Features and Benefits
0
Micropower consumption ideal for
battery-powered applications
0
Omnipolar, easy to use as output swit
c
both North and South pole
0
Very High Sensitivity Hall Sensor
0
Chopper stabilized amplifier stage
0
Open-Drain Output
0
Operation down to 1.5V
0
Ultra-Thin QFN package (0.43mm m
a
SOT23 3L (both RoHS Compliant)
Ordering Code
Product Code Temperature Code
MLX90248 E
MLX90248 E
Legend:
Temperature Code: E
for Temperature Range
Package Code:
SE for TSOT, LD for UTQFN
Packing Form:
RE for Reel
Ordering example:
MLX90248E
1 Functional Diagram
390
1
09
0
24
8
02
Rev
00
2
c
hes with
a
x) & Thin
M
L
Micropower & Omnipolar
⇔
Application Exampl
es
0
Solid State Switch
0
Handheld Wireless Handset
A
0
Lid close sensor for battery-p
o
0
Magnet proximity sensor for r
eed
replacement in low duty cycl
e
Package Code
Option Code Packing Form Code
SE EBA-000
RE
LD EBA-000
RE
for Temperature Range
-40°C to 85°C
SE for TSOT, LD for UTQFN
RE for Reel
MLX90248E
SE-EBA-000-RE
2 General Description
The MLX90248 Omnipolar
TM
IC is
fabricated
from mi
x
technology. It incorpor
ates
stabilization techniques to p
r
stable magnetic switch points.
The circuit design provides
an
clocking mechanism to cycl
e
element and analog signal
This serves to place the hig
h
portions of the circuit i
nto
Periodically the device is
“
internal logic and the m
agnet
element is evaluated agai
n
thresholds. If the flux density i
s
Bop/Brp thresholds then the
driven to change states acc
o
“Sleep” cycle the output tran
s
previous state. The design
has
service in applications
r
operating lifetime in battery po
w
The output transistor of the
90
on (BOP) in the presence of
South or North magnetic fiel
d
side of the package. The o
utput
(BRP) in the absence of a m
agnet
P
a
g
e
1
of
11
L
X90248
⇔
Hall Switch
es
A
wake Switch
o
wered devices
eed
switch
e
applications
Option Code Packing Form Code
RE
RE
TM
Hall effect sensor
xed signal CMOS
ates
advanced chopper-
r
ovide accurate and
an
internally controlled
e
power to the Hall
processing circuits.
h
current-consuming
nto
a “Sleep” mode.
“
Awakened” by this
agnet
ic flux from the Hall
n
st the predefined
above or below the
output transistor is
o
rdingly. While in the
s
istor is latched in its
has
been optimized for
r
equiring extended
w
ered systems.
90
248 will be latched
a sufficiently strong
facing the marked
utput
will be latched off
agnet
ic field.
Data
S
h
e
et
Apr/12
M
L
X
90248
Micropower & Omnipolar
⇔
Hall Swit
ch
390109024802
Rev
002
Page 2 of
11
Data
Sheet
Apr/12
Table of Contents
1 Functional Diagram ........................................................................................................ 1
2 General Description........................................................................................................ 1
3 Glossary of Terms .......................................................................................................... 3
4 Absolute Maximum Ratings ........................................................................................... 3
5 Pin Definitions and Descriptions................................................................................... 3
6 General Electrical Specifications .................................................................................. 4
7 Magnetic Specifications ................................................................................................. 4
8 Outputs Behaviour vs. Magnetic Pole........................................................................... 4
9 Detailed General Description ......................................................................................... 5
10 Unique Features............................................................................................................ 5
11 Performance Graphs .................................................................................................... 6
11.1 Magnetic Thresholds vs. T
A
....................................................................................................................
6
11.2 Magnetic Thresholds vs. V
DD
..................................................................................................................
6
11.3 Current Consumption vs. T
A
...................................................................................................................
6
11.4 Current Consumption vs. V
DD
.................................................................................................................
6
11.5 Consumption Period vs. T
A
.....................................................................................................................
6
11.6 Consumption Period vs. V
DD
...................................................................................................................
6
11.7 Output Saturation Voltage vs. T
A
............................................................................................................
