GP1S396HCPSF
1
Sheet No.: OP13020EN
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
GP1S396HCPSF is a phototransistor output,
transmissive photointerrupter with a industry’s
smallest compact and low-profile package by the thin
molding technology. This product detects an object
between the emitter and the detector.
In addition, by narrowing the slit width of the infrared
beam to 0.12mm, this product has improved detection
accuracy.
1. Transmissive with phototransistor output
2. Highlights :
・Compact size
・Low Profile
・Narrow Gap
3. Key Parameters :
・Gap Width : 1.2mm
・Slit Width (detector side) : 0.12mm
・Package : 2.26 × 1.4 × 1.6mm
4. RoHS directive compliant
1. Compliant with RoHS directive (2002/95/EC)
1. General purpose detection of object presence or
motion.
Example : printer, lens control for camera,
various mechanical position detection
■Description
■Features
■Agency approvals/Compliance
■Applications
Gap : 1.2mm Slit : 0.12mm
Phototransistor Output,
Compact Transmissive
Photointerrupter
GP1S396HCPSF
GP1S396HCPSF
2
Sheet No.: OP13020EN
■Internal Connection Diagram
■Outline Dimensions Drawing No. CY14942i02 Scale : 15/1 Unit : mm
<Reference>
Recommended soldering pattern dimensions
A : Anode
K : Cathode
C : Collector
E : Emitter
Top View
Note
1) Unspecified tolerance shall be ± 0.08mm.
2) Dimensions in parenthesis are shown for reference.
3) The dimensions indicated by ※ refer to the those
measured from the lead base.
4) The dimensions shown do not include those of burrs.
Burr’s dimensions shall be 0.15Max.
5) There is a possibility that the lead of part is exposed.
6) There is a possibility that the internal device is exposed
at the top of the device because of the thin thickness of
the outer package.
7) The recommendation pattern receives the influence of
reflow soldering and solder type etc..
Sufficiently after doing the verification of mounting,
please decide.
GP1S396HCPSF
3
Sheet No.: OP13020EN
10%
90%
Output
Input
tr
tf
■Absolute maximum ratings Ta=25°C
Parameter
Symbol
Rating
Unit
Input
Forward current
IF
30
mA
Reverse voltage
VR
6
V
Power dissipation
P
50
mW
Output
Collector-emitter voltage
VCEO
35
V
Emitter-collector voltage
VECO
6
V
Collector current
Ic
20
mA
Collector power dissipation
Pc
50
mW
Total power dissipation
Ptot
70
mW
Operating temperature
Topr
-25 to +85
°C
Storage temperature
Tstg
-40 to +100
°C
* Soldering temperature
Tsol
300
°C
* Soldering time : 3 s or less
■Electro-optical Characteristics Ta=25°C
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
Input
Forward voltage
VF
IF=20mA
-
1.2
1.4
V
Reverse current
IR
VR=3V
-
-
10
μA
Output
Collector dark current
ICEO
VCE=20V
-
-
100
nA
Transfer
character-
istics
Collector current
Ic
VCE=5V, IF=5mA
100
-
400
μA
Response time
(Rise)
tr
VCE=5V, Ic=100μA
RL=1kΩ
-
30
120
μs
(Fall)
tf
-
30
120
μs
Collector-emitter
saturation voltage
VCE(sat)
IF=10mA, Ic=40μA
-
-
0.4
V
(Test circuit for response time)
Vcc
RL
Test pin
GP1S396HCPSF
4
Sheet No.: OP13020EN
-25
0
25
50
75
100
85
50
40
30
20
10
0
40
Ambient temperature Ta (°C)
Forward current (mA)
Power dissipation P, Pc, Ptot (mW)
Ambient temperature Ta (°C)
15
100
85
75
50
25
0
-25
0
40
50
70
20
Total power dissipation
Input and output power dissipation
Forward current vs. ambient temperature
Power dissipation vs. ambient temperature
5
GP1S396HCPSF
5
Sheet No.: OP13020EN
100
80
60
40
20
50
90
10
-1
1
0
2
3
Shield distance L (mm)
Relative collector current (%)
Shield distance L
Shield
－
＋
０
Sensor
Test condition
IF=5.0mA
VCE=5V
Ta=25°C
100
80
60
40
20
50
90
10
-1
1
0
2
3
Shield distance L (mm)
Relative collector current (%)
Relative collector current vs. shield distance 1 (Reference value)
Relative collector current vs. shield distance 2 (Reference value)
Test condition
IF=5.0mA
VCE=5V
Ta=25°C
Shield distance L
Shield
－
＋
０
Sensor
GP1S396HCPSF
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Sheet No.: OP13020EN
■Supplements
●ODS materials
This product shall not contain the following materials.
