18055C - AVX Corporation - Datasheet.Directory

MIL-PRF-55681/Chips

Part Number Example

MILITARY DESIGNATION PER MIL-PRF-55681

Part Number Example

(example) CDR01 BP 101 B K S M

MIL Style

Voltage-temperature

Limits

Capacitance

Rated Voltage

Capacitance Tolerance

Termination Finish

Failure Rate

MIL Style: CDR01, CDR02, CDR03, CDR04, CDR05,

CDR06

Voltage Temperature Limits:

BP = 0 ± 30 ppm/°C without voltage; 0 ± 30 ppm/°C with

rated voltage from -55°C to +125°C

BX = ± 15% without voltage; +15 –25% with rated voltage

from -55°C to +125°C

Capacitance: Two digit figures followed by multiplier

(number of zeros to be added) e.g., 101 = 100 pF

Rated Voltage: A = 50V, B = 100V

Capacitance Tolerance: J ±5%, K ±10%, M ±20%

Termination Finish:

M = Palladium Silver U = Base Metallization/Barrier

N = Silver Nickel Gold Metal/Solder Coated*

S = Solder-coated W = Base Metallization/Barrier

Metal/Tinned (Tin or Tin/

Lead Alloy)

*Solder shall have a melting point of 200°C or less.

Failure Rate Level: M = 1.0%, P = .1%, R = .01%,

S = .001%

Packaging: Bulk is standard packaging. Tape and reel

per RS481 is available upon request.

CROSS REFERENCE: AVX/MIL-PRF-55681/CDR01 THRU CDR06*

Per AVX Length (L) Width (W) Thickness (T) D Termination Band (t)

MIL-PRF-55681 Style Max. Min. Max. Min. Max. Min.

