DAC3174IRGC25 - TEXAS INSTRUMENTS

One world. One KEMET

Benets

• High Q and low ESR

• High SRF

• High thermal stability

• 1 MHz to 50 GHz frequency range

• Operatingtemperaturerangeof−55°Cto+125°C

• Base metal electrode (BME) dielectric system

• Pb-free and RoHS compliant

• 0201, 0402, 0603, and 0805 case sizes (inches)

• DC voltage ratings of 6.3 V, 10 V, 25 V, 50 V, 100 V, 200 V,

250 V, and 500 V

• Capacitance offerings ranging from 0.1 pF up to 100 pF

Overview

KEMET’s CBR Series surface mount multilayer ceramic

capacitors (MLCCs) in C0G dielectric feature a robust and

exceptionally stable copper electrode dielectric system

that offers excellent low loss performance (high Q). These

devices provide extremely low ESR and high self-resonance

characteristics, and are well-suited for resonant circuit

applications or those where Q and stability of capacitance

characteristics are required. CBR Series capacitors

exhibit no change in capacitance with respect to time and

voltage, and boast a negligible change in capacitance with

reference to ambient temperature. Capacitance change is

limitedto±30ppm/ºCfrom−55°Cto+125°C.

CBR Series devices are suitable for many circuit applications

includingRFpowerampliers,mixers,oscillators,lownoise

ampliers,lternetworks,antennatuning,timingcircuits,

delay lines, and MRI imaging coils.

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

HiQ-CBR Series, C0G Dielectric, Low ESR

6.3 – 500 VDC, 1 MHz – 50 GHz (RF & Microwave)

Ordering Information

CBR 02 C330 F 9GA C

Series Case Size

(L"x W" )

Specication/

Series

Capacitance

Code (pF)

Capacitance

Tolerance

Rated

Voltage

(VDC)

Dielectric

Termination

Style Termination Finish

Packaging/

Grade

(C-Spec)1

CBR 02 = 0201

04 = 0402

06 = 0603

08 = 0805

C = Standard Twosignicantdigits

+numberofzeros

Use 9 for 1.0 – 9.9 pF

Use 8 for 0.1 – 0.99 pF

e.g., 2.2 pF = 229

e.g., 0.5 pF = 508

A = ±0.05 pF

B = ±0.1 pF

C = ±0.25 pF

D = ±0.5 pF

F = ±1%

G = ±2%

J = ±5%

9 = 6.3 V

8 = 10 V

3 = 25 V

5 = 50 V

1 = 100 V

2 = 200 V

A = 250 V

C = 500 V

G = C0G A = N/A C = 100% Matte Sn Blank =

7" Reel

Unmarked

1 When ordering CBR Series devices, a "sufx" or "C-Spec" is not required to indicate a 7" reel packaging option. CBR devices are only available and

shipped on 7" reels (paper tape). Bulk bag and cassette packaging options are not available. Please contact KEMET if you have a specic, non-standard

packaging requirement.

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Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

HiQ-CBR Series, C0G Dielectric, Low ESR 6.3 – 500 VDC, 1 MHz – 50 GHz (RF & Microwave)

Benets cont'd

• Available capacitance tolerances of ±0.05 pF, ±0.1 pF,

±0.25 pF, ±0.5 pF, ±1%, ±2%, and ±5%

• No piezoelectric noise

• No capacitance change with respect to applied rated DC

voltage

• Negligible capacitance change with respect to temperature

• No capacitance decay with time

• Non-polar device, minimizing installation concerns

• 100% pure matte tin-plated termination finish allowing for

excellent solderability

Applications

Typicalapplicationsincludecriticaltiming,tuning,bypass,coupling,feedback,ltering,impedancematchingandDC

blocking.

Field applications include wireless and cellular base stations, wireless LAN, subscriber-based wireless services, wireless

broadcastequipment,satellitecommunications,RFpoweramplier(PA)modules,lters,voltage-controlledoscillators

(VCOs), PAs, matching networks, RF modules, satellite communications and medical electronics.

