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ULC0408FC24C
105170.R3 2/04 www.protekdevices.com
UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY
Only One Name Means ProTek’Tion™
U0408
(Single Chip Shown)
05170
PIN CONFIGURATION
APPLICATIONS
✔ Cellular Phones
✔ P ersonal Digital Assistant (PD A)
✔ Notebook Computers
✔ SMART Cards
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
FEATURES
✔ ESD Protection > 25 kilovolts
✔ A vailab le in Six Voltage Types Ranging F rom 3.3V to 24V
✔ 200 W atts Peak Pulse P ower per Line (tp = 8/20µs)
✔ Low Clamping V oltage
✔ Bidirectional Configuration & Monolithic Structure
✔ Protects 4 to 7 Lines
✔
LOW CAPACITANCE
✔
LOW LEAKAGE CURRENT
MECHANICAL CHARACTERISTICS
✔ Standard EIA Chip Size: 0408
✔ Weight 0.73 milligrams (Approximate)
✔ Flammability Rating UL 94V -0
✔ 8mm Plastic & P aper Tape and Reel P er EIA Standard 481
✔ Device Marking On Reel
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DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
Operating T emperature
SYMBOL VALUE
-55°C to 150°C°C
°C
-55°C to 150°C
UNITS
TJ
TSTG
PARAMETER
Storage T emperature
P eak Pulse P ow er (tp = 8/20µs) - See Figure 1 PPP 200 Watts
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V(BR)
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ IP = 1A
VC
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@8/20µs
VC @ IPP
TYPICAL
CAPACITANCE
@0V, 1 MHz
C
pF
ULC0408FC3.3C
ULC0408FC05C
ULC0408FC08C
ULC0408FC12C
ULC0408FC15C
ULC0408FC24C
3.3
5.9
8.0
12.0
15.0
24.0
4.0
6.0
8.5
13.3
16.7
26.7
7.0
11.0
13.2
19.8
25.4
37.2
12.5V @ 16A
13V @ 15A
18V @ 11A
26.9V @ 7.4A
34.5V @ 5.8A
50.6V @ 4A
70
35
32
30
25
20
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
@VWM
ID
µA
75*
10**
1
1
1
1
RATED
STAND-OFF
VOLTAGE
VWM
VOLTS
0 5 10 15 20 25 30
t - Time - µs
0
20
40
60
80
100
120
IPP - Peak Pulse Current - % of IPP
TEST
WAVEFORM
PARAMETERS
tf = 8µs
td = 20µs
tfP eak V alue IPP
e-t
td = t IPP/2
FIGURE 2
PULSE WAVE FORM
0.01 1 10 100 1,000 10,000
td - Pulse Duration - µs
10
100
1,000
10,000
PPP - Peak Pulse Current - Watts
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
200W , 8/20µs W a vef orm
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2: *Maximum leakage current < 5µA @ 2.8V. **Maxim um leakage current <500nA @ 3.3V.
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GRAPHS
0 5 10 15 20
VC - Clamping Voltage - Volts
0
4
8
12
14
FIGURE 6
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR ULC0408FC05C
10
6
2
IPP - Peak Pulse Current - Amps
225°C
5-10 sec
Instantaneous
to 200°C
Soldering
Time Cool Down
Time
1-2 Minutes
to 150°C 1-2 Minutes to 25°C
Pre-Heat
Time
100°C
200°C
Note: This reflow profile does not take into account the printed circuit board (PCB) material
heating time. Additional time may be required for the preheat time and cool down time upon the
PCB or board material.
0 25 50 75 100 125 150
TL - Lead Temperature - °C
20
40
60
80
100
% Of Rated Power
Peak Pulse Power
8/20µs
Average Power
FIGURE 3
POWER DERATING CURVE
0
FIGURE 4
REFLOW SOLDER PROFILE
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 5
OVERSHOOT & CLAMPING VOLTAGE FOR ULC0408FC05C
5 Volts per Division
-5
5
15
25
35
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PACKAGE OUTLINE & DIMENSIONS
A
B
C
E
F
I
0.56 NOM
0.86 NOM
0.99 ± 0.0254
0.15 SQ
2.0 ± 0.0254
0.406 NOM
0.022 NOM
0.034 NOM
0.039 ± 0.001
0.006 SQ
0.079 ± 0.001
0.016 NOM
DIM MILLIMETERS INCHES
PACKAGE DIMENSIONS
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
PACKAGE OUTLINE
MOUNTING PAD LAYOUT - Option 1
A
C
D
E
F
G
H
I
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.99
0.51
NOTE:
1.
Preferred:
Using 0.1mm (0.004”) stencil.
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
PAD DIMENSIONS
DIM MILLIMETERS INCHES
Outline & Dimensions: Rev 3 - 2/04, 06026
C
SOLDER PRINT 0.010” - 0.012” DIA.
A
H
D
I
SOLDER PADS
F
G
E
SOLDER
MASK
DIE
SOLDER
CONTACT
Metalized Die Contact
E
F
I
SIDE
A
B
C
TOP
END
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PACKAGE OUTLINE & DIMENSIONS
A
F
G
H
I
0.51
0.15 SQ
0.71
0.99
0.51
0.020
0.006 SQ
0.028
0.039
0.020
DIM MILLIMETERS INCHES
PACKAGE DIMENSIONS
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
3.
Preferred:
Using 0.1mm (0.004”) stencil.
MOUNTING PAD LAYOUT - Option 2
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and
reeled in accordance with EIA 481.
2.
8mm Plastic Tape:
7 Inch Reels - 5,000
pieces per reel. Ordering Suffix: -T75-1
(i.e., ULC0408FC05C-T75-1).
3.
8mm P aper Tape:
7 Inch Reels -5,000
pieces per reel. Ordering Suffix: -T710-2
(i.e., ULC0408FC05C-T710-2).
Outline & Dimensions: Rev 3 - 2/04, 06026
COPYRIGHT © ProTek Devices 2004
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
TAPE & REEL ORIENTATION
NOTE:
1. Top view of tape. Solder bumps are face
down in tape package.
Quad Die - 0408
COPPER CONTACT 0.009” [0.23] DIA.
SOLDER PRINT 0.014” [0.36] DIA.
A
H
I
F
G
SOLDER
MASK
DIE
SOLDER
CONTACT
