05170 ULC0408FC3.3C thru Only One Name Means ProTek'TionTM ULC0408FC24C UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY APPLICATIONS Cellular Phones Personal Digital Assistant (PDA) Notebook Computers SMART Cards IEC COMPATIBILITY (EN61000-4) 61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns U0408 (Single Chip Shown) FEATURES ESD Protection > 25 kilovolts Available in Six Voltage Types Ranging From 3.3V to 24V 200 Watts Peak Pulse Power per Line (tp = 8/20s) Low Clamping Voltage Bidirectional Configuration & Monolithic Structure Protects 4 to 7 Lines LOW CAPACITANCE LOW LEAKAGE CURRENT MECHANICAL CHARACTERISTICS Standard EIA Chip Size: 0408 Weight 0.73 milligrams (Approximate) Flammability Rating UL 94V-0 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 Device Marking On Reel PIN CONFIGURATION 05170.R3 2/04 1 www.protekdevices.com ULC0408FC3.3C thru ULC0408FC24C DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25C Unless Otherwise Specified SYMBOL VALUE UNITS Peak Pulse Power (tp = 8/20s) - See Figure 1 PPP 200 Watts Operating Temperature TJ -55C to 150C C TSTG -55C to 150C C PARAMETER Storage Temperature ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified PART NUMBER (See Note 1) ULC0408FC3.3C ULC0408FC05C ULC0408FC08C ULC0408FC12C ULC0408FC15C ULC0408FC24C RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM LEAKAGE CURRENT (See Note 2) TYPICAL CAPACITANCE V WM VOLTS @ 1mA V(BR) VOLTS @ IP = 1A VC VOLTS @8/20s VC @ IPP @VWM ID A @0V, 1 MHz C pF 3.3 5.9 8.0 12.0 15.0 24.0 4.0 6.0 8.5 13.3 16.7 26.7 7.0 11.0 13.2 19.8 25.4 37.2 12.5V @ 16A 13V @ 15A 18V @ 11A 26.9V @ 7.4A 34.5V @ 5.8A 50.6V @ 4A 75* 10** 1 1 1 1 70 35 32 30 25 20 Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Note 2: *Maximum leakage current < 5A @ 2.8V. **Maximum leakage current <500nA @ 3.3V. FIGURE 1 PEAK PULSE POWER VS PULSE TIME IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts 10,000 1,000 200W, 8/20s Waveform 100 10 0.01 05170.R3 2/04 FIGURE 2 PULSE WAVE FORM 120 tf 100 TEST WAVEFORM PARAMETERS tf = 8s td = 20s Peak Value IPP 80 e-t 60 40 td = t I /2 PP 20 0 1 10 100 td - Pulse Duration - s 1,000 10,000 2 0 5 10 15 t - Time - s 20 25 30 www.protekdevices.com ULC0408FC3.3C thru ULC0408FC24C GRAPHS 100 Peak Pulse Power 8/20s 80 % Of Rated Power FIGURE 4 REFLOW SOLDER PROFILE FIGURE 3 POWER DERATING CURVE 225C 5-10 sec 60 200C Instantaneous to 200C 40 1-2 Minutes to 150C 20 1-2 Minutes to 25C 100C Average Power 0 0 25 50 75 100 125 TL - Lead Temperature - C 150 Pre-Heat Time Soldering Time Cool Down Time Note: This reflow profile does not take into account the printed circuit board (PCB) material heating time. Additional time may be required for the preheat time and cool down time upon the PCB or board material. FIGURE 5 OVERSHOOT & CLAMPING VOLTAGE FOR ULC0408FC05C 5 Volts per Division 35 25 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 6 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR ULC0408FC05C VC - Clamping Voltage - Volts 14 12 10 8 6 4 2 0 0 5 10 15 20 IPP - Peak Pulse Current - Amps 05170.R3 2/04 3 www.protekdevices.com ULC0408FC3.3C thru ULC0408FC24C PACKAGE OUTLINE & DIMENSIONS PACKAGE DIMENSIONS TOP SIDE A B C PACKAGE OUTLINE DIM MILLIMETERS INCHES A 0.56 NOM 0.022 NOM B 0.86 NOM 0.034 NOM C 0.99 0.0254 0.039 0.001 E 0.15 SQ 0.006 SQ F 2.0 0.0254 0.079 0.001 I 0.406 NOM 0.016 NOM NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002"). E F Metalized Die Contact END I PAD DIMENSIONS MOUNTING PAD LAYOUT - Option 1 D A C MILLIMETERS INCHES A C D E F G H I 0.51 0.30 0.46 0.20 0.15 SQ 0.71 0.99 0.51 0.020 0.012 0.018 0.008 0.006 SQ 0.028 0.039 0.020 E DIE SOLDER CONTACT DIM NOTE: H G 1. Preferred: Using 0.1mm (0.004") stencil. F I SOLDER PADS SOLDER PRINT 0.010" - 0.012" DIA. SOLDER MASK Outline & Dimensions: Rev 3 - 2/04, 06026 05170.R3 2/04 4 www.protekdevices.com ULC0408FC3.3C thru ULC0408FC24C PACKAGE OUTLINE & DIMENSIONS PACKAGE DIMENSIONS MOUNTING PAD LAYOUT - Option 2 DIM COPPER CONTACT 0.009" [0.23] DIA. A DIE SOLDER CONTACT MILLIMETERS INCHES A 0.51 0.020 F 0.15 SQ 0.006 SQ G 0.71 0.028 H 0.99 0.039 I 0.51 0.020 H G NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002"). 3. Preferred: Using 0.1mm (0.004") stencil. Outline & Dimensions: Rev 3 - 2/04, 06026 I F TAPE & REEL ORIENTATION SOLDER PRINT 0.014" [0.36] DIA. SOLDER MASK Quad Die - 0408 NOTE: 1. Top view of tape. Solder bumps are face down in tape package. TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA 481. 2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., ULC0408FC05C-T75-1). 3. 8mm Paper Tape: 7 Inch Reels -5,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., ULC0408FC05C-T710-2). COPYRIGHT (c) ProTek Devices 2004 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. 05170.R3 2/04 5 www.protekdevices.com