3

4

5

art. no.

SK 25 ... with slots for cover plates or PCBs

...

37.5 50 1000 mm

please indicate:

Rth [K/W]

200 [mm]

25,4

2,6

3,2

1,5

57,4

2

12,1

5

63,8 50 100 150

2

4

6

8

10

art. no.

SK 150 ...

...

1000 mm

please indicate:

A 61

E 26 – 27Screw mounted guide railsA 21Hole pattern

E 2 – 24Thermal conductive materialA 91Profiles for PCB components

D 14Heatsink-cooling aggregatesA 89Heatsinks for PCB

A 2 – 8Technical introductionA 89 – 112Profiles for PCB mounting

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

65

33

4

24

50 100 150

1

2

3

4

5

art. no.

SK 18 ...

... (optional)

TO 3; CB

...

37.5 50 75 1000 mm

please indicate:

Rth [K/W]

200 [mm]

65

4

29

27

50 100 150

1

2

3

4

5

art. no.

SK 63 ...

... (optional)

TO 3; CB

...

37.5 50 75 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

3,7

29

5

65

28,5

25

1,7

50 100 150

1

2

3

4

5

art. no.

SK 05 ... with slots for cover plates or PCBs

... (optional)

TO 3; CB

...

50 75 1000 mm

please indicate:

Rth [K/W]

200 [mm]

27,1

4

33,8

71,1 50 100 150

1

2

3

4

5

art. no.

SK 402 ...

... (optional)

TO 3; CB

...

100 mm

please indicate:

Rth [K/W]

200 [mm]

37,8

4,5

23,5

72 50 100 150

1

2

3

4

5

art. no.

SK 97 ...

... (optional)

TO 3

...

37.5 50 75 100 1000 mm

please indicate:

A 62

E 26 – 27Screw mounted guide railsA 21Hole pattern

E 2 – 24Thermal conductive materialA 91Profiles for PCB components

D 14Heatsink-cooling aggregatesA 89Heatsinks for PCB

A 2 – 8Technical introductionA 89 – 112Profiles for PCB mounting

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

79

4

15

31,5

50 100 150

1

2

3

4

5

art. no.

SK 45 ...

... (optional)

TO 3; CB

...

37.5 50 75 100 1000 mm

please indicate:

94

35

5

14,5

Rth [K/W]

50 100 150

1

2

3

4

5

200 [mm]

art. no.

SK 19 ...

... (optional)

TO 3; CB

...

37.5 50 75 100 1000 mm

please indicate:

3,5

94,5

20

36

Rth [K/W]

50 100 150

1

2

3

4

5

200 [mm]

art. no.

SK 28 ...

... (optional)

TO 3; CB

...

37.5 50 75 1000 mm

please indicate:

Rth [K/W]

200 [mm]

33

95

25

4

50 100 150

1

2

3

4

5

art. no.

SK 401 ...

... (optional)

TO 3; CB

...

100 1000 mm

please indicate:

33

97

4

25

Rth [K/W]

24

50 100 150

1

2

3

4

5

200 [mm]

art. no.

SK 72 ...

... (optional)

TO 3; CB

...

37.5 50 75 100 1000 mm

please indicate:

A 63

E 26 – 27Screw mounted guide railsA 21Hole pattern

E 2 – 24Thermal conductive materialA 91Profiles for PCB components

D 14Heatsink-cooling aggregatesA 89Heatsinks for PCB

A 2 – 8Technical introductionA 89 – 112Profiles for PCB mounting

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

97

4

36

25

1,6

3

50 100 150

1

2

3

4

5

art. no.

SK 04 ... with slots for cover plates or PCBs

... (optional)

SSR 1; SSR 2; TO 3; CB

...

37.5 50 75 100 1000 mm

please indicate:

104

10

40

Rth [K/W]

38

50 100 150

1

2

3

4

5

200 [mm]

art. no.

SK 403 ...

...

1000 mm

please indicate:

Rth [K/W]

1

2

3

4

5

105

23

30,6

3,5

200 [mm]

50 100 150

art. no.

SK 73 ...

... (optional)

TO 3; CB

...

50 75 1000 mm

please indicate:

120

37

34

6

Rth [K/W]

50 100 150

2,5

2,0

1,5

1,0

0,5

200 [mm]

art. no.

SK 71 ...

... (optional)

TO 3

...

37.5 50 75 100 1000 mm

please indicate:

120

50

8

10

1,6

Rth [K/W]

200 [mm]

36

50 100 150

0,5

1,0

1,5

2,0

2,5

art. no.

SK 57 ... with slots for cover plates or PCBs

...

37.5 75 100 1000 mm

please indicate:

A 64

E 26 – 27Screw mounted guide railsA 21Hole pattern

E 2 – 24Thermal conductive materialA 91Profiles for PCB components

D 14Heatsink-cooling aggregatesA 89Heatsinks for PCB

A 2 – 8Technical introductionA 89 – 112Profiles for PCB mounting

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

125,65

3,85 5,85

1,4

32,6

4,7

35

2,35

145 50 100 150

0,5

1,0

1,5

2,0

2,5

art. no.

SK 197 ...

... (optional)

TO 3; CB

...

37.5 1000 mm

please indicate:

Rth [K/W]

200 [mm]

150

29

640

1,6

32 0,5

50 100 150

0,5

1,0

1,5

2,0

2,5

art. no.

SK 98 ... with slots for cover plates or PCBs

...

100 150 mm

please indicate:

Rth [K/W]

200 [mm]

15,4 52,9

10

160

40

50 100 150

0,6

0,8

1,0

1,2

1,4

art. no.

SK 404 ...

... (optional)

TO 3; CB

...

50 75 1000 mm

please indicate:

A 65

E 26 – 27Screw mounted guide railsA 21Hole pattern

E 2 – 24Thermal conductive materialA 91Profiles for PCB components

D 14Heatsink-cooling aggregatesA 89Heatsinks for PCB

A 2 – 8Technical introductionA 89 – 112Profiles for PCB mounting

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

69,4

37

4

88

26

50 100 150

1

2

3

4

5

art. no.

SK 36 ... mounting parts IS 1, IS 2, IS 3 ➔E 49

... (optional)

TO 3; CB

...

50 75 1000 mm

please indicate:

Rth [K/W]

200 [mm]

115

93

36

4

26

50 100 150

1

2

3

4

5

art. no.

SK 01 ... mounting parts IS 1, IS 2, IS 3 ➔E 49

... (optional)

TO 3; CB

...

37.5 50 75 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

92

10

1,6

4

36

115

2

63

38,5

50 100 150

0,5

1,0

1,5

2,0

2,5

art. no.

SK 02 ... with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 ➔E 49

... (optional)

TO 3; CB

...

37.5 50 75 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

120

36

3

1,6

4

100

2

32

50 100 150

1

2

3

4

5

art. no.

SK 03 ... with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 ➔E 49

... (optional)

TO 3; CB

...

50 75 100 1000 mm

please indicate:

A 66

A 21Order exampleE 2 – 5Thermal conductive material

E 26 – 27Guide rails for PCBsE 44 – 48Mounting material for semiconduct.

D 14Heatsink-cooling aggregatesE 49 – 50Mounting parts for heatsinks

A 2 – 8Technical introductionE 39Distance sleeves for PCB´s in HP grid

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

100

4,8

121,3

34

31,4

5

1,7

Rth [K/W]

50 100 150

1

2

3

4

5

200 [mm]

art. no.

SK 39 ... with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 ➔E 49

... (optional)

TO 3; CB

...

75 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

100,6

4,8

33,8

122

67

10

1,6

50 100 150

0,5

1,0

1,5

2,0

2,5

art. no.

SK 30 ... with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 ➔E 49

... (optional)

TO 3; CB

...

75 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

104

5

36

125

65

10

1,6

50 100 150

0,5

1,0

1,5

2,0

2,5

art. no.

SK 34 ... with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 ➔E 49

... (optional)

TO 3; CB

...

50 75 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

10

1,7

106

5

34

125

66

50 100 150

0,5

1,0

1,5

2,0

2,5

art. no.

SK 14 ... with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 ➔E 49

... (optional)

TO 3; CB

...

50 75 100 mm

please indicate:

A 67

A 21Order exampleE 2 – 5Thermal conductive material

E 26 – 27Guide rails for PCBsE 44 – 48Mounting material for semiconduct.

D 14Heatsink-cooling aggregatesE 49 – 50Mounting parts for heatsinks

A 2 – 8Technical introductionE 39Distance sleeves for PCB´s in HP grid

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

34

4

89

4,5

7

28

2,5

1,6

100 50 100 150

1

2

3

4

5

200 [mm]

art. no.

SK 20 ... with slots for cover plates or PCBs; mounting parts IS 5, IS 8 ➔E 49

... (optional)

TO 3; CB

...

37.5 75 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

50,5

5

17,5

106,4

4

5,5

8,4

38

50 100 150

1

2

3

4

5

art. no.

SK 184 ...

...

100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

3,5

119

132

34

5

1,8

5,8

50

5

50 100 150

0,5

1,0

1,5

2,0

2,5

art. no.

SK 148 ... with slots for cover plates or PCBs

... (optional)

TO 3; CB

...

37.5 100 1000 mm

please indicate:

Rth [K/W]

142

35,5

4

25

50 100 150

0,5

1,0

1,5

2,0

2,5

200 [mm]

art. no.

SK 84 ...

... (optional)

TO 3

...

50 150 1000 mm

please indicate:

A 68

A 21Order exampleE 26 – 30Guide rails for PCBs

A 18 – 20Assignment tableE 44 – 48Mounting material for semiconduct.

A 21Hole patternE 49 – 50Mounting parts for heatsinks

A 2 – 8Technical introductionD 14Heatsink-cooling aggregates

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

145

164

6,5

34

40

50 100 150

0,5

1,0

1,5

2,0

2,5

art. no.

SK 67 ... mounting part IS 6 ➔E 49

... (optional)

TO 3

...

37.5 50 100 1000 mm

please indicate:

A 69

A 21Order exampleE 26 – 30Guide rails for PCBs

A 18 – 20Assignment tableE 44 – 48Mounting material for semiconduct.

A 21Hole patternE 49 – 50Mounting parts for heatsinks

A 2 – 8Technical introductionD 14Heatsink-cooling aggregates

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

37,5

18,75

14

46

37,5

37,5

18,75

14

75

1 x M 3

2 x M 3

10

4

5

3,5

22,5

54

38

12

37,5 mm 5,5 K/W 75 mm 3,6 K/W

art. no.

SK 65 ... for cases SOT 32

... (optional)

1xM3; 2xM3

...

37.5 75 mm

please indicate:

18,75

37,5

75

13

62

18,75

13

37,5

37,5

2 x M 3

1 x M 3

12

5

17

54

3,5

25

70

4

37,5 mm 4,1 K/W 75 mm 2,7 K/W

art. no.

SK 64 ... for cases TO 220, TOP 3

... (optional)

1xM3; 2xM3

...

37.5 75 mm

please indicate:

Rth [K/W]

200 [mm]

78

3

26,5

4,3

9

77

47

25,1

4

50 100 150

1,0

1,5

2,0

2,5

3,0

art. no.

SK 419 ...

...

1000 mm

please indicate:

1,6

3

120

4

21

36

50 100 150

1

2

3

4

5

Rth [K/W]

200 [mm]

art. no.

SK 21 ... with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 ➔E 49

... (optional)

TO 3; CB

...

37.5 1000 mm

please indicate:

A 70

E 45Insulting clamping partsA 125Mounting for TO 3 angle

E 19Mica wafersA 21Order example

E 52Insulator sleevesA 137 – 138Special heatsink design

A 2 – 8Technical introductionA 113 – 114Heatsinks for DC/DC converter

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

11,7

34

3

1,5

100

120,5

50 100 150

1

2

3

4

5

Rth [K/W]

200 [mm]

art. no.

SK 69 ... mounting parts IS 1, IS 2, IS 3 ➔E 49

... (optional)

TO 3; CB

...

50 75 100 1000 mm

please indicate:

31,5

5,5

22

127

Rth [K/W]

200 [mm]

50 100 150

1

2

3

4

5

art. no.

SK 74 ...

... (optional)

TO 3; CB

...

37.5 100 1000 mm

please indicate:

140

33

38

8

Rth [K/W]

50 100 150 200 [mm]

0,5

1,0

1,5

2,0

2,5

art. no.

SK 124 ...

... (optional)

TO 3

...

50 100 150 1000 mm

please indicate:

Rth [K/W]

200 [mm]

185

165

60

2,8

4,2 7,6

32,5 32,5

1,5

5,1

25

50 100 150

0,5

1,0

1,5

2,0

2,5

85

art. no.

SK 195 ...

... (optional)

TO 3; CB

...

75 100 mm

please indicate:

A 71

E 45Insulting clamping partsA 125Mounting for TO 3 angle

E 19Mica wafersA 21Order example

E 52Insulator sleevesA 137 – 138Special heatsink design

A 2 – 8Technical introductionA 113 – 114Heatsinks for DC/DC converter

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

29

3

12

50

50 100 150

2

4

6

8

10

Rth [K/W]

200 [mm]

art. no.

SK 31 ...

... (optional)

TO 3; CB

...

37.5 50 75 1000 mm

please indicate:

36

3,2

70

15

50 100 150

1

2

3

4

5

Rth [K/W]

200 [mm]

art. no.

SK 07 ...

... (optional)

TO 3; CB

...

37.5 50 75 1000 mm

please indicate:

34

4,7

25,4

104,8

50 100 150

1

2

3

4

5

Rth [K/W]

200 [mm]

art. no.

SK 16 ... mountingpart IS 3 ➔E 49

... (optional)

TO 3; CB

...

75 1000 mm

please indicate:

3,0

2,5

2,0

1,5

1,0

8

50 100 150

39

105

39

Rth [K/W]

200 [mm]

art. no.

SK 500 ...

...

37.5 50 75 100 1000 mm

please indicate:

A 72

A 21Hole patternA 137 – 138Special heatsink design

A 84 – 88Profiles for lock-in fixing springA 125Mounting for TO 3 angle

A 22 – 83Extruded heatsinksA 140Special profiles

A 2 – 8Technical introductionA 129Fin coolers

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

2,7

4,5

30

4

34,4

65

2

18

4

5

6

7

8

50 150

100

Rth

[K/W]

200 [mm]

art. no.

SK 185 ... extruded heatsink for PCB mounting ➔A 104

... (optional)

TO 3; CB

...

37.5 50 1000 mm

please indicate:

30

4

65

20

50 100 150

1

2

3

4

5

Rth

[K/W]

200 [mm]

art. no.

SK 48 ...

... (optional)

SSR 3; TO 3; CB

...

37.5 50 75 100 1000 mm

please indicate:

1

2

3

4

5

30

4,5

25

88

3,5

1,7

Rth

[K/W]

200 [mm]

50 100 150

art. no.

SK 79 ... with slots for cover plates or PCBs

... (optional)

TO 3; CB

...

37.5 50 75 100 1000 mm

please indicate:

30

1,6

15

5

35

88

1

2

3

4

5

Rth

[K/W]

200 [mm]

50 100 150

art. no.

SK 08 ... with slots for cover plates or PCBs

... (optional)

TO 3; CB

...

37.5 50 75 100 1000 mm

please indicate:

100

50

30

30 1,6

6

Rth

[K/W]

200 [mm]

50 100 150

0,5

1,0

1,5

2,0

2,5

art. no.

SK 88 ... with slots for cover plates or PCBs

... (optional)

TO 3

...

37.5 50 75 100 1000 mm

please indicate:

A 73

A 115 – 117Retaining springs for transistorsA 18 – 20Assignment table

E 10Thermal. conductive silicone foam foilA 135 – 136Standard aluminium profiles

E 7Thermal conductive foilA 22 – 83Extruded heatsinks

A 2 – 8Technical introductionD 26 – 28High capacity cooling aggregat.

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

50 100 150

1

2

3

4

5

Rth [K/W]

200 [mm]

105

28

4,6

19

28 26,5

art. no.

SK 52 ...

... (optional)

2xTO 3; 2xCB

...

37.5 50 75 100 1000 mm

please indicate:

25

1,5

3,7 5,7

4

32,5 32,5

2,2

34

135

125 50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

art. no.

SK 60 ...

... (optional)

2xTO 3; 2xCB

...

50 75 100 1000 mm

please indicate:

135

4

2,5

10

29 34

25

30

29

10

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

art. no.

SK 147 ...

... (optional)

2xTO 3; 2xCB

...

50 150 1000 mm

please indicate:

37 32 37

4

179

20

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

art. no.

SK 80 ...

... (optional)

2xTO 3; 2xCB

...

75 100 1000 mm

please indicate:

180

38 68 38

5

48

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

art. no.

SK 53 ...

... (optional)

2xTO 3; 2xCB

...

50 75 100 150 1000 mm

please indicate:

A 74

A 10Heatsink as visual & decor-partsA 21Hole pattern

A 18 – 20Assignment tableA 135 – 136Standard aluminium profiles

E 16Kapton insulator washersA 22 – 83Extruded heatsinks

A 2 – 8Technical introductionE 2 – 5Thermal conductive material

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

29 29 29 29

28 28 28

232

4,5

38

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

art. no.

SK 86 ...

...

100 150 1000 mm

please indicate:

440

110

30

6

28

110 110

50 100 150

0,2

0,4

0,6

0,8

1,0

Rth [K/W]

200 [mm]

art. no.

SK 82 ...

...

100 1000 mm

please indicate:

A 75

A 10Heatsink as visual & decor-partsA 21Hole pattern

A 18 – 20Assignment tableA 135 – 136Standard aluminium profiles

E 16Kapton insulator washersA 22 – 83Extruded heatsinks

A 2 – 8Technical introductionE 2 – 5Thermal conductive material

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

3

5

45

8

200 [mm]50 100 150

12

10

2

4

6

8

26

17 9

art. no.

SK 596 ...

...

37.5 50 75 100 1000 mm

please indicate:

3

30

8

11,4

25

29

45

2

Rth [K/W]

200 [mm]

5

1

2

3

4

6

50 100 150

art. no.

SK 544 ...

...

50 75 100 1000 mm

please indicate:

38

8

54

6

50 100 150

1

2

3

4

5

26

20

Rth [K/W]

200 [mm]

art. no.

SK 32 ...

...

37.5 50 75 100 1000 mm

please indicate:

40

20

10,5 6,5

63

59

4,5 6,5

30,5

1

2

3

50 100 150

Rth [K/W]

200 [mm]

art. no.

SK 187 ...

... (optional)

SSR 3

...

75 1000 mm

please indicate:

A 76

A 11 – 12heatsinks for Solid State RelaisA 21Hole pattern

A 18 – 20Assignment tableA 135 – 136Standard aluminium profiles

E 16Kapton insulator washersA 22 – 83Extruded heatsinks

A 2 – 8Technical introductionE 2 – 5Thermal conductive material

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

72

5

10

37

8,5 13,5

22

94

Rth [K/W]

50 100 150 200 [mm]

0,5

1,0

1,5

2,0

2,5

art. no.

SK 140 ...

...

1000 mm

please indicate:

72

94,3

4

1,2

1,0

0,8

0,6

0,4

0,2

10050 150

5,3

Rth [K/W]

200 [mm]

art. no.

SK 556 ...

...

75 100 150 1000 mm

please indicate:

1,2

1,0

0,8

0,6

0,4

0,2

10050 150

Rth [K/W]

200 [mm]

62

48

14

30

72

124

35

art. no.

SK 15 ...

...

75 1000 mm

please indicate:

1

80

14,5

6

78,6

58,5 50 100 150

0,6

0,8

1,0

1,2

1,4

Rth [K/W]

200 [mm]

art. no.

SK 89 ... with slots for cover plates or PCBs

... (optional)

SSR 1; SSR 2

...

100 150 1000 mm

please indicate:

A 77

A 11 – 12heatsinks for Solid State RelaisA 21Hole pattern

A 18 – 20Assignment tableA 135 – 136Standard aluminium profiles

E 16Kapton insulator washersA 22 – 83Extruded heatsinks

A 2 – 8Technical introductionE 2 – 5Thermal conductive material

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

71

80

160

8

8

950 100 150

0,4

0,6

0,8

1,0

1,2

Rth [K/W]

200 [mm]

art. no.

SK 163 ...

...

100 150 1000 mm

please indicate:

82

25

8

16

78

58

50 100 150

1,0

1,2

1,4

1,6

1,8

Rth [K/W]

200 [mm]

art. no.

SK 176 ...

... (optional)

SSR 2

...

75 100 150 1000 mm

please indicate:

A 78

A 11 – 12heatsinks for Solid State RelaisA 21Hole pattern

A 18 – 20Assignment tableA 135 – 136Standard aluminium profiles

E 16Kapton insulator washersA 22 – 83Extruded heatsinks

A 2 – 8Technical introductionE 2 – 5Thermal conductive material

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

52

52

2

Rth [K/W]

50 100 150 200 [mm]

1

2

3

4

5

12,55

+0

art. no.

SK 11 ... threads, through holes and fixing according to your demand; mounting parts IS 1, IS 2, IS 3 ➔E 49

...

1000 mm

please indicate:

30

11

11

3,5

6

6

6

70

10 87,9

Rth [K/W]

50 100 150 200 [mm]

0,5

1,0

1,5

2,0

2,5

art. no.

SK 83 ...

...

100 1000 mm

please indicate:

50

6,4

40

,

3

107

107 50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

art. no.

SK 06 ... mounting part IS 4 ➔E 49

...

75 1000 mm

please indicate:

119

105

119

105

55

7,8

1,5

3,6

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

art. no.

SK 23 ... with slots for cover plates or PCBs; equipped with fan and endplates = LA 4 ➔D 14

...

75 mm

please indicate:

A 79

A 85 – 88heatsinks for lock-in retaining springA 91Profiles for PCB components

D 14Heatsink-cooling aggregatesA 57 – 58High capacity heatsinks

A 137 – 138Special heatsink designA 125Mounting for TO 3 angle

A 2 – 8Technical introductionA 89 – 112Heatsinks for PCB

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

120

120,5

52,5

76,9

70,5

22 8,5

50

13

8

12,4

12

15

8,3

52,5

Rth [K/W]

50 100 150

0,2

0,4

0,6

0,8

1,0

200 [mm]

art. no.

SK 110 ...

...

150 200 1000 mm

please indicate:

80

5,3

4,2

135

4,2

5,3

15,2

13

101,5

110

125

96

101,5

115

96

6

2,2

2,2

Rth [K/W]

50 100 150

0,2

0,4

0,6

0,8

1,0

200 [mm]

art. no.

SK 109 ... with slots for cover plates or PCBs

...

100 150 200 1000 mm

please indicate:

126

80

8,3 5,2

2,5

4,7

6,5

4

4,2

7,2

13

15,2

101,5

110

8,5 4,5

5,2

8,3

14

96

101,5

115

136

2,2

20

0,4

0,6

0,8

1,0

1,2

50 100 150

Rth [K/W]

200 [mm]

art. no.

SK 108 ... with slots for cover plates or PCBs

...

100 1000 mm

please indicate:

A 80

A 85 – 88heatsinks for lock-in retaining springA 91Profiles for PCB components

D 14Heatsink-cooling aggregatesA 57 – 58High capacity heatsinks

A 137 – 138Special heatsink designA 125Mounting for TO 3 angle

A 2 – 8Technical introductionA 89 – 112Heatsinks for PCB

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

58

81

4

38

40

50 100 150

1,2

1,6

2,0

2,4

2,8

Rth [K/W]

200 [mm]

art. no.

SK 111 ...

... (optional)

SSR 1; SSR 3

...

75 100 1000 mm

please indicate:

20,5

7

2

12

76

96

80

47,65,3

4,3

5,3 5

41

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

art. no.

SK 172 ...

... (optional)

SSR 1; SSR 4

...

50 75 100 150 1000 mm

please indicate:

145

75

120

5,3

8,4

8

7

7

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

art. no.

SK 194 ...

... (optional)

SSR 2

...

75 1000 mm

please indicate:

200

215

5,3

10,3 6,5

20

77

8,5

17

8,3

50 100 150

0,2

0,4

0,6

0,8

1,0

Rth [K/W]

200 [mm]

art. no.

SK 435 ...

...

150 200 1000 mm

please indicate:

A 81

A 22 – 83Extruded heatsinksA 57 – 58High capacity heatsinks

A 125Die-cast heatsinksA 113 – 114Heatsinks for DC/DC converter

A 9High decorative surfacesA 85 – 88heatsinks for lock-in retaining spring

A 2 – 8Technical introductionA 13 – 17Heatsink profile-overview

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Ø 4,4

5,1

41

87

21,5

47,6

16,65

4,4

1,8

1,85

2,2

4,4 7,3

5,1

7,3

7,3

4,4

76,2

50 100 150

0,8

1,6

2,4

3,2

4,0

Rth [K/W]

200 [mm]

art. no.

SK 432 ... with slots for cover plates or PCBs

...

100 1000 mm

please indicate:

6,5

12,5

12,5

63,5

9,6

108

127

27

46,8

19

6,5

6,5

6,5

Rth [K/W]

50 100 150

0,6

0,8

1,0

1,2

1,4

200 [mm]

art. no.

SK 40 ...

...

100 1000 mm

please indicate:

103

80

2,4

91

86,4

28

72,5

130

143

91

2

1,5

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

art. no.

SK 61 ... with slots for cover plates or PCBs; cooling case ➔M 29

...

75 100 150 1000 mm

please indicate:

102

122

240

13,5

8,5

25

108

12

13,5 8,5

48

175

13,5

8,5

50 100 150

0,2

0,4

0,6

0,8

1,0

Rth [K/W]

200 [mm]

art. no.

SK 144 ...

...

1000 mm

please indicate:

A 82

A 22 – 83Extruded heatsinksA 57 – 58High capacity heatsinks

A 125Die-cast heatsinksA 113 – 114Heatsinks for DC/DC converter

A 9High decorative surfacesA 85 – 88heatsinks for lock-in retaining spring

A 2 – 8Technical introductionA 13 – 17Heatsink profile-overview

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

50 100 150

28

36

40

26

34

38

32

30

M 3

6

3,5

36,5

200 [mm]

art. no.

SK 494 ...

...

25 37.5 50 75 100 1000 mm

please indicate:

Rth [K/W]

19

1,6

21,2

10,7

2,5

50 100 150

10

15

20

25

30

200 [mm]

art. no.

SK 153 ...

...

50 mm

please indicate:

71

35

4

41

10

20

Rth [K/W]

50 100 150

1

2

3

4

5

200 [mm]

art. no.

SK 55 ...

... (optional)

TO 3; CB

...

37.5 1000 mm

please indicate:

50 100 150

1,5

2,0

2,5

3,0

3,5

Rth [K/W]

22

7

7

12

6

9,5 80

4

7

39,9

69,8

10

200 [mm]

art. no.

SK 175 ...

...

50 1000 mm

please indicate:

A 83

A 22 – 83Extruded heatsinksA 57 – 58High capacity heatsinks

A 125Die-cast heatsinksA 113 – 114Heatsinks for DC/DC converter

A 9High decorative surfacesA 85 – 88heatsinks for lock-in retaining spring

A 2 – 8Technical introductionA 13 – 17Heatsink profile-overview

Standard extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

50

6

25

30,5

M 3

2,5

200 [mm]

Rth

[K/W]

50 100 150

2

4

6

8

10

art. no.

SK 575 ...

...

25 37.5 50 75 84 100 1000 mm

please indicate:

10,3

20

8

14,5

50 100 150

10

20

30

40

Rth

[K/W]

200 [mm]

art. no.

SK 512 ...

...

25 50 100 1000 mm

please indicate:

M3

28

10,3

22,8

8

Rth

[K/W]

50 100 150

2

6

10

14

12

8

4

200 [mm]

art. no.

SK 480 ...

...

25 37.5 50 75 84 100 1000 mm

please indicate:

50 100 150

2

4

6

8

10

Rth

[K/W]

200 [mm]

M3

M3

50

31,8

21,7

11

art. no.

SK 490 ...

...

37.5 50 75 84 100 1000 mm

please indicate:

16,8

26

M3

20

20

12 50 100 150

4

6

8

10

12

14

200 [mm]

Rth

[K/W]

art. no.

SK 492 ...

...

25 37.5 50 75 84 100 1000 mm

please indicate:

please note: profile threads ➔A 5

A 84

A 89Heatsinks for PCBE 49 – 50Mounting parts for heatsinks

A 91Profiles for PCB componentsE 51Insulating caps

A 93Heatsinks with threaded railE 46Mounting pads

A 2 – 8Technical introductionA 119 – 121Lock-in retaining spring for transistors

Extruded heatsinks for lock-in retaining spring

A

B

C

D

E

F

G

H

I

K

L

M

N

200 [mm]

Rth

[K/W]

M3

12

45

29,4

50 100 150

2

4

6

8

10

27,4

8

art. no.

SK 489 ...

...

25 37.5 50 75 84 100 1000 mm

please indicate:

7

M 3

8

30

25

12

Rth [K/W]

200 [mm]

50 100 150

1

2

3

4

7

5

6

8

3,5

19,9

6

art. no.

SK 573 ...

...

25 37.5 50 75 84 100 1000 mm

please indicate:

6

M 3

45

19

Rth [K/W]

200 [mm]

50 100 150

1

2

3

4

7

5

6

8

19,25

art. no.

SK 576 ...

...

25 37.5 50 75 84 100 1000 mm

please indicate:

50 100 150

1

2

3

4

7

5

6

Rth [K/W]

200 [mm]

45

30

M3

8

25,6

817

art. no.

SK 481 ...

...

25 37.5 50 75 84 100 1000 mm

please indicate:

please note: profile threads ➔A 5

A 85

A 89Heatsinks for PCBE 49 – 50Mounting parts for heatsinks

A 91Profiles for PCB componentsE 51Insulating caps

A 93Heatsinks with threaded railE 46Mounting pads

A 2 – 8Technical introductionA 119 – 121Lock-in retaining spring for transistors

Extruded heatsinks for lock-in retaining spring

A

B

C

D

E

F

G

H

I

K

L

M

N

8

3,4

2

M3

8

Rth [K/W]

200 [mm]

50 100 150

1

2

3

4

5

6

25,6

30

52

17

art. no.

SK 514 ...

...

25 37.5 50 75 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

50 100 150

1

2

3

4

7

5

6

M3

32,3

28

722

14

3,5

8

8

19,9

art. no.

SK 574 ...

...

25 37.5 50 75 84 100 1000 mm

please indicate:

50 100 150

1

2

3

4

7

5

6

Rth [K/W]

200 [mm]

66,5

33

8

M3

912

M3

31

art. no.

SK 589 ...

...

25 37.5 50 75 84 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

50 100 150

1

2

3

4

7

5

6

M3

10,3

35

825

12,5

22,8

art. no.

SK 482 ...

...

25 37.5 50 75 84 100 1000 mm

please indicate:

please note: profile threads ➔A 5

A 86

A 89Heatsinks for PCBE 49 – 50Mounting parts for heatsinks

A 91Profiles for PCB componentsE 51Insulating caps

A 93Heatsinks with threaded railE 46Mounting pads

A 2 – 8Technical introductionA 119 – 121Lock-in retaining spring for transistors

Extruded heatsinks for lock-in retaining spring

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

M3

4

M3

33

50 100 150

1

2

3

4

7

5

6

36,75

43,1

35,6

21,2

21,2

47,8

art. no.

SK 495 ...

...

25 37.5 50 75 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

33

M3

3,5

50 100 150

1

2

3

4

7

5

6

50,7

46

26,1

26,1

35,6

art. no.

SK 499 ...

...

25 37.5 50 75 100 1000 mm

please indicate:

28

M3

22,5

52,3

842

12,5

Rth [K/W]

50 100 150

2

4

6

8

10

200 [mm]

art. no.

SK 487 ...

...

25 37.5 50 75 84 100 1000 mm

please indicate:

M3

47

57

28

14

8

22,5

Rth [K/W]

200 [mm]

50 100 150

1

2

3

4

7

5

6

art. no.

SK 483 ...

...

25 37.5 50 75 84 100 1000 mm

please indicate:

Rth [K/W]

200 [mm]

50 100 150

1

2

3

4

7

5

6

50

60

50

75,5

26,4

57,5

art. no.

SK 593 ...

...

25 37.5 50 75 84 100 1000 mm

please indicate:

please note: profile threads ➔A 5

A 87

A 89Heatsinks for PCBE 49 – 50Mounting parts for heatsinks

A 91Profiles for PCB componentsE 51Insulating caps

A 93Heatsinks with threaded railE 46Mounting pads

A 2 – 8Technical introductionA 119 – 121Lock-in retaining spring for transistors

Extruded heatsinks for lock-in retaining spring

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

200 [mm]

50 100 150

1

2

3

4

7

5

6

50

65,8

50

75,5

57,5

29,5

50

art. no.

SK 617 ...

...

25 37.5 50 75 84 94 100 1000 mm

please indicate:

please note: profile threads ➔A 5

Screw-in solder pin ELS 3

– screw in solder pin made of brass

– easy mounting

– secure hold

– surface coating suitable for soldering

– suitable for all heatsinks with M3 profile thread

– position in the threaded channel as required

– specific designs upon customer´s request

M3

1

Ø 2,3

0,8

0,8

12,5

7,5

4

Ø 6

art. no.

ELS 3

A 88

A 89Heatsinks for PCBE 49 – 50Mounting parts for heatsinks

A 91Profiles for PCB componentsE 51Insulating caps

A 93Heatsinks with threaded railE 46Mounting pads

A 2 – 8Technical introductionA 119 – 121Lock-in retaining spring for transistors

Extruded heatsinks for lock-in retaining spring

A

B

C

D

E

F

G

H

I

K

L

M

N

Heatsinks for printed circuit boards

– matching cylindrial screws according to DIN 84 with zinc coated surface

– M 3 thread diameter: 2.90 ... 2.94 mm (art. no.: SZ M 3 x 8)

– screw-in solder pin M 3 (art. no.: ELS 3)

36,75

31

17

4

35,6

46

22

33

M 3

50 100 150

2

3

4

5

6

Rth [K/W]

200 [mm]

M 3

M 3

M 3

M 3

M 2,5

art. no.

SK 68 ...

46

34

33

31

28

35,6

8

M 3

50 100 150

2

3

4

5

6

Rth [K/W]

200 [mm]

art. no.

SK 112 ...

...

37.5 50 75 94 100 1000 mm

please indicate:

please note: profile threads ➔A 5

A 89

E 34Miniature distance sleevesA 119 – 121Lock-in retaining spring for transistors

E 23 – 24Thermal conductive glueA 91Profiles for PCB components

E 21 – 22Thermal conductive pasteE 41Vibration dampers

A 2 – 8Technical introductionA 93Heatsinks with threaded rail

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

Heatsinks for printed circuit boards

– the heatsinks SK 414, SK 105, SK 44 and SK 415 are especially suitable for printed circuit board heatsinks for 19'' plug in units

99

4

15

Rth [K/W]

200 [mm]

50 100 150

1

2

3

4

5

art. no.

SK 414 ...

...

100 233.4 1000 mm

please indicate:

4

10

50 100 150

1

2

3

4

5

Rth [K/W]

200 [mm]

159

art. no.

SK 105 ...

...

37.5 50 75 100 150 200 233.4 1000 mm

please indicate:

159

4

15

Rth [K/W]

200 [mm]

50 100 150

1

2

3

4

5

art. no.

SK 44 ...

...

50 75 100 150 200 233.4 1000 mm

please indicate:

219

4

15

Rth [K/W]

200 [mm]

50 100 150

1

2

3

4

5

art. no.

SK 415 ...

...

37.5 100 150 1000 mm

please indicate:

A 90

E 2 – 23Thermal conductive materialA 119 – 121Lock-in retaining spring for transistors

A 84 – 88Profiles for lock-in fixing springA 13 – 17Heatsink profile overview

A 115 – 117Retaining springs for transistorsA 89Heatsinks for PCB

A 2 – 8Technical introductionA 93Heatsinks with threaded rail

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

Heatsinks for printed circuit boards

– for use on eurocards

50 100 150 200 [mm]

2

4

6

8

10

Rth [K/W]

art. no.

SK 125 ... screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3

Rth [K/W]

50 100 150 200 [mm]

2

4

6

8

10

10

M 3

28

47

455

14

M 3

art. no.

SK 96 ... screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3

...

50 84 94 1000 mm

please indicate:

50 100 150 200 [mm]

2

4

6

8

10

Rth [K/W]

art. no.

SK 138 ...

50 100 150 200 [mm]

1,4

2,8

4,2

5,6

7,0

Rth [K/W]

art. no.

SK 451 ... screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3

Rth [K/W]

50 100 150 200 [mm]

2

4

6

8

10

art. no.

SK 128 ... screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3

...

50 84 94 1000 mm

please indicate:

please note: profile pressed threads ➔A 5

A 91

E 2 – 23Thermal conductive materialA 119 – 121Lock-in retaining spring for transistors

A 84 – 88Profiles for lock-in fixing springA 13 – 17Heatsink profile overview

A 115 – 117Retaining springs for transistorsA 89Heatsinks for PCB

A 2 – 8Technical introductionA 93Heatsinks with threaded rail

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

50 100 150 200 [mm]

2

4

6

8

10

Rth [K/W]

30

14

6,5

31

23

M 3

M 3

48

8

art. no.

SK 609 ... screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3

50 100 150 200 [mm]

2

4

6

8

10

Rth [K/W]

55

14

6,5

31

23

M 3

M 3

48

8

art. no.

SK 610 ... screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3

50 100 150 200 [mm]

1,4

2,8

4,2

5,6

7,0

Rth [K/W]

50

31

23

M 3

12,5

6,5

M 3

48

8

art. no.

SK 611 ... screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3

...

50 84 94 1000 mm

please indicate:

please note: profile pressed threads ➔A 5

A 92

E 2 – 23Thermal conductive materialA 119 – 121Lock-in retaining spring for transistors

A 84 – 88Profiles for lock-in fixing springA 13 – 17Heatsink profile overview

A 115 – 117Retaining springs for transistorsA 89Heatsinks for PCB

A 2 – 8Technical introductionA 93Heatsinks with threaded rail

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

Heatsink for PCB with threaded rail

– transistor mounting onto the heatsink using a slide-in rail with M 3 thread

– easy positioning using a grid 6.35mm

– other rail grids upon request

– suitable for TO 220, TO 218, TO 247 and similar

– suitable screws M 3 (art. no.: SZ M 3 x 8)

– screw-in solder pin M 3 (art. no.: ELS 3)

– specific versions upon customer´s request

55

28

14

847

M3

18

6

2M3 6,35

-1

versionRth [K/W][mm]art. no.

with threaded railTO 2205.050SK 517 50 GS

with threaded railTO 2203.975SK 517 75 GS

with threaded railTO 2203.684SK 517 84 GS

without threaded rail—5.050SK 517 50

without threaded rail—3.975SK 517 75

without threaded rail—3.684SK 517 84

6

2M3 6,35

-1

45

30

8

817

M3

18

versionRth [K/W][mm]art. no.

with threaded railTO 2204.350SK 518 50 GS

with threaded railTO 2203.375SK 518 75 GS

with threaded railTO 2203.084SK 518 84 GS

without threaded rail—4.350SK 518 50

without threaded rail—3.375SK 518 75

without threaded rail—3.084SK 518 84

please note: profile threads ➔A 5

black anodisedsurface:

A 93

E 19Mica wafersA 84 – 88Profiles for lock-in fixing spring

E 16Kapton insulator washersA 18 – 20Assignment table

E 21Thermal conductive pasteE 2 – 5Thermal conductive material

A 2 – 8Technical introductionA 119 – 121Lock-in retaining spring for transistors

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

Attachable heatsinks for transistors

– compact heatsink in transistor dimensions

– for horizontal and vertical transistors

– can be screwed or glued

– specific versions upon customer´s request

10

3,1

Ø 2,8

SK 515 10 S TO 220

SK 515 23,5 S 2 x TO 220 SK 515 37 S 3 x TO 220

Ø 2,8

3,1

5

23,5

13,5

10,7

3,2

8,4

15

3,1

37

13,5 13,5

Ø 2,8

5

versionRth [K/W][mm]art. no.

for screw fastening M2.5TO 22030.010.0SK 515 10 S TO 220

for screw fastening M2.52xTO 22027.523.5SK 515 23,5 S 2 x TO 220

for screw fastening M2.53xTO 22026.137.0SK 515 37 S 3 x TO 220

without screw fastening—30.010.0SK 515 10 TO 220

without screw fastening—27.523.5SK 515 23,5 TO 220

without screw fastening—26.137.0SK 515 37 TO 220

SK 516 33 S 2 x TO 218

4,6

15

Ø 3,5

SK 516 15 S TO 218

4,6

33

7,5

18

Ø 3,5

10

12,45

21

3,5

versionRth [K/W][mm]art. no.

for screw fastening M3TO 21828.415SK 516 15 S TO 218

for screw fastening M32xTO 21826.933SK 516 33 S 2 x TO 218

without screw fastening—28.415SK 516 15 TO 218

black anodisedsurface:

Attachable extruded heatsinks for transistors with thin bottom plate (0.5 mm)

10

3,1

Ø 2,8

SK 515 05 10 S

SK 515 05 23,5 S 2 SK 515 05 37 S 3

Ø 2,8

3,1

5

23,5

13,5

10,7

3,95

8,4

15

3,1

37

13,5 13,5

Ø 2,8

5

versionRth [K/W][mm]art. no.

for screw fastening M2.5TO 22030.010.0SK 515 05 10 S

for screw fastening M2.52xTO 22027.523.5SK 515 05 23,5 S 2

for screw fastening M2.53xTO 22026.137.0SK 515 05 37 S 3

without screw fastening—30.010.0SK 515 05 10

without screw fastening—27.523.5SK 515 05 23,5

without screw fastening—26.137.0SK 515 05 37

black anodisedsurface:

A 94

E 19Mica wafersA 84 – 88Profiles for lock-in fixing spring

E 16Kapton insulator washersA 18 – 20Assignment table

E 21Thermal conductive pasteE 2 – 5Thermal conductive material

A 2 – 8Technical introductionA 119 – 121Lock-in retaining spring for transistors

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

Attachable heatsinks for transistors

– extruded heatsink with intergrated spring locking function

– simple assembly by pushing the heatsink onto the transistor

– optimum heat transfer between component and heatsink

– solderable pin for PCB mounting

– specific versions upon customer´s request

5

25

32,5

15 2,3

30

25,4

= =

4,5

3,3

4

28

19,4

13,5

Ø 2,1

1

2,7

4

,

8

Ø 4

versionspring force [N]Rth [K/W][mm]for transistorart. no.

without solder pins5413.315TO 220SK 525 15

without solder pins1007.830TO 220SK 525 30

with 1 solder pin5413.315TO 220SK 525 15 ST

with 1 solder pin7010.720TO 220SK 525 20 ST

with 2 solder pins859.025TO 220SK 525 25 ST

with 2 solder pins1007.830TO 220SK 525 30 ST

4,5

4

,

5

35

22

1

15

3,3

Ø 2,1

2,7

4,8

Ø 4 2,3

30

25,4

versionspring force [N]Rth [K/W][mm]for transistorart. no.

with 2 solder pins1006.330TO 247SK 526 30 ST

black anodisedsurface:

A 95

E 19Mica wafersA 84 – 88Profiles for lock-in fixing spring

E 16Kapton insulator washersA 18 – 20Assignment table

E 21Thermal conductive pasteE 2 – 5Thermal conductive material

A 2 – 8Technical introductionC 10 – 16Attachable heatsinks

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

Extruded heatsinks for transistors

– compact PCB heatsink

– effective heat dissipation for single and double row transistor mounting

–profile SK 454 ➔A 24

–profile SK 452 ➔A 27

– specific versions upon customer´s request

21,45

3

19

10 2020 10

16

10

M 3 bei TO 220 M 3 bei SOT 32

2 x M 3

1 x M 3

20

Rth [K/W][mm]art. no.

SOT 32/ TO 22010.820SK 454 20 1 x M3 ...

SOT 32/ TO 2207.760SK 454 60 3 x M3 ...

SOT 32/ TO 22010.820SK 454 20 2 x M3 ...

SOT 32/ TO 2209.440SK 454 40 4 x M3 ...

SOT 32/ TO 2207.760SK 454 60 6 x M3 ...

TO 2209.440SK 454 40 2 x M3 TO 220

TO 2206.580SK 454 80 4 x M3 TO 220

TO 2205.9100SK 454 100 5 x M3 TO220

TO 2206.580SK 454 80 8 x M3 TO 220

TO 2205.9100SK 454 100 10xM3 TO220

...

SOT 32; TO 220

please indicate:

29

25

3,5

20202010

19

M 3

10

2 x M 3

1 x M 3

Rth [K/W][mm]art. no.

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P11.120SK 452 20 1 x M3

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P7.540SK 452 40 2 x M3

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P5.960SK 452 60 3 x M3

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P4.980SK 452 80 4 x M3

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P4.3100SK 452 100 5 x M3

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P11.120SK 452 20 2 x M3

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P7.540SK 452 40 4 x M3

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P5.960SK 452 60 6 x M3

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P4.980SK 452 80 8 x M3

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P4.3100SK 452 100 10 x M3

black anodisedsurface:

A 96

E 19Mica wafersA 84 – 88Profiles for lock-in fixing spring

E 16Kapton insulator washersA 18 – 20Assignment table

E 21Thermal conductive pasteE 2 – 5Thermal conductive material

A 2 – 8Technical introductionC 10 – 16Attachable heatsinks

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

– for semiconductor clip-mounting

– special lengths and transistor drillings upon request

–P= raised retaining stud, E= mounting method

25,4

12,7

1,5

16

34,9

3

Ø 2,3 max.

6 max.

Ø 6

1,5

M3

6,5

Ø 7

… STC … STIC … STCB

10,8

18,3

Ø 3,2

25,4

P

E

6,5

4,5 max.

Ø 2,3 max.

Rth [K/W][mm]art. no.

TO 2201425.4SK 104 25,4 ...

TO 2201138.1SK 104 38,1 ...

TO 220950.8SK 104 50,8 ...

TO 220863.5SK 104 63,5 ...

... mounting methodplease indicate:

with solder pin=STC

with solder pin and insulating washer=STIC

with threaded bolt M 3, brass=STCB

black anodisedsurface:

– for semiconductor screw-mounting

– special lengths and transistor drillings on request

–E= mounting method

25,4

18,3

25,4

18,3

3

Ø 2,3 max.

6 max.

Ø 6

1,5

M 3

6,5

Ø 7

… STS … STIS … STSB

4,5 max.

Ø 2,3 max.

10,8

6,5

25,4

10,8

6,5

13,5

25,4

Ø 3,2

Ø 3,2

13,5

E

25,4

12,7

1,5

16

34,9

Rth [K/W][mm]art. no.

SOT 32/ TO 220/ TO 3 P1425.4SK 104 25,4 ...

SOT 32/ TO 220/ TO 3 P1138.1SK 104 38,1 ...

SOT 32/ TO 220/ TO 3 P950.8SK 104 50,8 ...

SOT 32/ TO 220/ TO 3 P863.5SK 104 63,5 ...

... mounting methodplease indicate:

with solder pin=STS

with solder pins and insulating washer=STIS

with threaded bolt M 3, brass=STSB

black anodisedsurface:

A 97

E 19Mica wafersA 84 – 88Profiles for lock-in fixing spring

E 16Kapton insulator washersA 18 – 20Assignment table

E 21Thermal conductive pasteE 2 – 5Thermal conductive material

A 2 – 8Technical introductionC 10 – 16Attachable heatsinks

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

– horizontal for semiconductor screw-mounting

– special lengths and transistor drillings on request

10,8

9,5

13,5

18,3

25,4

10,8

9,5

Ø 3,2 Ø 3,2

13,5

18,3

25,4

25,4

12,7

1,5

15,9

34,9

Rth [K/W][mm]art. no.

SOT 32/ TO 220/ TO 3 P1425.4SK 104 25,4 LS

SOT 32/ TO 220/ TO 3 P1138.1SK 104 38,1 LS

SOT 32/ TO 220/ TO 3 P950.8SK 104 50,8 LS

black anodisedsurface:

A 98

E 19Mica wafersA 84 – 88Profiles for lock-in fixing spring

E 16Kapton insulator washersA 18 – 20Assignment table

E 21Thermal conductive pasteE 2 – 5Thermal conductive material

A 2 – 8Technical introductionC 10 – 16Attachable heatsinks

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

– for semiconductor clip-mounting

– special lengths and transistor drillings on request

–P= raised retaining stud, E= mounting method

… STC … STIC … STCB

17

35

25,4

25,4

2,5

18,3

10,8

25,4

Ø 3,2

E

6,5

P

3

Ø 2,3 max.

6 max.

Ø 6

1,5

M 3

6,5

Ø 7

4,5 max.

Ø 2,3 max.

Rth [K/W][mm]art. no.

TO 218/ TO 220/ TO 247/ TO 3 P11.025.4SK 600 25,4 ...

TO 218/ TO 220/ TO 247/ TO 3 P9.038.1SK 600 38,1 ...

TO 218/ TO 220/ TO 247/ TO 3 P7.350.8SK 600 50,8 ...

TO 218/ TO 220/ TO 247/ TO 3 P6.563.5SK 600 63,5 ...

... mounting methodplease indicate:

with solder pin=STC

with solder pin and insulating washer=STIC

with threaded bolt M 3, brass=STCB

black anodisedsurface:

– for semiconductor screw-mounting

– special lengths and transistor drillings on request

–E= mounting method

17

35

25,4

25,4

2,5

… STS … STIS … STSB

3

Ø 2,3 max.

6 max.

Ø 6

1,5

M 3

6,5

Ø 7

4,5 max.

Ø 2,3 max.

25,4

18,3

13,5

25,4

E

10,8

18,3

13,5

Ø 3,2

25,4

6,5

10,8

Ø 3,2

6,5

Rth [K/W][mm]art. no.

TO 218/ TO 220/ TO 247/ TO 3 P11.025.4SK 600 25,4 ...

TO 218/ TO 220/ TO 247/ TO 3 P9.038.1SK 600 38,1 ...

TO 218/ TO 220/ TO 247/ TO 3 P7.350.8SK 600 50,8 ...

TO 218/ TO 220/ TO 247/ TO 3 P6.563.5SK 600 63,5 ...

... mounting methodplease indicate:

with solder pin=STS

with solder pins and insulating washer=STIS

with threaded bolt M 3, brass=STSB

black anodisedsurface:

A 99

E 19Mica wafersA 84 – 88Profiles for lock-in fixing spring

E 16Kapton insulator washersA 18 – 20Assignment table

E 21Thermal conductive pasteE 2 – 5Thermal conductive material

A 2 – 8Technical introductionC 10 – 16Attachable heatsinks

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

– for semiconductor clip-mounting

– special lengths and transistor drillings on request

–P= raised retaining stud, E= mounting method

… STC … STIC … STCB

12,7

3

26,2

45

15

18,3

Ø2,8

35,5

P

E

16,5

14

9

6

25,8

3

Ø 2,3 max.

6 max.

Ø 6

1,5

M 3

6,5

Ø 7

4,5 max.

Ø 2,3 max.

Rth [K/W][mm]art. no.

TO 220/ TO 3 P8.225.4SK 409 25,4 ...

TO 220/ TO 3 P7.038.1SK 409 38,1 ...

TO 220/ TO 3 P6.250.8SK 409 50,8 ...

TO 220/ TO 3 P5.663.5SK 409 63,5 ...

... mounting methodplease indicate:

with solder pin=STC

with solder pin and insulating washer=STIC

with threaded bolt M 3, brass=STCB

black anodisedsurface:

– for semiconductor screw-mounting

– special lengths and transistor drillings on request

–E= mounting method

12,7

3

26,2

45

15

12,5

3,2

35,5 E

18,3

25,4

6

… STS … STIS

3

Ø 2,3 max.

