MS5637-02BA03 Low Voltage Baro met ri c Pres su re Sen s o r
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• QFN package 3 x 3 x 0.9 mm3
• High-resolution m o d u le, 13 cm
• Supply voltage: 1.5 to 3.6 V
• Fast conversion down to 0.5 ms
• Low power, 0.6 µA (standby ≤ 0.1 µA at 25°C)
• Integrated digital pressure sensor (24 bit ΔΣ ADC)
• Operati n g ra n g e: 300 to 1200 mbar, -40 to +85 °C
• I2C interface
• No external components (internal oscillator)
DESCRIPTION
The MS5637 is an ultra-compact micro altimeter. It is optimized for altimeter and barometer applications in
Smart-phones and Tablet P C s. The altitude res olut io n at s ea le ve l is 13 cm of air. T he s ensor m odule inclu de s a
high-li nearit y press ure s ens or and an ultr a-lo w power 24 bit ΔΣ ADC with inter nal factor y-calibrated c oeff icie nts.
It provides a prec ise digital 24-bit pressure and tem perature value and different operation modes that allow the
user to opt im ize for conver sion s peed an d current cons umption. A hi gh-resol ution tem peratur e output al lows the
implementation of an altimeter/thermometer function without any additional sensor. The MS5637 can be
interfaced t o an y microcont roller wi th I 2C-bus i nterfac e. The c omm unication proto col is s imple, withou t the need
of programming internal registers in the device. Small dimensions of 3 x 3 x 0.9 mm3 allow the integration in
mobile devices. This new sensor module generation is based on leading MEMS technology and latest benefits
from MEAS Switzerland proven experience and know-how in high volume m anufacturing of altimeter modules,
which has been widel y used f or over a dec ade. T he s ens ing pri ncip le employed le ads to very low hysteresis and
high stability of both pressure and temperature signal.
FEATURES
FIELD OF APPL ICATION TECHNICAL DATA
Smart-phones Sensor Performances (VDD = 3 V)
Tablet PCs Pressure Min Typ Max Unit
Personal navigation devices Maximum Range 10 2000 mbar
FUNCTIONAL BLOCK DIAGRAM
VDD
GND
SCL
SDA
ADC
I
2
C Bus
Interface
Memory
(PROM)
112 bits
SENSOR
SGND
+IN
-IN
dig.
Filter
Sensor
Interface IC
ADC 24 bit
Resolution (1)
0.11 / 0.062/ 0.039
/ 0.028 / 0.021 /
0.016
mbar
Error band at 25°C,
300 to 1200 mbar
-2 +2 mbar
Error band, -20°C to + 85°C
300 to 1200 mbar (2)
-4 +4 mbar
Response time (1)
0.5 / 1.1 / 2.1 / 4.1 /
8.22 / 16.44
ms
Long term stabilit y ±1 mbar/yr
Temperature Min Typ Max Unit
Range -40 +85 °C
Resolution <0.01 °C
Accuracy at 25°C -1 +1 °C
Notes: (1) Oversamp ling Ratio: 2 56 / 512 / 10 24 / 2048 / 4096 / 8192
(2) With auto-zero at one pressure point
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PERFORMANCE SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
Supply voltage
VDD
-0.3
+3.6
V
Storage temperature
TS
-20
+85
°C
Overpressure
Pmax
6
bar
Maximum Soldering
Temperature
Tmax 40 sec max 250 °C
ESD rating
Human Body
Model
-2 +2 kV
Latch up
JEDEC standard
No 78
-100 +100 mA
ELECTRICAL CHARACTERISTICS
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
Operating Supply voltage
VDD
1.5
3.0
3.6
V
Operating Temperature
T
-40
+25
+85
°C
Supply current
(1 sample per sec.) IDD
OSR 8192
4096
2048
1024
512
256
20.09
10.05
5.02
2.51
1.26
0.63
µA
Peak supply current
during conversion
1.25
mA
Standby supply current
at 25°C (VDD = 3.0 V)
0.01
0.1
µA
VDD Capacitor
from VDD to GND
100
470
nF
ANALOG DIGITAL CONVERTER (ADC)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
Output Word
24
bit
Conversion time tc
OSR 8192
4096
2048
1024
512
256
16.44
8.22
4.13
2.08
1.06
0.54
ms
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PERFORMANCE SPECIFICATIONS (CO NTINUED)
PRESSURE OUTPUT CHARACTERISTICS (VDD = 3.0 V, T = 25 °C UNLESS OTHERWISE NOTED)
Parameter
Conditions
Min.
Typ.
Max.
Unit
Operating Pressure Range
Prange
300
1200
mbar
Extended Pressure Range Pext
Linear Range of
ADC
10 2000 mbar
Relative Accuracy, autozero at
one pressure poi nt (1) 700…1000 mbar at 25°C ±0.1 mbar
Absolute Accuracy,
no autozero 300..1200 mbar at 25°C
300..1200mbar, -20..85°C -2
-4 +2
+4 mbar
Resolution RMS
OSR 8192
4096
2048
1024
512
256
0.016
0.021
0.028
0.039
0.062
0.11
mbar
Maximum error with supply
voltage
VDD = 1.5 V … 3.6 V ±0.5 mbar
Long-term stability
±1
mbar/yr
Reflow soldering impact
IPC/JEDEC J-STD-020C
(See application note AN808
on http://meas-spec.com)
-1 mbar
Recoverin g time after reflow (2)
3
days
(1) Characterized value performed on qualification devices
(2) Recovering time at least 66% of the reflow impact
TEMPERATURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)
Parameter
Conditions
Min.
Typ.
Max.
Unit
Absolute Accuracy
at 25°C
-20..85°C
-1
-2
+1
+2
°C
Maximum error with supply
voltage
VDD = 1.5 V … 3.6 V ±0.3 °C
Resolution RMS
OSR
8192
4096
2048
1024
512
256
0.002
0.003
0.004
0.006
0.009
0.012
°C
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PERFORMANCE SPECIFICATIONS (CO NTINUED)
DIGITAL INPUTS (SDA, SCL)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
Serial data cloc k
SCL
400
kHz
Input high volta ge
VIH
80% VDD
100% VDD
V
Input low voltage
VIL
0% VDD
20% VDD
V
Input leakage cur rent
Ileak
T = 25 °C
0.1
µA
Input capacitance
CIN
6
pF
DIGITAL OUTPUTS (SDA)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
Output high voltage
VOH
Isource = 1 mA
80% VDD
100% VDD
V
Output low voltage
VOL
Isink = 1 mA
0% VDD
20% VDD
V
Load capacitan ce
CLOAD
16
pF
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FUNCTIONAL DESCRIPTION
VDD
GND
SCL
SDA
ADC
I
2
C Bus
Interface
Memory
(PROM)
112 bits
SENSOR
SGND
+IN
-IN
dig.
Filter
Sensor
Interface IC
Figure 1: Block diagram
GENERAL
The MS5637 cons ists of a pie zo-r esistive sensor and a sensor i nterface i ntegrated circ uit. The m ain function of
the MS5637 is to con vert the u ncom pensated an alogue o utput vo ltage from the pie zo-resist ive pressure sens or
to a 24-bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor.
FACTORY CALIBRATION
Every m odule is indi viduall y factor y calibrated at t wo t em peratures and two press ures. As a result, 6 c oeff icients
necessary to compensate for process variations and temperature variations are calculated and stored in the
112-bit PROM of each module. These bits (partitioned into 6 coefficients) must be read by the microcontroller
software and used in the program converting D1 and D2 into compensated pressure and temperature values.
SERIAL I2C INTERFACE
The ext ernal microcontr oller clocks in the data thro ugh the inp ut SC L ( Ser ial C Lock) and SDA (S er ial DAt a) . The
sensor r esponds on the s a me pin SDA which is bidirectional for the I 2C bus interf ac e. So th is interf ac e t ype uses
only 2 signal lines and does not require a chip select.
Module reference
Mode
Pins used
MS563702BA03
I2C
SDA, SCL
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PRESSURE AND TEMPERA TURE CALCULATION
Size [1]
[bit] min max
C1
Pressure sensitivity | SENST1 unsigned int 16 16 065535 46372
C2
Pressure offset | OFFT1 unsigned int 16 16 065535 43981
C3 Temperature coefficient of pressure sensitivity | TCS unsigned int 16 16 065535 29059
C4 Temperature coefficient of pressure offset | TCO unsigned int 16 16 065535 27842
C5
Reference temperature | TREF unsigned int 16 16 065535 31553
C6 Temperature coefficient of the temperature | TEMPSENS unsigned int 16 16 065535 28165
D1
Digital pressure value unsigned int 32 24 016777216 6465444
D2
Digital temperature value unsigned int 32 24 016777216 8077636
dT
Difference between actual and reference temperature [2]
dT = D2 - TREF = D2 - C5 * 28
signed int 32 25 -16776960 16777216 68
2000
= 20.00 °C
OFF
Offset at actual temperature [3]
OFF = OFFT1 + TCO * dT = C2 * 217 + (C4 * dT) / 26
signed int 64 41 -17179344900 25769410560 5764707214
SENS
Sensitivity at actual temperature [4]
SENS = SENST1 + TCS * dT = C1 * 216 + (C3 * dT) / 27
signed int 64 41 -8589672450 12884705280 3039050829
110002
= 1100.02 mbar
Notes
[1]
[2]
[3]
[4]
min and max have to be defined
min and max have to be defined
Maximal size of intermediate result during evaluation of variable
120000
1000
58
P
Recommended
variable type
Descript ion | Equation
signed int 32
Actual temperature (-40…85°C with 0.01°C resolution)
TEMP = 20°C + dT * TEMPSENS = 2000 + dT * C6 / 223
Read digital pressure and temperature data
signed int 32
Temperature compensated pressure (10…1200mbar with
0.01mbar resolution)
P = D1 * SENS - OFF = (D1 * SENS / 221 - OFF) / 2 15
min and max have to be defined
Convert calibration data into coefficients (see bit pattern of W1 to W4)
Variable
Example /
Typical
Value
Calculate temperature compensated pressure
8500
-4000
TEMP
41
Start
Maximum values for calculation results:
PMIN = 10mbar PMAX = 2000mbar
TMIN = -40°C TMAX = 85°C TREF = 20°C
Read calibration data (factory calibrated) f r om PROM
Read digital pressure and temperature data
Calculate temperature
Calculate temperature compensated pressure
Display pressure and temperature value
Figure 2: Flow chart for pressure and temperature reading and software compensation.
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SECOND ORDER TEMPERATURE CO MPENS ATIO N
In order to obtain best accuracy over temperature range, particularl y at low temperature, it is recommended to
compensate the non-linearity over the temperature. This can be achieved by correcting the calculated
temperature, offset and sensitivity b y a secon d-order correction factor. The second-order factors are calculated
as follows:
Figure 3: Flow chart for pressure and temperature to the optimum accuracy.
Yes
No
SENS2 = 29 ⋅ (TEMP – 2000)2/ 24
SENS2 = 0
SENS = SENS - SENS2
TEMP<20°C
Low temperature
T2 = 3 ⋅ dT
2
/ 2
33
OFF2 = 0
T2 = T2 = 5 ⋅ dT
2
/ 2
38
OFF2 = 61 ⋅ (TEMP – 2000)2 / 24
OFF = OFF - OFF2
TEMP = TEMP - T2
Low temperature
High temperature
Calculate pressure and temperature
TEMP<-15°C
No
Yes
SENS2 = SENS2 + 9 ⋅ (TEMP + 1500)2
Low temperature
OFF2 = OFF2 + 17 ⋅ (TEMP + 1500)2
Very low temperature
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I2C INTERFACE
COMMANDS
The MS5637 has only five basic commands:
1. Reset
2. Read PROM (112 bit of calibration words)
3. D1 conversion
4. D2 conversion
5. Read ADC result (24 bit pressure / temperature)
Each I2C communication message starts with the start condition and it is ended with the stop condition. The
MS5637 address is 1110110x (write : x=0, read : x=1).
Size of each c omm and is 1 b yte (8 b its) as des cribe d in t he t able below. After ADC read c omm ands , the devic e
will return 24 bit resu lt and af ter the PROM r ead 16 bi t res ults. The addres s of t he PROM is em bedded i nside of
the PROM read comm and using the a2, a1 and a0 bits .