Qualication

RFandmicrowaveproductsaresubjecttointernalqualication.Detailsregardingtestmethodsandconditionsare

referenced in Table 4, Performance & Reliability.

Environmental Compliance

Pb-free and RoHS compliant.

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

HiQ-CBR Series, C0G Dielectric, Low ESR 6.3 – 500 VDC, 1 MHz – 50 GHz (RF & Microwave)

Dimensions – Millimeters (Inches)

T

W L

B

Case

Size (in.)

Case

Size (mm)

L

Length

W

Width

T

Thickness

B

Bandwidth

Mounting

Technique

0201 0603

0.60±0.03

(0.024±0.001)

0.30±0.03

(0.012±0.001)

0.30±0.03

(0.012±0.001)

0.15±0.05

(0.006±0.002) SolderReowOnly

0402 1005

1.00±0.05

(0.040±0.002)

0.50±0.05

(0.020±0.002)

0.50±0.05

(0.020±0.002)

0.25+0.05/−0.10

(0.010+0.002/−0.004)

0603 1608

1.60±0.10

(0.063±0.004)

0.80±0.10

(0.031±0.004)

0.80±0.07

(0.031±0.003)

0.40±0.15

(0.016±0.006) Solder Wave

orSolderReow

0805 2012

2.00±0.20

(0.079±0.008)

1.25±0.20

(0.049±0.008)

0.85±0.10

(0.031±0.004)

0.50±0.20

(0.020±0.008)

Electrical Parameters/Characteristics

Item Parameters/Characteristics

Operating Temperature Range: −55°Cto+125°C

Capacitance Change with Reference to

+25°Cand0VDCApplied(TCC): 0±30ppm/ºC(0±60ppm/ºCfor0201casesizeproduct≥22pF)

Aging Rate (Maximum % Capacitance Loss/Decade Hour): 0%

1Dielectric Withstanding Voltage (DWV):

See Dielectric Withstanding Voltage Table

(5±1 seconds and charge/discharge not exceeding 50 mA)

2Quality Factor (Q):

≥1,000forcapacitancevalues≥30pF

≥400+20ºCforcapacitancevalues<30pF

3InsulationResistance(IR)Limitat25°C: 10GΩminimum(ratedvoltageappliedfor120±5seconds)

1 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the

capacitor.

2 Capacitance and quality factor (Q) measured at 1 MHz ±100 kHz and 1.0 ±0.2 Vrms.

3 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON."

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

HiQ-CBR Series, C0G Dielectric, Low ESR 6.3 – 500 VDC, 1 MHz – 50 GHz (RF & Microwave)

Dielectric Withstanding Voltage Table

Rated Voltage (VDC) ≤100 V 200 V 250 V 500 V

DWV 250% 200% 200% 150%

Electrical Characteristics

SRF (MHz) vs. Cap (pF)

100

1,000

10,000

100,000

0.1 1 10 100

SRF (MHz)

Cap (pF)

0201

0402

0603

0805

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

HiQ-CBR Series, C0G Dielectric, Low ESR 6.3 – 500 VDC, 1 MHz – 50 GHz (RF & Microwave)

Electrical Characteristics cont'd

Q vs. Frequency 0805ESR vs. Frequency 0805

Q vs. Frequency 0603ESR vs. Frequency 0603

Q vs. Frequency 0402

1

10

100

1,000

10,000

100 1,000 10,000

Q

Freq (MHz)

2.2pF

10pF

33pF

47pF

100pF

0.01

0.1

1

100 1,000 10,000

ESR (Ohms)

Freq (MHz)

2.2pF

10pF

33pF

47pF

100pF

0.01

0.1

1

100 1,000 10,000

ESR (Ohms)

Freq (MHz)

