K M Y Last update: 2012.8.30 No.FCC-K-HTS-0003-12
(Uncontrolled copy)
Specification
(Reference)
Title: CHIP FUSE; RECTANGULAR TYPE
Style: FCC10,16,20,32, FHC10,16,20,32
RoHS COMPLIANCE ITEM
Product specification contained in this specification
are subject to change at any time without notice
If you have any questions or a Purchasing Specification for any quality
Agreement is necessary, please contact our sales staff.
Issue Dept.: Research & Development Department Hokkaido Research Center
K M Y Drawing No: FCC−K−HTS−0003 /12
Title: CHIP FUSES; RECTANGULAR TYPE
FCC10,16,20,32, FHC10,16,20,32 Page: 1/10
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.8.30
1. Scope
1.1 This specification covers the detail requirements for chip fuses; rectangular type, style of FCC10,16,20,32,
FHC10,16,20,32.
1.2 Applicable documents
UL248−1−2000 Low−Voltage Fuses−Part1: General Requirements
UL248−14−2000 Low−Voltage Fuses−Part14: Supplemental Fuses
CSA C22.2 No.248.1−2000 Low−Voltage Fuses−Part1: General Requirements
CSA C22.2 No.248.14−2000 Low−Voltage Fuses−Part14: Supplemental Fuses
IEC60127−1 Miniature fuses−part 1: Definitions for miniature fuses and general requirements for miniature fuse−links
IEC60127−4 Miniature fuses−Part4: Universal modular fuse−links (UMF)
2. Classification
Type designation shall be the following form.
(Example) FCC 20
162 AD TP
1 2 3 4 5
Style
1 Chip fuses; rectangular type
2 Size
3 Rated current Example: 162 → 1.6 (A)
4 Optional code
5 Packaging form
3. Safety standard approval
• UL248−1 and UL248−14
• CSA C22.2, No. 248.1−00 and CSA C22.2, No. 248.14−00
The file number to be designated by UL and C−UL shall be as follows: E176847
4. Rating
The ratings shall be in accordance with Table−1.
4.1 Optional code: AB
Tabl e −1(1)
Rated current Internal
resistance value Time / current characteristic
Style
Symbol (A) Marking
symbol (mΩ max.)
Rated
voltage
（V）
Breaking
capacity
(A) Current Pre−arcing time
201 0.2 Z 2400
251 0.25 C 1000
321 0.315 D 750
401 0.4 E 620
501 0.5 F 340
631 0.63 I 290
751 0.75 A 220
801 0.8 K 210
102 1.0 L 150
132 1.25 M 120
152 1.5 H 100
FCC10
162 1.6 N 90
DC30
202 2.0 S 55
FHC10 252 2.5 T 40
DC24
35 200% 5 s max.
Symbol Content
AB
AD Standard
Style
K M Y Drawing No: FCC−K−HTS−0003 /12
Title: CHIP FUSES; RECTANGULAR TYPE
FCC10,16,20,32, FHC10,16,20,32 Page: 2/10
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.8.30
Tabl e −1(2)
Rated current Internal
resistance value Time / current characteristic
Style
Symbol (A) Marking
symbol (mΩ max.)
Rated
voltage
（V）
Breaking
capacity
(A) Current Pre−arcing time
201 0.2 ZB 3,200
251 0.25 CB 1,800
321 0.315 DB 1,000
401 0.4 EB 750
501 0.5 FB 330
631 0.63 IB 280
751 0.75 AB 210
801 0.8 KB 200
102 1.0 LB 130
132 1.25 MB 110
152 1.5 HB 95
162 1.6 NB 85
FCC16
202 2.0 SB 70
DC36
FHC16 252 2.5 TB 40 DC32
35 200% 5 s max.
501 0.5 FB 330
631 0.63 IB 270
801 0.8 KB 190
102 1.0 LB 130
132 1.25 MB 100
162 1.6 NB 80
FCC20
202 2.0 SB 65
DC50
FHC20 252 2.5 TB 40 DC32
50 200% 5 s max.
4.2 Optional code: AD
Tabl e −1(3)
Rated current Internal
resistance value Time / current characteristic
Style
Symbol (A) Marking
symbol (mΩ max.)
Rated
voltage
（V）
Breaking
capacity
(A) Current Pre−arcing time
151 0.15 O 2700 DC32
201 0.2 Z 1000
251 0.25 C 750
321 0.315 D 620
401 0.4 E 340
501 0.5 F 290
631 0.63 I 210
801 0.8 K 150
102 1.0 L 120
FCC10
132 1.25 M 90
DC30
162 1.6 N 55
202 2.0 S 40
252 2.5 T 36
FHC10
322 3.15 U 26
DC24
35 250% 5 s max.