6 max.

Ø 6

1,5

M 3

6,5

Ø 7

4,5 max.

Ø 2,3 max.

… STSB

Rth [K/W][mm]art. no.

TO 220/ TO 3 P8.225.4SK 409 25,4 ...

TO 220/ TO 3 P7.038.1SK 409 38,1 ...

TO 220/ TO 3 P6.250.8SK 409 50,8 ...

TO 220/ TO 3 P5.663.5SK 409 63,5 ...

... mounting methodplease indicate:

with solder pin=STS

with solder pins and insulating washer=STIS

with threaded bolt M 3, brass=STSB

black anodisedsurface:

A 100

E 19Mica wafersA 84 – 88Profiles for lock-in fixing spring

E 16Kapton insulator washersA 18 – 20Assignment table

E 21Thermal conductive pasteE 2 – 5Thermal conductive material

A 2 – 8Technical introductionC 10 – 16Attachable heatsinks

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

– for semiconductor clip-mounting

– special lengths and transistor drillings on request

–E= mounting method

Ø 5

Ø 5

30,3

10,5

20

E

3

20

30,3

50

30,8

11,7 11,7

12,22

8,5

0,72

3,1

25,33

3

Ø 2,3 max.

6 max.

Ø 6

1,5

M 3

6,5

Ø 7

4,5 max.

Ø 2,3 max.

… STC … STIC … STCB

Rth [K/W][mm]art. no.

TO 218/ TO 220/ TO 247/ TO 2487.925.0SK 459 25 ...

TO 218/ TO 220/ TO 247/ TO 2486.337.5SK 459 37,5 ...

TO 218/ TO 220/ TO 247/ TO 2485.650.0SK 459 50 ...

... mounting methodplease indicate:

with solder pin=STC

with solder pin and insulating washer=STIC

with threaded bolt M 3, brass=STCB

black anodisedsurface:

– for semiconductor screw-mounting

– special lengths and transistor drillings on request

–E= mounting method

M3

21,2

30,3 E

3

20

30,3

50

30,8

11,7 11,7

12,22

8,5

0,72

3,1

25,33

3

Ø 2,3 max.

6 max.

Ø 6

1,5

M 3

6,5

Ø 7

4,5 max.

Ø 2,3 max.

… STS … STIS … STSB

Rth [K/W][mm]art. no.

TO 218/ TO 220/ TO 247/ TO 2487.925.0SK 459 25 ...

TO 218/ TO 220/ TO 247/ TO 2486.337.5SK 459 37,5 ...

TO 218/ TO 220/ TO 247/ TO 2485.650.0SK 459 50 ...

... mounting methodplease indicate:

with solder pin=STS

with solder pins and insulating washer=STIS

with threaded bolt M 3, brass=STSB

black anodisedsurface:

A 101

E 19Mica wafersA 84 – 88Profiles for lock-in fixing spring

E 16Kapton insulator washersA 18 – 20Assignment table

E 21Thermal conductive pasteE 2 – 5Thermal conductive material

A 2 – 8Technical introductionC 10 – 16Attachable heatsinks

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

– for semiconductor screw-mounting

– special lengths and transistor drillings on request

–E= mounting method

… STS … STIS … STSB

18

30,3 E

M3

3

20

30,3

50

30,8

11,7 11,7

12,22

8,5

0,72

3,1

25,33

3

Ø 2,3 max.

6 max.

Ø 6

1,5

M 3

6,5

Ø 7

4,5 max.

Ø 2,3 max.

Rth [K/W][mm]art. no.

SIP-Multiwatt7.925.0SK 459 25 M ...

SIP-Multiwatt6.337.5SK 459 37,5 M ...

SIP-Multiwatt5.650.0SK 459 50 M ...

... mounting methodplease indicate:

with solder pin=STS

with solder pins and insulating washer=STIS

with threaded bolt M 3, brass=STSB

black anodisedsurface:

– for semiconductor screw-mounting

– with combination-hole pattern for mounting of 2 x TO 220 or 2 x SOT 32

– special lengths and transistor drillings on request

–E= mounting method

M3

18,9

M3

18

30,3 E

3

20

30,3

50

30,8

11,7 11,7

12,22

8,5

0,72

3,1

25,33

3

Ø 2,3 max.

6 max.

Ø 6

1,5

M 3

6,5

Ø 7

4,5 max.

Ø 2,3 max.

… STS … STIS … STSB

Rth [K/W][mm]art. no.

2xSOT 32/ 2xTO 2207.925.0SK 459 25 2 x TO 220 ...

2xSOT 32/ 2xTO 2206.337.5SK 459 37,5 2 x TO 220...

2xSOT 32/ 2xTO 2205.650.0SK 459 50 2 x TO 220 ...

... mounting methodplease indicate:

with solder pin=STS

with solder pins and insulating washer=STIS

with threaded bolt M 3, brass=STSB

black anodisedsurface:

A 102

E 19Mica wafersA 84 – 88Profiles for lock-in fixing spring

E 16Kapton insulator washersA 18 – 20Assignment table

E 21Thermal conductive pasteE 2 – 5Thermal conductive material

A 2 – 8Technical introductionC 10 – 16Attachable heatsinks

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

– for semiconductor clip-mounting

– special lengths and transistor drillings on request

–P= raised retaining stud, E= mounting method

42

17

1,8

25

P

10

4

8

19,5

25,4 E

Ø 2,8

3

Ø 2,3 max.

6 max.

Ø 6

1,5

M 3

6,5

Ø 7

4,5 max.

Ø 2,3 max.

… STC … STIC … STCB

Rth [K/W][mm]art. no.

TO 2207.825.4SK 129 25,4 ...

TO 2206.538.1SK 129 38,1 ...

TO 2205.350.8SK 129 50,8 ...

TO 2204.563.5SK 129 63,5 ...

... mounting methodplease indicate:

with solder pin=STC

with solder pin and insulating washer=STIC

with threaded bolt M 3, brass=STCB

black anodisedsurface:

– for semiconductor screw-mounting

– special lengths and transistor drillings on request

–E= mounting method

18,3

25,4

13,5

Ø

3,2

Ø 2,3 max.

25,4

13,5

E

18,3

25,4

Ø

3,2

25,4

42

17

1,8

25

3

Ø 2,3 max.

6 max.

Ø 6

1,5

M 3

6,5

Ø 7

4,5 max.

Ø 2,3 max.

… STS … STIS … STSB

Rth [K/W][mm]art. no.

SOT 32/ TO 220/ TO 3 P7.825.4SK 129 25,4 ...

SOT 32/ TO 220/ TO 3 P6.538.1SK 129 38,1 ...

SOT 32/ TO 220/ TO 3 P5.350.8SK 129 50,8 ...

SOT 32/ TO 220/ TO 3 P4.563.5SK 129 63,5 ...

... mounting methodplease indicate:

with solder pin=STS

with solder pins and insulating washer=STIS

with threaded bolt M 3, brass=STSB

black anodisedsurface:

A 103

E 19Mica wafersA 84 – 88Profiles for lock-in fixing spring

E 16Kapton insulator washersA 18 – 20Assignment table

E 21Thermal conductive pasteE 2 – 5Thermal conductive material

A 2 – 8Technical introductionC 10 – 16Attachable heatsinks

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

– for semiconductor clip-mounting

–profile SK 185 ➔A 73

– special lengths and drillings on request

–L= solderable pins

34,4

21,5

Ø 3,1 max.

4

Ø 5

10,25

versionRth [K/W][mm]art. no.

with solder pinsTO 2207.925.0SK 185 25 STC TO 220

with solder pinsTO 2206.437.5SK 185 37,5 STC TO 220

with solder pinsTO 2204.950.0SK 185 50 STC TO 220

without solder pinsTO 2204.950.0SK 185 50 C TO 220

black anodisedsurface:

– for semiconductor screw-mounting

–profile SK 185 ➔A 73

– special lengths and drillings on request

–L= solderable pins

4

34,4

18,3

3,2

3,1 max.

L

2

2,7

34,4

18

65

30

4,5

4

versionRth [K/W][mm]art. no.

with solder pinsTO 2207.925.0SK 185 25 STS TO 220

with solder pinsTO 2206.437.5SK 185 37,5 STS TO 220

with solder pinsTO 2204.950.0SK 185 50 STS TO 220

without solder pinsTO 2207.925.0SK 185 25 TO 220

without solder pinsTO 2206.437.5SK 185 37,5 TO 220

without solder pinsTO 2204.950.0SK 185 50 TO 220

black anodisedsurface:

A 104

E 19Mica wafersA 84 – 88Profiles for lock-in fixing spring

E 16Kapton insulator washersA 18 – 20Assignment table

E 21Thermal conductive pasteE 2 – 5Thermal conductive material

A 2 – 8Technical introductionC 10 – 16Attachable heatsinks

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

– for semiconductor screw-mounting

– hole pattern is centered to the total length of the heatsink

– special lengths and drillings on request

–*1 = versions with solder pins; *2 = versions without solder pins

–L= solderable pins

14

1515

5

3

17,78

32

*1 *2

L

4 max.

Ø 1,3

Ø 3,2

18,3

14,75

=

13

5

=

Ø 3,2

versionRth [K/W][mm]art. no.

with solder pinsTO 220/*112.525.0SK 75 25 STS TO 220

with solder pinsTO 220/*110.037.5SK 75 37,5 STS TO 220

with solder pinsTO 220/*18.550.0SK 75 50 STS TO 220

without solder pins—12.525.0SK 75 25

without solder pinsTO 220/*212.525.0SK 75 25 TO 220

without solder pins—10.037.5SK 75 37,5

without solder pinsTO 220/*210.037.5SK 75 37,5 TO 220

without solder pins—8.550.0SK 75 50

without solder pinsTO 220/*28.550.0SK 75 50 TO 220

without solder pins—7.075.0SK 75 75

without solder pins——1000.0SK 75 1000

1515

7

4

17,78

32

20

*1 *2

L

4 max.

Ø 1,3

Ø 3,2

18,3

14,75

=

13

5

=

Ø 3,2

versionRth [K/W][mm]art. no.

with solder pinsTO 220/*110.025.0SK 76 25 STS TO 220

with solder pinsTO 220/*18.037.5SK 76 37,5 STS TO 220

with solder pinsTO 220/*17.050.0SK 76 50 STS TO 220

without solder pins—10.025.0SK 76 25

without solder pinsTO 220/*210.025.0SK 76 25 TO 220

without solder pins—8.037.5SK 76 37,5

without solder pinsTO 220/*28.037.5SK 76 37,5 TO 220

without solder pins—7.050.0SK 76 50

without solder pinsTO 220/*27.050.0SK 76 50 TO 220

without solder pins—5.975.0SK 76 75

without solder pins——1000.0SK 76 1000

black anodisedsurface:

A 105

E 19Mica wafersA 84 – 88Profiles for lock-in fixing spring

E 16Kapton insulator washersA 18 – 20Assignment table

E 21Thermal conductive pasteE 2 – 5Thermal conductive material

A 2 – 8Technical introductionC 10 – 16Attachable heatsinks

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

– for semiconductor clip-mounting

–profile SK 145 ➔A 73

– special lengths and drillings on request

–L= solderable pins

Ø 2,8 max.

4,5

L

15

Ø 4,5

20,5

25,4

versionRth [K/W][mm]art. no.

with solder pinsTO 218/ TO 220/

TO 247/ TO 248

13.525SK 145 25 STC

with solder pinsTO 218/ TO 220/

TO 247/ TO 248

12.430SK 145 30 STC

with solder pinsTO 218/ TO 220/

TO 247/ TO 248

10.050SK 145 50 STC

black anodisedsurface:

– for semiconductor screw-mounting

–profile SK 145 ➔A 73

– special lengths and drillings on request

–L= solderable pins

15,5

25,4

29

12

3

Ø 2,8 max.

Ø 3,2

25,4

4,5

18,3

L

versionRth [K/W][mm]art. no.

with solder pinsTO 218/ TO 220/

TO 247/ TO 248

13.525.0SK 145 25 STS TO 220

with solder pinsTO 218/ TO 220/

TO 247/ TO 248

12.037.5SK 145 37,5 STS TO 220

with solder pinsTO 218/ TO 220/

TO 247/ TO 248

10.050.0SK 145 50 STS TO 220

black anodisedsurface:

A 106

E 19Mica wafersA 84 – 88Profiles for lock-in fixing spring

E 16Kapton insulator washersA 18 – 20Assignment table

E 21Thermal conductive pasteE 2 – 5Thermal conductive material

A 2 – 8Technical introductionC 10 – 16Attachable heatsinks

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

– special lengths and drillings on request

–L= solderable pins

M3

8

M3

18,3

SK 126 25 STS TO 220

SK 126 37,5 STS TO 220 SK 126 25 2 x M 3

SK 126 37,5 2 x M 3

SK 126 25 TO 220

SK 126 37,5 TO 220

M3

18,3

L

Ø 2,3

4,5 max.

M3

6,35

6,35

34,5

12,7

3

8

M3

18,3

versionRth [K/W][mm]art. no.

with solder pin and thread M3TO 218/ TO 220/

TO 247/ TO 248

8.025.0SK 126 25 STS TO 220

with solder pin and thread M3TO 218/ TO 220/

TO 247/ TO 248

6.537.5SK 126 37,5 STS TO 220

ohne Lötstift, mit M3-GewindeTO 218/ TO 220/

TO 247/ TO 248

8.025.0SK 126 25 TO 220

ohne Lötstift, mit M3-GewindeTO 218/ TO 220/

TO 247/ TO 248

8.025.0SK 126 25 2 x M3

ohne Lötstift, mit M3-GewindeTO 218/ TO 220/

TO 247/ TO 248

6.537.5SK 126 37,5 TO 220

ohne Lötstift, mit M3-GewindeTO 218/ TO 220/

TO 247/ TO 248

6.537.5SK 126 37,5 2 x M3

——8.025.0SK 126 25

——6.537.5SK 126 37,5

———1000.0SK 126 1000

black anodisedsurface:

A 107

E 19Mica wafersA 84 – 88Profiles for lock-in fixing spring

E 16Kapton insulator washersA 18 – 20Assignment table

E 21Thermal conductive pasteE 2 – 5Thermal conductive material

A 2 – 8Technical introductionC 10 – 16Attachable heatsinks

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

– special lengths and drillings on request

–L= solderable pins

SK 95 15 STS SOT 32 S SK 95 25 STS TO 220 SK 95 25 STS SOT 32

25

13,5

M3

15

11

M3

25

18,3

M3

LLL

3,5 max.

Ø 1,3

3,5 max.

Ø 1,3

3,5 max.

Ø 1,3

3,9

6,3

6,5

4,4

10,6

12,6

1,3

1,1

Rth [K/W][mm]art. no.

SOT 3238.515SK 95 15 STS SOT 32 S

SOT 3236.025SK 95 25 STS SOT 32

TO 22036.025SK 95 25 STS TO 220

6,5

4,4

10,6

12,6

1,3

1,1

SK 95 25 1 x M2,5 1 x M3

SK 95 25 2 x M3

25

18,3

M3

25

2,6

7

18,3

M3

M3

M2,5 M3

SK 95 15 SOT 32 S SK 95 25 SOT 32

M3

15

11

M3

25

13,5

M3

SK 95 25 TO 220

25

18,3

M3

2,6

Rth [K/W][mm]art. no.

SOT 3238.515SK 95 15 SOT 32 S

SOT 3236.025SK 95 25 SOT 32

TO 22036.025SK 95 25 TO 220

1xM2.5/ 1xM3 (TO 220)36.025SK 95 25 1x M2,5 1x M3

2xM3 (TO 220)36.025SK 95 25 2 x M3

—38.515SK 95 15

—36.025SK 95 25

——1000SK 95 1000

black anodisedsurface:

not anodisedtype of thread:

A 108

E 19Mica wafersA 84 – 88Profiles for lock-in fixing spring

E 16Kapton insulator washersA 18 – 20Assignment table

E 21Thermal conductive pasteE 2 – 5Thermal conductive material

A 2 – 8Technical introductionC 10 – 16Attachable heatsinks

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

– single solder pin

–profile SK 437 ➔A 24

– special lengths and drillings on request

–L= solderable pin

4,5 max.

Ø 2,55

L

10,5

14,5

Rth [K/W][mm]art. no.

TO 218/ TO 220/ TO 247/ TO 2482425SK 437 25 STC

TO 218/ TO 220/ TO 247/ TO 2482230SK 437 30 STC

TO 218/ TO 220/ TO 247/ TO 2481835SK 437 35 STC

TO 218/ TO 220/ TO 247/ TO 2481450SK 437 50 STC

Ø 2,55

4,5 max.

L

20

M3

16

5

16

3,5

Rth [K/W][mm]art. no.

TO 218/ TO 220/ TO 247/ TO 2482425SK 437 25 STS

TO 218/ TO 220/ TO 247/ TO 2482230SK 437 30 STS

TO 218/ TO 220/ TO 247/ TO 2481835SK 437 35 STS

TO 218/ TO 220/ TO 247/ TO 2481450SK 437 50 STS

black anodisedsurface:

– double solder pin

–profile SK 437 ➔A 24

– special lengths and drillings on request

–L= solderable pin

4,5 max.

L

10,5

14,5

Ø 1,45

L

Rth [K/W][mm]art. no.

TO 218/ TO 220/ TO 247/ TO 2482425SK 437 25 STC 2

TO 218/ TO 220/ TO 247/ TO 2482230SK 437 30 STC 2

TO 218/ TO 220/ TO 247/ TO 2481835SK 437 35 STC 2

Ø1,45

4,5 max.

L

20

M3

L

16

3,5

16

10

Rth [K/W][mm]art. no.

TO 218/ TO 220/ TO 247/ TO 2482425SK 437 25 STS 2

TO 218/ TO 220/ TO 247/ TO 2482230SK 437 30 STS 2

TO 218/ TO 220/ TO 247/ TO 2481835SK 437 35 STS 2

black anodisedsurface:

A 109

E 19Mica wafersA 84 – 88Profiles for lock-in fixing spring

E 16Kapton insulator washersA 18 – 20Assignment table

E 21Thermal conductive pasteE 2 – 5Thermal conductive material

A 2 – 8Technical introductionC 10 – 16Attachable heatsinks

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

– special versions on customer´s request

–L= solderable pin

2,5

1,25

5,9

11,8

8

M3

18

3,5 max.

Ø 1,3

L

Rth [K/W][mm]art. no.

SOT 32/ TO 22029.025SK 470 25 STS

SOT 32/ TO 22027.230SK 470 30 STS

SOT 32/ TO 22025.635SK 470 35 STS

SOT 32/ TO 22023.250SK 470 50 STS

15,24

3,5

1,75

6,75

13,5

M3

18

3,5 max.

Ø 1,3

L

Rth [K/W][mm]art. no.

SOT 32/ TO 22015.325SK 469 25 STS

SOT 32/ TO 22014.330SK 469 30 STS

SOT 32/ TO 22013.035SK 469 35 STS

SOT 32/ TO 22010.650SK 469 50 STS

black anodisedsurface:

– as mounting- and connecting piece

– for clamp mounting of the transistors

– triple unit can be seperated

– solder pin mounting possible

– special versions on customer´s request

20 15 20 15 20

94

20,4 20,4 20,4

2

5,2

11,5

Ø 2,6

Rth [K/W][mm]art. no.

TO 218/ TO 220/ TO 247/ TO 264/ TO 3 P6.025.0SK 484 25

TO 218/ TO 220/ TO 247/ TO 264/ TO 3 P4.537.5SK 484 37,5

TO 218/ TO 220/ TO 247/ TO 264/ TO 3 P3.750.0SK 484 50

TO 218/ TO 220/ TO 247/ TO 264/ TO 3 P2.875.0SK 484 75

A 110

E 19Mica wafersA 84 – 88Profiles for lock-in fixing spring

E 16Kapton insulator washersA 18 – 20Assignment table

E 21Thermal conductive pasteE 2 – 5Thermal conductive material

A 2 – 8Technical introductionC 10 – 16Attachable heatsinks

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

– compact PCB heatsinks

– especially suitable for vertical PCB mounting in housings, racks etc.

– easy solder fixing

– special versions on customer´s request

–L= solderable pin

SK 454 20 1 x M 3 L SK 454 40 2 x M 3 L SK 454 60 3 x M 3 L

10 20 10

M3 M3

17,8

3,9

Ø 2,3 max

Ø 2,3 ma x

10 20 20 10

M3 M3 M3

17,8

3,9

21,45

9,5

19

L

20

Ø 2,3 max

3,9 17,8

M3

Rth [K/W][mm]art. no.

SOT 32/ TO 22010.120SK 454 20 1 x M3 L

SOT 32/ TO 2208.840SK 454 40 2 x M3 L

SOT 32/ TO 2207.560SK 454 60 3 x M3 L

SK 448 20 1 x M 3 L SK 448 40 2 x M 3 L SK 448 60 3 x M 3 L

20

Ø 2,3 max

5,6 20,6

M3

10 20 10

M3 M3

Ø 2,3 max

5,6 20,6

Ø 2,3 max

10 20 20 10

M3 M3 M3

5,6 20,6

27,95

6,25

12,5

L

Rth [K/W][mm]art. no.

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P11.820SK 448 20 1 x M3 L

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P9.840SK 448 40 2 x M3 L

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P7.160SK 448 60 3 x M3 L

SK 400 20 1 x M 3 L SK 400 40 2 x M 3 L SK 400 60 3 x M 3 L

33

5

10

10 20 10

M3 M3

22,5

4

Ø 2,3 max Ø 2,3 max

10 20 20 10

M3 M3 M3

22,5

4

20

Ø 2,3 max

422,5

M3

L

Rth [K/W][mm]art. no.

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P11.620SK 400 20 1 x M3 L

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P8.240SK 400 40 2 x M3 L

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P7.260SK 400 60 3 x M3 L

SK 456 20 1 x M 3 L SK 456 40 2 x M 3 L SK 456 60 3 x M 3 L

40

3,4

6

20

Ø 2,3 max

5

20,3

M3

10 20 10

M3 M3

20,3

5

Ø 2,3 max Ø 2,3 max

10 20 20 10

M3 M3 M3

20,3

5

L

Rth [K/W][mm]art. no.

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P13.020SK 456 20 1 x M3 L

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P10.540SK 456 40 2 x M3 L

TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P8.560SK 456 60 3 x M3 L

A 111

E 19Mica wafersA 84 – 88Profiles for lock-in fixing spring

E 16Kapton insulator washersA 18 – 20Assignment table

E 21Thermal conductive pasteE 2 – 5Thermal conductive material

A 2 – 8Technical introductionC 10 – 16Attachable heatsinks

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

– for semiconductor clip-mounting

– special lengths and transistor drillings on request

–E= mounting method

… STC … STIC … STCB

2,25

18,16

14,54

7,1

E

34

5,1

18,16

20

4

3

Ø 2,3 max.

6 max.

Ø 6

1,5

M3

6,5

Ø 7

4,5 max.

Ø 2,3 max.

Rth [K/W][mm]art. no.

SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 2489.025.0SK 460 25 ...

SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 2487.937.5SK 460 37,5 ...

SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 2487.050.0SK 460 50 ...

... mounting methodplease indicate:

with solder pin=STC

with solder pin and insulating washer=STIC

with threaded bolt M 3, brass=STCB

black anodisedsurface:

– for semiconductor screw-mounting

– special lengths and transistor drillings on request

–E= mounting method

STS STIS

21,2

18,16

M3

E

3

Ø 2,3 max.

6 max.

Ø 6

4,5 max.

Ø 2,3 max.

34

5,1

18,16

20

4

Rth [K/W][mm]art. no.

SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 2489.025.0SK 460 25 STS

SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 2487.937.5SK 460 37,5 STS

SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 2487.050.0SK 460 50 STIS

black anodisedsurface:

A 112

E 19Mica wafersA 84 – 88Profiles for lock-in fixing spring

E 16Kapton insulator washersA 18 – 20Assignment table

E 21Thermal conductive pasteE 2 – 5Thermal conductive material

A 2 – 8Technical introductionC 10 – 16Attachable heatsinks

Extruded heatsinks for PCB mounting

A

B

C

D

E

F

G

H

I

K

L

M

N

– special versions on customer´s request

Rth [K/W]

V [m/s]

0123456

2,0

0

4,0

6,0

8,0

7 3,3

13,5 16,5 16,5 13,5

38,1

3,5

16,51

32,3

art. no.

SK DC 10 60 SA

7

32,3

13,5

16,516,5

13,5

3,3 Rth [K/W]

V [m/s]

0123456

2,0

0

4,0

6,0

8,0

40

1,8

6

art. no.

SK DC 8 60 SA

73,3 Rth [K/W]

V [m/s]

0123456

2,0

0

4,0

6,0

8,0

40

1,8

6

32,3

13,516,516,5

13,5

art. no.

SK DC 8 1 60 SA

61

10

12,8

53,3

45,745,7 12,8

3,8

2

Rth [K/W]

V [m/s]

3,0

0123456

2,0

1,0

0

4,0

art. no.

SK DC 4 1 117 SA

62,5

3,5

20

Rth [K/W]

V [m/s]

3,0

0123456

2,0

1,0

0

4,0

5,0

16,5

3,8

13,5 16,5 13,5

53,3

art. no.

SK DC 6 1 60 SA

black anodisedsurface:

A 113

A 135 – 136Standard aluminium profilesA 13 – 17Heatsink profile-overview

A 22 – 83Extruded heatsinksA 12Drilling pattern for Solid State Relais

A 89 – 112Profiles for PCB mountingA 11 – 12Heatsinks for Solid State Relais

A 2 – 8Technical introductionA 140Special profiles

Extruded heatsinks for DC/DC converter

A

B

C

D

E

F

G

H

I

K

L

M

N

– special versions on customer´s request

62,5

3,5

20

12,8

53,3

45,745,7 12,8

3,8 Rth [K/W]

V [m/s]

3,0

0123456

2,0

1,0

0

4,0

art. no.

SK DC 7 117 SA

Rth [K/W]

62,5

20

3,5

V [m/s]

3,0

0123456

2,0

1,0

0

4,0

12,8

53,3

45,745,7 12,8

3,8

art. no.

SK DC 7 1 117 SA

Ø 3,2

76,2

30,5

66

50,8

8

3

Rth [K/W]

V [m/s]

3,0

0123456

2,0

1,0

0

4,0

5,0

6,0

art. no.

SK DC 2 1 76 SA

62,5

3,5

20

Rth [K/W]

V [m/s]

3,0

0123456

2,0

1,0

0

4,0

50,8

59

48,3

Ø 3,2

art. no.

SK DC 5 59 SA

62,5

3,5

20

Rth [K/W]

V [m/s]

3,0

0123456

2,0

1,0

0

4,0

50,8

59

48,3

Ø 3,2

art. no.

SK DC 5 1 59 SA

black anodisedsurface:

A 114

A 135 – 136Standard aluminium profilesA 13 – 17Heatsink profile-overview

A 22 – 83Extruded heatsinksA 12Drilling pattern for Solid State Relais

A 89 – 112Profiles for PCB mountingA 11 – 12Heatsinks for Solid State Relais

A 2 – 8Technical introductionA 140Special profiles

Extruded heatsinks for DC/DC converter

A

B

C

D

E

F

G

H

I

K

L

M

N

materialplate thick-

ness [mm]

suitable for

heatsinks

for transistor-

housing

art. no.

4

4

4

10

6,6

11,3

3,1

13,8

13,2

spring steel,

corrosion protec-

ted

1-2FK 219/

FK 222/

SK 129

TO 220THF 129 TO 220

31,3

38,5

7,8

4

stainless steel1-2SK 104TO 220/

TO 247/

TO 248/

TO 3 P

THF 104

5

16,5

4,25 4,25

9,2

13,3

18

4,6

3

stainless steel1.5-3.0SK 409TO 220/

TO 247/

TO 248/

TO 3 P

THF 409 TO 220

5

16,5

4,25 4,25

11,4

18,2

7,2

3

4,5

stainless steel2-3SK 409TO 126/

SOT 32/

SOT 82

THF 409 SOT 32

3,1

4,6

12,1

7,5

7,15

4,6

2,45

3,9

11,5

1,5 2,2

spring steel,

corrosion protec-

ted

1-2FK 219/

FK 222

TO 220THF 220

5,5

29,5

3,5 3,5

30,4

14,1

9

4,5

5

stainless steel2SK 484TO 220/

TO 247/

TO 248/

TO 3 P

THF 247

3,5

29,5

3,5

5,5

5

16,1

31,3

4,3

32,9

6,9

stainless steel4SK 460TO 218/

TO 220/

TO 247/

TO 248/

TO 3 P

THF 247 4

1,8

16,5

1,5

3,9

17,4

316,9 3,6

9,2

3,5

4,5 8,8

stainless steel1.0-1.5UK 35TO 218/

TO 220/

TO 247/

TO 248/

TO 3 P

THF 220 17

21,6

12,3

4,6

3

Ø 5

3,2

20

stainless steel2-3SK 409/

SK 459

TO 218/

TO 220/

TO 247/

TO 248/

TO 3 P

THF 409 220 1

Ø 5

4,5

11,3

15,5

18

3

21,5

stainless steel4SK 145/

SK 185/

SK 437

TO 218/

TO 220/

TO 247/

TO 248/

TO 3 P

THF 409 220 2

16,4

11

6,3

12 3,7

4

153 3

spring steel,

corrosion protec-

ted

1.0-1.5FK 249TO 220THF 249

14,4

37,1 7,54

spring steel,

corrosion protec-

ted

2.5SK 600TO 218/

TO 220/

TO 247/

TO 3 P

THF 600

A 115

E 2 – 5Thermal conductive materialE 19Mica wafers

E 51Insulating capsE 16Kapton insulator washers

E 21Thermal conductive pasteA 89 – 112Heatsinks for PCB

A 2 – 8Technical introductionA 84 – 88Profiles for lock-in fixing spring

Retaining springs for transistors

A

B

C

D

E

F

G

H

I

K

L

M

N

– universal retaining spring for transistor housings types TO 218, TO 220, TO 247, TO 264, SOT 32 and various SIP Multiwatt etc.

– utility patent 200 14 739.0

– fast and easy mounting of the transistors

– number of retaining spring elements can be chosen (n = max. 10)

–THFMG with thread M 4

– specific versions and modifications on customer´s request

materialspring

force [N]

for transistor-

housing

art. no.

n (max. 172,5 mm)

7,5

3,25

25 17,5

n x Ø 3,2

11

14 6,5

30 8

10,4

15 3,5

stainless steel

60 ±5

TO 218/

TO 220/

TO 247/

TO 264/

SOT 32/

SIP Multiwatt

THFM ...

n (max. 172,5 mm)

7,5

3,25

25 17,5

M 4

11

14 6,5

30 8

10,4

15 3,5

stainless steel

60 ±5

TO 218/

TO 220/

TO 247/

TO 264/

SOT 32/

SIP Multiwatt

THFMG ...

... number of retaining-spring elementsplease indicate:

10-1

materialspring

force [N]

for transistor-

housing

art. no.

12

16,5

22,5

4,2

29,7

3,4

5,1

0,6

stainless steel79TO 220THFK 220

5,9

0,6

30,55

18

15,5

23,5

4,2

3,4

stainless steel119TO 218/

TO 247

THFK 247

A 116

E 2 – 5Thermal conductive materialE 19Mica wafers

E 51Insulating capsE 16Kapton insulator washers

E 21Thermal conductive pasteA 89 – 112Heatsinks for PCB

A 2 – 8Technical introductionA 84 – 88Profiles for lock-in fixing spring

Retaining springs for transistors

A

B

C

D

E

F

G

H

I

K

L

M

N

– able to slide on the transistor and mounting plate

– easy mounting

– high pressure force and firm grip

– specific versions upon customer´s request

materialhold-

ing

force

[N]

plate thick-

ness [mm]

for transistor-

housing

art. no.

7,9

10,7

2,5

22,1

0,6

10,2

stainless

steel

202TO 220THFA 1

13,2

0,5

13,1

26,5

6,3

10

spring steel,

corrosion

protected

206.5TO 220THFA 2

0,6

12,2

17,7

4

10

8,5

spring steel,

corrosion

protected

335.5TO 220THFA 3

13,2

0,5

13,1

26,5

6,3

15

spring steel,

corrosion

protected

596.5TO 218/

TO 247

THFA 4

A 117

E 2 – 5Thermal conductive materialE 19Mica wafers

E 49 – 50Mounting parts for heatsinksA 119 – 121Lock-in retaining spring for transistors

E 21 – 22Thermal conductive pasteA 89 – 91Heatsinks for PCB

A 2 – 8Technical introductionE 44 – 48Mounting material for semiconduct.

Retaining springs for transistors

A

B

C

D

E

F

G

H

I

K

L

M

N

– universal lock-in retaining spring for types TO 218, TO 220, TO 247, TO 264 and various SIP-Multiwatt etc. transistor housings

– clip fastening also for power transistors without holes, MAX types etc.

– easy assembly and secure hold when using a special groove geometry in heatsinks, housing parts etc.

– optimal heat transfer between component and cooling element

– various spring clip shapes available for fastening the components (see sketch)

– the range of suitable heat sinks is continuously extended

– versions speciﬁcally designed to meet customers requirements on request

Installation

THFU 1

A

B

– insert the lock-in retaining spring for transistors THFU 1 (A)

into the groove of the proﬁle

– push transistor (B) below the springinu

A

B

THFU 2, THFU 3, THFU 4, THFU 5, THFU 6, THFU 7

– place transistor (B) onto the mounting area

– press the lock-in retaining spring for transistors THFU 2 - 7 (A) into the

groove of the proﬁle (a suitable installation aid will facilitate pressing in)

– Once in place, the spring will keep its position and ﬁx the transistor with a high contact

pressure on the installation surface (the spring remains in its position and it can neither be

moved in a lengthwise direction nor fall it can out of the groove in a cross direction).

material: stainless steel

material thickness: 0.8 mm

A 118

E 2 – 5Thermal conductive materialE 19Mica wafers

E 49 – 50Mounting parts for heatsinksA 119 – 121Lock-in retaining spring for transistors

E 21 – 22Thermal conductive pasteA 89 – 91Heatsinks for PCB

A 2 – 8Technical introductionE 44 – 48Mounting material for semiconduct.

Retaining springs for transistors

A

B

C

D

E

F

G

H

I

K

L

M

N

materi-

al

spring

force [N]

suitable for

heatsinks

for transistor-

housing

art. no.

17,2

10,3

14

10

0,8

2,9

stain-

less

steel

60 ±5

SK 480/

SK 481/

SK 482/

SK 483/

SK 487/

SK 489/

SK 490/

SK 492/

SK 495/

SK 499/

SK 512/

SK 514/

SK 573/

SK 574/

SK 575/

SK 576/

SK 589/

SK 593/

SK 617/

LAM 3 K/

LAM 4 K/

LAM 5 K/

LA 27 K

TO 218/

TO 220/

TO 247/

TO 262/

TO 3 P/

SOT 199/

SOT 429

THFU 1

17,7

10,5

0,8

14,4

10

2,5

stain-

less

steel

60 ±5

SK 480/

SK 481/

SK 482/

SK 483/

SK 487/

SK 489/

SK 490/

SK 492/

SK 495/

SK 499/

SK 512/

SK 514/

SK 573/

SK 574/

SK 575/

SK 576/

SK 589/

SK 593/

SK 617/

LAM 3 K/

LAM 4 K/

LAM 5 K/

LA 27 K

TO 218/

TO 220/

TO 247/

TO 262/

TO 3 P/

SOT 199/

SOT 429

THFU 2

A 119

E 49 – 50Mounting parts for heatsinksA 89 – 93Heatsinks for PCB

A 89 – 112Profiles for PCB mountingA 13 – 17Heatsink profile-overview

E 2 – 24Thermal conductive materialA 18 – 20Assignment table

A 2 – 8Technical introductionA 84 – 88Profiles for lock-in fixing spring

Lock-in retaining spring for transistors

A

B

C

D

E

F

G

H

I

K

L

M

N

materi-

al

spring

force [N]

suitable for

heatsinks

for transistor-

housing

art. no.

20,5

10,4

0,8

17

10

2,8

stain-

less

steel

50 ±5

SK 480/

SK 481/

SK 482/

SK 483/

SK 487/

SK 489/

SK 490/

SK 492/

SK 495/

SK 499/

SK 514/

SK 573/

SK 574/

SK 575/

SK 576/

SK 589/

SK 593/

SK 617/

LAM 3 K/

LAM 4 K/

LAM 5 K/

LA 27 K

TO 218/

TO 220/

TO 247/

TO 262/

TO 3 P/

SOT 199/

SOT 429

THFU 3

23,6

10,4

0,8

19,7

10

1

stain-

less

steel

32 ±5

SK 480/

SK 481/

SK 482/

SK 483/

SK 487/

SK 489/

SK 490/

SK 495/

SK 499/

SK 514/

SK 575/

SK 589/

SK 593/

SK 617/

LAM 5 K/

LA 27 K

TO 218/

TO 202/

TO 220/

TO 248/

TO 262/

TO 264/

TO 3 P/

SOT 199

THFU 4

27,8

10,4

0,8

23,7

10

1,4

stain-

less

steel

25 ±5

SK 490/

SK 589/

SK 617/

LAM 5 K/

LA 27 K

TO 218/

TO 202/

TO 220/

TO 247/

TO 248/

TO 262/

TO 264/

TO 3 P/

SOT 199/

SOT 429

THFU 5

A 120

E 49 – 50Mounting parts for heatsinksA 89 – 93Heatsinks for PCB

A 89 – 112Profiles for PCB mountingA 13 – 17Heatsink profile-overview

E 2 – 24Thermal conductive materialA 18 – 20Assignment table

A 2 – 8Technical introductionA 84 – 88Profiles for lock-in fixing spring

Lock-in retaining spring for transistors

A

B

C

D

E

F

G

H

I

K

L

M

N

– THFU for transistors with low component height

materi-

al

spring

force [N]

suitable for

heatsinks

for transistor-

housing

art. no.

17,5

10,5

0,8

14,7

1,5 10

stain-

less

steel

65 ±5

SK 480/

SK 481/

SK 482/

SK 483/

SK 487/

SK 489/

SK 490/

SK 492/

SK 495/

SK 499/

SK 512/

SK 514/

SK 573/

SK 574/

SK 575/

SK 576/

SK 589/

SK 593/

SK 617/

LAM 3 K/

LAM 4 K/

LAM 5 K/

LA 27 K

TO 126/

TO 218/

TO 220/

TO 225/

TO 247/

TO 248/

TO 251/

TO 3 P/

SOT 32

THFU 6

10

20,25

10,4

0,8

16,9

3,6

stain-

less

steel

46 ±5

SK 480/

SK 482/

SK 483/

SK 487/

SK 490/

SK 492/

SK 495/

SK 573/

SK 574/

SK 576/

LAM 3 K

eSIPTHFU 7

A 121

E 49 – 50Mounting parts for heatsinksA 89 – 93Heatsinks for PCB

A 89 – 112Profiles for PCB mountingA 13 – 17Heatsink profile-overview

E 2 – 24Thermal conductive materialA 18 – 20Assignment table

A 2 – 8Technical introductionA 84 – 88Profiles for lock-in fixing spring

Lock-in retaining spring for transistors

A

B

C

D

E

F

G

H

I

K

L

M

N

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth [K/W]

100 [mm]

25 50 75

5

20

25

12

15

9

1,5 15

10

art. no.

SK 12 ...

...

1000 mm

please indicate:

Rth [K/W]

100 [mm]

25 50 75

5

20

25

17

13

14

1,5 15

10

art. no.

SK 13 ...

...

25 35 mm

please indicate:

50 100 150

2

4

6

8

10

200 [mm]

Rth [K/W]

12

40

4

art. no.

SK 115 ...

...

37.5 50 1000 mm

please indicate:

14

15

1,5

UK 14 SA 220 UK 14 SA 220 3,2 UK 14 SA M3

5

5

12,5

4

Ø 1,8

M 2,5

25

20

5

5

12,5

4

Ø 1,8

Ø 3,2

25

20

5

5

12,5

4

Ø 1,8

M3

25

20

Rth [K/W]art. no.

TO 22020UK 14 SA 220

TO 22020UK 14 SA 220 3,2

TO 22020UK 14 SA M3

black anodisedsurface:

A 123

A 89 – 112Profiles for PCB mountingA 91Profiles for PCB components

A 22 – 83Extruded heatsinksA 13 – 17Heatsink profile-overview

A 115 – 117Retaining springs for transistorsA 89 – 91Heatsinks for PCB

A 2 – 8Technical introductionA 21Hole pattern

U-Extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

1,2

35

14,8

27,5

9,5

4

3 x Ø 3,2

1,2

15

18,5

Rth [K/W]art. no.

TO 22015ICK 35 SA

4,5

4

10

20

25

M 2,5

SK 12 SA 32 SK 12 SA 2 x 32

12

15

1,5 3

8

10

20

35 45

50

M 2,5

Rth [K/W]art. no.

1xSOT 3230SK 12 SA 32

2xSOT 3215SK 12 SA 2 x 32

17

13

1,5

SK 13 35 SA 220 SK 13 35 SA 220 3,5

SK 13 35 SA 220 3,2

8

10,1

5

M3

35

24,85

8

10,1

5

Ø 3,5

35

24,85

8

10,1

5

Ø 3,2

35

24,85

Rth [K/W]art. no.

TO 22017SK 13 35 SA 220

TO 22017SK 13 35 SA 220 3,2

TO 22017SK 13 35 SA 220 3,5

11

9

2

16

SK 431 1 SK 431 2 SK 431 3

8

21

11

Ø 3,8

11

25

8

17

12

Ø 3,2

11

25

2,5

5,5

17

12

3,2

25

12

Rth [K/W]art. no.

TO 22018SK 431 1

TO 22018SK 431 2

TO 22018SK 431 3

black anodisedsurface:

A 124

A 89 – 112Profiles for PCB mountingA 91Profiles for PCB components

A 22 – 83Extruded heatsinksA 13 – 17Heatsink profile-overview

A 115 – 117Retaining springs for transistorsA 89 – 91Heatsinks for PCB

A 2 – 8Technical introductionA 21Hole pattern

U-Extruded heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Setup heatsinks and angle for TO 3

30,2

40

27 4,2

12,7

Ø 22

Ø 24

Rth [K/W][mm]art. no.

1427AKK 127

19,1

8,6

3,5

0,8

30,2

40

27 4,2

Ø 22

Ø 24

Rth [K/W][mm]art. no.

1227AKK 191

black lacqueredsurface:

die-casting aluminiummaterial:

5,56

Ø 4,2

11

33,5°

40

30

5

10,9

30,2

17

41

Ø 4,2

7

41

9

4,5

13

Rth [K/W][mm]art. no.

—3.7100WP 4030 100 ...

TO 33.7100WP 4030 100 3 ...

... surfaceplease indicate:

black anodised=SA

raw degreased aluminium=AL

socket: TF 3 2 ➔E 50

A 125

A 113 – 114Heatsinks for DC/DC converterA 125Mounting for TO 3 angle

A 84 – 88Profiles for lock-in fixing springA 21Order example

A 13 – 17Heatsink profile-overviewA 135 – 136Standard aluminium profiles

A 2 – 8Technical introductionA 89 – 112Heatsinks for PCB

Die-cast heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Die-cast acc. to german standard DIN 41882

– other lengths and drillings on request

2,8 K/W

M6

40

71

30°

M6

4,5

59,5

60,5

20,1

82

art. no.

K 3 ... for mounting use insulator: art. no.: IS 53

... semiconductor retaining thread

M 6, M 8, M 10, M 12, 1/4"-28 UNF

please indicate:

2,8 K/W

M6

40

71

30°

M6

4,5

59,5

60,5

20,1

82

art. no.

K 3 T ... Cathode lug insulator with an additional insulated connection (M 3).

for mounting use insulator: art. no.: IS 53

... semiconductor retaining thread

M 6, M 8

please indicate:

35

M5

5 K/W

44

M6

20,1

30°

61

4

53,5

art. no.

K 5 ... for mounting use insulator: art. no.: IS 53

... semiconductor retaining thread

M 5, M 6, M 8, 1/4"-28 UNF

please indicate:

55

41,5

33,5

M4

M4

14

30°

3

20

M4

9 K/W

55

art. no.

K 9 ...

... semiconductor retaining thread

M 4, M 5

please indicate:

black lacqueredsurface:

A 126

A 113 – 114Heatsinks for DC/DC converterA 125Mounting for TO 3 angle

A 84 – 88Profiles for lock-in fixing springA 21Special profiles

A 13 – 17Heatsink profile-overviewA 135 – 136Standard aluminium profiles

A 2 – 8Technical introductionA 89 – 112Heatsinks for PCB

Die-cast heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Die-cast acc. to german standard DIN 41882

– other lengths and drillings on request

20

M4

15 K/W

53

27,5

3

14

30°

34,5

M4

37

art. no.

K 15 ...

... semiconductor retaining thread

M 4, M 5

please indicate:

black lacqueredsurface:

Mounting parts for heatsinks

50

13,3

16,3

31

Ø 6,5

37

Ø 25,5

9,7

Ø 25,5

27

art. no.

IS 53

A 127

A 113 – 114Heatsinks for DC/DC converterA 125Mounting for TO 3 angle

A 84 – 88Profiles for lock-in fixing springA 21Special profiles

A 13 – 17Heatsink profile-overviewA 135 – 136Standard aluminium profiles

A 2 – 8Technical introductionA 89 – 112Heatsinks for PCB

Die-cast heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

– completely milled mounting surface for semiconductors with square bottom plates

– the mounting surface can be equipped with threads for fastening semiconductors with screwed glands (semiconductor thread tapping)

– threads from M 4 to M 32 x 1.5 or 4 x threads for semiconductors with clamping plate mounting are available

– strap fastening thread M 8

– delivery without anode strap

– other lengths and drillings on request

0,55 K/W Ø 61

5 x M 8

36

100

36

50 50

135 39

Rth [K/W][mm]art. no.

0.55120K 0,55 ...

... semiconductor retaining thread

M 12, M 24 x 1,5

please indicate:

1,1 K/W

25

Ø 42

3 x M 8

68

50

90

75

100

94

Rth [K/W][mm]art. no.

1.190K 1,1 ...

... semiconductor retaining thread

M 8, M 12, M 16 x 1,5

please indicate:

black lacqueredsurface:

Accessories

– anode end strap made of tin-plated cathode copper

Ø 52 FL 0,55 FL 1,1

Ø 42

86

2

65

1,5

Ø 9,4 Ø 8,5

art. no.art. no.

FL 1,1FL 0,55

Ø 52

WL 0,55 WL 1,1

Ø 42

90

95

2

80

45

1,5

Ø 9,5

Ø 13,5

Ø 8,5 Ø 11,4

80

55

art. no.art. no.

WL 1,1WL 0,55

A 128

A 113 – 114Heatsinks for DC/DC converterA 125Mounting for TO 3 angle

A 84 – 88Profiles for lock-in fixing springA 21Special profiles

A 13 – 17Heatsink profile-overviewA 135 – 136Standard aluminium profiles

A 2 – 8Technical introductionA 89 – 112Heatsinks for PCB

Die-cast heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

– fin coolers in special design

– especially suitable for thermoelectric elements (Peltier-elements) and similar power modules

– compact design with reduced volume

– large surface, therefore more efficient than extruded profiles

– particularly low heat resistance with forced air cooling

– ideally fitted fins from a heat engineer´s point of view

– accurately flat milled surfaces

– very low roughness

– machining for module mounting according to drawing

– heat bridges (spacing bridges) on request

– lapped surface on request

– customer specific special design

KTE 1

0,9

0,8

0,7

0,6

0,5

0,4

0,3

0,2

0,1

00123456

V [m/s]

Rth [K/W] KTE 2

0,9

0,8

0,7

0,6

0,5

0,4

0,3

0,2

0,1

00 1 23456

V [m/s]

Rth [K/W]

0,05 100

8

2

0,8

32 x 3 = 96 mm

100

Rz10

[mm]art. no.[mm]art. no.

46KTE 258KTE 1

aluminium, construction with copper on requestmaterial:

A 129

A 12Drilling pattern for Solid StateA 131 – 133Fluid coolers

A 137 – 138Special heatsink designA 135 – 136Standard aluminium profiles

A 140Special profilesD 26 – 29High capacity cooling aggregat.

A 2 – 8Technical introductionA 13 – 17Heatsink profile-overview

Standard fin coolers for thermoelectrical elements

A

B

C

D

E

F

G

H

I

K

L

M

N

B

max. 30

C

max. 150

D

0.8 / 1 / 1.5 / 2

E

min. 2

F

max. 400

B 1

max. 30

A

max. 400

FEDCA B

C

B

D

A

0,05 100

F

≤ Rz10

E

KTE

dimensions [mm]

A

max. 400

B

max. 30

C

max. 150

D

0.8 / 1 / 1.5 / 2

E

min. 2

F

max. 400

dimensions [mm]

please indicate with your order:

material: aluminium, construction with copper upon request

≤ Rz10

≤ Rz10

A

DE

C

BB1

F

≤ 0,2 100

ʺ 0,2 100

– ﬁn coolers in special design

– for forced convection, thus particularly low thermal

resistance

– two opposite bottom plates as mounting surfaces

for power modules and similar

– mounting surfaces precisely ﬂat milled

– compact design with reduced volume

– ideally ﬁtted ﬁns from a heat engineering point of view

– lapped ﬁnish on request

– additional machining according to customer’s requirements

– fan versions on request

– special constructions to customer’s indications

KTED

dimensions [mm

dimensions [mm]

please indicate with your order:

material: aluminium, construction with copper upon request

A

max. 400

B

max. 30

C

max. 150

D

0.8 / 1 / 1.5 / 2

E

min. 2

F

max. 400

B 1

max. 30

possible dimensions:

possible dimensions:

A 130

A 12Drilling pattern for Solid StateA 131 – 133Fluid coolers

A 137 – 138Special heatsink designA 135 – 136Standard aluminium profiles

A 140Special profilesD 26 – 29High capacity cooling aggregat.

A 2 – 8Technical introductionA 13 – 17Heatsink profile-overview

Fin coolers KTE/KTED custom design

A

B

C

D

E

F

G

H

I

K

L

M

N

1000

900

800

700

600

500

400

300

200

100

00 100 200 300 400 500 600 700 800 900 1000

∆πw [mbar]

Vw [l/h]

˙

2600

2400

2200

2000

1800

1600

1400

1200

1000 0100 200 300 400 500 600 700 800 900 1000

Vw [l/h]

˙

500

400

300

200

100

0 . . . . 24 33 42 51 60

Temperatur [°C]

Vw [l/h]

˙

Q [W]

˙

U-flow (FLKU 140)

I-flow (FLKI 80)

FLKI 80

FLKU 140

U-flow (FLKU 140)

I-flow (FLKI 80)

– water-gycol mixture (60/40); inlet temperature approx. 26 °C

Fluid cooler for dissipating large quantities of heat with low space requirement; effective system to cool power modules; suitable

for water pH 6.5-8.5 with anticorrosives, as well as other fluids (eg. oil, alcohols, etc.); compact design with internal fin structure

for particularly good heat transfer to the fluid; minimised flow pressure losses (see diagram); operating pressure up to 2

bar possible; thick base plate for optimum heat distribution and to secure the heat-emmiting elements; mounting flange for the

cooler according to customer's instructions; precisely face milled surface of component mounting area with very good flatness

and low roughness depth; dimensionally accurate adjustment to given mounting conditions; connections using hole ports

12 mm in diameter with reinforcing seam to DIN 71550 or installation flange to customers instuctions; I- or U-throughflow or multiple

throughflow versions; max. drilling depth in the base plate: 7 mm

To avoid corrosion in the water cooler the cooling fluid has to flow in a closed circuit and it has to contain 40-60% (preferred is 50%)

anti-corrosive fluids for aluminium, if necessary with anti-freeze. For the choice and approval of the cooling fluid as well as for the possible

consequences in the cooling circuit the user is the only liable person. Therefore we exclude any liability for damages caused by the choice

or approval of the cooling fluids.