2.2pF

4.7pF

10pF

20pF

47pF

1

10

100

1,000

10,000

100 1,000 10,000

Q

Freq (MHz)

2.2pF

4.7pF

10pF

20pF

47pF

ESR vs. Frequency 0402

0.01

0.1

1

100 1,000 10,000

ESR (Ohms)

Freq (MHz)

1.8pF

4.7pF

10pF

18pF

22pF

1

10

100

1,000

10,000

100 1,000 10,000

Q

Freq (MHz)

1.8pF

4.7pF

10pF

18pF

22pF

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

HiQ-CBR Series, C0G Dielectric, Low ESR 6.3 – 500 VDC, 1 MHz – 50 GHz (RF & Microwave)

Case Size – Inches (mm) 0201 (0603) 0402 (1005) 0603 (1608) 0805 (2012)

Length

mm

(Inches)

0.60 ± 0.03

(0.024 ± 0.001)

1.00 ± 0.05

(0.040 ± 0.002)

1.60 ± 0.10

(0.063 ± 0.004)

2.00 ± 0.20

(0.079 ± 0.008)

Width

mm

(Inches)

0.30 ± 0.03

(0.012 ± 0.001)

0.50 ± 0.05

(0.020 ± 0.002)

0.80 ± 0.10

(0.031 ± 0.004)

1.25 ± 0.20

(0.049 ± 0.008)

Thickness

mm

(Inches)

0.30 ± 0.03

(0.012 ± 0.001)

0.50 ± 0.05

(0.020 ± 0.002)

0.80 ± 0.07

(0.031 ± 0.003)

0.85 ± 0.10

(0.031 ± 0.004)

Bandwidth

mm

(Inches)

0.15 ± 0.05

(0.006 ± 0.002)

0.25 + 0.05 / -0.10

(0.010 + 0.002 / -0.004)

0.40 ± 0.15

(0.016 ± 0.006)

0.50 ± 0.20

(0.020 ± 0.008)

Rated Voltage (VDC) 6.3 10 25 50 25 50 100 200 50 100 250 50 100 250 500

Voltage Code 983 5 3 5 1 2 51A 5 1A C

Capacitance Capacitance

Tolerance Capacitance Code (Available Capacitance)

0.1 pF

A = ±0.05 pF

B = ±0.1 pF

108*

108

108*

0.2 pF

208

0.3 pF

308

0.4 pF

408

0.5 pF

A = ±0.05 pF

B = ±0.1 pF

C = ±0.25 pF

508

0.6 pF

608

0.7 pF

708

0.8 pF

808

0.9 pF

908

1.0 pF

109

1.1 pF

119

1.2 pF

129

1.3 pF

139

1.4 pF

149

1.5 pF

159

1.6 pF

169

1.7 pF

179

1.8 pF

189

1.9 pF

199

2.0 pF

209

2.1 pF

219

2.2 pF

229

2.3 pF

239

2.4 pF

249

2.5 pF

259

2.6 pF

269

2.7 pF

279

2.8 pF

289

2.9 pF

299

3.0 pF

309

3.1 pF

319

3.2 pF

329

3.3 pF

339

3.4 pF

349

3.5 pF

359

3.6 pF

369

3.7 pF

379

3.8 pF

389

3.9 pF

399

4.0 pF

409

4.1 pF

419

4.2 pF

429

4.3 pF

439

4.4 pF

449

4.5 pF

459

4.6 pF

469

4.7 pF

479

4.8 pF

489

4.9 pF

499

Rated Voltage (VDC) 6.3 10 25 50 25 50 100 200 50 100 250 50 100 250 500

Voltage Code 983 5 3 5 1 2 51A 5 1A C

Table 1 – CBR Series, Capacitance Range Waterfall

*Available only in "B" ( ±0.1pF) capacitance tolerance.

