MULTILAYER FERRITE CHIP BEADS BK SERIES OPERATING TEMP. -55V+125C FEATURES YInternal silver printed layer creates a closed circuit which acts as a magnetic shield minimizing heat generation and crosstalk. YNo need for grounding provides greater circuit design flexibility. YSeveral material types and a broad range of impedance values provide noise countermeasures for various applications. HS : Suppresses the XL component. Helps stop the reduction of the waveform(digital wave-form overshoot, etc.) HM : Increases the Z characteristic sharply above 20MHz and is applicable for radiated noise in the 100MHzV300MHz range. Especially effective on video signal lines. LL : Designed as a noise countermeasure for the 200MHzV500MHz range where the rise of the Z component is in the high frequency area. LM : Intended for noise suppression around 200MHz. Effectively increases attenuation. HW : The best material in the BK Series to suppress the XL component and stop the reduction of the wave-form while maintaining attenuation in the high frequency area. TS : Reduced DC resistance version for noise countermeasures around LSI power supplies. YAg YGND Y HS DXL() HM D20MHzZ100MHzV300MHz () LL DZ200MHzV500MHz LM D200MHz HWDXL TS DLSI APPLICATIONS YHigh frequency noise countermeasure in personal computers, digital cameras and other information system products. For use on digital product clock lines and general signal lines. YRediated noise suppression in computer or printer interfaces and harness connectors. YNoise suppression in video and other AV products. YPrevents interference between circuits in cellular phones(PHS, PDC, etc.) YDue to the closed internal circuit which acts as a magnetic shield, the TS material is extremely effective as a noise filter on LSI power supply lines where downsizing of components is needed. YY Y YAV YPDCPHS YLSI (TS) ORDERING CODE 1 3 4 5 7 hEi BK 2 HW HS HM LM LL TS 150 101 102 Q QW 6 fLPWghmmi 0603(0201) 1005(0402) 1608(0603) 2125(0805) K 15 100 1000 T 0.6P0.3 1.0P0.5 1.6P0.8 2.0P1.25 B K 1 6 0 8 H S 1 2 1 _ T Z 1 2 4 5 6 1 3 4 5 7 Type Material ImpedancehEi Characteristics Internal code BK Multilayer Ferrite Chip Beads 2 External DimensionsfLPWghmmi 0603(0201) 1005(0402) 1608(0603) 2125(0805) 234 3 0.6P0.3 1.0P0.5 1.6P0.8 2.0P1.25 HW HS HM LM LL TS Refer to impedance curves for material differences example 150 101 102 K Standard Products 15 100 1000 6 Packaging T Tape & Reel 7 Q Standard Products QWBlank Space EXTERNAL DIMENSIONS Type L 0.60M0.03 BK0603 f0201g f0.024M0.01g BK1005 1.00M0.05 f0402g f0.039M0.002g W 0.30M0.03 T 0.30M0.03 f0.012M0.001g 0.50M0.05 f0.020M0.002g e 0.15M0.05 f0.012M0.001g f0.006M0.002g 0.50M0.05 0.25M0.10 f0.020M0.002g f0.010M0.004g BK1608 1.6M0.15 0.8M0.15 0.8M0.15 0.3M0.2 f0603g f0.063M0.006g f0.031M0.006g f0.031M0.006g f0.012M0.008g 2.0 J0.3 1.25M0.2 0.85M0.2 0.15M0.05 K0.1 BK2125 f0805g f0.079J0.012 g K0.004 1.25M0.2 f0.049M0.008g f0.033M0.008g f0.020M0.012g f0.049M0.008g UnitDmmfinchg 5 FERRITE PRODUCTS AVAILABLE MATERIALS BK0603 HS type HM type LL type I max=200mA I max=200mA I max=150V200mA HS type HM type BK1005 HW type LL type 2500 1 2 3 4 5 6 601 241 121 680 330 100 1 1250 1 2 3 4 5 6 7 8 LL241 LL181 LL121 LL680 LL470 LL330 LL220 LL100 1 2 3 2 3 I max=300V500mA 4 5 6 7 8 4 5 6 0 I max=300V1000mA I max=150V300mA I max=250V500mA HS type HM type LL type BK1608 HW type I max=150mA LL type 2000 1000 1 2 3 4 5 6 7 LL241 LL181 LL121 LL680 LL560 LL470 LL300 1 2 3 4 5 6 7 0 I max=300V600mA Selection Guide P.10 I max=200V350mA I max=300V1500mA Part Numbers P.237 Electrical Characteristics P.239 Packaging P.260 I max=150V500mA I max=150V500mA Reliability Data Precautions P.262 P.270 etc 235 AVAILABLE MATERIALS BK1608 LM type TS type I max=200V300mA I max=300V400mA BK2125 236 HS type HM type LL type LM type I max=300V1200mA I max=400V800mA I max=300V600mA I max=200V400mA PART NUMBERS BK0603 Ordering code 0603 0603 0603 0603 0603 0603 0603 0603 HS HS HS HM HM LL LL LL 800 121 241 600 121 100 220 330 Measuring frequency hMHzi Impedance hEi M25L 68 120 240 430 600 10 33 68 120 240 600 120 240 470 600 1000 10 22 33 47 68 120 180 240 Measuring frequency hMHzi 100 DC resistance hEi fmax.g 0.40 0.50 0.80 0.40 0.50 0.40 0.50 0.80 Rated current hmAi fmax.g 200 200 200 200 200 200 200 150 DC resistance hEi fmax.g 0.17 0.24 0.31 0.50 0.60 0.05 0.10 0.13 0.23 0.33 0.58 0.25 0.36 0.56 0.59 0.80 0.15 0.20 0.30 0.35 0.31 0.45 0.53 0.70 Rated current hmAi fmax.g 500 450 400 350 300 1000 700 600 500 400 300 300 300 250 250 150 500 400 400 350 400 350 300 250 Thickness hmmi finchg 0.30M0.03 f0.012M0.001g BK1005 Ordering code BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 HW HW HW HW HW HS HS HS HS HS HS HM HM HM HM HM LL LL LL LL LL LL LL LL 680 121 241 431 601 100 330 680 121 241 601 121 241 471 601 102 100 220 330 470 680 121 181 241 100 Thickness hmmi finchg 5 FERRITE PRODUCTS BK BK BK BK BK BK BK BK Impedance hEi M25L 80 120 240 60 120 10 22 33 0.50M0.05 f0.020M0.002g 237 PART NUMBERS BK1608 Ordering code BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 HW HW HW HW HS HS HS HS HS HS HS HS HS HM HM HM HM HM LL LL LL LL LL LL LL LL LL LL LL LM LM LM LM TS TS TS 121 241 431 601 220 330 470 600 800 121 241 601 102 121 241 471 601 102 300 470 560 680 121 181 241 331 431 511 681 751 152 182 252 431 601 102 Impedance hEi M25L 120 240 430 600 22 33 47 60 80 120 240 600 1000 120 240 470 600 1000 30 47 56 68 120 180 240 330 430 510 680 750 1500 1800 2500 430 600 1000 Measuring frequency hMHzi Impedance hEi M25L 15 22 33 47 75 100 120 240 430 600 1000 120 240 470 600 1000 56 120 240 750 1500 1800 2500 Measuring frequency hMHzi 100 DC resistance hEi fmax.g 0.15 0.25 0.30 0.40 0.05 0.08 0.10 0.10 0.10 0.18 0.25 0.45 0.60 0.20 0.35 0.45 0.60 0.70 0.20 0.30 0.30 0.35 0.50 0.65 0.80 0.85 0.85 0.90 1.00 0.60 0.75 0.85 1.10 0.25M30% 0.27M30% 0.35M30% Rated current hmAi fmax.g 600 450 400 300 1500 1200 900 800 600 500 400 350 300 350 300 250 250 200 500 400 400 300 300 250 250 200 200 200 150 300 250 200 200 400 350 300 DC resistance hEi fmax.g 0.05 0.05 0.05 0.05 0.10 0.10 0.15 0.20 0.25 0.30 0.40 0.15 0.20 0.25 0.25 0.35 0.20 0.30 0.35 0.30 0.35 0.45 0.75 Rated current hmAi fmax.g 1200 1200 1200 1000 1000 900 800 600 500 500 300 800 600 500 500 400 600 400 300 400 400 300 200 Thickness hmmi finchg 0.80M0.15 f0.031M0.006g BK2125 Ordering code BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK 238 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 HS HS HS HS HS HS HS HS HS HS HS HM HM HM HM HM LL LL LL LM LM LM LM 150 220 330 470 750 101 121 241 431 601 102 121 241 471 601 102 560 121 241 751 152 182 252 100 Thickness hmmi finchg 0.85M0.2 f0.033M0.008g 1.25M0.2 (0.049M0.008) ELECTRICAL CHARACTERISTICS BK0603 5 FERRITE PRODUCTS 239 ELECTRICAL CHARACTERISTICS BK1005 BK1005 HS680 BK1005 HS330 100 100 80 80 60 60 40 40 20 20 0 0 1 240 10 100 1000 1 10 100 1000 ELECTRICAL CHARACTERISTICS BK1005 LL100 BK1005 LL220 200 200 150 150 100 100 50 50 0 1 10 BK1005 LL330 100 1000 10000 1 10 500 400 400 300 300 200 200 100 100 1000 10000 1000 10000 BK1005 LL680 BK1005 LL470 500 100 500 FERRITE PRODUCTS 0 5 250 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 241 ELECTRICAL CHARACTERISTICS BK1608 242 ELECTRICAL CHARACTERISTICS 5 FERRITE PRODUCTS BK1608 LL300 BK1608 LL470 BK1608 LL560 500 500 500 250 250 250 0 0 1 10 100 1000 10000 0 1 BK1608 LL680 10 100 1000 10000 1 10 100 1000 10000 BK1608 LL121 500 1500 250 750 0 0 1 10 100 1000 10000 1 10 100 1000 243 244 ELECTRICAL CHARACTERISTICS ELECTRICAL CHARACTERISTICS BK2125 5 FERRITE PRODUCTS 245 ELECTRICAL CHARACTERISTICS BK2125 HM471 Impedance 1000 Z 500 R X 0 1 10 100 1000 Frequency BK2125 LL121 1000 Z Impedance R 500 X 0 1 10 Frequency 246 100 1000 MULTILAYER FERRITE CHIP BEADS (FOR POWER SUPPLY LINES) BK SERIES P TYPE -55V+85C OPERATING TEMP. FEATURES YLow Rdc value brings about low power dissipation and extending the life of batteries. That stands on the high advanced green sheet and printing technologies. YNo need for grounding provides greater circuit design. YRdc YGND APPLICATIONS YHigh frequency noise debug on the DC power supply line in personal computers and other information system products. YNoise suppression in USB and IEEE1394 interface. YPrevents interference between circuits in mobile systems(PDC, PHS, PDA) YDC YUSBIEEE1394 YPDCPHSPDA ORDERING CODE 1 3 4 5 7 hEi BKP HS 330 101 391 2 Q QW 6 fLPWghmmi 1005(0402) 1608(0603) 2125(0805) K 33 100 390 T 1.0P0.5 1.6P0.8 2.0P1.25 B K P 1 6 0 8 H S 1 8 1 _ T Z 1 5 4 6 1 3 4 5 7 Type Material ImpedancehEi Characteristics Internal code BKP Multilayer Ferrite Chip Beads (For Power Supply Lines) HS For broadband applications example 330 101 391 K Standard Products 33 100 390 2 6 External DimensionsfLPWghmmi Packaging 1005(0402) 1608(0603) 2125(0805) 248 3 2 1.0P0.5 1.6P0.8 2.0P1.25 T Tape & Reel 7 Q Standard Products QWBlank Space EXTERNAL DIMENSIONS Type L W T e 1.00M0.05 0.50M0.05 0.50M0.05 0.25M0.10 BKP1005 f0402g f0.039M0.002g f0.020M0.002g f0.020M0.002g f0.010M0.004g BKP1608 1.6M0.15 0.8M0.15 0.8M0.15 0.3M0.2 f0603g f0.063M0.006g f0.031M0.006g f0.031M0.006g f0.012M0.008g BKP2125 f0805g 2.0 J0.3 K0.1 f0.079J0.012 g K0.004 1.25M0.2 0.85M0.2 0.15M0.05 f0.049M0.008g f0.033M0.008g f0.020M0.012g UnitDmmfinchg 5 AVAILABLE MATERIALS FERRITE PRODUCTS BKP1005 HS type 500 250 121 5 6 I max=1A BKP1608 HS type 500 1 2 3 4 5 6 HS391 HS271 HS181 HS101 HS600 HS330 1 2 250 3 4 5 6 I max=1V3A BKP2125 HS type 500 1 2 3 4 HS221 HS101 HS600 HS330 250 1 2 3 4 I max=2V4A Selection Guide P.10 Part Numbers P.250 Electrical Characteristics P.251 Packaging P.260 Reliability Data Precautions P.262 P.270 etc 249 PART NUMBERS BKP1005 Ordering code BKP1005 HS 121 Impedance hEi M25L 120 Measuring frequency hMHzi DC resistance hmEi fmax.g Rated current hAi fmax.g 100 140 1.0 DC resistance hmEi fmax.g 25 40 50 75 110 140 Rated current hAi fmax.g 3.0 2.5 1.7 1.5 1.2 1.0 DC resistance hmEi fmax.g 20 25 40 50 Rated current hAi fmax.g 4.0 3.0 2.5 2.0 Thickness hmmi finchg 0.50M0.05 (0.02M0.002) BKP1608 Ordering code BKP1608 BKP1608 BKP1608 BKP1608 BKP1608 BKP1608 HS HS HS HS HS HS 330 600 101 181 271 391 Impedance hEi M25L 33 60 100 180 270 390 Measuring frequency hMHzi Impedance hEi M25L 33 60 100 220 Measuring frequency hMHzi 100 Thickness hmmi finchg 0.80M0.15 (0.031M0.006) BKP2125 Ordering code BKP2125 BKP2125 BKP2125 BKP2125 250 HS HS HS HS 330 600 101 221 100 Thickness hmmi finchg 0.85M0.2 (0.033M0.008) ELECTRICAL CHARACTERISTICS BKP1005 BKP1005 HS121 500 250 5 1 10 100 FERRITE PRODUCTS 0 1000 BKP1608 BKP1608 HS600 BKP1608 HS330 BKP1608 HS101 100 100 500 50 50 250 0 0 1 10 100 1 1000 BKP1608 HS181 10 100 1000 0 1 BKP1608 HS271 500 500 250 250 250 0 1 10 100 1000 1 10 100 100 1000 BKP1608 HS391 500 0 10 1000 0 1 10 100 1000 251 ELECTRICAL CHARACTERISTICS BKP2125 BKP2125 HS330 BKP2125 HS600 100 500 50 50 250 0 0 1 10 100 1000 BKP2125 HS221 500 250 0 1 252 BKP2125 HS101 100 10 100 1000 0 1 10 100 1000 1 10 100 1000 MULTILAYER FERRITE CHIP BEAD ARRAY BK ARRAY SERIES OPERATING TEMP. K55VJ125C FEATURES YAvailable in a wide range of frequency characteristics and impedance values providing excellent suppression of various noise. Y4 line action in one chip is available for mounting with higher density and efficiency. YHeat generation and crosstalk between adjacent circuits is minimized. Y Y14 Y APPLICATIONS YWaveform correction in personal computers, word processors, printers and facsimile signal lines, and provides radiated noise countermeasures in interfaces and harness connecting parts. YPrevents noise intrusion in videos, car audio, etc. Y Y Y ORDERING CODE 1 3 4 5 6 [E] BK 4W 4S 4M 4L 601 102 Q QW KT 600 1000 2 fLPWghmmi 2010f0804g 3216 f1206g 2.0P1.0 3.2P1.6 B K 3 2 1 6 1 2 S 0 1 _ 6 3 4 T Z 5 1 3 4 5 6 Type Material Nominal Impedance [E] Packaging Inter nal code BK Multilayer ferrite chip beads 2 External DimensionfLPWg[mm] 2010 f0804g 3216 f1206g 254 4 2.0P1.0 3.2P1.6 4W 4S 4M 4L Refer to impedance curves for material difference example 601 102 KT 600 1000 Tape&Reel 6 Q Standard Products QWBlank Space EXTERNAL DIMENSIONS Type Material BK2010 4W, 4S,4M L W T E1 2.0M0.15 1.0M0.15 0.45M0.05 0.25 J0.15 K0.1 E2 P 0.25M0.15 0.5M0.1 f0804g f0.079M0.006g f0.039M0.006g f0.018M0.002g f0.010 J0.006 4L K0.004 g f0.010M0.006g f0.020M0.004g BK3216 4W, 4S, 4M, 3.2M0.2 1.6M0.2 0.8M0.1 0.35M0.2 0.3M0.2 0.8M0.1 (1206) f0.126M0.008g f0.063M0.008g f0.031M0.004g f0.014M0.008g f0.012M0.008g f0.031M0.004g 4L UnitDmmfinchg 5 AVAILABLE MATERIALS FERRITE PRODUCTS BK2010 4S type BK3216 Selection Guide P.10 Part Numbers P.256 Electrical Characteristics P.257 Packaging P.260 Reliability Data Precautions P.262 P.270 etc 255 PART NUMBERS BK2010 Ordering code Impedance Measuring Frequency DC Resistance Rated current hEiM25L hMHzi hEi fmax.g hmAi fmax.g BK2 0 1 0 4W68 0 68 0.35 BK2 0 1 0 4W12 1 120 0.40 BK2 0 1 0 4W24 1 240 0.50 BK2 0 1 0 4 S1 2 1 120 0.30 BK2 0 1 0 4 S2 4 1 240 0.45 BK2 0 1 0 4 S4 3 1 430 0.55 BK2 0 1 0 4 S6 0 1 600 0.70 BK2 0 1 0 4M1 2 1 120 0.30 BK2 0 1 0 4M2 4 1 240 BK2 0 1 0 4M4 3 1 430 BK2 0 1 0 4M6 0 1 600 0.70 BK2 0 1 0 4 L 0 5 0 5 0.10 BK2 0 1 0 4 L 1 0 0 10 0.10 BK2 0 1 0 4 L 2 2 0 22 0.20 BK2 0 1 0 4 L 3 3 0 33 0.30 BK2 0 1 0 4 L 4 7 0 47 0.40 BK2 0 1 0 4 L 6 8 0 68 0.50 BK2 0 1 0 4 L 1 2 1 120 0.70 BK2 0 1 0 4 L 1 8 1 180 0.90 0.45 100 0.55 100 BK3216 Ordering code 256 Impedance Measuring Frequency DC Resistance Rated current hEiM25L hMHzi hEi fmax.g hmAi fmax.g BK3 2 1 6 4W12 1 120 0.15 100 BK3 2 1 6 4W24 1 240 0.25 100 BK3 2 1 6 4W43 1 430 0.35 100 BK3 2 1 6 4W60 1 600 0.40 100 BK3 2 1 6 4 S6 0 0 60 0.18 200 BK3 2 1 6 4 S1 2 1 120 0.18 200 BK3 2 1 6 4 S2 4 1 240 0.30 200 BK3 2 1 6 4 S4 7 1 470 0.40 200 BK3 2 1 6 4 S6 0 1 600 0.45 200 BK3 2 1 6 4 S1 0 2 1000 0.68 100 BK3 2 1 6 4M1 2 1 120 0.20 150 BK3 2 1 6 4M2 4 1 240 0.35 150 BK3 2 1 6 4M3 0 1 300 0.45 150 BK3 2 1 6 4M4 7 1 470 0.50 150 BK3 2 1 6 4M6 0 1 600 0.60 100 BK3 2 1 6 4M1 0 2 1000 0.80 100 100 BK3 2 1 6 4 L 6 8 0 68 0.35 200 BK3 2 1 6 4 L 1 2 1 120 0.55 200 BK3 2 1 6 4 L 1 8 1 180 0.65 150 BK3 2 1 6 4 L 2 4 1 240 0.75 150 ELECTRICAL CHARACTERISTICS BK2010 BK2010 4W121 BK2010 4S121 BK2010 4W241 500 500 400 300 250 200 5 100 BK2010 4S431 BK2010 4M121 BK2010 4S601 1000 1000 400 800 800 300 600 600 200 400 400 100 200 200 FERRITE PRODUCTS BK2010 4S241 500 500 250 BK2010 4M241 BK2010 4M601 BK2010 4M431 BK2010 4L050 2000 100 1000 50 1 BK2010 4L100 BK2010 4L220 BK2010 4L330 200 500 500 50 100 250 250 10 100 1000 10000 1 10 100 1000 10000 1 10 100 100 1000 10000 1000 10000 BK2010 4L470 100 1 10 1000 10000 1 10 100 257 BK3216 258 ELECTRICAL CHARACTERISTICS ELECTRICAL CHARACTERISTICS 5 FERRITE PRODUCTS 259 PACKAGING 1 Minimum Quantity F Tape & Reel Packaging Type [pcs] Thickness Standard Quantity [mm] f inchg Paper Tape Embossed Tape 4000 E E 2000 10000 E 4000 E 4000 E E 2000 15000 E 10000 E 4000 E E 4000 E 3000 15000 E 10000 E 4000 E 4000 E E 2000 4000 E E 4000 10000 E 4000 E 4000 E 0.85 CK2125f0805g 2 Taping material f0.033g 1.25 f0.049g LK1005f0603g 0.5 f0.020g LK1608f0603g 0.8 f0.031g 0.85 LK2125f0805g f0.033g 1.25 f0.049g HK0603f0201g 0.3 f0.012g HK1005f0402g 0.5 f0.020g HK1608f0603g 0.8 f0.031g 0.85 HK2125f0805g f0.033g 1.0 f0.039g BK0603f0201g 0.3 f0.012g BK1005f0402g 0.5 C L L L B B B B H H H B B B B K K K K K K K K K K K K K P K P K P 2 1 1 2 0 1 1 2 0 1 1 2 1 1 2 1 0 6 1 6 0 6 1 6 0 6 0 0 6 1 2 0 0 2 0 0 0 2 0 0 0 1 0 0 2 5 5 8 5 3 5 8 5 3 5 8 0 5 8 5 f0.020g BK1608f0603g 0.8 f0.031g 0.85 BK2125f0805g f0.033g 1.25 f0.049g BK2010f0804g 0.45 f0.018g BK3216f1206g 0.8 f0.031g BKP1005f0402g 0.5 f0.020g BKP1608f0603g 0.8 f0.031g BKP2125f0805g 0.85 f0.033g 260 C K 2 1 2 5 L K 2 1 2 5 B K 2 1 2 5 B K 3 2 1 6 H K 2 1 2 5 PACKAGING 3 Taping Dimensions Y8mm Paper tape (0.315 inches wide) Type CK2125f0805g LK2125f0805g Chip Thickness Chip cavity max. Insertion Pitch B F K T 1.25 1.5M0.2 2.3M0.2 4.0M0.1 2.0 0.3 f0.049g f0.059M0.008g f0.091M0.008g f0.157M0.004g 1.25 1.5M0.2 2.3M0.2 4.0M0.1 f0.059M0.008g f0.091M0.008g f0.157M0.004g f0.033g 1.5M0.2 2.3M0.2 4.0M0.1 f0.059g BK3216f1206g Type CK2125f0805g LK1005f0402g LK1608f0603g LK2125f0805g HK0603(2010) HK1005f0402g HK1608f0603g BK0603f0201g BK1005f0402g BK1608f0603g BK2125f0805g BK2010f0804g BKP1005f0402g BKP1608f0603g BKP2125f0805g Chip cavity 0.3 1.0 f0.059M0.008g f0.091M0.008g f0.157M0.004g 2.0 f0.012g 1.25 1.5M0.2 2.3M0.2 4.0M0.1 f0.049g f0.059M0.008g f0.091M0.008g A B F T 0.85 1.5M0.2 2.3M0.2 4.0M0.1 1.1max f0.033g f0.059M0.008g f0.091M0.008g f0.157M0.004g f0.043maxg 0.5 0.65M0.1 1.15M0.1 2.0M0.05 f0.020g f0.026M0.004g f0.045M0.004g f0.079M0.002g f0.031maxg 0.8 1.0M0.2 f0.039M0.008g 0.85 1.5M0.2 f0.033g f0.059M0.008g 0.3 f0.012g 1.8M0.2 4.0M0.1 2.3M0.2 4.0M0.1 0.65M0.1 1.15M0.1 f0.026M0.004g f0.045M0.004g f0.079M0.002g 1.0M0.2 f0.039M0.008g 0.3 f0.012g 1.8M0.2 2.0M0.05 4.0M0.1 1.1max 0.65M0.1 1.15M0.1 2.0M0.05 0.8max f0.045M0.004g f0.079M0.002g f0.031maxg 1.8M0.2 4.0M0.1 1.1max 0.85 1.5M0.2 f0.071M0.008g f0.157M0.004g f0.043maxg 4.0M0.1 1.1max 2.3M0.2 f0.033g f0.059M0.008g f0.091M0.008g f0.157M0.004g f0.043maxg 0.45 1.2M0.1 f0.018g f0.047M0.004g 2.17M0.1 4.0M0.1 0.80max f0.085M0.004g f0.157M0.004g f0.031maxg 0.5 0.65M0.1 1.15M0.1 2.0M0.05 0.8max f0.020g f0.026M0.004g f0.045M0.004g f0.079M0.002g f0.031maxg 1.0M0.2 f0.039M0.008g 0.85 1.5M0.2 f0.033g f0.059M0.008g 5 Reel Size f0.028M0.002g f0.079M0.002g f0.020maxg f0.026M0.004g 0.8 4 LEADER AND BLANK PORTION 0.8max 0.5 f0.031g 0.3 f0.031maxg f0.020g 1.0M0.2 1.4 f0.055g f0.012g 0.45max 0.45max f0.039M0.008g 4.0M0.1 f0.157M0.004g 1.1max 0.40M0.06 0.70M0.06 2.0M0.05 0.8 3.5M0.1 f0.138M0.004g 1.1max f0.043maxg f0.031g 1.9M0.1 f0.075M0.004g 0.8max f0.071M0.008g f0.157M0.004g f0.016M0.002g 0.8 f0.031g f0.028M0.002g f0.079M0.002g f0.018maxg 0.5 0.8 0.3 f0.091M0.008g f0.157M0.004g f0.043maxg f0.020g f0.031g 2.0 f0.157M0.004g f0.079g f0.012g 5 f0.071M0.008g f0.157M0.004g f0.043maxg 0.40M0.06 0.70M0.06 2.0M0.05 f0.016M0.002g f0.079g Insertion Pitch Tape Thickness Chip Thickness f0.031g 0.3 FERRITE PRODUCTS BK2125f0805g 2.0 f0.079g f0.012g 1.5 f0.039g Unit : mm (inch) f0.079g f0.012g f0.049g 0.85 HK2125f0805g Tape Thickness A 1.8M0.2 4.0M0.1 1.1max f0.071M0.008g f0.157M0.004g f0.043maxg 2.3M0.2 4.0M0.1 f0.091M0.008g f0.157M0.004g 1.1max f0.043maxg Y8mm Embossed Tape (0.312 inches wide) 6 Top tape strength 0.10.7N The top tape requires a peel-off force of 0.1V0.7N in the direction of the arrow as illustrated below. Unit : mm (inch) 261 1/4 RELIABILITY DATA Multilayer chip inductors and beads Specified Value ARRAY Item BK0603 BK1005 BK1608 BK2125 Test Methods and Remarks BKP1005 BKP1608 BKP2125 CK2125 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 BK2010 BK3216 1.Operating K55VJ125C K55VJ85C K55VJ125C K55VJ85C Te m p e r a t u r e K40V J85C K40VJ85C K55VJ125C K40VJ85C K40V K40VJ85C K55VJ125C K40VJ85C Range 2.Storage Tem- 3.Rated Current 150V 150 V 150 V 200 V 100mA 100V 200mA 1000mA 1500mA 1200mA DC 200mA DC DC DC DC DC 5V 50V 150V 300mA 300mA 1.0A 1.0V 2.0V 60V DC 3.0A 4.0A 500mA 25mA 50mA 300mA 250mA 300mA DC DC DC DC 10V DC 1V DC DC DC DC DC 10V 10V 22V 15V 5V 68V 120E 33V BK0603 Series: 240E 1000E 2500E 2500E 600E 1000E M25L 390E 220E Measuring frequency: 100M1MHz M25L M25L M25L M25L M25L M25L M25L M25L Measuring equipment: HP4291A 33V Measuring jig: 16193A BK1005 Series: BKP1005 Series: Measuring frequency: 100M1MHz FERRITE PRODUCTS 4.Impedance 5 J85C perature Range Measuring equipment: HP4291A BB BB BB BB BB BB BB BB Measuring jig: 16192A, 16193A BK1608, 2125 Series: BKP1608, 2125 Series: Measuring frequency: 100M1MHz Measuring equipment: HP4291A, 4195A Measuring jig: 16092A or 16192A (HW) BK2010, 3216 Series: Measuring frequency: 100M1MHz Measuring equipment: HP4291A,4195A Measuring jig: 16192A 5. Inductance 0.1V 0.12V 0.047V 0.047V 1.0V5.6nH 1.0V5.6nH 1.0V5.6nH 1.5V5.6nH CK Series: 10.0AH 2.2AH 33.0AH 33.0AH D M0.3nH D M0.3nH D M0.3nH DM0.3nH Measuring frequency: 2 to 25 MHz (CK2125) DM20L DM10L DM20L DM20L 6.8V56nH 6.8V120nH 6.8V220nH 6.8V470nH 0.10V 0.10V 12.0AH 12.0AH DM10L DM10L D M5L D M5L D M5L DM5L LK Series: Measuring frequency: 10 to 25 MHz (LK1005) Measuring frequency: 1 to 50 MHz (LK1608) Measuring frequency: 0.4 to 50MHz (LK2125) Measuring equipment, jig: HP4194A + 16085B + 16092A (or its equivalent) HP4195A + 41951 + 16092A (or its equivalent) HP4294 + 16192A HP4291A + 16193A (LK1005) BB Measuring current: 1mA rms (0.047 to 4.7AH) 0.1mA rms (5.6 to 33AH) HK Series: Measuring frequency: 100MHz (HK0603, HK1005) Measuring frequency: 50 / 100MHz (HK1608, 2125) Measuring equipment, jig: HP4291A + 16197A (HK0603) HP4291A + 16193A (HK1005) HP4195A + 16092A + in-house made jig (HK1608, 2125) * Definition of rated current : In the CK and BK Series, the rated current is the value of current at which the temperature of the element is increased within 20C. In the BK Series P type, the rated current is the value of current at which the temperature of the element is increased within 40C. In the LK and HK Series, the rated current is either the DC value at which the internal L value is decreased within 5% with the application of DC bias, or the value of current at which the temperature of the element is increased within 20C. 263 2/4 RELIABILITY DATA Multilayer chip inductors and beads Specified Value ARRAY Item BK0603 BK1005 BK1608 BK2125 Test Methods and Remarks BKP1005 BKP1608 BKP2125 CK2125 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 BK2010 BK3216 6.Q 15V20 10V20 10V35 15V50 min. min. min. 5min. 8min. min. 8V12 10V18 CK Series: min. Measuring frequency: 2 to 25 MHz (CK2125) min. LK Series: Measuring frequency: 10 to 25 MHz (LK1005) 5 Measuring frequency: 1 to 50 MHz (LK1608) Measuring equipment, jig: HP4194A + 16085B + 16092A (or its equivalent) HP4195A + 41951 + 16092A HP4294 + 16192A HP4291A + 16193A (LK1005) BB (or its equivalent) Measuring current: 1mA rms (0.047 to 4.7AH) FERRITE PRODUCTS Measuring frequency: 0.4 to 50MHz (LK2125) 0.1mA rms (5.6 to 33AH) HK Series: Measuring frequency: 100MHz (HK0603, HK1005) Measuring frequency: 50 / 100MHz (HK1608, 2125) Measuring equipment, jig: HP4291A + 16197A(HK0603) HP4291A + 16193A(HK1005) HP4195A + 16092A + in-house made jig 7.DC Resistance 0.40V 0.005V 0.05V 0.05V 0.01V 0.15V 0.140E 0.025V 0.020V 0.16V 0.7V 0.3V 0.80E 0.80E 1.10E 0.75E 0.70E 0.80E max. 0.140E 0.050E 0.65E 1.70E 2.95E 1.25E 3.0E 1.6E 1.5E 1.5E