Data Sheet 300mA RF ULDO REGULATOR AP2210 General Description Features The AP2210 is a 300mA ULDO regulator which provides very low noise, ultra low dropout voltage (typically 250mV at 300mA), very low standby current (1A maximum) and excellent power supply ripple rejection (PSRR 75dB at 100Hz) in battery powered applications, such as handsets, PDAs and in noise sensitive applications, such as RF electronics. * * * * Up to 300mA Output Current Excellent ESR Stability Low Standby Current Low Dropout Voltage: VDROP=250mV at 300mA * * High Output Accuracy: 1% Good Ripple Rejection Ability: 75dB at 100Hz and IOUT=100A * * * * * * Tight Load and Line Regulation Low Temperature Coefficient Over Current Protection Thermal Protection Reverse-battery Protection Logic-controlled Enable The AP2210 also features individual logic compatible enable/shutdown control inputs, a low power shutdown mode for extended battery life, over current protection, over temperature protection, as well as reversed-battery protection. The AP2210 has 2.5V, 2.8V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V and ADJ versions. Applications The AP2210 is available in space saving SOT-23-3 and SOT-23-5 packages. * * * * * * Cellular Phones Cordless Phones Wireless Communicators PDAs/Palmtops PC Mother Board Consumer Electronics SOT-23-5 SOT-23-3 Figure 1. Package Types of AP2210 Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 1 Data Sheet 300mA RF ULDO REGULATOR AP2210 Pin Configuration N Package (SOT-23-3) K Package (SOT-23-5) VIN 3 1 2 GND VIN 1 GND 2 EN 3 5 VOUT 4 BYP/ADJ VOUT Figure 2. Pin Configuration of AP2210 (Top View) Pin Description Pin Number Function Pin Name SOT-23-3 SOT-23-5 1 2 GND 2 5 VOUT 3 1 VIN Input voltage 3 EN Enable input: CMOS or TTL compatible input. Logic high=enable, logic low=shutdown 4 BYP/ADJ Ground Regulated output voltage Bypass capacitor for low noise operation/Adjustable Output Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 2 Data Sheet 300mA RF ULDO REGULATOR AP2210 Functional Block Diagram VIN BYP 3 (1) 2 (5) VOUT (4) + EN Bandgap Ref. A (B) A for SOT-23-3 B for SOT-23-5 (3) Current Limit Thermal Shutdown 1 (2) GND Fixed Version VIN ADJ 1 5 VOUT 4 + - EN Bandgap Ref. 3 Current Limit Thermal Shutdown 2 GND ADJ Version (For SOT-23-5) Figure 3. Functional Block Diagram of AP2210 Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 3 Data Sheet 300mA RF ULDO REGULATOR AP2210 Ordering Information AP2210 E1: Lead Free G1: Green Circuit Type TR: Tape and Reel Package N: SOT-23-3 K: SOT-23-5 Package SOT-23-3 SOT-23-5 Temperature Range -40 to 125oC -40 to 125oC 2.5: Fixed Output 2.5V 2.8: Fixed Output 2.8V 3.0: Fixed Output 3.0V 3.3: Fixed Output 3.3V 3.6: Fixed Output 3.6V 4.0: Fixed Output 4.0V 5.0: Fixed Output 5.0V ADJ: Adjustable Output Part Number Lead Free Marking ID Green Lead Free Green Packing Type AP2210N-2.5TRE1 AP2210N-2.5TRG1 EH2 GH2 Tape & Reel AP2210N-2.8TRE1 AP2210N-2.8TRG1 EH3 GH3 Tape & Reel AP2210N-3.0TRE1 AP2210N-3.0TRG1 EH4 GH4 Tape & Reel AP2210N-3.3TRE1 AP2210N-3.3TRG1 EH5 GH5 Tape & Reel AP2210N-3.6TRG1 GB7 Tape & Reel AP2210N-4.0TRG1 GC7 Tape & Reel AP2210N-5.0TRG1 GH9 Tape & Reel AP2210K-2.5TRE1 AP2210K-2.5TRG1 E5C G5C Tape & Reel AP2210K-2.8TRE1 AP2210K-2.8TRG1 E5F G5F Tape & Reel AP2210K-3.0TRE1 AP2210K-3.0TRG1 E5H G5H Tape & Reel AP2210K-3.3TRE1 AP2210K-3.3TRG1 E5K G5K Tape & Reel AP2210K-3.6TRG1 G5I Tape & Reel AP2210K-4.0TRG1 G5J Tape & Reel AP2210K-5.0TRG1 G5L Tape & Reel AP2210K-ADJTRG1 G5M Tape & Reel BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Products with "G1" suffix are available in green packages. Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 4 Data Sheet 300mA RF ULDO REGULATOR AP2210 Absolute Maximum Ratings (Note 1) Symbol Value Unit Supply Input Voltage VIN 15 V Enable Input Voltage VEN 15 V PD Internally Limited (Thermal Protection) W TLEAD 260 o Junction Temperature TJ 150 oC Storage Temperature TSTG -65 to 150 oC ESD (Machine Model) ESD 300 V Thermal Resistance (No Heatsink) JA Parameter Power Dissipation Lead Temperature (Soldering, 10sec) C SOT-23-3 200 SOT-23-5 200 oC/W Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods may affect device reliability. Recommended Operating Conditions Parameter Symbol Min Max Unit Supply Input Voltage VIN 2.5 13.2 V Enable Input Voltage VEN 0 13.2 V TJ -40 125 oC Operating Junction Temperature Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 5 Data Sheet 300mA RF ULDO REGULATOR AP2210 Electrical Characteristics (Continued) AP2210-2.5 Electrical Characteristics VIN=3.5V, IOUT=100A, CIN=1.0F, COUT=2.2F, VEN2.0V, TJ=25oC, Bold typeface applies over -40oCTJ125oC (Note 2), unless otherwise specified. Parameter Symbol Conditions Variation from specified VOUT Min Typ Max -1 1 -2 2 Unit Output Voltage Accuracy VOUT/VOUT Output Voltage Temperature Coefficient (Note 3) VOUT/T 120 V/oC (VOUT/VOUT)/T 48 ppm/oC 1.5 Line Regulation VRLINE VIN=3.5V to 13.2V Load Regulation (Note 4) VRLOAD IOUT=0.1mA to 300mA 110 140 IOUT=100mA Ground Pin Current (Note 6) 165 250 mV 275 350 250 400 500 VEN0.4V (shutdown) 0.01 VEN0.18V (shutdown) 100 VEN2.0V, IOUT=50mA 350 VEN2.0V, IOUT=150mA 1.3 VEN2.0V, IOUT=300mA 4 IGND 1 5 VEN2.0V, IOUT=100A A 150 180 600 A 800 1.9 2.5 10 mA 15 Ripple Rejection PSRR f=100Hz, IOUT=100A 75 Current Limit ILIMIT VOUT=0V 450 Output Noise eno IOUT=50mA, COUT=2.2F, 100pF from BYP to GND 260 Jan. 2012 Rev. 1. 6 150 300 IOUT=300mA ISTD 50 230 IOUT=150mA Standby Current mV 70 IOUT=50mA VDROP mV 6 30 15 IOUT=100A Dropout Voltage (Note 5) 4.5 12 1 % dB 900 mA nV / Hz BCD Semiconductor Manufacturing Limited 6 Data Sheet 300mA RF ULDO REGULATOR AP2210 Electrical Characteristics (Continued) AP2210-2.5 Electrical Characteristics VIN=3.5V, IOUT=100A, CIN=1.0F, COUT=2.2F, VEN2.0V, TJ=25oC, Bold typeface applies over -40oCTJ125oC (Note 2), unless otherwise specified. Parameter Symbol Conditions Enable Input Logic-low Voltage VIL Regulator shutdown Enable Input Logic-high Voltage VIH Regulator enabled Enable Input Logic-low Current IIL Enable Input Logic-high Current IIH VIL0.4V Min Typ 0.4 0.18 2.0 VIL2.0V Unit V V 0.01 VIL0.18V VIL2.0V Max 1 2 5 20 25 A A Note 2: Specifications in bold type are limited to -40oCTJ125oC. Limits over temperature are guaranteed by design, but not tested in production. Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 0.1mA to 300mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% (TJ=25oC) or 2% (40oCTJ125oC) below its nominal value measured at 1V differential. Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 7 Data Sheet 300mA RF ULDO REGULATOR AP2210 Electrical Characteristics (Continued) AP2210-2.8 Electrical Characteristics VIN=3.8V, IOUT=100A, CIN=1.0F, COUT=2.2F, VEN2.0V, TJ=25oC, Bold typeface applies over -40oCTJ125oC (Note 2), unless otherwise specified. Parameter Symbol Conditions Variation from specified VOUT Min Typ Max -1 1 -2 2 Unit Output Voltage Accuracy VOUT/VOUT Output Voltage Temperature Coefficient (Note 3) VOUT/T 120 V/oC (VOUT/VOUT)/T 42.8 ppm/oC 1.5 Line Regulation VRLINE VIN=3.8V to 13.2V Load Regulation (Note 4) VRLOAD IOUT=0.1mA to 300mA 110 140 IOUT=100mA Ground Pin Current (Note 6) 165 250 mV 275 350 250 400 500 VEN0.4V (shutdown) 0.01 VEN0.18V (shutdown) 100 VEN2.0V, IOUT=50mA 350 VEN2.0V, IOUT=150mA 1.3 VEN2.0V, IOUT=300mA 4 IGND 1 5 VEN2.0V, IOUT=100A A 150 180 600 A 800 1.9 2.5 10 mA 15 Ripple Rejection PSRR f=100Hz, IOUT=100A 75 Current Limit ILIMIT VOUT=0V 450 Output Noise eno IOUT=50mA, COUT=2.2F, 100pF from BYP to GND 260 Jan. 2012 Rev. 1. 