© Semiconductor Components Industries, LLC, 2016
October, 2016 − Rev. 8 1Publication Order Number:
MSRD620CT/D
MSRD620CT,
NRVSRD620VCT,
SSRD8620CT Series
Switch-mode
Soft Ultrafast Recovery
Power Rectifier
Plastic DPAK Package
State−of−the−art geometry features epitaxial construction with
glass passivation and metal overlay contact. Ideally suited for low
voltage, high frequency switching power supplies, free wheeling
diode and polarity protection diodes.
Features
Soft Ultrafast Recovery (35 ns typ)
Highly Stable Oxide Passivated Junction
Matched Dual Die Construction − May Be Paralleled for High
Current Output
Short Heat Sink Tab Manufactured − Not Sheared
Epoxy Meets UL 94 V−0 @ 0.125 in.
NRVSRD and SSRD8 Prefixes for Automotive and Other
Applications Requiring Unique Site and Control Change
Requirements; AEC−Q101 Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant*
Mechanical Characteristics
Case: Epoxy, Molded
Weight: 0.4 Grams (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
ESD Ratings:
Machine Model = C
Human Body Model = 2
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
SOFT ULTRAFAST
RECTIFIER
6.0 AMPERES, 200 VOLTS
1
3
2, 4
DPAK
CASE 369C
MARKING DIAGRAM
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
AYWW
S
620TG
Device Package Shipping
ORDERING INFORMATION
MSRD620CTT4G DPAK
(Pb−Free) 2,500 /
Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer t o our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
MSRD620CTG DPAK
(Pb−Free) 75 Units/Rail
www.onsemi.com
NRVSRD620VCTT4G DPAK
(Pb−Free) 2,500 /
Tape & Reel
SSRD8620CTT4G DPAK
(Pb−Free) 2,500 /
Tape & Reel
MSRD620CT, NRVSRD620VCT, SSRD8620CT Series
www.onsemi.com
2
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
200 V
Average Rectified Forward Current
(At Rated VR, TC = 137°C)
Per Leg
Per Package
IO
3.0
6.0
A
Peak Repetitive Forward Current
(At Rated VR, Square Wave, 20 kHz, TC = 138°C)
Per Leg
IFRM
6.0
A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions, Halfwave, Single Phase, 60 Hz)
Per Package
IFSM
50
A
Storage / Operating Case Temperature Tstg, Tc−55 to +175 °C
Operating Junction Temperature TJ−55 to +175 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be af fected.
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Resistance − Junction−to−Case
Per Leg RqJC 9.0 °C/W
Thermal Resistance − Junction−to−Ambient
Per Leg RqJA 80 °C/W
ELECTRICAL CHARACTERISTICS
Rating Symbol Value Unit
Maximum Instantaneous Forward Voltage (Note 1) (See Figure 2)
Per Leg VFTJ = 25°C TJ = 150°CV
(IF = 3.0 A)
(IF = 6.0 A) 1.15
1.35 1.05
1.30
Maximum Instantaneous Reverse Current (See Figure 4)
Per Leg IRTJ = 25°C TJ = 150°CmA
(VR = 200 V)
(VR = 100 V) 5.0
2.0 200
100
Maximum Reverse Recovery Time (Note 2)
Per Leg
(VR = 30 V, IF = 1.0 A, di/dt = 50 A/ms)
(VR = 30 V, IF = 3.0 A, di/dt = 50 A/ms)
trr
45
55
ns
Maximum Peak Reverse Recovery Current
Per Leg
(VR = 30 V, IF = 1.0 A, di/dt = 50 A/ms)
(VR = 30 V, IF = 3.0 A, di/dt = 50 A/ms)
IRM
2.0
3.0
A
1. Pulse Test: Pulse Width 250 ms, Duty Cycle 2%.
2. trr measured projecting from 25% of IRM to ground.
