SN74F126 QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS SDFS017B - JANUARY 1989 - REVISED NOVEMBER 2002 D D D D, N, OR NS PACKAGE (TOP VIEW) 4.5-V to 5.5-V VCC Operation Max tpd of 6.5 ns at 5 V 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers 1OE 1A 1Y 2OE 2A 2Y GND description/ordering information The SN74F126 bus buffer features independent line drivers with 3-state outputs. Each output is disabled when the associated output-enable (OE) input is low. 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 4OE 4A 4Y 3OE 3A 3Y To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. ORDERING INFORMATION PDIP - N 0C to 70C ORDERABLE PART NUMBER PACKAGE TA SOIC - D SOP - NS Tube SN74F126N Tube SN74F126D Tape and reel SN74F126DR Tape and reel SN74F126NSR TOP-SIDE MARKING SN74F126N F126 74F126 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each buffer) INPUTS OE A OUTPUT Y H H H H L L L X Z Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2002, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SN74F126 QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS SDFS017B - JANUARY 1989 - REVISED NOVEMBER 2002 logic diagram (positive logic) 1OE 1A 2OE 2A 3OE 3A 4OE 4A 1 2 3 1Y 4 5 6 2Y 10 9 8 3Y 13 12 11 4Y absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.2 V to 7 V Input current range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -30 mA to 5 mA Voltage range applied to any output in the disabled or power-off state . . . . . . . . . . . . . . . . . . . . -0.5 V to 5.5 V Voltage range applied to any output in the high state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to VCC Current into any output in the low state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Package thermal impedance, JA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input voltage ratings may be exceeded provided the input current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) MIN NOM MAX 4.5 5 5.5 UNIT VCC VIH Supply voltage VIL IIK Low-level input voltage 0.8 V Input clamp current -18 mA IOH IOL High-level output current -15 mA Low-level output current 64 mA High-level input voltage 2 V V TA Operating free-air temperature 0 70 C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN74F126 QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS SDFS017B - JANUARY 1989 - REVISED NOVEMBER 2002 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VIK II = -18 mA IOH = -3 mA VOH IOH = -15 mA IOH = -3 mA VCC 4.5 V MIN 45V 4.5 4.75 V TYP 2.4 3.3 2 3.1 MAX UNIT -1.2 V V 2.7 VOL II IOL = 64 mA VI = 7 V 4.5 V 0.55 V 0 0.4 0.1 mA IIH IIL VI = 2.7 V VI = 0.5 V 5.5 V 20 A 5.5 V -20 A IOZH IOZL IOS VO = 2.7 V VO = 0.5 V 5.5V 50 A -50 A -225 mA 20 30 mA 32 48 mA ICCZ Outputs open 5.5 V 26 All typical values are at VCC = 5 V, TA = 25C. Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. 39 mA ICCH ICCL 5.5 V VO = 0 Outputs open 5.5 V 5.5 V Outputs open 5.5 V -100 switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A Y tPZH tPZL OE Y tPHZ tPLZ OE Y VCC = 5 V, CL = 50 pF, RL = 500 , TA = 25C VCC = 4.5 V to 5.5 V, CL = 50 pF, RL = 500 , TA = MIN to MAX MIN TYP MAX MIN 2 4 6.5 2 7 3 5.5 8 2.8 8.5 3.8 6 7.5 3.3 8.5 3.8 6 8 3.5 8.5 2 4.5 6.5 2 7.5 3 5.5 7.5 3 8 UNIT MAX ns ns ns For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SN74F126 QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS SDFS017B - JANUARY 1989 - REVISED NOVEMBER 2002 PARAMETER MEASUREMENT INFORMATION 7V From Output Under Test CL (see Note A) 500 S1 From Output Under Test Test Point CL (see Note A) 500 Open 500 TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 7V Open 7V Open Collector LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3V Timing Input 1.5 V 0V tw tsu 3V 1.5 V Input 1.5 V th 3V 1.5 V 1.5 V Data Input 0V 1.5 V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH tPHL 1.5 V 1.5 V VOL tPHL 1.5 V tPLZ 3.5 V 1.5 V tPZH VOH 1.5 V VOL 1.5 V 0V Output Waveform 1 S1 at 7 V (see Note B) tPLH 1.5 V 3V Output Control tPZL VOH In-Phase Output Out-of-Phase Output 0V VOLTAGE WAVEFORMS PULSE DURATION Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + 0.3 V VOL tPHZ 1.5 V VOH - 0.3 V VOH 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns, duty cycle = 50%. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74F126D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F126DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F126DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F126DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F126DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F126DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F126N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74F126NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74F126DR Package Package Pins Type Drawing SOIC D 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 9.0 2.1 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74F126DR SOIC D 14 2500 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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