NCD57000
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ABSOLUTE MAXIMUM RATINGS (Over operating free−air temperature range unless otherwise noted) (Note 1)
Symbol Parameter Minimum Maximum Unit
VDD1−GND1 Supply voltage, input side −0.3 6 V
VDD2−GND2 Positive Power Supply, output side −0.3 25 V
VEE2−GND2 Negative Power Supply, output side −10 0.3 V
VDD2−VEE2 (VMAX2)Differential Power Supply, output side 0 25 V
VOUTH Positive gate−driver output voltage VEE2 − 0.3 VDD2 + 0.3 V
VOUTL Negative gate−driver output voltage VEE2 − 0.3 VDD2 + 0.3 V
IPK−SRC Gate−driver output sourcing current
(maximum pulse width = 10 ms, maximum duty cycle = 0.2%, VMAX2 = 23 V)
−7.8 A
IPK−SNK Gate−driver output sinking current
(maximum pulse width = 10 ms, maximum duty cycle = 0.2%, VMAX2 = 23 V)
−7.1 A
IPK−CLAMP Clamp sinking current
(maximum pulse width = 10 ms, maximum duty cycle = 0.2%, VCLAMP = 2.5 V)
−2.5 A
tCLP Maximum Short Circuit Clamping Time (IOUTH_CLAMP = 500 mA) −10 ms
VLIM−GND1 Voltage at IN+, IN−, /RST, /FLT, RDY −0.3 VDD1 + 0.3 V
ILIM−GND1 Output current of /FLT, RDY −10 mA
VDESAT−GND2 Desat Voltage (Note 2) −9 VDD2 + 0.3 V
VCLAMP−GND2 Clamp Voltage VEE2 − 0.3 VDD2 + 0.3 V
PDPower Dissipation (Note 3) −1400 mW
VISO Input to Output Isolation Voltage −1200 1200 V
TJ(max) Maximum Junction Temperature −40 150 °C
TSTG Storage Temperature Range −65 150 °C
ESDHBM ESD Capability, Human Body Model (Note 4) −±2 kV
ESDCDM ESD Capability, Charged Device Model (Note 4) −±2 kV
MSL Moisture Sensitivity Level −2−
TSLD Lead Temperature Soldering Reflow, Pb−Free Versions (Note 5) −260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. The minimum value is verified by characterization with a single pulse of 100 mA for 100 ms.
3. The value is estimated for ambient temperature 25°C and junction temperature 150°C, 650 mm2, 1 oz copper, 2 surface layers and 2 internal
power plane layers. Power dissipation is affected by the PCB design and ambient temperature.
4. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Charged Device Model tested per AEC−Q100−011 (EIA/JESD22−C101)
Latchup Current Maximum Rating: ≤100 mA per JEDEC standard: JESD78, 25°C
5. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
THERMAL CHARACTERISTICS
Symbol Parameter Conditions Value Unit
RqJA Thermal Resistance, Junction−to−Air 100 mm2, 1 oz Copper, 1 Surface Layer 150 °C/W
650 mm2, 1 oz Copper, 2 Surface Layers and
2 Internal Power Plane Layers
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