MT9D131C12STC-DP - ON SEMICONDUCTOR

May, 2017 − Rev. 9

1Publication Order Number:

MT9M034/D

MT9M034

MT9M034 1/3-Inch CMOS

Digital Image Sensor

Table 1. KEY PARAMETERS

Parameter Value

Optical Format 1/3−inch (6 mm)

Active Pixels 1280 × 960 = 1.2 Mp

Pixel Size 3.75 μm

Color Filter Array RGB Bayer or Monochrome

Shutter Type Electronic Rolling Shutter

Input Clock Range 6–50 MHz

Output Clock Maximum 74.25 MHz

Output Parallel 12−bit

Frame Rate Full Resolution 45 fps

720p 60 fps

Responsivity 5.48 V/lux−sec

SNRMAX 43.9 dB

Maximum Dynamic Range >115 dB

Supply Voltage I/O 1.8 V* or 2.8 V

Digital 1.8 V

Analog 2.8 V

Power Consumption 270 mW (1280 × 720

60 fps Parallel Output Linear

Mode)

460 mW (1280 × 720 60 fps

Parallel Output HDR Mode)

Operating Temperature (ambient) −TA–30°C to + 70°C (Surveillance)

Package Options 10×10 mm 48−pin iLCC

Bare Die

*1.8 V VDD_IO is recommended due to better row noise performance

Features

•Superior Low−light performance

•HD Video (720p60)

•Linear or High Dynamic Range Capture

•Video/Single Frame Modes

•On−chip AE and Statistics Engine

•Parallel and Serial Output

•Auto Black Level Calibration

•Context Switching

•Temperature Sensor

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See detailed ordering and shipping information on page 2 of

this data sheet.

ORDERING INFORMATION

ILCC48 10x10

CASE 847AD

Applications

•Video Surveillance

•720p60 Video Applications

•High Dynamic Range Imaging

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ORDERING INFORMATION

Table 2. AVAILABLE PART NUMBERS

Part Number Product Description Orderable Product Attribute Description

MT9M034I12STC−DPBR1 1.2 MP 1/3” CIS Dry Pack with Protective Film, Double Side BBAR Glass

MT9M034I12STC−DRBR1 1.2 MP 1/3” CIS Dry Pack without Protective Film, Double Side BBAR Glass

MT9M034I12STM−DPBR1 1.2 MP 1/3” CIS Dry Pack with Protective Film, Double Side BBAR Glass

MT9M034I12STM−DRBR 1.2 MP 1/3” CIS Dry Pack without Protective Film, Double Side BBAR Glass

GENERAL DESCRIPTION

The ON Semiconductor MT9M034 is a 1/3−inch CMOS

digital image sensor with an active−pixel array of 1280 (H)

× 960 (V). It captures images in either linear or high dynamic

range modes, with a rolling−shutter readout. It includes

sophisticated camera functions such as auto exposure

control, windowing, and both video and single frame modes.

It is designed for both low light and high dynamic range

scene performance. It is programmable through a simple

two−wire serial interface. The MT9M034 produces

extraordinarily clear, sharp digital pictures, and its ability to

capture both continuous video and single frames makes it the

perfect choice for a wide range of applications, including

surveillance and HD video.

The ON Semiconductor MT9M034 can be operated in its

default mode or programmed for frame size, exposure, gain,

and other parameters. The default mode output is a

960p−resolution image at 45 frames per second (fps). In

linear mode, it outputs 12−bit raw data. In high dynamic

range mode, it outputs 12−bit compressed data using parallel

output. The device may be operated in video (master) mode

or in single frame trigger mode.

FRAME_VALID and LINE_VALID signals are output on

dedicated pins, along with a synchronized pixel clock in

parallel mode.

The MT9M034 includes additional features to allow

application−specific tuning: windowing and offset,

adjustable auto−exposure control, auto black level

correction, and on−board temperature sensor. Optional

be embedded in first and last 2 lines of the image frame.

The sensor is designed to operate in a wide temperature

range (–30°C to +70°C).

FUNCTIONAL OVERVIEW

The MT9M034 is a progressive−scan sensor that

generates a stream of pixel data at a constant frame rate. It

uses an on−chip, phase−locked loop (PLL) that can be

optionally enabled to generate all internal clocks from a

single master input clock running between 6 and 50 MHz

The maximum output pixel rate is 74.25 Mp/s,

corresponding to a clock rate of 74.25 MHz. Figure 1 shows

a block diagram of the sensor.

Figure 1. Block Diagram

Control Registers

PLL

MemoryOTPM External

Clock

Parallel

Output

Two−Wire

Serial

Interface

Trigger

Power

Active Pixel Sensor

(APS)

Array

Analog Processing and

A/D Conversion

Timing and Control

(Sequencer)

Auto Exposure

and Stats Engine

Pixel Data Path

(Signal Processing)

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User interaction with the sensor is through the two−wire

serial bus, which communicates with the array control,

analog signal chain, and digital signal chain. The core of the

sensor is a 1.2 Mp Active− Pixel Sensor array. The timing

and control circuitry sequences through the rows of the

array, resetting and then reading each row in turn. In the time

interval between resetting a row and reading that row, the

pixels in the row integrate incident light. The exposure is

controlled by varying the time interval between reset and

readout. Once a row has been read, the data from the

columns is sequenced through an analog signal chain

(providing offset correction and gain), and then through an

analog−to−digital converter (ADC). The output from the

ADC is a 12−bit value for each pixel in the array. The ADC

output passes through a digital processing signal chain

(which provides further data path corrections and applies

digital gain). The sensor also offers a high dynamic range

mode of operation where multiple images are combined

on−chip to produce a single image at 20−bit per pixel value.

A compressing mode is further offered to allow this 20−bit

pixel value to be transmitted to the host system as a 12−bit

value with close to zero loss in image quality. The pixel data

are output at a rate of up to 74.25 Mp/s, in parallel to frame

and line synchronization signals.

Figure 2. Typical Configuration: Parallel Pixel Data Interface

Notes:

Master clock

(6–50 MHz)

SDATA

SCLK

RESET_BAR

TEST

FRAME_VALID

DOUT [11:0]

EXTCLK

DGND

Digital

ground

Analog

ground

Controller

LINE_VALID

PIXCLK

1.5kΩ2

1.5kΩ2,3

VAA_PIX

VDD_IO VDD VDD_PLL VAA

Digital I/0

Power1

Digital

Core

Power1

PLL

Power1

Analog

Power1

Analog

Power1

1. All power supplies should be adequately decoupled.

2. ON Semiconductor recommends a resistor value of 1.5 kΩ, but a greater value may be used for slower two-wire speed.

3. The serial interface output pads and VDDSLVS can be left unconnected if the parallel output interface is used.

4. ON Semiconductor recommends that 0.1 μF and 10 μF decoupling capacitors for each power supply are mounted as

close as possible to the pad. Actual values and results may vary depending on layout and design considerations.

Check the demo headboard schematics for circuit recommendations.

5. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital

power planes is minimized.

6. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage currents.

7. The serial interface output pads and VDDSLVS can be left unconnected if the parallel output interface is used.

SADDR

OE_BAR

TRIGGER

AGND

From

Controller

VAA_PIX

STANDBY

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Figure 3. 48 iLCC Package, Parallel Output

DOUT7

DOUT8

DOUT9

DOUT10

DOUT11

VDD_IO

PIXCLK

VDD

SCLK

SDATA

RESET_BAR

VDD_IO

VAA

AGND

VAA_PIX

Reserved

VAA_PIX

VAA

AGND

VAA

Reserved

VDD

STANDBY

OE_BAR

SADDR

TEST

FLASH

TRIGGER

FRAME_VALID

LINE_VALID

DGND

EXTCLK

VDD_PLL

DOUT6

DGND

DOUT5

DOUT4

DOUT3

DOUT2

DOUT1

DOUT0

19 20 21 22 23 24 25 26 27 28 29 30

6 5 4 3 2 1 48 47 46 45 44 43

Reserved

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Table 3. PIN DESCRIPTION

Pin Number Name Type Description

1DOUT4Output Parallel pixel data output

2DOUT5Output Parallel pixel data output

3DOUT6Output Parallel pixel data output

4VDD_PLL Power PLL power

5 EXTCLK Input External input clock

6DGND Power Digital ground

7DOUT7Output Parallel pixel data output

8DOUT8Output Parallel pixel data output

9DOUT9Output Parallel pixel data output

10 DOUT10 Output Parallel pixel data output

11 DOUT11 Output Parallel pixel data output (MSB)

12 VDD_IO Power I/O supply power

13 PIXCLK Output Pixel clock out. DOUT is valid on rising edge of this clock

14 VDD Power Digital power

15 SCLK Input Two−Wire Serial clock input

16 SDATA I/O Two−Wire Serial data I/O

17 RESET_BAR Input Asynchronous reset (active LOW). All settings are restored to

factory default

18 VDD_IO Power I/O supply power

19 VDD Power Digital power

20 NC

21 NC

22 STANDBY Input Standby−mode enable pin (active HIGH)

23 OE_BAR Input Output enable (active LOW)

24 SADDR Input Two−Wire Serial address select

25 TEST Input Manufacturing test enable pin (connect to DGND)

26 FLASH Output Flash output control

27 TRIGGER Input Exposure synchronization input

28 FRAME_VALID Output Asserted when DOUT frame data is valid

29 LINE_VALID Output Asserted when DOUT line data is valid

30 DGND Power Digital ground

31 Reserved NC

32 Reserved NC

33 Reserved NC

34 VAA Power Analog power

35 AGND Power Analog ground

36 VAA Power Analog power

37 VAA_PIX Power Pixel power

38 VAA_PIX Power Pixel power

39 AGND Power Analog ground

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Table 3. PIN DESCRIPTION (continued)

Pin Number DescriptionTypeName

40 VAA Power Analog power

41 NC

42 NC

43 NC

44 DGND Power Digital ground

45 DOUT0Output Parallel pixel data output (LSB)

46 DOUT1Output Parallel pixel data output

47 DOUT2Output Parallel pixel data output

48 DOUT3Output Parallel pixel data output

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PIXEL DATA FORMAT

Pixel Array Structure

The MT9M034 pixel array is configured as 1412 columns

by 1028 rows, (see Figure 4). The dark pixels are optically

black and are used internally to monitor black level. Of the

right 100 columns, 64 are dark pixels used for row noise

correction. Of the top 24 rows of pixels, 12 of the dark rows

are used for black level correction. There are 1296 columns

by 976 rows of optically active pixels. While the sensor’s

format is 1280 × 960, the additional active columns and

active rows are included for use when horizontal or vertical

mirrored readout is enabled, to allow readout to start on the

same pixel. The pixel adjustment is always performed for

monochrome or color versions. The active area is

surrounded with optically transparent dummy pixels to

improve image uniformity within the active area. Not all

dummy pixels or barrier pixels can be read out.

