Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS Product information in this catalog is as of October 2011. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products. Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this catalog or individual specification. Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is available. Please conduct validation and verification of products in actual condition of mounting and operating environment before commercial shipment of the equipment. All electronic components or functional modules listed in this catalog are developed, designed and intended for use in general electronics equipment.(for AV, office automation, household, office supply, information service, telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance. Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, submarine system, military, etc. where higher safety and reliability are especially required. In addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. The contents of this catalog are applicable to the products which are purchased from our sales offices or distributors (so called"TAIYO YUDEN' s official sales channel"). It is only applicable to the products purchased from any of TAIYO YUDEN's official sales channel. Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights. Caution for export Certain items in this catalog may require specific procedures for export according to"Foreign Exchange and Foreign Trade Control Law"of Japan,"U.S. Export Administration Regulations", and other applicable regulations. Should you have any question or inquiry on this matter, please contact our sales staff. 12 notice_e-01 ARRAY TYPE MULTILAYER CERAMIC CAPACITORS REFLOW FEATURES APPLICATIONS High density and high efficiency mounting. General electronic equipment Internal electrodes are composed of nickel for improved cost performance and reliability. Communication equipment (cellular phone, wireless applications, etc.) PART NUMBER E 4 K 2 1 2 B J 1 4 M D T 0 End Temperature Rated Dimension termination characteristics voltageVDC Type inch LxW mm code K Plated A 4 096 0302 0.9x0.6 B BJ J 6.3 110 0504 1.37x1.0 X5R L 10 212 0805 2.0x1.25 B7 X7R E 16 CH Series name Dimension tolerance CH T 25 C0H 2 circuits Standard 2 U 50 multilayer capacitor Blank space 4 circuits 4 multilayer capacitor Thickness mm P 0.3 K 0.45 V 0.5 B 0.6 A 0.8 D 0.85 Capacitance tolerance F 1pF K 10% M 20% Nominal capacitance pF example 104 100,000 105 1,000,000 Internal code Standard Blank space Special code Standard T F Packaging 178mm Taping 4mm pitch 0504, 0805 Type 178mm Taping 2mm pitch 0302 Type STANDARD EXTERNAL DIMENSIONS/STANDARD QUANTITY Dimension [mm] E2 W L Type T L W E1 E2 P 2K096 0302 inch 0.90.05 0.60.05 0.230.10 0.1250.075 0.450.05 2K110 0504 inch 1.370.07 1.000.08 0.360.10 0.20.10 0.640.10 2.000.10 1.250.10 0.500.20 0.250.15 2.000.10 1.250.10 0.250.10 0.250.15 P K V B A 0.300.03 0.450.05 0.500.05 0.600.06 0.800.08 1.000.10 D 0.500.10 D E1 P W L E2 T 2K212 0805 inch 4K212 0805 inch Standard quantity [pcs] Embossed Paper tape tape T 10000 4000 0.850.10 4000 0.850.10 4000 E1 P AVAILABLE CAPACITANCE RANGE BJ/B7 Cap [F] 0.001 0.0022 0.0047 0.01 0.022 0.047 0.1 0.22 0.47 1.0 2.2 CH Type VDC [3-digit] 102 222 472 103 223 473 104 224 474 105 225 096 2 circuits 2K096 B/X5R X5R 10V 6.3V 4V 110 2 circuits 212 2 circuits 212 4circuits 2K110 4K212 2K212 X7R B/X5R X5R B/X5R X5R X7R B/X5R X5R 50V 25V 16V 50V 25V 16V 10V 16V 10V 6.3V 25V 10V 16V 25V 16V 10V 10V B B B P B B B B B K K K K B B B B B B B D D B A K D D D A A,V V A D D D Letters in the table indicate thickness. Cap [pF] 10 12 15 18 22 27 33 39 47 56 68 82 100 Type VDC [3-digit] 100 120 150 180 220 270 330 390 470 560 680 820 101 096 2 circuits 2K096 CH 25V 110 2 circuits 2K110 CH 50V P P P P P P P P P P P P P B B B B B B B B B B B B B Letters in the table indicate thickness. Temp.char.Code BJ B7 CH Applicable standard JIS B EIA X5R EIA X7R JIS CH EIA C0H Temperature characteristics Temperature range Ref. Temp. 2585 20 5585 25 55125 25 55125 20 55125 25 Capacitance change 10 15 15 60ppm/ 60ppm/ Capacitance tolerance 10K 20M 10K This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 36 12 mlcc08_e-01 REPRESENTATIVE PART NUMBERS 096TYPE 2 circuits type Temperature Characteristic 0.45mm thickness K Rated voltage 6.3V 4V BJB/X5R Part number 1 Part number 2 J2K096 BJ473K J2K096 BJ104K J2K096 BJ224MK J2K096 BJ474MK A2K096 BJ105MK Temp. char. Capacitance F Capacitance tolerance tan % Thickness mm Soldering R:Reflow W:Wave X5R X5R X5R X5R X5R 0.047 0.1 0.22 0.47 1 10, 20 10, 20 20 20 20 5 5 10 10 10 0.450.05 0.450.05 0.450.05 0.450.05 0.450.05 R R R R R Temp. char. Capacitance F Capacitance tolerance tan % Thickness mm Soldering R:Reflow W:Wave B/X5R 0.01 10, 20 5 0.30.03 R Temp. char. Capacitance pF Capacitance tolerance Q Thickness mm Soldering R:Reflow W:Wave CH/C0H CH/C0H CH/C0H CH/C0H CH/C0H CH/C0H CH/C0H CH/C0H CH/C0H CH/C0H CH/C0H CH/C0H CH/C0H 