(All voltages referenced to GND.)
VCC .....................................................................-0.3V to +6.0V
RE, RO ..................................................... -0.3V to (VCC + 0.3)V
DE, DI ...................................................................-0.3V to +6.0V
A, B, Y, Z ...........................................................-8.0V to +13.0V
Short-Circuit Duration ................................................ Continuous
Continuous Power Dissipation (TA = +70°C)
8 SO (derate 7.6mW/°C above +70°C) .......................606mW
14 SO (derate 11.9mW/°C above +70°C) ...................952mW
TSSOP (derate 10mW/°C above +70°C) ....................796mW
Operating Temperature Range
8 SO ............................................................. -40°C to +105°C
14 SO ........................................................... -40°C to +125°C
TSSOP .......................................................... -40°C to +125°C
Junction Temperature ...................................................... +150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) ....................................... +260°C
Junction-to-Case Thermal Resistance (θJC)
8 SO ............................................................................38°C/W
14 SO ..........................................................................34°C/W
TSSOP .........................................................................30°C/W
Junction-to-Ambient Thermal Resistance (θJA)
8 SO ..........................................................................132°C/W
14 SO ..........................................................................84°C/W
TSSOP .........................................................................30°C/W
(Note 1)
Electrical Characteristics
(VCC = 3.0V to 5.5V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 5V, and TA = +25°C.) (Notes 2, 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLY
Supply Voltage VCC 3.0 5.5 V
Supply Current ICC DE = high, RE = low, no load 1.9 4 mA
Shutdown Supply Current ISHDN DE = low, RE = high 5 10 μA
DRIVER
Differential Driver Output VOD
RL = 54Ω, VCC = 4.5V, Figure 1 2.1
VRL = 100Ω, VCC = 3.0V, Figure 1 2.0
RL = 54Ω, VCC = 3.0V, Figure 1 1.5
Change in Magnitude of Differ-
ential Driver Output Voltage ΔVOD RL = 100Ω or 54Ω, Figure 1 (Note 4) 0.2 V
Driver Common-Mode Output
Voltage VOC RL = 100Ω or 54Ω, Figure 1 (Note 4) VCC/2 3 V
Change in Magnitude of Driver
Common-Mode Output Voltage ΔVOC RL = 100Ω or 54Ω, Figure 1 (Note 4) 0.2 V
Single-Ended Driver Output
Voltage High VOH Y and Z outputs, IY, Z = -20mA 2.2 V
Single-Ended Driver Output
Votlage Low VOL Y and Z outputs, IY, Z = +20mA 0.8 V
Differential Driver Output Ca-
pacitance COD DE = RE = high, f = 4MHz 12 pF
MAX14784E/MAX14786E/
MAX14787E/MAX14789E
Full-Duplex, ±35kV ESD-Protected,
RS-485 Transceivers for
High-Speed Communication
www.maximintegrated.com Maxim Integrated
│
2
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics