© Semiconductor Components Industries, LLC, 2013
November, 2013 − Rev. 1
1Publication Order Number:
MBR560MFS/D
MBR560MFS, NRVB560MFS
SWITCHMODE
Power Rectifiers
These state−of−the−art devices have the following features:
Features
•Low Power Loss / High Efficiency
•New Package Provides Capability of Inspection and Probe After
Board Mounting
•Guardring for Stress Protection
•Low Forward Voltage Drop
•175°C Operating Junction Temperature
•NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
•Wettable Flanks Option available
•These are Pb−Free Devices
Mechanical Characteristics:
•Case: Epoxy, Molded
•Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.
•Lead Finish: 100% Matte Sn (Tin)
•Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•Device Meets MSL 1 Requirements
•The Heat Generated must be less than the Thermal Conductivity
from Junction−to−Ambient: dPD/dTJ < 1/RJA
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR60
V
Average Rectified Forward Current
(Rated VR, TC = 160°C)
IF(AV) 5.0 A
Peak Repetitive Forward Current,
(Rated VR, Square Wave,
20 kHz, TC = 165°C)
IFRM 10 A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load
Conditions Halfwave, Single
Phase, 60 Hz)
IFSM 100 A
Storage Temperature Range Tstg −65 to +175 °C
Operating Junction Temperature TJ−55 to +175 °C
Unclamped Inductive Switching
Energy (10 mH Inductor,
Non−repetitive)
EAS 10 mJ
ESD Rating (Human Body Model) 3B
ESD Rating (Machine Model) M4
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Device Package Shipping†
ORDERING INFORMATION
MBR560MFST1G SO−8 FL
(Pb−Free)
1500 /
Tape & Reel
SCHOTTKY BARRIER
RECTIFIERS
5 AMPERES
60 VOLTS
http://onsemi.com
1,2,3 5,6
SO−8 FLAT LEAD
CASE 488AA
STYLE 2
B560 = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
MARKING
DIAGRAM
B560
AYWZZ
A
A
A
Not Used
C
C
1
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
MBR560MFST3G SO−8 FL
(Pb−Free)
5000 /
Tape & Reel
NRVB560MFST1G SO−8 FL
(Pb−Free)
1500 /
Tape & Reel
NRVB560MFST3G SO−8 FL
(Pb−Free)
5000 /
Tape & Reel
MBR560MFS, NRVB560MFS
http://onsemi.com
2
THERMAL CHARACTERISTICS
Characteristic Symbol Typ Max Unit
Thermal Resistance, Junction−to−Case, Steady State
(Assumes 600 mm2 1 oz. copper bond pad, on a FR4 board)
RθJC −2.4 °C/W
ELECTRICAL CHARACTERISTICS
Instantaneous Forward Voltage (Note 1)
(iF = 5 Amps, TJ = 100°C)
(iF = 5 Amps, TJ = 25°C)
vF
0.60
0.65
0.72
0.78
V
Instantaneous Reverse Current (Note 1)
(Rated dc Voltage, TJ = 100°C)
(Rated dc Voltage, TJ = 25°C)
iR
1.5
0.015
2.5
0.150
mA
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤2.0%.
