E13C5C2F-74.250M TR RoHS Pb E13C5 C 2 F -74.250M TR Series RoHS Compliant (Pb-free) 3.3V 6 Pad 3.2mm x 5mm Ceramic SMD LVPECL Oscillator Packaging Options Tape & Reel Frequency Tolerance/Stability 100ppm Maximum over 0C to +70C Duty Cycle 50 5(%) Nominal Frequency 74.250MHz Logic Control / Additional Output Tri-State and Complementary Output ELECTRICAL SPECIFICATIONS Nominal Frequency 74.250MHz Frequency Tolerance/Stability 100ppm Maximum over 0C to +70C (Inclusive of all conditions: Calibration Tolerance (at 25C), Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25C, Shock, and Vibration) Supply Voltage +3.3Vdc 5% Input Current 75mA Maximum Output Voltage Logic High (Voh) Vcc-1.025Vdc Minimum from 0C to +85C, Vcc-1.085Vdc Minimum from -40C to +0C Output Voltage Logic Low (Vol) Vcc-1.620Vdc Maximum from 0C to +85C, Vcc-1.555Vdc Maximum from -40C to +0C Rise/Fall Time 300pSec Typical, 700pSec Maximum (Measured at 20% to 80% of Waveform) Duty Cycle 50 5(%) (Measured at 50% of Waveform) Load Drive Capability 50 Ohms into Vcc-2.0Vdc Output Logic Type LVPECL Phase Noise -60dBc/Hz at 10Hz Offset, -95dBc/Hz at 100Hz Offset, -125dBc/Hz at 1kHz Offset, -143dBc/Hz at 10kHz Offset, -145dBc/Hz at 100kHz Offset, -145dBc/Hz at 1MHz Offset, -146dBc/Hz at 10MHz Offset (All Values are Typical, Fo=156.250MHz) Logic Control / Additional Output Tri-State and Complementary Output Tri-State Input Voltage (Vih and Vil) Vih of 70% of Vcc Minimum or No Connect to Enable Output and Complementary Output, Vil of 30% of Vcc Maximum to Disable High Impedance Output and Complementary Output Standby Current 30A Maximum (Without Load) RMS Phase Jitter 0.4pSec Typical, 1pSec Maximum (Fj=12kHz to 20MHz) Start Up Time 10mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-883, Method 2002, Condition B Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/14/2010 | Page 1 of 6 E13C5C2F-74.250M TR MECHANICAL DIMENSIONS (all dimensions in millimeters) 3.20 0.15 1.20 0.15 1.30 MAX 6 2.54 0.15 5.00 0.15 1.27 0.15 1 5 2 4 3 1.00 0.15 PIN CONNECTION 1 Tri-State 2 No Connect 3 Case/Ground 4 Output 5 Complementary Output 6 Supply Voltage LINE MARKING 0.64 0.10 1 E74.250 E=Ecliptek Designator 2 XXYZZ XX=Ecliptek Manufacturing Code Y=Last Digit of the Year ZZ=Week of the Year Suggested Solder Pad Layout All Dimensions in Millimeters 1.40 (X6) 1.00 (X6) 0.27 (X4) 0.80 (X2) Solder Land (X6) All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/14/2010 | Page 2 of 6 E13C5C2F-74.250M TR Test Circuit for Tri-State and Complementary Output 50 Ohms Pin Connections 1 Tri-State 2 No Connect 3 Ground 4 Output 5 Complementary Output 6 Supply Voltage (VDD) Frequency Counter Oscilloscope Power Supply Probe 2 (Note 2) Supply Voltage (VDD) Output Current Meter Switch 0.01F (Note 1) 0.1F (Note 1) Probe 1 (Note 2) 50 Ohms Complementary Output Ground Power Supply Voltage Meter Power Supply Tri-State No Connect Power Supply Note 1: An external 0.01F ceramic bypass capacitor in parallel with a 0.1F high frequency ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>500MHz) passive probe is recommended. Note 3: Test circuit PCB traces need to be designed for a characteristic line impedance of 50 ohms. www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/14/2010 | Page 3 of 6 E13C5C2F-74.250M TR Tape & Reel Dimensions Quantity Per Reel: 1,000 units 4.0 0.1 2.0 0.1 DIA 1.5 +0.1/-0.0 0.30 0.1 7.5 0.1 16.0 0.3 A0* 6.75 0.1 8.0 0.1 B0* K0* *Compliant to EIA 481A 1.5 MIN 22.4 MAX DIA 40 MIN Access Hole at Slot Location 360 MAX DIA 50 MIN DIA 20.2 MIN DIA 13.0 0.2 2.5 MIN Width 10.0 MIN Depth Tape slot in Core for Tape Start 16.4 +2.0/-0.0 www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/14/2010 | Page 4 of 6 E13C5C2F-74.250M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/14/2010 | Page 5 of 6 E13C5C2F-74.250M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 1 Time / 230C Maximum 2 Times 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/14/2010 | Page 6 of 6