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

HiQ-CBR Series, C0G Dielectric, Low ESR 6.3 – 500 VDC, 1 MHz – 50 GHz (RF & Microwave)

Case Size – Inches (mm) 0201 (0603) 0402 (1005) 0603 (1608) 0805 (2012)

Length

mm

(Inches)

0.60 ± 0.03

(0.024 ± 0.001)

1.00 ± 0.05

(0.040 ± 0.002)

1.60 ± 0.10

(0.063 ± 0.004)

2.00 ± 0.20

(0.079 ± 0.008)

Width

mm

(Inches)

0.30 ± 0.03

(0.012 ± 0.001)

0.50 ± 0.05

(0.020 ± 0.002)

0.80 ± 0.10

(0.031 ± 0.004)

1.25 ± 0.20

(0.049 ± 0.008)

Thickness

mm

(Inches)

0.30 ± 0.03

(0.012 ± 0.001)

0.50 ± 0.05

(0.020 ± 0.002)

0.80 ± 0.07

(0.031 ± 0.003)

0.85 ± 0.10

(0.031 ± 0.004)

Bandwidth

mm

(Inches)

0.15 ± 0.05

(0.006 ± 0.002)

0.25 + 0.05 / -0.10

(0.010 + 0.002 / -0.004)

0.40 ± 0.15

(0.016 ± 0.006)

0.50 ± 0.20

(0.020 ± 0.008)

Rated Voltage (VDC) 6.3 10 25 50 25 50 100 200 50 100 250 50 100 250 500

Voltage Code 983 5 3 5 1 2 51A 5 1A C

Capacitance Capacitance

Tolerance Capacitance Code (Available Capacitance)

5.0 pF

A = ±0.05 pF

B = ±0.1 pF

C = ±0.25 pF

509 509 509 509 509 509 509 509 509 509 509 509 509 509 509

5.1 pF

B = ±0.1 pF

C = ±0.25 pF

D = ±0.5 pF

519

5.2 pF

529

5.3 pF

539

5.4 pF

549

5.5 pF

559

5.6 pF

569

5.7 pF

579

5.8 pF

589

5.9 pF

599

6.0 pF

609

6.1 pF

619

6.2 pF

629

6.3 pF

639

6.4 pF

649

6.5 pF

659

6.6 pF

669

6.7 pF

679

6.8 pF

689

6.9 pF

699

7.0 pF

709

7.1 pF

719

7.2 pF

729

7.3 pF

739

7.4 pF

749

7.5 pF

759

7.6 pF

769

7.7 pF

779

7.8 pF

789

7.9 pF

799

8.0 pF

809

8.1 pF

819

8.2 pF

829

8.3 pF

839

8.4 pF

849

8.5 pF

859

8.6 pF

869

8.7 pF

879

8.8 pF

889

8.9 pF

899

9.0 pF

909

9.1 pF

919

9.2 pF

929

9.3 pF

939

9.4 pF

949

9.5 pF

959

Rated Voltage (VDC) 6.3 10 25 50 25 50 100 200 50 100 250 50 100 250 500

Voltage Code 983 5 3 5 1 2 51A 5 1A C

Table 1 – CBR Series, Capacitance Range Waterfall cont'd

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

HiQ-CBR Series, C0G Dielectric, Low ESR 6.3 – 500 VDC, 1 MHz – 50 GHz (RF & Microwave)

Case Size – Inches (mm) 0201 (0603) 0402 (1005) 0603 (1608) 0805 (2012)

Length

mm

(Inches)

0.60 ± 0.03

(0.024 ± 0.001)

1.00 ± 0.05

(0.040 ± 0.002)

1.60 ± 0.10

(0.063 ± 0.004)

2.00 ± 0.20

(0.079 ± 0.008)

Width

mm

(Inches)

0.30 ± 0.03

(0.012 ± 0.001)

0.50 ± 0.05

(0.020 ± 0.002)

0.80 ± 0.10

(0.031 ± 0.004)

1.25 ± 0.20

(0.049 ± 0.008)

Thickness

mm

(Inches)

0.30 ± 0.03

(0.012 ± 0.001)

0.50 ± 0.05

(0.020 ± 0.002)

0.80 ± 0.07

(0.031 ± 0.003)

0.85 ± 0.10

(0.031 ± 0.004)

Bandwidth

mm

(Inches)

0.15 ± 0.05

(0.006 ± 0.002)

0.25 + 0.05 / -0.10

(0.010 + 0.002 / -0.004)

0.40 ± 0.15

(0.016 ± 0.006)

0.50 ± 0.20

(0.020 ± 0.008)

Rated Voltage (VDC) 6.3 10 25 50 25 50 100 200 50 100 250 50 100 250 500

Voltage Code 983 5 3 5 1 2 51A 5 1A C

Capacitance Capacitance

Tolerance Capacitance Code (Available Capacitance)

9.6 pF

B = ±0.1 pF

C = ±0.25 pF

D = ±0.5 pF

969

9.7 pF

979

9.8 pF

989

9.9 pF

999

10 pF

F = ±1%

G = ±2%

J = ±5%

100

11 pF

110

12 pF

120

13 pF

130

15 pF

150

16 pF

160

18 pF

180

20 pF

200

22 pF

220

24 pF

240

27 pF

270

30 pF

300

33 pF

330

36 pF

360

39 pF

390

43 pF

430

47 pF

470

51 pF

510

56 pF

560

62 pF

620

68 pF

680

75 pF

750

82 pF

820

91 pF

910

100 pF

101

Rated Voltage (VDC)

6.3

10

25

50

25

50

100

200

50

100

250

50

100

250

500

Voltage Code 983 5 3 5 1 2 51A 5 1A C

Table 1 – CBR Series, Capacitance Range Waterfall cont'd

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

HiQ-CBR Series, C0G Dielectric, Low ESR 6.3 – 500 VDC, 1 MHz – 50 GHz (RF & Microwave)

Table 2 – Chip Thickness/Reeling Quantities

Chip Size

Inches (mm)

Chip

Thickness

(mm)

Reel Quantity

7" Paper 13" Paper

0201 (0603) 0.30 ±0.03 15,000

Contact KEMET

for availability.

0402 (1005) 0.50 ±0.05 10,000

0603 (1608) 0.80 ±0.07 4,000

0805 (2012) 0.85 ±0.10 4,000

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 (mm)

Case

Size

(Inches)

Case

Size

(mm)

Density Level A:

Maximum (Most) Land

Protrusion

Density Level B:

Median (Nominal) Land

Protrusion

Density Level C:

Minimum (Least) Land

Protrusion

C Y X V1 V2 C Y X V1 V2 C Y X V1 V2

0201 0603 0.38 0.56 0.52 1.80 1.00 0.33 0.46 0.42 1.50 0.80 0.28 0.36 0.32 1.20 0.60

0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80

0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20

0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reow

solder processes. KEMET only recommends wave soldering of 0603(1608) and 0805 (2012) case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform

qualication testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1608 case size.

C C

X

V1

V2

Grid Placement Courtyard

Y

X

Y

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

HiQ-CBR Series, C0G Dielectric, Low ESR 6.3 – 500 VDC, 1 MHz – 50 GHz (RF & Microwave)

Soldering Process

Recommended Soldering Technique:

 •Solderwaveorsolderreowfor0603and0805casesizes

 •0201and0402casesizesarelimitedtosolderreowonly

Recommended Soldering Prole:

• KEMET recommends following the guidelines outlined in IPC/JEDEC J–STD–020

Recommended Solder Alloys:

Alloy Composition Solidus Liquidous

In50 50 In, 50 Pb 180°C 209°C

In52 52 In, 48 Sn 118°C 118°C

Sn62

62.5 Sn, 36.1 Pb, 1.4 Ag

179°C 179°C

Sn63 63 Sn, 37 Pb 183°C 183°C

Pb-Free 95.5 Sn, 3.8 Ag, 0.7 Cu 217°C 217°C

Hi-Temp 5 Sn, 93.5 Pb, 1.5 Ag 296°C 301°C

Sn5 5 Sn, 95 Pb 308°C 312°C

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

HiQ-CBR Series, C0G Dielectric, Low ESR 6.3 – 500 VDC, 1 MHz – 50 GHz (RF & Microwave)

Table 4 – Performance & Reliability: Test Methods & Conditions

Stress Test or Inspection Method Requirements

Terminal Strength

Pressurizing force:

0201 case size: 2N

0402 & 0603 case sizes: 5N

0805 case size: 10N

Test time: 10±1 second

No visible damage or separation of termination system.

Vibration

Resistance

Vibration frequency: 10 ~ 55 Hz/minimum

Total amplitude: 1.5 mm

Test time: 6 hours (Two hours each in three mutually

perpendicular directions.)

No visible damage.

CapchangeandQ/DF:Tomeetinitialspecication

Solderability

Soldertemperature:235±5°C

Dipping time: 2±0.5 seconds 95%minimumcoverageofterminationnish.

Board Flex

Capacitorismountedtoasubstratewhichisexedby

means of ram at a rate of 1 mm per second until the

deectionbecomes1mm.(Deectionismaintained

for 5±1 second)

Store at room temperature for 24±2 hours before

measuring electrical properties.

No visible damage.

Capacitance change: within ±5.0% or ±0.5 pF, whichever

is larger.

(Capacitancechangeismonitoredduringexure.)

Resistance to

Soldering Heat

Soldertemperature:260±5°C

Dipping time: 10±1 second

Preheating:120to150°Cfor1minutebeforeimmerse

the capacitor in a eutectic solder.

Store at room temperature for 24±2 hours before

measuring electrical properties.

No visible damage.

Capacitance change: within ±2.5% or ±0.25 pF, whichever

is larger.

Q/DF, IR and dielectric strength: To meet initial

requirements.

25% maximum leaching on each edge.

Temperature

Cycling

5 cycles of steps 1 - 4:

No visible damage.

Capacitance change: within ±2.5% or ±0.25 pF, whichever

is larger.

Q/DF, IR and dielectric strength: To meet initial

requirements.

Step Temperature (ºC) Time (min.)

1

Minimum operating

temperature+0/−3 30 ±3

2Room temperature 2 ~ 3

3Maximum operating

temperature+3/−0

30 ±3

4Room temperature (25ºC) 2 ~ 3

Store at room temperature for 24±2 hours before

measuring electrical properties.

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

HiQ-CBR Series, C0G Dielectric, Low ESR 6.3 – 500 VDC, 1 MHz – 50 GHz (RF & Microwave)

Stress Test or Inspection Method Requirements

Humidity (Damp Heat)

Steady State

Testtemperature:40±2°C

Humidity: 90 ~ 95% RH

Testtime:500+24/−0hours

Store at room temperature for 24±2 hours before

measuring electrical properties.

No visible damage.

Capacitance change: within ±5.0% or ±0.5 pF, whichever is

larger.

Q/DFvalue:Capacitance≥30pF,Q≥350,

10pF≤Capacitance<30pF,Q≥275+2.5°C

Capacitance<10pF;Q≥200+10ºC

IR:≥1GΩ

Humidity (Damp Heat)

Load

Testtemperature:40±2°C

Humidity: 90 ~ 95% RH

Testtime:500+24/−0hours

Applied voltage: rated voltage

Store at room temperature for 24±2 hours before

measuring electrical properties.

No visible damage.

Capacitance change: within ±7.5% or ±0.75 pF, whichever is

larger.