max. max. max. max. max. max. max. max. max. max. max. max. max. max. 0.20V 0.14V 0.08V 0.05V 0.10V max. max. (HK1608, 2125) Measuring equipment: VOAC-7412 (made by Iwasaki Tsushinki) YVOACK7512fmade by Iwasaki Tsushinkig 24V 8.Self Resonance 40V 9V 13V 1300V 600V 400V 200V LK Series: 235MHz 180MHz 260MHz 320MHz 10000MHz 10000MHz 10000MHz 4000MHz Measuring equipment: HP4195A Frequency(SRF) min. min. min. min. min. min. min. min. Measuring jig: 41951 + 16092A (or its equivalent) BB HK Series: Measuring equipment: HP8719C YHP8753DfHK2125g 9.Temperature Characteristic BB 10. Resistance to No mechanical damage. BB Inductance change: HK Series: Within M10% Temperature range: -30 to +85C Reference temperature: +20C Warp: 2mm Flexure of Testing board: glass epoxy-resin substrate Substrate Thickness: 0.8mm 265 3/4 RELIABILITY DATA Multilayer chip inductors and beads Specified Value ARRAY Item BK0603 BK1005 BK1608 BK2125 Test Methods and Remarks BKP1005 BKP1608 BKP2125 CK2125 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 BK2010 BK3216 11.Solderability 12.Resistance to Soldering At least 75% of terminal electrode is covered by new solder. At least 75% of terminal elec- Solder temperature: 230M5C trode is covered by new solder. Duration: 4M1 sec. Appearance: No significant abnormality No mechanical damage. Solder temperature: 260M5C Impedance change: Within M30% Remaining terminal electrode: 70% min. Duration: 10M0.5 sec. Preheating time: 3 min. Flux: Immersion into methanol solution with colophony for 3 to 5 sec. Recovery: 2 to 3 hrs of recovery under the standard condition after the test. (See Note 1) 13.Thermal Shock Appearance: No significant abnormality No No mechanical damage. mechanical Impedance change: Within M30% damage. Conditions for 1 cycle step 1: Minimum operating temperature Inductance change: Within M10% J0/K3C 30M3 min. step 2: Room temperature 2 to 3min. step 3: Minimum operating temperature Inductance Within J0/K3C 30M3 min. step 4: Room temperature 2 to 3min. Number of cycles: 5 M20% Recovery: 2 to 3 hrs of recovery under the stan- change: FERRITE PRODUCTS Preheating temperature: 150C 5 Q change: Within M20% dard condition after the test. (See Note 1) Qchange: Within M30% (Note 1) When there are questions concerning mesurement resultDmeasurement shall be made after 48M2 hrs of recovery under the standard condition. 267 4/4 RELIABILITY DATA Multilayer chip inductors and beads Specified Value ARRAY Item BK0603 BK1005 BK1608 BK2125 Test Methods and Remarks BKP1005 BKP1608 BKP2125 CK2125 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 BK2010 BK3216 14. Damp Heat Appearance: No significant abnormality fSteady stateg Impedance change: Within M30% No No mechanical mechanical mechanical No No mechanical damage. BK Series: damage. damage. damage. Inductance Inductance Inductance Q change: Within M20% change: change: change: standard condition after the removal Within Within Within fro test chamber.fSee Note1g M20% M10% M20% Qchange: Qchange: Qchange: Within Within Within M 30% M30% M 30% Temperature: 40M2C Inductance change: WithinM 10% Humidity: 90 to 95%RH Duration: 500 +24 K0 hrs Recovery: 2 to 3 hrs of recovery under the Temperature: 40M2C (LK Series) 60M2C (HK Series) Humidity: 90 to 95%RH Duration: 500M12 hours Recovery: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. 15.Loading under Damp Heat No mechanical damage, Inductance changeD No withinM30L mechanical mechanical mechanical mechanical damage. No damage. No damage. No damage. No mechanical damage. BK Series: Temperature: 40M2C (LK Series) Inductance change: WithinM 10% Humidity: 90 to 95%RH +24 Duration: 500 K0 hrs Inductance Inductance Inductance change: FERRITE PRODUCTS LK, HK Series: 5 Inductance Q change: Within M20% Applied current: Rated current Recovery: 2 to 3 hrs of recovery under the change: change: 0.047 to change: Within Within 12.0AH: Within standard condition after the removal M20% M10% Within M20% from test chamber. fSee Note1g M10% Q change: Q change: 15.0 to Q change: LK, HK Series: Within Within 33.0AH: Within Temperature: 40M2C (LK Series) M30% M30% Within M30% 60M2C (HK Series) M15% Humidity: 90 to 95%RH Q change: Duration: 500M12 hrs Within Applied current: Rated current M 30% Recovery: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. 16.Loading at Appearance: No significant abnormality No No No No mechanical damage. BK Series: mechanical mechanical mechanical mechanical High Temperature No Impedance change: Within M30% damage. damage. damage. damage. Temperature: 125M3C Inductance change: WithinM 10% Applied current: Rated current Duration: 500 +24 K0 hrs Inductance Inductance Inductance change: Inductance Q change: Within M20% Recovery: 2 to 3 hrs of recovery under the change: change: 0.047 to change: standard condition after the removal Within Within 12.0AH: Within from test chamber. fSee Note1g M20% M10% Within M20% M10% Q change: Q change: 15.0 to Q change: LK, HK Series: Within Within 33.0AH: Within Temperature: 85M2C (LK Series) M30% M30% Within M30% : 85M2C (HK 1608, 2125) : 85M2C (HK 1005 operating M15% Q change: temperature range K55 to J85C) Within : 125M2C (HK 0603, HK1005 operating temperature range M30% K55 to J125C) Applied current: Rated current Duration: 500M12 hrs Recovery: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. Note on standard condition: "standard condition" referred to herein is defined as follows: (Note 1) 5 to 35C of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure. measurement shall be made after 48M2 hrs of re- When there are questions concerning measurement results: covery under the standard condition. In order to provide correlation data, the test shall be conducted under condition of 20M2C of temperature, 65 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." 269 1/7 PRECAUTIONS Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads Stages 1. Circuit Design Precautions Technical considerations SVerification of operating environment, electrical rating and performance 1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications. As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from components used in general purpose applications. 5 FERRITE PRODUCTS SOperating Current (Verification of Rated current) 1. The operating current for inductors must always be lower than their rated values. 2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect. 2. PCB Design SPattern configurations (Design of Land-patterns) 1. When inductors are mounted on a PCB, the amount of solder used (size of fillet) can directly affect inductor performance. Therefore, the following items must be carefully considered in the design of solder land patterns: also shown. (1) Recommended land dimensions for a typical chip inductor land patterns for PCBs Recommended land dimensions for wave-soldering (unit: mm) Type 1608 2125 L 1.6 2.0 W 0.8 1.25 A 0.8V1.0 1.0V1.4 B 0.5V0.8 0.8V1.5 C 0.6V0.8 0.9V1.2 Size (1) The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. (2) When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated by solder-resist. 1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts (larger fillets which extend above the component end terminations). Examples of improper pattern designs are Recommended land dimensions for reflow-soldering (unit: mm) Type Size 0603 1005 1608 L 0.6 1.0 1.6 2125 2.0 W 0.3 0.5 0.8 1.25 A 0.20V0.30 0.45V0.55 0.6V0.8 0.8V1.2 B 0.20V0.30 0.40V0.50 0.6V0.8 0.8V1.2 C 0.25V0.40 0.45V0.55 0.6V0.8 0.9V1.6 Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns. Recommended land dimension for wave-soldering (unit: mm) 2010 3.2 2.0 W 1.6 1.0 0.7V0.9 0.5V0.6 b 0.8V1.0 0.5V0.6 c 0.4V0.5 0.2V0.3 d 0.8 0.5 Size 3216 L a 271 2/7 PRECAUTIONS Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads Stages Precautions Technical considerations (2) Examples of good and bad solder application 2.PCB Design Not recommended Recommended Mixed mounting of SMD and leaded components Component placement close to the chassis 5 Horizontal component placement 1-1. The following are examples of good and bad inductor layout; SMD inductors SPattern configurations (Inductor layout on panelized [breakaway] PC boards) 1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processes (PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.) For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to minimize stress. FERRITE PRODUCTS Hand-soldering of leaded components near mounted components should be located to minimize any possible mechanical stresses from board warp or deflection. Item Not recommended Recommended Deflection of the board 1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on inductor layout. An example below should be counted for better design. 1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure. 273 3/7 PRECAUTIONS Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads Stages 3.Considerations for automatic placement Precautions Technical considerations SAdjustment of mounting machine 1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards. 2. The maintenance and inspection of the mounter should be conducted periodically. 1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the following points should be considered before lowering the pick-up nozzle: (1)The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the board. (2)The pick-up pressure should be adjusted between 1 and 3 N static loads. (3)To reduce the amount of deflection of the board caused by impact of the pickup nozzle, supporting pins or back-up pins should be used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement: Proper method Single-sided mounting Double-sided mounting FERRITE PRODUCTS Improper method 5 2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical impact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the pin should be conducted periodically. SSelection of Adhesives 1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use. 1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of the inductors may result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect component placement, so the following precautions should be noted in the application of adhesives. (1)Required adhesive characteristics a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive should have sufficient strength at high temperatures. c. The adhesive should have good coating and thickness consistency. d. The adhesive should be used during its prescribed shelf life. e. The adhesive should harden rapidly f. The adhesive must not be contaminated. g. The adhesive should have excellent insulation characteristics. h. The adhesive should not be toxic and have no emission of toxic gasses. 