234
BK1608HS121_TZ
1 2 3 457
6
形名表記法 ORDERING CODE
用途 APPLICATIONS
特長 FEATURES
BK
積層ハイロスインダクタ
YAg内部導体を使用した磁気シールド構造により、発熱やクロストークが小
さい
YGND不要のため、パターン設計上の自由度が大きい
Yノイズ対策のため様々なバリエーションとインピーダンスをラインナップ
DXL成分を抑え、(デジタル波形のオーバーシュート等)波形品位の低
下を抑制
D20MHz以上で急峻に増大するZ特性により、100MHzV300MHz帯
の輻射ノイズに適用(映像信号廻りに効果的)
DZの立ち上がりを高周波域とした設計により、200MHzV500MHzの
ノイズ対策に適用
D200MHz近傍のノイズ対策に最適。より高い減衰効果
Dシリーズ中最もXL成分を抑えた設計により、波形品位低下の抑止
と共に高周波域での減衰をも確保
D直流抵抗低減化設計により、LSI電源廻りでのノイズ対策に最適
YInternal silver printed layer creates a closed circuit which acts as a mag-
netic shield minimizing heat generation and crosstalk.
YNo need for grounding provides greater circuit design flexibility.
YSeveral material types and a broad range of impedance values provide
noise countermeasures for various applications.
Suppresses the XL component. Helps stop the reduction of the wave-
form(digital wave-form overshoot, etc.)
Increases the Z characteristic sharply above 20MHz and is applicable for
radiated noise in the 100MHzV300MHz range. Especially effective on video
signal lines.
Designed as a noise countermeasure for the 200MHzV500MHz range where
the rise of the Z component is in the high frequency area.
Intended for noise suppression around 200MHz. Effectively increases at-
tenuation.
The best material in the BK Series to suppress the XL component and stop
the reduction of the wave-form while maintaining attenuation in the high fre-
quency area.
Reduced DC resistance version for noise countermeasures around
LSI power supplies.
YHigh frequency noise countermeasure in personal computers, digital cam-
eras and other information system products. For use on digital product
clock lines and general signal lines.
YRediated noise suppression in computer or printer interfaces and harness
connectors.
YNoise suppression in video and other AV products.
YPrevents interference between circuits in cellular phones(PHS, PDC, etc.)
YDue to the closed internal circuit which acts as a magnetic shield, the TS
material is extremely effective as a noise filter on LSI power supply lines
where downsizing of components is needed.
積層ハイロスインダクタ
MULTILAYER FERRITE CHIP BEADS
BK SERIES
Yパソコン、デジタルスチルカメラ等の情報機器Yデジタル機器のクロック
ライン、一般信号ラインに於ける高調波ノイズ対策
Yパソコン、プリンタ等のインターフェイス、ハーネス接続部での輻射ノイ
ズ及びイミュニティ対策
Yビデオ、ムービー等のAV機器に於けるノイズ対策
YPDC、PHS等の移動体通信機器の回路間の干渉防止
Y磁気シールド構造による小型化メリットを生かし、LSI電源供給ラインのノ
イズ防止フィルタ用途に最適(TS)
形式
0603(0201) 0.6P0.3
1005(0402) 1.0P0.5
1608(0603) 1.6P0.8
2125(0805) 2.0P1.25
形状寸法fLPWghmmi
材質記号
HW
HS
HM
LM
LL
TS
材質によりインピー
ダンス特性が異なる
4
公称インピーダンス hEi 特性
K標準品
当社管理記号
Q標準品
QW スペース
BK
Multilayer Ferrite Chip Beads
Type
0603(0201) 0.6P0.3
1005(0402) 1.0P0.5
1608(0603) 1.6P0.8
2125(0805) 2.0P1.25
External DimensionsfLPWghmmi
Material
HW
HS
HM
LM
LL
TS
ImpedancehEi Characteristics
KStandard Products
Internal code
example
150 15
101 100
102 1000
Refer to impedance
curves for material
differences
OPERATING TEMP.
13
2
例
150 15
101 100
102 1000
57
13457
2
QStandard Products
QWBlank Space
–55V+125C
HS
HM
LL
LM
HW
TS
:
:
:
:
:
:
HS
HM
LL
LM
HW
TS
包装
Tリールテーピング
6
Packaging
T Tape & Reel
6
235
FERRITE PRODUCTS
5
外形寸法 EXTERNAL DIMENSIONS
P.237 P.239 P.260 P.262 P.270P.10
概略バリエーション AVAILABLE MATERIALS
Type L W T e
BK0603 0.60M0.03 0.30M0.03 0.30M0.03 0.15M0.05
f0201gf0.024M0.01g
f0.012M0.001gf0.012M0.001g
f0.006M0.002g
BK1005 1.00M0.05 0.50M0.05 0.50M0.05 0.25M0.10
f0402gf0.039M0.002g
f0.020M0.002gf0.020M0.002g
f0.010M0.004g
BK1608 1.6M0.15 0.8M0.15 0.8M0.15 0.3M0.2
f0603gf0.063M0.006gf0.031M0.006gf0.031M0.006gf0.012M0.008g
2.0 1.25M0.2 0.85M0.2 0.15M0.05
BK2125 1.25M0.2
f0805gf0.079 gf0.049M0.008gf0.033M0.008gf0.020M0.012g
f0.049M0.008g
UnitDmmfinchg
アイテム一覧
Part Numbers
特性図
Electrical Characteristics
梱包
Packaging
信頼性
Reliability Data
使用上の注意
Precautions
セレクションガイド
Selection Guide
etc
HM type LL type
BK0603
I max=150V200mAI max=200mA
J0.3
K0.1
J0.012
K0.004
I max=200mA
HS type
I max=150mA
BK1608
HW type HS type
I max=300V600mA I max=300V1500mA
HM type LL type
I max=200V350mA I max=150V500mA
LL type
I max=150V500mA
1 LL241
2 LL181
3 LL121
4 LL680
5 LL560
6 LL470
7 LL300
2000
1000
0
1
3
45
2
6
7
HS type HM type
BK1005
I max=150V300mAI max=300V1000mA
LL type
I max=250V500mA
I max=300V500mA
HW type
1
34
5
2
6
1 601
2 241
3 121
4 680
5 330
6 100
1
2
3
4
5
6
7
8
2500
1250
0
1 LL241
2 LL181
3 LL121
4 LL680
5 LL470
6 LL330
7 LL220
8 LL100
236
概略バリエーション AVAILABLE MATERIALS
BK1608
LM type
I max=200V300mA
TS type
I max=300V400mA
BK2125
HS type LL typeHM type LM type
I max=300V1200mA I max=400V800mA I max=300V600mA I max=200V400mA
237
FERRITE PRODUCTS
5
アイテム一覧 PART NUMBERS
68 0.17 500
120 0.24 450
240 0.31 400
430 0.50 350
600 0.60 300
10 0.05 1000
33 0.10 700
68 0.13 600
120 0.23 500
240 0.33 400
600 0.58 300
120 100 0.25 300 0.50M0.05
240 0.36 300
f0.020M0.002g
470 0.56 250
600 0.59 250
1000 0.80 150
10 0.15 500
22 0.20 400
33 0.30 400
47 0.35 350
68 0.31 400
120 0.45 350
180 0.53 300
240 0.70 250
形 名
Ordering code
厚み
Thickness
hmmi
finchg
定格電流
Rated current
hmAi
fmax.g
直流抵抗
DC
resistance
hEi
fmax.g
測定周波数
Measuring
frequency
hMHzi
インピーダンス
Impedance
hEi
M25L
BK1005
80 0.40 200
120 0.50 200
240 0.80 200
60 100 0.40 200 0.30M0.03
120 0.50 200
f0.012M0.001g
10 0.40 200
22 0.50 200
33 0.80 150
形 名
Ordering code
厚み
Thickness
hmmi
finchg
定格電流
Rated current
hmAi
fmax.g
直流抵抗
DC
resistance
hEi
fmax.g
測定周波数
Measuring
frequency
hMHzi
インピーダンス
Impedance
hEi
M25L
BK0603
BK 0603 HS 800
BK 0603 HS 121
BK 0603 HS 241
BK 0603 HM 600
BK 0603 HM 121
BK 0603 L L 100
BK 0603 L L 220
BK 0603 L L 330
BK 1005 HW 680
BK 1005 HW 121
BK 1005 HW 241
BK 1005 HW 431
BK 1005 HW 601
BK 1005 HS 100
BK 1005 HS 330
BK 1005 HS 680
BK 1005 HS 121
BK 1005 HS 241
BK 1005 HS 601
BK 1005 HM 121
BK 1005 HM 241
BK 1005 HM 471
BK 1005 HM 601
BK 1005 HM 102
BK 1005 L L 100
BK 1005 L L 220
BK 1005 L L 330
BK 1005 L L 470
BK 1005 L L 680
BK 1005 L L 121
BK 1005 L L 181
BK 1005 L L 241
238
アイテム一覧 PART NUMBERS
形 名
Ordering code
厚み
Thickness
hmmi
finchg
定格電流
Rated current
hmAi
fmax.g
直流抵抗
DC
resistance
hEi
fmax.g
測定周波数
Measuring
frequency
hMHzi
インピーダンス
Impedance
hEi
M25L
BK2125
15 0.05 1200
22 0.05 1200
33 0.05 1200
47 0.05 1000
75 0.10 1000
100 0.10 900
120 0.15 800
240 0.20 600
430 0.25 500
600 0.30 500
1000 100 0.40 300 0.85M0.2
120 0.15 800
f0.033M0.008g
240 0.20 600
470 0.25 500
600 0.25 500
1000 0.35 400
56 0.20 600
120 0.30 400
240 0.35 300
750 0.30 400
1500 0.35 400
1800 0.45 300 1.25M0.2
2500 0.75 200 (0.049M0.008)
100
120 0.15 600
240 0.25 450
430 0.30 400
600 0.40 300
22 0.05 1500
33 0.08 1200
47 0.10 900
60 0.10 800
80 0.10 600
120 0.18 500
240 0.25 400
600 0.45 350
1000 0.60 300
120 0.20 350
240 0.35 300
470 0.45 250
600 0.60 250 0.80M0.15
1000 100 0.70 200
f0.031M0.006g
30 0.20 500
47 0.30 400
56 0.30 400
68 0.35 300
120 0.50 300
180 0.65 250
240 0.80 250
330 0.85 200
430 0.85 200
510 0.90 200
680 1.00 150
750 0.60 300
1500 0.75 250
1800 0.85 200
2500 1.10 200
430 0.25
M30%
400
600 0.27
M30%
350
1000 0.35
M30%
300
形 名
Ordering code
厚み
Thickness
hmmi
finchg
定格電流
Rated current
hmAi
fmax.g
直流抵抗
DC
resistance
hEi
fmax.g
測定周波数
Measuring
frequency
hMHzi
インピーダンス
Impedance
hEi
M25L
BK1608
BK 1608 HW 121
BK 1608 HW 241
BK 1608 HW 431
BK 1608 HW 601
BK 1608 HS 220
BK 1608 HS 330
BK 1608 HS 470
BK 1608 HS 600
BK 1608 HS 800
BK 1608 HS 121
BK 1608 HS 241
BK 1608 HS 601
BK 1608 HS 102
BK 1608 HM 121
BK 1608 HM 241
BK 1608 HM 471
BK 1608 HM 601
BK 1608 HM 102
BK 1608 L L 300
BK 1608 L L 470
BK 1608 L L 560
BK 1608 L L 680
BK 1608 L L 121
BK 1608 L L 181
BK 1608 L L 241
BK 1608 L L 331
BK 1608 L L 431
BK 1608 L L 511
BK 1608 L L 681
BK 1608 LM 751
BK 1608 LM 152
BK 1608 LM 182
BK 1608 LM 252
BK 1608 T S 431
BK 1608 T S 601
BK 1608 T S 102
BK 2125 HS 150
BK 2125 HS 220
BK 2125 HS 330
BK 2125 HS 470
BK 2125 HS 750
BK 2125 HS 101
BK 2125 HS 121
BK 2125 HS 241
BK 2125 HS 431
BK 2125 HS 601
BK 2125 HS 102
BK 2125 HM 121
BK 2125 HM 241
BK 2125 HM 471
BK 2125 HM 601
BK 2125 HM 102
BK 2125 L L 560
BK 2125 L L 121
BK 2125 L L 241
BK 2125 LM 751
BK 2125 LM 152
BK 2125 LM 182
BK 2125 LM 252
239
FERRITE PRODUCTS
5
特性図 ELECTRICAL CHARACTERISTICS
BK0603
240
特性図 ELECTRICAL CHARACTERISTICS
BK1005
100
80
60
40
20
0
1 10 100 1000
BK1005 HS330
100
80
60
40
20
0
1 10 100 1000
BK1005 HS680
241
FERRITE PRODUCTS
5
特性図 ELECTRICAL CHARACTERISTICS
500
250
0
1 10 100 1000 10000
BK1005 LL680
200
150
100
50
0
1 10 100 1000 10000
BK1005 LL100
200
150
100
50
0
1 10 100 1000 10000
BK1005 LL220
500
400
300
200
100
0
1 10 100 1000 10000
BK1005 LL330
500
400
300
200
100
0
1 10 100 1000 10000
BK1005 LL470
242
特性図 ELECTRICAL CHARACTERISTICS
BK1608
243
FERRITE PRODUCTS
5
特性図 ELECTRICAL CHARACTERISTICS
500
250
0
1 10 100 1000 10000
BK1608 LL300
500
250
0
1 10 100 1000 10000
BK1608 LL470
500
250
0
1 10 100 1000 10000
BK1608 LL560
500
250
0
1 10 100 1000 10000
BK1608 LL680
1500
750
0
1 10 100 1000
BK1608 LL121
244
特性図 ELECTRICAL CHARACTERISTICS
245
FERRITE PRODUCTS
5
BK2125
特性図 ELECTRICAL CHARACTERISTICS
246
特性図 ELECTRICAL CHARACTERISTICS
R
Z
X
1000100101
0
500
1000
Frequency
Impedance
BK2125 HM471
R
Z
1000100101
0
500
1000
Frequency
Impedance
BK2125 LL121
X
248
BKP1608HS181_TZ
7
6
5
4
3
21
形名表記法 ORDERING CODE
用途 APPLICATIONS
特長 FEATURES
BKP
電源用積層ハイロスインダクタ
Yグリーンシート及び印刷技術の高度化により実現された低Rdcが、低消費
電力やバッテリーの長寿命化を達成します。
YGND不要のため、パターン設計上の自由度が大きい。
YLow Rdc value brings about low power dissipation and extending the life of
batteries. That stands on the high advanced green sheet and printing tech-
nologies.
YNo need for grounding provides greater circuit design.
YHigh frequency noise debug on the DC power supply line in personal
computers and other information system products.
YNoise suppression in USB and IEEE1394 interface.
YPrevents interference between circuits in mobile systems(PDC, PHS, PDA)
電源用積層ハイロスインダクタ
MULTILAYER FERRITE CHIP BEADS
(FOR POWER SUPPLY LINES)
BK SERIES P TYPE
Yパソコンや情報機器DC電源ラインにおける、高周波ノイズ対策。
YUSBやIEEE1394などのインターフェイスラインでのノイズ対策。
YPDC、PHSやPDAなど携帯機器の回路間の相互干渉防止。
形式
1005(0402) 1.0P0.5
1608(0603) 1.6P0.8
2125(0805) 2.0P1.25
形状寸法fLPWghmmi
4
公称インピーダンス hEi 特性
K標準品
当社管理記号
Q標準品
QW スペース
BKP
Multilayer Ferrite Chip Beads
(For Power Supply Lines)
Type
1005(0402) 1.0P0.5
1608(0603) 1.6P0.8
2125(0805) 2.0P1.25
External DimensionsfLPWghmmi
ImpedancehEi Characteristics
KStandard Products
Internal code
example
330 33
101 100
391 390
OPERATING TEMP.
