Parameter Symbol Value Units
TOTAL DEVICE TSTG -55 to +150 °C
Storage Temperature
Operating Temperature TOPR -55 to +100 °C
Lead Solder Temperature TSOL 260 for 10 sec °C
Total Device Power Dissipation @ TA= 25°C PD260 mW
Derate above 25°C 3.5 mW/°C
EMITTER IF80 mA
*Forward DC Current
*Reverse Input Voltage VR6.0 V
*Forward Current - Peak (1µs pulse, 300pps) IF(pk) 3.0 A
*LED Power Dissipation @ TA= 25°C PD150 mW
Derate above 25°C 1.41 mW/°C
FEATURES
• High Voltage
- H11D1, H11D2, BVCER = 300 V
- H11D3, H11D4, BVCER = 200 V
• High isolation voltage
- 5300 VAC RMS - 1 minute
- 7500 VAC PEAK - 1 minute
• Underwriters Laboratory (UL) recognized File# E90700
DESCRIPTION
The H11DX and 4N38 are phototransistor-type optically coupled optoisolators. An infrared emitting
diode manufactured from specially grown gallium arsenide is selectively coupled with a high voltage
NPN silicon phototransistor. The device is supplied in a standard plastic six-pin dual-in-line package.
8/9/00 200046A
EMITTER
COLLECTOR
1
2
3
ANODE
CATHODE
4
5
6BASE
N/C
HIGH VOLTAGE
PHOTOTRANSISTOR OPTOCOUPLERS
H11D1
H11D2
H11D3
H11D4
4N38
APPLICATIONS
Power supply regulators
Digital logic inputs
Microprocessor inputs
Appliance sensor systems
Industrial controls
ABSOLUTE MAXIMUM RATINGS
8/9/00 200046A
H11D1, H11D2, H11D3, H11D4, 4N38
HIGH VOLTAGE
PHOTOTRANSISTOR OPTOCOUPLERS
Notes* Parameters meet or exceed JEDEC registered data (for 4N38 only)
** All typical values at TA= 25°C
ELECTRICAL CHARACTERISTICS (TA= 25°CUnless otherwise specified.)
Characteristic Test Conditions Symbol Device Min Typ** Max Unit
EMITTER (IF= 10 mA) VFALL 1.15 1.5 V
*Forward Voltage
Forward Voltage Temp. !VFALL -1.8 mV/°C
Coefficient !TA
Reverse Breakdown Voltage (IR= 10 µA) BVRALL 6 25 V
Junction Capacitance (VF= 0 V, f = 1 MHz) CJALL 50 pF
(VF= 1 V, f = 1 MHz) ALL 65 pF
*Reverse Leakage Current (VR= 6 V) IRALL 0.05 10 µA
DETECTOR (RBE = 1 M")BVCER H11D1/2 300
*Breakdown Voltage (IC= 1.0 mA, IF= 0) H11D3/4 200
Collector to Emitter (No RBE) (IC= 1.0 mA) BVCEO 4N38 80
H11D1/2 300 V
*Collector to Base (IC= 100 µA, IF= 0) BVCBO H11D3/4 200
4N38 80
Emitter to Base (IE= 100 µA , IF= 0) BVEBO 4N38 7
Emitter to Collector BVECO ALL 7 10
(VCE = 200 V, IF= 0, TA= 25°C) H11D1/2 100 nA
*Leakage Current (VCE = 200 V, IF= 0, TA= 100°C) ICER 250 µA
Collector to Emitter (VCE = 100 V, IF= 0, TA= 25°C) H11D3/4 100 nA
(RBE = 1 M")(V
CE = 100 V, IF= 0, TA= 100°C) 250 µA
(No RBE) (VCE = 60 V, IF= 0, TA= 25°C) ICEO 4N38 50 nA
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameter Symbol Value Units
DETECTOR 300 mW
*Power Dissipation @ TA= 25°CP
D
Derate linearly above 25°C 4.0 mW/°C
H11D1 - H11D2 300
*Collector to Emitter Voltage H11D3 - H11D4 VCER 200
4N38 80
H11D1 - H11D2 300 V
*Collector Base Voltage H11D3 - H11D4 VCBO 200
4N38 80
*Emitter to Collector Voltage H11D1 - H11D2 VECO 7
H11D3 - H11D4
Collector Current (Continuous) 100 mA
ABSOLUTE MAXIMUM RATINGS (Cont.)
