5025-03R1 / 1531-1032 - MOLEX - Datasheet.Directory

R6020ANJ

　　Nch 600V 20A Power MOSFET 　　 Datasheet

llOutline

VDSS 600V TO-263

RDS(on)(Max.) 0.25Ω SC-83

ID±20A LPT(S)

PD304W 　

llInner circuit

llFeatures

1) Low on-resistance.

2) Fast switching speed.

3) Gate-source voltage (VGSS) guaranteed to

be ±30V.

4) Drive circuits can be simple.

5) Parallel use is easy.

6) Pb-free plating ; RoHS compliant

llPackaging specifications

Type

Packing Embossed

Tape

Reel size (mm) 330

llApplication Tape width (mm) 24

Switching Power Supply Basic ordering unit (pcs) 1000

Taping code TL

Marking R6020ANJ

llAbsolute maximum ratings (Ta = 25°C ,unless otherwise specified)

Parameter Symbol Value Unit

Drain - Source voltage VDSS 600 V

Continuous drain current (Tc = 25°C) ID*1 ±20 A

Pulsed drain current IDP*2 ±80 A

Gate - Source voltage VGSS ±30 V

Avalanche current, single pulse IAS*3 10 A

Avalanche energy, single pulse EAS*3 26.7 mJ

Power dissipation (Tc = 25°C) PD304 W

Junction temperature Tj150 ℃

Operating junction and storage temperature range Tstg -55 to +150 ℃

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R6020ANJ 　　　　　　　　　　　　　　 Datasheet

llThermal resistance 　　　　　　　　　　　　　　　　　　

Parameter Symbol

Values

Unit

Min. Typ. Max.

Thermal resistance, junction - case RthJC - - 0.41 ℃/W

Thermal resistance, junction - ambient RthJA - - 80 ℃/W

Soldering temperature, wavesoldering for 10s Tsold - - 265 ℃

llElectrical characteristics (Ta = 25°C)

Parameter Symbol Conditions

Values

Unit

Min. Typ. Max.

Drain - Source breakdown

voltage V(BR)DSS VGS = 0V, ID = 1mA 600 - - V

Zero gate voltage

drain current IDSS

VDS = 600V, VGS = 0V 　　　

μA

Tj = 25°C - 0.1 100

Tj = 125°C ---

Gate - Source leakage current IGSS VGS = ±30V, VDS = 0V - - ±100 nA

Gate threshold voltage VGS(th) VDS = 10V, ID = 1mA 2.5 - 4.5 V

Static drain - source

on - state resistance RDS(on)*4

VGS = 10V, ID = 10A 　　　

Ω

Tj = 25°C - 0.19 0.25

Tj = 125°C - 0.37 -

Gate resistance RG f = 1MHz, open drain - 13.4 - Ω

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R6020ANJ 　　　　　　　　　　　　　　 Datasheet

llElectrical characteristics (Ta = 25°C)

Parameter Symbol Conditions Values Unit

Min. Typ. Max.

Forward Transfer

Admittance |Yfs|*4 VDS = 10V, ID = 10A 7 14 - S

Input capacitance Ciss VGS = 0V - 2040 -

pFOutput capacitance Coss VDS = 25V - 1660 -

Reverse transfer capacitance Crss f = 1MHz - 70 -

Turn - on delay time td(on)*4 VDD ⋍ 300V, VGS = 10V - 40 -

ns

Rise time tr*4 ID = 10A - 60 -

Turn - off delay time td(off)*4 RL ⋍ 30Ω - 230 -

Fall time tf*4 RG = 10Ω - 70 -

llGate charge characteristics (Ta = 25°C)

Parameter Symbol Conditions Values Unit

Min. Typ. Max.

Total gate charge Qg*4 VDD ⋍ 300V - 65 -

nCGate - Source charge Qgs*4 ID = 20A - 10 -

Gate - Drain charge Qgd*4 VGS = 10V - 25 -

Gate plateau voltage V(plateau) VDD ⋍ 300V, ID = 20A - 5.9 - V

*1 Limited only by maximum temperature allowed.

