MBRB20200CT-D - ON Semiconductor - Datasheet.Directory

 Semiconductor Components Industries, LLC, 2003

May, 2003 - Rev. 3 1Publication Order Number:

MBRB20200CT/D

MBRB20200CT

Preferred Device

SWITCHMODE

Power Rectifier

Dual Schottky Rectifier

. . . using Schottky Barrier technology with a platinum barrier

metal. This state-of-the-art device is designed for use in high

frequency switching power supplies and converters with up to 48 volt

outputs. They block up to 200 volts and offer improved Schottky

performance at frequencies from 250 kHz to 5.0 MHz.

•200 Volt Blocking Voltage

•Low Forward Voltage Drop

•Guardring for Stress Protection and High dv/dt Capability (10,000

V/µs)

•Dual Diode Construction — Terminals 1 and 3 Must be Connected

for Parallel Operation at Full Rating

Mechanical Characteristics

•Case: Epoxy, Molded, Epoxy Meets UL94, VO

•Weight: 1.7 grams (approximately)

•Finish: All External Surfaces Corrosion Resistant and Terminal

Leads are Readily Solderable

•Lead and Mounting Surface Temperature for Soldering

Purposes: 260°C Max. for 10 Seconds

•Shipped 50 units per plastic tube

•Available in 24 mm Tape and Reel, 800 units per 13″ reel by adding a

“T4” suffix to the part number

•Marking: B20200

•Device Meets MSL1 Requirements

•ESD Ratings: Machine Model, C (>400 V)

Human Body Model, 3B (>8000 V)

MAXIMUM RATINGS (Per Leg)

Rating Symbol Value Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRM

VRWM

200 V

Average Rectified Forward Current

(At Rated VR, TC = 134°C)

Per Device

Per Leg

IF(AV)

Peak Repetitive Forward Current

(At Rated VR, Square Wave,

20 kHz, TC = +137°C) Per Leg

IFRM 20 A

Non-Repetitive Peak Surge Current

(Surge Applied at Rated Load Conditions

Halfwave, Single Phase, 60 Hz)

IFSM 150 A

Peak Repetitive Reverse Surge Current

(2.0 s, 1.0 kHz) IRRM 1.0 A

Storage Temperature Range Tstg -65 to +175 °C

Operating Junction Temperature TJ-65 to +150 °C

Voltage Rate of Change (Rated VR) dv/dt 10,000 V/s

Device Package Shipping

ORDERING INFORMATION

MBRB20200CT D2PAK

D2PAK

CASE 418B

STYLE 3

50/Rail

SCHOTTKY BARRIER

RECTIFIER

20 AMPERES

200 VOLTS

Preferred devices are recommended choices for future use

and best overall value.

MBRB20200CTT4 D2PAK 800/Tape & Reel

MARKING DIAGRAM

B20200

B20200 = Device Code

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MBRB20200CT

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THERMAL CHARACTERISTICS (Per Leg)

Characteristic Symbol Value Unit

Thermal Resistance — Junction to Case RθJC 2.0 °C/W

ELECTRICAL CHARACTERISTICS (Per Leg)

Maximum Instantaneous Forward Voltage (Note 1.)

(IF = 10 Amps, TC = 25°C)

(IF = 10 Amps, TC = 125°C)

(IF = 20 Amps, TC = 25°C)

(IF = 20 Amps, TC = 125°C)

VF0.9

0.8

1.0

0.9

Volts

Maximum Instantaneous Reverse Current (Note 1.)

(Rated dc Voltage, TC = 25°C)

(Rated dc Voltage, TC = 125°C)

IR1.0

DYNAMIC CHARACTERISTICS (Per Leg)

Capacitance (VR = -5.0 V, TC = 25°C, Frequency = 1.0 MHz) CT500 pF

1. Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤2.0%.