Q/DFvalue:Capacitance≥30pF,Q≥200,

Capacitance<30pF,Q≥100+10/3ºC

IR:≥500MΩ

High Temperature Life

Testtemperature:125±3°C

Applied voltage:

200% of rated voltage (10 VDC – 250 VDC)

150% of rated voltage (6.3 VDC and 500 VDC)

Testtime:1,000+24/−0hours

Store at room temperature for 24±2 hours before

measuring electrical properties.

No visible damage.

Capacitance change: within ±3.0% or ±0.3 pF, whichever is

larger.

Q/DFvalue:Capacitance≥30pF,Q≥350,

10pF≤Capacitance<30pF,Q≥275+2.5°C

Capacitance<10pF,Q≥200+10°C

IR:≥1GΩ

ESR

The ESR should be measured at room temperature and

tested at frequency 1±0.1 GHz.

0201 Case Size

0402 Case Size

0.1pF≤Capacitance≤1pF:

<350mΩ/pF

0.1pF≤Capacitance≤1pF:

<350mΩ/pF

1.0pF<Capacitance≤5.0pF:

<300mΩ

1.0pF<Capacitance≤5.0pF:

<300mΩ

5.0pF<Capacitance≤22.0

pF:<250mΩ

5.0pF<Capacitance≤100

pF:<250mΩ

0603 Case Size

0805 Case Size

0.3pF≤Capacitance≤1pF:

<1,500mΩ

0.3pF≤Capacitance≤1pF:

<1,500mΩ

1pF<Capacitance≤10pF:

<250mΩ

1pF<Capacitance≤10pF:

<250mΩ

10pF<Capacitance≤100pF:

<200mΩ

Capacitance > 10 pF:

<200mΩ

The ESR should be measured at room temperature and

tested at frequency 500±50 MHz.

0201casesize,22pF≤Cap≤33pF:<300mΩ

Table 4 – Performance & Reliability: Test Methods & Conditions cont'd

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

HiQ-CBR Series, C0G Dielectric, Low ESR 6.3 – 500 VDC, 1 MHz – 50 GHz (RF & Microwave)

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in

other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,

and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp

and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum

storagehumiditynotexceed70%relativehumidity.Temperatureuctuationsshouldbeminimizedtoavoidcondensationon

the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock

should be used promptly, preferably within 1.5 years of receipt.

Construction

Dielectric Material

(BaTiO3 Based)

Detailed Cross Section

Barrier Layer

(Ni)

Inner Electrodes

(Cu)

Termination Finish

(100% Matte Sn)

Barrier Layer

(Ni)

Termination Finish

(100% Matte Sn)

Inner Electrodes

(Cu)

Dielectric Material

(BaTiO3 Based)

End Termination/

External Electrode

(Cu)

End Termination/

External Electrode

(Cu)

Marking

CBR series devices are supplied unmarked.

If you require marked product, please contact KEMET for availability of a laser-marked option.

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

HiQ-CBR Series, C0G Dielectric, Low ESR 6.3 – 500 VDC, 1 MHz – 50 GHz (RF & Microwave)

Tape & Reel Packaging Information

KEMET offers RF and Microwave Multilayer Ceramic Chip Capacitors packaged in 8 mm tape on 7" reels. This packaging

system is compatible with all tape-fed automatic pick and place systems.

Table 5 – Carrier Tape Con guration (mm)

EIA Case Size Tape Size (W)* Lead Space (P

1

)*

0201 – 0402 8 2

0603 – 1210 8 4

*Refer to Figure 1 for W and P1 carrier tape reference locations.

*Refer to Table 6 for tolerance speci cations.

