Multilayer Chip Inductor
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Applications:
High frequency application.
Cellular phone, pagers.
EMI countermeasure in high frequency circuits and computer communication etc.
WLAN and RF module.
Dimensions : Millimetres
Dimensions:
Size L W T A
(Minimum/Maximum)
0402 1.0 ±0.10 0.5 ±0.10 0.5 ±0.10 0.1/0.30
0603 1.6 ±0.15 0.8 ±0.15 0.8 ±0.15 0.2/0.60
0805 2.0 ±0.20 1.25 ±0.20 0.9 ±0.20 0.2/0.80
Features:
• A ceramic material construction for high frequency application up to 10GHz.
• Tight tolerance physical dimensions (±0.05mm).
• Tight inductance tolerance and excellent Q value.
• Available in three compact sizes of 0402, 0603 and 0805.
Dimensions : Millimetres
Multilayer Chip Inductor
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Electrical Specifications
Inductance
(nH) Tolerance
Quality
Factor
/Minimum
L/Q
Frequency
(MHz)
Q (Typical)
Frequency
(MHz)
Resistance
DC/Maximum
(Ohm)
Self Resonant
Frequency/Minimum
(GHz)
Current
DC/Maximum
(mA)
1.0
±0.3nH
8 100
11 33 37 0.12 10.00
300
1.5 12 29 40 0.13
6.002.2 11 26 36 0.16
3.3
±0.3nH, ±10%
11 28 37 0.19
4.7 12 0.24 4.00
6.8
±5%, ±10%
11
26 34 0.32 3.90
10.0 25 31 0.42 3.20
15.0
24 30
0.55 2.30
22.0
12
0.80 1.60
33.0 23 26 1.00 1.20 200
47.0 11 21 23 1.30 0.90 150
68.0 11 19 19 2.20 0.75
100
100.0 10 18 - 2.50 0.60
0402 Multilayer Chip Inductors
Measuring Equipment : HP-4291B+16192A.
Storage Temperature : 25 ±3°C; Humidity <80%RH.
Inductance
(nH) Tolerance
Quality
Factor
/Minimum
L/Q
Frequency
(MHz)
Q (Typical)
Frequency
(MHz)
Resistance
DC/Maximum
(Ohm)
Self Resonant
Frequency/Minimum
(GHz)
Current
DC/Maximum
(mA)
1.0
±0.3nH 8
100
15 36 49 0.10
6.00
500
1.5 14 34 47 0.10
2.2 15 38 49 0.10
3.3
±0.3nH, ±10%
10
16 40 51 0.13
4.7 14
37
48 0.20 4.00
6.8
±5%, ±10%
15 48 0.25 3.75
10.0
12
16
47 0.3 3.00
300
15.0 38 48 0.40 2.30
22.0 18
40
49 0.50 1.60
33.0
17
46 0.60 1.20
47.0 36 39 0.70 0.90
68.0
18
35 36 0.85 0.70
100.0 28 16 1.20 0.60
0603 Multilayer Chip Inductors
Measuring Equipment : HP-4291B+16197A.
Storage Temperature : 25 ±3°C; Humidity <80%RH.
Multilayer Chip Inductor
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Electrical Specifications
Inductance
(nH) Tolerance
Quality
Factor
/Minimum
L/Q
Frequency
(MHz)
Self Resonant
Frequency/Minimum
(GHz)
Resistance
DC/Maximum
(Ohm)
Current
DC/Maximum
(mA)
1.0
±0.3nH 10
100
>6.00
0.10
300
1.5
2.2
3.3
±0.3nH, ±10% 12
0.13
4.7 4.50 0.20
6.8
±5%, ±10%
15
3.65 0.25
10.0 2.50 0.30
15.0 2.00 0.40
22.0 1.70 0.50
33.0 1.35 0.60
47.0
18
1.20 0.70
68.0 1.00 0.80
100.0 0.73 1.00
0805 Multilayer Chip Inductors
Measuring Equipment : HP-4291B+16197A.
Storage Temperature : 25 ±3°C; Humidity <80%RH.
Testing Condition and Requirements
Electrical Characteristics
Test Items Test Condition Requirements
Inductance
a. Temperature: 25 ±1°C
Within specified tolerance.
b. Relative humidity: 45 to 85%RH
c. Atmospheric pressure: 86 to 106kPa
d. Measuring equipment and fixture:
2012 (0805) HP 4291 + 16197A
1608 (0603) HP 4291 + 16192A
1005 (0402) HP 4291 + 16193A
Q Value
a. Temperature: 25 ±1°C
In accordance with electrical specification.
b. Relative Humidity: 45 to 85%RH
c. Atmospheric Pressure: 86 to 106kPa
d. Measuring equipment and fixture:
2012 (0805) HP 4291 + 16197A
1608 (0603) HP 4291 + 16192A
1005 (0402) HP 4291 + 16193A
Multilayer Chip Inductor
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Test Items Test Condition Requirements
DC Resistance
a. Temperature: 25 ±1°C
In accordance with electrical specification.
b. Relative Humidity: 45 to 85%RH
c. Atmospheric Pressure: 86 to 106kPa
Measuring equipment: HP 4338
Temperature Characteristics
a. Temperature range: -30 to +85°C
Within specified tolerance.