13
2
例
330 33
101 100
391 390
57
13457
2
QStandard Products
QWBlank Space
–55V+85C
包装
Tリールテーピング
6
Packaging
T Tape & Reel
6
材質記号
HS 広帯域対応
Material
HS
For broadband applications
249
FERRITE PRODUCTS
5
外形寸法 EXTERNAL DIMENSIONS
P.250 P.251 P.260 P.262 P.270P.10
概略バリエーション AVAILABLE MATERIALS
Type L W T e
BKP1005 1.00M0.05 0.50M0.05 0.50M0.05 0.25M0.10
f0402gf0.039M0.002gf0.020M0.002gf0.020M0.002gf0.010M0.004g
BKP1608 1.6M0.15 0.8M0.15 0.8M0.15 0.3M0.2
f0603gf0.063M0.006gf0.031M0.006gf0.031M0.006gf0.012M0.008g
BKP2125 2.0 1.25M0.2 0.85M0.2 0.15M0.05
f0805gf0.079 gf0.049M0.008gf0.033M0.008gf0.020M0.012g
UnitDmmfinchg
アイテム一覧
Part Numbers
特性図
Electrical Characteristics
梱包
Packaging
信頼性
Reliability Data
使用上の注意
Precautions
セレクションガイド
Selection Guide
etc
J0.3
K0.1
J0.012
K0.004
BKP1608
HS type
I max=1V3A
BKP2125
HS type
I max=2V4A
1 HS391
2 HS271
3 HS181
4 HS101
5 HS600
6 HS330
500
250
1
2
4
3
5
6
500
250
1
2
4
3
1 HS221
2 HS101
3 HS600
4 HS330
BKP1005
HS type
I max=1A
500
250
121
5
6
250
アイテム一覧 PART NUMBERS
33 25 3.0
60 40 2.5
100 50 1.7 0.80M0.15
180 100 75 1.5 (0.031M0.006)
270 110 1.2
390 140 1.0
形 名
Ordering code
厚み
Thickness
hmmi
finchg
定格電流
Rated current
hAi
fmax.g
直流抵抗
DC
resistance
hmEi
fmax.g
測定周波数
Measuring
frequency
hMHzi
インピーダンス
Impedance
hEi
M25L
BKP1608
33 20 4.0
60 25 3.0 0.85M0.2
100 100 40 2.5 (0.033M0.008)
220 50 2.0
形 名
Ordering code
厚み
Thickness
hmmi
finchg
定格電流
Rated current
hAi
fmax.g
直流抵抗
DC
resistance
hmEi
fmax.g
測定周波数
Measuring
frequency
hMHzi
インピーダンス
Impedance
hEi
M25L
BKP2125
120 100 140 1.0 0.50M0.05
(0.02M0.002)
形 名
Ordering code
厚み
Thickness
hmmi
finchg
定格電流
Rated current
hAi
fmax.g
直流抵抗
DC
resistance
hmEi
fmax.g
測定周波数
Measuring
frequency
hMHzi
インピーダンス
Impedance
hEi
M25L
BKP1005
BKP1005 HS 121
BKP1608 HS 330
BKP1608 HS 600
BKP1608 HS 101
BKP1608 HS 181
BKP1608 HS 271
BKP1608 HS 391
BKP2125 HS 330
BKP2125 HS 600
BKP2125 HS 101
BKP2125 HS 221
251
FERRITE PRODUCTS
5
特性図 ELECTRICAL CHARACTERISTICS
BKP1608
500
250
0
1 10 100 1000
BKP1608 HS101
500
250
0
1 10 100 1000
BKP1608 HS181
500
250
01 10 100 1000
BKP1608 HS271
500
250
0
1 10 100 1000
BKP1608 HS391
100
50
0
1 10 100 1000
BKP1608 HS600
100
50
0
1 10 100 1000
BKP1608 HS330
BKP1005
500
250
0
1 10 100 1000
BKP1005 HS121
252
特性図 ELECTRICAL CHARACTERISTICS
BKP2125
500
250
0
1 10 100 1000
BKP2125 HS101
500
250
0
1 10 100 1000
BKP2125 HS221
100
50
0
1 10 100 1000
BKP2125 HS600
100
50
0
1 10 100 1000
BKP2125 HS330
254
BK 32164S601_TZ
1 2 3 4 5 6
形名表記法 ORDERING CODE
用途 APPLICATIONS
特長 FEATURES
Y周波数特性、インピーダンス値を幅広いバリエーションで用意しているた
め、各種ノイズを対策可能
Y1チップで4ラインの対策が可能になり、より高密度、高効率な実装を実現
Y各回路間のクロストークや、チップの発熱を極力抑制
YAvailable in a wide range of frequency characteristics and impedance val-
ues providing excellent suppression of various noise.
Y4 line action in one chip is available for mounting with higher density and
efficiency.
YHeat generation and crosstalk between adjacent circuits is minimized.
積層ハイロスインダクタアレイ
MULTILAYER FERRITE CHIP BEAD ARRAY
BK ARRAY SERIES
OPERATING TEMP. K55VJ125C
BK
積層ハイロスインダクタ
YWaveform correction in personal computers, word processors, printers and
facsimile signal lines, and provides radiated noise countermeasures in in-
terfaces and harness connecting parts.
YPrevents noise intrusion in videos, car audio, etc.
Yノートパソコン、液晶モジュール等、小形軽量の携帯機器に於ける発生源
対策Y輻射ノイズ対策
Yインターフェイス、ハーネス接続部での輻射ノイズ対策
1
形式
2
形状寸法fLPWghmmi
材質記号
4W
4S
4M
4L
4
公称インピーダンス [E]
例
601 600
102 1000
包装
KTリールテーピング
当社管理記号
BK
Multilayer ferrite chip beads
1
Type
2
External DimensionfLPWg[mm]
3
Material
4W
4S
4M
4L
4
Nominal Impedance [E]Packaging
KT Tape&Reel
5
example
601 600
102 1000
材質によりインピー
ダンス特性が異なる
Refer to impedance
curves for material
difference
3
2010f0804g2.0P1.0
3216 f1206g3.2P1.6
56
Q 標準品
QW スペース
2010 f0804g2.0P1.0
3216 f1206g3.2P1.6
Internal code
6
QStandard Products
QWBlank Space
255
FERRITE PRODUCTS
5
概略バリエーション AVAILABLE MATERIALS
外形寸法 EXTERNAL DIMENSIONS
UnitDmmfinchg
P.256 P.257 P.260 P.262 P.270P.10
アイテム一覧
Part Numbers
特性図
Electrical Characteristics
梱包
Packaging
信頼性
Reliability Data
使用上の注意
Precautions
セレクションガイド
Selection Guide
etc
BK2010
BK3216
LW TE1E2P
2.0M0.15 1.0M0.15 0.45M0.05 0.25 0.25M0.15 0.5M0.1
f0.079M0.006gf0.039M0.006gf0.018M0.002gf0.010 gf0.010M0.006gf0.020M0.004g
3.2M0.2 1.6M0.2 0.8M0.1 0.35M0.2 0.3M0.2 0.8M0.1
f0.126M0.008gf0.063M0.008gf0.031M0.004gf0.014M0.008gf0.012M0.008gf0.031M0.004g
Material
4W, 4S,4M
4L
4W, 4S, 4M,
4L
J0.15
K0.1
J0.006
K0.004
Type
BK2010
f0804g
BK3216
(1206)
4S type
256
アイテム一覧 PART NUMBERS
BK3 2 1 6 4W12 1
BK3 2 1 6 4W24 1
BK3 2 1 6 4W43 1
BK3 2 1 6 4W60 1
BK3216 4S600
BK3216 4S121
BK3216 4S241
BK3216 4S471
BK3216 4S601
BK3216 4S102
BK3216 4M121
BK3216 4M241
BK3216 4M301
BK3216 4M471
BK3216 4M601
BK3216 4M102
BK3216 4L680
BK3216 4L121
BK3216 4L181
BK3216 4L241
120 0.15 100
240 0.25 100
430 0.35 100
600 0.40 100
60 0.18 200
120 0.18 200
240 0.30 200
470 0.40 200
600 0.45 200
1000 100 0.68 100
120 0.20 150
240 0.35 150
300 0.45 150
470 0.50 150
600 0.60 100
1000 0.80 100
68 0.35 200
120 0.55 200
180 0.65 150
240 0.75 150
形名
Ordering code
インピーダンス
Impedance
hEiM25L
定格電流
Rated current
hmAi fmax.g
測定周波数
Measuring Frequency
hMHzi
直流抵抗
DC Resistance
hEi fmax.g
BK2010
BK3216
BK2010 4W680
BK2010 4W121
BK2010 4W241
BK2010 4S121
BK2010 4S241
BK2010 4S431
BK2010 4S601
BK2010 4M121
BK2010 4M241
BK2010 4M431
BK2010 4M601
BK2010 4L050
BK2010 4L100
BK2010 4L220
BK2010 4L330
BK2010 4L470
BK2010 4L680
BK2010 4L121
BK2010 4L181
68 0.35
120 0.40
240 0.50
120 0.30
240 0.45
430 0.55
600
100 100
0.70
120
240
430
600
5
10
22
33
47
68
120
0.30
0.45
0.55
0.70
0.10
0.10
0.20
0.30
0.40
0.50
0.70
形名
Ordering code
インピーダンス
Impedance
hEiM25L
定格電流
Rated current
hmAi fmax.g
測定周波数
Measuring Frequency
hMHzi
直流抵抗
DC Resistance
hEi
fmax.g
180 0.90
257
FERRITE PRODUCTS
5
特性図 ELECTRICAL CHARACTERISTICS
250
500
250
500
BK2010 4W241
500
400
300
200
100
BK2010 4S121
BK2010 4M121
BK2010 4W121
BK2010 4M241 BK2010 4M431
500
400
300
200
100
BK2010 4S241
1000
800
600
400
200
BK2010 4S431
1000
800
600
400
200
BK2010 4S601
BK2010 4L050
50
1 10 100 1000 10000
100
BK2010 4L100
50
1 10 100 1000 10000
100
BK2010 4L220
100
1 10 100 1000 10000
200
BK2010 4L330
250
1 10 100 1000 10000
500
BK2010 4L470
250
1 10 100 1000 10000
500
BK2010 4M601
1000
2000
BK2010
258
特性図 ELECTRICAL CHARACTERISTICS
BK3216
259
FERRITE PRODUCTS
5
特性図 ELECTRICAL CHARACTERISTICS
260
梱包 PACKAGING
CK 2125
LK 1005
LK 1608
LK 2125
BK 0603
BK 1005
BK 1608
BK 2125
HK 0603
HK 1005
HK 1608
BK 2010
B K P 1608
B K P 1005
B K P 2125
0.85 4000 E
CK2125f0805gf0.033g
1.25 E2000
f0.049g
LK1005f0603g0.5 10000 E
f0.020g
LK1608f0603g0.8 4000 E
f0.031g
0.85 4000 E
LK2125f0805gf0.033g
1.25 E2000
f0.049g
HK0603f0201g0.3 15000 E
f0.012g
HK1005f0402g0.5 10000 E
f0.020g
HK1608f0603g0.8 4000 E
f0.031g
0.85 E4000
HK2125f0805gf0.033g
1.0 E3000
f0.039g
BK0603f0201g0.3 15000 E
f0.012g
BK1005f0402g0.5 10000 E
f0.020g
BK1608f0603g0.8 4000 E
f0.031g
0.85 4000 E
BK2125f0805gf0.033g
1.25 E2000
f0.049g
BK2010f0804g0.45 4000 E
f0.018g
BK3216f1206g0.8 E4000
f0.031g
BKP1005f0402g0.5 10000 E
f0.020g
BKP1608f0603g0.8 4000 E
f0.031g
BKP2125f0805g0.85 4000 E
f0.033g
CK 2125
LK 2125
BK 2125
BK 3216
HK 2125
2テーピング材質 Taping material
1最小受注単位数 Minimum Quantity
Fテーピング梱包 Tape & Reel Packaging
標準数量[pcs]
Standard Quantity
紙テープ エンボステープ
Paper Tape Embossed Tape
形 式
Type
製品厚み
Thickness
[mm]
finchg
261
梱包 PACKAGING
FERRITE PRODUCTS
5
CK2125f0805g1.25 1.5M0.2 2.3M0.2 4.0M0.1 2.0 0.3
f0.049g
f0.059M0.008gf0.091M0.008gf0.157M0.004g
f0.079gf0.012g
LK2125f0805g1.25 1.5M0.2 2.3M0.2 4.0M0.1 2.0 0.3
f0.049g
f0.059M0.008gf0.091M0.008gf0.157M0.004g
f0.079gf0.012g
0.85 1.5
HK2125f0805gf0.033g1.5M0.2 2.3M0.2 4.0M0.1
f0.059g
0.3
1.0
f0.059M0.008g f0.091M0.008g f0.157M0.004g
2.0
f0.012g
f0.039g
f0.079g
BK2125f0805g1.25 1.5M0.2 2.3M0.2 4.0M0.1 2.0 0.3
f0.049g
f0.059M0.008g f0.091M0.008g f0.157M0.004g
f0.079gf0.012g
BK3216f1206g0.8 1.9M0.1 3.5M0.1 4.0M0.1 1.4 0.3
f0.031g
f0.075M0.004g f0.138M0.004g f0.157M0.004g
f0.055g
f0.012g
Y紙テープ（8mm幅）
4リーダ部・空部 LEADER AND BLANK PORTION
5リール寸法 Reel Size
3テーピング寸法 Taping Dimensions
Paper tape (0.315 inches wide)
6トップテープ強度 Top tape strength
トップテープの剥離力は、下図矢印方向にて0.1〜0.7Nとなります。
The top tape requires a peel-off force of 0.1V0.7N in the direction of
the arrow as illustrated below.
Unit : mm (inch)
Unit : mm (inch)
テープ厚みmax.