10 12 15 18 22 27 33 39 47 56 68 82 100 1pF 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 600 640 700 760 840 940 1000 1000 1000 1000 1000 1000 1000 0.30.03 0.30.03 0.30.03 0.30.03 0.30.03 0.30.03 0.30.03 0.30.03 0.30.03 0.30.03 0.30.03 0.30.03 0.30.03 R R R R R R R R R R R R R Temp. char. Capacitance F Capacitance tolerance tan % Thickness mm Soldering R:Reflow W:Wave X5R B/X5R X5R X5R 1 0.47 1 2.2 10, 20 10, 20 10, 20 10, 20 10 5 10 10 0.80.08 0.80.08 0.80.08 0.80.08 R R R R Temp. char. Capacitance F Capacitance tolerance tan % Thickness mm Soldering R:Reflow W:Wave B/X5R* B/X5R*1 B/X5R*1 B/X5R*1 B/X5R*1 B/X5R B/X5R*1 B/X5R*1 B/X5R 0.001 0.0022 0.0047 0.01 0.022 0.1 0.047 0.1 0.22 10, 20 10, 20 10, 20 10, 20 10, 20 10, 20 10, 20 10, 20 10, 20 3.5 3.5 3.5 3.5 3.5 5 3.5 5 5 0.60.06 0.60.06 0.60.06 0.60.06 0.60.06 0.60.06 0.60.06 0.60.06 0.60.06 R R R R R R R R R Temp. char. Capacitance F Capacitance tolerance tan % Thickness mm Soldering R:Reflow W:Wave X5R X5R 1 1 20 10, 20 10 10 0.50.05 0.50.05 R R HALT % Rated voltage 150% 150% 150% 150% 150% Internal code P/N 1 Note HALT % Rated voltage 200% Internal code P/N 1 Note HALT % Rated voltage 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% Internal code P/N 1 Note HALT % Rated voltage 150% 200% 150% 150% Internal code P/N 1 Note HALT % Rated voltage 200% 200% 200% 200% 200% 200% 200% 200% 200% Internal code P/N 1 Note HALT % Rated voltage 150% 150% Internal code P/N 1 Note 0.3mm thickness P Part number 1 10V L2K096 BJ103P Part number 2 Capacitance tolerance code is applied to of part number. Temperature Characteristic Rated voltage 25V CHCH/C0H Part number 1 Part number 2 T2K096 CH100FP T2K096 CH120KP T2K096 CH150KP T2K096 CH180KP T2K096 CH220KP T2K096 CH270KP T2K096 CH330KP T2K096 CH390KP T2K096 CH470KP T2K096 CH560KP T2K096 CH680KP T2K096 CH820KP T2K096 CH101KP CAPACITORS Rated voltage Capacitance tolerance code is applied to of part number. 110TYPE 2 circuits type Temperature Characteristic 0.8mm thickness A Rated voltage 16V 10V 6.3V BJB/X5R Part number 1 Part number 2 E2K110 BJ105A L2K110 BJ474A L2K110 BJ105A J2K110 BJ225A 0.6mm thickness B Rated voltage 50V 25V 16V 10V Part number 1 Part number 2 1 U2K110 BJ102B U2K110 BJ222B U2K110 BJ472B T2K110 BJ103B T2K110 BJ223B T2K110 BJ104B E2K110 BJ473B E2K110 BJ104B L2K110 BJ224B 0.5mm thickness V Rated voltage Part number 1 10V 6.3V L2K110 BJ105MV J2K110 BJ105V Part number 2 Capacitance tolerance code is applied to of part number. *1 We may provide X7R for some itemes according to the individual specification. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc08_e-01 12 37 REPRESENTATIVE PART NUMBERS Temperature Characteristic Rated voltage 50V 25V 16V B7X7R Part number 1 Part number 2 U2K110 B7102B U2K110 B7222B U2K110 B7472B T2K110 B7103B T2K110 B7223B E2K110 B7473B E2K110 B7104B Temp. char. Capacitance F Capacitance tolerance tan % Thickness mm Soldering R:Reflow W:Wave X7R X7R X7R X7R X7R X7R X7R 0.001 0.0022 0.0047 0.01 0.022 0.047 0.1 10, 20 10, 20 10, 20 10, 20 10, 20 10, 20 10, 20 3.5 3.5 3.5 3.5 3.5 3.5 5 0.60.06 0.60.06 0.60.06 0.60.06 0.60.06 0.60.06 0.60.06 R R R R R R R Temp. char. Capacitance pF Capacitance tolerance Q Thickness mm Soldering R:Reflow W:Wave CH/C0H CH/C0H CH/C0H CH/C0H CH/C0H CH/C0H CH/C0H CH/C0H CH/C0H CH/C0H CH/C0H CH/C0H CH/C0H 10 12 15 18 22 27 33 39 47 56 68 82 100 1pF 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 600 640 700 760 840 940 1000 1000 1000 1000 1000 1000 1000 0.60.06 0.60.06 0.60.06 0.60.06 0.60.06 0.60.06 0.60.06 0.60.06 0.60.06 0.60.06 0.60.06 0.60.06 0.60.06 R R R R R R R R R R R R R Temp. char. Capacitance F Capacitance tolerance tan % Thickness mm Soldering R:Reflow W:Wave B/X5R X5R 1 2.2 10, 20 20 5 10 0.850.1 0.850.1 R R Temp. char. Capacitance F Capacitance tolerance tan % Thickness mm Soldering R:Reflow W:Wave B/X5R B/X5R*1 B/X5R B/X5R X5R 0.1 0.1 0.22 0.47 1 10, 20 10, 20 10, 20 10, 20 10, 20 5 5 5 5 10 0.850.1 0.850.1 0.850.1 0.850.1 0.850.1 R R R R R HALT % Rated voltage 200% 200% 200% 200% 200% 200% 200% Internal code P/N 1 Note HALT % Rated voltage 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% Internal code P/N 1 Note HALT % Rated voltage 200% 150% Internal code P/N 1 Note HALT % Rated voltage 200% 200% 200% 200% 150% Internal code P/N 1 Note HALT % Rated voltage 200% Internal code P/N 1 Note Capacitance tolerance code is applied to of part number. Temperature Characteristic Rated voltage 50V CHCH/C0H Part number 1 Part number 2 U2K110 CH100FB U2K110 CH120KB U2K110 CH150KB U2K110 CH180KB U2K110 CH220KB U2K110 CH270KB U2K110 CH330KB U2K110 CH390KB U2K110 CH470KB U2K110 CH560KB U2K110 CH680KB U2K110 CH820KB U2K110 CH101KB 212TYPE 2 circuits type Temperature Characteristic BJB/X5R Rated voltage Part number 1 25V 10V T2K212 BJ105D L2K212 BJ225MD Part number 2 Capacitance tolerance code is applied to of part number. 