1CY74FCT162827T Data sheet acquired from Cypress Semiconductor Corporation. Data sheet modified to remove devices not offered. CY74FCT16827T CY74FCT162827T 20-Bit Buffers/Line Drivers SCCS064B - August 1994 - Revised September 2001 Features * Ioff Supports Partial-Power-Down Mode Operation * Edge-rate control circuitry for significantly improved noise characteristics * Typical output skew < 250 ps * ESD > 2000V * TSSOP (19.6-mil pitch) and SSOP (25-mil pitch) packages * Industrial temperature range of -40C to +85C * VCC = 5V 10% CY74FCT16827T Features: * 64 mA sink current, 32 mA source current * Typical VOLP (ground bounce) <1.0V at VCC = 5V, TA = 25C Functional Description The CY74FCT16827T 20-bit buffer/line driver and the CY74FCT162827T 20-bit buffer/line driver provide high-performance bus interface buffering for wide data/address paths or buses carrying parity. These parts can be used as a single 20-bit buffer or two 10-bit buffers. Each 10-bit buffer has a pair of NANDed OE for increased flexibility. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The CY74FCT16827T is ideally suited for driving high-capacitance loads and low-impedance backplanes. The CY74FCT162827T has 24-mA balanced output drivers with current-limiting resistors in the outputs. This reduces the need for external terminating resistors and provides for minimal undershoot and reduced ground bounce. The CY74FCT162827T is ideal for driving transmission lines. CY74FCT162827T Features: * Balanced 24 mA output drivers * Reduced system switching noise * Typical VOLP (ground bounce) <0.6V at VCC = 5V, TA = 25C Logic Block Diagrams Pin Configuration SSOP/TSSOP Top View 1OE1 1OE1 1 56 1OE2 1Y1 2 55 1A 1 1Y2 3 54 1A 2 GND 4 53 GND 1Y3 5 52 1A 3 1Y4 6 51 1A 4 VCC 7 50 VCC 8 49 1A 5 1Y6 9 48 1Y7 10 1A 7 GND 1Y8 11 47 46 45 1A 8 1Y9 12 13 44 1A 9 1Y10 14 43 1A 10 2OE1 2Y1 15 42 2A 1 2OE2 2Y2 16 41 2A 2 2Y3 17 40 2A 3 GND 18 39 GND 2Y4 19 38 2A 4 2Y5 20 37 2A 5 2Y6 21 36 2A 6 VCC 2Y7 22 35 VCC 23 34 2A 7 1OE2 1Y1 1A1 1Y5 TO 9 OTHER CHANNELS 2A1 FCT16827-1 2Y1 TO 9 OTHER CHANNELS FCT16827-2 1A 6 GND 2Y8 24 GND 25 33 32 2A 8 2Y9 26 31 2A 9 2Y10 27 30 2A10 2OE1 28 29 2OE2 GND FCT16827-3 Copyright (c) 2001, Texas Instruments Incorporated CY74FCT16827T CY74FCT162827T Maximum Ratings[2, 3] Pin Description Name (Above which the useful life may be impaired. For user guidelines, not tested.) Description OE Output Enable Inputs (Active LOW) A Data Inputs Y Three-State Outputs Storage Temperature ............................... -55C to +125C Ambient Temperature with Power Applied.......................................... -55C to +125C DC Input Voltage .................................................-0.5V to +7.0V Function Table[1] DC Output Voltage ..............................................-0.5V to +7.0V Inputs DC Output Current (Maximum Sink Current/Pin) ...........................-60 to +120 mA Outputs OE1 OE2 A Y L L L L L L H H H X X Z X H X Z Power Dissipation .......................................................... 1.0W Static Discharge Voltage............................................>2001V (per MIL-STD-883, Method 3015) Operating Range Range Industrial Ambient Temperature VCC -40C to +85C 5V 10% Electrical Characteristics Over the Operating Range Parameter Description Test Conditions VIH Input HIGH Voltage VIL Input LOW Voltage VH Input Hysteresis[5] VIK Input Clamp Diode Voltage VCC=Min., IIN=-18 mA IIH Input HIGH Current IIL Min. Typ.[4] Max. 2.0 Unit V 0.8 100 mV -1.2 V VCC=Max., VI=VCC 1 A Input LOW Current VCC=Max., VI=GND 1 A IOZH High Impedance Output Current (Three-State Output pins) VCC=Max., VOUT=2.7V 1 A IOZL High Impedance Output Current (Three-State Output pins) VCC=Max., VOUT=0.5V 1 A IOS Short Circuit Current[6] VCC=Max., VOUT=GND -80 -200 mA Current[6] VCC=Max., VOUT=2.5V -50 -180 mA 1 A Max. Unit IO Output Drive IOFF Power-Off Disable VCC=0V, VOUT -0.7 V -140 4.5V[7] Output Drive Characteristics for CY74FCT16827T Parameter VOH VOL 1. 2. 3. 4. 5. 6. 7. Description Output HIGH Voltage Output LOW Voltage Min. Typ.[4] VCC=Min., IOH=-3 mA 2.5 3.5 VCC=Min., IOH=-15 mA 2.4 3.5 VCC=Min., IOH=-32 mA 2.0 3.0 Test Conditions VCC=Min., IOL=64 mA 0.2 V 0.55 V H = HIGH Voltage Level. L = LOW Voltage Level. X = Don't Care.Z = HIGH Impedance. Operation beyond the limits set forth may impair the useful life of the device. Unless noted, these limits are over the operating free-air temperature range. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground. Typical values are at VCC= 5.0V, TA= +25C ambient. This parameter is specified but not tested. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. Tested at +25C. 2 CY74FCT16827T CY74FCT162827T Output Drive Characteristics for CY74FCT162827T Parameter Description Test Conditions Min. Typ.[4] Max. Unit Output LOW Current[6] VCC=5V, VIN=VIH or VIL, VOUT=1.5V 60 115 150 mA IODH Output HIGH Current[6] VCC=5V, VIN=VIH or VIL, VOUT=1.5V -60 -115 -150 mA VOH Output HIGH Voltage VCC=Min., IOH=-24 mA 2.4 3.3 VOL Output LOW Voltage VCC=Min., IOL=24 mA IODL 0.3 V 0.55 V Capacitance[5] (TA = +25C, f = 1.0 MHz) Parameter Description Test Conditions Typ.[4] Max. Unit CIN Input Capacitance VIN = 0V 4.5 6.0 pF COUT Output Capacitance VOUT = 0V 5.5 8.0 pF Power Supply Characteristics Parameter Description Test Conditions Min. Typ.[4] Max. Unit ICC Quiescent Power Supply Current VCC=Max. VIN<0.2V, VIN>VCC-0.2V -- 5 500 A ICC Quiescent Power Supply Current (TTL inputs HIGH) VCC=Max. VIN=3.4V[8] -- 0.5 1.5 mA ICCD Dynamic Power Supply Current[9] VCC=Max., One Input Toggling, 50% Duty Cycle, Outputs Open, OE1=OE2=GND, VIN=VCC or VIN=GND -- 60 100 A/MHz IC Total Power Supply Current[10] VCC=Max., f1=10 MHz, 50% Duty Cycle, Outputs Open, One Bit Toggling, OE1=OE2=GND VIN=VCC or VIN=GND -- 0.6 1.5 mA VIN=3.4V or VIN=GND -- 0.9 2.3 VIN=VCC or VIN=GND -- 3.0 5.5[11] VIN=3.4V or VIN=GND -- 8.0 20.5[11] VCC=Max., f1=2.5 MHz, 50% Duty Cycle, Outputs Open, Twenty Bits Toggling, OE1=OE2=GND Notes: 8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND. 9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations. = IQUIESCENT + IINPUTS + IDYNAMIC 10. IC IC = ICC+ICCDHNT+ICCD(f0/2 + f1N1) ICC = Quiescent Current with CMOS input levels ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V) = Duty Cycle for TTL inputs HIGH DH = Number of TTL inputs at DH NT ICCD = Dynamic Current caused by an input transition pair (HLH or LHL) = Clock frequency for registered devices, otherwise zero f0 = Input signal frequency f1 = Number of inputs changing at f1 N1 All currents are in milliamps and all frequencies are in megahertz. 11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested. 3 CY74FCT16827T CY74FCT162827T Switching Characteristics Over the Operating Range[12] CY74FCT16827AT CY74FCT162827AT Parameter tPLH tPHL tPZH tPZL tPHZ tPLZ tSK(O) Description Propagation Delay A to Y Output Enable Time OE to Y Output Disable Time OE to Y CY74FCT162827BT Condition[13] Min. Max. Min. Max. Unit Fig. No.[13] CL=50 pF RL=500 1.5 8.0 1.5 5.0 ns 1, 3 CL=300 pF RL=500 1.5 15.0 1.5 13.0 CL=50 pF RL=500 1.5 12.0 1.5 8.0 ns 1, 7, 8 CL=300 pF RL=500 1.5 23.0 1.5 15.0 CL=5 pF RL=500 1.5 9.0 1.5 6.0 ns 1, 7, 8 CL=50 pF RL=500 1.5 10.0 1.5 7.0 -- 0.5 -- 0.5 ns -- Output Skew[14] CY74FCT16827CT CY74FCT162827CT Parameter tPLH tPHL tPZH tPZL tPHZ tPLZ tSK(O) Description Propagation Delay A to Y Output Enable Time OE to Y Output Disable Time OE to Y Output Skew[14] Condition[12] Min. Max. Unit Fig. No.[13] CL=50 pF RL=500 1.5 4.2 ns 1, 3 CL=300 pF RL=500 1.5 10.0 CL=50 pF RL=500 1.5 5.6 ns 1, 7, 8 CL=300 pF RL=500 1.5 14.0 CL=5 pF RL=500 1.5 5.7 ns 1, 7, 8 CL=50 pF RL=500 1.5 6.0 -- 0.5 ns -- Notes: 12. Minimum limits are specified but not tested on Propagation Delays. 13. See "Parameter Measurement Information" in the General Information section. 14. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design. 