7
11.8 Output Switching
Characteristics
............................................................................................................ 7
12 Application Information................................................................................................ 7
13 Standard information regarding manufacturability of Melexis products with
different soldering processes........................................................................................... 8
14 ESD Precautions ........................................................................................................... 8
15 Package Information..................................................................................................... 9
15.1 SE Package
(TSOT-3L)
.......................................................................................................................... 9
15.2 LD Package (UTQFN-6L)
..................................................................................................................... 10
16 Disclaimer.................................................................................................................... 11
M
L
X
90248
Micropower & Omnipolar
⇔
Hall Swit
ch
390109024802
Rev
002
Page 3 of
11
Data
Sheet
Apr/12
3 Glossary of Terms
Gauss, milliTesla (mT), Units of magnetic flux density :
10 Gauss = 1mT
4 Absolute Maximum Ratings
Parameter Symbol Value Units
S
upp
l
y
V
o
l
t
a
g
e
V
DD
5
V
S
upp
l
y
Cu
rr
e
n
t
I
DD
5
m
A
Output
V
o
l
t
a
g
e
V
O
UT
5
V
Output
Cu
rr
e
n
t
I
O
UT
10
m
A
Op
e
r
a
t
i
ng
Temperature
Range
T
A
-40 to
85
°
C
Storage Temperature
Range
T
S
-50 to
150
°
C
ESD
S
e
n
s
i
t
i
v
i
ty
- HBM
(
1
)
-
8000
V
ESD
S
e
n
s
i
t
i
v
i
ty
- MM
(
2
)
-
800
V
Table 1: Absolute maximum ratings
Note 1: Human Body Model according JESD22-A114 standard – 100pF capacitor discharged through 1.5k
&
resistor into each pin.
Note 2: Machine Model according JESD22-A115 standard – 200pF capacitor discharged directly (0
&
resistor) into each pin.
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximum-
rated conditions for extended periods may affect device reliability.
5 Pin Definitions and Descriptions
SE Package LD Package
Pin Name Function Pin №
(SE) Pin №
(LD)
V
DD
Power
S
upp
l
y
1
2
GND
Ground
3
4
OU
T
Output (Open
Dr
a
i
n
)
2
5
N
C
Not
Conn
e
c
t
e
d
-
1,3,6
Table 2: Pin definitions and descriptions
Note : Exposed Pad on LD package is connected to ground
M
L
X
90248
Micropower & Omnipolar
⇔
Hall Swit
ch
390109024802
Rev
002
Page 4 of
11
Data
Sheet
Apr/12
A
DD
A
DD
6 General Electrical Specifications
DC Operating Parameters T = 25
o
C, V = 1.5V to 3.6V (unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Units
S
upp
l
y
V
o
l
t
a
g
e
V
DD
Op
e
r
a
t
i
ng
1.5
-
3.6
V
Awake
S
upp
l
y
Cu
rr
e
n
t
I
DD
a
w
a
k
e
V
DD
=
3.6
V
-
3
5
m
A
S
l
ee
p
S
upp
l
y
Cu
rr
e
n
t
I
DD
s
l
ee
p
V
DD
=
3.6
V
-
3.5
6
∝
A
Average
S
upp
l
y
Cu
rr
e
n
t
I
DD
a
v
V
DD
= 3.6V,
A
v
e
r
a
g
e
-
6.5
10
∝
A
Output
S
a
t
u
r
a
t
i
on
V
o
l
t
a
g
e
V
S
A
T
I
OUT
=
1
m
A
-
0.27
0.4
V
Output
L
ea
k
a
g
e
Cu
rr
e
n
t
I
L
E
AK
V
DD
=
3.6
V
-
-
1
∝
A
Awake
P
e
r
i
od
T
A
W
Op
e
r
a
t
i
ng
30
50
120
∝
s
S
l
ee
p
P
e
r
i
od
T
S
L
Op
e
r
a
t
i
ng
25
40
70
ms
Table 3: Electrical specifications
7 Magnetic Specifications
DC Operating Parameters T = 25
o
C, V = 1.5V to 3.6V (unless otherwise specified)
Parameter Symbol Min Typ Max Units
Op
e
r
a
t
i
ng
P
o
i
n
t
B
O
P
+
/-
1.1
-
+
/-
6
m
T
R
e
l
ea
s
e
P
o
i
n
t
B
R
P
+
/-
0.8
-
+
/-
5.7
m
T
Hy
s
t
e
r
e
s
i
s
B
H
Y
S
T
0.3
-
2.3
m
T
Table 4: Magnetic specifications
Note : For typical values, please refer to the performance graphs section
8 Outputs Behaviour vs. Magnetic Pole
SE Package LD Package
Parameter Test conditions OUT (SE) OUT (LD)
North or South
po
l
e
B >
|
B
O
P
|
L
o
w
L
o
w
“
Z
e
r
o
”
m
a
gn
e
t
i
c
po
l
e
B <
|
B
R
P
|
H
i
gh
H
i
gh
Table 5: Outputs behaviour vs. magnetic pole
Note : The magnetic pole is applied facing the branded side of the package
M
L
X
90248
Micropower & Omnipolar
⇔
Hall Swit
ch
390109024802
Rev
002
Page 5 of
11
Data
Sheet
Apr/12
9 Detailed General Description
The MLX90248 is originally used in mobile phone applications for open/close lid detection (flip, slide and
swivel phone type). The goal of this detection is to switch on or off the application if the lid is opened or
closed, in order to save battery power.
