MODEL LPT-4545 Inductors Surface Mount, Toroidal FEATURES * Toroidal design for minimal EMI radiation in DC to DC converter applications Designed to support the growing need for efficient DC to DC converters in battery operated equipment * Two separate windings provide versatility by ability to connect windings in series or parallel * Supplied on tape and reel and is designed to be pick and place compatible Custom versions available. Contact the factory with your specifications. PARALLEL CONNECTED SERIES CONNECTED IND. RATED DCR IND. RATED DCR (ui) CURRENT MAX. (ul) CURRENT MAX. ENERGY* MODEL + 15% (A) (Ohms) + 15% (A) (Ohms) (ui) LPT-4545-100LA 10 4.000 .030 40 2.000 0.120 55 LPT-4545-150LA 15 3.000 045 60 1.500 0.180 45 LPT-4545-200LA 20 2.100 .050 80 1.050 0.215 45 LPT-4545-330LA 33 1.650 .075 132 0.830 0.300 45 LPT-4545-500LA 50 1.350 .105 200 0.675 0.420 45 LPT-4545-101LA 100 0.950 175 400 0.475 0.700 45 LPT-4545-151LA 150 0.720 .330 600 0.360 1.320 45 LPT-4545-251LA 250 0.600 .600 1000 0.300 2.400 45 LPT-4545-301LA 300 0.550 .600 1200 0.275 2.300 45 * Based on 1/2LI? where | is the current that reduces the inductance by 30% to 35%. CL y Ol I | Max. * -020 [.508] Minimum Clearance for Cleaning Transformer Parallel Series 100% 1 4 ul 1 1 e e 4 1 4 2 . = 90% o 8 J Z = 3 B0% 3 az 2 3.2 3 2 <o J Ea = L FE 70% 6 e 2 ivy QO 60% a a - Dale Model number 0% 25% 50% 75% 100% Pin 1 identification PERCENT OF RATED CURRENT DRALORIC ELECTRONIC GMBH, Geheimrat-Rosenthal-Str. 100, 95100 Selb, Germany Tel: (0)9287/710 + Fax: (0)9287/70435 244 MODEL LPT-4545 SURFACE MOUNT SOLDERING Solder methods for surface mount are IR, vapor phase and solder wave. IR is the most used at this time and discussion between users and vendors has resulted in recommendations for solder. A Recommended Temperature Profile for the IR reflow process is included which reflects the typical current usage. Preheat: Incorporates a 2 1/2C rise per second maximum. Zone 1: 1C to 2C rise per second. Zone 2: Stabilize, to allow more uniform heat distribution. Zone 3: Solder liquidus interval 45 seconds preferred, 60 seconds maximum. Helps to prevent lead (Pb) crystallization. Cool Down: 2C to 4C drop per second forced room air temperature cooling. As a general rule for all methods of soldering: 1. Preheat the components and the board to within TEMPERATURE DEG. CENTIGRADE >| |< 5 Second Peak 250 Preheat Cool Down 240 120 150 TIME (SECONDS) 270 100C of the soldering temperature for a minimum of 60 seconds. This ramping should not exceed 1 1/2C to 2 1/2C per second. 2. (a) Reflow soldering temperature should not exceed + 230C with a maximum time of 20 seconds. (b) Wave soldering temperature should not exceed + 240C with a maximum time of 5 seconds. (c) Vapor phase reflow soldering should not exceed + 220C with a maximum time of 40 seconds. 3. In all cases, gradual cooling to room temperature is recommended. When profiling IR ovens, profile each board style with thermocouples embedded under components on the board. Expect the edges of the board to get 20C to 30C hotter than the board center. Ultrasonic cleaning should be done with power regulated equipment. Older 25 kHz, unregulated equipment can damage joints and components. [Numbers in brackets indicate millimeters] < 492 [12.497] __ << .348 [8.839] ->| HOWTOORDER LPT MODEL 4545 SIZE 100 VALUE INDUCTANCE + 15% INDUCTANCE TOLERANCE A CORE/ HEIGHT Pocket Tape Orientation Carrier Tape Width 945 [24.0] OOOOOO0O000 Mey bY Pitch .630 [16.0] 600 OOO 0 Stas Parts per 13" [330.2] Reel All embossed carrier tape packaging will be in compliance with the latest revision of EIA-481. REELING DIRECTION A DRALORIC ELECTRONIC GMBH, Geheimrat-Rosenthal-Str. 100, 95100 Selb, Germany Tel: (0)9287/710 + Fax: (0)9287/70435 245