MULTILAYER CERAMIC CAPACITORS
1. INTRODUCTION
2. FEATURES
a. High Q and low ESR performance at high frequency.
b. Ultra low capacitance to 0.1pF.
c. Can offer high precision tolerance to ±0.05pF.
d. Quality improvement of telephone calls for low
power loss and better performance.
3. APPLICATIONS
a. Telecommunication
products & equipments: Mobile
phone, WLAN, Base station.
b. RF module: Power amplifier, VCO.
c. Tuners.
TOLERANCE
A=±0.05pF
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
SERIES
GUQ=Ultra
High Q &
Low ESR
DIELECTRIC
CG = NP0
(C0G)
CAPACITANCE
Two significant
digits followed
b no. of zeros.
An R is in place
of decimal point.
eg.:
0R5=0.5pF
1R0=1.0pF
100=10pF
VOLTAGE
Two significant
digits followed by
no. of zeros. And
R is in place of
decimal point.
25=25 VDC
50=50 VDC
100=100 VDC
250=250 VDC
TERMINATION
N=Cu/Ni/Sn
PACKAGING
T=7” reeled
GUQ
10
CG
101
J
250
N
T
MLCC Consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve miniaturization,
high density and high efficiency, ceramic condensers are used.
Calchip GUQ series MLCC is used at high frequencies and generally have a small temperature coefficient of capacitance,
typical within the +/-30ppm/C required for NPO (COG) classification and have excellent conductivity internal electrode. Thus,
Calchip GUQ series MLCC will be with the feature of low EST and high Q characteristics.
HOW TO ORDER
Calchip Electronics, INC. www.calchipelectronics.com
59 Steamwhistle Drive, Ivyland, PA. 18974 ph 215-942-8900 fx 215-942-6400
Ultra High Q & Low ESR Series (GUQ)
SIZE
02=0201
04=0402
10=0603
21=0805
T = 7" reel
TD = 13 reel
5. EXTERNAL DIMENSIONS
6. GENERAL ELECTRICAL DATA
Dielectric NP0
Size 0201, 0402, 0603, 0805
Capacitance* 0201: 0.1pF to 33pF; 0402: 0.1pF to 22pF; 0603: 0.3pF to 47pF; 0805: 0.3pF to 100pF
Capacitance tolerance
Cap≤5pF: A (±0.05pF ), B (±0.1pF), C (±0.25pF)
5pF<Cap<10pF: B (±0.1pF), C (±0.25pF), D (±0.5pF)
Cap≥10pF: F (±1%), G (±2%), J (±5%)
Rated voltage (WVDC) 6.3V, 10V, 25V, 50V, 100V, 250V
Q* Cap≥30pF, Q≥1000; Cap<30pF,Q≥400+20C
Insulation resistance at Ur ≥10GΩ
Operating temperature -55 to +125°C
Capacitance change ±30ppm/°C; 0201Cap≥22pF, ±60ppm/°C
Termination Ni/Sn (lead-free termination)
* Measured at the conditions of 25°C ambient temperature and 30~70% related humidity.
Apply 1.0±0.2Vrms, 1.0MHz±10% for Cap≤1000pF and 1.0±0.2Vrms, 1.0kHz±10% for Cap>1000pF.
T
W
L
M
B
M
B
Fig. 1 The outline of MLCC
Size
Inch (mm)
L (mm) W (mm) T (mm)/Symbol
Remark
M
B
(mm)
0201 (0603)
0.60±0.03
0.30±0.03
0.30±0.03
L
# 0.15±0.05
0402 (1005)
1.00±0.05
0.50±0.05
0.50±0.05
N
# 0.25+0.05/-0.10
0603 (1608)
1.60±0.10
0.80±0.10
0.80±0.07
S
0.40±0.15
0805 (2012)