*2 Pw ≤ 10μs, Duty cycle ≤ 1%

*3 L⋍500μH, VDD=50V, RG=25Ω, starting Tj=25°C

*4 Pulsed

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R6020ANJ 　　　　　　　　　　　　　　 Datasheet

llBody diode electrical characteristics (Source-Drain) (Ta = 25°C)

Parameter Symbol Conditions Values Unit

Min. Typ. Max.

Continuous forward

current IS*1

TC = 25℃

- - 20 A

Pulse forward current ISP*2 - - 80 A

Forward voltage VSD*4 VGS = 0V, IS = 20A - - 1.5 V

Reverse recovery time trr*4

IS = 20A

di/dt = 100A/μs

- 493 - ns

Reverse recovery charge Qrr*4 - 7.43 - μC

Peak reverse recovery current Irrm*4 - 30.2 - A

llTypical transient thermal characteristics 　　　　　　　　　　

Symbol Value Unit Symbol Value Unit

Rth1 0.0462

K/W

Cth1 0.00308

Ws/K

Rth2 0.17 Cth2 0.0118

Rth3 0.6 Cth3 0.232

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R6020ANJ 　　　　　　　　　　　　　　 Datasheet

llElectrical characteristic curves

Fig.1 Power Dissipation Derating Curve Fig.2 Maximum Safe Operating Area

Fig.3 Normalized Transient Thermal 　

　　　　　　　Resistance vs. Pulse Width

Fig.4 Avalanche Energy Derating Curve 　

　　　　　　　vs. Junction Temperature

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R6020ANJ 　　　　　　　　　　　　　　 Datasheet

llElectrical characteristic curves

Fig.5 Typical Output Characteristics(I) Fig.6 Typical Output Characteristics(II)

Fig.7 Tj = 150°C Typical Output 　　　　　　

　　Characteristics (I)

Fig.8 Tj = 150°C Typical Output 　　　　　　

　　Characteristics (II)

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R6020ANJ 　　　　　　　　　　　　　　 Datasheet

llElectrical characteristic curves

Fig.9 Normalized Breakdown Voltage vs. 　

　　　　　　　Junction Temperature

Fig.10 Typical Transfer Characteristics

Fig.11 Normalized Gate Threshold Voltage

vs. 　Junction Temperature

Fig.12 Forward Transfer Admittance vs.

Drain Current

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R6020ANJ 　　　　　　　　　　　　　　 Datasheet

llElectrical characteristic curves

Fig.13 Static Drain - Source On - State

　Resistance vs. Gate Source Voltage

Fig.14 Static Drain - Source On - State

　Resistance vs. Junction Temperature

Fig.15 Static Drain - Source On - State

　Resistance vs. Drain Current

Fig.16 Typical Capacitance vs. Drain -

　Source Voltage

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R6020ANJ 　　　　　　　　　　　　　　 Datasheet

llElectrical characteristic curves

Fig.17 Switching Characteristics Fig.18 Dynamic Input Characteristics

Fig.19 Inverse Diode Forward Current vs.

　Source - Drain Voltage

Fig.20 Reverse Recovery Time vs.

　Inverse Diode Forward Current

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R6020ANJ 　　　　　　　　　　　　　　 Datasheet

llMeasurement circuits

Fig.1-1 Switching Time Measurement Circuit Fig.1-2 Switching Waveforms

Fig.2-1 Gate Charge Measurement Circuit Fig.2-2 Gate Charge Waveform

Fig.3-1 Avalanche Measurement Circuit Fig.3-2 Avalanche Waveform

Fig.4-1 dv/dt Measurement Circuit Fig.4-2 dv/dt Waveform

Fig.5-1 di/dt Measurement Circuit Fig.5-2 di/dt Waveform

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R6020ANJ 　　　　　　　　　　　　　　　　　　　 Datasheet

llDimensions

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Notice-PGA-E Rev.003

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅡb

CLASSⅢ

CLASSⅣ

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

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Notice-PGA-E Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

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