www.vishay.com For technical questions, contact: thickfilmchip@vishay.com Document Number: 20043
174 Revision: 08-Dec-10
CRCW-HP e3
Vishay Draloric Pulse Proof, High Power Thic k Film Chip Resistors
All tests are carried out in accordance with the following specifications:
•EN 60115-1, generic specification
•EN 140400, sectional specification
•EN 140401-802, detail specification
•IEC 60068-2, environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE
CHANGE (ΔR)
STABILITY CLASS 2 OR BETTER
Stability for product types: 1 Ω to 1 MΩ
CRCW-HP e3
4.5 - Resistance - ± 1 %, ± 5 %
4.7 - Voltage proof U = 1.4 x Uins; 60 s -
4.13 - Short time overload ≤ 2 × Umax.; duration: According to style ± (0.5 % R + 0.05 Ω)
4.17.2 58 (Td) Solderability
Solder bath method; Sn60Pb40;
non-activated flux; (235 ± 5) °C; (2 ± 0.2) s Good tinning (≥ 95 % covered)
no visible damage
Solder bath method; Sn96.5Ag3Cu0.5;
non-activated flux; (245 ± 5) °C; (3 ± 0.3) s Good tinning (≥ 95 % covered)
no visible damage
4.8.4.2 - Temperature coefficient (20/- 55/20) °C and (20/125/20) °C ± 100 ppm/K, ± 200 ppm/K
4.32 21 (UU3) Shear (adhesion) RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N No visible damage
4.33 21 (UU1) Substrate bending Depth 2 mm; 3 times No visible damage,
no open circuit in bent position
± (0.25 % R + 0.05 Ω)
4.19 14 (Na) Rapid change of temperature 30 min. at - 55 °C; 30 min at 125 °C
5 cycles
1000 cycles ± (0.5 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
4.23 - Dry heat -
± (2 % R + 0.1 Ω)
4.23.2 2 (Ba) Damp heat, cyclic 125 °C; 16 h
4.23.3 30 (Db) cold 55 °C; ≥ 90 % RH; 24 h; 1 cycle
4.23.4 1 (Aa) Low air pressure - 55 °C; 2 h
4.23.5 13 (M) - 1 kPa; (25 ± 10) °C; 1 h
4.23.6 30 (Db) Damp heat, cyclic 55 °C; ≥ 90 % RH; 24 h; 5 cycle
4.23.7 - D.C. load
4.25.1 - Endurance at 70 °C 1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h ± (2 % R + 0.1 Ω)
± (4 % R + 0.1 Ω)
4.18.2 58 (Td) Resistance to soldering heat Solder bath method; (260 ± 5) °C; (10 ± 1) s ± (0.5 % R + 0.05 Ω)
4.35 - Flammability, needle flame test IEC 60695-15-5; 10 s No burning after 30 s
4.24 78 (Cab) Damp heat, steady state (40 ± 2) °C; (93 ± 3) % RH; 56 days ± (1 % R + 0.05 Ω)
4.25.3 - Endurance at
upper category temperature 155 °C; 1000 h ± (2 % R + 0.1 Ω)
4.40 - Electrostatic discharge
(human body model) IEC 61340-3-1; 3 positive and 3 negative
discharges; ESD voltage according to size ± (1 % R + 0.05 Ω)
4.29 45 (XA) Component solvent resistance Isopropyl alcohol; 50 °C; method 2 No visible damage
4.30 45 (XA) Solvent resistance of marking Isopropyl alcohol; 50 °C; method 1;
toothbrush Marking legible,
no visible damage
4.22 6 (Fc) Vibration, endurance by sweeping f = 10 Hz to 2000 Hz; x, y, z ≤ 1.5 mm;
A ≤ 200 m/s2; 10 sweeps per axis ± (0.5 % R + 0.05 Ω)
4.37 - Periodic electric overload 0.1 s “ON”; 2.5 s “OFF”; 1000 cycles ± (1 % R + 0.05 Ω)
4.27 - Single pulse high voltage overload,
10 µs/700 µs 10 pulses ± (1 % R + 0.05 Ω)