Figure 4. Pixel Array Description

2 light dummy + 4 barrier + 24 dark + 4 barrier + 6 dark dummy

Dark pixel Barrier pixel Light dummy Active pixel

pixel

1412

2 light dummy + 4 barrier + 6 dark dummy

2 light dummy + 4 barrier + 100 dark + 4 barrier

1028

2 light dummy + 4 barrier

1296 x 976 (1288 x 968 active)

4.86 x 3.66 mm2(4.83 x 3.63 mm )

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Figure 5. Pixel Color Pattern Detail (Top Right Corner)

Active Pixel (0, 0)

Physical Pixel (122, 44)

Row Readout Direction

Column Readout Direction

Default Readout Order

By convention, the sensor core pixel array is shown with

pixel (0,0) in the top right corner (see Figure 5). This reflects

the actual layout of the array on the die. Also, the first pixel

data read out of the sensor in default condition is that of pixel

(112, 44).

When the sensor is imaging, the active surface of the

sensor faces the scene as shown in Figure 6. When the image

is read out of the sensor, it is read one row at a time, with the

rows and columns sequenced as shown in Figure 6.

Figure 6. Imaging a Scene

Lens

Pixel (0,0)

Row

Readout

Order

Column Readout Order

Scene

Sensor (rear view)

Digital Gain Control

MT9M034 supports four digital gains for the color

channels: Red, Green1 (green pixels on the red rows),

Green2 (green pixels on the blue rows), and Blue. Digital

gain control of the MT9M034 is dependent on the

configuration of the x_addr_start register. Table 4 illustrates

how the digital gains are applied when x_addr_start is even

or odd number.

Table 4. DIGITAL GAIN CONTROL FOR ODD AND EVEN X_ADDR_START (R0X3004)

Pixels x_addr_start Gain Register

Red Even red_gain R0x305A

Odd green1_gain R0x3056

Green1 (on Red rows) Even green1_gain R0x3056

Odd red_gain R0x305A

Green2 (on Blue rows) Even green2_gain R0x305C

Odd blue_gain R0x3058

Blue Even blue_gain R0x3058

Odd green2_gain R0x305C

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OUTPUT DATA FORMAT

The MT9M034 image data is read out in a progressive

scan. Valid image data is surrounded by horizontal and

vertical blanking (see Figure 7). The amount of horizontal

row time (in clocks) is programmable through R0x300C.

The amount of vertical frame time (in rows) is

programmable through R0x300A. Line_Valid (LV) is HIGH

during the shaded region of Figure 7. Optional Embedded

information are available in first 2 and last row of image

data.

Figure 7. Spatial Illustration of Image Readout

P0,0 P 0,1 P 0,2 .....................................P0,n−1P0,n

P1,0 P 1,1 P 1,2 .....................................P1,n−1P1,n

00 00 00 .................. 00 00 00

m−1,0 Pm−1,1 .....................................Pm−1,n−1P

m−1,n

m,0 Pm,1 .....................................Pm,n−1P

m,n

00 00 00 .................. 00 00 00

00 00 00 ..................................... 00 00 00

VALID IMAGE

HORIZONTAL

BLANKING

VERTICAL BLANKING VERTICAL/HORIZONTAL

BLANKING

Readout Sequence

Typically, the readout window is set to a region including

only active pixels. The user has the option of reading out

dark regions of the array, but if this is done, consideration

must be given to how the sensor reads the dark regions for

its own purposes.

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Parallel Output Data Timing

The output images are divided into frames, which are

further divided into lines. By default, the sensor produces

968 rows of 1284 columns each. The FV and LV signals

indicate the boundaries between frames and lines,

respectively. PIXCLK can be used as a clock to latch the

data. For each PIXCLK cycle, with respect to the falling

edge, one 12−bit pixel datum outputs on the DOUT pins.

When both FV and LV are asserted, the pixel is valid.

PIXCLK cycles that occur when FV is de−asserted are called

vertical blanking. PIXCLK cycles that occur when only LV

is de−asserted are called horizontal blanking.

Figure 8. Default Pixel Output Timing

ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ

PIXCLK

DOUT [11:0] P0 P1 P2 P3 P4

Vertical Blanking Horiz Blanking Valid Image Data Horiz Blanking Vertical Blanking

LV and FV

The timing of the FV and LV outputs is closely related to

the row time and the frame time.

FV will be asserted for an integral number of row times,

which will normally be equal to the height of the output

image.

LV will be asserted during the valid pixels of each row.

The leading edge of LV will be offset from the leading edge

of FV by 6 PIXCLKs. Normally, LV will only be asserted if

FV is asserted; this is configurable as described below.

LV Format Options

The default situation is for LV to be de−asserted when FV

is de−asserted. By configuring R0x306E[1:0], the LV signal

can take two different output formats. The formats for

reading out four lines and two vertical blanking lines are

shown in Figure 9.

Figure 9. LV Format Options

Default

Continuous LV

XOR LV

The timing of an entire frame is shown in Figure 10: “Line

Timing and FRAME_VALID/LINE_VALID Signals”.

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Frame Time

The pixel clock (PIXCLK) represents the time needed to

sample 1 pixel from the array. The sensor outputs data at the

maximum rate of 1 pixel per PIXCLK. One row time

(tROW) is the period from the first pixel output in a row to

the first pixel output in the next row. The row time and frame

time are defined by equations in Table 5.

Figure 10. Line Timing and FRAME_VALID/LINE_VALID Signals

P1 A QA QAP2

Number of master clocks

FRAME_VALID

LINE_VALID

...

Table 5. FRAME TIME (EXAMPLE BASED ON 1280 X 960, 45 FRAMES PER SECOND)

Parameters Name Equation

Default Timing

at 74.25 MHz

AActive Data Time Context A: R0x3008 − R0x3004 + 1

Context B: R0x308E − R0x308A + 1

1280 pixel clocks

= 17.23 μs

P1 Frame Start Blanking 6 (fixed) 6 pixel clocks

= 0.08 μs

P2 Frame End Blanking 6 (fixed) 6 pixel clocks

= 0.08 μs

QHorizontal Blanking R0x300C − A 370 pixel clocks

= 4.98 μs

A + Q (tROW) Line (Row) Time R0x300C 1650 pixel clocks

= 22.22 μs

VVertical Blanking Context A: (R0x300A−(R0x3006−R0x3002+1)) x (A + Q)

Context B: ((R0x30AA−(R0x3090−R0x308C+1)) x (A + Q)

49,500 pixel clocks

= 666.66 μs

Nrows × (A + Q) Frame Valid Time Context A: ((R0x3006−R0x3002+1) ×(A+Q))−Q+P1+P2

Context B: ((R0x3090−R0x308C+1) ×(A+Q))−Q+P1+P2

1,584,000 pixel clocks

= 21.33 ms

FTotal Frame Time V + (Nrows × (A + Q)) 1,633,500 pixel clocks

= 22.22 ms

Sensor timing is shown in terms of pixel clock cycles (see

Figure 7). The recommended pixel clock frequency is 74.25

MHz. The vertical blanking and the total frame time

equations assume that the integration time (coarse

integration time plus fine integration time) is less than the

number of active lines plus the blanking lines:

Window Height )Vertical Blanking (eq. 1)

If this is not the case, the number of integration lines must

be used instead to determine the frame time, (see Table 6).

In this example, it is assumed that the coarse integration time

control is programmed with 2000 rows and the fine shutter

width total is zero.

For Master mode, if the integration time registers exceed

the total readout time, then the vertical blanking time is

internally extended automatically to adjust for the additional

integration time required. This extended value is not written

back to the frame_length_lines register. The

frame_length_lines register can be used to adjust

frame−to−frame readout time. This register does not affect

the exposure time but it may extend the readout time.

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Table 6. FRAME TIME: LONG INTEGRATION TIME

Parameters Name Equation (Number of Pixel Clock Cycles)

Default Timing

at 74.25 MHz

F’Total Frame Time

(Long Integration Time)

Context A: (R0x3012 x (A + Q)) + R0x3014 + P1 + P2

Context B: (R0x3016 x (A + Q)) + V R0x3018 + P1 + P2

3,300,012 pixel

clocks

= 44.44 ms

1. The MT9M034 uses column parallel analog−digital converters; thus short line timing is not possible. The minimum total line time is 1650

columns (horizontal width + horizontal blanking) for HDR mode and 1400 for linear mode. The minimum horizontal blanking is 370.

Exposure

Total integration time is the result of

Coarse_Integration_Time and Fine_Integration_Time

registers, and depends also on whether manual or automatic

exposure is selected.

The actual total integration time, tINT is defined as:

tINT +tINTCoarse *410 *tINTFine (eq. 2)

= (number of lines of integration x line time) − (410 pixel

clocks of conversion time overhead) − (number of pixels of

integration x pixel time)

where:

♦Number of Lines of Integration (Auto Exposure

Control: Enabled)

When automatic exposure control (AEC) is enabled,

the number of lines of integration may vary from

frame to frame, with the limits controlled by

R0x311E (minimum auto exposure time) and

R0x311C (maximum auto exposure time)

♦Number of Lines of Integration (Auto Exposure

Control: Disabled)

If AEC is disabled, the number of lines of

integration equals the value in R0x3012 (context A)

or R0x3016 (context B)

♦Number of Pixels of Integration

The number of fine shutter width pixels is

independent of AEC mode (enabled or disabled):

−Context A: the number of pixels of integration

equals the value in R0x3014

−Context B: the number of pixels of integration

equals the value in R0x3018. Maximum value for

tINTFine is line length pixel clocks − 611

Typically, the value of the Coarse_Integration_Time

includes vertical blanking lines), such that the frame rate is

not affected by the integration time. For more information

on coarse and fine integration time settings limits, please

refer to the Register Reference document.

NOTE: In HDR mode, there are specific limitations on

coarse_integration_time due to the number of

line buffers available. Please refer to the section

called “HDR Specific Exposure Settings”.

For best image quality, it is recommended that the

integration time be set to two rows or greater for the shortest

exposure, particularly for monochrome sensors. For linear

mode, this would be the coarse integration time (R0x3012).

For HDR mode, the integration time should be set such that

the T3 exposure is 2 rows or greater. Setting the exposure

time to 1 row may result in non−uniformity between rows.

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HIGH DYNAMIC RANGE MODE

By default, the sensor powers up in Linear Mode,

however, the MT9M034 can be configured to run in HDR

mode. The HDR scheme used is multi−exposure HDR. This

allows the sensor to handle 120 dB of dynamic range. The

sensor also features a linear mode. In HDR mode, the sensor

sequentially captures three exposures by maintaining 3

separate read and reset pointers that are interleaved within

the rolling shutter readout. The intermediate pixel values are

stored in line buffers while waiting for the 3 exposures

values to be present. As soon as a pixel’s 3 exposure values

are available, they are combined to create a linearized 20−bit

value for each pixel’s response. This 20−bit value is then

optionally compressed back to a 12− or 14−bit value for

output. For 14−bit mode, the compressing is lossless. In

12−bit mode, there is minimal data loss. Figure 11 shows the

HDR data compression:

Figure 11. HDR Data Compression

Signal Response to Light Intensity

Digital output

code

K1 = knee point 1

K2 = knee point 2

Pout = P

Decompressed linear

output

ADC max code

Piece−wise Compressed

Signal Output From

Sensor

The HDR mode is selected when Operation_Mode_Ctrl,

R0x3082[1:0] = 0. Further controls on exposure time limits

and compressing are controlled by R0x3082[5:2], and

R0x31D0. More details can be found in the MT9M034

In HDR mode, when compression is used, there are two

types of knee−points: (i) T1/T2 and T2/T3 capture

knee−points and (ii) POUT and POUT2 compression

knee−points (Figure 11). Aligning the capture knee−points

on top of the compression knee−points, can avoid code

losses (SNR loss) in the compression. Table 7 and Table 8

below show the knee points for the different modes.

Alternatively, the sensor automatically reports the knee

points and can be read directly from registers R0x319A and

R0x319C.

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Table 7. KNEE POINTS FOR COMPRESSION TO 14 BITS

T1/T2

Exposure

Ratio (R1)

R0x3082[3:2] P1 POUT1 = P1 P2

POUT2 =

(P2 − P1) / R1 + POUT1

T2/T3

Exposure

Ratio (R2)

R0x3082[5:4] PMAX

POUTMAX

= (PMAX − P2) /

(R1  R2) + POUT2

4x 212 4096 214 7168 4x 216 10240

8x 217 10752

16x 218 11008

8x 212 4096 215 7680 4x 217 10752

8x 218 11264

16x 219 11520

16x 212 4096 216 7936 4x 218 11008

8x 219 11520

16x 220 11776

Table 8. KNEE POINTS FOR COMPRESSION TO 12 BITS

T1/T2

Exposure

Ratio (R1)

R0x3082[3:2] P1 POUT1 = P1 P2

POUT2 =

(P2 − P1) / R1 + POUT1

T2/T3

Exposure

Ratio (R2)

R0x3082[5:4] PMAX

POUTMAX

= (PMAX − P2) /

(R1  R2) + POUT2

4x 211 2048 214 2944 8x 217 3840

16x 218 3904

8x 211 2048 215 3008 4x 217 3776

8x 218 3904

16x 219 3968

16x 211 2048 216 3040 4x 218 3808

8x 219 3936

16x 220 4000

HDR Specific Exposure Settings

In HDR mode, pixel values are stored in line buffers while

waiting for all 3 exposures to be available for final pixel data

combination. There are 42 line buffers used to store

intermediate T1 data. Due to this limitation, the maximum

coarse integration time possible is equal to 42 ×T1 / T2 lines.

For example, if R0x3082[3:2] = 2, the sensor is set to have

T1/T2 ratio = 16x. Therefore the maximum number of

integration lines is 42 × 16 = 672 lines.

If coarse integration time is greater than this, the T2

integration time will stay at 42. The sensor will calculate the

ratio internally,enabling the linearization to be performed.

If companding is being than relinearization would still

follow the programmed ratio. For example if the T1 / T2

ratio was programmed to 16x but coarse integration was

increased beyond 672 than one would still use the 16x

relinearization formulas.

An additional limitation is the maximum number of

exposure lines in relation to the frame_length_lines register.

In Linear mode, maximum coarse_integration_time =

frame_length_lines − 1. However in HDR mode, since the

coarse integration time register controls T1, the max

coarse_integration time is frame_length_lines − 45.

Putting the two criteria listed above together, it can be

summarized as follows:

maximum coarse_integration_time +minimum(42 T1ńT2, frame_length_lines *45) (eq. 3)

In HDR mode, subline integration is not utilized. As such,

fine integration time register changes will have no effect on

the image.

There is also a limitation of the minimum number of

exposure lines that can be used. This is summarized in the

following formula:

minimumcoarse_integration_time +(0.5) (T1ńT2) (T2ńT3) (eq. 4)

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Due to limitation on the internal floating point calculation,

the exact ratio specified by the RATIO_T2_T3

(R0x3082[5:4]) may not be achievable.

When using companded output in combination with

certain exposure ratios (other than T1 / T2 = 16x and T2 / T3

= 16x), digital gain needs to be set to a fixed value. Table

below provides the proper digital gain settings for each

T1 / T2 and T2 / T3 ratio.

Table 9. DIGITAL GAIN SETTING FOR EACH T1 / T2 AND T2 / T3 RATIO

T1 / T2 Ratio T2 / T3 Ratio

Setting for Digital Gain Register

(0x305E Context A or 0x30C4 Context B)

4 4 0x02h

4 8 0x04h

4 16 0x08h

8 4 0x04h

8 8 0x08h

8 16 0x10h

16 4 0x08h

16 8 0x10h

16 16 Any Legal Value

Motion Compensation

In typical multi−exposure HDR systems, motion artifacts

can be created when objects move during the T1, T2 or T3

integration time. When this happens, edge artifacts can

potentially be visible and might look like a ghosting effect.

To correct this feature, the MT9M034 has special 2D

motion compensation circuitry that detects motion artifacts

and corrects the image accordingly.

There are two motion compensation options available.

One using the default HDR motion compensation by setting

R0x318C[14] = 1. Additional parameters are available to

control the extent of motion detection and correction as per

the requirements of the specific application. These can be set

in R0x318C–R0x3190. The other is using the DLO method

of HDR combination. When using DLO, R0x318C[14] is

ignored. DLO is enabled by setting R0x3190[13] = 1. Noise

filtering is enabled by setting R0x3190[14] = 1. For more

information, please refer to the MT9M034 Register

Reference document.

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REAL−TIME CONTEXT SWITCHING

In the MT9M034, the user may switch between two full

switch change bit in R0x30B0[13]. This context switch will

change all registers (no shadowing) at the frame start time

and have the new values apply to the immediate next

exposure and readout time.

Table 10. REAL−TIME CONTEXT−SWITCH REGISTERS

Context A Context B

Y_Addr_Start R0x3002 R0x308C

X_Addr_Start R0x3004 R0x308A

Y_Addr_End R0x3006 R0x3090

X_Addr_End R0x3008 R0x308E

Coarse_Integration_Time R0x3012 R0x3016

Fine_Integration_Time R0x3014 R0x3018

Y_Odd_Inc R0x30A6 R0x30A8

Column Gain R0x30B0[5:4] R0x30B0[9:8]

Green1_Gain (GreenR) R0x3056 R0x30BC

Blue_Gain R0x3058 R0x30BE

Red_Gain R0x305A R0x30C0

Green2_Gain (GreenB) R0x305C R0x30C2

Global_Gain R0x305E R0x30C4

Frame_Length_Lines R0x300A R0x30AA

Digital_Binning R0x3032[1:0] R0x3032[5:4]

Operation_Mode_Ctrl 0x3082 0x3084

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FEATURES

See the MT9M034 Register Reference for additional

details.

Reset

The MT9M034 may be reset by using RESET_BAR

(active LOW) or the reset register.

Hard Reset of Logic

The RESET_BAR pin can be connected to an external RC

circuit for simplicity. The recommended RC circuit uses a

10 kΩ resistor and a 0.1 μF capacitor. The rise time for the

RC circuit is 1 μs maximum.

Soft Reset of Logic

Soft reset of logic is controlled by the R0x301A Reset

while preserving the existing two−wire serial interface

configuration. Furthermore, by asserting the soft reset, the

sensor aborts the current frame it is processing and starts a

new frame. This bit is a self−resetting bit and also returns to

“0” during two−wire serial interface reads.

Clocks

The MT9M034 requires one clock input (EXTCLK).

PLL−Generated Master Clock

The PLL contains a prescaler to divide the input clock

applied on EXTCLK, a VCO to multiply the prescaler

output, and two divider stages to generate the output clock.

The clocking structure is shown in Figure 12. PLL control

registers can be programmed to generate desired master

clock frequency.

NOTE: The PLL control registers must be programmed

while the sensor is in the software Standby state.

The effect of programming the PLL divisors

while the sensor is in the streaming state is

undefined.

Figure 12. PLL−Generated Master Clock PLL Setup

Pre_pll_clk_div

EXTCLK

vt_sys_clk_div

pll_multiplier

PIXCLK

Pre PLL

Div

(PFD)

PLL

Multiplier

(VCO)

PLL Output

Div1

PLL Output

Div2

vt_pix_clk_div

SYSCLKPLL Output

Clock

PLL Input

Clock

The PLL is enabled by default on the MT9M034. To

configure and use the PLL:

1. Bring the MT9M034 up as normal; make sure that

fEXTCLK is between 6 and 50 MHz and ensure

the sensor is in software standby (R0x301A−B[2]

= 0). PLL control registers must be set in software

standby.

2. Set pll_multiplier, pre_pll_clk_div, vt_sys_clk_siv,

and vt_pix_clk_div based on the desired input

(fEXTCLK) and output (fPIXCLK) frequencies.

Determine the M, N, P1, and P2 values to achieve

the desired fPIXCLK using this formula:

fPIXCLK= (fEXTCLK × M) / (N × P1 x P2)

where

M = PLL_Multiplier

N = Pre_PLL_Clk_Div

P1 = Vt_Sys_Clk_Div

P2 = Vt_PIX_Clk_Div

3. Wait 1 ms to ensure that the VCO has locked.

4. Set R0x301A[2] = 1 to enable streaming and to

switch from EXTCLK to the PLL−generated

clock.

NOTES:

1. The PLL can be bypassed at any time (sensor will

run directly off EXTCLK) by setting

R0x30B0[14] = 1. The PLL is always bypassed in

software standby mode. To disable the PLL, the

sensor must be in standby mode (R0x301A[2] = 0)

2. The following restrictions apply to the PLL tuning

parameters:

32  M  255

1  N  63

1  P1  16(P1 = 1, 2, 3, 4, 6, 8, 10, 12, 14, 16)

4  P2  16

3. The VCO frequency, defined as fVCO = fEXTCLK ×

M / N must be within 384−768 MHz.

