SLVS072C − DECEMBER 1992 − REVISED OCTOBER 1995
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS
77251−1443
Copyright 1995, Texas Instruments Incorporated
8−1
available features
•Fully Integrated 9-Channel SCSI
Termination
•No External Components Required
•Maximum Allowed Current Applied at First
High-Level Step
•6-pF Typical Power-Down Output
Capacitance
•Wide Vterm† (Termination Voltage)
Operating Range, 3.5 V to 5.5 V
•TTL-Compatible Disable Feature
•Compatible With Active Negation
•Thermal Regulation
description
The TL2218-285 is a current-mode 9-channel monolithic terminator specially designed for single-ended
small-computer-systems-interface (SCSI) bus termination. A user-controlled disable function is provided to
reduce standby power. No impedance-matching resistors or other external components are required for its
operation as a complete terminator.
The device operates over a wide termination-voltage (Vterm†) range of 3.5 V to 5.5 V, offering an extra 0.5 V of
operating range when compared to the minimum termination voltage of 4 V required by other integrated active
terminators. The TL2218-285 functions as a current-sourcing terminator and supplies a constant output current
of 23 mA into each asserted line. When a line is deasserted, the device senses the rising voltage level and begins
to function as a voltage source, supplying a fixed output voltage of 2.85 V. The TL2218-285 features
compatibility with active negation drivers and has a typical sink current capability of 20 mA.
The TL2218-285 is able to ensure that maximum current is applied at the first high-level step. This performance
means that the device should provide a first high-level step exceeding 2 V even at a 10-MHz rate. Therefore,
noise margins are improved considerably above those provided by resistive terminators.
A key difference between the TL2218-285 current-mode terminator and a Boulay terminator is that the
TL2218-285 does not incorporate a low dropout regulator to set the output voltage to 2.85 V. In contrast with
the Boulay termination concept, the accuracy of the 2.85 V is not critical with the current-mode method used
in the TL2218-285 because this voltage does not determine the driver current. Therefore, the primary device
specifications are not the same as with a voltage regulator but are more concerned with output current.
The DISABLE terminal is TTL compatible and must be taken low to shut down the outputs. The device is
normally active, even when DISABLE is left floating. In the disable mode, only the device startup circuits remain
active, thereby reducing the supply current to just 500 µA. Output capacitance in the shutdown mode is typically
6 pF.
The TL2218-285 has on-board thermal regulation and current limiting, thus eliminating the need for external
protection circuitry. A thermal regulation circuit that is designed to provide current limiting, rather than an actual
thermal shutdown, is included in the individual channels of the TL2218-285. When a system fault occurs that
leads to excessive power dissipation by the terminator, the thermal regulation circuit causes a reduction in the
asserted-line output current suf ficient to maintain operation. This feature allows the bus to remain active during
a fault condition, which permits data transfer immediately upon removal of the fault. A terminator with thermal
shutdown does not allow for data transfer until sufficient cooling has occurred. Another advantage offered by
the TL2218-285 is a design that does not require costly laser trimming in the manufacturing process.
The TL2218-285 is characterized for operation over the virtual junction temperature range of 0°C to 125°C.
†This symbol is not presently listed within EIA/JEDEC standards for letter symbols.
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
TERMPWR
NC
NC
D0
D1
D2
D3
D4
NC
GND
TERMPWR
DISABLE
NC
D8
D7
NC
D6
D5
NC
GND
PW PACKAGE
(TOP VIEW)
1
NC − No internal connection
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#"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*&
"&#"0 !)) '!!&"&#+
SLVS072C − DECEMBER 1992 − REVISED OCTOBER 1995
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS
77251−1443
8−2
AVAILABLE OPTIONS
TJSURFACE MOUNT
(PW)†CHIP FORM
(Y)
0°C to 125°C TL2218-285PWLE TL2218-285Y
†The PW package is only available left-end taped and reeled.