Also, the following materials shall not be used in the production process for this product.
Materials for ODS : CFCS, Halon, Carbon tetrachloride 1.1.1-Trichloroethane (Methyl chloroform)
●Halogen material
Chlorine < 900ppm , Bromine < 900ppm , Chlorine + Bromine < 1500ppm (Homogeneous material)
●Compliance with each regulation
1) The RoHS directive(2002/95/EC)
This product complies with the RoHS directive(2002/95/EC).
Object substances: mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls (PBB)
and polybrominated diphenyl ethers (PBDE)
2) Content of six substances specified in Management Methods for Control of Pollution Caused by Electronic
Information Products Regulation (Chinese : 电子信息产品污染控制管理办法).
Category
Toxic and hazardous substances
Lead
(Pb)
Mercury
(Hg)
Cadmium
(Cd)
Hexavalent
chromium
(Cr6+)
Polybrominated
biphenyls
(PBB)
Polybrominated
diphenyl ethers
(PBDE)
Photointerrupter
✓
✓
✓
✓
✓
✓
✓: indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is
below the concentration limit requirement as described in SJ/T 11363-2006 standard.
●Product mass : Approx. 5mg
●Country of origin : China
●Taping specification : Refer to the attachment-2.
●Moisture-proof package specification : Refer to the attachment-3.
GP1S396HCPSF
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Sheet No.: OP13020EN
0.86mm or more
0.86mm or more
■Notes
●Circuit design
In circuit designing, make allowance for the degradation of the light emitting diode output that results
from long continuous operation. (50% degradation/5 years)
●Prevention of detection error
To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to the
external light.
●Position of opaque board
Opaque board shall be installed at place 0.86mm or more from the top of elements.
(Example)
●Soldering
1) Reflow soldering
Please do only two soldering at the temperature and the time within the temperature profile in attachment-1.
2) Hand soldering
To solder onto lead pins, please solder at 300°C for 3 seconds or less.
Please also take care not to let mechanical stress exert on package and lead pins when soldering.
Please have soldering adjustment, etc. after GP1S396HCPSF is cooled down, and also note that the outer mold
resin may be meltdown by heating for a long time.
Since the tip of the lead has exposed lead frame base material, there is a case not to be soldered, so please
consider the soldering pattern on a print circuit board to solder well with the bottom and side surface of the lead.
●Cleaning
Cleaning shall be carried out under the below conditions to avoid keeping solvent, solder and flux on the device.
1) Solvent cleaning : Solvent temperature 45°C or less, Immersion for 3 min. or less
2) Ultrasonic cleaning : Since the influence to the product may changes by the conditions of the ultrasonic
power, time, the tank size, PCB size, the product installation condition, etc., please evaluate with actual
conditions and confirm before usage.
3) The cleaning shall be carried out with solvent below.
Solvent : Ethyl alcohol, Methyl alcohol
●Lead pin
Lead terminals of this product have Copper, Nickel, Palladium and Gold plating.
Before usage, please evaluate solder ability with actual conditions and confirm.
The uniformity in color for the lead terminals are not specified.
●Storage and management after open
1) Storage condition : Storage shall be in accordance with the below conditions.
Storage temp. : 5 to 30°C
Storage humidity : 70%RH or less
2) Treatment after open
(1) After open, please mount at the conditions of humidity 60%RH or less and temperature 5 to 30°C
within 3 days.
In case that two times reflow soldering are required, please complete your 2nd reflow soldering
within 3 days after the 1st reflow soldering.
(2) In case of long time storage after open, please storage at the conditions of humidity 70%RH or less
and temperature 5 to 30°C by using dry box or resealing with desiccant in moisture-proof bag by sealer
and mount within 2 weeks.
3) Baking before mounting
In case that it could not carry out the above treatment, it is able to mount with baking treatment.