2.00±0.20
1.25±0.20
0.85±0.10
T
0.50±0.20
# Reflow soldering only is recommended.
Ultra High Q & Low ESR Series (GUQ)
Calchip Electronics, INC. www.calchipelectronics.com
59 Steamwhistle Drive, Ivyland, PA. 18974 ph 215-942-8900 fx 215-942-6400
7. CAPACITANCE RANGE
DIELECTRIC NP0
SIZE 0201 0402 0603 0805
RATED VOLTAGE (VDC)
6.3
10
25
50
100
50 100 250 50 100 250 Tolerance
0.1pF (0R1)
L L L N N B
0.2pF (0R2)
L L L N N A, B
0.3pF (0R3)
L L L N N S S S T T T A, B
0.4pF (0R4)
L L L N N S S S T T T A, B
0.5pF (0R5)
L L L N N S S S T T T A, B, C
0.6pF (0R6)
L L L N N S S S T T T A, B, C
0.7pF (0R7)
L L L N N S S S T T T A, B, C
0.8pF (0R8)
L L L N N S S S T T T A, B, C
0.9pF (0R9)
L L L N N S S S T T T A, B, C
1.0pF (1R0)
L L L N N S S S T T T A, B, C
1.2pF (1R2)
L L L N N S S S T T T A, B, C
1.5pF (1R5)
L L L N N S S S T T T A, B, C
1.8pF (1R8)
L L L N N S S S T T T A, B, C
2.2pF (2R2)
L L L N N S S S T T T A, B, C
2.7pF (2R7)
L L L N N S S S T T T A, B, C
3.3pF (3R3)
L L L N N S S S T T T A, B, C
3.9pF (3R9)
L L L N N S S S T T T A, B, C
4.7pF (4R7)
L L L N N S S S T T T A, B, C
5.6pF (5R6)
L L L N N S S S T T T B, C, D
6.8pF (6R8)
L L L N N S S S T T T B, C, D
8.2pF (8R2)
L L L N N S S S T T T B, C, D
10pF (100)
L L L N N S S S T T T F, G, J
11pF (110)
L L L N S S S T T T F, G, J
12pF (120)
L L L N S S S T T T F, G, J
13pF (130)
L L L N S S S T T T F, G, J
15pF (150)
L L L N S S S T T T F, G, J
16pF (160)
L L L N S S S T T T F, G, J
18pF (180)
L L L N S S S T T T F, G, J
20pF (200)
L L N S S S T T T F, G, J
22pF (220)
L L N S S S T T T F, G, J
24pF (240)
L L S S S T T T F, G, J
27pF (270)
L L S S S T T T F, G, J
30pF (300)
L L S S S T T T F, G, J
33pF (330)
L L S S S T T T F, G, J
36pF (360)
S S S T T T F, G, J
39pF (390)
S S S T T T F, G, J
43pF (430)
S S S T T T F, G, J
47pF (470)
S S S T T T F, G, J
56pF (560)
T T T F, G, J
68pF (680)
T T T F, G, J
82pF (820)
T T T F, G, J
Capacitance
100pF (101)