4. When PLL_Multiplier is odd, 2 MHz <= fEXTCLK

/ N <= 24 MHz

The user can utilize the Register Wizard tool

accompanying DevWare to generate PLL settings given a

supplied input clock and desired output frequency.

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Spread−Spectrum Clocking

To facilitate improved EMI performance, the external

clock input allows for spread spectrum sources, with no

impact on image quality. Limits of the spread spectrum input

clock are:

•5% maximum clock modulation

•35 KHz maximum modulation frequency

•Accepts triangle wave modulation, as well as sine or

modified triangle modulations.

Stream/Standby Control

The sensor supports two standby modes: Hard Standby

and Soft Standby. In both modes, external clock can be

optionally disabled to further minimize power consumption.

If this is done, then the “Power−Up Sequence” must be

followed.

Soft Standby

Soft Standby is a low power state that is controlled

through register R0x301A[2]. Depending on the value of

R0x301A[4], the sensor will go to standby after completion

of the current frame readout (default behavior) or after the

completion of the current row readout. When the sensor

comes back from Soft Standby, previously written register

settings are still maintained. Soft standby will not occur if

the TRIGGER pin is held high.

A specific sequence needs to be followed to enter and exit

from Soft Standby.

Entering Soft Standby:

1. Set R0x301A[2] = 0 and drive the TRIGGER pin

LOW

2. External clock can be turned off to further

minimize power consumption (Optional)

Exiting Soft Standby:

1. Enable external clock if it was turned off

2. R0x301A[2] = 1 or drive the TRIGGER pin HIGH

Hard Standby

Hard Standby puts the sensor in lower power state;

previously written register settings are still maintained.

A specific sequence needs to be followed to enter and exit

from Hard Standby.

Entering Hard Standby:

1. R0x301A[8] = 1

2. Assert STANDBY pin

3. External clock can be turned off to further

minimize power consumption (Optional)

Exiting Hard Standby:

1. Enable external clock if it was turned off

2. De−assert STANDBY pin

3. Set R0x301A[8] = 0

Window Control

Registers x_addr_start, x_addr_end, y_addr_start, and

y_addr_end control the size and starting coordinates of the

image window.

The exact window height and width out of the sensor is

determined by the difference between the Y address start and

end registers or the X address start and end registers,

respectively.

The MT9M034 allows different window sizes for context

A and context B.

Blanking Control

Horizontal blank and vertical blank times are controlled

by the line_length_pck and frame_length_lines registers,

respectively.

•Horizontal blanking is specified in terms of pixel

clocks. It is calculated by subtracting the X window

size from the line_length_pck register. The minimum

horizontal blanking is 370 pixel clocks.

•Vertical blanking is specified in terms of numbers of

lines. It is calculated by subtracting the Y window size

from the frame_length_lines register. The minimum

vertical blanking is 26 lines.

The actual imager timing can be calculated using Table 5

and Table 6, which describe the Line Timing and FV/LV

signals.

When in HDR mode, the maximum size is 1280 × 960.

Readout Modes

Digital Binning

By default, the resolution of the output image is the full

width and height of the FOV as defined above. The output

resolution can be reduced by digital binning. For RGB and

monochrome mode, this is set by the register R0x3032. For

Context A, use bits [1:0], for Context B, use bits [5:4].

Available settings are:

00 = No binning

01 = Horizontal binning

10 = Horizontal and vertical binning

Binning gives the advantage of reducing noise at the cost

of reduced resolution. When both horizontal and vertical

binning are used, a 2x improvement in SNR is achieved,

therefore improving low light performance. Binning results

in a smaller resolution image, but the FOVs between the

binned and unbinned images are the same.

Bayer Space Resampling

All of the pixels in the FOV contribute to the output image

in digital binning mode. This can result in a more pleasing

output image with reduced subsampling artifacts. It also

improves low−light performance. For RGB mode,

resampling can be enabled by setting of register 0x306E[4]

= 1.

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Mirror

Column Mirror Image

By setting R0x3040[14] = 1, the readout order of the

columns is reversed, as shown in Figure 13. The starting

Bayer color pixel is maintained in this mode by a 1−pixel

shift in the imaging array.

When using horizontal mirror mode, the user must

retrigger column correction. Please refer to the column

correction section to see the procedure for column

correction retriggering. Bayer resampling must be enabled,

by setting bit 4 of register 0x306E[4] = 1.

Figure 13. Eight Pixels in Normal and Column Mirror Readout Modes

G0[11:0] R0[11:0] G1[11:0] R1[11:0] G2[11:0] R2[11:0]

G3[11:0] R3[11:0] G2[11:0] R2[11:0] G1[11:0] R1[11:0]

DOUT [11:0]

Normal readout

DOUT [11:0]

Reverse readout

G3[11:0] R3[11:0]

G0[11:0] R0[11:0]

Row Mirror Image

By setting R0x3040[15] = 1, the readout order of the rows

is reversed as shown in Figure 14. The starting Bayer color

pixel is maintained in this mode by a 1−pixel shift in the

imaging array. When using horizontal mirror mode, the user

must retrigger column correction. Please refer to the column

correction section to see the procedure for column

correction retriggering.

Figure 14. Six Rows in Normal and Row Mirror Readout Modes

Row0[11:0] Row1[11:0] Row2[11:0] Row3[11:0] Row4[11:0] Row5[11:0]

DOUT [11:0]

Normal readout

DOUT [11:0]

Reverse readout

Row0[11:0]Row1[11:0]Row2[11:0]Row3[11:0]Row4[11:0]Row5[11:0]

Maintaining a Constant Frame Rate

Maintaining a constant frame rate while continuing to

have the ability to adjust certain parameters is the desired

scenario. This is not always possible, however, because

shutter pointer for a frame is usually active during the

readout of the previous frame. Therefore, any register

changes that could affect the row time or the set of rows

sampled causes the shutter pointer to start over at the

beginning of the next frame.

By default, the following register fields cause a “bubble”

in the output rate (that is, the vertical blank increases for one

frame) if they are written in video mode, even if the new

value would not change the resulting frame rate. The

following list shows only a few examples of such registers;

a full listing can be seen in the MT9M034 Register

Reference.

•x_addr_start

•x_addr_end

•y_addr_start

•y_addr_end

•frame_length_lines

•line_length_pclk

•coarse_integration_time

•fine_integration_time

•read_mode

The size of this bubble is (Integration_Time × t

ROW),

calculating the row time according to the new settings.

The Coarse_Integration_Time and Fine_Integration

_Time fields may be written to without causing a bubble in

the output rate under certain circumstances. Because the

shutter sequence for the next frame often is active during the

output of the current frame, this would not be possible

without special provisions in the hardware. Writes to these

registers take effect two frames after the frame they are

written, which allows the integration time to increase

without interrupting the output or producing a corrupt frame

(as long as the change in integration time does not affect the

frame time).

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Synchronizing Register Writes to Frame Boundaries

Changes to most register fields that affect the size or

brightness of an image take effect on two frames after the

one during which they are written. These fields are noted as

“synchronized to frame boundaries” in the MT9M034

effect on the next frame, the write operation must be

completed after the leading edge of FV and before the

trailing edge of FV.

Fields not identified as being frame−synchronized are

updated immediately after the register write is completed.

The effect of these registers on the next frame can be difficult

to predict if they affect the shutter pointer.

Restart

To restart the MT9M034 at any time during the operation

of the sensor, write a “1” to the Restart register (R0x301A[1]

= 1). This has two effects: first, the current frame is

interrupted immediately. Second, any writes to

frame−synchronized registers and the shutter width registers

take effect immediately, and a new frame starts (in video

mode). The current row completes before the new frame is

started, so the time between issuing the Restart and the

beginning of the next frame can vary by about tROW.

Image Acquisition Modes

The MT9M034 supports two image acquisition modes:

video(master) and single frame.

Video

The video mode takes pictures by scanning the rows of the

sensor twice. On the first scan, each row is released from

reset, starting the exposure. On the second scan, the row is

sampled, processed, and returned to the reset state. The

exposure for any row is therefore the time between the first

and second scans. Each row is exposed for the same

duration, but at slightly different point in time, which can

cause a shear in moving subjects as is typical with electronic

rolling shutter sensors.

Single Frame

The single−frame mode operates similar to the video

mode. It also scans the rows of the sensor twice, first to reset

the rows and second to read the rows. Unlike video mode

where a continuous stream of images are output from the

image sensor, the single−frame mode outputs a single frame

in response to a high state placed on the TRIGGER input pin.

As long as the TRIGGER pin is held in a high state, new

images will be read out. After the TRIGGER pin is returned

to a low state, the image sensor will not output any new

images and will wait for the next high state on the TRIGGER

pin.

The TRIGGER pin state is detected during the vertical

blanking period (i.e. the FV signal is low). The pin is level

sensitive rather than edge sensitive. As such, image

integration will only begin when the sensor detects that the

TRIGGER pin has been held high for 3 consecutive clock

cycles. If the trigger signal is applied to multiple sensors at

the same time, the single frame output of the sensors will be

synchronized to within 1 PIXCLK if is PLL disabled or 2

PIXCLKs if PLL is enabled.

During integration time of single−frame mode and video

mode, the FLASH output pin is at high.

Continuous Trigger

In certain applications, multiple sensors need to have their

video streams synchronized (E.g. surround view or

panorama view applications). The TRIGGER pin can also

be used to synchronize output of multiple image sensors

together and still get a video stream. This is called

continuous trigger mode. Continuous trigger is enabled by

holding the TRIGGER pin high. Alternatively, the

TRIGGER pin can be held high until the stream bit is

enabled (R0x301A[2] = 1) then can be released for

continuous synchronized video streaming.

If the TRIGGER pins for all connected MT9M034 sensors

are connected to the same control signal, all sensors will

receive the trigger pulse at the same time. If they are

configured to have the same frame timing, then the usage of

the TRIGGER pin guarantees that all sensors will be

synchronized within 1 PIXCLK cycle if PLL is disabled, or

2 PIXCLK cycles if PLL is enabled.

With continuous trigger mode, the application can now

make use of the video streaming mode while guaranteeing

that all sensor outputs are synchronized. As long as the initial

trigger for the sensors takes place at the same time, all

subsequent video streams will be synchronous.

Temperature Sensor

The MT9M034 sensor has a built−in PTAT−based

temperature sensor, accessible through registers, that is

capable of measuring die junction temperature.

