EC4SMC-18.400M TR EC4SM C -18.400M TR Series 4.0mm Epoxy Base SMD Crystal Packaging Options Tape and Reel Frequency Tolerance/Stability 30ppm at 25C, 50ppm over 0C to +70C Mode of Operation AT-Cut Fundamental Nominal Frequency 18.400MHz Load Capacitance 18pF Parallel Resonant ELECTRICAL SPECIFICATIONS Nominal Frequency 18.400MHz Frequency Tolerance/Stability 30ppm at 25C, 50ppm over 0C to +70C Aging at 25C 5ppm/year Maximum Load Capacitance 18pF Parallel Resonant Shunt Capacitance (C0) 7pF Maximum Equivalent Series Resistance 50 Ohms Maximum Mode of Operation AT-Cut Fundamental Drive Level 1mWatts Maximum Storage Temperature Range -40C to +85C Insulation Resistance 500 Megaohms Minimum at 100Vdc ENVIRONMENTAL & MECHANICAL SPECIFICATIONS Fine Leak Test MIL-STD-883, Method 1014 Condition A Gross Leak Test MIL-STD-883, Method 1014 Condition C Mechanical Shock MIL-STD-202, Method 213 Condition C Resistance to Soldering Heat MIL-STD-202, Method 210 Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010 Vibration MIL-STD-883, Method 2007 Condition A MECHANICAL DIMENSIONS (all dimensions in millimeters) 4 4.95 MAX 12.5 MAX 3 2.0 REF MARKING ORIENTATION 1 2 PIN CONNECTION 1 Connected to Pin 4 and to Crystal 2 Connected to Pin 3 and to Crystal 3 Connected to Pin 2 and to Crystal 4 Connected to Pin 1 and to Crystal LINE MARKING 1 4.0 MAX 1.3 0.1 (x4) E18.400 E=Ecliptek Designator 1.2 0.1 9.0 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/19/2010 | Page 1 of 4 EC4SMC-18.400M TR Suggested Solder Pad Layout All Dimensions in Millimeters 2.2 (X4) 2.3 (X4) Solder Land (X4) 6.7 1.3 All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/19/2010 | Page 2 of 4 EC4SMC-18.400M TR Tape & Reel Dimensions Quantity Per Reel: 1,000 units 4.0 0.1 2.0 0.1 DIA 1.5 0.1 0.40 0.05 11.5 0.1 24.0 0.3 12.5 0.1 10.75 0.10 12.0 0.1 5.4 0.1 4.2 0.1 *Compliant to EIA 481A 1.5 MIN 30.4 MAX DIA 40 MIN Access Hole at Slot Location 360 MAX DIA 50 MIN DIA 20.2 MIN DIA 13.0 0.2 2.5 MIN Width 10.0 MIN Depth Tape slot in Core for Tape Start 24.4 +2.0/-0 www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/19/2010 | Page 3 of 4 EC4SMC-18.400M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 225C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 30 - 60 Seconds 5C/second Maximum 150C 200 Seconds Maximum 225C Maximum 225C Maximum 2 Times 80 seconds Maximum 2 Times 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/19/2010 | Page 4 of 4