275 4/7 PRECAUTIONS Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads Stages Precaution 3.Considerations for automatic placement Technical considerations When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect component placement. Too little adhesive may cause the inductors to fall off the board during the solder process. Too much adhesive may cause defective soldering due excessive flow of adhesive on to the land or solder pad. [Recommended conditions] SSelection of Flux 1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use; (1)Flux used should be with less than or equal to 0.1 wt% (Chlorine conversion method) of halogenated content. Flux having a strong acidity content should not be applied. (2)When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level. (3)When using water-soluble flux, special care should be taken to properly clean the boards. SSoldering Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions. 0805 case sizes as examples a 0.3mm min b 100 V120 Am c Area with no adhesive 5 FERRITE PRODUCTS 4.Soldering Figure 1-1. When too much halogenated substance (Chlorine, etc.) content is used to activate the flux, or highly acidic flux is used, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the Inductor. 1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines used should also be considered carefully when selecting watersoluble flux. 1-1. Preheating when soldering Heating: Chip inductor components should be preheated to within 100 to 130C of the soldering. Cooling: The temperature difference between the components and cleaning process should not be greater than 100 C. Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock. 277 5/7 PRECAUTIONS Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads Stages 4.Soldering Precautions SAnd please contact us about peak temperature when you use lead-free paste. Technical considerations Recommended conditions for soldering [Reflow soldering] Temperature profile 5 1. The ideal condition is to have solder mass (fillet) controlled to 1/2 to 1/3 of the thickness of the inductor, as shown below: FERRITE PRODUCTS Caution 2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible. [Wave soldering] Temperature profile Caution 1. Make sure the inductors are preheated sufficiently. 2. The temperature difference between the inductor and melted solder should not be greater than 100 to 130C 3. Cooling after soldering should be as gradual as possible. 4. Wave soldering must not be applied to the inductors designated as for reflow soldering only. [Hand soldering] Temperature profile Caution 1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm. 2. The soldering iron should not directly touch the inductor. 5.Cleaning SCleaning conditions 1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution ac- 1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation of the inductor's electrical properties (especially insulation resistance). cording to the type of flux used and purpose of the cleaning (e.g. to remove soldering flux or other materials from the production process.) 279 6/7 PRECAUTIONS Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads Stages 5.Cleaning Precautions 2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's characteristics. Technical considerations 2. Inappropriate cleaning conditions (insufficient or excessive cleaning) may detrimentally affect the performance of the inductors. (1)Excessive cleaning In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the inductor or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked; 6. Post cleaning processes SApplication of resin coatings, moldings, etc. to the PCB and components. 1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the inductor's performance. 5 FERRITE PRODUCTS Ultrasonic output Below 20 w/b Ultrasonic frequency Below 40 kHz Ultrasonic washing period 5 min. or less 2. When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat may lead to inductor damage or destruction. 3. Stress caused by a resin's temperature generated expansion and contraction may damage inductors. The use of such resins, molding materials etc. is not recommended. 7. Handling SBreakaway PC boards (splitting along perforations) 1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection or twisting to the board. 2. Board separation should not be done manually, but by using the appropriate devices. SGeneral handling precautions 1. Always wear static control bands to protect against ESD. 2. Keep the inductors away from all magnets and magnetic objects. 3. Use non-magnetic tweezers when handling inductors. 4. Any devices used with the inductors (soldering irons, measuring instruments) should be properly grounded. 5. Keep bare hands and metal products (i.e., metal desk) away from chip electrodes or conductive areas that lead to chip electrodes. 6. Keep inductors away from items that generate magnetic fields such as speakers or coils. SMechanical considerations 1. Be careful not to subject the inductors to excessive mechanical shocks. (1) If inductors are dropped on the floor or a hard surface they should not be used. (2)When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components. 281 7/7 PRECAUTIONS Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads Stages 8. Storage conditions Precautions Technical considerations SStorage 1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. 1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If exceeding the above period, please check solderability before using the inductors Recommended conditions Ambient temperature Humidity Below 40 C Below 70% RH *The packaging material should be kept where no chlorine or sulfur exists in the air. FERRITE PRODUCTS The ambient temperature must be kept below 30 C. Even under ideal storage conditions inductor electrode solderability decreases as time passes, so inductors should be used within 6 months from the time of delivery. 5 283 RECTANGULAR FERRITE CHIP BEADS (HIGH CURRENT) FB SERIES M TYPE OPERATING TEMP. K40VJ85C FEATURES Yf6Ag Y Y FBMJ HS HM HL GHz FBMH Power supply units: Large withstand voltage (allowable current: up to 6 A) Resistance to high energy High reliability There are several variations of the FBMJ type HS: For broadband applications HM: For upper MHz range applications HL: For GHz range applications The FBMH type are optimal for circuit designs which require high impedances and large currents to combat radiated noise on power lines, etc. APPLICATIONS YY Y Y YOA YUSB Y YDeals with power line radiated and conducted noise. YProvides waveform correction of digital signals and high frequency noise countermeasures in various types of digital equipment. YAutomotive YComputer Peripherals YDifferential transmission line on USB and similar products YMobile devices which require lower power consumption ORDERING CODE 1 3 4 5 7 fLPWghmmi FB J H 1608(0603) 2125(0805) 2012(0805) 2016(0806) 3216(1206) 3225(1210) 4516(1806) 4525(1810) 4532(1812) 2 1.6P0.8 2.0P1.25 2.0P1.25 2.0P1.6 3.2P1.6 3.2P2.5 4.5P1.6 4.5P2.5 4.5P3.2 M HS HM HL M 25L M 30L E N 8 6 hEi 330 111 132 33 110 1300 T 9 QW Q F B M J 3 2 1 6 H S 8 0 0 _ T Z 1 2 4 5 6 7 8 9 1 3 4 5 7 Type Product characteristics External DimensionsfLPWg hmmi Material code Impedance Tolerance FB Ferrite bead 2 Shape M 284 3 Rectangular chip J H Standard type High Impedance type 1608(0603) 2125(0805) 2012(0805) 2016(0806) 3216(1206) 3225(1210) 4516(1806) 4525(1810) 4532(1812) 1.6P0.8 2.0P1.25 2.0P1.25 2.0P1.6 3.2P1.6 3.2P2.5 4.5P1.6 4.5P2.5 4.5P3.2 HS HM HL M 25L M 30L E N Refer to impedance curves for material difference 8 Packaging T Tape&Reel 6 Nominal ImpedancehEi example 330 111 132 33 110 1300 9 Internal code Q Standard product QWBlank space EXTERNAL DIMENSIONS Type FBMJ1608(0603) FBMJ2125(0805) FBMJ3216(1206) FBMJ4516(1806) FBMH1608(0603) FBMH2012(0805) FBMH2016(0806) FBMH3216(1206) FBMH4516(1806) FBMH4525(1810) FBMH4532(1812) W 0.8M0.2 f0.031M0.008g 1.25M0.2 f0.049M0.008g 1.6M0.2 f0.063M0.008g 1.6M0.2 f0.063M0.008g 0.8M0.1 f0.031M0.004g 1.25M0.2 f0.049M0.008g 1.6M0.2 f0.063M0.008g 1.6M0.2 f0.063M0.008g 2.5M0.3 f0.098M0.012g 1.6M0.2 f0.063M0.008g 2.5M0.3 f0.098M0.012g 3.2M0.3 f0.126M0.012g T 0.8M0.2 f0.031M0.008g 0.85M0.2 f0.033M0.008g 1.1M0.2 f0.043M0.008g 1.1M0.2 f0.043M0.008g 0.8M0.1 f0.031M0.004g 0.85M0.2 f0.033M0.008g 1.6M0.2 f0.063M0.008g 1.6M0.2 f0.063M0.008g 2.5M0.3 f0.098M0.012g 1.6M0.2 f0.063M0.008g 2.5M0.3 f0.098M0.012g 3.2M0.3 f0.126M0.012g e 0.3M0.2 f0.012M0.008g 0.5M0.3 f0.020M0.012g 0.5M0.3 f0.020M0.012g 0.5M0.3 f0.020M0.012g 0.3M0.15 f0.012M0.006g 0.5M0.3 f0.020M0.012g 0.5M0.3 f0.020M0.012g 0.5M0.3 f0.020M0.012g 0.5M0.3 f0.020M0.012g 0.5M0.3 f0.020M0.012g 0.9M0.6 f0.035M0.024g 0.9M0.6 f0.035M0.024g UnitDmmfinchg AVAILABLE MATERIALS (High impedance Type) (Standard Type) FBMJ1608 HS-type 5 FERRITE PRODUCTS FBMH3225(1210) L 1.6M0.2 f0.063M0.008g 2.0M0.2 f0.079M0.008g 3.2M0.3 f0.126M0.012g 4.5M0.3 f0.177M0.012g 1.6M0.1 f0.063M0.004g 2.0M0.2 f0.079M0.008g 2.0M0.2 f0.079M0.008g 3.2M0.3 f0.126M0.012g 3.2M0.3 f0.126M0.012g 4.5M0.3 f0.177M0.012g 4.5M0.4 f0.177M0.016g 4.5M0.4 f0.177M0.016g FBMH1608 HM-type HM-type HL-type I max=4A I max=4A I max=0.33.5A I max=0.32.5A HS-type HM-type HL-type I max=46A I max=46A I max=2A FBMH20ZZ FBMJ2125 I max=1.82.7A FBMH32ZZ FBMJ3216 HS-type HM-type I max=46A I max=46A I max=13A FBMH45ZZ FBMJ4516 HS-type HM-type I max=46A I max=46A Selection Guide P.10 Part Numbers P.286 I max=1.54A Electrical Characteristics P.288 Packaging P.292 Reliability Data P.294 Precautions P.296 etc 285 PART NUMBERS fStandard Typeg FBMJ1608 ---------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Impedance Ordering code hEi FB MJ 1 6 0 8 HS 2 8 0 NT FB MJ 1 6 0 8HM 2 3 0 NT 28M30% 23M30% Measuring frequency hMHzi 100 DC Resistance Rated current hEimax. hAimax. 0.007 4.0 Thickness hmmi (inch) 0.8M0.2 (0.031M0.008) FBMJ2125 ---------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Ordering code FB FB FB FB FB MJ 2 1 2 5 HS 4 2 0 K T MJ 2 1 2 5 HS 2 5 0 NT MJ 2 1 2 5 HM3 3 0 K T MJ 2 1 2 5 HM2 1 0 NT MJ 2 1 2 5 HL 8 R0 NT Impedance hEi 42M25% 25M30% 33M25% 21M30% 8M30% Measuring frequency hMHzi 100 DC Resistance Rated current hEimax. hAimax. 0.008 0.004 0.008 0.004 0.010 4.0 6.0 4.0 6.0 2.0 Thickness hmmi (inch) 0.85M0.2 (0.033M0.008) FBMJ3216 ---------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Ordering code FB FB FB FB MJ 3 2 1 6 HS 8 0 0 K T MJ 3 2 1 6 HS 4 8 0 NT MJ 3 2 1 6 HM6 0 0 K T MJ 3 2 1 6 HM3 8 0 NT Impedance hEi 80M25% 48M30% 60M25% 38M30% Measuring frequency hMHzi 100 DC Resistance Rated current hEimax. hAimax. 0.010 0.005 0.010 0.005 4.0 6.0 4.0 6.0 Thickness hmmi (inch) 1.1M0.2 (0.043M0.008) FBMJ4516 ---------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Ordering code FB FB FB FB 286 MJ 4 5 1 6 HS 1 1 1 K T MJ 4 5 1 6 HS 7 2 0 NT MJ 4 5 1 6 HM9 0 0 K T MJ 4 5 1 6 HM5 6 0 NT Impedance hEi 110M25% 72M30% 90M25% 56M30% Measuring frequency hMHzi 100 DC Resistance Rated current hEimax. hAimax. 0.014 0.007 0.014 0.007 4.0 6.0 4.0 6.0 Thickness hmmi (inch) 1.1M0.2 (0.043M0.008) PART NUMBERS fHigh impedance Typeg Ordering code MH1 6 0 8 HM4 7 0 K T MH1 6 0 8 HM6 0 0 K T MH1 6 0 8 HM1 0 1 K T MH1 6 0 8 HM1 5 1 K T MH1 6 0 8 HM2 2 1 K T MH1 6 0 8 HM3 3 1 K T MH1 6 0 8 HM4 7 1 K T MH1 6 0 8 HM6 0 1 K T MH1 6 0 8 HM1 0 2 K T MH1 6 0 8 HL 3 0 0 K T MH1 6 0 8 HL 6 0 0 K T MH1 6 0 8 HL 1 2 1 K T MH1 6 0 8 HL 2 2 1 K T MH1 6 0 8 HL 3 3 1 K T MH1 6 0 8 HL 4 7 1 K T MH1 6 0 8 HL 6 0 1 K T MH2 0 1 2 HM8 0 0 K T MH2 0 1 2 HM1 2 1 K T MH2 0 1 2 HM2 2 1 K T MH2 0 1 2 HM3 3 1 K T MH2 0 1 6 HM2 5 1 NT MH3 2 1 6 HM5 0 1 NT MH4 5 1 6 HM8 5 1 NT MH3 2 2 5 HM6 0 1 NT MH3 2 2 5 HM1 0 2 NT MH3 2 2 5 HM2 0 2 NT MH4 5 2 5 HM1 0 2 NT MH4 5 2 5 HM1 6 2 NT MH4 5 3 2 HM6 8 1 K T MH4 5 3 2 HM1 3 2 K T MH4 5 3 2 HM2 0 2 NT hEi 47M25% 60M25% 100M25% 150M25% 220M25% 330M25% 470M25% 600M25% 1000M25% 30M25% 60M25% 120M25% 220M25% 330M25% 470M25% 600M25% 80M25% 120M25% 220M25% 330M25% 250M30% 500M30% 850M30% 600M30% 1000M30% 2000M30% 1000M30% 1600M30% 680M25% 1300M25% 2000M30% Measuring frequency hMHzi 100 DC Resistance Rated current hEimax. hAimax. 