PTZ3.6B
THRU
PTZ36B
1 Watt
Zener Diode
3.6 to 36 Volts
Features
• Small surface mounting type.
• Voltage regulation and voltage limiting
• High surge withstand level.
• 1W of power can be obtained despite compact size.
0.05
0.085 ”
0.058 ”
SUGGESTED SOLDER
PAD LAYOUT
MAX
MIN
MIN
DO-214AC
(SMA)( LEAD FRAME)
DIMENSIONS
INCHES MM
DIM MIN MAX MIN MAX NOTE
A .079 .096 2.00 2.44
B .050 .064 1.27 1.63
C .002 .008 .05 .20
D --- .02 --- .51
E .030 .060 .76 1.52
F .065 .091 1.65 2.32
G .189 .220 4.80 5.59
H .157 .181 4.00 4.60
J .090 .115 2.25 2.92
H
J
E
F
G
A
B
D
C
omponents
20736 Marilla Street Chatsworth
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MCC
Revision:2 2008/03/21
TM
Micro Commercial Components
www.mccsemi.com
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Parameter Symbol Limits Unit
P
Tj 150 °C
Tstg °C
W1
−55~+150
Power dissipation ∗
Junction temperature
Storage temperature
∗
Mounting density of other power components should be taken into consideration
when laying out the pattern.
Maximum Ratings
• Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0 and MSL Rating 1
Notes:1.High Temperature Solder Exemption Applied, see EU Directive Annex 7.
• Lead Free Finish/RoHS Compliant(Note 1) ("P" Suffix designates
RoHS Compliant. See ordering information)
Revision:2 2008/03/21
MCC
PTZ3.6B THRU PTZ36B
TM
Micro Commercial Components
www.mccsemi.com
2 of 4
Electrical characteristics °
Zener voltage subdivision Operating resistance Reverse current
PTZ 3.6B 3.600 4.000
PTZ 3.9B 3.900 4.400 40 15 40 20 1.0
PTZ 4.3B 4.300 4.800 40 15 40 20 1.0
Type VZ (V) ZZ ( ) IR (µA)
Min. Max. Iz(mA) Max. Iz(mA) Max. VR(V)
40 15 40 20 1.0
PTZ 4.7B4.700 5.200
PTZ 5.1B 5.100 5.700 40 8 40 20 1.0
PTZ 5.6B 5.600 6.300 40 8 40 20 1.5
40 10 40 20 1.0
PTZ 6.2B6.200 7.000
PTZ 6.8B 6.800 7.700 40 6 40 20 3.5
PTZ 7.5B 7.500 8.400 40 4 40 20 4.0
40 6 40 20 3.0
PTZ 8.2B8.200 9.300
PTZ 9.1B 9.100 10.20 40 6 40 20 6.0
PTZ 10B 10.00 11.20 40 6 40 10 7.0
40 4 40 20 5.0
PTZ 11B11.00 12.30
PTZ 12B 12.00 13.50 20 8 20 10 9.0
PTZ 13B 13.30 15.00 20 10 20 10 10.0
20 8 20 10 8.0
PTZ 15B14.7016.50
PTZ 16B 16.20 18.30 20 12 20 10 12.0
PTZ 18B 18.00 20.30 20 12 20 10 13.0
20 10 20 10 11.0
PTZ 20B20.0022.40
PTZ 22B 22.00 24.50 10 14 10 10 17.0
PTZ 24B 24.00 27.60 10 14 10 10 19.0
20 14 20 10 15.0
PTZ 27B27.0030.80
PTZ 30B 30.00 34.00 10 18 10 10 23.0
PTZ 33B 33.00 37.00 10 18 10 10 25.0
10 16 10 10 21.0
PTZ 36B 36.00 40.00
10 20 10 10 27.0
Notes) 1. The Zener voltage is measured 40ms after power is supplied.
2. The operating resistances (Z
z
, Z
zk
) are measured by superimposing a minute alternating current on
the regulated current (I
z
).
ΩMarking
Z3.6B
Z3.9B
Z4.3B
Z4.7B
Z5.1B
Z5.6B
Z6.2B
Z6.8B
Z7.5B
Z8.2B
Z9.1B
Z10B
Z11B
Z12B
Z13B
Z15B
Z16B
Z18B
Z20B
Z22B
Z24B
Z27B
Z30B
Z33B
Z36B
Revision:2 2008/03/21
TPZ3.6B THRU TPZ36B MCC TM
Micro Commercial Components
www.mccsemi.com
3 of 4
z
zz
z(OHFWULFDOFKDUDFWHULVWLFFXUYHV°
0
0
Glass epoxy substrate
32
×
30
×
1.6 (mm)
82×30×1.0 (mm)
1200
1000
800
600
400
200
25 50 87.5 100 150 200
POWER DISSIPATION : Pd (mn)
AMBIENT TEMPERATURE : Ta (°C)
Ceramic substrate
Individual part
(not mounted)
Fig.1 Derating curve
0
114
×
124
×
1.6
(Units : mm)
1.5W
1.0W
0.5W
200
100
1 10 100
A
15mm
MOUNTING QUANTITY (pcs/substrate)
Fig.2 Rise in surface temperature
Alumina substrate
RISE IN DIODE A SURFACE TEMPERATURE (°C)
Mounting position
10mm
0
200
100
1 10 100
A
15mm
1.5W
1.0W
0.5W
144×220×1.6
(Units : mm)
Glass epoxy
substrate
RISE IN DIODE A SURFACE TEMPERATURE (°C)
MOUNTING QUANTITY (pcs/substrate)
Mounting position
10mm
Fig.3 Rise in surface temperature
3.6
3.9
4.3
4.7
5.1
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
7.5
6.8
6.2
5.6
0
1µ
10µ
100µ
1m
10m
100m
5 10152025303540
ZENER CURRENT : I
Z
(A)
Fig.4 Zener voltage characteristics
ZENER VOLTAGE : V
Z
(V)
−0.08
−0.06
−0.04
−0.02
0.00
0.02
0.04
0.06
0.08
0.10
125-25°C
Iz=20mA
Iz=40mA
010203040
TEMP. COEFFICIENT CHARACTERISTICS (% / °C)
Fig.5 Zener voltage -
temp.coefficient characteristics
ZENER VOLTAGE : Vz (V)
MCC
Revision:2 2008/03/21
TM
Micro Commercial Components
www.mccsemi.com
4 of 4
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***APPLICATIONS DISCLAIMER***
***IMPORTANT NOTICE***
Aerospace or Military Applications.
Products offer by Micro Commercial Components Corp .are not intended for use in Medical,
Micro Commercial Components Corp .reserves the right to make changes without further notice to any
product herein to make corrections, modifications , enhancements , improvements , or other changes .
Micro Commercial Components Corp .does not assume any liability arising out of the application or
use of any product described herein; neither does it convey any license under its patent rights ,nor
the rights of others . The user of products in such applications shall assume all risks of such use
and will agree to hold Micro Commercial Components Corp .and all the companies whose
Ordering Information
Device Packing
(Part Number)-TP Tape&Reel;7.5Kpcs/Reel
