Application Specification 114-2154 Modular Jacks with Integral Light Emitting Diode (LED) NOTE 26 AUG 03 Rev A All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2 . Figures and illustrations are for identification only and are not drawn to scale. _ 1. INTRODUCTION This specification covers the requirements for application of modular jacks with integral LED. The jacks are available in standard, inverted, and light pipe. The jacks are available shielded and unshielded with up to 8 ports. These jacks are designed for mounting onto a printed circuit (pc) board and panel. When corresponding with personnel, use the terminology provided in this specification to facilitate your inquiries for information. Basic terms and features of this product are provided in Figure 1. Standard Modular Jack Multiport (1 4 Shown) Panel Ground Tab Single Port LED Solder Tines PC Board Ground Tab Contact Solder Tines Boardlock Inverted Modular Jack Multiport (1 8 Shown) Panel Ground Tab Single Port Boardlock LED Solder Contact PC Board Tines Solder Tines Ground Tab Light Pipe Modular Jack Multiport (1 4 Shown) Panel Ground Tab Single Port Light Pipe Boardlock LED Solder Tines Note: Note to Scale PC Board Contact Ground Tab Solder Tines Figure 1 E2003 Tyco Electronics Corporation, Harrisburg, PA This controlled document is subject to change. For latest revision, call the FAX/PRODUCT INFO number. All International Rights Reserved AMP and Tyco are trademarks. *Trademark Other products, logos, and company names used are the property of their respective owners. TOOLING ASSISTANCE CENTER 1-800-722-1111 FAX/PRODUCT INFO 1-800-522-6752 For Regional Customer Service, visit our website at www.tycoelectronics.com 1 of 9 LOC B Modular Jacks with Integral LED 114-2154 Shielded modular jacks feature tin-lead plated brass shells which provide continuity for electromagnetic compatibility (EMC). When mated with corresponding shielded modular plugs, shielding and grounding continuity are achieved. When the shield solder tines are soldered to the pc board, they provide electrical continuity to any ground path on the pc board and, if applicable, panel ground tabs on the shield provide electrical continuity to any ground path through the equipment panel. 2. REFERENCE MATERIAL 2.1. Revision Summary Revisions to this application specification per EC 0990-1178-03 include: S S S S S S Updated document to corporate requirements Added titles to Figures 2 and 3 Added finished hole diameter for standard modular jack LED solder tine to Figure 4 Removed NOTE from Paragraph 3.5.B Replaced temperature and exposure time in Paragraph 3.5.B with Figure 6 Added standard modular jack to Figure 10 2.2. Customer Assistance Reference Product Base Part Number 406549 and Product Code 1977 are representative of modular jacks with integral LED. Use of these numbers will identify the product line and expedite your inquiries through a service network established to help you obtain product and tooling information. Such information can be obtained through a local Representative (Field Service Engineer, Field Applications Engineer, etc.) or, after purchase, by calling PRODUCT INFO at the number at the bottom of page 1. 2.3. Drawings Customer Drawings for product part numbers are available from the service network. If there is a conflict between the information contained in the Customer Drawings and this specification or with any other technical documentation supplied, call PRODUCT INFO at the number at the bottom of page 1. 2.4. Manuals Manual 402-40 can be used as a guide to soldering. This manual provides information on various flux types and characteristics with the commercial designation and flux removal procedures. A checklist is included in the manual as a guide for information on soldering problems. 