T T T F, G, J
1. The letter in cell is expressed the symbol of product thickness.
2. WTC provide E96 (IEC-63) product range with which capacitance≤10pF.
3. For more information about products with special capacitance or other data, please contact WTC local representative.
8. PACKAGING DIMENSION AND QUANTITY
Paper tape
Size Thickness (mm)/Symbol 7” reel 13” reel
0201 (0603) 0.30±0.03 L 15k 70k
0402 (1005) 0.50±0.05 N 10k 50k
0603 (1608) 0.80±0.07 S 4k 15k
0805 (2012) 0.85±0.10 T 4k 15k
Unit: pieces
Ultra High Q & Low ESR Series (GUQ)
Calchip Electronics, INC. www.calchipelectronics.com
59 Steamwhistle Drive, Ivyland, PA. 18974 ph 215-942-8900 fx 215-942-6400
CCE
CCE
9. ELECTRICAL CHARACTERISTICS
RF15, NP0, 50V
0.01
0.1
1
100 1,000 10,000
Frequency (MHz)
ESR (Ω)
6.8pF
3.3pF
1.5pF
1pF
Fig. 2 ESR vs. Frequency
RF15, NP0, 50V
1
10
100
1000
10000
100 1,000 10,000
Frequency (MHz)
Q
6.8pF
1pF
1.5pF
Fig. 3 Q vs. Frequency
RF15, NP0, 50V
1
10
100
1000
10000
100000
1 10 100 1,000 10,000
Frequency (MHz)
IZI (Ω)
1pF
1.5pF
3.3pF
6.8pF
Fig. 4 Impedance vs. Frequency
Ultra High Q & Low ESR Series (GUQ)
Calchip Electronics, INC. www.calchipelectronics.com
59 Steamwhistle Drive, Ivyland, PA. 18974 ph 215-942-8900 fx 215-942-6400
GUQ04, NPO, 50V
GUQ04, NPO, 50V
GUQ04, NPO, 50V
RF03, NP0, 25V
0
5
10
15
20
25
30
0.1 1 10 100
Capacitance (pF)
Self resonance frequency (GHz)
Measured data (<8.5GHz)
Simulation data
Fig. 5 Self resonance frequency vs. Capacitance (0201 size)
RF15, NP0, 50V
0
5
10
15
20
25
0.1 1 10 100
Capacitance (pF)
Self resonance frequency (GHz)
Measured data (<8.5GHz)
Simulation data
Fig. 6 Self resonance frequency vs. Capacitance (0402 size)
R F03, N P 0, 25 V C om pariso n
-100
-80
-60
-40
-20
0
0.1 1 10
Frequen cy (G Hz )
S11 (dB)
2 p F
1 p F
0. 5pF
Fig. 7 S11 vs. frequency. (0201 size)
R F0 3, N P0, 25V C om pariso n
- 1 0 0
- 8 0
- 6 0
- 4 0
- 2 0
0
0 . 1 1 1 0
F re qu e ncy ( GH z )
S21 (dB)
2 p F
1 p F
0 .5 pF
Fig. 9 S21 vs. frequency. (0201 size)
R F1 5 , N P 0, 50 V C om p a rison
-1 0 0
- 80
- 60
- 40
- 20
0
0. 1 1 1 0
Fre quenc y ( G H z)
S11 (dB)
2p F
1 pF
0.5p F
Fig. 8 S11 vs. frequency. (0402 size)
R F15, N P0, 50 V C omparison
-1 0 0
-8 0
-6 0
-4 0
-2 0
0
0. 1 1 10
F re qu en cy (GH z )
S21 (dB)
2 p F
1p F
0. 5p F
Fig. 10 S21 vs. frequency. (0402 size)
Ultra High Q & Low ESR Series (GUQ)
Calchip Electronics, INC. www.calchipelectronics.com
59 Steamwhistle Drive, Ivyland, PA. 18974 ph 215-942-8900 fx 215-942-6400
GUQ02, NPO, 25V
GUQ04, NPO, 50V
GUQ02, NPO, 25V Comparison
GUQ04, NPO, 50V Comparison
GUQ02, NPO, 25V Comparison
GUQ04, NPO, 50V Comparison
10. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
No.
Item Test Conditions Requirements
1.
Visual and
Mechanical
--- * No remarkable defect.
* Dimensions to conform to individual specification sheet.
2.
Capacitance * Shall not exceed the limits given in the detailed spec.
3.
Q/ D.F.
(Dissipation
Factor)
1.0±0.2Vrms, 1MHz±10%
At 25°C ambient temperature. * Cap≥30pF, Q≥1000; Cap<30pF,Q≥400+20C
4.
Dielectric
Strength
* To apply voltage:
≤100V, ≥250% of rated voltage.
250V, ≥200% of rated voltage.
* Duration: 1 to 5 sec.
* Charge and discharge current less than 50mA.