Command by te
hex value
Bit number
0
1
2
3
4
5
6
7
Bit name
PRO
M
CO
NV
-
Typ
Ad2/
Os2
Ad1/
Os1
Ad0/
Os0
Stop
Command
Reset
0
0
0
1
1
1
1
0
0x1E
Convert D1 (OSR=256)
0
1
0
0
0
0
0
0
0x40
Convert D1 (OSR=512)
0
1
0
0
0
0
1
0
0x42
Convert D1 (OSR=1024)
0
1
0
0
0
1
0
0
0x44
Convert D1 (OSR=2048)
0
1
0
0
0
1
1
0
0x46
Convert D1 (OSR=4096)
0
1
0
0
1
0
0
0
0x48
Convert D1 (OSR=8192)
0
1
0
0
1
0
1
0
0x4A
Convert D2 (OSR=256)
0
1
0
1
0
0
0
0
0x50
Convert D2 (OSR=512)
0
1
0
1
0
0
1
0
0x52
Convert D2 (OSR=1024)
0
1
0
1
0
1
0
0
0x54
Convert D2 (OSR=2048)
0
1
0
1
0
1
1
0
0x56
Convert D2 (OSR=4096)
0
1
0
1
1
0
0
0
0x58
Convert D2 (OSR=8192)
0
1
0
1
1
0
1
0
0x5A
ADC Read
0
0
0
0
0
0
0
0
0x00
PROM Read
1
0
1
0
Ad2
Ad1
Ad0
0
0xA0 to
0xAE
Figure 4: Command structure
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RESET SEQUENCE
The Res et s e que nce s ha ll be s en t o nc e af ter po wer -on to make sur e tha t th e c a li bratio n PRO M ge ts lo ade d into
the internal register. It can be also used to reset the device PROM from an unknown condition.
The res et c an be s e nt at a n y t ime. In the e vent that the r e is n ot a succes sful power on res et th is may be caus ed
by the S DA be ing b lock ed b y the m odule in th e ack nowledge s tate. T he onl y wa y to get the MS5637 to func tion
is to send several SCLs followed by a reset sequence or to repeat power on reset.
1110110000001111 0 0
S W A A P
From Master
S = Start Condition
W = Write A = Acknowledge
From Slave P = Stop Condition R = Read
N = Not Acknowledge
cmd byte
Device Address
Device Address
command
Figure 5: I2C Reset Command
PROM READ SEQUENCE
The read command for PROM shall be executed once after reset by the user to read the content of the
calibratio n PROM and to c alculate the calibration coefficients. T here are in tot al 7 ad dresses result ing in a total
memory of 112 bit. Addresses contains factory data and the setup, calibration coefficients, the serial code and
CRC. T he command s equence is 8 bits long with a 16 bit result which is cloc ked with t he MSB first . The PRO M
Read command consists of two parts. First command sets up the system into PROM read mode. The second
part gets the data from the system.
111011000101001100
S W A A P
From Master
S = Start Condition
W = Write A = Acknowl edge
From Slave P = Stop Condition R = Read
N = Not Acknowledge
Device Address
Device Address
cmd byte
command
Figure 6: I2C Command to read memory addres s= 011
1 1 1011010 X X XXXX X X 0 X X XXXXXX0
S R A A N P
From Master
S = Start Condition
W = Write A = Acknowledge
From Slave P = Stop Condition R = Read N = Not Acknowledage
Memory bi t 7 - 0
Device Address
Device Address
Memory bi t 15 - 8
data
data
Figure 7: I2C answer from MS5637
CONVERSION SEQUENC E
The conver sion com m and is used to init iate uncom pens ated press ure (D1) or uncom pens ated tem perature ( D2)
conversion. After the conversion, using ADC read command the result is clocked out with the MSB first. If the
conversi on is not ex ecute d bef ore the AD C read com mand, or the A DC read c om m and is repeated, it wil l give 0
as the outp ut resu lt. If the ADC read com mand is sent duri ng convers ion the res ult will b e 0, the c onversio n will
not stop and the final result will be wrong. Conversion sequence sent during the already started conversion
process will yield incorrect result as well. A conversion can be started by sending the command to MS5637.