0.020 0.025 0.035 0.050 0.070 0.130 0.150 0.170 0.350 0.028 0.045 0.130 0.170 0.210 0.350 0.450 0.025 0.032 0.060 0.080 0.050 0.070 0.100 0.042 0.100 0.140 0.060 0.130 0.028 0.060 0.130 3.5 3.0 2.0 2.0 1.5 0.9 0.7 0.7 0.3 2.5 1.8 0.9 0.7 0.6 0.5 0.4 2.7 2.5 2.0 1.8 2.0 2.0 1.5 3.0 2.0 1.0 3.0 2.0 4.0 3.0 1.5 Thickness hmmi (inch) 5 0.8M0.1 (0.031M0.004) FERRITE PRODUCTS FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB Impedance 0.85M0.2 (0.033M0.008) 1.6M0.2 (0.063M0.008) 2.5M0.3 (0.098M0.012) 3.2M0.3 (0.126M0.012) 287 ELECTRICAL CHARACTERISTICS fStandard Typeg FBMJ1608 ----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- FBMJ2125 ----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- FBMJ3216 ----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- 288 ELECTRICAL CHARACTERISTICS fStandard Typeg FBMJ3216 ----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- 5 FERRITE PRODUCTS FBMJ4516 ----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- 289 ELECTRICAL CHARACTERISTICS fHigh impedance Typeg FBMH1608HM470-T FBMH1608HM600-T FBMH1608HM101-T 200 200 200 180 180 180 160 160 160 140 140 140 120 120 120 100 100 100 80 80 Z 60 60 R 40 0 1 10 100 1000 0 1 10 100 1000 10000 500 400 Z 300 Z 10000 FBMH1608HM102-T 1400 1200 1200 1000 1000 100 1000 10000 Z 800 Z R 600 400 1000 10000 0 1 X 10 100 1000 200 10000 0 1 FBMH1608HL600-T X 10 100 1000 10000 FBMH1608HL121-T 300 300 600 250 250 500 200 200 R 150 150 X 100 1400 100 R FBMH1608HL300-T 1600 1200 10 10 FBMH1608HM601-T 1600 1400 200 0 1 X 0 1 1600 400 100 1000 10000 800 R X 100 1000 200 100 10 100 FBMH1608HM471-T X 0 1 10 600 R 200 0 1 FBMH1608HM331-T 400 100 X 20 600 500 Z 200 R X FBMH1608HM221-T 600 300 300 R 40 20 10000 400 Z 60 R 40 X 20 500 80 Z FBMH1608HM151-T 600 Z Z 400 R 1000 Z 800 R 300 600 Z X 200 X 50 200 0 1 100 R 400 50 100 X 10 100 1000 10000 0 1 FBMH1608HL221-T 10 100 1000 10000 0 1 FBMH1608HL331-T 1000 10 100 1000 10000 0 1 FBMH1608HL471-T 1400 100 1000 10000 FBMH1608HL601 2500 2000 900 10 1800 1200 800 1600 1000 700 600 800 Z R 290 1000 10000 500 X 200 0 100 X 400 X 200 10 R 1000 600 X 100 0 1 800 400 200 Z 1500 R 1000 600 300 Z 1200 Z 500 400 2000 1400 R 1 10 100 1000 10000 0 0 1 10 100 1000 10000 1 10 100 1000 10000 ELECTRICAL CHARACTERISTICS FBMH2012HM800-T FBMH2012HM121-T FBMH2012HM221-T 400 400 400 350 350 350 300 300 300 250 250 250 200 200 200 150 150 Z 100 0 1 10 100 1000 10000 0 1 FBMH2016HM251NT 100 1000 10000 0 1 600 600 10 100 1000 10000 FBMH4516HM851NT Z 100 1000 10000 5 1200 1000 R 800 R 400 10 FBMH3225HM601NT 1200 1000 400 0 1 800 Z 600 600 R Z 400 X R 200 0 1 10 100 1000 0 1 FBMH3225HM102NT 10 100 1000 2000 800 1500 R Z R Z 1000 1600 1400 1400 1000 1000 10 100 1000 0 1 10 100 1800 1600 1600 1400 1400 1000 1000 1200 1200 800 800 Z 400 X 200 1 10 100 1000 0 1 10 100 1000 FBM4532HM202 2000 1500 Z R R 1000 600 R 200 400 100 500 X 200 X 10 0 R 2500 Z 600 400 200 1000 1000 600 FBM4532HM132-T FBMH4532HM681-T 1800 Z 800 R X X 100 1200 Z 400 500 X X 10 FBMH4525HM162NT 1800 1600 600 200 0 1 1800 800 400 1 100 1200 1000 0 10 200 FBMH4525HM102NT 2500 1000 0 1 0 1 FBMH3225HM202 1200 600 X 200 X Z 400 200 FERRITE PRODUCTS 800 X 200 X 50 FBMH3216HM501NT 800 400 100 X 10 Z R 150 R 50 X 600 Z R Z 100 R 50 FBMH2012HM331-T 800 1000 0 X 0 1 10 100 1000 1 10 100 1000 291 PACKAGING 1 Minimum Quantity 3 Standard Quantity [pcs] Type Taping Dimensions 8mm Paper tapef0.315 inches wideg Paper Tape Embossed Tape 1608(0603) 4000 EE 2125(0805) 4000 EE 2012(0805) 4000 EE 2016(0806) EE 2000 3216(1206) EE 2000 4516(1806) EE 2000 3225(1210) EE 1000 4525(1810) EE 1000 4532(1812) EE 2000 Type 2 Tape Material FBMJ1608 FBMH1608 Chip Cavity A Insertion Pitch Tape Thickness B F 1.0M0.2 1.8M0.2 4.0M0.2 f0.039M0.008g f0.071M0.008g f0.157M0.008g T 1.1max f0.043maxg f0603g FBMJ2125 FBMH2012 f0805g 1.5M0.2 2.3M0.2 4.0M0.2 f0.059M0.008g f0.091M0.008g f0.157M0.008g 1.1max f0.043maxg UnitDmmfinchg 8mm Embossed tapef0.315 inches wideg Type FBMH2016 f0806g FBMJ3216 f1206g FBMH3216 f1206g FBMH3225 f1210g Chip Cavity Insertion Pitch Tape Thickness A B F 1.8M0.2 2.2M0.2 4.0M0.2 K T 2.6max 0.6max f0.071M0.008g f0.087M0.008g f0.157M0.008g f0.102maxg f0.024maxg 1.9M0.2 3.5M0.2 4.0M0.2 1.5max 0.3max f0.075M0.008g f0.138M0.008g f0.157M0.008g f0.059maxg f0.012maxg 1.9M0.2 3.5M0.2 4.0M0.2 2.6max 0.6max f0.075M0.008g f0.138M0.008g f0.157M0.008g f0.102maxg f0.024maxg 2.8M0.2 3.5M0.2 4.0M0.2 4.0max 0.6max f0.110M0.008g f0.138M0.008g f0.157M0.008g f0.157maxg f0.024maxg UnitDmmfinchg 292 PACKAGING 12mm Embossed tapef0.472 inches wideg 5 Reel size 5 Type FBMJ4516 f1806g FBMH4516 f1806g FBMH4525 f1810g FBMH4532 f1812g Chip cavity Insertion pitch Tape Thickness A B F 1.9M0.2 4.9M0.2 4.0M0.2 K T 1.5max 0.3max f0.075M0.008g f0.193M0.008g f0.157M0.008g f0.059maxg f0.012maxg 1.9M0.2 4.9M0.2 4.0M0.2 2.6max 0.6max f0.075M0.008g f0.193M0.008g f0.157M0.008g f0.102maxg f0.024maxg 2.9M0.2 4.9M0.2 4.0M0.2 4.0max 0.6max f0.114M0.008g f0.193M0.008g f0.157M0.008g f0.157maxg f0.024maxg 3.6M0.2 4.9M0.2 8.0M0.2 4.0max 0.6max f0.142M0.008g f0.193M0.008g f0.315M0.008g f0.157maxg f0.024maxg UnitDmmfinchg BAhmmi BBhmmi Whmmi Type finchg finchg finchg FBMJ1608 FERRITE PRODUCTS 9.0M0.3 FBMJ2125 f0.354M0.012g FBMJ3216 FBMJ4516 FBMH1608 FBMH2012 FBMH2016 13M0.3f0.512M0.012g 180 J0 K3 60 f7.09 J0 K0.118 g J1 K0 f2.36 J0.039 g K0 9.0M0.3 f0.354M0.012g FBMH3216 FBMH3225 FBMH4516 13M0.3 FBMH4525 f0.512M0.012g FBMH4532 330M2.0f12.99M0.080g 100M1.0f3.94M0.039g 14M2.0f0.551M0.080g EIAJ ETX-7001 All FBM series items conform to EIAJ ETX-7001 reel width of 9.0mm +/0.3mm except the 4516 type which has a 13.0mm +/-0.3mm reel width. 4 Leader and Blank portion 6 Top tape strength 0.10.7N The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illutrated below. 293 1/1 RELIABILITY DATA RECTANGULAR FERRITE CHIP BEADSfHIGH CURRENTgFB series M type Item Specified Value Test Methods and Remarks 1.Operating Temperature Range K40 ~ J85C 2.Storage Temperature Range K40 ~ J85C *Note: K5 to J40C in taped packaging 3.Impedance Within the specified tolerance Measuring equipment: Impedance analyzer (HP4291A) or its equivalent 4. DC Resistance Within the specified range 5.Rated Current Within the specified range 6.Vibration Appearance: No significant abnormality According to JIS C 0040. Impedance change: Within M30% of the initial value Vibration type: A Measuring frequency: 100M1 MHZ Four-terminal method Measuring equipment: Milliohm High-Tester 3226(Hioki Denki) or its equivalent 5 Total: 6 hrs Frequency range: 10 to 55 to 10Hz(/min.) Amplitude: 1.5 mm(shall not exceed acceleration 196m/s2 ) Mounting method: Soldering onto PC board 7. Solderability 75% or more of immersed surface of terminal electrode shall be covered with Solder temperature: 230M5C fresh solder. Duration: 4M1 sec. Preconditioning: Immersion into flux. Immersion and Removal speed: 25mm/sec. 8.Resistance to Solder Heat Appearance: No significant abnormality Preheating: 150C for 3 min. Impedance change: Within M30% of the initial value Solder temperature: 260M5C FERRITE PRODUCTS Directions: 2 hrs each in X,Y, and Z directions Duration: 10M0.5sec Preconditioning: Immersion into flux. Immersion and Removal speed: 25 mm/sec. Recovery: 2 to 3 hrs of recovery under the standard condition after the test. 9.Thermal Shock Appearance: No significant abnormality J50 Impedance change: Within K10 % of the initial value According to JIS C 0025. Conditions for 1 cycle Step Temperature(C) 1 K40M3C Duration(min.) 30M3 2 Room Temperature Within 3 3 K85M2C 30M3 4 Room Temperature Within 3 Number of cycles: 100 Mounting method: Soldering onto PC board Recovery: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. 10.Humidity (steady state) Appearances: No significant abnormality Temperature: 40M2C Impedance change: Within M30% of the initial value Humidity: 90 to 95%RH J24 Duration: 500 K 0 hrs Mounting method: Soldering onto PC board Recovery: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. 11.Loading under Damp Heat Appearance : No significant abnormality Temperature : 40M2C Impedance change : Within M30% of the initial value Humidity : 90 to 95%RH Applied current : Rated current J24 Duration : 500 K 0 hrs Mounting method : Soldering onto PC board Recovery : 2 to 3hrs of recovery under the standard condition after the removal from test chamber. 12.High Temperature Loading Test Appearance: No significant abnormality Temperature: 85M2C Impedance change: Within M30% of the initial value Duration: 500 K 0 hrs J24 Applied current: Rated current Mounting method: Soldering onto PC board Recovery: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. 13.Resistance to Flexure of No mechanical damage. Substrate Warp: 2mm Testing board: Glass epoxy-resin substrate Thickness: 0.8mm 14.Adhesion of Electrode No separation or indication of separation of electrode. Applied force: 5N Duration: 10 sec. Note on standard condition: "standard condition" referred to herein is defined as follows 5 to 35C of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20M2C of temperature, 60 to 70% relative humidity and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." 295 PRECAUTIONS FBM Type Stages 1.Circuit Design Precautions Technical considerations Operating environment, 1.The products described in this specification are intended for use in general equipment, electronic equipment,(office telecommunications systems, supply measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear control 5 systems and medical equipment including life-support systems,) where product failure might result in loss of life, FERRITE PRODUCTS injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance. Rated current 1.Rated current of this product is shown in this catalogue, but please be sure to have the base board designed with adequate inspection in case of the generation of heat becomes high within the rated current range when the base board is in high resistance or in bad heating conditions. 2.PCB Design Land pattern design 1.Please contact any of our offices for a land pattern, and refer to a recommended land pattern of specifications. 3.Considerations for Adjustment of mounting machine automatic placement 1.Excessive impact load should not be imposed on the products when mounting onto the PC boards. 1.When installing products, care should be taken not to apply distortion stress as it may deform the products. 2.Mounting and soldering conditions should be checked beforehand. 4.Soldering Wave soldering 1.Please refer to the specifications in the catalog for a wave soldering. 1.If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of the products. Reflow soldering 1.Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified. Lead free soldering 1.When using products with lead free soldering, we request to use them after confirming of adhesion, temperature of resistance to soldering heat, etc. sufficiently. Preheating when soldering 1.There is a case that products get damaged by a heat shock. Heating:The temperature difference between soldering and remaining heat should not be greater than 150. Cooling:The temperature difference between the components and cleaning process should not be greater than 100. Recommended conditions for using a soldering iron Put the soldering iron on the land-pattern. Soldering iron's temperature - Below 350 1.If products are used beyond the range of the recommended conditions, heat stresses may deformthe products, and consequently degrade the reliability of the products Duration - 3 seconds or less The soldering iron should not directly touch the inductor. 5.Handling Handling 1.Keep the inductors away from all magnets and magnetic 1.There is a case that a characteristic varies with magnetic influence. objects. Setting PC boards 1.When setting a chip mounted base board, please make sure 1.There is a case that a characteristic varies with residual stress. that there is no residual stress to the chip by distortion in the board or at screw part. Breakaway PC boards (splitting along perforations) 1.When splitting the PC board after mounting inductors, care should be taken not to give any stresses of deflection or 1.Planning pattern configurations and the position of products should be carefully performed to minimize stress. twisting to the board. 2.Board separation should not be done manually, but by using the appropriate devices. Mechanical considerations 1.Please do not give the inductors any excessive mechanical 1.There is a case to be damaged by a mechanical shock. shocks. 6.Storage conditions Storage 1.To maintain the solderability of terminal electrodes and to 1. Under a high temperature and humidity environment, problems such as reduced keep the packing material in good condition, temperature solderability caused by oxidation of terminal electrodes and deterioration and humidity in the storage area should be controlled.. of taping/packaging materials may take place. Recommended conditions Ambient temperature Humidity 040 Below 70% RH The ambient temperature must be kept below 30. Even under ideal storage conditions, solderability of products electrodes may decrease as time passes. For this reason, inductors should be used within 6 months from the time of delivery. 297 LEADED FERRITE BEADS INDUCTORS OPERATING TEMP. K25VJ85C FEATURES YUse of high loss ferrite material. YEasy mounting on PC boards. YAvailable in a wide range of values and configurations to suit most applications. Y Y Y APPLICATIONS YWaveform correction of digital signals from digital equipment and absorption of high-frequency noise from data lines. Y ORDERING CODE 1 3 5 6 fD g[mm] hEi hmmi FB 03 04 05 06 07 2 A R 850 121 B2.5 B3.5 5.0 6.0 7.5 03 4 AB BB KD KE KF NA 85 120 7 HA VA 52.0 10.0 12.5 15.0 2.5fFBRg SA SB UB US VB VS 2.5 5.0 5.0 5.0 5.0 5.0 fFBAg 26.0 NB 5.0 K00 F B A 0 4 H A 4 5 0 B B ZZ Z 1 2 3 4 5 1 3 5 6 Type Core Dimensions[mm] Nominal Impedance Lead configuration hmmi example 850 121 AB BB KD KE KF NA FB Ferrite Beads 03 04 05 06 07 2 B2.5 B3.5 5.0 6.0 7.5 85 120 Excluding 03Type Configuration A R Axial lead Radial lead 7 Material code Internal code Refer to impedance curves for material difference straight lead (26mm lead space) / ammo straight lead (52mm lead space) / ammo Formed lead (10mm pitch) / bulk Formed lead (12.5mm pitch) / bulk Formed lead / bulk (15.0mm pitch) / bulk straight lead (2.5mm pitch)/bulk (FBR) straight lead / bulk (FBA) 4 HA VA 326 6 NB Formed lead (crimped) / bulk K00 Standard Products 7 SA SB UB US VB VS Straight lead (FBR05 type) / ammo Straight lead (FBR07 type) / ammo Radial lead formed / ammo Formed lead (crimped) / bulk Dual side lead formed (crimped) / ammo Formed lead / bulk EXTERNAL DIMENSIONS Type Straight Dimensionshmmifinchg Configurations Taping Formed Bulk Straight Formed D L 03HA450G -00 2.5M0.2 4.5M0.3 03VA450G -00 f0.098M0.008g f0.177M0.012g P :12.7 (0.500) 5 3.5M0.2 4.5M0.3 f0.138M0.008g f0.177M0.012g 04HA600G -00 3.5M0.2 6.0J0.5 K0 04VA600G -00 f0.138M0.008g FBA P :12.7 (0.500) J0.020 f0.236M0.008g K0 FERRITE PRODUCTS 04HA450G -00 04VA450G -00 P :12.7 (0.500) 04HA900G -00 3.5M0.2 9.0M0.5 04VA900G -00 f0.138M0.008g f0.354M0.020g P :12.7 (0.500) 5.0max. 7.5 f0.197max.g f0.295g 06VA850NA-00 6.0M0.5 f0.197g 06HA121NA-00 f0.236M0.020g 05VA121G -00 P :12.7 (0.500) 06HA850NA-00 FBR 5.0 7.0 06VA121NA-00 f0.276g 07HA850G -00 5.5 07VA850G -00 7.5M0.5 07HA121G -00 f0.295g UnitDmmfinchg G G Please specify the lead configuration code. Fd0.65M0.05mm FBR05,07Bd0.6M0.05mm Note: Lead diameter (Bd) shall fall within a range of 0.65mmM0.05mm, FBR05, and FBR07 types however , will have a lead diameter (Bd) range of 0.6mm M0.05mm. PART NUMBERS Ordering code FBA FBR 7.5 f0.295M0.020g P :12.7 (0.500) 07VA121G -00 f0.217g 03 Q 450 G K00 04 Q 450 G K00 04 Q 600 G K00 04 Q 900 G K00 05VA121 G K00 06 Q 850NAK00 06 Q 121NAK00 07 Q 850 G K00 07 Q 121 G K00 Impedance [E]min. 35.0 45.0 60.0 90.0 120.0 85.0 120.0 85.0 120.0 Measuring frequency[MHz] Rated current[A]max. Material HA 50 50 50 50 EE 50 50 50 50 VA 100 100 100 100 100 100 100 100 100 HA 7.0 7.0 7.0 7.0 EE 7.0 7.0 7.0 7.0 Material VA 7.0 7.0 7.0 7.0 7.0 7.0 7.0 7.0 7.0 QfHA,VAgG Q Please specify material codesfHA,VAg and G lead configuration code. F DC ResistanceD0.01Emax Insulation resistanceD1.0MEmin Selection Guide P.10 Part Numbers P.327 Electrical Characteristics P.328 Packaging P.330 Reliability Data Precautions P.338 P.356 etc 327 ELECTRICAL CHARACTERISTICS IMPEDANCE-vs-FREQUENCY CHARACTERISTICS 328 ELECTRICAL CHARACTERISTICS 5 FERRITE PRODUCTS Measured by HP4191A 329 PACKAGING 1 Minimum Quantity KD/KE/KF Axial leadfFBAg Standard quantity hpcsi Taped Lead configration Bulk Ammo Type FBA03 FBA04 NA 1000 EE AB, BB EE 2000 KE,KF 500 EE Type 1000 US 1000 EE UB EE 3000 NA, KD, US 1000 EE KE, KF, VS 500 EE AB, BB EE 1000 VB, UB EE 3000 Dimensions hmmi finchg BD F L1 2.5M0.2 10.0M1.0 4.5M0.3 SYMBOL FBA03G450 EE KD LEAD b Bd 7M2 f0.098M0.008g f0.394M0.040g f0.177M0.012g FBA04G450 KD FBA04G600 3.5M0.2 10.0M1.0 4.5M0.3 f0.276M0.079g 0.65M0.05 3.5M0.2 J0.5 6.0M0.3 K0 10.0M1.0 7.5M2 J0.020 f0.138M0.008g f0.394M0.040g f0.236M0.0 g K0 FBA03G450 2.5M0.2 12.5M1.0 f0.295M0.079g 4.5M0.3 7M2 f0.098M0.008g f0.492M0.004g f0.177M0.012g FBA04G450 Radial leadfFBRg Taped Lead configuration Bulk Ammo Type FBR05 FBR06 FBR07 Standard quantity hpcsi NA 1000 EE SA EE 2000 NA 1000 EE NB 1000 EE SB EE 2000 FBA04G600 3.5M0.2 KE 12.5M1.0 f0.276M0.079g 4.5M0.3 7.5M2 f0.138M0.008g f0.492M0.004g f0.177M0.012g 0.65M0.05 f0.295M0.079g 3.5M0.2 J0.5 6.0M0.3 K0 12.5M1.0 f0.026M0.020g J0.020 f0.138M0.008g f0.492M0.004g f0.236M0.0 g K0 FBA04G900 3.5M0.2 12.5M1.0 2.5M0.2 9.0M0.5M0.3 15.0M1.0 7.5M2 f0.295M0.079g 4.5M0.3 7M2 f0.098M0.008g f0.591M0.004g f0.177M0.012g FBA04G450 UnitDmmfinchg FBA04G600 KF 15.0M1.0 f0.276M0.079g 4.5M0.3 7.5M2 f0.138M0.008g f0.591M0.004g f0.177M0.012g 0.65M0.05 f0.295M0.079g 3.5M0.2 J0.5 6.0M0.3 K0 15.0M1.0 f0.026M0.020g J0.020 f0.138M0.008g f0.591M0.004g f0.236M0.0 g K0 FBA04G900 2 Bulk dimensions 3.5M0.2 3.5M0.2 15.0M1.0 7.5M2 f0.295M0.079g 9.0M0.5M0.3 7.5M2 f0.138M0.008g f0.591M0.004g f0.354M0.020g Axial leadfFBAg 7.5M2 f0.295M0.079g f0.138M0.008g f0.492M0.004g f0.354M0.020g FBA03G450 7.5M2 f0.138M0.008g f0.394M0.040g f0.177M0.012g f0.026M0.020g f0.295M0.079g f0.295M0.079g UnitDmmfinchg NA VS Dimensions hmmi finchg Type FBA03G450 BD L1 L2 2.5M0.2 4.5M0.3 6.5max. b Bd 9005M1 Dimensionshmmifinchg f0.098M0.008g f0.177M0.012g f0.256max.g FBA04G450 3.5M0.2 4.5M0.3 Type 6.5max. f0.138M0.008g f0.177M0.012g f0.335max.g 0.65M0.05 FBA04G600 3.5M0.2 J0.5 6.0M0.3 K0 8.5max. 18min. f0.026M0.002g f0.709min.g 3.5M0.2 9.0M0.5 BD A a F Bd 3.5M0.2 4.5M0.3 12.5max. 5M1 0.65M0.05 f0.138M0.008g f0.177M0.012g f0.492max.g f0.197M0.039g f0.026M0.002g J0.020 f0.138M0.008g f0.236M0.0g f0.335max.g K0 FBA04G900 FBA04G450 FBA04G600 11.0max. 3.5M0.2 J0.5 6.0M0.3 K0 J0.020 f0.138M0.008g f0.236M K0 0.0 g f0.138M0.008g f0.354M0.020g f0.433max.g UnitDmmfinchg FBA04G900 3.5M0.2 9.0M0.5 12.5max. 5M1 0.65M0.05 f0.492max.g f0.197M0.039g f0.026M0.002g 16.0max. 5M1 0.65M0.05 f0.138M0.008g f0.354M0.020g f0.630max.g f0.197M0.039g f0.026M0.002g US UnitDmmfinchg Dimensions hmmi finchg Type FBA03G450 BD A a 2.5M0.2 4.5M0.3 9.0max. f0.098M0.008g f0.177M0.012g f0.354max.g FBA04G450 3.5M0.2 4.5M0.3 9.0max. F Bd 5M1 0.65M0.05 f0.197M0.039g f0.026M0.002g f0.138M0.008g f0.177M0.012g f0.354max.g UnitDmmfinchg 330 PACKAGING 3 Taping Dimensions AB (a : 26mm) f1.02inch lead spaceg Radial leadfFBRg NA 5 FBR05VA121 FBR06G850 FBR06G121 D L L1 Bd 5.0max. 7.5 9.0max. 0.65M0.05 f0.197max.g f0.295g 6M0.5 5.0 f0.236M0.020g f0.197g 6M0.5 7.0 f0.236M0.020g f0.276g Type W F FBR05VA121 2.5max. 2.5M1 b J3 109999 K5 f0.354max.g f0.026M0.002g f0.394 J0.118 M0.00g K0.197 7.0max. 0.65M0.05 J3 109999 K5 f0.276max.g f0.026M0.002g f0.394 J0.118 M0.00g K0.197 9.0max. 0.65M0.05 f0.354max.g f0.026M0.002g J3 109999 K5 f0.394 J0.118 M0.00g K0.197 3.0M0.5 Dimensions Type FBA03 f0.098max.g f0.098M0.039g FBR06G850 D L a 2.5M0.2 4.5M0.3 J1.5 26K0 3.0M0.5 FBA04 UnitDmmfinchg f0.118M0.020g f0.098M0.039g Bd 1.0max 1.0max 0.65M0.05 10.0 f0.394g 1.0max 1.0max 0.65M0.05 10.0 f0.138M0.008g f0.177M0.012g f1.02 J0.059 g f0.039maxgf0.039maxg f0.026M0.002g K0 f0.394g 2.5M1 2.5M1 |L1-L2| f0.039maxgf0.039maxg f0.026M0.002g f0.098M0.008g f0.177M0.012g f1.02 J0.059 g K0 f0.118M0.020g f0.098M0.039g FBR06G121 b Minimum insertion pitch 3.5M0.2 4.5M0.3 J1.5 26K0 FERRITE PRODUCTS Dimensions hmmi finchg Type UnitDmmfinchg BG (a : 52mm) NB f2.05 inches lead spaceg Dimensions hmmi finchg Type FBR07G850 FBR07G121 Type FBR07G850 FBR07G121 D L L1 Bd 7.5M0.5 5.5 7.0max.. 0.6M0.05 f0.295M0.020g f0.217g 7.5M0.5 7.5 f0.295M0.020g f0.295g W f0.276max.g f0.024M0.002g f0.197J0.039 M0.0g K0.079 9.0max. 0.6M0.05 J1 5000 K2 f0.354max.g f0.024M0.002g f0.197J0.039 M0.0g K0.079 F 2.5max. J1 5000 K0.5 f0.098max.g f0.197J0.039 M0.0g K0.020 2.5max. J1 5000 K0.5 f0.197J0.039 M0.0g K0.020 f0.098max.g b J1 5000 K2 Dimensions Type D L 2.5M0.2 4.5M0.3 UnitDmmfinchg FBA03 f0.098M0.008g f0.177M0.012g FBA04 3.5M0.2 4.5M0.3 a J2 52K1 f2.05J0.079 K0.039 g J2 52K1 b |L1-L2| Bd Minimum insertion pitch 1.2max 1.0max 0.65M0.05 10.0 f0.047maxg f0.039maxg f0.026M0.002g f0.394g 1.2max 1.0max 0.65M0.05 10.0 f0.138M0.008g f0.177M0.012g f2.05J0.079 K0.039 g f0.047maxg f0.039maxg f0.026M0.002g f0.394g UnitDmmfinchg 331 PACKAGING SA (F : 2.5mm pitch) SB (F : 5mm pitch) (0.197 inches) (0.098 inches) Type Symbol Dimensions Symbol Dimensions A W Type Symbol Dimensions Symbol Dimensions A J1.0 18000 K0.5 f0.709J0.039 K0.020 g 121D9.0max. f0.354maxg Wo 2.5max. W1 850D7.0max. 12.5min. f0.098max.g D 5.0max. f0.354 W2 f0.197max.g H J0.079 f0.7090000g K0 FBR05 P 12.7M1.0 12.7M0.3 BD0 F1 Bd 5.1M0.7 6.35M1.3 L 11.0max. t 0.7M0.2 FBR07 P P0 P1 F1 20M2mm F2 F1 Accumulated error for 20 pitches is M2mm. F2 Bonding tape must not protrude from the base tape. 332 12.7M1.0 12.7M0.3 F1 3.85M0.8 P2 6.35M1.3 3max. F2 f0.118max.g b 1.0max. f0.039max.g BD0 4M0.3 f0.157M0.012g Bd 0.6M0.05 f0.024M0.002g L f0.152M0.028g 11.0max. f0.433max.g t f0.250M0.051g F 