DDR3L SDRAM Data Sheet Addendum
MT41K1G4 – 128 Meg x 4 x 8 banks
MT41K512M8 – 64 Meg x 8 x 8 banks
MT41K256M16 – 32 Meg x 16 x 8 banks
Description
DDR3L SDRAM (1.35V) is a low voltage version of the
DDR3 (1.5V) SDRAM. Refer to DDR3 (1.5V) SDRAM
(Die Rev.: E) data sheet specifications when running in
1.5V compatible mode.
Features
• VDD = VDDQ = 1.35V (1.283–1.45V)
• Backward compatible to VDD = VDDQ = 1.5V ±0.075V
– Supports DDR3L devices to be backward com-
patible in 1.5V applications
• Differential bidirectional data strobe
• 8n-bit prefetch architecture
• Differential clock inputs (CK, CK#)
• 8 internal banks
• Nominal and dynamic on-die termination (ODT)
for data, strobe, and mask signals
• Programmable CAS (READ) latency (CL)
• Programmable posted CAS additive latency (AL)
• Programmable CAS (WRITE) latency (CWL)
• Fixed burst length (BL) of 8 and burst chop (BC) of 4
(via the mode register set [MRS])
• Selectable BC4 or BL8 on-the-fly (OTF)
• Self refresh mode
• TC of 0°C to +95°C
– 64ms, 8192-cycle refresh at 0°C to +85°C
– 32ms at +85°C to +95°C
• Self refresh temperature (SRT)
• Automatic self refresh (ASR)
• Write leveling
• Multipurpose register
• Output driver calibration
Options Marking
• Configuration
– 1 Gig x 4 1G4
– 512 Meg x 8 512M8
– 256 Meg x 16 256M16
• FBGA package (Pb-free) – x4, x8
– 78-ball (8mm x 10.5mm) Rev. P DA
• FBGA package (Pb-free) – x16
– 96-ball (8mm x 14mm) Rev. P TW
• Timing – cycle time
– 938ps @ CL = 14 (DDR3-2133) -093
– 1.07ns @ CL = 13 (DDR3-1866) -107
– 1.25ns @ CL = 11 (DDR3-1600) -125
• Special Options
– Premium Lifecycle Product (PLP) X
• Operating temperature
– Commercial (0°C ≤ TC ≤ +95°C) None
– Industrial (–40°C ≤ TC ≤ +95°C) IT
• Revision P
Table 1: Key Timing Parameters
Speed Grade Data Rate (MT/s) Target tRCD-tRP-CL tRCD (ns) tRP (ns) CL (ns)
-093 1, 2 2133 14-14-14 13.09 13.09 13.09
-107 1 1866 13-13-13 13.91 13.91 13.91
-125 1600 11-11-11 13.75 13.75 13.75
Notes: 1. Backward compatible to 1600, CL = 11 (-125).
2. Backward compatible to 1866, CL = 13 (-107).
4Gb: x4, x8, x16 DDR3L SDRAM Addendum
Description
PDF: X26P4QTWDSPK-13-10329
4gb_1_35v_ddr3l_xit_addendum.pdf - Rev. A 02/16 EN 1Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2016 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
Table 2: Addressing
Parameter 1 Gig x 4 512 Meg x 8 256 Meg x 16
Configuration 128 Meg x 4 x 8 banks 64 Meg x 8 x 8 banks 32 Meg x 16 x 8 banks
Refresh count 8K 8K 8K
Row address 64K (A[15:0]) 64K (A[15:0]) 32K (A[14:0])
Bank address 8 (BA[2:0]) 8 (BA[2:0]) 8 (BA[2:0])
Column address 2K (A[11, 9:0]) 1K (A[9:0]) 1K (A[9:0])
Page size 1KB 1KB 2KB
Figure 1: DDR3L Part Numbers
Example Part Number: MT41K256M16TW-107 XIT:P
Configuration
1 Gig x 4
512 Meg x 8
256 Meg x 16
1G4
512M8
256M16
-
Configuration
MT41K Package Speed
Revision
Revision:P
:
Commercial
Industrial temperature
{
None
IT
Package Mark
Mark
Rev.
Speed Grade
tCK = 1.07ns, CL = 13
tCK = 1.25ns, CL = 11
-093
-125
Temperature
78-ball 8mm x 10.5mm FBGA P DA
tCK = .938ns, CL = 14
-107
96-ball 8mm x 14mm FBGA P TW
Special Options
X
Premium Lifecycle Product (PLP)
Mark
Mark
Mark
Note: 1. Not all options listed can be combined to define an offered product. Use the part catalog search on
http://www.micron.com for available offerings.
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
http://www.micron.com.
4Gb: x4, x8, x16 DDR3L SDRAM Addendum
Description
PDF: X26P4QTWDSPK-13-10329
4gb_1_35v_ddr3l_xit_addendum.pdf - Rev. A 02/16 EN 2Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2016 Micron Technology, Inc. All rights reserved.
Revision History
Rev. A – 02/16
• Initial release based on the 4Gb x4, x8, x16 DDR3L SDRAM, Rev. N 12/15 data sheet
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-4000
www.micron.com/products/support Sales inquiries: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
times occur.
4Gb: x4, x8, x16 DDR3L SDRAM Addendum
Revision History
PDF: X26P4QTWDSPK-13-10329
4gb_1_35v_ddr3l_xit_addendum.pdf - Rev. A 02/16 EN 3Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2016 Micron Technology, Inc. All rights reserved.