212TYPE 4 circuits type Temperature Characteristic Rated voltage 25V 16V 10V BJB/X5R Part number 1 Part number 2 T4K212 BJ104D E4K212 BJ104D L4K212 BJ224D L4K212 BJ474D L4K212 BJ105D Capacitance tolerance code is applied to of part number. *1 We may provide X7R for some itemes according to the individual specification. Temperature Characteristic B7X7R Rated voltage Part number 1 16V E4K212 B7104D Part number 2 Temp. char. Capacitance F Capacitance tolerance tan % Thickness mm Soldering R:Reflow W:Wave X7R 0.1 10, 20 5 0.850.1 R Capacitance tolerance code is applied to of part number. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 38 12 mlcc08_e-01 ELECTRICAL CHARACTERISTICS Example of Impedance ESR vs. Frequency characteristics Taiyo Yuden multilayer ceramic capacitor L2K096 BJ103MP 100000 10000 1000 1000 100 100 10 10 1 1 0.1 0.1 0.01 0.1 1 10 100 1000 10000 100000 J2K096 BJ104MK 100000 10000 T2K096 CH100FP 1000000 0.01 0.1 1 10 100 1000 10000 100000 10000 1000 1000 100 100 10 10 1 1 0.1 0.1 10 100 1000 10000 ESR Impedance 100000 10000 0.01 1 T2K096 CH101KP 1000000 ESR Impedance 100000 0.01 1 10 100 T2K110 BJ103MB / T2K110 B7103MB 100000 100000 E2K110 BJ104MB / E2K110 B7104MB 10000 10000 L2K110 BJ105MA 1000 10 1 10 10 1 1 1 100 10 100 100 0.1 0.1 0.1 0.1 0.01 0.01 0.001 0.1 0.001 0.1 1 10 100 1000 10000 100000 J2K110 BJ225MA 10000 1000 100 1000 1000 10000 1 10 100 1000 10000 100000 CAPACITORS 1000000 1000 MHz MHz 0.01 0.01 0.001 0.1 0.001 0.1 1 10 100 1000 10000 100000 1 10 100 1000 10000 100000 L4K212 BJ105KD 10000 1000 100 10 1 0.1 0.01 0.001 0.1 1 10 100 1000 10000 100000 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc08_e-01 12 39 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 40 12 mlcc08_e-01 PACKAGING Minimum Quantity Taped package Thickness Type MK042 MK063 2K096 WK105 MK105 VK105 MK107 WK107 2K110 MK212 WK212 4K212 2K212 MK316 MK325 MK432 mm code 0.2 0.3 0.3 0.45 0.3 0.2 0.3 0.5 0.5 0.45 0.5 0.8 0.5 0.6 0.8 0.45 0.85 1.25 0.85 0.85 0.85 1.15 1.25 1.6 0.85 1.15 1.9 2.0max 2.5 2.5 C,D P,T P K P C P V, W W K V A V B A K D G D D D F G L D F N Y M M Standard quantity [pcs] Embossed tape -- 40000 15000 Representative taping dimensions Paper Tape8mm wide Pressed carrier tape2mm pitch 0.1/-0 Paper tape 10000 20000 15000 -- T1 10000 4000 -- 4000 Unitmm 4000 -- -- 3000 4000 -- Type No bottom tape for pressed carrier tape Insertion Pitch MK063 2K096 WK105 MK105 *1C 0.65 1.15 MK105 *1P 1 * Thickness, C0.2mmP0.3mm Tape Thickness T1 0.45max. 0.42max. 0.4max. 0.45max. 0.3max. 0.42max. 2.00.05 Punched carrier tape2mm pitch 0.1/-0 -- 3000 2000 -- -- 500T, 1000P 500 Unitmm Type Taping material Chip Cavity 0.37 0.67 0.65 1.02 2K096 MK105 VK105 Chip Cavity A B 0.72 1.02 0.65 Insertion Pitch F Tape Thickness T 0.6max. 52.00.05 1.15 0.8max. Paper tape Punched carrier tape4mm pitch 0.1/-0 Unitmm Embossed tape Type MK107 WK107 2K110 MK212 WK212 4K212 2K212 MK316 Chip Cavity A B Insertion Pitch F Tape Thickness T 1.0 1.8 1.1max. 1.15 1.55 1.0max. 1.65 2.4 2.0 3.6 4.00.1 1.1max. Chip filled NoteTaping size might be different depending on the size of the product. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc_pack-P1 12 mlcc_pack_e-01 PACKAGING Embossed tape4mm wide Trailer and Leader 0.80.04 4.00.05 1.80.02 0.90.05 100mm or more Trailer 160mm min. Leader 400mm min. 1.00.02 2.00.04 Unitmm Type MK042 Chip Cavity A B 0.23 0.43 Insertion Pitch F 1.00.02 Tape Thickness K T 0.5max. 0.25max. Reel size t E C Embossed tape8mm wide 0.1/-0 A B D R W Unitmm A 1782.0 B 50min. C 13.00.2 D 21.00.8 E 2.00.5 R 1.0 4mm wide tape 8mm wide tape 12mm wide tape t 1.5max. 2.5max. 2.5max. W 51.0 101.5 141.5 Unitmm Type WK107 MK212 MK316 MK325 Chip Cavity A B 1.0 1.8 1.65 2.4 2.0 3.6 2.8 3.6 Insertion Pitch F 4.00.1 Tape Thickness K T 1.3max 0.250.1 3.4max. 0.6max. Embossed tape12mm wide Top Tape Strength 0.1/-0 The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below. 2.00.1 F Type MK432 Chip Cavity A B 3.7 4.9 Unitmm Insertion Pitch F 8.00.1 Tape Thickness K T 4.0max. 0.6max. Bulk Cassette The exchange of individual specification is necessary. Please contact Taiyo Yuden sales channels. 120.1 360/-0.2 1100.7 8.80.1 2.00/-0.1 1.50.1/-0 6.80.1 12.00.1 0/-0.2 0.2/-0 1.00/-0.1 Unitmm This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc_pack_e-01 12 mlcc_pack-P2 RELIABILITY DATA Super Low Distortion Multilayer Ceramic Capacitors and Medium-High Voltage Multilayer Ceramic Capacitors are noted separately. Multilayer Ceramic Capacitors 1.Operating Temperature Range Temperature Compensating Class 1 Specified Value Standard High Frequency Type 55 to 125 BJ B7 C6 C7 High PermittivityClass 2 F Specification B X5R X7R X6S X7S F Y5V Temperature Range 25 to 85 55 to 85 55 to 125 55 to 105 55 to 125 25 to 85 30 to 85 2. Storage Conditions Temperature Compensating Class 1 Specified Value Standard High Frequency Type 55 to 125 BJ B7 C6 C7 High PermittivityClass 2 F Specification B X5R X7R X6S X7S F Y5V Temperature Range 25 to 85 55 to 85 55 to 125 55 to 105 55 to 125 25 to 85 30 