Tape Thickness
KT
挿入ピッチ
Insertion Pitch
F
形 式
Type
チップ挿入部
Chip cavity
AB
製品厚み
Chip Thickness
Yエンボステープ（8mm幅） Embossed Tape (0.312 inches wide)
製品 チップ挿入部
挿入ピッチ テープ厚み
厚み Chip cavity
Insertion Pitch
Tape Thickness
Chip Thickness
ABFT
CK2125f0805g
0.85 1.5M0.2 2.3M0.2 4.0M0.1 1.1max
f0.033gf0.059M0.008gf0.091M0.008g
f0.157M0.004g
f0.043maxg
LK1005f0402g
0.5 0.65M0.1 1.15M0.1 2.0M0.05 0.8max
f0.020gf0.026M0.004gf0.045M0.004g
f0.079M0.002g
f0.031maxg
LK1608f0603g
0.8 1.0M0.2 1.8M0.2 4.0M0.1 1.1max
f0.031gf0.039M0.008gf0.071M0.008gf0.157M0.004g
f0.043maxg
LK2125f0805g
0.85 1.5M0.2 2.3M0.2 4.0M0.1 1.1max
f0.033gf0.059M0.008gf0.091M0.008g f0.157M0.004g
f0.043maxg
HK0603(2010)
0.3 0.40M0.06 0.70M0.06 2.0M0.05 0.45max
f0.012gf0.016M0.002gf0.028M0.002g f0.079M0.002gf0.018maxg
HK1005f0402g
0.5 0.65M0.1 1.15M0.1 2.0M0.05 0.8max
f0.020gf0.026M0.004gf0.045M0.004g f0.079M0.002g f0.031maxg
HK1608f0603g
0.8 1.0M0.2 1.8M0.2 4.0M0.1 1.1max
f0.031gf0.039M0.008gf0.071M0.008gf0.157M0.004g f0.043maxg
BK0603f0201g
0.3 0.40M0.06 0.70M0.06 2.0M0.05 0.45max
f0.012gf0.016M0.002gf0.028M0.002g f0.079M0.002gf0.020maxg
BK1005f0402g
0.5 0.65M0.1 1.15M0.1 2.0M0.05 0.8max
f0.020gf0.026M0.004gf0.045M0.004gf0.079M0.002gf0.031maxg
BK1608f0603g
0.8 1.0M0.2 1.8M0.2 4.0M0.1 1.1max
f0.031gf0.039M0.008gf0.071M0.008g
f0.157M0.004g
f0.043maxg
BK2125f0805g
0.85 1.5M0.2 2.3M0.2 4.0M0.1 1.1max
f0.033gf0.059M0.008gf0.091M0.008g
f0.157M0.004g
f0.043maxg
BK2010f0804g
0.45 1.2M0.1 2.17M0.1 4.0M0.1 0.80max
f0.018gf0.047M0.004g f0.085M0.004g
f0.157M0.004g
f0.031maxg
BKP1005f0402g
0.5 0.65M0.1 1.15M0.1 2.0M0.05 0.8max
f0.020gf0.026M0.004gf0.045M0.004gf0.079M0.002gf0.031maxg
BKP1608f0603g
0.8 1.0M0.2 1.8M0.2 4.0M0.1 1.1max
f0.031gf0.039M0.008g f0.071M0.008g
f0.157M0.004g
f0.043maxg
BKP2125f0805g
0.85 1.5M0.2 2.3M0.2 4.0M0.1 1.1max
f0.033gf0.059M0.008g f0.091M0.008g
f0.157M0.004g
f0.043maxg
形 式
Type
263
FERRITE PRODUCTS
5
300mA
DC
300mA
DC
Specified Value
LK Series:
Measuring frequency: 10 to 25 MHz (LK1005)
CK Series:
Measuring frequency: 2 to 25 MHz (CK2125)
Measuring frequency: 1 to 50 MHz (LK1608)
Measuring frequency: 0.4 to 50MHz (LK2125)
Measuring equipment, jig:
HP4194A + 16085B + 16092A (or its equivalent)
HP4195A + 41951 + 16092A (or its equivalent)
HP4294 + 16192A
HP4291A + 16193A (LK1005)
Measuring current:
1mA rms (0.047 to 4.7AH)
0.1mA rms (5.6 to 33AH)
HK Series:
Measuring frequency:
100MHz (HK0603, HK1005)
Measuring frequency:
50 / 100MHz (HK1608, 2125)
Measuring equipment, jig:
HP4291A + 16193A (HK1005)
HP4291A + 16197A (HK0603)
HP4195A + 16092A + in-house made jig
(HK1608, 2125)
BKP1608BKP1005
LK1608BK2125
BK3216
BK1005BK0603 BK1608
150 V
1000mA
DC
10V
1000E
M25L
100V
200mA
DC
68V
1000E
M25L
150V
200mA
DC
10V
M25L
33V
390E
M25L
120E
M25L
33V
220E240E
M25L
200 V
1200mA
DC
15V
2500E
M25L
0.047V
33.0AH
DM20L
0.10V
12.0AH
DM10L
0.12V
2.2AH
DM10L
0.1V
10.0AH
DM20L
1.5V5.6nH
DM0.3nH
6.8 V470nH
DM5L
1.0V5.6nH
DM0.3nH
6.8V56nH
DM5L
150 V
1500mA
DC
22V
2500E
M25L
BB
K55VJ125C
K55VJ125C
BK2010
100mA
DC
5V
600E
M25L
HK2125HK1608
K40V
J85C
J85C
K40V
K55VJ85C
K55VJ85C
CK2125 LK1005 HK0603 HK1005
K40VJ85C
K40VJ85C
K40VJ85C
K40VJ85CK55VJ125C
K55VJ125C
150V
300mA
DC
50V
250mA
DC
5V
300mA
DC
60V
500mA
DC
10V
25mA
DC
1V
50mA
DC
1.0V
3.0A
DC
1.0A
DC
2.0V
4.0A
DC
BKP2125
LK2125
0.047V
33.0AH
DM20L
0.10V
12.0AH
DM10L
BB BB BB BB BB BB BB BB
Item
1.Operating
Temperature
Range
2.Storage Tem-
perature Range
3.Rated Current
4.Impedance
ARRAY
BK1005 Series:
Measuring frequency: 100M1MHz
Measuring equipment: HP4291A
Measuring jig: 16192A, 16193A
BK0603 Series:
Measuring frequency: 100M1MHz
Measuring equipment: HP4291A
Measuring jig: 16193A
BK1608, 2125 Series:
BKP1608, 2125 Series:
BKP1005 Series:
Measuring frequency: 100M1MHz
Measuring equipment: HP4291A, 4195A
Measuring jig: 16092A or 16192A (HW)
BK2010, 3216 Series:
Measuring frequency: 100M1MHz
Measuring equipment: HP4291A,4195A
Measuring jig: 16192A
5. Inductance
Test Methods and Remarks
1.0V5.6nH
DM0.3nH
6.8 V120nH
DM5L
1.0V5.6nH
DM0.3nH
6.8 V220nH
DM5L
RELIABILITY DATA 1/4
Multilayer chip inductors and beads
* Definition of rated current : In the CK and BK Series, the rated current is the value of current at which the temperature of the element is increased within 20C.
In the BK Series P type, the rated current is the value of current at which the temperature of the element is increased within 40C.
In the LK and HK Series, the rated current is either the DC value at which the internal L value is decreased within 5% with the application of DC bias, or the value of
current at which the temperature of the element is increased within 20C.
265
FERRITE PRODUCTS
5
BKP1608BKP1005
LK1608BK2125
BK3216
BK1005BK0603 BK1608
BB
BK2010
HK2125HK1608CK2125 LK1005 HK0603 HK1005
BKP2125
LK2125
10V18
min.
8V12
min.
8min.5min.15V50
min.
15V20
min.
6.Q
10V35
min.
10V20
min.
Specified Value
Item
ARRAY Test Methods and Remarks
LK Series:
Measuring frequency: 10 to 25 MHz (LK1005)
CK Series:
Measuring frequency: 2 to 25 MHz (CK2125)
Measuring frequency: 1 to 50 MHz (LK1608)
Measuring frequency: 0.4 to 50MHz (LK2125)
Measuring equipment, jig:
HP4194A + 16085B + 16092A
HP4195A + 41951 + 16092A
HP4294 + 16192A
HP4291A + 16193A (LK1005)
(or its equivalent)
(or its equivalent)
Measuring current:
1mA rms (0.047 to 4.7AH)
0.1mA rms (5.6 to 33AH)
HK Series:
Measuring frequency:
100MHz (HK0603
,
HK1005)
Measuring frequency:
50 / 100MHz (HK1608
,
2125)
Measuring equipment, jig:
HP4291A + 16193A
(
HK1005)
HP4291A + 16197A
(
HK0603)
HP4195A + 16092A + in-house made jig
0.005V
0.80E
max.
0.40V
0.80E
max.
0.05V
1.10E
max.
0.05V
0.75E
max.
0.01V
0.70E
max.
0.15V
0.80E
max.
0.025V
0.140E
max.
0.140E
max.
0.020V
0.050E
max.
0.16V
0.65E
max.
0.7V
1.70E
max.
0.3V
2.95E
max.
0.20V
1.25E
max.
0.14V
3.0E
max.
0.08V
1.6E
max.
0.10V
1.5E
max.
0.05V
1.5E
max.
400V
10000MHz
min.
1300V
10000MHz
min.
40V
180MHz
min.
24V
235MHz
min.
9V
260MHz
min.
13V
320MHz
min.
200V
4000MHz
min.
600V
10000MHz
min.
Inductance change:
Within M10%
7.DC Resistance
8.
Self Resonance
Frequency(SRF)
9.Temperature
Characteristic
10. Resistance to
Flexure of
Substrate
No
mechanical
damage.
BB
BB
BB
Measuring equipment: VOAC-7412
(made by Iwasaki Tsushinki)
YVOAC K7512fmade by Iwasaki Tsushinkig
LK Series:
Measuring equipment: HP4195A
Measuring jig: 41951 + 16092A
(or its equivalent)
HK Series:
Measuring equipment: HP8719C
YHP8753DfHK2125g
HK Series:
Temperature range: -30 to +85C
Reference temperature: +20C
Warp: 2mm
Testing board: glass epoxy-resin substrate
Thickness: 0.8mm
(HK1608, 2125)
RELIABILITY DATA 2/4
Multilayer chip inductors and beads
267
FERRITE PRODUCTS
5
RELIABILITY DATA 3/4
(Note 1) When there are questions concerning
mesurement resultDmeasurement shall be made
after 48M2 hrs of recovery under
the standard condition.
Multilayer chip inductors and beads
BKP1608BKP1005
LK1608BK2125
BK3216
BK1005BK0603 BK1608
BK2010
HK2125HK1608CK2125 LK1005 HK0603 HK1005
BKP2125
LK2125
Specified Value
Item
ARRAY Test Methods and Remarks
At least 75% of terminal elec-
trode is covered by new solder.
No mechanical damage.
Remaining terminal electrode: 70% min.
No mechanical damage.
Inductance change: Within
M10%
Q change: Within M20%
At least 75% of terminal electrode is covered by new solder.
Appearance: No significant abnormality
Impedance change: Within M30%
Appearance: No significant abnormality
Impedance change: Within M30%
11.Solderability
12.Resistance to
Soldering
13.Thermal Shock
Solder temperature: 230M5C
Duration: 4M1 sec.
Solder temperature: 260M5C
Duration: 10M0.5 sec.
Preheating temperature: 150C
Preheating time: 3 min.
Recovery: 2 to 3 hrs of recovery under the stan-
dard condition after the test. (See Note 1)
Flux: Immersion into methanol solution with
colophony for 3 to 5 sec.
Conditions for 1 cycle
step 1: Minimum operating temperature
J
0/
K
3
C
30M3 min.
step 2: Room temperature 2 to 3min.
step 3: Minimum operating temperature
J
0/
K
3
C
30M3 min.
step 4: Room temperature 2 to 3min.
Number of cycles: 5
Recovery: 2 to 3 hrs of recovery under the stan-
dard condition after the test. (See Note 1)
No
mechanical
damage.
Inductance
change:
Within
M20%
Qchange:
Within
M30%
269
FERRITE PRODUCTS
5
BKP1608BKP1005
LK1608BK2125
BK3216
BK1005BK0603 BK1608
BK2010
HK2125HK1608CK2125 LK1005 HK0603 HK1005
BKP2125
LK2125
Specified Value
Item
ARRAY Test Methods and Remarks
14. Damp Heat
fSteady stateg
15.Loading under
Damp Heat
16.Loading at
High
Temperature
No mechanical damage.
Inductance change: Within M10%
Inductance change: Within M10%
Inductance change: Within M10%
Q change: Within M20%
No mechanical damage.
Q change: Within M20%
No mechanical damage.
Q change: Within M20%
No
mechanical
damage.
Inductance
change:
Within
M20%
Q change:
Within
M30%
No
mechanical
damage.
Inductance
change:
Within
M10%
Q change:
Within
M30%
No
mechanical
damage.
Inductance
change:
Within
M20%
Q change:
Within
M30%
BK Series:
Temperature: 40M2C
Humidity: 90 to 95%RH
Duration: 500 hrs
Recovery: 2 to 3 hrs of recovery under the
standard condition after the removal
fro test chamber.fSee Note1g
LK, HK Series:
Temperature: 40M2C (LK Series)
60M2C (HK Series)
Humidity: 90 to 95%RH
Duration: 500M12 hours
Recovery: 2 to 3 hrs of recovery under the
standard condition after the removal
from test chamber.
standard condition after the removal
from test chamber.
BK Series:
Temperature: 40M2C (LK Series)
Humidity: 90 to 95%RH
Duration: 500 hrs
Applied current: Rated current
Recovery: 2 to
to
3 hrs of recovery under the
fSee Note1g
standard condition after the removal
from test chamber.
2 to 3 hrs of recovery under the
fSee Note1g
standard condition after the removal
from test chamber.
3 hrs of recovery under the
LK, HK Series:
Temperature: 40M2C (LK Series)
60M2C (HK Series)
Humidity: 90 to 95%RH
Duration: 500M12 hrs
Applied current: Rated current
Recovery: 2
BK Series:
Temperature: 125M3C
Applied current: Rated current
Duration: 500 hrs
Recovery:
LK, HK Series:
Temperature: 85M2C (LK Series)
: 85M2C (HK 1608, 2125)
: 85M2C (HK 1005 operating
temperature range
K
55 to J85C)
: 125M2C (HK 0603, HK1005
operating temperature range
K55 to
J
125C)
Applied current: Rated current
Duration: 500M12 hrs
Recovery: 2 to 3 hrs of recovery under the
standard condition after the removal
from test chamber.
+24
K
0
Appearance: No significant abnormality
Impedance change: Within M30%
Appearance: No significant abnormality
Impedance change: Within M30%
No mechanical damage, Inductance changeD
withinM30L
+24
K
0
+24
K
0
No
mechanical
damage.
Inductance
change:
0.047 to
12.0AH:
Within
M10%
15.0 to
33.0AH:
Within
M15%
Q change:
Within
M30%
No
mechanical
damage.
Inductance
change:
Within
M20%
Q change:
Within
M30%
No
mechanical
damage.
Inductance
change:
Within
M10%
Q change:
Within
M30%
No
mechanical
damage.
Inductance
change:
Within
M20%
Q change:
Within
M30%
No
mechanical
damage.
Inductance
change:
0.047 to
12.0AH:
Within
M10%
15.0 to
33.0AH:
Within
M15%
Q change:
Within
M30%
No
mechanical
damage.
Inductance
change:
Within
M20%
Qchange:
Within
M30%
No
mechanical
damage.
Inductance
change:
Within
M20%
Qchange:
Within
M30%
No
mechanical
damage.
Inductance
change:
Within
M10%
Qchange:
Within
M30%
RELIABILITY DATA 4/4
Multilayer chip inductors and beads
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35C of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20M2C of temperature, 65 to 70% relative humidity,
and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."
(Note 1)
measurement shall be made after 48M2 hrs of re-
covery under the standard condition.
PRECAUTIONS
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1/7
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
1. Circuit Design SVerification of operating environment, electrical rating
and performance
1. A malfunction in medical equipment, spacecraft,
nuclear reactors, etc. may cause serious harm to
human life or have severe social ramifications. As
such, any inductors to be used in such equipment may
require higher safety and/or reliability considerations
and should be clearly differentiated from components
used in general purpose applications.
SOperating Current (Verification of Rated current)
1. The operating current for inductors must always be
lower than their rated values.
2. Do not apply current in excess of the rated value
because the inductance may be reduced due to the
magnetic saturation effect.
Technical considerationsStages Precautions
2. PCB Design SPattern configurations
(Design of Land-patterns)
1. When inductors are mounted on a PCB, the amount of
solder used (size of fillet) can directly affect inductor
performance. Therefore, the following items must be
carefully considered in the design of solder land pat-
terns:
(1) The amount of solder applied can affect the ability of
chips to withstand mechanical stresses which may lead
to breaking or cracking. Therefore, when designing
land-patterns it is necessary to consider the appropri-
ate size and configuration of the solder pads which in
turn determines the amount of solder necessary to form
the fillets.
(2) When more than one part is jointly soldered onto the
same land or pad, the pad must be designed so that
each component's soldering point is separated by sol-
der-resist.
1. The following diagrams and tables show some examples of recommended
patterns to prevent excessive solder amounts (larger fillets which extend above
the component end terminations). Examples of improper pattern designs are
also shown.
(1) Recommended land dimensions for a typical chip inductor land patterns for
PCBs
Type 0603 1005 1608 2125
L 0.6 1.0 1.6 2.0
W 0.3 0.5 0.8 1.25
A 0.20V0.30 0.45V0.55 0.6V0.8 0.8V1.2
B 0.20V0.30 0.40V0.50 0.6V0.8 0.8V1.2
C 0.25V0.40 0.45V0.55 0.6V0.8 0.9V1.6
Recommended land dimensions for reflow-soldering (unit: mm)
Type 1608 2125
L1.6 2.0
W 0.8 1.25
A0.8V1.0 1.0V1.4
B0.5V0.8 0.8V1.5
C0.6V0.8 0.9V1.2
Size Size
Excess solder can affect the ability of chips to withstand mechanical stresses.
Therefore, please take proper precautions when designing land-patterns.
Recommended land dimensions for wave-soldering (unit: mm)
Recommended land
dimension for
wave-soldering (unit: mm)
3216 2010
L3.2 2.0
W1.6 1.0
a 0.7V0.9 0.5V0.6
b 0.8V1.0 0.5V0.6
c 0.4V0.5 0.2V0.3
d0.80.5
Size
PRECAUTIONS
273
FERRITE PRODUCTS
5
(2) Examples of good and bad solder application
Not recommended Recommended
2.PCB Design
Not recommended Recommended
Deflection of
the board
Mixed mounting
of SMD and
leaded compo-
nents
Component
placement close
to the chassis
Hand-soldering
of leaded com-
ponents near
mounted compo-
nents
Horizontal com-
ponent place-
ment
SPattern configurations
(Inductor layout on panelized [breakaway] PC boards)
1. After inductors have been mounted on the boards, chips
can be subjected to mechanical stresses in subsequent
manufacturing processes (PCB cutting, board inspec-
tion, mounting of additional parts, assembly into the
chassis, wave soldering the reflow soldered boards etc.)
For this reason, planning pattern configurations and
the position of SMD inductors should be carefully per-
formed to minimize stress.
1-1. The following are examples of good and bad inductor layout; SMD inductors
should be located to minimize any possible mechanical stresses from board
warp or deflection.
Item
1-2. To layout the inductors for the breakaway PC board, it should be noted that
the amount of mechanical stresses given will vary depending on inductor
layout. An example below should be counted for better design.
1-3. When breaking PC boards along their perforations, the amount of mechani-
cal stress on the inductors can vary according to the method used. The
following methods are listed in order from least stressful to most stressful:
push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor
layout must also consider the PCB splitting procedure.