6 150 300 IOUT=300mA ISTD 50 230 IOUT=150mA Standby Current mV 70 IOUT=50mA VDROP mV 6 30 15 IOUT=100A Dropout Voltage (Note 5) 4.5 12 1 % dB 900 mA nV / Hz BCD Semiconductor Manufacturing Limited 8 Data Sheet 300mA RF ULDO REGULATOR AP2210 Electrical Characteristics (Continued) AP2210-2.8 Electrical Characteristics VIN=3.8V, IOUT=100A, CIN=1.0F, COUT=2.2F, VEN2.0V, TJ=25oC, Bold typeface applies over -40oCTJ125oC (Note 2), unless otherwise specified. Parameter Symbol Conditions Enable Input Logic-low Voltage VIL Regulator shutdown Enable Input Logic-high Voltage VIH Regulator enabled Enable Input Logic-low Current IIL Enable Input Logic-high Current IIH VIL0.4V Min Typ 0.4 0.18 2.0 VIL2.0V Unit V V 0.01 VIL0.18V VIL2.0V Max 1 2 5 20 25 A A Note 2: Specifications in bold type are limited to -40oCTJ125oC. Limits over temperature are guaranteed by design, but not tested in production. Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 0.1mA to 300mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% (TJ=25oC) or 2% (40oCTJ125oC) below its nominal value measured at 1V differential. Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 9 Data Sheet 300mA RF ULDO REGULATOR AP2210 Electrical Characteristics (Continued) AP2210-3.0 Electrical Characteristics VIN=4V, IOUT=100A, CIN=1.0F, COUT=2.2F, VEN2.0V, TJ=25oC, Bold typeface applies over -40oCTJ125oC (Note 2), unless otherwise specified. Parameter Symbol Conditions Variation from specified VOUT Min Typ Max -1 1 -2 2 Unit Output Voltage Accuracy VOUT/VOUT Output Voltage Temperature Coefficient (Note 3) VOUT/T 120 V/oC (VOUT/VOUT)/T 40 ppm/oC 1.5 Line Regulation VRLINE VIN=4V to 13.2V Load Regulation (Note 4) VRLOAD IOUT=0.1mA to 300mA 110 140 IOUT=100mA Ground Pin Current (Note 6) 165 250 mV 275 350 250 400 500 VEN0.4V (shutdown) 0.01 VEN0.18V (shutdown) 100 VEN2.0V, IOUT=50mA 350 VEN2.0V, IOUT=150mA 1.3 VEN2.0V, IOUT=300mA 4 IGND 1 5 VEN2.0V, IOUT=100A A 150 180 600 A 800 1.9 2.5 10 mA 15 Ripple Rejection PSRR f=100Hz, IOUT=100A 75 Current Limit ILIMIT VOUT=0V 450 Output Noise eno IOUT=50mA, COUT=2.2F, 100pF from BYP to GND 260 Jan. 2012 Rev. 1. 6 150 300 IOUT=300mA ISTD 50 230 IOUT=150mA Standby Current mV 70 IOUT=50mA VDROP mV 6 30 15 IOUT=100A Dropout Voltage (Note 5) 4.5 12 1 % dB 900 mA nV / Hz BCD Semiconductor Manufacturing Limited 10 Data Sheet 300mA RF ULDO REGULATOR AP2210 Electrical Characteristics (Continued) AP2210-3.0 Electrical Characteristics VIN=4V, IOUT=100A, CIN=1.0F, COUT=2.2F, VEN2.0V, TJ=25oC, Bold typeface applies over -40oCTJ125oC (Note 2), unless otherwise specified. Parameter Symbol Conditions Enable Input Logic-low Voltage VIL Regulator shutdown Enable Input Logic-high Voltage VIH Regulator enabled Enable Input Logic-low Current IIL Enable Input Logic-high Current IIH VIL0.4V Min Typ 0.4 0.18 2.0 VIL2.0V Unit V V 0.01 VIL0.18V VIL2.0V Max 1 2 5 20 25 A A Note 2: Specifications in bold type are limited to -40oCTJ125oC. Limits over temperature are guaranteed by design, but not tested in production. Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 0.1mA to 300mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% (TJ=25oC) or 2% (40oCTJ125oC) below its nominal value measured at 1V differential. Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 11 Data Sheet 300mA RF ULDO REGULATOR AP2210 Electrical Characteristics (Continued) AP2210-3.3 Electrical Characteristics VIN=4.3V, IOUT=100A, CIN=1.0F, COUT=2.2F, VEN2.0V, TJ=25oC, Bold typeface applies over -40oCTJ125oC (Note 2), unless otherwise specified. Parameter Symbol Conditions Min Variation from specified VOUT Typ Max -1 1 -2 2 Unit Output Voltage Accuracy VOUT/VOUT Output Voltage Temperature Coefficient (Note 3) VOUT/T 120 V/oC (VOUT/VOUT)/T 36.3 ppm/oC 1.5 Line Regulation VRLINE VIN=4.3V to 13.2V Load Regulation (Note 4) VRLOAD IOUT=0.1mA to 300mA 110 140 IOUT=100mA Ground Pin Current (Note 6) 165 250 mV 275 350 250 400 500 VEN0.4V (shutdown) 0.01 VEN0.18V (shutdown) 100 VEN2.0V, IOUT=50mA 350 VEN2.0V, IOUT=150mA 1.3 VEN2.0V, IOUT=300mA 4 IGND 1 5 VEN2.0V, IOUT=100A A 150 180 600 A 800 1.9 2.5 10 mA 15 Ripple Rejection PSRR f=100Hz, IOUT=100A 75 Current Limit ILIMIT VOUT=0V 450 Output Noise eno IOUT=50mA, COUT=2.2F, 100pF from BYP to GND 260 Jan. 2012 Rev. 1. 6 150 300 IOUT=300mA ISTD 50 230 IOUT=150mA Standby Current mV 70 IOUT=50mA VDROP mV 6 30 15 IOUT=100A Dropout Voltage (Note 5) 4.5 12 1 % dB 900 mA nV / Hz BCD Semiconductor Manufacturing Limited 12 Data Sheet 300mA RF ULDO REGULATOR AP2210 Electrical Characteristics (Continued) AP2210-3.3 Electrical Characteristics VIN=4.3V, IOUT=100A, CIN=1.0F, COUT=2.2F, VEN2.0V, TJ=25oC, Bold typeface applies over -40oCTJ125oC (Note 2), unless otherwise specified. Parameter Symbol Conditions Enable Input Logic-low Voltage VIL Regulator shutdown Enable Input Logic-high Voltage VIH Regulator enabled Enable Input Logic-low Current IIL Enable Input Logic-high Current IIH VIL0.4V Min Typ 0.4 0.18 2.0 VIL2.0V Unit V V 0.01 VIL0.18V VIL2.0V Max 1 2 5 20 25 A A Note 2: Specifications in bold type are limited to -40oCTJ125oC. Limits over temperature are guaranteed by design, but not tested in production. Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 0.1mA to 300mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% (TJ=25oC) or 2% (40oCTJ125oC) below its nominal value measured at 1V differential. Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 13 Data Sheet 300mA RF ULDO REGULATOR AP2210 Electrical Characteristics (Continued) AP2210-3.6 Electrical Characteristics VIN=4.6V, IOUT=100A, CIN=1.0F, COUT=2.2F, VEN2.0V, TJ=25oC, Bold typeface applies over -40oCTJ125oC (Note 2), unless otherwise specified. Parameter Symbol Conditions Variation from specified VOUT Min Typ Max -1 1 -2 2 Unit Output Voltage Accuracy VOUT/VOUT Output Voltage Temperature Coefficient (Note 3) VOUT/T 120 V/oC (VOUT/VOUT)/T 48 ppm/oC 1.5 Line Regulation VRLINE VIN=4.6V to 13.2V Load Regulation (Note 4) VRLOAD IOUT=0.1mA to 300mA 110 140 IOUT=100mA Ground Pin Current (Note 6) 165 250 mV 275 350 250 400 500 VEN0.4V (shutdown) 0.01 VEN0.18V (shutdown) 100 VEN2.0V, IOUT=50mA 350 VEN2.0V, IOUT=150mA 1.3 VEN2.0V, IOUT=300mA 4 IGND 1 5 VEN2.0V, IOUT=100A A 150 180 600 A 800 1.9 2.5 10 mA 15 Ripple Rejection PSRR f=100Hz, IOUT=100A 75 Current Limit ILIMIT VOUT=0V 450 Output Noise eno IOUT=50mA, COUT=2.2F, 100pF from BYP to GND 260 Jan. 2012 Rev. 1. 6 150 300 IOUT=300mA ISTD 50 230 IOUT=150mA Standby Current mV 70 IOUT=50mA VDROP mV 6 30 15 IOUT=100A Dropout Voltage (Note 5) 4.5 12 1 % dB 900 mA nV / Hz BCD Semiconductor Manufacturing Limited 14 Data Sheet 300mA RF ULDO REGULATOR AP2210 Electrical Characteristics (Continued) AP2210-3.6 Electrical Characteristics VIN=4.6V, IOUT=100A, CIN=1.0F, COUT=2.2F, VEN2.0V, TJ=25oC, Bold typeface applies over -40oCTJ125oC (Note 2), unless otherwise specified. Parameter Symbol Conditions Enable Input Logic-low Voltage VIL Regulator shutdown Enable Input Logic-high Voltage VIH Regulator enabled Enable Input Logic-low Current IIL Enable Input Logic-high Current IIH VIL0.4V Min Typ 0.4 0.18 2.0 VIL2.0V Unit V V 0.01 VIL0.18V VIL2.0V Max 1 2 5 20 25 A A Note 2: Specifications in bold type are limited to -40oCTJ125oC. Limits over temperature are guaranteed by design, but not tested in production. Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 0.1mA to 300mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% (TJ=25oC) or 2% (40oCTJ125oC) below its nominal value measured at 1V differential. Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 15 Data Sheet 300mA RF ULDO REGULATOR AP2210 Electrical Characteristics (Continued) AP2210-4.0 Electrical Characteristics VIN=5.0V, IOUT=100A, CIN=1.0F, COUT=2.2F, VEN2.0V, TJ=25oC, Bold typeface applies over -40oCTJ125oC (Note 2), unless otherwise specified. Parameter Symbol Conditions Variation from specified VOUT Min Typ Max -1 1 -2 2 Unit Output Voltage Accuracy VOUT/VOUT Output Voltage Temperature Coefficient (Note 3) VOUT/T 120 V/oC (VOUT/VOUT)/T 48 ppm/oC 1.5 Line Regulation VRLINE VIN=5.0V to 13.2V Load Regulation (Note 4) VRLOAD IOUT=0.1mA to 300mA 110 140 IOUT=100mA Ground Pin Current (Note 6) 165 250 mV 275 350 250 400 500 VEN0.4V (shutdown) 0.01 VEN0.18V (shutdown) 100 VEN2.0V, IOUT=50mA 350 VEN2.0V, IOUT=150mA 1.3 VEN2.0V, IOUT=300mA 4 IGND 1 5 VEN2.0V, IOUT=100A A 150 180 600 A 800 1.9 2.5 10 mA 15 Ripple Rejection PSRR f=100Hz, IOUT=100A 75 Current Limit ILIMIT VOUT=0V 450 Output Noise eno IOUT=50mA, COUT=2.2F, 100pF from BYP to GND 260 Jan. 2012 Rev. 1. 6 150 300 IOUT=300mA ISTD 50 230 IOUT=150mA Standby Current mV 70 IOUT=50mA VDROP mV 6 30 15 IOUT=100A Dropout Voltage (Note 5) 4.5 12 1 % dB 900 mA nV / Hz BCD Semiconductor Manufacturing Limited 16 Data Sheet 300mA RF ULDO REGULATOR AP2210 Electrical Characteristics (Continued) AP2210-4.0 Electrical Characteristics VIN=5.0V, IOUT=100A, CIN=1.0F, COUT=2.2F, VEN2.0V, TJ=25oC, Bold typeface applies over -40oCTJ125oC (Note 2), unless otherwise specified. Parameter Symbol Conditions Enable Input Logic-low Voltage VIL Regulator shutdown Enable Input Logic-high Voltage VIH Regulator enabled Enable Input Logic-low Current IIL Enable Input Logic-high Current IIH VIL0.4V Min Typ 0.4 0.18 2.0 VIL2.0V Unit V V 0.01 VIL0.18V VIL2.0V Max 1 2 5 20 25 A A Note 2: Specifications in bold type are limited to -40oCTJ125oC. Limits over temperature are guaranteed by design, but not tested in production. Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 0.1mA to 300mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% (TJ=25oC) or 2% (40oCTJ125oC) below its nominal value measured at 1V differential. Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 17 Data Sheet 300mA RF ULDO REGULATOR AP2210 Electrical Characteristics (Continued) AP2210-5.0 Electrical Characteristics VIN=6.0V, IOUT=100A, CIN=1.0F, COUT=2.2F, VEN2.0V, TJ=25oC, Bold typeface applies over -40oCTJ125oC (Note 2), unless otherwise specified. Parameter Symbol Conditions Variation from specified VOUT Min Typ Max -1 1 -2 2 Unit Output Voltage Accuracy VOUT/VOUT Output Voltage Temperature Coefficient (Note 3) VOUT/T 120 V/oC (VOUT/VOUT)/T 48 ppm/oC 1.5 Line Regulation VRLINE VIN=6.0V to 13.2V Load Regulation (Note 4) VRLOAD IOUT=0.1mA to 300mA 110 140 IOUT=100mA Ground Pin Current (Note 6) 165 250 mV 275 350 250 400 500 VEN0.4V (shutdown) 0.01 VEN0.18V (shutdown) 100 VEN2.0V, IOUT=50mA 350 VEN2.0V, IOUT=150mA 1.3 VEN2.0V, IOUT=300mA 4 IGND 1 5 VEN2.0V, IOUT=100A A 150 180 600 A 800 1.9 2.5 10 mA 15 Ripple Rejection PSRR f=100Hz, IOUT=100A 75 Current Limit ILIMIT VOUT=0V 450 Output Noise eno IOUT=50mA, COUT=2.2F, 100pF from BYP to GND 260 Jan. 2012 Rev. 1. 6 150 300 IOUT=300mA ISTD 50 230 IOUT=150mA Standby Current mV 70 IOUT=50mA VDROP mV 6 30 15 IOUT=100A Dropout Voltage (Note 5) 4.5 12 1 % dB 900 mA nV / Hz BCD Semiconductor Manufacturing Limited 18 Data Sheet 300mA RF ULDO REGULATOR AP2210 Electrical Characteristics (Continued) AP2210-5.0 Electrical Characteristics VIN=6.0V, IOUT=100A, CIN=1.0F, COUT=2.2F, VEN2.0V, TJ=25oC, Bold typeface applies over -40oCTJ125oC (Note 2), unless otherwise specified. Parameter Symbol Conditions Enable Input Logic-low Voltage VIL Regulator shutdown Enable Input Logic-high Voltage VIH Regulator enabled Enable Input Logic-low Current IIL Enable Input Logic-high Current IIH VIL0.4V Min Typ 0.4 0.18 2.0 VIL2.0V Unit V V 0.01 VIL0.18V VIL2.0V Max 1 2 5 20 25 A A Note 2: Specifications in bold type are limited to -40oCTJ125oC. Limits over temperature are guaranteed by design, but not tested in production. Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 0.1mA to 300mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% (TJ=25oC) or 2% (40oCTJ125oC) below its nominal value measured at 1V differential. Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 19 Data Sheet 300mA RF ULDO REGULATOR AP2210 Electrical Characteristics (Continued) AP2210-ADJ Electrical Characteristics VIN=VOUT+1V, IOUT=100A, CIN=1.0F, COUT=2.2F, VEN2.0V, TJ=25oC, Bold typeface applies over -40oCTJ125oC (Note 2), unless otherwise specified. Parameter Output Voltage Accuracy Output Voltage Temperature Coefficient (Note 3) Symbol VOUT/VOUT Conditions Variation from specified VOUT Min Typ -1 1 -2 2 % 120 V/oC (VOUT/VOUT)/T 48 ppm/oC VIN=VOUT+1V to 13.2V 1.5 Load Regulation (Note 4) VRLOAD IOUT=0.1mA to 300mA 1 Standby Current ISTD VEN0.4V (shutdown) 0.01 Ground Pin Current (Note 6) Unit VOUT/T VRLINE Line Regulation Max 4.5 12 VEN0.18V (shutdown) mV 6 30 mV 1 A 5 VEN2.0V, IOUT=100A 100 VEN2.0V, IOUT=50mA 350 VEN2.0V, IOUT=150mA 1.3 VEN2.0V, IOUT=300mA 4 150 180 A 600 800 IGND 1.9 2.5 10 mA 15 Ripple Rejection PSRR f=100Hz, IOUT=100A 75 Current Limit ILIMIT VOUT=0V 450 Output Noise eno IOUT=50mA, COUT=2.2F, 100pF from BYP to GND 260 Enable Input Logic-low Voltage VIL Regulator shutdown Enable Input Logic-high Voltage VIH Regulator enabled Enable Input Logic-low Current IIL VIL0.4V Enable Input Logic-high Current IIH VIL2.0V dB 900 mA nV / Hz 0.4 V 0.18 2.0 V 0.01 VIL0.18V VIL2.0V Jan. 2012 Rev. 1. 6 1 A 2 5 20 A 25 BCD Semiconductor Manufacturing Limited 20 Data Sheet 300mA RF ULDO REGULATOR AP2210 Electrical Characteristics (Continued) AP2210-ADJ Electrical Characteristics VIN=VOUT+1V, IOUT=100A, CIN=1.0F, COUT=2.2F, VEN2.0V, TJ=25oC, Bold typeface applies over -40oCTJ125oC (Note 2), unless otherwise specified. Note 2: Specifications in bold type are limited to -40oCTJ125oC. Limits over temperature are guaranteed by design, but not tested in production. Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 0.1mA to 300mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 21 Data Sheet 300mA RF ULDO REGULATOR AP2210 Typical Performance Characteristics 550 3.0150 3.0075 CIN=1.0F, COUT=2.2F Output Voltage (V) 3.0050 3.0025 3.0000 2.9975 2.9950 500 IOUT=50mA 450 IOUT=100mA 300 250 200 150 2.9900 100 2.9875 50 -25 0 25 50 75 100 IOUT=300mA 350 2.9925 2.9850 -50 0 125 -60 -40 -20 o 20 40 60 80 100 120 140 Junction Temperature ( C) Figure 4. Output Voltage vs. Junction Temperature Figure 5. Dropout Voltage vs. Junction Temperature 5.0 5.0 AP2210-3.0 VIN=4V,CIN=1.0F,COUT=2.2F 4.5 4.5 o TA=25 C 4.0 4.0 CIN=1.0F, COUT=2.2F Ground Pin Current (mA) Ground Pin Current (mA) 0 o Junction Temperature ( C) 3.5 3.0 2.5 2.0 1.5 3.5 3.0 IOUT=100mA 2.0 IOUT=150mA 1.0 0.5 50 100 150 200 250 0.0 300 IOUT=300mA 1.5 0.5 0 IOUT=50mA 2.5 1.0 0.0 CIN=1.0F, COUT=2.2F IOUT=150mA 400 Dropout Voltage (mv) 3.0100 AP2210-3.0 VIN=4V, IOUT=10mA 3.0125 -60 -40 -20 0 20 40 60 80 100 120 140 o Output Current (mA) Junction Temperature ( C) Figure 6. Ground Pin Current vs. Output Current Figure 7. Ground Pin Current vs. Junction Temperature Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 22 Data Sheet 300mA RF ULDO REGULATOR AP2210 Typical Performance Characteristics (Continued) 2.0 20 16 VEN=2.0V COUT=2.2F, IOUT=100A VEN=3.0V Enable Voltage (V) 18 Enable Current (A) VEN=1.8V AP2210-3.0 