MMSZ5221BT1 Series Zener Voltage Regulators 500 mW SOD-123 Surface Mount Three complete series of Zener diodes are offered in the convenient, surface mount plastic SOD-123 package. These devices provide a convenient alternative to the leadless 34-package style. http://onsemi.com Specification Features: * * * * * * 500 mW Rating on FR-4 or FR-5 Board Wide Zener Reverse Voltage Range - 2.4 V to 110 V Package Designed for Optimal Automated Board Assembly Small Package Size for High Density Applications General Purpose, Medium Current ESD Rating of Class 3 (>16 KV) per Human Body Model 1 Cathode 2 Anode 2 Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic case FINISH: Corrosion resistant finish, easily solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 1 SOD-123 CASE 425 STYLE 1 260C for 10 Seconds POLARITY: Cathode indicated by polarity band FLAMMABILITY RATING: UL94 V-0 MARKING DIAGRAM AA AA AA MAXIMUM RATINGS Rating Symbol Total Power Dissipation on FR-5 Board, (Note 1) @ TL = 75C Derated above 75C PD Max Unit 500 6.7 mW mW/C Thermal Resistance Junction to Ambient (Note 2) RJA 340 C/W Thermal Resistance Junction to Lead (Note 2) RJL 150 C/W TJ, Tstg -55 to +150 C Junction and Storage Temperature Range 1. FR-5 = 3.5 X 1.5 inches, using the On minimum recommended footprint 2. Thermal Resistance measurement obtained via infrared Scan Method xx M xx M = Specific Device Code = Date Code ORDERING INFORMATION Device Package Shipping MMSZ52xxBT1 SOD-123 3000/Tape & Reel MMSZ52xxBT3 SOD-123 10,000/Tape & Reel DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet. Devices listed in bold, italic are ON Semiconductor Preferred devices. Preferred devices are recommended choices for future use and best overall value. The "T1" suffix refers to an 8 mm, 7 inch reel. The "T3" suffix refers to an 8 mm, 13 inch reel. Semiconductor Components Industries, LLC, 2003 January, 2003 - Rev. 3 1 Publication Order Number: MMSZ5221BT1/D MMSZ5221BT1 Series ELECTRICAL CHARACTERISTICS (TA = 25C unless I otherwise noted, VF = 0.95 V Max. @ IF = 10 mA) Symbol IF Parameter VZ Reverse Zener Voltage @ IZT IZT Reverse Current ZZT Maximum Zener Impedance @ IZT IZK Reverse Current ZZK Maximum Zener Impedance @ IZK IR Reverse Leakage Current @ VR VR Reverse Voltage IF Forward Current VF Forward Voltage @ IF VZ VR IR VF IZT Zener Voltage Regulator http://onsemi.com 2 V MMSZ5221BT1 Series ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA) Zener Voltage (Notes 3 and 4) VZ (Volts) @ IZT Zener Impedance (Note 5) ZZT @ IZT Leakage Current ZZK @ IZK IR @ VR Device Device Marking Min Nom Max mA mA A Volts MMSZ5221BT1 MMSZ5222BT1 MMSZ5223BT1 MMSZ5224BT1 MMSZ5225BT1 C1 C2 C3 C4 C5 2.28 2.38 2.57 2.66 2.85 2.4 2.5 2.7 2.8 3.0 2.52 2.63 2.84 2.94 3.15 20 20 20 20 20 30 30 30 30 29 1200 1250 1300 1400 1600 0.25 0.25 0.25 0.25 0.25 100 100 75 75 50 1 1 1 1 1 MMSZ5226BT1 MMSZ5227BT1 MMSZ5228BT1 MMSZ5229BT1 MMSZ5230BT1 D1 D2 D3 D4 D5 3.14 3.42 3.71 4.09 4.47 3.3 3.6 3.9 4.3 4.7 3.47 3.78 4.10 4.52 4.94 20 20 20 20 20 28 24 23 22 19 1600 1700 1900 2000 1900 0.25 0.25 0.25 0.25 0.25 25 15 10 5 5 1 1 1 1 2 MMSZ5231BT1 MMSZ5232BT1 MMSZ5233BT1 MMSZ5234BT1 MMSZ5235BT1 E1 E2 E3 E4 E5 4.85 5.32 5.70 5.89 6.46 5.1 5.6 6.0 6.2 6.8 5.36 5.88 6.30 6.51 7.14 20 20 20 20 20 17 