– dimensions and designs using customer's instructions

1

+_

Ø 12 x 1,5

68

80

DIN 71550

580

8,5

16

11,5

40

ʺ 0,1100

Rz10

500 2

+

_

art. no.

FLKI 80

500

40

Ø 12 x 1,5

119

540

8,5

16

11,5

DIN 71550

ʺ 0,1 100

140

2

+_

1,5

+_

Rz10

art. no.

FLKU 140

EN AW 6060 (AlMgSi 0.5)material:

A 131

A 137 – 138Special heatsink designA 129Fin coolers

A 140Special profilesD 13 – 25Cooling aggregates with axial fan

A 21Hole patternD 26 – 29High capacity cooling aggregat.

A 2 – 8Technical introductionA 13 – 17Heatsink profile-overview

Fluid coolers for power modules

A

B

C

D

E

F

G

H

I

K

L

M

N

1000

900

800

700

600

500

400

300

200

100

00 100 200 300 400 500 600 700 800

Vw [l/h]

˙

Δπw [mbar]

Δπw [mbar]

1 = FLKU 140 G 500 2 = FLKU 140 G 300 3 = FLKU 140 G 200

1 = FLKI 80 G 500 2 = FLKI 80 G 300 3 = FLKI 80 G 200

Vw [l/h]

˙

500

400

300

200

100

0 . . . .24 33 42 51

Temperatur [°C]

Vw [l/h]

˙

500

400

300

200

100

0 . . . . 24 33 42 51

Temperatur [°C]

1

2

3

1

2

3

1000

900

800

700

600

500

400

300

200

100

00 100 200 300 400 500 600 700 800

Vw [l/h]

˙

1

2

3

32 1

– water-gycol mixture (60/40); inlet temperature approx. 26 °C

Fluid cooler for dissipating large quantities of heat with low space requirement; effective system to cool power modules; suitable

for water pH 6.5-8.5 with anticorrosive, as well as other fluids (eg. oil, alcohols, etc.); compact design with internal fin structure

for particularly good heat transfer to the fluid; minimised flow pressure losses; operating pressure up to 2 bar possible;

thick base plate for optimum heat distribution and to secure the heat-emitting elements; mounting flange for the cooler according

to customer's instructions; precisely face milled surface of component mounting area with very good eveness and low roughness

depth; for power modules like IGBT-module, Thyristor-module, SCR diode module, bridge amplifiers and others;

dimensionally accurate adjustment to given mounting conditions; conncetions with thread muffle 1/8" or mounting flange

according to customer's instructions; I- or U-throughflow or multiple throughflow versions; max. drilling depth in the base

plate: 17 mm

To avoid corrosion in the water cooler the cooling fluid has to flow in a closed circuit and it has to contain 40-60% (preferred is 50%)

anti-corrosive fluids for aluminium, if necessary with anti-freeze. For the choice and approval of the cooling fluid as well as for the possible

consequences in the cooling circuit the user is the only liable person. Therefore we exclude any liability for damages caused by the choice

or approval of the cooling fluids.

– dimensions and designs using customer's instructions

Vw [l/h]

˙

20

Ø 20

1/8”

ʺ 0,1 100

60

80

20

15

29

20

Q [W]

2600

2400

2200

2000

1800

1600

1400

1200

10000 100 200 300 400 500 600 700 800 900 1000

Rz10 FLKI 80 G 500

FLKI 80 G 300

FLKI 80 G 200

[mm]art. no.[mm]art. no.

500FLKI 80 G 500200FLKI 80 G 200

300FLKI 80 G 300

Vw [l/h]

˙

20

Ø 20

ʺ 0,1 100

Q [W]

˙

15

29

20

Rz10

100

140

20

2600

2400

2200

2000

1800

1600

1400

1200

10000 100 200 300 400 500 600 700 800 900 1000

1/8”

FLKU 140 G 500

FLKU 140 G 300

FLKU 140 G 200

[mm]art. no.[mm]art. no.

500FLKU 140 G 500200FLKU 140 G 200

300FLKU 140 G 300

EN AW 6060 (AlMgSi 0.5)material:

A 132

A 137 – 138Special heatsink designA 129Fin coolers

A 140Special profilesD 13 – 25Cooling aggregates with axial fan

A 21Hole patternD 26 – 29High capacity cooling aggregat.

A 2 – 8Technical introductionA 13 – 17Heatsink profile-overview

Fluid coolers for power modules

A

B

C

D

E

F

G

H

I

K

L

M

N

– recooling system for all types of liquid coolers

– cools up to 2,600 watts thermal power loss

– consists of pump and recooler

– pump as normally aspirating, single-stage centrifugal pump with spiral housing in block construction

– recooler with liquid-conducting tube system with air lamella and electrically driven fan motor

– further information free of charge under: FLK R1-Info

– notes: anticorrosive agents are required when water is used as coolant (eg. water/glykol - 60/40)

– the hose systems used (NOT in scope of delivery) must be resistant to anticorrosive agents (eg. material EPDM according to DIN 73411,

ISO 4081)

To avoid corrosion in the water cooler the cooling fluid has to flow in a closed circuit and it has to contain 40-60% (preferred is 50%)

anti-corrosive fluids for aluminium, if necessary with anti-freeze. For the choice and approval of the cooling fluid as well as for the possible

consequences in the cooling circuit the user is the only liable person. Therefore we exclude any liability for damages caused by the choice

or approval of the cooling fluids.

64

106

56

25

90

3/4”

288

276

90

225

75

120

82

1/8”

177

art. no.

FLKR 1

max. 2.600 Wthermal cooling capacity:

single-phase 230 V AC, 120 Wpump:

single-phase 230 V AC, 120 W/ three-phase 400 V AC, 90 Wrecooler:

pump and recoolertype of delivery:

A 133

A 137 – 138Special heatsink designA 129Fin coolers

A 140Special profilesD 13 – 25Cooling aggregates with axial fan

A 21Hole patternD 26 – 29High capacity cooling aggregat.

A 2 – 8Technical introductionA 13 – 17Heatsink profile-overview

Recooling systems for liquid coolers

A

B

C

D

E

F

G

H

I

K

L

M

N

A

B

C

D

E

F

G

H

I

K

L

M

N

– length, drilling and surface finishes to customer's instructions

– other standard profiles on request

U-profiles

B

C

D

A

D [mm]C [mm]B [mm]A [mm]art. no.D [mm]C [mm]B [mm]A [mm]art. no.

2.0303030SU 162.5204020SU 02

2.0204020SU 03 2.5404040SU 27

4.0404040SU 292.0302030SU 05

1.5202020SU 09 3.0303030SU 32

EN 755tolerances:

EN AW 6060 (AlMgSi 0.5)material:

flat profiles

A

B

B [mm]A [mm]art. no.B [mm]A [mm]art. no.

840SFP 0581540SFP 005

830SFP 006 880SFP 060

1530SFP 067540SFP 007

1570SFP 016 1070SFP 074

3060SFP 0761040SFP 028

1030SFP 029 10090SFP 079

15120SFP 0901055SFP 037

525SFP 046 15100SFP 100

2040SFP 1061050SFP 054

100115SFP 057 25100SFP 112

EN 755tolerances:

EN AW 6060 (AlMgSi 0.5)material:

angled profile

A

B

C

C [mm]B [mm]A [mm]art. no.C [mm]B [mm]A [mm]art. no.

21015SWP 2988080SWP 02

64080SWP 06 55075SWP 36

53040SWP 4022030SWP 10

42040SWP 15 54040SWP 55

53060SWP 5721520SWP 23

53050SWP 25

EN 755tolerances:

EN AW 6060 (AlMgSi 0.5)material:

A 135

A 139Construction parts made of aluminiumA 21Hole pattern

A 10Heatsink as visual & decor-partsA 22 – 83Extruded heatsinks

A 140Special profilesA 125 – 126Mounting for TO 3 angle

A 2 – 8Technical introductionA 57 – 58High capacity heatsinks

Standard aluminium profiles

A

B

C

D

E

F

G

H

I

K

L

M

N

quadrangular profile

A

B

B [mm]A [mm]art. no.B [mm]A [mm]art. no.

5050SVP 1288SVP 01

2525SVP 04 5555SVP 13

1010SVP 10

EN 755tolerances:

EN AW 6060 (AlMgSi 0.5)material:

T-profile

A

B

C

C [mm]B [mm]A [mm]art. no.C [mm]B [mm]A [mm]art. no.

22020STP 566060STP 4

EN 755tolerances:

EN AW 6060 (AlMgSi 0.5)material:

A 136

A 139Construction parts made of aluminiumA 21Hole pattern

A 10Heatsink as visual & decor-partsA 22 – 83Extruded heatsinks

A 140Special profilesA 125 – 126Mounting for TO 3 angle

A 2 – 8Technical introductionA 57 – 58High capacity heatsinks

Standard aluminium profiles

A

B

C

D

E

F

G

H

I

K

L

M

N

Extruded heatsinks with pressed-in ﬁns

– for highest thermal dissipation losses

– channelled ﬁn geometrie for increasing the surface

– thermotechnical optimized connection between ﬁn and

bottom plate

– deliverable in widths of 200 up to 750 mm

– customer speciﬁc versions and treatments

CNC treatments of cooling proﬁles

Streamlined omnidirectional ﬁn geometrie

Heatsinks with pressed-in ﬁns

Precise milled ﬂat surfaces

Customer speciﬁed CNC treatments of cooling proﬁles

– latest CNC machining centres for highest

quality demands

– proﬁle treatments for seizes up to 1600 mm

– future orientated stockkeeping of the aluminium proﬁles

in fully automated honeycomb warehouses

– batch size optimized production ﬂow

– special proﬁles, modiﬁcations and surfaces according

to your special demand

Streamlined omnidirectional ﬁn geometrie

– free-standing cooling ﬁngers for forced cooling

– incident ﬂow of the heatsinks by means of fans from all

sides (omnidirectional)

– no direction-oriented installation position

– ﬁn spacings according to your demand

– special designs, treatments and versions according to

customer’s request

Precise milled ﬂat surfaces

– very small depth of roughness and unevenness

– individually milled ﬂat semi-conductor mounting surfaces

for minimizing the heat-transmission resistances

– millings on the already anodized heatsinks

– protective foil avoid scratching of the high-quality

mounting surface

– special designs according to customer’s drawing

Heatsinks with integrated sealing

– foamed sealing applied on the proﬁle as a permanent

element of the heatsink

– also usable for front plates or milled parts

– groove ﬁlled or stacked

– permanently elastic and CFC-free

– adaption of the sealing properties to the speciﬁc

application

Surface labelling

Additional equipments

Heatsinks with integrated sealing

19“ compliant CNC-treatment

Surface labelling

– durable and high quality labeling by means of

YAG-laser, silk screen-, pad- and digital printing

– print layout preparation by means of in-house repro

department

– precise in contrast, precise engraved fonts and contours

by means of CNC-controlled treatment systems

– labeling of aluminium, Plexiglas and plastics

Additional equipments

– fractional semi-conductor mounting surfaces made of

copper for heat dissipation

– pressed-in or screwed distance sleeves made of metal

and plastics

– threaded bolts with internal and external thread

– support rail mountings made of metal or plastics

according to DIN EN 50022

19“ compliant CNC-treatment

– milled heatsink side or back panels for 19” cases,

19” plug in boxes, subracks and insert modules

– pressing in or welding of threaded bolts

– customer speciﬁed modiﬁcations, designs

– surfaces and printing upon request

Construction- and milled parts made of aluminium

according to customer speciﬁcations

– precise milled contours and surfaces

– inserting of holes and cut-outs, cutting or milling of

threads

– turning in of wire thread inserts for high- and

wear-resistant threads

– simple data exchange by means of up to date

CAD- / CAM-systems

Welded high perfomance heatsinks

Welded heatsinks

Construction- and milled parts

Cases and contour milled parts

Welded high performance heatsinks

– optimal ﬁn geometry with channelled structure for free

convection

– production of heatsink widths outside of the

press-technical production possibilities

– removing of the welding line by means of precise milled

ﬂat surfaces

– individual surface design

Welded heatsinks

– homogeneous connection of the materials by means of

special welding methods

– welding on additional mounting levels which are situated

diagonally to the pressing direction of the proﬁles

– production of prototypes

– application-based special designs and treatments

according to your demand

Cases and contour milled parts made of aluminium

– customer speciﬁc cases and construction parts

– precise mechanical treatments for highest quality

demands

– all requested surface designs

– modiﬁcations and versions, special requirements,

treatments and designs according to your drawing

speciﬁcation

Special proﬁles

A 140

A

B

C

D

E

F

G

H

I

K

L

M

N

If required please send your request.

Whenever you cannot ﬁnd the ideal solution for your problem from the wide range of standard extrusions on offer or a solution

constitutes a compromise between the use of the space available and the weight, as long as the quantity is correct a special section

is the answer.

Released from the dimensional restrictions of the standard proﬁles, special extrusions are tailored to your design requirements, and

offer considerable beneﬁts in terms of machining time and use of space.

Furthermore your calculation will be inﬂuenced positively by the optimised material use and shorter machining times.

You can determine the combination of the desired thermal properties and the design element yourself, by the use of a special proﬁle.

We are not allowed to publish many of our customer-speciﬁc Proﬁles, because they are subject to „non disclosure agreements“.

Therefore we only show some examples for customer proﬁles in the industry.

All ﬁgures are illustrations. Changes reserved.

120

22

37.1

80

98

27.5

120

22

44.3

26.8

85

70

59

18

40

66

222.9

65.5

107

50

107

50

138

25

7.5

200

70

200

70

220.8

15

Round and pin heatsinks

Heatsinks for LEDs

Heatsinks for all transistor types

Heatsinks and coolers for processors

Heatsinks for all current PL CC, DIL-IC and SMD

transistor types

– effective heat dissipation at a low proﬁle and low weight

– direct mounting of the component by means of a

double-sided adhesive thermal foil or glue

– solderable versions of the surface

– special packaging such as tape & reel, magazine or tray

upon request

Round and pin heatsinks

– streamlined omnidirectional ﬁn geometrie

– excellent thermal conductivity due to special aluminium

alloys

– suitable for free and forced convection

– no direction bounded installation position

– ﬂat semiconductor mounting surfaces

– contour also as milled parts according to your demands

Heatsinks for LEDs

– various heatsink geometries adjusted to all current

LED-types and light-engines

– star shaped heatsinks for the use as a LED-lamp housing

– LED mounting by means of screws, thermal conductive

adhesive foil or thermal conductive glue

– customer speciﬁed versions with application based

„thermal management“

Heatsinks and coolers for processors

– passive and active product solutions

– effective heat dissipation due to optimal conception of

fan and heatsink

– long lifetime and high operating safety due to

high quality fans

– versions for screw, glue and clip mounting

– customer speciﬁc solutions and fans

suitable for processor

type

socketway of fixationdissipation

loss

[W]

Rth

[K/W]

pageart. no.

universaluniversaltherm. conductive foil/

therm. cond. adhesive

6.420B 11ICK PGA 6 x 6 x 14

universaluniversaltherm. conductive foil/

therm. cond. adhesive

8.114.8B 11ICK PGA 8 x 8 x 12

universaluniversaltherm. conductive foil/

therm. cond. adhesive

314B 11ICK PGA 9 x 9

universaluniversaltherm. conductive foil/

therm. cond. adhesive

7.516B 11ICK PGA 11 x 11 x 8

universaluniversaltherm. conductive foil/

therm. cond. adhesive

4.510.9B 11ICK PGA 11 x 11

universaluniversaltherm. conductive foil/

therm. cond. adhesive

3.912.3B 12ICK PGA 11 x 11 x 12

universaluniversaltherm. conductive foil/

therm. cond. adhesive

4.910B 12ICK PGA 14 x 14

universaluniversaltherm. conductive foil/

therm. cond. adhesive

11.210.5B 12ICK PGA 14 x 14 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

12.59.6B 12ICK PGA 14 x 14 x 14

universaluniversaltherm. conductive foil/

therm. cond. adhesive

5.39.8B 12ICK PGA 14 x 14 x 12

universaluniversaltherm. conductive foil/

therm. cond. adhesive

5.99.4B 12ICK PGA 15 x 15

universaluniversaltherm. conductive foil/

therm. cond. adhesive

4.914B 13ICK PGA 16 x 16 x 8

universaluniversaltherm. conductive foil/

therm. cond. adhesive

12.910.5B 13ICK PGA 16 x 16 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

6.29.3B 13ICK PGA 16 x 16 x 12

universaluniversaltherm. conductive foil/

therm. cond. adhesive

6.98.6B 13ICK PGA 17 x 17

universaluniversaltherm. conductive foil/

therm. cond. adhesive

5.213.2B 13ICK PGA 17 x 17 x 8

universaluniversaltherm. conductive foil/

therm. cond. adhesive

6.59B 13ICK PGA 17 x 17 x 12

universaluniversaltherm. conductive foil/

therm. cond. adhesive

7.28.4B 14ICK PGA 18 x 18

universaluniversaltherm. conductive foil/

therm. cond. adhesive

7.68.6B 14ICK PGA 19 x 19

universaluniversaltherm. conductive foil/

therm. cond. adhesive

6.99B 14ICK PGA 19 x 19 x 12

universaluniversaltherm. conductive foil/

therm. cond. adhesive

15.18.5B 14ICK PGA 20 x 20 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

8.37.6B 14ICK PGA 20 x 20

IDT W2A/

AMD®K6-III/

AMD®K6-2/

MMX/

IDT C6/

Intel®Pentium®

socket 7/

socket 370

fixing clamp8.37.6B 15ICK PGA 20 x 20 K

universaluniversaltherm. conductive foil/

therm. cond. adhesive

6.312B 15ICK PGA 20 x 20 x 8

universaluniversaltherm. conductive foil/

therm. cond. adhesive

8.18B 15ICK PGA 20 x 20 x 12

B 2

– very good thermal efficiency

– aerodynamic imnidirectional fin geometry

– simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue

– customer specified designs, surfaces and modifications upon request

Heatsinks for IC processor

A

B

C

D

E

F

G

H

I

K

L

M

N

suitable for processor

type

socketway of fixationdissipation

loss

[W]

Rth

[K/W]

pageart. no.

universaluniversaltherm. conductive foil/

therm. cond. adhesive

8.67B 15ICK PGA 21 x 21

universaluniversaltherm. conductive foil/

therm. cond. adhesive

8.96.2B 15ICK PGA 22 x 22

universaluniversaltherm. conductive foil/

therm. cond. adhesive

11.15B 16ICK PGA 25 x 25

universaluniversaltherm. conductive foil/

therm. cond. adhesive

1.830B 17ICK BGA 10 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

1.928.5B 17ICK BGA 10 x 10 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

2.130B 17ICK BGA 14 x 14

universaluniversaltherm. conductive foil/

therm. cond. adhesive

2.327.4B 17ICK BGA 14 x 14 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

2.524.3B 18ICK BGA 21 x 21

universaluniversaltherm. conductive foil/

therm. cond. adhesive

2.822.5B 18ICK BGA 23 x 23

universaluniversaltherm. conductive foil/

therm. cond. adhesive

2.921.5B 18ICK BGA 23 x 23 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

3.120B 18ICK BGA 27 x 27

universaluniversaltherm. conductive foil/

therm. cond. adhesive

3.318.5B 18ICK BGA 27 x 27 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

9.513.5B 18ICK BGA 27 x 27 x 14

universaluniversaltherm. conductive foil/

therm. cond. adhesive

9.510.5B 19ICK BGA 27 x 27 x 22

universaluniversaltherm. conductive foil/

therm. cond. adhesive

3.418.6B 19ICK BGA 31 x 31

universaluniversaltherm. conductive foil/

therm. cond. adhesive

3.717B 19ICK BGA 31 x 31 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

3.716.5B 19ICK BGA 35 x 35

universaluniversaltherm. conductive foil/

therm. cond. adhesive

3.815.7B 19ICK BGA 35 x 35 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

9.515.7B 19ICK BGA 37 x 37 x 6

universaluniversaltherm. conductive foil/

therm. cond. adhesive

10.514B 20ICK BGA 37 x 37 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

4.314.6B 20ICK BGA 40 x 40

universaluniversaltherm. conductive foil/

therm. cond. adhesive

4.413.8B 20ICK BGA 40 x 40 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

4.213.6B 20ICK BGA 42,5 x 45

universaluniversaltherm. conductive foil/

therm. cond. adhesive

2.525B 21ICK S 10 x 10 x 6,5

universaluniversaltherm. conductive foil/

therm. cond. adhesive

2.623.75B 21ICK S 10 x 10 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

2.822.5B 21ICK S 10 x 10 x 12,5

universaluniversaltherm. conductive foil/

therm. cond. adhesive

321.75B 22ICK S 10 x 10 x 18,5

B 3

– very good thermal efficiency

– aerodynamic imnidirectional fin geometry

– simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue

– customer specified designs, surfaces and modifications upon request

Heatsinks for IC processor

A

B

C

D

E

F

G

H

I

K

L

M

N

suitable for processor

type

socketway of fixationdissipation

loss

[W]

Rth

[K/W]

pageart. no.

universaluniversaltherm. conductive foil/

therm. cond. adhesive

59B 22ICK S 14 x 14 x 6,5

universaluniversaltherm. conductive foil/

therm. cond. adhesive

5.18.8B 22ICK S 14 x 14 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

5.48.1B 22ICK S 14 x 14 x 12,5

universaluniversaltherm. conductive foil/

therm. cond. adhesive

5.67.9B 22ICK S 14 x 14 x 18,5

universaluniversaltherm. conductive foil/

therm. cond. adhesive

5.958.36B 22ICK S 17 x 17 x 15

universaluniversaltherm. conductive foil/

therm. cond. adhesive

6.37.89B 23ICK S 17 x 17 x 20

universaluniversaltherm. conductive foil/

therm. cond. adhesive

7.77B 23ICK S 18 x 18 x 6,5

universaluniversaltherm. conductive foil/

therm. cond. adhesive

86.8B 23ICK S 18 x 18 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

8.55.9B 23ICK S 22 x 22 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

105B 23ICK S 22 x 22 x 18,5

universaluniversaltherm. conductive foil/

therm. cond. adhesive

12.95.8B 23ICK S 25 x 25 x 6,5

universaluniversaltherm. conductive foil/

therm. cond. adhesive

14.15.3B 24ICK S 25 x 25 x 12,5

universaluniversaltherm. conductive foil/

therm. cond. adhesive

14.45.2B 24ICK S 25 x 25 x 18,5

universaluniversaltherm. conductive foil/

therm. cond. adhesive

13.15.7B 24ICK S 29 x 29 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

20.23.7B 24ICK S 29 x 29 x 20

universaluniversaltherm. conductive foil/

therm. cond. adhesive

212.9B 24ICK S 29 x 29 x 30

universaluniversaltherm. conductive foil/

therm. cond. adhesive

13.85.4B 24ICK S 32 x 32 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

20.43.7B 25ICK S 32 x 32 x 20

universaluniversaltherm. conductive foil/

therm. cond. adhesive

164.7B 25ICK S 36 x 36 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

19.23.9B 25ICK S 36 x 36 x 15

universaluniversaltherm. conductive foil/

therm. cond. adhesive

223.2B 25ICK S 36 x 36 x 20

universaluniversaltherm. conductive foil/

therm. cond. adhesive

23.42.5B 25ICK S 36 x 36 x 30

universaluniversaltherm. conductive foil/

therm. cond. adhesive

16.34.6B 25ICK S 40 x 40 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

21.43.5B 26ICK S 40 x 40 x 20

universaluniversaltherm. conductive foil/

therm. cond. adhesive

23.73.1B 26ICK S 40 x 40 x 25

universaluniversaltherm. conductive foil/

therm. cond. adhesive

164.7B 26ICK S 45 x 45 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

174.4B 26ICK S 45 x 45 x 20

B 4

– very good thermal efficiency

– aerodynamic imnidirectional fin geometry

– simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue

– customer specified designs, surfaces and modifications upon request

Heatsinks for IC processor

A

B

C

D

E

F

G

H

I

K

L

M

N

suitable for processor

type

socketway of fixationdissipation

loss

[W]

Rth

[K/W]

pageart. no.

universaluniversaltherm. conductive foil/

therm. cond. adhesive

27.72.7B 26ICK S 50 x 50 x 20

universaluniversaltherm. conductive foil/

therm. cond. adhesive

31.22.4B 26ICK S 50 x 50 x 25

universaluniversaltherm. conductive foil/

therm. cond. adhesive

13.56.05B 27ICK S 50 x 50 x 40

universaluniversaltherm. conductive foil/

therm. cond. adhesive

14.324.05B 27ICK S 50 x 50 x 50

universaluniversaltherm. conductive foil/

therm. cond. adhesive

352.4B 27ICK S 98 x 98 x 30

universaluniversaltherm. conductive foil/

therm. cond. adhesive

423.5B 27ICK S 98 x 98 x 45

universaluniversaltherm. conductive foil/

therm. cond. adhesive

4.610.85B 28ICK S D 12 x 12 x 7,5

universaluniversaltherm. conductive foil/

therm. cond. adhesive

5.49B 28ICK S D 18 x 12 x 7,5

universaluniversaltherm. conductive foil/

therm. cond. adhesive

5.858.5B 28ICK S D 24 x 18 x 7,5

universaluniversaltherm. conductive foil/

therm. cond. adhesive

10.254.88B 28ICK S D 98 x 98 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

15.65.82B 29ICK S R 28,5 x 6,5

universaluniversaltherm. conductive foil/

therm. cond. adhesive

165.65B 29ICK S R 28,5 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

16.35.53B 29ICK S R 28,5 x 12,5

universaluniversaltherm. conductive foil/

therm. cond. adhesive

20.24.25B 29ICK S R 28,5 x 18,5

universaluniversaltherm. conductive foil/

therm. cond. adhesive

95.54B 29ICK S R 32,5 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

8.95.6B 29ICK S R 32,5 x 20

universaluniversaltherm. conductive foil/

therm. cond. adhesive

114.2B 30ICK S R 32,5 x 30

universaluniversaltherm. conductive foil/

therm. cond. adhesive

153.2B 30ICK S R 32,5 x 40

universaluniversaltherm. conductive foil/

therm. cond. adhesive

182.7B 30ICK S R 32,5 x 50

universaluniversaltherm. conductive foil/

therm. cond. adhesive

186.41B 30ICK S R 36,5 x 20

universaluniversaltherm. conductive foil/

therm. cond. adhesive

8.411.04B 30ICK S R 40 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

8.810.32B 30ICK S R 40 x 20

universaluniversaltherm. conductive foil/

therm. cond. adhesive

8.211.62B 31ICK S R A 40 x 20

universaluniversaltherm. conductive foil/

therm. cond. adhesive

169.77B 31ICK S R 40 x 30

universaluniversaltherm. conductive foil/

therm. cond. adhesive

252B 31ICK S R 40 x 50

universaluniversaltherm. conductive foil/

therm. cond. adhesive

9.28B 31ICK S R 45 x 30

universaluniversaltherm. conductive foil/

therm. cond. adhesive

9.26B 31ICK S R 45 x 45

B 5

– very good thermal efficiency

– aerodynamic imnidirectional fin geometry

– simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue

– customer specified designs, surfaces and modifications upon request

Heatsinks for IC processor

A

B

C

D

E

F

G

H

I

K

L

M

N

suitable for processor

type

socketway of fixationdissipation

loss

[W]

Rth

[K/W]

pageart. no.

universaluniversaltherm. conductive foil/

therm. cond. adhesive

9.55.28B 31ICK S R 50 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

9.88.55B 32ICK S R 50 x 20

universaluniversaltherm. conductive foil/

therm. cond. adhesive

108.26B 32ICK S R 50 x 30

universaluniversaltherm. conductive foil/

therm. cond. adhesive

12.76.32B 32ICK S R 50 x 45

universaluniversaltherm. conductive foil/

therm. cond. adhesive

10.28.11B 32ICK S R 54 x 20

universaluniversaltherm. conductive foil/

therm. cond. adhesive

11.576.95B 32ICK S R 54 x 30

universaluniversaltherm. conductive foil/

therm. cond. adhesive

15.25.37B 33ICK S R 54 x 45

universaluniversaltherm. conductive foil/

therm. cond. adhesive

271.8B 33ICK S R 70 x 30

universaluniversaltherm. conductive foil/

therm. cond. adhesive

331.5B 33ICK S R 70 x 50

universaluniversaltherm. conductive foil/

therm. cond. adhesive

252B 33ICK S R 85 x 30

universaluniversaltherm. conductive foil/

therm. cond. adhesive

271.8B 33ICK S R 85 x 45

universaluniversaltherm. conductive foil/

therm. cond. adhesive

301.65B 34ICK S R 98 x 30

universaluniversaltherm. conductive foil/

therm. cond. adhesive

351.4B 34ICK S R 98 x 50

universaluniversaltherm. conductive foil/

therm. cond. adhesive

6.518.58B 35ICK LED R 23,5 x 14

universaluniversaltherm. conductive foil/

therm. cond. adhesive

6.319.16B 35ICK LED R 23,5 x 14 G

universaluniversaltherm. conductive foil/

therm. cond. adhesive

6.717.69B 35ICK LED R 27 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

6.618.24B 35ICK LED R 27 x 10 G

universaluniversaltherm. conductive foil/

therm. cond. adhesive

7.815.24B 35ICK LED R 28 x 15

universaluniversaltherm. conductive foil/

therm. cond. adhesive

7.615.72B 36ICK LED R 28 x 15 G

universaluniversaltherm. conductive foil/

therm. cond. adhesive

8.217.26B 36ICK LED R 29 x 11,5

universaluniversaltherm. conductive foil/

therm. cond. adhesive

817.8B 36ICK LED R 29 x 11,5 G

universaluniversaltherm. conductive foil/

therm. cond. adhesive

7.815.23B 36ICK LED R 32 x 14

universaluniversaltherm. conductive foil/

therm. cond. adhesive

7.615.23B 36ICK LED R 32 x 14 G

universaluniversaltherm. conductive foil/

therm. cond. adhesive

6.817.6B 36ICK LED R 33 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

6.618.15B 36ICK LED R 33 x 10 G

universaluniversaltherm. conductive foil/

therm. cond. adhesive

8.513.87B 37ICK LED R 33 x 16,5

universaluniversaltherm. conductive foil/

therm. cond. adhesive

8.314.3B 37ICK LED R 33 x 16,5 G

B 6

– very good thermal efficiency

– aerodynamic imnidirectional fin geometry

– simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue

– customer specified designs, surfaces and modifications upon request

Heatsinks for IC processor

A

B

C

D

E

F

G

H

I

K

L

M

N

suitable for processor

type

socketway of fixationdissipation

loss

[W]

Rth

[K/W]

pageart. no.

universaluniversaltherm. conductive foil/

therm. cond. adhesive

9.3516.9B 37ICK LED R 35 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

9.217.5B 37ICK LED R 35 x 10 G

universaluniversaltherm. conductive foil/

therm. cond. adhesive

1012.88B 37ICK LED R 36 x 12

universaluniversaltherm. conductive foil/

therm. cond. adhesive

8.913.28B 37ICK LED R 36 x 12 G

universaluniversaltherm. conductive foil/

therm. cond. adhesive

9.4512.28B 37ICK LED R 40 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

9.312.66B 38ICK LED R 40 x 10 G

universaluniversaltherm. conductive foil/

therm. cond. adhesive

12.19.41B 38ICK LED R 40 x 27

universaluniversaltherm. conductive foil/

therm. cond. adhesive

11.99.71B 38ICK LED R 40 x 27 G

universaluniversaltherm. conductive foil/

therm. cond. adhesive

11.0510.46B 38ICK LED R 45,7 x 16,5

universaluniversaltherm. conductive foil/

therm. cond. adhesive

10.810.49B 38ICK LED R 45,7 x 16,5 G

universaluniversaltherm. conductive foil/

therm. cond. adhesive

10.510.57B 38ICK LED R 50 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

10.310.9B 39ICK LED R 50 x 10 G

universaluniversaltherm. conductive foil/

therm. cond. adhesive

11.110.17B 39ICK LED R 50,8 x 16,5

universaluniversaltherm. conductive foil/

therm. cond. adhesive

10.910.49B 39ICK LED R 50,8 x 16,5 G

universaluniversaltherm. conductive foil/

therm. cond. adhesive

12.19.48B 39ICK LED R 54 x 20

universaluniversaltherm. conductive foil/

therm. cond. adhesive

11.99.78B 39ICK LED R 54 x 20 G

universaluniversaltherm. conductive foil/

therm. cond. adhesive

213.2B 39ICK LED R 66 x 40

universaluniversaltherm. conductive foil/

therm. cond. adhesive

12.15.2B 40ICK LED R 75 x 10

universaluniversaltherm. conductive foil/

therm. cond. adhesive

14.52.5B 40ICK LED R 84 x 40

universaluniversaltherm. conductive foil/

therm. cond. adhesive

272B 40ICK LED R 100 x 40

universaluniversaltherm. conductive foil/

therm. cond. adhesive

421.4B 40ICK LED R 160 x 40

universaluniversaltherm. conductive foil/

therm. cond. adhesive

511B 41ICK LED R 200 x 40

B 7

– very good thermal efficiency

– aerodynamic imnidirectional fin geometry

– simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue

– customer specified designs, surfaces and modifications upon request

Heatsinks for IC processor

A

B

C

D

E

F

G

H

I

K

L

M

N

suitable for processor

type

socketway of fixationdissipation

loss

[W]

Rth

[K/W]

pageart. no.

universaluniversaltherm. conductive foil/

therm. cond. adhesive

351.4B 49LA LED 40 x 30

universaluniversaltherm. conductive foil/

therm. cond. adhesive

401.25B 49LA LED 50 x 20

universaluniversaltherm. conductive foil/

therm. cond. adhesive

500.9B 49LA LED 50 x 45

Power PCscrew fastening148.1B 56ICK PPC 51

Intel®Pentium®

III-XeonTM Slot II

Format

Slot 2screw fastening31.32B 56ICK PEN 3 XE

Intel®Pentium®

III-XeonTM Slot II

Format

Slot 2screw fastening33.61.8B 56ICK PEN 3 XE 1

Q7 Boardscrew fastening20.43.9B 56ICK EM 25

AMD®K6-III/

IDT W2A/

MMX/

IDT C6/

Intel®Pentium®/

AMD®K6-2

socket 7/

socket 370

therm. conductive foil15.14B 57ICK PEN 38 F

AMD®K6-III/

IDT W2A/

MMX/

IDT C6/

Intel®Pentium®/

AMD®K6-2

socket 7/

socket 370

therm. cond. adhesive15.14B 57ICK PEN 38 W

AMD®K6-III/

IDT W2A/

MMX/

IDT C6/

Intel®Pentium®/

AMD®K6-2

socket 7/

socket 370

therm. cond. adhesive213.5B 57ICK PEN 45 W

Intel®Pentium®PRO

socket 8therm. cond. adhesive222.7B 57ICK PRO 40 W

Intel®Pentium®III FC

PGA (Mendocino,

Coppermine)

socket 7/

socket 370

fixing clamp223.5B 57ICK PEN 3 FC

universaluniversaltherm. conductive foil22.22.3B 58LA ICK 15 x 15 F 05

universaluniversaltherm. conductive foil22.22.3B 58LA ICK 15 x 15 F 12

universaluniversaltherm. conductive foil35.81.6B 58LA ICK 17 x 17 F 12

universaluniversaltherm. conductive foil35.81.6B 58LA ICK 17 x 17 F 12 A

universaluniversaltherm. cond. adhesive35.81.6B 58LA ICK 17 x 17 W 05

universaluniversaltherm. cond. adhesive35.81.6B 58LA ICK 17 x 17 W 12

universaluniversaltherm. conductive foil41.71.5B 58LA ICK 18 x 18 F 12

universaluniversaltherm. cond. adhesive41.71.5B 58LA ICK 18 x 18 W 12

universaluniversaltherm. conductive foil46.31.4B 58LA ICK 21 x 21 F 05

universaluniversaltherm. conductive foil46.31.4B 58LA ICK 21 x 21 F 12

universaluniversaltherm. cond. adhesive46.31.4B 58LA ICK 21 x 21 W 05

universaluniversaltherm. cond. adhesive46.31.4B 58LA ICK 21 x 21 W 12

B 8

– high-quality industrial design

– compact design with high mechanical stability

– fan with doubled ball bearing axis

– optimal thermotechnical design of fan and heatsink

Fan coolers for IC processor

A

B

C

D

E

F

G

H

I

K

L

M

N

suitable for processor

type

socketway of fixationdissipation

loss

[W]

Rth

[K/W]

pageart. no.

AMD®K6-III/

IDT W2A/

Cyrix MII and similar/

MMX/

IDT C6/

Intel®Pentium®/

AMD®K6-2

socket 7/

socket 370

therm. conductive foil23.42.5B 59LA ICK PEN 8 F 05

AMD®K6-III/

IDT W2A/

Cyrix MII and similar/

MMX/

IDT C6/

Intel®Pentium®/

AMD®K6-2

socket 7/

socket 370

therm. conductive foil23.42.5B 59LA ICK PEN 8 F 12

AMD®K6-III/

IDT W2A/

Cyrix MII and similar/

MMX/

IDT C6/

Intel®Pentium®/

AMD®K6-2

socket 7/

socket 370

therm. cond. adhesive23.42.5B 59LA ICK PEN 8 W 05

AMD®K6-III/

IDT W2A/

Cyrix MII and similar/

MMX/

IDT C6/

Intel®Pentium®/

AMD®K6-2

socket 7/

socket 370

therm. cond. adhesive23.42.5B 59LA ICK PEN 8 W 12

AMD®K6-III/

IDT W2A/

Cyrix MII and similar/

MMX/

IDT C6/

Intel®Pentium®/

AMD®K6-2

socket 7/

socket 370

fixing clamp51.11.2B 59LA ICK PEN 16 K 12

AMD®K6-III/

IDT W2A/

Cyrix MII and similar/

MMX/

IDT C6/

Intel®Pentium®/

AMD®K6-2

socket 7/

socket 370

therm. cond. adhesive51.11.2B 59LA ICK PEN 16 W 12

AMD®K6-III/

IDT W2A/

Cyrix MII and similar/

MMX/

IDT C6/

Intel®Pentium®/

AMD®K6-2

socket 7/

socket 370

therm. cond. adhesive51.11.2B 59LA ICK PEN 16 W 12 A

B 9

– high-quality industrial design

– compact design with high mechanical stability

– fan with doubled ball bearing axis

– optimal thermotechnical design of fan and heatsink

Fan coolers for IC processor

A

B

C

D

E

F

G

H

I

K

L

M

N

suitable for processor

type

socketway of fixationdissipation

loss

[W]

Rth

[K/W]

pageart. no.

AMD®K6-III/

IDT W2A/

Cyrix MII and similar/

MMX/

IDT C6/

Intel®Pentium®/

AMD®K6-2

socket 7/

socket 370

therm. cond. adhesive38.61.6B 59LA ICK PEN 18 W 12

AMD®K6-III/

IDT W2A/

Cyrix MII and similar/

MMX/

IDT C6/

Intel®Pentium®/

AMD®K6-2

socket 7/

socket 370

therm. cond. adhesive53.61.1B 59LA ICK PEN 38 W 12

Intel®Pentium®PRO

socket 8therm. conductive foil600.97B 59LA ICK PRO 25 F 12

Intel®Pentium®II/

AMD®Athlon®

Slot A/

Slot 1

581.2B 60LA ICK PEN 2 K 12

Intel®Pentium®

III-XeonTM

Slot 2screw fastening61.80.8B 60LA ICK PEN 3 XE

Intel®Pentium®IV

socket 463/

socket 423

fixing clamp850.6B 60LA ICK PEN 4 1 K

B 10

– high-quality industrial design

– compact design with high mechanical stability

– fan with doubled ball bearing axis

– optimal thermotechnical design of fan and heatsink

Fan coolers for IC processor

A

B

C

D

E

F

G

H

I

K

L

M

N

–double-sided adhesive thermal conductive foil WLF ... ➔E 7

–surface: black anodised

14 14

14

2,5

v [m/s]

Rth

[K/W]

20

16

12

8

4

0

01 2 3 4 5 6

art. no.

ICK PGA 6 x 6 x 14

WLF ... 14 x 14

23 23

12,3

2,5

v [m/s]

Rth

[K/W]

15

12

9

6

3

0

0 1 2 3 4 5 6

art. no.

ICK PGA 8 x 8 x 12

WLF ... 23 x 23

Rth

[K/W]

14

12

10

8

6

4

2

0

0 1 2 3 4 5 6

v [m/s]

24,2 24,2

12,3

3,5

art. no.

ICK PGA 9 x 9

WLF ... 24 x 24

8

2,5

27,95

24,76

0123456

v [m/s]

Rth

[K/W]

20

16

12

8

4

0

art. no.

ICK PGA 11 x 11 x 8

WLF ... 24 x 27

Rth

[K/W]

14

12

10

8

6

4

2

0

v [m/s]

01 2 3 4 5 6

15,24

3,5

27,95

24,76

art. no.

ICK PGA 11 x 11

WLF ... 24 x 27

B 11

B 21 – 27Pin heatsinks for ICE 44 – 48Mounts

B 53 – 54SMD-heatsinksB 52Heatsinks for PLCC

B 11 – 16Heatsinks for PGAE 21 – 24Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Heatsinks for PGA

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth

[K/W]

14

12

10

8

6

4

2

0

v [m/s]

01 2 3 4 5 6

12,5

27,95

24,76

3,5

art. no.

ICK PGA 11 x 11 x 12

WLF ... 24 x 27

Rth

[K/W]

14

12

10

8

6

4

2

0

16,51

5

34,5

31,34

v [m/s]

01 2 3 4 5 6

art. no.

ICK PGA 14 x 14

WLF ... 31 x 34

35 35

10

0123456

2,5

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

art. no.

ICK PGA 14 x 14 x 10

WLF ... 35 x 35

35 35

14

2,5

0123456

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

art. no.

ICK PGA 14 x 14 x 14

WLF ... 35 x 35

Rth

[K/W]

14

12

10

8

6

4

2

0

36 36

12,3

v [m/s]

0123456

3,5

art. no.

ICK PGA 14 x 14 x 12

WLF ... 36 x 36

Rth

[K/W]

14

12

10

8

6

4

2

0

v [m/s]

01 2 3 4 5 6

16,51

3,5

38,1

37,92

art. no.

ICK PGA 15 x 15

WLF ... 37 x 37

B 12

B 21 – 27Pin heatsinks for ICE 44 – 48Mounts

B 53 – 54SMD-heatsinksB 52Heatsinks for PLCC

B 11 – 16Heatsinks for PGAE 21 – 24Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Heatsinks for PGA

A

B

C

D

E

F

G

H

I

K

L

M

N

40

8

3,5

40

Rth

[K/W]

14

12

10

8

6

4

2

0

v [m/s]

01 2 3 4 5 6

art. no.

ICK PGA 16 x 16 x 8

WLF ... 40 x 40

40

2,5

10

40

0123456

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

art. no.

ICK PGA 16 x 16 x 10

WLF ... 40 x 40

v [m/s]

Rth

[K/W]

14

12

10

8

6

4

2

0

0 1 2 3 4 5 6

40 40

3,5

12,3

art. no.

ICK PGA 16 x 16 x 12

WLF ... 40 x 40

v [m/s]

Rth

[K/W]

14

12

10

8

6

4

2

001 2 3 4 5 6

43,1

4

43,1

16,51

art. no.

ICK PGA 17 x 17

WLF ... 43 x 43

v [m/s]

Rth

[K/W]

14

12

10

8

6

4

2

001 2 3 4 5 6

43,1 43,1

8

3

art. no.

ICK PGA 17 x 17 x 8

WLF ... 43 x 43

v [m/s]

Rth

[K/W]

14

12

10

8

6

4

2

001 2 3 4 5 6

43,6 43,6

3,5

12,3

art. no.

ICK PGA 17 x 17 x 12

WLF ... 43 x 43

B 13

B 21 – 27Pin heatsinks for ICE 44 – 48Mounts

B 53 – 54SMD-heatsinksB 52Heatsinks for PLCC

B 11 – 16Heatsinks for PGAE 21 – 24Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Heatsinks for PGA

A

B

C

D

E

F

G

H

I

K

L

M

N

v [m/s]

Rth

[K/W]

14

12

10

8

6

4

2

0

01 2 3 4 5 6

45,7

4

45,7

16,51

art. no.

ICK PGA 18 x 18

WLF ... 45 x 45

48,3

4

48,3

16,51

v [m/s]

Rth

[K/W]

14

12

10

8

6

4

2

0

0 1 2 3 4 5 6

art. no.

ICK PGA 19 x 19

WLF ... 48 x 48

v [m/s]

Rth

[K/W]

14

12

10

8

6

4

2

0

0 1 2 3 4 5 6

47,3

3,5

47,3

12,3

art. no.

ICK PGA 19 x 19 x 12

WLF ... 47 x 47

v [m/s]

Rth

[K/W]

14

12

10

8

6

4

2

0

0 1 2 3 4 5 6

50 50

2,5

10

art. no.

ICK PGA 20 x 20 x 10

WLF ... 48 x 48

4

16,51

50,8

50,8

v [m/s]

Rth

[K/W]

14

12

10

8

6

4

2

001 2 3 4 5 6

art. no.

ICK PGA 20 x 20

WLF ... 50 x 50

B 14

B 21 – 27Pin heatsinks for ICE 44 – 48Mounts

B 53 – 54SMD-heatsinksB 52Heatsinks for PLCC

B 11 – 16Heatsinks for PGAE 21 – 24Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Heatsinks for PGA

A

B

C

D

E

F

G

H

I

K

L

M

N

v [m/s]

Rth

[K/W]

14

12

10

8

6

4

2

0

01 2 3 4 5 6

4

50,8

16,51

50,8

art. no.

ICK PGA 20 x 20 K

WLF ... 50 x 50 with fixing clamp for socket 7 and socket 370

v [m/s]

Rth

[K/W]

14

12

10

8

6

4

2

001 2 3 4 5 6

50,8

3

50,8

8

art. no.

ICK PGA 20 x 20 x 8

WLF ... 50 x 50

v [m/s]

Rth

[K/W]

14

12

10

8

6

4

2

0

01 2 3 4 5 6

51 51

3,5

12,3

art. no.

ICK PGA 20 x 20 x 12

WLF ... 50 x 50

v [m/s]

Rth

[K/W]

14

12

10

8

6

4

2

0

01 2 3 4 5 6

53,3

5

53,3

16,5

art. no.

ICK PGA 21 x 21

WLF ... 53 x 53

v [m/s]

Rth

[K/W]

14

12

10

8

6

4

2

0

01 2 3 4 5 6

4

20

54 54

art. no.

ICK PGA 22 x 22

WLF ... 54 x 54

B 15

B 21 – 27Pin heatsinks for ICE 44 – 48Mounts

B 53 – 54SMD-heatsinksB 52Heatsinks for PLCC

B 11 – 16Heatsinks for PGAE 21 – 24Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Heatsinks for PGA

A

B

C

D

E

F

G

H

I

K

L

M

N

v [m/s]

Rth

[K/W]

14

12

10

8

6

4

2

0

0 1 2 3 4 5 6

20

62,5 62,5

3,5

art. no.

ICK PGA 25 x 25

WLF ... 62 x 62

B 16

B 21 – 27Pin heatsinks for ICE 44 – 48Mounts

B 53 – 54SMD-heatsinksB 52Heatsinks for PLCC

B 11 – 16Heatsinks for PGAE 21 – 24Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Heatsinks for PGA

A

B

C

D

E

F

G

H

I

K

L

M

N

– particularly suited for Ball Grid Arrays

– heatsink dimensions match the respective BGA-type

– can be glued directly on the BGA component

–double-sided adhesive thermal conductive foil WLF ... ➔E 7

–surface: black anodised

v [m/s]

Rth

[K/W]

35

30

25

20

15

10

5

0

0 1 2 3 4 5 6

10 10

6

1,8

art. no.

ICK BGA 10 x 10

WLF ... 10 x 10

v [m/s]

Rth

[K/W]

30

24

18

12

6

0

01 2 3 4 5 6

10

1,8

10

10

art. no.

ICK BGA 10 x 10 x 10

WLF ... 10 x 10

v [m/s]

Rth

[K/W]

35

30

25

20

15

10

5

0

01 2 3 4 5 6

6

1,8

14 14

art. no.

ICK BGA 14 x 14

WLF ... 14 x 14

v [m/s]

Rth

[K/W]

30

24

18

12

6

0

01 2 3 4 5 6

14

10

1,8

14

art. no.

ICK BGA 14 x 14 x 10

WLF ... 14 x 14

B 17

E 23 – 24Thermal conductive glueE 44 – 48Mounts

A 21Hole patternB 53 – 55SMD-heatsinks

B 2 – 10Processor overviewE 5 – 15Thermally conductive foil

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Heatsinks for BGAs

A

B

C

D

E

F

G

H

I

K

L

M

N

1,8

6

21 21

v [m/s]

Rth

[K/W]

25

20

15

10

5

0

0123456

art. no.

ICK BGA 21 x 21

WLF ... 21 x 21

v [m/s]

Rth

[K/W]

25

20

15

10

5

0

0123456

23

6

1,8

23

art. no.

ICK BGA 23 x 23

WLF ... 23 x 23

v [m/s]

Rth

[K/W]

24

18

12

6

0

0 1 2 3 4 5 6

23

10

1,8

23

art. no.

ICK BGA 23 x 23 x 10

WLF ... 23 x 23

v [m/s]

Rth

[K/W]

25

20

15

10

5

0

01 2 3 4 5 6

2727

1,8

6

art. no.

ICK BGA 27 x 27

WLF ... 27 x 27

v [m/s]

Rth

[K/W]

20

16

12

8

4

0

0 1 2 3 4 5 6

2727

1,8

10

art. no.

ICK BGA 27 x 27 x 10

WLF ... 27 x 27

27

27

2,5

14

v [m/s]

Rth

[K/W]

14

12

10

8

6

4

2

0

01 2 3 4 5 6

art. no.

ICK BGA 27 x 27 x 14

WLF ... 27 x 27

B 18

E 23 – 24Thermal conductive glueE 44 – 48Mounts

A 21Hole patternB 53 – 55SMD-heatsinks

B 2 – 10Processor overviewE 5 – 15Thermally conductive foil

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Heatsinks for BGAs

A

B

C

D

E

F

G

H

I

K

L

M

N

2727

3,5

22

v [m/s]

Rth

[K/W]

14

12

10

8

6

4

2

0

01 2 3 4 5 6

art. no.

ICK BGA 27 x 27 x 22

WLF ... 27 x 27

0123456

v [m/s]

Rth

[K/W]

20

16

12

8

4

0

31

1,8

6

31

art. no.

ICK BGA 31 x 31

WLF ... 31 x 31

v [m/s]

Rth

[K/W]

20

16

12

8

4

0

0 1 2 3 4 5 6

31

1,8

10

31

art. no.

ICK BGA 31 x 31 x 10

WLF ... 31 x 31

35

35

1,8

6

v [m/s]

Rth

[K/W]

20

16

12

8

4

0

0 1 2 3 4 5 6

art. no.

ICK BGA 35 x 35

WLF ... 35 x 35

v [m/s]

Rth

[K/W]

20

16

12

8

4

0

0 1 2 3 4 5 6

1,8

10

35 35

art. no.

ICK BGA 35 x 35 x 10

WLF ... 35 x 35

1,8

6

37 37

v [m/s]

Rth

[K/W]

20

16

12

8

4

0

0 1 2 3 4 5 6

art. no.