0.7M0.2 f0.028M0.008g J1.0 5000 K0.5 J0.039 f0.19700000g K0.020 0M2 f0M0.079g J2.0 18.0000 K0 9 J0.75 K0.5 f0.354 J0.039 K0.020 g W2 f0.500M0.012g J0.039 f0.09800000g K0.020 Qh 7.5M0.5 f0.500M0.039g f0.028M0.008g J1.0 2.5000 K0.5 W1 J0.079 f0.7090000g K0 f0.433max.g f0.250M0.051g F H f0.026M0.002g f0.201M0.028g P2 0.65M0.05 2.5max. 12.5min. f0.492min.g f0.925M0.020g 1.0max. 4M0.3 Wo f0.098max.g D 3max.F2 f0.157M0.012g f0.500M0.039g P1 T J0.039 K0.020 g f0.039max.g f0.500M0.039g P0 J0.75 K0.5 J1.0 18000 K0.5 f0.709J0.039 K0.020 g f0.276max.g f0.118max.g b J2.0 18.0000 K0 9 W f0.354max.g f0.492min.g T 19.0max. 121D Qh UnitDmmfinchg 0M2 f0M0.079g F1 20M2mm F2 F1 Accumulated error for 20 pitches is M2mm. F2 Bonding tape must not protrude from the base tape. UnitDmmfinchg PACKAGING UB VB 5 FERRITE PRODUCTS Type Symbol Dimensions Symbol Dimensions 4.5M0.3 Qh A f0.177M0.012g A1 9.0max. W 03D 2.7max. W0 f0.146max.g H J0.5 20.0M0.3 K1.0 W2 f0.787 J0.020 M0.3g K0.039 FBA04G450 12.7M0.1 P b f0.500M0.039g P0 12.7M0.3 F1 BD0 f0.500M0.012g P1 3.85M0.8 6.35M1.3 Bd 5.0M1.0 Dimensions 4.5M0.3 F A J1.0 18000 K0.5 600: L 900: 9 A1 t F1 20M2mm F2 F1 Accumulated error for 20 pitches is M2mm. F2 Bonding tape must not protrude from the base tape. 9.0M0.5 450 12.5max. 600: 3.0max.F2 900: 16.0max. f0.118max.g FBA04G450 f0.630max.g 1.0max. FBA04G600 3.7max. f0.039max.g FBA04G900 BD 0.65M0.05 11.0max. 0.7M0.2 16.0M0.5 P 12.7M1.0 W0 12.7M0.3 F1 W1 3.85M0.8 W2 6.35M1.3 3.0max.F2 f0.118max.g b 1.0max. f0.039max.g BD0 4.0M0.3 f0.157M0.012g Bd 0.65M0.05 f0.026M0.002g L 11.0max. f0.433max.g f0.152M0.032g P2 9 J0.75 K0.5 f0.354 J0.039 K0.020 g f0.500M0.012g P1 12.5min. f0.492min.g f0.500M0.039g P0 J1.0 18000 K0.5 J0.039 f0.70900 00g K0.020 f0.650M0.020g f0.028M0.008g UnitDmmfinchg W f0.146max.g H0 0M2 f0M0.079g f0.492max.g g 4.0M0.3 Qh f0.354M0.020g f0.433max.g f0.197M0.039g J0.5 6.000.3 K0 5.0M1.0 f0.197M0.039g f0.236 J0.020 K00.0 g 12.5min. J0.75 K0.5 f0.354J0.039 K0.020 450: f0.177M0.012g f0.026M0.002g f0.250M0.051g F Symbol f0.157M0.012g f0.152M0.032g P2 Dimensions f0.492min.g W1 FBA03G450 0M2 Symbol J0.039 f0.7090000g K0.020 f0.106max.g 04D 3.7max. Type f0M0.079g f0.354max.g BD t f0.250M0.051g F1 20M2mm F2 F1 Accumulated error for 20 pitches is M2mm. F2 Bonding tape must not protrude from the base tape. 0.7M0.2 f0.028M0.008g UnitDmmfinchg 333 1/9 RELIABILITY DATA Specified Value Item 1.Operating temperature LA02 Type/ LA03 Type LA04 Type LA05 Type K25VJ105C LHL FBA/FBR LAV35 K25VJ85C K25VJ105C FL05 Type Test Method and Remarks FL06BT Type LAYFLD Including self-generated heat Range LHLD Including self-generated heat [LHL] 2 .S t o r a g e t e m p e r a t u r e Within the specified tolerance LAD The maximum DC value having inductance within 10% and temperature incease within 20 by the application of DC bias. LHLYLAV35D The maximum DC value having inductance decrease within 10% and temperature incease within the following specified temperature by the application of DC bias. Reference temperature D20CfLHL06, LAV35g FERRITE PRODUCTS Range 3.Rated current 5 K40VJ85C D25CfLHL08, LHL10, LHL13g D30CfLHLC06, LHLZ06, LHL16, LHLPg FBD No disconnection or appearance abnormaliry by continuous current application for 30 min. Chage after the application shall be within 20% of the initial value.This is not guaranteed for electrial characteristics during current application. FLD The maximum DC value having temperature rise within specified value. 4.Impedance Within the Refer to specified i n d i v i d u a l Measuring equipmentDImpedance analyzer fHP4191Agor tolerance specification FBD its equivalent Measuring frequencyDSpecified frequency FL06BTD Measuring equipmentD4291A fHPg or its equivalent Measuring frequencyDSpecified frequency 5. Inductance Within the specified tolerance Within the specified toler- LAD ance Measuring equipmentDLCR meterfHP4285A + HP42851A or its equivalentg Measuring frequencyDSpecified frequency LHLD Measuring equipmentDQ meterfHP4285AJHP42851A or its equivalentg LCR meterf HP4262Ag or its equivalentfat 1KHzg Measuring frequencyDSpecified frequency LAV35D Measuring equipmentDQ meterfHP4285AJHP42851A or its equivalentg Measuring frequencyDSpecified frequency FL05RD Measuring equipmentDHP4262A or its equivalent. Measuring frequencyD1kHz 339 2/9 RELIABILITY DATA Specified Value Item 6.Q LA02 Type/ LA03 Type LA04 Type LA05 Type LHL Within the specified tolerance FBA/FBR LAV35 FL05 Type Test Method and Remarks FL06BT Type Within the LAD specified Measuring equipmentDLCR meterfHP4285AJHP42851A tolerance or its equivalentg Measuring frequencyDSpecified frequency LHLYLAV35fexcept LHLPgD 5 Measuring equipmentDQ meterfHP4285AJHP42851A or Q meterfHP4342Agor its equivalent Measuring frequencyDSpecified frequency 7.DC Resisitance Within the specified tolerance LAD Measuring equipmentDlow ohmmeter fA&D AD5812 or its equivalentg LHLYFBYLAV35YFLD Measuring equipmentDDC ohmmetr 8.Self resonance frequency Within the specified tolerance Within the LAD specified Measuring equipmentDNetwork analyzerfAnritsu MS620J tolerance FERRITE PRODUCTS its equivalentg or its equivalentg LHLYLAV35fexcept LHLPgD Measuring equipmentDfHP4191A, 4192Ag its equivalent 9.Temperature characteristic L/LDWithinM5L L/LD L/LD LAD WithinM7L WithinM5L Change of maximum inductance deviation in step 1to5 step TemperaturefCg 1 20 2 K25 fMinimum operating temperatureg 3 20 fStandard temperatureg 4 J85 fMaximum operating temperatureg 5 20 LHLYLAV35D [LHL, LAV35] Change of maximum inductance deviation in step 1to5 Temperature at step 1D20C Temperature at step 2DMinimum operating temperature Temperature at step 3D20C fStandard temperatureg Temperature at step 4DMaximum operating temperature Temperature at step 5D20C 341 3/9 RELIABILITY DATA Specified Value Item 10.Terminal strengthD LA02 Type/ LA03 Type LA04 Type LA05 Type LHL No abnormality such as cut lead, or looseness. tensile force FBA/FBR LAV35 FL05 Type Test Method and Remarks FL06BT Type No abnor- No abnormality such as cut LAD mality such lead,or looseness. Apply the stated tensile force progressively in the direction as cut lead, to draw terminal. or loose- force(N) durationfSg 25 5 ness. 5 LHLYLAVD Apply the stated tensile force progressively in the direction Nominal wire diameter tensile Bdfmmg force fNg 0.3<BdT0.5 5 0.5<BdT0.8 10 0.8<BdT1.2 25 durationfSg 30M5 FBAD A bead shall be fixed and static loaded 20M1Nf2.0M0.1 kgfg in axial direction of lead wire in 10M1 seconds. FL05RD FERRITE PRODUCTS to draw terminal. Fix the component in the direction to draw terminal,and gradually apply the tensile force of 4.9 N. 11.Over current 12.Terminal strengthD LHLD There shall be no scorch Measuring currentDRated currentP2 or short of DurationD5min. wire. Number of measuringDone time LAD No abnormality such as cut lead, or looseness. Suspend a mass at the end the terminalincline the body bending though angel of 90 and return it to initial position.This operation is done over a period of 2-3 sec.Then second bend in the opposite direction shall be made. Number of bendsDTwo times. Nominal wire diameter tensile Bdfmmg Bending force Mass reference weight fNg fkgg 0.3<BdT0.5 2.5 0.25 0.5<BdT0.8 5 0.50 LHYFBYLAVD Suspend a mass at the end the terminalincline the body though angel of 90 and return it to initial position.This operation is done over a period of 2-3 sec.Then second bend in the opposite direction shall be made. Number of bendsDTwo times. Nominal wire diameter tensile Bdfmmg 13.Insulation resisitanceD Bending force Mass reference weight fNg fkgg 0.3<BdT0.5 2.5 0.25 0.5<BdT0.8 5 0.5 0.8<BdT1.2 10 1.0 LHLD 100Mmin. Applied voltageD500 VDC between the terminals DurationD60 sec. and body 1Mmin. FBAYFBRD between terminals and fOther than Applied voltageD100 VDC core materail DurationD60M5 sec. 14.Insulation resistanceD code MAg 15.WithstandingDbetween the terminals and body No abnor- LHL mality such Accoding to JIS C5102. 7. 1. 3 fCg as insula- Metal global method tion dam- Applied voltageD500 VDC age DurationD60 sec. 343 4/9 RELIABILITY DATA Specified Value Item 16.DC bias characteristic 17.Body strength LA02 Type/ LA03 Type LA04 Type LA05 Type LHL FBA/FBR L/LDWithin K10L No abnormality as damage. LAV35 FL05 Type Test Method and Remarks FL06BT Type L/LD LAYLAV35D K10L Measure inductance with appliation of rated current using Within LCR meter to compare it with the initial value. No signifi- No abnor- LA02YLAV35D cant dam- m a l i t y a s Applied forceD30N age such as damage. DurationD10 sec. cracks on SpeedDShall attain to specified force in 2 sec. LA03YLA04YLA05D Applied forceD50N DurationD10 sec. SpeedDShall attain to specified force in 2 sec. FBD Applied forceD50M3N DurationD30M1 sec. 18.Resisitance to vibration L/LD L/LD AppearanceD AppearanceD L/LD WithinM5L WithinM5L L/LD WithinM5L No No WithinM5L QD30min. QD15min. abnomality abnomality QD30min. L/LD Impedance DirectionsD2 hrs each in X, Y and Z directions totalD6hrs. WithinM5L changeD Frequency rangeD10 to 55 to 10Hzf1min.g Q/QD WithinM10L LAD Accoding to JIS C5102 8. 2 Vibaration typeDA Q changeD WithinM20L AmplitudeD1.5mm WithinM30L Mounting methodDSoldering onto printed board. fLHLPD RecoveryDAt least 1hr of recovery under the standard only L/Lg FERRITE PRODUCTS body. 5 condition after the test, followed by the measurement within 2hrs. LHLYFBYLAVD Accoding to JIS C0040 Vibaration typeDA DirectionsD2 hrs each in X, Y and Z directions totalD6hrs. Frequency rangeD10 to 55 to 10Hzf1min.g AmplitudeD1.5mm fBut don't exceed acceleration 196m/s ftwo powerg Mounting methodDSoldering onto printed board. 345 5/9 RELIABILITY DATA Specified Value Item 19.Resistance to shock LA02 Type/ LA03 Type LA04 Type LA05 Type LHL FBA/FBR No significant abnormality in appearance LAV35 FL05 Type Test Method and Remarks FL06BT Type No signifi- LAYLAV35D cant abnor- Drop test mality in ap- Impact materialDconcrete or vinyl tile pearance HeightD1m Total number of dropsD10 times 20.Solderability A t l e a s t A t l e a s t At least 75L of lead circu, ference is LAD coverd by new solder. 