However baking treatment shall be limited only 1 time. Although it is possible to have baking treatment
with taping package, please bake it by putting a reel with standing situation. Please do not lay it down
since it may change the reel shape and occur a mounting problem. Since a label and a fixing tape
for the carrier tape does not have enough heat resistance, there may be a case to leave some paste.
Recommended baking conditions : 100°C, 22 to 26 hours
GP1S396HCPSF
8
Sheet No.: OP13020EN
■Parts
This product uses the below parts.
● Light detector (Quantity : 1)
Type
Material
Maximum sensitivity
(nm)
Sensitivity
(nm)
Response time
(μs)
Phototransistor
Silicon
(Si)
920
700 to 1200
20
● Light emitter (Quantity : 1)
Type
Material
Maximum light emitting
wavelength (nm)
I/O Frequency
(MHz)
Infrared light emitting diode
(non-coherent)
GaAs
940
0.3
● Material
Case
Lead frame
Lead frame plating
Black PPA resin
42 Alloy
Au-Pd-Ni-Cu
● Others
This product shall not be proof against radiation flux.
GP1S396HCPSF
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Sheet No.: OP13020EN
■Packing Drawing No. CY14943i09
● Inner Packing
1) Inner Packaging drawing
2) Inner Packing material : ・Reel(PPE) ・Carrier tape(PC) ・Caver tape(PET)
3) Quantity : 2,500pcs./Reel
● Outer Packaging
1) Outer Packaging drawing
2) Outer Packing material : Packing case(Corrugated cardboard), Cushioning material(Urethane)
Aluminium laminated bag(Alumi-Polyethylene)
Label(paper), silica gel, craft tape
3) Quantity : 12,500pcs./box
4) The contents of the carton indication conforms to EIAJ C-3 and the following items are indicated.
Model No., Internal production control name, Quantity, Packing date, Corporate name, Country of origin
5) Regular packaged mass : Approximately 700g
GP1S396HCPSF
10
Sheet No.: OP13020EN
(Attachment-1)
Precautions for Soldering photointerrupter
1) In case of reflow soldering,
Please do only two soldering at the temperature and the time within the temperature profile as shown in the
figure below.
2) Other precautions
An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin.
So keep the package temperature within that specified in Item 1.
Also avoid immersing the resin part in the solder.
Even if within the temperature profile above, there is the possibility that the gold wire in package is broken
in case that the deformation of PCB gives the affection to lead pins.
Please use after confirmation the conditions fully by actual solder reflow machine.
230°C
25°C
MAX
250°C
1
～
4°C/s
1
～
5°C/s
1
～
5°C/s
MAX120S
MAX40S
MAX70S
MAX10S
180°C
160°C
MAX
100°C
MAX240S
GP1S396HCPSF
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Sheet No.: OP13020EN
(Attachment-2-1)
Package specifications (φ180mm reel)
1) Application
This specification applies to the taping specifications and the relation items for the GP1S396HCPSF.
2) Taping method
(1) Tape structure and Dimensions (Refer to the attached sheets-2-2)
The tape shall have a structure in which a cover tape is sealed pressed on the carrier tape made by
polycarbonate to protect against static electricity.
(2) Reel structure and Dimensions (Refer to the attached sheets-2-3)
(3) Direction of product insertion (Refer to the attached sheets-2-3)
Product direction in carrier tape shall direct to the detector at the hole side on the tape.
3) Repair method of sealing error
In case of repairing a sealing error, three sides of a cover tape matching to the product insertion portion are
opened by a cutter and it will be closed by adhesiveness tape after repairing.
4) Adhesiveness of cover tape
The exhalation force between carrier tape and cover tape shall be 0.1N to 1.0N for the angle from 165° to 180°.
5) Rolling method and quantity
(1) Wind the tape back on the reel so that the cover tape will be outside the tape.
(2) Attach more than 16cm of blank tape to the trailer and attach more than 10cm of the leader.
Attach more than 40cm of cover tape to the leader to the tape and fix the both ends with adhesive tape.
(3) One reel shall contain 2,500 pcs.
6) Indication items
The contents of the carton indication conforms to EIAJ C-3 and the following items are indicated.
Model No., Internal production control name, Quantity, Packing date, Corporate name, Country of origin
7) Safety protection during shipping
There shall be no deformation of component or degradation of electrical characteristics due to shipping.
