Effective June 2017 Supersedes July 2010 Technical Data 4071 MLVB HALOGEN HF Pb FREE Multilayer varistor ESD suppressor Applications Computers and peripherals Digital cameras Mobile phones Medical equipment DVD Players MP3/Multimedia players LCD TV / Monitor External storage Cable/DSL Modems USB 2.0 Set top boxes * * * * * * * * * * * Surface Mount Device Product features MLVB * Zinc oxide based ceramic chip * Low capacitance to meet the need for high speed transient voltage protection * Provides ESD protection with fast response time (<1ns) allowing equipment to pass IEC 61000-4-2 Level 4 Test * Low profile designs for board space savings * Low and stable leakage current reduces power consumption * Low clamping voltage * Lead free, halogen free and RoHS compliant for global applications 04 Size 0402 0402 0402 0402 0603 0603 0603 0603 Working Voltage (Vdc) 18 18 18 9 18 18 18 9 C001 Product Family Size Working DC Voltage Capacitance in pF* * Part numbers use "R" to denote decimal point for decimal values of pico farads. Packaging * Size 0402: 10,000 pieces per reel - EIA (EIAJ) * Size 0603: 4000 pieces per reel - EIA (EIAJ) Specifications Part Number MLVB04V18C0R5 MLVB04V18C001 MLVB04V18C003 MLVB04V09C005 MLVB06V18C0R5 MLVB06V18C001 MLVB06V18C003 MLVB06V09C005 V18 Varistor Voltage @1mAdc 90-120 46-60 22-34 11-17 90-120 46-60 22-34 11-17 Clamping Voltage 250* 110* 58 35 250* 110* 58 35 * Maximum peak voltage across the varistor with 8/20s waveform and 0.5A pulse current. Working Voltage (Vdc) - Maximum DC operating voltage the varistor can maintain and not exceed 10A leakage current. Varistor Voltage - Voltage across the device measured at 1mA DC current. Equivalent to VB, "breakdown voltage." Clamping Voltage - Maximum peak voltage across the varistor with 8/20s waveform and 1A pulse current. Capacitance - Device capacitance measured with zero volt bias 1Vrms at 1MHz. Capacitance Leakage pF Current (A) 0.5 <10 1 <10 3 <10 5 <10 0.5 <10 1 <10 3 <10 5 <10 MLVB Multilayer varistor ESD suppressor Technical Data 4071 Effective June 2017 Dimensions - mm Recommended Pad Layout - mm (in) c W a b C d L H Size 0402 0603 L 1.000.15 1.600.20 W 0.500.10 0.800.20 H 0.500.10 0.800.20 Size 0402 0603 C 0.250.15 0.300.20 Tape Packaging Specifications - mm a b 0.51 (0.020) 0.61 (0.024) 0.50 (0.020) 1.02 (0.040) c 0.51 (0.020) 0.76 (0.030) d 1.70 (0.067) 2.54 (0.100) Soldering Recommendations A B W 0402 Carrier Dimensions E F P0 P1 0.58 1.2 0.03 0.03 8.0 1.75 0.1 0.05 0.90 1.80 0.20 0.20 8.0 1.75 0.30 0.10 3.5 0.05 4.0 0.1 2.0 0.05 P2 D0 T 2.0 0.05 1.55 0.60 0.05 0.03 2.00 0.05 1.50 0.10 Time (seconds) 0603 Carrier Dimensions 3.50 0.05 4.00 0.10 - Temperature (C) * Compatible with lead and lead-free solder reflow processes * Peak reflow temperatures and durations: - IR Reflow = 260C max for 30 sec. max. - Wave Solder = 260C max. for 10 sec. max. * Recommended IR Reflow Profile: - Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics (c) 2017 Eaton All Rights Reserved Printed in USA Publication No. 4071 BU-SB10744 June 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners.