3517/10100SF - 3M - Datasheet.Directory

June 2007 Rev 3 1/11

SMP50 / SMTPA / TPA

Trisil™ for telecom equipment protection

Features

■Bidirectional crowbar protection

■Voltage range from 62 V to 320 V

■Low capacitance from 12 pF to 20 pF @ 50 V

■Low leakage current : IR = 2 µA max

■Holding current: IH = 150 mA min

■Repetitive peak pulse current :

IPP = 50 A (10/1000 µs)

Main applications

Telecommunication equipment such as:

■Analog and digital line cards (xDSL, T1/E1,

ISDN, ...)

■Terminals (phone, fax, modem, ...) and central

office equipment

Description

These Trisil series have been designed to protect

telecommunication equipment against lightning

and transient induced by AC power lines.

They are available in SMA, SMB and DO-15

packages.

Benefits

Trisils are not subject to ageing and provide a fail

safe mode in short circuit for a better protection.

They are used to help equipment to meet various

standards such as UL1950, IEC950 / CSA C22.2,

UL1459 and FCC part 68.

Trisils have UL94 V0 approved resin.

SMA and SMB packages are JEDEC registered

(DO-214AC and DO-214AA).

Trisils are UL497B approved (file: E136224).

TM: TRISIL is a trademark of STMicroelectronics

Order codes

Schematic Diagram

Part Number Marking

SMP50-xxx

See Ordering Information

on page 9

TPAxxx

SMTPAxxx

SMA

(JEDEC DO-214AC)

SMP50

SMB

(JEDEC DO-214AA)

SMTPA

DO-15

TPA

www.st.com

Characteristics SMP50 / SMTPA / TPA

2/11

1 Characteristics

Table 1. Compliant with the following standards

Standard

Peak Surge

Voltage

(V)

Waveform

Voltage

Required

peak current

(A)

Current

waveform

Minimum serial

resistor to meet

standard (Ω)

GR-1089 Core

First level

2500

1000

2/10 µs

10/1000 µs

500

100

2/10 µs

10/1000 µs

GR-1089 Core

Second level 5000 2/10 µs 500 2/10 µs 40

GR-1089 Core

Intra-building 1500 2/10 µs 100 2/10 µs 0

ITU-T-K20/K21 6000

1500 10/700 µs 150

37.5 5/310 µs 53

ITU-T-K20

(IEC61000-4-2)

8000

15000 1/60 ns ESD contact discharge

ESD air discharge

VDE0433 4000

2000 10/700 µs 100

50 5/310 µs 21.5

VDE0878 4000

2000 1.2/50 µs 100

50 1/20 µs 0

IEC61000-4-5 4000

4000

10/700 µs

1.2/50 µs

100

5/310 µs

8/20 µs

21.5

FCC Part 68, lightning

surge type A

1500

800

10/160 µs

10/560 µs

200

100

10/160 µs

10/560 µs

12.5

6.5

FCC Part 68, lightning

surge type B 1000 9/720 µs 25 5/320 µs 0

Table 2. Absolute ratings (Tamb = 25° C)

Symbol Parameter Value Unit

IPP Repetitive peak pulse current (see Figure 1)

10/1000 µs

8/20 µs

10/560 µs

5/310 µs

10/160 µs

1/20 µs

2/10 µs

150

100

IFS Fail-safe mode : maximum current(1)

1. in fail safe mode, the device acts as a short circuit

8/20 µs 2.5 kA

ITSM

Non repetitive surge peak on-state current

(sinusoidal)

t = 0.2 s

t = 1 s

t = 2 s

t = 15 mn

11.5

3.5

I2tI

2t value for fusing t = 16.6 ms

t = 20 ms

6.2

6.5 A2s

Tstg

Storage temperature range

Maximum junction temperature

-55 to 150

150 °C

TLMaximum lead temperature for soldering during 10 s. 260 °C

SMP50 / SMTPA / TPA Characteristics

3/11

Table 3. Thermal resistances

Symbol Parameter

Value

Unit

DO-15 SMA SMB

Rth(j-a)

Junction to ambient (with recommended footprint

or with Llead = 10 mm for DO-15) 100 120 100 °C/W

Rth(j-l) Junction to leads (Llead = 10 mm for DO-15) 60 30 20 °C/W

Table 4. Electrical characteristics - definitions (Tamb = 25°C)

Symbol Parameter

VRM Stand-off voltage

VBR Breakdown voltage

VBO Breakover voltage

IRM Leakage current

IPP Peak pulse current

IBO Breakover current

IHHolding current

VRContinuous reverse voltage

IRLeakage current at VR

C Capacitance

Characteristics SMP50 / SMTPA / TPA

4/11

Table 5. Electrical characteristics - values (Tamb = 25°C)

Types IRM @ VRM IR @ VR(1) Dynamic

VBO(2)

Static

VBO @ IBO(3) IH(4) C(5) C(6)

max. max. max. max. max. min. typ. typ.