MSRD620CT, NRVSRD620VCT, SSRD8620CT Series
www.onsemi.com
3
Figure 1. Typical Forward Voltage, Per Leg Figure 2. Maximum Forward Voltage, Per Leg
1.60.4
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
100
10
IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
0.1
1.00.6 0.8 1.2 1.4 1.8 2.0
TJ = 175°C
25°C
1.0
100°C
150°C
1.60.4
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
100
10
IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
0.1
1.00.6 0.8 1.2 1.4 1.8 2.0
TJ = 175°C
25°C
1.0
150°C
Figure 3. Typical Reverse Current, Per Leg Figure 4. Maximum Reverse Current, Per Leg
100 1400
VR, REVERSE VOLTAGE (VOLTS)
100E-6
10E-6
1E-6
100E-9
10E-9
1E-9
120
I
20 40 60 80 180160 200
, REVERSE CURRENT (AMPS)
R
TJ = 175°C
150°C
25°C
100 1400
VR, REVERSE VOLTAGE (VOLTS)
100E-6
10E-6
1E-6
100E-9
10E-9
120
I
20 40 60 80 180160 200
, MAXIMUM REVERSE CURRENT (AMPS)
R
TJ = 175°C
150°C
25°C
1E-3
TC, CASE TEMPERATURE (°C)
100
0.5
1.0
2.0
2.5
3.0
IF(AV)
0
3.5
4.0
5.0
110 120 130 140 150 160 170 180
Figure 5. Current Derating, Case (Per Leg)
25
1.0
1.5
2.5
0
45 65 85 105
TA, AMBIENT TEMPERATURE (°C)
IF(AV)
Figure 6. Current Derating, Ambient (Per Leg)
RATED VOLTAGE APPLIED
FREQUENCY = 20 kHz
RqJC = 9°C/W
TJ = 175°C
, AVERAGE FORWARD CURRENT (AMPS)
SINE WAVE
dc
, AVERAGE FORWARD CURRENT (AMPS)
125 145 165 185
0.5
2.0
SQUARE WAVE
1.5
4.5 RATED VOLTAGE APPLIED
FREQUENCY = 20 kHz
RqJA = 80°C/W
TJ = 175°C
SINE WAVE
dc
SQUARE WAVE
MSRD620CT, NRVSRD620VCT, SSRD8620CT Series
www.onsemi.com
4
0
10
100
1.0
20 40 60 80
VR, REVERSE VOLTAGE (VOLTS)
Figure 7. Typical Capacitance (Per Leg)
C, CAPACITANCE (pF)
100 120 140 200
TJ = 25°C
160 180
Figure 8. Transient Thermal Response (RqJA)
0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000 10000
t, TIME (s)
1.0E+00
1.0E-01
1.0E-02
1.0E-03
1.0E-04
R(t) EFFECTIVE TRANSIENT THERMAL RESISTANCE (NORMALIZED)
MSRD620CT, NRVSRD620VCT, SSRD8620CT Series
www.onsemi.com
5
Figure 9. Transient Thermal Response (Rq
JC
)
0.00001 0.0001 0.001 0.01 0.1 1.0 10 100
t, TIME (s)
1.0E+00
1.0E-01
1.0E-02
R(t) EFFECTIVE TRANSIENT THERMAL
(NORMALIZED)RESISTANCE
MSRD620CT, NRVSRD620VCT, SSRD8620CT Series
www.onsemi.com
6
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C
ISSUE F
5.80
0.228
2.58
0.102
1.60
0.063
6.20
0.244
3.00
0.118
6.17
0.243
ǒmm
inchesǓ
SCALE 3:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
b
D
E
b3
L3
L4b2
M
0.005 (0.13) C
c2
A
c
C
Z
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
D0.235 0.245 5.97 6.22
E0.250 0.265 6.35 6.73
A0.086 0.094 2.18 2.38
b0.025 0.035 0.63 0.89
c2 0.018 0.024 0.46 0.61
b2 0.028 0.045 0.72 1.14
c0.018 0.024 0.46 0.61
e0.090 BSC 2.29 BSC
b3 0.180 0.215 4.57 5.46
L4 −− 0.040 −− 1.01
L0.055 0.070 1.40 1.78
L3 0.035 0.050 0.89 1.27
Z0.155 −− 3.93 −−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
7. OPTIONAL MOLD FEATURE.
12 3
4
H0.370 0.410 9.40 10.41
A1 0.000 0.005 0.00 0.13
L1 0.114 REF 2.90 REF
L2 0.020 BSC 0.51 BSC
A1
HDET AIL A
SEATING
PLANE
A
B
C
L1
L
H
L2 GAUGE
PLANE
DETAIL A
ROTATED 90 CW5
eBOTTOM VIEW
Z
BOTTOM VIEW
SIDE VIEW
TOP VIEW
ALTERNATE
CONSTRUCTIONS
NOTE 7
Z
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Phone: 81−3−5817−1050
MSRD620CT/D
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