2.5. Specifications Product Specifications 108-1163-3 (light pipe modular jacks) and 108-1163-4 (inverted modular jacks) provide product performance and test information. 2.6. Instructional Material Instruction Sheets (408-series) provide product assembly instructions or tooling setup and operation procedures and Customer Manuals (409-series) provide machine setup and operation procedures. There are no documents that pertain to this product. 3. REQUIREMENTS 3.1. Storage A. Ultraviolet Light Prolonged exposure to ultraviolet light may deteriorate the chemical composition used in the modular jack housings. B. Shelf Life The modular jacks should remain in the shipping containers until ready for use to prevent damage. The modular jacks should be used on a first in, first out basis to avoid storage contamination that could adversely affect signal transmissions. 2 of 9 Rev A Modular Jacks with Integral LED 114-2154 C. Chemical Exposure Do not store modular jacks near any chemicals listed below as they may cause stress corrosion cracking in the contacts. Alkalies Ammonia Citrates Phosphates Citrates Sulfur Compounds Amines Carbonates Nitrites Sulfur Nitrites Tartrates 3.2. LED Operating Requirements The LED operating requirements for these modular jacks are given in Figures 2 and 3. STANDARD AND INVERTED MODULAR JACKS ABSOLUTE MAXIMUM RATINGS (TA = 25_ C [77_ F]) DESCRIPTION CR PT ON GREEN YELLOW ORANGE UNIT 565 590 610 nm Diffused Diffused Diffused -- Luminous Intensity--Minimum (IF = 10 mA) 5 3.2 5 mcd Luminous Intensity--Maximum 20 12.5 20 mcd Forward Voltage (Typ) IF = 20 mA 2.2 2.1 2.0 V Forward Voltage (Max) IF = 20 mA 2.5 2.5 2.6 V Reverse Voltage (VR) 5 5 5 V Forward Current (IF) (1/10 Duty Cycle, 0.1 ms Pulse Width) 25 30 30 mA Forward Current (Peak) 150 150 150 mA Reverse Current VR = 5 V 10 10 10 mA Power Dissipation 105 105 105 mW Forward Voltage (Typ) IF = 2 mA 1.9 1.8 1.7 V Forward Voltage (Max) IF = 2 mA 2.2 2.1 2.0 V 7 7 7 mA Forward Current (Peak) 150 150 150 mA Power Dissipation 24 25 26 mW Wavelength At Peak Emission IF = 20 mA Lens Type Low Current Application: Forward Current (IF) (1/10 Duty Cycle, 0.1 ms Pulse Width) Figure 2 LIGHT PIPE MODULAR JACK ABSOLUTE MAXIMUM RATINGS (TA = 25_ C [77_ F]) DESCRIPTION CR PT ON GREEN YELLOW UNIT 565 585 nm Clear Tint Clear Tint -- Luminous Intensity--Minimum (IF = 10 mA) 2.5 2.5 mcd Luminous Intensity--Maximum 10 10 mcd Forward Voltage (Typ) IF = 20 mA 2.1 2.0 V Forward Voltage (Max.) IF = 20 mA 2.8 2.8 V Reverse Voltage (VR) 5 5 V Forward Current (IF) (1/10 Duty Cycle, f = 1.0 KHz 30 30 mA Forward Current (Peak) 160 160 mA Reverse Current VR = 5 V 10 10 mA Power Dissipation 100 85 mW Wavelength At Peak Emission IF = 20 mA Lens Type Figure 3 Rev A 3 of 9 Modular Jacks with Integral LED 114-2154 3.3. PC Board A. Material and Thickness The pc board material shall be glass epoxy (FR-4 or G-10). The pc board thickness shall be 1.57 [.062]. B. Hole Dimensions Plated through holes must be used for contact and LED solder tines and, for shielded modular jacks, shield solder tines. The drilled hole size, plating types, and plating thickness are dependent on the application requirements. The finished hole size must be as stated to provide unrestricted insertion, proper retention in the pc board, and to ensure adequate application of solder to the tines. See Figure 4. C. Layout The holes in the pc board must be precisely located to ensure proper placement and optimum performance of the modular jack. The pc board layout must be designed using the dimensions provided on the customer drawing for the specific modular jack. Finished Annular Ring Pad (As Required) Contact Solder Tine Hole Trace Width (As Required) PC Board Finished Hole Diameter (After Plating) SEE TABLE Drilled Hole Diameter (As Required) Boardlock Hole Drilled Hole Diameter (Use No. 30 (3.25 [.128]) Drill Bit. DO NOT Use 3.18 [.125 (1/8)] Drill