VCE - COLLECTOR VOLTAGE (V)
NORMALIZED ICER - OUTPUT CURRENT
Fig.2 Normalized Output Characteristics
0.1 1 10 100
0.01
0.1
1
10
Normalized to:
VCE = 10 V
IF = 10 mA
RBE = 106
TA = 25˚C
IF = 50 mA
IF = 5 mA
IF = 10 mA
IF - LED FORWARDCURRENT (mA)
VF - FORWARD VOLTAGE (V)
Fig.1 LED Forward Voltage vs. Forward Current
1 10 100
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
TA = 55˚C
TA = 25˚C
TA = 100˚C
8/9/00 200046A
H11D1, H11D2, H11D3, H11D4, 4N38
HIGH VOLTAGE
PHOTOTRANSISTOR OPTOCOUPLERS
DC Characteristic Test Conditions Symbol Device Min Typ** Max Unit
EMITTER H11D1
Current Transfer Ratio (IF= 10 mA, VCE = 10 V) H11D2 2 (20)
Collector to Emitter (RBE = 1 M") CTR H11D3 mA (%)
H11D4 1 (10)
(IF= 10 mA, VCE = 10 V) 4N38 2 (20)
(IF= 10 mA, IC= 0.5 mA) H11D1/2/3/4 0.1 0.40
*Saturation Voltage (RBE = 1 M")V
CE (SAT) V
(IF= 20 mA, IC= 4 mA) 4N38 1.0
TRANSFER CHARACTERISTICS
Characteristic Test Conditions Symbol Device Min Typ** Max Unit
SWITCHING TIMES (VCE =10 V, ICE = 2 mA) ton ALL 5
Non-Saturated Turn-on Time µs
Turn-off Time (RL= 100 ") toff ALL 5
TRANSFER CHARACTERISTICS
Characteristic Test Conditions Symbol Device Min Typ** Max Unit
Isolation Voltage (II-O #$1 µA, 1 min.) VISO ALL 5300 (VACRMS)
7500 (VACPEAK)
Isolation Resistance (VI-O = 500 VDC) RISO ALL 1011 "
Isolation Capacitance (f = 1 MHz) CISO ALL 0.5 pF
ISOLATION CHARACTERISTICS
Notes* Parameters meet or exceed JEDEC registered data (for 4N38 only)
** All typical values at TA= 25°C
TA - AMBIENT TEMPERATURE (˚C)
NORMALIZED ICER - DARK CURRENT
Fig.3 Normalized Output Current vs. LED Input Current
IF - LED INPUT CURRENT (mA)
110
NORMALIZED ICER - OUTPUT CURRENT
0.01
0.1
1
10
Normalized to:
VCE = 10 V
IF = 10 mA
RBE = 106
TA = 25˚C
TA - AMBIENT TEMPERATURE (˚C)
NORMALIZED ICER - OUTPUT CURRENT
Fig.4 Normalized Output Current vs. Temperature
-60 -40 -20 0 20 40 60 80 100
0.1
1
Normalized to:
VCE = 10 V
IF = 10 mA
RBE = 106
TA = 25˚C
IF = 10 mA
IF = 5 mA
IF = 20 mA
TA - AMBIENT TEMPERATURE (˚C)
NORMALIZED ICBO - COLLECTOR-BASE CURRENT
Normalized Collector-Base Current vs. Temperature
-60 -40 -20 0 20 40 60 80 100
0
1
2
3
4
5
6
7
8
9
10
Normalized to:
VCE = 10 V
IF = 10 mA
RBE = 106
TA = 25˚C
IF = 50 mA
IF = 10 mA
IF = 5 mA
Fig.5 Normalized Dark Current vs. Ambient Temperature
10 20 30 40 50 60 70 80 90 100 110
0.1
1
10
100
1000
10000
VCE = 300 V
VCE = 100 V
VCE = 50 V
Normalized to:
VCE = 100 V
RBE = 106
TA = 25˚C
8/9/00 200046A
H11D1, H11D2, H11D3, H11D4, 4N38
HIGH VOLTAGE
PHOTOTRANSISTOR OPTOCOUPLERS
Lead Coplanarity : 0.004 (0.10) MAX
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
0.300 (7.62)
TYP
0.405 (10.30)
MAX
0.315 (8.00)
MIN
0.016 (0.40) MI N
2
5
PIN 1
ID.
0.016 (0.41)
0.008 (0.20)
0.100 (2.54)
TYP
0.022 (0.56)
0.016 (0.41)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.165 (4.18)
4
3
0.020 (0.51)
MIN
1
6
0.100 (2.54)
TYP
0.020 (0.51)
MIN
0.350 (8.89)
0.330 (8.38)
0.270 (6.86)
0.240 (6.10)
PIN 1
ID.
0.022 (0.56)
0.016 (0.41)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.135 (3.43)
0.300 (7.62)
TYP
0° to 15°
0.154 (3.90)
0.100 (2.54)
SEATING PLANE
0.016 (0.40)
0.008 (0.20)
321
456
SEATING PLANE
0.016 (0.40)
0.008 (0.20)
0.070 (1.78)
0.045 (1.14)
0.350 (8.89)
0.330 (8.38)
0.154 (3.90)
0.100 (2.54)
0.200 (5.08)
0.135 (3.43)
0.004 (0.10)
MIN
0.270 (6.86)
0.240 (6.10)
0.400 (10.16)
TYP
0° to 15°
0.022 (0.56)
0.016 (0.41) 0.100 (2.54) TYP
3
PIN 1
ID.
21
456
NOTE
All dimensions are in inches (millimeters)
0.070 (1.78)
0.060 (1.52)
0.030 (0.76)
0.100 (2.54)
0.295 (7.49)
0.415 (10.54)
Packa ge Dimensions (Surface Mount)Packa ge Dimensions (Thr ough Hole)
Packa ge Dimensions (0.4”Lead Spacing) Recommended Pad Layout for
Surface Mount Leadform
8/9/00 200046A
H11D1, H11D2, H11D3, H11D4, 4N38
HIGH VOLTAGE
PHOTOTRANSISTOR OPTOCOUPLERS
S .S Surface Mount Lead Bend
SD .SD Surface Mount; Tape and reel
W .W 0.4 Lead Spacing
300 .300 VDE 0884
300W .300W VDE 0884, 0.4 Lead Spacing
3S .3S VDE 0884, Surface Mount
3SD .3SD VDE 0884, Surface Mount, Tape & Reel
Option Order Entry Identifier Description
4.0 ± 0.1
Ø1.55 ± 0.05
User Direction of Feed
4.0 ± 0.1
1.75 ± 0.10
7.5 ± 0.1
16.0 ± 0.3
12.0 ± 0.1
0.30 ± 0.05
13.2 ± 0.2
4.85 ± 0.20
0.1 MAX 10.30 ± 0.20
9.55 ± 0.20
Ø1.6 ± 0.1
QT Carrier Tape Specifications (“D” Taping Orientation)
ORDERING INFORMATION
NOTE
All dimensions are in millimeters
8/9/00 200046A
H11D1, H11D2, H11D3, H11D4, 4N38
HIGH VOLTAGE
PHOTOTRANSISTOR OPTOCOUPLERS
MARKING INFORMATION
Reflow Profile (Black Package, No Suffix)
H11D1
V XX YY K
1
2
6
43 5
Definitions
1 Fairchild logo
2 Device number
3VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4 Two digit year code, e.g., ‘03’
5 Two digit work week ranging from ‘01’ to ‘53’
6 Assembly package code
Peak reflow temperature: 225° C (package surface temperature)
Time of temperature higher than 183° C for 60150 seconds
One time soldering reflow is recommended
215°C, 1030 s
225 C peak
Time (Minute)
0
300
250
200
150
100
50
0
0.5 1 1.5 2 2.5 3 3.5 4 4.5
Temperature (°C)
Time above 183° C, 60150 sec
Ramp up = 3 C/sec
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY
ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT
CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
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