CDR01 0805 .080 ± .015 .050 ± .015 .055 .020 — .030 — .010

CDR02 1805 .180 ± .015 .050 ± .015 .055 .020 — — .030 .010

CDR03 1808 .180 ± .015 .080 ± .018 .080 .020 — — .030 .010

CDR04 1812 .180 ± .015 .125 ± .015 .080 .020 — — .030 .010

CDR05 1825 .180 +.020 .250 +.020 .080 .020 — — .030 .010

-.015 -.015

CDR06 2225 .225 ± .020 .250 ± .020 .080 .020 — — .030 .010

*For CDR11, 12, 13, and 14 see AVX Microwave Chip Capacitor Catalog

MIL-PRF-55681/Chips

Military Part Number Identification

CDR01 thru CDR06

CDR01 thru CDR06 to MIL-PRF-55681

Military Rated temperature WVDC

Type Capacitance Capacitance and voltage-

Designation in pF tolerance temperature limits

AVX Style 0805/CDR01

CDR01BP100B--- 10 J,K BP 100

CDR01BP120B--- 12 J BP 100

CDR01BP150B--- 15 J,K BP 100

CDR01BP180B--- 18 J BP 100

CDR01BP220B--- 22 J,K BP 100

CDR01BP270B--- 27 J BP 100

CDR01BP330B--- 33 J,K BP 100

CDR01BP390B--- 39 J BP 100

CDR01BP470B--- 47 J,K BP 100

CDR01BP560B--- 56 J BP 100

CDR01BP680B--- 68 J,K BP 100

CDR01BP820B--- 82 J BP 100

CDR01BP101B--- 100 J,K BP 100

CDR01B--121B--- 120 J,K BP,BX 100

CDR01B--151B--- 150 J,K BP,BX 100

CDR01B--181B--- 180 J,K BP,BX 100

CDR01BX221B--- 220 K,M BX 100

CDR01BX271B--- 270 K BX 100

CDR01BX331B--- 330 K,M BX 100

CDR01BX391B--- 390 K BX 100

CDR01BX471B--- 470 K,M BX 100

CDR01BX561B--- 560 K BX 100

CDR01BX681B--- 680 K,M BX 100

CDR01BX821B--- 820 K BX 100

CDR01BX102B--- 1000 K,M BX 100

CDR01BX122B--- 1200 K BX 100

CDR01BX152B--- 1500 K,M BX 100

CDR01BX182B--- 1800 K BX 100

CDR01BX222B--- 2200 K,M BX 100

CDR01BX272B--- 2700 K BX 100

CDR01BX332B--- 3300 K,M BX 100

CDR01BX392A--- 3900 K BX 50

CDR01BX472A--- 4700 K,M BX 50

AVX Style 1805/CDR02

CDR02BP221B--- 220 J,K BP 100

CDR02BP271B--- 270 J BP 100

CDR02BX392B--- 3900 K BX 100

CDR02BX472B--- 4700 K,M BX 100

CDR02BX562B--- 5600 K BX 100

CDR02BX682B--- 6800 K,M BX 100

CDR02BX822B--- 8200 K BX 100

CDR02BX103B--- 10,000 K,M BX 100

CDR02BX123A--- 12,000 K BX 50

CDR02BX153A--- 15,000 K,M BX 50

CDR02BX183A--- 18,000 K BX 50

CDR02BX223A--- 22,000 K,M BX 50

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

Military Rated temperature WVDC

Type Capacitance Capacitance and voltage-

Designation in pF tolerance temperature limits

AVX Style 1808/CDR03

CDR03BP331B--- 330 J,K BP 100

CDR03BP391B--- 390 J BP 100

CDR03BP471B--- 470 J,K BP 100

CDR03BP561B--- 560 J BP 100

CDR03BP681B--- 680 J,K BP 100

CDR03BP821B-- 820 J BP 100

CDR03BP102B--- 1000 J,K BP 100

CDR03BX123B-- 12,000 K BX 100

CDR03BX153B--- 15,000 K,M BX 100

CDR03BX183B--- 18,000 K BX 100

CDR03BX223B--- 22,000 K,M BX 100

CDR03BX273B--- 27,000 K BX 100

CDR03BX333B--- 33,000 K,M BX 100

CDR03BX393A--- 39,000 K BX 50

CDR03BX473A--- 47,000 K,M BX 50

CDR03BX563A--- 56,000 K BX 50

CDR03BX683A--- 68,000 K,M BX 50

AVX Style 1812/CDR04

CDR04BP122B--- 1200 J BP 100

CDR04BP152B--- 1500 J,K BP 100

CDR04BP182B--- 1800 J BP 100

CDR04BP222B--- 2200 J,K BP 100

CDR04BP272B--- 2700 J BP 100

CDR04BP332B--- 3300 J,K BP 100

CDR04BX393B--- 39,000 K BX 100

CDR04BX473B--- 47,000 K,M BX 100

CDR04BX563B--- 56,000 K BX 100

CDR04BX823A--- 82,000 K BX 50

CDR04BX104A--- 100,000 K,M BX 50

CDR04BX124A--- 120,000 K BX 50

CDR04BX154A--- 150,000 K,M BX 50

CDR04BX184A--- 180,000 K BX 50

AVX Style 1825/CDR05

CDR05BP392B--- 3900 J,K BP 100

CDR05BP472B--- 4700 J,K BP 100

CDR05BP562B--- 5600 J,K BP 100

CDR05BX683B--- 68,000 K,M BX 100

CDR05BX823B--- 82,000 K BX 100

CDR05BX104B--- 100,000 K,M BX 100

CDR05BX124B--- 120,000 K BX 100

CDR05BX154B--- 150,000 K,M BX 100

CDR05BX224A--- 220,000 K,M BX 50

CDR05BX274A--- 270,000 K BX 50

CDR05BX334A--- 330,000 K,M BX 50

AVX Style 2225/CDR06

CDR06BP682B--- 6800 J,K BP 100

CDR06BP822B--- 8200 J,K BP 100

CDR06BP103B--- 10,000 J,K BP 100

CDR06BX394A--- 390,000 K BX 50

CDR06BX474A--- 470,000 K,M BX 50

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

How to Order

Part Number Explanation

EXAMPLE: 08055A101JAT2A

0805

Size

(L" x W")