The temperature sensor can be enabled by writing

R0x30B4[0] = 1 and R0x30B4[4] = 1. After this, the

temperature sensor output value can be read from

R0x30B2[10:0].

The value read out from the temperature sensor register is

an ADC output value that needs to be converted downstream

to a final temperature value in degrees Celsius. Since the

PTAT device characteristic response is quite linear in the

temperature range of operation required, a simple linear

function in the format of listed in the equation below can be

used to convert the ADC output value to the final

temperature in degrees Celsius.

Temperature +slope R0x30B2[10 : 0] )T0(eq. 5)

For this conversion, a minimum of 2 known points are

needed to construct the line formula by identifying the slope

and y−intercept “T0”. These calibration values can be read

from registers R0x30C6 and R0x30C8 which correspond to

value read at 70°C and 55°C respectively. Once read, the

slope and y−intercept values can be calculated and used in

the above equation.

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For more information on the temperature sensor registers,

refer to the MT9M034 Register Reference.

Automatic Exposure Control

The integrated automatic exposure control (AEC) is

responsible for ensuring that optimal settings of exposure

and gain are computed and updated every other frame. AEC

can be enabled or disabled by R0x3100[0].

When AEC is disabled (R0x3100[0] = 0), the sensor uses

the manual exposure value in coarse and fine shutter width

registers and the manual gain value in the gain registers.

When AEC is enabled (R0x3100[0] = 1), the target luma

value in linear mode is set by R0x3102. For the MT9M034

this target luma has a default value of 0x0800 or about half

scale. For HDR mode, the luma target maximum auto

exposure value is limited by R0x311C; the minimum auto

exposure is limited by R0x311E. These values are in units of

line−times.

The exposure control measures current scene luminosity

by accumulating a histogram of pixel values while reading

out a frame. It then compares the current luminosity to the

desired output luminosity. Finally, the appropriate

adjustments are made to the exposure time and gain. All

pixels are used, regardless of color or mono mode. In HDR

mode, the coarse and fine integration time is the longest

integration time of the three integration, the other two

shorter integration are generated automatically base on the

pre−defined exposure ratios. When using non−default HDR

exposure ratios, auto_dg_en should not be enabled

(R0x3100[4] = 0) due to required digital gains as

documented in Table 9, “Digital Gain Setting for Each T1 /

T2 and T2 / T3 Ratio”.

Embedded Data and Statistics

The MT9M034 has the capability to output image data

and statistics embedded within the frame timing. There are

2 types of information embedded within the frame readout:

1. Embedded Data: If enabled, these are displayed on

the 2 rows immediately before the first active pixel

row is displayed

2. Embedded Statistics: If enabled, these are

displayed on the 2 rows immediately after the last

active pixel row is displayed

NOTE: Embedded data and embedded statistics must be

enabled or disabled together.

Figure 15. Frame Format with Embedded Data Lines Enabled

Image

Status & Statistics Data

HBlank

VBlank

Embedded Data

The embedded data contains the configuration of the

image being displayed. This includes all register settings

used to capture the current frame. The registers embedded

in these rows are as follows:

Line 1:

Registers R0x3000 to R0x312F

Line 2:

Registers R0x3136 to R0x31BF, R0x31D0 to R0x31FF

NOTE: All non−defined registers will have a value of 0.

In parallel mode, since the pixel word depth is

12−bits/pixel, the sensor 16−bit register data will be

transferred over 2 pixels where the register data will be

broken up into 8msb and 8lsb. The alignment of the 8bit data

will be on the 8MSB bits of the 12−bit pixel word. For

example, if a register value of 0x1234 is to be transmitted,

it will be transmitted over 2, 12−bit pixels as follows: 0x120,

0x340.

The first pixel of each line in the embedded data is a tag

value of 0x0A0. This signifies that all subsequent data is 8

bit data aligned to the MSB of the 12−bit pixel.

The figure below summarizes how the embedded data

transmission looks like. It should be noted that data, as

shown in Figure 16, is aligned to the MSB of each word:

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Figure 16. Format of Embedded Data Output within a Frame

{register_

value_LSB} 8’h5A

Data line 1

Data line 2

8’h5A

8’hAA {register_

address_MSB} 8’hA5 {register_

address_LSB} 8’h5A {register_

value_MSB} 8’h5A

{register_

value_LSB}

data_format_

code =8’h0A

8’hAA

{register_

address_MSB} 8’hA5 {register_

address_LSB} 8’h5A {register_

value_MSB} 8’h5A

data_format_

code =8’h0A

The data embedded in these rows are as follows:

•0x0A0 − identifier

•0xAA0

•Register Address MSB of the first register

•0xA50

•Register Address LSB of the first register

•0x5A0

•Register Value MSB of the first register addressed

•0x5A0

•Register Value LSB of the first register addressed

•0x5A0

•Register Value MSB of the register at first address + 2

•0x5A0

•Register Value LSB of the register at first address + 2

•0x5A0

•etc.

Embedded Statistics

The embedded statistics contain frame identifiers and

histogram information of the image in the frame. This can be

used by downstream auto−exposure algorithm blocks to

make decisions about exposure adjustment.

This histogram is divided into 244 bins with a bin spacing

of 64 evenly spaced bins for digital code values 0 to 212, 120

evenly spaced bins for values 212 to 216, 60 evenly spaced

bins for values 216 to 220. In HDR with a 16x exposure ratio,

this approximately corresponds to the T1, T2, T3 exposures

respectively.

The first pixel of each line in the embedded statistics is a

tag value of 0x0B0. This signifies that all subsequent

statistics data is 10 bit data aligned to the MSB of the 12−bit

pixel.

The figure below summarizes how the embedded

statistics transmission looks like. It should be noted that

data, as shown in Figure 17, is aligned to the msb of each

word:

Figure 17. Format of Embedded Statistics Output within a Frame

{2’b00,frame

_countLSB}

{2’b00,frame

_IDMSB}

{2’b00,frame

_IDLSB}

histogram

bin0[9:0]

histogram

bin1[9:0]

#words=

10’h1EC

data_format_

code=8’h0B

#words=

10’h00C

data_format_

code=8’h0B

mean

[9:0]

histBegin

[19:10]

histBegin

[9:0]

histEnd

[19:10]

histEnd

[9:0]

lowEndMean

[19:10]

lowEndMean

[9:0]

perc_lowEnd

[19:10]

perc_lowEnd

[9:0]

norm_abs_

dev[19:10]

norm_abs_

dev[9:0]

8’h07 8’h07

8’h07

statsline1

statsline2

histogram

bin0[19:10]

histogram

bin243 [19:0]

histogram

bin243 [9:0]

histogram

bin1 [19:0]

mean

[19:10]

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The statistics embedded in these rows are as follows:

Line 1:

•0x0B0 − (identifier)

•Register 0x303A − frame_count

•Register 0x31D2 − frame ID

•Histogram data − histogram bins 0−243

Line 2:

•0x0B0 (identifier)

•Mean

•Histogram Begin

•Histogram End

•Low End Histogram Mean

•Percentage of Pixels Below Low End Mean

•Normal Absolute Deviation

Gain

Digital Gain

Digital gain can be controlled globally by R0x305E

(Context A) or R0x30C4 (Context B). There are also

registers that allow individual control over each Bayer color

(GreenR, GreenB, Red, Blue).

The format for digital gain setting is xxx.yyyyy where

0b00100000 represents a 1x gain setting and 0b00110000

represents a 1.5x gain setting. The step size for yyyyy is

0.03125 while the step size for xxx is 1. Therefore to set a

gain of 2.09375 one would set digital gain to 01000011.

Analog Gain

The MT9M034 has a column parallel architecture and

therefore has an Analog gain stage per column.

There are 2 stages of analog gain, the first stage can be set

to 1x, 2x, 4x or 8x. This can be set in R0x30B0[5:4] (Context

A) or R0x30B0[9:8] (Context B). The second stage is

capable of setting an additional 1x or 1.25x gain which can

be set in R0x3EE4[9:8].

This allows the maximum possible analog gain to be set

to 10x.

Black Level Correction

Black level correction is handled automatically by the

image sensor. No adjustments are provided except to enable

or disable this feature. Setting R0x30EA[15] disables the

automatic black level correction. Default setting is for

automatic black level calibration to be enabled.

The automatic black level correction measures the

average value of pixels from a set of optically black lines in

the image sensor. The pixels are averaged as if they were

light−sensitive and passed through the appropriate gain.

This line average is then digitally low−pass filtered over

many frames to remove temporal noise and random

instabilities associated with this measurement. The new

filtered average is then compared to a minimum acceptable

level, low threshold, and a maximum acceptable level, high

threshold. If the average is lower than the minimum

acceptable level, the offset correction value is increased by

a predetermined amount. If it is above the maximum level,

the offset correction value is decreased by a predetermined

amount. The high and low thresholds have been calculated

to avoid oscillation of the black level from below to above

the targeted black level.

Row−wise Noise Correction

Row (Line)−wise Noise Correction is handled

automatically by the image sensor. No adjustments are

provided except to enable or disable this feature. Clearing

R0x3044[10] disables the row noise correction. Default

setting is for row noise correction to be enabled.

Row−wise noise correction is performed by calculating an

average from a set of optically black pixels at the start of

each line and then applying each average to all the active

pixels of the line.

Column Correction

The MT9M034 uses column parallel readout architecture

to achieve fast frame rate. Without any corrections, the

consequence of this architecture is that different column

signal paths have slightly different offsets that might show

up on the final image as structured fixed pattern noise.

MT9M034 has column correction circuitry that measures

this offset and removes it from the image before output. This

is done by sampling dark rows containing tied pixels and

measuring an offset coefficient per column to be corrected

later in the signal path.

Column correction can be enabled/disabled via

R0x30D4[15]. Additionally, the number of rows used for

this offset coefficient measurement is set in R0x30D4[3:0].

By default this register is set to 0x7, which means that 8 rows

are used. This is the recommended value. Other control

features regarding column correction can be viewed in the

MT9M034 Register reference. Any changes to column

correction settings need to be done when the sensor

streaming is disabled and the appropriate triggering

sequence must be followed as described below.

Column Correction Triggering

Column correction requires a special procedure to trigger

depending on which state the sensor is in.

Column Triggering on Startup

When streaming the sensor for the first time after

powerup, a special sequence needs to be followed to make

sure that the column correction coefficients are internally

calculated properly.