to 85 3. Rated Voltage Temperature Compensating SpecifiedClass 1 Value High PermittivityClass 2 Standard High Frequency Type 4. Withstanding Voltage Between terminals Standard Temperature Compensating SpecifiedClass 1 High Frequency Type Value High Permittivity Class 2 Test Methods and Remarks Applied voltage Duration Charge/discharge current 50VDC, 25VDC, 16VDC 50VDC, 16VDC 50VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC No breakdown or damage Class 1 Class 2 Rated voltagex3 Rated voltagex2.5 1 to 5 sec. 50mA max. 5. Insulation Resistance Standard Temperature Compensating High Frequency Type SpecifiedClass 1 Value High PermittivityClass 2Note 1 10000 M min. C0.047F : 10000 M min. C0.047F : 500MF Test Methods and Remarks Applied voltage: Rated voltage Duration: 605 sec. Charge/discharge current: 50mA max. 6. CapacitanceTolerance Standard C U 0.5pFC5pF0.25pF 0.5pF<C10pF0.5pF C10pF5% High Frequency Type CH RH 0.5pFC2pF0.1pF C2pF5% Temperature Compensating SpecifiedClass 1 Value High PermittivityClass 2 Test Methods and Remarks Standard Preconditioning Measuring frequency Measuring voltage Note 1 Bias application RH S T 0.5pFC2pF0.1pF C2pF5% BJ, B7, C6,C710 or 20, F2080 Class 1 Class 2 High Frequency Type C10F C10F None Thermal treatmentat 150 for 1hr Note 2 1Hz10 1Hz10 12010Hz 0.5 to 5Vrms 10.2Vrms 0.50.1Vrms None 7. Q or Dissipation Factor Standard Temperature Compensating SpecifiedClass 1 High Frequency Type Value High Permittivity Class 2Note 1 Test Methods and Remarks C30 pFQ40020CC30 pFQ1000 CNominal capacitance Refer to detailed specification BJ, B7, C6,C72.5 max., F7 max. Class 1 Class 2 High Frequency Type C10F C10F None Thermal treatmentat 150 for 1hr Note 2 1Hz10 1GHz 1Hz10 12010Hz 0.5 to 5Vrms 10.2Vrms 0.50.1Vrms None Standard Preconditioning Measuring frequency Measuring voltage Note 1 Bias application High Frequency Type Measuring equipment: HP4291A Measuring jig: HP16192A This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc_reli-R1 12 mlcc_reli_e-01 RELIABILITY DATA 8. Temperature Characteristic Without voltage application Standard Temperature Compensating Class 1 High Frequency Type Temperature Characteristicppm/ C 0 CH, CJ, CK R 220 RH S 330 SH, SJ, SK T 470 TJ, TK U 750 UJ, UK SL 350 to 1000 Specified Value BJ B7 C6 C7 High PermittivityClass 2 F Specification B X5R X7R X6S X7S F Y5V Tolerance H60 J120 K250 Capacitance change 10 15 15 22 22 30/80 22/82 Reference temperature 20 25 25 25 25 20 25 Temperature Range 25 to 85 55 to 85 55 to 125 55 to 105 55 to 125 25 to 85 30 to 85 Test Methods and Remarks Class 1 Capacitance at 20 and 85 shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation. C85C20 6 x 10ppm/ C20xT T65 Class 2 Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation. CC2 x100 BF X5RX7RX6SX7SY5V C2 Minimum operating temperature C Capacitance in Step 1 or Step 3 20 25 C2 Capacitance in Step 2 Maximum operating temperature Step 1 2 3 9. Deflection Standard Temperature Compensating SpecifiedClass 1 Value High Frequency Type High PermittivityClass 2 Appearance : Capacitance change : Appearance : Capacitance change : Appearance : Capacitance change : No abnormality Within 5% or 0.5 pF, whichever is larger. No abnormality Within0.5 pF No abnormality Within 12.5% BJ, B7, C6, C7 , Within 30% F Test Methods and Remarks Multilayer Ceramic Capacitors Board 042063 Type The other types glass epoxy-resin substrate Thickness 0.8mm 1.6mm Warp Duration 1mm 10 sec. Thickness 1.6mm Warp 1mm Duration 10 sec. Board Warp Array Type 096110212 Type Board glass epoxy-resin substrate Capacitance measurement shall be conducted with the board bent 10. Body Strength Standard High Frequency Type Temperature Compensating SpecifiedClass 1 Value High PermittivityClass 2 Test Methods and Remarks High Frequency Type Applied force: 5N Duration: 10 sec. -- No mechanical damage. -- A A A 11. Adhesive Strength of Terminal Electrodes Standard Temperature Compensating SpecifiedClass 1 High Frequency Type Value High PermittivityClass 2 Test Methods and Remarks Multilayer Ceramic Capacitors 042063 Type 105 Type or more Applied force 2N 5N No terminal separation or its indication. Array Type Duration 305 sec. 096 Type 110212 Type Applied force 2N 5N Duration 305 sec. 12. Solderability Standard Temperature Compensating SpecifiedClass 1 At least 95% of terminal electrode is covered by new solder. High Frequency Type Value High PermittivityClass 2 Test Methods and Remarks Solder type Solder temperature Duration Eutectic solder H60A or H63A 2305 41 sec. Lead-free solder Sn-3.0Ag0.5Cu 2453 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc_reli_e-01 12 mlcc_reli-R2 RELIABILITY DATA 13. Resistance to Soldering Standard Temperature Compensating Class 1 High Frequency Type Specified Value High PermittivityClass 2 Note 1 Appearance: No abnormality Capacitance change: Within 2.5% or 0.25pF, whichever is larger. Q: Initial value Insulation resistance: Initial value Withstanding