0402

0504

0603

0805

1005

0907

1206

1210

1505

1805

1808

1812

1825

2225

3640

Voltage

10V = Z

16V = Y

25V = 3

50V = 5

100V = 1

200V = 2

250V = V

500V = 7

600V = C

1000V = A

1500V = S

2000V = G

2500V = W

3000V = H

4000V = J

5000V = K

Dielectric

C0G (NP0) = A

X7R = C

X5R = D

Z5U = E

Y5V = G

101

Capacitance

Code

(2 significant

digits + no. of

zeros)

Examples:

Capacitance

Tolerance

Failure

Rate

A = Not

Applicable

Terminations

Special**

Code

10 pF = 100

100 pF = 101

1,000 pF = 102

22,000 pF = 223

220,000 pF = 224

1 µF = 105

C = ±.25 pF*

D = ±.50 pF*

F = ±1% (≥25 pF)

G = ±2% (≥13 pF)

J = ±5%

K = ±10%

M = ±20%

Z = +80%, -20%

P = +100%, -0%

Others:

7 = Bulk Cassette

9 = Bulk

*C&D tolerances for ⱕ10 pF values.

** Standard Tape and Reel material depends upon chip size and thickness.

See individual part tables for tape material type for each capacitance value.

Note: Unmarked product is standard. Marked product is available on special request, please contact AVX.

Standard packaging is shown in the individual tables.

Non-standard packaging is available on special request, please contact AVX.

Standard:

T = Ni and Tin

Plated

A = Standard

Product

Non-Standard

P = Embossed

unmarked

M = Embossed

marked

E = Standard

packaging

marked

Low Profile

Chips Only

Max. Thickness

T = .66mm (.026")

S = .56mm (.022")

R = .46mm (.018")

For values below 10 pF,

use “R” in place of

decimal point, e.g., 9.1

pfd = 9R1.

Recommended:

2 =7" Reel

4 =13" Reel

Others:

7 = Plated Ni

Gold Plated

1 = Pd/Ag

Packaging**

Surface Mounting Guide

MLC Chip Capacitors

Component Pad Design

Component pads should be designed to achieve good sol-

der filets and minimize component movement during reflow

soldering. Pad designs are given below for the most com-

mon sizes of multilayer ceramic capacitors for both wave

and reflow soldering. The basis of these designs is:

• Pad width equal to component width. It is permissible to

decrease this to as low as 85% of component width but it

is not advisable to go below this.

• Pad overlap 0.5mm beneath component.

• Pad extension 0.5mm beyond components for reflow and

1.0mm for wave soldering.

Case Size D1 D2 D3 D4 D5

0402 1.70 (0.07) 0.60 (0.02) 0.50 (0.02) 0.60 (0.02) 0.50 (0.02)

0603 2.30 (0.09) 0.80 (0.03) 0.70 (0.03) 0.80 (0.03) 0.75 (0.03)

0805 3.00 (0.12) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.25 (0.05)

1206 4.00 (0.16) 1.00 (0.04) 2.00 (0.09) 1.00 (0.04) 1.60 (0.06)

1210 4.00 (0.16) 1.00 (0.04) 2.00 (0.09) 1.00 (0.04) 2.50 (0.10)

1808 5.60 (0.22) 1.00 (0.04) 3.60 (0.14) 1.00 (0.04) 2.00 (0.08)

1812 5.60 (0.22) 1.00 (0.04)) 3.60 (0.14) 1.00 (0.04) 3.00 (0.12)

1825 5.60 (0.22) 1.00 (0.04) 3.60 (0.14) 1.00 (0.04) 6.35 (0.25)

2220 6.60 (0.26) 1.00 (0.04) 4.60 (0.18) 1.00 (0.04) 5.00 (0.20)

2225 6.60 (0.26) 1.00 (0.04) 4.60 (0.18) 1.00 (0.04) 6.35 (0.25)

Dimensions in millimeters (inches)

REFLOW SOLDERING

WAVE SOLDERING

Component Spacing

For wave soldering components, must be spaced sufficiently

far apart to avoid bridging or shadowing (inability of solder

to penetrate properly into small spaces). This is less impor-

tant for reflow soldering but sufficient space must be

allowed to enable rework should it be required.

