SLVS072C - DECEMBER 1992 - REVISED OCTOBER 1995 available features * * * * * * * * PW PACKAGE (TOP VIEW) Fully Integrated 9-Channel SCSI Termination No External Components Required Maximum Allowed Current Applied at First High-Level Step 6-pF Typical Power-Down Output Capacitance Wide Vterm (Termination Voltage) Operating Range, 3.5 V to 5.5 V TTL-Compatible Disable Feature Compatible With Active Negation Thermal Regulation TERMPWR NC NC D0 D1 D2 D3 D4 NC GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 TERMPWR DISABLE NC D8 D7 NC D6 D5 NC GND NC - No internal connection description The TL2218-285 is a current-mode 9-channel monolithic terminator specially designed for single-ended small-computer-systems-interface (SCSI) bus termination. A user-controlled disable function is provided to reduce standby power. No impedance-matching resistors or other external components are required for its operation as a complete terminator. The device operates over a wide termination-voltage (Vterm) range of 3.5 V to 5.5 V, offering an extra 0.5 V of operating range when compared to the minimum termination voltage of 4 V required by other integrated active terminators. The TL2218-285 functions as a current-sourcing terminator and supplies a constant output current of 23 mA into each asserted line. When a line is deasserted, the device senses the rising voltage level and begins to function as a voltage source, supplying a fixed output voltage of 2.85 V. The TL2218-285 features compatibility with active negation drivers and has a typical sink current capability of 20 mA. The TL2218-285 is able to ensure that maximum current is applied at the first high-level step. This performance means that the device should provide a first high-level step exceeding 2 V even at a 10-MHz rate. Therefore, noise margins are improved considerably above those provided by resistive terminators. A key difference between the TL2218-285 current-mode terminator and a Boulay terminator is that the TL2218-285 does not incorporate a low dropout regulator to set the output voltage to 2.85 V. In contrast with the Boulay termination concept, the accuracy of the 2.85 V is not critical with the current-mode method used in the TL2218-285 because this voltage does not determine the driver current. Therefore, the primary device specifications are not the same as with a voltage regulator but are more concerned with output current. The DISABLE terminal is TTL compatible and must be taken low to shut down the outputs. The device is normally active, even when DISABLE is left floating. In the disable mode, only the device startup circuits remain active, thereby reducing the supply current to just 500 A. Output capacitance in the shutdown mode is typically 6 pF. The TL2218-285 has on-board thermal regulation and current limiting, thus eliminating the need for external protection circuitry. A thermal regulation circuit that is designed to provide current limiting, rather than an actual thermal shutdown, is included in the individual channels of the TL2218-285. When a system fault occurs that leads to excessive power dissipation by the terminator, the thermal regulation circuit causes a reduction in the asserted-line output current sufficient to maintain operation. This feature allows the bus to remain active during a fault condition, which permits data transfer immediately upon removal of the fault. A terminator with thermal shutdown does not allow for data transfer until sufficient cooling has occurred. Another advantage offered by the TL2218-285 is a design that does not require costly laser trimming in the manufacturing process. The TL2218-285 is characterized for operation over the virtual junction temperature range of 0C to 125C. This symbol is not presently listed within EIA/JEDEC standards for letter symbols. Copyright 1995, Texas Instruments Incorporated !" # $%&" !# '%()$!" *!"&+ *%$"# $ " #'&$$!"# '& ",& "&# &-!# #"%&"# #"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*& "&#"0 !)) '!!&"&#+ * * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 8-1 SLVS072C - DECEMBER 1992 - REVISED OCTOBER 1995 AVAILABLE OPTIONS SURFACE MOUNT (PW) TJ CHIP FORM (Y) 0C to 125C TL2218-285PWLE TL2218-285Y The PW package is only available left-end taped and reeled. TL2218-285Y chip information This chip, when properly assembled, displays characteristics similar to the TL2218-285. Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS (1) (20) (19) 1, 20 TERMPWR Feedback 19 (17) (4) Active Negation Clamp DISABLE Vref Thermal Regulation (16) (5) 4 Common to All Channels 161 (6) CHIP THICKNESS: 11 MILS TYPICAL BONDING PADS: 4 x 4 MILS MINIMUM (14) (7) TJmax = 150C TOLERANCES ARE 10%. ALL DIMENSIONS ARE IN MILS. (8) (10) (11) (13) 84 8-2 * * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 D0 SLVS072C - DECEMBER 1992 - REVISED OCTOBER 1995 functional block diagram (each channel) 1, 20 TERMPWR Feedback DISABLE Active Negation Clamp 19 Vref 4 D0 Thermal Regulation Common to All Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted) (see Figures 1, 2, and 3) Continuous termination voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 V Continuous output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 5.5 V Continuous disable voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 5.5 V Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Operating virtual junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55C to 150C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -60C to 150C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATING TABLE PACKAGE POWER RATING AT T 25 25C C POWER RATING TA TC TL 828 mW 6.62 mW/C 530 mW 430 mW PW 4032 mW 32.2 mW/C 2583 mW 2100 mW 812 mW 2475 mW 19.8 mW/C 1584 mW 1287 mW 495 mW DERATING FACTOR ABOVE T = 25C 25 C T = 70 70C C POWER RATING T = 85 85C C POWER RATING T = 125 125C C POWER RATING 166 mW RJL is the thermal resistance between the junction and device