voltagebetween terminals : No abnormality Appearance: No abnormality Capacitance change: Within 2.5% Q: Initial value Insulation resistance: Initial value Withstanding voltagebetween terminals : No abnormality Appearance: No abnormality Capacitance change: Within 7.5%BJ, B7, C6, C7 Within 20%F Dissipation factor: Initial value Insulation resistance: Initial value Withstanding voltagebetween terminals : No abnormality Test Methods and Remarks Class 1 Class 2 105 Type Array 096, 110 Type None 150, 1 to 2 min. 80 to 100, 2 to 5 min. 150 to 200, 2 to 5 min. 2705 30.5 sec. 6 to 24 hrsStandard condition Note 5 042, 063 Type Preconditioning Preheating Solder temp. Duration Recovery 105, 107, 212 Type 316, 325 Type Array 096, 110,212 Type Thermal treatmentat 150 for 1 hrNote 2 150, 1 to 2 min. 80 to 100, 2 to 5 min. 80 to 100, 5 to 10 min. 150 to 200, 2 to 5 min. 150 to 200, 5 to 10 min. 2705 30.5 sec. 242 hrsStandard condition Note 5 042063 Type Preconditioning Preheating Solder temp. Duration Recovery 14. Temperature Cycle (Thermal Shock Standard Temperature Compensating Class 1 High Frequency Type Specified Value High PermittivityClass 2 Note 1 Appearance: No abnormality Capacitance change: Within 2.5% or 0.25pF, whichever is larger. Q: Initial value Insulation resistance: Initial value Withstanding voltagebetween terminals : No abnormality Appearance: No abnormality Capacitance change: Within 0.25pF Q: Initial value Insulation resistance: Initial value Withstanding voltagebetween terminals : No abnormality Appearance: No abnormality Capacitance change: Within 7.5%BJ, B7, C6, C7 Within 20%F Dissipation factor: Initial value Insulation resistance: Initial value Withstanding voltagebetween terminals : No abnormality Test Methods and Remarks Class 1 None Preconditioning Step 1 2 3 4 1 cycle Number of cycles Recovery Class 2 Thermal treatmentat 150 for 1 hr Note 2 Temperature Lowest operating temperature 0/3 Normal temperature Highest operating temperature 0/3 Normal temperature Time min. 303 2 to 3 303 2 to 3 5 times 6 to 24 hrsStandard condition Note 5 242 hrsStandard condition Note 5 15. HumiditySteady State Standard Temperature Compensating Class 1 Specified Value High Frequency Type High PermittivityClass 2 Note 1 Appearance: No abnormality Capacitance change: Within 5% or 0.5pF, whichever is larger. Q C10pF Q20010C 10C30pF Q2752.5C C30pF Q350 CNominal capacitance Insulation resistance: 1000 M min. Appearance: No abnormality Capacitance change: Within 0.5pF, Insulation resistance: 1000 M min. Appearance: No abnormality Capacitance change: Within 12.5% BJ, B7, C6, C7 Within 30% F Dissipation factor 5.0% max.BJ, B7, C6, C7 11.0% max. F Insulation resistance: 50 MF or 1000 M whichever is smaller. Test Methods and Remarks Class 1 Class 2 Standard Preconditioning Temperature Humidity Duration Recovery High Frequency Type None 402 602 90 to 95RH 50024/0 hrs 6 to 24 hrsStandard condition Note 5 Preconditioning Temperature Humidity Duration Recovery All items Thermal treatmentat 150 for 1 hr Note 2 402 90 to 95RH 50024/0 hrs 242 hrsStandard condition Note 5 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc_reli-R3 12 mlcc_reli_e-01 RELIABILITY DATA 16. Humidity Loading Standard Temperature Compensating Class 1 High Frequency Type Specified Value High PermittivityClass 2 Note 1 Appearance: No abnormality Capacitance change: Within 7.5% or 0.75pF, whichever is larger. Q C30pFQ10010C/3 C30pFQ200 CNominal capacitance Insulation resistance: 500 M min. Appearance: No abnormality Capacitance change: C2pFWithin 0.4 pF C2pFWithin 0.75 pF CNominal capacitance Insulation resistance: 500 M min. Appearance: No abnormality Capacitance change: Within 12.5%BJ, B7, C6, C7 Within 30% F Dissipation factor 5.0% max.BJ, B7, C6, C7 11.0% max. F Insulation resistance: 25 MF or 500 M, whichever is smaller. Test Methods and Remarks Class 1 Class 2 Standard Preconditioning Temperature Humidity Duration Applied voltage Charge/discharge current Recovery High Frequency Type None 402 602 90 to 95RH 50024/0 hrs Rated voltage 50mA max. 6 to 24 hrsStandard condition Note 5 Preconditioning Temperature Humidity Duration Applied voltage Charge/discharge current Recovery All items Voltage treatment Rated voltage are applied for 1 hour at 40 Note 3 402 90 to 95RH 50024/0 hrs Rated voltage 50mA max. 242 hrsStandard condition Note 5 17. High Temperature Loading Standard Temperature Compensating Class 1 Specified Value High Frequency Type High PermittivityClass 2 Note 1 Appearance: No abnormality Capacitance change: Within 3% or 0.3pF, whichever is larger. Q C10pF Q20010C 10C30pF Q2752.5C C30pF Q350CNominal capacitance Insulation resistance: 1000 M min. Appearance: No abnormality Capacitance change: Within 3% or 0.3pF, whichever is larger. Insulation resistance: 1000 M min. Appearance: No abnormality Capacitance change: Within 12.5% BJ, B7, C6, C7 Within 30% F Dissipation factor 5.0% max. BJ, B7, C6, C7 11.0% max. F Insulation