2/7
Stages Precautions Technical considerations
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
PRECAUTIONS
275
FERRITE PRODUCTS
5
3/7
Technical considerationsStages Precautions
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed
on the inductors, causing damage. To avoid this, the following points should
be considered before lowering the pick-up nozzle:
(1)The lower limit of the pick-up nozzle should be adjusted to the surface level of
the PC board after correcting for deflection of the board.
(2)The pick-up pressure should be adjusted between 1 and 3 N static loads.
(3)To reduce the amount of deflection of the board caused by impact of the pick-
up nozzle, supporting pins or back-up pins should be used under the PC board.
The following diagrams show some typical examples of good pick-up nozzle
placement:
Improper method Proper method
2. As the alignment pin wears out, adjustment of the nozzle height can cause
chipping or cracking of the inductors because of mechanical impact on the
inductors. To avoid this, the monitoring of the width between the alignment pin
in the stopped position, and maintenance, inspection and replacement of the
pin should be conducted periodically.
SSelection of Adhesives
1. Mounting inductors with adhesives in preliminary as-
sembly, before the soldering stage, may lead to de-
graded inductor characteristics unless the following
factors are appropriately checked; the size of land pat-
terns, type of adhesive, amount applied, hardening tem-
perature and hardening period. Therefore, it is impera-
tive to consult the manufacturer of the adhesives on
proper usage and amounts of adhesive to use.
1. Some adhesives may cause reduced insulation resistance. The difference
between the shrinkage percentage of the adhesive and that of the inductors
may result in stresses on the inductors and lead to cracking. Moreover, too
little or too much adhesive applied to the board may adversely affect compo-
nent placement, so the following precautions should be noted in the applica-
tion of adhesives.
(1)Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the
mounting & solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
3.Considerations for
automatic placement
SAdjustment of mounting machine
1. Excessive impact load should not be imposed on the
inductors when mounting onto the PC boards.
2. The maintenance and inspection of the mounter should
be conducted periodically.
Double-sided
mounting
Single-sided mounting
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
PRECAUTIONS
277
FERRITE PRODUCTS
5
3.Considerations for
automatic placement
4.Soldering SSelection of Flux
1. Since flux may have a significant effect on the perfor-
mance of inductors, it is necessary to verify the follow-
ing conditions prior to use;
(1)Flux used should be with less than or equal to 0.1 wt%
(Chlorine conversion method) of halogenated content.
Flux having a strong acidity content should not be ap-
plied.
(2)When soldering inductors on the board, the amount of
flux applied should be controlled at the optimum level.
(3)When using water-soluble flux, special care should be
taken to properly clean the boards.
SSoldering
Temperature, time, amount of solder, etc. are specified in
accordance with the following recommended conditions.
1-1. When too much halogenated substance (Chlorine, etc.) content is used to
activate the flux, or highly acidic flux is used, an excessive amount of resi-
due after soldering may lead to corrosion of the terminal electrodes or deg-
radation of insulation resistance on the surface of the Inductor.
1-2. Flux is used to increase solderability in flow soldering, but if too much is
applied, a large amount of flux gas may be emitted and may detrimentally
affect solderability. To minimize the amount of flux applied, it is recom-
mended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in
the air, the residue on the surface of Inductor in high humidity conditions
may cause a degradation of insulation resistance and therefore affect the
reliability of the components. The cleaning methods and the capability of the
machines used should also be considered carefully when selecting water-
soluble flux.
1-1. Preheating when soldering
Heating: Chip inductor components should be preheated to within 100 to
130C of the soldering. Cooling: The temperature difference between the
components and cleaning process should not be greater than 100 C.
Chip inductors are susceptible to thermal shock when exposed to rapid or
concentrated heating or rapid cooling. Therefore, the soldering process
must be conducted with a great care so as to prevent malfunction of the
components due to excessive thermal shock.
Technical considerationsStages Precaution
4/7
Figure 0805 case sizes as examples
a 0.3mm min
b 100 V120 Am
c Area with no adhesive
When using adhesives to mount inductors on a PCB, inappropriate amounts of
adhesive on the board may adversely affect component placement. Too little
adhesive may cause the inductors to fall off the board during the solder process.
Too much adhesive may cause defective soldering due excessive flow of adhe-
sive on to the land or solder pad.
[Recommended conditions]
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
PRECAUTIONS
279
FERRITE PRODUCTS
5
5/7
Stages Precautions Technical considerations
4.Soldering Recommended conditions for soldering
[Reflow soldering]
Temperature profile
2. Because excessive dwell times can detrimentally affect solderability, sol-
dering duration should be kept as close to recommended times as pos-
sible.
[Wave soldering]
Temperature profile
Caution
1. The ideal condition is to have solder mass (fillet) controlled to 1/2 to 1/3 of
the thickness of the inductor, as shown below:
Caution
1. Make sure the inductors are preheated sufficiently.
2. The temperature difference between the inductor and melted solder should
not be greater than 100 to 130C
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the inductors designated as for reflow
soldering only.
[Hand soldering]
Temperature profile
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the inductor.
SCleaning conditions
1. When cleaning the PC board after the Inductors are all
mounted, select the appropriate cleaning solution ac-
cording to the type of flux used and purpose of the
cleaning (e.g. to remove soldering flux or other materi-
als from the production process.)
1. The use of inappropriate solutions can cause foreign substances such as flux
residue to adhere to the inductor, resulting in a degradation of the inductor's
electrical properties (especially insulation resistance).
5.Cleaning
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
SAnd please contact us about peak temperature when
you use lead-free paste.
PRECAUTIONS
281
FERRITE PRODUCTS
5
Technical considerationsStages Precautions
6/7
2. Cleaning conditions should be determined after verify-
ing, through a test run, that the cleaning process does
not affect the inductor's characteristics.
2. Inappropriate cleaning conditions (insufficient or excessive cleaning) may
detrimentally affect the performance of the inductors.
(1)Excessive cleaning
In the case of ultrasonic cleaning, too much power output can cause
excessive vibration of the PC board which may lead to the cracking of the
inductor or the soldered portion, or decrease the terminal electrodes' strength.
Thus the following conditions should be carefully checked;
Ultrasonic output Below 20 w/b
Ultrasonic frequency Below 40 kHz
Ultrasonic washing period 5 min. or less
5.Cleaning
7. Handling SBreakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting inductors
and other components, care is required so as not to
give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by
using the appropriate devices.
SGeneral handling precautions
1. Always wear static control bands to protect against ESD.
2. Keep the inductors away from all magnets and mag-
netic objects.
3. Use non-magnetic tweezers when handling inductors.
4. Any devices used with the inductors (soldering irons,
measuring instruments) should be properly grounded.
5. Keep bare hands and metal products (i.e., metal desk)
away from chip electrodes or conductive areas that lead
to chip electrodes.
6. Keep inductors away from items that generate mag-
netic fields such as speakers or coils.
SMechanical considerations
1. Be careful not to subject the inductors to excessive
mechanical shocks.
(1) If inductors are dropped on the floor or a hard surface
they should not be used.
(2)When handling the mounted boards, be careful that
the mounted components do not come in contact with
or bump against other boards or components.
SApplication of resin coatings, moldings, etc. to the PCB
and components.
1. With some type of resins a decomposition gas or chemi-
cal reaction vapor may remain inside the resin during
the hardening period or while left under normal storage
conditions resulting in the deterioration of the inductor's
performance.
2. When a resin's hardening temperature is higher than
the inductor's operating temperature, the stresses gen-
erated by the excess heat may lead to inductor dam-
age or destruction.
3. Stress caused by a resin’s temperature generated ex-
pansion and contraction may damage inductors.
The use of such resins, molding materials etc. is not rec-
ommended.
6. Post cleaning processes
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
PRECAUTIONS
283
FERRITE PRODUCTS
5
7/7
8. Storage conditions 1. If the parts are stocked in a high temperature and humidity environment, prob-
lems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place. For this rea-
son, components should be used within 6 months from the time of delivery. If
exceeding the above period, please check solderability before using the in-
ductors
SStorage
1. To maintain the solderability of terminal electrodes and
to keep the packaging material in good condition, care
must be taken to control temperature and humidity in
the storage area. Humidity should especially be kept
as low as possible.
Recommended conditions
Ambient temperature Below 40 C
Humidity Below 70% RH
The ambient temperature must be kept below 30 C. Even
under ideal storage conditions inductor electrode solder-
ability decreases as time passes, so inductors should be
used within 6 months from the time of delivery.
*The packaging material should be kept where no chlo-
rine or sulfur exists in the air.
Technical considerationsStages Precautions
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
形名表記法 ORDERING CODE
用途 APPLICATIONS
284
特長 FEATURES
FBMJ3216HS800_TZ
65 7 84321 9
FB
フェライトビーズインダクタ
電源部で使用可能
Y耐大電流f定格電流6Ag
Y耐高エネルギー
Y高信頼性
FBMJタイプは様々なバリエーションをラインナップ
HS ：広帯域対応
HM：高帯域対応
HL ：GHz対応
FBMHタイプは、電源ラインのケーブル輻射ノイズ等、高インピーダンス、
大電流を要する回路に最適
角チップビーズインダクタ
RECTANGULAR FERRITE CHIP BEADS
(HIGH CURRENT)
FB SERIES M TYPE
Y電源ラインの輻射Y伝導ノイズ対策
Y各種デジタル機器におけるデジタル信号の波形整形、データラインの高周
波ノイズ対策
Y電装機器
YOA機器
YUSB等の差動伝送ライン
Y低消費電力化が要求される携帯機器
1
形式
OPERATING TEMP. K40VJ85C
4
外形寸法 fLPWghmmi
6
公称インピーダンス hEi
例
330 33
111 110
132 1300
8
梱包仕様
Tテーピング
9
当社管理記号
5
材質コード
HS
HM
HL
M角形チップ
形状
2
7
EM25L
NM30L
材質によりインピー
ダンス特性が異なる
FB Ferrite bead
1
Type
4
1608(0603) 1.6P0.8
2125(0805) 2.0P1.25
2012(0805) 2.0P1.25
2016(0806) 2.0P1.6
3216(1206) 3.2P1.6
3225(1210) 3.2P2.5
4516(1806) 4.5P1.6
4525(1810) 4.5P2.5
4532(1812) 4.5P3.2
External DimensionsfLPWg hmmi
6
5
Material code
M Rectangular chip
Shape
2
7
Impedance Tolerance
EM25L
NM30L
Nominal ImpedancehEi
1608(0603) 1.6P0.8
2125(0805) 2.0P1.25
2012(0805) 2.0P1.25
2016(0806) 2.0P1.6
3216(1206) 3.2P1.6
3225(1210) 3.2P2.5
4516(1806) 4.5P1.6
4525(1810) 4.5P2.5
4532(1812) 4.5P3.2
インピーダンス許容差
Q標準品
QW スペース
example
330 33
111 110
132 1300
YDeals with power line radiated and conducted noise.
YProvides waveform correction of digital signals and high frequency noise
countermeasures in various types of digital equipment.
YAutomotive
YComputer Peripherals
YDifferential transmission line on USB and similar products
YMobile devices which require lower power consumption
Power supply units:
Large withstand voltage (allowable current: up to 6 A)
Resistance to high energy
High reliability
There are several variations of the FBMJ type
HS: For broadband applications
HM: For upper MHz range applications
HL: For GHz range applications
The FBMH type are optimal for circuit designs which require high imped-
ances and large currents to combat radiated noise on power lines, etc.
Refer to impedance
curves for material dif-
ference
HS
HM
HL
8
Packaging
T Tape&Reel
9
Internal code
QStandard product
QWBlank space
3
J標準品
H高インピーダンス品
特性区分
3
J Standard type
H High Impedance type
Product characteristics
285
外形寸法 EXTERNAL DIMENSIONS
FERRITE PRODUCTS
5
FBMJ2125
概略バリエーション AVAILABLE MATERIALS
P.286 P.288 P.292 P.294P.10
アイテム一覧
Part Numbers
特性図
Electrical Characteristics
梱包
Packaging
信頼性
Reliability Data
使用上の注意
Precautions
セレクションガイド
Selection Guide
etc
高インピーダンス品 (High impedance Type)
標 準 品 (Standard Type)
FBMJ1608
HS-type HM-type
I max=4A I max=4A
HS-type HM-type HL-type
I max=4〜6A I max=4〜6A I max=2A
HS-type HM-type
I max=4〜6A I max=4〜6A
FBMJ3216
HS-type HM-type
I max=4〜6A I max=4〜6A
FBMJ4516
FBMH1608
I max=0.3〜2.5A
FBMH20ZZ
I max=1.8〜2.7A
FBMH32ZZ
I max=1〜3A
FBMH45ZZ
I max=1.5〜4A
UnitDmmfinchg
Type L W T e
FBMJ1608(0603) 1.6M0.2 0.8M0.2 0.8M0.2 0.3M0.2
f0.063M0.008gf0.031M0.008gf0.031M0.008gf0.012M0.008g
FBMJ2125(0805) 2.0M0.2 1.25M0.2 0.85M0.2 0.5M0.3
f0.079M0.008gf0.049M0.008gf0.033M0.008gf0.020M0.012g
FBMJ3216(1206) 3.2M0.3 1.6M0.2 1.1M0.2 0.5M0.3
f0.126M0.012gf0.063M0.008gf0.043M0.008gf0.020M0.012g
FBMJ4516(1806) 4.5M0.3 1.6M0.2 1.1M0.2 0.5M0.3
f0.177M0.012gf0.063M0.008gf0.043M0.008gf0.020M0.012g