8 mm Carrier Tape

178 mm (7.00")

Anti-Static Reel

Punched Paper Carrier

Punched Cavity

Anti-Static Cover Tape

(0.10mm (0.004") Maximum Thickness)

KEMET

®

Bar Code Label

Sprocket Holes

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

HiQ-CBR Series, C0G Dielectric, Low ESR 6.3 – 500 VDC, 1 MHz – 50 GHz (RF & Microwave)

Figure 1 – Punched (Paper) Carrier Tape Dimensions

P

2

A

0

P

0

P

1

B

0

W

T

E

F

D

0

K

1

A

0

D

1

Table 6 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size D0E1P0P2

R Reference

Note 2

K0

8 mm 1.55+0.05

(0.061+0.002) 1.55±0.05

(0.061±0.002) 4.0±0.10

(0.157±0.004) 2.0±0.05

(0.079±0.002) 25.0

(0.984) -

Variable Dimensions — Millimeters (Inches)

Tape Size Pitch A0B0F P1T W D1

8 mm Half (2 mm)

0.37±0.03

(0.015±0.001)

0.67±0.03

(0.03±0.001)

3.5±0.05

(0.138±0.002)

2.0±0.05

(0.079±0.002)

0.42±0.03

(0.017±0.001)

8.0±0.10

(0.315±0.004) -

0.62±0.05

(0.025±0.002)

1.12±0.05

(0.04±0.002)

0.60±0.05

(0.024±0.002)

8 mm Single (4 mm)

1.00±0.10

(0.040±0.004)

1.80±0.10

(0.07±0.004) 4.0±0.10

(0.157±0.004)

0.95±0.05

(0.037±0.002)

1.50±0.10

(0.06±0.004)

2.30±0.10

(0.09±0.004)

0.95±0.05

(0.037±0.002)

2. The tape with or without components shall pass around R without damage (see Figure 3).

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

HiQ-CBR Series, C0G Dielectric, Low ESR 6.3 – 500 VDC, 1 MHz – 50 GHz (RF & Microwave)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width Peel Strength

8 mm 0.1 to 1.0 Newton (10 to 100 gf)

12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf)

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be

165°to180°fromtheplaneofthecarriertape.Duringpeeling,thecarrierand/orcovertapeshallbepulledatavelocityof

300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 2 – Bending Radius

R

Bending

Radius

Punched

Carrier

Figure 3 – Tape Leader & Trailer Dimensions

Trailer

110mm minimum

Carrier Tape

END Leader

Round Sprocket Holes

Top Cover Tape

Punched Carrier

8mm

Components

20mm

minimum

400mm ~ 560mm

Minimum (empty

cavities and leader)

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

HiQ-CBR Series, C0G Dielectric, Low ESR 6.3 – 500 VDC, 1 MHz – 50 GHz (RF & Microwave)

Figure 4 – Maximum Camber

Carrier Tape

Round Sprocket Holes

1 mm maximum, either direction

Straight Edge

250 mm

Figure 5 – Reel Dimensions

N

A

W

1

C

Table 7 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size Reel Size A C

8 mm 7

178±0.10

(7.008±0.004)

13.0±0.20

(0.512±0.008)

Variable Dimensions — Millimeters (Inches)

Tape Size

N Minimum See Note 2, Table 6

W1

8 mm

60±0.10

(2.4±0.04)

8.4+1.5/−0.0

(0.331+0.059/−0.0)

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

HiQ-CBR Series, C0G Dielectric, Low ESR 6.3 – 500 VDC, 1 MHz – 50 GHz (RF & Microwave)

KEMET Electronic Corporation Sales Of ces

Foracompletelistofourglobalsalesofces,pleasevisitwww.kemet.com/sales.

Disclaimer

Allproductspecications,statements,informationanddata(collectively,the“Information”)inthisdatasheetaresubjecttochange.Thecustomerisresponsiblefor

checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.

All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

StatementsofsuitabilityforcertainapplicationsarebasedonKEMETElectronicsCorporation’s(“KEMET”)knowledgeoftypicaloperatingconditionsforsuch

applications,butarenotintendedtoconstitute–andKEMETspecicallydisclaims–anywarrantyconcerningsuitabilityforaspeciccustomerapplicationoruse.

The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any

technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no

obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component

failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards

(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or

property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other

measures may not be required.

KEMET is a registered trademark of KEMET Electronics Corporation.