resistance: 50 MF or 1000 M, whichever is smaller. Test Methods and Remarks Class 1 Class 2 Standard Preconditioning Temperature Duration Applied voltage Charge/discharge current Recovery Note 1 Note 2 Note 3 Note 4 Note 5 High Frequency Type None 1253 100048/0 hrs Rated voltagex2 50mA max. 6 to 24hrStandard condition Note 5 Preconditioning Temperature Duration Applied voltage Charge/discharge current Recovery BJ, F C6 B7, C7 Voltage treatmentTwice the rated voltage shall be applied for 1 hour at 85, 105 or 125 Note 3, 4 852 1053 1253 100048/0 hrs Rated voltagex2 Note 4 50mA max. 242 hrsStandard condition Note 5 The figures indicate typical specifications. Please refer to individual specifications in detail. Thermal treatment : Initial value shall be measured after test sample is heat-treated at 1500/10 for an hour and kept at room temperature for 242hours. Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the test conditions, and kept at room temperature for 242hours. 150% of rated voltage is applicable to some items. Please refer to their specifications for further information. Standard condition: Temperature: 5 to 35, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condition. Temperature: 202, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the "standard condition". This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc_reli_e-01 12 mlcc_reli-R4 PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors 1. Circuit Design Verification of operating environment, electrical rating and performance 1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications. Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general purpose applications. Operating VoltageVerification of Rated voltage Precautions 1. The operating voltage for capacitors must always be their rated voltage or less. If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less. For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less. 2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage having rapid rise time is used in a circuit. 2. PCB Design Pattern configurationsDesign of Land-patterns 1. When capacitors are mounted on PCBs, the amount of solder usedsize of filletcan directly affect the capacitor performance. Therefore, the following items must be carefully considered in the design of land patterns: 1 Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper amount of solder. Precautions 2 When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist. Pattern configurations Capacitor layout on PCBs After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processesPCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc. . For this reason, land pattern configurations and positions of capacitors shall be carefully considered to minimize stresses. Pattern configurationsDesign of Land-patterns The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts. 1 Recommended land dimensions for typical chip capacitors Multilayer Ceramic Capacitors : Recommended land dimensionsunit: mm Wave-soldering Land patterns for PCBs Type Size L W A B C Land 107 212 316 325 1.6 2.0 3.2 3.2 0.8 51.25 1.6 2.5 0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5 0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7 0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5 Chip capacitor C B Reflow-soldering Type Size L W A B C 042 063 105 107 0.4 0.6 1.0 1.6 0.2 0.3 0.5 0.8 0.15 to 0.25 0.20 to 0.30 0.45 to 0.55 0.8 to 1.0 0.15 to 0.20 0.20 to 0.30 0.40 to 0.50 0.6 to 0.8 0.15 to 0.30 0.25 to 0.40 0.45 to 0.55 0.6 to 0.8 212 2.0 51.25 0.8 to 1.2 0.8 to 1.2 0.9 to 1.6 316 3.2 1.6 1.8 to 2.5 1.0 to 1.5 1.2 to 2.0 325 3.2 2.5 1.8 to 2.5 1.0 to 1.5 1.8 to 3.2 432 4.5 3.2 2.5 to 3.5 1.5 to 1.8 2.3 to 3.5 Chip capacitor W L LWDC: Recommended land dimensions for reflow-solderingunit: mm Type Technical considerations 105 0.52 1.0 0.18 to 0.22 0.2 to 0.25 0.9 to 1.1 L W A B C 107 50.8 1.6 0.25 to 0.3 0.3 to 0.4 1.5 to 1.7 LWDC 212 1.25 2.0 0.5 to 0.7 0.4 to 0.5 1.9 to 2.1 W L Array type: Recommended land dimensions for reflow-solderingunit: mm Type Size a b c d L W B A NoteRecommended land size might be different according to the allowance of the size of the product. Size Solder-resist 2 circuits 0962 circuits 1102 circuits 2122 circuits 212 4 circuits 0.9 1.37 2.0 2.0 0.6 1.0 1.25 1.25 0.25 to 0.35 0.35 to 0.45 0.5 to 0.6 0.5 to 0.6 0.15 to 0.25 0.55 to 0.65 0.5 to 0.6 0.5 to 0.6 0.15 to 0.25 0.3 to 0.4 0.5 to 0.6 0.2 to 0.3 0.45 0.64 1.0 0.5 4 circuits Chip capacitor c c a b a Land d a b a d 2 Examples of good and bad solder application Items Not recommended Recommended Mixed mounting of SMD and leaded components Component placement close to the chassis Hand-soldering of leaded components near mounted components Horizontal component placement To next page This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc_prec-P1 12 mlcc_prec_e-01 PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors 2. PCB Design Pattern configurations Capacitor layout on PCBs 1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical stresses from board warp or deflection. Items Not recommended Recommended Deflection of board Technical considerations 1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below. 1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location. 3. Mounting Adjustment of mounting machine 1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them. 2.Maintenance and inspection of mounting machines shall be conducted periodically. Precautions Selection of Adhesives 1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further information. Adjustment of mounting machine 1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points shall be considerable. 1The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection. 2The pressure of nozzle shall be adjusted between 1 and 3 N static loads. 3To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement: Items Not recommended Recommended Single-sided mounting Double-sided mounting Technical considerations 2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical impact on the capacitors. To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted periodically. Selection of Adhesives Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions shall be noted in the application of adhesives. 1 Required adhesive characteristics a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive shall have sufficient strength at high temperatures. c. The adhesive shall have good coating and thickness consistency. d. The adhesive shall be used during its prescribed shelf life. e. The adhesive shall harden rapidly. f . The adhesive shall have corrosion resistance. g. The adhesive shall have excellent insulation characteristics. h. The adhesive shall have no emission of toxic gasses and no effect on the human body. 2 The recommended amount of adhesives is as follows; Recommended condition Figure 212/316 case sizes as examples a 0.3mm min b 100 to 120 m c Adhesives shall not contact land This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc_prec_e-01 12 mlcc_prec-P2 PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors 4. Soldering Selection of Flux Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use; 1 Flux used shall be less than or equal to 0.1 wt%in CI equivalentof halogenated content. Flux having a strong acidity content shall not be applied. 2 When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level. 3 When water-soluble flux is used, special care shall be taken to properly clean the boards. Precautions Soldering Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions. Sn-Zn solder paste can adversely affect MLCC reliability. Please contact us prior to usage of Sn-Zn solder. Selection of Flux 1-1. When too much halogenated substanceChlorine, Chlorine, etc. content is used to activate fl flux, ux, or highly acidic fl flux ux is used, it may lead to corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors. 1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used. Peak260 260Max. Max. Peak 230 Within10sec. 10sec. Within Within 10 sec. Preheating 200 60sec. 200 200 Min. 60sec. Min. Slow Slow cooling Slowcooling cooling 300 100 100 100 Peak 260 Max. Withinabove 10sec. Heating Preheating 150 230 200 60sec. Min. 40sec. Max. 0 Slow cooling 300 100 Peak 260 Max. 230250 Within 10sec. Heating above Heating above Within 3sec. Preheating Heating above Preheating 150 150 Preheating 230 230 Preheating 150 120sec. Min. 230 60sec. Min. Min. 60sec. 40sec. Max. Max. 40sec. 200 60sec. Min. 200 00 40sec. Max. Slow 0 0 Slow cooling cooling Caution 300 The300 ideal condition is to have solder massfilletcontrolled to 1/2 to 1/3 of the thickness of a capacitor. 300 100 excessive dwell times 100 230250 230250 Because can adversely affect solderability, soldering duration230250 shall be kept as Within 3sec. Within 3sec. close to recommended timesHeating as possible. Preheating Preheating Within 3sec. above Preheating Preheating 150 120sec. Min. 120sec. Min. 230 120sec. Min. 200 200 60sec. Min. 200 40sec. Max. Wave soldering 0 0 Slow cooling cooling Slow Slow cooling Recommended condition for Pb-free soldering Recommended conditions for eutectic soldering 200 00 Preheating 120sec. Min. 300 100 200 Slow cooling 300 300 100 200 200 0 230250 Within 3sec. Peak260 260Max. Max. Peak Within10sec. 10sec. Within 120sec. Min. Min. 120sec. Slow Slow cooling Preheating cooling Preheating 150 150 120sec. Min. Hand200 soldering 00 120sec. Min. 0 300 100 200 0 Slow Preheating cooling 150 Peak 260 Max. Within 10sec. 120sec. Min. Slow 100 300 230280 Within 3 sec. The soldering iron shall not directly touch capacitors. 