SN74LVC2G74-Q1 www.ti.com ........................................................................................................................................................ SCES563C - MARCH 2004 - REVISED APRIL 2008 SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET FEATURES 1 * * * * * * * * * * Qualified for Automotive Applications Supports 5-V VCC Operation Inputs Accept Voltages to 5.5 V Max tpd of 6.9 ns at 3.3 V Low Power Consumption, 10-A Max ICC 24-mA Output Drive at 3.3 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25C Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25C Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II * ESD Protection Exceeds JESD 22 - 2000-V Human-Body Model (A114-A) - 200-V Machine Model (A115-A) - 1000-V Charged-Device Model (C101) DCU PACKAGE (TOP VIEW) CLK D Q GND 1 8 VCC 2 7 3 6 4 5 PRE CLR Q DESCRIPTION/ORDERING INFORMATION This single positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation. A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION (1) TA -40C to 125C (1) (2) (3) PACKAGE (2) VSSOP - DCU Reel of 3000 ORDERABLE PART NUMBER SN74LVC2G74QDCURQ1 TOP-SIDE MARKING (3) C74_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DCU: The actual top-side marking has one additional character that designates the wafer fab/assembly site. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2004-2008, Texas Instruments Incorporated SN74LVC2G74-Q1 SCES563C - MARCH 2004 - REVISED APRIL 2008 ........................................................................................................................................................ www.ti.com FUNCTION TABLE INPUTS (1) OUTPUTS PRE CLR CLK D Q Q L H X X H L H L X X L H L L X X H (1) H (1) H H H H L H H L L H H H L X Q0 Q0 This configuration is nonstable; that is, it does not persist when PRE or CLR returns to its inactive (high) level. LOGIC DIAGRAM (POSITIVE LOGIC) PRE CLK 7 1 C C C 5 Q TG C C C C D 2 TG TG TG 3 C CLR 2 C Q C 6 Submit Documentation Feedback Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): SN74LVC2G74-Q1 SN74LVC2G74-Q1 www.ti.com ........................................................................................................................................................ SCES563C - MARCH 2004 - REVISED APRIL 2008 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VCC Supply voltage range VI Input voltage range (2) (2) MIN MAX -0.5 6.5 -0.5 6.5 -0.5 6.5 -0.5 VCC + 0.5 VO Voltage range applied to any output in the high-impedance or power-off state VO Voltage range applied to any output in the high or low state (2) (3) IIK Input clamp current VI < 0 -50 IOK Output clamp current VO < 0 -50 IO Continuous output current 50 Continuous current through VCC or GND JA Package thermal impedance Tstg Storage temperature range (1) (2) (3) (4) UNIT V mA 100 (4) -65 227 C/W 150 C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): SN74LVC2G74-Q1 Submit Documentation Feedback 3 SN74LVC2G74-Q1 SCES563C - MARCH 2004 - REVISED APRIL 2008 ........................................................................................................................................................ www.ti.com Recommended Operating Conditions (1) VCC Supply voltage Operating Data retention only High-level input voltage MAX 1.65 5.5 1.5 VCC = 2.3 V to 2.7 V 1.7 VCC = 3 V to 3.6 V 0.7 x VCC 0.35 x VCC VCC = 1.65 V to 1.95 V Low-level input voltage V V 2 VCC = 4.5 V to 5.5 V VIL UNIT 0.65 x VCC VCC = 1.65 V to 1.95 V VIH MIN VCC = 2.3 V to 2.7 V 0.7 VCC = 3 V to 3.6 V 0.8 V 0.3 x VCC VCC = 4.5 V to 5.5 V VI Input voltage 0 5.5 V VO Output voltage 0 VCC V VCC = 1.65 V -4 VCC = 2.3 V IOH High-level output current -8 -16 VCC = 3 V VCC = 4.5 V -24 VCC = 1.65 V 4 VCC = 2.3 V IOL Low-level output current t/v Input transition rise or fall rate 