When command is sent to the system it stays busy until conversion is done. When conversion is finished the
data can be accessed by sending a Read command, when an acknowledge is sent from the MS5637, 24 SCL
cycles may be sent to receive all result bits. Every 8 bits the system waits for an acknowledge signal.
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111011000010010000
S W A A P
From Master
S = Start Condition
W = Write A = Acknowledge
From Slave P = Stop Condition R = Read
N = Not Acknowledge
cmd byte
Device Address
Device Address
command
Figure 8: I2C command to initiate a pressure conversion (OSR=4096, typ=D1)
111011000000000000
S W A A P
From Master
S = Start Condition
W = Write A = Acknowledge
From Slave P = Stop Condition R = Read
N = Not Acknowledge
Device Address
Device Address
cmd byte
command
Figure 9: I2C ADC read sequence
Figure 10: I 2C answer from MS5637
1
1
1
0
1
1
0
1
0
X
X
X
X
X
X
X
X
0
X
X
X
X
X
X
X
X
0
X
X
X
X
X
X
X
X
0
S
R
A
A
A
N
P
From Master
S = Start Condition
W = Write
A = Acknowledge
From Slave
P = Stop Condition
R = Read
N = Not Acknowledge
Data 7 - 0
Data 15 - 8
Device Address
Device Address
data
data
Data 23-16
data
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CYCLIC REDUNDANCY CHECK (CRC)
MS5637 contains a PRO M mem ory with 112-Bit. A 4-bit CRC has been implemented to check the data validity
in memory. The C code example below describes the CRC calculation which is stored on DB12 to DB15 in the
first PROM word.
A
d
d
D
B
1
5
D
B
1
4
D
B
1
3
D
B
1
2
D
B
1
1
D
B
1
0
D
B
9
D
B
8
D
B
7
D
B
6
D
B
5
D
B
4
D
B
3
D
B
2
D
B
1
D
B
0
0
CRC
Factory defined
1
C1
2
C2
3
C3
4
C4
5
C5
6
C6
Figure 11: Memory PROM mapping
C Code example for CRC-4 calculation:
unsigned char crc4(unsigned int n_prom[]) // n_prom defined as 8x unsigned int (n_prom[8])
{
int cnt; // simple counter
unsigned int n_rem=0; // crc reminder
unsigned char n_bit;
n_prom[0]=((n_prom[0]) & 0x0FFF); // CRC byte is replaced by 0
n_prom[7]=0; // Subsidiary value, set to 0
for (cnt = 0; cnt < 16; cnt++) // operation is performed on bytes
{ // choose LSB or MSB
if (cnt%2==1) n_rem ^= (unsigned short) ((n_prom[cnt>>1]) & 0x00FF);
else n_rem ^= (unsigned short) (n_prom[cnt>>1]>>8);
for (n_bit = 8; n_bit > 0; n_bit--)
{
if (n_rem & (0x8000)) n_rem = (n_rem << 1) ^ 0x3000;
else n_rem = (n_rem << 1);
}
}
n_rem= ((n_rem >> 12) & 0x000F); // final 4-bit reminder is CRC code
return (n_rem ^ 0x00);
}
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APPLICATION CIRCUIT
The MS5637 is a circuit that can be used in conjunction with a microcontroller in mobile altimeter applications.
Figure 12: Typical application circuit
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PIN CONFIGURATION
Pin
Name
Type
Function
1 VDD P Positive supply voltage
2 SDA I/O I2C data
3 SCL I I2C clock
4 GND I Ground
DEVICE PACKAGE OUTLINE
Notes: (1) Dimensions in mm
(2) General tolerance: ±0.1
Figure 13: MS5637 package outline
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RECOMMENDED PAD LAY OUT
Pad layout for bottom side of the MS5637 soldered onto printed circuit board.
Figure 14: MS5637 pad lay out
SHIPPING PAC KA GE
Tape and Tape and reel
Reserved area:
Please do not route
tracks between pads
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MOUNTING AND ASSEMBLY CONSIDERATIONS
SOLDERING
Please refer to the application note AN808 available on our website for all soldering issues.