0 Preheating 60sec. Min. 0 400 60sec. Min. T Slow cooling 200 400 400 400 100 300 300 300 0 200 200 200 400 100 100 100 300 00 200 100 0 400 Peak 350 Max. Within 3sec. 300 0 Recommended condition for Pb-free soldering 200 400 400 Slow cooling 400 Peak 350 350Max. Max. Peak 230280Within Within 3sec. 3sec. 100 Within 3 sec. 300 300 300 Preheating T T 60sec. Min. 0 Slow cooling cooling Slow 0 200 200 200 200 200 Slow cooling cooling Slow Preheating Preheating Slow cooling 400 400 150 Min.350 Max. 150 Min. Peak 230280 100 100 100 100 Within 3sec. 100 Within 3 sec. 300 Preheating 300 Preheating Preheating T 60sec. Min. 60sec. Min. 60sec. Min. Min. 60sec. 60sec. Min. 00 00 0 Slow cooling T 200 200 Slow cooling 316type or less Preheating T150 Caution 150 Min. Use100 a 50W soldering iron with a maximum tip diameter of100 1.0 mm. Slow Recommended conditions for eutectic soldering Preheating cooling 400 400 150 100 230280 230280 Within 33 sec. sec. Within 300 300 T PC board Peak 260 Max. Within 10sec. Caution Preheating cooling 300 400 as for reflow soldering Wave soldering must not be applied to capacitors designated 150 only. 100 100 Peak 260 Max. Within 10sec. Capacitor Solder Temperature Temperature Temperature Temperature Temperature 300 100 100 Temperature Temperature Temperature Temperature Temperature Temperature Temperature Temperature Temperature Technical considerations 300 100 0 Preheating Peak 280 280Max. Max. Peak 150 Peak Min. 350 Max. Within 3sec. 3sec. Within Within 3sec. T Min. 60sec. T T Temperature Temperature Temperature Temperature Temperature Temperature Temperature Temperature Temperature Temperature Temperature Temperature Temperature Temperature 300 300 300 200 Slow Recommended condition for Pb-free cooling soldering Slow cooling cooling Slow Slow cooling Preheating Preheating Preheating 150 Min. 150 Min. Peak 280 Max. 150 Min. Within 3sec. 60sec. Min. Min. 60sec. 60sec. Min. T Slow cooling T 325type or morePreheating T130 150 Min. 60sec. Min. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc_prec-P3 12 mlcc_prec_e-01 300 T 200 400 100 Temperature Recommended conditions for eutectic soldering Temperature Reflow soldering Temperature Soldering * Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. as to prevent malfunction of the components due to excessive thermal shock. * Therefore, the soldering must be conducted with great care so300 Peak 260 * Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between theMax. capacitors and solder shall be within 100 to 130. * Cooling : The temperature difference between the capacitors and cleaning process shall Within not be10sec. greater than 100. 300 60sec. M 0 200 T 100 0 60sec. PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors 5. Cleaning Precautions Technical considerations Cleaning conditions 1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use of the cleaning.e.g. to remove soldering flux or other materials from the production process. 2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics. 1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate their outer coating, resulting in a degradation of the capacitor's electrical propertiesespecially insulation resistance . 2. Inappropriate cleaning conditionsinsufficient or excessive cleaningmay adversely affect the performance of the capacitors. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully checked; Ultrasonic output : 20 W/ or less Ultrasonic frequency : 40 kHz or less Ultrasonic washing period : 5 min. or less 6. Resin coating and mold 1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the capacitor's performance. 2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat may lead to damage or Precautions destruction of capacitors. The use of such resins, molding materials etc. is not recommended. 7. Handling Splitting of PCB 1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board. 2. Board separation shall not be done manually, but by using the appropriate devices. Precautions Mechanical considerations Be careful not to subject capacitors to excessive mechanical shocks. 1 If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used. 2 Please be careful that the mounted components do not come in contact with or bump against other boards or components. 8. Storage conditions Storage 1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. Recommended conditions Ambient temperature : Below 30 Humidity : Below 70% RH Precautions The ambient temperature must be kept below 40. Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capacitors shall be used within 6 months from the time of delivery. Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air. 2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, o care shall be taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150 for 1hour. Technical If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and quality loss of taping/ consider- packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the above period, please check solderability beations fore using the capacitors. RCR-2335B Safety Application Guide for fixed ceramic capacitors for use in electronic equipment is published by JEITA. Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc_prec_e-01 12 mlcc_prec-P4