µA V µA V V V mA mA pF pF

SMP50-62 / TPA62

SMTPA62

62 85 82

800 150

20 40

SMP50-68 / TPA68

SMTPA68 61 68 93 90 20 40

SMP50-100 / TPA100

SMTPA100 90 100 135 133 16 35

SMP50-120 / TPA120

SMTPA120 108 120 160 160 16 30

SMP50-130 / TPA130

SMTPA130 117 130 173 173 14 30

SMP50-180 / TPA180

SMTPA180 162 180 235 240 14 25

SMP50-200 / TPA200

SMTPA200 180 200 262 267 12 25

SMP50-220 / TPA220

SMTPA220 198 220 285 293 12 25

SMP50-240 / TPA240

SMTPA240 216 240 300 320 12 25

SMP50-270 / TPA270

SMTPA270 243 270 350 360 12 25

SMP50-320 / SMTPA320 290 320 400 400 12 25

1. IR measured at VR guarantee VBR min ≥ VR

2. See functional test circuit 1(Figure 9.)

3. See test circuit 2(Figure 10.)

4. See functional holding current test circuit 3(Figure 11.)

5. VR = 50 V bias, VRMS = 1 V, F = 1 MHz

6. VR = 2 V bias, VRMS = 1 V, F = 1 MHz

Figure 1. Pulse waveform (10/1000 µs) Figure 2. Non repetitive surge peak on-state

current versus overload duration

100

Repetitive peak pulse current

tr = rise time (µs)

tp = pulse duration time (µs)

1E-2 1E-1 1E+0 1E+1 1E+2 1E+3

F=50Hz

t(s)

I (A)

TSM

SMP50 / SMTPA / TPA Characteristics

5/11

Figure 3. On-state voltage versus on-state

current (typical values)

Figure 4. Relative variation of holding

current versus junction

temperature

012345678910

V (V)

I (A)

T =25°C

-40 -20 0 20 40 60 80 100 120

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

T (°C)

I [T ] / I [T =25°C]

Hj Hj

Figure 5. Relative variation of breakover

voltage versus junction

temperature

Figure 6. Relative variation of leakage

current versus reverse voltage

applied (typical values)

-40 -20 0 20 40 60 80 100

0.90

0.95

1.00

1.05

1.10

62 V

270 V

V [T ] / V [T =25°C]

BO j BO j

T (°C)

25 50 75 100 125

100

1000

2000

I [T ] / I [T =25°C]

RM j RM j

V=V

RRM

T (°C)

Figure 7. Variation of thermal impedance

junction to ambient versus pulse

duration (Printed circuit board FR4,

SCu = 35 µm, recommended pad

layout)

Figure 8. Relative variation of junction

capacitance versus reverse voltage

applied (typical values)

1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2

1E-1

1E+0

1E+1

1E+2

Z (°C/W)

th(j-a)

SMTPA / TPA

SMP50

t (s)

1 2 5 10 20 50 100 300

0.0

0.5

1.0

1.5

2.0

2.5

V (V)

C[V ] / C[V =50V]

T =25°C

F=1MHz

V =1V

RMS

Characteristics SMP50 / SMTPA / TPA

6/11

Figure 9. Test circuit 1 for Dynamic IBO and VBO parameters

Figure 10. Test circuit 2 for IBO and VBO parameters

Figure 11. Test circuit 3 for dynamic IH parameters

100 V / µs, di /dt < 10 A / µs, Ipp = 50 A

1 kV / µs, di /dt < 10 A / µs, Ipp = 10 A

10 µF

2Ω45 Ω

66 Ω470 Ω

83 Ω

0.36 nF

46 µH

60 µF

26 µH

12 Ω

250 Ω46 µH

47 Ω

KeyTek 'System 2' generator with PN246I module

220V 50Hz

1/4

R1 = 140Ω

R2 = 240Ω

ton = 20ms

IBO

measurement

VBO

measurement

Vout DUT

TEST PROCEDURE

Pulse test duration (tp = 20ms):

V selection:

●

for Bidirectional devices = Switch K is closed

for Unidirectional devices = Switch K is open

Device with V > 200V V = 250 V , R1 = 140

OUT

BO OUT RMS

➔Ω

Device with V 200V V = 480 V , R2 = 240

BO OUT RMS

≥Ω➔

TEST PROCEDURE

1/ Adjust the current level at the I value by short circuiting the AK of the D.U.T.