* No evidence of damage or flash over during test.
5.
Insulation
Resistance
To apply rated voltage for max. 120 sec. ≥10GΩ
6.
Temperature
Coefficient
With no electrical load.
Operating temperature: -55~125°C at 25°C
* Capacitance change: within ±30ppm/°C;
0201Cap≥22pF, within ±60ppm/°C
7.
Adhesive
Strength of
Termination
* Pressurizing force：
0201: 2N
0402 & 0603: 5N
>0603: 10N
* Test time: 10±1 sec.
* No remarkable damage or removal of the terminations.
8.
Vibration
Resistance
* Vibration frequency: 10~55 Hz/min.
* Total amplitude: 1.5mm
* Test time: 6 hrs. (Two hrs each in three mutually
perpendicular directions.)
* No remarkable damage.
* Cap change and Q/D.F.: To meet initial spec.
9.
Solderability * Solder temperature: 235±5°C
* Dipping time: 2±0.5 sec.
95% min. coverage of all metalized area.
10.
Bending Test
* The middle part of substrate shall be pressurized by means
of the pressurizing rod at a rate of about 1 mm per second until
the deflection becomes 1 mm and then the pressure shall be
maintained for 5±1 sec.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±5.0% or ±0.5pF whichever is larger.
(This capacitance change means the change of capacitance under
specified flexure of substrate from the cap
acitance measured before
the test.)
11.
Resistance to
Soldering Heat
* Solder temperature: 270±5°C
* Dipping time: 10±1 sec
* Preheating: 120 to 150°C for 1 minute before immerse the
capacitor in a eutectic solder.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±2.5% or ±0.25pF whichever is larger.
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* 25% max. leaching on each edge.
12.
Temperature
Cycle
* Conduct the five cycles according to the temperatures and
time.
Step
Temp. (°C) Time (min.)
1 Min. operating temp. +0/-3 30±3
2 Room temp. 2~3
3 Max. operating temp. +3/-0 30±3
4 Room temp. 2~3
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No
remarkable damage.
* Cap change
：within ±2.5％ or ±0.25pF whichever is larger.
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
Ultra High Q & Low ESR Series (GUQ)
Calchip Electronics, INC. www.calchipelectronics.com
59 Steamwhistle Drive, Ivyland, PA. 18974 ph 215-942-8900 fx 215-942-6400
No.
Item Test Condition Requirements
13.
Humidity
(Damp Heat)
Steady State
* Test temp.: 40±2°C
* Humidity: 90~95% RH
* Test time: 500+24/-0hrs.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±5.0% or ±0.5pF whichever is larger.
* Q/D.F. value: Cap≥30pF, Q≥350;
10pF≤Cap<30pF, Q≥275+2.5C
Cap<10pF; Q≥200+10C
* I.R.: ≥1GΩ.
14.
Humidity
(Damp Heat)
Load
* Test temp.: 40±2°C
* Humidity: 90~95%RH
* Test time: 500+24/-0 hrs.
* To apply voltage：rated voltage
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±7.5% or ±0.75pF whichever is larger.
* Q/D.F. value: Cap≥30pF, Q≥200;
Cap<30pF, Q≥100+10/3C
* I.R.: ≥500MΩ.
15.
High
Temperature
Load
(Endurance)
* Test temp.: 125±3°C
* To apply voltage: 200% of rated voltage.
* Test time: 1000+24/-0 hrs.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±3.0% or ±0.3pF whichever is larger.
* Q/D.F. value: Cap≥30pF, Q≥350
10pF≤Cap<30pF, Q≥275+2.5C
Cap<10pF, Q≥200+10C
* I.R.: ≥1GΩ.
16.
ESR
The ESR should be measured at room temperature and tested
at frequency 1±0.1 GHz.