MBR560MFS, NRVB560MFS
http://onsemi.com
3
TYPICAL CHARACTERISTICS
Figure 1. Typical Instantaneous Forward
Characteristics
Figure 2. Maximum Instantaneous Forward
Characteristics
VF
, INSTANTANEOUS FORWARD VOLTAGE (V) VF
, INSTANTANEOUS FORWARD VOLTAGE (V)
0.60.50.40.30.20.10
0.1
1
10
0.80.50.40.30.20.10
0.1
1
10
Figure 3. Typical Reverse Characteristics Figure 4. Maximum Reverse Characteristics
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
503020100
1.E+00
Figure 5. Typical Junction Capacitance Figure 6. Current Derating TO−220AB
VR, REVERSE VOLTAGE (V) TC, CASE TEMPERATURE (°C)
603020100
10
100
1000
1601401201008060
0
1
3
4
5
7
9
10
iF
, INSTANTANEOUS FORWARD
CURRENT (A)
iF
, INSTANTANEOUS FORWARD
CURRENT (A)
IR, INSTANTANEOUS REVERSE CURRENT (A)C, JUNCTION CAPACITANCE (pF)
IF(AV), AVERAGE FORWARD CURRENT (A)
0.7
TA = 175°C
TA = 100°C
TA = 150°C
TA = −40°C
TA = 25°C
0.6 0.7
TA = 175°C
TA = 100°C
TA = 150°C
TA = −40°C
TA = 25°C
1.E−01
1.E−02
1.E−03
1.E−04
1.E−05
1.E−06
1.E−07
1.E−08
1.E−09
1.E−10
TA = 175°C
TA = 150°C
TA = 100°C
TA = −40°C
TA = 25°C
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
30 4020 50100
1.E+00
IR, INSTANTANEOUS REVERSE CURRENT (A)
1.E−01
1.E−02
1.E−03
1.E−04
1.E−05
1.E−06
1.E−07
1.E−08
1.E−09
40 60
TJ = 25°C
2
6
8
RqJC = 2.4°C/W
Square Wave
DC
60
40 50
TA = 175°C
TA = 150°C
TA = 100°C
TA = −40°C
TA = 25°C
MBR560MFS, NRVB560MFS
http://onsemi.com
4
TYPICAL CHARACTERISTICS
Figure 7. Forward Power Dissipation
IF(AV), AVERAGE FORWARD CURRENT (A)
43210
0
1
2
3
4
6
7
8
Figure 8. Thermal Characteristics
PULSE TIME (sec)
1100.10.010.0010.00010.000010.000001
0.01
0.1
1
10
100
PF(AV), AVERAGE FORWARD
POWER DISSIPATION (W)
R(t) (°C/W)
100 1000
5
TJ = 175°C
Square Wave
DC
IPK/IAV = 5
IPK/IAV = 10IPK/IAV = 20
50% Duty Cycle
Single Pulse
20%
10%
5%
2%
1%
Assumes 25°C ambient and soldered to
a 600 mm2 − oz copper pad on PCB
MBR560MFS, NRVB560MFS
http://onsemi.com
5
PACKAGE DIMENSIONS
M3.00 3.40
q0 −−−
_
3.80
12
_
DFN5 5x6, 1.27P
(SO−8FL)
CASE 488AA
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION D1 AND E1 DO NOT INCLUDE
MOLD FLASH PROTRUSIONS OR GATE
BURRS.
1234
TOP VIEW
SIDE VIEW
BOTTOM VIEW
D1
E1 q
D
E
2
2
B
A
0.20 C
0.20 C
2 X
2 X
DIM MIN NOM
MILLIMETERS
A0.90 1.00
A1 0.00 −−−
b0.33 0.41
c0.23 0.28
D5.15 BSC
D1 4.50 4.90
D2 3.50 −−−
E6.15 BSC
E1 5.50 5.80
E2 3.45 −−−
e1.27 BSC
G0.51 0.61
K1.20 1.35
L0.51 0.61
L1 0.05 0.17
A
0.10 C
0.10 C
DETAIL A
14
L1
e/2
8X
D2
G
E2
K
b
A0.10 B
C
0.05 cL
DETAIL A
A1
e
3 X
c
4 X
C
SEATING
PLANE
MAX
1.10
0.05
0.51
0.33
5.10
4.22
6.10
4.30
0.71
1.50
0.71
0.20
M
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
1.270
2X
0.750
1.000
0.905
0.475
4.530
1.530
4.560
0.495
3.200
1.330
0.965
2X
2X
3X 4X
4X
PIN 5
(EXPOSED PAD)
STYLE 2:
PIN 1. ANODE
2. ANODE
3. ANODE
4. NO CONNECT
5. CATHODE
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
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does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
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PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
MBR560MFS/D
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