Bit FINISHED HOLE DIAMETER (After Plating) LED SOLDER TINE CONTACT SOLDER TINE SHIELD H L SOLDER TINE 0.89 [.035] 1.57 [.062] Standard Modular Jacks Light Pipe Modular Jack Inverted Modular Jack 1.19 [.047] 1.22 [.048] 0.89 [.035] Figure 4 4 of 9 Rev A Modular Jacks with Integral LED 114-2154 3.4. Placement CAUTION The modular jacks should be handled only by the housing to avoid deformation, contamination, or damage to the solder tines. A. Alignment The modular jack number one position must be aligned with the number one position board hole. When placing modular jacks on the pc board, the solder tines and boardlocks must be aligned with matching holes before placing the jack onto the pc board. All solder tines and boardlocks must be started into the holes, then gently pressed downward. B. Seating The modular jack shall be flush and evenly seated on the pc board. 3.5. Soldering A hold-down may be used to hold the modular jack in place during the soldering process. NOTE A. Flux Selection Solder tines must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the flux will depend on the type of pc board and other components mounted on the board. Additionally, the flux must be compatible with the wave solder line, manufacturing, health, and safety requirements. Call PRODUCT INFO at the number at the bottom of page 1 for consideration of other types of flux. Flux that is compatible with these connectors are provided in Figure 5. FLU TYPE FLUX TYP ACT TY ACTIVITY R RESIDUE U RMA Mild Noncorrosive COMMERCIAL DESIGNATION KESTER ALPHA 186 611 Figure 5 B. Process The modular jacks can be soldered using wave soldering or equivalent soldering techniques. It is recommended using SN60 or SN62 solder for these modular jacks. The temperature and exposure time must be as specified in Figure 6. Reflow Soldering Process Cycle Peak Dwell 20 Seconds Max 230_C [446_F] Ambient Rate 160_C [320_F] 110_C [230_F] Ambient Rate 20_C [68_F] Ramp-Up 30 Seconds 3_C [37.4_F] Per Second Equalization 100 Seconds 0.5_C [33_F] Per Second Pre-Heat Reflow 45 Seconds 3_C [37.4_F] Per Second Cool-Down More Than 3 Minutes 3_C [37.4_F] Per Second Soldering Solidification Figure 6 Rev A 5 of 9 Modular Jacks with Integral LED 114-2154 C. Cleaning After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the solder and flux for recommended cleaning solvents. Cleaners must be free of dissolved flux and other contaminants. It is recommended cleaning with the pc board on its edge. If using an aqueous cleaner, standard equipment such as a soak-tank or an automatic in-line machine should be used. The following is a list of common cleaning solvents that will not affect the connectors for the time and temperature specified. See Figure 7. CLEANER TYPE TIME (Minutes) TEMPERATURE (Maximum) ALPHA 2110 Aqueous 1 132_C [270_F] BIOACT EC-7 Solvent 5 100_C [212_F] Butyl CARBITOL Solvent 1 Ambient Room Isopropyl Alcohol Solvent 5 100_C [212_F] KESTER 5778 Aqueous 5 100_C [212_F] KESTER 5779 Aqueous 5 100_C [212_F] LONCOTERGE 520 Aqueous 5 100_C [212_F] LONCOTERGE 530 Aqueous 5 100_C [212_F] Terpene Solvent Solvent 5 100_C [212_F] NAME Figure 7 DANGER NOTE Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer. Refer to the manufacturer's Material Safety Data Sheet (MSDS) for characteristics and handling of cleaners. Trichloroethylene and Methylene Chloride is not recommended because of harmful occupational and environmental effects. Both are carcinogenic (cancer-causing). If you have a particular solvent that is not listed, contact PRODUCT INFO at the number at the bottom of page 1. D. Drying When drying cleaned assemblies and pc boards, make certain that temperature limitations are not exceeded: -40_ to 70_C [-40_ to 158_F]. Excessive temperatures may cause housing degradation. 