Silicon 1 Watt Zener Diodes
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
Copyright © 2005
10-18-2005 REV C
WWW.Microsemi .COM
SCOTTSDALE DIVISION
1N4728AP thru 1N4764AP,e3 (PLASTIC)
1N4728AP-1N4764AP,e3
DESCRIPTION APPEARANCE
The popular 1N4728AP thru 1N4764AP series of 1.0 watt Zeners provides
voltage regulation in a selection from 3.3 to 100 volts in 5% tolerances with
other tighter tolerances also available as identified by different suffix letters
in the part number. These plastic encapsulated Zeners are moisture
classified as Level 1 with no dry pack required. They are also available in
various military screening levels by adding a prefix identifier as described in
the Features below. These plastic molded Zeners with a P suffix provide a
lower thermal resistance compared to the glass-body (G suffix) option for
these same JEDEC part numbers. Both package options are available by
Microsemi in RoHS Compliant devices with an “e3” suffix. Microsemi also
offers numerous other Zener products to meet higher and lower power and
test current applications.
DO-41 or
DO-204AL
Plastic
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES APPLIC ATIONS / BENEFITS
• JEDEC registered 1N4728A to 1N476 4A
• Extensive voltage selection from 3.3 to 100 V
• Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers.
• Surface mount equivalents available as SMAJ4728A to
SMAJ4764A and MLL4728A to MLL476 4A (consult
factory for others)
• RoHS Compliant devices avai lable by adding “e3” suffix
• Regulates voltage over a broad op erating current and
temperature range
• Standard voltage tolerances are plus/minus 5% with
A suffix and 10 % with no suffix identific ation
• Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
• Flexible axial-lead mounting terminals
• Nonsensitive to ESD per MIL-STD-750 Method 1020
• Moisture classification is Level 1 per IPC/JEDEC J-
STD-020B with no dry pack required
MAXIMUM RAT ING S MECHANICAL AND PACKAGING
• Power dissipation at 25ºC: 1.0 watts (also see
derating in Figure 1).
• Operating and Storage temperature: -65ºC to
+150ºC
• Thermal Resistance: 45 ºC/W junction to le ad at 3/8
(10 mm) lead length from body, or 105ºC/W junction
to ambient when mounted on FR4 PC board (1 oz
Cu) with 4 mm2 copper pads and track width 1 mm,
length 25 mm
• Steady-State Power: 1.0 watts at TL < 105oC 3/8
inch (10 mm) from body or at TA < 45ºC when
mounted on FR4 PC board as described for thermal
resistance above (also see F igure 1)
• Forward voltage @200 mA: 1.2 volts (maximum)
• Solder Temperatures: 260 ºC for 10 s (max)
• CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
• TERMINALS: Tin-Lead (Sn/Pb) or RoHS Compliant
annealed matte-Tin plating solderable per MIL-STD-
750, method 2026
• POLARITY: Cathode indicated by band. Dio de to be
operated with the banded end positive with respect to
the opposite end for Zener regulation
• MARKING: Part number
• TAPE & REEL option: Standard per EIA-296 (add
“TR” suffix to part number)
• WEIGHT: 0.7 grams
• See package dimensions on l ast page