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Figure 1. Typical Forward Voltage (Per Leg)

100

10.2 0.4 0.6 0.8 1

TJ = 125°C

TJ = 100°C

TJ = 25°C

vF, INSTANTANEOUS VOLTAGE (VOLTS)

TJ = 150°C

I , INSTANEOUS FORWARD CURRENT (AMP)

I , REVERSE CURRENT ( A)

Rµ

VR, REVERSE CURRENT (VOLTS)

10,000

1,000

100

0.1

0.01 20 40 60 80 100 120 140 160 180 200

TJ = 125°C

TJ = 100°C

TJ = 150°C

TJ = 25°C

Figure 2. Typical Reverse Current (Per Leg)

0 5 10 15 20 25 30 35

TJ = 125°C

SQUARE

WAVE

IPK

IAV

= 20

IF(AV), AVERAGE FORWARD CURRENT (AMPS)

Figure 3. Forward Power Dissipation

P , AVERAGE POWER DISSIPATION (WATTS)

F(AV)

090 100 110 120 130 140 150 160

I , AVERAGE FORWARD CURRENT (AMPS)

F(AV)

TC, CASE TEMPERATURE (°C)

Figure 4. Current Derating, Case

SQUARE

WAVE

RATED VOLTAGE

RθJC = 2°C/W

I , AVERAGE FORWARD CURRENT (AMPS)

F(AV)

RθJA = 16°C/W

RATED VOLTAGE

TA, AMBIENT TEMPERATURE (°C)

Figure 5. Current Derating, Ambient

SQUARE

WAVE

0 25 50 75 100 125 150 175

500

400

300

200

100

C, CAPACITANCE (pF)

TJ = 25°C

VR, REVERSE VOLTAGE (VOLTS)

1 2 5 10 20 50 70 100

Figure 6. Typical Capacitance (Per Leg)

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INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINTS FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the

total design. The footprint for the semiconductor packages

must be the correct size to insure proper solder connection

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to a solder reflow process.

inches

0.33

8.38

0.04

1.016

0.67

17.02

0.42

10.66

0.12

3.05

0.24

6.096

D2PAK POWER DISSIPATION

The power dissipation of the D2PAK is a function of the

drain pad size. This can vary from the minimum pad size

for soldering to a pad size given for maximum power

dissipation. Power dissipation for a surface mount device is

determined by TJ(max), the maximum rated junction

temperature of the die, RθJA, the thermal resistance from

the device junction to ambient; and the operating

temperature, TA. Using the values provided on the data

sheet for the D2PAK package, PD can be calculated as

follows:

PD = TJ(max) - TA

RθJA

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values

into the equation for an ambient temperature TA of 25°C,

one can calculate the power dissipation of the device which

in this case is 2.5 watts.

PD = 150°C - 25°C= 2.5 watts

50°C/W

The 50°C/W for the D2PAK package assumes the

recommended drain pad area of 158K mil2 on FR-4 glass

epoxy printed circuit board to achieve a power dissipation

of 2.5 watts using the footprint shown. Another alternative

is to use a ceramic substrate or an aluminum core board

such as Thermal Clad. By using an aluminum core board

material such as Thermal Clad, the power dissipation can

be doubled using the same footprint.

GENERAL SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within

a short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are

subjected.

•Always preheat the device.

•The delta temperature between the preheat and

soldering should be 100°C or less.*

•When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering

method, the difference shall be a maximum of 10°C.

•The soldering temperature and time shall not exceed

260°C for more than 5 seconds.

•When shifting from preheating to soldering, the

maximum temperature gradient shall be 5°C or less.

•After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and

result in latent failure due to mechanical stress.

•Mechanical stress or shock should not be applied

during cooling

* * Soldering a device without preheating can cause

excessive thermal shock and stress which can result in

damage to the device.

* * Due to shadowing and the inability to set the wave

height to incorporate other surface mount components, the

D2PAK is not recommended for wave soldering.