0201, 0402 0603
0.5pF≤Cap≤1pF: < 350mΩ 0.3pF≤Cap≤1pF: < 1500mΩ
1pF<Cap≤5pF: < 300mΩ 1pF<Cap≤10pF: < 250mΩ
5pF<Cap≤22pF: < 250mΩ 10pF<Cap≤47pF: < 200mΩ
APPENDIXES
◙ Tape & reel dimensions
Fig. 12 The dimension of reel
Fig. 11 The dimension of paper tape
Size 0201, 0402, 0603, 0805
Reel size
7” 13”
C 13.0+0.5/-0.2 13.0+0.5/-0.2
W
1
8.4+1.5/-0 8.4+1.5/-0
A 178.0±1.0 330.0±1.0
N 60.0+1.0/-0 100±1.0
Size 0201 0402 0603 0805
Thickness
L N S T
A
0
0.37±0.03
0.62±0.05
1.00
+0.05/-0.1
1.50±0.10
B
0
0.67±0.03
1.12±0.05
1.80±0.10
2.30±0.10
T 0.42±0.03
0.60±0.05
0.95±0.05
0.95±0.05
K
0
- - - -
W 8.00±0.10
8.00±0.10
8.00±0.10
8.00±0.10
P
0
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
10xP
0
40.0±0.10
40.0±0.10
40.0±0.20
40.0±0.20
P
1
2.00±0.05
2.00±0.05
4.00±0.10
4.00±0.10
P
2
2.00±0.05
2.00±0.05
2.00±0.05
2.00±0.05
D
0
1.55±0.05
1.55±0.05
1.55±0.05
1.55±0.05
D
1
- - - -
E 1.75±0.05
1.75±0.05
1.75±0.05
1.75±0.05
F 3.50±0.05
3.50±0.05
3.50±0.05
3.50±0.05
Ultra High Q & Low ESR Series (GUQ)
Calchip Electronics, INC. www.calchipelectronics.com
59 Steamwhistle Drive, Ivyland, PA. 18974 ph 215-942-8900 fx 215-942-6400
◙ Description of customer label
◙ Constructions
◙ Storage and handling conditions
(1) To store products at 5 to 40°C ambient temperature and 20 to 70%. related humidity conditions.
(2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life
extension is needed.
Cautions:
a. Don’t store products in a corrosive environment such as sulfide, chloride gas, or acid. It may cause oxidization of
electrode, which easily be resulted in poor soldering.
b. To store products on the shelf and avoid exposure to moisture.
c. Don’t expose products to excessive shock, vibration, direct sunlight and so on.
No. Name NP0
1
Ceramic material BaTiO3 based
2
Inner electrode Cu
3
Inner layer Cu
4
Middle layer Ni
5
Termination
Outer layer Sn (Matt)
Fig. 13 The construction of MLCC
a. Customer name
b. WTC order series and item number
c. Customer P/O
d. Customer P/N
e. Description of product
f. Quantity
g. Bar code including quantity & WTC P/N or customer
h. WTC P/N
i. Shipping date
j. Order bar code including series and item numbers
k. Serial number of label
Ultra High Q & Low ESR Series (GUQ)
Calchip Electronics, INC. www.calchipelectronics.com
59 Steamwhistle Drive, Ivyland, PA. 18974 ph 215-942-8900 fx 215-942-6400
Cross Reference
Walsin
◙ Recommended soldering conditions
The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable
against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and
concentration of N
2
within oven are recommended.
Fig. 14 Recommended IR reflow soldering profile for SMT
process with SnAgCu series solder paste.
4℃
℃℃
℃/ sec max
Over 60sec at least by
natural cooling
4℃
℃℃
℃/ sec max
Over 60sec at least by
natural cooling
Fig. 15 Recommended wave soldering profile for SMT process
with SnAgCu series solder.
Ultra High Q & Low ESR Series (GUQ)
Calchip Electronics, INC. www.calchipelectronics.com
59 Steamwhistle Drive, Ivyland, PA. 18974 ph 215-942-8900 fx 215-942-6400
