GaAs HBT INTEGRATED CIRCUIT PG2301T5L D POWER AMPLIFIER FOR BluetoothTM Class 1 UE DESCRIPTION The PG2301T5L is GaAs HBT MMIC for power amplifier which were developed for Bluetooth Class 1. This device realizes high efficiency, high gain and high output power by using InGaP HBT. This device is housed in a 12-pin plastic TSQFN package. And this package is able to high-density surface mounting. FEATURES : fopt = 2 400 to 2 500 MHz (2 450 MHz TYP.) * Supply voltage : VCC1, 2 = Vbias = 2.7 to 3.6 V (3.3 V TYP.) * Control voltage : Vcont = 0 to 3.6 V (2.5 V TYP.) O NT IN * Operation frequency : Venable = 0 to 3.1 V (2.9 V TYP.) * Circuit current : ICC = 120 mA TYP. @ VCC1, 2 = Vbias = 3.3 V, Vcont = 2.5 V, Venable = 2.9 V, Pin = +4 dBm * Maximum power V, : Pout (MAX.) = +23 dBm TYP. @ VCC1, 2 = Vbias = 3.3 V, Vcont = 2.5 V, Venable = 2.9 Pin = +4 dBm * Gain Control Range : GCR = 23 dB TYP. @ VCC1, 2 = Vbias = 3.3 V, Vcont = 0 to 2.5 V, Venable = 2.9 V, * Power gain : GP = 23 dB TYP. (Reference value) Pin = +4 dBm * High efficiency : PAE = 50% TYP. (Reference value) * Shut down function * High-density surface mounting : 12-pin plastic TSQFN package (2.0 2.0 0.37 mm) APPLICATIONS * Power Amplifier for Bluetooth Class 1 etc. SC ORDERING INFORMATION Part Number Order Number Package Marking PG2301T5L-E2 PG2301T5L-E2-A 12-pin plastic TSQFN 2301 (Pb-Free) Note Supplying Form Embossed tape 8 mm wide Pin 10, 11, 12 face the perforation side of the tape Qty 3 kpcs/reel Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact DI your nearby sales office. Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PG2301T5L-A Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge Document No. PG10559EJ01V0DS (1st edition) Date Published April 2005 CP(K) NEC Compound Semiconductor Devices, Ltd. 2005 PG2301T5L PIN CONNECTIONS Pin Name 1 GND (NC) 2 GND 3 OUT/VCC2 4 GND (NC) 5 Venable 6 Vbias 7 VCC1 8 GND 9 IN 10 GND (NC) 11 Vcont 12 GND (NC) O NT IN UE D Pin No. ABSOLUTE MAXIMUM RATINGS (T A = +25C, unless otherwise specified) Parameter Supply Voltage Symbol Ratings Unit VCC1, 2 5.5 V 3.6 V ICC 400 mA Icont 0.5 mA Vbias Control Voltage Vcont Venable Circuit Current Control Current Ienable Power Dissipation PD 700 Note mW TA 40 to +85 C Storage Temperature Tstg 55 to +150 C Pin +10 dBm SC Operating Ambient Temperature Input Power Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB, TA = +85C RECOMMENDED OPERATING RANGE (T A = +25C) DI Parameter Operating Frequency Supply Voltage Control Voltage Symbol MIN. TYP. MAX. Unit fopt 2 400 2 450 2 500 MHz VCC1, 2 2.7 3.3 3.6 V Vcont 0 2.5 3.6 V Venable 0 2.9 3.1 Vbias ELECTRICAL CHARACTERISTICS 2 Data Sheet PG10559EJ01V0DS PG2301T5L (T A = +25C, VCC1, 2 = Vbias = 3.3 V, f = 2 450 MHz, External input and output matching, unless otherwise specified) Parameter Circuit Current Symbol ICC Test Conditions MIN. TYP. MAX. Unit Vcont = 2.5 V, Venable = 2.9 V, 110 120 130 mA Pin = +4 dBm Ishut down Vcont = 2.5 V, Venable = 0 V, Pin = +4 dBm Output Power 1 Pout1 Vcont = 2.5 V, Venable = 2.9 V, +21 Output Power 2 Pout2 Vcont = 0 V, Venable = 2.9 V, Pin = +4 dBm Gain Control Range GCR Vcont = 0 to 2.5 V, Venable = 2.9 V, Pin = +4 dBm 1.0 A +23 +24.5 dBm UE Pin = +4 dBm 0.1 D Shut Down Current 0 +1 dBm 20 23 dB O NT IN STANDARD CHARACTERISTICS FOR REFERENCE (T A = +25C, VCC1, 2 = Vbias = 3.3 V, f = 2 450 MHz, External input and output matching, unless otherwise specified) Parameter Efficiency Symbol PAE Test Conditions Vcont = 2.5 V, Venable = 2.9 V, MIN. TYP. MAX. Unit 50 % 23 dB 19 dB Pin = +4 dBm Power Gain1 GP1 Vcont = 2.5 V, Venable = 2.9 V, Pin = 5 dBm Power Gain2 GP2 Vcont = 2.5 V, Venable = 2.9 V, DI SC Pin = +4 dBm Data Sheet PG10559EJ01V0DS 3 PG2301T5L O NT IN UE D EVALUATION CIRCUIT (VCC1, 2 = Vbias = 3.3 V, f = 2 450 MHz) DI SC The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10559EJ01V0DS PG2301T5L PACKAGE DIMENSIONS O NT IN UE D 12-PIN PLASTIC TSQFN (UNIT: mm) DI SC Remark ( ) : Reference value Data Sheet PG10559EJ01V0DS 5 PG2301T5L RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Wave Soldering : 260C or below Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260C or below : 120C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350C or below : 3 seconds or less O NT IN Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below DI SC Caution Do not use different soldering methods together (except for partial heating). 6 Data Sheet PG10559EJ01V0DS WS260 : 10 seconds or less Preheating temperature (package surface temperature) Soldering time (per side of device) IR260 D Peak temperature (package surface temperature) Time at peak temperature Partial Heating Condition Symbol UE Infrared Reflow Soldering Conditions HS350 PG2301T5L Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. D 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. DI SC O NT IN UE * Do not lick the product or in any way allow it to enter the mouth. Data Sheet PG10559EJ01V0DS 7