Reference temperature: 25°C
Electrical Characteristics
Item Test Condition Requirements
Appearance Inductors shall be visually inspected for visible evidence of defect. In accordance with
specification.
Dimension Dimension shall be measured with calliper or micrometer In accordance with
dimension specification.
Solderability
Immerse a test sample into a methanol solution containing rosin, preheat it at 150
to 180°C for 3 to 5 seconds and immerse into molten solder of 245 ±5°C for 3±1
seconds.
More than 75% of the
terminal electrode part
shall be covered with
fresh solder.
Resistance to
Soldering Heat
Immerse a test sample into a methanol solution containing resin, preheat it at 150
to 180°C for 2 to 3 minutes and immerse into molten solder of 260 ±5°C for 10 ±0.5
seconds so that both terminal electrodes are completely submerged.
No visible damage
Bending Strength
Solder the chip to test jig then apply a force in the direction shown in below. The
soldering shall be done with the reflow method and shall be conducted with care so
that the soldering is uniform and free of defects such as heat shock.
No mechanical damage
shall
be observed.
Mechanical Characteristics
Multilayer Chip Inductor
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Item Test Condition Requirements
Thermal Shock
Solder a test sample to printed circuit board, and conduct
100 cycles of test under the conditions shown as below.
Cycle:
No visible damage
Inductance variation within 10%
Q variation within 20%
High Humidity State
Life Test
Keep a test sample in an atmosphere with a temperature of
70 ±2°C, 90 to 95%RH for 500 ±12 hours. After the test, keep
the test sample at a normal temperature for 1 to 2 hours, and
then carry out measurement.
High Humidity Load
Life Test
Solder a test sample to printed circuit board then keep the
test sample in an atmosphere with a temperature of 70 ±2°C,
90 to 95%RH for 500 ±12 hours while supplying the rated current.
After the test, keep the test sample at a normal
temperature for 1 to 2 hours, and then carry out measurement.
High Temperature
State Life Test
Keep a test sample in an atmosphere with a temperature of
85 ±2°C for 500 ±12 hours. After the test, keep the test sample
at a normal temperature for 1 to 2 hours, and then carry out
measurement.
High Temperature
Load
Solder a test sample to printed circuit board then keep the
test sample in an atmosphere with a temperature of 85 ±2°C for
500 ±12 hours while supplying the rated current. After the
test, keep the test sample at a normal temperature for 1 to 2
hours, and then carry out measurement.
Testing Condition and Requirements
Reliability
Part Number Table
Description Part Number
Inductor, 0402, 1nH MCFT000024
Inductor, 0402, 1.5nH MCFT000025
Inductor, 0402, 2.2nH MCFT000026
Inductor, 0402, 3.3nH MCFT000027
Inductor, 0402, 4.7nH MCFT000028
Inductor, 0402, 6.8nH MCFT000029
Inductor, 0402, 10nH MCFT000030
Inductor, 0402, 15nH MCFT000031
Inductor, 0402, 22nH MCFT000032
Inductor, 0402, 33nH MCFT000033
Inductor, 0402, 47nH MCFT000034
Inductor, 0402, 68nH MCFT000035
Multilayer Chip Inductor
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Description Part Number
Inductor, 0402, 100nH MCFT000036
Inductor, 0603, 1nH MCFT000037
Inductor, 0603, 1.5nH MCFT000038
Inductor, 0603, 2.2nH MCFT000039
Inductor, 0603, 3.3nH MCFT000040
Inductor, 0603, 4.7nH MCFT000041
Inductor, 0603, 6.8nH MCFT000042
Inductor, 0603, 10nH MCFT000043
Inductor, 0603, 15nH MCFT000044
Inductor, 0603, 22nH MCFT000045
Inductor, 0603, 33nH MCFT000046
Inductor, 0603, 47nH MCFT000047
Inductor, 0603, 68nH MCFT000048
Inductor, 0603, 100nH MCFT000049
Inductor, 0805, 1nH MCFT000050
Inductor, 0805, 1.5nH MCFT000051
Inductor, 0805, 2.2nH MCFT000052
Inductor, 0805, 3.3nH MCFT000053
Inductor, 0805, 4.7nH MCFT000054
Inductor, 0805, 6.8nH MCFT000055
Inductor, 0805, 10nH MCFT000056
Inductor, 0805, 15nH MCFT000057
Inductor, 0805, 22nH MCFT000058
Inductor, 0805, 33nH MCFT000059
Inductor, 0805, 47nH MCFT000060
Inductor, 0805, 68nH MCFT000061
Inductor, 0805, 100nH MCFT000062
Part Number Table
Disclaimer This data sheet and its contents (the "Information") belong to the Premier Farnell Group (the "Group") or are licensed to it. No licence is granted for the use of it other than for information purposes
in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces all data sheets previously supplied.
The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use made of it. Users of this data
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resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising) is excluded.
This will not operate to limit or restrict the Group's liability for death or personal injury resulting from its negligence. SPC Multicomp is the registered trademark of the Group. © Premier Farnell plc 2009.