2/ Fire the D.U.T. with a surge current

➔I=

10A, 10/1000µs.

3/ The D.U.T. will come back off-state within 50ms maximum.

This is a GO-NOGO test which allows to confirm the holding current (I ) level in a

functional test circuit.

BAT

= - 48 V

Surge generator

D.U.T

SMP50 / SMTPA / TPA Ordering information scheme

7/11

2 Ordering information scheme

3 Package information

●Epoxy meets UL94, V0

Figure 12. Footprint, dimensions in mm (inches)

SMP 50 - xxx

Series

Repetitive Peak Pulse Current

Voltage

SMP = Trisil surface mount in SMA

SMTP = Trisil surface mount in SMB

TP = Trisil in DO-15

A or 50 = 50 A

62 = 62 V

Table 6. SMA dimensions

Ref.

Dimensions

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.094

A2 0.05 0.20 0.002 0.008

b 1.25 1.65 0.049 0.065

c 0.15 0.40 0.006 0.016

D 2.25 2.90 0.089 0.114

E 4.80 5.35 0.189 0.211

E1 3.95 4.60 0.156 0.181

L 0.75 1.50 0.030 0.059

2.63

(0.103)

5.43

(0.214)

1.4

1.64

(0.064)

1.4

(0.055) (0.055)

Package information SMP50 / SMTPA / TPA

8/11

Figure 13. Footprint, dimensions in mm (inches)

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 7. SMB dimensions

Ref.

Dimensions

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087

c 0.15 0.40 0.006 0.016

E 5.10 5.60 0.201 0.220

E1 4.05 4.60 0.159 0.181

D 3.30 3.95 0.130 0.156

L 0.75 1.50 0.030 0.059

Table 8. DO-15 dimensions

Ref.

Dimensions

Millimeters Inches

Min. Max. Min. Max.

A 6.05 6.75 0.238 0.266

B 2.95 3.53 0.116 0.139

C 26 31 1.024 1.220

D 0.71 0.88 0.028 0.035

2.60

5.84

1.62

2.18

1.62

(0.064) (0.102)

(0.300)

(0.064)

(0.086)

SMP50 / SMTPA / TPA Ordering Information

9/11

4 Ordering Information

Part Number Marking Package Weight Base qty Delivery mode

SMP50-62 V06

SMA 0.068 g 5000 Tape & reel

SMP50-68 V07

SMP50-100 V10

SMP50-120 V12

SMP50-130 V13

SMP50-180 V18

SMP50-200 V20

SMP50-220 V22

SMP50-240 V24

SMP50-270 V27

SMP50-320 V32

SMTPA62 U01

SMB 0.11 g 2500 Tape & reel

SMTPA68 U05

SMTPA100 U13

SMTPA120 U17

SMTPA130 U19

SMTPA180 U25

SMTPA200 U27

SMTPA220 U31

SMTPA240 U35

SMTPA270 U39

SMTPA320 U47

TPA62 TPA62

DO-15 0.40 g

1000 Ammopack

TPA62RL 6000 Tape & reel

TPA68 TPA68 1000 Ammopack

TPA68RL 6000 Tape & reel

TPA100 TPA100 1000 Ammopack

TPA100RL 6000 Tape & reel

TPA120 TPA120 1000 Ammopack

TPA130 TPA130 1000 Ammopack

TPA130RL 6000 Tape & reel

TPA180 TPA180 1000 Ammopack

TPA180RL 6000 Tape & reel

TPA200 TPA200 1000 Ammopack

TPA200RL 6000 Tape & reel

TPA220 TPA220 1000 Ammopack

TPA220RL 6000 Tape & reel

TPA240 TPA240 1000 Ammopack

TPA240RL 6000 Tape & reel

TPA270 TPA270 1000 Ammopack

TPA270RL 6000 Tape & reel

Revision History SMP50 / SMTPA / TPA

10/11

5 Revision History

Date Revision Description of Changes

16-Nov-2004 1 SMP50, SMTPA and TPA datasheets merge.

30-Mar-2007 2

Reformatted to current standards. Updated IPP value in

Table 2 . Added part numbers SMP50-320 and

SMTPA320. Updated dimensions and footprint for SMA

and footprint for SMB.

12-Jun-2007 3 Corrected typographical error in part number. Added

dimensions in inches to footprint illustrations.

SMP50 / SMTPA / TPA

11/11

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