K M Y Drawing No: FCC−K−HTS−0003 /12
Title: CHIP FUSES; RECTANGULAR TYPE
FCC10,16,20,32, FHC10,16,20,32 Page: 3/10
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.8.30
Tabl e −1(4)
Rated current Internal
resistance value Time / current characteristic
Style
Symbol (A) Marking
symbol (mΩ max.)
Rated
voltage
（V）
Breaking
capacity
(A) Current Pre−arcing time
151 0.15 OD 4000 DC50
201 0.2 ZD 1800
251 0.25 CD 1000
321 0.315 DD 750
401 0.4 ED 330
501 0.5 FD 280
631 0.63 ID 200
801 0.8 KD 130
102 1.0 LD 110
132 1.25 MD 85
162 1.6 ND 70
202 2.0 SD 55
DC36
FCC16
252 2.5 TD 45 DC32
322 3.15 UD 26
FHC16 402 4.0 XD 19 DC24
35 250% 5 s max.
401 0.4 401 330
501 0.5 501 270
631 0.63 631 190
801 0.8 801 130
102 1.0 102 100
132 1.25 132 80
162 1.6 162 65
202 2.0 202 55
FCC20
252 2.5 252 40
DC50
322 3.15 UD 26
402 4.0 XD 19 DC32
FHC20
502 5.0 YD 14 DC24
50 250% 5 s max.
201 0.2 201 1800
251 0.25 251 1000
321 0.315 321 750
401 0.4 401 350
501 0.5 501 295
631 0.63 631 200
801 0.8 801 140
102 1.0 102 110
132 1.25 132 85
152 1.5 152 78
162 1.6 162 75
202 2.0 202 65
FCC32
252 2.5 252 45
DC64
322 3.15 UD 26
402 4.0 XD 19
FHC32
502 5.0 YD 14
DC32
50 250% 5 s max.
4.3 Working temperature range: −55 to +125(°C)
K M Y Drawing No: FCC−K−HTS−0003 /12
Title: CHIP FUSES; RECTANGULAR TYPE
FCC10,16,20,32, FHC10,16,20,32 Page: 4/10
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.8.30
5. Packaging form
The standard packaging form shall be in accordance with Table−2.
Tabl e −2
Symbol Packaging form Standard packaging
quantity / units Application
B Bulk (loose package) 1,000 pcs. FCC10,16,20,32, FHC10,16,20,32
PA Press pocket taping
(paper taping) 8mm width, 2mm pitches 10,000 pcs. FCC10, FHC10
TP Paper taping 8mm width, 4mm pitches 5,000 pcs. FCC16,20,32, FHC16,20,32
6. Dimensions
6.1 The resistor shall be of the design and physical dimensions in accordance with Figure−1 and Table−3.
Figure−1
Table−3 Unit:mm
Style L W H c d
FCC10, FHC10 1.0±0.05 0.5±0.05 0.4±0.05 0.2±0.1 0.25±0.10
FCC16, FHC16 1.6±0.1 +0.15
0.8 −0.05 0.45±0.10 0.3±0.15 0.3±0.1
FCC20, FHC20 2.0±0.1 1.25±0.10 0.6±0.1 0.4±0.2 0.4±0.2
FCC32 0.6±0.1
FHC32 3.2±0.2 1.6±0.15
0.65±0.10 0.5±0.25 0.5±0.25
6.2 Net weight (Reference)
Style Net weight(mg)
FCC10, FHC10 0.8
FCC16, FHC16 2
FCC20, FHC20 6
FCC32 10
FHC32 11
L
c
H
dd
W
c
K M Y Drawing No: FCC−K−HTS−0003 /12
Title: CHIP FUSES; RECTANGULAR TYPE
FCC10,16,20,32, FHC10,16,20,32 Page: 5/10
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.8.30
7. Marking
The Marking symbol of Sub− clause 4.1 shall be marked on over coat side.
(Example)
Style Optional code Marking symbol Content
FCC10 N FCC10 162 AB
FHC10 T FHC10 322 AD
FCC16 SB FCC16 202 AB
FHC16 TB FHC16 252 AB
FCC20 SB FCC20 202 AB
FHC20
AB
TB FHC20 252 AB
FCC10 N FCC10 162 AD
FHC10 U FHC10 322 AD
FCC16 ND FCC16 162 AD
FHC16 UD FHC16 322 AD
FCC20 162 FCC20 162 AD
FHC20 UD FHC20 322 AD
FCC32 162 FCC32 162 AD
FHC32
AD
UD FHC32 322 AD
8. Performance
8.1 Unless otherwise specified, the standard range of atmospheric conditions for tests is as follows;
Ambient temperature: 5 °C to 35 °C, Relative humidity: 45 % to 85 %, Air presser: 86 kPa to 106 kPa
If there is any doubt the results, measurements shall be made within the following:
Ambient temperature: 20 °C ± 2 °C, Relative humidity: 60 % to 70 %, Air presser: 86 kPa to 106 kPa
8.2 The performance shall be satisfied in Table−4.
Tabl e −4(1)
No. Test items Condition of test Performance requirements
1 Temperature rise The fuse shall be mounted on the test substrate as
shown in Figure−2.