VIN=4V, CIN=1.0F VEN=3.7V 14 12 10 8 6 1.8 AP2210-3.0 CIN=1.0F, COUT=2.2F 1.6 VIN=4V, IOUT=100A 1.4 1.2 VEN=logic high VEN=logic low 1.0 0.8 4 0.6 2 0 -50 -25 0 25 50 75 100 0.4 -50 125 50 75 100 125 5.5 0.1 AP2210-3.0 VIN=4.5V, IOUT=10mA CIN=1.0F, COUT=2.2F CBYP=100pF 0.0001 100 1k 10k 100k 1M 4.5 4 VOUT (50mV/Div) 0.01 10M AP2210-3.0 5 VIN (0.5V/Div) 1 Output Noise ( V/ Hz ) 25 Figure 9. Enable Voltage vs. Junction Temperature 10 10 0 Junction Temperature ( C) Figure 8. Enable Current vs. Junction Temperature 0.001 -25 o o Junction Temperature ( C) 50 0 -50 -100 Frequency (Hz) Time (20s/Div) Figure 10. Output Noise vs. Frequency Figure 11. Line Transient (Conditions: VIN=4 to 5V, VEN=2V, IOUT=1mA, COUT=2.2F) Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 23 Data Sheet 300mA RF ULDO REGULATOR AP2210 Typical Performance Characteristics (Continued) 6 400 VEN (2V/Div) AP2210-3.0 200 0 50 VOUT (2V/Div) VOUT (50mV/Div) IOUT (200mA/Div) 600 0 -50 -100 4 AP2210-3.0 2 0 2 0 -2 -4 Time (20s/Div) Time (40s/Div) Figure 13. VEN vs. VOUT (Conditions: VEN=0 to 2V, VIN=4V, IOUT=30mA, CIN=1.0F, COUT=2.2F) Figure 12. Load Transient (Conditions: VIN=4V, VEN=2V, IOUT=10mA to 300mA, CIN=1.0F, COUT=2.2F) 0.9 100 80 0.7 Power Dissipation (W) IOUT=10mA, COUT=2.2F PSRR (dB) 70 60 50 40 30 0.6 0.5 0.4 0.3 0.2 20 0.1 10 0 10 AP2210-3.0 SOT-23-3 Package No Heatsink 0.8 AP2210-3.0 VIN=4V, VRIPPLE=1VPP 90 100 1k 10k 100k 0.0 25 1M Frequency (Hz) 50 75 100 125 150 o Ambient Temperature ( C) Figure 14. PSRR vs. Frequency Figure 15. Power Dissipation vs. Ambient Temperature Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 24 Data Sheet 300mA RF ULDO REGULATOR AP2210 Typical Performance Characteristics (Continued) 0.9 1000 AP2210-3.0 SOT-23-5 Package No Heatsink 0.7 COUT=1F No Bypass Capacitor 100 0.6 0.5 ESR () Power Dissipation (W) 0.8 0.4 10 Stable Area 1 0.3 0.2 0.1 0.1 0.0 25 50 75 100 125 0.01 150 50 o Ambient Temperature ( C) 100 150 300 Figure 17. ESR vs. Output Current 1000 1000 COUT=2.2F COUT=4.7F No Bypass Capacitor 100 No Bypass Capacitor 100 10 10 ESR () ESR () 250 Output Current (mA) Figure 16. Power Dissipation vs. Ambient Temperature Stable Area 1 0.1 0.01 200 Stable Area 1 0.1 50 100 150 200 250 0.01 300 Output Current (mA) 50 100 150 200 250 300 Output Current (mA) Figure 18. ESR vs. Output Current Figure 19. ESR vs. Output Current Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 25 Data Sheet 300mA RF ULDO REGULATOR AP2210 Typical Application VIN =4.0V VIN AP2210-3.0 3 VIN CIN VIN =4.0V VOUT COUT GND 1.0 F VIN VOUT VOUT =3.0V 2 2.2 F 1 1 2 AP2210-3.0 VIN VOUT VOUT =3.0V 5 VOUT GND COUT CIN 1.0 F 3 EN BYP 2.2 F 4 C BYP 100pF For Fixed Version Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 26 Data Sheet 300mA RF ULDO REGULATOR AP2210 Typical Application (Continued) 1 VIN 2 V EN C IN 3 AP2210-ADJ VOUT VIN 5 VOUT R1 GND ADJ 4 EN COUT R2 VOUT=1.25V*(1+R2/R1) For Adjustable Version Figure 20. Typical Application of AP2210 (Note 7) Note 7: Dropout voltage is 250mV when TA=25oC. In order to obtain a normal output voltage, VOUT+0.25V is the minimum input voltage which will results a low PSRR, imposing a bad influence on system. Therefore, the recommended input voltage is VOUT+1V to 13.2V. For AP2210-3.0 version, its input voltage can be set from 4V(VOUT+1V) to 13.2V. Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 27 Data Sheet 300mA RF ULDO REGULATOR AP2210 Application Information Input Capacitor A 1F minimum capacitor is recommended to be placed between VIN and GND. ture must be within the range specified under absolute maximum ratings to avoid thermal shutdown. To determine if the power dissipated in the regulator reaches the maximum power dissipation (see figure 16, 17), using: TJ = PD*JA + TA PD=(VIN-VOUT)*IOUT+VIN*IGND Output Capacitor It is required to prevent oscillation. 1.0F minimum is recommended when CBYP is unused. 2.2F minimum is recommended when CBYP is 100pF. The output capacitor may be increased to improve transient response. Where: TJTJ(max), TJ(max) is absolute maximum ratings for the junction temperature; VIN*IGND can be ignored due to its small value. Noise Bypass Capacitor Bypass capacitor is connected to the internal voltage reference. A small capacitor connected from BYP to GND make this reference quiet, resulting in a significant reduction in output noise, but the ESR stable area will be narrowed. In order to keep the output stability, it is recommended to use the bypass capacitor no more than 100pF. TJ(max) is 150oC, JA is 200oC/W, no heatsink is required since the package alone will dissipate enough heat to satisfy these requirements unless the calculated value for power dissipation exceeds the limit. Example (3.0V version): IOUT=300mA, TA=50oC, VIN(Max) is: The start-up speed of the AP2210 is inversely proportional to the value of reference bypass capacitor. In some cases, if output noise is not a major concern and rapid turn-on is necessary, omit CBYP and leave BYP open. (150oC-50oC)/(0.3A*200oC/W)+3.0V=4.67V Therefore, for good performance, please make sure that input voltage is less than 4.67V without heatsink when TA=50oC. Power Dissipation Thermal shutdown may take place if exceeding the maximum power dissipation in application. Under all possible operating conditions, the junction tempera- Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 28 Data Sheet 300mA RF ULDO REGULATOR AP2210 Mechanical Dimensions SOT-23-3 Unit: mm(inch) 2.820(0.111) 3.020(0.119) 1.800(0.071) 2.000(0.079) 0.200(0.008) 0 8 0.300(0.012) 0.500(0.020) 1.450(0.057) MAX. 0.950(0.037) TYP 0.300(0.012) 0.600(0.024) 2.650(0.104) 2.950(0.116) 1.500(0.059) 1.700(0.067) 0.100(0.004) 0.200(0.008) 0.000(0.000) 0.150(0.006) 0.900(0.035) 1.300(0.051) Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 29 Data Sheet 300mA RF ULDO REGULATOR AP2210 Mechanical Dimensions (Continued) SOT-23-5 Unit: mm(inch) 0.300(0.012) 0.600(0.024) 1.500(0.059) 1.700(0.067) 0.100(0.004) 0.200(0.008) 2.950(0.116) 2.650(0.104) 2.820(0.111) 3.020(0.119) 0.200(0.008) 0.700(0.028) REF 0.300(0.012) 0.400(0.016) 0 8 1.800(0.071) 2.000(0.079) 0.000(0.000) MAX 1.450(0.057) 0.950(0.037) TYP 0.150(0.006) 0.900(0.035) 1.300(0.051) Jan. 2012 Rev. 1. 6 BCD Semiconductor Manufacturing Limited 30 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com IMPORTANT NOTICE IMPORTANT NOTICE BCD Semiconductor BCD Semiconductor Manufacturing Manufacturing Limited Limited reserves reserves the the right right to to make make changes changes without without further further notice notice to to any any products products or or specifispecifications herein. cations herein. BCD BCD Semiconductor Semiconductor Manufacturing Manufacturing Limited Limited does does not not assume assume any any responsibility responsibility for for use use of of any any its its products products for for any any particular purpose, particular purpose, nor nor does does BCD BCD Semiconductor Semiconductor Manufacturing Manufacturing Limited Limited assume assume any any liability liability arising arising out out of of the the application application or or use use of any of any its its products products or or circuits. circuits. BCD BCD Semiconductor Semiconductor Manufacturing Manufacturing Limited Limited does does not not convey convey any any license license under under its its patent patent rights rights or or other rights other rights nor nor the the rights rights of of others. others. 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