8 16 VCC = 3 V (1) 4 mA 24 VCC = 4.5 V 24 VCC = 1.8 V 0.15 V, 2.5 V 0.2 V 20 VCC = 3.3 V 0.3 V 10 VCC = 5 V 0.5 V TA mA -24 ns/V 5 Operating free-air temperature -40 125 C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): SN74LVC2G74-Q1 SN74LVC2G74-Q1 www.ti.com ........................................................................................................................................................ SCES563C - MARCH 2004 - REVISED APRIL 2008 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC IOH = -100 A VOH 1.65 V to 5.5 V 1.65 V 1.2 IOH = -8 mA 2.3 V 1.85 IOH = -16 mA 3V 2.4 3V 2.3 4.5 V 3.8 IOL = 100 A Data or control inputs 0.1 IOL = 4 mA 1.65 V 0.45 IOL = 8 mA 2.3 V 0.3 IOL = 16 mA 3V 0.4 3V 0.55 4.5 V 0.55 VI or VO = 5.5 V ICC VI = 5.5 V or GND, IO = 0 ICC One input at VCC - 0.6 V, Other inputs at VCC or GND Ci VI = VCC or GND (1) V 0 to 5.5 V 5 A 0 10 A 1.65 V to 5.5 V 10 A 3 V to 5.5 V 500 A VI = 5.5 V or GND Ioff UNIT V 1.65 V to 5.5 V IOL = 24 mA II TYP (1) MAX VCC - 0.1 IOH = -4 mA IOH = -24 mA VOL MIN 3.3 V 5 pF All typical values are at VCC = 3.3 V, TA = 25C. Timing Requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) VCC = 1.8 V 0.15 V VCC = 2.5 V 0.2 V MIN MAX fclock MIN MAX 80 tw Pulse duration tsu Setup time before CLK th Hold time, data after CLK VCC = 3.3 V 0.3 V MIN 120 VCC = 5 V 0.5 V MAX UNIT MIN MAX 120 140 CLK 6.2 3.5 3.5 3.3 PRE or CLR low 6.2 3.5 3.5 3.3 Data 3.5 2.3 1.9 1.7 PRE or CLR inactive 2.5 2 1.8 1.6 0 0.3 0.5 0.8 MHz ns ns ns Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) fmax tpd VCC = 1.8 V 0.15 V MIN MAX 80 CLK PRE or CLR VCC = 2.5 V 0.2 V VCC = 3.3 V 0.3 V VCC = 5 V 0.5 V MIN MIN MIN MAX MAX 120 MAX 120 140 MHz Q 4.8 14.4 2.2 8.1 2.2 6.9 1.4 5.1 Q 6 16 3 9.7 2.6 7.2 1.6 5.4 4.4 14.9 2.3 9.5 1.7 7.9 1.6 6.1 Q or Q Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): SN74LVC2G74-Q1 UNIT Submit Documentation Feedback ns 5 SN74LVC2G74-Q1 SCES563C - MARCH 2004 - REVISED APRIL 2008 ........................................................................................................................................................ www.ti.com Operating Characteristics TA = 25C PARAMETER Cpd 6 Power dissipation capacitance Submit Documentation Feedback TEST CONDITIONS f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V TYP TYP TYP TYP 35 35 37 40 UNIT pF Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): SN74LVC2G74-Q1 SN74LVC2G74-Q1 www.ti.com ........................................................................................................................................................ SCES563C - MARCH 2004 - REVISED APRIL 2008 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test Open TEST GND CL (see Note A) S1 Open VLOAD tPLH/tPHL tPLZ/tPZL tPHZ/tPZH RL GND LOAD CIRCUIT INPUTS VCC 1.8 V 0.15 V 2.5 V 0.2 V 3.3 V 0.3 V 5 V 0.5 V VI tr/tf VCC VCC 3V VCC 2 ns 2 ns 2.5 ns 2.5 ns VM VLOAD CL RL VD VCC/2 VCC/2 1.5 V VCC/2 2 x VCC 2 x VCC 6V 2 x VCC 30 pF 30 pF 50 pF 50 pF 1 kW 500 W 500 W 500 W 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tW tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VOH VM VOL tPHL VM VM 0V tPLZ Output Waveform 1 S1 at VLOAD (see Note B) tPLH VLOAD/2 VM tPZH VOH Output VM tPZL tPHL VM Output VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + VD VOL tPHZ VM VOH - VD VOH 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 W. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): SN74LVC2G74-Q1 Submit Documentation Feedback 7 PACKAGE OPTION ADDENDUM www.ti.com 4-Mar-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CLVC2G74QDCURG4Q1 ACTIVE US8 DCU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC2G74QDCURQ1 ACTIVE US8 DCU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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