ICK BGA 37 x 37 x 6

WLF ... 37 x 37

B 19

E 23 – 24Thermal conductive glueE 44 – 48Mounts

A 21Hole patternB 53 – 55SMD-heatsinks

B 2 – 10Processor overviewE 5 – 15Thermally conductive foil

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Heatsinks for BGAs

A

B

C

D

E

F

G

H

I

K

L

M

N

1,8

10

37 37

v [m/s]

Rth

[K/W]

14

12

10

8

6

4

2

0

01 2 3 4 5 6

art. no.

ICK BGA 37 x 37 x 10

WLF ... 37 x 37

40

1,8

40

6

v [m/s]

Rth

[K/W]

20

16

12

8

4

0

0 1 2 3 4 5 6

art. no.

ICK BGA 40 x 40

WLF ... 40 x 40

v [m/s]

Rth

[K/W]

20

16

12

8

4

0

0 1 2 3 4 5 6

1,8 10

40

40

art. no.

ICK BGA 40 x 40 x 10

WLF ... 40 x 40

v [m/s]

Rth

[K/W]

15

12

9

6

3

0

0 1 2 3 4 5 6

1,8

6

45

42,5

art. no.

ICK BGA 42,5 x 45

WLF ... 42,5 x 45

B 20

E 23 – 24Thermal conductive glueE 44 – 48Mounts

A 21Hole patternB 53 – 55SMD-heatsinks

B 2 – 10Processor overviewE 5 – 15Thermally conductive foil

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Heatsinks for BGAs

A

B

C

D

E

F

G

H

I

K

L

M

N

– arrangement and number of pins for optimum air flow

– suitable for forced and free convection

– excellent thermal conductivity by the alloy material (Al99,5; 220 W/mK) and homogeneous arrangement of materials

– constant heat dissipation in the base and the pins in the direction of heat flow

– low weight achieved by optimised geometry

– components fastened using glue, adhesive foil or clamps

– customer-specific modifications and special designs

– other pin-lengths and surfaces on request

–surface: Al-natural

10 10

6,5

2

Rth

[K/W]

v [m/s]

30

25

20

15

10

5

0 1 2 3 4 5

art. no.

ICK S 10 x 10 x 6,5

WLF ... 10 x 10

weight: 1g

10 10

10

2

Rth

[K/W]

v [m/s]

30

25

20

15

10

5

012345

art. no.

ICK S 10 x 10 x 10

WLF ... 10 x 10

weight: 1g

10 10

12,5

2

Rth

[K/W]

v [m/s]

30

25

20

15

10

5

012345

art. no.

ICK S 10 x 10 x 12,5

WLF ... 10 x 10

weight: 1.3g

B 21

E 21 – 22Thermal conductive pasteB 2 – 10Processor overview

E 23 – 24Thermal conductive glueE 44 – 48Mounts

B 35 – 48Heatsinks for LEDsB 53 – 55SMD-heatsinks

A 2 – 8Technical introductionE 5 – 15Thermally conductive foil

Pin heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

10 10

18,5

2

Rth

[K/W]

v [m/s]

30

25

20

15

10

5

012345

art. no.

ICK S 10 x 10 x 18,5

WLF ... 10 x 10

weight: 1.3g

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

012345

6,5

2

14 14

art. no.

ICK S 14 x 14 x 6,5

WLF ... 14 x 14

weight: 1.5g

14 14

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

012345

10

2

art. no.

ICK S 14 x 14 x 10

WLF ... 14 x 14

weight: 1.9g

14 14

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

012345

12,5

2

art. no.

ICK S 14 x 14 x 12,5

WLF ... 14 x 14

weight: 2g

14 14

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

012345

18,5

2

art. no.

ICK S 14 x 14 x 18,5

WLF ... 14 x 14

weight: 2.4g

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

012345

3,5

15

17,317,3

art. no.

ICK S 17 x 17 x 15

WLF ... 17 x 17

weight: 4.7g

B 22

E 21 – 22Thermal conductive pasteB 2 – 10Processor overview

E 23 – 24Thermal conductive glueE 44 – 48Mounts

B 35 – 48Heatsinks for LEDsB 53 – 55SMD-heatsinks

A 2 – 8Technical introductionE 5 – 15Thermally conductive foil

Pin heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

0 1 2 3 4 5

3,5

20

17,317,3

art. no.

ICK S 17 x 17 x 20

WLF ... 17 x 17

weight: 5.6g

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

012345

6,5

2

18 18

art. no.

ICK S 18 x 18 x 6,5

WLF ... 18 x 18

weight: 2.5g

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

012345

10

2

1818

art. no.

ICK S 18 x 18 x 10

WLF ... 18 x 18

weight: 3.1g

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

012345

10

2

2222

art. no.

ICK S 22 x 22 x 10

WLF ... 22 x 22

weight: 4g

v [m/s]

Rth

[K/W]

18,5

2

2222

6

5

4

3

2

1

0 1 2 3 4 5

art. no.

ICK S 22 x 22 x 18,5

WLF ... 22 x 22

weight: 5.4g

25 25

6,5

2

Rth

[K/W]

v [m/s]

6

5

4

3

2

1

012345

art. no.

ICK S 25 x 25 x 6,5

WLF ... 25 x 25

weight: 4g

B 23

E 21 – 22Thermal conductive pasteB 2 – 10Processor overview

E 23 – 24Thermal conductive glueE 44 – 48Mounts

B 35 – 48Heatsinks for LEDsB 53 – 55SMD-heatsinks

A 2 – 8Technical introductionE 5 – 15Thermally conductive foil

Pin heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

25 25

12,5

2

Rth

[K/W]

v [m/s]

6

5

4

3

2

1

012345

art. no.

ICK S 25 x 25 x 12,5

WLF ... 25 x 25

weight: 6g

Rth

[K/W]

v [m/s]

6

5

4

3

2

1

012345

25 25

2

18,5

art. no.

ICK S 25 x 25 x 18,5

WLF ... 25 x 25

weight: 7g

3,5

10

29 29

Rth

[K/W]

v [m/s]

6

5

4

3

2

1

012345

art. no.

ICK S 29 x 29 x 10

WLF ... 29 x 29

weight: 11g

Rth

[K/W]

v [m/s]

6

5

4

3

2

1

012345

3,5

20

29 29

art. no.

ICK S 29 x 29 x 20

WLF ... 29 x 29

weight: 15g

Rth

[K/W]

v [m/s]

6

5

4

3

2

1

012345

3,5

30

29 29

art. no.

ICK S 29 x 29 x 30

WLF ... 29 x 29

weight: 15.4g

10

3,5

32,7 32,7

Rth

[K/W]

v [m/s]

6

5

4

3

2

1

012345

art. no.

ICK S 32 x 32 x 10

WLF ... 32 x 32

weight: 14g

B 24

E 21 – 22Thermal conductive pasteB 2 – 10Processor overview

E 23 – 24Thermal conductive glueE 44 – 48Mounts

B 35 – 48Heatsinks for LEDsB 53 – 55SMD-heatsinks

A 2 – 8Technical introductionE 5 – 15Thermally conductive foil

Pin heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth

[K/W]

v [m/s]

6

5

4

3

2

1

012345

32,7 32,7

20

3,5

art. no.

ICK S 32 x 32 x 20

WLF ... 32 x 32

weight: 19g

10

3,5

36,4 36,4

Rth

[K/W]

v [m/s]

6

5

4

3

2

1

012345

art. no.

ICK S 36 x 36 x 10

WLF ... 36 x 36

weight: 17g

15

3,5

36,4 36,4

Rth

[K/W]

v [m/s]

6

5

4

3

2

1

012345

art. no.

ICK S 36 x 36 x 15

WLF ... 36 x 36

weight: 20g

Rth

[K/W]

v [m/s]

6

5

4

3

2

1

012345

36,4 36,4

20

3,5

art. no.

ICK S 36 x 36 x 20

WLF ... 36 x 36

weight: 24g

Rth

[K/W]

v [m/s]

6

5

4

3

2

1

012345

36,4 36,4

30

3,5

art. no.

ICK S 36 x 36 x 30

WLF ... 36 x 36

weight: 24.4g

10

3,5

40

40

Rth

[K/W]

v [m/s]

6

5

4

3

2

1

012345

art. no.

ICK S 40 x 40 x 10

WLF ... 40 x 40

weight: 21g

B 25

E 21 – 22Thermal conductive pasteB 2 – 10Processor overview

E 23 – 24Thermal conductive glueE 44 – 48Mounts

B 35 – 48Heatsinks for LEDsB 53 – 55SMD-heatsinks

A 2 – 8Technical introductionE 5 – 15Thermally conductive foil

Pin heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth

[K/W]

v [m/s]

6

5

4

3

2

1

012345

20

3,5

40

40

art. no.

ICK S 40 x 40 x 20

WLF ... 40 x 40

weight: 29g

Rth

[K/W]

v [m/s]

6

5

4

3

2

1

012345

25

3,5

40

40

art. no.

ICK S 40 x 40 x 25

WLF ... 40 x 40

weight: 37g

3,5

10

45 45

Rth

[K/W]

v [m/s]

6

5

4

3

2

1

012345

art. no.

ICK S 45 x 45 x 10

WLF ... 45 x 45

weight: 26g

Rth

[K/W]

v [m/s]

6

5

4

3

2

1

012345

45 45

3,5

20

art. no.

ICK S 45 x 45 x 20

WLF ... 45 x 45

weight: 36g

50 50

3,5

20

Rth

[K/W]

v [m/s]

6

5

4

3

2

1

012345

art. no.

ICK S 50 x 50 x 20

WLF ... 50 x 50

weight: 43g

Rth

[K/W]

v [m/s]

6

5

4

3

2

1

012345

25

3,5

50

50

art. no.

ICK S 50 x 50 x 25

WLF ... 50 x 50

weight: 49g

B 26

E 21 – 22Thermal conductive pasteB 2 – 10Processor overview

E 23 – 24Thermal conductive glueE 44 – 48Mounts

B 35 – 48Heatsinks for LEDsB 53 – 55SMD-heatsinks

A 2 – 8Technical introductionE 5 – 15Thermally conductive foil

Pin heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Rth

[K/W]

v [m/s]

6

5

4

3

2

1

012345

40

3,5

50

50

art. no.

ICK S 50 x 50 x 40

WLF ... 50 x 50

weight: 80.05g

Rth

[K/W]

v [m/s]

012345

50

3,5

50

50

6

5

4

3

2

1

art. no.

ICK S 50 x 50 x 50

WLF ... 50 x 50

weight: 95.51g

v [m/s]

Rth

[K/W]

6

5

4

3

2

1

0

012345

98

5

30

98

art. no.

ICK S 98 x 98 x 30

WLF ... 98 x 98

weight: nullg

v [m/s]

Rth

[K/W]

6

5

4

3

2

1

0

012345

98

5

45

98

art. no.

ICK S 98 x 98 x 45

WLF ... 98 x 98

weight: 301.3g

B 27

E 21 – 22Thermal conductive pasteB 2 – 10Processor overview

E 23 – 24Thermal conductive glueE 44 – 48Mounts

B 35 – 48Heatsinks for LEDsB 53 – 55SMD-heatsinks

A 2 – 8Technical introductionE 5 – 15Thermally conductive foil

Pin heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Dome

12

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

012345

12

7,5

2,5

art. no.

ICK S D 12 x 12 x 7,5

WLF ... 12 x 12

weight: 1.8g

7,5

2,5

12

18

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

012345

art. no.

ICK S D 18 x 12 x 7,5

WLF ... 12 x 18

weight: 2.7g

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

0 1 2 3 4 5

7,5

2,5

24

18

art. no.

ICK S D 24 x 18 x 7,5

WLF ... 18 x 24

weight: 4.4g

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

012345

10

5

9898

art. no.

ICK S D 98 x 98 x 10

WLF ... 98 x 98

weight: 154g

B 28

E 21 – 22Thermal conductive pasteB 2 – 10Processor overview

E 23 – 24Thermal conductive glueE 44 – 48Mounts

B 35 – 48Heatsinks for LEDsB 53 – 55SMD-heatsinks

A 2 – 8Technical introductionE 5 – 15Thermally conductive foil

Pin heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Round

v [m/s]

Rth

[K/W]

6

5

4

3

2

1

0

012345

Ø 28,5

2

6,5

art. no.

ICK S R 28,5 x 6,5

WLF ... D 28,5

weight: 4.41g

v [m/s]

Rth

[K/W]

6

5

4

3

2

1

0

012345

Ø 28,5

2

10

art. no.

ICK S R 28,5 x 10

WLF ... D 28,5

weight: 5.16g

v [m/s]

Rth

[K/W]

6

5

4

3

2

1

0

012345

Ø 28,5

2

12,5

art. no.

ICK S R 28,5 x 12,5

WLF ... D 28,5

weight: 5.7g

v [m/s]

Rth

[K/W]

6

5

4

3

2

1

0

012345

Ø 28,5

2

18,5

art. no.

ICK S R 28,5 x 18,5

WLF ... D 28,5

weight: 6.98g

Ø 32,5

3

10

v [m/s]

Rth

[K/W]

6

5

4

3

2

1

0

012345

art. no.

ICK S R 32,5 x 10

WLF ... D 32

weight: 9.7g

v [m/s]

Rth

[K/W]

6

5

4

3

2

1

0

012345

Ø 32,5

3

20

art. no.

ICK S R 32,5 x 20

WLF ... D 32

weight: 13.8g

B 29

E 44 – 48Mounting material for semiconduct.E 23 – 24Thermal conductive glue

E 5 – 15Thermally conductive foilE 21 – 22Thermal conductive paste

B 35 – 51Heatsinks for LEDsB 53 – 55SMD-heatsinks

A 2 – 8Technical introductionB 2 – 8Processor overview

Pin heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

v [m/s]

Rth

[K/W]

6

5

4

3

2

1

0

012345

Ø 32,5

3,5

30

art. no.

ICK S R 32,5 x 30

WLF ... D 32

weight: 20.6g

v [m/s]

Rth

[K/W]

6

5

4

3

2

1

0

012345

Ø 32,5

3,5

40

art. no.

ICK S R 32,5 x 40

WLF ... D 32

weight: 24.61g

v [m/s]

Rth

[K/W]

6

5

4

3

2

1

0

012345

Ø 32,5

3,5

50

art. no.

ICK S R 32,5 x 50

WLF ... D 32

weight: 28.62g

v [m/s]

Rth

[K/W]

7

6

5

4

3

2

1

012345

Ø 36,5

3,5

20

art. no.

ICK S R 36,5 x 20

WLF ... D 36,5

weight: 17.59g

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

012345

Ø 40

3,5

10

art. no.

ICK S R 40 x 10

WLF ... D 40

weight: 15.85g

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

012345

Ø 40

3,5

20

art. no.

ICK S R 40 x 20

WLF ... D 40

weight: 21.96g

B 30

E 44 – 48Mounting material for semiconduct.E 23 – 24Thermal conductive glue

E 5 – 15Thermally conductive foilE 21 – 22Thermal conductive paste

B 35 – 51Heatsinks for LEDsB 53 – 55SMD-heatsinks

A 2 – 8Technical introductionB 2 – 8Processor overview

Pin heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

012345

Ø 40

20

3,5

art. no.

ICK S R A 40 x 20

WLF ... D 40

weight: 22.18g

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

012345

Ø 40

30

3,5

art. no.

ICK S R 40 x 30

WLF ... D 40

weight: 29.24g

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

012345

Ø 40

50

3,5

art. no.

ICK S R 40 x 50

WLF ... D 40

weight: 47.96g

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

012345

Ø 45

30

3,5

art. no.

ICK S R 45 x 30

WLF ... D 45

weight: 37.78g

v [m/s]

Rth

[K/W]

8

7

6

5

4

3

2

1

0012345

Ø 45

45

3,5

art. no.

ICK S R 45 x 45

WLF ... D 45

weight: 50.67g

v [m/s]

Rth

[K/W]

6

5

4

3

2

1

0

012345

Ø 50

3

10

art. no.

ICK S R 50 x 10

WLF ... D 50

weight: 22g

B 31

E 44 – 48Mounting material for semiconduct.E 23 – 24Thermal conductive glue

E 5 – 15Thermally conductive foilE 21 – 22Thermal conductive paste

B 35 – 51Heatsinks for LEDsB 53 – 55SMD-heatsinks

A 2 – 8Technical introductionB 2 – 8Processor overview

Pin heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

v [m/s]

Rth

[K/W]

9

8

6

5

4

3

2

1

0012345

Ø 50

3,5

20

art. no.

ICK S R 50 x 20

WLF ... D 50

weight: 34.39g

v [m/s]

Rth

[K/W]

9

8

6

5

4

3

2

1

0012345

Ø 50

3,5

30

art. no.

ICK S R 50 x 30

WLF ... D 50

weight: 45.28g

v [m/s]

Rth

[K/W]

8

7

6

5

4

3

2

1

0012345

Ø 50

3,5

45

art. no.

ICK S R 50 x 45

WLF ... D 50

weight: 61.59g

v [m/s]

Rth

[K/W]

8

7

6

5

4

3

2

1

0012345

Ø 54

20

3,5

art. no.

ICK S R 54 x 20

WLF ... D 54

weight: 40.94g

v [m/s]

Rth

[K/W]

8

7

6

5

4

3

2

1

0012345

Ø 54

30

3,5

art. no.

ICK S R 54 x 30

WLF ... D 54

weight: 54.11g

B 32

E 44 – 48Mounting material for semiconduct.E 23 – 24Thermal conductive glue

E 5 – 15Thermally conductive foilE 21 – 22Thermal conductive paste

B 35 – 51Heatsinks for LEDsB 53 – 55SMD-heatsinks

A 2 – 8Technical introductionB 2 – 8Processor overview

Pin heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

v [m/s]

Rth

[K/W]

6

5

4

3

2

1

0

012345

Ø 54

45

3,5

art. no.

ICK S R 54 x 45

WLF ... D 54

weight: 73.86g

Ø 70

30

5

v [m/s]

Rth

[K/W]

6

5

4

3

2

1

0

012345

art. no.

ICK S R 70 x 30

WLF ... D 70

weight: 92.8g

Ø 70

50

5

v [m/s]

Rth

[K/W]

6

5

4

3

2

1

0

012345

art. no.

ICK S R 70 x 50

WLF ... D 70

weight: 135.56g

Ø 85

30

5

v [m/s]

Rth

[K/W]

6

5

4

3

2

1

0

012345

art. no.

ICK S R 85 x 30

WLF ... D 85

weight: nullg

v [m/s]

Rth

[K/W]

6

5

4

3

2

1

0

012345

Ø 85

45

5

art. no.

ICK S R 85 x 45

WLF ... D 85

weight: nullg

B 33

E 44 – 48Mounting material for semiconduct.E 23 – 24Thermal conductive glue

E 5 – 15Thermally conductive foilE 21 – 22Thermal conductive paste

B 35 – 51Heatsinks for LEDsB 53 – 55SMD-heatsinks

A 2 – 8Technical introductionB 2 – 8Processor overview

Pin heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Ø 98

30

5

v [m/s]

Rth

[K/W]

6

5

4

3

2

1

0

012345

art. no.

ICK S R 98 x 30

WLF ... D 98

weight: nullg

Ø 98

50

5

v [m/s]

Rth

[K/W]

6

5

4

3

2

1

0

012345

art. no.

ICK S R 98 x 50

WLF ... D 98

weight: 194.23g

B 34

E 44 – 48Mounting material for semiconduct.E 23 – 24Thermal conductive glue

E 5 – 15Thermally conductive foilE 21 – 22Thermal conductive paste

B 35 – 51Heatsinks for LEDsB 53 – 55SMD-heatsinks

A 2 – 8Technical introductionB 2 – 8Processor overview

Pin heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

– suitable for free or forced convection

– heat sink dimensions are fitted to the respective LED typ

– simple mounting by using thermally conductive adhesive foil, glue or screw mounting

– specific versions on customer´s request

–double-sided adhesive thermal conductive foil WLF ... ➔E 7

– special design, surfaces and modification to customer specification on request

–surface: black anodised

Ø 23,5

14

2,5

Rth = 18,58 K/W

art. no.

ICK LED R 23,5 x 14

WLF ... D 23

Ø 23,5

14

2,5

v [m/s]

Rth

[K/W]

20

16

12

8

4

0

0 1 2 3 4 5 6

art. no.

ICK LED R 23,5 x 14 G

WLF ... D 23

Ø 27

10

3

Rth = 17,69 K/W

art. no.

ICK LED R 27 x 10

WLF ... D 27

10

3

Ø 27

v [m/s]

Rth

[K/W]

20

16

12

8

4

0

0 1 2 3 4 5 6

art. no.

ICK LED R 27 x 10 G

WLF ... D 27

15,24

3,5

Ø 27,95 Rth = 15,24 K/W

art. no.

ICK LED R 28 x 15

WLF ... D 28

B 35

E 23 – 24Thermal conductive glueB 29 – 33Pin heatsinks Ø

A 21Hole patternE 44 – 48Mounts

A 13 – 17Heatsink profile-overviewE 5 – 15Thermally conductive foil

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Heatsinks for LEDs

A

B

C

D

E

F

G

H

I

K

L

M

N

15,24

3,5

Ø 27,95

v [m/s]

Rth

[K/W]

20

16

12

8

4

0

01 2 3 4 5 6

art. no.

ICK LED R 28 x 15 G

WLF ... D 28

11,5

3,5

Ø 29 Rth = 17,26 K/W

art. no.

ICK LED R 29 x 11,5

WLF ... D 29

v [m/s]

Rth

[K/W]

20

16

12

8

4

0

0 1 2 3 4 5 6

11,5

3,5

Ø 29

art. no.

ICK LED R 29 x 11,5 G

WLF ... D 29

14

2,5

Ø 32 Rth = 15,23 K/W

art. no.

ICK LED R 32 x 14

WLF ... D 32

v [m/s]

Rth

[K/W]

20

16

12

8

4

0

0 1 2 3 4 5 6

14

2,5

Ø 32

art. no.

ICK LED R 32 x 14 G

WLF ... D 32

10

3

Ø 33 Rth = 17,6 K/W

art. no.

ICK LED R 33 x 10

WLF ... D 33

10

3

Ø 33

v [m/s]

Rth

[K/W]

20

16

12

8

4

0

0 1 2 3 4 5 6

art. no.

ICK LED R 33 x 10 G

WLF ... D 33

B 36

E 23 – 24Thermal conductive glueB 29 – 33Pin heatsinks Ø

A 21Hole patternE 44 – 48Mounts

A 13 – 17Heatsink profile-overviewE 5 – 15Thermally conductive foil

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Heatsinks for LEDs

A

B

C

D

E

F

G

H

I

K

L

M

N

16,5

3,5

Ø 33 Rth = 13,87 K/W

art. no.

ICK LED R 33 x 16,5

WLF ... D 33

v [m/s]

Rth

[K/W]

20

16

12

8

4

0

01 2 3 4 5 6

16,5

3,5

Ø 33

art. no.

ICK LED R 33 x 16,5 G

WLF ... D 33

10

2,5

Ø 35 Rth = 16,9 K/W

art. no.

ICK LED R 35 x 10

WLF ... D 35

10

2,5

Ø 35

v [m/s]

Rth

[K/W]

20

16

12

8

4

0

01 2 3 4 5 6

art. no.

ICK LED R 35 x 10 G

WLF ... D 35

12,3

3,5

Ø 36 Rth = 12,88 K/W

art. no.

ICK LED R 36 x 12

WLF ... D 36

12,3

3,5

Ø 36

v [m/s]

Rth

[K/W]

20

16

12

8

4

0

01 2 3 4 5 6

art. no.

ICK LED R 36 x 12 G

WLF ... D 36

10

2,5

Ø 40 Rth = 12,28 K/W

art. no.

ICK LED R 40 x 10

WLF ... D 40

B 37

E 23 – 24Thermal conductive glueB 29 – 33Pin heatsinks Ø

A 21Hole patternE 44 – 48Mounts

A 13 – 17Heatsink profile-overviewE 5 – 15Thermally conductive foil

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Heatsinks for LEDs

A

B

C

D

E

F

G

H

I

K

L

M

N

10

2,5

Ø 40

v [m/s]

Rth

[K/W]

20

16

12

8

4

0

01 2 3 4 5 6

art. no.

ICK LED R 40 x 10 G

WLF ... D 40

27

5

Ø 40 Rth = 9,41 K/W

art. no.

ICK LED R 40 x 27

WLF ... D 40

27

5

Ø 40

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

001 2 3 4 5 6

art. no.

ICK LED R 40 x 27 G

WLF ... D 40

16,51

4

Ø 45,7 Rth = 10,46 K/W

art. no.

ICK LED R 45,7 x 16,5

WLF ... D 45

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

001 2 3 4 5 6

16,51

4

Ø 45,7

art. no.

ICK LED R 45,7 x 16,5 G

WLF ... D 45

10

2,5

Ø 50

Rth = 10,57 K/W

art. no.

ICK LED R 50 x 10

WLF ... D 50

B 38

E 23 – 24Thermal conductive glueB 29 – 33Pin heatsinks Ø

A 21Hole patternE 44 – 48Mounts

A 13 – 17Heatsink profile-overviewE 5 – 15Thermally conductive foil

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Heatsinks for LEDs

A

B

C

D

E

F

G

H

I

K

L

M

N

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

01 2 3 4 5 6

10

2,5

Ø 50

art. no.

ICK LED R 50 x 10 G

WLF ... D 50

16,51

4

Ø 50,8

Rth = 10,17 K/W

art. no.

ICK LED R 50,8 x 16,5

WLF ... D 50

4

Ø 50,8

16,51

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

001 2 3 4 5 6

art. no.

ICK LED R 50,8 x 16,5 G

WLF ... D 50

20

4

Ø 54

Rth = 9,48 K/W

art. no.

ICK LED R 54 x 20

WLF ... D 54

v [m/s]

Rth

[K/W]

12

10

8

6

4

2

0

20

4

Ø 54

0123456

art. no.

ICK LED R 54 x 20 G

WLF ... D 54

40

10

Ø 66 Rth = 3,2 K/W

art. no.

ICK LED R 66 x 40

WLF ... D 66

B 39

E 23 – 24Thermal conductive glueB 29 – 33Pin heatsinks Ø

A 21Hole patternE 44 – 48Mounts

A 13 – 17Heatsink profile-overviewE 5 – 15Thermally conductive foil

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Heatsinks for LEDs

A

B

C

D

E

F

G

H

I

K

L

M

N

2,5

10

Ø 75

Rth = 5,2 K/W

art. no.

ICK LED R 75 x 10

WLF ... D 75

Rth = 2,5 K/W

40

10

Ø 84

art. no.

ICK LED R 84 x 40

WLF ... D 84

Rth = 2 K/W

40

10

Ø 100

art. no.

ICK LED R 100 x 40

WLF ... D 100

10

40

Ø 160

Rth = 1,4 K/W

art. no.

ICK LED R 160 x 40

WLF ... D 160

B 40

E 23 – 24Thermal conductive glueB 29 – 33Pin heatsinks Ø

A 21Hole patternE 44 – 48Mounts

A 13 – 17Heatsink profile-overviewE 5 – 15Thermally conductive foil

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Heatsinks for LEDs

A

B

C

D

E

F

G

H

I

K

L

M

N

Ø 200

40

Rth = 1 K/W

10

art. no.

ICK LED R 200 x 40

WLF ... D 200

B 41

E 23 – 24Thermal conductive glueB 29 – 33Pin heatsinks Ø

A 21Hole patternE 44 – 48Mounts

A 13 – 17Heatsink profile-overviewE 5 – 15Thermally conductive foil

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Heatsinks for LEDs

A

B

C

D

E

F

G

H

I

K

L

M

N

– special design, surfaces and modification to customer specification on request

–up from a profile length of 25 mm: optional adapter plate LA LED 68 ... ➔B 50 suitable for LED modules:

Bridgelux Vero, Citizen CitiLED, Cree XLamp, Edison Edilex, GE Infusion, Luga Shop und Industrial, Lustrous Lustron, Megaman Teco,

Osram PrevaLED und Soleriq, Philips Fortimo und Luxeon, Prolight Opto, Sharp Mega Zenigata, Toshiba E-Core, Tridonic Stark, Vexica

Lumaera, Vossloh Schwabe

50 100 150 200 [mm]

1,5

3,0

4,5

6,0

7,5

Ø

20

Rth [K/W]

Ø12

Ø

13,6

art. no.

SK 585 ...

Ø 30

Ø 18

50 100 150 200 [mm]

1,5

3,0

4,5

6,0

7,5

Rth [K/W]

art. no.

SK 620 ...

6,75

Ø 45

Ø 25

50 100 150 200 [mm]

1

2

3

4

5

Rth [K/W]

art. no.

SK 618 ...

...

10 15 20 25 37.5 50 1000 mm

please indicate:

black anodisedsurface:

Ø 46

Ø 30

50 100 150 200 [mm]

1

2

3

4

5

Rth [K/W]

art. no.

SK 619 ...

50 100 150 200 [mm]

1

2

3

4

5

Rth

5,73

Ø 46

Ø 30

[K/W]

art. no.

SK 598 ...

... adapter (optional)...

10 15 20 25 37.5 50 1000 mm

please indicate:

adapter plate=AD

black anodisedsurface:

B 42

E 44 – 48MountsB 29 – 33Pin heatsinks Ø

E 5 – 15Thermally conductive foilA 21Hole pattern

E 23 – 24Thermal conductive glueA 137 – 138Special heatsink design

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Heatsinks for LEDs

A

B

C

D

E

F

G

H

I

K

L

M

N

Ø 50

Ø 30

6,5 50 100 150 200 [mm]

1

2

3

4

5

Rth [K/W]

art. no.

SK 602 ...

50 100 150 200 [mm]

0,5

1,0

1,5

2,0

2,5

Rth

6,76

Ø 50

Ø 30

[K/W]

art. no.

SK 577 ...

50 100 150 200 [mm]

0,5

1,0

1,5

2,0

2,5

51,5

51

Ø 26

Rth [K/W]

art. no.

SK 46 ...

50 100 150 200 [mm]

0,5

1,0

1,5

2,0

2,5

5,73

Ø 60

Ø 30

Rth [K/W]

art. no.

SK 578 ...

50 100 150 200 [mm]

0,5

1,0

1,5

2,0

2,5

8,1

Ø 60

Ø 40

Rth [K/W]

art. no.

SK 569 ...

... adapter (optional)...

10 15 20 25 37.5 50 1000 mm

please indicate:

adapter plate=AD

black anodisedsurface:

B 43

E 44 – 48MountsB 29 – 33Pin heatsinks Ø

E 5 – 15Thermally conductive foilA 21Hole pattern

E 23 – 24Thermal conductive glueA 137 – 138Special heatsink design

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Heatsinks for LEDs

A

B

C

D

E

F

G

H

I

K

L

M

N

50 100 150 200 [mm]

0,5

1,0

1,5

2,0

2,5

9,1

Ø 70

Ø 50

Rth [K/W]

art. no.

SK 570 ...

50 100 150 200 [mm]

0,5

1,0

1,5

2,0

2,5

Ø 70

Ø 35

Rth [K/W]

art. no.

SK 571 ...

50 100 150 200 [mm]

0,5

1,0

1,5

2,0

2,5

Ø 85

Ø 50

Rth [K/W]

art. no.

SK 572 ...

... adapter (optional)...

10 15 20 25 37.5 50 1000 mm

please indicate:

adapter plate=AD

black anodisedsurface:

50 100 150 200 [mm]

0,5

1,0

1,5

2,0

2,5

Ø 105

Ø 70

Rth [K/W]

art. no.

SK 584 ...

...

10 15 20 25 37.5 50 1000 mm

please indicate:

black anodisedsurface:

B 44

E 44 – 48MountsB 29 – 33Pin heatsinks Ø

E 5 – 15Thermally conductive foilA 21Hole pattern

E 23 – 24Thermal conductive glueA 137 – 138Special heatsink design

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Heatsinks for LEDs

A

B

C

D

E

F

G

H

I

K

L

M

N

50 100 150 200 [mm]

0,5

1,0

1,5

2,0

2,5

Ø 120

Ø 60

Rth [K/W]

art. no.

SK 615 ...

50 100 150 200 [mm]

0,5

1,0

1,5

2,0

2,5

Ø 120

Ø 65

Rth

10

[K/W]

art. no.

SK 599 ...

50 100 150 200 [mm]

0,5

1,0

1,5

2,0

2,5

Ø 145

Ø 85

Rth [K/W]

art. no.

SK 592 ...

...

10 15 20 25 37.5 50 75 100 150 1000 mm

please indicate:

black anodisedsurface:

B 45

E 44 – 48MountsB 29 – 33Pin heatsinks Ø

E 5 – 15Thermally conductive foilA 21Hole pattern

E 23 – 24Thermal conductive glueA 137 – 138Special heatsink design

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Heatsinks for LEDs

A

B

C

D

E

F

G

H

I

K

L

M

N

50 100 150 200 [mm]

0,5

1,0

1,5

2,0

2,5

Ø 178

Ø 80

Rth [K/W]

art. no.

SK 590 ...

...

10 15 20 25 37.5 50 75 100 150 1000 mm

please indicate:

black anodisedsurface:

B 46

E 44 – 48MountsB 29 – 33Pin heatsinks Ø

E 5 – 15Thermally conductive foilA 21Hole pattern

E 23 – 24Thermal conductive glueA 137 – 138Special heatsink design

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Heatsinks for LEDs

A

B

C

D

E

F

G

H

I

K

L

M

N

– individual LED heatsinks acc. to customer’s requests

– adaptable to all common LED modules and sizes

– integration possibility of reflectors or fans by using special sheet metal design

– entry core for heat dissipation made of copper upon request

– other dimensions, sheet metal geometries, surfaces and mechanical machinings upon request

D

Ø B

Ø A

Ø C

F

G

H

KTE R

possible dimensions:

dim. [mm]

A

B + 20 to 200

B

35

40

55

80

90

100

C

30

35

50

75

85

95

D

0.8

1

1.5

2

E

32

36

50

72

84

92

F

max. 400

E max. number of grooves at D = 0.8 mm

G H

max. 800 max. 200

please indicate with your order:

dim. [mm]

A B C D E F G H

material: aluminium

please indicate: ... surface

SA = black anodised

ME = clear anodised

B 47

E 44 – 48MountsB 29 – 33Pin heatsinks Ø

E 5 – 15Thermally conductive foilA 21Hole pattern

B 2 – 10Processor overviewA 137 – 138Special heatsink design

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

LED fin cooler KTE R customised

A

B

C

D

E

F

G

H

I

K

L

M

N

– heatsink specially made for flexible and fixed LED Line Modules

– insertion possibility of metal sheets and sheets of Plexiglas

– customer specified designs, lengths and treatments upon request

24,8

20,8

18,4

16

2,2

5

1,8

2

7

18

36

17

8,7

1,2

50 100 150 200 [mm]

4

6

8

10

Rth [K/W]

art. no.

SK LED 1

33,2

30,8

34,4

10,6

26,2

53,9

30°

17,8

32,2

35,6

50 100 150 200 [mm]

2

4

6

8

Rth [K/W]

art. no.

SK LED 2

41,8

39,4

37

57,2

42,55

1,2

15,5

1,8

12,2

5,6

2,3

9,4

19,2

39

40

2,2

50 100 150 200 [mm]

2

3

4

5

Rth [K/W]

art. no.

SK LED 3

... surface...

50 75 100 150 1000 mm

please indicate:

black anodised=SA

clear anodised=ME

B 48

E 44 – 48MountsB 29 – 33Pin heatsinks Ø

E 5 – 15Thermally conductive foilA 21Hole pattern

B 2 – 10Processor overviewA 137 – 138Special heatsink design

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Heatsinks for LEDs

A

B

C

D

E

F

G

H

I

K

L

M

N

30

31,4

Ø 40

Ø 40

3,5

10

Rth [K/W]art. no.

1.4LA LED 40 x 30

20

22,4

Ø 50

Ø 40

3,5

10

Rth [K/W]art. no.

1.25LA LED 50 x 20

45

46,4

Ø 50

Ø 40

3,5

10

Rth [K/W]art. no.

0.9LA LED 50 x 45

Technical data of the fans

LF 40B12

12 Vcircuit voltage

two-way plain bearingbearing type

50 mAcur. consumpt.

160 mAmax. iuitial current

157 l/min - 9.4 m3/h

max. volume flow

3.4 mmH2O - 33 Pamax. static pressure

26 dB(A), 1 m lateralnoise level

-20°C... +60°Ctemperature range

60,000 hfailure rate (L10)

1,900,000 h (20°C)MTBF

6,600 min-1

Type rotor speed

10 gweight

B 49

E 44 – 48MountsB 29 – 33Pin heatsinks Ø

E 5 – 15Thermally conductive foilA 21Hole pattern

B 2 – 10Processor overviewA 137 – 138Special heatsink design

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Active heat dissipation of LEDs

A

B

C

D

E

F

G

H

I

K

L

M

N

– active heat dissipation of LED modules

– Zhaga compliant mounting possibility

– integrated low noise fan

– optional adapter plate suitable for LED modules:

Bridgelux Vero, Citizen CitiLED, Cree XLamp, Edison Edilex, GE Infusion, Luga Shop und Industrial, Lustrous Lustron, Megaman Teco,

Osram PrevaLED und Soleriq, Philips Fortimo und Luxeon, Prolight Opto, Sharp Mega Zenigata, Toshiba E-Core, Tridonic Stark, Vexica

Lumaera, Vossloh Schwabe

35

M2x0,4 - 6H (3x)

M3x0,5 - 6H (2x)

Ø 68,5

50 100 150 200 [mm]

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

art. no.

LA LED 68 ...

... adapter (optional)... surface...

50 75 100 mm

please indicate:

adapter plate=ADblack anodised=SA

clear anodised=ME

Technical data of the fans

LF 40B12

12 Vcircuit voltage

two-way plain bearingbearing type

50 mAcur. consumpt.

160 mAmax. iuitial current

157 l/min - 9.4 m3/h

max. volume flow

3.4 mmH2O - 33 Pamax. static pressure

26 dB(A), 1 m lateralnoise level

-20°C... +60°Ctemperature range

60,000 hfailure rate (L10)

1,900,000 h (20°C)MTBF

6,600 min-1

Type rotor speed

10 gweight

B 50

E 44 – 48MountsB 29 – 33Pin heatsinks Ø

E 5 – 15Thermally conductive foilA 21Hole pattern

B 2 – 10Processor overviewA 137 – 138Special heatsink design

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Active heat dissipation of LEDs

A

B

C

D

E

F

G

H

I

K

L

M

N

– Sample box for verification of the thermal management for LEDs

– Contains a choice of different extruded heatsinks, LED extruded heatsinks in round design, LED pin heatsinks and extruded profiles for

LED-Line modules

– for thermal contacting or mounting of LED a high-performance thermal conductive graphite foil is also enclosed (WLFG, sample strips

25x150mm), a high-performance thermal conductive (silicone-free) ceramic-filled thermal conductive paste (WLPK, syringe), a

double-sided sticky thermal conductive foil (WLFT 404, sample strips 25x150mm) and a thermal conductive epoxy based two-component

adhesive (WLK DK, syringe)

art. no.

SK LED BOX 1

B 51

E 44 – 48MountsB 29 – 33Pin heatsinks Ø

E 5 – 15Thermally conductive foilA 21Hole pattern

B 2 – 10Processor overviewA 137 – 138Special heatsink design

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Sample box LED Heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

Heatsinks for DIL-IC

– other length on request

6,3

4,8

1

Rth [K/W][mm]for casesart. no.Rth [K/W][mm]for casesart. no.

3425.020 contactsICK 20 L838.56/8 contactsICK 6 8 L

4619.014/16 contactsICK 14 16 L

19

1

4,8

Rth [K/W][mm]for casesart. no.Rth [K/W][mm]for casesart. no.

16.547.036 contactsICK 36 B54.06.314/16 contactsICK 14 16 B

19.433.024 contactsICK 24 B 15.851.040 contactsICK 40 B

—1000.0—ICK 1000 B18.537.028 contactsICK 28 B

black anodisedsurface:

– with clip

– other length on request

16

14,8

1

2,45 7,1

12

Rth [K/W][mm]for casesart. no.Rth [K/W][mm]for casesart. no.

1623.018 contactsICK 18 H2018.014 contactsICK 14 H

1820.516 contactsICK 16 H —1000.0—ICK 1000 H

black anodisedsurface:

Heatsinks for PLCC

8,5

Ø 10

12

Ø 25

Ø 16

Ø 10

16

Rth [K/W]art. no.

19ICK R

11,8

2,5

8

Rth [K/W][mm]art. no.

2511.8ICK PLCC 28

black anodisedsurface:

B 52

E 5 – 15Thermally conductive foilA 22 – 83Extruded heatsinks

E 21 – 22Thermal conductive pasteB 21 – 28Pin heatsinks for IC

A 21Hole patternE 45Insulting clamping parts

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Heatsinks for DIL-IC and PLCC

A

B

C

D

E

F

G

H

I

K

L

M

N

– particularly suitable for SMD components

– low profile

– reduced weight

– effective heat dissipation

– can be glued directly onto the component

– solderable versions

– customer specific versions on request

– special packaging like tape and real, bar magazin, tray etc. on request

6,3

4,8

1

Rth [K/W][mm]art. no.Rth [K/W][mm]art. no.

6313ICK SMD A 13 ...1235ICK SMD A 5 ...

878ICK SMD A 8 ... 5117ICK SMD A 17 ...

3422ICK SMD A 22 ...7510ICK SMD A 10 ...

19

4,8

1

Rth [K/W][mm]art. no.Rth [K/W][mm]art. no.

2913ICK SMD B 13 SA565ICK SMD B 5 ...

477ICK SMD B 7 SA 2219ICK SMD B 19 ...

3510ICK SMD B 10 SA

7,5

2,8

30

17

Rth [K/W][mm]art. no.Rth [K/W][mm]art. no.

1717ICK SMD C 17 ...337ICK SMD C 7 SA

2610ICK SMD C 10 SA

... surfaceplease indicate:

black anodised=SA

solderable surface=MI

B 53

E 5 – 15Thermally conductive foilA 22 – 83Extruded heatsinks

E 21 – 22Thermal conductive pasteB 21 – 28ICK S 10 x 10 x 6,5

A 21Hole patternE 45Insulting clamping parts

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Heatsinks for SMD

A

B

C

D

E

F

G

H

I

K

L

M

N

3

8

BB

Rth [K/W][mm]art. no.Rth [K/W][mm]art. no.

1829.0ICK SMD E 29 SA2715.3ICK SMD E 15 SA

2122.3ICK SMD E 22 SA

8

2

6

Rth [K/W][mm]art. no.Rth [K/W][mm]art. no.

3719ICK SMD F 19 ...748ICK SMD F 8 ...

7110ICK SMD F 10 ... 3321ICK SMD F 21 ...

2626ICK SMD F 26 ...4217ICK SMD F 17 SA

1,8

6

10

Rth [K/W][mm]art. no.Rth [K/W][mm]art. no.

4117ICK SMD G 17 SA738ICK SMD G 8 MI

7010ICK SMD G 10 ... 3619ICK SMD G 19 SA

3221ICK SMD G 21 ...6113ICK SMD G 13 SA

11,8

8

2,5

Rth [K/W][mm]art. no.Rth [K/W][mm]art. no.

23.019ICK SMD H 19 SA33.08ICK SMD H 8 ...

29.010ICK SMD H 10 ... 20.025ICK SMD H 25 ...

24.517ICK SMD H 17 ...

3,5

13,5

15,24

Rth [K/W][mm]art. no.Rth [K/W][mm]art. no.

19.417ICK SMD K 17 ...25.68ICK SMD K 8 ...

23.410ICK SMD K 10 SA 18.019ICK SMD K 19 ...

16.521ICK SMD K 21 ...21.513ICK SMD K 13 ...

6

1,8

14

Rth [K/W][mm]art. no.Rth [K/W][mm]art. no.

3519ICK SMD M 19 SA728ICK SMD M 8 SA

6610ICK SMD M 10 SA 3121ICK SMD M 21 SA

4017ICK SMD M 17 MI

... surfaceplease indicate:

black anodised=SA

solderable surface=MI

B 54

E 5 – 15Thermally conductive foilA 22 – 83Extruded heatsinks

E 21 – 22Thermal conductive pasteB 21 – 28ICK S 10 x 10 x 6,5

A 21Hole patternE 45Insulting clamping parts

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Heatsinks for SMD

A

B

C

D

E

F

G

H

I

K

L

M

N

8

2

6

Rth [K/W][mm]art. no.Rth [K/W][mm]art. no.

3719ICK SMD N 19 ...748ICK SMD N 8 ...

7110ICK SMD N 10 ... 3321ICK SMD N 21 ...

2626ICK SMD N 26 ...4217ICK SMD N 17 ...

... surfaceplease indicate:

black anodised=SA

solderable surface=MI

Sample box SMD heatsinks

– contains an assortment of SMD heatsinks with anodised and solderable surface as well as thermally conductive glue (WLK) and

double-sided adhesive thermal foil (WLF)

art. no.

ICK SMD BOX 1

B 55

E 5 – 15Thermally conductive foilA 22 – 83Extruded heatsinks

E 21 – 22Thermal conductive pasteB 21 – 28ICK S 10 x 10 x 6,5

A 21Hole patternE 45Insulting clamping parts

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

heatsink for SMD

A

B

C

D

E

F

G

H

I

K

L

M

N

51

5

12

1,3

Ø 4,2 R 6,5

48

51

48

suitable for processor typeRth [K/W]art. no.

Power PC8.1ICK PPC 51

Rth [K/W]

v [m/s]

107

130

Ø 4,2

Ø 8,5

25

4,2

3,0

0123456

2,0

1,0

0

suitable for processor typeRth [K/W]art. no.

Intel®Pentium®III-XeonTM Slot II Format

2ICK PEN 3 XE

Rth [K/W]

v [m/s]

25

4,2

130

Ø 4,2

Ø 8,5

107

3,0

0 1 2 3 4 5 6

2,0

1,0

0

suitable for processor typeRth [K/W]art. no.

Intel®Pentium®III-XeonTM Slot II Format

1.8ICK PEN 3 XE 1

Heatsink specially for Q7 "Embedded-Boards"

75

5

25

56,5

2,5

18

52

70

6,5

2,9

3

3

suitable for processor typeRth [K/W]art. no.

Q7 Board3.9ICK EM 25

B 56

B 56Heatsinks for Q7 "Embedded-Boards"B 60Fan cooler for Intel PentiumIIIXeon

B 17 – 20Heatsinks for BGAB 58Fan cooler, universal

B 11 – 16Heatsinks for PGAC 10 – 16Attachable heatsinks

A 2 – 8Technical introductionE 2 – 24Thermal conductive material

Passive heatsinks for processors

A

B

C

D

E

F

G

H

I

K

L

M

N

– customer specific versions and modifications on request

3

2

1

0021 3 4 5 6

v [m/s]

4

1

0021 3 4 5 6

v [m/s]

2

3

ICK PEN 38

Rth [K/W]

ICK PEN 45

Rth [K/W]

A

B

D

C

dim. [mm]suitable for processor typeRth [K/W]art. no.

DCBA

5.03849.549.5

AMD®K6-III/ IDT W2A/ MMX/ IDT C6/

Intel®Pentium®/ AMD®K6-2

4.0ICK PEN 38 F

5.03849.549.5

AMD®K6-III/ IDT W2A/ MMX/ IDT C6/

Intel®Pentium®/ AMD®K6-2

4.0ICK PEN 38 W

3.54550.050.0

AMD®K6-III/ IDT W2A/ MMX/ IDT C6/

Intel®Pentium®/ AMD®K6-2

3.5ICK PEN 45 W

D

C

A

B

0021 3 4 5 6

v [m/s]

Rth [K/W]

3

2

1

dim. [mm]suitable for processor typeRth [K/W]art. no.

DCBA

4.54067.565

Intel®Pentium®PRO

2.7ICK PRO 40 W

F= with double-sided thermally conductive adhesive foil

W= for thermally conductive adhesive (please order separately)

WLK ... ➔E 23

0 1 2 3 4 5 6

v [m/s]

4

3

2

1

0

Rth [K/W]

25

4,5

70

14

63

suitable for processor typeRth [K/W]art. no.

Intel®Pentium®III FC PGA (Mendocino, Copper-

mine)

3.5ICK PEN 3 FC

fixing method: K = with fixing clamp (incl. one-sided adherent thermal foil)

B 57

B 56Heatsinks for Q7 "Embedded-Boards"B 60Fan cooler for Intel PentiumIIIXeon

B 17 – 20Heatsinks for BGAB 58Fan cooler, universal

B 11 – 16Heatsinks for PGAC 10 – 16Attachable heatsinks

A 2 – 8Technical introductionE 2 – 24Thermal conductive material

Passive heatsinks for processors

A

B

C

D

E

F

G

H

I

K

L

M

N

B

A

C

dim. [mm]suitable for processor typeRth [K/W]art. no.

CBA

2038.1037.92universal2.3LA ICK 15 x 15 F 05

2038.1037.92universal2.3LA ICK 15 x 15 F 12

2043.1043.10universal1.6LA ICK 17 x 17 F 12

2043.1043.10universal1.6LA ICK 17 x 17 F 12 A

2043.1043.10universal1.6LA ICK 17 x 17 W 05

2043.1043.10universal1.6LA ICK 17 x 17 W 12

2045.7045.70universal1.5LA ICK 18 x 18 F 12

2045.7045.70universal1.5LA ICK 18 x 18 W 12

2053.3453.34universal1.4LA ICK 21 x 21 F 05

2053.3453.34universal1.4LA ICK 21 x 21 F 12

2053.3453.34universal1.4LA ICK 21 x 21 W 05

2053.3453.34universal1.4LA ICK 21 x 21 W 12

used fans:

5 Volt = Sepa MFB 25 F 05 L / MFB 40 H 05 / MFB 40 H 05 A;

12 Volt = Sepa MFB 25 F 12 / MFB 40 H 12 / MFB 40 H 12 A

F= with double-sided thermally conductive adhesive foil

W= for thermally conductive adhesive (please order separately) WLK ... ➔E 23

A= alarm exit

B 58

B 56Heatsinks for P II-Mobile ModuleB 17 – 20Heatsinks for BGA

B 60Fan cooler for Pentium IVB 56Heatsinks for Q7 "Embedded-Boards"

E 2 – 24Thermal conductive materialB 58Fan cooler, universal

A 2 – 8Technical introductionB 57Heatsinks for Pentium PRO

Active heatsinks for processors

A

B

C

D

E

F

G

H

I

K

L

M

N

– easy assembly on ZIF socket by fixing clamp

B

C

D

A

dim. [mm]suitable for processor typeRth [K/W]art. no.

DCBA

9.008.0050.850.8

AMD®K6-III/ IDT W2A/ Cyrix MII and similar/

MMX/ IDT C6/ Intel®Pentium®/ AMD®K6-2

2.50LA ICK PEN 8 F 05

9.008.0050.850.8

AMD®K6-III/ IDT W2A/ Cyrix MII and similar/

MMX/ IDT C6/ Intel®Pentium®/ AMD®K6-2

2.50LA ICK PEN 8 F 12

9.008.0050.850.8

AMD®K6-III/ IDT W2A/ Cyrix MII and similar/

MMX/ IDT C6/ Intel®Pentium®/ AMD®K6-2

2.50LA ICK PEN 8 W 05

9.008.0050.850.8

AMD®K6-III/ IDT W2A/ Cyrix MII and similar/

MMX/ IDT C6/ Intel®Pentium®/ AMD®K6-2

2.50LA ICK PEN 8 W 12

26.5116.5150.850.8

AMD®K6-III/ IDT W2A/ Cyrix MII and similar/

MMX/ IDT C6/ Intel®Pentium®/ AMD®K6-2

1.20LA ICK PEN 16 K 12

26.5116.5150.850.8

AMD®K6-III/ IDT W2A/ Cyrix MII and similar/

MMX/ IDT C6/ Intel®Pentium®/ AMD®K6-2

1.20LA ICK PEN 16 W 12

26.5116.5150.850.8

AMD®K6-III/ IDT W2A/ Cyrix MII and similar/

MMX/ IDT C6/ Intel®Pentium®/ AMD®K6-2

1.20LA ICK PEN 16 W 12 A

18.008.0050.850.8

AMD®K6-III/ IDT W2A/ Cyrix MII and similar/

MMX/ IDT C6/ Intel®Pentium®/ AMD®K6-2

1.60LA ICK PEN 18 W 12

48.0038.0049.549.5

AMD®K6-III/ IDT W2A/ Cyrix MII and similar/

MMX/ IDT C6/ Intel®Pentium®/ AMD®K6-2

1.10LA ICK PEN 38 W 12

35.0025.0067.563.5

Intel®Pentium®PRO

0.97LA ICK PRO 25 F 12

used fans: 5 Volt = Sepa MFB 50 E 05; 12 Volt = Sepa MFB 50 E 12/ Sepa MFB 50 E 12 A;

LA ICK PEN 8: 5 Volt = Sepa HFB 44 X 05 A; 12 Volt = Sepa HFB 44 B 12 A

K= with fixing clamp (incl. one-sided adherent conductive foil)

F= with double-sided thermally conductive adhesive foil

W= for thermally conductive adhesive (please order separately) WLK ... ➔E 23

A= alarm exit

B 59

B 56Heatsinks for P II-Mobile ModuleB 17 – 20Heatsinks for BGA

B 60Fan cooler for Pentium IVB 56Heatsinks for Q7 "Embedded-Boards"

E 2 – 24Thermal conductive materialB 58Fan cooler, universal

A 2 – 8Technical introductionB 57Heatsinks for Pentium PRO

Active heatsinks for processors

A

B

C

D

E

F

G

H

I

K

L

M

N

– incl. one-sided adherent thermal foil

4

27

3,5

125

52

suitable for processor typeRth [K/W]art. no.

Intel®Pentium®II/ AMD®Athlon®

1.2LA ICK PEN 2 K 12 ...

... accessory (optional)please indicate:

molex connection plug=SM

utilized fans: 12 Volt = Sepa MFB 40 H 12

28,4

4

107

130

suitable for processor typeRth [K/W]art. no.

Intel®Pentium®III-XeonTM

0.8LA ICK PEN 3 XE

... accessory (optional)please indicate:

alarm exit=A

molex connection plug=SM

fixing method: SB= screw fixing

utilized fans: 12 Volt = Sepa MFB 50 E 12

– with copper base plate

– customer specific designs and modifications on request

63,5

80

7,7

7

70

45

suitable for processor typeRth [K/W]art. no.

Intel®Pentium®IV

0.6LA ICK PEN 4 1 K

... accessory (optional)please indicate:

molex connection plug=SM

fixing method: K = with fixing clamp

operating voltage of the fan motor: 12 Volt (Papst 612 NHH)

B 60

B 56Heatsinks for P II-Mobile ModuleB 17 – 20Heatsinks for BGA

B 60Fan cooler for Pentium IVB 56Heatsinks for Q7 "Embedded-Boards"

E 2 – 24Thermal conductive materialB 58Fan cooler, universal

A 2 – 8Technical introductionB 57Heatsinks for Pentium PRO

Active heatsinks for processors

A

B

C

D

E

F

G

H

I

K

L

M

N

A

B

C

D

E

F

G

H

I

K

L

M

N

molex crimp case series: 6471; molex crimp terminals: 2759

– Sepa-fan 24 h BURN-IN tested

5 volt fan

ebmpapstSepaSepaSepaSepaSepa

405 FHFB 44 X 05 AMFB 50 E 05MFB 40 H 05 AMFB 40 H 05MFB 25 F 05 L

4.5...5.5 V DC4.5...5.5 V DC4.5...5.5 V DC4.5...5.5 V DC4.5...5.5 V DC4.5...5.5 V DC

circuit voltage

double slide

bearing

ball bearingdouble ball bearingdouble ball bearingdouble ball bearingdouble ball bearing

bearing type

40x40x10 mm44x44x6.2 mm50x50x10 mm40x40x10 mm40x40x10 mm25x25x10 mm

fan dimensions

140 mA90 mA50 mA90 mA90 mA90 mA

cur. consumpt.

160 mA120 mA250 mA250 mA170 mA

max. iuitial current

132 l/min

8 m3/h

50 l/min

3 m3/h

169 l/min

10.1 m3/h

184 l/min

11 m3/h

184 l/min

11 m3/h

46 l/min

2.8 m3/h

max. volume flow

3.06mm H2O

30 Pa

2.6mm H2O

25.5 Pa

1.6mm H2O

15.6 Pa

3.1mm H2O

30.5 Pa

3.1mm H2O

30.5 Pa

2.2 mmH2O

22 Pa

max. static pressure

22.1 dB(A), 1 m

lateral

28 dB(A), 1 m lateral17 dB(A), 1 m lateral24 dB(A), 1 m lateral24 dB(A), 1 m lateral18 dB(A), 1 m lateral

noise level

-20°C... +70°C-40°C... +80°C-10°C... +70°C-40°C... +80°C-40°C... +80°C-10°C ... +85°C

temperature range

45,000 h (20°C)95,000 h95,000 h95,000 h95,000 h95,000 h

failure rate (L10)

280,000 h (20°C)280,000 h (20°C)280,000 h (20°C)280,000 h (20°C)280,000 h (20°C)

MTBF

17 g7 g19 g13 g13 g8 g

weight

plastic PBT

(UL E38324)

plastic PBT

(UL E54695)

plastic PBT

(UL E54695)

plastic PBT

(UL E54695)

plastic PBT

(UL E54695)

plastic PBT

(UL E54695)

cases

12 volt fan

ebmpapstSepaSepaSepaSepaSepa

412 FHFB 44 B 12 AMFB 50 E 12MFB 40 H 12 AMFB 40 H 12MFB 25 F 12

10-14 V DC10.2...13.8 V DC10.2...13.8 V DC10.2...13.8 V DC10.2...13.8 V DC10.2...13.8 V DC

circuit voltage

double slide

bearing

ball bearingball bearingdouble ball bearingdouble ball bearingdouble ball bearing

bearing type

40x40x10 mm44x44x6.2 mm50x50x10 mm40x40x10 mm40x40x10 mm25x25x10 mm

fan dimensions

60 mA40 mA60 mA50 mA50 mA70 mA

cur. consumpt.

70 mA140 mA130 mA130 mA150 mA

max. iuitial current

132 l/min

8 m3/h

50 l/min

3 m3/h

238 l/min

14.3 m3/h

173 l/min

10.3 m3/h

173 l/min

10.3 m3/h

70 l/min

4.1 m3/h

max. volume flow

3.06mm H2O

30 Pa

2.6mm H2O

25.5 Pa

2.7mm H2O

26.9 Pa

2.9 mmH2O

28.5 Pa

2.9 mmH2O

28.5 Pa

2.24mm H2O

41.5 Pa

max. static pressure

22.1 dB(A), 1 m

lateral

28 dB(A), 1 m lateral22 dB(A), 1 m lateral21 dB(A), 1 m lateral24 dB(A), 1 m lateral23 dB(A), 1 m lateral

noise level

-20°C... +70°C-40°C... +80°C-10°C... +70°C-40°C... +80°C-40°C... +80°C-40°C... +80°C

temperature range

45,000 h (20°C)95,000 h95,000 h95,000 h95,000 h95,000 h

failure rate (L10)

280,000 h (20°C)280,000 h (20°C)280,000 h (20°C)280,000 h (20°C)280,000 h (20°C)

MTBF

17 g20 g19 g13 g13 g8 g

weight

plastic PBT

(UL E38324)

steel/aluminium (UL

E54695)

plastic PBT

(UL E54695)

plastic PBT

(UL E54695)

plastic PBT

(UL E54695)

plastic PBT

(UL E54695)

cases

Fans with pulse output - Technical data of fans with pulse output:

– pulse output for activation of the alarm control

– pulse similar to a square pulse with three times the frequency of the rotor speed

– when the rotor is blocked, the output signal may be L (≤0.8 V) or H (Vcc-1 V)

– the pulse output must not be connected to GND or Vcc withoutb protective resistor (>10 K)

– in order to avoid short circuits, the pulse output not being used must be insulated

B 62

Technical data of the fans

A

B

C

D

E

F

G

H

I

K

L

M

N

Finger shaped heatsinks for transistors

– effective heat dissipation of transistors

– efﬁcient radiation of heat at a horizontal or vertical

mounting position

– component fastening by means of screws or special

transistor retaining springs

– solder mounting by means of integrated solder pins and

solderable surfaces

Finger shaped heatsinks for

power semiconductors

Attachable heatsinks

Finger shaped heatsinks for transistors

Miniature heatsinks

Finger shaped heatsinks for power semiconductors

– specially compatible for power semiconductors in

a TO-case

– made as a bent sheet metal part or die cast heatsink

made of aluminium

– aligned heatsink contours for the best heat dissipation

– direct screwing of the component to the heatsink on

the PCB

Attachable heatsinks

– made of aluminium or copper material

– solderable surface coating

– integrated spring clip for easy and fast mounting of

the transistor

– secure hold of the component due to optimized spring

force and geometry

– customer speciﬁc version upon request

Miniature heatsinks

– for TO 5, SOT 82, D PAK and similar semiconductors

– made of aluminium, phosphorus bronze or copper

– simple mounting by direct plugging or soldering

of the heatsink

– special types of packaging such as tape & reel,

magazine or tray upon request

– versions and designs for your application

30,2

13,2

4,2

10,9

38,1

46

38,1

46

3,7

4,5

Rth [K/W][mm]art. no.

TO 35.825.4FK 254 SA 3

without4.831.8FK 318 SA

TO 34.831.8FK 318 SA 3

die-casting aluminiummaterial:

black lacqueredsurface:

30,2

45

35

13,2

10,9

4,2

TO 3 CB

2,5

10

9,5

Ø

3

13,2

13,1

30,2

45

40

5,6

4,2

10,9

Ø 4,2

14,9

15,1

3,6

Rth [K/W][mm]art. no.

without625.4FK 201 SA

TO 3625.4FK 201 SA 3

CB625.4FK 201 SA CB

without812.7FK 202 SA

TO 3812.7FK 202 SA 3

CB812.7FK 202 SA CB

2,5

10,9

5,4

4,2

4,2

33

30,1

23,1

16,9

13

41,6

1,5

3,6

L (TO 3 – SOT 9 + TO 66 – SOT 32 – TO220)

Rth [K/W][mm]art. no.

L9.031.8FK 205 SA L

L10.525.4FK 206 SA L

L12.019.1FK 207 SA L

L14.012.7FK 208 SA L

aluminiummaterial:

black anodisedsurface:

C 2

E 44 – 48MountsC 10 – 14Attachable heatsinks

E 51Insulating capsC 17 – 19Heatsinks for TO 5 and TO 18

E 2 – 24Thermal conductive materialC 21 – 117Heatsinks for D PAK

A 2 – 8Technical introductionE 17 – 18Aluminium oxide wafers

Finger shaped heatsinks for power semiconductors

A

B

C

D

E

F

G

H

I

K

L

M

N

1,5

32

42

10,9

4,2

13,2

30,2

Ø 4,2

5,6

4,2

10

3,6

9,5

13,2

13,1

30,2

FK 223 SA 3 FK 223 SA CB

10,9

1,8

Ø 3

Rth [K/W][mm]art. no.

without6.817FK 223 SA

TO 36.817FK 223 SA 3

CB6.817FK 223 SA CB

1,5

8,5

M 2,5 M 3

10

4

28,3

35,5

14,75

Rth [K/W][mm]art. no.

CB 2 (SOT 32; TO 220)1613FK 217 SA CB 2

aluminiummaterial:

black anodisedsurface:

C 3

E 44 – 48MountsC 10 – 14Attachable heatsinks

E 51Insulating capsC 17 – 19Heatsinks for TO 5 and TO 18

E 2 – 24Thermal conductive materialC 21 – 117Heatsinks for D PAK

A 2 – 8Technical introductionE 17 – 18Aluminium oxide wafers

Finger shaped heatsinks for power semiconductors

A

B

C

D

E

F

G

H

I

K

L

M

N

– for semiconductor screw-assembly, horizontal

3

8

20

28

14,75

8

12,5

28

3

8

20

28

10

20

28

10

1,5

18,5±0,5

Ø 3,8

Ø 3,2 Ø 3,8

Ø 3,2

Ø 3,8 Ø 3,8

FK 234 SA L 1

FK 234 SA L 3

FK 234 SA L 2

FK 234 SA L 4

11,5±0,5

Rth [K/W][mm]art. no.

TO 2201715FK 234 SA L 1

SOT 321715FK 234 SA L 2

CB1715FK 234 SA L 3

CB1715FK 234 SA L 4

aluminiummaterial:

black anodisedsurface:

– for semiconductor screw-assembly, vertical

FK 235 ... L 1 FK 235 ... L 2

28

13,5

4

10,16 2

4

18,3

28

10,16

2

1,5

18,5±0,5

Ø 3,2

Ø 3,8

11,5±0,5

Rth [K/W][mm]art. no.

TO 2201615FK 235 MI L 1

SOT 321615FK 235 MI L 2

TO 2201615FK 235 SA L 1

SOT 321615FK 235 SA L 2

aluminiummaterial:

solderable surface/ black anodisedsurface:

C 4

E 44MountsC 10 – 14Attachable heatsinks

E 51Insulating capsC 17 – 19Heatsinks for TO 5 and TO 18

E 2 – 24Thermal conductive materialC 21Heatsinks for D PAK

A 2 – 8Technical introductionE 17 – 18Aluminium oxide wafers

Heatsinks for transistors in plastic case

A

B

C

D

E

F

G

H

I

K

L

M

N

4

38

13

19

18

22

26

24,5

1,5

9,9 K/W

TO 220

art. no.

FK 225 SA L 1

3,6

38

6,9

31,2

10

16,5 2,5

8

18

22

26

24,5

9,9 K/W

TO 220

art. no.

FK 225 SA L 2

30 K/W

TO 220

4

6,5

19 13

11,5

21

18,5

1,5

art. no.

FK 228 SA L 1

27 K/W

TO 220

4

6,5

19 13

13,5

21

18,5

1,5

art. no.

FK 229 SA L 1

21 K/W

TO 220

4

6,5

19 13

19,5

21

18,5

1,5

art. no.

FK 230 SA L 1

aluminiummaterial:

black anodisedsurface:

17 K/W

TO 220

0,8

515,2 5,1

3,8

15

3

4

7

12,5

31,2

1,9

11,1

1,2

24,2

30,4

art. no.

FK 249 SA 220

aluminiummaterial:

black passivated, solder pins tin platedsurface:

C 5

E 44 – 48MountsC 10 – 14Attachable heatsinks

E 51Insulating capsC 17 – 19Heatsinks for TO 5 and TO 18

E 2 – 24Thermal conductive materialC 21Heatsinks for D PAK

A 2 – 8Technical introductionE 17 – 18Aluminium oxide wafers

Heatsinks for transistors in plastic case

A

B

C

D

E

F

G

H

I

K

L

M

N

8

1

3,8

25,4

18

12,2

25 K/W

SOT 32

art. no.

FK 209 SA 32 available without hole pattern as well

8

1

25,4

3,8

12,2

30

18 K/W

CB (SOT 32 + TO 220)

22,4

art. no.

FK 210 SA CB available without hole pattern as well

13

1

Ø

3,8

12,2

25,4

18

21 K/W

SOT 32

art. no.

FK 213 SA 32 available without hole pattern as well

13

1

25,4

Ø

3,8

12,2

30

15 K/W

CB (SOT 32 + TO 220)

22,4

art. no.

FK 214 SA CB available without hole pattern as well

24 K/W

TO 220

9,5

1

11,5

13,5

13,5

3,8

19

art. no.

FK 231 SA 220

24 K/W

SOT 32

9,5

1,3

16,45

13,34

19,05

3,8

19,5

art. no.

FK 239 SA 32

aluminiummaterial:

black anodisedsurface:

C 6

E 44 – 48MountsC 10 – 14Attachable heatsinks

E 51Insulating capsC 17 – 19Heatsinks for TO 5 and TO 18

E 2 – 24Thermal conductive materialC 21Heatsinks for D PAK

A 2 – 8Technical introductionE 17 – 18Aluminium oxide wafers

Heatsinks for transistors in plastic case

A

B

C

D

E

F

G

H

I

K

L

M

N

8

11,2

25,4

3,8

18 3

1

12,2

25 K/W

SOT 32

art. no.

FK 211 32 ... available without hole pattern as well

18 K/W

CB (SOT 32 + TO 220)

8

11,2

3

25,4

3,8

18,2

12,2

30

1

22,4

art. no.

FK 212 CB ... available without hole pattern as well

13

11,2

25,4

Ø

3,8

12,2

18 3

1

21 K/W

SOT 32

art. no.

FK 215 32 ... available without hole pattern as well

15 K/W

CB (SOT 32 + TO 220)

13

11,2

3

25,4

3,8

18, 2

22,4

30

1

12, 2

art. no.

FK 216 CB available without hole pattern as well

20 K/W

TO 220

30

3,8 14,4

3,8

5,2

25,4

12,7

5,5 2,5

1

art. no.

FK 222 ... available without hole pattern as well

30

3,8

25,4

14,4

3,8

5,2

12

8

2,2

1,6

4

20 K/W

TO 220

12,7

5,5 2,5

1

art. no.

FK 222 THF ...

22 K/W

TO 220

7,9

1,95

1,5

23,5 4,5

19,1

1,5

16,8

3,8

art. no.

FK 247 220 ...

... surfaceplease indicate:

black anodised=SA

solderable surface=MI

aluminiummaterial:

C 7

E 44MountsC 10 – 14Attachable heatsinks

E 51Insulating capsC 17 – 19Heatsinks for TO 5 and TO 18

E 2 – 24Thermal conductive materialC 21Heatsinks for D PAK

A 2 – 8Technical introductionE 17 – 18Aluminium oxide wafers

Heatsinks for transistors in plastic case

A

B

C

D

E

F

G

H

I

K

L

M

N

45

Ø

3,6

17,8

4,3

20

9,8

18

9

17

22 K/W

TO 220

art. no.

FK 227 SA L 1

10,2

12,2

45

36,6

Ø

3,7

9,5

18

1

20

12 K/W

TO 220

art. no.

FK 238 SA L 1

aluminiummaterial:

black anodisedsurface:

12,3

19,4

35,6

Ø 3,2

1,6

4

19,3

22

1,2

3,5

6,7

21 K/W

SOT 32

TO 220

art. no.

FK 218 32 ...

13

3,2

1,2

21 K/W

TO 220

24

20,5

Ø 3,6

17

4

7

24,5

art. no.

FK 232 220 ...

1,2

16

3,2

20,2 K/W

TO 220

27

33

Ø

3,6

20

4

729

art. no.

FK 233 220 ...

... surfaceplease indicate:

black anodised=SA

solderable surface=MI

aluminiummaterial:

C 8

E 44MountsC 10 – 14Attachable heatsinks

E 51Insulating capsC 17 – 19Heatsinks for TO 5 and TO 18

E 2 – 24Thermal conductive materialC 21Heatsinks for D PAK

A 2 – 8Technical introductionE 17 – 18Aluminium oxide wafers

Heatsinks for transistors in plastic case

A

B

C

D

E

F

G

H

I

K

L

M

N

FK 219 CB 1 ... FK 219 CB 2 ...

22,9 2,5

3,2

18,3

4,8

25,4

7,1

50,8

16,6

35,1

10,8

2,5

14,8

9,7

21 4,8

16,6

50,8

35,1

3,2

1,2

Rth [K/W][mm]art. no.

CB 1 (TO 220)1412.6FK 219 CB 1 ...

CB 2 (TO 220)1412.6FK 219 CB 2 ...

22,9 2,5

3,2

18,3

4,8

25,4

7,1

50,8

16,6

35,1

1,5

1,8

11,5

3,9

6

1,2

Rth [K/W][mm]art. no.

CB 3 (TO 220)1412.6FK 219 CB 3 ...

3,3

3,8

5

32

12

3,3

12

22

18

22,8

28,5

30,8

16

1

3,8

5

32

12

23,4

22,8

28,5

30,8

1,9

16

3,3

22

23,4

FK 236 CB ... FK 236 220 ...

1,9

Rth [K/W][mm]art. no.

TO 220185FK 236 220 ...

CB185FK 236 CB ...

... surfaceplease indicate:

black anodised=SA

solderable surface=MI

aluminiummaterial:

C 9

C 17 – 19Heatsinks for TO 5 and TO 18A 115 – 117Retaining springs for transistors

C 10 – 14Attachable heatsinksA 119Lock-in retaining spring for transistors

E 46Mounting material for semiconductorsA 84Profiles for lock-in fixing spring

A 2 – 8Technical introductionA 89 – 112Profiles for PCB mounting

Heatsinks for transistors in plastic case

A

B

C

D

E

F

G

H

I

K

L

M

N

25

20,5

7

0,6

Rth [K/W]art. no.

TO 22025FK 220 SA 220

aluminiummaterial:

black anodisedsurface:

– for transistiors with thin bottom thickness (0.5 mm)

7

0,6

25

20,5

Rth [K/W]art. no.

TO 22025FK 258 SA 220

aluminiummaterial:

black anodisedsurface:

25

1,2

4

18

22,5

8,3

1,3

25,4

1,2

Rth [K/W]art. no.

P SIP18FK 224 ... P SIP

... surfaceplease indicate:

black anodised=SA

solderable surface=MI

aluminiummaterial:

C 10

E 41Vibration dampersC 21Heatsinks for D PAK

A 123 – 124U-shaped heatsinkC 4 – 9Heatsinks for transistors

E 17 – 18Aluminium oxide wafersE 16Kapton insulator washers

A 2 – 8Technical introductionE 41Vibration dampers

Attachable heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

FK 224 ... 218 2

FK 224 ... 220 2

FK 224 ... 218 1

FK 224 ... 220 1

15,5

25

1,2

4

18

1,3

25,4

8,3

14,5

8,3

15,5

25

1,2

4

18

1,3

4

10,5

25

1,2

4

18

25,4

8,3

15,5

8,3

10,5

25

1,2

4

18

15,5

1,3 1,3

14,5

4

25,4 25,4

Rth [K/W]art. no.Rth [K/W]art. no.

TO 22018FK 224 ... 220 1TO 21818FK 224 ... 218 1

TO 21818FK 224 ... 218 2 TO 22018FK 224 ... 220 2

... surfaceplease indicate:

black anodised=SA

solderable surface=MI

aluminiummaterial:

3,4

2

5,3

3,81

0,81

7,6

1,27

25,4

31

22,86

12,7

art. no.

FK 241 SA 218 V with tin-plated soldering lug for direct soldering onto circuit board, for vertical installation

17,2

8

28

1,4

Ø

1,2

9,8 K/W

TO 220

20

20

20,1

art. no.

FK 248 SA 220

aluminiummaterial:

black anodised, solder pins tin platedsurface:

C 11

E 41Vibration dampersC 21Heatsinks for D PAK

A 123 – 124U-shaped heatsinkC 4 – 9Heatsinks for transistors

E 17 – 18Aluminium oxide wafersE 16Kapton insulator washers

A 2 – 8Technical introductionE 41Vibration dampers

Attachable heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

– universal clip on heatsinks for type TO 218, TO 229, TO 247, TO 248, SIP-Muliwatt and similar

– easy assembly by pushing the heatsink onto the component

– for vertical and horizontal fastening by soldering

– fin height variations on request

– special design accord. to customized specification

20,2 K/W

1,2

16

9

8,5

0,6

10

27 20

art. no.

FK 245 MI 247 O without soldering lug

20,5 K/W

1,2

16

10

1

9

8,5

0,6

0,6

3,2

27 20

art. no.

FK 245 MI 247 H with soldering lug for horizontal mounting

19,7 K/W

4,85

1

4

1,1

0,6

1,2

16

27

9

8,5

0,6

10

20

art. no.

FK 245 MI 247 V with soldering lug for vertical mounting

18,4 K/W

13

8,5

0,6

10

1,2 20

16

27

art. no.

FK 243 MI 247 O without soldering lug

19 K/W

1,2

16

0,6

3,2

27

13

0,6

10

1

8,5

20

art. no.

FK 243 MI 247 H with soldering lug for horizontal mounting

18,4 K/W

4,85

1

4

1,1

13

8,5

0,6

10

0,6

1,2

16

27 20

art. no.

FK 243 MI 247 V with soldering lug for vertical mounting

copper (Cu)material:

solderable surfacesurface:

0.6 mmmaterial thickness:

C 12

E 41Vibration dampersC 21Heatsinks for D PAK

A 123 – 124U-shaped heatsinkC 4 – 9Heatsinks for transistors

E 17 – 18Aluminium oxide wafersE 16Kapton insulator washers

A 2 – 8Technical introductionE 41Vibration dampers

Attachable heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

2

1

*

3

TO 220

– narrow version with better thermal resistance

– max. 14.5 mm wide

– 3 different lengths for varied dissipation power

– takes less space than any other attachable heatsink

– simple assembly by pushing the heatsink onto the TO 220 housing

– the cooling fingers form spring clamps (1+2), which pushes the TO 220 and it's mounting flange onto the heatsink (3)

– optimum heat transfer due the constant pressure on the entire contact surface of the TO 220 cases

– effective heat emmision with horizontal and vertical mounting

–*= touch in edge of transistor

0,81

max. 14,5

26 K/W

*

12,7

15,24

ca.

8,5

art. no.

FK 242 SA 220 O without soldering lug

0,81

max. 14,5

ca.

8,5

12,7

*

19,05

21 K/W

art. no.

FK 237 SA 220 O without soldering lug

0,81

max. 14,5

16 K/W

12,7

*

38,1

ca.

8,5

art. no.

FK 240 SA 220 O without soldering lug

aluminiummaterial:

black anodised, solder pins tin platedsurface:

C 13

E 41Vibration dampersC 21Heatsinks for D PAK

A 123 – 124U-shaped heatsinkC 4 – 9Heatsinks for transistors

E 17 – 18Aluminium oxide wafersE 16Kapton insulator washers

A 2 – 8Technical introductionE 41Vibration dampers

Attachable heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

0,81

1,27

6,4

ca.

8,5

max. 14,5

26 K/W

4,05

0,81

0,81

*

12,7

15,24

11,8

art. no.

FK 242 SA 220 H with tinned soldering lug for direct soldering onto circuit board, for horizontal installation

0,81

1,27

6,4

max. 14,5

ca.

8,5

21 K/W

12,7

*

0,81

4,05

0,81

4,6

19,05

art. no.

FK 237 SA 220 H with tinned soldering lug for direct soldering onto circuit board, for horizontal installation

0,81

1,27

6,4

max. 14,5

12,7

0,81

0,81

4,6

*

4,05

38,1

16 K/W

ca.

8,5

art. no.

FK 240 SA 220 H with tinned soldering lug for direct soldering onto circuit board, for horizontal installation

aluminiummaterial:

black anodised, solder pins tin platedsurface:

– with tinned soldering lug for direct soldering onto circuit board, for vertical installation

0,81

6,4

ca.

8,5

*

12,7

15,24

1,62

A

9

0,81

max. 14,5

Rth [K/W]A [mm]art. no.Rth [K/W]A [mm]art. no.

269.53FK 242 SA 220 VL266.35FK 242 SA 220 V

0,81

6,4

ca.

8,5

12,7

*

19,05

A

12,8

0,81

1,62

max. 14,5

Rth [K/W]A [mm]art. no.Rth [K/W]A [mm]art. no.

219.53FK 237 SA 220 VL216.35FK 237 SA 220 V

0,81

6,4

ca.

8,5

max. 14,5

*

12,7

38,1

A

31,8

1,62

0,81

Rth [K/W]A [mm]art. no.Rth [K/W]A [mm]art. no.

169.53FK 240 SA 220 VL166.35FK 240 SA 220 V

aluminiummaterial:

black anodised, solder pins tin platedsurface:

C 14

E 41Vibration dampersC 21Heatsinks for D PAK

A 123 – 124U-shaped heatsinkC 4 – 9Heatsinks for transistors

E 17 – 18Aluminium oxide wafersE 16Kapton insulator washers

A 2 – 8Technical introductionE 41Vibration dampers

Attachable heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

– narrow version with better thermal resistance

– max. 14.5 mm wide

– takes less space than any other attachable heatsink

– simple assembly by pushing the heatsink onto the TO 220 housing

– the cooling fingers form spring clamps (1+2), which pushes the TO 220 and it's mounting flange onto the heatsink (3)

– optimum heat transfer due the constant pressure on the entire contact surface of the TO 220 cases

– effective heat emmision with horizontal and vertical mounting

–*= touch in edge of transistor

21 K/W

0,81

*

19,05

12,7

ca.

8,4

12,7

max

14,5

art. no.

FK 252 SA 220 O without soldering lug

21 K/W

0,81

*

19,05

0,81

4

,

1

6

,

35

12,7

ca.

8,4

12,7

max

14,5

1,27

art. no.

FK 252 SA 220 H with tinned soldering lug for direct soldering onto circuit board, for horizontal installation

aluminiummaterial:

black anodisedsurface:

– with tinned soldering lug for direct soldering onto circuit board, for vertical installation

0,81

*

19,05

0,81

A

12,7

ca.

8,4

12,7

max.

14,5

1,27

Rth [K/W]A [mm]art. no.Rth [K/W]A [mm]art. no.

219.53FK 252 SA 220 VL216.35FK 252 SA 220 V

aluminiummaterial:

black anodisedsurface:

C 15

E 41Vibration dampersC 21Heatsinks for D PAK

A 123 – 124U-shaped heatsinkC 4 – 9Heatsinks for transistors

E 17 – 18Aluminium oxide wafersE 16Kapton insulator washers

A 2 – 8Technical introductionE 41Vibration dampers

Attachable heatsinks for TO 220 with a bottom plate thickness of 0.5 mm

A

B

C

D

E

F

G

H

I

K

L

M

N

22

10,7

11,1

19

19

Rth [K/W]art. no.

TO 22023.7FK 253

11,7

24,8

11,1

19,05

19,05

Rth [K/W]art. no.

TO 22016.8FK 255

4,19±0,13

19,05

21,84

12,2

10,2

0,6

19,05

Rth [K/W]art. no.

TO 22021.2FK 257

aluminiummaterial:

black anodisedsurface:

C 16

E 41Vibration dampersC 21Heatsinks for D PAK

A 123 – 124U-shaped heatsinkC 4 – 9Heatsinks for transistors

E 17 – 18Aluminium oxide wafersE 16Kapton insulator washers

A 2 – 8Technical introductionE 41Vibration dampers

Attachable heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

21,4

10,1

3,96 6,35

0,6

40 K/W

TO 5

Ø 8

art. no.

KK 1 3,96

21,4

10,1

6,35 6,35

0,6

38 K/W

TO 5

Ø 8

art. no.

KK 1 6,35

21,4

10,1

12,7 6,35

0,6

35 K/W

TO 5

Ø 8

art. no.

KK 1 12,7

21,4

10,1

19,05 6,35

0,6

31 K/W

TO 5

Ø 8

art. no.

KK 1 19,05

aluminiummaterial:

black anodisedsurface:

C 17

E 2 – 24Thermal conductive materialC 2 – 3Finger-shaped heatsinks

E 46 – 48Mounting material for semiconductorsC 4 – 9Heatsinks for transistors

A 22 – 83Extruded heatsinksC 10 – 16Attachable heatsinks

A 2 – 8Technical introductionC 21 – 22Heatsinks for D PAK

Small heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

57 K/W

TO 5

25

7,9

5

art. no.

KF 5/5

46 K/W

TO 5

25

7,9

10

art. no.

KF 5/10

40 K/W

TO 5

25

7,9

15

art. no.

KF 5/15

brassmaterial:

blackenedsurface:

60 K/W

TO 5

8

7,8

19

T

F

art. no.

KK 562 GS T= gap; F= spring loaded

special bronze CuZn 15material:

0.3 mmmaterial thickness:

blackenedsurface:

C 18

E 2 – 24Thermal conductive materialC 2 – 3Finger-shaped heatsinks

E 46 – 48Mounting material for semiconductorsC 4 – 9Heatsinks for transistors

A 22 – 83Extruded heatsinksC 10 – 16Attachable heatsinks

A 2 – 8Technical introductionC 21 – 22Heatsinks for D PAK

Small heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

max. 12,7

8

,

1±0,1

1+0,5

-0,2

63 K/W

TO 5

6

art. no.

SKK 56

max. 12,7

8

,

1±0,1

1+0,5

-0,2

55 K/W

TO 5

8

art. no.

SKK 58

max. 12,7

8

,

1±0,1

1+0,5

-0,2

44 K/W

TO 5

10

art. no.

SKK 510

aluminiummaterial:

etched (other surfaces on request)surface:

15

3,5

80 K/W

TO 126

SOT 32

SOT 82

9,5

art. no.

KK 92

30

10

11

Ø 2,2

13

4

0,5

2,4

3,3

8,8

60 K/W

TO 126

SOT 32

SOT 82

art. no.

KK 32

special bronze CuZn 6material:

blackenedsurface:

C 19

E 2 – 24Thermal conductive materialC 2 – 3Finger-shaped heatsinks

E 46 – 48Mounting material for semiconductorsC 4 – 9Heatsinks for transistors

A 22 – 83Extruded heatsinksC 10 – 16Attachable heatsinks

A 2 – 8Technical introductionC 21 – 22Heatsinks for D PAK

Small heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

A

B

C

D

E

F

G

H

I

K

L

M

N

– copper heatsinks with excellent heat conductivity

– direct mounting on printed circuit through solderable surface

– especially suitable for SMD components of type D PAK (TO 252), D² PAK (TO 263), D³ PAK (TO 268), SOT 669 LF PAK,

SO IC-8 FL MP, Power SO-8, Power SO-10, Power SO-20, Power SO-36, SO-14, SO-16, SOT 223 etc

– available standard packing: bulk parts or reel

– special packing like magazine, tray etc. on request; - special versions according to customers specifications

–tape width: 44 mm, reel diameter: 330 mm, quantity: FK 244 08 = 450, FK 244 13 = 200

31,5 K/W

23

8

14,8

10

8

10

art. no.

FK 244 08 D PAK ...

weight: 2g

25 K/W

13

23

14,8

10

8

10

art. no.

FK 244 13 D PAK ...

weight: 3.3g

29,3 K/W

26

8

17,8

13

8

10

art. no.

FK 244 08 D2 PAK ...

weight: 2.2g

22,8 K/W

17,8

13

8

10

26

13

art. no.

FK 244 13 D2 PAK ...

weight: 3.6g

26 K/W

22,8

18

8

10

31

8

art. no.

FK 244 08 D3 PAK ...

weight: 2.5g

19,5 K/W 31

22,8

18

8

10

13

art. no.

FK 244 13 D3 PAK ...

weight: 3.9g

... packing (optional)please indicate:

tape and reel=TR

solderable surfacesurface:

copper (Cu)material:

0.6 mmmaterial thickness:

C 21

C 10 – 16Attachable heatsinksA 13 – 17Heatsink profile-overview

C 17 – 19Heatsinks for TO 5 and TO 18A 18 – 20Assignment table

E 2 – 24Thermal conductive materialC 2 – 3Finger-shaped heatsinks

A 2 – 8Technical introductionC 4 – 9Heatsinks for transistors

Heatsinks for D PAK and others

A

B

C

D

E

F

G

H

I

K

L

M

N

–tape width: 24 mm, reel diameter: 330 mm, quantity: FK 250 06 = 450, FK 250 08 = 450, FK 250 10 = 350

–tape width: 24 mm, reel diameter: 330 mm, quantity: FK 251 06 = 450, FK 251 08 = 350, FK 251 10 = 250

15

8

37 K/W

7

11,4

4,5

6,5

art. no.

FK 250 06 LF PAK ...

weight: 1g

15

8

34,8 K/W

7

11,4

6

8

art. no.

FK 250 08 LF PAK ...

weight: 1.1g

15

8

7

11,4

8

10

28,8 K/W

art. no.

FK 250 10 LF PAK ...

weight: 1.2g

13

15

32 K/W

7

11,4

4,5

6,5

art. no.

FK 251 06 LF PAK ...

weight: 1.3g

13

15

29,8 K/W

7

11,4

6

8

art. no.

FK 251 08 LF PAK ...

weight: 1.4g

7

11,4

8

10

13

15

24 K/W

art. no.

FK 251 10 LF PAK ...

weight: 1.5g

... packing (optional)please indicate:

tape and reel=TR

solderable surfacesurface:

copper (Cu)material:

0.6 mmmaterial thickness:

25,4

15,24

11,43

11,43

0,6

19,38

19,38

11 K/W

art. no.

FK 256

solderable surfacesurface:

aluminiummaterial:

0.6 mmmaterial thickness:

C 22

C 10 – 16Attachable heatsinksA 13 – 17Heatsink profile-overview

C 17 – 19Heatsinks for TO 5 and TO 18A 18 – 20Assignment table

E 2 – 24Thermal conductive materialC 2 – 3Finger-shaped heatsinks

A 2 – 8Technical introductionC 4 – 9Heatsinks for transistors

Heatsinks for D PAK and others

A

B

C

D

E

F

G

H

I

K

L

M

N

High performance heatsinks

– exclusive for forced convection

– for radial- and tangential fans

– ﬂow-optimized design, best heat dissipation by means

of especially thick bottom plates

– precise milled ﬂat semiconductor mounting surfaces

– mechanical treatments, special designs and surface

coating for your application

Segment cooling aggregates

Miniature cooling aggregates

Hollow ﬁn cooling aggregates

High performance heatsinks

Segment cooling aggregates

– modular assembly consisting of different circle- and

length segments

– electrical and thermal insulation of the single cooling

segment sections

– standard drilling patterns TO 3 and pressﬁt

– segment proﬁle also sold by the meter

– other fan types and fan voltages upon request

Miniature cooling aggregates

– compact construction for dissipating high power losses

on smallest installation space

– heatsink geometries and ﬁxed length optimal adjusted

to the fan being used

– homogeneous heat dissipation

– mounting of the semi-conductor by means of sliding nut

chanels or speciﬁc snap-to-retaining springs for

transistors

Hollow ﬁn cooling aggregates

– ﬂow-optimized hollow ﬁn geometry

– precise milled ﬂat semiconductor mounting surface,

single- and double-sided

– laminar airﬂow and noise reduction by means of

harmonized chamber systems

– additional treatments, modiﬁcations and designs

according to customers speciﬁcations

date:

pieces p. order:

company:

name/dept.:

town:

street:

signature:

length units:

mm

The segment-line C-D-E-F is

shown against air-escape

orifice, thus on the other side

of the axial fan.

From this view also tick off

cable terminal with axial fan.

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 Fassung

TO-3 Lochung

Preßfit-Bohrg.

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

1

35.0

2

71.5

3

108.0

4

144.5

5

181.0

6

217.5

7

254.0

8

290.5

CF

DE

9

327.0

10

363.5

segment: segment: segment:segment:

voltage:

230 Volt ...... Volt

LA 1 LA 2

~ =

with fan

protection grid

without fan CF

DE

cable connection

Please check off here total length of the cooling aggregate.

Order example

Semiconductor cooling package, consisting of 4 heatsinks LA 1 -2 A (segment C), 1 heatsink LA 1 - 8 A (segment D),

8 heatsinks LA 1 - 1 A (segment E) and 2 heatsinks LA 1- 4 A (segment F).

Total dissipation 1280 W.

How to tick off?

1. Tick on the left hand side the circles corresponding to an eight element long package,

and also at the end of each row of the segments C, D, E and F to deﬁne the length.

2. For segment C: 4 marks for four double length elements, insulated from each other. This indicates 4 units LA 1 - 2.

3. For segment D: 1 mark for one single length of heatsink, 290.5 mm long. This indicates 1 unit LA 1 - 8.

4. For segment E: 8 marks for 8 elements of the standard length (35 mm) each insulated from the other. This indicates 8 units LA 1 - 1.

5. For segment F: 2 marks for each two heatsinks of 144.5 mm length, each insulated from the other. This indicates 2 units LA 1 - 4.

6. For each segment the proﬁle types, either A or B, must be indicated for aggregate LA 1.

7. In the rectangle corresponding to the heatsink elements, the pin layouts for the transistor should also be indicated.

8. In the order form please indicate whether the cooling-aggregate is to be supplied with a fan and whether this is equipped with a

protection-grid, or if it is to be supplied without a fan.

Upon request, it is possible to supply fans for special voltages and higher temperatures.

C F

D E

Order example (see drawing on the right)

D 2

A

B

C

D

E

F

G

H

I

K

L

M

N

POB 1590

Nottebohmstraße 28

Tel.: +49 (0) 23 51 / 4 35-0

D - 58465 Lüdenscheid

D - 58511 Lüdenscheid

Fax: +49 (0) 23 51 / 4 57 54

info@ﬁscherelektronik.de

www.ﬁscherelektronik.de

www.facebook.de/ﬁscherelektronik

date:

pieces p. order:

company:

name/dept.:

town:

street:

signature:

length units:

mm

The segment-line C-D-E-F is

shown against air-escape

orifice, thus on the other side

of the axial fan.

From this view also tick off

cable terminal with axial fan.

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 Fassung

TO-3 Lochung

Preßfit-Bohrg.

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

1

35.0

2

71.5

3

108.0

4

144.5

5

181.0

6

217.5

7

254.0

8

290.5

CF

DE

9

327.0

10

363.5

segment:segment: segment: segment:

voltage:

230 Volt ...... Volt

LA 1 LA 2

~ =

with fan

protection grid

without fan CF

DE

cable connection

Please check off here total length of the cooling aggregate.

D 3

Order / inquiry

A

B

C

D

E

F

G

H

I

K

L

M

N

POB 1590

Nottebohmstraße 28

Tel.: +49 (0) 23 51 / 4 35-0

D - 58465 Lüdenscheid

D - 58511 Lüdenscheid

Fax: +49 (0) 23 51 / 4 57 54

info@ﬁscherelektronik.de

www.ﬁscherelektronik.de

www.facebook.de/ﬁscherelektronik

date:

pieces p. order:

company:

name/dept.:

town:

street:

signature:

length units:

mm

The segment-line C-D-E-F is

shown against air-escape

orifice, thus on the other side

of the axial fan.

From this view also tick off

cable terminal with axial fan.

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 Fassung

TO-3 Lochung

Preßfit-Bohrg.

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

Typ. A B

TO-3 holder

TO-3 hole

pressfit hole

1

35.0

2

71.5

3

108.0

4

144.5

5

181.0

6

217.5

7

254.0

8

290.5

CF

DE

9

327.0

10

363.5

segment:segment: segment: segment:

voltage:

230 Volt ...... Volt

LA 1 LA 2

~ =

with fan

protection grid

without fan CF

DE

cable connection

Please check off here total length of the cooling aggregate.

Order / inquiry

D 4

A

B

C

D

E

F

G

H

I

K

L

M

N

POB 1590

Nottebohmstraße 28

Tel.: +49 (0) 23 51 / 4 35-0

D - 58465 Lüdenscheid

D - 58511 Lüdenscheid

Fax: +49 (0) 23 51 / 4 57 54

info@ﬁscherelektronik.de

www.ﬁscherelektronik.de

www.facebook.de/ﬁscherelektronik

B-Type

90

80

70

60

50

40

30

20

10

0

9

8

7

6

5

4

3

2

1

0

20 40 60 80 100 120 140 160 180 200

0 0,5 1 1,5 2 2,5 3

[PA]

p

[mm WS ]

V [m 3/h]

V [m 3/min]

35

30

25

20

15

10

05

20 40 60 80 100 [CFM]

[INCHES H2O]

60 Hz

50 Hz

38

Y

X7,5

119

129

170

105

129

105

86

1,5

6,2 100

58,5

62,7

42

A-Type 84

48

6,5

58,5

35

V [m3/min]

.

V [m3/h]

.

dim. [mm]L [mm]art. no.

YX

dim. [mm]L [mm]art. no.

YX

271.1208.5217.5LA 1 06 ...88.626.035.0LA 1 01 ...

125.162.571.5LA 1 02 ... 307.6245.0254.0LA 1 07 ...

344.1281.5290.5LA 1 08 ...161.699.0108.0LA 1 03 ...

198.1135.5144.5LA 1 04 ... 380.6318.0327.0LA 1 09 ...

417.1354.5363.5LA 1 10 ...234.6172.0181.0LA 1 05 ...

... for A-types: please add an "A", for B-types: please add a "B".

L: unit lengths of the segments incl. insulation; X: mounting distance; Y: length of the cooling aggregate incl. fan

24 V DC fan on request

In case of order please use order form.

segments also available in meter length:

art. no. for A-type: LA 1 1000 A; art. no. for B-type: LA 1 1000 B

Other fan types and fan voltages on request.

Technical data of the fans

... 230

ebmpapst, ball bearingtype

119x119x38 mmdimensions

230 V ACtension

19 Wpower inout

160 m3/h

max. air volume

-40°C... +85°Ctemperature range

47 dB(A)noise level

2,650 min-1

speed

550 gweight

L10 < 37,500 h (40°C)failure rate (L10)

D 5

D 2Order exampleD 9 – 11Miniature cooling aggregates

D 3 – 4Order formD 36Protection grid for axial fans

E 49 – 50Mounting parts for heatsinksE 2 – 29Thermal conductive material

A 2 – 8Technical introductionD 30Heatsinks with hollow fin profile

Segment cooling aggregates

A

B

C

D

E

F

G

H

I

K

L

M

N

The thermal resistance in the following diagrams is given on the base of a total dissipation of 40 Watt per heatsink of the

„A“-type. When using „B“-types this value increases by 3 %.

1. Cooling aggregate consisting of 4 heatsinks LA 1 - 1 A.

Total dissipation 160 W.

2. Cooling aggregate consisting of 4 heatsinks LA 1 - 1 A and 2 x 1 heatsink LA 1 - 2 A.

Total dissipation 320 W.

3. Cooling aggregate consisting of 4 heatsinks LA 1 - 1 A, 2 heatsinks

LA 1 - 2 A and 2 x 1 heatsink LA 1 - 4 A. Total dissipation 640 W.

4. Cooling aggregate consisting of 6 heatsinks LA 1 - 1 A, 3 heatsinks

LA 1 - 2 A and 2 x 1 heatsink LA 1 - 6 A. Total dissipation 960 W.

5. Cooling aggregate consisting of 8 heatsinks LA 1 - 1 A, 4 heatsinks LA 1 - 2 A,

2 heatsinks LA 1 - 4 A and 1 heatsink LA 1 - 8 A. Total dissipation 1280 W.

6. Cooling aggregate consisting of 10 heatsinks LA 1 – 1 A, 2 heatsinks LA 1 – 5 A,

and 2 x 1 heatsink LA 1 – 10 A. Total dissipation 1600 W.

K/W

K/W

K/W

K/W

K/W

K/W

D 6

D 2Order exampleD 9 – 11Miniature cooling aggregates

D 3 – 4Order formD 36Protection grid for axial fans

E 49 – 50Mounting parts for heatsinksE 2 – 29Thermal conductive material

A 2 – 8Technical introductionD 30Heatsinks with hollow fin profile

Thermal resistance LA 1

A

B

C

D

E

F

G

H

I

K

L

M

N

33,8

22

72,5

30

45,5

100

148

72

100

75

M4

Y

X5

92

38

V [m3/min]

.

V [m3/h]

.

dim. [mm]L [mm]art. no.

YX

dim. [mm]L [mm]art. no.

YX

274.5236.7217.5LA 2 06 ...92.054.235.0LA 2 01 ...

128.590.771.5LA 2 02 ... 311.0273.2254.0LA 2 07 ...

347.5309.7290.5LA 2 08 ...165.0127.2108.0LA 2 03 ...

201.5163.7144.5LA 2 04 ... 384.0346.2327.0LA 2 09 ...

420.5382.7363.5LA 2 10 ...238.0200.2181.0LA 2 05 ...

L: unit lengths of the segments incl. insulation; X: mounting distance; Y: length of the cooling aggregate incl. fan

24 V DC fan on request

In case of order please use order form.

segments also available in meter length: art. no. for A-type: LA 1 1000 A; art. no. for B-type: LA 2 1000 B

Other fan types and fan voltages on request.

Technical data of the fans

... 230

ebmpapst, ball bearingtype

92x92x38 mmdimensions

230 V ACtension

12 Wpower inout

75 m3/h

max. air volume

-40°C... +75°Ctemperature range

37 dB(A)noise level

2,700 min-1

speed

420 gweight

L10 < 52,500 h (40°C)failure rate (L10)

D 7

D 2Order exampleD 9 – 11Miniature cooling aggregates

D 3 – 4Order formD 36Protection grid for axial fans

E 49 – 50Mounting parts for heatsinksE 2 – 29Thermal conductive material

A 2 – 8Technical introductionD 30Heatsinks with hollow fin profile

Segment cooling aggregates

A

B

C

D

E

F

G

H

I

K

L

M

N

The thermal resistance in the following diagrams is given on the base of a total dissipation of 40 Watt per heatsink of the

„A“-type.

1. Cooling aggregate consisting of 4 heatsinks LA 2 - 1. Total dissipation 160 W

maximal.

2. Cooling aggregate consisting of 4 heatsinks LA 2 - 1 and 2 x 1 heatsink LA 2 - 2.

Total dissipation 320 W.

3. Cooling aggregate consisting of 4 heatsinks LA 2 - 1, 2 heatsinks LA 2 - 2

and 2 x 1 heatsink LA 2 - 4. Total dissipation 640 W.

4. Cooling aggregate consisting of 6 heatsinks LA 2 - 1, 3 heatsinks LA 2 - 2

and 2 x 1 heatsink LA 2 - 6. Total dissipation 960 W.

5. Cooling aggregate consisting of 8 heatsinks LA 2 - 1, 4 heatsinks LA 2 - 2, 2

heatsinks LA 2 - 4 and 1 heatsink LA 2 - 8. Total dissipation 1280 W.

6. Cooling aggregate consisting of 10 heatsinks LA 2 - 1, 2 heatsinks LA 2 - 5,

and 2 x 1 heatsink LA 2 - 10. Total dissipation 1600 W.

K/W

K/W

K/W

K/W

K/W

K/W

D 8

D 2Order exampleD 9 – 11Miniature cooling aggregates

D 3 – 4Order formD 36Protection grid for axial fans

E 49 – 50Mounting parts for heatsinksE 2 – 29Thermal conductive material

A 2 – 8Technical introductionD 30Heatsinks with hollow fin profile

Thermal resistance LA 2

A

B

C

D

E

F

G

H

I

K

L

M

N

– made for dissipation of high power within a very small space

– approximate length is optimised to the fan motor

– slide-nut channels for M3 nuts for mounting the transistors and circuit boards

– other fan types and fan voltages on request

0,3 K/W

140 mm

3,1

5,5

1

3,5

4

75

50

25

75

50

15

art. no.

LAM 1

0,73 K/W

100 mm

3,1

5,5

1

3,5

4

50

13

50

11

32

32

art. no.

LAM 2

natural colour anodisedsurface:

Technical data of the fans

LAM 2LAM 1

ebmpapst 412 Febmpapst 612 NHH-118type

40x40x10 mm60x60x25 mmdimensions

12 V DC12 V DCtension

0.7 W2.9 Wpower inout

8 m3/h56 m3/h

max. air volume

-20°C... +70°C-20°C... +70°Ctemperature range

22.1 dB(A)41 dB(A)noise level

5,400 min-1

6,800 min-1

speed

17 g66 gweight

L10 < 45,000 h (20°C)L10 < 60,000 h (40°C)failure rate (L10)

D 9

A 131 – 133Fluid coolersA 115 – 117Retaining springs for transistors

D 36Protection grid for axial fansA 137 – 138Special heatsink design

E 5 – 15Thermally conductive foilD 15 – 25Hollow-fin cooling aggregates

A 2 – 8Technical introductionD 26 – 35High capacity cooling aggregat.

Miniature cooling aggregates

A

B

C

D

E

F

G

H

I

K

L

M

N

– compact design

– homogeneous heat dissipation

– mounting possible on any side

– powerful axial-fan motor

– other lengths, special designs and processing according to customer´s requirements

– other surfaces treatment, fan types and fan voltages on request

0,15 4 x

10

Rth [K/W]

1,6

1,4

1,2

1,0

0,8

25 50 75 100 125 150

5 V DC

12 V DC

3

30

24

30

24

3

[mm]

art. no.

LAM 3 ...

... fan type...

50 75 100 125 150 mm

please indicate:

5 V DC=5

12 V DC=12

natural colour anodisedsurface:

–with grooves for lock-in retaining spring for transistors THFU ➔A 119

– compact design

– homogeneous heat dissipation

– mounting possible on any side

– powerful axial-fan motor

– other lengths, special designs and processing according to customers requirements

– other surfaces treatment, fan types and fan voltages on request

10

Rth [K/W]

1,6

1,4

1,2

1,0

0,8

25 50 75 100 125 150

5 V DC

12 V DC

3

30

30

20

3

24

24

[mm]

0,1 2 x

0,15 2 x

art. no.

LAM 3 K ...

... fan type...

50 75 100 125 150 mm

please indicate:

5 V DC=5

12 V DC=12

natural colour anodisedsurface:

Technical data of the fans

... 12... 5

Sepa, ball bearingSepa, ball bearingtype

30x30x10 mm30x30x10 mmdimensions

12 V DC5 V DCtension

7.7 m3/h6.8 m3/h

max. air volume

70 mA130 mAcur. consumpt.

-10°C... +70°C-10°C... +70°Ctemperature range

23 dB(A)21 dB(A)noise level

9,100 min-1

8,500 min-1

speed

8 g8 gweight

L10 < 95,000 h (20°C)

MTBF < 280,000 h (20°C)

L10 < 95,000 h (20°C)

MTBF < 280,000 h (20°C)

failure rate (L10)

D 10

A 131 – 133Fluid coolersA 115 – 117Retaining springs for transistors

D 36Protection grid for axial fansA 137 – 138Special heatsink design

E 5 – 15Thermally conductive foilD 15 – 25Hollow-fin cooling aggregates

A 2 – 8Technical introductionD 26 – 35High capacity cooling aggregat.

Miniature cooling aggregates

A

B

C

D

E

F

G

H

I

K

L

M

N

– compact design

– homogeneous heat dissipation

– mounting possible on any side

– powerful axial-fan motor

– other lengths, special designs and processing according to customer´s requirements

– other surfaces treatment, fan types and fan voltages on request

0,15 4 x

40

1,6

1,4

1,2

1,0

0,8

0,6

0,4

12 V DC

24 V DC

Rth [K/W]

25 50 75 100 125 150

5 V DC

40

32

40

32

3

3

[mm]

(25)

20

art. no.

LAM 4 ...

... fan type...

50 75 100 125 150 mm

please indicate:

5 V DC=5

12 V DC=12

24 V DC=24

natural colour anodisedsurface:

–with grooves for lock-in retaining spring for transistors THFU ➔A 119

– compact design

– homogeneous heat dissipation

– mounting possible on any side

– powerful axial-fan motor

– other lengths, special designs and processing according to customer's requirements

– other surfaces treatment, fan types and fan voltages on request

40

40

32

40

3

32

1,6

1,4

1,2

1,0

0,8

0,6

0,4

12 V DC

24 V DC

Rth [K/W]

25 50 75 100 125 150

5 V DC

26,5

3

[mm]

0,1 2 x

0,15 2 x

20

(25)

art. no.

LAM 4 K ...

... fan type...

50 75 100 125 150 mm

please indicate:

5 V DC=5

12 V DC=12

24 V DC=24

natural colour anodisedsurface:

Technical data of the fans

... 24... 12... 5

ebmpapst 414 JHHebmpapst 412 JHHebmpapst 405type

40x40x25 mm40x40x25 mm40x40x20 mmdimensions

24 V DC12 V DC5 V DCtension

3.6 W3.3 W0.9 Wpower inout

24 m3/h24 m3/h10 m3/h

max. air volume

-20°C... +60°C-20°C... +60°C-20°C... +70°Ctemperature range

46 dB(A)46 dB(A)18 dB(A)noise level

13,000 min-1

13,000 min-1

6,000 min-1

speed

50 g50 g27 gweight

L10 < 57,500 h (40°C)

L10 < 35,000 h (tmax)

L10 < 57,500 h (40°C)

L10 < 35,000 h (tmax)

L10 < 50,000 h (40°C)

L10 < 20,000 h (tmax)

failure rate (L10)

D 11

A 131 – 133Fluid coolersA 115 – 117Retaining springs for transistors

D 36Protection grid for axial fansA 137 – 138Special heatsink design

E 5 – 15Thermally conductive foilD 15 – 25Hollow-fin cooling aggregates

A 2 – 8Technical introductionD 26 – 35High capacity cooling aggregat.

Miniature cooling aggregates

A

B

C

D

E

F

G

H

I

K

L

M

N

– compact design

– homogeneous heat dissipation

– mounting possible on any side

– powerful axial-fan motor

– other lengths, special designs and processing according to customer´s requirements

– other surfaces treatment, fan types and fan voltages on request

50

1,4

1,2

1,0

0,8

0,6

0,4

0,2

50

42

50

42

4,5

4,5 Rth [K/W]

25 50 75 100 125 150 [mm]

5 V DC

12 V DC

24 V DC

0,15 4 x

10

(15)

art. no.

LAM 5 ...

... fan type...

50 75 100 125 150 mm

please indicate:

5 V DC=5

12 V DC=12

24 V DC=24

natural colour anodisedsurface:

–with grooves for lock-in retaining spring for transistors THFU ➔A 119

– compact design

– homogeneous heat dissipation

– mounting possible on any side

– powerful axial-fan motor

– other lengths, special designs and processing according to customer´s requirements

– other surfaces treatment, fan types and fan voltages on request

50

1,4

1,2

1,0

0,8

0,6

0,4

0,2

50

42

50

42

4,5

4,5 Rth [K/W]

25 50 75 100 125 150 [mm]

5 V DC

12 V DC

24 V DC

27,1

0,2 4 x

(15)

10

art. no.

LAM 5 K ...

... fan type...

50 75 100 125 150 mm

please indicate:

5 V DC=5

12 V DC=12

24 V DC=24

natural colour anodisedsurface:

Technical data of the fans

... 24... 12... 5

ebmpapstSepa, ball bearingSepa, ball bearingtype

50x50x15 mm50x50x10 mm50x50x10 mmdimensions

24 V DC12 V DC5 V DCtension

20 m3/h14.3 m3/h10 m3/h

max. air volume

-20°C... +70°C-10°C... +70°C-10°C... +70°Ctemperature range

5,000 min-1

4,800 min-1

3,400 min-1

speed

30 dB(A)22 dB(A)17 dB(A)noise level

27 g19 g19 gweight

L10 50,000 h (20°C)L10 < 95,000 h (20°C)

MTBF < 280,000 h (20°C)

L10 < 95,000 h (20°C)

MTBF < 280,000 h (20°C)

failure rate (L10)

withwithalarm output

D 12

A 131 – 133Fluid coolersA 115 – 117Retaining springs for transistors

D 36Protection grid for axial fansA 137 – 138Special heatsink design

E 5 – 15Thermally conductive foilD 15 – 25Hollow-fin cooling aggregates

A 2 – 8Technical introductionD 26 – 35High capacity cooling aggregat.

Miniature cooling aggregates

A

B

C

D

E

F

G

H

I

K

L

M

N

Heatsink-cooling aggregates

–with grooves for lock-in retaining springs THFU ➔A 119

– screw-in solder pin M 3 (art. no.: ELS 3)

– different lengths, special designs and machinings according to customer specifications

– different surfaces, fan types and fan voltages upon request

200 [mm]

Rth [K/W]

50 100

0,4

0,8

1,2

1,6

2,0

50

65,8

50

75,5

57,5

29,5

50

24 V DC

12 V DC

150

art. no.

LA 27 K ...

... fan type...

50 75 84 94 100 125 150 mm

please indicate:

12 V DC=12

24 V DC=24

Technical data of the fans

... 24... 12

ebmpapst, ball bearingebmpapst, ball bearingtype

60x60x25 mm60x60x25 mmdimensions

24 V DC12 V DCtension

2.9 W2.9 Wpower inout

56 m3/h56 m3/h

max. air volume

-20°C... +70°C-20°C... +70°Ctemperature range

41 dB(A)41 dB(A)noise level

6,850 min-1

6,800 min-1

speed

66 g66 gweight

L10 < 60,000 h (40°C)L10 < 60,000 h (40°C)failure rate (L10)

D 13

A 22 – 83Extruded heatsinksD 5 – 7Cooling aggreg. in segment mount.

D 33 – 35Cooling aggregates with radial fanD 9 – 11Miniature cooling aggregates

D 30Heatsinks with hollow fin profileD 36Protection grid for axial fans

A 2 – 8Technical introductionE 2 – 29Thermal conductive material

Cooling aggregates with axial fan

A

B

C

D

E

F

G

H

I

K

L

M

N

Heatsink-cooling aggregates

– especially suitable for IGBT, SSR, semiconductor modules, high performance transistors etc.

– effective construction with axial fans

– good thermal performance

– additional machining according to customer's instructions

– cooling aggregates also available without fans

– other fan types and fan voltages on request

150 [mm]

Rth [K/W]

105

105

119

8

119

55

230

V

AC

50 100

0,2

0,4

0,6

0,8

1,0

24 V DC

art. no.

LA 4 ...

150 [mm]

Rth [K/W]

57

112

116

10,5 2

230 V AC

24 V DC

50 100

0,2

0,4

0,6

0,8

1,0

art. no.

LA 5 ... *for one segment

... fan type...

75 100 150 mm

please indicate:

24 V DC=24

230 V AC=230

Technical data of the fans

... 230... 24

ebmpapst, ball bearingebmpapst, ball bearingtype

119x119x38 mm119x119x38 mmdimensions

230 V AC24 V DCtension

19 W11 Wpower inout

160 m3/h237 m3/h

max. air volume

-40°C... +85°C-30°C ... +70°Ctemperature range

47 dB(A)57 dB(A)noise level

2,650 min-1

4,400 min-1

speed

550 g390 gweight

L10 < 37,500 h (40°C)L10 < 70,000 h (40°C)failure rate (L10)

D 14

A 22 – 83Extruded heatsinksD 5 – 7Cooling aggreg. in segment mount.

D 33 – 35Cooling aggregates with radial fanD 9 – 11Miniature cooling aggregates

D 30Heatsinks with hollow fin profileD 36Protection grid for axial fans

A 2 – 8Technical introductionE 2 – 29Thermal conductive material

Cooling aggregates with axial fan

A

B

C

D

E

F

G

H

I

K

L

M

N

Hollow-fin cooling aggregates

– geometry of hollow fin opimising the air flow

– particularly effective heat dissipation

– compact construction

– milled flat semiconductor mounting surface

– other fan types and fan voltages on request

50

62 ±0,5

50

11,5 ±0,5

74 ±0,5

100 200 300

0,10

0,15

0,20

0,25

0,30

[mm]

Rth [K/W]

1,2

1,2

24 V DC

12 V DC

≤ Rz10 ≤ 0,1 100

art. no.

LA 6 ... without air flow chamber

74 ±0,5

125 ±0,5

1,4

1,2

100 200

0,05

0,10

0,15

0,20

0,25

300 [mm]

Rth [K/W]

24 V DC

12 V DC

≤ Rz10 ≤ 0,1 100

art. no.

LA 7 ... without air flow chamber

74 ±0,5

188 ±0,5 100 200

0,05

0,10

0,15

0,20

0,25

300 [mm]

Rth [K/W]

24 V DC

12 V DC

≤ Rz10 ≤ 0,1 100

art. no.

LA 8 ... without air flow chamber

... fan type...

100 150 200 250 300 mm

please indicate:

12 V DC=12

24 V DC=24

Technical data of the fans

... 24... 12

ebmpapst, ball bearingebmpapst, ball bearingtype

60x60x25 mm60x60x25 mmdimensions

24 V DC12 V DCtension

2.9 W2.9 Wpower inout

56 m3/h56 m3/h

max. air volume

-20°C... +70°C-20°C... +70°Ctemperature range

41 dB(A)41 dB(A)noise level

6,850 min-1

6,800 min-1

speed

66 g66 gweight

L10 < 60,000 h (40°C)L10 < 60,000 h (40°C)failure rate (L10)

D 15

A 137 – 138Special heatsink designD 9 – 11Miniature cooling aggregates

D 30Heatsinks with hollow fin profileD 36Protection grid for axial fans

E 2 – 24Thermal conductive materialA 12Drilling pattern for Solid State Relais

A 2 – 8Technical introductionA 57 – 58High capacity heatsinks

Cooling aggregates with axial fan

A

B

C

D

E

F

G

H

I

K

L

M

N

Hollow-fin cooling aggregates

– geometry of hollow fin optimising the air flow

– particularly effective heat dissipation

– compact construction

– milled flat semiconductor mounting surface

– other fan types and fan voltages on request

0,10

0,15

0,20

0,25

0,30

100 200 300

Rth [K/W]

[mm]

24 V DC

12 V DC

≤ 0,1 100

≤ Rz10

60

25 30

74 ±0,5

50

62 ±0,5

50

11,5 ±0,5

74 ±0,5

art. no.

LA V 6 ... with air flow chamber

Rth [K/W]

24 V DC

12 V DC

0,04

0,08

0,12

0,16

0,20

100 200 300 [mm]

74 ±0,5

125 ±0,5

≤ 0,1 100

≤ Rz10

art. no.

LA V 7 ... with air flow chamber

74 ±0,5

188 ±0,5 100 200 300

Rth [K/W]

[mm]

0,04

0,06

0,08

0,10

0,12

24 V DC

12 V DC

≤ 0,1 100

≤ Rz10

art. no.

LA V 8 ... with air flow chamber

... fan type...

100 150 200 250 300 mm

please indicate:

12 V DC=12

24 V DC=24

Technical data of the fans

... 24... 12

ebmpapst, ball bearingebmpapst, ball bearingtype

60x60x25 mm60x60x25 mmdimensions

24 V DC12 V DCtension

2.9 W2.9 Wpower inout

56 m3/h56 m3/h

max. air volume

-20°C... +70°C-20°C... +70°Ctemperature range

41 dB(A)41 dB(A)noise level

6,850 min-1

6,800 min-1

speed

66 g66 gweight

L10 < 60,000 h (40°C)L10 < 60,000 h (40°C)failure rate (L10)

D 16

A 137 – 138Special heatsink designD 9 – 11Miniature cooling aggregates

D 30Heatsinks with hollow fin profileD 36Protection grid for axial fans

E 2 – 24Thermal conductive materialA 12Drilling pattern for Solid State Relais

A 2 – 8Technical introductionA 57 – 58High capacity heatsinks

Cooling aggregates with axial fan

A

B

C

D

E

F

G

H

I

K

L

M

N

Hollow-fin cooling aggregates

– geometry of hollow fin opimising the air flow

– particularly effective heat dissipation

– compact construction

– milled flat semiconductor mounting surface

– other fan types and fan voltages on request

83 ±0,5

80

11,5 ±0,5

+1

–0,5 200

0,05

0,10

0,15

0,20

0,30

230 V AC

100

24V DC

0,25

300 [mm]

Rth [K/W]

≤ 0,1 100

≤ Rz10

art. no.

LA 9 ... without air flow chamber

230 V AC

24 V DC

200

100 300

Rth [K/W]

[mm]

0,02

0,06

0,10

0,14

0,20

0,18

160 +1,5

–1

83 ±0,5

11 ±0,5

≤ Rz10 ≤ 0,1 100

art. no.

LA 10 ... without air flow chamber

240 +2

–0,5

10

±0,5

83 ±0,5

230V AC

100 200 300

24V DC

0,04

0,06

0,08

0,10

0,12

Rth [K/W]

[mm]

≤ 0,1 100

≤ Rz10

art. no.

LA 11 ... without air flow chamber

... fan type...

100 150 200 250 300 mm

please indicate:

24 V DC=24

230 V AC=230

Technical data of the fans

... 230... 24

ebmpapst, ball bearingebmpapst, ball bearingtype

80x80x38 mm80x80x32 mmdimensions

230 V AC24 V DCtension

12 W6 Wpower inout

50 m3/h80 m3/h

max. air volume

-40°C... +90°C-20°C... 75°Ctemperature range

31 dB(A)48 dB(A)noise level

2,800 min-1

5,000 min-1

speed

490 g170 gweight

L10 < 52,500 h (40°C)L10 < 55,000 h (40°C)failure rate (L10)

D 17

A 137 – 138Special heatsink designD 9 – 11Miniature cooling aggregates

D 30Heatsinks with hollow fin profileD 36Protection grid for axial fans

E 2 – 24Thermal conductive materialA 12Drilling pattern for Solid State Relais

A 2 – 8Technical introductionA 57 – 58High capacity heatsinks

Cooling aggregates with axial fan

A

B

C

D

E

F

G

H

I

K

L

M

N

Hollow-fin cooling aggregates

– geometry of hollow fin optimising the air flow

– particularly effective heat dissipation

– compact construction

– milled flat semiconductor mounting surface

– other fan types and fan voltages on request

80

38 30

83 ±0,5

80

11,5

±0,5

83 ±0,5

+1

–0,5

0,10

0,15

0,20

0,25

0,30

100 200 300

230

V

AC

24

V

DC

Rth [K/W]

[mm]

≤ 0,1 100

≤ Rz10

art. no.

LA V 9 ... with air flow chamber

0,05

0,10

0,15

0,20

0,25

100 200 300

230

V

AC

24

V

DC

Rth [K/W]

[mm]

160 +1,5

–1

11

±0,5

83 ±0,5

≤ 0,1 100

≤ Rz10

art. no.

LA V 10 ... with air flow chamber

240 +2

–0,5

10

±0,5

83 ±0,5

0,04

0,06

0,08

0,10

0,12

100 200 300

230

V

AC

24

V

DC

Rth [K/W]

[mm]

≤ 0,1 100

≤ Rz10

art. no.

LA V 11 ... with air flow chamber

... fan type...

100 150 200 250 300 mm

please indicate:

24 V DC=24

230 V AC=230

Technical data of the fans

... 230... 24

ebmpapst, ball bearingebmpapst, ball bearingtype

80x80x38 mm80x80x32 mmdimensions

230 V AC24 V DCtension

12 W6 Wpower inout

50 m3/h80 m3/h

max. air volume

-40°C... +90°C-20°C... 75°Ctemperature range

31 dB(A)48 dB(A)noise level

2,800 min-1

5,000 min-1

speed

490 g170 gweight

L10 < 52,500 h (40°C)L10 < 55,000 h (40°C)failure rate (L10)

D 18

A 137 – 138Special heatsink designD 9 – 11Miniature cooling aggregates

D 30Heatsinks with hollow fin profileD 36Protection grid for axial fans

E 2 – 24Thermal conductive materialA 12Drilling pattern for Solid State Relais

A 2 – 8Technical introductionA 57 – 58High capacity heatsinks

Cooling aggregates with axial fan

A

B

C

D

E

F

G

H

I

K

L

M

N

Hollow-fin cooling aggregates

– extremly low losses due to optimised hollow fin geometry

– particularly effective heat dissipation

– compact design with axial fan

– milled flat semiconductor mounting surface

– addtional design to customer's intructions

– other fan types and fan voltages on request

120 ±0,5

120 ±0,8 200

0,05

0,10

0,15

0,20

0,25

100 300

Rth [K/W]

[mm]

230V AC

24V DC

15 ±0,5

≤ 0,1 100

≤ Rz10

art. no.

LA 14 ... without air flow chamber

120 ±0,5

200

0,02

0,04

0,06

0,08

0,10

100 300

Rth [K/W]

[mm]

230V AC

24V DC

15 ±0,5

240 -1,2

+1,4

≤ 0,1 100

≤ Rz10

art. no.

LA 15 ... without air flow chamber

... fan type...

100 150 200 250 300 400 mm

please indicate:

24 V DC=24

230 V AC=230

Technical data of the fans

... 230... 24

ebmpapst, ball bearingebmpapst, ball bearingtype

119x119x38 mm119x119x38 mmdimensions

230 V AC24 V DCtension

19 W11 Wpower inout

160 m3/h237 m3/h

max. air volume

-40°C... +85°C-30°C ... +70°Ctemperature range

47 dB(A)57 dB(A)noise level

2,650 min-1

4,400 min-1

speed

550 g390 gweight

L10 < 37,500 h (40°C)L10 < 70,000 h (40°C)failure rate (L10)

D 19

A 137 – 138Special heatsink designD 9 – 11Miniature cooling aggregates

D 30Heatsinks with hollow fin profileD 36Protection grid for axial fans

E 2 – 24Thermal conductive materialA 12Drilling pattern for Solid State Relais

A 2 – 8Technical introductionA 57 – 58High capacity heatsinks

Cooling aggregates with axial fan

A

B

C

D

E

F

G

H

I

K

L

M

N

Hollow-fin cooling aggregates

– extremly low losses due to optimised hollow fin geometry

– particularly effective heat dissipation

– compact design with axial fan

– milled flat semiconductor mounting surface

– addtional design to customer's intructions on request

– other fan types and fan voltages on request

200

0,05

0,10

0,15

0,20

0,25

100 300

230

V

AC

24

V

DC

Rth [K/W]

[mm]

120 ±0,8

15

±0,5

120 ±0,5

119

38 30

120 ±0,5

≤ 0,1 100

≤ Rz10

art. no.

LA V 14 ... with air flow chamber

240 +1,4

–1,2

15

±0,5

120

±0,5

200

0,02

0,04

0,06

0,08

0,10

100 300

230

V

AC

24

V

DC

Rth [K/W]

[mm]

≤ 0,1 100

≤ Rz10

art. no.

LA V 15 ... with air flow chamber

... fan type...

100 150 200 250 300 400 mm

please indicate:

24 V DC=24

230 V AC=230

Technical data of the fans

... 230... 24

ebmpapst, ball bearingebmpapst, ball bearingtype

119x119x38 mm119x119x38 mmdimensions

230 V AC24 V DCtension

19 W11 Wpower inout

160 m3/h237 m3/h

max. air volume

-40°C... +85°C-30°C ... +70°Ctemperature range

47 dB(A)57 dB(A)noise level

2,650 min-1

4,400 min-1

speed

550 g390 gweight

L10 < 37,500 h (40°C)L10 < 70,000 h (40°C)failure rate (L10)

D 20

A 137 – 138Special heatsink designD 9 – 11Miniature cooling aggregates

D 30Heatsinks with hollow fin profileD 36Protection grid for axial fans

E 2 – 24Thermal conductive materialA 12Drilling pattern for Solid State Relais

A 2 – 8Technical introductionA 57 – 58High capacity heatsinks

Cooling aggregates with axial fan

A

B

C

D

E

F

G

H

I

K

L

M

N

Hollow-fin cooling aggregates

– extremly low losses due to optimised hollow fin geometry

– effective heat dissipation

– compact construction with axial fans

– two oposite mounting surfaces are milled flat

– additional treatment upon customer's request

– other fan types and fan voltages on request

≤ Rz10

120 ±0,5

122 ±0,8

200

0,03

0,06

0,09

0,12

0,15

100

230 V AC

24

V

DC

300

Rth [K/W]

[mm]

10 ±0,5

10 ±0,5

≤ 0,1 100

≤ Rz10

100≤0,1

art. no.

LA 17 ... without air flow chamber

≤ Rz10

120 ±0,5

243 ±1,5

≤ 0,1 100

≤ Rz10

100≤0,1

10

±0,5

10

±0,5

200

0,02

0,03

0,04

0,05

0,06

100

230 V AC

24

V

DC

300

Rth [K/W]

[mm]

0,07

art. no.

LA 18 ... without air flow chamber

... fan type...

100 150 200 250 300 400 mm

please indicate:

24 V DC=24

230 V AC=230

Technical data of the fans

... 230... 24

ebmpapst, ball bearingebmpapst, ball bearingtype

119x119x38 mm119x119x38 mmdimensions

230 V AC24 V DCtension

19 W11 Wpower inout

160 m3/h237 m3/h

max. air volume

-40°C... +85°C-30°C ... +70°Ctemperature range

47 dB(A)57 dB(A)noise level

2,650 min-1

4,400 min-1

speed

550 g390 gweight

L10 < 37,500 h (40°C)L10 < 70,000 h (40°C)failure rate (L10)

D 21

A 137 – 138Special heatsink designD 9 – 11Miniature cooling aggregates

D 30Heatsinks with hollow fin profileD 36Protection grid for axial fans

E 2 – 24Thermal conductive materialA 12Drilling pattern for Solid State Relais

A 2 – 8Technical introductionA 57 – 58High capacity heatsinks

Cooling aggregates with axial fan

A

B

C

D

E

F

G

H

I

K

L

M

N

Hollow-fin cooling aggregates

– extremly low losses due to optimised hollow fin geometry

– effective heat dissipation

– compact construction with axial fans

– two oposite mounting surfaces are milled flat

– additional treatment upon customer's request

– other fan types and fan voltages on request

≤ Rz10

120 ±0,5

122 ±0,8

119

38 30

120 ±0,5

200

0,03

0,06

0,09

0,12

0,15

100

230

V

AC

24

V

DC

300

Rth [K/W]

[mm]

10 ±0,5

10 ±0,5

≤ 0,1 100

≤ Rz10

100≤0,1

art. no.

LA V 17 ... with air flow chamber

≤ Rz10

120 ±0,5

243 ±1,5

≤ 0,1 100

≤ Rz10

100≤0,1

10

±0,5

10 ±0,5

200

0,01

0,02

0,03

0,04

0,05

100

230 V AC

24

V

DC

300 [mm]

0,06

Rth [K/W]

38

119

30

art. no.

LA V 18 ... with air flow chamber

... fan type...

100 150 200 250 300 400 mm

please indicate:

24 V DC=24

230 V AC=230

Technical data of the fans

... 230... 24

ebmpapst, ball bearingebmpapst, ball bearingtype

119x119x38 mm119x119x38 mmdimensions

230 V AC24 V DCtension

19 W11 Wpower inout

160 m3/h237 m3/h

max. air volume

-40°C... +85°C-30°C ... +70°Ctemperature range

47 dB(A)57 dB(A)noise level

2,650 min-1

4,400 min-1

speed

550 g390 gweight

L10 < 37,500 h (40°C)L10 < 70,000 h (40°C)failure rate (L10)

D 22

A 137 – 138Special heatsink designD 9 – 11Miniature cooling aggregates

D 30Heatsinks with hollow fin profileD 36Protection grid for axial fans

E 2 – 24Thermal conductive materialA 12Drilling pattern for Solid State Relais

A 2 – 8Technical introductionA 57 – 58High capacity heatsinks

Cooling aggregates with axial fan

A

B

C

D

E

F

G

H

I

K

L

M

N

Hollow-fin cooling aggregates

– extremly low losses due to optimised hollow fin geometry

– effective heat dissipation

– compact construction with axial fans

– two oposite mounting surfaces are milled flat

– additional treatment upon customer's request

– other fan types and fan voltages on request

93 ±0,5

92 ±0,8

9,5 ±0,5 9,5 ±0,5

300

Rth [K/W]

[mm]

230 V AC

24 V DC

0,08

0,12

0,16

0,20

≤ 0,1 100

≤ Rz10

≤ Rz10 100≤0,1

100 200

art. no.

LA 21 ... without air flow chamber

≤ Rz10

93 ±0,5

184 ±1,25 200

0,03

0,06

0,09

0,12

0,15

100

230 V AC

24

V

DC

300

Rth [K/W]

[mm]

≤ 0,1 100

≤ Rz10

100≤0,1

9 ±0,5

9 ±0,5

art. no.

LA 22 ... without air flow chamber

... fan type...

100 150 200 250 300 400 mm

please indicate:

24 V DC=24

230 V AC=230

Technical data of the fans

... 230... 24

ebmpapst, ball bearingebmpapst, ball bearingtype

92x92x38 mm92x92x32 mmdimensions

230 V AC24 V DCtension

12 W5 Wpower inout

75 m3/h107 m3/h

max. air volume

-40°C... +75°C-20°C... 75°Ctemperature range

37 dB(A)47 dB(A)noise level

2,700 min-1

4,000 min-1

speed

420 g190 gweight

L10 < 52,500 h (40°C)L10 < 57,500 h (40°C)failure rate (L10)

D 23

A 137 – 138Special heatsink designD 9 – 11Miniature cooling aggregates

D 30Heatsinks with hollow fin profileD 36Protection grid for axial fans

E 2 – 24Thermal conductive materialA 12Drilling pattern for Solid State Relais

A 2 – 8Technical introductionA 57 – 58High capacity heatsinks

Cooling aggregates with axial fan

A

B

C

D

E

F

G

H

I

K

L

M

N

Hollow-fin cooling aggregates

– extremly low losses due to optimised hollow fin geometry

– effective heat dissipation

– compact construction with axial fans

– two oposite mounting surfaces are milled flat

– additional treatment upon customer's request

– other fan types and fan voltages on request

≤ Rz10 100≤0,1

93 ±0,5

92 ±0,8

9,5 ±0,5 9,5 ±0,5

92

32

(38) 30

≤ 0,1 100 Rth [K/W]

100 200 300 [mm]

230 V AC

24 V DC

≤ Rz10

0,08

0,12

0,16

0,20

art. no.

LA V 21 ... with air flow chamber

≤ Rz10

93 ±0,5

184 ±1,25 200

0,03

0,06

0,09

0,12

0,15

100

230 V AC

24

V

DC

300

Rth [K/W]

[mm]

≤ 0,1 100

≤ Rz10

100≤0,1

9

±0,5

9 ±0,5

92

32

(38) 30

art. no.

LA V 22 ... with air flow chamber

... fan type...

100 150 200 250 300 400 mm

please indicate:

24 V DC=24

230 V AC=230

Technical data of the fans

... 230... 24

ebmpapst, ball bearingebmpapst, ball bearingtype

92x92x38 mm92x92x32 mmdimensions

230 V AC24 V DCtension

12 W5 Wpower inout

75 m3/h107 m3/h

max. air volume

-40°C... +75°C-20°C... 75°Ctemperature range

37 dB(A)47 dB(A)noise level

2,700 min-1

4,000 min-1

speed

420 g190 gweight

L10 < 52,500 h (40°C)L10 < 57,500 h (40°C)failure rate (L10)

D 24

A 137 – 138Special heatsink designD 9 – 11Miniature cooling aggregates

D 30Heatsinks with hollow fin profileD 36Protection grid for axial fans

E 2 – 24Thermal conductive materialA 12Drilling pattern for Solid State Relais

A 2 – 8Technical introductionA 57 – 58High capacity heatsinks

Cooling aggregates with axial fan

A

B

C

D

E

F

G

H

I

K

L

M

N

Hollow-fin cooling aggregates

– extremly low losses due optimised hollow fin geometry

– especially effective heat dissipation

– compact construction with axial fans

– two oposite mounting surfaces are miled flat

– additional treatment upon customer's request

– other fan types and fan voltages on request

≤ Rz10

158 ±0,5

155 ±1

12 ±0,5

12 ±0,5

Ø150

38

(55) 30

100≤0,1

200 300 400 500

230 V AC

24 V DC

Rth [K/W]

[mm]

0,01

0,03

0,05

0,07

0,08

0,02

0,04

0,06

≤ 0,1 100

≤ Rz10

art. no.

LA V 24 ... with air flow chamber

... fan type...

200 300 400 mm

please indicate:

24 V DC=24

230 V AC=230

Technical data of the fans

... 230... 24

ebmpapst, ball bearing, with gridebmpapst, ball bearing, with gridtype

Ø150x55 mmØ150x38 mmdimensions

230 V AC24 V DCtension

47 W19 Wpower inout

380 m3/h420 m3/h

max. air volume

-30°C... +60°C-25°C... +72°Ctemperature range

60 dB(A)59 dB(A)noise level

2,700 min-1

3,350 min-1

speed

1,100 g620 gweight

L10 < 40,000 h (40°C)L10 < 75,000 h (40°C)failure rate (L10)

D 25

A 137 – 138Special heatsink designD 9 – 11Miniature cooling aggregates

D 30Heatsinks with hollow fin profileD 36Protection grid for axial fans

E 2 – 24Thermal conductive materialA 12Drilling pattern for Solid State Relais

A 2 – 8Technical introductionA 57 – 58High capacity heatsinks

Cooling aggregates with axial fan

A

B

C

D

E

F

G

H

I

K

L

M

N

High performance cooling aggregate

extremely low losses of air flow as compared to cooling aggregates with extruded aluminium

– compact dimensions, that means high performance density due to large heat-conducting surfaces

– maximum heat flow due to brazing or thermal adhesion

– high performance cooling aggregates are only effective with forced ventilation by means of the fan, but not with free convection

– other fan types and fan voltages on request

material: solder-plated aluminium sheet, thus minimal weight due to the thickness of the material

An optimised unit for any application can be produced from the wide range of existing components upon request.

The specific capacity will be determined by a test run upon customer´s request.

Technical data of the fans

... 230

ebmpapst, ball bearingtype

119x119x38 mmdimensions

230 V ACtension

19 Wpower inout

160 m3/h

max. air volume

-40°C... +85°Ctemperature range

47 dB(A)noise level

2,650 min-1

speed

550 gweight

L10 < 37,500 h (40°C)failure rate (L10)

D 26

A 137 – 138Special heatsink designD 9 – 11Miniature cooling aggregates

D 30Heatsinks with hollow fin profileD 36Protection grid for axial fans

E 2 – 24Thermal conductive materialA 12Drilling pattern for Solid State Relais

A 2 – 8Technical introductionA 57 – 58High capacity heatsinks

Cooling aggregates with axial fan

A

B

C

D

E

F

G

H

I

K

L

M

N

High performance cooling aggregate

119

115

38 1050 max.

1

Rth [K/W]

+ 0, 28

+ 0,061

+ 0,096

23250 [mm]

50

Rth [K/W]

0,02

0,06

0,10

0,14

0,18

100 150 200

3

2

1

150 mm v = 6 m/s v = 6 m/s

0,025

0,050

0,075

0,100

LA HL 1 ... 3

129 ± 1

104,8

115 ± 1

ca. 6

ca. 2

104,8

1

Rth [K/W]

0,02

0,06

0,10

0,14

0,18

2 3 4 5 6 v [m/s]

150 mm

0,2 100

Rz16

0,2 100

Rz16

art. no.

LA HL 1 ... without air flow chamber

104,8

104,8

115 ± 1

ca. 6

ca. 2

104,8

33,2 258 ± 1

0,2 100

Rz16

0,2 100

Rz16

art. no.

LA HL 2 ... without air flow chamber

104,8

104,8

115 ± 1

ca. 6

ca. 2

29,2

387 ± 1,5

0,3 100

Rz16

0,3 100

Rz16

art. no.

LA HL 3 ... without air flow chamber

...

100 150 200 250 300 400 mm

please indicate:

D 27

A 137 – 138Special heatsink designD 9 – 11Miniature cooling aggregates

D 30Heatsinks with hollow fin profileD 36Protection grid for axial fans

E 2 – 24Thermal conductive materialA 12Drilling pattern for Solid State Relais

A 2 – 8Technical introductionA 57 – 58High capacity heatsinks

Cooling aggregates with axial fan

A

B

C

D

E

F

G

H

I

K

L

M

N

High performance cooling aggregate

38

119

115

30

1050 max.

1

Rth [K/W]

0,025

0,050

+ 0,027

0,075

+ 0,059

0,100 + 0,09

2 3 250 [mm]

50

Rth [K/W]

100 150 200

3

2

1

0,02

0,06

0,10

0,14

0,18

150 mm v = 6 m/s v = 6 m/s

LA HL V 1 ... 3

129 ± 1

104,8

115 ± 1

ca. 6

ca. 2

104,8

1

Rth [K/W]

0,02

0,06

0,10

0,14

0,18

23456

v [m/s]

150 mm

0,2 100

Rz16

0,2 100

Rz16

art. no.

LA HLV 1 ... with air flow chamber

104,8

104,8

115 ± 1

ca. 6

ca. 2

104,8

33,2 258 ± 1

0,2 100

Rz16

0,2 100

Rz16

art. no.

LA HLV 2 ... with air flow chamber

104,8

104,8

115 ± 1

ca. 6

ca. 2

29,2

387 ± 1,5

0,3 100

Rz16

0,3 100

Rz16

art. no.

LA HLV 3 ... with air flow chamber

...

100 150 200 250 300 400 mm

please indicate:

D 28

A 137 – 138Special heatsink designD 9 – 11Miniature cooling aggregates

D 30Heatsinks with hollow fin profileD 36Protection grid for axial fans

E 2 – 24Thermal conductive materialA 12Drilling pattern for Solid State Relais

A 2 – 8Technical introductionA 57 – 58High capacity heatsinks

Cooling aggregates with axial fan

A

B

C

D

E

F

G

H

I

K

L

M

N

High performance cooling aggregate

– innovative, efficient heatsink design

– thick multiwall sheets for maximum heat dissipation

– specially formed laminated structures ensure optimum heat exchange with the air flow

– powerful mixed axial fan for highly effcient heat dissipation

– reduced noise output achieved by an optimised adaption of fan and heatsink

– additional treatment and modifications upon customer's request

– double and triple versions upon request

38

115

30

1050

max.

129 ± 1

104,8

115 ± 1

ca. 6

ca. 2

104,8

Rth [K/W]

0,10

0,08

0,06

0,04

0,02

0100 200 300 [mm]

12 V DC

24 V DC

0,2 100

0,2 100

Rz16

Rz16

119

art. no.

LAHL D 1 ...

... fan type...

100 150 200 250 300 400 mm

please indicate:

12 V DC=12

24 V DC=24

Technical data of the fans

... 24... 12

ebmpapst, ball bearing, with gridebmpapst, ball bearing, with gridtype

119x119x38 mm119x119x38 mmdimensions

24 V DC12 V DCtension

19.5 W21 Wpower inout

310 m3/h310 m3/h

max. air volume

-20°C... +65°C-20°C... +65°Ctemperature range

65 dB(A)65 dB(A)noise level

6,000 min-1

6,000 min-1

speed

390 g390 gweight

L10 > 65,000 h (40°C)

L10 > 37,500 h (tmax)

L10 > 60,000 h (40°C)

L10 > 37,500 h (tmax)

failure rate (L10)

D 29

A 137 – 138Special heatsink designD 9 – 11Miniature cooling aggregates

D 30Heatsinks with hollow fin profileD 36Protection grid for axial fans

E 2 – 24Thermal conductive materialA 12Drilling pattern for Solid State Relais

A 2 – 8Technical introductionA 57 – 58High capacity heatsinks

Cooling aggregates with axial fan

A

B

C

D

E

F

G

H

I

K

L

M

N

High performance heatsinks with hollow-fin profile

– high performance heatsinks for fan operation

– exclusively for forced convection

– preferably for radial or tangential fans

– hollow fin geometry optimises the air flow

– particularly effective heat dissipation

– milled flat base (except length 1000 mm)

100 200 300

0,08

0,07

0,06

0,05

0,04

0,03

0,02

0,01

400

[mm]

100≤0,1

≤ Rz10

Rth [K/W] v = 5 m/s

165 ± 1

17 84 ± 0,5

5,2

8

64

art. no.

SK 497 ...

[mm]

Rth [K/W] v = 5 m/s

100≤0,1

≤ Rz10

215 ± 1,2

76 ± 0,5

75

15

100 200 300

0,08

0,07

0,06

0,05

0,04

0,03

0,02

0,01

400

5

6,5

60

art. no.

SK 498 ...

... surface...

150 200 250 300 1000 mm

please indicate:

black anodised=SA

raw degreased aluminium=AL

71

6

8,5

[mm]

B

A

C

100 200 300

0,08

0,07

0,06

0,05

0,04

0,03

0,02

0,01

SK 440

SK 458

SK 441

SK 461

v = 5 m/s

Rth [K/W]

dim. [mm]number of finsart. no.

CBA

16

200 ±1.2

84 ±1

15SK 440 ...

16

250 ±1.4

84 ±1

19SK 458 ...

16

300 ±1.6

84 ±1

23SK 441 ...

20

400 ±2

88 ±1

31SK 461 ...

... surface...

150 200 300 1000 mm

please indicate:

black anodised=SA

raw degreased aluminium=AL

D 30

D 14Heatsink-cooling aggregatesD 26 – 29High capacity cooling aggregat.

D 5Cooling aggreg. in segment mount.D 33 – 35Cooling aggregates with radial fan

D 9 – 11Miniature cooling aggregatesD 30 – 31Heatsinks with hollow fin profile

A 2 – 8Technical introductionD 15 – 25Hollow-fin cooling aggregates

High-performance heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

– high capacity heatsinks for fan operation preferably for radial- or tangential fan motors

– universal modular design

– exclusively for forced convection

– flow-optimized hollow fin geometry

– minimum order quantity: 1000 kg, samples on request

A

20

23

555555

112

81,5

70

62

52

43

dim. [mm]number of finsart. no.

A

20025SK 603 ...

25032SK 604 ...

30039SK 605 ...

35045SK 606 ...

40052SK 607 ...

50065SK 608 ...

... surface...

200 300 400 500 mm

... fin heightplease indicate:

black anodised=SA43 mm=430

clear anodised=ME52 mm=520

62 mm=620

70 mm=700

81.5 mm=815

112 mm=1120

150 250 350

0,04

0,05

Rth [K/W] v = 11 m/s

0,01

0,02

0,03

SK 604 1120

SK 604 700

SK 604 620

SK 604 520

SK 604 430

SK 604

[mm]

100 200 300 400 500

150 250

0,04

0,05

0,06

Rth [K/W] v = 11 m/s

0,01

0,02

0,03

[mm]

SK 603

100 200 300 350

SK 603 815

SK 603 700

SK 603 620

SK 603 1120

SK 603 520

SK 603 430

400 450 500

SK 604 815

D 31

D 14Heatsink-cooling aggregatesD 26 – 29High capacity cooling aggregat.

D 5Cooling aggreg. in segment mount.D 33 – 35Cooling aggregates with radial fan

D 9 – 11Miniature cooling aggregatesD 30 – 31Heatsinks with hollow fin profile

A 2 – 8Technical introductionD 15 – 25Hollow-fin cooling aggregates

High performance heatsinks with hollow-fin profile

A

B

C

D

E

F

G

H

I

K

L

M

N

150 250 350

0,020

0,025

0,030

0,035

Rth [K/W] v = 11 m/s

0,010

0,015

SK 605

[mm]

100 200 300 400

0,040

150 250 350

0,020

0,025

0,030

0,035

Rth [K/W] v = 11 m/s

0,01

0,015

SK 606 815

SK 606 1120

SK 606 700

SK 606 620

SK 606 520

SK 606 430

SK 606

[mm]

100 200 300 400 450 500

250 350 450

0,008

0,010

0,012

0,014

Rth [K/W] v = 11 m/s

0,006

SK 608

[mm]

200 300 400

0,016

500

250 350 450

0,020

Rth [K/W] v = 11 m/s

0,005

0,010

0,015

SK 607 700

SK 607

[mm]

200 300 400 500 550 600

450 500

SK 605 815

SK 605 1120

SK 605 700

SK 605 620

SK 605 520

SK 605 430

SK 607 815

SK 607 1120

SK 607 620

SK 607 520

SK 607 430

SK 608 815

SK 608 1120

SK 608 700

SK 608 620

SK 608 520

SK 608 430

550 600

D 32

D 14Heatsink-cooling aggregatesD 26 – 29High capacity cooling aggregat.

D 5Cooling aggreg. in segment mount.D 33 – 35Cooling aggregates with radial fan

D 9 – 11Miniature cooling aggregatesD 30 – 31Heatsinks with hollow fin profile

A 2 – 8Technical introductionD 15 – 25Hollow-fin cooling aggregates

High performance heatsinks with hollow-fin profile

A

B

C

D

E

F

G

H

I

K

L

M

N

High performance cooling aggregate

– optimised air flow due to hollow fin geometrie

– very good thermal performance

– optimized high performance construction with radial fan

– milled flat mounting surface for semiconductor

– cover plate for fin side upon request

– additional customized treatment upon request

– fan condenser: art. no. LAHLR K 2

100 200 300 400 500 600

0,02

0,04

0,06

0,08

0,10

160 +1,5

– 1

83

±0,5

11

±0,5

162

165

1000 max.

Rth [K/W]

[mm]

≤ 0,1 100

≤ Rz10

art. no.

LA 25 ...

100 200 300 400 500 600

0,02

0,04

0,06

0,08

162

165

1000 max.

17

±0,5

165 ±0,5

84

±0,5

Rth [K/W]

[mm]

≤ 0,1 100

≤ Rz10

art. no.

LA 26 ...

...

200 300 400 500 600 mm

please indicate:

Technical data of the fans

... 230

ebmpapst, radial blower with grid, double sided absorbtiontype

ball bearingbearing type

435 m3/h

discharge air flow

1,950 min-1

rotation speed

87 Wpower inout

0.39 Acurrent consumption

-25°C... +40°Ctemperature range

230 V ACcircuit voltage

2 µF/400 Vmotor condenser

58 dB(A)noise level

1,500 gweight

D 33

D 9 – 12Miniature cooling aggregatesA 12Drilling pattern for Solid State Relais

135 – 136heatsinks for Solid State RelaisA 125 – 128Mounting for TO 3 angle

A 21Hole patternA 57 – 58High capacity heatsinks

A 2 – 8Technical introductionD 5 – 7Cooling aggreg. in segment mount.

Cooling aggregates with radial fan

A

B

C

D

E

F

G

H

I

K

L

M

N

High performance cooling aggregate

– optimised air flow due to hollow fin geometrie

– very good thermal performance

– optimized high performance construction with radial fan

– milled flat mounting surface for semiconductor

– cover plate for fin side upon request

– additional customized treatment upon request

– fan condenser: art. no. LA 20 K 6

0,005

0,015

0,025

0,035

100 200 300 400 500 600

276

27

±1

126

±1,6

300 ±1,6 225

241

(1000 max.)

Rth [K/W]

[mm]

≤ 0,1 100

≤ Rz10

art. no.

LA 20 ...

...

200 300 400 500 600 mm

please indicate:

Technical data of the fans

... 230

ball bearingbearing type

ebmpapst, radial blower with grid, double sided absorbtiontype

1,310 m3/h

discharge air flow

1,350 min-1

rotation speed

185 Wpower inout

0.81 Acurrent consumption

230 V ACcircuit voltage

-25°C... +70°Ctemperature range

6 µFmotor condenser

64 dB(A)noise level

5,900 gweight

D 34

D 9 – 12Miniature cooling aggregatesA 12Drilling pattern for Solid State Relais

135 – 136heatsinks for Solid State RelaisA 125 – 128Mounting for TO 3 angle

A 21Hole patternA 57 – 58High capacity heatsinks

A 2 – 8Technical introductionD 5 – 7Cooling aggreg. in segment mount.

Cooling aggregates with radial fan

A

B

C

D

E

F

G

H

I

K

L

M

N

High performance cooling aggregate

– other lengths upon request

– fan condenser: art. no. LAHLR K 2

0,5

≤ Rz16

0,05

0,07

0,09

100 200 300 400 500 600 [mm]

Rth [K/W]

162

165

170 ±1500 ±2 max.

70 ±1

art. no.

LAHLR 1 500

solid frame construction with inner animation and carrier plates, thermally connected by

soldering

construction:

6,300 gweight:

aluminium alloymaterial:

blanc, milled flatsurface:

Technical data of the fans

... 230

ebmpapst, radial blower with grid, double sided absorbtiontype

ball bearingbearing type

435 m3/h

discharge air flow

1,950 min-1

rotation speed

87 Wpower inout

0.39 Acurrent consumption

-25°C... +40°Ctemperature range

230 V ACcircuit voltage

2 µF/400 Vmotor condenser

58 dB(A)noise level

1,500 gweight

D 35

D 9 – 12Miniature cooling aggregatesA 12Drilling pattern for Solid State Relais

135 – 136heatsinks for Solid State RelaisA 125 – 128Mounting for TO 3 angle

A 21Hole patternA 57 – 58High capacity heatsinks

A 2 – 8Technical introductionD 5 – 7Cooling aggreg. in segment mount.

Cooling aggregates with radial fan

A

B

C

D

E

F

G

H

I

K

L

M

N

– protection against contact as per EN 294

– aerodynamic contruction

– minimized noise modification

– only low modification of the air flow

32 ±0,4

Ø 29 ±0,8

Ø 4 +0,3

4,7 +1

1,5 +0,3

suitable for cooling aggregateart. no.

LAM 2/ LAM 4/ LAM 4 KLAGI 40

4,7 +1

1,5 +0,3

50 ±0,6

Ø 53 ±1

Ø 4 +0,3

suitable for cooling aggregateart. no.

LAM 1/ LA (V) 6/ LA (V) 7/ LA (V) 8/ LA 27 KLAGI 60

71,5 ±0,6

Ø 75 ±1,2

1,5 +0,3

Ø 4 +0,3

4,7 +1

suitable for cooling aggregateart. no.

LA (V) 9/ LA (V) 10/ LA (V) 11LAGI 80

Ø 89 ±1,5

1,5 +0,3

Ø 4 +0,3

4,7 +1

82,5 ±0,6

suitable for cooling aggregateart. no.

LA 2/ LA (V) 21/ LA (V) 22LAGI 92

104,8 ±0,8

Ø 115,4 ±1,5

Ø 4 +0,3

1,5 +0,3

4,7 +1

suitable for cooling aggregateart. no.

LA 1/ LA 4/ LA 5/ LA (V) 14/ LA (V) 15/ LA (V) 17/ LA (V) 18/ LA HL (V) 1/ LA HL (V) 2/ LA HL (V) 3 /

LA HL D1

LAGI 119

steel wire, nickel-platedmaterial:

D 36

D 14Heatsink-cooling aggregatesD 26 – 29High capacity cooling aggregat.

D 5Cooling aggreg. in segment mount.D 33 – 35Cooling aggregates with radial fan

D 9 – 11Miniature cooling aggregatesD 30Heatsinks with hollow fin profile

A 2 – 8Technical introductionD 15 – 25Hollow-fin cooling aggregates

Protection grid for fans

A

B

C

D

E

F

G

H

I

K

L

M

N

Mounting material for semiconductors

– mounting disc for discrete devices such as transistors,

capacitors and LEDs

– electrically insulating mounting of the transistors

– simple and fast assembly

– insulating clamping pins for various semiconductors for

increasing the dielectric strength

– cover and insulating cap for transistors

Thermal conductive material

Guide rails for PCBs

Mounting material for semiconductors-

Mounting material for

mechanical components

Thermal conductive material

– large standard programme for thermal conductive pastes

and glues, silicone-, GEL-, and foam foils (Gap Filler),

cuts, tapes, tubes and caps

– thermal conductive electrically insulating foils

– customer speciﬁc productions made in our

in-house punching shop

Guide rails for PCBs

– for horizontal and vertical assembly

– suitable for sheet thicknesses of 0.5 - 1.85 mm

– with and without lock mechanism

– slim an wide designs

– screwable and snapable versions, extractors with locking

pin ﬁxing

– special designs upon request

Mounting material for mechanical components

– distance bolts made of metal and plastics with inner or

outer thread

– clamp mounting made of aluminium and plastics for

mounting the heatsinks and cases on the mounting rail

acc. to DIN EN 50022

– anti-vibration device for minimizing the noise and

resonance

SEITE E1

A: washer

B: insulating cap

C: insulating tube

D: cuts

Our thermal conduction wafers effect following advantages:

– good surface contact as material is flexible

– reduced production costs as a matter of mounting without thermal conducting paste (clean and fast)

– spring-back of the elastic material protects the transistor against damage

– free of any toxic substances

Customer specific versions:

– punching and cuts of our thermal conductive foil according to drawing

– sold per sheet or by the meter

– other foils, plastics, papers, etc. upon request

The thermal details refer to an area of 1 inch2(6.45 cm2).