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RECOMMENDED PROFILE FOR REFLOW SOLDERING

For any given circuit board, there will be a group of

control settings that will give the desired heat pattern. The

operator must set temperatures for several heating zones,

and a figure for belt speed. Taken together, these control

settings make up a heating “profile” for that particular

circuit board. On machines controlled by a computer, the

computer remembers these profiles from one operating

session to the next. Figure 7 shows a typical heating profile

for use when soldering the D2PAK to a printed circuit

board. This profile will vary among soldering systems but it

is a good starting point. Factors that can affect the profile

include the type of soldering system in use, density and

types of components on the board, type of solder used, and

the type of board or substrate material being used. This

profile shows temperature versus time. The line on the

graph shows the actual temperature that might be

experienced on the surface of a test board at or near a

central solder joint. The two profiles are based on a high

density and a low density board. The Vitronics SMD310

convection/infrared reflow soldering system was used to

generate this profile. The type of solder used was 62/36/2

Tin Lead Silver with a melting point between 177-189°C.

When this type of furnace is used for solder reflow work,

the circuit boards and solder joints tend to heat first. The

components on the board are then heated by conduction.

The circuit board, because it has a large surface area,

absorbs the thermal energy more efficiently, then

distributes this energy to the components. Because of this

effect, the main body of a component may be up to 30

degrees cooler than the adjacent solder joints.

STEP 1

PREHEAT

ZONE 1

RAMP"

STEP 2

VENT

SOAK"

STEP 3

HEATING

ZONES 2 & 5

RAMP"

STEP 4

HEATING

ZONES 3 & 6

SOAK"

STEP 5

HEATING

ZONES 4 & 7

SPIKE"

STEP 6

VENT

STEP 7

COOLING

200°C

150°C

100°C

50°C

TIME (3 TO 7 MINUTES TOTAL) TMAX

SOLDER IS LIQUID FOR

40 TO 80 SECONDS

(DEPENDING ON

MASS OF ASSEMBLY)

205° TO

219°C

PEAK AT

SOLDER

JOINT

DESIRED CURVE FOR LOW

MASS ASSEMBLIES

DESIRED CURVE FOR HIGH

MASS ASSEMBLIES

100°C

150°C

160°C

170°C

140°C

Figure 7. Typical Solder Heating Profile

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PACKAGE DIMENSIONS

STYLE 3:

PIN 1. ANODE

2. CATHODE

3. ANODE

4. CATHODE

SEATING

PLANE

-T-

0.13 (0.005) T

231

3 PL

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.340 0.380 8.64 9.65

B0.380 0.405 9.65 10.29

C0.160 0.190 4.06 4.83

D0.020 0.035 0.51 0.89

E0.045 0.055 1.14 1.40

G0.100 BSC 2.54 BSC

H0.080 0.110 2.03 2.79

J0.018 0.025 0.46 0.64

K0.090 0.110 2.29 2.79

S0.575 0.625 14.60 15.88

V0.045 0.055 1.14 1.40

-B-

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. 418B-01 THRU 418B-03 OBSOLETE,

NEW STANDARD 418B-04.

F0.310 0.350 7.87 8.89

L0.052 0.072 1.32 1.83

M0.280 0.320 7.11 8.13

N0.197 REF 5.00 REF

P0.079 REF 2.00 REF

R0.039 REF 0.99 REF

VARIABLE

CONFIGURATION

ZONE RN P

VIEW W-W VIEW W-W VIEW W-W

123

PAK

CASE 418B-04

ISSUE H

MBRB20200CT

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Notes

MBRB20200CT

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PUBLICATION ORDERING INFORMATION

JAPAN: ON Semiconductor, Japan Customer Focus Center

2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051

Phone: 81-3-5773-3850

ON Semiconductor Website: http://onsemi.com

For additional information, please contact your local

Sales Representative.

MBRB20200CT/D

SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.

Thermal Clad is a trademark of the Bergquist Company.

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