FBMH1608(0603) 1.6M0.1 0.8M0.1 0.8M0.1 0.3M0.15
f0.063M0.004gf0.031M0.004gf0.031M0.004gf0.012M0.006g
FBMH2012(0805) 2.0M0.2 1.25M0.2 0.85M0.2 0.5M0.3
f0.079M0.008gf0.049M0.008gf0.033M0.008gf0.020M0.012g
FBMH2016(0806) 2.0M0.2 1.6M0.2 1.6M0.2 0.5M0.3
f0.079M0.008gf0.063M0.008gf0.063M0.008gf0.020M0.012g
FBMH3216(1206) 3.2M0.3 1.6M0.2 1.6M0.2 0.5M0.3
f0.126M0.012gf0.063M0.008gf0.063M0.008gf0.020M0.012g
FBMH3225(1210) 3.2M0.3 2.5M0.3 2.5M0.3 0.5M0.3
f0.126M0.012gf0.098M0.012gf0.098M0.012gf0.020M0.012g
FBMH4516(1806) 4.5M0.3 1.6M0.2 1.6M0.2 0.5M0.3
f0.177M0.012gf0.063M0.008gf0.063M0.008gf0.020M0.012g
FBMH4525(1810) 4.5M0.4 2.5M0.3 2.5M0.3 0.9M0.6
f0.177M0.016gf0.098M0.012gf0.098M0.012gf0.035M0.024g
FBMH4532(1812) 4.5M0.4 3.2M0.3 3.2M0.3 0.9M0.6
f0.177M0.016gf0.126M0.012gf0.126M0.012gf0.035M0.024g
HM-type HL-type
I max=0.3〜3.5A
P.296
286
アイテム一覧 PART NUMBERS
標準品fStandard Typeg
FBMJ1608 -----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
形名 インピーダンス
インピーダンス 直流抵抗 定格電流 厚み
Impedance 測定周波数 DC Resistance Rated current Thickness
hEi Measuring frequency hEimax. hAimax. hmmi
Ordering code hMHzi(inch)
28M30%
100 0.007 4.0
0.8M0.2
23M30% (0.031M0.008)
FBMJ2125 -----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
形名 インピーダンス
インピーダンス 直流抵抗 定格電流 厚み
Impedance 測定周波数 DC Resistance Rated current Thickness
hEi Measuring frequency hEimax. hAimax. hmmi
Ordering code hMHzi(inch)
42M25% 0.008 4.0
25M30% 0.004 6.0 0.85M0.2
33M25% 100 0.008 4.0 (0.033M0.008)
21M30% 0.004 6.0
8M30% 0.010 2.0
FBMJ3216 -----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
形名 インピーダンス
インピーダンス 直流抵抗 定格電流 厚み
Impedance 測定周波数 DC Resistance Rated current Thickness
hEi Measuring frequency hEimax. hAimax. hmmi
Ordering code hMHzi(inch)
80M25% 0.010 4.0
48M30% 0.005 6.0 1.1M0.2
60M25% 100 0.010 4.0 (0.043M0.008)
38M30% 0.005 6.0
FBMJ4516 -----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
形名 インピーダンス
インピーダンス 直流抵抗 定格電流 厚み
Impedance 測定周波数 DC Resistance Rated current Thickness
hEi Measuring frequency hEimax. hAimax. hmmi
Ordering code hMHzi(inch)
110M25% 0.014 4.0
72M30% 0.007 6.0 1.1M0.2
90M25% 100 0.014 4.0 (0.043M0.008)
56M30% 0.007 6.0
FB MJ1608HS280NT
FB MJ1608HM230NT
FB MJ2125HS420
K
T
FB MJ2125HS250NT
FB MJ2125HM330
K
T
FB MJ2125HM210NT
FB MJ2125HL8R0NT
FB MJ3216HS800
K
T
FB MJ3216HS480NT
FB MJ3216HM600
K
T
FB MJ3216HM380NT
FB MJ4516HS111
K
T
FB MJ4516HS720NT
FB MJ4516HM900
K
T
FB MJ4516HM560NT
287
FERRITE PRODUCTS
5
アイテム一覧 PART NUMBERS
高インピーダンス品fHigh impedance Typeg
形名 インピーダンス
インピーダンス 直流抵抗 定格電流 厚み
Impedance 測定周波数 DC Resistance Rated current Thickness
hEi Measuring frequency hEimax. hAimax. hmmi
Ordering code hMHzi(inch)
47M25% 0.020 3.5
60M25% 0.025 3.0
100M25% 0.035 2.0
150M25% 0.050 2.0
220M25% 0.070 1.5
330M25% 0.130 0.9
470M25% 0.150 0.7
600M25% 0.170 0.7 0.8M0.1
1000M25% 0.350 0.3 (0.031M0.004)
30M25% 0.028 2.5
60M25% 0.045 1.8
120M25% 0.130 0.9
220M25% 0.170 0.7
330M25% 0.210 0.6
470M25% 0.350 0.5
600M25% 0.450 0.4
80M25% 100 0.025 2.7
120M25% 0.032 2.5 0.85M0.2
220M25% 0.060 2.0 (0.033M0.008)
330M25% 0.080 1.8
250M30% 0.050 2.0 1.6M0.2
500M30% 0.070 2.0
850M30% 0.100 1.5
(0.063M0.008)
600M30% 0.042 3.0
1000M30% 0.100 2.0 2.5M0.3
2000M30% 0.140 1.0 (0.098M0.012)
1000M30% 0.060 3.0
1600M30% 0.130 2.0
680M25% 0.028 4.0 3.2M0.3
1300M25% 0.060 3.0 (0.126M0.012)
2000M30% 0.130 1.5
FB MH1608HM470
K
T
FB MH1608HM600
K
T
FB MH1608HM101
K
T
FB MH1608HM151
K
T
FB MH1608HM221
K
T
FB MH1608HM331
K
T
FB MH1608HM471
K
T
FB MH1608HM601
K
T
FB MH1608HM102
K
T
FB MH1608HL300
K
T
FB MH1608HL600
K
T
FB MH1608HL121
K
T
FB MH1608HL221
K
T
FB MH1608HL331
K
T
FB MH1608HL471
K
T
FB MH1608HL601
K
T
FB MH2012HM800
K
T
FB MH2012HM121
K
T
FB MH2012HM221
K
T
FB MH2012HM331
K
T
FB MH2016HM251NT
FB MH3216HM501NT
FB MH4516HM851NT
FB MH3225HM601NT
FB MH3225HM102NT
FB MH3225HM202NT
FB MH4525HM102NT
FB MH4525HM162NT
FB MH4532HM681
K
T
FB MH4532HM132
K
T
FB MH4532HM202NT
288
標 準 品 fStandard Typeg
特性図 ELECTRICAL CHARACTERISTICS
FBMJ1608 -----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
FBMJ2125 -----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
FBMJ3216 -----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
289
FERRITE PRODUCTS
5
特性図 ELECTRICAL CHARACTERISTICS
標 準 品 fStandard Typeg
FBMJ3216 -----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
FBMJ4516 -----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
290
高インピーダンス品 fHigh impedance Typeg
特性図 ELECTRICAL CHARACTERISTICS
200
180
160
140
120
100
80
60
40
20
0
1 100 100010 10000
FBMH1608HM470-T
200
180
160
140
120
100
80
60
40
20
0
1 100 100010 10000
FBMH1608HM600-T
200
180
160
140
120
100
80
60
40
20
0
1 10010 1000 10000
FBMH1608HM101-T
600
500
400
300
200
100
0
1 10010 1000 10000
FBMH1608HM151-T
600
500
400
300
200
100
0
1 10010 1000 10000
FBMH1608HM221-T
600
500
400
300
200
100
0
1 10010 1000 10000
FBMH1608HM331-T
300
250
200
150
100
50
0
1 10010 1000 10000
FBMH1608HL300-T
300
250
200
150
100
50
0
1 10010 1000 10000
FBMH1608HL600-T
600
500
400
300
200
100
0
1 10010 1000 10000
FBMH1608HL121-T
1600
1400
1200
1000
800
600
400
200
0
1 10010 1000 10000
FBMH1608HM471-T
1600
1400
1200
1000
800
600
400
200
0
1 10010 1000 10000
FBMH1608HM601-T
1600
1400
1200
1000
800
600
400
200
0
1 10010 1000 10000
FBMH1608HM102-T
1000 1400
1200
1000
800
600
400
200
0
2500
2000
1500
1000
500
0
900
800
700
600
500
400
300
200
100
0
2000
1800
1600
1400
1200
1000
800
600
400
200
0
1 10010 1000 10000
FBMH1608HL221-T
1 10010 1000 10000
FBMH1608HL331-T
1 10010 1000 10000
FBMH1608HL471-T
1 10010 1000 10000
FBMH1608HL601
Z
R
X
Z
R
X
Z
Z
R
X
Z
R
X
Z
R
X
ZR
X
Z
X
R
Z
R
XZ
X
R
Z
R
X
Z
R
X
Z
X
R
R
X
Z
R
X
Z
R
X
Z
R
X
291
FERRITE PRODUCTS
5
特性図 ELECTRICAL CHARACTERISTICS
400
350
300
250
200
150
100
50
0
1 10010 1000 10000
FBMH2012HM800-T
400
350
300
250
200
150
100
50
0
1 10010 1000 10000
FBMH2012HM121-T
400
350
300
250
200
150
100
50
0
1 10010 1000 10000
FBMH2012HM221-T
800
600
400
200
0
1 10010 1000 10000
FBMH2012HM331-T
800
600
400
200
0
1 10010 1000
FBMH2016HM251NT
800
600
400
200
0
1 10010 1000
FBMH3216HM501NT
1200
1000
200
800
600
400
0
1 10010 1000
FBMH4516HM851NT
1200
1000
200
800
600
400
0
1 10010 1000
FBMH3225HM601NT
1200
1000
200
800
600
400
0
1 10010 1000
FBMH3225HM102NT
2500
2000
1500
1000
500
0
1 10010 1000
FBMH3225HM202
2500
2000
1500
1000
500
0
1 10010 1000
FBM4532HM202
1800
1600
1400
1200
1000
200
800
600
400
0
1 10010 1000
FBMH4525HM162NT
1800
1600
1400
1200
1000
200
800
600
400
0
1 10010 1000
FBMH4532HM681-T
Z
X
R
Z
X
R
Z
X
R
Z
X
R
Z
R
X
Z
R
X
X
ZR
R
X
Z
R
X
Z
ZR
X
ZR
X
R
X
1800
1600
1400
1200
1000
200
800
600
400
0
1 10010 1000
FBMH4525HM102NT
R
X
Z
X
1800
1600
1400
1200
1000
200
800
600
400
0
1 10010 1000
FBM4532HM132-T
Z
R
X
Z
Z
R
292
梱包 PACKAGING
3テープ寸法 Taping Dimensions
2テーピング材質 Tape Material
1608(0603) 4000 EE
2125(0805) 4000 EE
2012(0805) 4000 EE
2016(0806) EE 2000
3216(1206) EE 2000
4516(1806) EE 2000
3225(1210) EE 1000
4525(1810) EE 1000
4532(1812) EE 2000
1最小受注単位数 Minimum Quantity
標準数量 Standard Quantity [pcs]
紙テーピング エンボステーピング
Paper Tape Embossed Tape
Type
形 式 チップ挿入部 挿入ピッチ テープ厚み
Chip Cavity
Insertion Pitch
Tape Thickness
Type ABF T
FBMJ1608 1.0M0.2 1.8M0.2 4.0M0.2
1.1max
FBMH1608
f0603g
f0.039M0.008gf0.071M0.008gf0.157M0.008gf0.043maxg
FBMJ2125 1.5M0.2 2.3M0.2 4.0M0.2
1.1max
FBMH2012
f0.059M0.008gf0.091M0.008gf0.157M0.008gf0.043maxg
f0805g
エンボステープ（8mm幅） Embossed tapef0.315 inches wideg
形 式 チップ挿入部 挿入ピッチ テープ厚み
Type Chip Cavity
Insertion Pitch
Tape Thickness
ABFKT
FBMH2016 1.8M0.2 2.2M0.2 4.0M0.2
2.6max
0.6max
f0806g
f0.071M0.008gf0.087M0.008gf0.157M0.008g
f0.102
max
gf0.024
max
g
FBMJ3216 1.9M0.2 3.5M0.2 4.0M0.2
1.5max
0.3max
f1206g
f0.075M0.008gf0.138M0.008gf0.157M0.008g
f0.059
max
gf0.012
max
g
FBMH3216 1.9M0.2 3.5M0.2 4.0M0.2
2.6max
0.6max
f1206g
f0.075M0.008gf0.138M0.008gf0.157M0.008g
f0.102
max
gf0.024
max
g
FBMH3225 2.8M0.2 3.5M0.2 4.0M0.2
4.0max
0.6max
f1210g
f0.110M0.008gf0.138M0.008gf0.157M0.008g
f0.157
max
gf0.024
max
g
UnitDmmfinchg
UnitDmmfinchg
紙テープ（8mm幅） Paper tapef0.315 inches wideg
293
FERRITE PRODUCTS
5
4リーダ部・空部 Leader and Blank portion
トップテープのはがし力は、下図矢印方向にて0.1〜0.7Nとなります。
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the
arrow as illutrated below.
形式
Type
FBMJ1608
FBMJ2125
FBMJ3216
FBMJ4516
FBMH1608
FBMH2012
FBMH2016
FBMH3216
FBMH3225
FBMH4516
FBMH4525
FBMH4532
5リール寸法 Reel size
6トップテープ強度 Top tape strength
梱包 PACKAGING
EIAJ ETX-7001規格に基づく。
All FBM series items conform to EIAJ ETX-7001 reel width of 9.0mm +/-
0.3mm except the 4516 type which has a 13.0mm +/-0.3mm reel width.
形 式 チップ挿入部 挿入ピッチ テープ厚み
Type Chip cavity
Insertion pitch Tape Thickness
ABFKT
FBMJ4516 1.9M0.2 4.9M0.2 4.0M0.2
1.5max
0.3max
f1806g
f0.075M0.008gf0.193M0.008gf0.157M0.008g
f0.059
max
gf0.012
max
g
FBMH4516 1.9M0.2 4.9M0.2 4.0M0.2
2.6max
0.6max
f1806g
f0.075M0.008gf0.193M0.008gf0.157M0.008g
f0.102
max
gf0.024
max
g
FBMH4525 2.9M0.2 4.9M0.2 4.0M0.2
4.0max
0.6max
f1810g
f0.114M0.008gf0.193M0.008gf0.157M0.008g
f0.157
max
gf0.024
max
g
FBMH4532 3.6M0.2 4.9M0.2 8.0M0.2
4.0max
0.6max
f1812g
f0.142M0.008gf0.193M0.008gf0.315M0.008g
f0.157
max
gf0.024
max
g
エンボステープ（12mm幅） Embossed tapef0.472 inches wideg
UnitDmmfinchg
BAhmmi
finchg
180
f7.09 g
330M2.0f12.99M0.080g
BBhmmi
finchg
60
f2.36 g
100M1.0f3.94M0.039g
J0
K3
J0.039
K0
J0
K0.118
J1
K0
Whmmi
finchg
9.0M0.3
f0.354M0.012g
13M0.3f0.512M0.012g
9.0M0.3
f0.354M0.012g
13M0.3
f0.512M0.012g
14M2.0f0.551M0.080g
295
FERRITE PRODUCTS
5
RELIABILITY DATA
*Note: K5 to J40C in taped packaging
Measuring equipment: Impedance analyzer (HP4291A) or its equivalent
Measuring frequency: 100M1 MHZ
Four-terminal method
Measuring equipment: Milliohm High-Tester 3226(Hioki Denki) or its equivalent
According to JIS C 0040.
Vibration type: A
Directions: 2 hrs each in X,Y, and Z directions Total: 6 hrs
Frequency range: 10 to 55 to 10Hz(/min.)
Amplitude: 1.5 mm(shall not exceed acceleration 196m/s2)
Mounting method: Soldering onto PC board
Solder temperature: 230M5C
Duration: 4M1 sec.
Preconditioning: Immersion into flux.
Immersion and Removal speed: 25mm/sec.
Preheating: 150C for 3 min.
Solder temperature: 260M5C
Duration: 10M0.5sec
Preconditioning: Immersion into flux.
Immersion and Removal speed: 25 mm/sec.
Recovery: 2 to 3 hrs of recovery under the standard condition after the test.
According to JIS C 0025.
Conditions for 1 cycle
Step Temperature(C) Duration(min.)
1K40M3C30M3
2 Room Temperature Within 3
3K85M2C30M3
4 Room Temperature Within 3
Number of cycles: 100
Mounting method: Soldering onto PC board
Recovery: 2 to 3 hrs of recovery under the standard condition after the removal
from test chamber.
Temperature: 40M2˚C
Humidity: 90 to 95%RH
Duration: 500 hrs
Mounting method: Soldering onto PC board
Recovery: 2 to 3 hrs of recovery under the standard condition after the removal
from test chamber.
Temperature : 40M2˚C
Humidity : 90 to 95%RH
Applied current : Rated current
Duration : 500 hrs
Mounting method : Soldering onto PC board
Recovery : 2 to 3hrs of recovery under the standard condition after the removal
from test chamber.
Temperature: 85M2C
Duration: 500 hrs
Applied current: Rated current
Mounting method: Soldering onto PC board
Recovery: 2 to 3 hrs of recovery under the standard condition after the removal
from test chamber.
Warp: 2mm
Testing board: Glass epoxy-resin substrate
Thickness: 0.8mm
Applied force: 5N
Duration: 10 sec.
1/1
Item Specified Value Test Methods and Remarks
RECTANGULAR FERRITE CHIP BEADSfHIGH CURRENTgFB series M type
K40 ~ J85C
K40 ~ J85C
Within the specified tolerance
Within the specified range
Within the specified range
Appearance: No significant abnormality
Impedance change: Within M30% of the initial value
75% or more of immersed surface of terminal electrode shall be covered with
fresh solder.
Appearance: No significant abnormality
Impedance change: Within M30% of the initial value
Appearance: No significant abnormality
Impedance change: Within % of the initial value
Appearances: No significant abnormality
Impedance change: Within M30% of the initial value
Appearance : No significant abnormality
Impedance change : Within M30% of the initial value
Appearance: No significant abnormality
Impedance change: Within M30% of the initial value
No mechanical damage.
No separation or indication of separation of electrode.
Note on standard condition: "standard condition" referred to herein is defined as follows 5 to 35C of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20M2C of temperature, 60 to 70% relative humidity
and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
1.
Operating Temperature Range
2.
Storage Temperature Range
3.Impedance
4. DC Resistance
5.Rated Current
6.Vibration
7. Solderability
8.Resistance to Solder Heat
9.Thermal Shock
10.Humidity (steady state)
11.Loading under Damp Heat
12.High Temperature Loading
Test
13.Resistance to Flexure of
Substrate
14.Adhesion of Electrode
J50
K10
J24
K 0
J24
K 0
J24
K 0
297
FERRITE PRODUCTS
5
Technical considerationsStages Precautions
FBM Type
1.Circuit Design
2.PCB Design
3.Considerations for
automatic placement
4.Soldering
5.Handling
6.Storage conditions
Operating environment,
1.The products described in this specification are intended for
use in general electronic equipment,(office supply
equipment, telecommunications systems, measuring
equipment, and household equipment). They are not
intended for use in mission-critical equipment or systems
requiring special quality and high reliability (traffic systems,
safety equipment, aerospace systems, nuclear control
systems and medical equipment including life-support
systems,) where product failure might result in loss of life,
injury or damage. For such uses, contact TAIYO YUDEN
Sales Department in advance.