E 2

A 89 – 112Heatsinks for PCBE 7 – 10Thermal conductive foil

B 17 – 20Heatsinks for BGAE 12 – 15GEL thermal conductive foils

A 22 – 83Extruded heatsinksE 21 – 22Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Silicon-rubber insulating material for semiconductors

A

B

C

D

E

F

G

H

I

K

L

M

N

– other cuttings on request

11

29

42

2

30

5,5

R 6

R 14,5

2 x Ø 1,5

2 x Ø 3,1

11

36

50

2

30

5,5

R 10

R 18

2 x Ø 2

2 x Ø 4,2

Ø 4,2

28,2

42

2 x Ø

2

30

10,9

16,9

4

17,5

20,5

Ø 3,1

15

17,5

20,5

Ø 3,1

15 5,5

20

24

Ø 3,1

16,5 7,5

10

Ø 3,9

16

17,4

20

22

17,1

11

13

18

13,5

Ø 3

17

21

Ø 3,2

15

Ø 3,1

21

24

18 6

60

18 4

7,5 7,5

15 15 15

Ø 3,2

9

11

Ø 2,5

5,5

8

11

Ø 3,1

7,3

E 3

A 89 – 112Heatsinks for PCBE 7 – 10Thermal conductive foil

B 17 – 20Heatsinks for BGAE 12 – 15GEL thermal conductive foils

A 22 – 83Extruded heatsinksE 21 – 22Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Silicone rubber insulating material for semiconductors

A

B

C

D

E

F

G

H

I

K

L

M

N

foil WBfoil WKfoil WGfoil WSfoil type

silicone foil, GF rein-

forced

silicone foil, GF rein-

forced, one-sided self-

adhesive

silicone foil, GF rein-

forced

silicone foil, standardmaterial

Washer

WB 3WK 3WG 3WS 3TO-3

WS 3 MTO-3 M

WK 3/4WS 3/4TO-3/4

WB 3 PWK 3 PWG 3 PWS 3 PTO-3 PF

WB 3158WK 3158WS 31583158

WS TOP 3TOP 3

WK TOP 3/1WS TOP 3/1TOP 3/1

WG 218TO 218 (Multiwatt)

WK 247WS 247TO 247

WB 220WK 220WG 220WS 220TO 220

WS 4 2204 X TO 220

WB 3159WK 3159WS 31593159

WK 126TO 126

WK 32SOT 32

WS 247/1TO 247/1

Insulating tube

WSC-220TO-220 Ø 11 mm,

length 25 mm

WSC-3 PTO-3 PF Ø 13.5 mm,

length 25 mm

WSC-247TO-247 Ø 14.5 mm,

length 30 mm

Insulating tube as meterpiece

WSM-220TO-220 Ø 11 mm

WSM-3 PTO-3 PF Ø 13.5 mm

Tape material (width)

WKT 2424 mm

WBT 30WST 3030 mm

WST 3636 mm

WST 8585 mm

WBT 300WKT 300WGT 300300 mm

Foil WBFoil WKFoil WGFoil WS

0.15 mm0.2 mm0.3 mmmaterial thickness

90 Shore A87 Shore A75 Shore Amaterial hardness

3 kV6.5 kV10 kVdielectric strength

0.34 K/W0.45 K/W0.42 K/W0.4 K/Wthermal resistance

1.43 W/m·K0.92 W/m·K1.13 W/m·K1.22 W/m·Kthermal conductivity

1.6·1015 Ω·cm5.7·1015 Ω·cm2.9·1015 Ω·cm

insulation resistance

4 %2 %100 %extensibility

-60°C... +180°Ctemperature range

UL 94 V-0class of flammibility

E 4

A 89 – 112Heatsinks for PCBE 7 – 10Thermal conductive foil

B 17 – 20Heatsinks for BGAE 12 – 15GEL thermal conductive foils

A 22 – 83Extruded heatsinksE 21 – 22Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Thermally conductive foil made of siliconelastomer

A

B

C

D

E

F

G

H

I

K

L

M

N

C

A

B

D

dim. [mm]typeart. no.

DCBA

0.95.021.011TO 220WSI 220 210

0.35.022.511TO 220WSI 220 225

0.95.023.518TOP 3WSI TOP 3 235

0.35.028.016TO 3 PL/TO 247WSI TOP 3 280

0.95.534.022TO 3 PL/TO 247WSI TO 3 PL

Foil WSIFoil WSI

0.3 mm0.9 mmmaterial thickness

75 Shore Amaterial hardness

10 kV15 kVdielectric strength

0.4 K/W0.96 K/Wthermal resistance

1.22 W/m·Kthermal conductivity

2.9·1015 Ω·cm

insulation resistance

100 %extensibility

-60°C... +180°Ctemperature range

UL 94 V-0class of flammibility

E 5

A 89 – 112Heatsinks for PCBE 7 – 10Thermal conductive foil

B 17 – 20Heatsinks for BGAE 12 – 15GEL thermal conductive foils

A 22 – 83Extruded heatsinksE 21 – 22Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Insulating cap

A

B

C

D

E

F

G

H

I

K

L

M

N

– one-sided acrylate adhesive coating, silicone-free carrier material

– good thermal characteristics with high operating temperature

– thin material thickness for optimal thermal resistance

– high dielectric strength, electrically insulating

– cuttings and customised cut-outs acc. to customer specific requirements

type of deliveryart. no.

plates, usable area 300x200mmWLFT 8943

WLFT 8943

one-sided adhesive, filled Copolymerdescription

0.17 mmoverall thickness

ceramicfilling material

4.7°C cm2/W

specific thermal resistance

0.4 W/m·Kthermal conductivity

-40°C... +150°Ctemperature range

2.5·1013 Ω/cm

volume resistance

62,7 kV/mmdielectric strength

6 N/cmpeel strength at ambient temperat-

ure and 24 h

UL 94 V-0class of flammibility

E 6

E 12 – 15GEL thermal conductive foilsE 2 – 5Thermal conductive material

E 40SpacersA 89 – 93Heatsinks for PCB

E 32 – 33Insulating distance sleevesA 89 – 112Profiles for PCB mounting

A 2 – 8Technical introductionC 4 – 9Heatsinks for transistors

Thermal conductive foil one-sided adhesive

A

B

C

D

E

F

G

H

I

K

L

M

N

– good thermal charactaristics

– double-sided adhesive layers

– replaces mechanical fastenings

– cuttings and cut-outs upon request

type of deliverywidth

[mm]

art. no.type of deliverywidth

[mm]

art. no.

sold by the meter100WLFT 414 R100sold by the meter25WLFT 404 R25

sold by the meter50WLFT 404 R50 sold by the meter200WLFT 414 R200

sold by the meter25WLFT 405 R25sold by the meter100WLFT 404 R100

sold by the meter200WLFT 404 R200 sold by the meter50WLFT 405 R50

sold by the meter100WLFT 405 R100sold by the meter25WLFT 414 R25

sold by the meter50WLFT 414 R50 sold by the meter200WLFT 405 R200

type of deliv-

ery

dimensions [mm]art. no.type of deliv-

ery

dimensions [mm]art. no.

plate200x200WLFT 414 200x200plate100x100WLFT 404 100x100

plate100x200WLFT 404 100x200 plate100x100WLFT 405 100x100

plate100x200WLFT 405 100x200plate200x200WLFT 404 200x200

plate100x100WLFT 414 100x100 plate200x200WLFT 405 200x200

plate100x200WLFT 414 100x200

WLFT 405WLFT 414WLFT 404

non insulating, double-sided

adhesive

insulating, double sided adhesivedescription

0.15 mm ±0.03

0.127 mm ±0.03

overall thickness

aluminium foil 0.05mmpolyimide (Kapton MT) 0.025mmtruss material

acrylate (pressure sensitive) double-sidedglue layer

0.5 W/m·K0.4 W/m·Kthermal conductivity

3.4°C cm2/W3.7°C cm2/W

specific thermal resistance

-30°C... +125°Ctemperature range

0.93 MPa0.86 MPaholding force (overlapping)

Al 25°C 0.86 [MPa]/ Al

150°C 0.38 [MPa]/ Cu 25°C

1.1 [MPa]/ Cu 150°C 0.48

[MPa]/ Al2O325°C 1.0

[MPa]/ Al2O3150°C 0.41

[MPa]

Al 25°C 0.897 [MPa]/ Al

150°C 0.345 [MPa]

Al 25°C 0.897 [MPa]/ Al

150°C 0.345 [MPa]/ Cu

25°C 0.828 [MPa]/ Cu

150°C 0.31 [MPa]/ Al2O3

25°C 1.17 [MPa]/ Al2O3

150°C 0.34 [MPa]

holding force (shear rate)

5 kV (AC)dielectric strength

UL 94 V-0class of flammibility

E 7

E 12 – 15GEL thermal conductive foilsE 2 – 5Thermal conductive material

E 40SpacersA 89 – 93Heatsinks for PCB

E 32 – 33Insulating distance sleevesA 89 – 112Profiles for PCB mounting

A 2 – 8Technical introductionC 4 – 9Heatsinks for transistors

Thermally conductive foil both sides adhesive

A

B

C

D

E

F

G

H

I

K

L

M

N

– double sided adhesive layer

– optimal adhesion of different substrates

– very good thermal conductivity, electrical insulating

– easy handling due to double sided protection foil

– optimized surface moistening and excellent impact strength

– cutouts and different punchings according to customer drawing

type of deliveryart. no.

plates, usable area 300x200mmWLFT 8805

plates, usable area 300x200mmWLFT 8810

plates, usable area 300x200mmWLFT 8815

plates, usable area 300x200mmWLFT 8820

plates, usable area 300x200mmWLFT 8940

WLFT 8940WLFT 8820WLFT 8815WLFT 8810WLFT 8805

double sided adhesive, filled acrylic polymerdescription

0.19 mm0.5 mm0.38 mm0.25 mm0.13 mmoverall thickness

ceramicfilling material

silicone treated polyester, 37.5 - 50 µmprotection cover

0.9 W/m·K0.6 W/m·Kthermal conductivity

9.7°C cm2/W7.6°C cm2/W5.7°C cm2/W3.1°C cm2/W

specific thermal resistance

permanent up to

150°C

permanent up to 100°Ctemperature range

2.5·1013 Ω/cm3.8·1011 Ω/cm3.9·1011 Ω/cm5.2·1011 Ω/cm

volume resistance

55 kV/mm37 kV/mmdielectric strength

6 N/cm11.9 N/cm9.8 N/cm8.3 N/cm5.8 N/cmpeel strength at ambient temperat-

ure and 72 h

UL 94 V-0UL 746 Cclass of flammibility

E 8

E 12 – 15GEL thermal conductive foilsE 2 – 5Thermal conductive material

E 40SpacersA 89 – 93Heatsinks for PCB

E 32 – 33Insulating distance sleevesA 89 – 112Profiles for PCB mounting

A 2 – 8Technical introductionC 4 – 9Heatsinks for transistors

Thermally conductive foil both sides adhesive

A

B

C

D

E

F

G

H

I

K

L

M

N

– high-compressed anisotropic natural graphite

– very good thermal characteristics

– optimal for heat spreading

– high operating temperature range

– different material thicknesses and coatings upon request

– customer specified cuttings and stampings acc. to drawing

type of deliverywidth

[mm]

art. no.type of deliverywidth

[mm]

art. no.

sold by the meter25WLFG 9020 R 25sold by the meter25WLFG 9010 R 25

sold by the meter50WLFG 9010 R 50 sold by the meter50WLFG 9020 R 50

sold by the meter100WLFG 9020 R 100sold by the meter100WLFG 9010 R 100

sold by the meter25WLFG 9015 R 25 sold by the meter25WLFG S 900 K R 25

sold by the meter50WLFG S 900 K R 50sold by the meter50WLFG 9015 R 50

sold by the meter100WLFG 9015 R 100 sold by the meter100WLFG S 900 K R 100

WLFG S 900 KWLFG 9020WLFG 9015WLFG 9010

graphite foil, electrically conductivebase film made of

graphite, electrically

conductive

description

adherent layer on one sideversion

0.175 mm0.25 mm0.2 mm0.15 mmoverall thickness

0,08 K/W0,23 K/W0,07 K/W0,09 K/Wthermal resistance

7.5 (<450) W/m·K4 (55) W/m·K6 (55) W/m·K5.5 (55) W/m·Kthermal conductivity z (x/y)

34°C mm2/W72°C mm2/W28.8°C mm2/W36°C mm2/W

specific thermal resistance

-40°C... +500°Ctemperature range

30 Shore Dhardness range

10 N/mm2

5.5 N/mm2

6 N/mm2

5.5 N/mm2

tensile strength

5 %10 %elongation at break

<1.6 g/cm3

1 g/cm3

tightness

UL 94 V-0class of flammibility

E 9

E 12 – 15GEL thermal conductive foilsE 2 – 5Thermal conductive material

E 40SpacersA 89 – 93Heatsinks for PCB

E 32 – 33Insulating distance sleevesA 89 – 112Profiles for PCB mounting

A 2 – 8Technical introductionC 4 – 9Heatsinks for transistors

High thermoconducting graphite foils

A

B

C

D

E

F

G

H

I

K

L

M

N

– elastomer foam with closed cell structure

– good heat conductor e.g. between components, heatsinks and casing parts

– electrical insulating

– can be compressed even with a low contact pressure

– absorbs shocks and vibrations

material thickness [mm]art. no.

1.60 ±0.4

WSF 16

3.20 ±0.8

WSF 32

6.35 ±1.2

WSF 635

6.35 ±1.2

WSFS 635

Thermal resistance at 3.2 mm material thickness:

502510contactcompression %

34125>1contact pressure PSI

12.54.56

Rth K/W (1 in2x 3.2 mm)

0.650.450.40.3heat conductivity W/mK

–WSFS 635 double sided adhesive and WSF adhesive upon request

– according to NASA gas emission requirements

WSFS 635WSF

one-sided self-adhesiveno adhesiveversion

0.108 W/m·K (substrate)thermal conductivity

13 Shore Dhardness range

18 PSIcompression, 25%

-62°C... +205°Ctemperature range

150 %extensibility

120 PSItensile strength

4 kV/mmdielectric strength

1.118 g/cm3

tightness

UL 94 V-1 (at thickness ≥3.2mm)class of flammibility

plates 914x914mm/ cuttings on customer's requirementstype of delivery

E 10

E 16Kapton insulator washersE 2 – 5Thermal conductive material

B 11 – 16Heatsinks for PGAE 12 – 15GEL thermal conductive foils

B 17 – 20Heatsinks for BGAE 21 – 22Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Heat conductive silicon foam foil

A

B

C

D

E

F

G

H

I

K

L

M

N

– silicone free gap-filler with good thermal characteristics

– smooth, compressible and elastic

– cut outs, punchings and modifications according to customer specification

– other material thicknesses upon request

Rth (100 kPa)

[°C cm2/W]

Rth (100 kPa)

[°C in2/W]

material thick-

ness [mm]

art. no.Rth (100 kPa)

[°C cm2/W]

Rth (100 kPa)

[°C in2/W]

material thick-

ness [mm]

art. no.

7.551.16

1.0 ±0.2

GEL F 15 G 106.561.06

1.0 ±0.2

GEL F 15 10

8.011.44

1.5 ±0.2

GEL F 15 15 9.221.52

1.5 ±0.2

GEL F 15 G 15

10.891.93

2.0 ±0.3

GEL F 15 G 2011.261.83

2.0 ±0.3

GEL F 15 20

GEL F 15 GGEL F 15

polyamide film mash reinforcedstandardversion

1.5 W/m·Kthermal conductivity

2 ·103MΩ/m

volume resistance

53 Shore 00hardness range

-40°C... +105°Ctemperature range

150 %extensibility

9,12 [50 Hz] / 8,55 [1 kHz] / 5,83 [1 MHz]dielectric constant

0,152 [50 Hz] / 0,135 [1 kHz] / 0,034 [1 MHz]dielectric loss factor

11 kV/mmdielectric strength

2.1 g/cm3

tightness

UL 94 V-0class of flammibility

on both sides covered with protective foil/ plates, usable area 300x200mm/ cuttings on

customer's requirements

type of delivery

E 11

A 22 – 83Extruded heatsinksE 2 – 5Thermal conductive material

B 35 – 48Heatsinks for LEDsE 7 – 15Thermal conductive foil

A 13 – 17Heatsink profile-overviewE 21 – 22Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Silicone free thermal adhesive foils

A

B

C

D

E

F

G

H

I

K

L

M

N

– highly heat-conductive silocon foil

– smooth, elastic and compressible

– equals uneven surfaces very well (Gap-Filler)

Rth (100 kPa)

[°C cm2/W]

Rth (100 kPa)

[°C in2/W]

material thick-

ness [mm]

art. no.Rth (100 kPa)

[°C cm2/W]

Rth (100 kPa)

[°C in2/W]

material thick-

ness [mm]

art. no.

4.040.63

0.5 ±0.1

GEL G 054.450.69

0.5 ±0.1

GEL 05

6.641.03

1.0 ±0.2

GEL 10 7.561.17

1.0 ±0.2

GEL G 1

10.271.59

1.5 ±0.2

GEL G 158.961.39

1.5 ±0.2

GEL 15

9.781.52

2.0 ±0.3

GEL 20 13.332.07

2.0 ±0.3

GEL G 2

16.812.61

2.5 ±0.3

GEL G 2513.582.10

2.5 ±0.3

GEL 25

15.152.35

3.0 ±0.3

GEL 30 18.662.89

3.0 ±0.3

GEL G 3

21.633.35

3.5 ±0.3

GEL G 3516.512.56

3.5 ±0.3

GEL 35

20.953.25

4.0 ±0.4

GEL 40 22.963.56

4.0 ±0.4

GEL G 4

25.103.89

4.5 ±0.4

GEL G 4521.823.38

4.5 ±0.4

GEL 45

22.703.52

5.0 ±0.5

GEL 50 27.234.22

5.0 ±0.5

GEL G 5

GEL G 3 - 5GEL G 05 - 25GEL

polyamide film mash reinforced, adherent layer on one sidestandardversion

1.5 W/m·Kthermal conductivity

1·106MΩ/m

volume resistance

49 Shore 00hardness range

-60°C ... +200°Ctemperature range

60 %100 %extensibility

5.8 [50 Hz]/ 5.6 [1 KHz]/ 5.5 [1 MHz]dielectric constant

0.048 [50 Hz]/ 0.015 [1 KHz]/ 0.003 [1 MHz]dielectric loss factor

8 kV/mm (AC)14 kV/mm (AC)dielectric strength

2.6 g/cm3

tightness

UL 94 V-0UL 94 V-1UL 94 V-0class of flammibility

on both sides covered with protective foil/ plates, usable area 300x200mm/ cuttings on

customer's requirements

type of delivery

E 12

A 22 – 83Extruded heatsinksE 2 – 5Thermal conductive material

B 35 – 48Heatsinks for LEDsE 7 – 15Thermal conductive foil

A 13 – 17Heatsink profile-overviewE 21 – 22Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Gel thermal conducting foils

A

B

C

D

E

F

G

H

I

K

L

M

N

– GEL thermal conductive foils with very good thermical characteristics

– for balancing non-planarities and differences in components (Gap Filler)

– soft, elastic and compressible

– customer specific cuts and punchings according to drawing

Rth (100 kPa)

[°C cm2/W]

Rth (100 kPa)

[°C in2/W]

material thick-

ness [mm]

art. no.Rth (100 kPa)

[°C cm2/W]

Rth (100 kPa)

[°C in2/W]

material thick-

ness [mm]

art. no.

1.850.29

0.5 ±0.15

GEL 28 G 051.480.23

0.5 ±0.15

GEL 28 05

2.760.44

1.0 ±0.2

GEL 28 10 2.990.47

1.0 ±0.2

GEL 28 G 10

4.530.72

1.5 ±0.2

GEL 28 G 153.820.61

1.5 ±0.2

GEL 28 15

5.000.80

2.0 ±0.3

GEL 28 20 6.070.97

2.0 ±0.3

GEL 28 G 20

7.231.15

2.5 ±0.3

GEL 28 G 255.650.90

2.5 ±0.3

GEL 28 25

6.901.10

3.0 ±0.3

GEL 28 30 7.691.23

3.0 ±0.3

GEL 28 G 30

8.461.35

3.5 ±0.3

GEL 28 G 357.971.27

3.5 ±0.3

GEL 28 35

8.691.39

4.0 ±0.3

GEL 28 40 10.471.67

4.0 ±0.3

GEL 28 G 40

12.021.92

5.0 ±0.3

GEL 28 G 5010.471.67

5.0 ±0.3

GEL 28 50

GEL 28 GGEL 28

polyamide film mash reinforcedstandardversion

2.5 W/m·Kthermal conductivity

3.6·104MΩ/m

volume resistance

55 Shore 0050 Shore 00hardness range

-60°C ... +200°Ctemperature range

32 %64 %extensibility

8,98 [50 Hz] / 8,63 [1 kHz] / 8,05 [1 MHz]dielectric constant

0.0826 [50 Hz]/0.0300 [1 kHz]/0.0052 [1 MHz]dielectric loss factor

15 kV/mmdielectric strength

2.7 g/cm3

tightness

UL 94 V-0class of flammibility

on both sides covered with protective foil/ plates, usable area 300x200mm/ other dimensions

upon request

type of delivery

E 13

A 22 – 83Extruded heatsinksE 2 – 5Thermal conductive material

B 35 – 48Heatsinks for LEDsE 7 – 15Thermal conductive foil

A 13 – 17Heatsink profile-overviewE 21 – 22Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Gel thermal conducting foils

A

B

C

D

E

F

G

H

I

K

L

M

N

– gap filler with exceptionally good thermal conductivity and low outgassing

– especially smooth, compressible and elastic

– cut outs, punchings and modifications according to customer specification

– other material thicknesses upon request

Rth (100 kPa)

[°C cm2/W]

Rth (100 kPa)

[°C in2/W]

material thick-

ness [mm]

art. no.Rth (100 kPa)

[°C cm2/W]

Rth (100 kPa)

[°C in2/W]

material thick-

ness [mm]

art. no.

4.170.64

0.5 ±0.15

GEL 45 G 053.940.61

0.5 ±0.15

GEL 45 05

6.270.96

1.0 ±0.2

GEL 45 10 6.280.97

1.0 ±0.2

GEL 45 G 10

11.061.71

1.5 ±0.2

GEL 45 G 158.421.30

1.5 ±0.2

GEL 45 15

9.851.52

2.0 ±0.3

GEL 45 20 11.061.71

2.0 ±0.3

GEL 45 G 20

13.112.03

2.5 ±0.3

GEL 45 G 2511.081.71

2.5 ±0.3

GEL 45 25

12.521.94

3.0 ±0.3

GEL 45 30 14.762.28

3.0 ±0.3

GEL 45 G 30

16.402.54

3.5 ±0.35

GEL 45 G 3514.202.20

3.5 ±0.35

GEL 45 35

15.882.46

4.0 ±0.4

GEL 45 40 18.122.80

4.0 ±0.4

GEL 45 G 40

19.563.03

4.5 ±0.45

GEL 45 G 4517.342.68

4.5 ±0.45

GEL 45 45

17.342.84

5.0 ±0.5

GEL 45 50 20.823.22

5.0 ±0.5

GEL 45 G 50

GEL 45 GGEL 45

polyamide film mash reinforcedstandardversion

4.5 W/m·Kthermal conductivity

1.4·105Ω/cm

volume resistance

45 Shore 00hardness range

-60°C ... +200°Ctemperature range

50 %extensibility

8,98 [50 Hz] / 8,63 [1 kHz] / 8,05 [1 MHz]dielectric constant

0,0249 [50 Hz] / 0,0219 [1 kHz] / 0,00675 [1 MHz]dielectric loss factor

11 kV/mmdielectric strength

3.2 g/cm3

tightness

UL 94 V-0class of flammibility

on both sides covered with protective foil/ plates, usable area 300x200mm/ cuttings on

customer's requirements

type of delivery

E 14

A 22 – 83Extruded heatsinksE 2 – 5Thermal conductive material

B 35 – 48Heatsinks for LEDsE 7 – 15Thermal conductive foil

A 13 – 17Heatsink profile-overviewE 21 – 22Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Thermal adhesive foils

A

B

C

D

E

F

G

H

I

K

L

M

N

– GEL silicone foils with especially high thermal conductivity

– balances non-planarities and differences in components (Gap Filler)

– soft, elastic and compressible

– cuts, punchings and special designs according to customer specifications

Rth (100 kPa)

[°C cm2/W]

Rth (100 kPa)

[°C in2/W]

material thick-

ness [mm]

art. no.Rth (100 kPa)

[°C cm2/W]

Rth (100 kPa)

[°C in2/W]

material thick-

ness [mm]

art. no.

1.370.21

0.5 ±0.1

GEL 60 G 051.300.20

0.5 ±0.1

GEL 60 05

2.110.33

1.0 ±0.2

GEL 60 10 1.990.31

1.0 ±0.2

GEL 60 G 10

3.080.48

1.5 ±0.2

GEL 60 G 153.450.53

1.5 ±0.2

GEL 60 15

3.910.61

2.0 ±0.3

GEL 60 20 4.000.62

2.0 ±0.3

GEL 60 G 20

4.960.77

2.5 ±0.3

GEL 60 G 254.670.72

2.5 ±0.3

GEL 60 25

GEL 60 GGEL 60

polyamide film mash reinforcedstandardversion

6 W/m·Kthermal conductivity

1·106MΩ/m

volume resistance

52 Shore 00hardness range

-60°C ... +200°Ctemperature range

80 %extensibility

6.4 [50 Hz]/6.4 [1 kHz]/6.4 [1 MHz]dielectric constant

0.035 [50 Hz]/0.005 [1 kHz]/0.001 [1 MHz]dielectric loss factor

13 kV/mmdielectric strength

3.2 g/cm3

tightness

UL 94 V-0class of flammibility

on both sides covered with protective foil/ plates, usable area 300x200mm/ other dimensions

upon request

type of delivery

– especially soft design

– levels smallest air gaps and unevennesses

– cuts and contours with cutouts according to customer specifaction

Rth (100 kPa)

[°C cm2/W]

Rth (100 kPa)

[°C in2/W]

material thick-

ness [mm]

art. no.Rth (100 kPa)

[°C cm2/W]

Rth (100 kPa)

[°C in2/W]

material thick-

ness [mm]

art. no.

10.911.695.0GEL 27 S 506.050.942.5GEL 27 S 25

standardversion:

2.7 W/m·Kthermal conductivity:

2·107MΩ/m

volume resistance:

53 Shore 00hardness range:

-60°C ... +200°Ctemperature range:

45 %extensibility:

15 kV/mmdielectric strength:

3 g/cm3

tightness:

UL 94 V-0class of flammibility:

on both sides covered with protective foil/ plates, usable area 300x200mm/ other dimensions

upon request

type of delivery:

E 15

A 22 – 83Extruded heatsinksE 2 – 5Thermal conductive material

B 35 – 48Heatsinks for LEDsE 7 – 15Thermal conductive foil

A 13 – 17Heatsink profile-overviewE 21 – 22Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Gel thermal conducting foils

A

B

C

D

E

F

G

H

I

K

L

M

N

– very low thermal resistance

– optimised heat conductivity

– best mechanical charactaristics

– polyimide-carrier foil with silicone-free phase changing thermal conductive layer completely coated on both sides

– clean processing, no abrasion of the coating

– stacked foils do not stick together

– good resistance against cleening agents

– no cold flow

– low pressure force necessary, thus particularly applicable for spring-fixing of semiconductors

– cuttings and special versions according to customer's requirements

–the thermal details refer to an area of 1 inch2(6.45 cm2)

21

18

24

6

Ø 3,1

art. no.

KAP 218

TO 248/ TO 218/ TO 247

13

18

art. no.

KAP 220 O

TO 220

18

23

art. no.

KAP 218 O

TO 218

21

24

art. no.

KAP 247 O

TO 248/ TO 218/ TO 247

1000

±0,5

305±0,5

art. no.

KAP 1 P

suitable for pre-cut parts (plate)

17

29

42

Ø

1,5

11

30

Ø

4,2

Ø

4,2

art. no.

KAP 3 K

TO 3

17

34

47

Ø

1,5

5,5

5,5

8,5

13

Ø

4,2

Ø

4,2

art. no.

KAP 3 G

TO 3

13

13,5

18

4,5

Ø 3,1

art. no.

KAP 220 K

TO 220

18

16

23

7

Ø 3,1

art. no.

KAP 220 G

TO 220

KAP

polyimide-carrier foil with silicone-free phase changing thermal conductive layer completely

coated on both sides

material

0.077mm (substrate 0.05mm)material thickness

0.45 W/m·K (substrate)thermal conductivity

1014 Ω

insulation resistance

0.15 K/W [at 1 inch2; = 6.45 cm2; = TO 3 (KAP 3)]

thermal resistance

-40°C... +150°Ctemperature range

52 °Cphase change temperature

30 %extensibility

7.8 kVdielectric strength

UL 94 V-0class of flammibility

E 16

C 2 – 3Finger-shaped heatsinksA 91Profiles for PCB components

E 39Distance sleeves for PCB´s in HP gridA 89 – 93Heatsinks for PCB

E 40SpacersA 89 – 112Profiles for PCB mounting

A 2 – 8Technical introductionC 4 – 9Heatsinks for transistors

Kapton insulator washers

A

B

C

D

E

F

G

H

I

K

L

M

N

– other thicknesses and versions on request

= thickness; = flatness

17,5

20,5

Ø

3,1

15

art. no.

AOS 3 P SL

1.5 mm 0.15 mm

20

23

Ø

3,6

16

art. no.

AOS 3 P 2

1 mm 0.15 mm

21

25

Ø

4

18

7

art. no.

AOS 218 247 1

1.5 mm 0.02 mm

21

25

Ø

4

18

7

art. no.

AOS 218 247

3 mm 0.15 mm

20

23

art. no.

AOS 247

1 mm 0.02 mm

8

11

Ø

3,1

7,3 3,7

art. no.

AOS 32

1.5 mm 0.033 mm

12

18

Ø

3,1

14 4

art. no.

AOS 220

1.5 mm 0.054 mm

12

18

Ø

4

14 4

art. no.

AOS 220 4

1.5 mm 0.054 mm

14

18

Ø

3,2

14 4

art. no.

AOS 220 SL

4.5 mm 0.054 mm

14,5

Ø

3,7

14

19,3

art. no.

AOS 220 3

1.6 mm 0.11 mm

8

2,5

Ø O,9

art. no.

AOS 18

1.5 mm 0.023 mm

9,5

Ø 3,2

art. no.

AOS 93

2.3 mm 0.03 mm

10,9

5,1

Ø 1,1

art. no.

AOS 5

1.5 mm 0.032 mm

4

17,5

20,5

Ø

3,1

15

art. no.

AOS 3 P

1.5 mm 0.061 mm

21

18

25

R 7,5

Ø 4

art. no.

AOS 127

3 mm 0.076 mm

14,7

19,2

Ø

4,3

Ø

4,3

9,7

5,1

33,3

art. no.

AOS 66

2.5 mm 0.10 mm

4,2

26,2

40,5

Ø

4,9

13,2

11

4,9

16,9

art. no.

AOS 3

2.9 mm 0.123 mm

AOS

AL2O3- ceramicsmaterial

0.3 K/W [at 1 inch2; = 6.45 cm2; = TO 3 (AOS 3 G)]

thermal resistance

>1014 Ω/cm

specific electrical resistance

25 W/m·Kthermal conductivity

9dielectric constant

~8·10-6/K

linear expansion coefficient

10 kV/mmsnap through stability

E 17

E 7 – 10Thermal conductive foilE 2 – 5Thermal conductive material

E 16Kapton insulator washersE 12 – 15GEL thermal conductive foils

E 19Mica wafersE 21 – 22Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Aluminium oxide wafers

A

B

C

D

E

F

G

H

I

K

L

M

N

– laser-cut versions with outer dimensions and cutouts according to customer's requirements

– other plate dimensions upon request

– max. plate dimension 180 x 180 mm

outer dimensions [mm]material thickness [mm]

114x1142.000

114x1142.540

114x1141.500

114x1141.270

114x114/ 165x115/ 160x1131.000

114x114/ 165x115/ 160x1130.800

106.5x106.5/ 114x114/ 165x115/ 160x1130.635

106.5x106.5/ 114x1140.500

106.5x106.5/ 114x1140.400

106.5x106.5/ 114x1140.300

106.5x106.5/ 114x1140.250

E 18

E 7 – 10Thermal conductive foilE 2 – 5Thermal conductive material

E 16Kapton insulator washersE 12 – 15GEL thermal conductive foils

E 19Mica wafersE 21 – 22Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Aluminium oxide wafers according to customer's instructions

A

B

C

D

E

F

G

H

I

K

L

M

N

18

4

12

Ø 4

art. no.

GS 220 4

TO 220

13,5

18

Ø

3,7

5,3

art. no.

GS 66 P

TO 66

17,5

20,5

Ø

3,1

15

art. no.

GS 3 P SL

TOP 3

21

18

Ø

4,1

24

art. no.

GS 218

TO 218

11

20

art. no.

GS 220 C

TO 220

17

10,9

30

43

Ø

4,2

Ø

2

13,2

art. no.

GS 3

TO 3

4

17,5

20,5

Ø

3,1

15

art. no.

GS 3 P

TOP 3

3,7

8

Ø

3,1

11

art. no.

GS 32 P

SOT 32

12

18

Ø

3,1

4

art. no.

GS 220 P

TO 220

GS

muskovitmaterial

0.05 mmmaterial thickness

0.4 K/Wthermal resistance (GS 3)

3·1017 Ω·cm

insulation resistance

5 kVsnap through stability

E 19

E 23 – 24Thermal conductive glueE 2 – 5Thermal conductive material

E 16Kapton insulator washersE 7 – 10Thermal conductive foil

E 17 – 18Aluminium oxide wafersE 12 – 15GEL thermal conductive foils

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Mica wafers

A

B

C

D

E

F

G

H

I

K

L

M

N

– self-supporting differential phase changing thermal interface material, contains no substrate (Free Standing Film)

– materials with phase change temperature at 52 °C;

– best thermal conductivity, exceeding phase change temperature point, material flows into all gaps between components and heatsink

– thixotropic, does not migrate from the interface area

– no lowering of thermal conductivity though thermal cycling

– application with very low contact pressure, due to non elastomeric material, particularly suitable for clamp mounting of components

– electrically non-conductive, but not an insulator

– self adhering characteristics, also suitable for large areas

– no toxic ingredients

– custom required shapes on request

– all with protection foil on both sides

dimensions [mm]basinart. no.

330x343x0.127 ±0.025

plate, protection foil on both sidesFSF 52 P

FSF 52 P

52 °Cphase change temperature

whitecolour

2 g/cm3

tightness

0.9 W/m·Kthermal conductivity

0.03 K/W

0.031 N/mm2

thermal resistance (1 in2, TO 3) at

contact pressure of

≤+200°Ctemperature range

0.35 N/mm2

adhesive holding force

UL 94 V-0class of flammibility

3.8 [1 kHz]

3.4 [1 MHz]

dielectric constant

E 20

E 2 – 5Thermal conductive materialE 19Mica wafers

E 51Insulating capsE 7 – 10Thermal conductive foil

E 17 – 18Aluminium oxide wafersE 21 – 22Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Free standing film

A

B

C

D

E

F

G

H

I

K

L

M

N

Silicon thermal transfer compound

– thermal transfer compound used to reduce the thermal transmission resistance between semiconductor and heatsink

delivery quantity [g]basinart. no.

4boxWLP 004

35boxWLP 035

500boxWLP 500

300cartridge (310 ml)WLP 300 S

500cartridge (310 ml)WLP 500 S

Silicone-free thermal transfer compound

– thermal transfer compound used to reduce the thermal transmission resistance between semiconductor and heatsink

delivery quantity [g]delivery quantity [ml]basinart. no.

—2syringeWLPF 05

—5syringeWLPF 10

—10syringeWLPF 20

—20syringeWLPF 50

300—cartridge (310 ml)WLPF 300 S

WLPFWLP

silicone free synthetic liquid. Metal oxide

filling.

silicone oil, inorganic filling materialcomposition

pasteyconsistance

white-greywhitecolour

approx. 2 g/cm3

1.1 g/cm3

tightness

>0.7 W/m·K0.61 W/m·Kthermal conductivity

>1012 Ω/cm

specific electrical resistance

of the basic oil >280°C (ISO 2592)none (DIN 53213)flashpoint

>260°Cdrop point

<1% (96 h/200°C)no bleeding at (4 h/200°C)thermal resistance

-40°C... +150°C-40°C ... +250°Ctemperature range

< 0.01 mg KOH/gacid number

insolublesolubility in water

E 21

E 2 – 5Thermal conductive materialE 19Mica wafers

E 51Insulating capsE 7 – 10Thermal conductive foil

E 17 – 18Aluminium oxide wafersE 21 – 22Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Thermal transfer compounds

A

B

C

D

E

F

G

H

I

K

L

M

N

Ceramic filled, silicone-free thermal conductive paste with high thermal conductivity

– suitable especially for silicone-sensitive applications

– no drying out, hardening or melting of the thermal conductive paste

– high long-term stability

– further package sizes, container types such as cans, cartridge, etc. upon request

delivery quantity [ml]basinart. no.

3syringeWLPK 3

5syringeWLPK 5

10syringeWLPK 10

WLPK

silicone-free, synthetic fluid ceramic filledcomposition

pasteyconsistance

silvercolour

1.4 g/cm3

tightness

10 W/m·Kthermal conductivity

not applicable, because conductingdielectric strength

-60°C ... +150°Ctemperature range

insolublesolubility in water

E 22

E 2 – 5Thermal conductive materialE 19Mica wafers

E 51Insulating capsE 7 – 10Thermal conductive foil

E 17 – 18Aluminium oxide wafersE 21 – 22Thermal conductive paste

A 2 – 8Technical introductionE 23 – 24Thermal conductive glue

Thermal transfer compounds

A

B

C

D

E

F

G

H

I

K

L

M

N

– thermally conductive, electrically non-conductive adhesive

– two part epoxy resin adhesive, metaloxide filled

– fully replaces mechanical fastenings

– excellent function and application characteristics

–to be stored at a cool and dark place

compositionart. no.compositionart. no.

10 g resin/1 g hardenerWLK 105 g resin/0.5 g hardenerWLK 5

compositionart. no.compositionart. no.

120 g resin/12 g hardenerWLK 12030 g resin/3 g hardenerWLK 30

WLK

0.836 W/m·Kthermal conductivity

1.2 m·K/Wspecific thermal resistance

1016 Ω/cm

volume resistance

-56°C... +149°Ctemperature range

20°C approx. 16-24h / 25°C approx. 8 h / 120°C approx. 20 minhardening time

Epoxidglue layer

10:1mixture proportion

E 23

E 23 – 24Thermal conductive glueE 2 – 5Thermal conductive material

B 59fan cooler for Pentium and MMXE 7 – 10Thermal conductive foil

B 57heatsinks for Pentium III FC PGAE 12 – 15GEL thermal conductive foils

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Thermally conductive adhesive

A

B

C

D

E

F

G

H

I

K

L

M

N

– solvent-free and thermal conductive two part adhesive

– epoxy based filled with aluminium oxide

– composition of hardener and resin (1:1) with statical mixing tube

– lockability of the container via Luer-Lock System

– good usage and working properties

contents of deliverybasinart. no.

1x 4 ml syringe / 3x mixer WLK M4syringeWLK DK 4

1x 10 ml syringe / 3x mixer WLK M4syringeWLK DK 10

1x 50 ml cartridge / 3x mixer WLK M50cartridgeWLK DK 50

WLK DK

1 W/m·Kthermal conductivity

118°C cm/Wspecific thermal resistance

8·1011 Ω/cm

volume resistance

-50°C... +145°Ctemperature range

approx. 30 minworking life at room temperature

25°C approx. 4 h/50°C approx. 1 h/85°C approx. 10 min/125°C approx. 2 minhardening time

Epoxidglue layer

1:1mixture proportion

Accessories

– more package sizes and container types upon request

– store cool and dry

contents of deliveryart. no.

10x mixer für 4 & 10 ml syringe (packing unit 10 pieces)WLK M 4

10x mixer für 50 ml cartridge (packing unit 10 pieces)WLK M 50

1x applicator gun for 50 ml cartridgeWLK P

E 24

E 23 – 24Thermal conductive glueE 2 – 5Thermal conductive material

B 59fan cooler for Pentium and MMXE 7 – 10Thermal conductive foil

B 57heatsinks for Pentium III FC PGAE 12 – 15GEL thermal conductive foils

A 2 – 8Technical introductionE 21 – 22Thermal conductive paste

Thermally conductive adhesive

A

B

C

D

E

F

G

H

I

K

L

M

N

– universal, solid plastic clip fastening for all 35 mm mounting rails

– suitable for rail material thicknesses from 1 to 2.3 mm according to DIN EN 60 715 (formerly DIN EN 50 022)

– registrated design DE 200 07 435.0

– fast and easy mounting of heatsinks, casings etc. due to direct snap up on the mounting rail

– safe hold due to a stable extruded plastic profile with integrated spring back

– electroconductive material or surface on request

– special lengths and treatments on customer's request

– * = examples of mounting rail versions suitable for KL 35 K

*

1

7,515 15

1,5 2,3

35

35

35

9

2,7

13,5

5,6

2,7

12,9

43,7

dim. [mm]art. no.dim. [mm]art. no.

75KL 35 K 7540KL 35 K 40

50KL 35 K 50 100KL 35 K 100

rigid PVCmaterial:

-30°C ... +80°Cheat distortion:

anthracite greycolour:

UL 94 V-0class of flammibility:

– safe hold due to a stable extuded profile with integrated stainless steel spring

– special lengths (≥40mm), treatments and surfaces on request

–*= examples of mounting rail versions suitable for KL 35

50

8,5

3,5

7,4

37,5

512,1

17

*

1

7,515 15

1,5 2,3

35

35

35

dim. [mm]art. no.dim. [mm]art. no.dim. [mm]art. no.

100KL 35 10075KL 35 7550KL 35 50

aluminiummaterial:

clear anodisedsurface:

E 25

E 47Mounting pads for transistorsE 39Distance sleeves for PCB´s in HP grid

E 49Mounting parts for heatsinksE 30Extractors for guide rails

E 41Vibration dampersE 45Insulting clamping parts

A 2 – 8Technical introductionE 41Vibration dampers

Fastening for mounting rail

A

B

C

D

E

F

G

H

I

K

L

M

N

Screw-on type

– for eurocards

– connectors according to DIN 41612 or VG 95324 mountable

– high stability through inner reinforcements

– stable foot mounting trough inserted brass- thread inserts

– groove depth: 2.2 mm, groove width 1.9 mm

– suitable for PCB thicknesses from 0.5 to 1.85 mm

–*= printed circuit board

15

11

1,5

7,8

108

90

M4 x 7,5

116,5

10,2

5

A

10,2

Ø 2,8

90

119,5

16,4

37,5

2,75

*

10

B

12

Ø 4,05

100

dim. [mm]art. no.

BA

2.5151FS 151 P

2,5

Ø1,2

10,35

15

10

9,5

24,25

27,5

20

2,6

7,5

8

art. no.

CLIP 151 only for FS 151 P

polycarbonate, GF reinforcedmaterial:

-40°C... +125°Ctemperature range:

UL 94 V-0class of flammibility:

E 26

E 39Distance sleeves for PCB´s in HP gridE 43Solder pins

E 47Mounting pads for transistorsE 29 – 30Snap-in guide rails

E 41Vibration dampersE 30Extractors for guide rails

A 2 – 8Technical introductionE 45Insulting clamping parts

Guide rails

A

B

C

D

E

F

G

H

I

K

L

M

N

Screw-on type

6

3

1,8

2,4

M 3

C8

6

B

A

dim. [mm]art. no.

CBA

75065FS 6 065

125070FS 6 070

56780FS 6 080

156790FS 6 090

884100FS 6 100

1884110FS 6 110

2884120FS 6 120

3884130FS 6 130

polycarbonate, GF reinforcedmaterial:

-20°C... +130°Ctemperature range:

brass nickel-platedthread nut:

UL 94 V-0class of flammibility:

18

4

109

14

2

2

5

8,5 3

art. no.

FS 109

M3

7

2

2,5

22

100

93

8

12,5

9

92

2

3

8,5

9

7

art. no.

FS 100

M3

2

8,5

100

92

8

12,5

1

5

85

2,2

2,2

5,5

∅ 7

∅ 1,8

*

art. no.

MSVL 100 *= position of snap-in slot

polyamide, GF reinforcedmaterial:

-40°C... +205°Ctemperature range:

UL 94 V-0class of flammibility:

E 27

E 39Distance sleeves for PCB´s in HP gridE 43Solder pins

E 47Mounting pads for transistorsE 29 – 30Snap-in guide rails

E 41Vibration dampersE 30Extractors for guide rails

A 2 – 8Technical introductionE 45Insulting clamping parts

Guide rails

A

B

C

D

E

F

G

H

I

K

L

M

N

Lockable mounting rails

– lockable by pushing the plastic pin or the metal button

– no conductive connection to the PCB

– the PCB requires a snap-in slot in accordance to the drawing

– other position with locking device on request

–*= position of snap-in slot

9,5

6

6

A

Ø 3,1

3

12,7

18,8

2

L

dim. [mm]versionart. no.

AL

dim. [mm]versionart. no.

AL

6270without bolting

device

FS 85 704250without bolting

device

FS 85 50

5260without bolting

device

FS 85 60 7685without bolting

device

FS 85

Ø 3,1

3

12,7

18,8

2

2,2

2,2

8,5

1

5

6

A

L

6

5,5

Ø 7

Ø 1,8

9,5

3

*

A

dim. [mm]versionart. no.

AL

dim. [mm]versionart. no.

AL

6270with bolting deviceMSVL 704250with bolting deviceMSVL 50

5260with bolting deviceMSVL 60 7685with bolting deviceMSVL 85

polyamide, GF reinforcedmaterial:

-40°C... +205°Ctemperature range:

UL 94 V-0class of flammibility:

– the guide bars have got mounting holes for vertical and horizontal assembly of printed circuits

– they can also be stacked together horizontally or vertically using pins and treatments

4

7

10

9

90

65

Ø 3 Ø 2,8

22

22,5

13,9

80

10

3,5

7

4,5

Ø 2,5 3

4

Ø 8

art. no.

MSHV 90

polyamide, GF reinforcedmaterial:

UL 94 V-0class of flammibility:

E 28

E 39Distance sleeves for PCB´s in HP gridE 43Solder pins

E 47Mounting pads for transistorsE 29 – 30Snap-in guide rails

E 41Vibration dampersE 30Extractors for guide rails

A 2 – 8Technical introductionE 45Insulting clamping parts

Guide rails

A

B

C

D

E

F

G

H

I

K

L

M

N

Snap-in

– narrow version

6,2

2

L

4,4

B

A

6,4

Ø 3,2 5,5

R 1,5

3

1,2 ... 2,2

1,2

3,2

3,2

3,4

dim. [mm]art. no.

BAL

dim. [mm]art. no.

AL

—139.7152.4FS S 15 250.863.5FS S 06 2

63.576.2FS S 07 2 —152.4165.1FS S 16 2

76.288.9FS S 08 2 88.9177.8190.5FS S 19 3

88.9101.6FS S 10 2 95.2190.5203.2FS S 20 3

101.6114.3FS S 11 2 —203.2215.9FS S 21 2

114.3127.0FS S 12 2 101.6203.2215.9FS S 21 3

127.0139.7FS S 13 2

nylon, natural colouredmaterial:

-40°C... +120°Ctemperature range:

UL 94 V-2class of flammibility:

– wide version

3,2

4,3

1,9

4,4

4,3

3,2

12,7 A

Ø 4,6 5,7

4,5

R 2,2

7,9

1,9

L

7,9

1,9

L

FS BF ...

FS BT ...

1,2 ... 2,3

1,2 ... 2,3

dim. [mm]versionart. no.

AL

dim. [mm]versionart. no.

AL

38.163.5shallow grooveFS BF 0638.163.5deep grooveFS BT 06

63.588.9deep grooveFS BT 08 50.876.2shallow grooveFS BF 07

76.2101.6shallow grooveFS BF 1076.2101.6deep grooveFS BT 10

88.9114.3deep grooveFS BT 11 88.9114.3shallow grooveFS BF 11

114.3139.7shallow grooveFS BF 13114.3139.7deep grooveFS BT 13

127.0152.4deep grooveFS BT 15 127.0152.4shallow grooveFS BF 15

165.1190.5shallow grooveFS BF 19139.7165.1deep grooveFS BT 16

165.1190.5deep grooveFS BT 19 177.8203.2shallow grooveFS BF 20

177.8203.2deep grooveFS BT 20

nylon, natural colouredmaterial:

-40°C... +120°Ctemperature range:

UL 94 V-2class of flammibility:

E 29

E 39Distance sleeves for PCB´s in HP gridE 43Solder pins

E 47Mounting pads for transistorsE 29 – 30Snap-in guide rails

E 41Vibration dampersE 30Extractors for guide rails

A 2 – 8Technical introductionE 45Insulting clamping parts

Guide rails

A

B

C

D

E

F

G

H

I

K

L

M

N

Ejectors

– low profile

– suitable for ejectors art. no. AHG V 14 und AHG V 17

2

7,9

L

1,2 ... 2,3

C

4

12,7 B

A

Ø 4,4 3

4,4

4,4

2,6 2,6

3,4

D

dim. [mm]art. no.

DCBAL

dim. [mm]art. no.

DCAL

3.22.0—127.4152.4FS LP 153.22.025.850.8FS LP 05

3.22.038.576.2FS LP 07 3.22.0—127.4165.1FS LP 16

3.22.038.588.9FS LP 08 3.22.0—153.2177.8FS LP 17

3.22.076.6101.6FS LP 10 3.62.095.7191.3228.6FS LP 22

3.22.076.6114.3FS LP 11 4.02.4134.0267.9304.8FS LP 30

3.22.076.6139.7FS LP 13

polyamide, GF reinforcedmaterial:

-40°C... +120°Ctemperature range:

UL 94 V-0class of flammibility:

– deep guideway

– bevelled entrance zone

1,2 ... 2,3

12,7 B

11,3

6,35

A

6,35

R 2,3

4,62

Ø 4,75

1,27

2

L

3,3

6,35

6,35

1,3

6,4

4,8

dim. [mm]art. no.

BAL

—38.163.5FS U 06

—88.9114.3FS U 11

88.9177.8203.2FS U 20

polyamide, GF reinforcedmaterial:

-40°C... +120°Ctemperature range:

UL 94 V-0class of flammibility:

E 30

E 39Distance sleeves for PCB´s in HP gridE 43Solder pins

E 47Mounting pads for transistorsE 29 – 30Snap-in guide rails

E 41Vibration dampersE 30Extractors for guide rails

A 2 – 8Technical introductionE 45Insulting clamping parts

Guide rails

A

B

C

D

E

F

G

H

I

K

L

M

N

7,9

6,4

14,3

1,6

0,76

7,6

10,8

3,2

Ø 2,4 14,3

Ø 2

28,7

6,9

14,3

6,4 Ø 2,8

6,4

3,2

6,4

Ø 2,2

PCB

FS LP

*

art. no.

AHG V 14 *= mounting dimensions; locking in FS LP

7,9

6,4

14,3

1,6

0,76

7,6

10,8

3,2

Ø 2,4 14,3

Ø 2

28,4

6,9

19,8

3,2

14,3

6,4 Ø 2,8

6,4

3,2

6,4

Ø 2,2

PCB

FS LP

*

art. no.

AHG V 17 *= mounting dimensions; locking in FS LP

27,9

R 3,2

9,5

6,4

R 3,6

Ø 2,4

6,4

3,2

1,6

art. no.

AHG K 27

11,1

6,4

28,6

12,7

R 3,2

Ø 2,3

R 3,6

1,6

6,4

9,5

6,4

art. no.

AHG K 28

1,9

16,6

15

A

12,4

4,7

6,6

50,8

37,5

11

4

Ø 2,3

6,4

1,2

6,4

7,6

6,1

45 Ø 2,8

°

dim. [mm]art. no.

A

7.4AHG L 7

nylonmaterial:

-40°C... +120°Ctemperature range:

UL 94 V-2class of flammibility:

all ejectors with matching spring pintype of delivery:

E 31

E 39Distance sleeves for PCB´s in HP gridE 43Solder pins

E 47Mounting pads for transistorsE 29 – 30Snap-in guide rails

E 41Vibration dampersE 30Extractors for guide rails

A 2 – 8Technical introductionE 45Insulting clamping parts

Ejectors

A

B

C

D

E

F

G

H

I

K

L

M

N

field of applications:

– insulated assembly of stacked PCB

– insulated assembly of stacked heatsinks with varying capacities

– insulated assembly of chassis plates in cases

– insulated supports in the wiring

– mechanicaly very stable as threads are made of brass

– other lengths on request

– dimensions = nominal size: deviation ±0.5 mm

–... please indicate length "L"

D

P P’L

A

D'

dim. [mm]art. no.

P/P'LD/D'A

6.010/ 15/ 20/ 25M2.5/M2.58.0ISAB 25 A ...

6.010/ 20M3/M38.0ISAB 3 A ...

6.015/ 20M4/M48.0ISAB 4 A ...

12.725M6/M612.7ISAB 6 A ...

27 kV/mmdielectric strength:

CTI 600creeping current resistance:

brassthread inserts:

-30°C... +85°C (short term +200°C)temperature range:

rawsurface:

polyamide 66plastic body:

natural (opaque)colour:

E 32

E 44 – 48Mounting material for semiconduct.E 40Spacers

E 49 – 50Mounting parts for heatsinksE 26 – 30Screw mounted guide rails

E 2 – 24Thermal conductive materialE 31Ejectors

A 2 – 8Technical introductionE 41Vibration dampers

Insulating spacers with internal and external thread

A

B

C

D

E

F

G

H

I

K

L

M

N

P

L

A

D

P'

D'

dim. [mm]art. no.

P/P'LD/D'A

6.010/ 13/ 15/ 18/ 20/ 25/ 30M2.5/M2.58.0ISAB 25 B ...

6.010/ 13/ 15/ 18/ 20/ 25/ 30/ 35/ 40M3/M38.0ISAB 3 B ...

6.015/ 20/ 25/ 30/ 40M4/M48.0ISAB 4 B ...

10.020/ 30/ 40M5/M59.5ISAB 5 B ...

12.725/ 30/ 35/ 40/ 50M6/M612.7ISAB 6 B ...

– dimensions = nominal size: deviation ±0.5 mm; at ISAB 3 C ... L=10 => P/P'=3.5

P

L

D

P'

A

D'

dim. [mm]art. no.

P/P'LD/D'A

6.010/ 13/ 15/ 18/ 20/ 25/ 30M2.5/M2.58.0ISAB 25 C ...

6.010/ 13/ 15/ 18/ 20M3/M38.0ISAB 3 C ...

6.015/ 35M4/M48.0ISAB 4 C ...

10.020M5/M59.5ISAB 5 C ...

12.025M6/M612.7ISAB 6 C ...

12.730M6/M612.7ISAB 6 C ...

27 kV/mmdielectric strength:

CTI 600creeping current resistance:

brassthread inserts:

-30°C... +85°C (short term +200°C)temperature range:

rawsurface:

polyamide 66plastic body:

natural (opaque)colour:

E 33

E 44 – 48Mounting material for semiconduct.E 40Spacers

E 49 – 50Mounting parts for heatsinksE 26 – 30Screw mounted guide rails

E 2 – 24Thermal conductive materialE 31Ejectors

A 2 – 8Technical introductionE 41Vibration dampers

Insulating spacers with internal and external thread

A

B

C

D

E

F

G

H

I

K

L

M

N

– allows compact, insulated constructions

– reduced volume in case of stack assembly

– insulated mounting of heatsinks, PCB, housingparts etc.

– very good mechanical stability due to brass inserts

– dimensions = nominal size: deviation ±0.5 mm

–... please indicate length "L"

6+0,5 6+0,5 S

G

L

Ø

dim. [mm]art. no.

max. diameter

of the bushing

Ltype of threadS

64/ 5/ 7/ 9/ 11/ 12M2.56ISAM 2 A ...

74/ 5/ 7/ 8/ 9/ 10M37ISAM 3 A ...

6+0,5

4-0,3 S

G

L

Ø

dim. [mm]art. no.

max. diameter

of the bushing

Ltype of threadS

68/ 9/ 10/ 11M2.56ISAM 2 B ...

77/ 8/ 9/ 10/ 11/ 12M37ISAM 3 B ...

4-0,3 4-0,3

G

S

L

Ø

dim. [mm]art. no.

max. diameter

of the bushing

Ltype of threadS

69M2.56ISAM 2 C ...

79/ 10/ 12M37ISAM 3 C ...

28 kV/mmdielectric strength:

CTI 600creeping current resistance:

brassthread inserts:

-30°C... +85°C (short term +200°C)temperature range:

rawsurface:

polyamide 6plastic body:

natural (opaque)colour:

E 34

E 44 – 48Mounting material for semiconduct.E 40Spacers

E 49 – 50Mounting parts for heatsinksE 26 – 30Screw mounted guide rails

E 2 – 24Thermal conductive materialE 31Ejectors

A 2 – 8Technical introductionE 41Vibration dampers

Miniature spacers with threads

A

B

C

D

E

F

G

H

I

K

L

M

N

field of applications:

– insulated assembly of stacked PCBs

– insulated assembly of stacked heatsinks with varying capacities

– insulated assembly of chassis plates in cases

– insulated supports in the wiring

– mechanicaly very stable, as threads are made of brass

– other lengths on request

– dimensions = nominal size: deviation ±0.5 mm

–... please indicate length "L"

D

P

D’

P’L

A

dim. [mm]art. no.

P/P'LD/D'A

6.015/ 20/ 25/ 30/ 35/ 40M2.5/M2.56.35ISAS 25 A ...

6.015/ 20/ 25/ 30/ 35/ 40/ 45/ 50M3/M36.35ISAS 30 A ...

6.015/ 20/ 25/ 30/ 35/ 40/ 45/ 50M4/M48.00ISAS 40 A ...

10.020/ 25/ 30/ 35/ 40/ 45/ 50M5/M59.50ISAS 50 A ...

12.725/ 30/ 35/ 40/ 45/ 50/ 60M6/M612.70ISAS 60 A ...

27 kV/mmdielectric strength:

CTI 600creeping current resistance:

brassthread inserts:

-30°C... +85°C (short term +200°C)temperature range:

rawsurface:

polyamide 66plastic body:

natural (opaque)colour:

E 35

E 44 – 48Mounting material for semiconduct.E 40Spacers

E 49 – 50Mounting parts for heatsinksE 26 – 30Screw mounted guide rails

E 2 – 24Thermal conductive materialE 31Ejectors

A 2 – 8Technical introductionE 41Vibration dampers

Distance hexagonal bolts insulating

A

B

C

D

E

F

G

H

I

K

L

M

N

D

P

P’

L

A

D’

dim. [mm]art. no.

P/P'LD/D'A

6.015/ 20/ 25/ 30/ 35/ 40M2.5/M2.56.35ISAS 25 B ...

6.015/ 20/ 25/ 30/ 35/ 40/ 45/ 50M3/M36.35ISAS 30 B ...

6.015/ 20/ 25/ 30/ 35/ 40/ 45/ 50M4/M48.00ISAS 40 B ...

10.020/ 25/ 30/ 35/ 40/ 45/ 50M5/M59.50ISAS 50 B ...

12.725/ 30/ 35/ 40/ 45/ 50/ 60M6/M612.70ISAS 60 B ...

D

P’

L

A

D’

P

dim. [mm]art. no.

P/P'LD/D'A

6.015/ 20/ 25/ 30/ 35/ 40M2.5/M2.56.35ISAS 25 C ...

6.015/ 20/ 25/ 30/ 35/ 40/ 45/ 50M3/M36.35ISAS 30 C ...

6.015/ 20/ 25/ 30/ 35/ 40/ 45/ 50M4/M48.00ISAS 40 C ...

10.020/ 25/ 30/ 35/ 40/ 45/ 50M5/M59.50ISAS 50 C ...

12.725/ 30/ 35/ 40/ 45/ 50/ 60M6/M612.70ISAS 60 C ...

27 kV/mmdielectric strength:

CTI 600creeping current resistance:

brassthread inserts:

-30°C... +85°C (short term +200°C)temperature range:

rawsurface:

polyamide 66plastic body:

natural (opaque)colour:

E 36

E 44 – 48Mounting material for semiconduct.E 40Spacers

E 49 – 50Mounting parts for heatsinksE 26 – 30Screw mounted guide rails

E 2 – 24Thermal conductive materialE 31Ejectors

A 2 – 8Technical introductionE 41Vibration dampers

Distance hexagonal bolts insulating

A

B

C

D

E

F

G

H

I

K

L

M

N

– other lengths and threads on request

–... please indicate length "L"

D’

L ±0,1

PP’

H

D

dim. [mm]art. no.

P'PLD/D'H

2.565M2.55GBM 2550 ...

5.0610M2.55GBM 2550 ...

8.0615/ 20M2.55GBM 2550 ...

10.0825/ 30/ 35M2.55GBM 2550 ...

2.585M35GBM 3050 ...

5.0810/ 12/ 14M35GBM 3050 ...

10.0815/ 18/ 20M35GBM 3050 ...

10.01025/ 30/ 35/ 40/ 45/ 50M35GBM 3050 ...

2.585M47GBM 4070 ...

5.0810M47GBM 4070 ...

8.0815M47GBM 4070 ...

10.0820M47GBM 4070 ...

10.01025/ 30/ 35/ 40/ 45/ 50M47GBM 4070 ...

5.0810M58GBM 5080 ...

6.0815/ 20M58GBM 5080 ...

10.01025/ 30/ 35/ 40/ 45/ 50M58GBM 5080 ...

brassmaterial:

6 µm nickel-plated, solderablesurface:

– other lengths and threads on request

–... please indicate length "L"

D’

L ±0,1

PP’

H

D

dim. [mm]art. no.

P'PLD/D'H

7810M36GBP 3060 ...

8812M36GBP 3060 ...

10815/ 18/ 20/ 25/ 30M36GBP 3060 ...

7810M48GBP 4080 ...

9812M48GBP 4080 ...

10815/ 18/ 20/ 25/ 30/ 35/ 40/ 45M48GBP 4080 ...

polyamide, GF reinforcedmaterial:

-30°C... +110°Ctemperature range:

blackcolour:

E 37

E 44 – 48Mounting material for semiconduct.E 40Spacers

E 49 – 50Mounting parts for heatsinksE 26 – 30Screw mounted guide rails

E 2 – 24Thermal conductive materialE 31Ejectors

A 2 – 8Technical introductionE 41Vibration dampers

Spacers with internal and external thread

A

B

C

D

E

F

G

H

I

K

L

M

N

– other lengths and threads on request

–... please indicate length "L"

D

L ±0,1

PP’

H

D’

dim. [mm]art. no.

P'PLD/D'H

—=L5/ 8/ 10/ 12/ 15M2.55ABM 2550 ...

8818M2.55ABM 2550 ...

101020/ 25/ 30/ 35/ 40/ 45/ 50M2.55ABM 2550 ...

—=L5/ 8/ 9/ 10/ 12/ 13/ 15M35ABM 3050 ...

8816/ 18/ 19M35ABM 3050 ...

101020/ 25/ 29/ 30/ 35/ 40/ 45/ 50M35ABM 3050 ...

—=L5/ 8/ 10/ 12/ 15M47ABM 4070 ...

9918M47ABM 4070 ...

101020/ 25/ 30/ 35/ 40/ 45/ 50M47ABM 4070 ...

—=L5/ 12/ 15M58ABM 5080 ...

101020/ 30/ 40/ 50M58ABM 5080 ...

brassmaterial:

6 µm nickel-plated, solderablesurface:

– other lengths and threads on request

–... please indicate length "L"

D

L ±0,1

PP’

H

D’

dim. [mm]art. no.

P'PLD/D'H

—=L10M2.55ABP 2550 ...

6615/ 20/ 25/ 30M2.55ABP 2550 ...

—=L10/ 12/ 15M36ABP 3060 ...

8820M36ABP 3060 ...

101025/ 30M36ABP 3060 ...

—=L10/ 15/ 20M48ABP 4080 ...

101030/ 40M48ABP 4080 ...

polyamide, GF reinforcedmaterial:

-30°C... +110°Ctemperature range:

blackcolour:

E 38

E 44 – 48Mounting material for semiconduct.E 40Spacers

E 49 – 50Mounting parts for heatsinksE 26 – 30Screw mounted guide rails

E 2 – 24Thermal conductive materialE 31Ejectors

A 2 – 8Technical introductionE 41Vibration dampers

Distance sleeves with internal thread

A

B

C

D

E

F

G

H

I

K

L

M

N

– these internally threaded distance sleeves mount PCBs to the correct pitch for insertion into subracks

–ABM TE: spacer between two PC boards

–ABM TE ... DIN:spacer between two PC boards, one of them equipped with DIN-connector resp. A front panal/PCB Interconnection

deviece VS 1

– spacers with internal and external thread to HP grid on request

dim. [mm]suitable for TEart. no.

P/P'L

818.724ABM TE 04

828.886ABM TE 06

839.048ABM TE 08

dim. [mm]suitable for TEart. no.

PL

=L12.724ABM TE 04 DIN

822.886ABM TE 06 DIN

833.048ABM TE 08 DIN

brassmaterial:

8 µm nickel-plated, solderablesurface:

–... please indicate length "L"

Ø

D

L ±0,1

Ø

A

dim. [mm]art. no.

LDA

1/ 2/ 3/ 4/ 5/ 6/ 7/ 8/ 9/ 10/ 12/ 15/ 18/ 25/ 303.26AHM 3260...

2/ 3/ 4/ 5/ 6/ 7/ 8/ 9/ 10/ 12/ 15/ 18/ 204.38AHM 4380...

brassmaterial:

8 µm nickel-plated, solderablesurface:

E 39

E 44 – 48Mounting material for semiconduct.E 40Spacers

E 49 – 50Mounting parts for heatsinksE 26 – 30Screw mounted guide rails

E 2 – 24Thermal conductive materialE 31Ejectors

A 2 – 8Technical introductionE 41Vibration dampers

Distance sleeves for PCB in HP grid

A

B

C

D

E

F

G

H

I

K

L

M

N

– special lengths on request

C [mm]art. no.C [mm]art. no.C [mm]art. no.

25DR 725 V09DR 079 V01DR 071 V0

2DR 072 V0 30DR 730 V010DR 710 V0

11DR 711 V03DR 073 V0 35DR 735 V0

40DR 740 V012DR 712 V04DR 074 V0

5DR 075 V0 45DR 745 V013DR 713 V0

14DR 714 V06DR 076 V0 50DR 750 V0

60DR 760 V015DR 715 V07DR 077 V0

8DR 078 V0 20DR 720 V0

C [mm]art. no.C [mm]art. no.C [mm]art. no.

25DR 825 V09DR 089 V01DR 081 V0

2DR 082 V0 30DR 830 V010DR 810 V0

11DR 811 V03DR 083 V0 35DR 835 V0

40DR 840 V012DR 812 V04DR 084 V0

5DR 085 V0 45DR 845 V013DR 813 V0

14DR 814 V06DR 086 V0 50DR 850 V0

60DR 860 V015DR 815 V07DR 087 V0

8DR 088 V0 20DR 820 V0

C [mm]art. no.C [mm]art. no.C [mm]art. no.

40DR 140 V025DR 125 V05DR 105 V0

10DR 110 V0 45DR 145 V030DR 130 V0

35DR 135 V015DR 115 V0 50DR 150 V0

20DR 120 V0

polyamidematerial:

180°Cheat distortion:

+180°Ctemperature range:

blackcolour:

UL 94 V-0class of flammibility:

E 40

E 44 – 48Mounting material for semiconduct.E 40Spacers

E 49 – 50Mounting parts for heatsinksE 26 – 30Screw mounted guide rails

E 2 – 24Thermal conductive materialE 31Ejectors

A 2 – 8Technical introductionE 41Vibration dampers

Distance spacers

A

B

C

D

E

F

G

H

I

K

L

M

N

– universal applicable round metal, antivibration buffers for solving vibration problems

– other lengths and hardness range on request

–... please indicate height "H"

Field of applications:

– reduction of dynamic component stress

– vibration insulation for disc drives and motors

– impact reducing on sensitive instruments

– reduction of the noise level

– prevention of vibration resonance phenomena (amplified effect)

– compensation of mechanical inbalances

Ø D

H

LL

G

dim. [mm]art. no.

LØ Dtype of threadH

1010M410SMP 410 A …

1015M415SMP 415 A …

1215M515SMP 515 A …

Ø D

H

L

L’

G

dim. [mm]art. no.

LL'Ø Dtype of threadH

10410M410SMP 410 B …

10415M415SMP 415 B …

12515M515SMP 515 B …

Ø D

H

L’

G

dim. [mm]art. no.

L'Ø Dtype of threadH

410M415/ 20SMP 410 C …

415M415/ 20SMP 415 C …

515M520SMP 515 C …

rubber-metal connectionmaterial:

natural rubber (NR according to ISO)rubber:

~ 50 Shore Ahardness range:

very goodextensibility and tebsile strength:

blackcolour:

steel tin-platedmetall parts:

-40°C... +80°C (short term +90°C)temperature range:

E 41

E 45Insulting clamping partsE 26 – 28Screw mounted guide rails

E 49 – 50Mounting parts for heatsinksE 31Ejectors

E 44Mounting material for semiconduct.E 32 – 39Insulating distance sleeves

A 2 – 8Technical introductionE 40Spacers

Contructional elements to vibration damping and insulation

A

B

C

D

E

F

G

H

I

K

L

M

N

7,5

3,5

1

1,5

1,2

Ø 2,4

1,2

Ø 3,8

Ø 4,4

art. no.

LSD 07520

Ø 2

Ø 1

Ø 3,8

Ø 4,4

3,5

1,5

2,5

1

8,9

art. no.

LSD 08910

Ø 2

Ø 1

Ø 4,4

Ø 3,8

8,9

2,5

1,5

3,5

1

art. no.

LSD 08920

Ø 2

Ø 1

Ø 3,8

Ø 1,5

Ø 4,4

4,7

13,5

1,5

2,5

13,5

art. no.

LSD 13510

Ø 2

Ø 1

Ø 1,5

Ø 3,8

Ø 4,4

13,5

2,5

1,5

1

3,5

4,7

art. no.

LSD 13520

insulating body: PTFE (teflon)material:

brass, 2 µm Ni, 4 µm Agcontact pin:

-200°C ... +260°Ctemperature range:

E 42

E 45Insulting clamping partsE 26 – 28Screw mounted guide rails

E 49 – 50Mounting parts for heatsinksE 31Ejectors

E 44Mounting material for semiconduct.E 32 – 39Insulating distance sleeves

A 2 – 8Technical introductionE 40Spacers

Solder terminals

A

B

C

D

E

F

G

H

I

K

L

M

N

2,8

2,2

6,6

13

1,1

0,95

art. no.

LS 105

0.5 mm

1,4

7

11,3

3

1,2

art. no.

LS 104

0.6 mm

2,8

2,9

8,5

1,4

Ø 1,3

art. no.

LS 103

0.6 mm

1,4

4

10

3,5

Ø 1,4

art. no.

LS 102

0.6 mm

3

1,2

5

11,3

1,2

art. no.

LS 101

0.6 mm

3,8

2,8

7

16

1,4

Ø 1,4

art. no.

LS 107

0.5 mm

2,8

3,5

10,5

1,2

Ø 1,4

art. no.

LS 106

0.8 mm

= thickness

LS

brass, 6 µm Snmaterial

E 43

E 34Miniature distance sleevesE 42Solder terminals

E 44 – 48Mounting material for semiconduct.E 39Distance sleeves for PCB´s in HP grid

E 49 – 50Mounting parts for heatsinksE 39 – 40Spacers

A 2 – 8Technical introductionE 45Insulting clamping parts

Solder pins

A

B

C

D

E

F

G

H

I

K

L

M

N

contents of deliveryversionfor transistorart. no.

1 mica wafer, 2 insulator sleeves, 1 tin-plated solder lug, 2 cheese

head screws, nickel-plated, 2 screw nuts M3 nickel-plated

with mica wafer GS

3

TO 3MST 3

1 silicone wafer, 2 insulator sleeves, 1 tin-plated solder lug, 2

cheese head screws, nickel-plated, 2 screw nuts M3 nickel-plated

with silicone wafer

WS 3

TO 3MSTS 3

1 mica wafer, 1 tin-plated solder lug, 1 cheese head screw, nickel-

plated, 1 screw nut M3 nickel-plated

with mica wafer GS

220

TO 220MST 220

1 silicone wafer, 1 insulator sleeve, 1 tin-plated solder lug, 1

cheese head screw, nickel-plated, 1 screw nut M3 nickel-plated

with silicone wafer

WS 220

TO 220MSTS 220

Snap rivet for quick fastening of TO 220

– detachable plastic snap rivet for quick fastening of transistors onto heatsinks and cooling plates (e.g. FK 212-CB, FK 216-CB, FK

222-220. FK 232. FK 233. FK 235-L 1)

– suitable for material thickness: 1 – 1.5 mm

– suitable for hole diameter: 3.5 – 4 mm

–*= bottom view, pin not inserted

6,1

*

Ø 6,4

1,6

4,5 0,85

Ø 4,6

Ø 3,5

for transistorart. no.

TO 220EPN 1

polysulphone, GF reinforcedmaterial:

-70°C... +180°C (5s+260°C)temperature range:

UL 94 V-0class of flammibility:

E 44

E 41Vibration dampersE 49 – 50Mounting parts for heatsinks

E 2 – 24Thermal conductive materialE 40Spacers

A 115 – 117Retaining springs for transistorsE 26 – 30Guide rails for PCBs

A 2 – 8Technical introductionC 2 – 3Finger-shaped heatsinks

Mounting kits for insulation of power transistors

A

B

C

D

E

F

G

H

I

K

L

M

N

Plastic insulating clamping parts for mounting transistors in cases TO 220, TO 218 and TO 247 for enhanced

dielectric stengths

– electrically insulating assembly of the transistor by means of a plastic clamping part

– pin reaching into the hole of the transistor plate

– fastening of clamping part onto the mounting plate by screws, no electroinsulating connection to the transistor

– dielectric strength only determined by the insulating washer between transistor and mounting surface

– no insulating bush necessary, thus no dielectric breakdown

10,1

15,2

3,7

8,5

6,5

Ø 3,7

Ø3,4

3

3,4

4

art. no.

ISP 220

12,1

17,7

5,6

Ø 3,4

10

6,4

Ø 3,7

4,6

art. no.

ISP 220 V

15,2

18,5

5,8

7

12,1

Ø3,5

Ø 3,7

0,9

3,8

art. no.

ISP 218

7

2

24

20

3,8

Ø 3,7

13,1

art. no.

ISP 247

polyamide 6, GF reinforcedmaterial:

<27 kV/mmdielectric strength:

205°C (1.8 MPa); 135°C (8 MPa)heat distortion:

8 [100 Hz]/4.5 [1 MHz]dielectric constant:

1300 [100 Hz] 450 [1 MHz]dielectric loss factor:

>1013 Ω·cm

specific volume resistance:

blackcolour:

UL 94 V-0class of flammibility:

E 45

E 32 – 34Insulating distance sleevesA 91Profiles for PCB components

E 41Vibration dampersA 89Heatsinks for PCB

E 17 – 18Aluminium oxide wafersA 89 – 112Profiles for PCB mounting

A 2 – 8Technical introductionE 2 – 23Thermal conductive material

Insulating clamping parts for power transistors

A

B

C

D

E

F

G

H

I

K

L

M

N

Ø5,08

Ø9

0,8

3

5

art. no.

MS 58 5

TO 5-8 p.

Ø 9,2

Ø5,08 2,5

1

0,8

art. no.

MS 54 25

TO 5

Ø 9,2

2,5

Ø5,08 1

0,8

art. no.

MS 53 25

TO 5

5,08

Ø 9,2

5

7

Ø 0,8

art. no.

MS 53 7

TO 5

3

Ø 9,4

5,08

□0,8

art. no.

MS 53 3

TO 5

2,5

1,5

Ø 2,54

Ø 5,08

Ø 9

art. no.

MS 3518 25

TO 5/ TO 18

1,5

1

5,08

0,8

9,5

art. no.

MS 510 15

TO 5-10 p.

1

1,5

5,08

0,8

9,5

art. no.

MS 58 15

TO 5-8 p.

1,5

1

9,5

5,08

0,8

art. no.

MS 56 15

TO 5-6 p.

Ø5,08

Ø 9,2

5

7

Ø 0,8

art. no.

MS 58 7

TO 5-8 p.

3,5

0,5

2,5

5,5

2,54

1

art. no.

MS 183 35

TO 18

2,5

1

1

2,5

5,4

art. no.

MS 184 25

TO 18

2,5

1

2,5

5,4

0,8

art. no.

MS 183 25

TO 18

3,5

0,7

1

5,08

9,2

2,5

art. no.

MS 34 518

TO 5/TO 18

3,5

2,5

Ø 9,0

Ø 0,8

Ø 2,54

Ø 5,08

art. no.

MS 3518 35

TO 5/ TO 18

2,5

1,755,1

2,5

0,8

art. no.

MS 923 25

TO 92

4

7,1

10

1

art. no.

MS 84 4

TO 8

7

5

2,54

5,4

0,8

art. no.

MS 184 7

TO 18

7

5

5,4

2,54

0,8

art. no.

MS 183 7

TO 18

3,5

2,5

0,8

5,5

2,54

0,5

art. no.

MS 184 35

TO 18

7,62

2,54

9,9

5,08

4

art. no.

US 512 4

TO 5

3,6

2,54

9,9

5,08

art. no.

US 58 4

TO 5

4

3,2

Ø 1,3

1,5

Ø 0,9 2,5

art. no.

MS 4016

max. 16 contacts

*=transfer washer: the US-pads convent the TO 5 pin circle to a pitch of 2.54 mm

polyamide 6, GF reinforcedmaterial:

-40°C... +205°Ctemperature range:

UL 94 V-0 (at thickness ≥3mm), UL 94 V-1class of flammibility:

E 46

E 32 – 34Insulating distance sleevesE 49 – 50Mounting parts for heatsinks

C 2 – 3Finger-shaped heatsinksA 89 – 93Heatsinks for PCB

A 115 – 117Retaining springs for transistorsA 89 – 112Profiles for PCB mounting

A 2 – 8Technical introductionE 2 – 24Thermal conductive material

Mounts

A

B

C

D

E

F

G

H

I

K

L

M

N

Mounts for power transistors

– for TO 220, TO 219, TO 202 and similar

– for vertical and horizontal mounting

– also suitable as mounting bracket for angled connections

5,6

10,8

1,3

1

1

C

3,2

B

Ø 1,5

A

dim. [mm]colourart. no.

CBA

7.1—3.2whiteMLW 32

7.11.34.4whiteMLW 44

7.11.95.1whiteMLW 51

polyamide 6 (nylon)material:

-40°C... +120°Ctemperature range:

UL 94 V-2class of flammibility:

Mounts for rectangular LEDs

– for LED 2x4 mm oder 2x5 mm

– symmetric version for easy assembly

– self-adhesive

2,3 max.

5,2

Ø 0,813

Ø 0,51

Ø 1,1

2,5

1,25

Ø 0,64

4,2

A

B

C

1,3

dim. [mm]colourart. no.

CBA

10.52whiteMRL 20

polyamide 6 (nylon)material:

-40°C... +120°Ctemperature range:

UL 94 V-2class of flammibility:

E 47

E 32 – 34Insulating distance sleevesE 49 – 50Mounting parts for heatsinks

C 2 – 3Finger-shaped heatsinksA 89 – 93Heatsinks for PCB

A 115 – 117Retaining springs for transistorsA 89 – 112Profiles for PCB mounting

A 2 – 8Technical introductionE 2 – 24Thermal conductive material

Mounts

A

B

C

D

E

F

G

H

I

K

L

M

N

– suitable for various components e.g. resistors, capacitors etc.

D

E

C

B

A

F

Ø 1,1

dim. [mm]art. no.

FEDCBA

dim. [mm]art. no.

FEDCBA

2.39.93.60.661.17.6MD A 092.34.61.30.551.12.5MD A 04

3.26.92.30.551.13.8MD A 06 2.312.44.80.761.110.2MD A 12

2.37.42.30.551.15.1MD A 07

0,81

A

0,64

2,5

0,76

B

2,5

1,3

Ø 0,89

Ø 1,7

dim. [mm]art. no.

BA

dim. [mm]art. no.

BA

10.212.7MD B 125.17.6MD B 07

7.610.2MD B 10 12.715.2MD B 15

8.911.4MD B 11

Ø 2,3

7,4

B

A

30°

5,1

2,3

Ø 1,1

dim. [mm]art. no.

BA

dim. [mm]art. no.

A

0.892.2MD C 221.3MD C 13

polyamide 6 (nylon)material:

-30°C... +110°Ctemperature range:

UL 94 V-2class of flammibility:

E 48

E 32 – 34Insulating distance sleevesA 91Profiles for PCB components

C 2 – 3Finger-shaped heatsinksA 89Heatsinks for PCB

A 115 – 117Retaining springs for transistorsA 89 – 112Profiles for PCB mounting

A 2 – 8Technical introductionE 2 – 23Thermal conductive material

Mounts for discrete components

A

B

C

D

E

F

G

H

I

K

L

M

N

7

Ø 7,3

5

25,7

Ø 4,2

5

4

4,2

4

2

7,3

4,2

10

9

10

Ø 4

20

26

4

35,7

art. no.

IS 1 for SK 01, 02, 03, 11, 14, 21, 30, 34, 36, 39, 46, 69; heatsink length: 50 mm

7

Ø 7,3

5

19,5

Ø 4,2

5

4

4,2

4

27,3

4,2

10

2

10

Ø 4

20

26

29,5

9

7

4

art. no.

IS 2 for SK 01, 02, 03, 11, 14, 21, 30, 34, 36, 39, 46, 69; heatsink length: 37.5 75 100 mm

9

,

3

4,2

10

22

2

5,5

10

6,9

art. no.

IS 3 for SK 01, 02, 03, 11, 14, 21, 30, 34, 36, 39, 46, 69

16

ø 4,2

ø 7,3

34,5

14

12,5 14,6 1,8

11,6

2,7

8,6

art. no.

IS 4 for SK 06

7

M2,5

7

3

2

10

5

art. no.

IS 5 for SK 20

14,5

2,5

2,5

6,2

M5

12

4

25

13

5

3

15

art. no.

IS 6 for SK 67

polyamide 6, GF reinforcedmaterial:

UL 94 V-0class of flammibility:

E 49

E 45Insulting clamping partsA 13 – 17Heatsink profile-overview

E 47Mounting pads for transistorsA 89 – 112Profiles for PCB mounting

E 48Mounting pads for single componentsA 89 – 93Heatsinks for PCB

A 2 – 8Technical introductionE 32 – 34Insulating distance sleeves

Mounting parts for heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

6,2

10,5

M5

13,5

3,5

13

3

5

6

24,5

art. no.

IS 7

10

2

9,5

13

3

5

19,5

3

6,8

4,2

M3

art. no.

IS 8 for SK 20

polyamide 6, GF reinforcedmaterial:

UL 94 V-0class of flammibility:

Sockets for power transistors TO 3

17,5

5,9

14,6

1,5

0,8

4

17

11,4

Ø 3,3

30,2

39,8

Ø 6,4

Ø 5,5

Ø 5,5

10,9

no. of contactsart. no.

3TF 3 2

stanyl PA 4.6insulating body material:

CuSn-alloy, CuSn 6; Ni 1-2µm, Au 0.2µmcontact:

15 A max.current rating:

<10 mΩcontact resistance:

-65°C ... +290°Ctemperature range:

1 pFcapacity:

1650 Vtest voltage:

UL 94 V-0class of flammibility:

E 50

E 45Insulting clamping partsA 13 – 17Heatsink profile-overview

E 47Mounting pads for transistorsA 89 – 112Profiles for PCB mounting

E 48Mounting pads for single componentsA 89 – 93Heatsinks for PCB

A 2 – 8Technical introductionE 32 – 34Insulating distance sleeves

Mounting parts for heatsinks

A

B

C

D

E

F

G

H

I

K

L

M

N

– different transistor flange levels will be by the sleeves

11

Ø 3,2

43,6

29

30,2

art. no.

IK 341 3

26,5

11,6

12,341,3

art. no.

IK 3

polyamide, GF reinforcedmaterial:

brass, nickel-platedpressed-in sleeves:

UL 94 V-0class of flammibility:

E 51

E 17 – 18Aluminium oxide wafersE 19Mica wafers

E 21 – 22Thermal conductive pasteE 2 – 5Thermal conductive material

E 23 – 24Thermal conductive glueA 125Mounting for TO 3 angle

A 2 – 8Technical introductionA 125 – 128Die-cast heatsinks

Insulating caps

A

B

C

D

E

F

G

H

I

K

L

M

N

2,6

Ø 6,2

Ø 9,2

Ø 4

Ø 3,1

4,2

1,8

art. no.

IB 5

2,2

Ø 3

1,2

Ø 4,2

Ø 2,6

art. no.

IB 4 / IBT 4

1,9

Ø 4,4

Ø 3,2

1,05

Ø 6,3

art. no.

IB 3 / IBT 3

2,5

Ø 6,3

Ø 4

1,4

Ø 9,3

art. no.

IB 2 / IBT 2

4,7

Ø 3,9

Ø 3,1

1,5

Ø 7,1

art. no.

IB 1 / IBT 1

2,3

1,2

Ø 6,4

Ø 3,8

Ø 3,1

art. no.

IB 10 / IBT 10

4

1

Ø 6

Ø 3,55

Ø 3,05

art. no.

IB 9 / IBT 9

3,5

1

Ø 6

Ø 3,5

Ø 3,1

art. no.

IB 8 / IBT 8

7,5

1,6

Ø 8

Ø 4,3

Ø 3,3

art. no.

IB 7 / IBT 7

2,2

1

Ø 6

Ø 3,5

Ø 3,1

art. no.

IB 6 / IBT 6

Ø 4

Ø 3

1,5

Ø 7

6

art. no.

IB 15 / IBT 15

Ø 3,9

Ø 3,1

1

Ø 7,5

4,5

art. no.

IB 14 / IBT 14

6,2

1,7

Ø 6,5

Ø 4,15

Ø 3,85

7,7

Ø 3,1

art. no.

IB 13

4,4

2,1

Ø 8

Ø 3

Ø 2,6

art. no.

IB 12 / IBT 12

Ø 3,8

Ø 3,1

1

Ø 7,1

3,5

art. no.

IB 11 / IBT 11

1,4

Ø 6

Ø 3,5

Ø 3,1

1

art. no.

IB 18 / IBT 18

5,8

10

4

Ø 3,5

Ø 3,1

1,4

art. no.

IB 17

3,5

Ø 3,5

Ø 3,1

1

Ø 7

art. no.

IB 16

IB 8 - IB 17IBT 1 - IBT 15 / 18IB 1 - IB 7 / 18

thermoplastic resinPTFE (teflon)polyamide 4.6, GF reinforcedmaterial

-40°C ... +200°C-260°C ... +250°C-40°C ... +250°C

(1.8 MPa)

form stability

38 kV/mm40 kV/mm30 kV/mmdielectric strength

UL 94 V-0class of flammibility

E 52

E 17 – 18Aluminium oxide wafersE 19Mica wafers

E 21 – 22Thermal conductive pasteE 2 – 5Thermal conductive material

E 23 – 24Thermal conductive glueA 125Mounting for TO 3 angle

A 2 – 8Technical introductionE 32 – 128Insulating distance sleeves

Insulating bush

A

B

C

D

E

F

G

H

I

K

L

M

N

Gold-plating

properties: high resistance to wear, good

corrosion resistance, temperature

stability and solderability

process: drum technology

materials: non-ferrous metals

coating system: copper/nickel/gold

Tin-plating

properties: solderable layers with improved

tarnishing and corrosion resistance

process: drum technology

materials: non-ferrous metals

coating system: copper/nickel/tin

Anodising

performance: fabrication of corrosion resistant,

decorative oxide ﬁlms

process: anodic oxidation in fully

automated equipment

materials: aluminium and aluminium alloys

max. component size: 1500 x 2000 x 450 mm

colour: natural aluminium or black

Degreasing

performance: degreasing of oily or greasy

metallic surfaces

process: steam degreasing using chlorina-

ted hydro-carbons in hermetically

sealed equipment

material: aluminium and aluminium alloys

min. component size: 30 x 30 x 30 mm

max. component size: 600 x 400 x 380 mm

max. component weight: 80 kg

High quality surface treatment

for electronic components

Transparent passivating

(surface free from chromium VI)

characteristics: environmental compatibility due to chrome

free passivation of the aluminium surfaces

process: fabrication of conversion coatings by

immersion process

materials: aluminium und aluminium alloys

max. component size: 1500 x 2000 x 450 mm

colour: natural aluminium or black

Vibratory grinding

characteristics: deburring, removing of sharp edges,

rough and ﬁne grinding

process: treatment using vibration technique and

grinding tools (trowalization)

materials: metallic, aluminium favourized

max. component size: 230 x 200 mm

Anodisation facility

– economization of water by using spray-rinsing,

automized ion exchange installation, cascade water

guided system and recirculation of splash water

– reduction of electrical energy by means of current

density regulation

– reduction of chemicals by recirculation of the

dragged-off chemicals using a compensation of the

evaporation losses

– recycling of the sulphuric acid out of the anodizing bathes

High quality surface treatment

for electronic components

General Business conditions

1. General provisions

Our deliveries are exclusively subject to

the conditions set forth herein which shall

be deemed to be explicitly accepted by the

purchaser. No conditions which may appear

on the purchaser‘s order shall be binding on

us, even without our express contra diction.

2. Quotations and orders

Our quotations are not binding on us. This

applies also to information contained in

price lists, leaﬂets etc.. Delivery dates stated

in our quotations or given to the purchaser

by any other means are approximate, and

we endeavour to keep to them. Delays in

delivery shall give no right to claims, unless we

have explicitly conﬁrmed such delivery dates

and an adequate period of grace granted to

us has expired. Orders shall only be binding

on us when they are explicitly conﬁrmed in

writing, regardless of the form in which they

have been placed with us. Furthermore the

characteristics of our samples cannot be

regarded as guaranteed characteristics.

3. Prices

Prices shall be valid only when conﬁrmed by

us in writing. They are exclusive of VAT at the

current rate and incidentals such as postage

and packing, freight, insurance etc.. If delive-

ry is made more than 4 months after the date

of order, we shall be entitled to invoice the pri-

ce valid at the date of despatch, even though

different prices were initially conﬁrmed. The

price valid at the date of despatch shall also

apply if the order was conﬁrmed without

prices. When an order on call is placed,

partial deliveries shall be invoiced at the price

valid at the date of despatch. Any request by

the purchaser for subsequent modiﬁcations

shall give us the right to amend prices.

4. Conditions of payment

Payment of the invoice amount shall

be come due following receipt of the invoice.

Payments made within 14 days of the date of

invoice give the right to a 2% cash discount.

Payments 30 days after the date of invoice

shall be made without any deduction. If the

purchaser is in default with any payment, we

are entitled to claim interest for such default at

the normal rate for current accounts. If greater

damage can be demonstrated to have been

caused by the delay, we are entitled to request

compensation for such damage.

5. Set-off, right to retention

Only uncontested or legally binding counter-

claims may be offset against our invoices.

Any right to a retention to be exercised by

the purchaser in connection with our claims is

explicitly excluded.

6. Delivery

Delivery of our goods is explicitly made on

behalf of and at the risk of the purchaser.

The risk shall pass on to the purchaser when

the ordered goods leave our premises. The

same applies if goods are collected in our

premises after notiﬁcation of their readi-ness.

We decide at our discretion on the most

economical delivery method without as-

suming any liability for the chosen means of

delivery.

7. Specially manufactured goods

Components made according to a sample

or a drawing or by special request must be

taken over and paid for, unless they have

a defect we are answerable for and which

makes the components completely unﬁt for

the purchaser‘s purposes. If their ﬁtness for

the purchaser‘s pur poses is only reduced,

the purchaser may request a reduction of

payment but the contract shall not be

cancelled.

8. Quantities

We are entitled to supply quantities which

are above or below the ordered quantities by

up to 10%. Such deviations are usual in this

trade and the deliveries are deemed as being

in compliance with the contract. If delivery

quantities fall below the ordered quantities

there shall be no right to subsequent delivery

of the missing quantity.

9. Reservation of proprietary rights

9.1. All goods supplied shall remain our

property until all of our claims resulting

from the contract have been paid in full.

The purchaser is entitled to dispose of the

purchased goods in the ordinary course

of business transactions. Reservation of

proprietary rights also applies to products

resulting from processing, mixing up or

combining our goods with goods of third

parties, in which case we are considered as

manufacturers. In the case where our goods

are processed, mixed up or combined with

goods of third parties, and the proprietary

rights of such third parties remain in force,

we are entitled to co-ownership according

to the proportion of the amount invoiced for

such processed goods. Such right to

coownership shall be safeguarded by the

purchaser.

9.2. The purchaser shall transfer to us, as a

security, his claims against third parties

resulting from the re-sale of our goods in

full or in the proportion of our co-ownership

(see subparagraph 9.1). He is entitled to

collect the amount of such claims on our

behalf until revoked or until cessation of

his payments made to us. The purchaser is

not entitled to assign these claims to third

parties.

9.3. The purchaser is not entitled to mortgage

or transfer the goods which are subject to

reservation by way of security.

9.4. The purchaser shall advise us immediately

at any seizure of our goods or of any

infringement of our rights by third parties.

9.5. In case of a default in payment or a

deterioration in the ﬁnancial situation, we

are entitled to request immediate handing

over of the goods which are subject to

reservation. Any time limited claims shall

immediately become due.

9.6. If the value of the securities exceeds our

claims by more than 20%, securities to a

corresponding amount will be released by

us on request at our discretion.

10. Warranty

10.1. We expressly point out that all information

and data is given to the best of our

knowledge and belief. The user is solely

responsible for the proper use of our

products and he should check their

suitability for the intended application.

Fischer Elektronik do not assume any

warranty, whether expressed or implied, for

the suitability, function or merchantibility of

their products in speciﬁc or general appli-

cations, and they cannot be held liable for

accidental or consequential damage due to

non-observance of the above.

10.2. Claims for defects can only be

considered if the purchaser has complied

with his obligation to check and put for-

ward a complaint as per § 377 HGB.

10.3. If goods have a defect attributable to us,

we are obliged to provide subsequent

fulﬁlment, excluding the purchaser‘s right

to withdraw from the contract or to reduce

the purchase price (abatement), unless we

are entitled to refuse subsequent fulﬁlment

by virtue of legal provisions. The purchaser

shall grant us an adequate period of

grace for subsequent fulﬁlment. Subsequent

fulﬁlment may at our discretion be an

elimination of the defect (rectiﬁcation) or the

supply of new products.

10.4. If rectiﬁcation of the defect has failed, the

purchaser shall be entitled to request a

reduction in the purchase price (abatement)

or to withdraw from the contract. Rectiﬁca-

tion shall be deemed to have failed after the

second vain attempt, unless further attempts

are reasonable in view of the object of the

contract and can be reasonably imposed on

the purchaser.

10.5. The purchaser‘s right to put forward further

claims for damages shall remain unaffected

by this.

10.6. The purchaser‘s warranty claims shall

come under the limitation of time which is

12 months from the delivery of the goods to

the purchaser, unless we have fraudulently

concealed the defect. In this case, the legal

provisions shall apply.

10.7 The purchaser‘s claims for damages shall

come under the limitation of time which is

12 months from the delivery of the goods.

This does not apply if the threat to life,

bodily injury or injury to health is

imputable to us, our legal representatives

or other vicarious agents, or if we or our

legal representatives have been grossly

negligent, or if our vicarious agents have

acted deliberately.

11. Withdrawal

When delivery in accordance with the

contract is not possible for reasons beyond

our control, we are entitled to withdraw from

the contract. Such withdrawal shall not en title

the purchaser to assert any right against us.

12. Place of performance, place of venue,

applicable law

12.1. The place of performance and the place of

venue for deliveries and payments and for

any litigation arising between us and the

purchaser shall be the headquarters of our

company.

12.2. The relations between the parties to the

contract shall be exclusively governed by

the law of the Federal Republic of Germany.

The application of the UN Conventions on

contracts for the international sale of goods

is excluded.

If any provision herein is or will become invalid,

such provision shall not affect the validity of the

remaining provisions. The invalid provision shall

be replaced by a valid provision which shall meet

as closely as possible the legal and commercial

purpose of the original one.

As at: 1. 1. 2014

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How to ﬁnd us

Fischer Elektronik GmbH und Co. KG

Nottebohmstraße 28

D – 58511 Lüdenscheid

Telefon: +49 (0) 23 51 / 4 35 - 0

Telefax: +49 (0) 23 51 / 4 57 54

info@ﬁscherelektronik.de

www.ﬁscherelektronik.de

www.facebook.de/ﬁscherelektronik

Fischer Elektronik GmbH & Co. KG

Postfach 1590 • D-58465 Lüdenscheid

Hausadresse/House Address/Adresse de domicile

Nottebohmstr. 28 • D-58511 Lüdenscheid

Telefon: 0 23 51 / 4 35-0

Telefax:

Verkauf / sales / ventes

0 23 51 / 4 57 54

Einkauf / purchasing / achats

0 23 51 / 45 94 33

Export / exports / exports

0 23 51 / 43 51 85

info@fischerelektronik.de

www.fischerelektronik.de

Fischer Elektronik

Österreich Ges. m.b.H.

Firmiangasse 49-51 • A -1130 Wien

Telefon: 01 / 8 76 62 27

Telefax: 01 / 8 76 62 27-11

online@fischerelektronik.co.at

www.fischerelektronik.at

f.cool.e 08-2014

Fischer Elektronik GmbH & Co. KG

P.O. Box 1590

D-58465 Lüdenscheid

House Address

Nottebohmstr. 28

D-58511 Lüdenscheid

Fon: +49 (0) 23 51 4 35-0

Fax: sales +49 (0) 23 51 4 57 54

purchasing +49 (0) 23 51 45 94 33

exports +49 (0) 23 51 43 51 85

info@fischerelektronik.de

www.fischerelektronik.de

The information given in this catalogue were established and examined

carefully. Nevertheless, mistakes or printing errors, and especially

technical modifications and updating and improvement of our products,

cannot be excluded. All trade marks are recognised even if they are not

specifically identified or mentioned. No identification does not imply that

a product or trademark is not registered. No part of this catalogue may

be reproduced or distributed without prior written consent of Fischer

Elektronik. All data contained in this catalogue, in texts, illustrations,

documents and descriptions are subject to copyright and the provisions

of DIN ISO 16016. All rights reserved.

© Copyright Fischer Elektronik 1969 ... 2014

AL

BZ

LP

ME

MI

SA

TP

raw degreased aluminium

raw pickled aluminium

outside black lacquered RAL 9005/transparent passivated

clear anodised

solderable surface

black anodised

chrome-free transparent passivated

art. no.HEATSINKS & CASES SURFACES

G

S

Z

gold-plated

selective gold-plated

tin-plated

art. no.CONNECTOR CONTACT SURFACE FINISH

GO

K

LG

NB

S

TB

UL

6026

7032

7035

5022

9005

5018

5002

ARTICLES

RAL COLOURS

opal green system cases RackCase/shell cases

gravel grey bench cases

light grey shell cases

night blue system cases RackCase/shell cases

deep black bench cases/shell cases/system cases RackCase

turquoise blue system cases RackCase/shell cases

ultramarine blue Plusline/shell cases

art. no.

Fischer Elektronik GmbH & Co. KG

Postfach 1590 • D-58465 Lüdenscheid

Hausadresse/House Address/Adresse de domicile

Nottebohmstr. 28 • D-58511 Lüdenscheid

Telefon: 0 23 51 / 4 35-0

Telefax:

Verkauf / sales / ventes

0 23 51 / 4 57 54

Einkauf / purchasing / achats

0 23 51 / 45 94 33

Export / exports / exports

0 23 51 / 43 51 85

info@fischerelektronik.de

www.fischerelektronik.de

Fischer Elektronik

Österreich Ges. m.b.H.

Firmiangasse 49-51 • A -1130 Wien

Telefon: 01 / 8 76 62 27

Telefax: 01 / 8 76 62 27-11

online@fischerelektronik.co.at

www.fischerelektronik.at

f.cool.e 08-2014

Fischer Elektronik GmbH & Co. KG

P.O. Box 1590

D-58465 Lüdenscheid

House Address

Nottebohmstr. 28

D-58511 Lüdenscheid

Fon: +49 (0) 23 51 4 35-0

Fax: sales +49 (0) 23 51 4 57 54

purchasing +49 (0) 23 51 45 94 33

exports +49 (0) 23 51 43 51 85

info@fischerelektronik.de

www.fischerelektronik.de

The information given in this catalogue were established and examined

carefully. Nevertheless, mistakes or printing errors, and especially

technical modifications and updating and improvement of our products,

cannot be excluded. All trade marks are recognised even if they are not

specifically identified or mentioned. No identification does not imply that

a product or trademark is not registered. No part of this catalogue may

be reproduced or distributed without prior written consent of Fischer

Elektronik. All data contained in this catalogue, in texts, illustrations,

documents and descriptions are subject to copyright and the provisions

of DIN ISO 16016. All rights reserved.

© Copyright Fischer Elektronik 1969 ... 2014

AL

BZ

LP

ME

MI

SA

TP

raw degreased aluminium

raw pickled aluminium

outside black lacquered RAL 9005/transparent passivated

clear anodised

solderable surface

black anodised

chrome-free transparent passivated

art. no.HEATSINKS & CASES SURFACES

G

S

Z

gold-plated

selective gold-plated

tin-plated

art. no.CONNECTOR CONTACT SURFACE FINISH

GO

K

LG

NB

S

TB

UL

6026

7032

7035

5022

9005

5018

5002

ARTICLES

RAL COLOURS

opal green system cases RackCase/shell cases

gravel grey bench cases

light grey shell cases

night blue system cases RackCase/shell cases

deep black bench cases/shell cases/system cases RackCase

turquoise blue system cases RackCase/shell cases

ultramarine blue Plusline/shell cases

art. no.