- 1 - E05X11-PS
This IC is ESD sensitive device. Special handling precautions are required.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license
by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating
the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
CXG1199UR
High-Freq uency SPDT Switch
Description
The CXG1199UR is a SPDT (Single Pole Dual Throw) switch and suitable for middle power wireless
communication systems, for example, cellular phones, Bluetooth and WLAN.
Low insertion loss is realized by the Sony JPHEMT process.
(Applications: Cellular phones, Bluetooth and WLAN)
Features
Low insertion loss
Package
Small package: 12-pin UQFN (2.0mm × 2.0mm × 0.6mm (Max.))
Structure
GaAs JPHEMT MMIC
Absolute Maximum Ratings
(Ta = 25°C)
Control voltage Vctl 5 V
Operating temperature Topr –35 to +85 °C (for general use)
–40 to +85 °C (for Bluetooth & WLAN)
Storage temperature Tstg –65 to +150 °C
CXG1199UR
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Block Diagram and Recommended Circuit
When using this IC, the following external components are needed:
Rctl: This resistor is for improving ESD performance. 1kΩ is recommended.
CRF: This capacitor is for RF decoupling and needed for all applications.
Cbypass: This capacitor is for DC line filtering. 100pF is recommended.
Truth Table
DC Bias Condition
(Ta = 25°C)
*1 General use
*2 Bluetooth & WLAN
CTLA
Cbypass
(100pF)
Rctl (1kΩ)
56 4
1110 12
8
7
9
2
3
1
Cbypass
(100pF)
Rctl (1kΩ)
CRF
GND
RF3RF2
RF1
CTLB
GND
GND
GND
GND GND
GND
CRF
CRF
F2
F4
F1
F3
CTLA CTLB ON Path F1 F2 F3 F4
L H RF1 – RF2 ON OFF OFF ON
H L RF1 – RF3 OFF ON ON OFF
Item Min. Typ. Max. Unit Condition
Vctl (H)*1 2.0 2.8 3.6 V Pin = 15dBm
Vctl (H)*2 1.65 1.8 1.95 V Pin = 5dBm
Vctl (L) 0 — 0.4 V —
CXG1199UR
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Elec trical Charac teristics
1. Electrical Char acteristics for General Use
(Ta = 25°C)
Common condition: Pin = 15dBm, Vctl (H) = 2.8V, Vctl (L) = 0V, All RF ports are 50Ω terminated.
2. Electrical Char acteristics for Bluetooth & WLAN
(Ta = 25°C)
Common condition: Pin = 5dBm, Vctl (H) = 1.8V, Vctl (L) = 0V, All RF ports are 50Ω terminated.
Item Symbol Path Condition Min. Typ. Max. Unit
Insertion loss IL
RF1 – RF2
0.5 to 1.0GHz — 0.20 0.30 dB
1.0 to 2.0GHz — 0.25 0.35 dB
2.0 to 2.5GHz — 0.35 0.45 dB
RF1 – RF3
0.5 to 1.0GHz — 0.20 0.30 dB
1.0 to 2.0GHz — 0.25 0.35 dB
2.0 to 2.5GHz — 0.35 0.45 dB
Isolation ISO.
RF1 – RF2
0.5 to 1.0GHz 25 32 — dB
1.0 to 2.0GHz 25 31 — dB
2.0 to 2.5GHz 20 27 — dB
RF1 – RF3
0.5 to 1.0GHz 25 32 — dB
1.0 to 2.0GHz 25 31 — dB
2.0 to 2.5GHz 20 27 — dB
VSWR VSWR —
0.5 to 1.0GHz — 1.2 1.5 —
1.0 to 2.0GHz — 1.2 1.5 —
2.0 to 2.5GHz — 1.2 1.5 —
Control current Ictl — Vctl = 2.8V — 2 6 µA
Item Symbol Path Condition Min. Typ. Max. Unit
Insertion loss IL RF1 – RF2 2.0 to 2.5GHz — 0.35 0.50 dB
RF1 – RF3 2.0 to 2.5GHz — 0.35 0.50 dB
Isolation ISO. RF1 – RF2 2.0 to 2.5GHz 20 27 — dB
RF1 – RF3 2.0 to 2.5GHz 20 27 — dB
VSWR VSWR — 2.0 to 2.5GHz — 1.2 1.5 —
Control current Ictl — Vctl = 1.8V — 1 3 µA
Switching speed TSW — — 0.1 1 µs
CXG1199UR
- 4 - Sony Corporation
Package Outline
(Unit: mm)
PIN 1 INDEX
C
0.1 S A-B
0.4
0.05 M S C
C
A-B
S
0.05 S
MAX0.02
+ 0.09
12PIN UQFN (PLASTIC)
0.25 – 0.03
+ 0.09
0.14 – 0.03
x 4
2.0
4
1 3
9 7
6
12
10
2.0
S
0.4 ± 0.1
0.6
0.55 ± 0.05
4-R0.2
0.26
A B
0.25
0.14
0.07 0.18
SONY CODE
EIAJ CODE
JEDEC CODE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
0.01g
PACKAGE STRUCTURE
UQFN-12P-01
PACKAGE MASS
TERMINAL SECTION
Note:Cutting burr of lead are 0.05mm MAX.
Solder Plating
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL COPPER ALLOY
SOLDER COMPOSITION Sn-Bi Bi:1-4wt%
PLATING THICKNESS 5-18µm
SPEC.
