2007-04-19
1
BAS28...
Silicon Switching Diode
For high-speed switching applications
Electrical insulated diodes
Pb-free (RoHS compliant) package1)
Qualified according AEC Q101
BAS28/W
,
!"
,
Type Package Configuration Marking
BAS28
BAS28W SOT143
SOT343 parallel pair
parallel pair JTs
JTs
Maximum Ratings at T
A
= 25°C, unless otherwise specified
Parameter Symbol Value Unit
Diode reverse voltage VR80 V
Peak reverse voltage VRM 85
Forward current IF200 mA
Peak forward current IFM -
Surge forward current, t = 1 µs IFS 4.5 A
Non-repetitive peak surge forward current IFSM -
Total power dissipation
BAS28, TS 31°C
BAS28W, TS 103°C
Ptot
330
250
mW
Junction temperature T
j
150 °C
Storage temperature Tst
g
-55 ... 150
1Pb-containing package may be available upon special request
2007-04-19
2
BAS28...
Thermal Resistance
Parameter Symbol Value Unit
Junction - soldering point1)
BAS28
BAS28W
RthJS
360
190
K/W
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Breakdown voltage
I(BR) = 100 µA V(BR) 85 - - V
Reverse current
VR = 75 V
VR = 25 V, TA = 150 °C
VR = 75 V, TA = 150 °C
IR
-
-
-
-
-
-
0.1
30
50
µA
Forward voltage
IF = 1 mA
IF = 10 mA
IF = 50 mA
IF = 100 mA
IF = 150 mA
VF
-
-
-
-
-
-
-
-
-
-
715
855
1000
1200
1250
mV
AC Characteristics
Diode capacitance
VR = 0 V, f = 1 MHz CT- - 2 pF
Reverse recovery time
IF = 10 mA, IR = 10 mA, measured at IR = 1mA ,
RL = 100
trr - - 4 ns
Test circuit for reverse recovery time
EHN00019
Ι
F
D.U.T.
Oscillograph
Pulse generator: tp = 100ns, D = 0.05,
tr = 0.6ns, Ri = 50
Oscillograph: R = 50, tr = 0.35ns,
C 1pF
1For calculation of RthJA please refer to Application Note Thermal Resistance
2007-04-19
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BAS28...
Reverse current IR = ƒ (TA)
VR = Parameter
0 25 50 75 100 °C 150
TA
1
10
2
10
3
10
4
10
5
10
nA
IR
70 V
25 V
Forward Voltage VF = ƒ (TA)
IF = Parameter
0
0.5
1.0
0 50 100 150
BAS 28 EHB00037
V
T
A
VF
C
Ι
F
= 100 mA
10 mA
1 mA
0.1 mA
Forward current IF = ƒ (VF)
TA = 25 °C
0
0
EHB00035BAS 28
Ι
0.5 1.0 V 1.5
50
100
mA
150
F
F
V
maxtyp
Peak forward current IFM = ƒ (tp)
TA = 25 °C
BAS28
EHB00036
-6
10
BAS 28
10-5 10-4 10-3 10-2 10-1 100
s
-2
10
-1
10
Ι
FM
10 0
10 1
10
A
2
t
T
tpDp
=T
t
D= 0.005
0.01
0.02
0.05
0.1
0.2
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BAS28...
Forward current IF = ƒ (TS)
BAS28
0 15 30 45 60 75 90 105 120 °C 150
TS
0
20
40
60
80
100
120
140
160
180
mA
220
IF
Forward current IF = ƒ (TS)
BAS28W
0 15 30 45 60 75 90 105 120 °C 150
TS
0
20
40
60
80
100
120
140
160
180
mA
220
IF
Permissible Puls Load RthJS = ƒ (tp)
BAS28W
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s tp
0
10
1
10
2
10
3
10
K/W
RthJS
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
Permissible Pulse Load
IFmax/ IFDC = ƒ (tp) BAS28W
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
stp
0
10
1
10
2
10
-
IFmax/ IFDC
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
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BAS28...
Package SOT143
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
RFs
2005, June
Date code (YM)
BFP181
Type code
56
Pin 1
0.8 0.81.2
0.9 1.1 0.9
1.2
0.8 0.8
0.8-0.05
+0.1
1.9
1.7
±0.1
2.9
+0.1
-0.05
0.4
0.1 MAX.
12
34
0.25 MB
±0.1
1
10˚ MAX.
0.15 MIN.
0.2 A
M
2.4
±0.15
0.2
10˚ MAX.
A
1.3
±0.1
0...8˚
0.08...0.15
2.6
4
3.15
Pin 1
8
0.2
1.15
B
Manufacturer
2007-04-19
6
BAS28...
Package SOT343
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
2005, June
Date code (YM)
BGA420
Type code
0.2
4
2.15
8
2.3
1.1
Pin 1
0.6
0.8
1.6
1.15
0.9
1.25
±0.1
0.1 MAX.
2.1
±0.1
0.15 +0.1
-0.05
0.3+0.1
2±0.2 ±0.1
0.9
12
34 A
+0.1
0.6 A
M
0.2
1.3
-0.05
-0.05
0.15
0.1 M
4x
0.1
0.1 MIN.
Pin 1
Manufacturer
2007-04-19
7
BAS28...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.