The same operation principle can be simply applied to any other battery-powered device with a lid/cover like
laptop, digital cameras and camcorders.
By the use of a very high sensitivity Hall sensor, a very small and cheap magnet is enough to trigger the
MLX90248, hence it can easily replace reed switch.
The major benefit of using a Hall sensor is to provide “electronic” commutation, which is bounce-free, more
reliable and with increased lifetime compared to usual mechanical contacts.
10 Unique Features
The MLX90248 exhibits “Omnipolar” magnetic characteristics. It means the device reacts to both North and
South magnetic pole. The purpose is to detect the presence of any magnetic field applied on the device.
This mode of operation simplifies customer production processes by avoiding the need to detect the Hall
sensor pole active on the magnet used in the application.
Taking the example of a generic Hall sensor “south pole active”, during its production, the customer must
detect the south pole of the application magnet and face it to the device to enable the output to be turned on
and off. Without any magnet pole detection system, the incorrect magnetic pole (north in this example) could
be faced to the device which would fail the application.
Therefore, the “Omnipolar” magnetic behaviour helps customers by removing the need of magnet pole
detection system during production phase.
The “Micropower” feature makes the MLX90248 especially suitable for battery-powered device as it
combines low voltage operation and low current consumption. By using a sleep/awake strategy managed
internally, the power consumption is drastically reduced. To make a comparison, the MLX90248 consumes
100 times less power than the generic low voltage Melexis Hall sensor US3881.
As well as Thin SOT package, the MLX90248 is now delivered in an ultra thin UTQFN package. This new
leadless package only requires 3mm
2
PCB surface and is 0.43mm maximum thick, which is particularly
important in design where space-saving and miniaturisation are the critical factors.
M
L
X
90248
Micropower & Omnipolar
⇔
Hall Swit
ch
390109024802
Rev
002
Page 6 of
11
Data
Sheet
Apr/12
Timing
Current Consumption
Magnetic threshold (mT)
Timing
Current Consumption
Magnetic threshold (mT)
11 Performance Graphs
Unless otherwise specified, performance graphs given at V
DD
= 3.6V and T
A
= 25 degree C.