Preheat & Soldering

The rate of preheat should not exceed 4°C/second to

prevent thermal shock. A better maximum figure is about

2°C/second.

For capacitors size 1206 and below, with a maximum

thickness of 1.25mm, it is generally permissible to allow a

temperature differential from preheat to soldering of 150°C.

In all other cases this differential should not exceed 100°C.

For further specific application or process advice, please

consult AVX.

Cleaning

Care should be taken to ensure that the capacitors are

thoroughly cleaned of flux residues especially the space

beneath the capacitor. Such residues may otherwise

become conductive and effectively offer a low resistance

bypass to the capacitor.

Ultrasonic cleaning is permissible, the recommended

conditions being 8 Watts/litre at 20-45 kHz, with a process

cycle of 2 minutes vapor rinse, 2 minutes immersion in the

ultrasonic solvent bath and finally 2 minutes vapor rinse.

Surface Mounting Guide

MLC Chip Capacitors

Case Size D1 D2 D3 D4 D5

0603 3.10 (0.12) 1.20 (0.05) 0.70 (0.03) 1.20 (0.05) 0.75 (0.03)

0805 4.00 (0.15) 1.50 (0.06) 1.00 (0.04) 1.50 (0.06) 1.25 (0.05)

1206 5.00 (0.19) 1.50 (0.06) 2.00 (0.09) 1.50 (0.06) 1.60 (0.06)

1210 5.00 (0.19) 1.50 (0.06) 2.00 (0.09) 1.50 (0.06) 2.50 (0.10)

Dimensions in millimeters (inches)

≥1mm (0.04)

≥1.5mm (0.06)

≥1mm (0.04)

Surface Mounting Guide

MLC Chip Capacitors

APPLICATION NOTES

Storage

Good solderability is maintained for at least twelve months,

provided the components are stored in their “as received”

packaging at less than 40°C and 70% RH.

Solderability

Terminations to be well soldered after immersion in a 60/40

tin/lead solder bath at 235 ±5°C for 2±1 seconds.

Leaching

Terminations will resist leaching for at least the immersion

times and conditions shown below.

Recommended Soldering Profiles

General

Surface mounting chip multilayer ceramic capacitors

are designed for soldering to printed circuit boards or other

substrates. The construction of the components is such that

they will withstand the time/temperature profiles used in both

wave and reflow soldering methods.

Handling

Chip multilayer ceramic capacitors should be handled with

care to avoid damage or contamination from perspiration

and skin oils. The use of tweezers or vacuum pick ups

is strongly recommended for individual components. Bulk

handling should ensure that abrasion and mechanical shock

are minimized. Taped and reeled components provides the

ideal medium for direct presentation to the placement

machine. Any mechanical shock should be minimized during

handling chip multilayer ceramic capacitors.

Preheat

It is important to avoid the possibility of thermal shock during

soldering and carefully controlled preheat is therefore

required. The rate of preheat should not exceed 4°C/second

and a target figure 2°C/second is recommended. Although

an 80°C to 120°C temperature differential is preferred,

recent developments allow a temperature differential

between the component surface and the soldering temper-

ature of 150°C (Maximum) for capacitors of 1210 size and

below with a maximum thickness of 1.25mm. The user is

cautioned that the risk of thermal shock increases as chip

size or temperature differential increases.

Soldering

Mildly activated rosin fluxes are preferred. The minimum

amount of solder to give a good joint should be used.

Excessive solder can lead to damage from the stresses

caused by the difference in coefficients of expansion

between solder, chip and substrate. AVX terminations are

suitable for all wave and reflow soldering systems. If hand

soldering cannot be avoided, the preferred technique is the

utilization of hot air soldering tools.

Cooling

Natural cooling in air is preferred, as this minimizes stresses

within the soldered joint. When forced air cooling is used,

cooling rate should not exceed 4°C/second. Quenching

is not recommended but if used, maximum temperature

differentials should be observed according to the preheat

conditions above.

Cleaning

Flux residues may be hygroscopic or acidic and must be

removed. AVX MLC capacitors are acceptable for use with

all of the solvents described in the specifications MIL-STD-

202 and EIA-RS-198. Alcohol based solvents are acceptable

and properly controlled water cleaning systems are also

acceptable. Many other solvents have been proven successful,

and most solvents that are acceptable to other components

on circuit assemblies are equally acceptable for use with

ceramic capacitors.

Termination Type Solder Solder Immersion Time

Tin/Lead/Silver Temp. °C Seconds

Nickel Barrier 60/40/0 260±5 30±1

Reflow

300

250

200

150

100

Solder Temp.

10 sec. max

1min

(Minimize soldering time)

Natural

Cooling

220°C

250°C

Preheat

Wave

300

250

200

150

100

Solder Temp.

(Preheat chips before soldering)

T/maximum 150°C

3 sec. max

1 to 2 min

Preheat Natural

Cooling

230°C

250°C

Packaging of Chip Components

Automatic Insertion Packaging

TAPE & REEL QUANTITIES

All tape and reel specifications are in compliance with RS481.

8mm 12mm

Paper or Embossed Carrier 0805, 1005, 1206,

1210

Embossed Only 0504, 0907 1505, 1805, 1812, 1825

1808 2220, 2225

Paper Only 0402, 0603

Qty. per Reel/7" Reel 2,000 or 4,000(1) 3,000 1,000

Qty. per Reel/13" Reel 10,000 10,000 4,000

(1) Dependent on chip thickness. Low profile chips shown on page 27 are 5,000 per reel for 7" reel. 0402 size chips are 10,000 per 7" reels and are

not available on 13" reels. For 3640 size chip contact factory for quantity per reel.

REEL DIMENSIONS

Tape A B* CD* N W1W2W3

Size(1) Max. Min. Min. Min. Max.

+1.0 7.9 Min.

8mm 8.4 –0.0 14.4 (.311)

(.331 +.060 ) (.567) 10.9 Max.

330 1.5 13.0±0.20 20.2 50

–0.0 (.429)

(12.992) (.059) (.512±.008) (.795) (1.969)

+2.0 11.9 Min.

12mm 12.4 –0.0 18.4 (.469)

(.488 +.076) (.724) 15.4 Max.

–0.0 (.607)

Metric dimensions will govern.

English measurements rounded and for reference only.

(1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision.

Tape Size B1D1FP

1RT

2WA

0 B0 K0

Max. Min. Min.

See Note 6 See Note 5 See Note 2

8mm 4.55 1.0 3.5 ± 0.05 4.0 ± 0.10 25 2.5 Max See Note 1

(.179) (.039) (.138 ± .002) (.157 ± .004) (.984) (.098)

12mm 8.2 1.5 5.5 ± 0.05 4.0 ± 0.10 30 6.5 Max. 12.0 ± .30 See Note 1

(.323) (.059) (.217 ± .002) (.157 ± .004) (1.181) (.256) (.472 ± .012)

8mm 4.55 1.0 3.5 ± 0.05 2.0 ± 0.10 25 2.5 Max. See Note 1

1/2 Pitch (.179) (.039) (.138 ± .002) 0.79 ± .004 (.984) (.098)

12mm 8.2 1.5 5.5 ± 0.05 8.0 ± 0.10 30 6.5 Max. 12.0 ± .30 See Note 1

Double (.323) (.059) (.217 ± .002) (.315 ± .004) (1.181) (.256) (.472 ± .012)

Pitch

Embossed Carrier Configuration

8 & 12mm Tape Only

8 & 12mm Embossed Tape

Metric Dimensions Will Govern

CONSTANT DIMENSIONS

Tape Size D0EP

0P2T Max. T1G1G2

8mm 8.4 +0.10 1.75 ± 0.10 4.0 ± 0.10 2.0 ± 0.05 0.600 0.10 0.75 0.75-0.0

and (.059 +.004) (.069 ± .004) (.157 ± .004) (.079 ± .002) (.024) (.004) (.030) (.030)

12mm -0.0 Max. Min. Min.