TL2218-285Y chip information
This chip, when properly assembled, displays characteristics similar to the TL2218-285. Thermal compression
or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 11 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
Thermal
Regulation
Feedback
Active
Negation
Clamp
TERMPWR
1, 20
4
19
Vref
DISABLE
D0
Common to All Channels
161
84
(1)
(4)
(5)
(6)
(7)
(8) (10)(11) (13)
(14)
(16)
(17)
(19)
(20)
SLVS072C − DECEMBER 1992 − REVISED OCTOBER 1995
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS
77251−1443
8−3
functional block diagram (each channel)
Thermal
Regulation
Feedback
Active
Negation
Clamp
TERMPWR
1, 20
4
19
Vref
DISABLE
D0
Common to All Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
(see Figures 1, 2, and 3)†
Continuous termination voltage 10 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output voltage range 0 V to 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous disable voltage range 0 V to 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation See Dissipation Rating Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature range, TJ −55°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −60°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE
POWER RATING
AT
T ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE T = 25 C
T = 70°C
POWER RATING
T = 85°C
POWER RATING
T = 125°C
POWER RATING
PACKAGE
POWER RATING
AT
T ≤ 25 C
POWER RATING
DERATING FACTOR
ABOVE T = 25°C
T = 70 C
POWER RATING
T = 85 C
POWER RATING
T = 125 C
POWER RATING
TA828 mW 6.62 mW/°C530 mW 430 mW 166 mW
PW TC4032 mW 32.2 mW/°C 2583 mW 2100 mW 812 mW
PW
TL‡2475 mW 19.8 mW/°C1584 mW 1287 mW 495 mW
‡RθJL is the thermal resistance between the junction and device lead. To determine the virtual junction temperature (TJ) relative to the device lead
temperature, the following calculations should be used: TJ = PD x RθJL + TL, where PD is the internal power dissipation of the device and TL is
the device lead temperature at the point of contact to the printed wiring board. RθJL is 50.5°C/W.
SLVS072C − DECEMBER 1992 − REVISED OCTOBER 1995
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS
77251−1443
8−4
600
400
200
025 50 75 100
800
1000
1200
125 150
1800
1600
1400
2000
2200
2400
FREE-AIR TEMPERATURE
DISSIPATION DERATING CURVE
TA − Free-Air Temperature − °C
Maximum Continuous Power Dissipation − mW
1200
800
400
025 50 75 100
1600
2000
2400
125 150
3600
3200
2800
4000
4400
4800
CASE TEMPERATURE
DISSIPATION DERATING CURVE
TC − Case Temperature − °C
RθJA = 151°C/W
RθJC = 31°C/W
Maximum Continuous Power Dissipation − mW
Figure 1 Figure 2
1200
800
400
025 50 75 100
2000
125 150
3600
3200
2800
4000
4400
4800
LEAD TEMPERATURE
DISSIPATION DERATING CURVE
TL − Lead Temperature − °C
2400
1600
†RθJL = 50.5°C/W
Maximum Continuous Power Dissipation − mW
Figure 3
†RθJL is the thermal resistance between the junction and device lead. To determine the virtual junction temperature (TJ) relative to the device lead
temperature, the following calculations should be used: TJ = PD x RθJL + TL, where PD is the internal power dissipation of the device, and TL is
the device lead temperature at the point of contact to the printed wiring board. RθJL is 50.5°C/W.