Rated current
1.Rated current of this product is shown in this catalogue, but
please be sure to have the base board designed with
adequate inspection in case of the generation of heat
becomes high within the rated current range when the base
board is in high resistance or in bad heating conditions.
Land pattern design
1.Please contact any of our offices for a land pattern, and refer
to a recommended land pattern of specifications.
Adjustment of mounting machine
1.Excessive impact load should not be imposed on the
products when mounting onto the PC boards.
2.Mounting and soldering conditions should be checked
beforehand.
Wave soldering
1.Please refer to the specifications in the catalog for a wave
soldering.
Reflow soldering
1.Please contact any of our offices for a reflow soldering, and
refer to the recommended condition specified.
Lead free soldering
1.When using products with lead free soldering, we request to
use them after confirming of adhesion, temperature of
resistance to soldering heat, etc. sufficiently.
Preheating when soldering
Heating:The temperature difference between soldering and
remaining heat should not be greater than 150℃.
Cooling:The temperature difference between the components
and cleaning process should not be greater than 100℃.
Recommended conditions for using a soldering iron
Put the soldering iron on the land-pattern.
Soldering iron's temperature - Below 350 ℃
Duration - 3 seconds or less
The soldering iron should not directly touch the inductor.
Handling
1.Keep the inductors away from all magnets and magnetic
objects.
Setting PC boards
1.When setting a chip mounted base board, please make sure
that there is no residual stress to the chip by distortion in the
board or at screw part.
Breakaway PC boards (splitting along perforations)
1.When splitting the PC board after mounting inductors, care
should be taken not to give any stresses of deflection or
twisting to the board.
2.Board separation should not be done manually, but by using
the appropriate devices.
Mechanical considerations
1.Please do not give the inductors any excessive mechanical
shocks.
Storage
1.To maintain the solderability of terminal electrodes and to
keep the packing material in good condition, temperature
and humidity in the storage area should be controlled..
・Recommended conditions
Ambient temperature 0〜40℃
Humidity Below 70% RH
The ambient temperature must be kept below 30℃. Even
under ideal storage conditions, solderability of products
electrodes may decrease as time passes. For this reason,
inductors should be used within 6 months from the time of
delivery.
1.When installing products, care should be taken not to apply distortion stress as it may
deform the products.
1.If products are used beyond the range of the recommended conditions, heat stresses
may deform the products, and consequently degrade the reliability of the products.
1.There is a case that products get damaged by a heat shock.
1.If products are used beyond the range of the recommended conditions, heat stresses
may deformthe products, and consequently degrade the reliability of the products
1.There is a case that a characteristic varies with magnetic influence.
1.There is a case that a characteristic varies with residual stress.
1.Planning pattern configurations and the position of products should be carefully
performed to minimize stress.
1.There is a case to be damaged by a mechanical shock.
1. Under a high temperature and humidity environment, problems such as reduced
solderability caused by oxidation of terminal electrodes and deterioration
of taping/packaging materials may take place.
PRECAUTIONS
326
用途 APPLICATIONS
形名表記法 ORDERING CODE
特長 FEATURES
ZZZ
7654132
FBA04HA450BB
材質によりインピー
ダンス特性が異なる
FB
フェライトビーズインダクタ
Y損失分の大きなフェライト材料を使用
Y基板への実装が容易
Y用途に合わせた幅広いバリエーション
YUse of high loss ferrite material.
YEasy mounting on PC boards.
YAvailable in a wide range of values and configurations to suit most
applications.
YWaveform correction of digital signals from digital equipment and absorp-
tion of high-frequency noise from data lines.
フェラ イトビーズインダクタ
（リードタイプ ）
LEADED FERRITE BEADS INDUCTORS
Y各種デジタル機器におけるデジタル信号の波形整形、データラインの高周
波ノイズ吸収
1
形式
OPERATING TEMP. K25VJ85C
3
03 B2.5
04 B3.5
05 5.0
06 6.0
07 7.5
コア寸法 fD寸法 g[mm]
5
公称インピーダンスhE以上i
例
850 85
121 120
4
材質コード
HA
VA
形状
2
材質によりインピー
ダンス特性が異なる
Aアキシャルリード
Rラジアルリード
6
リード加工形状hmmi
AB
26.0幅ストレートリードつづら折りテーピング
BB
52.0幅ストレートリードつづら折りテーピング
KD
10.0ピッチ コの字形フォーミング単品
KE
12.5ピッチ コの字形フォーミング単品
KF
15.0ピッチ コの字形フォーミング単品
NA
2.5ピッチストレートリード単品fFBRg
ストレートリード単品fFBAg
NB 5.0ピッチリード単品
FB Ferrite Beads
1
Type
3
Core Dimensions[mm]
5
Nominal Impedance
example
850 85
121 120
Configuration
2
A Axial lead
R Radial lead
SA
2.5ピッチストレートリードテーピング
SB
5.0ピッチストレートリードテーピング
UB
5.0ピッチラジアルフォーミングテーピング
US
5.0ピッチラジアルフォーミング単品
VB
5.0ピッチ両リードフォーミングテーピング
VS
5.0ピッチ両リードフォーミング単品
当社管理記号
K00
標準品
7
03タイプ除く
03 B2.5
04 B3.5
05 5.0
06 6.0
07 7.5
6
Lead configuration hmmi
AB
BB
KD
KE
KF
NA
NB
straight lead (26mm lead space) / ammo
straight lead (52mm lead space) / ammo
Formed lead (10mm pitch) / bulk
Formed lead (12.5mm pitch) / bulk
Formed lead / bulk (15.0mm pitch) / bulk
straight lead (2.5mm pitch)/bulk (FBR)
straight lead / bulk (FBA)
Formed lead (crimped) / bulk
Straight lead (FBR05 type) / ammo
Straight lead (FBR07 type) / ammo
Radial lead formed / ammo
Formed lead (crimped) / bulk
Dual side lead formed (crimped) / ammo
Formed lead / bulk
SA
SB
UB
US
VB
VS
4
Material code
HA
VA
Refer to impedance curves
for material difference
Internal code
K00 Standard Products
7
Excluding 03Type
327
外形寸法 EXTERNAL DIMENSIONS
FERRITE PRODUCTS
5
P.327
アイテム一覧
Part Numbers
特性図
Electrical Characteristics
梱包
Packaging
信頼性
Reliability Data
使用上の注意
Precautions
P.328 P.330 P.338
セレクションガイド
Selection Guide
P.10
形 状 Configurations
テーピング Taping
ストレート Straight
Dimensionshmmifinchg
フォーミング Formed
単 品 Bulk DL
フォーミング Formed
2.5M0.2
f0.098M0.008g
3.5M0.2
f0.138M0.008g
3.5M0.2
f0.138M0.008g
3.5M0.2
f0.138M0.008g
5.0max.
f0.197max.g
6.0M0.5
f0.236M0.020g
7.5M0.5
f0.295M0.020g
4.5M0.3
f0.177M0.012g
4.5M0.3
f0.177M0.012g
6.0J0.5
K0
f0.236M0.008g
9.0M0.5
f0.354M0.020g
7.5
f0.295g
5.0
f0.197g
7.0
f0.276g
5.5
f0.217g
7.5
f0.295g
FBA
ストレート Straight
UnitDmmfinchg
FBR
03HA450G-00
03VA450G-00
04HA450G-00
04VA450G-00
04HA600G-00
04VA600G-00
04HA900G-00
04VA900G-00
05VA121G-00
06HA850NA-00
06VA850NA-00
06HA121NA-00
06VA121NA-00
07HA850G-00
07VA850G-00
07HA121G-00
07VA121G-00
Type
形名のGにはリード加工形状記号が入ります。 G Please specify the lead configuration code.
Fリード線径d寸法は、0.65M0.05mm 但し、FBR05,07タイプのBd寸法は0.6M0.05mm
Note: Lead diameter (Bd) shall fall within a range of 0.65mmM0.05mm, FBR05, and FBR07 types however , will have a lead
diameter (Bd) range of 0.6mm M0.05mm.
インピーダンス
Impedance
[E]min.
形 名
Ordering code
35.0 50 100 7.0 7.0
45.0 50 100 7.0 7.0
60.0 50 100 7.0 7.0
90.0 50 100 7.0 7.0
120.0 EE 100 EE 7.0
85.0 50 100 7.0 7.0
120.0 50 100 7.0 7.0
85.0 50 100 7.0 7.0
120.0 50 100 7.0 7.0
VAHAVAHA
定格電流
Rated current[A]max.
材質 Material
インピーダンス測定周波数
Measuring frequency[MHz]
材質 Material
FBR
FBA
アイテム一覧 PART NUMBERS
形名のQには材質記号fHA,VAg、Gにはリード加工形状記号が入ります。
Q Please specify material codesfHA,VAg and G lead configuration code.
F直流抵抗 DC ResistanceD0.01Emax、絶縁抵抗 Insulation resistanceD1.0MEmin
P :12.7 (0.500)
J0.020
K0
P :12.7 (0.500)
P :12.7 (0.500)
P :12.7 (0.500)
P :12.7 (0.500)
P :12.7
(0.500)
etc
P.356
03 450
K
00
04 450
K
00
04 600
K
00
04 900
K
00
05VA121
K
00
06 850NA
K
00
06 121NA
K
00
07 850
K
00
07 121
K
00
QG
QG
QG
QG
G
Q
Q
QG
QG
328
特性図 ELECTRICAL CHARACTERISTICS
インピダース周波数特性
IMPEDANCE-vs-FREQUENCY CHARACTERISTICS
329
FERRITE PRODUCTS
5
特性図 ELECTRICAL CHARACTERISTICS
Measured by HP4191A
330
梱包 PACKAGING
Type
寸法 Dimensionshmmifinchg
BDA a F Bd
FBA04G450 3.5M0.2 4.5M0.3 12.5max. 5M1 0.65M0.05
f0.138M0.008gf0.177M0.012g
f0.492max.gf0.197M0.039gf0.026M0.002g
FBA04G600 3.5M0.2 6.0M0.3 12.5max. 5M1 0.65M0.05
f0.138M0.008gf0.236M 0.0 g
f0.492max.gf0.197M0.039gf0.026M0.002g
FBA04G900 3.5M0.2 9.0M0.5 16.0max. 5M1 0.65M0.05
f0.138M0.008gf0.354M0.020g
f0.630max.g
f0.197M0.039gf0.026M0.002g
VS 形状
J0.020
K0
J0.5
K0
UnitDmmfinchg
FBA03G450 2.5M0.2 4.5M0.3 6.5max.
f0.098M0.008gf0.177M0.012g
f0.256max.g
FBA04G450 3.5M0.2 4.5M0.3 6.5max.
f0.138M0.008gf0.177M0.012g
f0.335max.g0.65M0.05 18min.
FBA04G600 3.5M0.2 6.0M0.3 8.5max.
f0.026M0.002g
f0.709min.g
f0.138M0.008g
f0.236M0.0gf0.335max.g
FBA04G900 3.5M0.2 9.0M0.5 11.0max.
f0.138M0.008gf0.354M0.020g
f0.433max.g
Type
標準数量 Standard quantity hpcsi
テーピング Taped
アキシャルリード Axial leadfFBAg
FBA03G450 2.5M0.2 4.5M0.3 9.0max.
f0.098M0.008gf0.177M0.012g
f0.354max.g
5M1 0.65M0.05
FBA04G450 3.5M0.2 4.5M0.3 9.0max.
f0.197M0.039gf0.026M0.002g
f0.138M0.008gf0.177M0.012g
f0.354max.g
Type
寸法 Dimensions hmmi finchg
BDA a F Bd
リード加工
形状記号
Lead configration
つづら折りAmmo
1最小受注単位数 Minimum Quantity
袋詰め
Bulk
Type
寸法 Dimensions hmmi finchg
KD/KE/KF 形状
NA 1000 EE
AB, BB EE 2000
FBA03 KE,KF 500 EE
KD 1000 EE
US 1000 EE
UB EE 3000
NA, KD, US 1000 EE
FBA04 KE, KF, VS 500 EE
AB, BB EE 1000
VB, UB EE 3000
FBR05 NA 1000 EE
SA EE 2000
FBR06 NA 1000 EE
FBR07 NB 1000 EE
SB EE 2000
Type
ラジアルリード Radial leadfFBRg
標準数量 Standard quantity hpcsi
テーピング Taped
つづら折りAmmo
袋詰め
Bulk
UnitDmmfinchg
US形状
UnitDmmfinchg
2単品寸法 Bulk dimensions
アキシャルリード Axial leadfFBAg
NA形状
Type
寸法 Dimensions hmmi finchg
BDL1 L2 Bdb
UnitDmmfinchg
J0.5
K0
J0.020
K0
FBA03G450
2.5M0.2 10.0M1.0 4.5M0.3 7M2
f0.098M0.008gf0.394M0.040gf0.177M0.012gf0.276M0.079g
FBA04G450
KD 3.5M0.2 10.0M1.0 4.5M0.3 0.65M0.05 7.5M2
f0.138M0.008gf0.394M0.040gf0.177M0.012gf0.026M0.020gf0.295M0.079g
FBA04G600
3.5M0.2 10.0M1.0 6.0M0.3 7.5M2
f0.138M0.008g
f0.394M0.040g
f0.236M0.0 g
f0.295M0.079g
FBA03G450
2.5M0.2 12.5M1.0 4.5M0.3 7M2
f0.098M0.008gf0.492M0.004gf0.177M0.012gf0.276M0.079g
FBA04G450
3.5M0.2 12.5M1.0 4.5M0.3 7.5M2
KE
f0.138M0.008gf0.492M0.004gf0.177M0.012g
0.65M0.05
f0.295M0.079g
FBA04G600
3.5M0.2 12.5M1.0 6.0M0.3
f0.026M0.020g
7.5M2
f0.138M0.008gf
0.492
M0.
004
g
f0.236M0.0 g
f0.295M0.079g
FBA04G900
3.5M0.2 12.5M1.0 9.0M0.5M0.3 7.5M2
f0.138M0.008gf
0.492
M0.