11 7 7 5 1600 1600 1600 1000 750 0.25 0.25 0.25 0.25 0.25 5 5 5 5 3 2 3 3.5 4 5 MMSZ5236BT1 MMSZ5237BT1 MMSZ5238BT1 MMSZ5239BT1 MMSZ5240BT1 F1 F2 F3 F4 F5 7.13 7.79 8.27 8.65 9.50 7.5 8.2 8.7 9.1 10 7.88 8.61 9.14 9.56 10.50 20 20 20 20 20 6 8 8 10 17 500 500 600 600 600 0.25 0.25 0.25 0.25 0.25 3 3 3 3 3 6 6.5 6.5 7 8 MMSZ5241BT1 MMSZ5242BT1 MMSZ5243BT1 MMSZ5244BT1 MMSZ5245BT1 H1 H2 H3 H4 H5 10.45 11.40 12.35 13.30 14.25 11 12 13 14 15 11.55 12.60 13.65 14.70 15.75 20 20 9.5 9.0 8.5 22 30 13 15 16 600 600 600 600 600 0.25 0.25 0.25 0.25 0.25 2 1 0.5 0.1 0.1 8.4 9.1 9.9 10 11 MMSZ5246BT1 MMSZ5247BT1 MMSZ5248BT1 MMSZ5250BT1 J1 J2 J3 J5 15.20 16.15 17.10 19.00 16 17 18 20 16.80 17.85 18.90 21.00 7.8 7.4 7.0 6.2 17 19 21 25 600 600 600 600 0.25 0.25 0.25 0.25 0.1 0.1 0.1 0.1 12 13 14 15 MMSZ5251BT1 MMSZ5252BT1 MMSZ5253BT1 MMSZ5254BT1 MMSZ5255BT1 K1 K2 K3 K4 K5 20.90 22.80 23.75 25.65 26.60 22 24 25 27 28 23.10 25.20 26.25 28.35 29.40 5.6 5.2 5.0 4.6 4.5 29 33 35 41 44 600 600 600 600 600 0.25 0.25 0.25 0.25 0.25 0.1 0.1 0.1 0.1 0.1 17 18 19 21 21 MMSZ5256BT1 MMSZ5257BT1 MMSZ5258BT1 MMSZ5259BT1 MMSZ5260BT1 M1 M2 M3 M4 M5 28.50 31.35 34.20 37.05 40.85 30 33 36 39 43 31.50 34.65 37.80 40.95 45.15 4.2 3.8 3.4 3.2 3.0 49 58 70 80 93 600 700 700 800 900 0.25 0.25 0.25 0.25 0.25 0.1 0.1 0.1 0.1 0.1 23 25 27 30 33 MMSZ5261BT1 MMSZ5262BT1 MMSZ5263BT1 MMSZ5264BT1 MMSZ5265BT1 N1 N2 N3 N4 N5 44.65 48.45 53.20 57.00 58.90 47 51 56 60 62 49.35 53.55 58.80 63.00 65.10 2.7 2.5 2.2 2.1 2.0 105 125 150 170 185 1000 1100 1300 1400 1400 0.25 0.25 0.25 0.25 0.25 0.1 0.1 0.1 0.1 0.1 36 39 43 46 47 MMSZ5266BT1 MMSZ5267BT1 MMSZ5268BT1 MMSZ5269BT1 MMSZ5270BT1 P1 P2 P3 P4 P5 64.60 71.25 77.90 82.65 86.45 68 75 82 87 91 71.40 78.75 86.10 91.35 95.55 1.8 1.7 1.5 1.4 1.4 230 270 330 370 400 1600 1700 2000 2200 2300 0.25 0.25 0.25 0.25 0.25 0.1 0.1 0.1 0.1 0.1 52 56 62 68 69 MMSZ5272BT1 R2 104.5 110 115.5 1.1 750 3000 0.25 0.1 84 3. The type numbers shown have a standard tolerance of 5% on the nominal Zener voltage. 4. Nominal Zener voltage is measured with the device junction in thermal equilibrium at TL = 30C 1C 5. ZZT and ZZK are measured by dividing the AC voltage drop across the device by the ac current applied. The specified limits are for IZ(AC) = 0.1 IZ(dc) with the AC frequency = 1 KHz. http://onsemi.com 3 MMSZ5221BT1 Series VZ, TEMPERATURE COEFFICIENT (mV/C) VZ, TEMPERATURE COEFFICIENT (mV/C) TYPICAL CHARACTERISTICS 8 100 7 TYPICAL TC VALUES FOR MMSZ5221BT1 SERIES 6 5 4 VZ @ IZT 3 2 1 0 -1 -2 -3 2 3 4 5 6 7 8 9 10 VZ, NOMINAL ZENER VOLTAGE (V) 11 12 TYPICAL TC VALUES FOR MMSZ5221BT1 SERIES VZ @ IZT 10 1 10 100 VZ, NOMINAL ZENER VOLTAGE (V) Figure 1. Temperature Coefficients (Temperature Range - 55C to +150C) Figure 2. Temperature Coefficients (Temperature Range - 55C to +150C) 1.2 Ppk, PEAK SURGE POWER (WATTS) 1000 1.0 PD versus TL 0.8 0.6 100 PD versus TA 0.4 0.2 0 0 25 RECTANGULAR WAVEFORM, TA = 25C 50 75 100 T, TEMPERATURE (C) 125 10 1 150 Figure 3. Steady State Power Derating 1 1000 1000 TJ = 25C IZ(AC) = 0.1 IZ(DC) f = 1 kHz IF, FORWARD CURRENT (mA) IZ = 1 mA 100 75 V (MMSZ5267BT1) 91 V (MMSZ5270BT1) 100 5 mA 20 mA 10 10 150C 1 10 100 PW, PULSE WIDTH (ms) Figure 4. Maximum Nonrepetitive Surge Power 1000 ZZT, DYNAMIC IMPEDANCE () 0.1 75C 25C 0C 