SLVS072C − DECEMBER 1992 − REVISED OCTOBER 1995
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS
77251−1443
8−5
recommended operating conditions
MIN MAX UNIT
Termination voltage 3.5 5.5 V
High-level disable input voltage, VIH 2 Vterm V
Low-level disable input voltage, VIL 0 0.8 V
Operating virtual junction temperature, TJ0 125 °C
electrical characteristics, Vterm = 4.75 V, VO = 0.5 V, TJ = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Output high voltage 2.5 2.85 V
All data lines open 9
mA
TERMPWR supply current All data lines = 0.5 V 228 mA
TERMPWR supply current
DISABLE = 0 V 500 µA
Output current −20.5 −23 −24 mA
Disable input current (see Note 1)
DISABLE = 4.75 V 1
A
Disable input current (see Note 1) DISABLE = 0 V 600 µA
Output leakage current DISABLE = 0 V 100 nA
Output capacitance, device disabled VO = 0 V, 1 MHz 6 pF
Termination sink current, total VO = 4 V 20 mA
NOTE 1: When DISABLE is open or high, the terminator is active.
SLVS072C − DECEMBER 1992 − REVISED OCTOBER 1995
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS
77251−1443
8−6
THERMAL INFORMATION
The need for smaller surface-mount packages for use on compact printed-wiring boards (PWB) causes an
increasingly di fficult problem in the area of thermal dissipation. In order to provide the systems designer with a better
approximation of the junction temperature rise in the thin-shrink small-outline package (TSSOP), the junction-to-lead
thermal resistance (RθJL) is provided along with the more typical values of junction-to-ambient and junction-to-case
thermal resistances, RθJA and RθJC.
RθJL is used to calculate the device junction temperature rise measured from the leads of the unit. Consequently, the
junction temperature is dependent upon the board temperature at the leads, RθJL, and the internal power dissipation
of the device. The board temperature is contingent upon several variables, including device packing density,
thickness, material, area, and number of interconnects. The RθJL value depends on the number of leads connecting
to the die-mount pad, the lead-frame alloy, area of the die, mount material, and mold compound. Since the power level
at which the TSSOP can be used is highly dependent upon both the temperature rise of the PWB and the device itself,
the systems designer can maximize this level by optimizing the circuit board. The junction temperature of the device
can be calculated using the equation TJ = (PD × RθJL) + TL where TJ = junction temperature, PD = power dissipation,
RθJL = junction-to-lead thermal resistance, and TL = board temperature at the leads of the unit.
The values of thermal resistance for the TL2218-285 PW are as follows:
Thermal Resistance Typical Junction Rise
RθJA 151°C/W
RθJC 31 °C/W
RθJL 50.5°C/W
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
IOOutput current vs Input voltage 4
VOOutput voltage vs Input voltage 5
IOOutput current vs Junction temperature 6
VOOutput voltage vs Junction temperature 7
SLVS072C − DECEMBER 1992 − REVISED OCTOBER 1995
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS
77251−1443
8−7
TYPICAL CHARACTERISTICS
20
18
16
14 3 3.5 4 4.5
− Output Current − mA
22
OUTPUT CURRENT
vs
INPUT VOLTAGE
24
5 5.5
TJ = 25°C
VI − Input Voltage − V
2
1
03 3.5 4 4.5
VO − Output Voltage − V
OUTPUT VOLTAGE
vs
INPUT VOLTAGE
4
5 5.5
3
TJ = 25°C
ÁÁ
ÁÁ
VO
VI − Input Voltage − V
IO
Figure 4 Figure 5
15
10
50255075
20
OUTPUT CURRENT
vs
JUNCTION TEMPERATURE
25
100 125
Vterm = 4.75 V
TA = TJ
TJ − Junction Temperature − °C
3
2.5
20255075
3.5
4
100 125
Vterm = 4.75 V
TA = TJ
VO − Output Voltage − V
ÁÁ
ÁÁ
VO
TJ − Junction Temperature − °C
OUTPUT VOLTAGE
vs
JUNCTION TEMPERATURE
− Output Current − mA
IO
Figure 6 Figure 7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS
77251−1443
8−8
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TL2218-285PW ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL2218-285PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL2218-285PWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI
TL2218-285PWR ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL2218-285PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 29-Sep-2006
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TL2218-285PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TL2218-285PWR TSSOP PW 20 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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