004
g
f
0.354M0.020
g
f0.295M0.079g
FBA03G450
2.5M0.2 15.0M1.0 4.5M0.3 7M2
f0.098M0.008g
f0.591M0.004gf0.177M0.012gf0.276M0.079g
FBA04G450
3.5M0.2 15.0M1.0 4.5M0.3 7.5M2
KF
f0.138M0.008g
f0.591M0.004gf0.177M0.012g
0.65M0.05
f0.295M0.079g
FBA04G600
3.5M0.2 15.0M1.0 6.0M0.3
f0.026M0.020g
7.5M2
f0.138M0.008g
f0.591M0.004g
f0.236M0.0 g
f0.295M0.079g
FBA04G900
3.5M0.2 15.0M1.0 9.0M0.5M0.3 7.5M2
f0.138M0.008g
f0.591M0.004g
f
0.354M0.020
g
f0.295M0.079g
リード
加工形状
記 号
L
EAD
SYMBOL
BDF L1 Bdb
J0.5
K0
J0.020
K0
J0.020
K0
J0.5
K0
J0.5
K0
J0.020
K0
UnitDmmfinchg
リード加工
形状記号
Lead configuration
※900タイプのみ5M1
※
331
梱包 PACKAGING
FERRITE PRODUCTS
5
寸 法 Dimensions
Type
DLab
|L1-L2|Bd
52
J2
FBA03
2.5M0.2 4.5M0.3
K1
1.2max 1.0max
0.65
M0.05
10.0
f0.098M0.008gf0.177M0.012gf2.05 gf0.047maxgf0.039maxgf0.026M0.002gf0.394g
52
J2
FBA04
3.5M0.2 4.5M0.3
K1
1.2max 1.0max 0.65
M0.05
10.0
f0.138M0.008gf0.177M0.012gf2.05 gf0.047maxgf0.039maxgf0.026M0.002gf0.394g
寸 法 Dimensions
Type
DLab
|L1-L2|Bd
26
J1.5
FBA03
2.5M0.2 4.5M0.3
K0
1.0max 1.0max
0.65
M0.05
10.0
f0.098M0.008gf0.177M0.012gf1.02 gf0.039maxgf0.039maxgf0.026M0.002gf0.394g
26
J1.5
FBA04
3.5M0.2 4.5M0.3
K0
1.0max 1.0max 0.65
M0.05
10.0
f0.138M0.008gf0.177M0.012gf1.02 gf0.039maxgf0.039maxgf0.026M0.002gf0.394g
FBR07G850 7.5M0.5 5.5 7.0max.. 0.6M0.05 5000
f0.295M0.020gf0.217gf0.276max.gf0.024M0.002gf0.197 M0.0g
FBR07G121 7.5M0.5 7.5 9.0max. 0.6M0.05 5000
f0.295M0.020gf0.295gf0.354max.gf0.024M0.002gf0.197 M0.0g
Type
FBR05VA121 5.0max. 7.5 9.0max. 0.65M0.05 109999
f0.197max.g
f0.295gf0.354max.g
f0.026M0.002gf0.394 M0.00g
FBR06G850 6M0.5 5.0 7.0max. 0.65M0.05 109999
f0.236M0.020gf0.197g
f0.276max.g
f0.026M0.002gf0.394 M0.00g
FBR06G121 6M0.5 7.0 9.0max. 0.65M0.05 109999
f0.236M0.020gf0.276g
f0.354max.g
f0.026M0.002gf0.394 M0.00g
Type
ラジアルリード Radial leadfFBRg
Type
寸法 Dimensions hmmi finchg
DL L1Bdb
WF
FBR05VA121 2.5max. 2.5M1
f0.098max.gf0.098M0.039g
FBR06G850 3.0M0.5 2.5M1
f0.118M0.020gf0.098M0.039g
FBR06G121 3.0M0.5 2.5M1
f0.118M0.020gf0.098M0.039g
Type
寸法 Dimensions hmmi finchg
DL L1Bdb
FBR07G850 2.5max. 5000
f0.098max.gf0.197 M0.0g
FBR07G121 2.5max. 5000
f0.098max.gf0.197 M0.0g
WF
NA形状
J3
K5
J3
K5
J3
K5
J1
K2
J1
K2
J1
K0.5
J1
K0.5
3テーピング寸法 Taping Dimensions
AB (a : 26mm) 形状
BG (a : 52mm) 形状
UnitDmmfinchg
UnitDmmfinchg
J0.118
K0.197
J0.118
K0.197
J0.118
K0.197
NB形状
J0.039
K0.079
J0.039
K0.079
J0.039
K0.020
J0.039
K0.020
最 小
挿入ピッチ
Minimum
insertion
pitch
UnitDmmfinchg
最 小
挿入ピッチ
Minimum
insertion
pitch
f1.02inch lead spaceg
UnitDmmfinchg
J0.059
K0
J0.059
K0
f2.05 inches lead spaceg
J0.079
K0.039
J0.079
K0.039
332
梱包 PACKAGING
寸 法 記号 寸法 記号 寸法
Type Symbol Dimensions Symbol Dimensions
AW18000
9.0max. f0.709 g
f0.354maxgWo 12.5min.
f0.492min.g
T 2.5max. W19
f0.098max.gf0.354 g
D 5.0max. W23max.
f0.197max.gf0.118max.g
H 18.0000 b1.0max.
f0.7090000gf0.039max.g
P 12.7M1.0 BD04M0.3
FBR05
f0.500M0.039gf0.157M0.012g
P012.7M0.3 Bd0.65M0.05
f0.500M0.039gf0.026M0.002g
P15.1M0.7 L 11.0max.
f0.201M0.028gf0.433max.g
P26.35M1.3 t 0.7M0.2
f0.250M0.051gf0.028M0.008g
F 2.5000
f0.09800000g
Qh0M2
f0M0.079g
寸 法 記号 寸法 記号 寸法
Type Symbol Dimensions Symbol Dimensions
A19.0max. W18000
f0.354max.gf0.709 g
7.0max. Wo 12.5min.
f0.276max.gf0.492min.g
T 2.5max. W19
f0.098max.gf0.354 g
D7.5M0.5 W23max.
f0.925M0.020gf0.118max.g
H 18.0000 b1.0max.
f0.7090000gf0.039max.g
P 12.7M1.0 BD04M0.3
FBR07
f0.500M0.039gf0.157M0.012g
P012.7M0.3 Bd 0.6M0.05
f0.500M0.012gf0.024M0.002g
P13.85M0.8 L 11.0max.
f0.152M0.028gf0.433max.g
P26.35M1.3 t 0.7M0.2
f0.250M0.051gf0.028M0.008g
F5000
f0.19700000g
Qh0M2
f0M0.079g
SA (F : 2.5mm pitch) 形状 SB (F : 5mm pitch) 形状
(0.197 inches)
(0.098 inches)
J1.0
K0.5
J2.0
K0
J0.079
K0
J1.0
K0.5
J0.039
K0.020
J0.039
K0.020
UnitDmmfinchg
121D
J1.0
K0.5
J2.0
K0
J0.079
K0
J0.039
K0.020
J0.039
K0.020
UnitDmmfinchg
J1.0
K0.5
F1 20ピッチにつき、累積誤差M2mm以内。
F2 貼付テープは、台紙よりはみ出さないこと。
F1 Accumulated error for 20 pitches is M2mm.
F2 Bonding tape must not protrude from the base tape.
F1 20ピッチにつき、累積誤差M2mm以内。
F2 貼付テープは、台紙よりはみ出さないこと。
F1 Accumulated error for 20 pitches is M2mm.
F2 Bonding tape must not protrude from the base tape.
F1
121D
850D
F1
F2
F2
J0.75
K0.5
J0.039
K0.020
J0.75
K0.5
J0.039
K0.020
333
梱包 PACKAGING
FERRITE PRODUCTS
5
4.5M0.3
f0.177M0.012g
9.0max.
f0.354max.g
2.7max.
f0.106max.g
3.7max.
f0.146max.g
20.0M0.3
f0.787 M0.3g
12.7M0.1
f0.500M0.039g
12.7M0.3
f0.500M0.012g
3.85M0.8
f0.152M0.032g
6.35M1.3
f0.250M0.051g
5.0M1.0
f0.197M0.039g
0M2
f0M0.079g
18000
f0.7090000g
12.5min.
f0.492min.g
9
f
0.354
g
3.0max.
f0.118max.g
1.0max.
f0.039max.g
4.0M0.3
f0.157M0.012g
0.65M0.05
f0.026M0.002g
11.0max.
f0.433max.g
0.7M0.2
f0.028M0.008g
5.0M1.0
f0.197M0.039g
0M2
f0M0.079g
18000
f0.70900 00g
12.5min.
f0.492min.g
9
f0.354 g
3.0max.
f0.118max.g
1.0max.
f0.039max.g
4.0M0.3
f0.157M0.012g
0.65M0.05
f0.026M0.002g
11.0max.
f0.433max.g
0.7M0.2
f0.028M0.008g
4.5M0.3
f0.177M0.012g
6.000.3
f0.236 0.0 g
9.0M0.5
f0.354M0.020g
12.5max.
f0.492max.g
16.0max.
f0.630max.g
3.7max.
f0.146max.g
16.0M0.5
f0.650M0.020g
12.7M1.0
f0.500M0.039g
12.7M0.3
f0.500M0.012g
3.85M0.8
f0.152M0.032g
6.35M1.3
f0.250M0.051g
UB 形状 VB 形状
寸 法 記号 寸法 記号 寸法
Type Symbol Dimensions Symbol Dimensions
FBA03G450
FBA04G450
J0.020
K0.039
J0.5
K1.0
J1.0
K0.5
J0.039
K0.020
F1 20ピッチにつき、累積誤差M2mm以内。
F2 貼付テープは、台紙よりはみ出さないこと。
F1 Accumulated error for 20 pitches is M2mm.
F2 Bonding tape must not protrude from the base tape.
UnitDmmfinchg
03D
04D
A
A1
BD
H
P
P0
P1
P2
F
Qh
W
W0
W1
W2
b
BD0
Bd
L
t
寸 法 記号 寸法 記号 寸法
Type Symbol Dimensions Symbol Dimensions
FBA04G450
FBA04G600
FBA04G900
A
A1
BD
H0
P
P0
P1
P2
F
Qh
W
W0
W1
W2
b
BD0
Bd
L
t
450:
600:
900:
450
600:
900:
J1.0
K0.5
J0.039
K0.020
F1 20ピッチにつき、累積誤差M2mm以内。
F2 貼付テープは、台紙よりはみ出さないこと。
F1 Accumulated error for 20 pitches is M2mm.
F2 Bonding tape must not protrude from the base tape.
UnitDmmfinchg
F1
F2
F2
F1
J0.5
K0
J0.020
K0
J0.75
K0.5
J0.039
K0.020
J0.75
K0.5
J0.039
K0.020
339
FERRITE PRODUCTS
5
Item
LA02 Type/
LA03 Type
Specified Value
Test Method and Remarks
1.Operating temperature
Range
2.Storage temperature
Range
3.Rated current
4.Impedance
5. Inductance
LAYFLD
Including self-generated heat
LHL□□□D
Including self-generated heat
[LHL□□□]
LAD
The maximum DC value having inductance within 10% and
temperature incease within 20℃ by the application of DC bias.
LHL□□□YLAV35D
The maximum DC value having inductance decrease within
10% and temperature incease within the following speci-
fied temperature by the application of DC bias.
Reference temperature D20CfLHL06, LAV35g
D25CfLHL08, LHL10, LHL13g
D30CfLHLC06, LHLZ06, LHL16,
LHLP□□g
FBD
No disconnection or appearance abnormaliry by continuous
current application for 30 min. Chage after the application shall
be within ±20% of the initial value.This is not guaranteed for
electrial characteristics during current application.
FLD
The maximum DC value having temperature rise within
specified value.
FBD
Measuring equipmentDImpedance analyzer fHP4191Agor
its equivalent
Measuring frequencyDSpecified frequency
FL06BTD
Measuring equipmentD4291A fHPg or its equivalent
Measuring frequencyDSpecified frequency
LAD
Measuring equipmentDLCR meterfHP4285A + HP42851A or
its equivalentg
Measuring frequency
D
Specified frequency
LHL□□□D
Measuring equipmentDQ meterfHP4285AJHP42851A or
its equivalentg
LCR meterfHP4262Agor its
equivalentfat 1KHzg
Measuring frequencyDSpecified frequency
LAV35D
Measuring equipmentDQ meterfHP4285AJHP42851A or
its equivalentg
Measuring frequencyDSpecified frequency
FL05R□D
Measuring equipmentDHP4262A or its equivalent.
Measuring frequencyD1kHz
LA05
Type
LHL
□□□
FBA/FBR LAV35LA04
Type
Within the specified tolerance
FL05
□
Type
FL06BT
Type
K25VJ85C
Within the
specified
tolerance
Within the specified toler-
ance
Refer to
individual
specifica-
tion
K25VJ105C
K40VJ85C
Within the specified tolerance
K25VJ105C
RELIABILITY DATA 1/9
341
FERRITE PRODUCTS
5
Item
LA02 Type/
LA03 Type
Specified Value
Test Method and Remarks
6.Q
7.DC Resisitance
8.Self resonance frequency
9.
Temperature characteristic
LAD
Measuring equipmentDLCR meterfHP4285AJHP42851A
or its equivalentg
Measuring frequencyDSpecified frequency
LHL□□□YLAV35fexcept LHLPgD
Measuring equipmentDQ
meter
fHP4285AJHP42851A or
its equivalentg
Q meterfHP4342Agor its equivalent
Measuring frequencyDSpecified frequency
LAD
Measuring equipmentDlow ohmmeter fA&D AD5812 or its
equivalentg
LHL□□□YFBYLAV35YFLD
Measuring equipmentDDC ohmmetr
LAD
Measuring equipmentDNetwork analyzerfAnritsu MS620J
or its equivalentg
LHL□□□YLAV35fexcept LHLPgD
Measuring equipmentDfHP4191A, 4192Ag its equivalent
LAD
Change of maximum inductance deviation in step 1to5
step Temperature
f
C
g
120
2K25
f
Minimum operating temperature
g
3 20
f
Standard temperature
g
4J85
f
Maximum operating temperature
g
520
LHLYLAV35D
[LHL□□□, LAV35]
Change of maximum inductance deviation in step 1to5
Temperature at step 1D20C
Temperature at step 2DMinimum operating temperature
Temperature at step 3D20C
f
Standard temperature
g
Temperature at step 4DMaximum operating temperature
Temperature at step 5D20C
LA05
Type
LHL
□□□
FBA/FBR LAV35LA04
Type
Within the specified tolerance
△L/LD
WithinM7L
FL05
□
Type
FL06BT
Type
Within the
specified
tolerance
Within the
specified
tolerance
△L/LD
WithinM5L
Within the specified tolerance
Within the specified tolerance
△L/LDWithinM5L
RELIABILITY DATA 2/9
343
FERRITE PRODUCTS
5
Item
LA02 Type/
LA03 Type
Specified Value
Test Method and Remarks
10.Terminal strengthD
tensile force
11.Over current
12.Terminal strengthD
bending
13.Insulation resisitanceD
between the terminals
and body
14.Insulation resistanceD
between terminals and
core
15.WithstandingDbetween
the terminals and body
LAD
Apply the stated tensile force progressively in the direction
to draw terminal.
force(N) durationfSg
25 5
LHL□□□YLAVD
Apply the stated tensile force progressively in the direction
to draw terminal.
Nominal wire
diameter tensile
force durationfSg
BdfmmgfNg
0.3<BdT0.5 5
0.5<BdT0.8 10 30M5
0.8<BdT1.2 25
FBAD
A bead shall be fixed and static loaded 20M1Nf2.0M0.1 kgfg
in axial direction of lead wire in 10M1 seconds.
FL05R□D
Fix the component in the direction to draw terminal,and
gradually apply the tensile force of 4.9 N.
LHL□□□D
Measuring currentDRated currentP2
DurationD5min.
Number of measuringDone time
LAD
Suspend a mass at the end the terminal，incline the body
though angel of 90 and return it to initial position.This op-
eration is done over a period of 2-3 sec.Then second bend
in the opposite direction shall be made.
Number of bendsDTwo times.
Nominal wire Bending Mass reference
diameter tensile force weight
BdfmmgfNgfkgg
0.3<BdT0.5 2.5 0.25
0.5<BdT0.8 5 0.50
LHYFBYLAVD
Suspend a mass at the end the terminal，incline the body
though angel of 90 and return it to initial position.This op-
eration is done over a period of 2-3 sec.Then second bend
in the opposite direction shall be made.
Number of bendsDTwo times.
Nominal wire Bending Mass reference
diameter tensile force weight
BdfmmgfNgfkgg
0.3<BdT0.5 2.5 0.25
0.5<BdT0.8 5 0.5
0.8<BdT1.2 10 1.0
LHL□□□D
Applied voltageD500 VDC
DurationD60 sec.
FBAYFBRD
Applied voltageD100 VDC
DurationD60M5 sec.
〔LHL□□□〕
Accoding to JIS C5102. 7. 1. 3 fCg
Metal global method
Applied voltageD500 VDC
DurationD60 sec.
LA05
Type
LHL
□□□
FBA/FBR LAV35LA04
Type
No abnormality such as cut lead
,
or looseness.
There shall
be no scorch
or short of
wire.
100MΩmin.
No abnor-
mality such
as insula-
tion dam-
age
FL05
□
Type
FL06BT
Type
No abnor-
mality such
as cut lead
,
or loose-
ness.
1MΩmin.
fOther than
materail
code MAg
No abnormality such as cut lead
,
or looseness. No abnormality such as cut
lead,or looseness.
RELIABILITY DATA 3/9
345
FERRITE PRODUCTS
5
Item
LA02 Type/
LA03 Type
Specified Value
Test Method and Remarks
16.DC bias characteristic
17.Body strength
18.Resisitance to vibration
LAYLAV35D
Measure inductance with appliation of rated current using
LCR meter to compare it with the initial value.
LA02YLAV35D
Applied forceD30N
DurationD10 sec.
SpeedDShall attain to specified force in 2 sec.
LA03YLA04YLA05D
Applied forceD50N
DurationD10 sec.
SpeedDShall attain to specified force in 2 sec.
FBD
Applied forceD50M3N
DurationD30M1 sec.
LAD
Accoding to JIS C5102 8. 2
Vibaration typeDA
DirectionsD2 hrs each in X, Y and Z directions totalD6hrs.
Frequency rangeD10 to 55 to 10Hzf1min.g
AmplitudeD1.5mm
Mounting methodDSoldering onto printed board.
RecoveryDAt least 1hr of recovery under the standard
condition after the test, followed by the mea-
surement within 2hrs.
LHL□□□YFBYLAVD
Accoding to JIS C0040
Vibaration typeDA
DirectionsD2 hrs each in X, Y and Z directions totalD6hrs.
