EB51W4C30N-25.000M TR - Ecliptek Corporation

EB51W4C30N-25.000M TR

EB51W4 C 30 N -25.000M TR

Series

5.0Vdc HCMOS/TTL PCB SMD TCXO

Operating Temperature Range

-20°C to +70°C

Frequency Stability

±3.0ppm Maximum

Packaging Options

Tape & Reel

Nominal Frequency

25.000MHz

Control Voltage

None (No Connect on Pin 1)

ELECTRICAL SPECIFICATIONS

Nominal Frequency 25.000MHz

Frequency Stability ±3.0ppm Maximum (Inclusive of Operating Temperature Range)

Frequency Stability vs. Input Voltage ±0.3ppm Maximum (±5%)

Aging at 25°C ±1ppm/Year Maximum

Frequency Stability vs. Load ±0.2ppm Maximum (±2pF)

Operating Temperature Range -20°C to +70°C

Supply Voltage 5.0Vdc ±5%

Input Current 20mA Maximum

Output Voltage Logic High (Voh) 2.4Vdc Minimum w/TTL Load, Vdd-0.5Vdc Minimum w/HCMOS Load

Output Voltage Logic Low (Vol) 0.4Vdc Maximum w/TTL Load, 0.5Vdc Maximum w/HCMOS Load

Rise/Fall Time 10nSec Maximum (Measured at 0.4Vdc to 2.4Vdc w/TTL Load, 20% to 80% of waveform w/HCMOS Load)

Duty Cycle 50% ±10% (Measured at 1.4Vdc w/TTL Load, at 50% of waveform w/HCMOS Load)

Load Drive Capability 10TTL Load or 15pF HCMOS Load Maximum

Output Logic Type CMOS

Control Voltage None (No Connect on Pin 1)

Internal Trim ±3ppm Minimum (Top of Can)

Modulation Bandwidth 10kHz Minimum (Measured at -3dB with a Control Voltage of 2.5Vdc)

Input Impedance 10kOhms Typical

Phase Noise -70dBc at 10Hz Offset, -100dBc at 100Hz Offset, -130dBc at 1kHz Offset, -140dBc at 10kHz Offset, -

145dBc at 100kHz Offset (Typical Values)

Storage Temperature Range -40°C to +85°C

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

Fine Leak Test MIL-STD-883, Method 1014 Condition A (Internal Crystal Only)

Gross Leak Test MIL-STD-883, Method 1014 Condition C (Internal Crystal Only)

Lead Integrity MIL-STD-883, Method 2004

Mechanical Shock MIL-STD-202, Method 213 Condition C

Resistance to Soldering Heat MIL-STD-202, Method 210

Resistance to Solvents MIL-STD-202, Method 215

Solderability MIL-STD-883, Method 2003

Temperature Cycling MIL-STD-883, Method 1010

Vibration MIL-STD-883, Method 2007 Condition A

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 1 of 6

EB51W4C30N-25.000M TR

MECHANICAL DIMENSIONS (all dimensions in millimeters)

11.7

±0.5

1.5

±0.3 DIA 3.5 ±0.5

18.3 ±0.5

21.3 ±0.5

1.0

±0.1

4.0 ±0.3 1.7

±0.4

7.62

±0.30

4.5

±0.3

4.0 ±0.3

PIN CONNECTION

1 No Connect

2 Ground

3 Output

4 Supply Voltage

LINE MARKING

1ECLIPTEK

225.000M

M=MHz

3XXYZZ

XX=Ecliptek Manufacturing

Code

Y=Last Digit of the Year

ZZ=Week of the Year

All Tolerances are ±0.1

Suggested Solder Pad Layout

Solder Land

(X4)

All Dimensions in Millimeters

14.8

5.9

1.6 (X4)

3.5 (X4)

OUTPUT WAVEFORM

VOH

VOL

80% or 2.4VDC

50% or 1.4VDC

20% or 0.4VDC

Fall

Time

Rise

Time TW

Duty Cycle (%) = TW/T x 100

CLOCK OUTPUT

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 2 of 6

EB51W4C30N-25.000M TR

Supply

Voltage

(VDD)

Test Circuit for TTL Output

Output

No Connect

or Tri-State

Ground

+ +

Power

Supply Voltage

Meter

Current

Meter

0.01µF

(Note 1) 0.1µF

(Note 1) CL

(Note 3)

(Note 4)

Power

Supply

Oscilloscope Frequency

Counter

Probe

(Note 2)

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency

ceramic bypass capacitor close to the package ground and VDD pin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.

Note 4: Resistance value RL is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'.

Note 5: All diodes are MMBD7000, MMBD914, or equivalent.

Table 1: RL Resistance Value and CL Capacitance

Value Vs. Output Load Drive Capability

Output Load

Drive Capability RL Value

(Ohms) CL Value

(pF)

10TTL

5TTL

2TTL

10LSTTL

1TTL

390

780

1100

2000

2200

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 3 of 6

EB51W4C30N-25.000M TR

Supply

Voltage

(VDD)

Test Circuit for CMOS Output

Output

No Connect

or Tri-State

Ground

+ +

Power

Supply 0.01µF

(Note 1) 0.1µF

(Note 1) CL

(Note 3)

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency

ceramic bypass capacitor close to the package ground and VDD pin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.

Voltage

Meter

Current

Meter

Oscilloscope Frequency

Counter

Probe

(Note 2)

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 4 of 6

DIA 50 MIN

DIA 20.2 MIN

DIA 13.0 ±0.2

2.5 MIN Width

10.0 MIN Depth

Tape slot in Core

for Tape Start

DIA 40 MIN

Access Hole at

Slot Location

1.5 MIN

Tape & Reel Dimensions

*Compliant to EIA 481A

EB51W4C30N-25.000M TR

32.0 ±0.30

14.20 ±0.15

16.05 ±0.15

4.00 ±0.20

2.00 ±0.10

16.00 ±0.10 12.50 ±0.10

DIA 1.60 ±0.10

22.20

±0.10

0.40 ±0.05

5.00 ±0.10

30.4 MAX

360 MAX

1,000 pieces per reel

32.4 +2.0/-0/0

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 5 of 6

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

EB51W4C30N-25.000M TR

Low Temperature Infrared/Convection 240°C

TS MAX to TL (Ramp-up Rate) 5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) N/A

- Temperature Typical (TS TYP) 150°C

- Temperature Maximum (TS MAX) N/A

- Time (tS MIN) 60 - 120 Seconds

Ramp-up Rate (TL to TP)5°C/second Maximum

Time Maintained Above:

- Temperature (TL)150°C

- Time (tL)200 Seconds Maximum

Peak Temperature (TP)240°C Maximum

Target Peak Temperature (TP Target) 240°C Maximum 1 Time / 230°C Maximum 2 Times

Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

Ramp-down Rate 5°C/second Maximum

Time 25°C to Peak Temperature (t) N/A

Moisture Sensitivity Level Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 6 of 6