lead. To determine the virtual junction temperature (TJ) relative to the device lead temperature, the following calculations should be used: TJ = PD x RJL + TL , where PD is the internal power dissipation of the device and TL is the device lead temperature at the point of contact to the printed wiring board. RJL is 50.5C/W. * * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 8-3 SLVS072C - DECEMBER 1992 - REVISED OCTOBER 1995 CASE TEMPERATURE DISSIPATION DERATING CURVE 2400 Maximum Continuous Power Dissipation - mW Maximum Continuous Power Dissipation - mW FREE-AIR TEMPERATURE DISSIPATION DERATING CURVE 2200 2000 1800 1600 1400 1200 1000 800 600 400 200 RJA = 151C/W 4800 4400 4000 3600 3200 2800 2400 2000 1600 1200 RJC = 31C/W 800 400 0 0 25 50 75 100 125 25 150 50 TA - Free-Air Temperature - C 75 100 125 150 TC - Case Temperature - C Figure 1 Figure 2 Maximum Continuous Power Dissipation - mW LEAD TEMPERATURE DISSIPATION DERATING CURVE 4800 4400 4000 3600 3200 2800 2400 2000 1600 1200 800 RJL = 50.5C/W 400 0 25 50 75 100 125 150 TL - Lead Temperature - C Figure 3 RJL is the thermal resistance between the junction and device lead. To determine the virtual junction temperature (TJ) relative to the device lead temperature, the following calculations should be used: TJ = PD x RJL + TL, where PD is the internal power dissipation of the device, and TL is the device lead temperature at the point of contact to the printed wiring board. RJL is 50.5C/W. 8-4 * * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 SLVS072C - DECEMBER 1992 - REVISED OCTOBER 1995 recommended operating conditions MIN Termination voltage MAX UNIT 3.5 5.5 V High-level disable input voltage, VIH 2 V Low-level disable input voltage, VIL 0 Vterm 0.8 Operating virtual junction temperature, TJ 0 125 C MIN TYP MAX UNIT 2.5 2.85 V electrical characteristics, Vterm = 4.75 V, VO = 0.5 V, TJ = 25C PARAMETER TEST CONDITIONS Output high voltage All data lines open TERMPWR supply current 9 All data lines = 0.5 V 228 DISABLE = 0 V 500 Output current -20.5 -23 DISABLE = 4.75 V Disable input current (see Note 1) DISABLE = 0 V Output capacitance, device disabled VO = 0 V, VO = 4 V Termination sink current, total 1 MHz mA A -24 1 DISABLE = 0 V Output leakage current V 600 mA A A 100 nA 6 pF 20 mA NOTE 1: When DISABLE is open or high, the terminator is active. * * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 8-5 SLVS072C - DECEMBER 1992 - REVISED OCTOBER 1995 THERMAL INFORMATION The need for smaller surface-mount packages for use on compact printed-wiring boards (PWB) causes an increasingly difficult problem in the area of thermal dissipation. In order to provide the systems designer with a better approximation of the junction temperature rise in the thin-shrink small-outline package (TSSOP), the junction-to-lead thermal resistance (RJL) is provided along with the more typical values of junction-to-ambient and junction-to-case thermal resistances, RJA and RJC. RJL is used to calculate the device junction temperature rise measured from the leads of the unit. Consequently, the junction temperature is dependent upon the board temperature at the leads, RJL, and the internal power dissipation of the device. The board temperature is contingent upon several variables, including device packing density, thickness, material, area, and number of interconnects. The RJL value depends on the number of leads connecting to the die-mount pad, the lead-frame alloy, area of the die, mount material, and mold compound. Since the power level at which the TSSOP can be used is highly dependent upon both the temperature rise of the PWB and the device itself, the systems designer can maximize this level by optimizing the circuit board. The junction temperature of the device can be calculated using the equation TJ = (PD x RJL) + TL where TJ = junction temperature, PD = power dissipation, RJL = junction-to-lead thermal resistance, and TL = board temperature at the leads of the unit. The values of thermal resistance for the TL2218-285 PW are as follows: Thermal Resistance RJA RJC RJL Typical Junction Rise 151C/W 31 C/W 50.5C/W TYPICAL CHARACTERISTICS Table of Graphs FIGURE 8-6 IO VO Output current vs Input voltage 4 IO VO Output voltage vs Input voltage 5 Output current vs Junction temperature 6 Output voltage vs Junction temperature 7 * * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 SLVS072C - DECEMBER 1992 - REVISED OCTOBER 1995 TYPICAL CHARACTERISTICS OUTPUT CURRENT vs INPUT VOLTAGE OUTPUT VOLTAGE vs INPUT VOLTAGE 24 4 TJ = 25C TJ = 25C VO - Output Voltage - V VO I O - Output Current - mA 22 20 AA AA 18 16 14 3 2 1 0 3 3.5 4 4.5 VI - Input Voltage - V 5 5.5 3 3.5 Figure 4 5 5.5 Figure 5 OUTPUT CURRENT vs JUNCTION TEMPERATURE OUTPUT VOLTAGE vs JUNCTION TEMPERATURE 4 25 Vterm = 4.75 V TA = TJ Vterm = 4.75 V TA = TJ 20 VO - Output Voltage - V VO I O - Output Current - mA 4 4.5 VI - Input Voltage - V 15 AA AA 10 3.5 3 2.5 2 5 0 25 50 75 100 0 125 TJ - Junction Temperature - C Figure 6 25 50 75 100 TJ - Junction Temperature - C 125 Figure 7 * * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 8-7 8-8 * * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 PACKAGE OPTION ADDENDUM www.ti.com 29-Sep-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TL2218-285PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL2218-285PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL2218-285PWLE OBSOLETE TSSOP PW 20 TBD Call TI TL2218-285PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL2218-285PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TL2218-285PWR Package Package Pins Type Drawing TSSOP PW 20 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 16.4 Pack Materials-Page 1 6.95 B0 (mm) K0 (mm) P1 (mm) 7.1 1.6 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL2218-285PWR TSSOP PW 20 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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