Measurement temp.: 10 °C to 30 °C
Test current: Rated current
The temperature at the hottest point on the surface of
the fuse shall be measured after temperature
equilibrium has been attained.
75 °C max.
2 Current carrying capacity The fuse shall be mounted on the test substrate as
shown in Figure−2.
Test current: 110 % of Rated current
Test temp.: 70 °C ± 2 °C
Test period: 1h
Without opening
Optional
code
Current Pre−arcing
time
AB 200% 5 s max.
AD 250% 5 s max.
3 Time / current characteristic The fuse shall be mounted on the test substrate as
shown in Figure−2.
Test current shall be applied for continuously.
4 Terminal bond strength of
the face plating
JIS C 60068-2-21 Ue1
The fuse shall be mounted on the test substrate as
shown in Figure−2.
Bending value: 3 mm (Among the fulcrums: 90 mm)
Duration: 10 s ± 1 s
Change of internal resistance:
±3%
No evidence of mechanical
damage.
K M Y Drawing No: FCC−K−HTS−0003 /12
Title: CHIP FUSES; RECTANGULAR TYPE
FCC10,16,20,32, FHC10,16,20,32 Page: 6/10
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.8.30
Tabl e −4(2)
No. Test items Condition of test Performance requirements
Resistance to soldering
heat
Test by a piece.
Temp. of solder bath: 260 °C ± 5 °C
Immersion time: 10 s ± 1 s
After immersion into solder, leaving the room temp.
for 1h or more, and then measure the internal
resistance.
Change of internal resistance:
±10%
No evidence of appearance
damage
5
• Reflow soldering
Pre−heating: 150 °C ∼ 180 °C, 120 s max.
Peak: 260 °C ± 5 °C, 10 s max.
Refrow cycle: 2 times
After immersion into solder, leaving the room temp.
for 1h or more, and then measure the internal
resistance.
6 Solderability JIS C 60068-2-58
Test by a piece
Flux: Rosin−Methanol
Temp. of solder: bath: 235 °C ± 5 °C
Immersion time: 2 s ± 0.5 s
The surface of terminal immersed shall
be min. of 95 % covered with a new
coating of solder.
7 Rapid change temperature
JIS C 60068-2-14 Na
The fuse shall be mounted on the test substrate as
shown in Figure−2.
Upper temperature: +125 °C
Lower temperature: −55 °C
Duration of exposure at each temperature: 30 min.
Number of cycles: 5 cycles
Change of internal resistance:
±10%
No evidence of appearance
damage
8 Endurance test The fuse shall be mounted on the test substrate as
shown in Figure−2.
Test condition: Nominal ambient temp. and Relative
humidity.
Test potential:
1. Cycle of 1 h “ON” and 15 min. “OFF” at 1.05 times
rated current for 100 cycles.
2. After above the test , 1.25 times rated current for
1h.
The voltage drop across the fuse
after the test shall not have
increased by more than 10 % of
the value measured before test.
K M Y Drawing No: FCC−K−HTS−0003 /12
Title: CHIP FUSES; RECTANGULAR TYPE
FCC10,16,20,32, FHC10,16,20,32 Page: 7/10
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.8.30
9. Test substrate
Unit:mm
Style A b c
FCC10, FHC10 0.3 0.6 0.65
FCC16, FHC16 0.6 1.0 0.5
FCC20, FHC20 0.9 1.3 0.7
FCC32, FHC32 1.8 2.2 0.85
Figure−2 FCC, FHC TEST SUBSTRATE
Remark 1). Material: Epoxide woven glass
Thickness: 1. 6mm Thickness of copper clad: 0. 035mm
10. Taping
10.1 Applicable documents JIS C 0806−3: 1999, EIAJ ET−7103: 2004, EIAJ ET−7200B: 2003
10.2 Taping dimensions
10.2.1 Press pocket taping(8mm width, 2mm pitches)
Taping dimensions shall be in accordance with Figure−3 and Table−5.
