JANS 2N3501UB Qualified Levels: JANSM, JANSD, JANSP, JANSL, and JANSR RADIATION HARDENED NPN SILICON SWITCHING TRANSISTOR compliant Qualified per MIL-PRF-19500/366 DESCRIPTION This family of JANS 2N3501, epitaxial, planar transistors are military qualified in five RHA (Radiation Hardness Assurance) levels for high-reliability applications. These devices are also available in TO-5 and low profile TO-39 packaging. Microsemi also offers numerous other transistor products to meet higher and lower power ratings with various switching speed requirements in both through-hole and surface-mount packages. Important: For the latest information, visit our website http://www.microsemi.com. FEATURES * Surface mount equivalent of JEDEC registered 2N3501 number. * RHA level JAN qualifications per MIL-PRF-19500/366 (see part nomenclature for all options). * RoHS compliant by design. UB Package Also available in: APPLICATIONS / BENEFITS * * * * TO-5 package General purpose transistors for medium power applications requiring high frequency switching. Low profile ceramic package. Lightweight. Military and other high-reliability applications. (long-leaded) 2N3498L - 2N3501L TO-39 (TO-205AD) package (leaded) 2N3498 - 2N3501 MAXIMUM RATINGS @ TC = +25 C unless otherwise noted Parameters / Test Conditions Symbol Value Unit Collector-Emitter Voltage VCEO 150 V Collector-Base Voltage VCBO 150 V Emitter-Base Voltage VEBO 6.0 V IC 300 mA RJA 325 PT 0.5 1.5 W TJ, Tstg -65 to +200 C Collector Current Thermal Resistance Junction-to-Ambient Total Power Dissipation (1) @ TA = +25 C (2) @ TSP = +25 C Operating & Storage Junction Temperature Range Notes: 1. See figure 1. 2. See figure 2. o C/W MSC - Lawrence 6 Lake Street, Lawrence, MA 01841 Tel: 1-800-446-1158 or (978) 620-2600 Fax: (978) 689-0803 MSC - Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Website: www.microsemi.com T4-LDS-0056-2, Rev. 1 (121223) (c)2012 Microsemi Corporation Page 1 of 8 JANS 2N3501UB MECHANICAL and PACKAGING * * * * * * CASE: Ceramic. TERMINALS: Gold plating over nickel under plate. MARKING: Part number, date code, manufacturer's ID. TAPE & REEL option: Standard per EIA-418D. Consult factory for quantities. WEIGHT: < 0.04 Grams. See Package Dimensions on last page. PART NOMENCLATURE JANSM 2N3501 UB Reliability Level JANSM = 3K Rads (Si) JANSD = 10K Rads (Si) JANSP = 30K Rads (Si) JANSL = 50K Rads (Si) JANSR = 100K Rads (Si) Symbol Cobo ICEO ICEX IEBO hFE VCEO VCBO VEBO Surface Mount package JEDEC type number SYMBOLS & DEFINITIONS Definition Common-base open-circuit output capacitance Collector cutoff current, base open Collector cutoff current, circuit between base and emitter Emitter cutoff current, collector open Common-emitter static forward current transfer ratio Collector-emitter voltage, base open Collector-emitter voltage, emitter open Emitter-base voltage, collector open T4-LDS-0056-2, Rev. 1 (121223) (c)2012 Microsemi Corporation Page 2 of 8 JANS 2N3501UB ELECTRICAL CHARACTERISTICS @ TA = +25 C, unless otherwise noted Parameters / Test Conditions OFF CHARACTERISTICS Collector-Emitter Breakdown Voltage IC = 10 mA, pulsed Symbol Min. V(BR)CEO 150 Max. Unit V Collector-Base Cutoff Current VCB = 75 V VCB = 150 V ICBO 50 10 nA A Emitter-Base Cutoff Current VEB = 4.0 V VEB = 6.0 V IEBO 25 10 nA A ON CHARACTERISTICS (1) Forward-Current Transfer Ratio