SN74HC4066 QUADRUPLE BILATERAL ANALOG SWITCH SCLS325G - MARCH 1996 - REVISED JULY 2003 D D D D D D D D D D, DB, N, NS, OR PW PACKAGE (TOP VIEW) Wide Operating Voltage Range of 2 V to 6 V Typical Switch Enable Time of 18 ns Low Power Consumption, 20-A Max ICC Low Input Current of 1 A Max High Degree of Linearity High On-Off Output-Voltage Ratio Low Crosstalk Between Switches Low On-State Impedance . . . 50- TYP at VCC = 6 V Individual Switch Controls 1A 1B 2B 2A 2C 3C GND 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 1C 4C 4A 4B 3B 3A description/ordering information The SN74HC4066 is a silicon-gate CMOS quadruple analog switch designed to handle both analog and digital signals. Each switch permits signals with amplitudes of up to 6 V (peak) to be transmitted in either direction. Each switch section has its own enable input control (C). A high-level voltage applied to C turns on the associated switch section. Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems. ORDERING INFORMATION PDIP - N TOP-SIDE MARKING Tube of 25 SN74HC4066N Tube of 50 SN74HC4066D Reel of 2500 SN74HC4066DR Reel of 250 SN74HC4066DT SOP - NS Reel of 2000 SN74HC4066NSR HC4066 SSOP - DB Reel of 2000 SN74HC4066DBR HC4066 Tube of 90 SN74HC4066PW Reel of 2000 SN74HC4066PWR Reel of 250 SN74HC4066PWT SOIC - D -40C to 85C ORDERABLE PART NUMBER PACKAGE TA TSSOP - PW SN74HC4066N HC4066 HC4066 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each switch) INPUT CONTROL (C) SWITCH L OFF H ON Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SN74HC4066 QUADRUPLE BILATERAL ANALOG SWITCH SCLS325G - MARCH 1996 - REVISED JULY 2003 logic diagram, each switch (positive logic) A VCC VCC B C One of Four Switches absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Control-input diode current, II (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA I/O port diode current, II (VI < 0 or VI/O > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA On-state switch current (VI/O = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Package thermal impedance, JA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to ground unless otherwise specified. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN74HC4066 QUADRUPLE BILATERAL ANALOG SWITCH SCLS325G - MARCH 1996 - REVISED JULY 2003 recommended operating conditions (see Note 3) VCC VI/O VIH MIN 2 Supply voltage I/O port voltage t/v MAX 5 6 V VCC VCC V VCC VCC V 4.2 0 0.3 0 0.9 0 1.2 0 VCC = 2 V VCC = 4.5 V High-level input voltage, control inputs 1.5 3.15 VCC = 6 V VCC = 2 V VIL NOM Low-level input voltage, control inputs VCC = 4.5 V VCC = 6 V VCC = 2 V Input transition rise/fall time UNIT V 1000 500 VCC = 4.5 V VCC = 6 V ns 400 TA Operating free-air temperature -40 85 C With supply voltages at or near 2 V, the analog switch on-state resistance becomes very nonlinear. It is recommended that only digital signals be transmitted at these low supply voltages. NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) TEST CONDITIONS VCC TA = 25_C MIN TYP MAX 2V 150 IT = -1 1 mA, A VI = 0 to t VCC, VC = VIH (see Figure 1) 4.5 V 50 PARAMETER ron On-state switch resistance GND VC = VIH, VI = VCC or GND, IT = -1 mA MAX UNIT 85 106 170 215 100 1000 nA 6V 0.1 5 A 0.1 5 A 2 20 A 10 10 6V 30 2V 320 4.5 V 70 ron(p) ( ) Peak on-state resistance II Control input current Isoff Off-state switch leakage current Ison On-state switch leakage current VI = VCC or 0, VC = VIH (see Figure 3) 6V ICC Supply current VI = 0 or VCC, 6V VC = 0 or VCC VI = VCC or 0, VO = VCC or 0, VC = VIL (see Figure 2) IO = 0 A or B Ci Input capacitance Cf Feed-through capacitance A to B Co Output capacitance A or B 6V 50 6V 0.1 5V C VI = 0 5V POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MIN 9 3 pF 0.5 pF 9 pF 3 SN74HC4066 QUADRUPLE BILATERAL ANALOG SWITCH SCLS325G - MARCH 1996 - REVISED JULY 2003 switching characteristics over recommended operating free-air temperature range PARAMETER tPLH, tPHL Propagation P ti delay time tPZH, tPZL Switch S it h turn-on time tPLZ, tPHZ fI Switch S it h turn-off time Control input frequency Control feed-through noise FROM (INPUT) TO (OUTPUT) A or B B or A C C C C A or B TEST CONDITIONS CL = 50 pF F (see Figure 4) RL = 1 k, CL = 50 pF (see Figure 5) A or B RL = 1 k, CL = 50 pF (see Figure 5) A or B CL = 15 pF, RL = 1 k k, VC = VCC or GND, VO = VCC/2 (see Figure 6) A or B CL = 50 pF, Rin = RL = 600 , VC = VCC or GND GND, fin = 1 MHz (see Figure 7) VCC TA = 25_C TYP MAX MIN MIN MAX 2V 10 60 75 4.5 V 4 12 15 6V 3 10 13 2V 70 180 225 4.5 V 21 36 45 6V 18 31 38 2V 50 200 250 4.5 V 25 40 50 6V 22 34 43 2V 15 4.5 V 30 6V 30 4.5 V 15 UNIT ns ns ns MHz mV (rms) 6V 20 operating characteristics, VCC = 4.5 V, TA = 25C PARAMETER Cpd TEST CONDITIONS UNIT Power dissipation capacitance per gate CL = 50 pF, f = 1 MHz 45 pF Minimum through bandwidth, A to B or B to A [20 log (VO/VI)] = -3 dB CL = 50 pF, VC = VCC RL = 600 , (see Figure 8) 30 MHz Crosstalk between any switches CL = 10 pF, fin = 1 MHz RL = 50 , (see Figure 9) 45 dB Feed through, switch off, A to B or B to A CL = 50 pF, fin = 1 MHz RL = 600 , (see Figure 10) 42 dB Amplitude distortion rate, A to B or B to A CL = 50 pF, fin = 1 kHz RL = 10 k, (see Figure 11) 0.05% Adjust the input amplitude for output = 0 dBm at f = 1 MHz. Input signal must be a sine wave. Adjust the input amplitude for input = 0 dBm at f = 1 MHz. Input signal must be a sine wave. 4 TYP POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN74HC4066 QUADRUPLE BILATERAL ANALOG SWITCH SCLS325G - MARCH 1996 - REVISED JULY 2003 PARAMETER MEASUREMENT INFORMATION VCC VC = VIH VCC VI = VCC VO (ON) GND + r on 1.0 mA V + 10 I-O -3 W - V VI-O Figure 1. On-State Resistance Test Circuit VCC VC = VIL VCC A A (OFF) B GND VS = VA - VB CONDITION 1: VA = 0, VB = VCC CONDITION 2: VA = VCC, VB = 0 Figure 2. Off-State Switch Leakage-Current Test Circuit POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 SN74HC4066 QUADRUPLE BILATERAL ANALOG SWITCH SCLS325G - MARCH 1996 - REVISED JULY 2003 PARAMETER MEASUREMENT INFORMATION VCC VC = VIH VCC A A B (ON) VCC Open GND VA = VCC TO GND Figure 3. On-State Leakage-Current Test Circuit VCC VC = VIH VCC VI VO (ON) 50 50 pF GND TEST CIRCUIT tr tf VI A or B 90% 50% 10% VCC 90% 50% 10% 0V tPLH VO B or A tPHL VOH 50% 50% VOL VOLTAGE WAVEFORMS Figure 4. Propagation Delay Time, Signal Input to Signal Output 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN74HC4066 QUADRUPLE BILATERAL ANALOG SWITCH SCLS325G - MARCH 1996 - REVISED JULY 2003 PARAMETER MEASUREMENT INFORMATION VCC 50 VC RL VO 1 k VCC VI S2 S1 TEST S1 S2 tPZL tPZH tPLZ tPHZ GND VCC GND VCC VCC GND VCC GND CL 50 pF GND TEST CIRCUIT VCC VCC VC 50% 50% 0V 0V tPZH tPZL VOH VOH VO 50% 50% VOL VOL (tPZL, tPZH) VCC VCC VC 50% 50% 0V 0V tPHZ tPLZ VOH VOH VO VOL 10% 90% VOL (tPLZ, tPHZ) VOLTAGE WAVEFORMS Figure 5. Switching Time (tPZL, tPLZ, tPZH, tPHZ), Control to Signal Output POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 7 SN74HC4066 QUADRUPLE BILATERAL ANALOG SWITCH SCLS325G - MARCH 1996 - REVISED JULY 2003 PARAMETER MEASUREMENT INFORMATION VCC VCC 50 VC VC 0V VCC VO VI = VCC GND CL 15 