DATA SHEET
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
PHOTOCOUPLER
PS9303L,PS9303L2
1 Mbps TOTEM POLE OUTPUT TYPE
HIGH CMR, IPM DRIVER
6
-
PIN S
DI
P PHOTOCOUPLER
NEPOC Series
Document No. PN10694EJ04V0DS (4th edition)
Date Published September 2009 NS
Printed in Japan
2007, 2009
1. Anode
2. NC
3. Cathode
4. GND
5. V
O
6. V
CC
PIN CONNECTION
(Top View)
64
132
5
SHIELD
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
DESCRIPTION
The PS9303L and PS9303L2 are optical coupled high-speed, totem pole output (active high output type) isolators
containing a GaAlAs LED on the input side and a photodiode and a signal processing circuit on the output side on one
chip.
The PS9303L and PS9303L2 are specified high CMR and pulse width distortion with operating temperature. It is
suitable for IPM drive.
The PS9303L is lead bending type (Gull-wing) for surface mounting.
The PS9303L2 is lead bending type for long creepage distance (Gull-wing) for surface mount.
FEATURES
High common mode transient immunity (CMH, CML = ±15 kV/
μ
s MIN.)
Half size of 8-pin DIP
Pulse width distortion (tPLH tPHL = 350 ns MAX.)
High-speed (1 Mbps)
High isolation voltage (BV = 5 000 Vr.m.s.)
Totem pole output (Active High Output Type)
Ordering number of tape product: PS9303L-E3, PS9303L2-E3: 2 000 pcs/reel
• Pb-Free product
• Safety standards
UL approved: No. E72422
CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)
DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40024069 (Option)
APPLICATIONS
• IPM Driver
General purpose inverter
TRUTH TABLE
LED Output
ON H
OFF L
<R>
<R>
Data Sheet PN10694EJ04V0DS
2
PS9303L,PS9303L2
PACKAGE DIMENSIONS (UNIT: mm)
Lead Bending Type (Gull-wing) For Surface Mount
0.25±0.15
9.7±0.3
3.7±0.25
0.8±0.25
0.2±0.15
7.62
3.5±0.2
6.8±0.25
4.58±0.3
(0.82)
PS9303L
0.4±0.1
0.25 M
1.27
Lead Bending Type (Gull-wing) For Long Creepage Distance (Surface Mount)
0.2±0.15
PS9303L2
11.5±0.3
6.8±0.25
4.58±0.3
0.25±0.15
0.75±0.25
(0.82)
3.7±0.25
3.5±0.2
7.62
0.4±0.1
0.25 M
1.27
Data Sheet PN10694EJ04V0DS 3
PS9303L,PS9303L2
PHOTOCOUPLER CONSTRUCTION
Parameter PS9303L PS9303L2
Air Distance (MIN.) 7 mm 8 mm
Outer Creepage Distance (MIN.) 7 mm 8 mm
Isolation Distance (MIN.) 0.4 mm 0.4 mm
MARKING EXAMPLE
Rank Code
Year Assembled
(Last 1 Digit)
Week Assembled
N931
9303
N931
No. 1 pin Mark
Assembly Lot
Type Number
<R>
Data Sheet PN10694EJ04V0DS
4
PS9303L,PS9303L2
ORDERING INFORMATION
Part Number Order Number Solder Plating
Specification
Packing Style Safety Standard
Approval
Application Part
Number*1
PS9303L PS9303L-AX Pb-Free 20 pcs (Tape 20 pcs cut) Standard products PS9303L
PS9303L-E3 PS9303L-E3-AX (Ni/Pd/Au) Embossed Tape 2 000 pcs/reel (UL, CSA approved)
PS9303L2 PS9303L2-AX 20 pcs (Tape 20 pcs cut) PS9303L2
PS9303L2-E3 PS9303L2-E3-AX Embossed Tape 2 000 pcs/reel
PS9303L-V PS9303L-V-AX 20 pcs (Tape 20 pcs cut) DIN EN60747-5-2 PS9303L
PS9303L-V-E3 PS9303L-V-E3-AX Embossed Tape 2 000 pcs/reel (VDE0884 Part2)
PS9303L2-V PS9303L2-V-AX 20 pcs (Tape 20 pcs cut) Approved (Option) PS9303L2
PS9303L2-V-E3 PS9303L2-V-E3-AX Embossed Tape 2 000 pcs/reel
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter Symbol Ratings Unit
Diode Forward Current*1 IF 20 mA
Reverse Voltage VR 5 V
Detector Supply Voltage VCC 0.5 to +25 V
Output Voltage VO 0.5 to +25 V
Output Current IO 25 mA
Power Dissipation*2 PC 210 mW
Isolation Voltage*3 BV 5 000 Vr.m.s.
Operating Ambient Temperature TA 40 to +100 °C
Storage Temperature Tstg 55 to +125 °C
*1 Reduced to 0.33 mA/°C at TA = 70°C or more.
*2 Reduced to 4.0 mW/°C at TA = 70°C or more.
*3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-3 shorted together, 4-6 shorted together.
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol MIN. TYP. MAX. Unit
Supply Voltage VCC 4.5 15 20 V
Output Voltage VO 0 20 V
Input Current (ON) IF (ON) 6 10 mA
Input Voltage (OFF) VF (OFF) 0 0.8 V
Data Sheet PN10694EJ04V0DS 5
PS9303L,PS9303L2
ELECTRICAL CHARACTERISTICS (TA = 40 to +100°C, VCC = 4.5 to 20 V, unless otherwise specified)
Parameter Symbol Conditions MIN. TYP.*1 MAX. Unit
Diode Forward Voltage VF IF = 10 mA, TA = 25°C 1.2 1.6 1.9 V
Reverse Current IR VR = 3 V, TA = 25°C 10
μ
A
Terminal Capacitance Ct V = 0 V, f = 1 MHz, TA = 25°C 30 pF
Detector High Level Output Voltage VOH VCC = 5 V, IO = 3.5 mA, IF = 10 mA 2.4 3.5 V
VCC = 20 V, IO = 3.5 mA, IF = 10 mA 17.4 18.1
Low Level Output Voltage*2 VOL IO = 3.5 mA, VF = 0 V 0.1 0.35 V
High Level Supply Current ICCH VCC = 5 V, IF = 10 mA 1.6 2.7 mA
VCC = 20 V, IF = 10 mA 1.8 3
Low Level Supply Current ICCL VCC = 5 V, VF = 0 V 2.7 3.7 mA
VCC = 20 V, VF = 0 V 2.9 4
High Level Output Short
Circuit Current
IOSH VCC = 20 V, VO = GND, IF = 10 mA 7 40 mA
Low Level Output Short
Circuit Current
IOSL VCC = VO = 20 V, VF = 0 V 7 40 mA
Coupled Threshold Input Current IFLH VCC = 5 V, VO > 2.4 V, IO = 3.5 mA 2.4 5 mA
Isolation Resistance RI-O VI-O = 500 VDC, RH = 60%, TA = 25°C 1012 Ω
Isolation Capacitance CI-O V = 0 V, f = 1 MHz, TA = 25°C 0.6 pF
Propagation Delay Time
(H L)*3
tPHL VCC = 20 V, CL = 100 pF,
IF = 10 0 mA, VTHHL = 1.3 V
50 185 550 ns
Propagation Delay Time
(L H)*3
tPLH VCC = 20 V, CL = 100 pF,
IF = 0 10 mA, VTHLH = 1.3 V
50 240 500 ns
Pulse Width Distortion
(PWD)
tPLH-tPHL VCC = 20 V, CL = 100 pF,
IF = 10 0 mA
55 350 ns
Rise Time (10-90%)*3 tr VCC = 20 V, CL = 100 pF,
IF = 0 10 mA
120 ns
Fall Time (90-10%)*3 tf VCC = 20 V, CL = 100 pF,
IF = 10 0 mA
90 ns
Common Mode
Transient Immunity at High
Level Output*4
CMH VCC = 5 V, TA = 25°C, IF = 10 mA,
VCM = 1.5 kV, VO (MIN.) = 2.4 V
15 kV/
μ
s
Common Mode
Transient Immunity at Low
Level Output*4
CML VCC = 5 V, TA = 25°C, IF = 0 mA,
VCM = 1.5 kV, VO (MAX.) = 0.35 V
15 kV/
μ
s
Data Sheet PN10694EJ04V0DS
6
PS9303L,PS9303L2
*1 Typical values at TA = 25°C.
*2 Because VO of 2.4 V may be output when the LED current is not input and when output supply of VCC = 4.5 V or
less, it is important to confirm the characteristics (operation with the power supply on and off) during design,
before using this device.
*3 Test circuit for propagation delay time
I
F
Input
Output
V
O
1.3 V
V
OH
V
OL
50%
90%
10%
t
PHL
t
PLH
t
f
t
r
Input
(monitor)
47 Ω
Pulse input (I
F
)
μ
(PW = 1 s,
Duty cycle = 1/10) V
CC
= 20 V
0.1 F
μ
C
L
= 100 pF
V
O
(monitor)
Remark C
L
includes probe and stray wiring capacitance.
I
F
(ON)
1
2
3
6
5
4
*4 Test circuit for common mode transient immunity
90%
V
OH
V
OL
V
CM
V
O
(I
F
= 10 mA)
V
O
(I
F
= 0 mA)
10%
t
r
t
f
2.4 V
0.35 V
Remark C
L
includes probe and stray wiring capacitance.
I
F
V
CM
V
CC
= 5 V
0.1 F
μ
V
O
(monitor)
SW
1.5 kV
1
2
3
6
5
4
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. By-pass capacitor of more than 0.1
μ
F is used between VCC and GND near device. Also, ensure that the
distance between the leads of the photocoupler and capacitor is no more than 10 mm.
3. Pin 2 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open.
Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may
degrade the internal noise environment of the device.
*1 NC: Non-connection (No connection)
4. Avoid storage at a high temperature and high humidity.
<R>
Data Sheet PN10694EJ04V0DS 7
PS9303L,PS9303L2
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
Ambient Temperature TA (°C)
Maximum Forward Current IF (mA)
MAXIMUM FORWARD CURRENT
vs. AMBIENT TEMPERATURE
Ambient Temperature TA (°C)
Detector Power Dissipation PC (mW)
DETECTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
Ambient Temperature TA (°C)
High Level Supply Current ICCH (mA),
Low Level Supply Current ICCL (mA)
SUPPLY CURRENT vs.
AMBIENT TEMPERATURE
Ambient Temperature TA (°C)
Threshold Input Current IFLH (mA)
THRESHOLD INPUT CURRENT vs.
AMBIENT TEMPERATURE
Ambient Temperature TA (°C)
Low Level Output Voltage VOL (V)
LOW LEVEL OUTPUT VOLTAGE vs.
AMBIENT TEMPERATURE
Forward Voltage VF (V)
Forward Current IF (mA)
FORWARD CURRENT vs.
FORWARD VOLTAGE
100 1200
25
20
15
10
5
20 40 60 80 20 40 60 100 1200
250
200
150
100
50
80
1.0
0.01
0.1
1
10
100
1.2 1.4 1.6 1.8 2.0 2.2 2.4
TA = +100°C
+85°C
+50°C
+25°C
0°C
–40°C
–50 –25
0.00
0.05
0.15
0.30
2505075
100
0.10
0.35
IF = 0 mA,
IO = 3.5 mA
0.20
0.25
–50 –25 0 25 50 75 100
0
1
2
3
4
ICCL
ICCH
VCC = 5 V,
ICCH: IF = 10 mA
ICCL: VF = 0 V
0
1
2
3
4
5
–50 –25 0 25 50 75 100
VCC = 5 V,
VO = 2.4 V,
IO = –3.5 mA
Remark The graphs indicate nominal characteristics.
<R>
Data Sheet PN10694EJ04V0DS
8
PS9303L,PS9303L2
Forward Current I
F
(mA)
Propagation Delay Time t
PHL
, t
PLH
(ns)
PROPAGATION DELAY TIME
vs. AMBIENT TEMPERATURE
Propagation Delay Time t
PHL
, t
PLH
(ns)
Load Capacitance C
L
(pF)
PROPAGATION DELAY TIME
vs. LOAD CAPACITANCE
Propagation Delay Time t
PHL
, t
PLH
(ns)
Forward Current I
F
(mA)
Pulse Width Distortion t
PLH
– t
PHL
(ns)
Ambient Temperature T
A
(°C)
Pulse Width Distortion t
PLH
– t
PHL
(ns)
Ambient Temperature T
A
(°C)
PULSE WIDTH DISTORTION
vs. FORWARD CURRENT
PROPAGATION DELAY TIME
vs. FORWARD CURRENT
PULSE WIDTH DISTORTION
vs. AMBIENT TEMPERATURE
5101520
V
CC
= 20 V,
C
L
= 100 pF
0
100
200
300
400
500
600
t
PHL
t
PLH
25 5101520250
10
80
40
90
100
20
30
70
50
60
V
CC
= 20 V,
C
L
= 100 pF
–50 25 75 100
V
CC
= 20 V,
I
F
= 10 0 mA,
C
L
= 100 pF
0
100
200
300
400
500
600
t
PHL
t
PLH
–25 0 50 –50 –25 0 25 50
100
90
80
70
60
50
40
30
20
10
075 100
V
CC
= 20 V,
I
F
= 10 0 mA,
C
L
= 100 pF
0
100
200
300
400
500
600
100 200 300 400 500
t
PHL
t
PLH
V
CC
= 20 V,
I
F
= 10 0 mA
Remark The graphs indicate nominal characteristics.