11.1 Magnetic Thresholds vs. T
A
11.2 Magnetic Thresholds vs. V
DD
6 6
BopN
BrpN
BopS
BrpS
3 3
BopN
BrpN
BopS
BrpS
0 0
-3 -3
-6
-40 -20 0 20 40 60 80 100
120
Ta
(
°
C)
-6
1.5 2 2.5 3 3.5
VDD
(V)
11.3 Current Consumption vs. T
A
11.4 Current Consumption vs. V
DD
10 10
Idd awake (mA)
Idd sleep (uA)
8 Idd average (uA) 8
Idd awake (mA)
Idd sleep
(uA) Idd
average (uA)
6 6
4 4
2 2
0
-40 -20 0 20 40 60
80
Ta
(
°
C)
0
1.5 2 2.5 3 3.5
VDD
(V)
11.5 Consumption Period vs. T
A
11.6 Consumption Period vs. V
DD
100
80
Tawake(us), VDD=3.6V
Tsleep(ms), VDD=3.6V
80
Tawake(us)
Tsleep(ms)
60
60
40
40
20
20
0
-40 -20 0 20 40 60
80
Ta
(
°
C)
0
1.5 2 2.5 3 3.5
VDD
(V)
390109024802
Rev
002
Output Saturation Voltage (mV)
11.7 Output Saturation Volta
ge
400
VDD = 1.5V
VDD = 3.6V
300
200
100
0
-40 -20 0 20 40
Ta
(
°
C)
12 Application Informatio
n
M
L
X
Micropower & Omnipolar
⇔
Page 7 of
11
ge
vs. T
A
11.8 Output Switching Cha
r
60 80
n
Typical
application
X
90248
⇔
Hall Swit
ch
Data
Sheet
Apr/12
r
acteristics
M
L
X
90248
Micropower & Omnipolar
⇔
Hall Swit
ch
390109024802
Rev
002
Page 8 of
11
Data
Sheet
Apr/12
13 Standard information regarding manufacturability of Melexis
products with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture
sensitivity level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of
the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.aspx
14 ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
M
L
X
90248
Micropower & Omnipolar
⇔
Hall Swit
ch
390109024802
Rev
002
Page 9 of
11
Data
Sheet
Apr/12
15 Package
Information
15.1 SE
Package (TSOT-3L)
2.75
BSC
"I
110 MAX
H-i
SEATiNG
PLANE
I
Notes:
1. All
dimensions
are in
millimeters
2.Outermost
plasttc
extreme
width
does not
indude
mold
flash
or
protrusions.
Mold flash and
protrusions
shall not
exceed
0.15mm
per
side
3.Outermost
plasttc
extreme
length does not
i
nd
ude
mold
f
lash
or
protrusions.
Mold flash and
protrusions
shall not
exceed
0.25mm
per
side
4.The lead width
dimension
does not include dambar
protrusion.
Allowable dambar protrusion shallbe
0.07mm
totalin excess
of the lead width
dimension
at
maximum
material
oond1t1on
5.
Dimension
IS the length of term1nal for s
dering
6.
Dimension
on
SECT
I
ON
B+B'
are apply to the flat section
of
the lead
between
o.oamm
and
a.15mm from the
lead
tip.
12
"
REF.
TYP.
0.575
REF.
END
VIEW
TOP
VIEW
SIDE
VIEW
SECTION
B-B
'
Hall plate
location
END
VIEW
Package
line
7.Formed
lead
shallbe
planar with respect to one
another with
0.076mm
at
seating
plane
Markina-
Top
side
248E-
Name
of
the
Dev1ce
(MLX90248)
Bottom
side xyww
x
=
l
as
t
digit of
l
o
t
number
y
l
ast
d
i
g
1t
of
year
WN
"'w
eek
Notes
1_
AI!
dimensions
are
in
millimet
ers
M
L
X
90248
Micropower & Omnipolar
⇔
Hall Swit
ch
390109024802
Rev
002
Page 10 of
11
Data
Sheet
Apr/12
15.2 LD Package
(UTQFN-6L)
390
1
09
0
24
8
02
Rev
002
P
a
g
e
11
of 11
Data
S
h
e
et
Apr/12
M
L
X
90248
Micropower & Omnipolar
⇔
Hall Swit
ch
16 Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing
in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description
regarding the information set forth herein or regarding the freedom of the described devices from
patent infringement. Melexis reserves the right to change specifications and prices at any time and
without notice. Therefore, prior to designing this product into a system, it is necessary to check with
Melexis for current information. This product is intended for use in normal commercial applications.
Applications requiring extended temperature range, unusual environmental requirements, or high
reliability applications, such as military, medical life-support or life-sustaining equipment are
specifically not recommended without additional processing by Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall
not be liable to recipient or any third party for any damages, including but not limited to personal injury,
property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or
consequential damages, of any kind, in connection with or arising out of the furnishing, performance or
use of the technical data herein. No obligation or liability to recipient or any third party shall arise or
flow out of Melexis’ rendering of technical or other services.
© 2012 Melexis NV. All rights reserved.
For the latest version of this document, go to our website at
www.melexis.com
Or for additional information contact Melexis Direct:
Europe, Africa, Asia: America:
Phone: +32 1367 0495 Phone: +1 248 306 5400
E-mail: sales_europe@melexis.com E-mail: sales_usa@melexis.com
ISO/TS 16949 and ISO14001 Certified