1. Follow proper power up sequence for power

supplies and clocks

2. Apply sequencer settings if needed

(Linear or HDR mode)

3. Apply frame timing and PLL settings as required

by application

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4. Set analog gain to 1x and low conversion gain

(R0x30B0 = 0x1300)

5. Enable column correction and settings

(R0x30D4 = 0xE007)

6. Disable auto re−trigger for change in conversion

gain or col_gain, and enable column correction

always (R0x30BA = 0x0008)

7. Enable streaming (R0x301A[2] = 1) or drive the

TRIGGER pin HIGH

8. Wait 9 frames to settle (First frame after coming

up from standby is internally column correction

disabled)

9. Disable streaming (R0x301A[2] = 0)

After this, the sensor has calculated the proper column

correction coefficients and the sensor is ready for streaming.

Any other settings (including gain, integration time and

conversion gain etc.) can be done afterwards without

affecting column correction.

Column Correction Retriggering Due to Mode Change

Since column offsets is sensitive to changes in the analog

signal path, such changes require column correction

circuitry to be retriggered for the new path. Examples of

such mode changes include: horizontal mirror, vertical

mirror, changes to column correction settings.

When such changes take place, the following sequence

needs to take place:

1. Disable streaming (R0x301A[2] = 0) or drive the

TRIGGER pin LOW

2. Enable streaming (R0x301A[2] = 1) or drive the

TRIGGER pin HIGH

3. Wait 9 frames to settle

NOTE: The above steps are not needed if the sensor is

being reset (soft or hard reset) upon the mode

change.

Defective Pixel Correction

Defective Pixel Correction is intended to compensate for

defective pixels by replacing their value with a value based

on the surrounding pixels, making the defect less noticeable

to the human eye. The defect pixel correction feature

supports up to 200 defects. The locations of defective pixels

are stored in a table on chip during the manufacturing

process; this table is accessible through the two−wire serial

interface. There is no provision for later augmenting the

defect table entries.

The DPC algorithm is one−dimensional, calculating the

resulting averaged pixel value based on nearby pixels within

a row. The algorithm distinguishes between color and

monochrome parts; for color parts, the algorithm uses

nearest neighbor in the same color plane.

At high gain, long exposure, and high temperature

conditions, the performance of this function can degrade.

Test Patterns

The MT9M034 has the capability of injecting a number of

test patterns into the top of the datapath to debug the digital

logic. With one of the test patterns activated, any of the

datapath functions can be enabled to exercise it in a

deterministic fashion. Test patterns are selected by

Test_Pattern_Mode register (R0x3070). Only one of the test

patterns can be enabled at a given point in time by setting the

Test_Pattern_Mode register according to Table 11. When

test patterns are enabled the active area will receive the value

specified by the selected test pattern and the dark pixels will

receive the value in Test_Pattern_Green (R0x3074 and

R0x3078) for green pixels, Test_Pattern_Blue (R0x3076)

for blue pixels, and Test_Pattern_Red (R0x3072) for red

pixels.

NOTE: Turn off black level calibration (BLC) when

Test Pattern is enabled.

Table 11. TEST PATTERN MODES

Test_Pattern_Mode Test Pattern Output

0No test pattern (normal operation)

1Solid color test pattern

2100% color bar test pattern

3Fade−to−gray color bar test pattern

256 Walking 1s test pattern (12−bit)

Color Field

When the color field mode is selected, the value for each

pixel is determined by its color. Green pixels will receive the

value in Test_Pattern_Green, red pixels will receive the

value in Test_Pattern_Red, and blue pixels will receive the

value in Test_Pattern_Blue.

Vertical Color Bars

When the vertical color bars mode is selected, a typical

color bar pattern will be sent through the digital pipeline.

Walking 1s

When the walking 1s mode is selected, a walking 1s

pattern will be sent through the digital pipeline. The first

value in each row is 1.

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TWO−WIRE SERIAL REGISTER INTERFACE

The two−wire serial interface bus enables read/write

access to control and status registers within the MT9M034.

The interface protocol uses a master/slave model in which

a master controls one or more slave devices. The sensor acts

as a slave device. The master generates a clock (SCLK) that

is an input to the sensor and is used to synchronize transfers.

Data is transferred between the master and the slave on a

bidirectional signal (SDATA). SDATA is pulled up to VDD_IO

off−chip by a 1.5 kΩ resistor. Either the slave or master

device can drive SDATA LOW−the interface protocol

determines which device is allowed to drive SDATA at any

given time.

The protocols described in the two−wire serial interface

specification allow the slave device to drive SCLKLOW; the

MT9M034 uses SCLK as an input only and therefore never

drives it LOW.

Protocol

Data transfers on the two−wire serial interface bus are

performed by a sequence of low−level protocol elements:

1. a (repeated) start condition

2. a slave address/data direction byte

3. an (a no) acknowledge bit

4. a message byte

5. a stop condition

The bus is idle when both SCLK and SDATA are HIGH.

Control of the bus is initiated with a start condition, and the

bus is released with a stop condition. Only the master can

generate the start and stop conditions.

Start Condition

A start condition is defined as a HIGH−to−LOW

transition on SDATA while SCLK is HIGH. At the end of a

transfer, the master can generate a start condition without

previously generating a stop condition; this is known as a

“repeated start” or “restart” condition.

Stop Condition

A stop condition is defined as a LOW−to−HIGH transition

on SDATA while SCLK is HIGH.

Data Transfer

Data is transferred serially, 8 bits at a time, with the MSB

transmitted first. Each byte of data is followed by an

acknowledge bit or a no−acknowledge bit. This data transfer

mechanism is used for the slave address/data direction byte

and for message bytes.

One data bit is transferred during each SCLK clock period.

SDATA can change when SCLK is LOW and must be stable

while SCLK is HIGH.

Slave Address/Data Direction Byte

Bits [7:1] of this byte represent the device slave address

and bit [0] indicates the data transfer direction. A “0” in bit

[0] indicates a WRITE, and a “1” indicates a READ. The

default slave addresses used by the MT9M034 are 0x20

(write address) and 0x21 (read address) in accordance with

the specification. Alternate slave addresses of 0x30 (write

address) and 0x31 (read address) can be selected by enabling

and asserting the SADDR input.

An alternate slave address can also be programmed

through R0x31FC.

Message Byte

Message bytes are used for sending register addresses and

Acknowledge Bit

Each 8−bit data transfer is followed by an acknowledge bit

or a no−acknowledge bit in the SCLK clock period following

the data transfer. The transmitter (which is the master when

writing, or the slave when reading) releases SDATA. The

receiver indicates an acknowledge bit by driving SDATA

LOW. As for data transfers, SDATA can change when SCLK

is LOW and must be stable while SCLK is HIGH.

No−Acknowledge Bit

The no−acknowledge bit is generated when the receiver

does not drive SDATA LOW during the SCLK clock period

following a data transfer. A no−acknowledge bit is used to

terminate a read sequence.

Typical Sequence

A typical READ or WRITE sequence begins by the

master generating a start condition on the bus. After the start

condition, the master sends the 8−bit slave address/data

direction byte. The last bit indicates whether the request is

for a read or a write, where a “0” indicates a write and a “1”

indicates a read. If the address matches the address of the

slave device, the slave device acknowledges receipt of the

address by generating an acknowledge bit on the bus.

If the request was a WRITE, the master then transfers the

16−bit register address to which the WRITE should take

place. This transfer takes place as two 8−bit sequences and

the slave sends an acknowledge bit after each sequence to

indicate that the byte has been received. The master then

transfers the data as an 8−bit sequence; the slave sends an

acknowledge bit at the end of the sequence. The master stops

writing by generating a (re)start or stop condition.

If the request was a READ, the master sends the 8−bit

write slave address/data direction byte and 16−bit register

address, the same way as with a WRITE request. The master

then generates a (re)start condition and the 8−bit read slave

address/data direction byte, and clocks out the register data,

eight bits at a time. The master generates an acknowledge bit

after each 8−bit transfer. The slave’s internal register address

is automatically incremented after every 8 bits are

transferred. The data transfer is stopped when the master

sends a no−acknowledge bit.

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Single READ from Random Location

This sequence (Figure 18) starts with a dummy WRITE to

the 16−bit address that is to be used for the READ. The

master terminates the WRITE by generating a restart

condition. The master then sends the 8−bit read slave

address/data direction byte and clocks out one byte of

generating a no−acknowledge bit followed by a stop

condition. Figure 18 shows how the internal register address

maintained by the MT9M034 is loaded and incremented as

the sequence proceeds.

Figure 18. Single READ from Random Location

Previous Reg Address, N Reg Address, M M+1

S0 1 PASr

Slave

Address

Reg

Address[15:8]

Reg

Address[7:0] Slave Address

S = Start Condition

P = Stop Condition

Sr = Restart Condition

A = Acknowledge

A = No-acknowledge

Slave to Master

Master to Slave

A A A A Read Data

Single READ From Current Location

This sequence (Figure 19) performs a read using the

current value of the MT9M034 internal register address. The

master terminates the READ by generating a

no−acknowledge bit followed by a stop condition. The

figure shows two independent READ sequences.

Figure 19. Single READ from Current Location

Previous Reg Address, N Reg Address, N + 1 N + 2

S1 1 PA

SSlave Address Slave Address

AARead DataPRead Data A

Sequential READ, Start From Random Location

This sequence (Figure 20) starts in the same way as the

single READ from random location (Figure 18). Instead of

generating a no−acknowledge bit after the first byte of data

has been transferred, the master generates an acknowledge

bit and continues to perform byte READs until “L” bytes

have been read.

Figure 20. Sequential READ, Start from Random Location

Previous Reg Address, N Reg Address, M

S0Slave Address A AReg Address[15:8]

M+1

A A A1SrReg Address[7:0] Read DataSlave Address

M+LM+L−1M+L−2M+1 M+2 M+3

ARead Data A Read Data ARead Data Read Data

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Sequential READ, Start From Current Location

This sequence (Figure 21) starts in the same way as the

single READ from current location (Figure 19). Instead of

generating a no−acknowledge bit after the first byte of data

has been transferred, the master generates an acknowledge

bit and continues to perform byte READs until “L” bytes

have been read.

Figure 21. Sequential READ, Start from Current Location

N+LN+L−1N+2N+1Previous Reg Address, N

PAS 1 Read DataASlave Address Read DataRead Data Read DataAAA

Single WRITE to Random Location

This sequence (Figure 22) begins with the master

generating a start condition. The slave address/data

direction byte signals a WRITE and is followed by the HIGH

then LOW bytes of the register address that is to be written.

The master follows this with the byte of write data. The

WRITE is terminated by the master generating a stop

condition.