Data Sheet PN10694EJ04V0DS 9
PS9303L,PS9303L2
TAPING SPECIFICATIONS (UNIT: mm)
PS9303L-E3
330±2.0
100±1.0
2.0±0.5
13.0±0.2
R 1.0 21.0±0.8
2.0±0.5
17.5±1.0
21.5±1.0
2.0±0.1
4.0±0.1
5.08±0.1
8.0±0.1
1.5
+0.1
–0
1.75±0.1
4.5 MAX.
7.5±0.1
10.2±0.1
16.0±0.3
0.35
1.5
+0.1
–0
4.05±0.1
Outline and Dimensions (Tape)
Tape Direction
Outline and Dimensions (Reel)
Packing: 2 000 pcs/reel
15.9 to 19.4
Outer edge of
flange
<R>
Data Sheet PN10694EJ04V0DS
10
PS9303L,PS9303L2
PS9303L2-E3
330±2.0
100±1.0
2.0±0.5
13.0±0.2
R 1.0 21.0±0.8
2.0±0.5
25.5±1.0
29.5±1.0
2.0±0.1
4.0±0.1
5.08±0.1
8.0±0.1
2.0
+0.1
–0
1.5
+0.1
–0
4.05±0.1 1.75±0.1
4.5 MAX.
0.35
11.5±0.1
Outline and Dimensions (Tape)
Outline and Dimensions (Reel)
Tape Direction
Packing: 2 000 pcs/reel
23.9 to 27.4
Outer edge of
flange
24.0±0.3
12.0±0.1
Data Sheet PN10694EJ04V0DS 11
PS9303L,PS9303L2
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
Part Number
PS9303L
PS9303L2
Lead Bending A
lead bending type (Gull-wing)
for long creepage distance (surface mount)
lead bending type (Gull-wing)
for surface mount 8.2
10.2
B
1.27
1.27
C
0.8
0.8
D
2.2
2.2
D
CB
A
<R>
Data Sheet PN10694EJ04V0DS
12
PS9303L,PS9303L2
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
Peak reflow temperature 260°C or below (package surface temperature)
Time of peak reflow temperature 10 seconds or less
Time of temperature higher than 220°C 60 seconds or less
Time to preheat temperature from 120 to 180°C 120±30 s
Number of reflows Three
Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220°C
180°C
Package Surface Temperature T (°C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260°C MAX.
120°C
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
Number of times One (Allowed to be dipped in solder including plastic mold portion.)
Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
Peak temperature (lead part temperature) 350°C or below
Time (each pins) 3 seconds or less
Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
<R>
Data Sheet PN10694EJ04V0DS 13
PS9303L,PS9303L2
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between VCC
and GND at startup, the output side may enter the on state, even if the voltage is within the absolute maximum
ratings.
Data Sheet PN10694EJ04V0DS
14
PS9303L,PS9303L2
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter Symbol Spec. Unit
Climatic test class (IEC 60068-1/DIN EN 60068-1) 40/100/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.5 × UIORM, Pd < 5 pC
UIORM
Upr
1 130
1 695
Vpeak
Vpeak
Test voltage (partial discharge test, procedure b for all devices)
Upr = 1.875 × UIORM, Pd < 5 pC
Upr 2 119 Vpeak
Highest permissible overvoltage UTR 8 000 Vpeak
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1) 2
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11)) CTI 175
Material group (DIN EN 60664-1 VDE0110 Part 1) III a
Storage temperature range Tstg –55 to +125 °C
Operating temperature range TA –40 to +100 °C
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
VIO = 500 V dc at TA MAX. at least 100°C
Ris MIN.
Ris MIN.
1012
1011
Ω
Ω
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Current (input current IF, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
VIO = 500 V dc at TA = Tsi
Tsi
Isi
Psi
Ris MIN.
175
400
700
109
°C
mA
mW
Ω
<R>
Data Sheet PN10694EJ04V0DS 15
PS9303L,PS9303L2
The information in this document is current as of September, 2009. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets, etc., for the most up-to-date specifications of NEC Electronics products. Not all products
and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
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(Note)
M8E0904E
(1)
(2)
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
"Standard":
"Special":
"Specific":
PS9303L,PS9303L2
Caution GaAs Products This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
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and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by
you or third parties arising from the use of these circuits, software, or information.
5. When exporting the products or technology described in this document, you should comply with the applicable export control
laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas
Electronics products or the technology described in this document for any purpose relating to military applications or use by
the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and
technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited
under any applicable domestic or foreign laws or regulations.
6. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics
does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages
incurred by you resulting from errors in or omissions from the information included herein.
7. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and
“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as
indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular
application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior
written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for
which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way
liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an
application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written
consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise
expressly specified in a Renesas Electronics data sheets or data books, etc.
“Standard”: Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-
crime systems; safety equipment; and medical equipment not specifically designed for life support.
“Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or
systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare
intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.
8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or
damages arising out of the use of Renesas Electronics products beyond such specified ranges.
9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,
Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to
guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a
Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire
control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because
the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system
manufactured by you.
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental
compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable
laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS
Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with
applicable laws and regulations.
11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas
Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this
document or Renesas Electronics products, or if you have any other inquiries.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-
owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.