GP1S396HCPSF
12
Sheet No.: OP13020EN
(Attachment-2-2)
● Tape structure and dimensions
GP1S396HCPSF
13
Sheet No.: OP13020EN
(Attachment-2-3)
● Reel structure and dimensions
● Direction of product insertion
GP1S396HCPSF
14
Sheet No.: OP13020EN
(Attachment-3-1)
Moisture-proof package specification
1) Application
This specification applies to the moisture-proof package for the GP1S396HCPSF.
2) Packaging specifications
(1) Packaging material
Name
Material
Aluminum laminated sack
Aluminum polyethylene
Label
Paper(-made)
Silica gel
-
Outer case
Paper(-made)
Cushioning material
Urethane
(2) Packaging method
①Seal a reel with 2,500pcs products into an aluminum laminated bag included the ruled silica gel quantity.
②Fill up the blank of label and paste on the bag.
③Put the moisture-proof laminated bag in the ruled case (5bag/case).
The cushioning material is put in case.
Package shape
Product
Quantity
Moisture-proof sack Quantity
Tape-reel (φ180mm)
Single
2,500pcs./reel
1reel/bag
Minimum order Quantity : 2,500pcs (1 reel/bag)
④Fill out the model name, quantity and date after closing the outer case by craft tape.
(Quantity: 12,500pcs./case) *Except the case products by failing to seal are cut out
3) Storage and management after open
(1) Storage condition : Storage shall be in accordance with the below conditions.
Storage temp. : 5 to 30°C
Storage humidity : 70%RH or less
(2) Treatment after open
①After open, please mount at the conditions of humidity 60%RH or less and temperature 5 to 30°C within
3 days.
In case that two times reflow soldering are required, please complete your 2nd reflow soldering within
3 days after the 1st reflow soldering.
②In case of long time storage after open, please storage at the conditions of humidity 70%RH or less and
temperature 5 to 30°C by using dry box or resealing with desiccant in moisture-proof bag by sealer and
mount within 2 weeks.
(3) Baking before mounting
In case that it could not carry out the above treatment, it is able to mount with baking treatment.
However baking treatment shall be limited only 1 time.
Although it is possible to have baking treatment with taping package, please bake it by putting a reel with
standing situation.
Please do not lay it down since it may change the reel shape and occur a mounting problem.
Since a label and a fixing tape for the carrier tape does not have enough heat resistance, there may be
a case to leave some paste.
Recommended baking conditions : 100°C, 22 to 26 hours
GP1S396HCPSF
15
Sheet No.: OP13020EN
(Attachment-3-2)
● Baking treatment before mounting
・Placement of reels in an oven
1) Please hang reels by using a center hole for fixing the reel.
Please keep some space between reels for better air rotation in the oven.
Please do not lay a reel down in the oven to avoid any damages for the tape edge and the flange of reel.
2) Please make sure the carrier tape does not have any slack in a reel before baking to avoid peeling the cover
tale off.
Since the tape using for fixing carrier tape is not heatproof, there is a case to remain glue.
So if necessary, please change the tape to a heatproof one.
GP1S396HCPSF
16
Sheet No.: OP13020EN
■Important Notices
· The circuit application examples in this publication are provided
to explain representative applications of SHARP devices and are
not intended to guarantee any circuit design or license any
intellectual property rights. SHARP takes no responsibility for
any problems related to any intellectual property right of a third
party resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device specification
sheets before using any SHARP device. SHARP reserves the
right to make changes in the specifications, characteristics, data,
materials, structure, and other contents described herein at any
time without notice in order to improve design or reliability.
Manufacturing locations are also subject to change without
notice.
· Observe the following points when using any devices in this
publication. SHARP takes no responsibility for damage caused
by improper use of the devices which does not meet the
conditions and absolute maximum ratings to be used specified in
the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general
electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant design
should be taken to ensure reliability and safety when SHARP
devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connection with
equipment that requires an extremely high level of reliability and
safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall within the
scope of strategic products described in the Foreign Exchange
and Foreign Trade Law of Japan, it is necessary to obtain
approval to export such SHARP devices.
· This publication is the proprietary product of SHARP and is
copyrighted, with all rights reserved. Under the copyright laws,
no part of this publication may be reproduced or transmitted in
any form or by any means, electronic or mechanical, for any
purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also
required before any use of this publication may be made by a
third party.
· Contact and consult with a SHARP representative if there are
any questions about the contents of this publication.