IC = 0.1 mA, VCE = 10 V IC = 1.0 mA, VCE = 10 V IC = 10 mA, VCE = 10 V IC = 150 mA, VCE = 10 V IC = 300 mA, VCE = 10 V hFE 35 50 75 100 20 300 Collector-Emitter Saturation Voltage IC = 10 mA, IB = 1.0 mA IC = 150 mA, IB = 15 mA VCE(sat) 0.2 0.4 V Base-Emitter Saturation Voltage IC = 10 mA, IB = 1.0 mA IC = 150 mA, IB = 15 mA VBE(sat) 0.8 1.2 V DYNAMIC CHARACTERISTICS Forward Current Transfer Ratio, Magnitude IC = 20 mA, VCE = 20 V, f = 100 MHz |hfe| Output Capacitance VCB = 10 V, IE = 0, 100 kHz < f < 1.0 MHz Cobo 8.0 pF Input Capacitance VEB = 0.5 V, IC = 0, 100 kHz < f < 1.0 MHz Cibo 80 pF 1.5 8.0 (1) Pulse Test: pulse width = 300 s, duty cycle < 2.0%. T4-LDS-0056-2, Rev. 1 (121223) (c)2012 Microsemi Corporation Page 3 of 8 JANS 2N3501UB ELECTRICAL CHARACTERISTICS @ TA = +25 C, unless otherwise noted (continued) SWITCHING CHARACTERISTICS Parameters / Test Conditions Turn-On Time VEB = 5 V; IC = 150 mA; IB1 = 15 mA Turn-Off Time IC = 150 mA; IB1 = IB2 = 15 mA Symbol Min. Max. Unit ton 115 ns toff 1150 ns Collector Current IC (Milliamperes) SAFE OPERATING AREA (See SOA figure and reference MIL-STD-750 method 3053) DC Tests o TC = +25 C, tr > 10 ns; 1 Cycle, t = 1.0 s Test 1 VCE = 10 V, IC = 113 mA Test 2 VCE = 50 V, IC = 23 mA Test 3 VCE = 80 V, IC = 14 mA Clamped Switching o TA = +25 C Test 1 IB = 50 mA, IC = 300 mA Collector to Emitter Voltage VCE (Volts) Maximum Safe Operating Area T4-LDS-0056-2, Rev. 1 (121223) (c)2012 Microsemi Corporation Page 4 of 8 JANS 2N3501UB ELECTRICAL CHARACTERISTICS @ TA = +25 C, unless otherwise noted (continued) POST RADIATION ELECTRICAL CHARACTERISTICS Parameters / Test Conditions Collector-Emitter Breakdown Voltage IC = 10 mA Collector-Base Cutoff Current VCB = 150 V VCB = 75 V Collector to Emitter Cutoff VCE = 120 V Emitter-Base Cutoff Current VEB = 4.0 V VEB = 6.0 V Collector-Emitter Saturation Voltage IC = 10 mA, IB = 1.0 mA Base-Emitter Saturation Voltage IB = 10 mA, IB = 1.0 mA IB = 150 mA, IB = 15 mA T4-LDS-0056-2, Rev. 1 (121223) Symbol Min. V(BR)CEO 150 Max. Unit V ICBO 20 100 A nA ICEO 2 A IEBO 50 20 nA A VCE(sat) 0.23 V VBE(sat) 0.92 1.38 V (c)2012 Microsemi Corporation Page 5 of 8 JANS 2N3501UB DC Operation Maximum Rating (W) GRAPHS Tc (C) (Case) FIGURE 1 DC Operation Maximum Rating (W) Derating for all devices (RJSP) H Tc (C) (Case) FIGURE 2 Derating for all devices (RJA) T4-LDS-0056-2, Rev. 1 (121223) (c)2012 Microsemi Corporation Page 6 of 8 JANS 2N3501UB o Theta ( C/W) GRAPHS Time (s) FIGURE 3 Thermal impedance graph (RJSP) T4-LDS-0056-2, Rev. 1 (121223) (c)2012 Microsemi Corporation Page 7 of 8 JANS 2N3501UB PACKAGE DIMENSIONS Lid Symbol BH BL BW CL CW LL1 LL2 Inch Min .046 .115 .085 .022 .017 Dimensions Millimeters Max Min Max .056 1.17 1.42 .128 2.92 3.25 .108 2.16 2.74 .128 3.25 .108 2.74 .038 0.56 0.97 .035 0.43 0.89 Note Symbol LS1 LS2 LW r r1 r2 Inch Min .036 .071 .016 Dimensions Millimeters Max Min Max .040 0.91 1.02 .079 1.80 2.01 .024 0.41 0.61 .008 0.20 .012 0.31 .022 0.56 Note NOTES: 1. 2. 3. 4. 5. Dimensions are in inches. Millimeters are given for general information only. Hatched areas on package denote metallized areas. Pad 1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Shielding connected to the lid. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. T4-LDS-0056-2, Rev. 1 (121223) (c)2012 Microsemi Corporation Page 8 of 8