Figure 22. Single WRITE to Random Location

Previous Reg Address, N Reg Address, M M+1

S0Slave Address A Reg Address[15:8] A A A

Reg Address[7:0] Write Data P

Sequential WRITE, Start at Random Location

This sequence (Figure 23) starts in the same way as the

single WRITE to random location (Figure 22). Instead of

generating a no−acknowledge bit after the first byte of data

has been transferred, the master generates an acknowledge

bit and continues to perform byte WRITEs until “L” bytes

have been written. The WRITE is terminated by the master

generating a stop condition.

Figure 23. Sequential WRITE, Start at Random Location

Previous Reg Address, N Reg Address, M M+1

S0Slave Address A Reg Address[15:8] A A AReg Address[7:0]

M+LM+L−1M+L−2M+1 M+2 M+3

Write Data AA AP

Write Data

AWrite Data Write Data

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SPECTRAL CHARACTERISTICS

Figure 24. Quantum Efficiency − Color Sensor

red green blue

350

Wavelength (nm)

Quantum Efficiency (%)

400 450 500 550 600 650 700 750 800 850 900 950 1000 1050

Figure 25. Estimated Quantum Efficiency – Monochrome Sensor

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Electrical Specifications

Unless otherwise stated, the following specifications

apply to the following conditions:

VDD = 1.8 V – 0.10 / +0.15; VDD_IO = VDD_PLL = VAA

= VAA_PIX = 2.8 V ±0.3V ;

TA = −30°C to +70°C; output load = 10 pF; frequency =

74.25 MHz.

Two-Wire Serial Register Interface

The electrical characteristics of the two−wire serial

Table 12.

Figure 26. Two-Wire Serial Bus Timing Parameters

SSr

tSU;STO

tSU;STA

tHD;STA tHIGH

tLOW tSU;DAT

tHD;DAT

SDATA

SCLK

tBUF

trtHD;STA

Note: Read sequence: For an 8-bit READ, read waveforms start after WRITE command and register address are issued.

Table 12. TWO-WIRE SERIAL BUS CHARACTERISTICS

fEXTCLK = 27 MHz; VDD = 1.8 V; VDD_IO = 2.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; VDD_DAC = 2.8 V; TA = 25°C

Parameter Symbol

Standard−Mode Fast−Mode

Unit

Min Max Min Max

SCLK Clock Frequency fSCL 0 100 0 400 KHz

Hold Time (Repeated) START Condition

After this Period, the First Clock Pulse is Generated tHD;STA 4.0 −0.6 −μS

LOW Period of the SCLK Clock tLOW 4.7 −1.3 −μS

HIGH Period of the SCLK Clock tHIGH 4.0 −0.6 −μS

Set−up Time for a Repeated START Condition tSU;STA 4.7 −0.6 −μS

Data Hold Time tHD;DAT 0

(Note 4)

3.45

(Note 5)

(Note 6)

0.9

(Note 5)

μS

Data Set−up Time tSU;DAT 250 −1006−nS

Rise Time of Both SDATA and SCLK Signals tr−1000 20 + 0.1Cb

(Note 7)

300 nS

Fall Time of Both SDATA and SCLK Signals tf−300 20 + 0.1Cb

(Note 7)

300 nS

Set−up Time for STOP Condition tSU;STO 4.0 −0.6 −μS

Bus Free Time between a STOP and START Condition tBUF 4.7 −1.3 −μS

Capacitive Load for Each Bus Line Cb −400 −400 pF

Serial Interface Input pin Capacitance CIN_SI −3.3 −3.3 pF

SDATA Max Load Capacitance CLOAD_SD −30 −30 pF

SDATA Pull−up Resistor RSD 1.5 4.7 1.5 4.7 KΩ

1. This table is based on I2C standard (v2.1 January 2000). On Semiconductor.

2. Two−wire control is I2C−compatible.

3. All values referred to VIHmin = 0.9 VDD and VILmax = 0.1 VDD levels. Sensor EXCLK = 27 MHz.

4. A device must internally provide a hold time of at least 300 ns for the SDATA signal to bridge the undefined region of the falling edge of SCLK.

5. The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCLK signal.

6. A Fast−mode I2C−bus device can be used in a Standard−mode I2C−bus system, but the requirement tSU;DAT 250 ns must then be met.

This will automatically be the case if the device does not stretch the LOW period of the SCLK signal. If such a device does stretch the LOW

period of the SCLK signal, it must output the next data bit to the SDATA line tr max + tSU;DAT = 1000 + 250 = 1250 ns (according to the

Standard−mode I2C−bus specification) before the SCLK line is released.

7. Cb = total capacitance of one bus line in pF.

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I/O Timing

By default, the MT9M034 launches pixel data, FV, and LV

with the falling edge of PIXCLK. The expectation is that the

user captures DOUT[11:0], FV, and LV using the rising edge

of PIXCLK. This can be changed using register R0x3028.

See Figure 27 and Table 13 for I/O timing (AC)

characteristics.

Figure 27. I/O Timing Diagram

Data[11:0]

FRAME_VALID/

LINE_VALID FRAME_VALID leads LINE_VALID by 6 PIXCLKs. FRAME_VALID trails

LINE_VALID by 6 PIXCLKs.

PIXCLK

EXTCLK

tEXTCLK

tFtRP tFP

tPD

tPFH

tPLH

tPFL

tPLL

Pxl _ 0 Pxl _ 1 Pxl _ 2 Pxl _ n

90 %

10 %

90 %

10 %

Table 13. I/O TIMING CHARACTERISTICS (2.8 V VDD_IO) (Note 1)

Symbol Definition Condition Min Typ Max Unit

fEXTCLK Input Clock Frequency 6 – 50 MHz

tEXTCLK Input Clock Period 20 – 166 ns

tRInput Clock Rise Time – 3 – ns

tFInput Clock Fall Time – 3 – ns

tJITTER Input Clock Jitter – – 600 ps

tRP Pixclk Rise Time PCLK slew rate = 6 1.2 – 2.9 ns

tFP Pixclk Fall Time PCLK slew rate = 6 1.2 – 2.9 ns

Pixclk Duty Cycle 45 50 55 %

fPIXCLK PIXCLK Frequency (Note 2) 6 – 74.25 MHz

tPD PIXCLK to Data Valid PCLK slew rate = 6,

Parallel slew rate = 7

–2 – 2.5 ns

tPFH PIXCLK to FV HIGH PCLK slew rate = 6,

Parallel slew rate = 7

–2 – 2.5 ns

tPLH PIXCLK to LV HIGH PCLK slew rate = 6,

Parallel slew rate = 7

–2 – 2.5 ns

tPFL PIXCLK to FV LOW PCLK slew rate = 6,

Parallel slew rate = 7

–2 – 2.5 ns

tPLL PIXCLK to LV LOW PCLK slew rate = 6,

Parallel slew rate = 7

–2 – 2.5 ns

1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C at 2.5 V, and −30°C at 3.1 V. All values

are taken at the 50% transition point. The loading used is 10 pF.

2. Jitter from PIXCLK is already taken into account as the data of all the output parameters.

Table 14. I/O TIMING CHARACTERISTICS (1.8 V VDD_IO) (Note 1)

Symbol Definition Condition Min Typ Max Unit

fEXTCLK Input Clock Frequency 6−50 MHz

tEXTCLK Input Clock Period 20 −166 ns

tRInput Clock Rise Time −3−ns

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Table 14. I/O TIMING CHARACTERISTICS (1.8 V VDD_IO) (Note 1) (continued)

UnitMaxTypMinConditionDefinitionSymbol

tFInput Clock Fall Time −3−ns

tJITTER Input Clock Jitter – – 600 ps

tRP Pixel Rise Time PCLK slew rate = 6 1.8 −4.8 ns

tFP Pixel Fall Time PCLK slew rate = 6 1.7 −4.5 ns

Pixel Duty Cycle 45 50 55 %

fPIXCLK PIXCLK Frequency (Note 2) 6 74.25 MHz

tPD PIXCLK to Data Valid PCLK slew rate = 6,

Parallel slew rate = 7

–2.5 – 2 ns

tPFH PIXCLK to FV HIGH PCLK slew rate = 6,

Parallel slew rate = 7

–2.5 – 2 ns

tPLH PIXCLK to LV HIGH PCLK slew rate = 6,

Parallel slew rate = 7

–2.5 – 2 ns

tPFL PIXCLK to FV LOW PCLK slew rate = 6,

Parallel slew rate = 7

–2.5 – 2 ns

tPLL PIXCLK to LV LOW PCLK slew rate = 6,

Parallel slew rate = 7

–2.5 – 2 ns

1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C at 1.7 V, and −30°C at 1.95 V. All values

are taken at the 50% transition point. The loading used is 10 pF.

2. Jitter from PIXCLK is already taken into account as the data of all the output parameters.

Table 15. I/O RISE SLEW RATE (2.8 V VDD_IO) (Note 1)

Parallel Slew Rate

(R0x306E[15:13]) Conditions Min Typ Max Units

7 Default 1.08 1.77 2.72 V/ns

6 Default 0.77 1.26 1.94 V/ns

5 Default 0.58 0.95 1.46 V/ns

4 Default 0.44 0.70 1.08 V/ns

3 Default 0.32 0.51 0.78 V/ns

2 Default 0.23 0.37 0.56 V/ns

1 Default 0.16 0.25 0.38 V/ns

0 Default 0.10 0.15 0.22 V/ns

1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C at 2.5 V, and −30°C at 3.1 V. The loading

used is 10 pF.

Table 16. I/O FALL SLEW RATE (2.8 V VDD_IO) (Note 1)

Parallel Slew Rate

(R0x306E[15:13]) Conditions Min Typ Max Units

7 Default 1.00 1.62 2.41 V/ns

6 Default 0.76 1.24 1.88 V/ns

5 Default 0.60 0.98 1.50 V/ns

4 Default 0.46 0.75 1.16 V/ns

3 Default 0.35 0.56 0.86 V/ns

2 Default 0.25 0.40 0.61 V/ns

1 Default 0.17 0.27 0.41 V/ns

0 Default 0.11 0.16 0.24 V/ns

1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C at 2.5 V, and −30°C at 3.1 V. The loading

used is 10 pF.

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Table 17. I/O RISE SLEW RATE (1.8 V VDD_IO) (Note 1)

Parallel Slew Rate

(R0x306E[15:13]) Conditions Min Typ Max Units

7 Default 0.41 0.65 1.10 V/ns

6 Default 0.30 0.47 0.79 V/ns

5 Default 0.24 0.37 0.61 V/ns

4 Default 0.19 0.28 0.46 V/ns

3 Default 0.14 0.21 0.34 V/ns

2 Default 0.10 0.15 0.24 V/ns

1 Default 0.07 0.10 0.16 V/ns

0 Default 0.04 0.06 0.10 V/ns

1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C at 1.7 V, and −30°C at 1.95 V. The loading

used is 10 pF.