1 1 10 VZ, NOMINAL ZENER VOLTAGE 100 0.4 Figure 5. Effect of Zener Voltage on Zener Impedance 0.5 0.6 0.7 0.8 0.9 1.0 VF, FORWARD VOLTAGE (V) Figure 6. Typical Forward Voltage http://onsemi.com 4 1.1 1.2 MMSZ5221BT1 Series IR, LEAKAGE CURRENT (A) TYPICAL CHARACTERISTICS 1000 TA = 25C C, CAPACITANCE (pF) 0 V BIAS 1 V BIAS 100 BIAS AT 50% OF VZ NOM 10 1 1 10 VZ, NOMINAL ZENER VOLTAGE (V) 100 1000 100 10 1 +150C 0.1 0.01 0.001 + 25C 0.0001 - 55C 0.00001 0 10 Figure 7. Typical Capacitance 20 30 40 50 60 70 VZ, NOMINAL ZENER VOLTAGE (V) Figure 8. Typical Leakage Current 100 100 TA = 25C IZ, ZENER CURRENT (mA) IZ, ZENER CURRENT (mA) TA = 25C 10 1 0.1 0.01 80 10 1 0.1 0.01 0 2 4 6 8 VZ, ZENER VOLTAGE (V) 10 10 12 30 50 70 VZ, ZENER VOLTAGE (V) 90 Figure 10. Zener Voltage versus Zener Current (12 V to 91 V) Figure 9. Zener Voltage versus Zener Current (VZ Up to 12 V) http://onsemi.com 5 90 MMSZ5221BT1 Series INFORMATION FOR USING THE SOD-123 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINTS FOR SURFACE MOUNT APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection interface between the board and the package. The minimum recommended footprint for the SOD-123 is shown at the right. The SOD-123 package can be used on existing surface mount boards which have been designed for the leadless 34 package style. The footprint compatibility makes conversion from leadless 34 to SOD-123 straightforward. 0.91 0.036 2.36 0.093 4.19 0.165 EEEE EEEE EEEE EEEE 1.22 0.048 mm inches Figure 11. Minimum Recommended Footprint SOD-123 POWER DISSIPATION into the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 0.37 watts. The power dissipation of the SOD-123 is a function of the pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet for the SOD-123 package, PD can be calculated as follows: PD = PD = 150C - 25C = 0.37 watts 340C/W The 340C/W for the SOD-123 package assumes using recommended footprint shown on FR-4 glass epoxy printed circuit board. Another alternative is to use a ceramic substrate or an aluminum core board such as Thermal Clad. By using an aluminum core board material such as Thermal Clad, the power dissipation can be doubled using the same footprint. TJ(max) - TA RJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values GENERAL SOLDERING PRECAUTIONS * The soldering temperature and time shall not exceed 260C for more than 10 seconds. * When shifting from preheating to soldering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. http://onsemi.com 6 MMSZ5221BT1 Series PACKAGE DIMENSIONS Zener Voltage Regulators - Surface Mounted 500 mW SOD-123 SOD-123 CASE 425-04 ISSUE C A AAAA AAAA C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. H 1 K DIM A B C D E H J K B E 2 D J http://onsemi.com 7 INCHES MIN MAX 0.055 0.071 0.100 0.112 0.037 0.053 0.020 0.028 0.01 --- 0.000 0.004 --- 0.006 0.140 0.152 STYLE 1: PIN 1. CATHODE 2. ANODE MILLIMETERS MIN MAX 1.40 1.80 2.55 2.85 0.95 1.35 0.50 0.70 0.25 --- 0.00 0.10 --- 0.15 3.55 3.85 MMSZ5221BT1 Series Thermal Clad is a registered trademark of the Bergquist Company ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com JAPAN: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. N. American Technical Support: 800-282-9855 Toll Free USA/Canada http://onsemi.com 8 MMSZ5221BT1/D