4 CY74FCT16827T CY74FCT162827T Ordering Information CY74FCT16827 Speed (ns) 4.2 8.0 Ordering Code Package Name Package Type CY74FCT16827CTPACT Z56 56-Lead (240-Mil) TSSOP CY74FCT16827CTPVC/PVCT O56 56-Lead (300-Mil) SSOP CY74FCT16827ATPVC/PVCT Z56 56-Lead (240-Mil) SSOP Operating Range Industrial Industrial Document #: 38-00393-C Ordering Information CY74FCT162827 Speed (ns) 4.2 5.0 8.0 Ordering Code Package Name Package Type 74FCT162827CTPACT Z56 56-Lead (240-Mil) TSSOP CY74FCT162827CTPVC Z56 56-Lead (240-Mil) SSOP 74FCT162827CTPVCT Z56 56-Lead (240-Mil) SSOP CY74FCT162827BTPVC O56 56-Lead (300-Mil) SSOP 74FCT162827BTPVCT O56 56-Lead (300-Mil) SSOP CY74FCT162827ATPVC O56 56-Lead (300-Mil) SSOP 74FCT162827ATPVCT O56 56-Lead (300-Mil) SSOP 5 Operating Range Industrial Industrial Industrial CY74FCT16827T CY74FCT162827T Package Diagrams 56-Lead Shrunk Small Outline Package O56 56-Lead Thin Shrunk Small Outline Package Z56 6 PACKAGE OPTION ADDENDUM www.ti.com 28-Aug-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) 74FCT162827ATPACT ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples 74FCT162827ATPVCG4 ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 74FCT162827BTPVCG4 ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 74FCT162827CTPACT ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 74FCT162827ETPACT OBSOLETE TSSOP DGG 56 TBD TBD Call TI Call TI Samples Not Available Call TI 74FCT162827ETPVCT OBSOLETE SSOP DL 56 Call TI Samples Not Available 74FCT16827ATPACTE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 74FCT16827ATPACTG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 74FCT16827ATPVCG4 ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 74FCT16827CTPACTE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 74FCT16827CTPACTG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 74FCT16827CTPVCG4 ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 74FCT16827CTPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CY74FCT162827ATPVC ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CY74FCT162827BTPVC ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CY74FCT162827ETPAC OBSOLETE TSSOP DGG 56 TBD Call TI Call TI Samples Not Available CY74FCT162827ETPVC OBSOLETE SSOP DL 56 TBD Call TI Call TI Samples Not Available CY74FCT16827ATPACT ACTIVE TSSOP DGG 56 CU NIPDAU Level-1-260C-UNLIM Purchase Samples 2000 Green (RoHS & no Sb/Br) Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 28-Aug-2010 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CY74FCT16827ATPVC ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CY74FCT16827CTPACT ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CY74FCT16827CTPVC ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CY74FCT16827CTPVCT ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CY74FCT16827ETPAC OBSOLETE TSSOP DGG 56 TBD Call TI Call TI Samples Not Available CY74FCT16827ETPACT OBSOLETE TSSOP DGG 56 TBD Call TI Call TI Samples Not Available Samples Not Available CY74FCT16827ETPVC OBSOLETE SSOP DL 56 TBD Call TI Call TI CY74FCT16827ETPVCT OBSOLETE SSOP DL 56 TBD Call TI Call TI Samples Not Available FCT162827ATPACTE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples FCT162827ATPACTG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples FCT162827CTPACTE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples FCT162827CTPACTG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com (3) 28-Aug-2010 MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 74FCT162827ATPACT TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1 74FCT162827CTPACT TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1 CY74FCT16827ATPACT TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1 CY74FCT16827CTPACT TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1 CY74FCT16827CTPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74FCT162827ATPACT TSSOP DGG 56 2000 367.0 367.0 45.0 74FCT162827CTPACT TSSOP DGG 56 2000 367.0 367.0 45.0 CY74FCT16827ATPACT TSSOP DGG 56 2000 367.0 367.0 45.0 CY74FCT16827CTPACT TSSOP DGG 56 2000 367.0 367.0 45.0 CY74FCT16827CTPVCT SSOP DL 56 1000 367.0 367.0 55.0 Pack Materials-Page 2 MECHANICAL DATA MSSO001C - JANUARY 1995 - REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0-8 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D - JANUARY 1995 - REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. 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