Table 18. I/O FALL SLEW RATE (1.8 V VDD_IO) (Note 1)

Parallel Slew Rate

(R0x306E[15:13]) Conditions Min Typ Max Units

7 Default 0.42 0.68 1.11 V/ns

6 Default 0.32 0.51 0.84 V/ns

5 Default 0.26 0.41 0.67 V/ns

4 Default 0.20 0.32 0.52 V/ns

3 Default 0.16 0.24 0.39 V/ns

2 Default 0.12 0.18 0.28 V/ns

1 Default 0.08 0.12 0.19 V/ns

0 Default 0.05 0.07 0.11 V/ns

1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C at 1.7 V, and −30°C at 1.95 V. The loading

used is 10 pF.

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DC ELECTRICAL CHARACTERISTICS

The DC electrical characteristics are shown in the tables

below.

Table 19. DC ELECTRICAL CHARACTERISTICS

Symbol Definition Condition Min Typ Max

VDD Core Digital Voltage 1.7 1.8 1.95

VDD_IO I/O Digital Voltage 1.7 / 2.5 1.8 / 2.8 1.9 / 3.1

VAA Analog Voltage 2.5 2.8 3.1

VAA_PIX Pixel Supply Voltage 2.5 2.8 3.1

VDD_PLL PLL Supply Voltage 2.5 2.8 3.1

VDD_SLVS HiSPi Supply Voltage for SLVS Mode 0.3 0.4 0.6

VDD_SLVS HiSPi Supply Voltage for HiVcm Mode 1.7 1.8 1.95

VIH Input HIGH Voltage VDD_IO ×0.7 – –

VIL Input LOW Voltage – – VDD_IO ×0.3

IIN Input Leakage Current No pull−up resistor;

VIN = VDD_IO or DGND

– – 20

VOH Output HIGH Voltage VDD_IO − 0.3 – –

VOL Output LOW Voltage – – 0.4

IOH Output HIGH Current At specified VOH −22 – –

IOL Output LOW Current At specified VOL – – 22

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

CAUTION: Stresses greater than those listed in Table 14 may

cause permanent damage to the device. This is a stress

rating only, and functional operation of the device at

these or any other conditions above those indicated in

the operational sections of this specification is not

implied.

Table 20. ABSOLUTE MAXIMUM RATINGS

Symbol Definition Condition Min Max Unit

VSUPPLY Power Supply Voltage (All Supplies) –0.3 4.5 V VSUPPLY

ISUPPLY Total Power Supply Current – 200 mA ISUPPLY

IGND Total Ground Current – 200 mA IGND

VIN DC Input Voltage –0.3 VDD_IO + 0.3 VVIN

VOUT DC Output Voltage –0.3 VDD_IO + 0.3 V VOUT

TSTG (Note 1) Storage Temperature –40 +150 °C TSTG (Note 1)

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Exposure to absolute maximum rating conditions for extended periods may affect reliability.

2. To keep dark current and shot noise artifacts from impacting image quality, keep operating temperature at a minimum.

Table 21. OPERATING CURRENT CONSUMPTION IN PARALLEL OUTPUT AND LINEAR MODE

Definition Condition Symbol Min Typ Max Unit

Digital Operating Current Streaming, 1280x960 45 fps IDD1 – 63 90 mA

I/O Digital Operating Current Streaming, 1280x960 45 fps IDD_IO – 35 40 mA

Analog Operating Current Streaming, 1280x960 45 fps IAA – 30 45 mA

Pixel Supply Current Streaming, 1280x960 45 fps IAA_PIX – 10 15 mA

PLL Supply Current Streaming, 1280x960 45 fps IDD_PLL – 7 15 mA

Digital Operating Current Streaming, 720p 60 fps IDD1– 63 90 mA

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Table 21. OPERATING CURRENT CONSUMPTION IN PARALLEL OUTPUT AND LINEAR MODE (continued)

UnitMaxTypMinSymbolConditionDefinition

I/O Digital Operating Current Streaming, 720p 60 fps IDD_IO −35 40 mA

Analog Operating Current Streaming, 720p 60 fps IAA – 30 45 mA

Pixel Supply Current Streaming, 720p 60 fps IAA_PIX – 10 15 mA

PLL Supply Current Streaming, 720p 60f ps IDD_PLL – 7 15 mA

1. Operating currents are measured at the following conditions:

− VAA = VAA_PIX = VDD_IO = VDD_PLL = 2.8 V

− VDD =1.8 V

− PLL Enabled and PIXCLK = 74.25 MHz

− TA = 25°C

− CLOAD = 10 pF Measured in dark

Table 22. OPERATING CURRENT CONSUMPTION IN PARALLEL OUTPUT AND HDR MODE

Definition Condition Symbol Min Typ Max Unit

Digital Operating Current Streaming, 1280x960 45 fps IDD1– 63 90 mA

Digital Operating Current Streaming, 1280x960 45 fps IDD – 95 115 mA

I/O Digital Operating Current Streaming, 1280x960 45 fps IDD_IO – 35 40 mA

Analog Operating Current Streaming, 1280x960 45 fps IAA – 65 75 mA

Pixel Supply Current Streaming, 1280x960 45 fps IAA_PIX – 15 20 mA

PLL Supply Current Streaming, 1280x960 45 fps IDD_PLL – 7 15 mA

Digital Operating Current Streaming, 720p 60 fps IDD – 95 115 mA

I/O Digital Operating Current Streaming, 720p 60 fps IDD_IO – 35 40 mA

Analog Operating Current Streaming, 720p 60 fps IAA – 61 75 mA

Pixel Supply Current Streaming, 720p 60 fps IAA_PIX – 15 20 mA

PLL Supply Current Streaming, 720p 60 fps IDD_PLL – 7 15 mA

1. Operating currents are measured at the following conditions:

− VAA = VAA_PIX = VDD_IO = VDD_PLL = 2.8 V

− VDD =1.8 V

− PLL Enabled and PIXCLK = 74.25 MHz

− TA = 25°C

− CLOAD = 10 pF Measured in dark

Table 23. STANDBY CURRENT CONSUMPTION

Definition Condition Symbol Min Typ Max Unit

Hard Standby (Clock Off) Analog, 2.8 V – – 30 100 μA

Digital, 1.8 V – – 85 2500 μA

Hard Standby (Clock On) Analog, 2.8 V – – 30 100 μA

Digital, 1.8 V – – 1.55 4 mA

Soft Standby (Clock Off) Analog, 2.8 V – – 85 100 μA

Digital, 1.8 V – – 85 2500 μA

Soft Standby (Clock On) Analog, 2.8 V – – 30 100 μA

Digital, 1.8 V – – 1.55 4 mA

1. Analog – VAA + VAA_PIX + VDD_PLL

2. Digital – VDD + VDD_IO

MT9M034

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Figure 28. Power Supply Rejection Ratio

1000 10000 100000 1000000

Power Supply Rejection Ratio

Frequency (Hz)

PSRR (dB)

MT9M034

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POWER−ON RESET AND STANDBY TIMING

Power−Up Sequence

The recommended power−up sequence for the MT9M034

is shown in Figure 29. The available power supplies

(VDD_IO, VDD, VDD_PLL, VAA, VAA_PIX) must have the

separation specified below.

1. Turn on VDD_PLL power supply

2. After 0–10 μs, turn on VAA and VAA_PIX power

supply

3. After 0–10 μs, turn on VDD_IO power supply

4. After the last power supply is stable, enable

EXTCLK

5. Assert RESET_BAR for at least 1 ms

6. Wait 850000 EXTCLKs (for internal initialization

into software standby)

7. Configure PLL, output, and image settings to

desired values

8. Wait 1ms for the PLL to lock

9. Set streaming mode (R0x301A[2] = 1)

Figure 29. Power Up

VDD _PLL (2.8)

VAA _PIX

VAA (2.8)

VDD _IO (1.8/2.8)

VDD (1.8)

EXTCLK

RESET_BAR

t5 t6

Hard Reset Internal

Initialization

Software

Standby PLL Lock Streaming

Table 24. POWER−UP SEQUENCE

Definition Symbol Minimum Typical Maximum Unit

VDD_PLL to VAA/VAA_PIX (Note 3) t0 0 10 – μs

VAA/VAA_PIX to VDD_IO t1 0 10 – μs

VDD_IO to VDD t2 0 10 – μs

Xtal Settle Time tx – 30 (Note 1) – ms

Hard Reset t4 1 (Note 2) – – ms

Internal Initialization t5 850000 – – EXTCLKS

PLL Lock Time t6 1 – – ms

1. Xtal settling time is component−dependent, usually taking about 10–100 ms.

2. Hard reset time is the minimum time required after power rails are settled. In a circuit where Hard reset is held down by RC circuit, then the

RC time must include the all power rail settle time and Xtal settle time.

3. It is critical that VDD_PLL is not powered up after the other power supplies. It must be powered before or at least at the same time as the

others. If the case happens that VDD_PLL is powered after other supplies then sensor may have functionality issues and will experience high

current draw on this supply.

MT9M034

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Power−Down Sequence

The recommended power−down sequence for the

MT9M034 is shown in Figure 30. The available power

supplies (VDD_IO, VDD, VDD_PLL, VAA, VAA_PIX) must

have the separation specified below. Power may be removed

from all supplies simultaneously, and a sudden loss of power

on all rails does not cause damage or affect the lifetime of the

device.

1. Disable streaming if output is active by setting

standby R0x301A[2] = 0

2. The soft standby state is reached after the current

row or frame, depending on configuration, has

ended

3. Turn off VDD

4. Turn off VDD_IO

5. Turn off VAA/VAA_PIX

6. Turn off VDD_PLL

Figure 30. Power Down

VDD_IO (1.8/2.8)

EXTCLK

VDD (1.8)

VAA_PIX

(2.8)

VDD _PLL (2.8)

Power Down until next Power up cycle

VAA

Table 25. POWER−DOWN SEQUENCE

Definition Symbol Minimum Typical Maximum Unit

VDD to VDD_IO t1 0 – – μs

VDD_IO to VAA/VAA_PIX t2 0 – – μs

VAA/VAA_PIX to VDD_PLL t3 0 – – μs

PwrDn until Next PwrUp Time t4 100 – – ms

1. t4 is required between power down and next power up time; all decoupling caps from regulators must be completely discharged.

MT9M034

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ILCC48 10x10

CASE 847AD

ISSUE O

MT9M034

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