Frequency rangeD10 to 55 to 10Hzf1min.g
AmplitudeD1.5mm fBut don't exceed acceleration 196m/s
ftwo powerg
Mounting methodDSoldering onto printed board.
LA05
Type
LHL
□□□
FBA/FBR LAV35LA04
Type
AppearanceD
No
abnomality
△L/LD
WithinM5L
Q changeD
WithinM30L
fLHLPD
only △L/Lg
FL05
□
Type
FL06BT
Type
△L/LD
K10L
Within
No abnor-
mality as
damage.
△L/LD
WithinM5L
QD30min.
No signifi-
cant dam-
age such as
cracks on
body.
AppearanceD
No
abnomality
Impedance
changeD
WithinM20L
△L/LD
WithinM5L
△Q/QD
WithinM10L
△L/LD
WithinM5L
QD15min.
No abnormality as damage.
△L/LD
WithinM5L
QD30min.
△L/LDWithin K10L
RELIABILITY DATA 4/9
347
FERRITE PRODUCTS
5
Item
LA02 Type/
LA03 Type
Specified Value
Test Method and Remarks
19.Resistance to shock
20.Solderability
LAYLAV35D
Drop test
Impact materialDconcrete or vinyl tile
HeightD1m
Total number of dropsD10 times
LAD
Solder temperatureD230M5C
DurationD2M0.5 sec.
LHL□□□D
Solder temperatureD235M5C
DurationD2M0.5 sec.
Immersion depthDUp to 1.5mm from bottom of kinked part.
[LHL06, LHLC06, LHLZ06]
DUp to 1.5mm from bottom of case.
[LHL08, LHL10, LHL13, LHL16]
FBD
Solder temperatureD230M5C
DurationD3M1 sec.
Immersion depthDUp to 1.5mm from terminal root.
LAV35D
Solder temperatureD230M5C
DurationD2M0.5 sec.
FL05R□D
Solder temperatureD230M5C
DurationD2M0.5 sec.
Immersion depthDUp to 2V2.5mm from terminal root.
FL06BTD
Solder temperatureD230M5C
DurationD3M1 sec.
Immersion depthDUp to 0.5V1.0mm from terminal root.
LA05
Type
LHL
□□□
FBA/FBR LAV35LA04
Type
No significant abnormality in appearance
At least 75L of terminal electrode is
coverd by new solder.
At least
75L of lead
circu
,
ference is
covered by
new solder.
FL05
□
Type
FL06BT
Type
No signifi-
cant abnor-
mality in ap-
pearance
At least
90L of lead
circu
,
ference is
covered by
new solder.
At least 75L of lead circu, ference is
covered by new solder.
RELIABILITY DATA 5/9
349
FERRITE PRODUCTS
5
Item
LA02 Type/
LA03 Type
Specified Value
Test Method and Remarks
21.Resisitance to soldering
heat
LAD
Solder temperatureD260M5CfLA02g
270M5CfLA03YLA04YLA05g
DurationD5M0.5 sec. One time
Immersed conditions
D
Inserted into substrate withｔ= 1.6mm
RecoveryDAt least 1hr of recovery under the standard
condition after the test, followed by the mea-
surement within 2hrs.
LHL□□□D
Solder bath method
Solder temperatureD260M5C
DurationD10M1 sec.
DUp to 1.5mm from bottom of kinked part.
[LHL06, LHLC06, LHLZ06]
DUp to 1.5mm from bottom of case.
[LHL08, LHL10, LHL13, LHL16, LHLP□□]
Manual soldering
Solder temperatureD350M10CfAt the tip of soldering irong
DurationD5M1 sec.
DUp to 1.5mm from bottom of kinked part.
[LHL06, LHLC06, LHLZ06]
DUp to 1.5mm from bottom of case.
[LHL08, LHL10, LHL13, LHL16, LHLP□□]
CautionDNo excessive pressing shall be applied to terminald
RecoveryD4 to 24hrs of recovery under the standard con-
dition after the tset.
FBD
Solder bath method
Condition 1
Solder temperatureD260M5C
DurationD10M1 sec.
Immersion depthDUp to 1.5mm from terminal root.
Condition 2
Solder temperatureD350M5C
DurationD3M1 sec.
Immersion depthDUp to 1.5mm from terminal root.
RecoveryD3hrs of recovery under the standard condition
after the test.
LAV35D
Solder temperatureD260M5C
DurationD5M0.5 sec.
Immersion depthDUp to 2.0 to 2.5mm from botoom of
kinked part.
RecoveryD4 to 24hrs of recovery under the standard con-
dition after the tset.
FLD
Solder conditionD260M5C 10M1 sec.
Immersion depthDUp to 0.5 to 1.0mm from terminal root.
RecoveryD3hrs of recovery under the standard condition
after the test.
LA05
Type
LHL
□□□
FBA/FBR LAV35LA04
Type
No significant abnormality
in appearance
No signifi-
cant abnor-
mality in ap-
pearance
Inductance
changeD
WithinM5L
Q changeD
WithinM30L
fLHLPD
only △L/Lg
FL05
□
Type
FL06BT
Type
△L/LD
WithinM5L
QD30min.
No signifi-
cant abnor-
mality in ap-
pearance
Impedance
change
D
WithinM20L
Refer to
individual
specifica-
tion
△L/LD
Within M5L
QD15min.
No signifi-
cant abnor-
mality in ap-
pearance
Impedance
change：
WithinM20L
RELIABILITY DATA 6/9
351
FERRITE PRODUCTS
5
J0
K3
J2
K0
J0
K3
J2
K0
J0
K3
J2
K0
J0
K3
J2
K0
RELIABILITY DATA 7/9
Item
LA02 Type/
LA03 Type
Specified Value
Test Method and Remarks
22.Resisitance to solvent
23.Thermnal shock
FBD
Solvent temperatureD20V25C
DurationD30M5 sec.
Solvent typeDAcetone, trichloroethylene
RecoveryD3hrs of recovery under the standard condition
after the test.
LAD
Conditions for 1cycle
Step Temperature
f
C
g
Duration
f
min
g
1K25 30M3
2 Room temperature Within 3
3J85 30M3
4 Room temperature Within 3
Number of cyclesD5 cycles
RecoveryDAt least 1hr of recovery under the standard
condition after the removal from test chamber,
followed by the measurement within 2hrs.
LHL□□□D
Accoding to JIS C0025
Conditions for 1 cycle
Step Temperature
f
C
g
Duration
f
min
g
1Minimum operating 30M3
temperature
2 Room temperature Within 3
3Maximum oparating 30M3
temperature
4 Room temperature Within 3
Number of cyclesD10 cycles
〔LHL□□□〕
D5 cycles
f
FBA, FBR
g
Recovery
D
4 to 24hrs of recovery under the standard con-
dition after the removal from the test cfamber.
〔LHL□□□〕
D3hrs of recovery under the standard condition af-
ter the removal from the test cfamber.fFBA, FBRg
LAVD
Conditions for 1 cycle
Step Temperature
f
C
g
Duration
f
min
g
1Minimum operating 30M3
temperature
2 Room temperature Within 3
3Maximum oparating 30M3
temperature
4 Room temperature Within 3
Number of cyclesD10 cycles
RecoveryDAt least 1hr of recovery under the standard
condition after the removal from test chamber,
followed by the measurement within 2hrs.
FLD
Accoding to JIS C0025
Conditions for 1 cycle
Step Temperature
f
C
g
Duration
f
min
g
1K25 30M3
2 Room temperature Within 3
3J85 30M3
4 Room temperature Within 3
Number of cyclesD10 cycles
RecoveryD1 to 2hrs of recovery under the standard con-
dition after the removal from the test cfamber.
LA05
Type
LHL
□□□
FBA/FBR LAV35LA04
Type
△L/LD
WithinM10L
QD30min.
AppearanceD
No abnor-
mality
Inductance
changeD
WithinM10L
Q changeD
WithinM30L
fLHLPD
only △L/Lg
FL05
□
Type
FL06BT
Type
Please
avoid the ul-
trasonic
cleaning of
this product.
△L/LD
WithinM10L
QD20min.
No signifi-
cant abnor-
mality in ap-
pearance
Impedance
changeD
WithinM20L
AppearanceD
No abnor-
mality
Impedance
changeD
WithinM20L
Refer to
individual
specifica-
tion
△L/LD
WithinM10L
△Q/QD
WithinM30L
△L/LD
WithinM10L
QD15min.
AppearanceD
No abnor-
mality
Impedance
changeD
WithinM20L
Pleasa avoid the ultrasonic cleaning of
this product.
353
FERRITE PRODUCTS
5
RELIABILITY DATA 8/9
Item
LA02 Type/
LA03 Type
Specified Value
Test Method and Remarks
24.Damp heat
25.Loading under damp heat
26.Loading at high tempera-
ture
LAYLAV35D
TemperatureD40M2C
HumidityD90
V
95LRH
DurationD1000 hrs
RecoveryDAt least 1hr of recovery under the standard re-
moval from test chamber, followed by the mea-
surement within 2hrs.
FBD
TemperatureD60M2C
HumidityD90
V
95LRH
DurationD1000 hrs
RecoveryD1 to 2hrs of recovery under the standard con-
dition after the removal from the test cfamber.
LAYLAV35D
TemperatureD40M2C
HumidityD90V95LRH
DurationD1000 hrs
Applied currentDRated current
RecoveryDAt least 1hr of recovery under the standard re-
moval from test chamber, followed by the mea-
surement within 2hrs.
LHL□□□D
TemperatureD40M2C
HumidityD90V95LRH
DurationD1000M24 hrs
Applied currentDRated current
RecoveryD1 to 2hrs of recovery under the standard con-
dition after the removal from the test cfamber.
FLD
TemperatureD60M3C
HumidityD90V95LRH
DurationD500 fJ12, K0ghrs
Applied currentDRated current
RecoveryD1 to 2hrs of recovery under the standard con-
dition after the removal from the test cfamber.
LAYLAV35D
TemperatureD85M2C
DurationD1000 hrs
Applied currentDRated current
RecoveryDAt least 1hr of recovery under the standard re-
moval from test chamber, followed by the mea-
surement within 2hrs.
LA05
Type
LHL
□□□
FBA/FBR LAV35LA04
Type
△L/LD
WithinM10L
QD30min.
△L/LD
WithinM10L
QD30min.
△L/LD
WithinM10L
QD30min.
AppearanceD
No abnor-
mality
Imductance
changeD
WithinM10L
Q changeD
WithinM30L
fLHLPD
only △L/Lg
FL05
□
Type
FL06BT
Type
△L/LD
WithinM10L
QD20min.
△L/LD
WithinM10L
QD20min.
△L/LD
WithinM10L
QD20min.
AppearanceD
No abnor-
mality
Impedance
changeD
WithinM20L
Refer to
individual
specifica-
tion
△L/LD
WithinM10L
△Q/QD
WithinM30L
△L/LD
WithinM10L
△Q/QD
WithinM30L
△L/LD
WithinM10L
△Q/QD
WithinM30L
△L/LD
WithinM10L
QD15min.
△L/LD
WithinM10L
QD15min.
△L/LD
WithinM10L
QD15min.
AppearanceD
No abnor-
mality
Impedance
changeD
WithinM20L
355
FERRITE PRODUCTS
5
RELIABILITY DATA 9/9
Item
LA02 Type/
LA03 Type
Specified Value
Test Method and Remarks
27.Low temperature life test
28.High temperature life test
LAD
TemperatureDK25M2C
DurationD1000 hrs
RecoveryDAt least 1hr of recovery under the standard re-
moval from test chamber, followed by the mea-
surement within 2hrs.
LHL□□□D
TemperatureDK40M3C
DurationD1000M24 hrs
RecoveryD1 to 2hrs of recovery under the standard con-
dition after the removal from the test cfamber.
LAV35D
TemperatureDK40M3C
DurationD1000 hrs
RecoveryDAt least 1hr of recovery under the standard re-
moval from test chamber, followed by the mea-
surement within 2hrs.
FLD
TemperatureDK40M3C
DurationD500fJ12, K0ghrs
RecoveryD1 to 2hrs of recovery under the standard con-
dition after the removal from the test cfamber.
LHL□□□D
TemperatureD105M3C
DurationD1000M24 hrs
RecoveryD1 to 2hrs of recovery under the standard con-
dition after the removal from the test cfamber.
FLD
TemperatureD85M3C
DurationD500fJ12, K0ghrs
RecoveryD1 to 2hrs of recovery under the standard con-
dition after the removal from the test cfamber.
LA05
Type
LHL
□□□
FBA/FBR LAV35LA04
Type
△L/LD
WithinM10L
QD30min.
AppearanceD
No abnor-
mality
Inductance
change
D
WithinM10L
Q changeD
WithinM30L
fLHLPD
only △L/Lg
AppearanceD
No abnor-
mality
Inductance
changeD
WithinM10L
Q changeD
WithinM30L
FL05
□
Type
FL06BT
Type
△L/LD
WithinM10L
QD20min.
Refer to
individual
specifica-
tion
Refer to
individual
specifica-
tion
△L/LD
WithinM10L
△Q/QD
WithinM30L
△L/LD
WithinM10L
QD15min.
AppearanceD
No abnor-
mality
Impedance
changeD
WithinM20L
AppearanceD
No abnor-
mality
Impedance
changeD
WithinM20L
357
FERRITE PRODUCTS
5
Technical considerationsStages Precautions
LA Type，LH Type，FB Type，FL Type
1.Circuit Design
2.PCB Design
3.Considerations for
automatic placement
4.Soldering
5.Cleaning
6.Handling
7.Storage conditions
Operating environment,
1.The products described in this specification are intended for
use in general electronic equipment,(office supply
equipment, telecommunications systems, measuring
equipment, and household equipment). They are not
intended for use in mission-critical equipment or systems
requiring special quality and high reliability (traffic systems,
safety equipment, aerospace systems, nuclear control
systems and medical equipment including life-support
systems,) where product failure might result in loss of life,
injury or damage. For such uses, contact TAIYO YUDEN
Sales Department in advance.
Design
1.Please design insertion pitches of a base in the pitches that
fitted a terminal interval.
Adjustment of mounting machine
1.Excessive impact load should not be imposed on the
products when mounting onto the PC boards.
2.Mounting and soldering conditions should be checked
beforehand.
Wave soldering
1.Please refer to the specifications in the catalog for a wave
soldering.
2.Do not immerse the entire Inductors in the flux during the
soldering operation.
Lead free soldering
1.When using products with lead free soldering, we request to
use them after confirming of adhesion, temperature of
resistance to soldering heat, soldering etc sufficiently.
Recommended conditions for using a soldering iron:
Put the soldering iron on the land-pattern.
Soldering iron's temperature - Below 350 ℃
Duration - 3 seconds or less
The soldering iron should not directly touch the inductor.
Cleaning conditions
1.LA type, LH type
Please do not do cleaning by a supersonic wave.
Handling
1.Keep the inductors away from all magnets and magnetic
objects.
Mechanical considerations
1.Please do not give the inductors any excessive mechanical
shocks.
2.LH type
If inductors are dropped onto the floor or a hard surface they
should not be used.
Packing
1.Please do not give the inductors any excessive mechanical
shocks.
In loading, please pay attention to handling indication
mentioned in a packing box (a loading direction / number of
maximum loading / fragile item).
Storage
Storage
1.To maintain the solderability of terminal electrodes and to
keep the packing material in good condition, temperature
and humidity in the storage area should be controlled..
・Recommended conditions
Ambient temperature 0〜40℃
Humidity Below 70 % RH
The ambient temperature must be kept below 30℃. Even
under ideal storage conditions, solderability of products
electrodes may decrease as time passes. For this reason,
inductors should be used within one year from the time of
delivery.
In case of storage over 6 months, solderability shall be
checked before actual usage.
1.When Inductors are mounted onto a PC board, hole dimensions on the board should
match the lead pitch of the component, if not, it will cause breakage of the terminals or
cracking of terminal roots covered with resin as excess stress travels through the
terminal legs.
1. When installing products, care should be taken not to apply distortion stress as it may
deform the products.
1.If products are used beyond the range of the recommended conditions, heat stresses
may deform the products, and consequently degrade the reliability of the products.
LA type, LH type
1.If washing by supersonic waves, supersonic waves may deform products.
1.There is a case that a characteristic varies with magnetic influence.
1.There is a case to be damaged by a mechanical shock.
2.LH type
There is a case to be broken by a fall.
1.There is a case that a lead route turns at by a fall or an excessive shock.
1. Under a high temperature and humidity environment, problems such as reduced
solderability caused by oxidation of terminal electrodes and deterioration
of taping/packaging materials may take place.
PRECAUTIONS