75L of lead 90L of lead covered by new solder. Solder temperatureD230M5C c i r c u , c i r c u , DurationD2M0.5 sec. ference is ference is covered by covered by LHLD new solder. Solder temperatureD235M5C new solder. DurationD2M0.5 sec. Immersion depthDUp to 1.5mm from bottom of kinked part. [LHL06, LHLC06, LHLZ06] DUp to 1.5mm from bottom of case. [LHL08, LHL10, LHL13, LHL16] 5 FERRITE PRODUCTS At least 75L of terminal electrode is FBD Solder temperatureD230M5C DurationD3M1 sec. Immersion depthDUp to 1.5mm from terminal root. LAV35D Solder temperatureD230M5C DurationD2M0.5 sec. FL05RD Solder temperatureD230M5C DurationD2M0.5 sec. Immersion depthDUp to 2V2.5mm from terminal root. FL06BTD Solder temperatureD230M5C DurationD3M1 sec. Immersion depthDUp to 0.5V1.0mm from terminal root. 347 6/9 RELIABILITY DATA Specified Value Item 21.Resisitance to soldering heat LA02 Type/ LA03 Type LA04 Type LA05 Type No significant abnormality L/LD in appearance LHL FBA/FBR LAV35 FL05 Type Test Method and Remarks FL06BT Type No signifi- No signifi- L/LD Refer to Within M5L cant abnor- cant abnor- WithinM5L i n d i v i d u a l cant abnor- Solder temperatureD260M5CfLA02g QD15min. mality in ap- mality in ap- QD30min. specifica- mality in ap- pearance tion pearance No signifi- LAD pearance 270M5CfLA03YLA04YLA05g DurationD5M0.5 sec. One time Inductance Impedance Impedance Immersed conditionsDInserted into substrate with= 1.6mm changeD changeD change WithinM5L WithinM20L WithinM20L RecoveryDAt least 1hr of recovery under the standard 5 condition after the test, followed by the measurement within 2hrs. WithinM30L LHLD fLHLPD Solder bath method only L/Lg Solder temperatureD260M5C DurationD10M1 sec. DUp to 1.5mm from bottom of kinked part. [LHL06, LHLC06, LHLZ06] DUp to 1.5mm from bottom of case. [LHL08, LHL10, LHL13, LHL16, LHLP] Manual soldering FERRITE PRODUCTS Q changeD Solder temperatureD350M10CfAt the tip of soldering irong DurationD5M1 sec. DUp to 1.5mm from bottom of kinked part. [LHL06, LHLC06, LHLZ06] DUp to 1.5mm from bottom of case. [LHL08, LHL10, LHL13, LHL16, LHLP] CautionDNo excessive pressing shall be applied to terminald RecoveryD4 to 24hrs of recovery under the standard condition after the tset. FBD Solder bath method Condition 1 Solder temperatureD260M5C DurationD10M1 sec. Immersion depthDUp to 1.5mm from terminal root. Condition 2 Solder temperatureD350M5C DurationD3M1 sec. Immersion depthDUp to 1.5mm from terminal root. RecoveryD3hrs of recovery under the standard condition after the test. LAV35D Solder temperatureD260M5C DurationD5M0.5 sec. Immersion depthDUp to 2.0 to 2.5mm from botoom of kinked part. RecoveryD4 to 24hrs of recovery under the standard condition after the tset. FLD Solder conditionD260M5C 10M1 sec. Immersion depthDUp to 0.5 to 1.0mm from terminal root. RecoveryD3hrs of recovery under the standard condition after the test. 349 7/9 RELIABILITY DATA Specified Value Item 22.Resisitance to solvent LA02 Type/ LA03 Type LA04 Type LA05 Type LHL FBA/FBR LAV35 FL05 Type Test Method and Remarks FL06BT Type Pleasa avoid the ultrasonic cleaning of No signifi- P l e a s e FBD this product. cant abnor- avoid the ul- Solvent temperatureD20V25C mality in ap- t r a s o n i c DurationD30M5 sec. pearance Solvent typeDAcetone, trichloroethylene cleaning of Impedance this product. RecoveryD3hrs of recovery under the standard condition changeD after the test. WithinM20L L/LD L/LD L/LD WithinM10L WithinM10L WithinM10L QD30min. Q/QD WithinM30L QD15min. AppearanceD AppearanceD L/LD No abnor- No abnor- WithinM10L mality mality Inductance Impedance changeD changeD WithinM10L WithinM20L QD20min. Refer to individual AppearanceD LAD No abnor- Conditions for 1cycle specifica- mality Step TemperaturefCg tion Impedance 1 K25 K3 30M3 changeD 2 Room temperature Within 3 WithinM20L Q changeD Durationfming J0 J2 3 J85 K0 30M3 4 Room temperature Within 3 WithinM30L Number of cyclesD5 cycles fLHLPD RecoveryDAt least 1hr of recovery under the standard only L/Lg condition after the removal from test chamber, FERRITE PRODUCTS 23.Thermnal shock 5 followed by the measurement within 2hrs. LHLD Accoding to JIS C0025 Conditions for 1 cycle Step 1 2 3 4 TemperaturefCg Durationfming Minimum operating 30M3 temperature J0 K3 Room temperature Within 3 Maximum oparating 30M3 temperature J2 K0 Room temperature Within 3 Number of cyclesD10 cycles LHL D5 cyclesfFBA, FBRg RecoveryD4 to 24hrs of recovery under the standard condition after the removal from the test cfamber. LHL D3hrs of recovery under the standard condition after the removal from the test cfamber.fFBA, FBRg LAVD Conditions for 1 cycle Step 1 2 3 4 TemperaturefCg Minimum operating temperature J0 K3 Room temperature Maximum oparating J2 temperature K0 Room temperature Durationfming 30M3 Within 3 30M3 Within 3 Number of cyclesD10 cycles RecoveryDAt least 1hr of recovery under the standard condition after the removal from test chamber, followed by the measurement within 2hrs. FLD Accoding to JIS C0025 Conditions for 1 cycle Step TemperaturefCg 1 K25 J0 K3 30M3 2 Room temperature Within 3 3 J85 K0 30M3 4 Room temperature Within 3 J2 Durationfming Number of cyclesD10 cycles RecoveryD1 to 2hrs of recovery under the standard condition after the removal from the test cfamber. 351 8/9 RELIABILITY DATA Specified Value Item 24.Damp heat LA02 Type/ LA03 Type L/LD LA04 Type L/LD LA05 Type LHL L/LD WithinM10L WithinM10L WithinM10L QD30min. Q/QD QD15min. FBA/FBR FL05 Type Test Method and Remarks FL06BT Type AppearanceD L/LD LAYLAV35D No abnor- WithinM10L TemperatureD40M2C mality WithinM30L LAV35 HumidityD90V95LRH QD20min. Impedance DurationD1000 hrs changeD RecoveryDAt least 1hr of recovery under the standard re- WithinM20L moval from test chamber, followed by the mea- 5 surement within 2hrs. TemperatureD60M2C HumidityD90V95LRH DurationD1000 hrs RecoveryD1 to 2hrs of recovery under the standard condition after the removal from the test cfamber. 25.Loading under damp heat L/LD L/LD L/LD WithinM10L WithinM10L WithinM10L QD30min. Q/QD QD15min. WithinM30L AppearanceD L/LD Refer to AppearanceD LAYLAV35D No abnor- WithinM10L i n d i v i d u a l No abnor- TemperatureD40M2C mality QD20min. specifica- mality tion Impedance DurationD1000 hrs Imductance HumidityD90V95LRH FERRITE PRODUCTS FBD Applied currentDRated current changeD changeD WithinM10L WithinM20L RecoveryDAt least 1hr of recovery under the standard re- Q changeD moval from test chamber, followed by the mea- WithinM30L surement within 2hrs. fLHLPD only L/Lg LHLD TemperatureD40M2C HumidityD90V95LRH DurationD1000M24 hrs Applied currentDRated current RecoveryD1 to 2hrs of recovery under the standard condition after the removal from the test cfamber. FLD TemperatureD60M3C HumidityD90V95LRH DurationD500 fJ12, K0ghrs Applied currentDRated current RecoveryD1 to 2hrs of recovery under the standard condition after the removal from the test cfamber. 26.Loading at high temperature L/LD L/LD L/LD WithinM10L WithinM10L WithinM10L QD30min. Q/QD WithinM30L QD15min. L/LD LAYLAV35D WithinM10L TemperatureD85M2C QD20min. DurationD1000 hrs Applied currentDRated current RecoveryDAt least 1hr of recovery under the standard removal from test chamber, followed by the measurement within 2hrs. 353 9/9 RELIABILITY DATA Specified Value Item 27.Low temperature life test LA02 Type/ LA03 Type L/LD LA04 Type L/LD LA05 Type L/LD WithinM10L WithinM10L WithinM10L QD30min. Q/QD WithinM30L QD15min. LHL FBA/FBR LAV35 FL05 Type Test Method and Remarks FL06BT Type AppearanceD L/LD No abnor- WithinM10L i n d i v i d u a l No abnor- TemperatureDK25M2C mality QD20min. specifica- mality tion Impedance RecoveryDAt least 1hr of recovery under the standard re- Inductance Refer to AppearanceD LAD DurationD1000 hrs changeD changeD moval from test chamber, followed by the mea- WithinM10L WithinM20L surement within 2hrs. 5 Q changeD TemperatureDK40M3C only L/Lg DurationD1000M24 hrs RecoveryD1 to 2hrs of recovery under the standard condition after the removal from the test cfamber. LAV35D TemperatureDK40M3C DurationD1000 hrs RecoveryDAt least 1hr of recovery under the standard re- FERRITE PRODUCTS LHLD WithinM30L fLHLPD moval from test chamber, followed by the measurement within 2hrs. FLD TemperatureDK40M3C DurationD500fJ12, K0ghrs RecoveryD1 to 2hrs of recovery under the standard condition after the removal from the test cfamber. 28.High temperature life test LHLD AppearanceD Refer to AppearanceD No abnor- individual No abnor- TemperatureD105M3C mality specifica- mality Inductance tion Impedance RecoveryD1 to 2hrs of recovery under the standard con- changeD changeD WithinM10L WithinM20L Q changeD WithinM30L DurationD1000M24 hrs dition after the removal from the test cfamber. FLD TemperatureD85M3C DurationD500fJ12, K0ghrs RecoveryD1 to 2hrs of recovery under the standard condition after the removal from the test cfamber. 355 PRECAUTIONS LA TypeLH TypeFB TypeFL Type Stages 1.Circuit Design Precautions Technical considerations Operating environment, 1.The products described in this specification are intended for use in general equipment, electronic equipment,(office telecommunications systems, supply measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high reliability (traffic systems, 5 safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance. 2.PCB Design 1.When Inductors are mounted onto a PC board, hole dimensions on the board should Design 1.Please design insertion pitches of a base in the pitches that match the lead pitch of the component, if not, it will cause breakage of the terminals or cracking of terminal roots covered with resin as excess stress travels through the fitted a terminal interval. terminal legs. 3.Considerations for automatic placement Adjustment of mounting machine 1.Excessive impact load should not be imposed on the products when mounting onto the PC boards. 1. When installing products, care should be taken not to apply distortion stress as it may deform the products. FERRITE PRODUCTS systems,) where product failure might result in loss of life, 2.Mounting and soldering conditions should be checked beforehand. 4.Soldering Wave soldering 1.Please refer to the specifications in the catalog for a wave soldering. 2.Do not immerse the entire Inductors in the flux during the soldering operation. Lead free soldering 1.When using products with lead free soldering, we request to use them after confirming of adhesion, temperature of 1.If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of the products. resistance to soldering heat, soldering etc sufficiently. Recommended conditions for using a soldering iron: Put the soldering iron on the land-pattern. Soldering iron's temperature - Below 350 Duration - 3 seconds or less The soldering iron should not directly touch the inductor. 5.Cleaning 6.Handling Cleaning conditions 1.LA type, LH type LA type, LH type Please do not do cleaning by a supersonic wave. 1.If washing by supersonic waves, supersonic waves may deform products. Handling 1.Keep the inductors away from all magnets and magnetic 1.There is a case that a characteristic varies with magnetic influence. objects. Mechanical considerations 1.Please do not give the inductors any excessive mechanical 1.There is a case to be damaged by a mechanical shock. shocks. 2.LH type 2.LH type If inductors are dropped onto the floor or a hard surface they There is a case to be broken by a fall. should not be used. Packing 1.Please do not give the inductors any excessive mechanical 1.There is a case that a lead route turns at by a fall or an excessive shock. shocks. In loading, please pay attention to handling indication mentioned in a packing box (a loading direction / number of maximum loading / fragile item). 7.Storage conditions Storage 1. Under a high temperature and humidity environment, problems such as reduced Storage 1.To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. and humidity in the storage area should be controlled.. Recommended conditions Ambient temperature Humidity 040 Below 70 % RH The ambient temperature must be kept below 30. Even under ideal storage conditions, solderability of products electrodes may decrease as time passes. For this reason, inductors should be used within one year from the time of delivery. In case of storage over 6 months, solderability shall be checked before actual usage. 357