MOUNTING
The MS5637 can be placed with automatic Pick & Place equipment using vacuum nozzles. It will not be
damaged by the vacuum. Due to th e l o w str ess as sembly the sens or does not s h o w pres sur e h ysteresis eff ec ts .
It is important to solder all contact pads.
CONNECTION TO PCB
The package outline of the module allows the use of a flexible PCB for interconnection. This can be important
for applications in watches and other special devices.
CLEANING
The MS5637 has been manufactured under clean-room conditions. It is therefore recommended to assemble
the sensor und er c lass 10 ’0 00 or b etter co nd iti ons . Sho uld this not be possibl e, it i s rec ommended to protec t t he
sensor ope ning dur ing as sem bl y from enter ing partic les and dus t. To av oid clea ning of the PCB , sol der pas te of
type “no-clean” shall be used. Cleaning might damage the sensor!
ESD PRECAUTIONS
The electrical contact pads are protected against ESD up to 2 kV HBM (human body model). It is therefore
essential to ground machines and personnel properly during assembly and handling of the device.
The MS5637 is shipped in antistatic transport boxes. Any test adapters or production transport boxes used
during the assembly of the sensor shall be of an equivalent antistatic material.
DECOUPLING CAPACITOR
Particular care must be taken when connecting the device to the power supply. A 100nF minimum ceramic
capacitor must be placed as close as possible to the MS5637 VDD pin. This capacitor will stabilize the power
supply during data conversion and thus, provide the highest possible accuracy.
MS5637
MS5637-02BA03 Low Voltage Baro met ri c Pres su re Sen s o r
DA5637-02BA03_007 www.meas-spec.com July 24, 2014
000056372111 ECN2317 16/17
TYPICAL PERFORMANCE CHARACTERISTICS
PRESSURE AND TEMPERA TURE ERROR VERSUS PRESSURE AND TEMPERATURE
(TYPICAL VALUES)
PRESSURE AND TEMPERA TURE ERROR VERSUS POWER SUPPLY
(TYPICAL VALUES)
MS5637
MS5637-02BA03 Low Voltage Baro met ri c Pres su re Sen s o r
DA5637-02BA03_007 www.meas-spec.com July 24, 2014
000056372111 ECN2317 17/17
ORDERING INFORMATION
Part Number / Art. Number
Product
Delivery Form
MS563702BA03-50 Micro Altimeter Module 3x3mm
Tape & Reel
FACTORY CONTACTS
EUROPE ASIA NO RT H AMERICA
MEAS Switzerland Sàrl
Ch. Chapons-des-Prés 11
CH-2022 Bevaix
Tel: +41 32 847 9550
Fax: + 41 32 847 9569
e-mail: sales.ch@meas-spec.com
Website: www.meas-spec.com
Measurement Specialties (China), Ltd.
No. 26 Langshan Road
Shenzhen High-Tech Park (North)
Nanshan District, Shenzhen, 518057
China
Tel: +86 755 3330 5088
Fax: +86 755 3330 5099
e-mail: pfg.cs.asia@meas-spec.com
Website: www.meas-spec.com
Measurement Specialties
45738 Northport Loop West
Fremont, CA 94538
Tel: +1 800 767 1888
Fax: +1 510 498 1578
e-mail: pfg.cs.amer@meas-spec.com
Website: www.meas-spec.com
The information in this sheet has been carefull y reviewed and is believed to be accurate; however, no responsibilit y is assumed for
inaccuracies. Furtherm ore, this inform ation does not convey to the purchaser of such devices any license under the patent rights to the
manufacturer. Measurem ent Specialt i es, Inc. reserves the right to make changes without further notice to any product herein. Measurement
Specialti es, Inc. makes no warranty, represent ation or guarant ee regarding the sui t abil i t y of its product for any particular purpose, nor does
Measurement Specialti es, Inc. assume any liability arising out of the applic ation or use of any product or circuit and specifical ly disclaims
any and all liabilit y, includi ng without limitation consequential or incidental damages. Typical parameters can and do vary in different
applicat i ons. All operat i ng parameters must be validated for each customer application by customer’s technical experts. Measurem ent
Specialti es, Inc. does not convey any license under its patent rights nor the rights of others.