3.6. Checking Installed Jack The shoulder of each boardlock must be through its intended hole in the pc board. Solder fillet must be evenly formed around each solder tine. The housing of the modular jack must be seated on the pc board not exceeding the dimension given in Figure 8. Modular Jack 0.13 [.005] Max Modular Jack Housing to PC Board PC Board Shoulder of Boardlock Through PC Board Hole Solder Fillet is Evenly Formed Around Each Solder Tine Figure 8 6 of 9 Rev A Modular Jacks with Integral LED 114-2154 3.7. Panel A. Cutout The panel must be cut using the dimensions provided on the customer drawing for the specific modular jack. A reference sample of a recommended panel cutout for these modular jacks is shown in Figure 9. Standard Modular Jack Modular Jack Inside Panel Cutout DIMENSION SIZE Z 1 4 1 6 1 8 1 1 B +0.38/-0.00 [+.015/-.000] C SHIELDED H L A Y 16.51 [.650] Y 59.70 [2.350] Y 87.70 [3.450] Y 115.60 [4.550] B C 14.48 4 4 [.570] 0 0 2 [.010] 0.25 0 0 A Inverted Modular Jack DIMENSION SIZE Z SHIELDED H L 1 2 1 4 Y B C D 17.27 [.680] 13.97 [.550] 0.51 [.020] -- N 16.51 [.650] 13.59 [.535] -- 0.39 [.015] N 32.26 [1.270] 13.59 [.535] -- 0.39 [.015] Y 64.77 [2.550] 13.97 [.550] 0.51 [.020] -- N 63.75 [2.510] 13.59 [.535] -- 0.39 [.015] Y 96.27 [3.790] 13.97 [.550] 0.51 [.020] -- N 95.25 [3.750] 13.59 [.535] -- 0.39 [.015] Modular Jack Inside Panel Cutout 1 1 B +0.25/-0.13 [+.010/-.005] C D 1 6 A +0.25 [+.010] A Y 127.76 [5.030] 13.97 [.550] 0.51 [.020] -- N 126.75 [4.990] 13.59 [.535] -- 0.39 [.015] SIZE Z SHIELDED H L Y 1 8 Light Pipe Modular Jack Modular Jack Inside Panel Cutout B +0.13/-0.25 [+.005/-.010] C A +0.38/-0.00 [+.015/-.000] DIMENSION 1 1 1 2 1 4 A 16.51 [.650] N 15.62 [.615] Y 31.75 [.1.250] N 30.99 [1.220] Y 59.69 [2.350] N B 58.93 [2.320] C 0.38 [.015] 14.48 4 4 [.570] 0 0 [0] 0.38 [.015] 14.48 4 4 [.570] 0 0 [0] 0.38 [.015] 14.48 4 4 [.570] 0 0 [0] Figure 9 Rev A 7 of 9 Modular Jacks with Integral LED 114-2154 B. Mounting The modular jack should protrude through the panel cutout to the dimension given in Figure 10. Standard Modular Jack II II II Inverted Modular Jack 1.73+0.25 [.068+.010] 2.16+0.25 [.085+.010] Panel II IIIIIII II II PC Board Light Pipe Modular Jack Shielded Unshielded with Panel Ground 1.91+0.38 [.075+.015] 2.36+0.13 [.093+.005] Panel Stop Figure 10 3.8. Removal and Repair The modular jacks must be removed from the pc board by standard de-soldering methods. Damaged or defective modular jacks must NOT be used. Damaged modular jacks must be replaced. CAUTION When repairing or replacing a modular jack, care must be taken not to damage other pc board components during the de-soldering process. 4. QUALIFICATIONS Modular jacks with integral LED are recognized by Underwriters Laboratories Inc. (UL) under File E 81956 and certified by CSA International under File LR 7189. 5. TOOLING No tooling is required for manual placement of modular jacks; however, a pc board support that provides relief for protruding components must be used to prevent deformation of contact and LED solder tines and, if applicable, shield solder tines. The pc board support must be custom made (refer to 408-6927). 8 of 9 Rev A Modular Jacks with Integral LED 114-2154 6. VISUAL AID The illustration below shows a typical application of modular jacks with integral LED. This illustration should be used by production personnel to ensure a correctly applied product. Applications which DO NOT appear correct should be inspected using the information in the preceding pages of this specification and in the instructional material shipped with the product or tooling. HOUSING MUST NOT BE DAMAGED IN ANY WAY PANEL STOP (IF PRESENT) MUST BE AGAINST PANEL CONTACTS MUST NOT BE DEFORMED OR DAMAGED IN ANY WAY HOUSING MUST BE SEATED ON PC BOARD SOLDER FILLET MUST BE EVENLY FORMED AROUND EACH SOLDER TINE SHOULDER OF BOARDLOCK MUST BE THROUGH PC BOARD FIGURE 11. VISUAL AID Rev A 9 of 9