See Note 3 See Note 4

VARIABLE DIMENSIONS

NOTES:

1. A0, B0, and K0are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The

clearance between the end of the terminals or body of the component to the sides and depth of the cavity (A0, B0, and K0) must be within 0.05 mm (.002) min. and 0.50 mm

(.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches C & D).

2. Tape with components shall pass around radius “R” without damage. The minimum trailer length (Note 2 Fig. 3) may require additional length to provide R min. for 12 mm

embossed tape for reels with hub diameters approaching N min. (Table 4).

3. G1dimension is the flat area from the edge of the sprocket hole to either the outward deformation of the carrier tape between the embossed cavities or to the edge of the

cavity whichever is less.

4. G2dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity

or to the edge of the cavity whichever is less.

5. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment.

Dimensions of embossment location and hole location shall be applied independent of each other.

6. B1dimension is a reference dimension for tape feeder clearance only.

8.0 +0.3

-0.1

(.315 +.012 )-.004

8.0 +0.3

-0.1

(.315 +.012 )-.004

Tape Size P1FWA

0 B0T

8mm 4.0 ± 0.10 3.5 ± 0.05 See Note 1 See Note 3

(.157 ± .004) (.138 ± .002)

12mm 4.0 ± .010 5.5 ± 0.05 12.0 ± 0.3

(.157 ± .004) (.217 ± .002) (.472 ± .012)

8mm 2.0 ± 0.10 3.5 ± 0.05

1/2 Pitch (.079 ± .004) (.138 ± .002)

12mm 8.0 ± 0.10 5.5 ± 0.05 12.0 ± 0.3

Double (.315 ± .004) (.217 ± .002) (.472 ± .012)

Pitch

Paper Carrier Configuration

8 & 12mm Tape Only

8 & 12mm Paper Tape

Metric Dimensions Will Govern

CONSTANT DIMENSIONS

Tape Size D0EP

0P2T1G1G2R MIN.

8mm 1.5 +0.1 1.75 ± 0.10 4.0 ± 0.10 2.0 ± 0.05 0.10 0.75 0.75 25 (.984)-0.0

and (.059 +.004) (.069 ± .004) (.157 ± .004) (.079 ± .002) (.004) (.030) (.030) See Note 2

12mm -.000 Max. Min. Min.

VARIABLE DIMENSIONS

NOTES:

1. A0, B0, and T are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The

clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0, and T) must be within 0.05 mm (.002) min. and 0.50 mm

(.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches A & B).

2. Tape with components shall pass around radius “R” without damage.

3. 1.1 mm (.043) Base Tape and 1.6 mm (.063) Max. for Non-Paper Base Compositions.

8.0 +0.3

-0.1

(.315 +.012 )-.004

8.0 +0.3

-0.1

(.315 +.012 )-.004

Bar Code Labeling Standard

AVX bar code labeling is available and follows latest version of EIA-556-A.

Bulk Case Packaging

CASE QUANTITIES

Part Size 0402 0603 0805

Qty. 10,000 (T=0.6mm)

(pcs / cassette) 80,000 15,000 5,000 (T¯≥0.6mm)

BENEFITS BULK FEEDER

• Easier handling

• Smaller packaging volume

(1/20 of T/R packaging)

• Easier inventory control

• Flexibility

• Recyclable

CASE DIMENSIONS

Shutter

Slider

Attachment Base

110mm

12mm

36mm

Case

Cassette

Gate

Shooter

Chips

Expanded Drawing Mounter

Head