© 2000 Fairchild Semiconductor Corporation DS009469 www.fairchildsemi.com
April 1988
Revised September 2000
74F74 Dual D-Type Positive Edge-Triggered Flip-Flop
74F74
Dual D-Type Positive Edge-Triggered Flip-Flop
General Description
The F74 is a du al D-typ e flip-f lop with Di rect Cl ear and Set
inputs and complementary (Q, Q) outputs. Information at
the inp ut is transfe rred to t he outputs on the positive ed ge
of the clock pulse. Clock triggering occurs at a voltage level
of the clock pulse and is not directly related to the transition
time of the positive-going pulse. After the Clock Pulse input
threshold voltage has been passed, the Data input is
locked out and information present will not be transferred to
the outputs until the next rising edge of the Clock Pulse
input.
Asynchronous Inputs:
LOW input to SD sets Q to HIGH level
LOW input to CD sets Q to LOW level
Clear and Set are indepe nde nt of clock
Simultaneous LOW on CD and SD
makes both Q and Q HIGH
Ordering Code:
Devices also available in Tape and Reel. Spe ci fy by append ing the suffix let t er “X” to the o rdering code.
Logic Symbols
IEEE/IEC
Connection Diagram
Order Number Package Number Package Description
74F74SC M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150 Narrow
74F74SJ M14D 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74F74PC N14A 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
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74F74
Unit Loading/Fan Out
Truth Table
H (h) = HIGH Voltage Level
L (l) = LOW Voltage Level
X = Immaterial
Q0 = Previo us Q (Q) before LOW-to-HIGH Clock Transition
Lower case letters indicate the state of the referenced input or output one setup time prior to the LOW-to-HIGH clock transition.
Logic Diagram
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagatio n delays.
Pin Names Description U.L. Input IIH/IIL
HIGH/LOW Output IOH/IOL
D1, D2Data Inp uts 1.0/1.0 20 µA/0.6 mA
CP1, CP2Clock Pulse Inputs (Active Rising Edge) 1.0/1.0 20 µA/0.6 mA
CD1, CD2 Direct Clear Inputs (Active LOW) 1.0/3.0 20 µA/1.8 mA
SD1, SD2 Direct Set Inputs (Active LOW) 1.0/3.0 20 µA/1.8 mA
Q1, Q1, Q2, Q2Outputs 50/33.3 1 mA/20 mA
Inputs Outputs
SDCDCP D Q Q
LHXXHL
HLXXLH
LLXXHH
HH
hH L
HH
lLH
HHLXQ
0Q0
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74F74
Absolute Maximum Ratings(Note 1) Recommended Operating
Conditions
Note 1: Absolute maximum ratings are values beyond which the device
may be damaged or have its useful life impaired. Functional operation
under these conditions is not implied.
Note 2: Eith er v oltage lim it or c urrent limit is sufficie nt to protect inputs.
DC Electrical Characteristics
Storage Temperature 65°C to +150°C
Ambient Temper atu re und er Bias 55°C to +125°C
Junction Temperature under Bias 55°C to +150°C
VCC Pin Potential to Ground Pin 0.5V to +7.0V
Input Voltage (Note 2) 0.5V to +7.0V
Input Current (Note 2) 30 mA to +5.0 mA
Voltage Applied to Output
in HIGH State (with VCC = 0V)
Standa rd Outp ut 0.5V to VCC
3-STATE Output 0.5V to +5.5V
Current Applied to Output
in LOW State (Ma x) twice the rat ed IOL (mA)
ESD Last P assing Volt age (Min) 4000V
Free Air Ambient Temperatur e 0°C to +70°C
Supply Voltage +4.5V to +5.5V
Symbol Parameter Min Typ Max Units VCC Conditions
VIH Input HIGH Voltage 2.0 V Recognized as a HIGH Signal
VIL Input LOW Voltage 0.8 V Recognized as a LOW Signal
VCD Input Clamp Diode Voltage 1.2 V Min IIN = 18 mA
VOH Output HIGH 10% VCC 2.5 VMin
IOH = 1 mA
Voltage 5 % VCC 2.7 IOH = 1 mA
VOL Output LOW 10% VCC 0.5 V Min IOL = 20 mA
Voltage
IIH Input HIGH 5.0 µAMaxV
IN = 2.7 V
Current
IBVI Input HIGH Current 7.0 µAMaxV
IN = 7.0 V
Breakdown Test
ICEX Output HIGH 50 µAMaxV
OUT = VCC
Leakage Current
VID Input Leakage 4.75 V 0.0 IID = 1.9 µA
Test All Other Pins Grounded
IOD Output Leakage 3.75 µA0.0
VIOD = 150 mV
Circuit Current All Other Pins Grounded
IIL Input LOW Current 0.6 mA Max VIN = 0.5V (D, CP)
1.8 VIN = 0.5V (CD, SD)
IOS Output Short-Circuit Current 60 150 mA Max VOUT = 0V
ICC Power Supply Current 10.5 16.0 mA Max
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74F74
AC Electrical Characteristi cs
AC Operating Requirements
Symbol Parameter
TA = +25°CT
A = 0°C to +70°C
Units
VCC = +5.0V VCC = +5.0V
CL = 50 pF CL = 50 pF
Min Typ Max Min Max
fMAX Maximum Clock Frequency 100 125 100 MHz
tPLH Propagation Delay 3.8 5.3 6.8 3.8 7.8 ns
tPHL CPn to Qn or Qn4.4 6.2 8.0 4.4 9.2
tPLH Propagation Delay 3.2 4.6 6.1 3.2 7.1 ns
tPHL CDn or SDn to Qn or Qn3.5 7.0 9.0 3.5 10.5
Symbol Parameter
TA = +25°CT
A = 0°C to +70°C
UnitsVCC = +5.0V VCC = +5.0V
Min Max Min Max
tS(H) Setup Time, HIGH or LOW 2.0 2.0
ns
tS(L) Dn to CPn3.0 3.0
tH(H) Hold Time, HIGH or LOW 1.0 1.0
tH(L) Dn to CPn1.0 1.0
tW(H) CPn Pulse Width 4.0 4.0 ns
tW(L) H IGH or LOW 5.0 5.0
tW(L) CDn or SDn Pulse Width 4.0 4.0 ns
LOW
tREC Recovery Time 2.0 2.0 ns
CDn or SDn to CP
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74F74
Physical Dimensions inches (millimeters) unless otherwise noted
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150 Narrow
Package Number M14A
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74F74
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Sma ll Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M14D
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74F74 Dual D-Type Positive Edge-Triggered Flip-Flop
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
Package Number N14A
Fairchild does not assume an y responsibility for u se of any circuitry d escribed, no circu it patent licenses are im plied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life suppor t de vices o r syst ems are dev ic es or syste ms
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instruct ions fo r use pr ovi de d in the l abe ling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A crit ical componen t in any com ponen t of a life s uppor t
device or system whose failure to perform can be rea-
sonabl y e xpec ted to cause th e fa i lure of the l ife s upport
device or system, or to affect its safety or effectiveness.
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