Unit:mm
Figure−3
Table−5 Unit:mm
Style A B t
1 t 2 t 3
FCC10, FHC10 0.65±0.1 1.15±0.1 0.6±0.05 0.7max. 0.5±0.05
0.5
φ
3
φ
4.2
10
90
100
33
20
t1
+
0.1
φ1.5
0
4
±
0.05
1.75±0.1
t3
t2
2
±
0.05 3.5±0.05
8±0.2
A
B
Sprocket hole
Carrier cavity
Direction of unreeling
:Copper clad
:Solder resist
c b
a
c
K M Y Drawing No: FCC−K−HTS−0003 /12
Title: CHIP FUSES; RECTANGULAR TYPE
FCC10,16,20,32, FHC10,16,20,32 Page: 8/10
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.8.30
10.2.2 Paper taping (8mm width, 4mm pitches)
Taping dimensions shall be in accordance with Figure−4 and Table−6.
Unit:mm
Figure−4
Table−6 Unit:mm
Style A B t
1 t 2
FCC16, FHC16 1.15±0.15 1.9±0.2 0.6±0.1 0.8 max.
FCC20, FHC20 1.65±0.15 2.5±0.2
FCC32, FHC32 2.0±0.15 3.6±0.2 0.8±0.1 1.0 max.
1). The cover tapes shall not cover the sprocket holes.
2). Tapes in adjacent layers shall not stick together in the packing.
3). Components shall not stick to the carrier tape or to the cover tape.
4). Pitch tolerance over any 10 pitches ±0.2mm.
5). The peel strength of the top cover tape shall be with in 0.1N to 0.5N on the test method as shown in the following
FCC10:Figure−5,FCC16,20,32: Figure−6.
6). When the tape is bent with the minimum radius for 25 mm, the tape shall not be damaged and the components shall
maintain their position and orientation in the tape.
7). In no case shall there be two or more consecutive components missing.
The maximum number of missing components shall be one or 0.1%, whichever is greater.
8). The fuses shall be faced to upward at the over coating side in the carrier cavity.
Figure–5
Figure–6
t 1
t 2
+
0.1
φ1.5
0
4
±
0.1
2
±
0.05 1.75±0.1
8±0.2
4
±
0.1 3.5±0.05
A
B
Sprocket hole
Carrier cavity
Direction of unreeling
165°to 180°
Carrier tape
Top cover tape
Peel−off
(About 300mm/min)
Direction of unreeling
165°to180°
C
arr
i
er tape
Top cover tape
Peel
−
off
(
About 300mm
/
min
)
Di
rect
i
on o
f
unree
li
ng
K M Y Drawing No: FCC−K−HTS−0003 /12
Title: CHIP FUSES; RECTANGULAR TYPE
FCC10,16,20,32, FHC10,16,20,32 Page: 9/10
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.8.30
10.3 Reel dimension
Reel dimensions shall be in accordance with the following Figure−7 and Table−7.
Plastic reel (Based on EIAJ ET−7200B)
Unit:mm
Figure−7
Table−7 Unit:mm
Style A B Note
11.4±1.0 Injection molding
FCC10,16,20,32, FHC10,16,20,32 +1.0
9 0 13±1.0 Vacuum forming
Note: Marking label shall be marked on a place of Marking A or two place of marking A and B.
10.4 Leader and trailer tape.
(Example)
Figure−8
11. Marking on package
The label of a minimum package shall be legibly marked with follows.
11.1 Marking A
(1) Classification (Style, Rated current, Optional code, Packaging form) (2) Quantity (3) Lot number
(5) Manufacturer’s name or trade mark (6) UL and /or C−UL recognized component mark (7) Others
11.2 Marking B (KAMAYA Control label)
160mm min. 100mm min.
400mm min
.
End
Trailer
Direction of unreeling
Leader
Start
φ
21±0.8
2
±
0.5
Marking A
0
φ180
−1.5
+1
φ
60
0
φ
13±0.2
B
A
Marking B
K M Y Drawing No: FCC−K−HTS−0003 /12
Title: CHIP FUSES; RECTANGULAR TYPE
FCC10,16,20,32, FHC10,16,20,32 Page: 10/10
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.8.30
12. Recommended Derating for Rated Current
•Nominal Derating
Option Code AB: Nominal Derating ≤ 70% of Rated Current
Option Code AD: Nominal Derating ≤ 80% of Rated Current
•Temperature Derating
Please refer to the following graph regarding the current derating value for ambient temperature.
Ex.) • If Optional code: AB (Rated Current:1.0A) is used under ambient temperature 70°C
Kamaya recommends, less than the current value derated as below,
Rated Current: 1.0A × (Nominal Derating : 70% × Temperature Derating : 100%) =0.7A
• If Optional code: AD (Rated Current:1.0A) is used under ambient temperature 70°C
Kamaya recommends, less than the current value derated as below,
Rated Current: 1.0A × (Nominal Derating : 80% × Temperature Derating : 100%) =0.8A
0
20
40
60
80
100
Ambient temperature [°C]
Percent of rated current [%
-55 0 40 70 125
