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DATA SHEET
SMP1304 Series: Low-Distortion Attenuator Plastic
Packaged PIN Diodes
Applications
TV distribution
Attenuator circuits
Features
Low-distortion design
Frequency range from 5 MHz to >2 GHz
Designed for base station applications
Configured for PI and TEE attenuators
Packages rated MSL1 @ 260 °C per JEDEC J-STD-020
Description
The SMP1304 series of plastic packaged, surface mountable, low
capacitance (0.3 pF) silicon PIN diodes is designed for attenuator
applications from 5 MHz to beyond 2 GHz.
The thick 100 μm I region of these PIN diodes makes them very
attractive for use in low-distortion PI and TEE attenuators
commonly found in TV distribution applications.
The 1 μs typical carrier lifetime of these diodes results in a
resistance of 20 Ω maximum at 1 mA and 7 Ω maximum at
10 mA.
The SMP1304 series is available in a selection of plastic
packages: as a single diode in small footprint SOD-323 and SC-79
packages, and in a variety of configurations in an SOT-23
package, including the low inductance (0.4 nH) SMP1304-007.
The SMP1304-019, a three-diode junction designed for insertion
in PI attenuators, is available in an SOT-143 package. The
SMP1304-027 is available in an SOT-5 package as a four-diode
array designed for insertion in commonly used four-diode PI
attenuator circuits.
Table 1 describes the various packages and marking of the
SMP1304 series.
DATA SHEET • SMP1304 SERIES
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Table 1. SMP1304 Series Packaging and Marking
Single Common
Cathode Series Pair Reverse Series
Pair
Low
Inductance Single PI PI Single
SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOD-323
Green™ SOT-143 SOT-5 SC-79
Green™
SMP1304-001
Marking: PG1
SMP1304-004
Marking: PG3
SMP1304-005
Marking: PG2 SMP1304-007
Marking: PGB SMP1304-019
Marking: PGJ
SMP1304-027
Marking: PGM
SMP1304-
001LF
Green™
Marking: RG1
SMP1304-
004LF
Green™
Marking:RG3
SMP1304-
005LF
Green™
Marking: RG2
SMP1304-
006LF
Green™
Marking: RG8
SMP1304-
007LF
Green™
Marking: RGB
SMP1304
-011LF
Marking: RG
SMP1304-
019LF
Marking: RGJ
SMP1304-
027LF
Green™
Marking: RGM
SMP1304-
079LF
Marking:
Cathode
LS = 1.5 nH LS = 1.5 nH LS = 1.5 nH LS = 1.5 nH LS = 1.4 nH LS = 1.5 nH LS = 1.5 nH LS = 1.5 nH LS = 0.7 nH
The Pb-free symbol or “LF” in the part number denotes a lead-free, RoHS-compliant package unless otherwise noted as Green™. Tin/lead
(Sn/Pb) packaging is not recommended for new designs.
Innovation to Go™
Select Linear Products (indicated by ) now available for purchase online.
SMP1304-007
The inductance of the SMP1304-007 is effectively reduced to
0.4 nH compared to the 1.5 nH of the standard configuration. The
lower inductance is particularly beneficial when the diodes are
used as shunt-connected switches at frequencies >500 MHz
where inductance is the primary limitation on maximum switch
isolation.
To achieve the effective 0.4 nH, the SMP1304-007 must be
inserted in the microstrip circuit board with a gap in the trace as
shown in Figure 1. Because of the polarity of the diode junction,
the low inductance can only be achieved with the cathode
connected to ground.
Figure 1. SOT-23 Package Trace Gap
Figure 2. SMP1304-019 Package (PI)
SMP1304-019 PI Attenuator PIN Diodes
The SMP1304-019 uses three PIN diode junctions in an SOT-143
package (see Figure 2). The junctions are configured for ease of
insertion in PI attenuator circuits in common use from 10 MHz to
>1 GHz. The SMP1304-019 PIN diode junction was designed for
low capacitance, a wide resistance dynamic range, and low
distortion performance.
Electrical and Mechanical Specifications
The absolute maximum ratings of the SMP1304 series are
provided in Table 2. Electrical specifications are provided in
Table 3. Resistance versus temperature measurements are
provided in Table 4.
Typical performance characteristics of the SMP1304 series are
illustrated in Figures 3 to 6. Package dimensions are shown in
Figures 7 to 15 (odd numbers), and tape and reel dimensions are
provided in Figures 8 to 16 (even numbers).
Package and Handling Information
Instructions on the shipping container label regarding exposure to
moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SMP1304 series is rated to Moisture Sensitivity Level 1
(MSL1) at 260 °C. It can be used for lead or lead-free soldering.
For additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
DATA SHEET • SMP1304 SERIES
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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Table 2. SMP1304 Series Absolute Maximum Ratings
Parameter Symbol Minimum Maximum Units
Reverse voltage VR 200 V
Power dissipation @ 25 °C lead temperature PD 250 mW
Storage temperature TSTG 65 +150 °C
Operating temperature TA 65 +150 °C
Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. The
SMP1304 series PIN diodes are Class 1C ESD devices.
Table 3. SMP1304 Series Electrical Specifications (Note 1)
(TA = +25 °C, Unless Otherwise Noted)
Parameter Symbol Test Condition Typical Max Units
Reverse Current IR VR = 200 V 10 μA
Capacitance (Note 2) CT f = 1 MHz, V = 30 V 0.3 pF
Resistance RS f = 100 MHz
I = 1 mA
I = 10 mA
I = 100 mA
40
50
7
2
Ω
Ω
Ω
Forward voltage VF IF = 10 mA 0.8 V
Carrier lifetime Tl IF = 10 mA 1 μs
I region width 100 μm
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Note 2: The SMP1304-019 and SMP1304-027 maximum capacitance is 0.45 pF.
Table 4. Resistance vs Temperature @ 100 MHz
IF
(mA)
RS @ 55 °C
(Ω)
RS @ 15 °C
(Ω)
RS @ +25 °C
(Ω)
RS @ +65 °C
(Ω)
RS @ +100 °C
(Ω)
0.02 1590 1660 1752 `1770 1760
0.10 315 340 367 396 409
0.30 108 118 128 141 147
1.0 34.5 37.9 41.6 46.3 48.8
10 4.8 5.3 5.8 6.6 7.0
20 3.0 3.3 3.6 4.1 4.3
100 1.3 1.4 1.5 1.7 1.8
DATA SHEET • SMP1304 SERIES
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Typical Performance Characteristics
Figure 3. Series Resistance vs Current @ 100 MHz
Figure 5. Capacitance vs Reverse Voltage
Figure 4. DC Characteristic
Figure 6. Conductance vs Frequency and Reverse Voltage
DATA SHEET • SMP1304 SERIES
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Figure 7. SC-79 Package Dimension Drawing
Figure 8. SC-79 Tape and Reel Dimensions
DATA SHEET • SMP1304 SERIES
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Figure 9. SOD-323 Package Dimension Drawing
Figure 10. SOD-323 Tape and Reel Dimensions
DATA SHEET • SMP1304 SERIES
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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Figure 11. SOT-5 Package Dimension Drawing
Figure 12. SOT-5 Tape and Reel Dimensions
DATA SHEET • SMP1304 SERIES
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Figure 13. SOT-23 Package Dimension Drawing
Figure 14. SOT-23 Tape and Reel Dimensions
DATA SHEET • SMP1304 SERIES
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Figure 15. SOT-143 Package Dimension Drawing
Figure 16. SOT-143 Tape and Reel Dimensions
DATA SHEET • SMP1304 SERIES
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