pF RL 1 k VCC/2 Figure 6. Control-Input Frequency VCC 50 tr VC VCC VCC VI GND Rin 600 RL 600 90% 90% VC VO 10% 0V CL 50 pF tf 10% (f = 1 MHz) tr = tf = 6 ns VCC/2 VCC/2 Figure 7. Control Feed-Through Noise VCC VC = VCC 0.1 F fin 50 VI VCC (ON) GND VI VO RL 600 CL 50 pF VCC/2 Figure 8. Minimum Through Bandwidth 8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 (VI = 0 dBm at f = 1 MHz) SN74HC4066 QUADRUPLE BILATERAL ANALOG SWITCH SCLS325G - MARCH 1996 - REVISED JULY 2003 PARAMETER MEASUREMENT INFORMATION VCC VC = VCC VCC (ON) VI fin 50 0.1 F Rin 600 VO1 GND RL 600 CL 50 pF VCC/2 VI VCC VC = GND (VI = 0 dBm at f = 1 MHz) VCC (OFF) VO2 GND Rin 600 RL 600 CL 50 pF VCC/2 Figure 9. Crosstalk Between Any Two Switches VCC VC = GND 0.1 F 50 VCC (OFF) VI fin Rin 600 VI VO RL 600 GND VCC/2 CL 50 pF (VI = 0 dBm at f = 1 MHz) VCC/2 Figure 10. Feed Through, Switch Off VCC VC = VCC fin VI 10 F VCC (ON) GND VO RL 10 k VI CL 50 pF (VI = 0 dBm at f = 1 kHz) VCC/2 Figure 11. Amplitude-Distortion Rate POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 9 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74HC4066D ACTIVE SOIC D 14 SN74HC4066DBLE OBSOLETE SSOP DB 14 SN74HC4066DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4066DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4066DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4066DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4066DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4066DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4066DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4066DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4066DT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4066DTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4066DTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4066N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC4066NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC4066NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4066NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4066PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4066PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4066PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4066PWLE OBSOLETE TSSOP PW 14 TBD Call TI SN74HC4066PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4066PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4066PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4066PWT ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4066PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM 50 Green (RoHS & no Sb/Br) TBD Addendum-Page 1 Lead/Ball Finish CU NIPDAU Call TI MSL Peak Temp (3) Level-1-260C-UNLIM Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 Orderable Device Status (1) Package Type Package Drawing SN74HC4066PWTG4 ACTIVE TSSOP PW Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74HC4066DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SN74HC4066DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC4066DT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC4066NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74HC4066PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HC4066PWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HC4066DBR SSOP DB 14 2000 367.0 367.0 38.0 SN74HC4066DR SOIC D 14 2500 367.0 367.0 38.0 SN74HC4066DT SOIC D 14 250 367.0 367.0 38.0 SN74HC4066NSR SO NS 14 2000 367.0 367.0 38.0 SN74HC4066PWR TSSOP PW 14 2000 367.0 367.0 35.0 SN74HC4066PWT TSSOP PW 14 250 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated